Integrated tool lift

Abstract

A semiconductor processing apparatus is provided herein, comprising: an upper support frame; a plurality of semiconductor processing chambers arranged along a first axis; a linear guide system fixedly supported by the upper support frame and extending along a second axis substantially parallel to the first axis; and a carrier. Each processing chamber has a base fixedly mounted relative to the upper support frame and a removable cover including one or more lifting features. The carrier includes a lifting arm configured to pivot about a vertical axis substantially perpendicular to the second axis, the carrier being configured to movably engage with the linear guide system and translate relative to the linear guide system along the second axis. Both the carrier and the lifting arm are movable such that the lifting feature engagement interface of the lifting arm can be moved to engage with the lifting feature of any of the removable covers.

Description

Technical Field

[0001] Many semiconductor processing machines have large and bulky components that are removed during maintenance, upkeep, and repair. Prior Technology

[0002] The novel equipment and systems described herein are for moving components of semiconductor processing machines for maintenance, upkeep, and repair. These machines may have multiple semiconductor processing chambers, mounted directly or indirectly on a support frame of the machine and arranged side-by-side in a linear array. While conventional lifting devices, such as cranes or forklifts, which are detached from the machine and entirely supported by the floor, are traditionally used to lift and move many components of the semiconductor processing chambers, some of the machines described herein have lifting systems integrated into the machine itself for moving removable components. Summary of the Invention

[0003] In some embodiments, the lifting system may include a linear guide system that is directly or indirectly mounted to a support frame and extends along a linear array of semiconductor processing chambers. A movable carrier is connected to and supported by the linear guide system and has a movable lifting arm that can be connected to, lifted, and moved with any component of the semiconductor processing chamber; the carrier and its lifting arm can move along the linear guide system such that the lifting arm can be connected to and moved with any removable component of the semiconductor processing chamber. The lifting arm and the removable component have complementary connection features that allow the lifting arm to connect to and lift the removable component. When the carrier lifts a removable component, its weight is fully transferred to the support frame through the lifting arm, the carrier, and the linear guide system. In some embodiments, the carrier may be suspended from the linear guide system, for example, below the linear guide system or to the side of the linear guide system.

[0004] In some embodiments, a person can move the carrier along a linear guide system, and the lifting arm can also be moved to a position connected to the removable component. In some such embodiments, various states of the carrier can be driven by motors, such as lifting mechanisms on the carrier for raising and lowering the lifting arm. In some other embodiments, motors and other moving mechanisms can move the carrier along the linear guide system and / or move the lifting arm horizontally and / or vertically. A controller with a processor and memory can control the movement of the carrier and the lifting arm.

[0005] In some alternative embodiments, the machine may have a lifting system different from the carrier and linear guide system. These alternative embodiments use a detachable lifting system connected to one or more attachment points, which in turn connect to a support frame. The detachable lifting system is positioned on and supported by the floor and has vertical members connected to the attachment points on the support frame to provide lateral support for the vertical members. The detachable lifting system also includes a lifting arm movably connected to the vertical members; once the vertical members are connected to the one or more attachment points, the lifting arm can be connected to and raised / lowered from a removable component of one of the semiconductor processing chambers. In some embodiments, the detachable lifting system is fixed except for its lifting arm once connected to the one or more attachment points; however, in other embodiments, the detachable lifting system and its connected attachment points are movable simultaneously along an array of semiconductor processing chambers.

[0006] In some embodiments, a semiconductor processing rack may be provided. The semiconductor processing rack may include an upper support frame; a first plurality of semiconductor processing chambers arranged along a first axis; a first linear guide system fixedly supported by the upper support frame and extending along a second axis substantially parallel to the first axis; and a first carrier. Each semiconductor processing chamber has a base fixedly mounted relative to an upper support frame and a removable top cover including one or more lifting features. A first carrier may include a first lifting arm with one or more links, the first lifting arm being configured to pivot about a vertical axis substantially perpendicular to a second axis. The first carrier is configured to movably engage with a first linear guide system and translate relative to the first linear guide system along the second axis. The first lifting arm includes a lifting feature engagement interface for engaging with the lifting feature of any of the removable top covers of the first plurality of semiconductor processing chambers. Both the first carrier and the first lifting arm are movable such that the lifting feature engagement interface can be moved to engage with the lifting feature of any of the removable top covers of the first plurality of semiconductor processing chambers.

[0007] In some embodiments, the first carrier system further includes a first vertical translation system configured to vertically translate the first lifting arm relative to the first linear guide system in a direction parallel to the vertical axis.

[0008] In some of these embodiments, the semiconductor processing unit further includes a power supply. A first vertical translation system includes a motor for providing a first mechanical input to the first vertical translation system, which causes the first lifting arm to translate vertically in a direction parallel to the vertical axis. The first carrier system further includes an electrical control cable connected to the power supply, running along the first lifting arm, and terminating at a connector. Each removable top cover further includes an electrical interface for connection with the connector, and the length of the electrical control cable is such that the connector-lifting feature interface of the first lifting arm can only simultaneously engage with the electrical interface and lifting feature of a single processing chamber in the semiconductor processing chamber.

[0009] In some of these embodiments, the semiconductor processing unit further includes a controller comprising one or more processors and one or more non-transitory memory devices storing instructions for controlling the one or more processors, for: receiving information about the operating status of each semiconductor processing chamber; and a first actuation signal provided by an electrical interface of one of the semiconductor processing chambers being triggered only when the information about the operating status of the semiconductor processing chamber indicates that the semiconductor processing chamber is in a personnel-safe condition, so as to operate the first vertical translation system.

[0010] In some further embodiments, the semiconductor processing unit further includes: a first carrier positioning sensor for generating data regarding the position of a first carrier along a first linear guide system; and a controller including one or more processors and one or more non-transitory memory devices storing instructions for controlling the one or more processors, to: determine the position of the first carrier along the first linear guide system based on the data generated by the first carrier positioning sensor, and based on the determination of the position of the first carrier, activate the electrical interface of only one of the first plurality of semiconductor processing chambers at a time.

[0011] In some further embodiments, the semiconductor processing unit further includes an arm position sensor for generating data regarding the position of a first lifting arm relative to a semiconductor processing chamber in a first plurality of semiconductor processing chambers, and the one or more non-transitory memory devices store further instructions for controlling one or more processors to: determine the position of the lifting arm of each of the first plurality of semiconductor processing chambers based on the data generated by the arm position sensor, and based on the determination of the position of the lifting arm and the determination of the position of the first carrier, activate only the electrical interface of the semiconductor processing chamber in the first plurality of semiconductor processing chambers closest to the lifting feature engagement interface of the first lifting arm.

[0012] In some further embodiments, the one or more non-transitory memory devices store further instructions for controlling one or more processors to cause the first lifting arm to move only on a first side of a vertical plane that passes through the first carrier, is parallel to the vertical axis and perpendicular to the second axis.

[0013] In some further embodiments, the semiconductor processing unit further includes: a bonding sensor configured to generate data regarding whether the bonding interface of the lifting feature of the first lifting arm engages with the lifting feature of one of the removable top covers; and a controller including one or more processors and one or more non-transitory memory devices storing instructions for controlling the one or more processors, to: determine, based on the data generated by the bonding sensor, whether the bonding interface of the lifting feature of the first lifting arm engages with the lifting feature of one of the removable top covers of the first plurality of semiconductor processing chambers, and in response to the determination that the bonding interface of the lifting feature engages with the lifting feature of one of the removable top covers of the first plurality of semiconductor processing chambers, activate only the electrical interface of the semiconductor processing chamber containing the removable top cover.

[0014] In some further embodiments, the removable top cover receives power from a power source via a cable.

[0015] In some of these embodiments, the first carrier further includes a first interlock configured to: engage with the lifting feature of any of the removable covers of the first plurality of semiconductor processing chambers, and prevent the first vertical translation system from vertically translating the first lifting arm when not engaged with the lifting feature of one of the removable covers of the first plurality of semiconductor processing chambers.

[0016] In some of these embodiments, the first vertical translation system may be a linear ball screw actuator, a hydraulic actuator, a rack-and-pinion actuator, or a cable hoist.

[0017] In some of these embodiments, the semiconductor processing unit further includes a controller that includes one or more processors and one or more non-transitory memory devices. The first linear guiding system further includes a carrier translation system configured to translate the first carrier along a second axis. The first carrier further includes a lifting arm moving system configured to move the first lifting arm in a plane perpendicular to the vertical axis. One or more non-transitory memory devices store instructions for controlling one or more processors to: move the first carrier along the second axis using the carrier translation system; move the first lifting arm and the first vertical translation system to move the first lifting arm so that the lifting feature engagement interface engages with the lifting feature of one of the removable top covers of the first plurality of semiconductor processing chambers; when the lifting feature engagement interface engages with the lifting feature of one of the removable top covers, the first vertical translation system vertically translates the removable top cover; and when the lifting feature engagement interface engages with the lifting feature of one of the removable top covers, the lifting arm moving system translates the removable top cover in a plane perpendicular to the vertical axis.

[0018] In some further embodiments, the one or more non-transitory memory devices store further instructions for controlling one or more processors to perform: when the lifting feature engagement interface engages with the lifting feature of one of the removable top cover, the lifting arm moving system and the first vertical translation system move the first lifting arm so that the lifting feature engagement interface disengages from the lifting feature of the removable top cover.

[0019] In some further embodiments, the one or more non-transitory memory devices store further instructions for controlling one or more processors to: when the lifting feature engagement interface engages with the lifting feature of one of the removable top cover, cause the carrier translation system and the lifting arm movement system to translate the removable top cover in a plane perpendicular to the vertical axis.

[0020] In some embodiments, the semiconductor processing chambers in the first plurality of semiconductor processing chambers are all located inside a machine housing, and the first lifting arm is movable so that any removable cover of the first plurality of semiconductor processing chambers can be moved outside the machine housing.

[0021] In some embodiments, the first linear guide system further includes a first rail and a second rail, which are parallel to each other and offset from each other in a direction parallel to the vertical axis, and the first carrier system is configured to engage with both the first rail and the second rail simultaneously, and when engaged with both the first rail and the second rail simultaneously, translates relative to the first linear guide system along the second axis.

[0022] In some of these embodiments, the first carrier further includes a first vertical translation system configured to allow the first lifting arm to be vertically translated relative to the first linear guide system in a direction parallel to the vertical axis below the first linear guide system and above the base of the first plurality of semiconductor processing chambers.

[0023] In some further embodiments, the first vertical translation system is further used to vertically translate the first lifting arm above the first linear guide system.

[0024] In some embodiments, the first linear guide system is vertically offset above the first plurality of semiconductor processing chambers in a direction parallel to the vertical axis, and the first carrier is vertically offset below the first linear guide system.

[0025] In some embodiments, the lifting feature engagement interface is connected to the distal end of the first lifting arm via a connector, which is used to allow the lifting feature engagement interface to rotate about two or more axes perpendicular to the vertical axis.

[0026] In some of these embodiments, the connector is a ball joint.

[0027] In some of these embodiments, the connector is further configured to allow the engagement interface of the lifting feature to rotate about an axis parallel to the vertical axis.

[0028] In some embodiments, each removable cover lifting feature includes a pair of saddles, each saddle includes a pair of vertical lifters and a saddle plate spanning and covering the vertical lifters, each saddle plate includes a first mechanical interface feature, the saddles of each lifting feature are positioned such that the first mechanical interface features are spaced apart by a first distance, the lifting feature engagement interface includes a beam having two second mechanical interface features spaced apart by the first distance, and each first mechanical interface feature is complementary to one of the second mechanical interface features.

[0029] In some embodiments, each of the first plurality of semiconductor processing chambers includes a removable component, which may be a radio frequency (RF) generator, a pump, and a cryogenic pump. Each removable component includes one or more second lifting features, and the lifting feature engagement interface of the first lifting arm is further configured to engage with the second lifting feature of any of the removable components of the first plurality of semiconductor processing chambers. Both the first carrier and the first lifting arm are movable, allowing the lifting feature engagement interface to be moved to engage with the second lifting feature of any of the removable components of the first plurality of semiconductor processing chambers.

[0030] In some embodiments, the first lifting arm includes a linear segment perpendicular to the vertical axis and includes a lifting feature engagement interface.

[0031] In some of these embodiments, the first lifting arm may include a pivot section for pivoting about a vertical axis, and the first lifting arm may include an inclined section spanning between the pivot section and the linear section, and is oriented at an oblique angle relative to the vertical axis.

[0032] In some embodiments, the first plurality of semiconductor processing chambers comprises two semiconductor processing chambers.

[0033] In some of these embodiments, the first plurality of semiconductor processing chambers comprises three semiconductor processing chambers.

[0034] In some further embodiments, the first plurality of semiconductor processing chambers comprises five semiconductor processing chambers.

[0035] In some embodiments, the semiconductor processing unit further includes: a second plurality of semiconductor processing chambers configured along a third axis substantially parallel to and offset from the first axis; an interior region located between the first plurality of semiconductor processing chambers and the second plurality of semiconductor processing chambers; a second linear guide system fixedly supported by an upper support frame and extending along a fourth axis substantially parallel to the third axis; and a second carrier. Both the first and second linear guiding systems are located outside the internal region. Each of the second plurality of semiconductor processing chambers has a second base fixedly mounted relative to the upper support frame and a second removable cover including one or more second lifting features. The second carrier includes a second lifting arm with one or more links, which is configured to pivot about a second vertical axis substantially perpendicular to a fourth axis. The second carrier is configured to movably engage with the second linear guiding system and translate relative to the second linear guiding system along the fourth axis. The second lifting arm includes a second lifting feature engagement interface for engaging with the second lifting feature of any second removable cover of any of the semiconductor processing chambers in the second plurality of semiconductor processing chambers. Both the second carrier and the second lifting arm are movable, such that the second lifting feature engagement interface can be moved to engage with the second lifting feature of any second removable cover of any of the semiconductor processing chambers in the second plurality of semiconductor processing chambers.

[0036] In some of these embodiments, the base of the first plurality of semiconductor processing chambers, the second base of the second plurality of semiconductor processing chambers, and the interior region are all located within the second housing. The first lifting arm is movable so that the removable top cover of any of the first plurality of semiconductor processing chambers can be moved outside the second housing, and the second lifting arm is movable so that the second removable top cover of any of the second plurality of semiconductor processing chambers can be moved outside the second housing.

[0037] In some of these embodiments, the second removable top cover is of the same type as the removable top cover, the second lifting feature engagement interface is of the same type as the lifting feature engagement interface, and the second lifting feature system is of the same type as the lifting feature.

[0038] In some embodiments, the semiconductor processing equipment further includes a telescopic bladder that creates a seal at the interface between the first carrier and the first linear guide system when the first carrier is engaged with the first linear guide system.

[0039] In some embodiments, the semiconductor processing unit further includes a second carrier. The second carrier includes a second lifting arm having one or more links, and the second lifting arm is configured to pivot about a second vertical axis, the second vertical axis being substantially perpendicular to the second axis. The second carrier is configured to movably engage with a first linear guide system and translate relative to the first linear guide system along the second axis. The second lifting arm includes a second lifting feature engagement interface for engaging with the lifting feature of any of the removable top covers of the first plurality of semiconductor processing chambers. Both the second carrier and the second lifting arm are movable, such that the second lifting feature engagement interface of the second lifting arm can be moved to engage with the lifting feature of any of the removable top covers of the first plurality of semiconductor processing chambers. The first linear guide system is further configured such that the first carrier and the second carrier can be simultaneously engaged with the first linear guide system and can move along the second axis.

