Foreign object inspection systems, methods for inspecting foreign objects attached to an object being inspected, non-transitory computer-readable recording media, and semiconductor manufacturing apparatus.

Abstract

The objective of this invention is to provide a technique for determining the location and type of foreign matter attached to an object being inspected. This invention is a foreign matter inspection system for inspecting foreign matter attached to an object being inspected, and solves the aforementioned objective by comprising the following components: a light source unit that irradiates the object being inspected with excitation light; a detection unit that detects the emission of fluorescence caused by the irradiation of the excitation light; a determination unit that determines the location and type of foreign matter attached to the object being inspected based on the emission of fluorescence; and an output unit that outputs the determination result of the determination unit.

Description

Technical Field

[0001] This invention relates to a foreign object inspection system, a foreign object inspection method, a program, and a semiconductor manufacturing apparatus. Prior Technology

[0002] For example, the inspection device for inspecting foreign objects attached to the inside of a container captures a fluorescence image of the fluorescence emitted by the foreign object and detects the foreign object attached to the inside of the container based on the fluorescence image; the fluorescence emitted by the foreign object is generated by irradiating the inside of the container with excitation light (see, for example, Patent Document 1). [Previous Technical Documents] [Patent Literature]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2017-223474 Summary of the Invention

[0004] [The problem the invention aims to solve] This invention provides a technique for determining the location and type of foreign matter attached to an object being inspected. [Technical means to solve the problem]

[0005] One aspect of the present invention is a foreign object inspection system for inspecting foreign objects attached to an inspection object. The system comprises: a light source unit that irradiates the inspection object with excitation light; a detection unit that detects the emission of fluorescence caused by the irradiation of the excitation light; a determination unit that determines the location and type of the foreign object attached to the inspection object based on the emission of fluorescence; and an output unit that outputs the determination result of the determination unit. [Effects of the Invention]

[0006] According to the present invention, the location and type of foreign matter attached to the object being inspected can be determined. Simple Explanation of the Diagram

[0007] Figure 1 is a structural diagram of an example of the foreign object inspection system of this embodiment. Figure 2 shows an example of the placement of the light source and camera. Figure 3 shows the hardware configuration of an example computer. Figures 4(a) and (b) are examples used to illustrate the visualization of foreign objects attached to the area of ​​the inspection object. Figure 5 is a diagram illustrating an example of how information establishes a correspondence between the color of fluorescence, the type of foreign object, and the appropriate cleaning method for that type of foreign object. Figure 6 is a functional block diagram of an example of the foreign object inspection system implemented by the edge computer of this embodiment. Figure 7 is a flowchart of one example of the processing of the foreign object inspection system in this embodiment. Figure 8 is a conceptual diagram of one example of the area to be inspected during foreign object inspection. Figure 9 is a flowchart of one example of foreign object detection and processing. Figure 10 is a conceptual diagram of one example of the analysis screen. Figure 11 is a conceptual diagram of one example of a polluted area display mode. Figures 12(a) to (c) are conceptual diagrams of one example of the cleaning support mode screen. Figure 13 is a structural diagram of an example of the foreign object inspection system of this embodiment. Figure 14 is a functional block diagram of an example of the edge computer implementation of the foreign object inspection system of this embodiment. Implementation

[0008] Hereinafter, the method for implementing the present invention will be described with reference to the drawings. Furthermore, in this embodiment, an example of a foreign matter inspection system for inspecting foreign matter adhering to a semiconductor manufacturing apparatus will be described, but the inspection object is not limited to a semiconductor manufacturing apparatus. This embodiment can be used for various inspection objects for inspecting adhering foreign matter. Moreover, the foreign matter in this embodiment is contamination caused by substances that emit fluorescence when irradiated with excitation light, including organic, grease-based, ceramic, quartz-based, and metal oxide-based substances. Furthermore, the contamination in this embodiment includes particulate stains, spot stains with attached liquid, or film-forming (coated) stains.

[0009] [First Implementation] <System Composition> Figure 1 is a configuration diagram of an example of the foreign object inspection system of this embodiment. The semiconductor manufacturing apparatus 10, display device 12, on-premises server 14, and cloud server 16 in the foreign object inspection system 1 shown in Figure 1 are connected via a communicable network 18 such as a LAN (Local Area Network).

[0010] Semiconductor manufacturing apparatus 10 is an apparatus used to manufacture semiconductors and is one example of an inspection object for checking for attached foreign matter. Besides semiconductor manufacturing apparatus 10, inspection objects for checking for attached foreign matter also include FPD (flat panel display) manufacturing apparatuses. During the semiconductor manufacturing process, foreign matter may attach to the semiconductor manufacturing apparatus 10, which can be a major cause of yield reduction. Therefore, maintenance operations are performed in the semiconductor manufacturing apparatus 10 to prevent yield reduction caused by foreign matter.

