Pusher, substrate conveying device, and substrate processing device

Abstract

This invention reduces the contact area between the substrate and the pusher, and improves the safety and reliability of substrate reception. The pusher 230 includes: a plurality of support pillars 272, each having a support surface 272a at one end for supporting the substrate WF; a base 274 connected to the other end of the plurality of support pillars 272; and a first lifting mechanism 233 for lifting the base 274. The support surface is configured to support the substrate WF when it is transferred to the top ring 302 and when it is received from the top ring 302. At least one of the plurality of support pillars 272 has a suction channel 272b connected to a vacuum source 260 and open at the support surface 272a.

Description

Technical Field

[0001] The present invention relates to a pusher, a substrate transfer device, and a substrate processing device. The present invention claims priority based on Japanese Patent Application No. 2019-228056 filed on December 18, 2019, and Japanese Patent Application No. 2020-159966 filed on September 24, 2020. The entire disclosure content of the specification, claims, drawings, and abstract including Japanese Patent Application No. 2019-228056 and Japanese Patent Application No. 2020-159966 is incorporated herein by reference in its entirety. Prior Art

[0002] In order to planarize the surface of a substrate, chemical mechanical polishing (CMP) is used in the manufacture of semiconductor devices. Substrates used in the manufacture of semiconductor devices are, in many cases, circular plates. Also, not limited to semiconductor devices, a high degree of flatness is required when planarizing the surface of a rectangular substrate such as a CCL substrate (Copper Clad Laminate substrate), a PCB (Printed Circuit Board) substrate, a mask substrate, or a display panel. Also, there is a high demand for planarizing a package substrate on which an electronic device such as a PCB substrate is disposed.

[0003] A CMP device includes a pusher that transfers a substrate before polishing to a top ring and receives the polished substrate from the top ring. For example, Patent Document 1 discloses a pusher including: a plurality of substrate support pins that support a substrate before polishing and transfer it to the top ring; and a plurality of columnar substrate support members that receive the polished substrate from the top ring.

[0004] Patent Document 1 discloses a problem that when transferring a polished substrate from the top ring to the pusher, the substrate adheres tightly to the top ring due to surface tension and cannot be peeled off from the top ring. To solve this problem, Patent Document 1 discloses that by adsorbing the substrate with the pusher and tilting the substrate, the end of the substrate is peeled off from the top ring, and a gas such as air or nitrogen is blown into the gap formed between the end of the substrate and the top ring. Also, Patent Document 1 discloses that by inserting a plate-shaped or rod-shaped peeling auxiliary member into the gap formed between the end of the substrate and the top ring, the substrate is peeled off from the top ring. [Prior Art Documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-110471 Summary of the Invention Problems to be Solved by the Invention[[ID=二十九]]

[0006] In a substrate being processed, there are areas (patterned areas) where wiring or functional wafers are formed. It is undesirable for the pusher to come into contact with these patterned areas. In the pusher described in Patent Document 1, because the substrate support needle contacts the substrate before polishing and the substrate support component contacts the substrate after polishing, the contact area between the pusher and the substrate is increased. From the viewpoint of expanding the degree of freedom of the substrate patterned area, this is an undesirable situation.

[0007] Furthermore, it is known that a method of receiving a substrate from a top ring is achieved by releasing the substrate from the top ring while the pusher is raised near the substrate, allowing the substrate to fall onto the pusher. However, in this case, the impact of the falling substrate may cause damage to the substrate. To address this, it has been considered to raise the pusher until it contacts the substrate, and then release the substrate from the top ring while the pusher is in contact with the substrate, thus ensuring safe reception without substrate damage. However, in this method, because the substrate is attached to the top ring, there is a risk that the pusher may not be able to reliably receive the substrate.

[0008] The technology disclosed in Patent Document 1 still has room for improvement regarding the reliability of transferring the substrate from the top ring to the substrate. In other words, the technology described in Patent Document 1 involves peeling the substrate end from the top ring by tilting the substrate, which requires less force compared to peeling the entire substrate from the top ring. However, when the surface tension between the top ring and the substrate is high, even with the substrate tilted, it may be impossible to peel the substrate end from the top ring, and there is a risk that the substrate may not be able to be transferred to the pusher.

[0009] The purpose of this application is to resolve or mitigate at least one of the aforementioned problems.

[0010] As an example, the purpose of this application is to reduce the contact area between the substrate and the pusher, and to improve the safety and reliability of substrate reception. Furthermore, as an example, the purpose of this application is to improve the reliability of substrate transfer from the top ring to the substrate. The means to solve the problem

[0011] According to one embodiment, a pusher is disclosed. The pusher includes: a plurality of first support pillars, each having a support surface at one end for supporting a substrate; a first base connected to the other end of the plurality of first support pillars; and a first lifting mechanism for lifting the first base, wherein the support surface is configured to support the substrate when the substrate is transferred to and from the top ring; and at least one of the plurality of first support pillars has a suction conduit connected to a vacuum source and open at the support surface.

[0012] According to an embodiment, a substrate processing apparatus is disclosed. The substrate processing apparatus includes: a top ring configured to hold the back surface of the substrate in a state where the polished surface faces downward; a pusher configured to transfer the substrate between the top rings; and a wedge mechanism including: a wedge member disposed on the side surface of the substrate held by the top ring when transferring the substrate from the top ring to the pusher; and a drive member configured to move the wedge member in a direction along the back surface of the substrate and insert the wedge member between the substrate and the top ring. Effect of the Invention

[0013] Brief Explanation of Drawings

[0014] [First Drawing] A plan view showing the overall structure of a substrate processing apparatus according to an embodiment.

[0015] [Second Drawing] A plan view schematically showing a substrate as an object to be processed according to an embodiment.

[0016] [Third Drawing] A perspective view schematically showing a polishing module according to an embodiment.

[0017] [Fourth Drawing] A schematic view showing a top ring structure according to an embodiment.

[0018] [Fifth Drawing] A side view showing a transfer module according to an embodiment.

[0019] [Sixth Drawing] A perspective view showing a transfer module according to an embodiment.

[0020] [Seventh Drawing] A perspective view showing a pusher according to an embodiment.

[0021] [Eighth Drawing] A partial cross-sectional view of the pusher shown in the seventh drawing as viewed in the direction of arrow 8.

[0022] [Ninth Drawing] A cross-sectional view of a support column of a second platform according to an embodiment.

[0023] [Tenth Drawing] A cross-sectional view of a support column of a first platform according to an embodiment.

[0024] [Eleventh Drawing] A partial cross-sectional view showing the first platform and the second platform in the upper position.

[0025] [Figure 12] shows a partial cross-sectional view of the first platform and the second platform in the upper position, with the first platform in a position that is raised relative to the second platform.

[0026] [Figure 13] A side view of a conveying module in one embodiment.

[0027] [Figure 14] View the conveying module shown in Figure 13 from the direction of arrow 14.

[0028] [Figure 15] shows a plan view of the overall structure of a substrate processing apparatus according to one embodiment.

[0029] [Figure 16] A perspective view of a grinding module in one embodiment.

[0030] [Figure 17] A side cross-sectional view of a top ring structure in one embodiment.

[0031] [Figure 18] A side view of a conveying module in one embodiment.

[0032] [Figure 19] shows a perspective view of a conveying module in one embodiment.

[0033] [Figure 20] shows a perspective view of an implementation of a pusher.

[0034] [Figure 21] A partial cross-sectional view of the pusher shown in Figure 20, viewed in the direction of arrow 20.

[0035] [Figure 22] shows a cross-sectional view of a support column of a second platform in one embodiment.

[0036] [Figure 23] shows a cross-sectional view of a support column of the first platform in one embodiment.

[0037] [Figure 24] A perspective view of a wedge mechanism in one embodiment.

[0038] [Figure 25] A plan view and a cross-sectional view of a wedge mechanism in one embodiment.

[0039] [Figure 26] A cross-sectional view of a modified wedge mechanism.

[0040] [Figure 27] A cross-sectional view schematically showing one embodiment of the tilting mechanism.

[0041] [Figure 28] A cross-sectional view of a schematic implementation of an inclined mechanism.

[0042] [Figure 29] A cross-sectional view of a schematic implementation of an inclined mechanism.

[0043] [Figure 30] A cross-sectional view of a schematic implementation of an inclined mechanism. Implementation

[0044] Hereinafter, embodiments of the pusher, substrate conveying device, and substrate processing device of the present invention will be described together with the accompanying drawings. In the accompanying drawings, the same or similar elements are given the same or similar element symbols, and repeated descriptions of the same or similar elements may be omitted in the description of each embodiment. Furthermore, the features shown in each embodiment can be applied to other embodiments without contradiction.

[0045] The first figure shows a plan view of the overall structure of a substrate processing apparatus 1000 according to one embodiment. The substrate processing apparatus 1000 shown in the first figure includes: a loading module 100, a conveying module 200, a polishing module 300, a drying module 500, and an unloading module 600. In the illustrated embodiment, the conveying module 200 has two conveying modules 200A and 200B, and the polishing module 300 has two polishing modules 300A and 300B. In one embodiment, these modules can be formed independently. Because these modules are formed independently, substrate processing apparatuses 1000 with different structures can be easily formed by arbitrarily combining the number of modules. Furthermore, the substrate processing apparatus 1000 includes a control device 900, and each component of the substrate processing apparatus 1000 is controlled by the control device 900. In one embodiment, the control device 900 can be composed of a general-purpose computer equipped with input / output devices, a calculation device, and a memory device.

[0046] <Loading Module>

[0047] The loading module 100 is used to introduce the substrate WF before it undergoes grinding and cleaning into the substrate processing apparatus 1000. In one embodiment, the loading module 100 is configured to conform to the SMEMA (Surface Mount Equipment Manufacturers Association) machine interface specification (IPC-SMEMA-9851).

[0048] In the illustrated embodiment, the conveying mechanism of the loading module 100 has a plurality of conveying rollers 202 (first conveying rollers) and a plurality of roller shafts 204 on which the conveying rollers 202 are mounted. In the embodiment shown in the first figure, three conveying rollers 202 are mounted on each roller shaft 204. The substrate WF is disposed on the conveying rollers 202, and the substrate WF is conveyed by rotating the conveying rollers 202. The mounting position of the conveying rollers 202 on the roller shafts 204 can be arbitrarily determined if it is a position that can stably convey the substrate WF. However, since the conveying rollers 202 contact the substrate WF, even if they contact the substrate WF to be processed, they should be positioned so that the contact area of ​​the conveying rollers 202 is not problematic. In one embodiment, the conveying rollers 202 of the loading module 100 may be made of a conductive polymer. In one embodiment, the conveying rollers 202 are electrically grounded via the roller shafts 204. This is to prevent the substrate WF from becoming charged and damaging electronic devices on the substrate WF. In another embodiment, an ionizer (not shown) to prevent the substrate WF from becoming charged may also be provided in the loading module 100.

[0049] The second figure schematically shows a plan view of a substrate WF of a processed object according to one embodiment. As shown in the second figure, in one embodiment, the substrate WF is a thin plate-shaped substrate that is generally rectangular (including square). The substrate WF shown in the second figure has patterned areas 10 and non-patterned areas 20. The "patterned areas" are areas that have wiring or functional chips, etc., and are used as devices formed on the substrate, having wiring or functional chips that are functionally meaningful for the device. The "non-patterned areas" are areas that are not used as devices on the substrate. In the embodiment shown in the second figure, the substrate WF has two patterned areas 10, which are surrounded by non-patterned areas 20. In one embodiment, the substrate WF can be used to contain the ID information of the substrate WF in the non-patterned areas, for example, it can be used to have an ID tag 12. The ID of the substrate WF can be read by an ID reader provided in the loading module 100.