[0040] In some embodiments, the removable top cover is not a substrate.

[0041] In some embodiments, the first lifting arm is not configured to support the base plate.

[0042] In some of these embodiments, the lifting feature engagement interface is not provided for supporting the substrate.

[0043] In some embodiments, a semiconductor processing unit may be provided. The semiconductor processing unit may include a support frame, a first plurality of semiconductor processing chambers arranged along a first axis, a first attachment point connected to the support frame, and a first detachable lifting system. Each semiconductor processing chamber has a base fixedly mounted relative to the support frame and a removable top cover including one or more lifting features. The first detachable lifting system may include a vertical member having a top end with complementary attachment points and a bottom end with a moving mechanism, the complementary attachment points being detachably connected to the first attachment point. The moving mechanism may be supported by a floor. The first detachable lifting system may further include a lifting arm connected to the vertical member, having one or more links. The lifting arm is configured to pivot about a vertical axis substantially perpendicular to the first axis. The lifting arm includes a lifting feature engagement interface for engaging with a lifting feature of any of the removable top covers of the first plurality of semiconductor processing chambers.

[0044] In some embodiments, the first detachable lifting system may further include a vertical translation system configured to allow the lifting arm to translate vertically relative to the support frame in a direction parallel to the vertical axis.

[0045] In some such embodiments, the first vertical translation system includes a motor for providing a first mechanical input to the first vertical translation system, wherein the first mechanical input causes the lifting arm to translate along a vertical member.

[0046] In some of these embodiments, the first vertical translation system may move together with the lifting arm as a unit along the vertical member.

[0047] In some embodiments, the moving mechanism may include foldable wheels.

[0048] In some embodiments, a semiconductor processing apparatus may be provided. The semiconductor processing apparatus may include a support frame having an upper attachment point and a lower attachment point vertically offset below the upper attachment point; a first plurality of semiconductor processing chambers arranged along a first axis; and a detachable lifting system. Each semiconductor processing chamber has a base fixedly mounted relative to the support frame and a removable assembly including one or more lifting features. The detachable lifting system may include a vertical member having a top end having a raised attachment point, a bottom end having a bottom attachment point, and a moving mechanism. The raised attachment point is detachably connected to the upper attachment point, and the bottom attachment point is detachably connected to the lower attachment point. The detachable lifting system may further include a lifting arm having one or more links configured to pivot about a vertical axis substantially perpendicular to the first axis, and a vertical translation system configured to vertically translate the lifting arm relative to the support frame in a direction parallel to the vertical axis. The lifting arm includes a lifting feature engagement interface for engaging with the lifting feature of any of the removable components of the first plurality of semiconductor processing chambers.

[0049] In some embodiments, the vertical translation system includes a motor for providing a first mechanical input to the first vertical translation system, wherein the first mechanical input causes the lifting arm to translate in a direction parallel to the vertical axis.

[0050] In some such embodiments, the semiconductor processing unit further includes a power supply. The detachable lifting system may further include an electrical control cable connected to the power supply, running along the lifting arm, and terminating at a connector. Each detachable component further includes an electrical interface for connection with the connector, and the length of the electrical control cable is such that the interface between the connector and the lifting feature of the lifting arm can only simultaneously engage with the electrical interface and the lifting feature of a single processing chamber in the semiconductor processing chamber.

[0051] In some further embodiments of this kind, the semiconductor processing unit further includes a controller comprising one or more processors and one or more non-transitory memory devices, the one or more non-transitory memory devices storing instructions for controlling one or more processors to receive information about the operating status of each semiconductor processing chamber, and to cause a first actuation signal provided by an electrical interface of one of the semiconductor processing chambers to be triggered only when information about the operating status of that semiconductor processing chamber indicates that the semiconductor processing chamber is in a personnel-safe condition, so as to operate the vertical translation system.

[0052] In some further embodiments of this kind, the removable component can receive power from a power source via a cable.

[0053] In some of these embodiments, the vertical translation system may be a linear ball screw actuator, a hydraulic actuator, a rack and pinion actuator, or a cable winch.

[0054] In some of these embodiments, the detachable lifting system further includes a first interlock configured to engage with the lifting feature of any of the first plurality of removable components of the semiconductor processing chambers, and to prevent the first vertical translation system from vertically translating the first lifting arm when not engaged with the lifting feature of one of the first plurality of removable components of the semiconductor processing chambers.

[0055] In some embodiments, the mobility mechanism may include four wheels.

[0056] In some embodiments, the mobility mechanism may include a foldable wheel set.

[0057] In some embodiments, the first vertical translation system can be used to move along a vertical member together with the lifting arm as a unit.

[0058] In some of these embodiments, the vertical member may further include a slide rail configured along the first vertical translation system for movement.

[0059] In some embodiments, when the moving mechanism is connected to the lower attachment point and the upper attachment point, the moving mechanism may not be supported by the floor.

[0060] In some embodiments, when the moving mechanism is connected to the lower attachment point and the upper attachment point, the moving mechanism may be supported by the floor.

[0061] In some embodiments, the lower attachment point may be vertically offset below the base of the plurality of processing chambers.

[0062] In some embodiments, the support frame may further include a plurality of upper attachment points, the machine may further include a plurality of lower attachment points offset below the plurality of upper attachment points, the plurality of semiconductor processing chambers may include N processing chambers, the plurality of upper attachment points may include N-1 upper attachment points, and the plurality of lower attachment points may include N-1 lower attachment points.

[0063] In some embodiments, the lifting boom may further include three or more links, a double shoulder joint, and a double elbow joint.

[0064] In some embodiments, the removable component may not be a substrate.

[0065] In some embodiments, the lifting arm may not be configured to support the base plate.

[0066] In some of these embodiments, the lifting feature engagement interface may not be configured to support the substrate. Simple Explanation of the Diagram

[0067] The various embodiments disclosed herein are illustrated by way of example and not limitation, and similar reference numerals in the accompanying drawings refer to similar elements.

[0068] Figure 1 depicts a top view of an example semiconductor processing machine comprising two complex semiconductor processing chambers.

[0069] Figure 2 depicts a perspective view of the first exemplary portion of the semiconductor processing machine example of Figure 1.

[0070] Figure 3 depicts a detailed perspective view of a portion of the semiconductor equipment example in Figure 2.

[0071] Figure 4A depicts a cross-sectional view of a portion of the first lifting arm example in Figure 3, while Figure 4B describes an off-angle view of the removable top cover example in Figure 3.

[0072] Figure 5 depicts the same detailed perspective view of that part of the machine in Figure 3.

[0073] Figures 6A-6E depict the movement sequence of the removable component type in the first example of the semiconductor equipment example in Figure 2.

[0074] Figure 7 illustrates an example of a lifting boom.

[0075] Figure 8 depicts a perspective view of a second alternative example portion of the schematic diagram of the machine in Figure 1.

[0076] Figure 9 depicts a magnified portion of Figure 8.

[0077] Figure 10 shows an example of a machine tool similar to Figures 6A-6E, which has two first carriers engaged with a linear guidance system.

[0078] Figure 11 depicts a top view of an example semiconductor processing machine, which is similar to the schematic diagram of the machine in Figure 1, but with additional details and features shown.

[0079] Figure 12 depicts a top view of the semiconductor processing machine of Figure 6E, but with additional features shown.

[0080] Figure 13 depicts a block diagram of a portion of a semiconductor processing machine example 1200.

[0081] Figure 14 depicts another example of a semiconductor processing machine.

[0082] Figures 15A and 15B depict side views of another example of a semiconductor processing machine from Figure 14, and an example of a first detachable lifting system.

[0083] Figure 16 depicts a perspective view of a second example of a detachable lifting system.

[0084] Figure 17 illustrates another example of a semiconductor processing machine.

[0085] Figures 18A and 18B depict side views of the attachment sequence between the machine and the second detachable lifting system example of Figures 16 and 17.

[0086] Figure 19 depicts a perspective view of an example of a second detachable lifting system connected to the machine platform of Figures 17-18B.

[0087] Figures 20A and 20B depict the movement sequence of the removable component example of the second detachable lifting system example.

[0088] Figure 21 illustrates another construction of the second detachable lifting system example of Figure 16. Implementation

[0089] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the proposed embodiments. The embodiments disclosed herein may be practiced without some or all of these specific details. In other instances, well-known processing steps and / or structures are not described in detail so as not to unnecessarily obscure the embodiments disclosed herein. Although the disclosed embodiments are illustrated in connection with specific examples, it should be understood that this is not intended to limit the disclosed embodiments.

[0090] Semiconductor processing equipment typically has at least one processing chamber and other components capable of performing the processing, in which one or more substrates are processed. Exemplary substrate processing includes depositing materials on substrates using chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), and atomic layer deposition (ALD), and patterning and etching various materials (including conductors, semiconductors, and dielectric layers) using, for example, atomic layer etching (ALE). In this application, the terms "semiconductor wafer," "wafer," "substrate," "wafer substrate," and "partially fabricated integrated circuit" are used interchangeably. For example, the operation of depositing a thin film on a semiconductor substrate can be performed in a substrate processing apparatus, which is a processing chamber having a single substrate support located in an internal volume maintained by a vacuum pump. The substrate support (e.g., a base) may have heating elements to heat the base and the substrate. A gas delivery system and spray nozzles are fluidly coupled to the processing chamber to deliver, for example, thin film precursors, carriers, and / or cleaning and / or processing gases, subsequent reactants, etc. Devices for generating plasma within the processing chamber may also be included in the equipment, such as an RF power supply and a matching network for supplying power to the plasma. Plasma energy can be controlled (e.g., via a system controller with appropriate machine-readable instructions) by controlling one or more of the following: processing station pressure, gas concentration, RF source power, RF source frequency, and plasma power pulse timing. The RF power supply can provide RF power at any suitable frequency and can be configured as high-frequency and low-frequency RF power sources that are independently controlled, and can include frequencies between 50 kHz and 500 kHz and between 1.8 MHz and 2.45 GHz.

[0091] Although many substrate processing apparatuses use a single processing chamber, when time-consuming thin film deposition operations are involved, it can be advantageous to increase substrate processing throughput by performing multiple substrate operations in parallel on multiple substrates. For this purpose, multi-station substrate processing apparatuses can have a single substrate processing chamber containing multiple substrate processing stations located within a single internal volume defined by the walls of the processing chamber. Some other multi-station substrate processing apparatuses can have multiple processing chambers, sometimes referred to as "clustered units." Clustered units may have processing chambers containing multiple stations, for example, 2, 3, or 4 stations per processing chamber. Similarly, clustered units can have 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, or 16 or more processing chambers.

[0092] In terms of equipment cost and operating expenses, various efficiencies can be achieved by using machines comprising multiple chambers (i.e., clustered machines). For example, a single vacuum pump can be used to create a single high-vacuum environment for two or more processing chambers, and can also be used to vent used processing gases from those two or more chambers. Depending on the embodiment, the processing chambers may share the same gas delivery system, and certain components of the plasma generator equipment may be shared between processing chambers (e.g., power supplies). In some clustered machines, multiple processing chambers are connected to a wafer transport system and other components for performing deposition, etching, or other operations, such as vacuum pumps and gas delivery systems. The wafer transport system may include a robotic arm with one or more end effectors configured to pick up and transport wafers within the machine, including entering and exiting processing chambers and wafer cassettes (e.g., cassettes or front-opening wafer cassettes (FOUP)). A single clustered machine may be able to perform multiple processes simultaneously in multiple chambers while sharing some operating systems, such as gas delivery systems or generators.

[0093] For example, various efficiencies in space and throughput can also be achieved through the use of clustered machines. Generally, multiple clustered machines are located on the floor of a semiconductor manufacturing plant or fab. However, the positioning of machines relative to each other on the floor is subject to numerous constraints, such as electrical clearance areas and service areas between machines. The service area for a machine can include areas required for: removing machine components (e.g., pumps, process chamber covers), performing maintenance on the machine, adding or replacing machine parts, accessing the machine, and inspecting the machine, and can be defined at least in part according to ergonomic or other industry standards, such as meeting OSHA (Occupational Safety and Health Administration) requirements; the electrical clearance area can include areas required for personal or equipment safety, and areas required to prevent electrical interference between one or more components of adjacent machines.

[0094] Multiple chambers in each cluster can also be configured to maximize the number of chambers on the fab floor, potentially achieving higher substrate processing throughput. For example, clusters can densely pack components, positioning them close together, resulting in limited space and clearance between components. Densely packed clusters present challenges for maintenance and repair, limiting the ability to access and move components required for numerous maintenance and repair operations. For many densely packed machines, the positioning and configuration of components can prevent conventional lifting mechanisms from accessing and moving them. This access may be blocked by closely spaced components, stacked components mounted on top of each other, and machine support components such as support frames. The denser the configuration, the greater the space constraints for accessing and moving components. In some cases, it is necessary to move one or more components of the machine to allow conventional lifting mechanisms to enter and clear space for connecting, lifting, and moving components. For example, it is often necessary to remove the top cover of a processing chamber to inspect, service, clean, repair, and maintain the internal components of that chamber. For some densely packed machines, certain conventional lifting mechanisms cannot reach the top cover without removing other components surrounding it (such as a heavy-duty RF generator mounted above the top cover). Even if there are some access routes to the top cover, the support frame may further prevent conventional lifting mechanisms from reaching it.

[0095] Similarly, there may not be enough space above, below, or inside the machine for conventional lifting mechanisms to access machine components. For example, some conventional lifting mechanisms are supported on the floor by long horizontal support legs that can slide under semiconductor processing machines (similar to how pallet lifts slide under transport pallets) and use one or more lifting arms for lifting. However, some compactly installed machines may not have enough space to accommodate the support legs or lifting arms of such mechanisms, which are necessary for accessing and moving removable components.

[0096] Furthermore, the footprint of some conventional lifting mechanisms can adversely affect how closely the machines can be positioned relative to each other, i.e., the spacing between machines. For example, some machines may need to be spaced at a first minimum distance, providing sufficient clearance to allow them to be placed as close as possible and maximize the fab floor space. However, some conventional lifting systems are moved to and supported by the floor, potentially having a footprint larger than the first minimum distance. In these cases, machines may have to be spaced further than the first minimum distance to allow these conventional lifting systems to move and operate, thus reducing the spacing efficiency of the machines on the fab floor.

[0097] These traditional lifting mechanisms may also require additional time and manpower to access and move machine components, assuming the components are inherently accessible and movable. Furthermore, when space must be cleared from other components to access one, the movement, disassembly, and reinstallation of those other components may require additional alignment and calibration of that component. This extra time and manpower for routine and necessary maintenance and upkeep results in undesirable machine downtime. Therefore, we desire a machine with a lifting mechanism that allows easy, quick, and efficient access to machine components without incurring unwanted time, manpower, and machine downtime.

