Handle for wafer carrier

Abstract

This invention discloses a handle for a wafer carrier, the handle comprising: an insertable member configured to be inserted into an aperture of the wafer carrier; and a locking mechanism movable relative to the insertable member. In an engaged state, a tab of the insertable member retains the insertable member in the aperture. In a locked state, the locking mechanism holds the tab in the engaged state, and a flexible member of the locking mechanism is positioned to hold the locking mechanism in the locked state. A wafer carrier includes the removable handle and the locking mechanism.

Description

Technical Field

[0001] This invention generally relates to a front-opening substrate container. More specifically, this invention relates to a handle for a front-opening substrate container. Prior Technology

[0002] A semiconductor device may be made from a wafer substrate. The wafer substrate, or simply wafer, undergoes a series of manufacturing steps. For example, the manufacturing steps may include, but are not limited to, material layer deposition, doping, etching, or causing chemical or physical reactions of (some) materials of the substrate. One or more wafers may be stored and transported in a front-opening substrate container before, during, or after manufacturing. In some manufacturing steps, the wafer may be processed while still in the front-opening substrate container. The front-opening substrate container protects the stored wafers from physical damage (e.g., impact) and contamination. Summary of the Invention

[0003] This invention generally relates to an open-type substrate container for storing or transporting wafers. More specifically, this invention relates to a handle for an open-type substrate container.

[0004] This invention discloses a handle for a wafer carrier. The handle includes a body, an insertable member having a tab, and a locking mechanism having a flexible extension. The insertable member is configured to be inserted into an aperture in the wafer carrier. In an engaged state, the insertable member is held in the aperture. The locking mechanism is movable between a locked state and an unlocked state. In the locked state, the locking mechanism holds the tab in the engaged state, and the flexible extension is positioned to hold the locking mechanism in the locked state.

[0005] In one embodiment, the tab is disposed on a first side of the insertable member. The insertable member includes a second side opposite the first side, and in the locked state, the locking member extends along the second side.

[0006] In one embodiment, the handle includes a protrusion disposed at a first end of one of the bodies. The protrusion includes a first portion and a second portion extending in different directions. The protrusion is configured to engage a rail of the wafer carrier to help secure the handle to the wafer carrier.

[0007] This invention discloses a wafer carrier. The wafer carrier includes an outer surface, a handle, and a locking mechanism. The wafer carrier also includes a protrusion extending from the outer surface. An aperture is defined by the protrusion and lies between the outer surface and the protrusion. The handle is attached to the outer surface of the wafer carrier and includes a body. The body includes an insertable member extending into the aperture of the wafer carrier to secure the handle to the outer surface. The insertable member includes a tab that, in an engaged state, retains the insertable member within the aperture. The locking mechanism includes a flexible member movable relative to the insertable member between a locked state and an unlocked state. In the locked state, the locking mechanism holds the tab in the engaged state, and the flexible extension holds the locking mechanism in the locked state.

[0008] In one embodiment, the locking mechanism moves from the unlocked state to the locked state in one of the directions parallel to the direction in which the insertable member is inserted into the orifice.

[0009] In one embodiment, the wafer carrier includes a rail extending along its outer surface, and the handle includes a protrusion disposed at a first end of a body of the handle. The protrusion is configured to engage the rail of the wafer carrier to aid in securing the handle. In one embodiment, the protrusion is moved to engage the rail in the same direction as the insertable member is inserted into the aperture of the wafer carrier. In one embodiment, the engagement of the protrusion with the rail inhibits movement of the handle away from or toward a first side of the wafer carrier.

[0010] In one embodiment, the wafer carrier is a front-opening wafer cassette (FOUP). In another embodiment, the wafer carrier is a front-opening transport cassette (FOSB). Simple Explanation of the Diagram

[0011] The invention can be more fully understood by taking into account the following description of various illustrative embodiments with reference to the accompanying drawings.

[0012] Figure 1 is a right perspective view of one of the wafer carriers according to one embodiment of the present invention.

[0013] Figure 2 is a left perspective view of one of the wafer carriers without a front door shown in Figure 1.

[0014] Figure 3 is a front view of one of the wafer carriers shown in Figure 1 that does not have a front door.

[0015] Figure 4 is a side view of a wafer carrier without a front door shown in Figure 1.

[0016] Figure 5 is a right-side perspective view of one of the wafer carriers in Figure 1, where the handle has been removed.

[0017] Figure 6A is a side view of a detachable handle for a wafer carrier according to an embodiment.

[0018] Figure 6B is a front view of one of the detachable handles shown in Figure 6A.

[0019] Figure 6C is a rear view of one of the detachable handles shown in Figure 6A.

[0020] Figure 7 is a perspective view of a locking mechanism for a removable handle of a wafer carrier according to an embodiment.

[0021] Figure 8A is a cross-sectional view of one of the wafer carriers shown in Figure 3 along line VIII-VIII.

[0022] Figure 8B is an enlarged view of region B shown in Figure 8A.

[0023] Figure 8C is an enlarged view of region C shown in Figure 8A.

[0024] Figure 9 is a cross-sectional view of a portion of the wafer carrier shown in Figure 4 along line IX-IX.

[0025] Figure 10 is a perspective view of a portion of a wafer carrier according to one embodiment of the present invention.

[0026] Figure 11 is a front perspective view of one of the locking mechanisms of the wafer carrier shown in Figure 10.

[0027] Figure 12 is a side perspective view of the locking mechanism of the wafer carrier shown in Figure 10.

[0028] Figure 13 is a perspective view of a portion of a wafer carrier according to one embodiment of the present invention.

[0029] Figure 14 is a front perspective view of one of the locking mechanisms of the wafer carrier shown in Figure 13.

[0030] Figure 15 is a rear perspective view of one of the locking mechanisms of the wafer carrier shown in Figure 13.

[0031] Figure 16 is a cross-sectional view of a portion of the wafer carrier shown in Figure 13 along line XVI-XVI.

[0032] Figure 17 is a side view of a wafer including a handle and a locking mechanism according to one embodiment of the present invention.

[0033] Figure 18A is a perspective view of one of the handles shown in Figure 17.

[0034] Figure 18B is a front view of one of the handles shown in Figure 17.

[0035] Figure 18C is a side view of one of the handles shown in Figure 17.

[0036] Figure 19 is a perspective view of one of the locking mechanisms that interact with the handle, as shown in Figure 17.

[0037] Figure 20A is an enlarged view of one of the regions D shown in Figure 17.

[0038] Figure 20B is an enlarged view of region E shown in Figure 17.

[0039] Figure 21 is a cross-sectional view of one of the wafer carriers shown in Figure 17, taken along line 21A-21A.

[0040] Figure 22 is a perspective view of a wafer carrier having a handle in a detached state according to an embodiment.

[0041] Figure 23 is a side view of one of the wafer carriers shown in Figure 22.

[0042] Figure 24A is a perspective view of one of the handles shown in Figures 22 and 23.

[0043] Figure 24B is a front view of one of the handles shown in Figures 22 and 23.

[0044] Figure 24C is a side view of one of the handles shown in Figures 22 and 23.

[0045] Figure 25A is an enlarged view of region F shown in Figure 23.

[0046] Figure 25B is an enlarged view of region G shown in Figure 23.

[0047] Figure 26 is a partial cross-sectional view of a locking mechanism for a track engagement disposed on the sidewall of the wafer carrier shown in Figures 22 and 23, according to an embodiment.

[0048] Figure 27 is a perspective view of one of the wafer carriers according to another embodiment.

[0049] Figure 28 is a side view of one of the wafer carriers in Figure 27.

[0050] Figure 29 is a perspective view of one of the handles shown in Figures 27 and 28.

[0051] Figure 30 is a close-up view of one of the handles attached to the sidewall of the wafer carrier shown in Figure 28.

[0052] While the invention may have various modifications and alternatives, its details have been shown by way of example in the drawings and will be described in detail. However, it should be understood that the invention is not intended to be limited to the specific illustrative embodiments described. On the contrary, it is intended to cover all modifications, equivalents, and alternatives that fall within the spirit and scope of the invention. Implementation

[0053] [Cross-reference to related applications] []

[0054] This application claims priority and rights to U.S. Provisional Application No. 62 / 851,983, filed May 23, 2019, the full text of which is incorporated herein by reference for all purposes.

[0055] As used in this specification and the accompanying claims, the singular forms “a”, “an”, and “the” include the plural references, unless the context clearly requires otherwise. As used in this specification and the accompanying claims, the term “or” is generally used to mean “and / or”, unless the context clearly requires otherwise.

[0056] The term "approximately" generally refers to a range of numbers that are considered equivalent to the stated value (e.g., having the same function or result). In many instances, the term "approximately" may include numbers rounded to the nearest significant digit.

[0057] The range of numbers expressed using endpoints includes all numbers that fall within that range (for example, 1 to 5 includes 1, 1.5, 2, 2.75, 3, 3.80, 4, and 5).

[0058] The following [Description] should be understood with reference to the drawings, in which similar elements in different drawings are numbered the same. The [Description] and drawings (which are not necessarily to scale) depict illustrative embodiments and are not intended to limit the scope of the invention. The illustrative embodiments depicted are intended to be exemplary only. Selected features of any illustrative embodiment may be incorporated into an additional embodiment unless expressly stated otherwise.

[0059] A semiconductor device is formed by manufacturing a wafer substrate. One or more wafer substrates, or simply wafers, can be stored in a wafer carrier during, before, or after manufacturing. A front-opening substrate container protects the wafers within the wafer carrier during storage or transport. For example, a wafer carrier protects the wafers from damage caused by impacts with other objects and collisions with each other. For example, a wafer carrier can be configured to minimize or prevent contaminated air from entering the wafer carrier when the front of the wafer carrier is closed. The wafer carrier has a size and weight that allows a single person (e.g., a technician, a robotic arm, etc.) to carry it between locations.

[0060] The wafer carrier can be, for example, but not limited to, a front-opening wafer cassette (FOUP) or a front-opening transport cassette (FOSB). Generally, a FOUP is used to transport substrate wafers within a manufacturing facility, while a FOSB is used to transport substrate wafers over longer distances (e.g., between manufacturing facilities, from one manufacturing facility to another). For example, a FOUP can be configured to prevent contaminated air from entering the FOUP when the front of the FOUP is open. For example, a FOUP can also be configured to selectively allow gases to enter the FOUP, such as, but not limited to, process manufacturing gases or filtered gases used to generate a positive pressure within the FOUP.

