Facet system and lithography apparatus

Abstract

A faceting system (300A, 300B, 300C) for lithography apparatus (100A, 100B) includes a faceted element (304) having an optically effective surface (306), a first piezoelectric actuator arrangement (364) for tilting the faceted element (304) about a first spatial direction (x), and a second piezoelectric actuator arrangement (366) for tilting the faceted element (304) about a second spatial direction (y) perpendicular to the first spatial direction (x), wherein the first piezoelectric actuator arrangement (364) and the second piezoelectric actuator arrangement (366) are arranged in a common plane (E) unfolded by the first spatial direction (x) and the second spatial direction (y).

Description

Technical Field

[0001] This invention relates to a faceting system for a lithography apparatus, and to a lithography apparatus comprising such a faceting system. [Related patent references]

[0002] The entire contents of priority application DE 10 2021 202 768.7 are incorporated herein by reference. Prior Technology

[0003] Lithography is used to produce microstructured components, such as integrated circuits. The lithography process is performed using a lithography apparatus with an illumination system and a projection system. In this case, the image of a photomask (mask) illuminated by the illumination system is projected onto a substrate (e.g., a silicon wafer) through the projection system. This substrate is coated with a photosensitive layer (photoresist) and positioned within the image plane of the projection system to transfer the photomask structure onto the photosensitive coating of the substrate.

[0004] Due to the need for smaller structures in integrated circuit manufacturing, EUV lithography devices (extreme ultraviolet, EUV) using light with wavelengths in the range of 0.1 nm to 30 nm (especially 13.5 nm) are currently being developed. In the case of such EUV lithography devices, because most materials absorb light at this wavelength very well, it is necessary to use reflective optical units (i.e., mirrors) instead of refractive optical units (i.e., lens elements) as previously used. The mirrors operate with near-perpendicular or grazing incidence.

[0005] Illumination systems typically include field-faceted mirrors and pupil-faceted mirrors. These mirrors can be classified as faceted mirrors, which in each case usually have hundreds of facets. The facets of a field-faceted mirror are also called "field facets," and the facets of a pupil-faceted mirror are also called "pupil facets." Multiple pupil facets can be assigned to a single field facet. To achieve good illumination at high numerical apertures, it is desirable that a single field facet can be switched between the pupil facets assigned to it. Summary of the Invention

[0006] In view of this background, one object of the present invention is to provide an improved faceting system.

[0007] Therefore, a faceting system for lithography apparatus is proposed. The faceting system includes a faceted element having an optically effective surface, a first piezoelectric actuator arrangement for tilting the faceted element about a first spatial direction, and a second piezoelectric actuator arrangement for tilting the faceted element about a second spatial direction perpendicular to the first spatial direction, wherein the first piezoelectric actuator arrangement and the second piezoelectric actuator arrangement are arranged in a common plane unfolded by the first spatial direction and the second spatial direction.

[0008] By providing a first piezoelectric actuator configuration and a second piezoelectric actuator configuration, it is possible to tilt the faceted element about a first spatial direction and about a second spatial direction. By appropriately actuating the first and second piezoelectric actuator configurations, it is possible to obtain any combination of tilts about the first and second spatial directions. This allows the faceted element to be switched to any number of different tilt positions.

[0009] The faceted system can be a field faceted system or a pupil faceted system. The faceted system can also be part of a specular reflector. The faceted element can be a field faceted element or a pupil faceted element. The faceted system is particularly part of the beamforming and illumination system of a lithography apparatus. Specifically, the faceted system is part of a faceted mirror, especially a field faceted mirror. Such a faceted mirror preferably comprises multiple such faceted systems arranged in a checkerboard pattern or design. That is, the faceted systems are preferably arranged row-to-row and column-to-column. Such a field faceted mirror can contain any number of faceted systems. For example, a field faceted mirror can contain hundreds of thousands of faceted systems. Each faceted element can be tilted to a plurality of different tilt positions.

[0010] A coordinate system with a first spatial direction (x-direction), a second spatial direction (y-direction), and a third spatial direction (z-direction) is assigned to the faceted system. The spatial directions are positioned perpendicular to each other. The third spatial direction can be oriented perpendicular to the optically effective surface. The first and second spatial directions can be oriented parallel to the optically effective surface.

[0011] The faceted element is made of a mirror substrate or a substrate. The substrate may, in particular, contain silicon. An optically effective surface is disposed on the front side of the faceted element, i.e., away from the piezoelectric actuator configuration. The optically effective surface reflects light. The optically effective surface can be a mirror surface. The optically effective surface can be created by means of a coating applied to the faceted element. In particular, the faceted element itself is opaque. The optically effective surface is suitable for reflecting working light or light, especially EUV radiation. However, this does not preclude at least some light from being absorbed by the faceted element, thus heat is introduced into the faceted element.

[0012] Specifically, the first piezoelectric actuator is configured to tilt the faceted element about a first spatial direction, which is preferably parallel to the optically effective surface. Therefore, the second piezoelectric actuator is specifically configured to tilt the faceted element about a second spatial direction, which is preferably parallel to the optically effective surface and perpendicular to the first spatial direction. The optically effective surface is preferably flat. However, the optically effective surface can also be curved. For example, the optically effective surface can be cylindrical or annular.

[0013] A piezoelectric actuator configuration may also be called a piezoelectric element configuration or a piezoelectric actuator element configuration. In the present context, "piezoelectric actuator" or "piezoelectric element" should be understood to refer to a component that utilizes the so-called piezoelectric effect to perform mechanical motion by applying a voltage. The terms "piezoelectric actuator" and "piezoelectric element" may be used interchangeably as needed. Each piezoelectric actuator configuration may contain a plurality of piezoelectric actuators. Preferably, two piezoelectric actuators are assigned to each piezoelectric actuator configuration. A piezoelectric actuator is a so-called bending transducer, or may be referred to as a bending transducer.