[0098] Novel devices and systems are described herein for moving components of semiconductor processing kiosks or cluster kiosks, all of which may be referred to herein as kiosks. In some embodiments, features configured to move the kiosk components are integrated into the kiosk itself. Figure 1 depicts a top view of an example semiconductor processing kiosk comprising two plurality of semiconductor processing chambers. As seen in Figure 1, the kiosk 100 includes a first plurality of semiconductor processing chambers 102 having five semiconductor processing chambers 104 arranged along a first axis 106, and a second plurality of semiconductor processing chambers 108 comprising five processing chambers 110 also arranged along an axis 112 substantially parallel to the first axis 106. The word "substantially" is used herein because, in practice, axes or other elements may not be perfectly aligned; in this case, "substantially" means that these axes may be exactly parallel to each other, but may also be parallel to each other within, for example, + / - 10 degrees, + / - 5 degrees, or + / - 1 degree. While each plurality of semiconductor processing chambers comprises five processing chambers, each plurality of semiconductor processing chambers may, for example, have two, three, four, five, six, or more processing chambers. The machine 100 also includes an upper support frame 114 to which a portion of each semiconductor processing chamber 104 and 110 may be fixedly mounted. When an item is "fixedly mounted" to another item, this means that the item is mounted to the other item in a fixed position relative to the other item, either directly or through one or more intermediate components (e.g., a support frame). For example, a portion of each semiconductor processing chamber 104 and 110 is fixedly mounted to the upper support frame 114 such that these portions are fixed in their respective positions relative to the upper support frame 114. Other portions of the semiconductor processing chamber 104 may be intended to be removable / movable relative to the upper support frame 114 during normal service operation, as will be discussed further below.

[0099] As described above, machine 100 has a service area 115 surrounding its footprint, within which no other machine is placed; similar service areas may also exist on the opposite side of machine 100 (although not shown). Service area 115 can also be considered as a separation distance between other machines, allowing personnel and equipment to move between these machines. Some machine embodiments described herein add almost no static footprint to the machine.

[0100] The machine 100 may also include a linear guide system and a carrier for facilitating and moving the removable components of the semiconductor processing chamber. As discussed in more detail below, in some embodiments, the linear guide system may be fixedly connected to a support frame, and the carrier may be movably connected to the linear guide system and movably connected to the removable components of the semiconductor processing chamber, thereby allowing the carrier to translate along the linear guide system to approach, connect to, and move the removable components of the semiconductor processing chamber.

[0101] Figure 2 is a perspective view depicting a first exemplary portion of the semiconductor processing apparatus of Figure 1. Although a first plurality of semiconductor processing chambers 102 are indicated here, for illustrative purposes, only the base 116 of each of the five semiconductor processing chambers 104 and the removable top cover 118 of semiconductor processing chamber 104A shown in a removed state are shown (the remaining top covers of the other semiconductor processing chambers 104 are not shown). Each base 116 of the semiconductor processing chamber 104 can be directly or indirectly fixedly mounted to the upper support frame 114, although the interface between each base 116 and the upper support frame 114 is not visible. The base 116 can be fixedly mounted to the upper support frame 114 by any known means, such as bolts, welding, clamps, or pins.

[0102] Figure 2 also depicts the first linear guide system 120 and the first carrier 122, which will be further depicted in Figure 3 and discussed below. For illustrative purposes, the first carrier 122 is enclosed by dashed lines. The first linear guide system 120 may be fixedly supported by or mounted to the upper support frame 114; this may include directly or indirectly fixing or connecting the first linear guide system 120 to or connecting to the upper support frame 114, such that the first linear guide system 120 is fixed in one position relative to the upper support frame 114. The arrangement of the first linear guide system 120 may also be such that it extends along a second axis 124, which is substantially parallel to the first axis 106 (substantially meaning that these axes may be exactly parallel to each other or within, for example, + / - 10 degrees, + / - 5 degrees, or + / - 1 degree).

[0103] The first carrier 122 is configured to movably engage with the first linear guide system 120, allowing the first carrier 122 to translate along the second axis 124. This configuration may include the first linear guide system 120 supporting the first carrier 122 and having features that allow the first carrier 122 to move along the first linear guide system 120. For example, the first carrier 122 may have wheels or bearings that can be received by one or more tracks or grooves of the first linear guide system 120, thereby allowing the first linear guide system 120 to support the first carrier 122 and move the first carrier 122 along the first linear guide system 120 and the second axis 124, for example, by rolling or sliding. In some embodiments, the movable engagement between the first carrier 122 and the first linear guide system 120 may be passive, allowing the first carrier 122 to be moved manually along the first linear guide system 120. In other embodiments described below, this movable engagement can be powered by a carrier translation system to move the first carrier 122 along the first linear guide system 120.

[0104] Figure 3 depicts a portion of the semiconductor equipment example of Figure 2. A partial cross-sectional view of the first linear guide system 120, the first carrier 122, and the removable top cover 118 can be seen here. The first linear guide system 120 extends along a second axis 124 and includes two tracks 126A and 126B movably engaged with the wheels or bearings of the first carrier 122, such that the first linear guide system 120 supports the first carrier 122, which is movable along the second axis 124, as indicated by the double-headed arrow 128.

[0105] Additional features of the first carrier 122 will now be discussed. In some embodiments, the first carrier may include a first lifting arm having one or more links and pivotable about a vertical axis. In FIG. 3, the first carrier 122 includes a first lifting arm 130 having a single link 132. The first lifting arm 130 is configured to pivot about a vertical axis 134, as indicated by arrow 136, for example, relative to the first linear guide system 120 or the upper support frame 114; the vertical axis 134 is substantially perpendicular to the second axis 124 (here, substantially perpendicular means that these axes are actually perpendicular or orthogonal to each other within, for example, at least + / - 10 degrees, + / - 5 degrees, or + / - 1 degree). The pivoting capability of the first lifting arm 130 allows it to be at least partially moved to multiple positions to engage with components of the semiconductor processing chamber, thereby enabling the movement of these components. The first lifting arm 130 is also connected to the first carrier 122 so that the first lifting arm 130 moves together with the first carrier 122.

[0106] The first lifting arm and the removable component are configured to be connected to each other, such that the removable component can be supported by the first carrier while the first carrier is raised, lowered, and moved. In some embodiments, this configuration includes a first lifting arm having a lifting feature engagement interface for engaging with a lifting feature of the removable component; the engagement between this lifting feature engagement interface and the lifting feature creates a connection between the first lifting arm and the removable component, and allows the removable component to be raised, lowered, and supported by the first lifting arm and the first carrier.

[0107] Suitable lifting feature engagement interfaces, examples of lifting features, and their physical connections (i.e., engagement) can be conventional lifting mechanisms and connecting elements, such as hooks or lifting holes, shackles, threaded connections between elements, pins and holes, rotary latches, and cables, belts, or chains. For example, the lifting feature of a removable assembly can be connected to the removable assembly by a hook. The lifting feature engagement interface can be a cable connected to a first lifting arm, and their engagement can be a cable and hook connected together (e.g., by bolts or screws). This connection of the first lifting arm to the removable assembly allows the first lifting arm to be raised, lowered, and the removable assembly to be moved.

[0108] In some embodiments, the lifting feature engagement interface may have a first structure connected to the end of the first lifting arm and a second structure for engaging a removable component with the lifting feature. For example, as shown in FIG3, the first lifting arm 130 includes a lifting feature engagement interface, which is the first structure 138 (i.e., beam 138) connected to the end 140 of the first lifting arm 130; the lifting features of the removable component or removable top, removable cover 118 (which may also be considered as a removable top plate or removable top in some embodiments) are the second structures 142A and 142B. The first structure 138 may engage with the second structures 142A and 142B in various ways, such as by pins, screws, clamps, or bolts.

[0109] In some embodiments, the lifting feature engagement interface may have mechanical features for engaging with complementary mechanical features of the lifting feature. For example, Figure 4A depicts a cross-section of a portion of the first lifting arm example of Figure 3, and Figure 4B depicts an off-angle view of the removable cover example of Figure 3. In Figure 4A, the beam (i.e., the first structure 138 of the lifting feature engagement interface) includes two first mechanical interface features, depicted as holes 144A and 144B, separated by a first distance 146. These first mechanical interface features are complementary to the second mechanical interface features of the lifting feature of the removable cover 118. In Figure 4B, the lifting features of the removable cover 118 (i.e., the second structures 142A and 142B, which may be referred to here as saddles) are enclosed within dashed lines. Each second structure includes a pair of vertical lift rods 148A and 148B and saddle plates 150A and 150B spanning and enclosing each pair of vertical lift rods 148A and 148B. Each saddle plate 150A and 150B also includes second mechanical interface features 151A and 151B (depicted as pins), which are separated by a first distance 146. Based on the configuration of these features, the second mechanical interface features 151A and 151B can be inserted into the first mechanical features of the lifting feature engagement interface, namely the holes 144A and 144B of the beam 138, thus constituting an engagement between the lifting feature engagement interface and the removable component. Alternatively, the pins can be located on the lifting beam, while the holes can be located on the saddle plates.

[0110] In some embodiments, the first structure 138 of the lifting feature engagement interface may include a beam and a column perpendicular to the beam, similar to one of the vertical lifting rods 148A, which can be connected to the removable assembly using hooks, clamps, bolts, etc. In some such embodiments, the lifting feature may be a hole, a threaded hole, or other connecting feature that can be connected to the lifting feature engagement interface.

[0111] The first carrier and the first lifting arm are also movable, allowing the lifting feature engagement interface to be moved and engaged with the lifting feature of any removable component. Returning to Figure 2, this mobility includes the movement of the first carrier 122 along the second axis 124, allowing it to approach or adjoin any semiconductor processing chamber 104, and returning to Figure 3, it includes the ability of the first lifting arm 130 to rotate about the vertical axis 134. Rotation of the first lifting arm 130 about the vertical axis 134 causes the first lifting arm 130 to move in a plane perpendicular to the vertical axis 134, as discussed in more detail below.

[0112] The mobility of the first lifting arm 130 may also include the mobility of the lifting feature engagement interface. The lifting feature engagement interface can rotate about one or more axes. Returning to Figure 4A, the lifting feature engagement interface 152 is surrounded by a dashed line shape and is connected to a single link 132 of the first lifting arm at a joint 158. A vertical axis 134, an axis 160 parallel to the vertical axis, and two other axes 154 and 156 perpendicular to axis 160 are shown in Figures 4A and 5. The joint 158 ​​at the connection between the lifting feature engagement interface 152 and the link 132 of the first lifting arm 130 is used to allow the lifting feature engagement interface 152 to rotate relative to the first link 132 about one or more axes, in this particular example, which includes the vertical axis 134 and the other two axes 154 and 156. For example, the lifting feature engagement interface 152 can rotate about axis 156 at joint 158 ​​relative to link 132, but it can also rotate about axis 160 parallel to vertical axis 134 relative to link 132. In some cases, the joint where the lifting feature engagement interface 152 connects to link 132 of the first lifting arm 130 can be a ball joint. This ball joint allows for partial oscillation about an axis parallel to vertical axis, which can help with planar alignment. A ball joint can be advantageous because it can align the processing chamber cover and the processing chamber if they are not aligned. In some cases, certain moving axes can be lockable, for example, using spring plungers, pins, screws, or clamps to prevent movement about locking axes.

[0113] In some embodiments, the first carrier may include a vertical translation system configured to vertically translate the lifting arm relative to the first linear guide system or upper support frame. This vertical movement of the lifting arm also allows the first carrier to engage with and lift / lower removable components of the semiconductor processing chamber. In Figure 5, the same detailed perspective view of the machine portion of Figure 3 is shown, with the vertical translation system 162 outlined by dashed lines. The vertical translation system 162 is configured to vertically translate the first lifting arm 130 along a second vertical axis parallel to the vertical axis 134, indicated by double arrows 164. Returning to Figures 4A and 4B, the vertical translation system 162 positions the lifting feature engagement interface 152 below the second mechanical interface features 151A and 151B (i.e., pins), and then moves it vertically upwards, causing the second mechanical interface features 151A and 151B to be inserted into the first mechanical interface features (i.e., holes 144A and 144B), thereby engaging the lifting feature engagement interface 152 with the lifting feature of the removable top cover 118. Once engaged, the removable top cover can be raised and lowered using the vertical translation system 162 without risking disengagement of the lifting feature engagement interface 152.

[0114] The vertical translation system 162 can utilize various mechanisms to vertically translate the first lifting arm 130. For example, the vertical translation system 162 can be a linear ball screw actuator, a hydraulic actuator, a rack and pinion actuator, or a cable winch. The vertical translation system 162 may also include a motor 166 configured to provide mechanical input to the vertical translation system 162. For example, the motor 166 can provide mechanical drive force for any actuator, such as a linear ball screw actuator.

[0115] In some embodiments, the machine tool may include one or more bladders to seal portions of the linear guide system and the first carrier, preventing contamination by particles and other substances generated by these movable features; these contaminants could be harmful to the substrate and other parts of the machine tool. The interface between the linear guide system and the first carrier may be one of these movable components that can generate contaminants, and including a bladder around the interface between the linear guide system and the first carrier may be advantageous to create a seal at this interface. The vertical translation system may also have a bladder, as this system may generate contaminants.

[0116] The first carrier, the first lifting arm, or both of the above can be movable, allowing the removable component engaged with the first lifting arm to be moved. As described above, once the lifting feature interface of the first lifting arm engages with the lifting feature of the removable component, the first carrier can be used to vertically translate the removable component in a direction parallel to the vertical axis 134, as shown in FIG5. Furthermore, the first carrier is configured to allow the removable component engaged with the first lifting arm to be moved horizontally or in one or more directions within a plane perpendicular to the vertical axis 134. FIG6A-6E depict the movement sequence of the removable component example of the first exemplary portion of the semiconductor machine example of FIG2. For illustrative purposes, these figures are simplified top views of the machine of FIG2 without the upper support frame; these figures are viewed at an angle parallel to the vertical axis of FIG3 and FIG5, such that the vertical axis is perpendicular to and extends into the page. Here, the first linear guide system 120 includes two tracks 126A and 126B, extending along the second axis 124. The first carrier 122 is movably engaged with the first linear guide system 120, allowing the first carrier 122 to translate along the second axis 124. Also visible in the figure are the first plurality of semiconductor processing chambers 102, their bases 116, the first lifting arm 130, the connecting rod 132, and the lifting feature engagement interface 152 that engages with the lifting features (i.e., the second structures 142A and 142B of the removable top cover 118).

[0117] As shown in Figures 6A-6E, the first lifting arm 130, connecting rod 132, lifting feature engagement interface 152, first carrier 122, and removable cover 118 can all move in a plane perpendicular to the vertical axis. Figure 6A can be considered as the initial position after the lifting feature of the removable cover 118 engages with the lifting feature engagement interface 152 of the first lifting arm 130. In Figure 6B, the first carrier 122 has translated along the second axis 124 in the direction of arrow 128, and the removable cover 118 has moved in a horizontal direction 168 perpendicular to the second axis 124. This movement of the removable cover 118 can be considered as movement in a plane perpendicular to the vertical axis. This movement of the top cover 118 can also be achieved by the rotation of the lifting feature engagement interface 152 relative to the link 132 (as shown by arrow 169) and by the linear translation of the carrier 122 along the second axis 124, and by the rotation of the first lifting arm 130 about the vertical axis (134 is indicated by "X" on the next page), as shown by arrow 136. Further movement of the removable top cover 118 in the horizontal direction 168, and the corresponding movement and rotation of the first lifting arm 130, the lifting feature engagement interface 152, the link 132, and the first carrier 122, are further seen in Figures 6C-6E.

[0118] The removable components can be moved in a manner different from that described in Figures 6A-6E. For example, the carrier 122 can be held in a fixed position on the second axis 124, while one or more of the first lifting arm 130, the lifting feature engagement interface 152, the connecting rod 132, and the removable cover 118 can rotate about an axis parallel to the vertical axis 134. In some examples, only the first lifting arm 130 can rotate about an axis parallel to the vertical axis 134 (as indicated by arrow 136), while other aspects of the first carrier remain fixed. The mobility of the removable components engaged with the first carrier is also not limited to horizontal movement 168 or linear movement along the second axis 124. In some embodiments, the removable component may be moved such that the movement has a vector component in the horizontal direction 168 and the second axis 124, and a rotational component in the horizontal plane (including, but not limited to, the aforementioned horizontal direction 168 and the second axis 124) about an axis parallel to the vertical axis (as indicated by arrow 136) and about an axis perpendicular to the first axis.