[0050] The loading module 100 receives and transports the substrate WF, with the patterned area 10 of the substrate WF shown in the second figure facing downwards. Therefore, the transport roller 202 is configured to contact only the non-patterned area 20 of the substrate WF. Specifically, the transport roller 202 is positioned at the ends of the non-patterned area 20 of the substrate WF and at the center of the substrate WF. The position of the transport roller 202 can be changed according to the substrate WF being processed. Therefore, according to the illustrated embodiment, by changing the position of the roller shaft 204 mounted to the transport roller 202, substrates WF with different sizes or patterns can be transported. Because the size of a rectangular substrate is not determined by specifications like that of a circular semiconductor substrate, the transport mechanism disclosed in this embodiment has the advantage of being able to transport substrates of various sizes with minor adjustments.

[0051] <Grinding Module>

[0052] The third figure is a perspective view of one embodiment of the polishing module 300. The substrate processing apparatus 1000 shown in the first figure has two polishing modules 300A and 300B. Since the two polishing modules 300A and 300B can have the same structure, polishing module 300 will be used as the sole description below.

[0053] As shown in Figure 3, the polishing module 300 includes a polishing platform 350 and a top ring 302. The polishing platform 350 is supported by a platform shaft 351. The polishing platform 350 rotates around the axis of the platform shaft 351 by a drive unit (not shown in the figure), as indicated by arrow AC. A polishing pad 352 is attached to the polishing platform 350. The top ring 302 holds the substrate WF and presses it against the polishing pad 352. The top ring 302 is rotated by a drive source (not shown in the figure). The substrate WF is polished by being held in the top ring 302 and pressed against the polishing pad 352.

[0054] As shown in Figure 3, the grinding module 300 includes: a grinding fluid supply nozzle 354 for supplying grinding fluid or dressing fluid to the grinding pad 352. The grinding fluid is, for example, a slurry, and the dressing fluid is, for example, pure water. Also, as shown in Figure 3, a passage 353 for supplying grinding fluid is provided on the grinding platform 350 and the platform shaft 351. The passage 353 connects to an opening 355 on the surface of the grinding platform 350. At a position corresponding to the opening 355 of the grinding platform 350, a through hole 357 is formed in the grinding pad 352, and the grinding fluid is supplied from the opening 355 of the grinding platform 350 and the through hole 357 of the grinding pad 352 through the passage 353 to the surface of the grinding pad 352. Furthermore, the grinding module 300 includes: a dressing device 356 for adjusting the grinding pad 352. Also, the grinding module 300 includes: a sprayer 358 for spraying liquid or a mixture of liquid and gas onto the grinding pad 352. The liquid sprayed from sprayer 358 is, for example, pure water, and the gas is, for example, nitrogen.

[0055] The top ring 302 is supported by the top ring shaft 304. The top ring 302 is rotated around the axis of the top ring shaft 304 by a drive unit (not shown in the figure), as indicated by arrow AB. Furthermore, the top ring shaft 304 can be moved vertically by a drive mechanism (not shown in the figure).

[0056] The substrate WF is held in place by vacuum adsorption on the surface of the top ring 302 facing the polishing pad 352. During polishing, polishing slurry is supplied to the polishing surface of the polishing pad 352 from the polishing slurry supply nozzle 354 and / or the through hole 357 of the polishing pad 352. Furthermore, during polishing, the polishing platform 350 and the top ring 302 are rotated. The substrate WF is polished by being pressed against the polishing surface of the polishing pad 352 by the top ring 302.

[0057] As shown in Figure 3, the top ring shaft 304 is connected to the arm 360, which can rotate around the axis 362. During the polishing of the substrate WF, the arm 360 can be fixed or rotated so that the top ring 302 passes through the center of the polishing pad 352. Also, during the polishing of the substrate WF, the arm 360 can be fixed or rotated so that the substrate WF covers the through hole 357 of the polishing pad 352. As shown in Figure 1, the top ring 302 can be moved to the transfer module 200 via the movable arm 360. By moving to the substrate transfer position of the transfer module 200 (described later), the top ring 302 can receive the substrate WF from the pusher 230 (described later). Furthermore, after the substrate WF is polished in the polishing module 300, the substrate WF can be transferred from the top ring 302 to the pusher 230.

[0058] Figure 4 is a schematic side cross-sectional view showing the structure of a top ring 302 in one embodiment. The top ring 302 is connected to the lower end of the top ring shaft 304. The top ring 302 includes: a generally square head body 306; and a retainer member 308 disposed at the lower part of the head body 306. The head body 306 may be formed of a material with high strength and rigidity, such as metal or ceramic. Furthermore, the retainer member 308 may be formed of a material with high rigidity, such as resin or ceramic.

[0059] An elastic pad 310, which abuts against the substrate WF, is housed within the space formed inside the head body 306 and the retainer member 308. A pressure chamber (airbag) P1 is provided between the elastic pad 310 and the head body 306. The pressure chamber P1 is formed by the elastic pad 310 and the head body 306. The pressure chamber P1 is supplied with pressurized fluid such as pressurized air via a fluid conduit 312, or subjected to vacuum suction. In the embodiment shown in Figure 4, the pressure chamber P1 is formed across the entire surface of the retained substrate WF.

[0060] The peripheral end of the substrate WF is surrounded by a retainer member 308, preventing the substrate WF from popping out of the head body 306 during polishing. An elastic bladder 314 is disposed between the retainer member 308 and the head body 306, and a pressure chamber Pr is formed inside the elastic bladder 314. The retainer member 308 can move up and down relative to the head body 306 by the expansion / contraction of the elastic bladder 314. A fluid conduit 316 is connected to the pressure chamber Pr, and pressurized fluid such as pressurized air is supplied to the pressure chamber Pr through the fluid conduit 316. The internal pressure of the pressure chamber Pr is adjustable. Therefore, the pressing pressure of the retainer member 308 on the polishing pad 352 can be adjusted independently of the pressing pressure on the polishing pad 352 of the substrate WF.

[0061] <Drying Module>

[0062] The drying module 500 is an apparatus used to dry the substrate WF. In the substrate processing apparatus 1000 shown in the first figure, the drying module 500 dries the substrate WF that has been cleaned in the cleaning section of the transport module 200 after being polished by the polishing module 300. As shown in the first figure, the drying module 500 is disposed downstream of the transport module 200.

[0063] The drying module 500 includes a nozzle 530 for spraying gas onto the substrate WF being conveyed onto the conveyor roller 202. The gas can be, for example, compressed air or nitrogen. By blowing away water droplets on the conveyed substrate WF with the drying module 500, the substrate WF can be dried.

[0064] <Uninstall Module>

[0065] The unloading module 600 is used to remove the substrate WF, which has undergone grinding and cleaning processes, from the substrate processing apparatus 1000. In the substrate processing apparatus 1000 shown in the first figure, the unloading module 600 receives the substrate after it has been dried in the drying module 500. As shown in the first figure, the unloading module 600 is located downstream of the drying module 500. In one embodiment, the unloading module 600 is configured to conform to the SMEMA (Surface Mount Equipment Manufacturers Association) machine interface specification (IPC-SMEMA-9851).

[0066] <Transportation module>

[0067] Figure 5 shows a side view of one embodiment of the transfer module 200. The substrate processing apparatus 1000 shown in Figure 1 includes two transfer modules 200A and 200B. Since the two transfer modules 200A and 200B can be made with the same structure, the following description will refer to the transfer module 200.

[0068] Figure 6 shows a perspective view of a conveying module 200 according to one embodiment. Furthermore, for clarity, the upper conveying roller (second conveying roller) 290 and its drive mechanism, described later, are omitted in Figure 6. The conveying module 200 shown includes a plurality of conveying rollers (first conveying rollers) 202 for conveying substrates WF. By rotating the conveying rollers 202, the substrates WF on the conveying rollers 202 can be conveyed in a specific direction. The conveying rollers 202 of the conveying module 200 can be formed of a conductive polymer or a non-conductive polymer. The conveying rollers 202 are mounted on a roller shaft (first roller shaft) 204 and driven by a motor 208 via a gear 206. In one embodiment, the motor 208 can be a servo motor, and the gear 206 can be a gear type, but it can also be a magnetic gear. Additionally, the conveying module 200 shown includes a guide roller 212 that supports the side of the substrate WF being conveyed. The illustrated conveying module 200 includes a sensor 216 for detecting the presence of a substrate WF at a specific position on the conveying roller 202. The sensor 216 can be any type of sensor, such as an optical sensor. In the embodiment shown in Figure 5, seven sensors 216 (216a-216g) are provided in the conveying module 200. In one embodiment, the operation of the conveying module 200 can be controlled by detecting the substrate WF using these sensors 216a-216g. The positions and functions of these sensors 216a-216g will be described later. As shown in Figure 5, the conveying module 200 also includes an inlet gate 218, which can be opened and closed to receive substrate WF within the conveying module 200.

[0069] As shown in Figure 5, the conveying module 200 has a stopper 220. The stopper 220 is connected to the stopper moving mechanism 222 and can enter the conveying path of the substrate WF moving on the conveying roller 202. When the stopper 220 is located within the conveying path of the substrate WF, the side of the substrate WF moving on the conveying roller 202 contacts the stopper 220, stopping the moving substrate WF at the position of the stopper 220. Furthermore, when the stopper 220 is located in a position retracting from the conveying path of the substrate WF, the substrate WF can move on the conveying roller 202. The stopping position of the substrate WF caused by the stopper 220 is the position where the pusher 230 (described later) can receive the substrate WF on the conveying roller 202 (substrate transfer position).

[0070] Sensor 216a is located at the entrance side of the conveying module 200. Once sensor 216a confirms that the substrate WF has passed behind it, the entrance gate 218 can be closed. Then, sensor 216b, located downstream of sensor 216a, monitors the position of the substrate WF and conveys it using conveying roller 202. At this time, stopper 220 moves into the conveying path of substrate WF due to stopper moving mechanism 222. The substrate WF being conveyed on conveying roller 202 contacts stopper 220, stopping the substrate WF. Furthermore, sensor 216c is located at the stopper 220; when sensor 216c detects substrate WF, the movement of conveying roller 202 is stopped. The substrate WF stopped at the stopper 220 position (substrate transfer position) is transferred to the top ring 302 via pusher 230 (described later).

[0071] <Pusher>

[0072] As shown in Figures 5 and 6, the conveying module 200 has a pusher 230. The pusher 230 is configured to lift the substrate WF located on the plurality of conveying rollers 202 away from the plurality of conveying rollers 202. Furthermore, the pusher 230 is configured to transfer the held substrate WF to the conveying rollers 202 of the conveying module 200.

[0073] Figure 7 shows a perspective view of the pusher 230 in one embodiment. Figure 8 is a partial cross-sectional view of the pusher 230 shown in Figure 7, viewed in the direction of arrow 8. Figure 8 schematically shows the conveying roller 202, the substrate WF disposed at the substrate transfer position on the conveying roller 202, and the top ring 302 receiving the substrate WF together with the pusher 230. In the embodiments shown in Figures 7 and 8, the pusher 230 includes a first platform 270 and a second platform 232.

[0074] The second platform 232 is a platform used to support the retainer member 308 of the top ring 302 when the substrate WF is transferred from the pusher 230 to the top ring 302 (described later). The second platform 232 has a plurality of support pillars (second support pillars) 234. Figure 9 shows a cross-sectional view of one support pillar of the second platform 232. As shown in Figure 9, one end of the support pillar 234 has: a flat support surface 234a, which supports the retainer member 308 of the top ring 302 when the substrate WF is transferred to and from the top ring 302; and an inclined surface 234b, which guides the top ring 302. In one embodiment, the support pillars 234 located at the four corners of the plurality of support pillars 234 may also have the support surface 234a and the inclined surface 234b shown in Figure 9. The recesses formed by the support pillars 234 at the four corners can position the retainer member 308. The support pillars 234 other than the four corners may only have the support surface 234a. The other end of each support post 234 is connected to a common base (second base) 236. Furthermore, each support post 234 is positioned so as not to interfere with the conveying roller 202. In the embodiment shown in Figure 8, each support post 234 is arranged between the conveying rollers 202.