[0011] The foreign object inspection system 1 of this embodiment is equipped with a light source 24 and a camera 26 to visualize the attachment of foreign objects during maintenance operations. Furthermore, Figure 1 shows an example where the light source 24 and camera 26 are positioned on a transport arm 22, which is used to transport substrates within the semiconductor manufacturing apparatus 10. For example, the light source 24 and camera 26 can be positioned on the transport arm 22 as shown in Figure 2, or they can be positioned on a robotic arm other than the transport arm 22. Figure 2 is shown from the side opposite to the surface of the transport arm 22 where the substrate is placed, illustrating an example of the position of the light source 24 and camera 26.

[0012] Furthermore, the light source 24 and camera 26 are not limited to being mounted on the conveyor arm 22. The light source 24 and camera 26 can be fixedly or movably mounted inside the semiconductor manufacturing apparatus 10, or fixedly or movably mounted on the outside of the semiconductor manufacturing apparatus 10. Also, the light source 24 and camera 26 can be mounted on head-mounted displays (HMDs) such as AR (Augmented Reality) glasses, or on devices that can be held by maintenance personnel.

[0013] Light source 24 irradiates excitation light onto the area (the area to be inspected) where foreign matter is being inspected. Light source 24 may be, for example, composed of UV (ultraviolet) light. Light source 24 may also be a polariton lamp that uses a filter or a special glass called Wood's glass to cut off wavelengths of visible light above 400 nm. Alternatively, light source 24 may also utilize a light-emitting diode. Furthermore, the area to be inspected may be either the inner or outer side of the semiconductor manufacturing apparatus 10.

[0014] Excitation light is a general term for light that excites matter. Ultraviolet light is one example of excitation light. When a foreign object or similar substance is irradiated with excitation light and absorbs the energy of the excitation light to become excited, it will emit fluorescence when it returns to its ground state.

[0015] Camera 26 captures images of the area to be inspected that is irradiated by excitation light. For example, if a foreign object 30 or other substance is attached to the area to be inspected, camera 26 can capture images of the fluorescence emitted by the foreign object 30 or other substance due to irradiation by excitation light.

[0016] The edge computer 20 determines the location and type of foreign object 30 attached to the inspection area based on the fluorescence emitted by the camera 26. Furthermore, the process of determining the location and type of foreign object 30 attached to the inspection area based on the fluorescence emitted by the camera 26 will be described in detail later. The edge computer 20 stores the determination results of the location and type of foreign object 30 attached to the inspection area in its memory unit. Additionally, the edge computer 20 outputs the determination results of the location and type of foreign object 30 attached to the inspection area to the display device 12 (display control).

[0017] Display device 12 displays the determination results of the location and type of foreign object 30 attached to the inspection area, obtained by edge computer 20. Display device 12 is implemented by display device or head-mounted display device, etc. Head-mounted display device is a display device worn on the head by the operator. Furthermore, by using AR technology, display device 12 can display an image that overlays the determination results of the location and type of foreign object 30 attached to the inspection area as a virtual image onto the real image of the inspection area. The image that overlays the determination results of the location and type of foreign object 30 attached to the inspection area as a virtual image onto the real image of the inspection area can, for example, be used as a maintenance operation screen viewed by the operator during maintenance operations. The maintenance operation screen will be described in detail later.

[0018] Furthermore, some or all of the processing performed by the edge computer 20 can also be performed by the local server 14 or the cloud server 16, which are connected via the edge computer 20 and the network 18 for data communication.

[0019] For example, in the foreign object inspection system 1 of Figure 1, the edge computer 20 can also control the light source 24 and camera 26, control the image displayed on the display device 12, determine the location and type of foreign objects 30 attached to the inspection target area, and provide maintenance operation support. The local server 14 or the cloud server 16 can remember the determination results of the location and type of foreign objects 30 attached to the inspection target area or use this information to analyze the maintenance operation process. Alternatively, at least one of the local server 14 and the cloud server 16 can be omitted.

[0020] Local server 14 is an example of a server computer in a local environment. Cloud server 16 is an example of a server computer in a cloud environment. Furthermore, the foreign object inspection system 1 in Figure 1 is one example; needless to say, there will be various system configurations depending on the application or purpose. The division of semiconductor manufacturing device 10, edge computer 20, local server 14, and cloud server 16 in Figure 1 is an example.

[0021] For example, the foreign object inspection system 1 can be configured to omit the edge computer 20 and implement the functions of the edge computer 20 by the local server 14 or the cloud server 16, or it can be configured to further divide the foreign object inspection system 1 of FIG1, and can be configured in various ways. Furthermore, the local server 14 or the cloud server 16 can also uniformly implement the functions of the edge computers 20 of multiple semiconductor manufacturing devices 10.