[0119] The mobility of the first carrier, the first lifting arm, or both of the above also allows the removable assembly engaged with the first lifting arm to be moved outside the machine housing. In some embodiments, such as referring to FIG. 6E, the base of the first plurality of semiconductor processing chambers may be located within the housing 170, and the aforementioned movement of the first carrier 122 may allow the removable cover 118 to be moved outside the housing 170. In some cases, the removable cover 118 may be moved outside the housing 170 but into the service area surrounding the machine 100, as shown in FIG. 1. The housing 170 may be considered as containing all the bases of the semiconductor processing chambers of the machine.

[0120] In some embodiments, the first lifting arm may have a linear segment as shown in FIG3. This linear segment may be the same as the link 132 extending between the pivot segment 133 and the end 140 of the first lifting arm 130 (i.e., the connection point of the lifting feature engagement interface), the pivot segment 133 being the portion of the first lifting arm 130 that pivots or rotates about the vertical axis 134, as indicated by arrow 136. In some such embodiments, the first lifting arm may have a linear segment and a tilting segment. FIG7 depicts an example of a lifting arm. Here, the example lifting arm includes a linear segment 732 having an end 740 connected to the lifting feature engagement interface 752, and also includes a tilting segment 772 spanning between the pivot segment 733 and the linear segment 732. The tilting segment 772 is oriented at an angle 774 relative to the vertical axis 134, which may be an acute angle or an obtuse angle, as depicted in FIG7. The angle is in the range of approximately 15 to 75 degrees, approximately 30 to 60 degrees, including approximately 45 degrees. This tilted lifting arm can be advantageous because it enables different vertical operations compared to a lifting arm with only a linear segment. In some embodiments, the lifting arm may include two or more links and multiple joints, such as elbow joints and double elbow joints.

[0121] The positioning and arrangement of the first linear guide system and the first carrier can be different, thus affecting the mobility of the first carrier and the first lifting arm. In some embodiments, the first linear guide system can be positioned above the first plurality of semiconductor processing chambers. For example, referring back to FIG2, it can be seen that the first linear guide system 120 is located directly above or vertically offset above the first plurality of semiconductor processing chambers 102, which are located in a direction parallel to the vertical axis 134. In some embodiments, the first carrier 122 can be vertically offset below the first linear guide system 120 in a direction parallel to the vertical axis 134, as shown in FIG2. In some embodiments, when viewed along a direction parallel to the second axis 124, the first carrier 122 can be considered to be vertically inserted between the first linear guide system 120 and a portion (e.g., base 116) of the first plurality of semiconductor processing chambers 102.

[0122] The first lifting arm 130 is capable of engaging with a plurality of removable components of the semiconductor processing chamber 104 of the first plurality of semiconductor processing chambers 102, which may be connected to or surround the base 116. These removable components may include, for example, a removable cover 118, a radio frequency (RF) generator, a pump, or a cryogenic pump. We may wish to remove these components from the semiconductor processing chamber for maintenance or repair of the removable components or another part of the semiconductor processing chamber. Each of these removable components may include some of the lifting features discussed above, such that a lifting feature engagement interface engages with these removable components, thereby raising, lowering, and removing the removable components. For example, any removable component may have the lifting features described in FIG. 4B above, or they may have conventional lifting features, such as hooks, rings, etc. Regardless of the type of lifting features arranged on the removable assembly, the first carrier and the first lifting arm are movable, such that the lifting feature engagement interface can be moved to engage with these lifting features of the removable assembly.

[0123] In some other embodiments, the linear guide system and the first carrier are configured and positioned such that the first carrier can access other parts of the machine. For cases with different component configurations, it is advantageous to have different configurations of the linear guide system and the carrier. For example, the first exemplary portion of the machine in FIG2 has components arranged in a specific manner that may be sufficient for positioning the aforementioned linear guide system and the first carrier. In other cases, the machine has removable components configured such that the aforementioned linear guide system and the first carrier cannot reach these components. In these cases, the configuration may differ from that described above.

[0124] Figure 8 depicts a perspective view of a second alternative example portion of the schematic diagram of the machine in Figure 1. The component arrangement of the machine 800 is similar to, but different from, that of the machine 100 described above. Here in Figure 8, similar to Figure 2, the first plurality of semiconductor processing chambers 802 in this example includes three semiconductor processing chambers arranged along a first axis 806, each semiconductor processing chamber including a base 816 fixedly mounted on an upper support frame 814. As further shown in Figure 8, the machine 800 includes components 874 above the first plurality of semiconductor processing chambers 802, some of which are removable. The positioning and arrangement of these components 874 may be advantageous when using a different linear guide system, first carrier, or both than those described above, for example, in Figure 2.

[0125] The machine tool 800 includes a second linear guide system 876, which is arranged along a second axis 824 substantially parallel to the first axis 806, as described above, and includes a first track 878A and a second track 878B. As described above, these two tracks are parallel to each other and perpendicularly offset from each other along a vertical axis 834 perpendicular to the second axis 824. The second linear guide system 876 is also directly or indirectly fixedly supported by an upper support frame 814; Figure 8 shows the second linear guide system 876 directly and fixedly mounted to the upper support frame 814. A second carrier 880 is also depicted within the dashed lines, and a magnified portion of Figure 8 will be seen in more detail in Figure 9. In Figure 9, the second carrier 880 is movably engaged with the second linear guide system 876 such that it is simultaneously movably engaged with both the first track 878A and the second track 878B, thereby enabling the second carrier to translate along the second axis 824 in the direction of arrow 828, as described above. It should be understood that the reference to the "second" linear guide system and carrier is not intended to imply that a separate "first" instance necessarily exists in every identical semiconductor machine. The serial number is used only to distinguish this linear guide system and carrier from the examples discussed above.

[0126] The second carrier 880 also includes a first lifting arm 830, which may be identical to the first lifting arm 130 described above, including its elements, its ability to rotate about an axis parallel to the vertical axis 834, and its lifting feature engagement interface for engaging with the lifting feature of a removable component. In some cases, the link 832 may be longer or shorter than that in FIG. 2 to reach other components of the machine tool 800. Also as described above, the second carrier 880 may include a first vertical translation system 862 for translating the first lifting arm 830 in a direction parallel to the vertical axis 834, as indicated by arrow 864. The first vertical translation system 862 includes a motor 866, which may use pulleys and cables or screw actuators to drive the vertical translation as described above.

[0127] In some embodiments, the second linear guide system and the second carrier are configured to allow the second lifting arm to translate below, between, and above the second linear guide system. For example, in FIG8, the first lifting arm 830 is translatable below the second linear guide system 876 and between the first track 878A and the second track 878B; in some embodiments, the vertical translation system may even extend above the second track 878B, thereby allowing the second lifting arm to translate to a position above the second track 878B. This vertical translation range allows the lifting feature engagement interface of the first lifting arm 830 to approach and move removable components below the second linear guide system 876, such as the removable cover 818 and the removable component 882A, and removable components located between the first track 878A and the second track 878B (or above the second track 878B), such as the removable component 882B. In some embodiments, the first carrier is configured such that the first lifting arm 830 can access and move above the removable component above the bottom of the second linear guide system 876.

[0128] Some embodiments of the machine tool may have two or more carriers simultaneously and movably engaged with the same linear guide system. For example, the first linear guide system 120 in Figures 2 and 3 may have two first carriers 122 simultaneously and movably engaged with it. In some embodiments, the two first carriers 122 may be copies of each other. For example, Figure 10 depicts the machine tool shown in Figures 6A-6E, which has two first carriers engaged with a linear guide system. Here, first carriers 122A and 122B (which can be considered as second carriers) are simultaneously and movably engaged with the first linear guide system 120 such that they can both translate along the second axis 124. In these embodiments, first carriers 122A and 122B are duplicates, and their construction is the same as the first carrier 122 described above. This allows the removable components of multiple semiconductor processing chambers 104 to be accessed and moved, thereby increasing the efficiency of maintenance and repair and reducing time.

[0129] Returning to Figure 1, the machine 100 may have two sets of multiple semiconductor processing chambers, a first set 102 and a second set 108. The second set of semiconductor processing chambers 108 may be arranged along a third axis, which is considered to be the same as axis 112, which is substantially parallel to but offset from the first axis 106. In Figure 1, the second set of semiconductor processing chambers 108 is offset from the first set of semiconductor processing chambers 102 in another direction perpendicular to the first axis, such that the machine has an internal region 184 (shown as dashed lines with semi-transparent shading) between the multiple semiconductor processing chambers. The internal region may include a portion of the upper support frame 114 and components for semiconductor processing, such as gas cartridges, manifolds, gas sources, electronic devices, conduits, etc. This internal region 184 may also include one or more substrate handling robots for transporting one or more substrates into or out of the processing chambers or other parts of the machine. As discussed herein, these substrate handling robots differ from the carriers disclosed. For example, substrate handling robots are typically located in internal areas because this allows such robots to efficiently transfer wafers between different processing chambers while still keeping the wafers in a controlled environment, such as within a vacuum transfer module.

[0130] A machine 100 having multiple semiconductor processing chambers may have a linear guide system and a carrier in each of the multiple semiconductor processing chambers. Figure 11 depicts a top view of an example semiconductor processing machine similar to the schematic diagram of the machine in Figure 1, but showing additional details and features. The first plurality of semiconductor processing chambers 102 may be similar to those described in Figures 2-7. These semiconductor processing chambers may be arranged along a second axis 124, and their bases 116 may be fixedly mounted to an upper support frame 114. As described in Figures 2-7 above, the positioning and configuration of the first linear guide system 120 and the first carrier 122 is such that only the first plurality of semiconductor processing chambers 102 can be accessed and moved by a removable assembly, such as a removable top cover 118.

[0131] Additionally, the second plurality of semiconductor processing chambers 108 may be arranged along a third axis. The second linear guide system 1120 may be positioned along a fourth axis 1185, substantially parallel to the third axis 112 (see FIG. 1). The second carrier 1122 may be movably engaged with the second linear guide system 1120, and its configuration is for accessing and moving only the removable components of the second plurality of semiconductor processing chambers 108. The second carrier 1122 may be configured to engage with a lifting feature of a removable component (e.g., a removable cover 1118) of the second plurality of semiconductor processing chambers 108, as described above with respect to the first carrier 122. In some embodiments, the second linear guide system 1120 may be identical to the first linear guide system 120, the second carrier 1122 may be identical to the first carrier 122, and the removable components of the first and second plurality of semiconductor processing chambers may all be of the same or similar design. In some other embodiments, the first linear guide system 120 may be different from the second linear guide system 1120, and the first carrier 122 may be different from the second carrier 1122, but each of the first carrier and the second carrier may still be used to engage with the lifting feature of the removable component of their respective semiconductor processing chamber.

[0132] In some embodiments, the first plurality of semiconductor processing chambers 102, the second plurality of semiconductor processing chambers 108, and the interior region may all be located within the housing 170. In some instances, at least a portion of the first carrier and / or linear guide system is positioned outside the housing 170. The first carrier 122 and the second carrier 1122, including their respective first and second lifting arms, are movable so that removable components in each semiconductor processing chamber can be moved outside the housing. Figure 11 shows removable top covers 118 and 1118 moved and positioned outside the housing 170.

[0133] The lifting and lowering characteristics of the linear guide system and the first lifting arm described herein may include varying degrees of power and non-power characteristics. For example, in some embodiments of the machine tool, the movement of the first lifting arm 122 along the second axis 124 and the horizontal and rotary movement of the first lifting arm may be unpowered, allowing human, non-motor, electric, or mechanical power to move the first lifting arm 122 and to move the first lifting arm horizontally and rotaryly. In some examples, mechanical power, such as a motor or hydraulic device, may vertically move one or more portions of the first lifting arm 122 and the first lifting arm 130, for example, a motor causing the first lifting arm 130 to move vertically. In some other embodiments, the movement of the first lifting arm along the linear guide system and the horizontal and rotary movement of the first lifting arm may be powered, for example, using a motor, pump, hydraulic system, or the like.

[0134] Some embodiments of the equipment described herein may also include controllers that control different parts of the equipment. In some embodiments, the controller may be part of one or more processing chambers, one or more platforms for processing, and / or specific processing components (wafer pedestals, airflow systems, etc.). These equipment may be integrated with electronics to control their operation before, during, and after the processing of semiconductor wafers or substrates. These electronics may be referred to as "controllers" and control various components or sub-components of the equipment. Depending on the processing requirements and / or equipment type, the controller may be programmed to control any of the processing disclosed herein, including, for example, controlling the lifting system disclosed herein when power is supplied and monitoring the operating status of the semiconductor processing chamber for maintaining safety conditions. The controller may also control other aspects of equipment operation, including the delivery of processing gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and operation settings, wafer loading and unloading from the equipment and other transfer equipment, and / or loading locks connected or connected to a specific system, etc.

[0135] In a broad sense, a controller can be defined as an electronic device having various integrated circuits, logic, memory (including non-transitory media), and / or software that receives instructions, issues instructions, controls operations, enables cleaning operations, enables endpoint measurements, etc. Integrated circuits may include chips in firmware form that store program instructions, digital signal processors (DSPs), chips defined as application-specific integrated circuits (ASICs), and / or one or more microprocessors or microcontrollers (e.g., software) that execute program instructions. Program instructions can be instructions passed to the controller in the form of various individual settings (or program files), defining operating parameters for performing specific processes on or for a semiconductor wafer or system. In some embodiments, operating parameters may be part of a recipe defined by a process engineer to complete one or more processing steps during the manufacture of one or more of the following: layers, materials, metals, oxides, silicon, silicon oxides, surfaces, circuits, and / or wafer grains.

[0136] In some implementations, the controller may be part of or coupled to a computer, which may be integrated into, coupled to, or networked with the machine, or a combination thereof. For example, the controller may be located in the "cloud" or in whole or in part within the wafer fab's mainframe computer system, thus allowing remote access to wafer processing. The computer may initiate remote access to the system to monitor the current progress of manufacturing operations, examine the history of past manufacturing operations, examine trends or performance metrics from multiple manufacturing operations, change parameters of the current process, set process steps to continue the current process, or start a new process. In some examples, the remote computer (e.g., a server) may provide process recipes to the system via a network, which may include a local area network or the Internet. The remote computer may include a user interface that allows parameters and / or settings to be input or programmed and then transmitted from the remote computer to the system. In some examples, the controller receives instructions in the form of data specifying parameters for each process step to be performed during one or more operations. It should be understood that the parameters are specific to the type of process to be performed and the type of tool the controller uses to interface with or control it. Therefore, as mentioned above, a distributed controller can be implemented, for example, by comprising one or more discrete controllers (such as the process and control described herein) networked together and operating towards a common purpose. An example of a distributed controller for this purpose is one or more integrated circuits in a chamber that communicate with one or more remote integrated circuits (e.g., at the platform level or as part of a remote computer), which combine to control the process within the chamber.

[0137] The equipment may include plasma etching chambers or modules, deposition chambers or modules, rotary cleaning chambers or modules, metal plating chambers or modules, cleaning chambers or modules, bevel edge etching chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etching (ALE) chambers or modules, ion implantation chambers or modules, track chambers or modules, and any other semiconductor processing system that can be associated with or used in semiconductor wafer fabrication and / or production, without any limitation. The equipment may have multiple processing chambers or modules.