[0061] The disclosed embodiments relate to a wafer carrier including a handle. The handle allows one person to safely carry the wafer carrier. Advantageously, the disclosed wafer carrier includes a handle that, among other features, has a locking mechanism and a rail, which reduces the risk of accidental detachment of the handle and reduces the amount of deflection / deformation of the wafer carrier during carrying, thereby improving the security of the contents of the wafer carrier.

[0062] A locking mechanism prevents the handle from being accidentally removed from the wafer carrier. Advantageously, the handle can be installed using a force applied to the wafer carrier that is relatively low compared to previous configurations, such as those that could damage the wafer carrier. The handle of the present invention allows for a structure with enhanced strength relative to a one-piece handle and allows for separate cleaning of the handle, thereby increasing the cleanliness of the wafer carrier.

[0063] Figures 1 to 4 illustrate one embodiment of a wafer carrier. Figures 1 to 4 show one embodiment of a wafer carrier 1. Figure 1 is a right perspective view of one wafer carrier 1. Figure 2 is a left perspective view of one wafer carrier 1. Figure 3 is a front view of one wafer carrier 1. Figure 4 is a side view of one wafer carrier 1. According to various embodiments, the wafer carrier 1 may be a FOUP. In other embodiments, the wafer carrier 1 may be a FOSB.

[0064] The wafer carrier 1 includes a first handle 100A, a second handle 100B (Figure 2), a first locking mechanism 150A for the first handle 100A (Figure 4), and a second locking mechanism 150B for the second handle 100B (Figure 2).

[0065] Each handle 100A, 100B is preferably configured to be non-destructively detachable. Handles 100A and 100B have the same structure and are configured to attach or detach in the same manner, except that they are mirror images of each other. Features of the first handle 100A and the first locking mechanism 150A are described and labeled in the drawings with the suffix "A", while features of the second handle 100B and the second locking mechanism 150B are described and labeled in the drawings with the suffix "B". Unless otherwise explicitly described or shown, it should be understood that handle 100B and locking mechanism 150B each include one of the corresponding "B" features of each "A" feature described or shown for handle 100A and locking mechanism 150A.

[0066] The wafer carrier 1 includes a front door 7 and one of the following: a top 10, a right side 12 (Figures 1 and 4), a left side 14 (Figure 2), a rear portion 16, and a bottom 18, collectively referred to as sides 10, 12, 14, 16, and 18. The front door 7 and sides 10, 12, 14, 16, and 18 form an enclosed internal space 6 (Figure 3). The wafer carrier 1 has a front opening 9 at the front portion 8 (Figure 2). The front door 7 covers the front opening 9 (Figure 1) and can be accessed by moving (e.g., opening, removing) the front door 7. Figures 2 and 3 illustrate the wafer carrier 1 with the front door 7 removed (e.g., open).

[0067] Sides 10, 12, 14, 16, 18 and front door 7 define one outer surface 22 of wafer carrier 1. In one embodiment, sides 10, 12, 14, 16, 18 are a single integral structure. For example, sides 10, 12, 14, 16, 18 may be molded as a single continuous material or molded from multiple pieces permanently bonded together. In one embodiment, wafer carrier 1 is made of a material that is generally non-reactive and leak-proof (e.g., has low permeability), such as, but not limited to, a high-purity polycarbonate.

[0068] As shown in Figure 3, wafer teeth 20 are disposed within a wafer carrier 1 for storing a plurality of wafers (not shown) in an internal space 6. The wafers are inserted into the spaces of the wafer teeth 20 and stacked within the wafer carrier 1 in a direction perpendicular to the page. In one embodiment, the wafer carrier 1 may include any known structure other than the shown wafer teeth 20 for holding (a plurality of) wafers within the internal space 6 of the wafer carrier 1. A front door 7 covers the front opening 9 of the wafer carrier 1 to enclose the internal space 6. The wafers are protected within the internal space 6 by the wafer carrier 1. The front door 7 is configured to form a seal with the sides 10, 12, 14, 18 to prevent air leakage into the internal space 6 of the wafer carrier 1 and contamination of the stored wafers.

[0069] The top 10 includes an automation interface 26 and the bottom 18 includes a base 24. The automation interface 26 may also be referred to as a top handling flange. In one embodiment, the automation interface 26 allows a standard automation attachment (not shown) (such as, but not limited to, an automation arm) for moving the wafer carrier 1 to be attached to the wafer carrier 1. For example, the automation arm can be used to move the wafer carrier 1 between different manufacturing equipment. Handles 100A and 100B are configured not to extend into the volume typically reserved around the wafer carrier 1 for automation attachment. In one embodiment, the base 24 can be used to attach the wafer carrier 1 to different manufacturing equipment.

[0070] In one embodiment, the wafer carrier 1 may include one or more ports 28. For example, a port 28 may be an inlet for supplying gas to the wafer carrier 1 (e.g., open when the port 28 is fluidly connected to a fluid source), or for allowing gas to flow out of the wafer carrier 1 (e.g., a purge port). For example, a port 28 may be an inlet for generating a positive pressure within the wafer carrier 1 when the front door 7 is open, or for circulating one or more process gases through the wafer carrier 1 during a manufacturing step. For example, the base 24 is connected (e.g., placed on, attached to, etc.) to appropriate manufacturing equipment (not shown) at different manufacturing steps, and gas is injected into the wafer carrier 1 via port 28 and circulates through the wafer carrier 1.

[0071] The first handle 100A is attached to one side 12 of the wafer carrier 1 (Figure 1), and the second handle 100B is attached to a different side 14 of the wafer carrier 1 (Figure 2). The handles 100A and 100B allow one person to carry the wafer carrier 1 between positions by hand.

[0072] The wafer carrier 1 is configured to prevent the handles 100A and 100B from being accidentally detached. Each of the handles 100A and 100B includes a locking mechanism 150A and 150B (Figures 2 and 4), which is configured to prevent their respective handles 100A and 100B from being accidentally detached from the wafer carrier 1. For example, if one of the handles 100A or 100B is accidentally detached from the wafer carrier 1 while being carried, it may cause the wafer carrier 1 to fall and damage the wafers(s) stored in the wafer carrier 1.

[0073] Figure 5 is a right-side perspective view of one of the wafer carriers 1 in which the handle 100A is detached. When attached (Figure 1), the handle 100A extends along the side 12 of the wafer carrier 1.

[0074] As shown in Figure 5, the wafer carrier 1 includes protrusions 30A and 40A and rails 50A and 60A disposed along side 12. Protrusions 30A and 40A each extend from the outer surface 22 of the wafer carrier 1. A handle 100A is secured to the wafer carrier 1 via the protrusions 30A and 40A and rails 50A and 60A. As shown in Figure 2, protrusions 30B and 40B and rails 50B and 60B are disposed along opposite sides 14 of the wafer carrier 1 to secure a second handle 100B to the wafer carrier 1.

[0075] Apertures 32A and 42A are formed by protrusions 30A and 40A. Aperture 32A is defined and positioned between the outer surface 22 of the wafer carrier 1 and a range 34A of the protrusion 30A by the protrusion 30A. Aperture 42A is defined and positioned between the outer surface 22 of the wafer carrier 1 and a range 44A of the protrusion 40A by the protrusion 40A. Each aperture 32A and 42A extends along the side 12 of the wafer carrier 1 from the front portion 8 to the rear portion 16.

[0076] Figures 6A to 6C are views of a handle 100A according to one embodiment. Figure 6A is a side view of the handle 100A. Figure 6B is a front view of the handle 100A. For example, Figures 4 and 6B are similar perspectives of the handle 100A. Figure 6C is a rear view of the handle 100A.

[0077] The handle 100A includes a body 110A having a first end 112A and a second end 114A. A grip 120A is disposed between the first end 112A and the second end 114A of the body 110A. As shown in FIG6A, the grip 120A has a first end 122A closer to the first end 112A of the body 110A and a second end 124A closer to the second end 114A of the body 110A.

[0078] When the handle 100A is attached to the outer surface 22 of the wafer carrier 1, the handle 100A is configured to allow a person to grip the handle 100A to carry the wafer carrier 1. The grip 120A is configured to be easy to grip and handle when the handle 100A is attached to the side 12. For example, as shown in Figures 1 and 3, the grip 120A is spaced apart from the side 12 and extends in a direction that allows sufficient space for a person to grip and hold the grip 120A. As shown in Figures 6A to 6C, the grip 120A defines a portion of the body 110A of the handle 100A.

[0079] In one embodiment, the grip 120A may include a color indicator 126A (FIG. 6B). For example, a color indicator may be used to indicate the contents of the wafer carrier 1 (e.g., the specific type of wafer housed in the wafer carrier 1, the current manufacturing stage of the wafer in the wafer carrier 1, or the like). In one embodiment, the color indicator 126A may be integral with the body 110A of the handle 100A to avoid the formation of surfaces that are difficult to clean (e.g., cracks, grooves, etc.), because the detachability of the handles 100A and 100B allows for the replacement of the handles 100A and 100B when a different color indicator is desired for the wafer carrier 1. For example, the color indicator 126A in this embodiment may be provided by coloring the body 110A itself, or by a coloring material integrally formed in the body 110A.

[0080] The handle 100A also includes a first insertable member 130A and a second insertable member 140A. As shown in FIG6A, the first insertable member 130A is positioned between a first end 112A and a grip 120A. In one embodiment, the first insertable member 130A may be disposed at an end 122A of the grip 120A, at the first end 112A, or between the first end 112A and the grip 120A. The insertable member 130A includes a tab 132A, a front side 134A, and a back side 136A opposite to the front side 134A. The tab 132A is on the front side 134A of the insertable member 130A and extends away from the front side 134A of the insertable member 130A. The insertable member 130A has an end 138A (FIGs 6B and 8C) opposite to the body 110A. In one embodiment, tab 132A is positioned on the front side 134A of the insertable member 130A closer to the end 138A than to the body 110A. For example, tab 132A is positioned on the front side 134A and extends along the end 138A.

[0081] As shown in Figure 6A, a second insertable member 140A is disposed between the grip 120A and the second end 114A. In one embodiment, the second insertable member 140A may be disposed at end 124A of the grip 120A, at the second end 114A, or between the second end 114A and the grip 120A. Similar to the first insertable member 130A, the second insertable member 140A also includes a tab 142A, a front side 144A, and a back side 146A. In one embodiment, one or both of the first insertable member 130A and the second insertable member 140A may be integral with the body 110A (e.g., formed as a single continuous material). For example, when the handle 100A is molded (e.g., injection molded), it includes at least a single body 110A and an insertable member 130A. In this embodiment, the insertable member 130A is configured to have the desired flexibility relative to the body 110A to allow attachment and detachment of the handle 100A, as described below.