[0075] The first platform 270 is configured to receive the substrate WF on the transfer roller 202. The first platform 270 includes a plurality of support pillars (first support pillars) 272. Figure 10 shows a cross-sectional view of one support pillar 272 of the first platform 270 in one embodiment. As shown in Figure 10, one end of the support pillar 272 has a flat support surface 272a, which supports the substrate WF when transferring it to the top ring 302 and when receiving it from the top ring 302. Furthermore, at least one of the plurality of support pillars 272 has a suction conduit 272b that opens into the support surface 272a. The suction conduit 272b is connected to a vacuum source 260. Thus, at least one of the plurality of support pillars 272 is configured to attract the substrate WF via the suction conduit 272b when receiving it from the top ring 302. The other ends of each support pillar 272 are connected to a common base (first base) 274. Furthermore, each support post 272 is positioned so as not to interfere with the conveying roller 202. In the embodiment shown in Figure 8, each support post 272 is arranged between the conveying rollers 202. Also, each support post 272 is configured to support the non-patterned area 20 of the substrate WF. The first platform 270 and the second platform 232, as detailed below, are respectively connected to the lifting mechanism and can move in the height direction (z-direction).

[0076] The second platform 232 is configured to move in the height direction (z-direction). In one embodiment, the pusher 230 has a second lifting mechanism 231. In one embodiment, as shown in Figures 7 and 8, the second lifting mechanism 231 of the pusher 230 is a pneumatic lifting mechanism, comprising a cylinder 240 and a piston 242. The end of the piston 242 is connected to a movable platform 244. The cylinder 240 is connected to a fixed platform 246. The fixed platform 246 is fixed to the housing 201 covering the entire conveying module 200 or the ground on which the conveying module 200 is mounted. By adjusting the air pressure in the cylinder 240, the piston 242 moves, causing the movable platform 244 to move in the height direction (z-direction). Because the movable platform 244 moves in the height direction, the first platform 270 and the second platform 232 can be moved in the height direction. In the illustrated embodiment, an XY platform 248 is mounted on a movable base 244. The XY platform 248 allows the first platform 270 and the second platform 232 to move in the horizontal plane. The XY platform 248 can be a known XY platform, configured to move in two vertical directions via a linear guide or the like. In the illustrated embodiment, a rotary platform 250 is mounted on the XY platform 248. The rotary platform 250 is configured to rotate in the XY plane (horizontal plane). The rotary platform 250 can be a known rotary platform 250 constructed of a rotary bearing or the like.

[0077] A first lifting mechanism 233 is mounted on the rotating platform 250. The first lifting mechanism 233 has a cylinder 252 and a piston 254. The cylinder 252 is connected to the base 236 of the second platform 232. A movable piston 254 is connected to the cylinder 252, and the piston 254 can be moved by adjusting the air pressure inside the cylinder 252. The base 274 of the first platform 270 is connected to the end of the piston 254. Therefore, by adjusting the air pressure inside the cylinder 252, the piston 254 and the first platform 270 can move in the height direction (z-direction). Thus, the first lifting mechanism 233 can be configured to raise the base 274 when receiving the substrate WF from the top ring 302, so that the support surface 272a contacts the substrate WF, and simultaneously lower the base 274 while attracting the substrate WF through the suction pipe 272b. Furthermore, the sensor 216b can be configured to detect whether there is a substrate WF on the support surface 272a. In this case, the first lifting mechanism 233 can be configured such that when receiving the substrate WF from the top ring 302, if the sensor 216b detects that no substrate WF is present while the base 274 is lowered, the lifting and lowering of the base 274 is repeated. That is, when the substrate WF cannot be received normally from the top ring 302, the first lifting mechanism 233 raises the base 274 again, so that the support surface 272a contacts the substrate WF, and lowers the base 274 while attracting the substrate WF through the suction conduit 272b.

[0078] According to the above structure, the second lifting mechanism 231 moves both the first platform 270 and the second platform 232 in the height direction (z-direction), and the first lifting mechanism 233 moves the first platform 270 relative to the second platform 232 in the height direction (z-direction). Furthermore, the first platform 270 and the second platform 232 can move in the vertical directions (xy-direction) within the horizontal plane via the XY platform 248. Moreover, the first platform 270 and the second platform 232 can rotate in the horizontal plane (around the z-axis) via the rotating platform 250. Therefore, when receiving the substrate WF between the pusher 230 and the top ring 302 (described later), positioning of the pusher 230 and the top ring 302 can be achieved. In addition, in the illustrated embodiment, the first lifting mechanism 233 and the second lifting mechanism 231 are pneumatic lifting mechanisms, but these lifting mechanisms can also be hydraulic or electric lifting mechanisms using motors and ball screws, etc. The second lifting mechanism 231, the second platform 232 and the first platform 270 can move between the lower position and the upper position.

[0079] Next, the transfer of the substrate WF using the pusher 230 will be explained. Figure 8 shows the state when the first platform 270 and the second platform 232 are in the lower position. When the first platform 270 and the second platform 232 are in the lower position, as shown in Figure 8, the ends of the support pillars 234 of the second platform 232 and the ends of the support pillars 272 of the first platform 270 are located at a position lower than the surface of the substrate WF supported by the transfer roller 202. When the substrate WF is transferred to the top ring 302, the pusher 230, from the state shown in Figure 8, uses the second lifting mechanism 231 to raise the first platform 270 and the second platform 232, so that the support surface 272a of the support pillars 272 contacts the substrate WF and raises the substrate WF, resulting in the state shown in Figure 11.

[0080] Figure 11 shows the state when the first platform 270 and the second platform 232 are in the upper position. When the first platform 270 and the second platform 232 are in the upper position, the ends of the support pillars 234 of the second platform 232 and the first platform 270 are located at a position higher than the surface of the support substrate of the conveying roller 202. That is, when the second platform 232 and the first platform 270 move from the lower position to the upper position, the first platform 270 is raised to receive the substrate WF disposed on the conveying roller 202. In the state shown in Figure 11, the support surface 234a of the support pillar 234 supports the retainer member 308 of the top ring 302. The pusher 230 raises the first platform 270 relative to the second platform 232 from the state shown in Figure 11 using the first lifting mechanism 233, resulting in the state shown in Figure 12.

[0081] Figure 12 shows the state when the first platform 270 and the second platform 232 are in the upper position, and the first platform 270 is in a raised position relative to the second platform 232. When the substrate WF is transferred from the pusher 230 to the top ring 302, as shown in Figure 12, the pusher 230 raises the first platform 270 holding the substrate WF relative to the second platform 232. Thus, as shown in Figure 12, the substrate WF contacts the top ring 302. In this state, a vacuum suction is applied to the pressure chamber P1 of the top ring 302, and the substrate WF is adsorbed onto the top ring 302, thus transferring the substrate WF to the top ring 302. After transferring the substrate WF to the top ring 302, the pusher 230 returns to the state shown in Figure 8. When the substrate WF is transferred to the top ring 302, the vacuum suction performed by the vacuum source 260 is stopped.

[0082] On the other hand, when the pusher 230 receives the substrate WF from the top ring 302, the pusher 230 moves from the state shown in Figure 8 to the state shown in Figure 11. That is, as shown in Figure 12, the pusher 230 raises the base 274 using the first lifting mechanism 233 and brings the support surface 272a into contact with the substrate WF. In the state shown in Figure 12, the vacuum suction of the pressure chamber P1 of the top ring 302 is stopped, and vacuum suction using the vacuum source 260 is started. Thereby, the substrate WF is adsorbed onto the support surface 272a via the suction conduit 272b. With the substrate WF adsorbed onto the support surface 272a, the pusher 230 lowers the base 274 using the first lifting mechanism 233, resulting in the state shown in Figure 11.

[0083] In the state shown in Figure 11, sensor 216b detects whether there is a substrate WF on the support surface 272a. When pusher 230 determines that there is no substrate WF on the support surface 272a, the first lifting mechanism 233 raises the base 274 again to perform a substrate WF receiving operation. Pusher 230 can be preset to repeat the substrate WF receiving operation a certain number of times when it is determined that there is no substrate WF on the support surface 272a. Even if the substrate WF receiving operation is repeated a certain number of times, when it is determined that there is no substrate WF on the support surface 272a, an alarm can be generated in substrate processing device 1000 to stop substrate processing device 1000.

[0084] On the other hand, when the pusher 230 determines that there is a substrate WF on the support surface 272a, it stops the vacuum suction performed by the vacuum source 260, and at the same time lowers the first platform 270 and the second platform 232 by using the second lifting mechanism 231, placing the substrate WF on the conveying roller 202, and then becomes the state shown in Figure 8.

[0085] According to this embodiment, during the transfer and reception of the substrate WF to the top ring 302, since the substrate WF is only in contact with the support surface 272a of the support post 272 of the pusher 230, the contact area between the pusher 230 and the substrate WF can be suppressed. This increases the degree of freedom of the pattern area of ​​the substrate WF. Furthermore, since the top ring 302 receives the substrate WF while the pusher 230 is raised to contact the substrate WF, it can safely receive the substrate WF without damage, compared to the case where the substrate WF falls onto the pusher 230. Moreover, when receiving the substrate WF, the attraction path 272b formed by the support post 272 attracts the substrate WF, so the pusher 230 can reliably receive the substrate WF.

[0086] As shown in Figures 5 and 6, the conveying module 200 has a cleaning section. As shown in Figures 5 and 6, the cleaning section has cleaning nozzles 284. The cleaning nozzles 284 have: an upper cleaning nozzle 284a, disposed on the upper side of the conveying roller 202; and a lower cleaning nozzle 284b, disposed on the lower side. The upper cleaning nozzle 284a and the lower cleaning nozzle 284b are connected to a cleaning fluid supply source (not shown in the figures). The upper cleaning nozzle 284a is configured to supply cleaning fluid to the upper surface of the substrate WF conveyed on the conveying roller 202. The lower cleaning nozzle 284b is configured to supply cleaning fluid to the lower surface of the substrate WF conveyed on the conveying roller 202. The upper cleaning nozzle 284a and the lower cleaning nozzle 284b are configured to have a width that is the same as or greater than the width of the substrate WF being transported on the transfer roller 202. The entire substrate WF is cleaned by transporting the substrate WF on the transfer roller 202. As shown in Figures 5 and 6, the cleaning section is located on the downstream side of the substrate transfer area of ​​the transfer module 200.

[0087] As shown in Figure 5, in the washing section, an upper conveying roller 290 is disposed on the conveying roller 202. The upper conveying roller 290 is configured to be connected to a power source and is rotatable. In one embodiment, the upper conveying roller 290 is configured to be driven by a gear 206 and a motor 208, just like the conveying roller 202.

[0088] Figure 13 shows a schematic side view of a conveying module in one embodiment. Figure 14 is a view of the conveying module shown in Figure 13 from arrow 14. As shown in Figures 13 and 14, upper conveying rollers 290 are mounted on upper roller shaft (second roller shaft) 291. In the embodiment shown in Figure 14, three upper conveying rollers 290 are mounted on upper roller shaft 291. In one embodiment, the upper conveying rollers 290 are arranged at specific intervals on the conveying roller 202. The specific interval can be the same as the thickness of the substrate WF being conveyed. This specific interval can be adjusted as described later. The size of the upper conveying rollers 290 is arbitrary; they can be the same size as the conveying roller 202 or different sizes. In one embodiment, as shown in Figures 13 and 14, the diameter of the upper conveying rollers 290 is smaller than the diameter of the conveying roller 202. Because the diameter of the upper conveying rollers 290 is smaller, the overall size of the conveying module 200 can be reduced.

[0089] As shown in Figures 13 and 14, a gear 282a is installed on roller shaft 204, and a gear 282b is installed on upper roller shaft 291. The rotational force of roller shaft 204 is transmitted to upper roller shaft 291 via gears 282a and 282b. In one embodiment, gears 282a and 282b can be magnetic gears or mechanical gears. Gears 282a and 282b can be adjusted to change the size and style of each gear to correspond to the size of conveying roller 202 and upper conveying roller 290, so that the rotational speed of conveying roller 202 and upper conveying roller 290 is appropriate.