[0138] As described above, depending on the one or more process steps to be performed by the machine, the controller may communicate with one or more of the following: other machine circuits or modules, other machine components, clustered machines, other machine interfaces, adjacent machines, nearby machines, machines throughout the plant, a host computer, another controller, or machines used for transporting materials to and from the machine location and / or loading port of the semiconductor manufacturing plant.

[0139] In some embodiments, the various lifting states of the machine tool may be powered, and a controller may be configured to control a drive system that controls the movement of the carrier relative to the linear guide system and / or the movement of the arm link relative to the carrier. Figure 12 depicts a top view of an example semiconductor processing machine tool of Figure 6E, but shows additional features. For example, the machine tool 1200 has a first linear guide system 120, which includes a carrier translation system 1288 for translating a first carrier 122 along a first axis 124. The carrier translation system 1288 may include a moving mechanism (e.g., a motor) that can push the first carrier 122 along the first linear guide system 120. For example, the first carrier 122 may have one or more motors to drive one or more wheels and move the first carrier 122 along the first linear guide system 120. In another case, as shown in FIG6A, the first linear guide system 120 may have a linear ball screw actuator with a motor 191 for rotating a linear ball screw 189 connected to the first carrier 122, such that when the linear ball screw 189 is actuated by the motor 191, the first carrier 122 moves along the first linear guide system 120.

[0140] In some embodiments, the machine tool 1200 may have a first carrier (represented by frame 1290) further comprising a lifting arm movement system configured to move the first lifting arm 130 in a plane perpendicular to the aforementioned vertical axis. This configuration may include the ability to rotatably drive one or more pivot points of the first lifting arm about a direction parallel to the vertical axis. For example, the first carrier 122 may include a motor connected to a first link 132 at a pivot section 133, which allows the first link 132 to rotate about the vertical axis in the direction of arrow 136. The first carrier 122 may also include another motor directly or indirectly connected to the lifting feature engagement interface 152, which allows the lifting feature engagement interface 152 to rotate about axis 160, as shown in FIG4A and 169 of FIGS. 6C-6E above. This other motor (pneumatic or hydraulic system) may be located on the first lifting arm or within the first carrier 122 and connected to the lifting feature engagement interface 152 via pulleys, belts, transmission chains, gears, links, or the like. In some embodiments, the lifting arm moving system can also enable the lifting feature engagement interface 152 to rotate about one or more axes perpendicular to the vertical axis, for example, about an axis parallel to the first axis as described above. The machine base 1200 also includes the aforementioned vertical translation system 162, which is used to translate the first lifting arm 130 along the vertical axis 134.

[0141] The machine tool 1200 also includes a controller 1292, such as a controller similar to the one described above for controlling the carrier translation system and the lifting arm movement mechanism. The controller 1292 may include one or more non-transitory memory devices 1294 and one or more processors 1296. The processor 1296 may include one or more CPUs, multiple ASICs, one or more general-purpose computers and / or application-specific computers (one or more), one or more analog and / or digital input / output connectors (one or more), one or more stepper motor controller panels, etc.

[0142] The controller 1292 is communicatively connected to the rack translation system 1288, the lifting arm movement system 1290, and the vertical translation system 162. Figure 13 shows a block diagram of a portion of an example of a semiconductor processing unit 1200. As can be seen, the controller 1292 is communicatively connected to each of the first plurality of semiconductor processing chambers 104, the rack translation system 1288, the lifting arm movement system 1290, and the vertical translation system 162. The controller 1292 stores instructions in its non-transitory memory 1294 for controlling one or more processors 1296 to move the first rack 122, including the first lifting arm 130. This includes causing the carrier translation system 1288 to move the first carrier 122 along the second axis 124, causing the vertical translation system 162 to move the first lifting arm 130 (including the first connecting rod 132 and the lifting feature engagement interface 152) in the vertical direction, as described above, and causing the lifting arm movement system 1290 to move the first lifting arm 130 in a plane perpendicular to the vertical axis 134, as described above.

[0143] In some embodiments, the controller 1292 also stores instructions in its non-transitory memory 1294 for controlling one or more processors 1296 to engage the lifting feature engagement interface 152 with the lifting feature of the removable assembly of the semiconductor processing chamber 104. These instructions can cause various actions of the first carrier 122, such as linear translation along the second axis 124, vertical movement of the first lifting arm 130, and horizontal movement of the first lifting arm 130 (i.e., movement in a plane perpendicular to the vertical axis). For example, referring back to Figures 4A and 4B, the instructions can cause the vertical translation system 162 to move the first lifting arm 130 in a direction parallel to the vertical axis 134, so that the lifting feature engagement interface 152 (including holes 144A and 144B) is located below the second mechanical interface features 151A and 151B of the lifting feature, i.e., the second structures 142A and 142B. The command also causes the first lifting arm 130 (which may include a lifting feature engagement interface 152) to rotate, move linearly, or both in a plane perpendicular to the vertical axis 134, so that the second mechanical interface features 151A and 151B are aligned with holes 144A and 144B, respectively. Once these features are aligned (which may be determined, for example, based on the output of various sensors used to detect such alignment), the command may be, or can be manually input by the user, causing the vertical translation system 162 to move the first lifting arm 130 upward in a direction parallel to the vertical axis 134, so that the second mechanical interface features 151A and 151B are inserted into holes 144A and 144B, respectively. In some embodiments, saddle plates 150A and 150B are in contact with the lifting feature engagement interface 152.

[0144] Once the lifting features of the removable assembly and the lifting features of the first lifting arm engage with each other, instructions can control one or more processors to raise and / or lower the removable assembly in a direction parallel to the vertical axis; similarly, instructions can move the removable assembly in a plane perpendicular to the vertical axis by moving the first lifting arm in the manner described above using a lifting arm moving system, a carrier translation system, or both. For example, controller 1292 may contain instructions to cause the movement sequence described in Figures 6A-6E to occur.

[0145] In some embodiments, the command may cause only the lifting arm moving system to move the first lifting arm, while the first carrier remains stationary. In some embodiments, the command may cause both the lifting arm moving system and the carrier translation system to move the first lifting arm, as described in Figures 6A-6E above, for example, rotation of one or more lifting arm links combined with simultaneous translation of the carrier, such that the removable component travels along a generally linear axis perpendicular to the translation axis of the carrier. In other cases, the command may cause only the carrier translation system to move the first lifting arm, while the lifting arm moving system does not move the first lifting arm. In an illustrative example, referring to Figure 12, the lifting feature engagement interface 152 engages with the lifting feature of the removable cover 1218, and the carrier translation system 1288 may translate the first carrier 122 along the second axis 124 and thus the removable cover 1218 along the second axis 124. During movement, the lifting arm moving mechanism 1290 and the first vertical translation system 162 may not move the first lifting arm 130.

[0146] The command can also disengage the engagement between the lifting feature of the removable component and the lifting feature interface of the first lifting arm, for example, after the removable component has been returned to its original position and reinstalled. In Figures 4A and 4B, this may include lowering the first lifting arm 130 so that the second mechanical interface features 151A and 151B are removed from the holes 144A and 144B.

[0147] In some embodiments, the machine may further include a first rack position sensor configured to generate data regarding the position of the first rack along the first linear guide system. Referring back to FIG13, the first rack position sensor 1298 is positioned on the first rack 122 and is communicatively connected to the controller 1292 via wired or wireless means, so that the controller 1292 can receive the data generated by the first rack position sensor 1298. The controller 1292 can also interpret and determine the position of the first rack along the first linear guide system 120 from the data, including information about which of the semiconductor processing chambers 104 is closest to the first rack 122 and which is closest to or adjacent to the first rack 122. For example, in FIG13, the first rack position sensor 1298 may generate data indicating that the first rack 122 is closest to and adjacent to semiconductor processing chamber 104A and semiconductor processing chamber 104B. The rack position allows determination of which semiconductor processing chamber the lifting arm can enter. For example, in Figure 6A, the carrier position sensor 1298 can indicate that when the first carrier 122 is located close to the two semiconductor processing chambers 104A and 104B, the first lifting arm can be a removable component capable of accessing the two processing chambers.

[0148] In some embodiments, the machine may also include a first arm position sensor for generating data about the position of the first lifting arm relative to the semiconductor processing chamber. In FIG13, the first arm position sensor 12100 is positioned on the first lifting arm 130 and is communicatively connected to the controller 1292 via a wired or wireless connector so that the controller 1292 can receive the data generated by the first arm position sensor 12100. The controller 1292 can also interpret and determine the position of the first lifting arm 130 relative to each semiconductor processing chamber 104 from the carrier position data and / or arm position data, including, given the position of the first carrier 122, which lifting feature can be engaged by the first lifting arm 130, which semiconductor processing chamber 104 is closest to or adjacent to the first lifting arm 130, the position of the pivot section (i.e., shoulder) of the first lifting arm 130 relative to each semiconductor processing chamber 104, the position of the first lifting arm 130 relative to the lifting feature of each removable component on each semiconductor processing chamber 104, and the position of the first lifting arm 130 along the vertical axis (e.g., determining the vertical position of the engagement interface between the first lifting arm and the lifting feature relative to the lifting feature of the removable component). This data may also include distances from the various features of the machine to the state of the first lifting arm 130 (e.g., this can be achieved using a proximity sensor). In some embodiments, the machine may also include an arm position sensor for generating data regarding the position of the lifting arm rotating about the vertical axis. The controller can, for example, determine from this data whether the arm is properly positioned to avoid known obstacles or engaging lifting features during vertical translation. The controller may also include instructions to prevent the vertical translation system from translating the arm vertically above or below a certain height, or from not translating at all.

[0149] For example, the first arm position sensor 12100 can generate data indicating the position of the first lifting arm, including the horizontal and vertical position of its lifting feature engagement interface relative to the lifting feature of the semiconductor processing chamber; this position data can be used to determine which lifting feature can be engaged by the first lifting arm 130. In FIG. 6A, for example, the first arm position sensor 12100 can generate data that allows the controller to determine whether the lifting feature engagement interface can engage with the lifting feature of the semiconductor processing chamber 104A. As described above, the controller can determine the position of the first arm 130 along the vertical axis and further determine this position relative to the lifting feature of the removable assembly. In some embodiments, the machine may have two or more arm position sensors, all of which generate data regarding the position of the first lifting arm relative to the processing chamber.

[0150] In some embodiments, the machine may further include an engagement sensor configured to generate data regarding whether the engagement interface of the lifting feature engages with any lifting feature of the semiconductor processing chamber. In FIG. 13, the engagement sensor 12102 is positioned on the first lifting arm 130 and is communicatively connected to the controller 1292 via a wired or wireless connector, allowing the controller 1292 to receive the data generated by the engagement sensor 12102. The controller 1292 can also interpret and determine from this data whether the engagement interface of the lifting feature engages with any lifting feature. For example, the engagement sensor 12102 may be a conductive surface configured to be electrically connected to another conductive surface on the lifting feature, so that electrical continuity is created between these conductive surfaces when the engagement interface of the lifting feature engages with the lifting feature. Referring back to Figures 4A and 4B, for example, a first conductive surface may be positioned on the top surface of the first structure 138. When the lifting feature engagement interface 152 engages with lifting features 142A and 142B, the top surface of the first structure 138 may contact a second conductive surface located below saddle plates 150A or 150B. The controller 1292 can detect the presence of an electrical community between these two surfaces and determine the engagement between the lifting feature engagement interface and the lifting feature. The engagement sensor may be other types of sensors, such as proximity sensors, contact switches, vision sensors, etc. In some embodiments, when the lifting feature engagement interface is not engaged with any lifting feature, the controller 1292 may include instructions to prevent the vertical translation system from vertically translating the first arm or from translating it above a certain level (thus allowing sufficient vertical translation for the lifting feature engagement interface to engage with the lifting feature).

[0151] In some embodiments, the machine may further include an alignment sensor configured to generate data regarding whether the lifting feature engagement interface is aligned with the lifting feature of any semiconductor processing chamber. In certain cases, this data may be used to determine whether vertical movement of the first lifting arm 130 will cause engagement between the lifting feature and the lifting feature engagement interface. The alignment sensor may be positioned on the first lifting arm 130, on a removable component, or both, and is communicatively connected to the controller 1292 via a wired or wireless connector, allowing the controller 1292 to receive the data generated by the alignment sensor. The controller 1292 can therefore interpret and determine from this data whether the lifting feature engagement interface is properly aligned with the lifting feature of any removable component, such that vertical movement of the first lifting arm will engage these components. For example, referring back to Figures 4A and 4B, the alignment sensor can generate data that allows the controller 1292 to determine whether holes 144A and 144B are located below and aligned with the second mechanical interface features 151A and 151B, so that the upward movement of the first lifting arm 130 will insert the second mechanical interface features 151A and 151B into holes 144A and 144B. Such an alignment sensor can be, for example, a visual, magnetic, or proximity sensor.

[0152] The controller can use data from any of the aforementioned sensors to perform the movement of the first carrier and the removable component. For example, referring to FIG13, the controller 1292 can first determine the positioning and engagement of the first carrier 122; as shown in FIG13, these determinations are: the position of the first carrier 122 is closest to the semiconductor processing chamber 104B, the position of the first lifting arm 130 is closest to the semiconductor processing chamber 104C, and the engagement interface of the lifting feature is not engaged with any lifting feature. If it is desired to move the removable component of the semiconductor processing chamber 104A, the controller 1292 can use these determinations and data to move the first carrier 122 and / or the first lifting arm 130 so that the first lifting arm 130 can engage with the lifting feature of the semiconductor processing chamber 104A. This movement may include instructing the carrier translation system 1288 to move the first carrier 122 closer to the semiconductor processing chamber 104A and rotating the first lifting arm 130 (e.g., rotating it clockwise by about 180 degrees) to be closer to the semiconductor processing chamber 104A than shown in FIG13.

[0153] In some embodiments, the machine may have numerous safety features. For example, the controller may be configured to receive information about the operational status of each semiconductor processing chamber. This operational status may include whether the semiconductor processing chamber is actively processing a substrate and whether the semiconductor processing chamber is in a personnel-safe condition for entry, such as when the chamber is not powered, the pressure is at ambient pressure, or volatile chemicals have been removed from the chamber. If the controller receives information or determines that one of the semiconductor processing chambers is in a personnel-safe condition, the controller may allow the gantry translation system, the lifting arm movement system, and / or the vertical translation system to operate and move the removable component of that semiconductor processing chamber. Similarly, if the controller receives information or determines that one of the semiconductor processing chambers is not in a personnel-safe condition, the controller may prevent the gantry translation system, the lifting arm movement system, and / or the vertical translation system from operating in a manner that would cause the removable component of that semiconductor processing chamber to move (although it may allow the movable components of other chambers on the machine that are in a safe condition to move for this activity).

[0154] In some embodiments, each semiconductor processing chamber may have an electrical interface, such as a power outlet, configured to connect to a cable on the first carrier; this electrical interface may be located on its removable portion. This cable may be electrically connected to a power source on the first carrier or another power source on the machine (e.g., the system distribution box of the SPDB). Power can be transmitted from the SPDB along a linear guide system to the first carrier and then terminated at the lifting mechanism, or via a cable along the first lifting arm. This cable may terminate at a connector configured to connect to the electrical interface of any removable component and, when powered and the connector connected, can be used to supply power to those components. Providing power to the removable components allows for maintenance tasks to be performed on the removed removable components (e.g., driving a motor located on the removable cover during calibration) and keeps the equipment on the removable cover powered and warm (e.g., a pressure gauge), thereby accelerating maintenance recovery time.