[0014] In the planar view, that is, in the viewing direction perpendicular to the optically effective surface, the faceted element completely covers the first and second piezoelectric actuator configurations. In other words, light incident on the faceted system preferably only occurs on the optically effective surface and not on other components of the faceted system, such as the piezoelectric actuator configurations. Therefore, it is possible to obtain a high fill power of the faceted element or the optically effective surface.

[0015] Specifically, the first piezoelectric actuator is configured to pivot or tilt the faceted element only about a first spatial direction or about an axis parallel to the first spatial direction. Therefore, the second piezoelectric actuator is configured to tilt the faceted element only about a second spatial direction or about an axis parallel to the second spatial direction. With the assistance of the first and second piezoelectric actuator configurations, any number of tilt states or tilt positions of the faceted element can be set.

[0016] Preferably, the faceting system includes a control unit adapted to actuate a piezoelectric actuator configuration, or to actuate a piezoelectric actuator assigned to a piezoelectric actuator configuration. Voltage is applied to the corresponding piezoelectric actuator to achieve actuation. By applying voltage, the corresponding piezoelectric actuator deforms to tilt the faceted element. In this case, the corresponding piezoelectric actuator can transition from a non-deformed or non-deflected state to a deformed or deflected state. Any number of intermediate states can be provided between the non-deflected and deflected states. That is, the piezoelectric actuator can continuously deform or deflect between the non-deflected and deflected states.

[0017] According to one specific embodiment, the first piezoelectric actuator configuration and / or the second piezoelectric actuator configuration system are configured to perform the stroke motion of the faceted element in a third spatial direction perpendicular to the optically effective surface.

[0018] This results in further degrees of freedom. The faceted element thus has at least three degrees of freedom, specifically rotational freedom about a first spatial direction, rotational freedom about a second spatial direction, and translational freedom in a third spatial direction. To allow the faceted element to perform stroke motion, the piezoelectric actuators assigned to the corresponding piezoelectric actuator configurations are simultaneously actuated and deflected to the same degree, thereby producing stroke motion in the third spatial direction. Combined stroke and tilting motions of the faceted element can also be performed. For example, if the optically effective surface is curved, the third spatial direction can be oriented perpendicular to the vertex of the optically effective surface.

[0019] The first piezoelectric actuator configuration and the second piezoelectric actuator configuration are arranged in a common plane unfolded by the first spatial direction and the second spatial direction.

[0020] The common plane can also be configured to be parallel to the plane unfolded by the first spatial direction and the second spatial direction. For example, the bottom or top side of the piezoelectric actuators in a piezoelectric actuator configuration is disposed in the common plane. Once one of the piezoelectric actuators is actuated or a current is applied, the piezoelectric actuator deforms away from the common plane, resulting in the tilting of the faceted element.

[0021] According to another specific embodiment, the first piezoelectric actuator configuration includes at least two piezoelectric actuators configured to selectively tilt the faceted element about a first spatial direction in two oppositely oriented tilting motions.

[0022] Tilting motion can also be referred to as tilting direction. For example, tilting motion can be oriented clockwise and counterclockwise around a first spatial direction. For example, the first tilting motion is counterclockwise, and the second tilting motion is clockwise. For example, the faceted element can therefore tilt by a tilt angle of 100 mrad. If the two piezoelectric actuators configured with the first piezoelectric actuator are simultaneously actuated and deflected to the same degree, the faceted element performs the aforementioned stroke motion. As mentioned above, a combination of tilting motion and stroke motion can also be performed.

[0023] According to another specific embodiment, the second piezoelectric actuator configuration includes at least two piezoelectric actuators configured to selectively tilt the faceted element about a second spatial direction in two oppositely oriented tilting movements.

[0024] The tilting motion can be oriented clockwise and counterclockwise around the second spatial direction. For example, a third tilting motion oriented clockwise and a fourth tilting motion oriented counterclockwise are provided. The first and second tilting motions are oriented at right angles to the third and fourth tilting motions. As mentioned above, the tilting motion can also be referred to as the tilting direction.

[0025] According to another specific embodiment, the piezoelectric actuators configured with the first piezoelectric actuator and the piezoelectric actuator configured with the second piezoelectric actuator are arranged in a row.

[0026] Specifically, this means that all piezoelectric actuators are placed one after another. Preferably, the piezoelectric actuators in the first piezoelectric actuator configuration and the piezoelectric actuators in the second piezoelectric actuator configuration have the same structure. In particular, the piezoelectric actuators are so-called piezoelectric bending transducers, which change their curvature rather than their length when an electric current is applied to them.

[0027] According to another specific embodiment, the piezoelectric actuators configured with the first piezoelectric actuator and the piezoelectric actuators configured with the second piezoelectric actuator are configured alternately.

[0028] Specifically, this means that the piezoelectric actuator configured with the first piezoelectric actuator is, in all cases, positioned between the two piezoelectric actuators configured with the second piezoelectric actuator, and vice versa. Preferably, a first piezoelectric actuator, a second piezoelectric actuator, a third piezoelectric actuator, and a fourth piezoelectric actuator are provided, with the second piezoelectric actuator positioned between the first and third piezoelectric actuators. In particular, the third piezoelectric actuator is positioned between the second and fourth piezoelectric actuators.

[0029] According to another specific embodiment, the piezoelectric actuators of the first piezoelectric actuator are configured to be parallel to each other and spaced apart by a distance, and the piezoelectric actuators of the second piezoelectric actuator are also configured to be parallel to each other and spaced apart by a distance.

[0030] Specifically, when viewed in the second spatial direction, the piezoelectric actuators of the first piezoelectric actuator configuration are arranged such that they are spaced apart from each other and parallel to each other. Correspondingly, when viewed in the first spatial direction, the piezoelectric actuators of the second piezoelectric actuator configuration are arranged such that they are parallel to each other and spaced apart from each other. Specifically, the piezoelectric actuators are in the form of elongated, strip-shaped, or ribbon-shaped components. The piezoelectric actuators have the largest geometric range along the main range direction or longitudinal direction. The piezoelectric actuators of the first piezoelectric actuator configuration are positioned such that they extend in their main range direction, particularly in the first spatial direction. Correspondingly, the piezoelectric actuators of the second piezoelectric actuator configuration are positioned such that they extend in their main range direction, particularly in the second spatial direction.