[0090] Both ends of the upper roller 291 are connected to the support member 292. Furthermore, on both sides of the plurality of upper rollers 291, a base 295 extending in the conveying direction of the substrate WF is provided. An elastic member 296, such as a spring, is provided between the upper surface of the base 295 and the lower surface of the support member 292, and the support member 292 is pushed towards the base 295 by the elastic member 296. Therefore, although the support member 292 is pushed towards the base 295 by the elastic member 296, it can also move upwards.

[0091] Furthermore, as shown in Figure 5, the conveying module 200 includes a thickness sensor 217 for measuring the thickness of the substrate WF. The thickness sensor 217 is configured to be disposed near the inlet of the conveying module 200 to measure the thickness of the substrate WF being conveyed into the conveying module 200. The conveying module 200 also includes a drive device 211, which, in response to the measurement result of the thickness sensor 217, moves the position of at least one of the conveying roller 202 and the upper conveying roller 209, adjusting the spacing between the facing conveying roller 202 and the upper conveying roller 209. In the embodiments shown in Figures 13 and 14, the drive device 211 includes a screw shaft 210 screwed into a base 295 and a motor 209 that rotates and drives the screw shaft 210. The drive unit 211 rotates the drive motor 209 according to the thickness of the substrate WF measured by the thickness sensor 217, and can adjust the position of the upper and lower drive base 295, thereby adjusting the interval between the conveying roller 202 and the upper conveying roller 290.

[0092] For example, when the thickness of the substrate WF measured by the thickness sensor 217 in the drive unit 211 is thin, the position of the base 295 decreases, and the gap between the transfer roller 202 and the upper transfer roller 290 narrows. On the other hand, when the thickness of the substrate WF measured by the thickness sensor 217 in the drive unit 211 is thick, the position of the base 295 increases, and the gap between the transfer roller 202 and the upper transfer roller 290 widens. According to this embodiment, even when processing various substrates WF with different thicknesses, or when the substrate WF is warped, the rotational force of the upper transfer roller 290 can be transmitted to the substrate WF, and the substrate WF can be stably transferred by the transfer roller 202 and the upper transfer roller 290.

[0093] In addition, the support member 292 can move upwards while being pushed against the base 295 by the elastic member 296. Therefore, even if the substrate WF being transported is uneven or warped, the upper transport roller 290 can be kept in constant contact with the substrate WF, and the rotational force of the upper transport roller 290 can be transmitted to the substrate WF, so that the substrate WF can be transported stably by the transport roller 202 and the upper transport roller 290. Furthermore, the position of the upper transport roller 290 mounted on the upper roller shaft 291 can be changed together with the transport roller 202 according to the size of the substrate WF being transported.

[0094] In one embodiment, the aforementioned upper conveying roller 290 may be provided in a region other than the substrate transfer area. For example, it may be provided in the washing section located downstream of the substrate transfer area, or it may be provided on the upstream side of the substrate transfer area. Furthermore, the upper conveying roller 290 may also be provided in the aforementioned loading module 100, the drying module 500 described later, and the unloading module 600.

[0095] As shown in Figure 5, sensor 216d is positioned near the inlet of the cleaning section. In one embodiment, if substrate WF is detected by sensor 216d, cleaning fluid can be sprayed from cleaning nozzle 284 and cleaning of substrate WF can begin. Furthermore, during substrate WF cleaning, the rotation speed of the transfer roller 202 can also be used as the cleaning speed. Sensor 216e is positioned inside the cleaning section to monitor the position of substrate WF, clean substrate WF, and transfer substrate WF. In the embodiment shown in Figure 5, sensor 216f is positioned near the outlet of the cleaning section. In one embodiment, if substrate WF is detected by sensor 216f, spraying of cleaning fluid from cleaning nozzle 284 can be stopped. During substrate WF cleaning, because substrate WF is clamped and transported by transfer roller 202 and upper transfer roller 290, substrate WF can be stably transported even during cleaning fluid spraying.

[0096] As shown in Figure 5, the conveying module 200 has an openable and closable outlet gate 286. Furthermore, the conveying module 200 has a sensor 216g near the outlet. In one embodiment, if the substrate WF is detected by the sensor 216g, the outlet gate 286 can also be opened, and the substrate WF can be conveyed to the next module. In another embodiment, if the substrate WF is detected by the sensor 216g, the outlet gate 286 remains closed, and the conveying of the substrate WF on the conveying roller 202 stops, awaiting processing by the next module. After the next module has received and prepared the substrate, the outlet gate 286 can also be opened, and the substrate WF can be conveyed to the next module.

[0097] Hereinafter, embodiments of the pusher, substrate conveying device, and substrate processing device of the present invention will be described together with the accompanying drawings. In the accompanying drawings, the same or similar elements are given the same or similar element symbols, and repeated descriptions of the same or similar elements may be omitted in the description of each embodiment. Furthermore, the features shown in each embodiment can be applied to other embodiments without contradiction.

[0098] Figure 15 shows a plan view of the overall structure of a substrate processing apparatus 2-1000 according to one embodiment. The substrate processing apparatus 2-1000 shown in Figure 15 includes: a loading module 2-100, a conveying module 2-200, a polishing module 2-300, a drying module 2-500, and an unloading module 2-600. In the illustrated embodiment, the conveying module 2-200 has two conveying modules 2-200A and 2-200B, and the polishing module 2-300 has two polishing modules 2-300A and 2-300B. In one embodiment, these modules can be formed independently. Because these modules are formed independently, substrate processing apparatuses 2-1000 with different structures can be easily formed by arbitrarily combining the number of modules. Furthermore, the substrate processing apparatus 2-1000 includes a control device 2-900, and each component of the substrate processing apparatus 2-1000 is controlled by the control device 2-900. In one embodiment, the control device 2-900 may be composed of a general electronic computer equipped with input / output devices, calculation devices, memory devices, etc.

[0099] <Loading Module>

[0100] Loading module 2-100 is used to introduce the substrate WF before it undergoes grinding and cleaning into the substrate processing apparatus 2-1000. In one embodiment, loading module 2-100 is configured to conform to the SMEMA (Surface Mount Equipment Manufacturers Association) machine interface specification (IPC-SMEMA-9851).

[0101] In the illustrated embodiment, the conveying mechanism of the loading module 2-100 has a plurality of conveying rollers 2-202 (first conveying rollers) and a plurality of roller shafts 2-204 on which the conveying rollers 2-202 are mounted. In the embodiment shown in Figure 15, three conveying rollers 2-202 are mounted on each roller shaft 2-204. The substrate WF is disposed on the conveying rollers 2-202, and the substrate WF is conveyed by rotating the conveying rollers 2-202. The mounting position of the conveying rollers 2-202 on the roller shafts 2-204 can be arbitrarily determined if it is a position that can stably convey the substrate WF. However, since the conveying rollers 2-202 contact the substrate WF, even if they contact the substrate WF to be processed, they should be configured such that there is no problem with the contact of the conveying rollers 2-202. In one embodiment, the conveying rollers 2-202 of the loading module 2-100 may be made of a conductive polymer. In one embodiment, the conveying roller 2-202 is electrically grounded via the roller shaft 2-204. This is to prevent damage to electronic devices on the substrate WF due to electrification. Alternatively, in another embodiment, an ionizer (not shown) to prevent electrification of the substrate WF may be provided in the loading module 2-100.

[0102] <Grinding Module>

[0103] Figure 16 shows a perspective view of one embodiment of the polishing module 2-300. The substrate processing apparatus 2-1000 shown in Figure 15 includes two polishing modules 2-300A and 2-300B. Since the two polishing modules 2-300A and 2-300B can have the same structure, polishing module 2-300 will be used as the subject of the following description.

[0104] As shown in Figure 16, the polishing module 2-300 includes a polishing platform 2-350 and a top ring 2-302. The polishing platform 2-350 is supported by a platform shaft 2-351. The polishing platform 2-350 rotates around the axis of the platform shaft 2-351 by a drive unit (not shown in the figure), as indicated by arrow AC. A polishing pad 2-352 is attached to the polishing platform 2-350. The top ring 2-302 holds the substrate WF and presses it against the polishing pad 2-352. The top ring 2-302 is rotated by a drive source (not shown in the figure). The substrate WF is polished by being held in the top ring 2-302 and pressed against the polishing pad 2-352.

[0105] As shown in Figure 16, the grinding module 2-300 includes: a grinding fluid supply nozzle 2-354 for supplying grinding fluid or dressing fluid to the grinding pad 2-352. The grinding fluid is, for example, a slurry. The dressing fluid is, for example, pure water. Also, as shown in Figure 16, a passage 2-353 for supplying grinding fluid is provided on the grinding platform 2-350 and the platform shaft 2-351. The passage 2-353 connects to an opening 2-355 on the surface of the grinding platform 2-350. At a position corresponding to the opening 2-355 of the grinding platform 2-350, a through hole 2-357 is formed in the grinding pad 2-352, and the grinding fluid is supplied through the passage 2-353 from the opening 2-355 of the grinding platform 2-350 and the through hole 2-357 of the grinding pad 2-352 to the surface of the grinding pad 2-352. Furthermore, the grinding module 2-300 includes: a dresser 2-356 for adjusting the grinding pad 2-352. Furthermore, the grinding module 2-300 includes a sprayer 2-358 for spraying liquid or a mixture of liquid and gas onto the grinding pad 2-352. The liquid sprayed from the sprayer 2-358 is, for example, pure water, and the gas is, for example, nitrogen.

[0106] The top ring 2-302 is supported by the top ring shaft 2-304. The top ring 2-302 is rotated around the axis of the top ring shaft 2-304 by a drive unit (not shown in the figure), as indicated by arrow AB. Furthermore, the top ring shaft 2-304 can be moved vertically by a drive mechanism (not shown in the figure).

[0107] The substrate WF is held in place by vacuum adsorption on the surface of the top ring 2-302 facing the polishing pad 2-352. During polishing, polishing slurry is supplied to the polishing surface of the polishing pad 2-352 through the polishing slurry supply nozzle 2-354 and / or the through hole 2-357 of the polishing pad 2-352. Furthermore, during polishing, the polishing platform 2-350 and the top ring 2-302 are rotated. The substrate WF is polished by being pressed against the polishing surface of the polishing pad 2-352 by the top ring 2-302.

[0108] As shown in Figure 16, the top ring shaft 2-304 is connected to the arm 2-360, which can rotate around the shaft 2-362. During the polishing of the substrate WF, the arm 2-360 can be fixed or rotated so that the top ring 2-302 passes through the center of the polishing pad 2-352. Also, during the polishing of the substrate WF, the arm 2-360 can be fixed or rotated so that the substrate WF covers the through hole 2-357 of the polishing pad 2-352. As shown in Figure 15, the top ring 2-302 can be moved to the conveying module 2-200 via the movable arm 2-360. By moving to the substrate transfer position of the conveying module 2-200 (described later), the top ring 2-302 can receive the substrate WF from the pusher 2-230 (described later). Furthermore, after the substrate WF is polished in the polishing module 2-300, the substrate WF can be transferred from the top ring 2-302 to the pusher 2-230.

[0109] Figure 17 shows a schematic side sectional view of the structure of a top ring 2-302 according to one embodiment. The top ring 2-302 is connected to the lower end of the top ring shaft 2-304. The top ring 2-302 includes: a generally square head body 2-306; and a retainer component 2-308 disposed at the lower part of the head body 2-306. The head body 2-306 may be formed of a material with high strength and rigidity, such as metal or ceramic. Furthermore, the retainer component 2-308 may be formed of a material with high rigidity, such as resin or ceramic.

[0110] An elastic pad 2-310, which abuts against the substrate WF, is housed within the space formed inside the head body 2-306 and the retainer component 2-308. A pressure chamber (airbag) P1 is provided between the elastic pad 2-310 and the head body 2-306. The pressure chamber P1 is formed by the elastic pad 2-310 and the head body 2-306. The pressure chamber P1 is supplied with pressurized fluid such as pressurized air via a fluid conduit 2-312, or subjected to vacuum suction. In the embodiment shown in Figure 17, the pressure chamber P1 is formed across the entire surface of the retaining substrate WF.