[0082] In one embodiment, insertable members 130A and 140A are positioned along a portion of the body 110A that is different from the grip 120A (i.e., not positioned along the grip 120A). This provides space for gripping the grip 120A and helps prevent accidental contact with one of the insertable members 130A and 140A while handling the grip 120A. For example, such accidental contact could ultimately damage or loosen the insertable members 130A and 140A.

[0083] The handle 100A also includes a first protrusion 170A and a second protrusion 180A. The first protrusion 170A is located at a first end 112A of the body 110A. As shown in FIG. 4, the first protrusion 170A is configured to be flush with or below the outer surface 22 of the top 10 of the wafer carrier 1 when viewed from the side. For example, the first protrusion 170A is configured not to extend above the outer surface 22 of the top 10 of the wafer carrier 1. This prevents the protrusion 170A from interfering with the space for standard automated attachment operations when being attached to or being attached to the automation interface 26. The second protrusion 180A is located at a second end 114A of the body 110A. The first protrusion 170A is configured to engage the first track 50A of the wafer carrier 1. The second protrusion 180A is configured to engage the second track 60A of the wafer carrier 1.

[0084] Figure 1 shows a handle 100A attached to the outer surface 22 of the wafer carrier 1, while Figure 5 shows the handle 100A when it is detached. As can be seen by comparing Figures 1 and 5, the handle 100A is attached by moving the detached handle 100A (as shown in Figure 5) relative to the wafer carrier 1 in a first direction D1. In one embodiment, the first direction D1 extends from the rear portion 16 of the FOUP to the front portion 8. For example, the first direction D1 may be generally parallel to the side 12 of the wafer carrier 1. When the handle 100A is moved relative to the wafer carrier 1 in the first direction D1, each of the insert members 130A and 140A can be inserted into their corresponding apertures 32A and 42A, and each of the protrusions 170A and 180A engages with one of the corresponding rails 50A and 60A. The handle 100A is secured to the wafer carrier 1 via the insertable members 130A and 140A and the engaged protrusions 170A and 180A. Removing the attached handle 100A (as shown in Figure 4) involves moving the handle 100A in a direction D2 opposite to the first direction D1. The removal of the attached handle 100A is described in more detail below.

[0085] The insertable member 130A is configured to flex relative to the body 110A (i.e., bend relative to the body 110A). More specifically, the insertable member 130A is configured to flex in a direction perpendicular to its direction D1 extending from the body 110A (e.g., in FIG. 6B, in a direction of entering or leaving the page). In one embodiment, this flexibility describes allowing the insertable member 130A to flex (repeatedly) toward and away from the outer surface 22 of the wafer carrier 1. In one embodiment, when the insertable member 130A is inserted into the aperture 32A, the tab 132A contacts the protrusion 30A and the insertable member 130A is forced to flex toward the outer surface 22 of the wafer carrier 1 so that the insertable member 130A engages with the aperture 32A. For example, the flexure of the insertable member 130A allows the insertable member 130A to be inserted into the aperture 32A. Therefore, when the insertable member 130A is moved into the aperture 32A, the tab 132A contacts the protrusion 30A, which applies pressure to the insertable member 130A and causes the insertable member 130A to flex toward the outer surface 22 of the wafer carrier 1.

[0086] Once the tab 132A has traveled through the aperture 32A, the tab 132A flexes further away from the outer surface 22 of the wafer carrier 1. More specifically, the tension of the flexed insertable member 130A causes the tab 132A to flex further away from the outer surface 22 of the wafer carrier 1. The flexing of the tab 132A places the tab 132A in an engaged state. The tab 132A in the engaged state holds the insertable member 130A within the aperture 32A. More specifically, the tab 132A in its engaged state prevents the insertable member 130A from being removed from the aperture 32A. When the handle 100A is moved (e.g., pulled) in a direction D2 opposite to the insertion direction D1, the tab 132A prevents the removal of the insertable member 130A by contacting the outer surface 36A (FIG. 4) of the protrusion 30A. For example, tab 132A is hooked onto the outer surface 36A in front of protrusion 30A. As shown in FIG4, the outer surface 36A (e.g., in direction D1) faces away from the body 110A of handle 100A.

[0087] In one embodiment, tab 132A also has an unengaged state. In the unengaged state, tab 132A is configured to allow insertion member 130A to be removed from aperture 32A. For example, tab 132A in the unengaged state allows insertion member 130A to move relative to protrusion 30A in a direction D2 opposite to the insertion direction D1. In one embodiment, wafer carrier 1 is configured to allow detachment of handle 100A when all tabs 132A, 142A of (a few) insertion members 130A, 140A of handle 100A are in the unengaged state.

[0088] The movement of the handle 100A, which inserts the insertable member 130A into the aperture 32A (e.g., movement in the first direction D1), also causes the first protrusion 170A to move relative to the first rail 50A and the second protrusion 180A to move relative to the second rail 60A. More specifically, this movement of the handle 100A causes the first protrusion 170A to engage with the first rail 50A and the second protrusion 180A to engage with the second rail 60A. The engagement of each protrusion 170A, 180A with its corresponding rail 50A, 60A is configured to prevent the handle 100A from moving away from the wafer carrier 1 (e.g., in direction D3 in FIG3). For example, the engagement of a protrusion 170A, 180A with its rail 50A, 60A can reduce the force (some) that pulls the handle 100A away from the side 12 of the wafer carrier 1, and can reduce the outward deflection of the side 12 by distributing the pulling force to the corners of the wafer carrier 1.

[0089] Insertable members 140A and tabs 142A are inserted into corresponding protrusions 40A and apertures 42A of the wafer carrier 1 in a manner similar to that of insertable members 130A and tabs 132A. In one embodiment, handle 100A is configured such that a single movement of handle 100A in a first direction D1 inserts into insertable members 130A and 140A and engages protrusions 170A and 180A. In another embodiment, handle 100A is configured such that a single movement of handle 100A in the first direction D1 inserts into insertable members 130A and 140A, causing tabs 132A and 142A to move to an engaged state and engage protrusions 170A and 180A.

[0090] Figure 7 is a perspective view of a locking mechanism 150A according to one embodiment. The locking mechanism 150A is configured to prevent the handle 100A from being unintentionally removed from the wafer carrier 1. For example, when in a locked state, the locking mechanism 150A is configured to ensure that accidental contact with an insertable member 130A, 140A or a force on the handle 100A (e.g., the weight of the entire wafer carrier 1, pushing of the wafer carrier 1, etc.) cannot force the tab 132A out of its engaged state.

[0091] The locking mechanism 150A includes a front end 152A, a rear end 154A, a contact surface 156A, and a flexible extension 160A. The locking mechanism 150A also has a length L extending from the front end 152A to the rear end 154A. The contact surface 156A is positioned between the front end 152A and the flexible extension 160A of the locking mechanism 150A. In one embodiment, a maximum thickness T1 of the locking mechanism 150A between the front end 152A and the flexible extension 160A is located at the contact surface 156A. The thickness T1 of the locking mechanism 150A is perpendicular to its length L.

[0092] As shown in Figure 4, the locking mechanism 150A is held in a guide 116A of the body 110A of the handle 100A. The locking mechanism 150A is held in the guide 116A to be slidably attached to the body 110A. For example, the guide 116A allows the locking mechanism 150A to move along a first direction D1 while preventing the locking mechanism 150A from moving in directions perpendicular to the first direction D1 (e.g., directions D3, D4, etc. in Figure 3). In one embodiment, the locking mechanism 150A includes an upper limiter 164A and a lower limiter 166A (Figure 7). The locking mechanism 150A is slidably attached to the body 110A of the handle 100A by means of the guide 116A and the two limiters 164A, 166A. The upper limiting member 164A is positioned above the guide member 116A (e.g., in FIG. 4, in one direction away from the page, in FIG. 4, the guide member 116A is closer to the outer surface 22 than the upper limiting member 164A), and the lower limiting member 166A is positioned below the guide member 116A (e.g., in FIG. 4, the lower limiting member 166A is closer to the outer surface 22 than the guide member 116A). A height 162A is defined between the lower surface of the upper limiting member 164A and the upper surface of the lower limiting member 166A, for example, when the handle 100A is viewed from the side (e.g., in the view in FIG. 6A), the guide member 116A is positioned between the upper limiting member 164A and the lower limiting member 166A. In one embodiment, an upper limiting member 164A and a lower limiting member 166A may be provided along each side of the locking mechanism 150A.

[0093] In one embodiment, one of the limiting members 166A is flexible (e.g., flexible in one direction of width W) to allow the locking mechanism 150A to be formed separately from the handle 100A and then snapped into the guide member 116A. The limiting members 164A and 166A are configured to prevent the locking mechanism 150A from being removed after being snapped into the guide member 116A. In another embodiment, the handle 100A may be formed (e.g., molded) to have a locking mechanism 150A integral with the body 110A and in the guide member 116A, and the portion connecting the locking mechanism 150A to a portion of the body 110A is formed as a break, such that the locking mechanism 150A becomes slidably attached to the body 110A.

[0094] The body 110A of the handle 100A includes a through-hole 118A and a retaining space 119A. In one embodiment, the retaining space 119A is disposed in a rear portion 102A (FIG. 6A) of the body 110A facing the outer surface 22 of the side 12 of the wafer carrier 1 when the handle 100A is attached. For example, when the handle 100A is attached to the side 12 of the wafer carrier 1, the retaining space 119A is positioned between the body 110A and the outer surface 22 of the side 12 of the wafer carrier 1. The through-hole 118A is connected to the retaining space 119A. The through-hole 118A is adjacent to an insertable member 130A between the ends 112A and 114A of the body 110A of the handle 100A. The retaining space 119A is positioned between the through-hole 118A and the insertable member 130A. A locking mechanism 150A is configured to extend through the through-hole 118A into the retaining space 119A.

[0095] As shown in Figures 6A and 6C, the retaining space 119A is open along the rear portion 102A of the handle 100A. However, in one embodiment, the retaining space 119A is enclosed along the rear portion 102A of the handle 100A. For example, in this embodiment, a through-hole may extend through the body 110A, and the retaining space 119A may be a larger volume within the through-hole.