[0031] According to another specific embodiment, the piezoelectric actuators configured with the first piezoelectric actuator and the piezoelectric actuator configured with the second piezoelectric actuator are configured to be perpendicular to each other.

[0032] Therefore, this results in a helical (or spiral) configuration of the piezoelectric actuators. Specifically, as previously described, a first, second, third, and fourth piezoelectric actuator are provided. In this case, the second piezoelectric actuator is configured at a right angle to the first piezoelectric actuator. Simultaneously, the third piezoelectric actuator is placed at a right angle to the second piezoelectric actuator. The fourth piezoelectric actuator is placed at a right angle to the third piezoelectric actuator. The first and third piezoelectric actuators are assigned to the first piezoelectric actuator configuration. Correspondingly, the second and fourth piezoelectric actuators are assigned to the second piezoelectric actuator configuration. In this context, "at a right angle" should be understood to mean that the aforementioned main range directions of the piezoelectric actuators are placed at right angles to each other. In the current context, "at right angle" should be further understood as representing an angle of 90°±10°, preferably 90°±5°, even better 90°±1°, and even better exactly 90°.

[0033] According to another specific embodiment, the faceting system further includes a first piezoelectric actuator, a second piezoelectric actuator, a third piezoelectric actuator, and a fourth piezoelectric actuator, wherein the first piezoelectric actuator and the third piezoelectric actuator are assigned to the first piezoelectric actuator configuration, and the second piezoelectric actuator and the fourth piezoelectric actuator are assigned to the second piezoelectric actuator configuration.

[0034] In other words, the first piezoelectric actuator configuration includes a first piezoelectric actuator and a third piezoelectric actuator. Therefore, the second piezoelectric actuator configuration includes a second piezoelectric actuator and a fourth piezoelectric actuator. The number of piezoelectric actuators is preferably arbitrary. However, specifically, exactly four piezoelectric actuators are provided.

[0035] According to another specific embodiment, the faceted system further includes a substrate, with only the first piezoelectric actuator connected to the substrate. The substrate can also be referred to as the body of the faceted system. The substrate is preferably made of silicon. However, the substrate may also contain copper (especially copper alloys), iron-nickel alloys (e.g., invariant steel (Invar)), silicon, or some other suitable material. In the present case, "only" the first piezoelectric actuator is connected to the substrate means that the second to fourth piezoelectric actuators do not have a fixed connection to the substrate. In particular, in each case, a gap may be provided between the second to fourth piezoelectric actuators and the substrate. The piezoelectric actuator configuration is arranged between the substrate and the faceted elements.

[0036] According to another specific embodiment, the first piezoelectric actuator is connected only to the substrate and the second piezoelectric actuator, the second piezoelectric actuator is connected only to the first piezoelectric actuator and the third piezoelectric actuator, the third piezoelectric actuator is connected only to the second piezoelectric actuator and the fourth piezoelectric actuator, and the fourth piezoelectric actuator is connected only to the third piezoelectric actuator and the faceted element.

[0037] Preferably, a strip-shaped connecting portion with connection points is provided on the fourth piezoelectric actuator, to which the faceted element is fixed. For example, the faceted element can be adhesively connected to the connection points. In adhesive connections, the connecting partners are held together by atomic or molecular forces. Adhesive connections are non-releasable connections and can only be separated by breaking the connection means and / or the connecting partners. For example, adhesive connections can be achieved by adhesive bonding or welding. For example, the faceted element can be connected to the connection points by any joining method.

[0038] According to another specific embodiment, the faceted element is square in the plan view. In the present context, "plan view" should be understood as representing the viewing direction perpendicular to the optically effective surface. However, the faceted element may also have any other desired geometry in the plan view. For example, the faceted element may be an elongated rectangle, circle, hexagon, or elongated arc curve.

[0039] According to another specific embodiment, the faceting system is an integral component.

[0040] In this example, "monolithic" or "integrated" should be understood as meaning that the faceted system is not composed of multiple separable parts, but rather forms a common or monolithic component. For example, a faceted system can be realized using microelectromechanical manufacturing methods (MEMS). In this case, the three-dimensional microstructure composed of multiple substrates is achieved using different coating methods, microstructuring and etching techniques, and bonding methods. For example, the microstructure can be made of silicon. For example, a piezoelectric actuator can be based on piezoelectric ceramics, such as lead zirconate titanate (PZT).

[0041] According to another specific embodiment, the sensor is integrated into the faceting system.

[0042] The sensor can contain any number of sensors, especially capacitive sensors.

[0043] In addition, a lithography device incorporating such a faceting system was proposed.

[0044] A lithography apparatus may comprise multiple such faceted systems. The lithography apparatus may be an EUV lithography apparatus or a DUV lithography apparatus. EUV stands for "Extreme Ultraviolet," and indicates that the wavelength of the working light is between 0.1 nm and 30 nm. DUV stands for "Deep Ultraviolet," and indicates that the wavelength of the working light is between 30 nm and 250 nm.

[0045] "One; one" in this context is not necessarily to be understood as limited to exactly one element. Rather, a plurality of elements may be provided, such as two, three, or more. Any other numbers used herein should not be construed as a precise limitation on the number of elements stated. Rather, upward and downward numerical deviations are possible unless otherwise indicated.

[0046] The specific embodiments and features described for the faceted system are applicable accordingly to the proposed lithography apparatus, and vice versa.

[0047] Further possible embodiments of the invention include any combinations of features or specific embodiments not explicitly mentioned in the foregoing or hereinafter described with reference to exemplary specific embodiments. In such cases, those skilled in the art will add individual variations as improvements or supplements to the corresponding basic form of the invention. Simple Explanation of the Diagram

[0048] Other advantageous configurations and styles of the invention are appended to the claims and the subject of the exemplary embodiments of the invention described below. Hereinafter, the invention will be explained in more detail based on preferred embodiments with reference to the accompanying drawings.