[0111] The peripheral end of the substrate WF is surrounded by a retainer component 2-308, preventing the substrate WF from popping out of the head body 2-306 during polishing. An elastic bladder 2-314 is disposed between the retainer component 2-308 and the head body 2-306, and a pressure chamber Pr is formed inside the elastic bladder 2-314. The retainer component 2-308 can move up and down relative to the head body 2-306 by the expansion / contraction of the elastic bladder 2-314. A fluid conduit 2-316 is connected to the pressure chamber Pr, and pressurized fluid such as pressurized air is supplied to the pressure chamber Pr through the fluid conduit 2-316. The internal pressure of the pressure chamber Pr is adjustable. Therefore, the pressing pressure of the retainer component 2-308 on the polishing pad 2-352 can be adjusted independently of the pressing pressure on the polishing pad 2-352 of the substrate WF.

[0112] <Drying Module>

[0113] The drying module 2-500 is a device used to dry the substrate WF. In the substrate processing apparatus 2-1000 shown in Figure 15, the drying module 2-500 dries the substrate WF that has been cleaned by the washing mechanism of the conveying module 2-200 after being polished by the polishing module 2-300. As shown in Figure 15, the drying module 2-500 is disposed downstream of the conveying module 2-200.

[0114] The drying module 2-500 includes a nozzle 2-530 for spraying gas onto the substrate WF being conveyed onto the conveyor roller 2-202. The gas can be, for example, compressed air or nitrogen. By blowing away water droplets on the conveyed substrate WF with the drying module 2-500, the substrate WF can be dried.

[0115] <Uninstall Module>

[0116] The unloading module 2-600 is used to remove the substrate WF, which has undergone grinding and cleaning processes, from the substrate processing apparatus 2-1000. In the substrate processing apparatus 2-1000 shown in Figure 15, the unloading module 2-600 receives the substrate after it has been dried in the drying module 2-500. As shown in Figure 15, the unloading module 2-600 is positioned downstream of the drying module 2-500. In one embodiment, the unloading module 2-600 is configured to conform to the SMEMA (Surface Mount Equipment Manufacturers Association) machine interface specification (IPC-SMEMA-9851).

[0117] <Transportation module>

[0118] Figure 18 shows a side view of a conveying module 2-200 in one embodiment. The substrate processing apparatus 2-1000 shown in Figure 15 includes two conveying modules 2-200A and 2-200B. Since the two conveying modules 2-200A and 2-200B can be made with the same structure, the following description will refer to conveying module 2-200.

[0119] Figure 19 shows a perspective view of a conveying module 2-200 according to one embodiment. Furthermore, for clarity, the upper conveying roller (second conveying roller) 2-290 and its drive mechanism are omitted in Figure 19. The illustrated conveying module 2-200 includes a plurality of conveying rollers (first conveying rollers) 2-202 for conveying substrate WF. By rotating the conveying rollers 2-202, the substrate WF on the conveying rollers 2-202 can be conveyed in a specific direction. The conveying rollers 2-202 of the conveying module 2-200 can be formed of a conductive polymer or a non-conductive polymer. The conveying rollers 2-202 are mounted on a roller shaft (first roller shaft) 2-204 and driven by a motor 2-208 via a gear 2-206. In one embodiment, the motor 2-208 can be a servo motor, and the gear 2-206 can be a gear type, but it can also be a magnetic gear. Furthermore, the illustrated conveying module 2-200 includes: a guide roller 2-212 supporting the side of the substrate WF during conveying. The illustrated conveying module 2-200 also includes: a sensor 2-216 for detecting the presence of the substrate WF at a specific position on the conveying roller 2-202. The sensor 2-216 can be any type of sensor, such as an optical sensor. In the embodiment shown in Figure 18, seven sensors 2-216 (2-216a to 2-216g) are provided in the conveying module 200. In one embodiment, the operation of the conveying module 2-200 can be controlled by detecting the substrate WF using these sensors 2-216a to 2-216g. As shown in Figure 18, the conveying module 2-200 includes: an inlet gate 2-218 that can be opened and closed to receive the substrate WF within the conveying module 2-200. As shown in Figure 18, in areas where substrate WF transfer cannot be performed by the pusher 2-230, an upper transfer roller 2-290 is disposed on the transfer roller 2-202. The upper transfer roller 2-290 is configured to be connected to a power source and is rotatable. In one embodiment, the upper transfer roller 2-290, like the transfer roller 2-202, is configured to be driven by a gear 2-206 and a motor 2-208.

[0120] As shown in Figure 18, the conveying module 2-200 has a stopper 2-220. The stopper 2-220 is connected to the stopper moving mechanism 2-222, and can enter the conveying path of the substrate WF moving on the conveying roller 2-202. When the stopper 2-220 is located within the conveying path of the substrate WF, the side of the substrate WF moving on the conveying roller 2-202 contacts the stopper 2-220, stopping the moving substrate WF at the position of the stopper 2-220. Furthermore, when the stopper 2-220 is located in a position retracting from the conveying path of the substrate WF, the substrate WF can move on the conveying roller 2-202. The stopping position of the substrate WF caused by the stopper 2-220 is the position where the pusher 2-230 (described later) can receive the substrate WF on the conveying roller 2-202 (substrate transfer position).

[0121] Sensor 2-216a is located at the inlet side of the conveying module 2-200. After sensor 2-216a confirms that the substrate WF has passed behind it, the inlet gate 2-218 can be closed. Then, sensor 2-216b, located downstream of sensor 2-216a, monitors the position of the substrate WF and conveys it using conveying roller 2-202. At this time, due to the stopper moving mechanism 2-222, stopper 2-220 moves into the conveying path of substrate WF. The substrate WF being conveyed on conveying roller 2-202 contacts stopper 2-220, stopping the substrate WF. Furthermore, sensor 2-216c is located at the position of stopper 2-220; when sensor 2-216c detects substrate WF, the operation of conveying roller 2-202 is stopped. The substrate WF, which stops at the stopper 2-220 (substrate transfer position), is transferred to the top ring 2-302 via the pusher 2-230.

[0122] As shown in Figures 18 and 19, the conveying module 2-200 has a cleaning nozzle 2-284. The cleaning nozzle 2-284 has an upper cleaning nozzle 2-284a, disposed on the upper side of the conveying roller 2-202; and a lower cleaning nozzle 2-284b, disposed on the lower side. The upper cleaning nozzle 2-284a and the lower cleaning nozzle 2-284b are connected to a cleaning fluid supply source (not shown in the figures). The upper cleaning nozzle 2-284a is configured to supply cleaning fluid to the back surface of the substrate WF conveyed on the conveying roller 2-202. The lower cleaning nozzle 2-284b is configured to supply cleaning fluid to the polished surface of the substrate WF conveyed on the conveying roller 2-202. The upper cleaning nozzle 2-284a and the lower cleaning nozzle 2-284b are configured to have a width that is the same as or greater than the width of the substrate WF being transported on the conveying roller 2-202, thereby cleaning the entire substrate WF by transporting the substrate WF on the conveying roller 2-202.

[0123] <Pusher>

[0124] As shown in Figures 18 and 19, the conveying module 2-200 includes a pusher 2-230. The pusher 2-230 is configured to lift and transfer the substrate WF located on a plurality of conveying rollers 2-202 to the top ring 2-302. Furthermore, the pusher 2-230 is configured to transfer the substrate WF received from the top ring 2-302 to the conveying rollers 2-202 of the conveying module 2-200.

[0125] Figure 20 shows a perspective view of the pusher 2-230 in one embodiment. Figure 21 is a partial cross-sectional view of the pusher 2-230 shown in Figure 20, viewed in the direction of arrow 21. Figure 21 schematically shows the conveying roller 2-202, the substrate WF positioned on the conveying roller 2-202 for substrate transfer, and the top ring 2-302 receiving the substrate WF, together with the pusher 2-230. Furthermore, in the embodiments shown in Figures 20 and 21, the wedge mechanism and tilting mechanism described later are omitted for clarity of illustration.

[0126] In the embodiments shown in Figures 20 and 21, the pusher 2-230 includes a first platform 2-270 and a second platform 2-232. The second platform 2-232 is a platform used to support the retainer member 2-308 of the top ring 2-302 when the pusher 2-230 transfers the substrate WF to the top ring 2-302. The second platform 2-232 includes a plurality of support posts (second support posts) 2-234. Figure 22 shows a cross-sectional view of one support post of the second platform 2-232. As shown in Figure 22, one end of the support post 2-234 includes: a flat support surface 2-234a, which supports the retainer member 2-308 of the top ring 2-302 when transferring the substrate WF to and receiving the substrate WF from the top ring 2-302; and an inclined surface 2-234b, which guides the top ring 2-302. In one embodiment, the support pillars 2-234 located at the four corners of the plurality of support pillars 2-234 may also have a support surface 2-234a and an inclined surface 2-234b as shown in Figure 22. The recesses formed by the four corner support pillars 2-234 can position the retainer component 2-308. The support pillars 2-234 other than the four corners may only have a support surface 2-234a. The other end of each support pillar 2-234 is connected to a common base (second base) 2-236. Furthermore, each support pillar 2-234 is positioned so as not to interfere with the conveying roller 2-202. In the embodiment shown in Figure 21, each support pillar 2-234 is arranged between the conveying rollers 2-202.

[0127] The first platform 2-270 is configured to receive the substrate WF on the conveying roller 2-202. The first platform 2-270 includes a plurality of support pillars (first support pillars) 2-272. Figure 23 shows a cross-sectional view of one support pillar 2-272 of the first platform 2-270 according to one embodiment. As shown in Figure 23, one end of the support pillar 2-272 has a flat support surface 2-272a, which supports the substrate WF when transferring it to the top ring 2-302 and when receiving it from the top ring 2-302. An elastic suction pad 2-271 is provided on the support surface 2-272a. The support surface 2-272a supports the substrate WF via the suction pad 2-271. Alternatively, the suction pad 2-271 may not be provided. Furthermore, at least one of the plurality of support pillars 2-272 has an suction conduit 2-272b that opens into the support surface 2-272a. The suction conduit 2-272b is connected to the vacuum source 2-260. Thus, at least one of the plurality of support pillars 2-272 is configured to attract the substrate WF via the suction conduit 2-272b when receiving the substrate WF from the top ring 2-302. The other ends of each support pillar 2-272 are connected to a common base (first base) 2-274. Furthermore, each support pillar 2-272 is positioned to avoid interfering with the conveyor rollers 2-202; in the embodiment shown in Figure 21, each support pillar 2-272 is arranged between the conveyor rollers 2-202. Also, each support pillar 2-272 is configured to support non-patterned areas such as circuit patterns that do not form the polished surface of the substrate WF. The first platform 2-270 and the second platform 2-232, as detailed below, are respectively connected to the lifting mechanism and can move in the height direction (z-direction).

[0128] The second platform 2-232 is configured to move in the height direction (z-direction). In one embodiment, the pusher 2-230 has a second lifting mechanism 2-231. In one embodiment, as shown in Figures 20 and 21, the second lifting mechanism 2-231 of the pusher 2-230 is a pneumatic lifting mechanism, comprising a cylinder (third cylinder) 2-240 and a piston (third piston) 2-242. The end of the piston 2-242 is connected to a movable platform 2-244. The cylinder 2-240 is connected to a fixed platform 2-246. The fixed platform 2-246 is fixed to a housing 2-201 covering the entire conveying module 2-200 or to the ground on which the conveying module 2-200 is mounted. By adjusting the air pressure in the cylinder 2-240, the piston 2-242 moves, causing the movable platform 2-244 to move in the height direction (z-direction). Because the movable base 2-244 moves in the height direction, the first platform 2-270 and the second platform 2-232 can move in the height direction. In the illustrated embodiment, an XY platform 2-248 is mounted on the movable base 2-244, and the XY platform 2-248 can move the first platform 2-270 and the second platform 2-232 in the horizontal plane. The XY platform 2-248 can be a known XY platform, which is configured to move in two vertical directions by means of a linear guide or the like. In the illustrated embodiment, a rotary platform 2-250 is mounted on the XY platform 2-248. The rotary platform 2-250 is configured to rotate in the XY plane (horizontal plane). In other words, the rotary platform 2-250 is configured to rotate around the z-axis. The rotary platform 2-250 can be a known rotary platform 2-250 constructed of a rotary bearing or the like.