[0096] Figure 8A is a cross-sectional view of wafer carrier 1 along line VIII-VIII in Figure 3. Figure 8B is an enlarged view of region B in Figure 8A. Figure 8C is an enlarged view of region C in Figure 8A. For clarity and easier comparison, region B shown in Figure 8B is reversed and rotated relative to Figure 8A, and region C shown in Figure 8C is rotated relative to Figure 8A.

[0097] The locking mechanism 150A has a locked state and an unlocked state. Each of the handles 100A and 100B includes a locking mechanism 150A and 150B (Figures 1 and 2). The locking mechanism 150A of the first handle 100A is shown in the locked state in Figures 8A and 8C. The locking mechanism 150B of the second handle 100B is shown in the unlocked state in Figures 8A and 8B. The locking mechanism 150B in Figure 8B moves from its unlocked state to the locked state by moving in a first direction D1 (as shown by the locking mechanism 150A in Figure 8C). The locking mechanism 150A in Figure 8C moves from its locked state to the unlocked state (as shown by the locking mechanism 150A in Figure 8B) by applying a force to the flexible extension 160A and then moving the locking mechanism 150A in the opposite direction D2.

[0098] The locking mechanism 150A is configured to move relative to the insertable member 130A. For example, the locking mechanism 150A can move selectively because the flexible extension 160A inhibits the movement of the locking mechanism 150A in the locked state until it is acted upon by an external force, as discussed in further detail below.

[0099] In Figure 8B, the locking mechanism 150B is in the unlocked state. In the unlocked state, the locking mechanism 150B allows the tab 132B to move from its engaged state. For example, the locking mechanism 150B allows the insert member 130B to flex to a degree that moves the tab 132B from its engaged state. In the unlocked state, the contact surface 156B of the locking mechanism 150B may still contact the back surface 136B of the insertable member 130B. In another embodiment, in the unlocked state, the contact surface 156B may not contact the insertable member 130B. In its unlocked state, the locking mechanism 150B allows the insertable member 130B to flex away from the protrusion 30B, thus disengaging the tab 132B from the protrusion 30B. In one embodiment, the locking mechanism 150B is in the locked state when the flexible member 160B is positioned outside the retaining space 119B. The locking mechanism 150B moves in direction D1 and moves to the locked state when the flexible member 160B is positioned in the holding space 119B.

[0100] In Figure 8C, tab 132A is in an engaged state and locking mechanism 150A is in a locked state. For example, tab 132A in Figure 8C is positioned to contact the outer surface 36A of protrusion 30A before the handle 100A is moved (e.g., pulled) in direction D2, thus preventing the insertable member 130A from being removed from the aperture 32A. Locking mechanism 150A, in the locked state, is configured to maintain tab 132A in the engaged state. Tab 132A extends from insertable member 130A in a first direction D3 and is disengaged from the engaged state by movement in the opposite direction D4. In the locked state, the position of locking mechanism 150A prevents tab 132A from moving from the engaged state. In the locked state, the position of contact surface 156A of locking mechanism 150A restricts movement of tab 132A in the opposite direction D4 by limiting the deflection of insertable member 130A. For example, in the locked state, the position of the contact surface 156A of the locking mechanism 150A prevents the tab 132A from being removed from the engaged state. In one embodiment, when the locking mechanism 150A is in the locked state, the contact surface 156A of the locking mechanism 150A contacts the insertable member 130A. This contact by the locking mechanism 150A prevents deflection of the insertable member 130A. In one embodiment, the locking mechanism 150A can maintain the tab 132A in the engaged state without contacting the insertable member 130A. For example, a minimum amount of deflection of the insertable member 130A is required for the tab 132A to move from the engaged state. In the locked state, the contact surface 156A of the locking mechanism 150A prevents the insertable member 130A from reaching the minimum amount of deflection.

[0101] The locking mechanism 150A extends into the aperture 32A and along the back side 136A of the tab 132A. The insertable member 130A is positioned between the contact surface 156A of the locking mechanism 150A and the inner surface 38A of the protrusion 30A. The thickness T1 of the locking mechanism 150A maintains the tab 132A in an engaged state by restricting the deflection of the insertable member 130A. In FIG. 8C, the thickness T1 of the locking mechanism 150A prevents the insertable member 130A from deflecting and the tab 132A from moving. The thickness T1 extends perpendicularly to the direction D1 from the body 110A of the handle 100A into the aperture 32A.

[0102] The flexible extension 160A is configured to bend by an external force F1 (e.g., bend relative to the rest of the locking mechanism 150A). For example, the external force F1 can be applied by a person who wants to move the locking mechanism 150A. The retaining space 119A prevents accidental contact that could apply the external force F1 to the flexible extension 160A. The positioning of the flexible extension 160A prevents the locking mechanism 150A from moving in a direction D2 opposite to the first direction D1.

[0103] The locking mechanism 150A is selectively movable because the flexible extension 160A is configured to restrict movement of the locking mechanism 150A from the locked state unless flexed by an external force F1. The locking mechanism 150A moves from the unlocked state to the locked state by moving in the first direction D1. The movement of the locking mechanism 150A in the first direction D1 causes the flexible extension 160A to move through the through-hole 118A and into the retaining space 119A. In one embodiment, the locking mechanism 150A enters the locked state when the flexible extension 160A is positioned in the retaining space 119A.

[0104] The size of the retaining space 119A relative to the through hole 118A allows the flexible extension 160A to remain at least partially unbent. The normal geometry of the flexible extension 160A within the retaining space 119A (i.e., when not subjected to an external force F1) does not align (e.g., match, fit within) the through hole 118A in direction D2. This misalignment prevents the flexible extension 160A from fitting into the through hole 118A and prevents movement of the locking mechanism 150A in direction D2 (which would move the locking mechanism 150A from the locked position). Therefore, the position of the flexible extension 160A within the retaining space 119A maintains the locking mechanism 150A in the locked state. An external force F1 causes the flexible extension 160A to flex and align it with the through hole 118A in direction D2, allowing the flexible extension 160A to fit into the through hole 118A. Therefore, by applying an external force F1 to the flexible extension 160A and moving the locking mechanism 150A in direction D2 (which moves the flexible extension 160A from the holding space 119A into the through hole 118A), the locking mechanism 150A is moved from the locked state to the unlocked state. In one embodiment, the locking mechanism 150A enters the unlocked state when the flexible extension 160A is positioned outside the holding space 119A. In another embodiment, the locking mechanism 150A enters the unlocked state when the flexible extension 160A is positioned outside both the through hole 118A and the holding space 119A.

[0105] In one embodiment, the misalignment between the flexible extension 160A and the through-hole 118A in the second direction D2 is due to the width W of the locking mechanism 150A. As shown in FIG. 7, the locking mechanism 150A has a width W defined by the flexible extension 160A. In one embodiment, the flexible extension 160A is configured to flex by an external force F1, causing the width W of the locking mechanism 150A to change (e.g., decrease). For example, the locking mechanism has a width W1 when the external force F1 flexes the flexible extension 160A. In one embodiment, the external force F1 can compress the flexible extension 160A to reduce the width W of the locking mechanism 150A. The flexible extension 160A is configured to be compressed without permanent deformation.

[0106] As shown in Figure 6B, the through-hole 118A has a width W2 and the retaining space 119A has a width W3. The width W3 of the retaining space 119A is greater than the width W2 of the through-hole 118A. When the locking mechanism 150A is moved from the unlocked position (as shown by the locking mechanism 150B in Figure 8B) to the locked position (as shown by the locking mechanism 150A in Figure 8C), the flexible extension 160A moves from the through-hole 118A into the retaining space 119A. The larger width W3 of the retaining space 119A (relative to the width W2 of the through-hole 118A) allows the flexible extension 160A to remain at least partially unbent within the retaining space 119A. This unbent nature of the flexible extension 160A causes the width W of the locking mechanism 150A (e.g., along the flexible extension 160A) to be greater than the width W2 of the through-hole 118A. Therefore, the normal width W of the locking mechanism 150A in the locked state (i.e., when not subjected to external force F1) is greater than the width W2 of the through hole 118A. When the external force F1 causes the flexible extension 160A to flex, the width W1 of the locking mechanism 150A is equal to or less than the width W2 of the through hole 118A. Therefore, by flexing the flexible extension 160A to reduce the width W of the locking mechanism 150A and then moving the locking mechanism 150A in the second direction D2, the locking mechanism 150A moves from the unlocked state to the locked state.

[0107] Therefore, when positioned within the holding space 119A, the geometry of the flexible extension 160A maintains the locking mechanism 150A in a locked state. For example, when the locking mechanism 150A moves from an unlocked state to a locked state by moving in the first direction D1, the geometry of the flexible extension 160A within the holding space 119A then prevents the locking mechanism 150A from moving in the opposite direction D2. In one embodiment, the geometry of the flexible extension 160A that maintains the locking mechanism 150A in a locked state is the width W of the locking mechanism 150A, as described above.

[0108] The flexible extension 160A can be flexed to move the locking mechanism 150A from the unlocked state to the locked state. In one embodiment, one or both of the through hole 118A and the flexible extension 160A can be configured such that the force causing the locking mechanism 150A to move in the first direction D1 also causes the flexible extension 160A to flex and engage through the through hole 118A. For example, when in the unlocked state, one or more of the surfaces of the through hole 118A and the flexible extension 160A facing each other when the locking mechanism 150A is in the unlocked position can be inclined.

[0109] The upper surface 158A of the locking mechanism 150A is generally flat relative to the insertable member 130A. However, in one embodiment, the locking mechanism 150A may have a concave upper surface 158A and a length L that positions the contact surface 156A outside the aperture 32A when the flexible extension 160A is placed in the retaining space 119A. The convex shape of the upper surface 158A allows one of the insertable members 130A to flex sufficiently to move the tab 132A from its engaged state to its unengaged state. In this embodiment, the locking mechanism 150A can be moved from its locked state to its unlocked state by moving in a direction D2 opposite to the first direction D1. The locking mechanism 150A is in the unlocked state when the flexible extension 160A is placed in the retaining space 119A, and in the locked state when the flexible extension 160A is placed outside the retaining space 119A. In this embodiment, the flexible extension 160A can be configured to suppress movement of the locking mechanism 150A in direction D1 when in the locked state, as discussed above, except for movement in direction D2. For example, in this embodiment, insertion of the flexible extension 160A into the through hole 118A is prevented in the same manner as discussed above, except relative to direction D1 rather than direction D2.