[0049] Figure 1A shows a schematic diagram of a specific embodiment of the EUV lithography device;

[0050] Figure 1B shows a schematic diagram of a specific embodiment of the DUV lithography device;

[0051] Figure 2 shows a schematic diagram of a specific embodiment of the optical configuration for the lithography apparatus according to Figure 1A or Figure 1B;

[0052] Figure 3 shows a schematic diagram of another specific embodiment of the optical configuration for the lithography apparatus according to Figure 1A or Figure 1B;

[0053] Figure 4 shows a schematic plan view of a specific embodiment of a field-faceted mirror according to the optical configuration of Figure 2;

[0054] Figure 5 shows a detailed view V based on Figure 4;

[0055] Figure 6 shows another schematic diagram of the optical configuration according to Figure 2;

[0056] Figure 7 shows a schematic plan view of specific embodiments of the optical system for the optical configuration according to Figure 2 and for the optical configuration according to Figure 3;

[0057] Figure 8 shows a schematic cross-sectional view of the optical system along section line IIX-IIX in Figure 7;

[0058] Figure 9 shows a schematic cross-sectional view of the optical system along section line IX-IX of Figure 7;

[0059] Figure 10 shows a schematic cross-sectional view of a specific embodiment of a piezoelectric actuator for the optical system according to Figure 7;

[0060] Figure 11 shows a schematic perspective view of another specific embodiment of the optical system for the optical configuration according to Figure 2 and for the optical configuration according to Figure 3;

[0061] Figure 12 shows another schematic perspective view of the optical system according to Figure 11;

[0062] Figure 13 shows a schematic perspective view of another specific embodiment of the optical system for the optical configuration according to Figure 2 and for the optical configuration according to Figure 3; and

[0063] Figure 14 shows another schematic perspective view of the optical system according to Figure 13.

[0064] Unless otherwise stated, identical or functionally equivalent elements in the diagrams have the same element symbol. It should also be noted that the illustrations in the figures are not necessarily drawn to scale. Implementation

[0065] Figure 1A shows a schematic diagram of the structure of an EUV lithography apparatus 100A, including a beamforming and illumination system 102 and a projection system 104. In this case, EUV stands for "extreme ultraviolet light," indicating that the wavelength of the working light is between 0.1 nm and 30 nm. The beamforming and illumination system 102 and the projection system 104 are respectively housed in vacuum enclosures (not shown), each of which is evacuated with the aid of a vacuum pumping device (not shown). The vacuum enclosures are surrounded by a machine room (not shown), in which a drive device for mechanically moving or setting optical elements is installed. Furthermore, electrical controllers, etc., may also be installed in this machine room.

[0066] The EUV lithography apparatus 100A includes an EUV light source 106A. For example, a plasma source (or synchrotron) emitting radiation 108A in the EUV range (extreme ultraviolet range) (i.e., wavelength range, for example, from 5 nm to 20 nm) can serve as the EUV light source 106A. In the beamforming and illumination system 102, the EUV radiation 108A is focused, and the desired operating wavelength is filtered out from the EUV radiation 108A. The EUV radiation 108A generated by the EUV light source 106A has a relatively low air transmittance; therefore, the beam guiding space in the beamforming and illumination system 102 and in the projection system 104 is evacuated.

[0067] The beamforming and illumination system 102 shown in Figure 1A has five mirrors 110, 112, 114, 116, and 118. After passing through the beamforming and illumination system 102, EUV radiation 108A is guided onto a photomask (mask) 120. The photomask 120 is also in the form of a reflective optical element and can be disposed outside of systems 102 and 104. Furthermore, EUV radiation 108A can be guided onto the photomask 120 by means of mirror 122. The photomask 120 has a structure that is imaged onto a wafer 124 or the like in a reduced manner by a projection system 104.

[0068] The projection system 104 (also called the projection lens) has six mirrors M1-M6 for imaging the photomask 120 onto the wafer 124. In this case, the individual mirrors M1-M6 of the projection system 104 may be symmetrically arranged with respect to the optical axis 126 of the projection system 104. It should be noted that the number of mirrors M1-M6 in the EUV lithography apparatus 100A is not limited to the number shown. More or fewer mirrors M1-M6 may also be provided. Furthermore, the mirrors M1-M6 are typically bent on their front side for beamforming.

[0069] Figure 1B shows a schematic diagram of a DUV lithography apparatus 100B, which includes a beamforming and illumination system 102 and a projection system 104. In this case, DUV stands for "deep ultraviolet light" and indicates that the wavelength of the working light is between 30 nm and 250 nm. As already described with reference to Figure 1A, the beamforming and illumination system 102 and the projection system 104 may be surrounded by a room with corresponding drive devices.

[0070] The DUV lithography device 100B has a DUV light source 106B. For example, an ArF excimer laser that can provide radiation 108B in the DUV range of 193 nm can be used as the DUV light source 106B.

[0071] The beamforming and illumination system 102 shown in Figure 1B directs DUV radiation 108B onto a photomask 120. The photomask 120 is formed as a transmission optical element and can be configured outside of systems 102 and 104. The photomask 120 has a structure that images onto a wafer 124 or the like in a reduced manner via a projection system 104.

[0072] The projection system 104 has a plurality of lens elements 128 and / or mirrors 130 for imaging the photomask 120 onto the wafer 124. In this case, the individual lens elements 128 and / or mirrors 130 of the projection system 104 may be symmetrically arranged with respect to the optical axis 126 of the projection system 104. It should be noted that the number of lens elements 128 and mirrors 130 in the DUV lithography apparatus 100B is not limited to the number shown. More or fewer lens elements 128 and / or mirrors 130 may also be provided. Furthermore, the mirrors 130 are typically bent on their front side for beamforming.

[0073] The air gap between the last lens element 128 and the wafer 124 can be replaced by a liquid medium 132 with a refractive index >1. For example, the liquid medium 132 can be high-purity water. This configuration is also called immersion lithography and has higher optical lithography resolution. The medium 132 can also be called an immersion liquid.