[0022] <Hardware Components> The foreign object inspection system 1 shown in Figure 1, including its local server 14, cloud server 16, and edge computer 20, is implemented, for example, by a computer with the hardware configuration shown in Figure 3. Figure 3 is a hardware configuration diagram of an example computer.

[0023] The computer 500 in Figure 3 includes an input device 501, an output device 502, an external I / F (interface) 503, RAM (Random Access Memory) 504, ROM (Read Only Memory) 505, a CPU (Central Processing Unit) 506, a communication I / F 507, and an HDD (Hard Disk Drive) 508, all interconnected via bus B. Furthermore, the input device 501 and the output device 502 can be connected and used as needed.

[0024] Input device 501 includes a keyboard, mouse, touch panel, etc., used by operators to input various operation signals. Output device 502 includes a monitor, etc., displaying the processing results obtained by computer 500. Communication I / F 507 is an interface that connects computer 500 to network 18. HDD 508 is an example of a non-volatile memory device (memory unit) storing programs or data.

[0025] The external I / F 503 is the interface with external devices. The computer 500 can read and / or write to recording media 503a such as SD (Secure Digital) memory cards via the external I / F 503. Furthermore, the computer 500 can control the display of display devices 12 such as head-mounted displays via the external I / F 503. ROM 505 is an example of a non-volatile semiconductor memory (memory device) storing programs or data. RAM 504 is an example of a volatile semiconductor memory (memory device) temporarily storing programs or data.

[0026] The CPU 506 is a computing device that reads programs or data from memory devices such as ROM 505 or HDD 508 into RAM 504 for processing, thereby realizing the overall control or function of the computer 500.

[0027] The local server 14, cloud server 16, and edge computer 20 of the foreign object inspection system 1 shown in Figure 1 can realize various functions through the hardware configuration of the computer 500 in Figure 3.

[0028] Determining the location and type of foreign objects attached to the area being inspected. The determination of the location and type of foreign matter 30 attached to the inspection area can be performed, for example, as described below. Figure 4 is a diagram illustrating an example of the visualization of foreign matter attached to the inspection area. Generally, the phenomenon of foreign matter 30 being visible is the phenomenon of light being reflected by foreign matter 30 and the operator recognizing the reflected light 31.

[0029] As shown in Figure 4(a), when the foreign object 30 becomes smaller, the intensity of the reflected light 31 reflected by the foreign object 30 decreases. Therefore, the difference between the intensity of the reflected light 31 reflected by the foreign object 30 and the intensity of the reflected light 33 from the wall surface 32 decreases, making it difficult for workers to identify the reflected light 31.

[0030] Figure 4(b) illustrates the situation where ultraviolet light, which is invisible light, is used as excitation light to irradiate the foreign object 30. The foreign object 30, irradiated by the ultraviolet light as excitation light, absorbs the ultraviolet light and emits fluorescence, which is visible light, as reflected light 34. Since the reflected light 33 from the wall surface 32 is ultraviolet light, which is invisible light, the reflected light 34 of the foreign object 30, which is visible light, is clearly visible and can be easily identified by workers. Thus, in the foreign object inspection system 1 of this embodiment, the location of the foreign object 30 attached to the inspection target area can be determined by the reflected light 34 of the foreign object 30, which is visible light.

[0031] Furthermore, the emission color (wavelength) of the foreign object 30 irradiated by ultraviolet light as excitation light varies depending on the composition of the foreign object 30 (the type of foreign object 30). Therefore, in this embodiment, for example, based on the information shown in FIG5 that establishes a correspondence between the emission color of the fluorescence, the type of the foreign object 30, and a cleaning method suitable for the type of the foreign object 30, the type of the foreign object 30 and a cleaning method suitable for the type of the foreign object 30 are determined according to the emission color of the fluorescence.

[0032] Figure 5 is a diagram illustrating an example of how information establishes a correspondence between the fluorescence emission color, the type of foreign object, and the appropriate cleaning method for that type of foreign object. Figure 5 shows an example where, if the fluorescence emission color is less than 500 nm, the type of foreign object 30 is "organic," and the appropriate cleaning method for that type of foreign object 30 is "wiping with alcohol (IPA, ethanol, etc.) or removing it using a steam cleaner."