[0110] As shown in Figures 4 and 8C, when the handle 100A is pulled in the unloading direction D2, the tab 132A, in the engaged state, is configured to contact the outer surface 36A of the protrusion 30A to prevent the insertable member 130A from being removed from the aperture 32A. However, in one embodiment, a notch (not shown) may be provided within the aperture 32A, and the tab 132A may be configured to prevent the removal of the insertable member 130A by engaging with the notch. For example, the notch may be provided in the inner surface 38A of the protrusion 30A or in the outer surface 22 of the wafer carrier 1. In this embodiment, the insertable member 130A may only partially extend through the aperture 32A. In this embodiment, when in its locked state, a portion of the locking mechanism 150A may be positioned between the protrusion 30A and the insertable member 130A. In one embodiment, the tab 132A may extend from the insertable member 130A in a direction different from that of the outer surface 22 of the wafer carrier 1 (e.g., different from direction D3 in FIG. 8C). For example, in one embodiment, the tab 132A may extend from the insertable member 130A toward the outer surface 22 of the wafer carrier 1 (e.g., in direction D4, etc.), or in a direction perpendicular to that of the outer surface 22 of the wafer carrier 1 (e.g., in direction D5 in FIG. 9, etc.).

[0111] As discussed above, the insertable member 130A is configured to automatically flex the tab 132A to an engaged state upon insertion through the aperture 32A. However, in one embodiment, the insertable member 130A may be unconfigured to flex the tab 132A to an engaged state. In one embodiment, the locking mechanism 150A may flex the insertable member 130A to flex the tab 132A to an engaged position. For example, the tab 132A may be on the front surface 134A of the insertable member 130A, and the insertable member may need to flex in the second direction D2 to flex the tab 132A to an engaged state. Upon movement to the locked state, the locking mechanism 150A may be configured to push the insertable member 130A in the second direction D2 to flex the tab 132A to an engaged state.

[0112] Figure 9 is a cross-sectional view of a portion of the wafer carrier 1 along line IX-IX in Figure 4. The first protrusion 170A of the handle 100A is engaged with the first track 50A of the wafer carrier 1. More specifically, the first protrusion 170A is configured to interlock with the first track 50A.

[0113] The protrusion 170A includes a first portion 172A and a second portion 174A directly connected to the first portion 172A. The first portion 172A extends away from the body 110A of the handle 100A in a first direction D4, and the second portion 174A extends away from the first portion 172A in a different direction D5. The direction D4 of the first portion 172A is not planar with the first end 112A of the body 110A. In one embodiment, the first track 50A extends away from the outer surface 22 of the side 12 of the wafer carrier 1. The first track 50A includes an inner surface 52A and a groove 54A. The groove 54A is defined by the inner surface 52A. The protrusion 170A extends into the groove 54A of the track 50A. The contact between the inner surface 52A and the rail 50A and the second portion 174A of the protrusion 170A is configured to prevent movement away from the outer surface 22 of the wafer carrier 1 via the attached handle 100A (e.g., movement in direction D3). The second rail 60A and the second protrusion 180A have a similar structure and engagement as described for the first rail 50A and the first protrusion 170A, except that they are rotated, since the protrusion 180A is positioned along the second end 114A of the handle 100A.

[0114] As shown in Figure 3, wafer teeth 20 are attached to sides 12 and 14 of wafer carrier 1. A pulling force on handle 100A (e.g., in direction D3) can cause side 12 to deflect outward, which may affect the shape of wafer teeth 20 and damage the wafer within them. For example, rails 50A and 60A and protrusions 170A and 180A provide more rigid contact points (e.g., at or near corners) for attaching handle 100A to the outer surface 22 of wafer carrier 1. More rigid contact points can help reduce the outward deflection of side 12 by distributing the pulling force from handle 100A to the corners of wafer carrier 1.

[0115] The groove 54A defined by the first track 50A faces upward in FIG. 9 (i.e., in direction D5). However, in one embodiment, the orientation of the first track 50A and the second portion 174A may be reversed. For example, in this embodiment, the groove 54A may face downward (i.e., opposite to direction D5). In one embodiment, the second track 60A and the second protrusion 180A may also be modified in this manner.

[0116] The handle 100A of the wafer carrier 1 has two insertable members 130A and 140A, two protrusions 170A and 180A, and a locking mechanism 150A. However, in one embodiment, the handle 100A may have a different number of insertable members 130A and 140A, protrusions 170A and 180A, and locking mechanisms 150A. In one embodiment, the handle 100A may include one or more insertable members 130A and 140A. In one embodiment, the handle 100A may include one or more protrusions 170A and 180A. In this embodiment, the wafer carrier 1 may include a corresponding number of protrusions 30A and 40A and rails 50A and 60A. In one embodiment, the wafer carrier 1 may include multiple locking mechanisms 150A for the handle 100A. For example, in one embodiment, the wafer carrier 1 may provide a respective locking mechanism for each of the insertable members 130A and 140A of the handle 100A.

[0117] The handles 100A, 100B and locking mechanisms 150A, 150B shown in Figures 1 to 9 and described above are for a wafer carrier 1. However, it should be understood that the handles 100A, 100B, locking mechanisms 150A, 150B, and protrusions 30A, 30B can be similarly applied to other types of wafer carriers, such as, but not limited to, a front-opening transport box (FOSB) in a similar manner as shown and described for wafer carrier 1. In one embodiment, a front-opening transport box (FOSB) may include at least one protrusion 30A, 30B, a handle 100A, 100B, and a locking mechanism 150A, 150B for the handles 100A, 100B.

[0118] Figures 10 to 12 illustrate a locking mechanism 350A according to another embodiment. Figure 10 is a perspective view of a portion of a FOUP 300. Figure 11 is a front perspective view of the locking mechanism 350A. Figure 12 is a rear perspective view of the locking mechanism 350A.

[0119] FOUP 300 includes handles 100A and 100B similar to those of wafer carrier 1 in Figures 1 to 5. Therefore, FOUP 300 also includes a second locking mechanism similar to the second handle 100B for wafer carrier 1, which is similar to locking mechanism 350A.

[0120] Figure 10 shows the locking mechanism 350A in the locked position. In the unlocked position, the locking mechanism 350A is separated from the handle 100A and the wafer carrier 1, and is moved to the locked position by coupling the locking mechanism 350A to the handle 100A. The locking mechanism 350A has a locked state and an unlocked state. The locking mechanism 350A moves from the unlocked state to the locked state by being coupled to the handle 100A. When in the locked state, the locking mechanism 350A maintains the tab 132A of the insertable member 130A in its engaged state. The tab 132A is not shown in Figure 10 because it is obscured by the locking mechanism 350A in the view of Figure 10. More specifically, the locking mechanism 350A is configured in its locked state to prevent movement of the tab 132A, which would remove the tab 132A from its engaged state. The locking mechanism 350A moves from the locked state to the unlocked state by disengaging from the handle 350A.

[0121] As shown in Figures 11 and 12, the locking mechanism 350A has a front end 352A, a rear end 354A, an inner surface 366A, and a length L2. The locking mechanism 350A has a generally concave shape. The locking mechanism 350A includes a first tab 356A disposed at the front end 352A and a second tab 357A disposed at the rear end 354A. The first tab 356A and the second tab 357A have a similar structure. The first tab 356A and the second tab 357A each extend from the inner surface 366A of the locking mechanism 350A. In one embodiment, the first tab 356A and the second tab 357A each extend from the inner surface 366A in a direction parallel to the length L2 of the locking mechanism 350A. The locking mechanism 350A is coupled to the handle 100A by the first tab 356A and the second tab 357A.

[0122] When the locking mechanism 350A is in its locked state, the first tab 356A contacts the back side 136A of the insertable member 130A (shown in FIG. 6C), and the second tab 357A is inserted into the through hole 118A of the handle 100A. For example, when in the locked state, the first tab 356A is hooked onto the end 138A of the insertable member 130A, and the second tab 357A is hooked into the through hole 118A. In one embodiment, the through hole 118A for the tab 357A may alternatively be a blind hole. When coupled to the handle 100A, the first tab 356A presses against the back side 136A of the insertable member 130A. In the locked state, this pressure of the locking mechanism 350A on the insertable member 130A prevents the insertable member 130A from deflecting toward the outer surface 22 of the wafer carrier 1 and prevents the tab 132A from moving from the engaged state. Therefore, the locking mechanism 350A maintains the engagement state of the tab 132A.

[0123] The locking mechanism 350A extends beyond its normal length L2 (i.e., its length when no external forces F2 or F3 are applied to it). The length for coupling to and from the handle 100A is greater than length L2. The locking mechanism 350A is configured to be flexible, such that an external force (e.g., force F2 or force F3) can increase the length L2 of the locking mechanism 350A. In one embodiment, a portion of the locking mechanism 350A at its first end 352 is a flexible extension 353A. When no external forces F2 or F3 are applied to the locking mechanism 350A, the extendable extension 353A maintains its geometry and length L2. The position of the extendable extension 353A maintains the locking mechanism 350A coupled to the handle 100A. Therefore, the geometry of the extendable extension 353A holds the locking mechanism 350A in its locked state.

[0124] When the locking mechanism 350A is in its locked state, it can be moved to its unlocked state (i.e., disengaged) by applying an external force (e.g., force F2, force F3) along the first end 352A or the second end 354A to the inner surface 366A of the locking mechanism 350A. For example, the external forces F2 and F3 cause the extendable extension 353A to extend and increase the length L2 of the locking mechanism 350A. The greater length L2 causes the locking mechanism 350A to disengage from the handle 100A.

[0125] The illustrated embodiment of the locking mechanism 350A in Figures 10 to 12 is separated from the handle 100A when in the unlocked state (i.e., disengaged from the handle 100A in the unlocked state). However, in one embodiment, the handle 100A and the locking mechanism 350A may be a single integral piece. In this embodiment, the rear end 354A may be integrally connected to the body 110A of the handle 100A. The front end 353A may flex relative to the insertable member 130A, such that the front end 353A is configured to be pulled away from the insertable member 130A in direction D3, allowing the protrusion 30A to engage between the front end 353A and the insertable member 130A to detach the handle 100A from the wafer carrier 1.

[0126] Locking mechanism 350A is shown in Figures 10 to 12 and described above for use in a FOUP 300. However, it should be understood that handle 100A, locking mechanism 350A, and protrusion 30A can be similarly applied to other types of wafer carriers, such as, but not limited to, a front-opening transport box (FOSB). In one embodiment, a wafer carrier may include a handle 100A, a protrusion 30A, and a locking mechanism 350A for handle 100A in a manner similar to that shown and described for FOUP 300. In one embodiment, a wafer carrier may include a pair of protrusions 30A, 30B, a pair of handles 100A, 100B, and a pair of locking mechanisms 350A.