[0129] A first lifting mechanism 233 is mounted on the rotating platform 250. The first lifting mechanism 233 has a cylinder 252 and a piston 254. The cylinder 252 is connected to the base 236 of the second platform 232. Furthermore, a movable piston 254 is connected to the cylinder 252, and the piston 254 can be moved by adjusting the air pressure inside the cylinder 252. The base 274 of the first platform 270 is connected to the end of the piston 254. Therefore, by adjusting the air pressure inside the cylinder 252, the piston 254 and the first platform 270 can be moved in the height direction (z direction). In this way, the first lifting mechanism 2-233 can be configured such that when the substrate WF is received from the top ring 2-302, the base 2-274 is raised so that the support surface 2-272a contacts the substrate WF, and the base 2-274 is lowered while the substrate WF is being attracted through the suction pipe 2-272b. Furthermore, sensor 2-216b can be configured to detect whether substrate WF is present on support surface 2-272a. In this case, the first lifting mechanism 2-233 can be configured to, when receiving substrate WF from top ring 2-302, repeatedly raise and lower base 2-274 if sensor 2-216b detects no substrate WF while base 2-274 is lowered. That is, when substrate WF cannot be received normally from top ring 2-302, the first lifting mechanism 2-233 raises base 2-274 again, bringing support surface 2-272a into contact with substrate WF, and lowers base 2-274 while substrate WF is attracted via suction conduit 2-272b.

[0130] According to the above structure, the second lifting mechanism 2-231 moves both the first platform 2-270 and the second platform 2-232 in the height direction (z-direction), and the first lifting mechanism 2-233 moves the first platform 2-270 relative to the second platform 2-232 in the height direction (z-direction). Furthermore, the first platform 2-270 and the second platform 2-232 can move in the vertical directions (xy-direction) within the horizontal plane via the XY platform 2-248. Moreover, the first platform 2-270 and the second platform 2-232 can rotate within the horizontal plane (around the z-axis) via the rotating platform 2-250. Therefore, when receiving the substrate WF between the pusher 2-230 and the top ring 2-302 (described later), the pusher 2-230 and the top ring 2-302 can be positioned. Furthermore, in the illustrated embodiment, the first lifting mechanism 2-233 and the second lifting mechanism 2-231 are pneumatic lifting mechanisms, but these lifting mechanisms can also be hydraulic or electric lifting mechanisms using motors and ball screws. Through the second lifting mechanism 2-231, the second platform 2-232 and the first platform 2-270 can move between a lower position and an upper position.

[0131] Next, the transfer of substrate WF from pusher 2-230 to top ring 2-302 will be explained. Figure 21 shows the state where the first platform 2-270 and the second platform 2-232 are in the lower position. When substrate WF is transferred to top ring 2-302, pusher 2-230, from the state shown in Figure 21, raises the first platform 2-270 and the second platform 2-232 using the second lifting mechanism 2-231. Here, pusher 2-230 brings the adsorption pad 2-271 into contact with substrate WF and lifts substrate WF, while the support surface 2-234a of the support pillar 2-234 supports the holder member 2-308 of top ring 2-302. Then, pusher 2-230 raises the first platform 2-270 relative to the second platform 2-232 using the first lifting mechanism 2-233, so that substrate WF contacts top ring 2-302. In this state, the substrate WF is adsorbed by the top ring 2-302 and transferred to the top ring 2-302 by the vacuum attraction of the pressure chamber P1 of the top ring 2-302. The substrate WF transferred to the top ring 2-302 is then polished using the polishing module 2-300. After the substrate WF is transferred to the top ring 2-302, the pusher 2-230 returns to the state shown in Figure 21. Furthermore, the vacuum attraction of the vacuum source 2-260 is stopped when the substrate WF is transferred to the top ring 2-302.

[0132] Next, the transfer of substrate WF from top ring 2-302 to pusher 2-230 will be explained. When pusher 2-230 receives substrate WF from top ring 2-302, from the state shown in Figure 21, the first platform 2-270 and the second platform 2-232 are raised by the second lifting mechanism 2-231, and the retainer member 2-308 of top ring 2-302 is supported by the support surface 2-234a of support column 2-234. Then, pusher 2-230 raises the first platform 2-270 relative to the second platform 2-232 by the first lifting mechanism 2-233, so that substrate WF contacts adsorption pad 2-271. Then, pusher 2-230 adsorbs substrate WF through adsorption pad 2-271 by vacuum suction performed by vacuum source 2-260. On the other hand, top ring 2-302 stops vacuum suction on pressure chamber P1, and pressurized fluid such as pressurized air is supplied to pressure chamber P1 through fluid line 2-312. In this state, it is assumed that by lowering the pusher 2-230, the substrate WF can be peeled off from the top ring 2-302. However, due to the strong surface tension between the substrate WF and the top ring 2-302, even if the pusher 2-230 is lowered, there is a problem that the substrate WF cannot be peeled off from the top ring 2-302.

[0133] <Wedge Mechanism>

[0134] In this embodiment, a wedge mechanism is employed to improve the reliability of transferring the substrate WF from the top ring 2-302 to the pusher 2-230. Figure 24 schematically shows a perspective view of the wedge mechanism of one embodiment. Figure 24 is an enlarged view of area AA in Figure 20 to schematically represent the wedge mechanism. Figure 25 schematically shows a plan view and a cross-sectional view of the wedge mechanism of one embodiment. Figure 25(A) schematically shows a plan view of the wedge mechanism. Figure 25(B) is an enlarged view of area BB in Figure 25(A), and Figure 25(C) is a cross-sectional view showing the CC section of Figure 25(B).

[0135] As shown in Figures 24 and 25, the substrate processing apparatus of this embodiment includes two wedge mechanisms 2-235 provided on the support pillars 2-234. The two wedge mechanisms 2-235 are configured to clamp the corners of the rectangular substrate WF. Since the two wedge mechanisms 2-235 have the same structure, only one wedge mechanism 2-235 will be described below as representative. Furthermore, in this embodiment, it is exemplified that one of the four support pillars 2-234 is provided with two wedge mechanisms 2-235, but it is not limited to this, and wedge mechanisms 2-235 may be provided on a plurality of support pillars 2-234. Also, the wedge mechanisms 2-235 may be provided on components other than the support pillars 2-234.

[0136] The wedge mechanism 2-235 includes a wedge-shaped member 2-238 that is inserted between the substrate WF and the top ring 2-302. The wedge-shaped member 2-238 is disposed on the side of the substrate WF held by the elastic pad 2-310 of the top ring 2-302 when the substrate WF is transferred from the top ring 2-302 to the pusher 2-230. The wedge-shaped member 2-238 has a wedge shape that allows it to be inserted between the substrate WF and the top ring 2-302. Specifically, the wedge-shaped member 2-238 has: a first surface 2-238a extending parallel to the back surface of the substrate WF; and a second surface 2-238b inclined to face the first surface 2-238a and tapering towards the substrate WF. The substrate WF-side ends of the first surface 2-238a and the second surface 2-238b are connected, forming an acute angle front end 2-238e between the first surface 2-238a and the second surface 2-238b. The wedge-shaped member 2-238 has a third surface 2-238c, which is an end on the opposite side of the substrate WF connecting the first surface 2-238a and the second surface 2-238b. In this embodiment, the wedge-shaped member 2-238 is positioned on the support post 2-234 with the retainer member 2-308 of the top ring 2-302 supported by the support surface 2-234a of the support post 2-234, such that the acute front end 2-238e of the wedge-shaped member 2-238 is disposed on the side of the contact surface between the elastic pad 2-310 and the back surface of the substrate WF.

[0137] The wedge mechanism 2-235 includes a drive member 2-237, configured such that the wedge member 2-238 moves along the back surface of the substrate WF and is inserted between the back surface of the substrate WF and the elastic pad 2-310 of the top ring 2-302. In one example, the drive member 2-237 is a pneumatic drive mechanism, comprising a piston connected to the wedge member 2-238 and a cylinder housing the piston. By adjusting the air pressure within the cylinder, the wedge member 2-238 is moved reciprocally along the back surface of the substrate WF via the piston. However, the drive member 2-237 is not limited to this and can employ a known mechanism.

[0138] When the wedge mechanism 2-235 transfers the substrate WF from the top ring 2-302 to the pusher 2-230, as shown in Figure 25(C), the wedge member 2-238 is inserted between the back of the substrate WF and the elastic pad 2-310 of the top ring 2-302. This counteracts the surface tension acting between the substrate WF and the top ring 2-302, allowing the end of the substrate WF to peel off from the elastic pad 2-310. Since the end of the substrate WF is peeled off from the elastic pad 2-310, surrounding gas (air) easily enters between the substrate WF and the top ring 2-302. Therefore, while the pusher 2-230 is holding the substrate WF in place via the adsorption pad 2-271, the entire substrate WF can be easily peeled off from the elastic pad 2-310 by lowering the first platform 2-270. According to this embodiment of the substrate processing apparatus, the reliability of transferring the substrate WF from the top ring 2-302 to the pusher 2-230 is improved.

[0139] Figure 26 schematically shows a cross-sectional view of a modified wedge mechanism. As shown in Figure 26, the modified wedge member 2-238 has a cavity 2-238d that opens into the second surface 2-238b through the interior of the wedge member 2-238. In this embodiment, the cavity 2-238d is formed to connect the second surface 2-238b and the third surface 2-238c of the wedge member 2-238, but is not limited thereto. The wedge mechanism 2-235 includes a fluid supply source 2-239 that can inject fluid (e.g., air or nitrogen gas) from the second surface 2-238b via the cavity 2-238d.

[0140] In the modified example, when the wedge mechanism 2-235 transfers the substrate WF from the top ring 2-302 to the pusher 2-230, the wedge member 2-238 is inserted between the back of the substrate WF and the elastic pad 2-310 of the top ring 2-302, as described above. Then, the wedge mechanism 2-235 sprays fluid from the second surface 2-238b via the cavity 2-238d using the fluid supply source 2-239. According to this modified example, by inserting the wedge member 2-238 between the back of the substrate WF and the elastic pad 2-310 of the top ring 2-302, a gap is formed between the end of the substrate WF and the elastic pad 2-310, and by spraying fluid into the gap from the second surface 2-238b, the entire substrate WF can be easily peeled off from the elastic pad 2-310. Therefore, when the pusher 2-230 is holding the substrate WF in place via the adsorption pad 2-271, the entire substrate WF can be easily peeled off from the elastic pad 2-310 by lowering the first platform 2-270. According to this modified substrate processing apparatus, the reliability of transferring the substrate WF from the top ring 2-302 to the pusher 2-230 can be improved. Furthermore, as described above, when transferring the substrate WF from the top ring 2-302 to the pusher 2-230, pressurized fluid such as pressurized air can be supplied to the pressure chamber (airbag) P1 in the substrate processing apparatus 2-1000. Here, because the elastic pad 2-310 expands and its lower surface bends downwards, a gap can be made between the elastic pad 2-310 and the outer periphery of the substrate WF to facilitate the insertion of the wedge-shaped member 2-238. In addition, pressurized fluid, such as pressurized air, is supplied to the back side of the substrate WF through a plurality of openings (not shown) on the substrate holding surface of the pressure chamber P1 and the elastic pad 2-310. As a result, because the substrate WF can be easily peeled off from the elastic pad 2-310, the reliability and speed of transferring the substrate WF from the top ring 2-302 to the pusher 2-230 can be improved. By improving the speed of transferring the substrate WF from the top ring 2-302 to the pusher 2-230, the substrate WF transport time can be reduced, thereby increasing the output of the substrate processing apparatus 2-1000.