[0033] Furthermore, Figure 5 shows the following example: if the fluorescence emission color is 500 nm or higher but less than 610 nm, then the type of foreign matter 30 is "grease-based," and the suitable cleaning method for this type of foreign matter 30 is "wiping with alcohol (IPA, ethanol, etc.) or removing it using a steam cleaner." Figure 5 also shows the following example: if the fluorescence emission color is 610 nm or higher, then the type of foreign matter 30 is "ceramic-based, quartz-based, or metal oxide-based," and the suitable cleaning method for this type of foreign matter 30 is "wiping with alcohol (IPA, ethanol, etc.) or removing it using a steam cleaner, vacuum cleaner, or dry ice cleaning." The cleaning methods shown in Figure 5 are known technologies; for example, the cleaning method described in Japanese Patent Application Publication No. 2010-129966 can be used. Japanese Patent Application Publication No. 2010-129966 describes a method for cleaning a semiconductor manufacturing apparatus, including wiping and dry wiping with non-woven fabric using ethanol or similar solvents, and a steam cleaning apparatus (steam cleaner) for semiconductor manufacturing apparatuses. A vacuum cleaner is a cleaning apparatus for semiconductor manufacturing apparatuses that attracts foreign matter 30. Dry ice cleaning is a cleaning method that cleans by blowing dry ice particles onto the foreign matter 30.

[0034] Furthermore, the fluorescence intensity of the foreign object 30 irradiated by ultraviolet light as excitation light varies depending on the size of the foreign object 30. Therefore, in this embodiment, for example, the fluorescence intensity (reference size intensity) of the foreign object 30 when irradiated with excitation light is measured in advance, and the size of the foreign object 30 is determined by comparing the reference size intensity with the fluorescence intensity.

[0035] <Functional Composition> The edge computer 20 of the foreign object inspection system 1 in this embodiment is implemented, for example, by the functional blocks shown in FIG6. FIG6 is a functional block diagram of an example of the implementation of the foreign object inspection system by the edge computer in this embodiment. Furthermore, configurations that are not related to the description of this embodiment are omitted from the functional block diagram of FIG6.

[0036] The edge computer 20 executes the edge computer 20 application program to realize the control unit 50, the judgment unit 52, the output unit 54, the corresponding relationship information memory unit 56, the judgment result memory unit 58, and the maintenance operation process memory unit 60.

[0037] The control unit 50 controls the overall processing of foreign object inspection and maintenance support in this embodiment. For example, the control unit 50 controls the operation of the light source 24 to irradiate the inspection target area with excitation light, and controls the operation of the camera 26 to photograph the inspection target area irradiated by the excitation light.

[0038] The determination unit 52 receives image data from the image captured by the camera 26. If the foreign object 30 is attached to the area to be inspected, the image captured by the camera 26 will contain fluorescence caused by the foreign object 30. The determination unit 52 performs image analysis on the image data received from the camera 26, identifies the fluorescence contained in the image of the area to be inspected, and thereby determines the location of the foreign object 30 attached to the area to be inspected.

[0039] Furthermore, the determination unit 52 uses the correspondence information of Figure 5 stored in the correspondence information memory unit 56 to determine the type of foreign object 30 and the appropriate cleaning method for that type of foreign object 30 based on the fluorescence color contained in the image of the inspection target area. The determination unit 52 stores the determined location of the foreign object 30 attached to the inspection target area, the type of foreign object 30, and the appropriate cleaning method for that type of foreign object 30 as the determination result in the determination result memory unit 58.

[0040] The output unit 54 includes a judgment result display control unit 62, a cleaning action detection unit 64, and a cleaning support information display control unit 66. The judgment result display control unit 62 displays the location of the foreign object 30 attached to the inspection target area, the type of the foreign object 30, and the cleaning method suitable for the type of foreign object 30 as the judgment result on the display device 12.

[0041] The cleaning motion detection unit 64 detects the activities of the cleaning personnel (such as the hand movements of the cleaning personnel) through motion capture and other methods. The cleaning support information display control unit 66 displays the maintenance operation screen of the maintenance operation performed by the support personnel on the display device 12. In the maintenance operation screen, for example, the area where foreign objects 30 are attached to the real image of the area to be inspected is colored (colored) to show the location that needs to be cleaned to the personnel.

[0042] Furthermore, on the maintenance operation screen, based on the detection results of the cleaning action detection unit 64, the progress of the cleaning operation by the operator is estimated. The areas where the cleaning operation is estimated to be completed are partially deleted or their colors are changed in stages, thereby displaying the progress of the cleaning operation to the operator. When the overall cleaning operation of an area is estimated to be completed, a notification indicating the completion of the cleaning operation for that area is displayed to the operator on the maintenance operation screen via display or sound. Moreover, the output unit 54 stores the information of the maintenance operation performed by the operator as information for analyzing the maintenance operation process in the maintenance operation process memory unit 60.

[0043] <Processing> Figure 7 is a flowchart illustrating an example of the processing of the foreign object inspection system according to this embodiment. For example, a maintenance worker performs an operation to activate the information collection mode of the edge computer 20. The edge computer 20, having received the operation from the worker to activate the information collection mode, begins information collection mode processing in step S10.