[0127] Figures 13 to 16 illustrate a locking mechanism 450A according to another embodiment. Figure 13 is a partial perspective view of a FOUP 400. Figure 14 is a front perspective view of the locking mechanism 450A. Figure 15 is a rear perspective view of the locking mechanism 450A. Figure 16 is a partial cross-sectional view of the FOUP 400 along line XVI-XVI in Figure 13.

[0128] FOUP 400 includes removable handles 100A and 100B similar to those of wafer carrier 1 in Figures 1 to 4. Therefore, FOUP 400 includes a second locking mechanism for the second handle 100B of wafer carrier 1, similar to locking mechanism 450A.

[0129] The locking mechanism 450A has a locked state and an unlocked state. Figures 13 and 16 show the locking mechanism 450A in the locked state. The locking mechanism 450A moves from the unlocked state to the locked state by being inserted into the hole 32A in a direction D2, which is opposite to the insertion direction D1 of the insertable member 130A into the hole 32A. The locking mechanism 450A moves from the locked state to the unlocked state by moving in direction D1.

[0130] As shown in Figures 14 to 16, the locking mechanism 450A has a front end 452A, a rear end 454A, a length L3, a lip 453A, a biasing member 458A, and a flexible extension 460A. The flexible extension 460A includes a first arm 462A having a first tab 463A and a second arm 464A having a second tab 465A. In one embodiment, the length L3 of the locking mechanism 450A extends parallel to the direction in which the insertable member 130A extends from the body 110A of the handle 100A. The length L3 of the locking mechanism 450A is perpendicular to its thickness T2.

[0131] When the locking mechanism 450A is in its locked state, the biasing member 458A contacts the outer surface 22 of the wafer carrier 1 and pushes a contact surface 456A into contact with the back side 136A of the insertable member 130A. The insertable member 130A is pressed between the contact surface 456A of the locking mechanism 450A and the inner surface 38A of the protrusion 30A. The biasing member 464A is configured to provide a thickness T2 for the locking member 450A, which prevents the insertable member 130A from flexing. In one embodiment, the biasing member 464A is configured to provide a thickness T2 for the locking mechanism 450A, which at least prevents the insertable member from flexing to a minimum amount that allows the tab 132A to move from its engagement position. This prevents the insertable member 130A from causing the tab 132A to flex from its engaged state. Therefore, the locking mechanism 450A maintains the engaged state of the tab 132A in its locked state.

[0132] A lip 453A is positioned at the front portion 452A of the locking mechanism 450A. The lip 453A is configured to limit how far the locking mechanism 450A can be inserted into the aperture 32A. The lip 453A extends above the contact surface 456A. ​​When the locking mechanism 450A is moved to the locked state, the lip 453A contacts the end 138A of the insertable member 130A and further prevents insertion of the locking mechanism 450A. For example, the lip 453A prevents the locking mechanism 450A from being fully inserted into or through the aperture 30A.

[0133] When in the locked position, tabs 463A and 465A contact one of the inner surfaces 121A of the handle 100A, and no external force F4 is applied to the arms 462A and 464A. More specifically, tabs 463A and 465A are hooked onto one or more inner surfaces 121A of the handle 100A. For example, a retaining space 119A may define the inner surface 121A of the handle 100A. The contact of tabs 463A and 465A on the inner surfaces(s) prevents the locking mechanism 450A from moving in the first direction D1. The flexible extension 460A is configured to allow an external force F4 to flex the arms 462A and 464A closer together, thereby reducing the width W4 and moving the arms 462A and 464A away from their corresponding inner surfaces(s) 121A. For example, the external force F4 may be applied by someone who wants to move the locking mechanism 450A to the unlocked position.

[0134] Therefore, the size and positioning of the arms 462A and 464A of the flexible extension 460A maintain the locking mechanism in its locked position. For example, the flexible extension 460A prevents the locking mechanism 450A from moving from its locked state along the width W 4 of the tabs 463A and 465A.

[0135] As shown in Figure 16, the contact surface 456A is configured to push against the insertable member 130A in direction D3. However, as discussed above, in one embodiment, the insertable tab 132A is configured to extend from the insertable member 130A in a direction different from the outer surface 22 of the wafer carrier 1 (e.g., different from direction D3). In this embodiment, the locking mechanism 450A can be configured to push against the insertable member 130A in the appropriate direction, such that the tab 132A of the insertable member 130A is maintained in its engaged state. For example, the locking mechanism 450A can extend between the protrusion 30A and the front side 134A of the insertable member 130A, and is configured to push the insertable member 130A toward the outer surface 22 of the wafer carrier 1, or is configured to push the insertable member 130A in a direction perpendicular to either direction D1 or direction D3.

[0136] Locking mechanism 450A is shown in Figures 13 to 16 and described above for use in a FOUP 400. However, it should be understood that handle 100A, locking mechanism 450A and protrusion 30A can be similarly applied to other types of wafer carriers, such as, but not limited to, a front-opening transport box (FOSB).

[0137] Figures 17 to 21 illustrate various embodiments of the wafer carrier 500 and handle 510 according to another embodiment of the present invention.

[0138] Figure 17 is a side view of a wafer carrier 500 including a handle 510 and locking mechanisms 520A, 520B according to another embodiment of the present invention. The wafer carrier 500 may be a FOUP or FOSB as described herein, and may have many of the same features as the wafer carrier 1 described herein. In one embodiment, the wafer carrier 500 is a FOUP. The handle 510 includes many of the same features as the handle 100A discussed above with particular regard to Figures 6A to 6C. Those skilled in the art will appreciate that the wafer carrier 500 includes a second handle on opposite sidewalls of the wafer carrier 500 having the same features as the handle 510, which is not shown here for simplicity.

[0139] As shown in Figure 17, the handle 510 engages with rails 50A and 60A disposed on the sidewall 506 of the wafer carrier 500. Rails 50A and 60A have previously been described herein using, for example, the rails best visible in Figure 5. The handle 510 includes a handle body 512, a first locking mechanism 520A disposed at an upper end 524 of the handle body 512, and a second locking mechanism 520B disposed at a lower end 526 of the handle body 512. Each of the locking mechanisms 520A and 520B is configured to be held within vertical guides 530A and 530B disposed at the upper end 524 and lower end 526 of the handle body 512, respectively, such that they can slide within the vertical guides 530A and 530B to transition from an unlocked state to a locked state. Locking mechanisms 520A and 520B can be held in a locked state by retaining spaces 519A and 519B. In Figure 17, locking mechanism 520A is depicted in an unlocked state and locking mechanism 520B is depicted in a locked state.

[0140] Figures 18A to 18C show different views of the handle 510. Figure 18A shows the handle 510 including locking mechanisms 520A and 520B, each in an unlocked state. Figure 18B is a front view of the handle 510, in which the locking mechanisms 520A and 520B are removed, leaving the vertical guides 530A and 530B therein, and the transition from the unlocked to the locked state visible. Figure 18C is a side view of the handle 510. Like the handle 100A described herein, the handle 510 includes an upper protrusion 580A and a lower protrusion 580B configured to engage and slide along rails 50A and 60A. The upper protrusion 580A and the lower protrusion 580B have a shape complementary to the shape of the rails 50A and 60A. In some embodiments, the upper protrusion 580A and the lower protrusion 580B have an L-shape defining one of the guides 582A, 582B extending downward, which facilitates holding the upper protrusion 580A and the lower protrusion 580B on and sliding along the rails 50A, 60A.

[0141] Figure 19 shows an isolated locking mechanism 520A. Figures 20A and 20B show close-up views of the first locking mechanism 520A located at the upper end 524 of one of the handle bodies 512 and the second locking mechanism 520B located at the lower end 526 of one of the handle bodies 512, respectively. Figure 21 is a cross-sectional view showing the locking mechanism 520B in a locked state.

[0142] Locking mechanisms 520A and 520B are configured to prevent the handle 510 from being unintentionally removed from the wafer carrier 500. Locking mechanisms 520A and 520B are configured to remain within vertical guides 530A and 530B (best seen in Figure 18B) to allow sliding within them during transition from an unlocked to a locked state. Figure 20A shows locking mechanism 520A in an unlocked state. Figure 20B shows locking mechanism 520B in a locked state.

[0143] Referring now to FIG19, the locking mechanism 520A includes a first end 552A and a second end 554A, and a flexible extension 560A positioned between the first end 552A and the second end 554A. The locking mechanism 520A includes an upper limiter 564A and a lower limiter 566A disposed at the first end 552A. In one embodiment, an upper limiter 564A and a lower limiter 566A may be disposed along each side of the locking mechanism 520A. In one embodiment, one of the limiters 566A is flexible (e.g., flexible in a direction of width W) to allow the locking mechanism 520A to be separated from the handle 510 and then snapped into the vertical guide 530A. The upper limiter 564A and the lower limiter 566A are configured to prevent the locking mechanism 520A from being removed after being snapped into the vertical guide 530A.

[0144] As best seen in Figures 20A and 20B, the locking mechanisms 520A and 520B are slidably attached to the handle body 512 through the interaction of the two limiting members 564A, 564B and 566A, 566B with the vertical guide members 530A and 530B. Specifically, the upper limiting members 564A and 564B are positioned above the upper surface of one of the walls defining the vertical guide members 530A and 530B, and the lower limiting members 566A and 566B are positioned below the lower surface of one of the walls defining the vertical guide members 530A and 530B, such that the wall defining the vertical guide members 530A and 530B is positioned between the upper limiting members 564A and 564B and the lower limiting members 566A and 566B of the locking mechanisms 520A and 520B.

[0145] The flexible extension 560A is configured to flex inward toward a centerline x in response to an applied force, from a first state having a first width to a second state having a second width less than the first width. In the second state, when the locking mechanism 520A changes to the locked state, the flexible extension 560A can be received within the retaining space 519A.

[0146] Figures 20B and 21 show different views of the locking mechanism 520B in the locked state. As previously indicated, the locking mechanism 520B includes the same features as the locking mechanism 520A described herein. As shown in Figures 20B and 21, when the locking mechanism 520B is in the locked state, the flexible extension 560B is held within the retaining space 519B. Upon releasing the force applied to the flexible extension 560B, the flexible extension can transition from a second state to a first state, thereby causing the flexible extension 560B to be held within the retaining space 519B. To transition the locking mechanism 520B from the locked state to the unlocked state, a force can be applied again to the flexible extension 560B, causing the flexible extension 560B to be in the second state and have a width less than the width of the retaining space 519B, thereby allowing its removal.