[0074] Figure 2 shows a schematic diagram of a specific embodiment of the optical configuration 200. The optical configuration 200 is a beamforming and illumination system 102, particularly the beamforming and illumination system 102 of the EUV lithography apparatus 100A. Therefore, the optical configuration 200 can also be designated as a beamforming and illumination system, and the beamforming and illumination system 102 can be designated as an optical configuration. As described above, the optical configuration 200 can be disposed upstream of the projection system 104.

[0075] However, optical configuration 200 may also be part of DUV lithography apparatus 100B. However, it is assumed below that optical configuration 200 is part of EUV lithography apparatus 100A. In addition to optical configuration 200, Figure 2 also shows the EUV light source 106A (which emits EUV radiation 108A) and photomask 120 as described above. EUV light source 106A may be part of optical configuration 200.

[0076] Optical configuration 200 includes a plurality of mirrors 202, 204, 206, and 208. Additionally, a selective deflector 210 may be provided. The deflector 210 operates with grazing incidence and is therefore also referred to as a grazing-incidence mirror. The deflector 210 may correspond to mirror 122 shown in FIG. 1A. Mirrors 202, 204, 206, and 208 may correspond to mirrors 110, 112, 114, 116, and 118 shown in FIG. 1A. Specifically, mirror 202 corresponds to mirror 110, and mirror 204 corresponds to mirror 112.

[0077] Reflector 202 is a faceted mirror of optical configuration 200, particularly a field faceted mirror. Reflector 204 is also a faceted mirror of optical configuration 200, particularly a pupil faceted mirror. Reflector 202 reflects EUV radiation 108A to reflector 204. At least one of reflectors 206 and 208 can be a focusing mirror of optical configuration 200. The number of reflectors 202, 204, 206, and 208 is arbitrary. For example, as shown in Figure 1A, five reflectors 202, 204, 206, and 208 can be provided, namely reflectors 110, 112, 114, 116, and 118, or four reflectors 202, 204, 206, and 208 can be provided as shown in Figure 2. However, preferably, at least three reflectors 202, 204, 206, and 208 are provided, namely, a field facet reflector, a pupil facet reflector, and a focusing reflector.

[0078] Reflectors 202, 204, 206, and 208 are disposed within housing 212. Housing 212 can be in a vacuum state during operation of optical configuration 200 (especially during exposure operation). That is, reflectors 202, 204, 206, and 208 are disposed in a vacuum.

[0079] During operation of the optical configuration 200, the EUV light source 106A emits EUV radiation 108A. For example, tin plasma can be generated for this purpose. To generate tin plasma, a tin body, such as a tin bead or droplet, can be bombarded with a laser pulse. The tin plasma emits EUV radiation 108A, which is focused by a concentrator (e.g., an ellipsoidal mirror) of the EUV light source 106A and transmitted along the direction of the optical configuration 200. The concentrator focuses the EUV radiation 108A at an intermediate focal point 214. The intermediate focal point 214 can also be designated as an intermediate focal plane or located within an intermediate focal plane.

[0080] When passing through optical configuration 200, EUV radiation 108A is reflected by mirrors 202, 204, 206, 208 and deflector 210. In this case, not all mirrors 202, 204, 206, 208 are necessary. In particular, deflector 210 can be omitted. The beam path of EUV radiation 108A is indicated by element symbol 216. Photomask 120 is disposed in object plane 218 of optical configuration 200. Object field 220 is located in object plane 218.

[0081] Figure 3 shows a schematic diagram of another specific embodiment of optical configuration 400. Optical configuration 400 – similar to optical configuration 200 – is beamforming and illumination system 102, particularly the beamforming and illumination system 102 of EUV lithography device 100A. Therefore, optical configuration 400 can also be designated as beamforming and illumination system, and beamforming and illumination system 102 can be designated as optical configuration.

[0082] However, optical configuration 400 may also be part of DUV lithography apparatus 100B. However, it is assumed below that optical configuration 400 is part of EUV lithography apparatus 100A.

[0083] EUV radiation 108A emitted from radiation source 402 is focused by concentrator 404. Downstream of concentrator 404, EUV radiation 108A propagates through intermediate focal plane 406 and then incident on beam-forming faceted mirror 408 (which is used for targeted illumination of specular reflector 410). Specular reflector 410 is a reflector and can therefore also be called a reflector. By means of beam-forming faceted mirror 408 and specular reflector 410, EUV radiation 108A can be shaped such that EUV radiation 108A completely illuminates the object field 414 in object plane 412, and a predetermined (e.g., uniformly illuminated) circular boundary pupil illumination distribution (i.e., the corresponding illumination setting) appears in pupil plane 416 of projection system 104, which is located downstream of a shield.

[0084] The reflective surface of the specular reflector 410 is subdivided into individual mirrors. These individual mirrors of the specular reflector 410 are grouped to form individual mirror groups, that is, to form the facets of the specular reflector 410, according to illumination requirements. Each individual mirror group forms an illumination channel, which, on its own, does not fully illuminate the masking field in any given situation. Only the sum of all illumination channels can provide complete and uniform illumination of the masking field. The individual mirrors of the specular reflector 410 and the facets of the beam-forming facet mirror 408 can be tilted by an actuator system, thereby allowing for the setting of different fields and pupil illuminations.

[0085] Figure 4 shows a schematic plan view of a specific embodiment of the reflector 202 as explained above, which is in the form of a faceted reflector, particularly a field-faceted reflector. Reflectors 204, 408 and specular reflector 410 may also be in the form of faceted reflectors. However, only reflector 202 will be discussed below. However, all explanations relating to reflector 202 also apply to reflectors 204, 408 and specular reflector 410.

[0086] Figure 5 shows a detailed view IV according to Figure 4. Reference is made to both Figure 4 and Figure 5 below. Therefore, a faceted mirror or field faceted mirror is hereinafter referred to by element symbol 202. A coordinate system having a first spatial direction or x-direction x, a second spatial direction or y-direction y, and a third spatial direction or z-direction z is assigned to the field faceted mirror 202.