[0044] Here, an example of an inspection target area being the inner side of the semiconductor manufacturing apparatus 10 will be described. The control unit 50 of the edge computer 20, for example, controls the operation of the light source 24 to irradiate excitation light onto the inner side (inspection target area) of the semiconductor manufacturing apparatus 10 as shown in FIG. 8. FIG. 8 is a conceptual diagram of an example of an inspection target area for foreign object inspection. Furthermore, regarding the placement of the light source 24 and the camera 26 in FIG. 8, since there are various placement examples (placed on the transport arm 22, placed on a head-mounted display, and placed on a handheld device, etc.), they are omitted from the illustration. Also, the control unit 50 controls the operation of the camera 26 to photograph the inspection target area irradiated by the excitation light.

[0045] For example, when using a light source 24 and a camera 26 mounted on a conveyor arm 22 as shown in Figure 2, the control unit 50 moves the position of the conveyor arm 22 to irradiate the inspection area with excitation light, and controls the image capture of the inspection area irradiated by the excitation light. Furthermore, when using a light source 24 and a camera 26 movably mounted within the semiconductor manufacturing apparatus 10, the control unit 50 controls the irradiation direction of the light source 24 to irradiate the inspection area with excitation light, and controls the shooting direction of the camera 26 to capture the inspection area irradiated by the excitation light. When the light source 24 and camera 26 are mounted on a handheld device, the operator adjusts the orientation of the device to determine the direction of the excitation light irradiation onto the inspection area and to capture the image of the inspection area irradiated by the excitation light.

[0046] In step S12, the determination unit 52 of the edge computer 20 receives image data (image of the inspection object area irradiated by the excitation light) captured by the camera 26, and performs foreign object determination processing through the procedure shown in FIG9.

[0047] Figure 9 is a flowchart of an example of foreign object detection processing. In step S30, the determination unit 52 performs image analysis on the image data captured by the camera 26 and identifies the emission of fluorescence contained in the image of the inspection target area irradiated by the excitation light. Furthermore, the determination unit 52 can also exclude the emission of fluorescence caused by anything other than the foreign object 30 by comparing it with the image of the inspection target area irradiated by the excitation light in a state where no foreign object 30 is attached.

[0048] In step S32, the determination unit 52 determines the location of the fluorescence emitted in the image of the inspection target area as the location of the foreign object 30 attached to the inspection target area. Furthermore, in step S34, based on the fluorescence color of the location of the foreign object 30 attached to the inspection target area determined in step S32, and the correspondence information established in Figure 5, the determination unit 52 determines the type of foreign object 30 and the appropriate cleaning method for that type of foreign object 30.

[0049] In step S36, the determination unit 52 stores the image data captured by the camera 26, the location of the foreign object 30 determined in step S32, the type of foreign object 30 determined in step S34, and the cleaning method suitable for the type of foreign object 30 in the determination result memory unit 58.

[0050] After the information collection mode processing in step S10 and the foreign object detection processing in step S12 are completed, the operator may perform an operation to enable the edge computer 20 to start the analysis mode or the contaminated area display mode. The judgment result display control unit 62 of the edge computer 20, which has received the operation from the operator to enable the analysis mode, begins the display processing based on the analysis mode in step S16.

[0051] In the display processing based on the analysis mode in step S16, the judgment result display control unit 62 uses the location of the foreign object 30 attached to the inspection target area and the type of foreign object 30 determined by the judgment unit 52 as the judgment result, for example, to display the analysis screen shown in FIG10 on the display device 12.

[0052] Figure 10 is a conceptual diagram of one example of an analysis screen. In the analysis screen of Figure 10, the size and composition (type) of the presumed foreign object 30 are displayed in information 100, and the area 102 where the foreign object 30 is attached is colored. Furthermore, in the analysis screen of Figure 10, a representative image 104 corresponding to the presumed foreign object 30 can also be displayed by referring to an external database, etc.

[0053] Furthermore, in step S18, the judgment result display control unit 62, which received the operation from the operator to activate the contaminated area display mode, begins display processing based on the contaminated area display mode. The judgment result display control unit 62 uses the image data captured by the camera 26 stored in the judgment result memory unit 58, the location of the foreign object 30 determined in step S32, the type of foreign object 30 determined in step S34, and the cleaning method suitable for the type of foreign object 30 to display the contaminated area display mode screen.

[0054] Figure 11 is a conceptual diagram of one example of a contaminated area display mode screen. The contaminated area display mode screen in Figure 11 is an example of coloring (shading) multiple areas 110 with foreign matter 30 attached, overlaid on the actual image of the inspection object area shown in Figure 8. In the contaminated area display mode screen in Figure 11, the type of foreign matter 30 attached to the colored area 110 and the cleaning method suitable for the type of foreign matter 30 can also be displayed.