[0141] <Tilt Mechanism>

[0142] Next, the tilting mechanism used to tilt the first platform 2-270 of the pusher 2-230 will be described. Figures 27-30 show a schematic cross-sectional view of one embodiment of the tilting mechanism. In Figures 27-30, for clarity, the second lifting mechanism 2-231 and the wedge mechanism 2-235 are omitted. Figure 27 shows the state from that shown in Figure 21, where the first platform 2-270 and the second platform 2-232 are raised by the second lifting mechanism 2-231, and further, the first platform 2-270 is raised relative to the second platform 2-232 by the first lifting mechanism 2-233, with the substrate WF contacting the adsorption pad 2-271.

[0143] As shown in Figure 27, the substrate processing apparatus of this embodiment includes a tilting mechanism 2-251 for tilting a first platform 2-270. The tilting mechanism 2-251 includes a first rotating shaft 2-253 mounted at the center of the bottom surface of the first platform 2-270. The first rotating shaft 2-253 is disposed between a piston 2-254 and the first platform 2-270. In other words, the piston 2-254 supports the first platform 2-270 via the first rotating shaft 2-253. The tilting mechanism 2-251 includes a shaft 2-256 extending laterally from the piston 2-254; a second rotating shaft 2-258 mounted at the end of the bottom surface of the first platform 2-270; and a piston 2-257 (second piston) supporting the first platform 2-270 via the second rotating shaft 2-258. Furthermore, the tilting mechanism 2-251 includes: a third rotating shaft 2-259 mounted on top of shaft 2-256; and a cylinder 2-255 (second cylinder) configured to raise and lower piston 2-257. Cylinder 2-255 is supported by shaft 2-256 via the third rotating shaft 2-259. In this embodiment, the first rotating shaft 2-253, the second rotating shaft 2-258, and the third rotating shaft 2-259 are hinge-like rotating shafts extending in the x-axis direction, but are not limited thereto. The first rotating shaft 2-253, the second rotating shaft 2-258, the third rotating shaft 2-259, piston 2-254, shaft 2-256, piston 2-257, and cylinder 2-255 form a ring mechanism, configured to allow the first platform 2-270 to tilt around the first rotating shaft 2-253 via the ring mechanism. Furthermore, in this embodiment, a first rotating shaft 2-253 is provided at the center of the bottom surface of the first platform 2-270, and a second rotating shaft 2-258 is installed at the end of the bottom surface of the first platform 2-270. However, it is not limited to this, and the installation positions of the first rotating shaft 2-253 and the second rotating shaft 2-258 are arbitrary.

[0144] Figure 28 shows the state after peeling off the end of the substrate WF from the state shown in Figure 27. As shown in Figure 28, the pusher 2-230 is configured such that when the substrate WF is transferred from the top ring 2-302 to the pusher 2-230, the first platform 2-270 is tilted by the tilting mechanism 2-251, and the end of the substrate WF is peeled off from the top ring 2-302. Specifically, the pusher 2-230 uses the wedge mechanism 2-235 to insert the wedge member 2-238 between the substrate WF and the top ring 2-302. Then, the pusher 2-230 lowers the entire first platform 2-270 by the lowering piston 2-254, and rotates (tilts) the first platform 2-270 clockwise about the first rotation axis 2-253 by the lowering piston 2-257. According to this embodiment, by inserting the wedge member 2-238, a gap is formed between the end of the substrate WF and the top ring 2-302. Furthermore, by tilting the first platform 2-270 to peel off the end of the substrate WF that forms the gap, gas can easily enter the entire substrate WF from the gap, so the substrate WF can be easily peeled off from the top ring 2-302 with a small force.

[0145] Figure 29 shows the state where the first platform 2-270 is lowered using the first lifting mechanism 2-233 after the end of the substrate WF has been peeled off from the top ring 2-302 as shown in Figure 28. As shown in Figure 29, the pusher 2-230 can lower the first platform 2-270 while maintaining an inclined state by lowering the piston 2-254. In this way, as shown in Figure 29, the entire substrate WF can be peeled off from the top ring 2-302. Furthermore, after the pusher 2-230 inserts the wedge-shaped member 2-238 between the substrate WF and the top ring 2-302, at any time during the process of peeling off the substrate WF from the top ring 2-302 using the tilting mechanism 2-251 and the first lifting mechanism 2-233, fluid can be ejected from the second surface 2-238b via the cavity 2-238d by the fluid supply source 2-239. By spraying fluid between the top ring 2-302 and the substrate WF, the surface tension between the two is weakened, thus further improving the reliability of transferring the substrate WF from the top ring 2-302 to the pusher 2-230.

[0146] Figure 30 shows the tilting mechanism 2-251 used to bring the first platform 2-270 to a horizontal position, moving it from the state shown in Figure 29. As shown in Figure 30, the pusher 2-230, via the rising piston 2-257, can rotate the first platform 2-270 counterclockwise around the first rotation axis 2-253, returning the first platform 2-270 and the substrate WF to a horizontal position. After returning to the state shown in Figure 30, the pusher 2-230 can use the second lifting mechanism 2-231 to lower the first platform 2-270 and the second platform 2-232, transferring the substrate WF to the transfer roller 2-202.

[0147] The above describes some embodiments of the present invention. However, these embodiments are provided for ease of understanding and are not intended to limit the invention. The present invention can be modified and improved without departing from its spirit, and its equivalents are included. Furthermore, within the scope of solving at least some of the aforementioned problems or achieving at least some of the functions, the constituent elements described in the claims and specification can be arbitrarily combined or omitted.

[0148] Based on the above implementation methods, at least the following technical concepts can be grasped.

[0149] [Form 1] According to Form 1, a pusher is provided, the pusher comprising: a plurality of first support pillars having a support surface at one end for supporting a substrate; a first base connected to the other end of the plurality of first support pillars; and a first lifting mechanism for lifting the first base, wherein the support surface is configured to support the substrate when the substrate is transferred to the top ring and when the substrate is received from the top ring; at least one of the plurality of first support pillars is provided with a suction conduit connected to a vacuum source and opening in the support surface.

[0150] [Modulation 2] According to Configuration 2, at least one of the aforementioned plurality of first support pillars is configured to attract the aforementioned substrate via the aforementioned attraction conduit when receiving the aforementioned substrate from the aforementioned top ring.

[0151] [Modal 3] According to mode 3, the aforementioned first lifting mechanism is configured such that when the aforementioned substrate is received from the aforementioned top ring, the aforementioned first base is raised and the aforementioned support surface contacts the aforementioned substrate, and the aforementioned first base is lowered while the aforementioned substrate is attracted through the aforementioned suction pipe.

[0152] [Form 4] According to Form 4, the pusher further includes: a sensor for detecting whether there is a substrate on the aforementioned support surface; the aforementioned first lifting mechanism is configured to, when receiving the aforementioned substrate from the aforementioned top ring, repeat the lifting of the aforementioned first base when the aforementioned sensor detects that there is no substrate while the aforementioned first base is lowered.

[0153] [Form 5] According to Form 5, the pusher further includes: a plurality of second support posts having a support surface at one end, the support surface being used to support the top ring when the aforementioned substrate is transferred to the aforementioned top ring and when the aforementioned substrate is received from the aforementioned top ring; a second base connected to the other end of the plurality of second support posts; and a second lifting mechanism for lifting the aforementioned first base and the aforementioned second base.

[0154] [Form 6] According to Form 6, a substrate conveying apparatus is provided for conveying a substrate. The substrate conveying apparatus includes: a plurality of first conveying rollers configured to support the lower surface of a substrate; a plurality of first roller shafts on which the plurality of first conveying rollers are mounted; a motor for rotating the plurality of first roller shafts; and a pusher as described above for lifting the substrate on the plurality of first conveying rollers, transferring it to the top ring, and placing the substrate received from the top ring onto the plurality of first conveying rollers, wherein the pusher is configured such that the plurality of first support posts pass through the gaps between the plurality of first roller shafts.

[0155] [Modulation 7] According to Modulation 7, the aforementioned pusher is configured such that the aforementioned plurality of first support columns and the aforementioned plurality of second support columns pass through the gap between the aforementioned plurality of first rollers.

[0156] [Version 8] According to Version 8, the substrate conveying device further includes: a plurality of second conveying rollers configured to support the upper surface of the aforementioned substrate; and a plurality of second roller shafts on which the aforementioned plurality of second conveying rollers are mounted, wherein the aforementioned motor is configured to rotate the aforementioned first roller shaft and the aforementioned second roller shaft.

[0157] [Form 9] According to Form 9, the substrate conveying device further includes: a thickness sensor for measuring the thickness of the substrate; and a driving device for adjusting the interval between the plurality of first conveying rollers and the plurality of second conveying rollers by moving at least one position of the plurality of first conveying rollers and the plurality of second conveying rollers in response to the measurement result of the thickness sensor.

[0158] [Form 10] According to Form 10, a substrate processing apparatus is provided, further comprising: an elastic member configured to push the aforementioned second conveying roller toward the aforementioned first conveying roller.

[0159] [Form 11] According to Form 11, a substrate processing apparatus is provided, comprising: a polishing module for polishing a substrate; a conveying module for conveying a substrate; and a drying module for drying the substrate, wherein the aforementioned conveying module comprises any of the substrate conveying devices described above.

[0160] [Form 12] As one embodiment of this application, a substrate processing apparatus is disclosed, comprising: a top ring configured to hold the back side of a substrate in a state where the surface to be ground is facing downwards; a pusher configured to transfer the substrate between the top rings; and a wedge mechanism comprising: a wedge member disposed on the side of the substrate held in the top rings when the substrate is transferred from the top rings to the pusher; and a drive member configured to move the wedge member along the back side of the substrate and insert it between the substrate and the top rings.

[0161] [Form 13] Furthermore, as one embodiment of this application, a substrate processing apparatus is disclosed, wherein the aforementioned wedge-shaped member has: a first surface extending parallel to the back surface of the aforementioned substrate; and a second surface inclined to face the aforementioned first surface and tapering toward the aforementioned substrate.

[0162] [Form 14] Furthermore, as one embodiment of this application, a substrate processing apparatus is disclosed, wherein the aforementioned wedge-shaped member has a cavity that opens into the aforementioned second surface through the interior of the aforementioned wedge-shaped member; the aforementioned wedge-shaped mechanism further includes: a fluid supply source that can spray fluid from the aforementioned second surface through the aforementioned cavity.

[0163] [Form 15] Furthermore, as one embodiment of this application, a substrate processing apparatus is disclosed, wherein the aforementioned pusher includes: a first platform for transferring the aforementioned substrate between the aforementioned top rings; a first lifting mechanism for lifting the aforementioned first platform; and a tilting mechanism for tilting the aforementioned first platform.

[0164] [Form 16] Furthermore, as one embodiment of this application, a substrate processing apparatus is disclosed, wherein the aforementioned pusher is configured to tilt the aforementioned first platform by using the aforementioned tilting mechanism when the aforementioned substrate is transferred from the aforementioned top ring to the aforementioned pusher, and the end of the aforementioned substrate is peeled off from the aforementioned top ring.

[0165] [Form 17] Furthermore, as one embodiment of this application, a substrate processing apparatus is disclosed, wherein the aforementioned pusher is configured to peel off the end of the aforementioned substrate from the aforementioned top ring, and then use the aforementioned first lifting mechanism to lower the aforementioned first platform, while using the aforementioned tilting mechanism to make the aforementioned first platform horizontal.