[0147] Additionally, in some embodiments, the second end 554A is sized to be received and held within a corresponding aperture in the rail 50A when the locking mechanism 520A is in the locked state. The locking mechanism 520B engages with the rail 60A in the same manner. In some embodiments, the rail 60A may have an aperture sized to receive and hold the second end of the locking mechanism 520B when the locking mechanism 520B is in the locked state.

[0148] Figures 22 to 26 illustrate various views of a wafer carrier 600 and a handle 610 according to another embodiment of the present invention. The wafer carrier 600 includes many of the same features as wafer carriers 1 and 500 described herein. The wafer carrier 600 may be a FOUP or a FOSB. In one embodiment, the wafer carrier 600 is a FOUP.

[0149] Figure 22 shows a wafer carrier 600, which includes a handle 610 attached to rails 50A, 60A disposed on a sidewall 606 of the wafer carrier 600. Figure 23 shows a wafer carrier 600 including the handle 610 attached to the sidewall 606 of the wafer carrier. Those skilled in the art will understand that the wafer carrier 600 includes a second handle on the opposite sidewall of the wafer carrier 600, which has one of the same features as the handle 610, but is not shown here for simplicity.

[0150] As shown in Figure 23, the handle 510 engages with rails 50A and 60A disposed on the sidewall 606 of the wafer carrier 600. Rails 50A and 60A have previously been described herein using, for example, the rails best visible in Figure 5. The handle 610 includes a handle body 612, a first locking mechanism 520A disposed at an upper end 624 of the handle body 612, and a second locking mechanism 520B disposed at a lower end 626 of the handle body 612. The locking mechanisms 520A and 520B are described in detail with reference to Figure 19. Each of the locking mechanisms 520A and 520B is configured to be held within vertical guides 630A and 630B disposed at the upper end 624 and lower end 626 of the handle body 612, respectively, such that they can slide within the vertical guides 630A and 630B to transition from an unlocked state to a locked state.

[0151] In the embodiments shown in Figures 22 to 26, the retaining space 619B and the vertical groove 630B are offset from a centerline x2 extending through the lower end 626 of the handle body 612. In the previous embodiments described with reference to Figures 17 to 21, the retaining space 619B and the vertical groove 630B are centered on a centerline x2 extending through the lower end 526 of the handle body 512. Instead of cooperating with a hole provided in the rail 60A, when the locking mechanism 520B is in the locked state, the second end 554B of the locking mechanism 520B abuts one end of the rail 60A, as will be described in more detail below. In some cases, the retaining space 619A and the vertical groove 630A located at an upper end 624 of the handle 610 may also be located on the upper end 524 of the handle body, such that when the locking mechanism 520A is in the locked state, the second end 554A abuts one end of the rail 50A.

[0152] Figures 24A to 24C show different views of handle 610. Figure 24A shows handle 610 including locking mechanisms 520A and 520B, each in an unlocked state. Figure 24B is a front view of handle 610, in which the locking mechanisms 520A and 520B are removed, leaving the vertical guides 630A and 630B therein, and the transition from the unlocked to the locked state is visible. Figure 24C is a side view of handle 610. Like handles 100A and 510 described herein, handle 610 includes an upper protrusion 680A and a lower protrusion 680B configured to engage and slide along rails 50A and 60A. The upper protrusion 680A and the lower protrusion 680B have a shape complementary to the shape of rails 50A and 60A. In some embodiments, the upper protrusion 680A and the lower protrusion 680B have an L-shape defining one of the guides 682A and 682B extending downward, which facilitates holding the upper protrusion 680A and the lower protrusion 680B on and sliding along the rails 50A and 60A when the handle 610 is fixed to the sidewall 606 of the wafer carrier 600.

[0153] Figures 25A and 25B are close-up views of locking mechanisms 520A and 520B in a locked state. Locking mechanisms 520A and 520B are held in the locked state by retaining spaces 619A and 619B. When the force applied to the flexible extensions 560A and 560B is released, the flexible extensions 560A and 560B can transition from a second state to a first state, thereby causing the flexible extensions 560A and 560B to be retained in the retaining spaces 619A and 619B. To transition the locking mechanisms 520A and 520B from the locked state to the unlocked state, a force can be applied again to the flexible extensions 560A and 560B, causing the flexible extensions 560A and 560B to be in the second state and have a width smaller than one of the widths of the retaining spaces 619A and 619B, thereby allowing their removal.

[0154] Figure 26 is a partial cross-sectional view of the upper end 624 of the handle body 612, showing the locking mechanism 520A in the locked state and engaged with the rail 50A. As can be seen in Figure 26, the flexible extension 560A is received and held in the holding space 619A, and the second end 554A of the locking mechanism 520A abuts a distal end 558 of the rail 50A. This prevents the handle 610 from accidentally disengaging from the rail 50A.

[0155] Figures 27 to 30 show various views of a wafer carrier 700 and a handle 710 according to another embodiment disclosed herein. The wafer carrier 700 includes many of the same features as wafer carriers 1, 500, and 600 described herein. The wafer carrier 700 may be a FOUP or a FOSB. In one embodiment, the wafer carrier 700 is a FOUP.

[0156] Figure 27 shows a wafer carrier 700, which includes a handle 710 before attachment to rails 50A and 60A disposed on the sidewall 706 of the wafer carrier 700. Figure 28 shows a wafer carrier 700 including the handle 710 attached to the sidewall 706 of the wafer carrier 700. Figure 30 is a view of the handle 710 in isolation. Those skilled in the art will appreciate that the wafer carrier 700 includes a second handle on the opposite sidewall of the wafer carrier 700 having one of the same features as the handle 710, which is not shown here for simplicity.

[0157] As shown in Figures 28 and 29, the handle 710 engages with rails 50A and 60A disposed on the sidewall 706 of the wafer carrier 700. Rails 50A and 60A have previously been described herein as, for example, rails 50A and 60A best visible in Figure 5. The handle 710 includes a handle body 712, a first locking arm 720A disposed at an upper end 724 of the handle body 712, and a second locking arm 720B disposed at a lower end 726 of the handle body 712. The distal ends 760A and 760B of each of the locking arms 720A and 720B are configured to engage the distal ends 758A and 758B of each of the rails 50A and 60A. In some embodiments, the distal ends 760A and 760B may be configured as a barb, a latch, or other protrusions that can engage with the distal ends 758A and 758B of the rails 50A and 60A by means of retaining force (Figures 28 and 29).

[0158] Each of the locking arms 720A and 720B is flexible, such that when the handle 710 is attached to the wafer carrier 700, it flexes outward and away from the carrier side, straddling one of the outer surfaces 750 of the rails 50A and 60A. Upon reaching the distal ends 758A and 758B of one of the rails 50A and 50B, each of the flexible arms 720A and 720B is configured to flex inward and backward toward the sidewall 706 of the wafer carrier 700, such that one of the distal ends 760A and 760B of each of the flexible arms 720A and 720B engages with and remains thereon one of the distal ends 758A and 758B of each of the rails 50A and 50B, as best seen in Figure 29.

[0159] Pattern: Any of patterns 1 to 13 may be combined with any of patterns 14 to 23.

[0160] 1. A handle for a wafer carrier, the wafer carrier including a protrusion extending from an outer surface of the wafer carrier, the protrusion defining an aperture for attaching the handle between the outer surface of the wafer carrier and a portion of the protrusion, the handle including: a body including: a first end and a second end opposite to the first end; and an insertable member disposed between the first end and the second end of the body and configured to be inserted into the aperture to secure the handle to the wafer carrier, the insertable member including a tab holding the insertable member in the aperture in an engaged state; and a locking mechanism movable relative to the insertable member between a locked state and an unlocked state, the locking mechanism including a flexible extension, and in the locked state, the locking mechanism holding the tab in the engaged state, and the flexible extension being positioned to hold the locking mechanism in the locked state.

[0161] State 2. The handle of State 1, wherein the handle is configured to attach to the wafer carrier and to be nondestructively removed from the wafer carrier.

[0162] Type 3. A handle as in either Type 1 or 2, wherein the tab is disposed on a first side of one of the insertable members, and when in the locked state, the locking mechanism extends along a second side of one of the insertable members opposite to the first side.

[0163] Type 4. A handle as in any of types 1 to 3, wherein when in the locked state, the thickness of one of the locking mechanisms holds the tab in the engaged state.

[0164] Type 5. A handle as in any of types 1 to 4, wherein when the locking mechanism is in the locked state, a geometry of the flexible extension maintains the locking mechanism in the locked state.

[0165] Type 6. A handle as in any of types 1 to 5, wherein the flexible extension is configured to be flexible to a smaller geometry or a different position, and allows the locking mechanism to move from the locked state in response to an external force that causes the flexible extension to bend to the smaller geometry or the different position.

[0166] Type 7. A handle as in any of types 1 to 6, wherein the body includes a guide disposed adjacent to the insertable member within the body, the locking mechanism being held by the guide such that the locking mechanism is slidably attached to the body.

[0167] Type 8. A handle of any of types 1 to 7, wherein the insertable member is disposed at one end of the grip, at the first end, or between the grip and the first end.

[0168] Format 9. The handle of any of Formats 1 to 8, further comprising: a protrusion extending from the first end of the body in a first direction and a second direction in that order, the first direction being away from the body and not planar with the first end of the body, and the second direction being different from the first direction, wherein the protrusion is configured to engage a track of the wafer carrier to secure the handle to the wafer carrier.

[0169] Type 10. A handle as in any of types 1 to 9, wherein the insertable member is flexible relative to the rest of the body, and the tab is movable to the engaged state due to the flexure of the insertable member.

[0170] Type 11. A handle as in any of types 1 to 10, wherein the locking mechanism extends through the body.

[0171] Type 12. A handle as in any of types 1 to 11, wherein the locking mechanism extends through a through-hole of the body, and when in the locked state, the flexible extension causes the width of one of the locking mechanisms to be greater than the corresponding width of one of the through-holes.

[0172] Type 13. A handle of any of types 1 to 12, wherein the body includes a grip disposed between the first end and the second end of the body.

[0173] 14. A wafer carrier comprising: an outer surface; a protrusion extending from the outer surface, the protrusion defining an aperture between the outer surface and a portion of the protrusion; a handle attached to the outer surface via the aperture, the handle comprising: a body including a first end, a second end opposite to the first end, and an insertable member disposed between the first end and the second end and extending into the aperture to secure the handle to the outer surface, the insertable member including a tab holding the insertable member in the aperture when in an engaged state; and a locking mechanism movable relative to the insertable member between a locked state and an unlocked state, the locking mechanism including a flexible extension, and when in the locked state, the locking mechanism holding the tab in the engaged state, and the flexible extension being positioned to hold the locking mechanism in the locked state.