[0087] The field-faceted reflector 202 comprises multiple facets 222, only two of which are indicated by element symbols in Figure 5. The facets 222 are arranged in a pattern, a grid, or a checkerboard pattern. Specifically, this means that the facets 222 are arranged adjacent to each other in rows and on top of each other in columns. The facets 222 are preferably arranged in so-called bricks. Each brick may have 25 × 25 such facets 222. A distance of 40 to 50 μm can be provided between the facets 222 in the brick. A distance of 100 μm can be provided between individual bricks.

[0088] Specifically, facet 222 is a field facet, and is so specified hereinafter. For example, a field facet mirror 202 may contain hundreds of thousands of field facets 222. Each field facet 222 may be individually tilted. When facets 222 are assigned to mirror 204, they may also be specified as pupil facets.

[0089] In the plan view according to Figures 4 and 5, the field facet 222 can be polygonal, such as a quadrilateral. Specifically, the field facet 222 can be a square, as shown in Figure 5. If the field facet 222 is a square, it can have a side length of, for example, 1 mm. However, the field facet 222 can also be circular or hexagonal. In principle, the geometry of the field facet 222 is determined as needed. For example, the field facet 222 can also have an elongated rectangular geometry. The field facet 222 can also be curved in the plan view, particularly curved in an arcuate manner.

[0090] Figure 6 shows a significantly enlarged excerpt of the optical configuration 200 shown in Figure 2. The optical configuration 200 includes an EUV light source 106A (not shown) emitting EUV radiation 108A, an intermediate focal point 214, a field-faceted mirror 202, and a mirror 204 in the form of a pupil-faceted mirror. Mirror 204 is referred to hereinafter as the pupil-faceted mirror. Mirrors 206, 208, deflecting mirror 210, and housing 212 are not shown in Figure 6. The pupil-faceted mirror 204 is disposed at least approximately in the plane of the incident pupil of the projection system 104 or in its associated conjugate plane.

[0091] The intermediate focus 214 is the aperture stop of the EUV light source 106A. For simplicity, the following description does not distinguish between the aperture stop used to generate the intermediate focus 214 and the actual intermediate focus, i.e., the opening in the aperture stop.

[0092] The field-faceted mirror 202 includes a carrier or body 224, as described above, which carries multiple field faces 222A, 222B, 222C, 222D, 222E, and 222F. The field faces 222A, 222B, 222C, 222D, 222E, and 222F may have the same form, but may also differ from one another, particularly in the shape of their boundaries and / or the curvature of their respective optically effective surfaces 226. The optically effective surface 226 is the mirror surface. The optically effective surface 226 is planar. However, the optically effective surface 226 may also be curved.

[0093] The optically effective surface 226 is used to reflect EUV radiation 108A in the direction toward the pupil faceted mirror 204. In FIG. 6, only the optically effective surface 226 of the field facet 222A is shown as an element symbol. However, field facets 222B, 222C, 222D, 222E, and 222F also have such an optically effective surface 226. The optically effective surface 226 can be designated as a field facet surface.

[0094] The following discussion focuses only on field facet 222C. However, all interpretations of field facet 222C also apply to field facets 222A, 222B, 222D, 222E, and 222F. Therefore, only a portion of the EUV radiation 108A impacting field facet 222C is shown. However, the entire field facet reflector 202 is illuminated with the assistance of EUV light source 106A.

[0095] The pupil faceted mirror 204 includes a carrier or body 228 that carries multiple pupil facets 230A, 230B, 230C, 230D, 230E, and 230F. Each pupil facet 230A, 230B, 230C, 230D, 230E, and 230F has an optically effective surface 232, specifically a mirror surface. In Figure 6, only the optically effective surface 232 of the pupil facet 230A is symbolized. The optically effective surface 232 is suitable for reflecting EUV radiation 108A. The optically effective surface 232 can be designated as the pupil facet surface.

[0096] To switch between different pupils, the field surface 222C can be switched between different pupil facets 230A, 230B, 230C, 230D, 230E, and 230F. Specifically, for this purpose, pupil facets 230C, 230D, and 230E are assigned to the field surface 222C. This requires tilting the field surface 222C. This tilting is achieved mechanically, for example, by a tilt of up to 100 mrad.

[0097] As described above, the field surface 222C can be tilted between multiple positions or tilt positions P1, P2, P3 with the aid of an actuator (not shown) or a plurality of actuators. In the first tilt position P1, the field surface 222C images the intermediate focus 214 onto the pupil surface 230C using an imaging beam 234A (shown by dashed lines). In the second tilt position P2, the field surface 222C images the intermediate focus 214 onto the pupil surface 230D using an imaging beam 234B (shown by solid lines). In the third tilt position P3, the field surface 222C images the intermediate focus 214 onto the pupil surface 230E using an imaging beam 234C (shown by dotted lines). The corresponding pupil surfaces 230C, 230D, and 230E image the field surface 222C onto the photomask 120 (not shown here) or its vicinity.

[0098] In order for the field facet 222C to be positioned at different tilt positions P1, P2, and P3, it is necessary to allow the field facet 222C to be tilted in two spatial directions (specifically, x and y) within a plane unfolded by the x-direction and y-direction. The assignment of the field facet 222C to the pupil facets 230C, 230D, and 230E described above should not be construed as mandatory. The assignment may vary depending on the illumination setup. The pupil facets 230C, 230D, and 230E may also be tilted. Simultaneously, it is essential to dissipate the high thermal load generated by EUV radiation 108A. Further requirements include high positioning accuracy of the field facet 222C and, consequently, low sensitivity to disturbances such as temperature changes.

[0099] To achieve the highest possible fill factor for the field surface 222C, it is desirable to configure the entire actuator system, sensor system, and other mechanical components below the optically effective surface 226. To enable the implementation of the actuating elements, sensing elements, and mechanical components of the field surface 222C using conventional techniques for manufacturing microelectromechanical systems (MEMS), a layered structure of the field surface 222C can be selected.