[0166] [Form 18] Furthermore, as an embodiment of this application, a substrate processing apparatus is disclosed, wherein the first lifting mechanism includes: a first piston supporting the bottom surface of the aforementioned first platform; and a first cylinder configured to lift the aforementioned first piston; the aforementioned tilting mechanism includes: a first rotating shaft disposed between the aforementioned first piston and the aforementioned first platform; a shaft extending laterally from the aforementioned first piston; a second rotating shaft mounted on the bottom surface of the aforementioned first platform; a second piston supporting the aforementioned first platform via the aforementioned second rotating shaft; a third rotating shaft mounted on the upper surface of the aforementioned shaft; and a second cylinder configured to lift the aforementioned second piston.

[0167] [Form 19] Furthermore, as an embodiment of this application, a substrate processing apparatus is disclosed, wherein the aforementioned first platform includes: a plurality of first support pillars having a support surface at one end, the support surface being used to support the aforementioned substrate via an adsorption pad; and a first base connected to the other end of the plurality of first support pillars, wherein at least one of the plurality of first support pillars is formed with an adsorption conduit, the adsorption conduit being connected to a vacuum source and having an opening in the aforementioned support surface.

[0168] [Form 20] Furthermore, as one embodiment of this application, a substrate processing apparatus is disclosed, which further includes: a second platform for supporting the top rings when transferring the substrate between the top rings; and a second lifting mechanism for lifting the first platform and the second platform; the second platform includes: a plurality of second support pillars having a support surface at one end, the support surface being used to support the top rings when transferring the substrate between the top rings; and a second base connected to the other end of the plurality of second support pillars; and the wedge-shaped member being disposed on at least one of the plurality of second support pillars.

[0169] 8, 14, AB, AC: Arrows

[0170] 10: Pattern Area

[0171] 12: ID tags

[0172] 20: Non-patterned area

[0173] 100, 2-100: Loading Module

[0174] 200, 200A, 200B, 2-200, 2-200A, 2-200B: Conveying Modules

[0175] 201, 2-201: Shell

[0176] 202, 2-202: Conveying roller

[0177] 204, 2-204: Rollers

[0178] 206, 2-206, 282a, 282b: Gears

[0179] 208, 2-208, 209: Motors

[0180] 210: Screw

[0181] 211: Drive unit

[0182] 212, 2-212: Guide rollers

[0183] 216, 216a~216g, 2-216, 2-216a~2-216g: Sensor

[0184] 217: Thickness sensor

[0185] 218, 2-218: Entrance gate

[0186] 220, 2-220: Stopper

[0187] 222, 2-222: Stopper moving mechanism

[0188] 230, 2-230: Pusher

[0189] 231, 2-231: Second lifting mechanism

[0190] 232, 2-232: Second Platform

[0191] 233, 2-233: First lifting mechanism

[0192] 234, 272, 2-234, 2-272: Supporting columns

[0193] 234a, 272a, 2-234a, 2-272a: Support surface

[0194] 234b, 2-234b: Inclined surface

[0195] 2-235: Wedge Mechanism

[0196] 236, 274, 2-236, 2-274, 295: Base

[0197] 2-237: Drive components

[0198] 2-238: Wedge-shaped component

[0199] 2-238a: First page

[0200] 2-238b: Second page

[0201] 2-238c: Third side

[0202] 2-238d: point

[0203] 2-238e: Frontend

[0204] 2-239: Fluid supply source

[0205] 240, 252, 2-240, 2-255: Cylinder

[0206] 242, 254, 2-242, 2-254, 2-257: Pistons

[0207] 244, 2-244: Movable base

[0208] 246, 2-246: Fixed base

[0209] 248, 2-248: XY platform

[0210] 250, 2-250: Rotary platform

[0211] 2-251: Tilting Mechanism

[0212] 2-253: First Rotation Axis

[0213] 2-256: Axis

[0214] 2-258: Second Rotation Axis

[0215] 2-259: Third Rotation Axis

[0216] 260, 2-260: Vacuum source

[0217] 270, 2-270: First Platform

[0218] 2-271: Adsorption pad

[0219] 272b, 2-272b: Suction tubing

[0220] 284, 2-284: Clean the nozzle

[0221] 284a, 2-284a: Upper cleaning nozzle

[0222] 284b, 2-284b: Lower cleaning nozzle

[0223] 286: Exit Gate

[0224] 290, 2-290: Upper conveying roller

[0225] 291: Upper roller shaft

[0226] 292: Supporting components

[0227] 296: Elastic Components

[0228] 300, 300A, 300B, 2-300, 2-300A, 2-300B: Grinding Module

[0229] 302, 2-302: Top ring

[0230] 304, 2-304: Top ring shaft

[0231] 306, 2-306: Head body

[0232] 308, 2-308: Retainer component

[0233] 310, 2-310: Elastic Pad

[0234] 312, 2-312: Fluid piping

[0235] 314, 2-314: Elastic airbag

[0236] 316, 2-316: Fluid piping

[0237] 350, 2-350: Grinding platform

[0238] 351, 2-351: Platform axis

[0239] 352, 2-352: Grinding pad

[0240] 353, 2-353: Passage

[0241] 354, 2-354: Grinding fluid supply nozzle

[0242] 355, 2-355: Opening

[0243] 356, 2-356: Dresser

[0244] 357, 2-357: Through hole

[0245] 358, 2-358: Sprayer

[0246] 360, 2-360: Arm

[0247] 362, 2-362: Rotation axis

[0248] 500, 2-500: Drying module

[0249] 530, 2-530: Nozzle

[0250] 600, 2-600: Unload module

[0251] 900, 2-900: Control device

[0252] 1000, 2-1000: Substrate processing apparatus

[0253] P1, Pr: Pressure chamber

[0254] WF: substrate

Claims

1. A pusher comprising: a plurality of first support pillars, each having a support surface at one end for supporting a rectangular substrate; a first base connected to the other end of the plurality of first support pillars; and a first lifting mechanism for lifting the first base, wherein the support surface is configured to support the substrate when the substrate is transferred to a top ring and when the substrate is received from the top ring; at least one of the plurality of first support pillars forms a suction conduit, the suction conduit being connected to a vacuum source and opening into the support surface, the plurality of first support pillars tapering toward the support surface, the pusher further comprising: A plurality of second support pillars, each having a support surface at one end, the support surface being used to support the top ring when the aforementioned substrate is transferred to the aforementioned top ring and when the aforementioned substrate is received from the aforementioned top ring; a second base, connected to the other end of the plurality of second support pillars; and a second lifting mechanism for lifting the aforementioned first base and the aforementioned second base at one end of each of the aforementioned second support pillars located at the four corners of the plurality of second support pillars, wherein the aforementioned support surface of the aforementioned second support pillar is a flat support surface that supports the aforementioned top ring when the aforementioned substrate is received from the aforementioned top ring, and includes an inclined surface for guiding the aforementioned top ring.

2. The pusher as claimed in claim 1, wherein at least one of the aforementioned plurality of first support posts is configured to attract the substrate via the aforementioned attraction conduit when receiving the substrate from the aforementioned top ring.

3. The pusher as claimed in claim 1, wherein the aforementioned first lifting mechanism is configured to, when receiving the aforementioned substrate from the aforementioned top ring, raise the aforementioned first base and bring the aforementioned support surface of the aforementioned first support column into contact with the aforementioned substrate, and lower the aforementioned first base while attracting the aforementioned substrate via the aforementioned suction conduit.

4. The pusher as described in claim 3 further includes: a sensor for detecting whether there is a substrate on the aforementioned support surface of the aforementioned first support post; the aforementioned first lifting mechanism is configured to, when receiving the aforementioned substrate from the aforementioned top ring, repeat the lifting and lowering of the aforementioned first base when the aforementioned sensor detects that there is no substrate while the aforementioned first base is lowered.

5. A substrate conveying apparatus for conveying a substrate, comprising: a plurality of first conveying rollers configured to support the lower surface of the substrate; a plurality of first roller shafts on which the plurality of first conveying rollers are mounted; a motor for rotating the plurality of first roller shafts; and a pusher as claimed in claim 1 for lifting the substrate on the plurality of first conveying rollers, transferring it to the top ring, and placing the substrate received from the top ring onto the plurality of first conveying rollers, wherein the pusher is configured such that the plurality of first support posts pass through the gaps between the plurality of first roller shafts.

6. The substrate conveying apparatus as described in claim 5, wherein: The aforementioned pusher is configured such that the aforementioned plurality of first support columns and the aforementioned plurality of second support columns pass through the gap between the aforementioned plurality of first rollers.

7. The substrate conveying apparatus as claimed in claim 5 further comprises: a plurality of second conveying rollers configured to support the upper surface of the substrate; and a plurality of second roller shafts on which the plurality of second conveying rollers are mounted, wherein the motor is configured to rotate the first roller shaft and the second roller shaft.

8. The substrate conveying apparatus as claimed in claim 7 further comprises: a thickness sensor for measuring the thickness of the substrate; and a driving device for adjusting the spacing between the plurality of first conveying rollers and the plurality of second conveying rollers by moving the position of at least one of the plurality of first conveying rollers and the plurality of second conveying rollers in response to the measurement result of the thickness sensor.

9. The substrate conveying apparatus as claimed in claim 8 further includes: an elastic member configured to push the second conveying roller toward the first conveying roller.

10. A substrate processing apparatus comprising: a polishing module for polishing a substrate; a conveying module for conveying the substrate; and a drying module for drying the substrate, wherein the aforementioned conveying module comprises the substrate conveying apparatus of claim 5.

11. A substrate processing apparatus comprising: a top ring configured to hold the back surface of a substrate with the surface to be ground facing downwards; a pusher configured to transfer the substrate between the top rings; and a wedge mechanism comprising: a wedge-shaped member disposed on a side of the substrate held in the top rings when the substrate is transferred from the top rings to the pusher; and a driving member configured to move the wedge-shaped member along the back surface of the substrate and insert it between the substrate and the top rings, wherein the pusher comprises: a first platform for transferring the substrate between the top rings; and a first lifting mechanism for moving the first platform... The device includes a lifting mechanism and a tilting mechanism for tilting the first platform. The pusher is configured to tilt the first platform using the tilting mechanism when transferring the substrate from the top ring to the pusher. The pusher is configured to peel off the end of the substrate from the top ring, and after peeling off the end of the substrate from the top ring, the first lifting mechanism lowers the first platform while simultaneously using the tilting mechanism to level the first platform. The first lifting mechanism includes: a first piston supporting the bottom surface of the first platform; and a first cylinder configured to lift the first piston. The tilting mechanism includes: a first rotating shaft disposed between the first piston and the first platform; a shaft extending laterally from the first piston; a second rotating shaft mounted on the bottom surface of the first platform; a second piston supporting the first platform via the second rotating shaft; a third rotating shaft mounted on the upper surface of the shaft; and a second cylinder configured to be supported by the shaft via the third rotating shaft, thereby lifting the second piston.

12. The substrate processing apparatus of claim 11, wherein the wedge-shaped member has: a first surface that extends parallel to the back surface of the substrate; and a second surface that is inclined to face the first surface and tapers toward the substrate.

13. The substrate processing apparatus of claim 12, wherein the aforementioned wedge member has a cavity that opens through the interior of the aforementioned wedge member into the aforementioned second surface; the aforementioned wedge mechanism further includes: a fluid supply source capable of ejecting fluid from the aforementioned second surface through the aforementioned cavity.

14. The substrate processing apparatus of claim 11, wherein the first platform comprises: a plurality of first support pillars having a support surface at one end, the support surface being used to support the substrate via an adsorption pad; and a first base connected to the other end of the plurality of first support pillars, wherein an adsorption channel is formed in at least one of the plurality of first support pillars, the adsorption channel being connected to a vacuum source and opening in the support surface.

15. The substrate processing apparatus of claim 11, further comprising: a second platform for supporting the top rings when transferring a substrate between the top rings; and a second lifting mechanism for lifting the first platform and the second platform; the second platform comprising: a plurality of second support pillars having a support surface at one end, the support surface being used to support the top rings when transferring a substrate between the top rings; and a second base connected to the other end of the plurality of second support pillars; and the wedge-shaped member disposed on at least one of the plurality of second support pillars.

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