[0155] In some embodiments, the electrical interface can be used as part of a safety interlock. For example, the controller may include instructions for determining electrical continuity between the cable and the electrical interface. If electrical continuity is determined to exist, the controller may allow vertical translation or other movement mechanisms on the first carrier to operate. Furthermore, the controller may be able to determine whether the chamber is in the atmosphere, and if so, allow movement of removable components (such as a top plate). In some embodiments, an atmosphere signal is generated by the chamber and relayed through the electrical interface and cable, and this signal can be detected by the controller. The atmosphere signal can indicate whether the chamber is in or not in the atmosphere.

[0156] In some embodiments, the cable may be laid along the first lifting arm, and its length is such that the connector and the lifting feature engagement interface of the first lifting arm can only simultaneously engage with the electrical interface of a single processing chamber in the semiconductor processing chamber and the lifting feature, respectively. For example, referring back to FIG5, the first carrier 122 includes a cable 1104 laid along the first lifting arm 130, and its length is such that the connector 1106 can engage with the electrical interface 1108 of the removable cover 118. The length of the cable 1104 simultaneously allows the connector 1106 to engage with the electrical interface 1108 of the semiconductor processing chamber and allows the lifting feature engagement interface to engage with the lifting feature of the removable cover 118, as shown in FIG4A and 4B, but prevents the connector 1106 from connecting to a similar electrical interface of any other removable cover during engagement of the first lifting arm with the lifting feature of the depicted removable cover 118. For example, referring to FIG12, when the lifting feature interface is engaged with the lifting feature of the removable cover 118 of the semiconductor processing chamber 104A, the length of the cable 1104 is such that the connector 1106 is simultaneously connected to the electrical interface 1108 of the removable cover 118 of the semiconductor processing chamber 104B.

[0157] In some other embodiments, the electrical interface can provide power to components on the carrier. The electrical interface can be positioned at a fixed location in each semiconductor processing chamber or can be positioned on a removable component. Cables can be connected to one or more motors on the first carrier, such as motors of a vertical translation system and motors of a lifting arm movement system (if present), and terminated at a connector configured to connect to the electrical interface of any removable component, and if energized and connected, the connector is also used to supply power to those components.

[0158] In some embodiments, the controller may further include instructions for supplying power to the electrical interfaces of the semiconductor processing chamber based on data from one or more of the aforementioned sensors. For example, in some embodiments, the controller may, based on a determination of the position of the first carrier, supply power to the electrical interfaces of only one of the first plurality of semiconductor processing chambers at a time, and only when it is determined that the operating state of that semiconductor processing chamber is in a state where it is safe to remove the top cover. If a single plurality of semiconductor processing chambers includes multiple carriers / lifting arms, this functionality can be extended to allow power to be supplied to the electrical interfaces of a particular semiconductor processing chamber only when one of the carriers / lifting arms is determined to be in a position suitable for removing the removable component from the semiconductor processing chamber, and only when the semiconductor processing chamber is determined to be in an operating safe state. Referring to Figure 13, for example, the controller 1292 receives data about the position of the first carrier 122 from the first carrier position sensor 1298, determines the position of the first carrier based on this data, and then supplies power only to the electrical interface of the semiconductor processing chamber 104B (after determining that the processing chamber is in a "safe" state), because the lifting feature of the first arm 130 can only reach the removable components of the semiconductor processing chamber 104A. As described above, this "safe" state can be when a person can safely access the chamber, for example, when the chamber is not powered, the chamber pressure is at ambient pressure, the temperature is low enough for personnel to handle the removable components, any volatile or harmful chemicals have been removed from the chamber, and the removable components have been unlatched or unscrewed from the chamber.

[0159] Similarly, based on the determination of the positions of the first lifting arm 130 and the first carrier 122, the controller 1292 may include instructions to control the processor 1296 to power the electrical interface 1108 of a first plurality of semiconductor processing chambers having only lifting features that can engage with the lifting feature engagement interface 152 of the first lifting arm 130. Again, for example in FIG13, these determinations may indicate that the lifting feature of the removable component of semiconductor processing chamber 104A can engage with the lifting feature engagement interface of the first lifting arm 130, and the controller 1292 may therefore power the electrical interface 1108 of semiconductor processing chamber 104C.

[0160] Additionally or alternatively, the controller may respond to a determination that the lifting feature engagement interface is engaged with the lifting feature of one of the removable top covers of the first plurality of semiconductor processing chambers, and, as described above, supply power only to the electrical interface of the semiconductor processing chamber containing the removable top cover. In FIG13, for example, based on data generated by engagement sensor 12104, first arm position sensor 12100, and carrier position sensor 1298, it can be determined that the lifting feature engagement interface of the first lifting arm 130 is engaged with the lifting feature of the removable assembly of the semiconductor processing chamber 104C, and based on this determination, the controller 1292 may supply power only to the electrical interface of the semiconductor processing chamber 104C.

[0161] In some embodiments, the engagement sensor can be considered as a first interlock sensor, configured to generate data regarding whether the lifting feature engages with the lifting feature engagement interface. Instructions can cause the controller to control the processor to determine, based on the data generated by the first interlock sensor, whether the lifting feature engagement interface engages with the lifting feature of one of the removable components of the first plurality of semiconductor processing chambers. In response to both receiving a first input signal to cause the vertical translation system to operate and determining that the lifting feature engagement interface engages with the lifting feature of one of the removable top covers, the instructions can also cause the vertical translation system to vertically translate the first lifting arm. In response to both receiving a first input signal to cause the vertical translation system to operate and determining that the lifting feature engagement interface does not engage with the lifting feature of one of the removable top covers, the instructions can further prevent the vertical translation system from vertically translating the first lifting arm.

[0162] In some embodiments, another safety feature may be included that restricts the movement of the first lifting arm to a sector of less than 360 degrees, such as a sector of substantially 180 or 270 degrees (substantially within + / - 10 degrees). This restriction may be provided by using one or more physical hardstops (e.g., one or more pins) to prevent the first lifting arm from rotating out of the sector, or it may be provided by instructions within the controller (if present) to prevent the motor from rotating the first arm out of the sector. In some cases, the first lifting arm, restricted to movement only on a first side of the vertical plane passing through the first carrier, is parallel to the vertical axis and perpendicular to the second axis. Referring, for example, to FIG6B, it is shown that the vertical plane 1110 is substantially perpendicular to the second axis 124 (e.g., orthogonal within + / - 5 degrees), substantially parallel to the vertical axis 134 (e.g., parallel within + / - 5 degrees), and passes through the first carrier 122. Here, the first lifting arm 130 can only rotate to a position to the left of the vertical plane 1110. As described above, the instructions can control one or more processors to make the first lifting arm 130 move only on a first side or left side of the vertical plane 1110. Alternatively, such rotational limiting features can be operated to restrict the movement of the lifting arm to a position limited to the right side.

[0163] To avoid any potential confusion, it should be noted that the carriers and lifting arms discussed herein are not equivalent to robotic arms or end effectors intended or used to transfer substrates. Furthermore, the removable components of the semiconductor processing chamber described herein should not be considered substrates, and the lifting arms described herein are not configured or intended to support substrates.

[0164] In some embodiments, instead of a carrier and lifting arm system intended to be permanently mounted to a semiconductor processing machine and entirely supported by a linear guide system to which it is attached, a lifting system detachable from the semiconductor processing machine can be used. In this alternative system, the lifting arm can be attached to a removable vertical member equipped with a vertical translation system (it should be understood that in this embodiment, the reference to "vertical" refers to the orientation of the components when the lifting system is mounted on the semiconductor processing machine; obviously, if such a lifting system is removed from the semiconductor processing machine, rotated 90° and placed flat on the floor, the previously described "vertical" component is technically horizontal, and vice versa; for the purposes of this disclosure, such components may still potentially be described as "vertical"). The removable vertical member may include one or more mechanical interfaces that allow the removable vertical member to be connected to corresponding attachment points located at various locations on the semiconductor processing machine, such as the upper support frame of the machine or other lower parts of a similar lower frame. The bottom of the vertical member may be equipped with rollers or wheels to allow it to rotate and be positioned within the semiconductor processing equipment, positioning it in a position that allows it to connect with different semiconductor processing stations. The vertical member itself may have one or more arm links, which are supported by a vertical translation system mounted on the vertical member. Once the vertical member is attached to the upper support frame of the semiconductor processing station, the vertical translation system can be used to vertically drive one or more arm links up and down.

[0165] This type of lifting system is designed to be unreliable as a stand-alone system and / or unable to support removable components without some form of support attached to the machine (e.g., via attachment points on an upper support frame). Therefore, for example, in some embodiments, the lifting system may lack support feet extending generally below the lifting arm (as previously discussed in this disclosure), which would act to prevent the lifting system from tipping over due to its weight (and what it is lifting). In another example, the lifting system may have a lightweight support system that supports only the weight of the lifting system itself and not the weight of the removable components. Existing stand-alone lifting systems include feet or equivalent structures that extend generally below the lifting arm. In contrast, without some form of external support, the removable lifting system discussed herein cannot support the weight of the lifting arm and / or the removable components.

[0166] When such a lifting system is attached to a semiconductor processing machine via one or more attachment points, the attachment points primarily bear lateral loads, while axial (vertical) loads are instead transmitted along the length of the removable vertical member and pass through its bottom to the facility floor (e.g., in some cases, through wheels located at the base of the removable vertical member). Therefore, any torque resulting from a vertical load applied away from the centerline of the removable vertical member may be offset by the resistance exerted by the attachment points. In some cases, the attachment points may bear both lateral and some or all of the vertical loads. Here, the machine may include upper and lower attachment points to support the lateral and some or all of the vertical loads of the lifting system. The aforementioned torques can be offset through these multiple attachment points at the ends of the vertical member of the lifting system. Vertical loads can also be transmitted to the vertical member, upper attachment points and upper support frame, and lower attachment points, and ultimately guided to the ground, unlike the loads passing through the wheels of the lifting system. This allows for lighter vertical components and their moving mechanisms, and fewer load-bearing structures.

[0167] Because these lifting systems do not require self-support, they can have a much smaller footprint and lighter weight than stand-alone lifting systems. This makes them easier for people to operate and allows for use in more confined spaces.

[0168] Therefore, this disclosure includes additional alternative embodiments of another semiconductor processing machine example, which do not have the linear guide system and carrier described above, but instead have a detachable lifting system. In these alternative lifting system embodiments, the machine still includes an upper support frame, a plurality of semiconductor processing chambers arranged along a first axis, and a base fixedly attached to the upper support frame. In some such embodiments, the semiconductor chambers may be arranged along a non-linear axis, for example, in a circular arrangement.

[0169] In some of these alternative embodiments, the detachable lifting system is supported by the fab floor, connects to a support frame at an elevated attachment point, and has a lifting arm. The detachable lifting system is portable, allowing it to be moved within the service area on the fab floor to a position next to the machine, and then secured to the upper support frame at an attachment point. Once positioned and connected to the upper support frame, the lifting arm and vertical translation system can be used to raise, lower, and move one or more removable components of the semiconductor processing machine. As discussed in more detail below, the lifting arm and vertical translation system can be the same as or similar to the lifting arm and vertical translation system described above.

[0170] Figure 14 depicts another example of a semiconductor processing machine; this figure is similar to Figure 2, but with obvious differences. In these embodiments, as described above, another example of a machine 1400 includes an upper support frame 1414, a first plurality of semiconductor processing chambers 1402 arranged along a first axis 1406, a base 1416 fixedly connected to the upper support frame 1414, and a removable assembly (e.g., a removable top cover 1418) having a lifting feature (e.g., the second structure 1442 described above).

[0171] Compared to machine 100, another machine 1400 includes an attachment system that may include one or more attachment points 14112 fixedly supported by an upper support frame 1414. In some embodiments, two or more attachment points 14112 are connected to fixed positions of the upper support frame 1414 relative to the upper support frame 1414 and along a second axis 1424. In some other embodiments, the attachment system may include one or more guide rails to which the attachment points are movably connected. For example, the guide rail 14114, shown in shaded emphasis in FIG. 14, extends along the second axis 1424, similar to the first linear guide system described above, and one or more attachment points 14112 are movably connected to the guide rail 14114 so that one or more attachment points 14112 can translate along the second axis 1424 as indicated by arrow 1428. In some such embodiments, the attachment points can be locked or released, so that when locked, the attachment points can be fixed relative to the guide rail, or when released, they can slide along the rail. This allows for readjustment of the attachment point position to accommodate new machine configurations or modifications to maintenance procedures. As discussed below, one or more attachment points 14112 of the attachment system are positions (i.e., raised connection points) that can be attached to and connected to the upper support frame 1414 as a detachable lifting system.

[0172] Figures 15A and 15B depict side views of another example of the semiconductor processing rack of Figure 14 and an example of a first detachable lifting system. In Figure 15A, a base 1416 can be seen attached to an upper support frame 1414 and has a removable assembly 1418. An attachment point 14112 can also be seen connected to the upper support frame 1414; this can be a movable or fixed attachment point as discussed above. The first detachable lifting system example 14116 also includes a vertical member 14118 having a top end 14120 to which a complementary attachment point 14122 is attached, and a bottom end 14124 to which a moving mechanism 14126 (e.g., wheels or tracks) is attached. The moving mechanism 14126 can be positioned on and supported by a Fab floor 14128, allowing the first detachable lifting system example 14116 to move in various directions around the Fab floor. Complementary attachment point 14122 is configured to connect to or attach to attachment point 14112 of the attachment system, as shown in FIG15B; when they are connected as indicated by symbol 14127, the first detachable lifting system example 14116 is attached to the upper support frame 1414. This attachment provides lateral support for the first detachable lifting system example 14116, allowing it to have a relatively small footprint for installation within the service area 1415 and close to the machine base 1400, and enabling the first detachable lifting system example 14116 to lift, lower, and support the heavy detachable components of the machine base 1400. Without the lifting attachment between the upper support frame 1414 and the detachable lifting system 14116, the first detachable lifting system example 14116 cannot lift, move, or support the removable component. Instead, it will tip over in the absence of a support feature extending along the fab floor (similar to a foot extending from a conventional lifting mechanism), which may be larger than the permissible area between the machines.

[0173] The first detachable lifting system example 14116 further includes a lifting arm 14130, which may be the same as or similar to the first lifting arm described above. For example, the lifting arm 14130 may include the lifting feature engagement interface described above and may be configured to pivot about a vertical axis 1434, which is perpendicular to the second axis 1424 and the first axis 1406 and extends through the vertical member 14118. In some embodiments, the first detachable lifting system example 14116 may also include a vertical translation system 14132, which is configured to translate the lifting arm 14130 along the vertical axis 1434 in the direction of arrow 1464, as described above. As described above, the vertical load of the detachable component is borne by the lifting arm 14130 and the vertical member 14118 and transferred to the Fab floor by the first detachable lifting system example 14116 connected to the Fab floor.

[0174] This vertical translation system 14132 can be motor-powered or manually driven, for example via a manual crank or cable and winch, as illustrated in FIG15B. In some embodiments, once the complementary attachment point 14122 of the first detachable lifting system example 14116 is connected at attachment point 14112 to the upper support frame 1414, the lifting arm 14130 becomes movable, such that the lifting feature engagement interface can be moved to engage with the lifting feature of one of the removable components of the first plurality 1402 semiconductor processing chambers 1404. The mobility of the lifting arm 14130 can be the same as described above, for example including those shown in FIG6A-6E, such that it can move horizontally or in a plane perpendicular to the vertical axis 1434.