[0055] For example, when the display device 12 is a head-mounted display, the contaminated area display mode screen as shown in Figure 11 is displayed within the operator's field of vision. When the operator approaches any area 110 displayed in the contaminated area display mode screen, the cleaning support processing based on the cleaning support mode in step S20 begins.

[0056] The cleaning support information display control unit 66 controls the display of the cleaning support mode screen for the area 110 approached by the operator on a display device 12 such as a head-mounted display. Figure 12 is a conceptual diagram of an example of a cleaning support mode screen.

[0057] In the cleaning support mode screen of Figure 12, an example of a magnified display of the area 110 approached by the worker is shown. The cleaning motion detection unit 64 detects the worker's activities (such as the hand movements of the worker performing cleaning) by motion capture and the like. Based on the hand movements of the worker detected by the cleaning motion detection unit 64, the cleaning support information display control unit 66 estimates the progress of the worker's cleaning operation in area 110. As shown in Figure 12(a), the color of a portion of area 110 that is estimated to have completed the cleaning operation changes from the first color (e.g., red) indicating that the cleaning operation is not yet completed to the second color (e.g., green) indicating that the cleaning operation is completed.

[0058] When all colors in area 110 change to the second color (e.g., green), indicating that the cleaning operation has been completed, as shown in Figure 12(b), the cleaning support information display control unit 66 notifies the operator by displaying a message indicating that the cleaning operation in area 110 has been completed. Subsequently, based on the results of repeating steps S10 and S12 of Figure 7, if foreign matter 30 has been removed, the cleaning support information display control unit 66 changes the color of area 110 to the third color, as shown in Figure 12(c). Furthermore, the third color can be transparent or a color other than the first and second colors.

[0059] According to the foreign object inspection system 1 of this embodiment, the location and type of foreign object 30 attached to the inspection target area can be determined, and the operator can support the cleaning operation of the foreign object 30 at the determined location and type.

[0060] Furthermore, according to the foreign object inspection system 1 of this embodiment, a filter is provided in front of the lens of the camera 26 to select the wavelength for the camera 26 to capture images, thereby limiting the types of foreign objects 30 to be inspected. For example, in the example of establishing correspondence information in Figure 5, if a filter is provided in front of the lens of the camera 26 to block the emission color of any color other than the fluorescence of organic foreign objects 30, an organic mode can be achieved that only displays the location where organic foreign objects 30 are attached. Thus, according to the foreign object inspection system 1 of this embodiment, a mode that can narrow down the range of types of foreign objects 30 and display the location where foreign objects 30 are attached can also be achieved. Furthermore, by providing an RGB (red, green, blue) filter in front of the lens of the camera 26, the colors (red, green, blue; RGB) captured by the camera 26 can be selected, thereby selecting the wavelength for the camera 26 to capture images.

[0061] [Second Implementation] In the first embodiment, an example is shown where a worker performs a cleaning operation on the foreign object 30 based on the information displayed on the display device 12. However, if a cleaning unit is provided that can perform cleaning operations on the area to be inspected by a robotic arm or the like, then the cleaning unit can also perform the cleaning operation on the foreign object 30. Furthermore, since the second embodiment is the same as the first embodiment except for a portion, the description of the same portion is omitted.

[0062] Figure 13 is a structural diagram of an example of the foreign object inspection system of this embodiment. The foreign object inspection system 1 shown in Figure 13 is a configuration of the foreign object inspection system 1 of Figure 1 with the addition of a cleaning unit 40. The cleaning unit 40 receives information from the edge computer 20, including the location of the foreign object 30 attached to the inspection target area, the type of the foreign object 30, and a cleaning method suitable for the type of foreign object 30, and performs a cleaning operation based on the received information.

[0063] Figure 14 is a functional block diagram of an example of the foreign object inspection system implemented by the edge computer of this embodiment. The functional block diagram shown in Figure 14 is a configuration of the functional block diagram of Figure 6 with the addition of a cleaning unit 40 and a determination result cleaning control unit 68.

[0064] The determination result cleaning control unit 68 sends the location, type, and suitable cleaning method of the foreign object 30 attached to the inspection target area as determined by the determination unit 52, thereby controlling the cleaning operation performed by the cleaning unit 40. Furthermore, the determination result cleaning control unit 68 can also send control commands to the cleaning unit 40 according to the location, type, and suitable cleaning method of the foreign object 30 attached to the inspection target area as determined by the determination unit 52, thereby controlling the cleaning operation performed by the cleaning unit 40.