[0174] Version 15. A wafer carrier as in Version 14, wherein when in the locked state, the locking mechanism extends between the insertable member and the outer surface, and a thickness of the locking mechanism holds the tab in the engaged state.

[0175] State 16. A wafer carrier of any of states 14 and 15, wherein the insertable member extends into the aperture in a first direction, and the thickness of the locking mechanism extends in a second direction perpendicular to the first direction.

[0176] State 17. A wafer carrier of any of states 14 to 16, wherein when in the locked state, the locking mechanism extends between the insertable member and the outer surface.

[0177] State 18. A wafer carrier of any of States 14 to 17, wherein the insertable member is inserted into the aperture in a first direction, and the locking mechanism moves from the unlocked state to the locked state in a second direction parallel to the first direction.

[0178] Specimen 19. A wafer carrier of any of Specimens 14, 15, 17 and 18, further comprising: a track extending along the outer surface, wherein the handle includes a protrusion extending sequentially from the first end of the body in a first direction and a second direction, the first direction being away from the body and not planar with the first end of the body, and the second direction being different from the first direction, wherein the protrusion engages the track to secure the handle to the outer surface.

[0179] Version 20. A wafer carrier as in Version 19, wherein the protrusion of the handle is moved to engage the rail in the same direction as the insertable member is inserted into the aperture.

[0180] 21. A wafer carrier of any of 19 and 20, further comprising: a first side, the outer surface being defined by the first side, and the handle extending along the first side, and the engagement of the protrusion with the rail inhibiting movement of the handle away from or toward the first side.

[0181] State 22. A wafer carrier of any of states 19 to 21, further comprising: a groove defined by an inner surface of the track, the protrusion extending into the groove.

[0182] 23. A wafer carrier of any of 14 to 22, wherein the wafer carrier system is one of a front-opening wafer cassette and a front-opening transport cassette.

[0183] Several illustrative embodiments of the invention have thus been described, and those skilled in the art will readily understand that other embodiments can be made and used within the scope of the claims appended to this invention. Many advantages of the invention as covered herein have been set forth in the foregoing description. However, it should be understood that the invention is illustrative in many respects only. Changes may be made in details, particularly in the shape, size, and arrangement of parts, without departing from the scope of the invention. Of course, the scope of the invention is defined in the language of the appended claims.

[0184] 1: Wafer carrier 6: Interior space 7: Front Gate 8: Front 9: Front opening 10: Top / Side 12: Right side / side 14: Left side / side 16: Rear / Side 18: Bottom / Side 20: Wafer teeth 22: Outer surface 24: Base 26: Automation Interface 28: Port 30A: Protrusion 30B: Protrusion 32A: Porosity 34A: Range 36A: Front outer surface 38A: Inner surface 40A: Protrusion 40B: Protrusion 42A: Porosity 44A: Range 50A: Track 1 50B: Rail 52A: Inner surface 54A: Slot 60A: Second Track 60B: Track 100A: Top Leader 100B: Second-in-command 102A: Rear 110A: Main Body 112A: First end 114A: Second end 116A: Guide Component 118A: Through hole 119A: Maintain Space 119B: Maintain Space 120A: Grip 121A: Inner surface 122A: First end 124A: Second end 126A: Color Indicator 130A: First insertable component 130B: Insertable component 132A: lenticule 132B: lenticule 134A: Front side / front surface 136A: Dorsal side 136B: Back surface 138A: Terminal 140A: Second insertable component 142A: lenticule 144A: Front 146A: Dorsal side 150A: First locking mechanism 150B: Second locking mechanism 152A: Front-end 154A: Backend 156A: Contact Surface 156B: Contact Surface 158A: Top surface 160A: Flexible extension 160B: Flexible member 162A: Height 164A: Upper restraint 166A: Lower limiting component 170A: First protrusion 172A: Part One 174A: Part Two 180A: Second protrusion 300: Front-opening wafer cassette (FOUP) 350A: Locking mechanism 352A: Front-end / First End 353A: Flexible extension / Extendable extension / Extendable portion / Front end 354A: Backend / Second End 356A: First protrusion 357A: Second protrusion 366A: Inner surface 400: Front-opening wafer cassette (FOUP) 450A: Locking mechanism / locking component 452A: Front end / Front section 453A: Lip border 454A: Backend 456A: Contact Surface 458A: Offset component 460A: Flexible extension 462A: First Arm 463A: First protrusion 464A: Second Arm 465A: Second protrusion 500: Wafer carrier 506: Sidewall 510: Handle 512: Handle Body 519A: Maintain Space 519B: Maintain Space 520A: First Locking Mechanism 520B: Second Locking Mechanism 524: Top 526: Lower end 530A: Vertical guide 530B: Vertical guide 552A: First end 554A: Second end 558: Remote 560A: Flexible extension 560B: Flexible extension 564A: Upper limiting component 564B: Upper restraint 566A: Lower limiting component 566B: Lower limiting component 580A: Upper protrusion 580B: Lower protrusion 582A: Guide Component 582B: Guide Component 600: Wafer carrier 606: Sidewall 610: Handle 612: Handle Body 619A: Maintain Space 619B: Maintain Space 624: Top 626: Lower end 630A: Vertical guide / vertical groove 630B: Vertical guide / vertical groove 680A: Upper protrusion 680B: Lower protrusion 682A: Guide Component 682B: Guiding component 700: Wafer carrier 706: Sidewall 710: Handle 712: Handle Body 720A: First locking arm / flexible arm 720B: Second locking arm / flexible arm 724: Top 726: Lower end 750: Outer surface 758A: Remote 758B: Remote 760A: Remote 760B: Remote B: Area C: Area D 1: First direction / Insertion direction D 2: Second direction / Unloading direction D 3: First direction D 4: First direction D 5: Direction D: Area E: Area F 1: External force F 2: External force F 3: External force F 4: External force F: Area G: Area L: Length L2: Length L3: Length T1: Thickness T2: Thickness W: Width W 1: Width W2: Width W 3: Width W 4: Width x: Centerline x 2 : Centerline

Claims

1. A handle for a wafer carrier, the wafer carrier including a protrusion extending from an outer surface of the wafer carrier, the protrusion defining an aperture for attaching the handle between the outer surface of the wafer carrier and a portion of the protrusion, the handle comprising: A body comprising: a first end and a second end opposite to the first end; a handle disposed between the first end and the second end of the body; and an insertable member disposed between the first end and the second end of the body and configured to be inserted into a cavity to secure the handle to the wafer carrier, the insertable member including a tab that retains the insertable member in the cavity when in an engaged state, wherein the insertable member is positioned along a portion of the body different from the handle; and a locking mechanism movable relative to the insertable member between a locked state and an unlocked state, the locking mechanism including a flexible extension, wherein in the locked state the locking mechanism retains the tab in the engaged state, and the flexible extension is positioned to retain the locking mechanism in the locked state.

2. The handle of claim 1, wherein the handle is configured to attach to the wafer carrier and to be nondestructively detached from the wafer carrier.

3. The handle of claim 1, wherein the tab is disposed on a first side of one of the insertable members, and when in the locked state, the locking mechanism extends along a second side of one of the insertable members opposite to the first side.

4. The handle of claim 1, wherein when in the locked state, the thickness of one of the locking mechanisms holds the tab in the engaged state.

5. The handle of claim 1, wherein when the locking mechanism is in the locked state, a geometry of the flexible extension maintains the locking mechanism in the locked state.

6. The handle of claim 1, wherein the flexible extension is configured to be flexible to a smaller geometry or a different position, and allows the locking mechanism to move from the locked state in response to an external force that causes the flexible extension to bend to the smaller geometry or the different position.

7. The handle of claim 1, wherein the body includes a guide adjacent to the insertable member disposed in the body, the locking mechanism being held by the guide such that the locking mechanism is slidably attached to the body.

8. The handle of claim 1, wherein the insertable member is disposed at one end of the handle, at the first end, or between the grip on the handle and the first end.

9. The handle of request item 1 further includes: A protrusion extends from the first end of the body in a first direction and a second direction in sequence, the first direction being away from the body and not planar with the first end of the body, and the second direction being different from the first direction, wherein the protrusion is configured to engage a rail of the wafer carrier to secure the handle to the wafer carrier.

10. The handle of claim 1, wherein the insertable member is flexible relative to the remainder of the body, and the tab is movable to the engaged state due to the flexure of the insertable member.

11. The handle as requested in item 1, wherein the locking mechanism extends through the body.

12. The handle of claim 1, wherein the locking mechanism extends through a through-hole of the body, and when in the locked state, the flexible extension causes the width of one of the locking mechanisms to be greater than the corresponding width of one of the through-holes.

13. The handle of claim 1, wherein the body includes a grip disposed between the first end and the second end of the body.

14. A wafer carrier comprising: One outer surface; A protrusion extending from the outer surface defines a aperture between the outer surface and a portion thereof; a handle attached to the outer surface via the aperture, the handle comprising: a body including a first end, a second end opposite the first end, a grip disposed between the first end and the second end of the body, and an insertable member disposed between the first end and the second end and extending into the aperture to secure the handle to the outer surface, the insertable member including a tab holding the insertable member in the aperture when in an engaged state, wherein the insertable member is positioned along a portion of the body different from the grip; and a locking mechanism movable relative to the insertable member between a locked state and an unlocked state, the locking mechanism including a flexible extension, and when in the locked state, the locking mechanism holds the tab in the engaged state, and the flexible extension is positioned to hold the locking mechanism in the locked state.

15. The wafer carrier of claim 14, wherein when in the locked state, the locking mechanism extends between the insertable member and the outer surface, and a thickness of the locking mechanism holds the tab in the engaged state.

16. The wafer carrier of claim 14, wherein when in the locked state, the locking mechanism extends between the insertable member and the outer surface.

17. The wafer carrier of claim 14, wherein the insertable member is inserted into the aperture in a first direction, and the locking mechanism moves from the unlocked state to the locked state in a second direction parallel to the first direction.

18. The wafer carrier of claim 14, further comprising: A rail extends along the outer surface, wherein the handle includes a protrusion that extends sequentially from the first end of the body in a first direction and a second direction, the first direction being away from the body and not planar with the first end of the body, and the second direction being different from the first direction, and the protrusion engaging the rail to secure the handle to the outer surface.

Images