[0100] For the typical requirements of the EUV lithography apparatus 100A, previous solutions (e.g., building on capacitive actuator systems) placed high demands on the manufacturing process. This was particularly true for the high aspect ratio of the structures to be manufactured. Therefore, a design was needed that could produce the required actuator system, sensor system, and mechanical devices for the operating field facet 222C using relatively easy and few process steps.

[0101] Figure 7 shows a schematic diagram of a specific embodiment of the optical system 300A. Figure 8 shows a schematic cross-sectional view of the optical system 300A according to section line IIX-IIX of Figure 7. Figure 9 shows another schematic cross-sectional view of the optical system 300A according to section line IX-IX of Figure 7. Reference is made to Figures 7 through 9 below.

[0102] Optical system 300A is part of optical configurations 200 and 400 as described above. Specifically, optical configurations 200 and 400 may include multiple such optical systems 300A. In particular, optical system 300A is also part of field-faceted mirror 202, pupil-faceted mirror 204, faceted mirror 408, or specular reflector 410 as described above. However, only field-faceted mirror 202 will be discussed below. However, all explanations relating to field-faceted mirror 202 apply accordingly to pupil-faceted mirror 204, faceted mirror 408, or specular reflector 410.

[0103] Optical system 300A comprises field surfaces 222A, 222B, 222C, 222D, 222E, and 222F as explained above. Optical system 300A can therefore also be designated as a field surface, a surface system, a field surface system, or a field surface device. Optical system 300A is preferably a surface system, particularly a field surface system. However, optical system 300A can also be a pupil surface system. However, in the following text, surface system is designated as optical system 300A.

[0104] The optical system 300A includes a body or substrate 302. The substrate 302 may in particular include silicon. The substrate 302 is part of or firmly connected to the body 224 of the field-faceted mirror 202. Thus, the substrate 302 forms the "fixed world" of the optical system 300A.

[0105] Furthermore, the optical system 300A includes a faceted element 304, particularly a field-faceted element, which has an optically effective surface 306. The optically effective surface 306 is a mirror surface. The optically effective surface 306 is suitable for reflecting EUV radiation 108A. The optically effective surface 306 specifically corresponds to the optically effective surface 226 according to FIG. 6.

[0106] A plurality of piezoelectric actuators 308, 310, 312, and 314 are provided in a row between the substrate 302 and the faceted element 304. The piezoelectric actuators 308, 310, 312, and 314 may also be designated as piezoelectric elements or piezoelectric actuation elements. All piezoelectric actuators 308, 310, 312, and 314 are arranged in a common plane E. Plane E is extended by the x-direction x and the y-direction y, or placed parallel to a plane extended by the x-direction x and the y-direction y.

[0107] Each piezoelectric actuator 308, 310, 312, and 314 is assigned a primary range direction H, but Figure 7 only shows the first piezoelectric actuator 308. The primary range direction H of the first piezoelectric actuator 308 is oriented in the x-direction x. In this context, the primary range direction H should be understood as the direction in which the corresponding piezoelectric actuator 308, 310, 312, and 314 has its maximum geometric range.

[0108] The first piezoelectric actuator 308 is securely connected to the substrate 302 at a connection point 316 along its entire length. The connection point 316 is located on the rear side 318 of the first piezoelectric actuator 308. The other piezoelectric actuators 310, 312, and 314 do not contact the substrate 302. The front side 320 of the first piezoelectric actuator 308 is securely connected to the second piezoelectric actuator 310 at an end-side connection point 322. The second piezoelectric actuator 310 also has a rear side 324 and a front side 326. The front side 326 is securely connected to the third piezoelectric actuator 312 at an end-side connection point 328, such that the second piezoelectric actuator 310 is positioned between the first piezoelectric actuator 308 and the third piezoelectric actuator 312. The third piezoelectric actuator 312 also includes a rear side 330 and a front side 332.

[0109] With the aid of end-side connection point 334, the fourth piezoelectric actuator 314 is connected to the front side 332 of the third piezoelectric actuator 312. The fourth piezoelectric actuator 314 also includes a rear side 336 and a front side 338. A connection portion 340 with connection point 342 protrudes from the front side 338, wherein the faceted element 304 is securely connected to the connection point 342.

[0110] Figure 10 shows a specific embodiment of the first piezoelectric actuator 308. Piezoelectric actuators 308, 310, 312, and 314 preferably have the same structure; therefore, only the first piezoelectric actuator 308 will be discussed below. The following explanation of the first piezoelectric actuator 308 also applies to piezoelectric actuators 310, 312, and 314. The first piezoelectric actuator 308 includes a carrier layer 344. The carrier layer 344 may be made of silicon, particularly polycrystalline or monocrystalline silicon. A piezoelectric layer 346 is disposed on the carrier layer 344. The piezoelectric layer 346 may be based on piezoelectric ceramics, such as lead zirconate titanate (PZT).

[0111] A piezoelectric layer 346 is placed between a first electrode 348 and a second electrode 350. In this case, the first electrode 348 is disposed between a carrier layer 344 and a piezoelectric layer 346. Electrodes 348 and 350 can be energized with the aid of a voltage source 352.

[0112] The function of the first piezoelectric actuator 308 will be explained below. The first piezoelectric actuator 308 is fixed or clamped to the left side in the direction shown in FIG. 10. When a voltage is applied to the piezoelectric layer 346 via electrodes 348 and 350, an electric field is formed within the piezoelectric layer 346. As a result, the piezoelectric layer 346 contracts or shrinks in a direction parallel to the layer plane currently unfolded by the x-direction x and y-direction y, resulting in the piezoelectric layer 346 bending upwards together with the carrier layer 344 in the direction shown in FIG. 10. The first piezoelectric actuator 308 may also be designated as a single-crystal actuator or a single-crystal piezoelectric actuator.