[0065] According to the second embodiment, cleaning operations performed by workers can be reduced or eliminated, thereby reducing the risk of foreign matter contamination caused by workers entering the interior of the semiconductor manufacturing apparatus 10.

[0066] According to this embodiment, the inspection of foreign objects attached to the semiconductor manufacturing apparatus 10 and other inspection objects can be made more efficient, and the maintenance operation of cleaning the foreign objects can be made more efficient.

[0067] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above embodiments, and various modifications and substitutions can be made to the above embodiments without departing from the scope of the present invention.

[0068] Furthermore, light source 24 is an example of a light source unit described in the claims. Camera 26 is an example of a detection unit described in the claims. Determination unit 52 is an example of a determination unit described in the claims. Output unit 54 is an example of an output unit described in the claims. Display device 12 is an example of a display unit described in the claims. Cleaning motion detection unit 64 is an example of a detection unit described in the claims. Cleaning unit 40 is an example of a cleaning unit described in the claims.

[0069] 1: Foreign Object Inspection System 10: Semiconductor manufacturing equipment 12: Display device 14: Local Server 16: Cloud Server 18: Internet 20: Edge Computing 22:Conveying arm 24: Light source 26: Camera 30: Foreign object 31: Reflected light 32: Noodles 33: Reflected light 34: Reflected light 40: Cleaning Department 50: Control Department 52: Judgment Department 54: Output Section 56: Establish corresponding information memory department 58: Judgment Result Memory Department 60: Maintenance Operation Process Memory Department 62: Judgment results displayed in the control unit 64: Cleaning Motion Detection Unit 66: Cleaning Support Information Display and Control Department 68: Judgment Result Cleaning Control Department 100: News 102: Area 104: Represents an image 110: Area 500: Computer 501: Input device 502: Output device 503:External I / F 503a: Recording Media 504: RAM 505:ROM 506: CPU 507: Communication I / F 508:HDD B: Bus

Claims

1. A foreign object inspection system comprising: a light source configured to emit excitation light toward an object to be inspected; a camera configured to detect fluorescence emitted from a foreign object attached to the object to be inspected, the fluorescence being caused by irradiation from the excitation light of the light source; a display device; and a processor configured to determine the location and type of the foreign object based on the fluorescence emitted from the foreign object; output the result of the determination; and display the location and type of the foreign object attached to the object to be inspected as the result of the determination. During the cleaning operation of the aforementioned inspection object performed by the user or the cleaning unit, the display device displays the first location on the inspection object where the foreign object is attached in a first color, the first location being the object cleaned by the cleaning operation; and during the aforementioned cleaning operation of the aforementioned inspection object performed by the user or the cleaning unit, by changing the color from the first color to a second color, the display device displays at least a portion of the first location as a second location, the at least portion of the first location having been cleaned by the user or the cleaning unit, the second color being a color different from the first color; and the processor is further configured to perform the aforementioned determination at the second location; and in response to the result of the aforementioned determination being that no foreign object exists, the display device displays the third location on the inspection object in a third color different from the first color and the second color, the third location being at least a portion of the second location determined to be free of the aforementioned foreign object.

2. The foreign object inspection system of claim 1, wherein the foreign object inspection system stores and displays corresponding information relating the color of the fluorescence emitted from the foreign object to the type of the foreign object; and the processor is configured to determine the type of the foreign object based on the corresponding information and the color of the fluorescence emitted from the foreign object when performing the determination.

3. The foreign object inspection system of claim 1, wherein the processor is further configured to determine the size of the foreign object attached to the inspection object by comparing the intensity of the fluorescence emitted from the foreign object attached to the inspection object with the intensity of the fluorescence emitted from the reference foreign object of the reference size in response to emitting excitation light to the reference foreign object of the reference size.

4. The foreign object inspection system of claim 3, wherein the processor is configured to cause the display device to display the size of the foreign object attached to the object being inspected as the result of the determination.

5. The foreign object inspection system of claim 1, wherein the foreign object inspection system stores corresponding information relating to the color of the fluorescence emitted from the foreign object, the type of the foreign object, and a set of cleaning methods suitable for the type of the foreign object; and the processor is further configured to, based on the corresponding information and the color of the fluorescence emitted from the foreign object, perform a determination of a cleaning method for removing the foreign object attached to the inspection object, and cause the display device to display the cleaning method for removing the foreign object attached to the inspection object as the result of the determination.

6. The foreign object inspection system of claim 1, wherein the processor is configured to cause the display device to display a virtual image using augmented reality technology, the virtual image being generated by overlaying the result of the determination onto a real image of the object being inspected.