[0175] In some embodiments, the first detachable lifting system example 14116 is configured to translate along the second axis 1424. In some such embodiments, the attachment system may have a guide rail 14114 and a movable attachment point 14112 connected to the guide rail 14114 and movable along the second axis 1424, as described above, such that when the complementary attachment point 14122 of the first detachable lifting system example 14116 is attached to the upper support frame 1414 at attachment point 14112, the first detachable lifting system example 14116 and attachment point 14112 simultaneously move together along the second axis 1424, as shown by arrow 1428 in FIG14. In FIGS. 15A and 15B, this movement can be viewed as entering and leaving a page. This movement enables the first detachable lifting system example 14116 to connect with any removable component of the first plurality of semiconductor processing chambers 1402, allowing the removable component to be lifted, moved, and lowered. In this embodiment, the moving mechanism 14126 contacts the Fab floor 14128 and moves the vertical member 14118 along the second axis 1424 together with the remainder of the first detachable lifting system example 14116.

[0176] In some embodiments, a second detachable lifting system example may be provided, which is similar in construction to the first detachable lifting system example but differs in some aspects. The second detachable lifting system example includes a vertical member, a lifting arm, at least one attachment point for connection to a machine tool, wheels or rollers for allowing movement around the semiconductor processing equipment, and additional features and configurations described herein. In some cases, the second detachable lifting system example may not be able to stand independently or support the load of the detachable components without connection to a machine tool. Figure 16 depicts a perspective view of a second detachable lifting system example 16116, which includes a vertical member 16118 having a top end 16120 for providing a raised attachment point 16121 (also referred to herein as a complementary attachment point) and a bottom end 16124 for providing a moving mechanism 16126 (e.g., wheels or tracks), and also includes a lifting arm 16130 and a vertical translation system 16132.

[0177] In some embodiments, the lifting arm 16130 may be the same as or similar to the first lifting arm and lifting arm 14130 described above. In some embodiments, the lifting arm 16130 may include two or more links, as shown in FIG16. Here, the lifting arm 16130 has three links, wherein the first link 16131 and the second link 16133 are parallel to each other and form a double shoulder joint 16135 and a double elbow joint 16137 with the third link 16139. The lifting arm 16130 is configured to pivot about a vertical axis 1634 at the double shoulder joint 16135, the vertical axis 1634 being substantially parallel to the longitudinal axis of the vertical member 16118 (substantially meaning within, for example, about 5% or 1%). The longitudinal axis system depicted in FIG21 extends along the length of the vertical member 16118 and intersects the top end 16120 and the bottom end 16124. The lifting arm 16130 is also used to rotate about another axis 16141 parallel to the vertical axis 1634 at the elbow joint 16137. The distal end of the third link 16139 of the lifting arm 16130 may have any of the lifting feature engagement interfaces described above, such that it can engage with the lifting feature of any of the removable components described herein. Depending on the configuration of the lifting arm, it may be of the movable type described above, such as those shown in Figures 6A-6E, such that it can move horizontally or in a plane perpendicular to the vertical axis 1634. This movement is also shown in Figures 20A and 20B.

[0178] This vertical translation system 16132 can be motor-powered or manually driven, for example via motor 16166 and drive screw 16167, as illustrated in Figure 16. The vertical translation system 16132 is used to translate the lifting arm 16130 along the vertical axis 1634. As described above, this allows the lifting arm 16130 to lift and lower removable components of the machine tool.

[0179] The second detachable lifting system example can be attached to the machine in various ways. For example, similar to the first detachable lifting system example, the second detachable lifting system example can be attached to the machine at a single lifting attachment point, while the bottom of the second detachable lifting system example is located on and supported by the floor of the manufacturing facility. In some embodiments, the second detachable lifting system example can be attached to the machine at two different attachment points (e.g., an upper attachment point and a lower attachment point). Figure 17 depicts another example of a semiconductor processing machine. Similar to the other figures above, the machine example 1700 includes an upper support frame 1714, a first plurality of 1702 semiconductor processing chambers 1704 disposed along a first axis 1706, a base 1716 directly or indirectly fixedly attached to the upper support frame 1714, and a removable component (e.g., a removable top cover 1718) having lifting features as described above. The machine tool also includes one or more upper attachment points 17112A-D fixedly attached to the upper support frame 1714 and one or more lower attachment points 17113A-D fixedly attached to the lower components of the machine tool (e.g., the lower frame or plate 17115). As shown in FIG17, in some embodiments, each upper attachment point has a corresponding lower attachment point, and each pair is positioned parallel to each other along an axis perpendicular to the first axis 1706 (e.g., the vertical axis 1634).

[0180] Figures 18A and 18B show side views of the attachment sequence between the machine tool and the second detachable lifting system examples of Figures 16 and 17. In Figure 18A, the second detachable lifting system example 16116 is separated from but aligned with the machine tool 1700, such that the upper attachment point 17112 of the machine tool 1700 can connect to the rising attachment point 16121 of the second detachable lifting system example 16116, and the lower attachment point 17113 of the machine tool can connect to the bottom attachment point 16123 of the second detachable lifting system example 16116, as indicated by the dashed double arrows. The lower attachment point 17113 can be used to support the weight of the second detachable lifting system example 16116, for example, by having a U-shaped container to receive the horizontal bar of the bottom attachment point 16123, as shown in Figure 18A.

[0181] In Figure 18B, the second detachable lifting system example 16116 is attached to the machine base 1700 at upper attachment point 17112 and lower attachment point 17113. This attachment provides lateral and vertical support for the second detachable lifting system example 16116, allowing it to have a relatively small footprint suitable for service areas and proximity to the machine base 1700, enabling the second detachable lifting system example 16116 to lift, lower, and support heavy removable components of the machine base 1700. Without these upper and lower attachments, the second detachable lifting system example 16116 would not be able to lift, move, or support removable components without tipping over. In some embodiments, as shown in Figure 18B, when attached to the machine base 1700, the second detachable lifting system example 16116 may not be in direct contact with or supported by the floor of the manufacturing facility. In some such embodiments, the vertical load supported by the second detachable lifting system example 16116 is transferred to the machine tool 1700 via upper and lower attachment points 17112 and 17113; these loads are not directly transferred to the floor through direct contact between the floor and the second detachable lifting system example 16116. In some other embodiments, the second detachable lifting system example 16116 may directly contact and be supported by the floor of the manufacturing facility, so that the vertical load supported by the second detachable lifting system example 16116 is directly transferred to the floor.

[0182] Once connected to the machine tool, the lifting arm 161301 is movable, allowing its lifting feature engagement interface to be moved to engage with the lifting feature of one of the aforementioned removable components. Figure 19 depicts a perspective view of a second removable lifting system example 16116 connected to the machine tool 1700 of Figures 17-18B. As shown in Figure 19, the lifting arm 16130 has been moved such that its lifting feature engagement interface 1652 can engage with the lifting feature 1942 of the removable component 1718. Once these components are engaged, the lifting arm 16130 can be moved to move the removable component 1718 in a plane horizontal to the vertical axis 1634, which lies on the x and y axes shown in the figure. The vertical translation system 16132 can also raise and lower the removable component along the depicted z-axis or vertical axis 1634, which can be substantially parallel to each other (e.g., within + / - 5% of parallelism).

[0183] Figures 20A and 20B depict the sequence of the second detachable lifting system example 16116 and the movable removable component example. Similar to Figures 6A-6E above, these figures are simplified top views of the machine tool in Figures 17-19, which includes the second detachable lifting system example 16116 attached to the machine tool; they are viewed at an angle parallel to the vertical axis 1634 of Figures 16, 18A, and 19, such that the vertical axis 1634 is perpendicular to the page and extends into the page. Also visible are the first plurality of semiconductor processing chambers 1702 1704, the base 1716 of these processing chambers, the lifting arm 16130, and the lifting feature engagement interface 1752 that engages with the lifting feature 1742 of the removable component 1718. As shown in Figure 20B, the lifting arm 16130 is movable, allowing the removable assembly 1718 to be removed from and away from the processing chamber 1704 in a direction at least perpendicular to the first axis 1706, as indicated by the arrow on the removable assembly 1718. This movement is achieved through the movement of the links and joints of the lifting arm 16130 (including rotation about the vertical axis 1634 and another axis 16141). In some embodiments, the lifting arm 16130 may have only one link, and the removable assembly 1718 may still move in a plane perpendicular to the vertical axis 1634 as described above, including in the example where it remains fixed on the first carrier. As described above and partially depicted in Figure 20B, this movement of the lifting arm also allows the removable assembly engaged with the lifting arm to be moved outside the machine housing 20170.

[0184] In some embodiments, the second detachable lifting system example is configured such that the vertical translation system and the lifting arm move together as a unit along the vertical member. This allows the second detachable lifting system example to be easily moved around the manufacturing facility and stored close together when not in use. It also advantageously allows the vertical translation system to be removed during installation and unloading onto the machine tool, so that the vertical translation system does not obstruct or hinder access to the lifting attachment point. Figure 21 depicts another configuration of the second detachable lifting system example of Figure 16. Here, the second detachable lifting system example 16116 includes a slide rail 16145, which is configured to allow the vertical translation system 16132 and the lifting arm 16130 to move together as a unit along the longitudinal axis 16147 of the vertical member 16118. As shown in Figure 21, the vertical translation system 16132 and the lifting arm 16130 have moved together toward the bottom end of the vertical member 16118. In some embodiments, this movement is unpowered, while in others it may be driven by a motor, a linear actuator, or other mechanisms described herein.

[0185] As described above, by positioning the moving mechanism 16126 on the floor of the manufacturing facility, the second detachable lifting system example 16116 can move on the floor of the manufacturing facility. In some embodiments, the moving mechanism 16126 may include the foldable wheel assembly 16149 shown in FIG. 21. Here, the foldable wheel assembly 16149 is unfolded such that all four wheels of the second detachable lifting system example 16116 are positioned on and supported by the floor, thus allowing movement on the floor. The foldable wheel assembly 16149 is not intended to support the load of the removable components of the machine tool, but is designed to assist in moving the second detachable lifting system example 16116. In FIG. 18A, the foldable wheel assembly 16149 can be seen folded or collapsed to reduce the footprint of the installed second detachable lifting system example 16116.

[0186] As described above, the machine may include additional upper and lower attachment points, allowing the second detachable lifting system example to be positioned at various locations on the machine to access all semiconductor processing chambers. Referring, for example, to FIG20B, machine 1700 may include additional upper and lower attachment points around some or all of the semiconductor processing chambers (e.g., around location 20150). This allows the second detachable lifting system example 16116 to be detachably connected to machine 1700 at each of these locations 20150, enabling access to removable components on all semiconductor processing chambers 1704A–E. In some embodiments, each pair of upper and lower attachment points may be positioned generally between two side-by-side chambers, allowing the second detachable lifting system example 16116 to be positioned in one location to access the removable components of both side-by-side chambers. Referring, for example, to Figure 20A, the upper and lower attachment points of the second detachable lifting system example 16116 allow it to access the removable components of the two semiconductor processing chambers 1704D and 1704E. Therefore, in some such embodiments, the number of upper and lower attachment point pairs can be one less than the number of chambers in the plurality of semiconductor processing chambers. For example, in Figures 20A and 20B, the plurality of semiconductor processing chambers 1702 has five chambers 1704A-E, and four upper and lower attachment point pairs can be positioned approximately between each of these chambers, as shown in Figure 17, which depicts four pairs of upper and lower attachment point pairs 17112A–D and 17113A–D at positions 20150, respectively.

[0187] As described above, the connection between the detachable lifting system and the machine is reconfigurable, allowing the system to be attached to or removed from the machine without destructive means. This can include the use of bolts, pins, screws, clamps, or other features that can be secured together and removed without damaging the machine or system (e.g., damage caused by welding). Therefore, detachable lifting systems can be moved to a location and attached to a machine within a limited timeframe (e.g., the time required for maintenance or repair), and then disassembled and moved to different storage locations within other machines or facilities.

[0188] Detachable lifting systems may also include any of the aforementioned safety features, such as power lines and safety interlocks running along the lifting arm.

[0189] In addition to the claims listed in this disclosure, it should be understood that the following other embodiments are within the scope of this disclosure:

[0190] Embodiment 1: A semiconductor processing machine includes: a support frame; a first plurality of semiconductor processing chambers arranged along a first axis; a first attachment point connected to the support frame; and a first detachable lifting system, wherein each semiconductor processing chamber has a base fixedly mounted relative to the support frame and a removable top cover having one or more lifting features, the first detachable lifting system including a vertical member having a top end and a bottom end, the top end having complementary attachment points and the bottom end having a moving mechanism, the complementary attachment points being detachably connected to the first attachment point, the moving mechanism being supported by a floor, the first detachable lifting system further including a lifting arm connected to the vertical member, and the lifting arm having one or more links, the lifting arm being pivotable about a vertical axis substantially perpendicular to the first axis, and the lifting arm including a lifting feature engagement interface for engaging with a lifting feature of any of the removable components of the first plurality of semiconductor processing chambers.

[0191] Implementation Method 2: According to the semiconductor processing machine of Implementation Method 1, the first detachable lifting system further includes a first vertical translation system configured to make the lifting arm translate vertically relative to the support frame in a direction parallel to the vertical axis.

[0192] Implementation 3: According to the semiconductor processing machine of Implementation 2, the first vertical translation system includes a motor for providing a first mechanical input to the first vertical translation system, wherein the first mechanical input causes the lifting arm to translate along a vertical member.

[0193] Implementation 4: According to the semiconductor processing machine of Implementation 2, the first vertical translation system is configured to move together with the lifting arm as a unit along the vertical member.

[0194] Embodiment 5: A semiconductor processing machine according to Embodiment 1, wherein the moving mechanism includes foldable wheels.

[0195] Embodiment 6: A semiconductor processing machine includes: a support frame having an upper attachment point; and a lower attachment point vertically offset below the upper attachment point; a first plurality of semiconductor processing chambers arranged along a first axis; and a detachable lifting system, wherein each semiconductor processing chamber has a base fixedly mounted relative to the support frame and has a removable assembly including one or more lifting features. The detachable lifting system includes a vertical member having a top end with a lifting attachment point and a bottom end with a bottom attachment point, and a moving mechanism. The attachment point is detachably connected to the upper attachment point, and the bottom attachment point is detachably connected to the lower attachment point. The detachable lifting system further includes: a lifting arm having one or more links, the lifting arm being configured to pivot about a vertical axis substantially perpendicular to the first axis; and a first vertical translation system configured to vertically translate the lifting arm relative to the support frame in a direction parallel to the vertical axis. The lifting arm also includes a lifting feature engagement interface for engaging with the lifting feature of any of the removable components of the first plurality of semiconductor processing chambers.

[0196] Implementation 7: A semiconductor processing machine according to Implementation 6, wherein the first vertical translation system includes a motor for providing a first mechanical input to the first vertical translation system, wherein the first mechanical input causes the lifting arm to translate in a direction parallel to the vertical axis.

[0197] Embodiment 8: The semiconductor processing machine according to Embodiment 7 further includes a power supply, wherein the detachable lifting system further includes an electrical control cable connected to the power supply, laid along the lifting arm, and terminated at a connector, each detachable component further includes an electrical interface provided for connection with the connector, and the length of the electrical control cable is such that the interface between the connector and the lifting feature of the lifting arm can only simultaneously engage with the electrical interface and the lifting feature of a single processing chamber in the semiconductor processing chamber.

