Dicing frame

TWD247275SActive Publication Date: 2026-10-11SHIN ETSU POLYMER CO LTD
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
TW115301933
Authority / Receiving Office
TW · TW
Patent Type
Designs
Current Assignee / Owner
Priority Date
2025-10-23
Filing Date
2026-04-17
Publication Date
2026-10-11
Estimated Expiration
2041-04-16

Smart Images

  • Figure TWG2TB001916380_001
    Figure TWG2TB001916380_001
  • Figure TWG2TB001916380_002
    Figure TWG2TB001916380_002
  • Figure TWG2TB001916380_003
    Figure TWG2TB001916380_003
Patent Text Reader

Abstract

【Item Uses】 The item in this design is a slitting frame used to hold a cutting substrate by means of a slitting tape additionally fixed to the opening. 【Design Description】 none.
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Deposition ring of a process kit for semiconductor substrate processing

    TWD228654S