7. The foreign object inspection system of claim 1, wherein the processor is further configured to detect the activity of the user or the cleaning unit during the cleaning operation, and based on the activity of the user or the cleaning unit, perform a determination on whether the first position has been cleaned by the user or the cleaning unit, and in response to the determination that the first position has been cleaned by the user or the cleaning unit, cause the display device to change the first color of the first position to the second color.

8. The foreign object inspection system of claim 1, wherein the processor is further configured to display information indicating that the cleaning operation has been completed when the cleaning operation of the entire object to be inspected has been determined to be completed.

9. The foreign object inspection system of claim 1, further comprising the cleaning unit, which includes a cleaning mechanism; and the processor configured to output the result of the determination to the cleaning unit so that the cleaning unit removes the foreign object attached to the object being inspected.

10. The foreign object inspection system of claim 9, wherein the foreign object inspection system stores corresponding information relating the color of the fluorescence emitted from the foreign object, the type of the foreign object, and a set of cleaning methods suitable for the type of the foreign object; and the processor is further configured to determine a cleaning method for removing the foreign object attached to the inspection object based on the corresponding information and the color of the fluorescence emitted from the foreign object, and output the cleaning method determined by the processor to the cleaning unit; and the cleaning unit is configured to remove the foreign object attached to the inspection object according to the cleaning method received from the processor.

11. The foreign object inspection system of claim 1, wherein the camera includes a filter configured to select the wavelength range of light of the fluorescence detected by the camera.

12. The foreign object inspection system of claim 1, wherein the excitation light is ultraviolet light.

13. The foreign object inspection system of claim 1, wherein the processor is further configured to determine the fluorescence emitted from the foreign object by comparing the fluorescence emitted from the inspection object without the foreign object attached with the fluorescence emitted from the inspection object with the foreign object attached.

14. A method for inspecting foreign matter attached to an object of inspection, the method being performed by a foreign matter inspection system, and the method comprising: emitting excitation light toward the object of inspection; detecting fluorescence emitted from the foreign matter attached to the object of inspection, the fluorescence being caused by irradiation from the excitation light; determining the location and type of the foreign matter based on the fluorescence emitted from the foreign matter; outputting the result of the determination; and displaying the location and type of the foreign matter attached to the object of inspection as the result of the determination. During the cleaning operation of the aforementioned inspection object performed by the user or the cleaning department, a first position on the inspection object where the aforementioned foreign object is attached is displayed in a first color, the first position being the object cleaned by the aforementioned cleaning operation; and during the aforementioned cleaning operation of the aforementioned inspection object performed by the user or the aforementioned cleaning department, at least a portion of the aforementioned first position is displayed as a second position by changing the color from the aforementioned first color to the aforementioned second color, the aforementioned at least a portion of the aforementioned first position having been cleaned by the aforementioned user or the aforementioned cleaning department, the aforementioned second color being a color different from the aforementioned first color; and the aforementioned method further comprises: performing the aforementioned determination at the aforementioned second position; and, in response to the aforementioned determination result being that no foreign object exists, displaying a third position on the inspection object in a third color different from the aforementioned first color and the aforementioned second color, the aforementioned third position being at least a portion of the aforementioned second position determined to be free of the aforementioned foreign object.

15. A non-transitory computer-readable recording medium storing a computer program that causes a processor in a computer to execute a method comprising: emitting excitation light toward the object to be inspected; detecting fluorescence emitted from a foreign object attached to the object to be inspected, the fluorescence being caused by irradiation from the excitation light; determining the location and type of the foreign object based on the fluorescence emitted from the foreign object; outputting the result of the determination; and displaying the location and type of the foreign object attached to the object to be inspected as the result of the determination. During the cleaning operation of the aforementioned inspection object performed by the user or the cleaning department, a first position on the inspection object where the aforementioned foreign object is attached is displayed in a first color, the first position being the object cleaned by the aforementioned cleaning operation; and during the aforementioned cleaning operation of the aforementioned inspection object performed by the user or the aforementioned cleaning department, at least a portion of the aforementioned first position is displayed as a second position by changing the color from the aforementioned first color to the aforementioned second color, the aforementioned at least a portion of the aforementioned first position having been cleaned by the aforementioned user or the aforementioned cleaning department, the aforementioned second color being a color different from the aforementioned first color; and the aforementioned method further comprises: performing the aforementioned determination at the aforementioned second position; and, in response to the aforementioned determination result being that no foreign object exists, displaying a third position on the inspection object in a third color different from the aforementioned first color and the aforementioned second color, the aforementioned third position being at least a portion of the aforementioned second position determined to be free of the aforementioned foreign object.

16. A semiconductor manufacturing apparatus having a foreign object inspection system as claimed in claim 1.

17. The semiconductor manufacturing apparatus of claim 16, further comprising a conveying arm; and wherein the light source and the camera are disposed on the conveying arm.

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