[0198] Implementation 9: The semiconductor processing machine according to Implementation 8 further includes a controller, which includes one or more processors and one or more non-transitory memory devices, the one or more non-transitory memory devices storing instructions for controlling one or more processors to receive information about the operating status of each semiconductor processing chamber, and causing a first actuation signal provided by an electrical interface of one of the semiconductor processing chambers to be triggered only when the information about the operating status of that semiconductor processing chamber indicates that the semiconductor processing chamber is in a personnel-safe condition, so as to operate the vertical translation system.

[0199] Embodiment 10: A semiconductor processing machine according to Embodiment 8, wherein the removable component receives power from a power source via a cable.

[0200] Implementation 11: The semiconductor processing machine according to Implementation 7, wherein the vertical translation system is a linear ball screw actuator, a hydraulic actuator, a rack and pinion actuator, and a cable winch.

[0201] Implementation 12: According to the semiconductor processing machine of Implementation 6, the detachable lifting system further includes a first interlock, which is configured to engage with the lifting feature of any of the first plurality of semiconductor processing chambers' detachable components, and to prevent the first vertical translation system from vertically translating the lifting arm when not engaged with the lifting feature of one of the first plurality of semiconductor processing chambers' detachable components.

[0202] Implementation method 13: A semiconductor processing machine according to implementation method 6, wherein the moving mechanism includes four wheels.

[0203] Embodiment 14: A semiconductor processing machine according to Embodiment 6, wherein the moving mechanism includes a foldable wheel set.

[0204] Embodiment 15: A semiconductor processing machine according to Embodiment 6, wherein the first vertical translation system is configured to move together with the lifting arm as a unit along a vertical member.

[0205] Embodiment 16: A semiconductor processing machine according to Embodiment 15, wherein the vertical member further includes a slide rail configured along the portion of the first vertical translation system for movement.

[0206] Implementation 17: The semiconductor processing machine according to Implementation 6, wherein when the moving mechanism is connected to the lower attachment point and the upper attachment point, the moving mechanism may not be supported by the floor.

[0207] Implementation 18: A semiconductor processing machine according to Implementation 6, wherein when the moving mechanism is connected to the lower attachment point and the upper attachment point, the moving mechanism can be supported by the floor.

[0208] Implementation 19: A semiconductor processing machine according to Implementation 6, wherein the lower attachment point is vertically offset below the base of the plurality of processing chambers.

[0209] Implementation 20: According to the semiconductor processing machine of Implementation 6, the support frame may further include a plurality of upper attachment points, the machine may further include a plurality of lower attachment points offset below the plurality of upper attachment points, the plurality of semiconductor processing chambers may include N processing chambers, the plurality of upper attachment points may include N-1 upper attachment points, and the plurality of lower attachment points may include N-1 lower attachment points.

[0210] Implementation 21: The semiconductor processing machine according to Implementation 6, wherein the lifting arm further includes three or more links, a double shoulder joint and a double elbow joint.

[0211] Implementation method 22: The semiconductor processing machine according to implementation method 6, wherein the removable component is not a substrate.

[0212] Implementation method 23: The semiconductor processing machine according to implementation method 6, wherein the lifting arm is not configured to support the substrate.

[0213] Embodiment 24: The semiconductor processing machine according to Embodiment 23, wherein the lifting feature interface is not configured to support the substrate.

[0214] Compared to traditional lifting mechanisms, the machine features described herein offer numerous advantages for lifting and moving removable components. These features allow clustered machines to be placed closer together because no additional fab floor space is required to accommodate individual lifting mechanisms. The machine footprint is not increased, or only slightly increased, due to the inclusion of these features. Removable components can be accessed more easily and moved more quickly, thus reducing machine downtime required for maintenance and repair. The ability to control the movement of the carrier and lifting arm using moving mechanisms and controllers also enables more efficient, faster, and safer control and movement of removable components.

[0215] Unless the context of this disclosure clearly requires it, throughout the description of the invention and the scope of the claims, the words "comprising" and "including" should be interpreted as including, rather than exclusive or exhaustive; that is, they should be interpreted as "including, but not limited to." The use of singular or plural terms generally also includes the plural or singular, respectively. Furthermore, terms such as "here," "below," "above," "under," and similar expressions refer to the entire application and not any particular part thereof. When the word "or" is used in a list of two or more items, it applies to all of the following interpretations: any one of the items in the list, all of the items in the list, and any combination of the items in the list. The term "implementation" refers to the implementation of the techniques and methods described herein, and the physical object embodying and / or embodying the structures and / or methods described herein. Unless otherwise specified, the term "substantially" in this document means within 5% of the reference value. For example, "vertical" essentially refers to a vertical range of + / - 5%.

[0216] 100: Semiconductor processing machine 102: The first complex semiconductor processing chamber 104: Semiconductor Processing Room 104A, 104B, 104C, 104D, 104E: Processing Rooms 106: First Axis 108: The second complex semiconductor processing chamber 110: Processing Room 112: Axis 114: Upper support frame 116: Base 118: Removable top cover 120: First Linear Guidance System 122: First carrier 122A, 122B: First carrier 124: Second Axis 126A, 126B: Tracks 128: Arrow 130: First lifting arm 132: First Link 133: Pivot Section 134: Vertical axis 136: Arrow 138: First Structure 140:End 142A, 142B: Second Structure 144A, 144B: Hole 146: First distance 148A, 148B: Vertical lifting mast 150A, 150B: Saddle Plate 151A, 151B: Second mechanical interface feature section 152: Lifting Feature Part Joint Interface 154: Axis 156: Axis 158: Connector 160: Axis 162: Vertical Translation System 164: Arrow 166: Motor 168: Horizontal direction 169: Arrow 170: Outer shell 184: Internal Area 189: Linear Ball Screw 191: Motor 732: Linear Section 733: Pivot Section 740:End 752: Lifting Feature Interface 772: Inclined Section 774: Oblique Angle 800: Machine 802: The first complex semiconductor processing chamber 806: First Axis 814: Upper support frame 816: Base 818: Removable top cover 824: Second Axis 828: Arrow 830: First lifting arm 832: Linkage 834: Vertical axis 862: First Vertical Translation System 864: Arrow 866: Motor 874: Component 876: Second Linear Guidance System 878A: First Track 878B: Second Track 880: Second carrier 882A, 882B: Removable Components 1104: Cable 1106: Connector 1108: Electrical Interface 1110: Vertical plane 1118: Removable top cover 1120: Second Linear Guidance System 1122: Second carrier 1185: Fourth Axis 1200: Semiconductor Processing Unit 1288: Carrier Translation System 1290: Lifting Boom Moving System 1292: Controller 1294: Non-transitory memory device 1296: Processor 1298: First carrier position sensor 1400: Semiconductor Processing Unit 1402: The first complex semiconductor processing chamber 1404: Semiconductor Processing Room 1406: First Axis 1414: Upper support frame 1415: Service Area 1416: Base 1418: Removable top cover 1424: Second Axis 1428: Arrow 1434: Vertical axis 1442: Second Structure 1464: Arrow 1634: Vertical axis 1652: Lifting Feature Part Joint Interface 1700: Semiconductor Processing Unit 1702: The First Complex Semiconductor Processing Chamber 1704A, 1704B, 1704C, 1704D, 1704E: Semiconductor Processing Chamber 1706: First Axis 1714: Upper support frame 1716: Base 1718: Removable component / Removable top cover 1742: Lifting Feature Section 1752: Lifting Feature Part Joint Interface 1942: Lifting Feature Section 12100: First arm position sensor 12102: Connection sensor 14112: Attachment Point 14114: Guide rail 14116: First example of a detachable lifting system 14118: Vertical component 14120: Top 14122: Attachment Point 14124: Bottom 14126: Mobile mechanism 14127: Identifier 14128: Fab Flooring 14130: Lifting arm 14132: Vertical Translation System 16116: Example of a second detachable lifting system 16118: Vertical component 16120: Top 16121: Raise attachment point 16123: Bottom attachment point 16124: Bottom 16126: Mobile mechanism 16130: Lifting arm 16131: First Link 16132: Vertical Translation System 16133: Second Link 16135: Double shoulder joint 16137: Double elbow joint 16139: Third Link 16141: Axis 16145: Slide rail 16147: Vertical axis 16149: Foldable Wheelset 16166: Motor 16167: Transmission screw 17112: Upper attachment point 17112A, 17112B, 17112C, 17112D, 17112E: Upper attachment points 17113:Lower attachment point 17113A, 17113B, 17113C, 17113D, 17113E: Lower attachment point 17115: Lower frame or panel 20150: Location 20170: Outer Shell

Claims

1. A lifting system for a semiconductor processing machine, the lifting system comprising: a linear guide system extending along a first axis; and a carrier movably connected to the linear guide system and having: a lifting arm having an end portion and a pivot section, wherein the pivot section is configured to rotate about a second axis, and the end portion is configured to engage with an assembly of a semiconductor processing machine; and a vertical translation system connected to the pivot section of the lifting arm and configured to move the lifting arm vertically along the second axis.

2. The lifting system for a semiconductor processing machine as claimed in claim 1, wherein the end of the lifting arm includes a lifting feature engagement interface configured to engage with the component of the semiconductor processing machine.

3. The lifting system for a semiconductor processing machine as claimed in claim 2, wherein the lifting feature engagement interface is configured to rotate about a plurality of axes perpendicular to the second axis.

4. The lifting system for a semiconductor processing machine as claimed in claim 2, wherein the lifting feature engagement interface includes a beam having two mechanical interface features spaced apart by a first distance.

5. The lifting system for a semiconductor processing machine as claimed in claim 4, wherein each mechanical interface feature is a hole located on a first side of one of the beams facing the linear guide system.

6. The lifting system for a semiconductor processing machine as claimed in claim 4 further includes an engagement sensor configured to generate data on whether the engagement interface of the lifting feature is engaged with the component.

7. The lifting system for a semiconductor processing machine as claimed in claim 6 further includes a controller comprising one or more processors and one or more non-transitory memory devices storing instructions for controlling the one or more processors, to: determine whether the lifting feature engagement interface is engaged with the component based on the data generated by the engagement sensor; in response to determining that the lifting feature engagement interface is engaged with the component, supply power to the vertical translation system; and in response to determining that the lifting feature engagement interface is not engaged with the component, deprive the vertical translation system of power.

8. The lifting system for a semiconductor processing machine as claimed in claim 6, wherein the engagement sensor is a proximity sensor, a contact switch, or a vision sensor.

9. The lifting system for a semiconductor processing machine as claimed in claim 1, wherein the lifting arm has a first link spanning between the pivot section and the end.

10. The lifting system for a semiconductor processing machine as described in claim 1, wherein: The lifting arm has a first linear section and a tilting section. The first linear section has the end portion, and the tilting section has the pivot section. The tilting section is oriented at an oblique angle relative to the second axis.

11. The lifting system for a semiconductor processing machine as claimed in claim 1 further comprises: a power supply; and a cable configured to electrically connect the power supply to the carrier, wherein: The cable is detachably connected to the power source, and the first vertical translation system includes an electric motor configured to be powered by the power source when the cable is electrically connected to the power source and the carrier.

12. The lifting system for a semiconductor processing machine as claimed in claim 11 further includes a controller comprising one or more processors and one or more non-transitory memory devices storing instructions for controlling the one or more processors, for detecting whether the power supply is electrically connected to the carrier.

13. The lifting system for a semiconductor processing machine as claimed in claim 1, wherein the carrier is configured to move along the linear guide system without mechanical power.

14. The lifting system for a semiconductor processing machine as claimed in claim 1, wherein the carrier has a plurality of wheels or a plurality of bearings that engage with the linear guide system.

15. The lifting system for a semiconductor processing machine as claimed in claim 1, wherein the first axis is parallel to the floor of a manufacturing facility.

16. The lifting system for a semiconductor processing machine as claimed in claim 1, wherein the linear guiding system further includes a first track and a second track, the first track and the second track being parallel to each other and offset from each other in a direction parallel to the second axis.

17. A lifting system for a semiconductor processing machine, the lifting system comprising: a support frame having a plurality of attachment points arranged along a first axis; and a detachable lifting system having: a vertical member having a top end, a bottom end, and a complementary attachment point configured to detachably connect to the attachment points of the support frame; a lifting arm configured to rotate about a second axis and having an end end configured to engage with an assembly of a semiconductor processing machine; a vertical translation system connected to the lifting arm and configured to move the lifting arm vertically; and a moving mechanism connected at the bottom end to the vertical member and configured to be supported by a floor.

18. The lifting system for a semiconductor processing machine as claimed in claim 17, wherein the complementary attachment point of the detachable lifting system is located at the top of the vertical member.

19. The lifting system for a semiconductor processing machine as claimed in claim 17, wherein the plurality of attachment points are vertically positioned above the semiconductor processing chamber.

20. The lifting system for a semiconductor processing machine as described in claim 17, wherein: The plurality of attachment points includes a plurality of upper attachment points and a plurality of lower attachment points, and the vertical member has: a top complementary attachment point configured to be detachably connected to an upper attachment point; and a bottom complementary attachment point configured to be detachably connected to a lower attachment point.

21. The lifting system for a semiconductor processing machine as described in claim 17, wherein: The lifting arm includes a first link and a second link spanning between the first link and the vertical translation system, and the first link and the second link are rotatably connected to each other.

22. The lifting system for a semiconductor processing machine as described in claim 21, wherein: The lifting arm includes a third link that is parallel to and lower than the second link. The second link and the third link form a double shoulder joint at the vertical translation system, and the second link and the third link form a double elbow joint at the first link.

23. The lifting system for a semiconductor processing machine as claimed in claim 17, wherein the end of the lifting arm includes a lifting feature engagement interface configured to engage with the component of the semiconductor processing machine.

24. The lifting system for a semiconductor processing machine as claimed in claim 23, wherein the lifting feature engagement interface is configured to rotate about a plurality of axes perpendicular to the second axis.

25. The lifting system for a semiconductor processing machine as claimed in claim 23, wherein the lifting feature engagement interface includes a beam having two mechanical interface features spaced apart by a first distance.

26. The lifting system for a semiconductor processing machine as claimed in claim 25, wherein each mechanical interface feature is a hole located on the top side of one of the beams.

27. The lifting system for a semiconductor processing machine as claimed in claim 25 further includes an engagement sensor configured to generate data on whether the engagement interface of the lifting feature is engaged with the component.

28. The lifting system for a semiconductor processing machine as claimed in claim 27 further includes a controller comprising one or more processors and one or more non-transitory memory devices storing instructions for controlling the one or more processors, to: determine whether the lifting feature engagement interface is engaged with the component based on the data generated by the engagement sensor; in response to determining that the lifting feature engagement interface is engaged with the component, supply power to the vertical translation system; and in response to determining that the lifting feature engagement interface is not engaged with the component, deprive the vertical translation system of power.

29. The lifting system for a semiconductor processing machine as claimed in claim 27, wherein the engagement sensor is a proximity sensor, a contact switch, or a vision sensor.

30. The lifting system for a semiconductor processing machine as claimed in claim 17 further comprises: a power supply; and a cable configured to electrically connect the power supply to the vertical translation system, wherein: The cable is detachably connected to the power source, and the first vertical translation system includes an electric motor configured to be powered by the power source when the cable is electrically connected to the power source and the vertical translation system.

31. The lifting system for a semiconductor processing machine as claimed in claim 30 further includes a controller comprising one or more processors and one or more non-transitory memory devices storing instructions for controlling the one or more processors, for detecting whether the power supply is electrically connected to the vertical translation system.

Images