[0113] When a voltage is applied to the first piezoelectric actuator 308, or when the first piezoelectric actuator 308 is actuated, the first piezoelectric actuator 308 transitions from a non-deformed or non-deflected state Z1 (depicted by a solid line) to a deformed or deflected state Z2 (depicted by a dashed line). Any number of intermediate states can be provided between the non-deflected state Z1 and the deflected state Z2, thus the first piezoelectric actuator 308 can deflect continuously between the non-deflected state Z1 and the deflected state Z2. For example, the deflection of the first piezoelectric actuator 308 can be implemented in a voltage-dependent manner, such as by increasing the deflection of the first piezoelectric actuator 308 when a higher voltage is applied to electrodes 348, 350.

[0114] Returning to Figures 7 through 9, the function of the optical system 300A will now be explained. With the assistance of piezoelectric actuators 308 and 312, it is possible to tilt the faceted element 304 in the opposite manner, either about the x-direction or about an axis extending parallel to the x-direction. For example, if only the first piezoelectric actuator 308 is actuated, the faceted element 304 tilts counterclockwise about the x-direction in the direction shown in Figure 8, as indicated by the tilting motion K1.

[0115] Conversely, if only the third piezoelectric actuator 312 is actuated, the faceted element 304 tilts clockwise about the x-direction x in the direction shown in FIG. 8, as shown in FIG. 8 by means of the tilting motion K2. If both piezoelectric actuators 308 and 312 are actuated simultaneously and deflected by the same degree, the faceted element 304 performs a pure stroke motion H1 in the z-direction z without tilting about the x-direction x. By simultaneously actuating the two piezoelectric actuators 308 and 312 to produce unequal deflections, a combined motion of the faceted element 304 from the tilting motions K1 and K2 and the stroke motion H1 can be obtained.

[0116] As shown in Figure 9, with the assistance of piezoelectric actuators 310 and 314, it is possible to tilt the faceted element 304 in the opposite manner about the y-direction y or about an axis extending parallel to the y-direction y. For example, if only the second piezoelectric actuator 310 is actuated, the faceted element 304 performs a clockwise tilt about the y-direction y in the direction shown in Figure 9, as shown in Figure 9 by means of tilting motion K3.

[0117] Conversely, if only the fourth piezoelectric actuator 314 is actuated, the faceted element 304 tilts counterclockwise about the y-direction in the direction shown in FIG. 9, as shown in FIG. 9 by means of the tilting motion K4. If both piezoelectric actuators 310 and 314 are actuated simultaneously and deflected to the same degree, the faceted element 304 performs a pure stroke motion H2 in the z-direction. By simultaneously actuating the two piezoelectric actuators 310 and 314 to produce unequal deflections, a combined motion of the faceted element 304 from the tilting motions K3 and K4 and the stroke motion H2 can be obtained.

[0118] By combining the actuation of all piezoelectric actuators 308, 310, 312, and 314, it is possible to obtain combined tilt / stroke movements about the x-direction, about the y-direction, and in the z-direction. A control unit 354 is provided for actuating the piezoelectric actuators 308, 310, 312, and 314.

[0119] Due to the sequential arrangement of piezoelectric actuators 308, 310, 312, and 314 as described above, it is possible to tilt the faceted element 304 about two axes, specifically the x-direction and the y-direction, in each case in the positive and negative directions as interpreted according to tilting movements K1, K2, K3, and K4. Since multiple or all piezoelectric actuators 308, 310, 312, and 314 can be operated simultaneously, it is possible to achieve combinations of tilting movements K1, K2, K3, and K4 about the x-direction and the y-direction, thus establishing a unified two-dimensional tilting field for the faceted element 304.

[0120] Furthermore, with the assistance of stroke movements H1 and H2, the piezoelectric actuators 308, 310, 312, and 314 provide the option to move the faceted element 304 in a direction perpendicular to the optically effective surface 306, particularly along the z-direction. For example, if two piezoelectric actuators 308, 312 or 310, 314 assigned to directions x and y operate simultaneously at the same voltage, then as described above, the faceted element 304 does not tilt, but rather translates along the z-direction, particularly its respective stroke movements H1 and H2.

[0121] This also applies to the parallel operation of all four piezoelectric actuators 308, 310, 312, and 314. Therefore, the faceted element 304 has three degrees of freedom: tilting movements K1, K2, K3, and K4 about the x and y directions, and stroke movements H1 and H2 along the z direction. This property provides additional degrees of freedom, thus offering greater flexibility in setting the illumination state.

[0122] The integration of a sensing system, for example to record the deflection of piezoelectric actuators 308, 310, 312, 314, can be achieved, for example, by using capacitive elements (in the form of electrodes) or piezoresistive sensors, configured, for example, parallel to the piezoelectric actuators 308, 310, 312, 314. To implement a capacitive sensing system, electrodes can be attached to the top sides of the piezoelectric actuators 308, 310, 312, 314. Then, corresponding counter-electrodes can be attached to the bottom side of the faceted element 304. Then, when the faceted element 304 is tilted, the distance between the electrodes on the piezoelectric actuators 308, 310, 312, 314 and the electrodes on the bottom side of the faceted element 304 changes. Therefore, the capacitance changes as a function of the tilt angle of the faceted element 304. Thus, a capacitive sensor can be implemented.

[0123] When the sensing system is implemented using piezoresistive sensors, sensors 356, 358, 360, and 362 are assigned to each piezoelectric actuator 308, 310, 312, and 314. For example, sensors 356, 358, 360, and 362 are piezoresistive elements that change their resistance upon deformation. Piezoresistive sensors 356, 358, 360, and 362 can be integrated into a movable element (e.g., carrier layer 344) or applied thereto in a free position. Alternatively, piezoresistive sensors 356, 358, 360, and 362 can be located within / on top of an additional bending element parallel to piezoelectric layer 346.

[0124] Piezoelectric actuators 308 and 312 together form a first piezoelectric actuator configuration 364 of the optical system 300A, which facilitates tilting movements K1 and K2 about the x-direction. In contrast, piezoelectric actuators 310 and 314 together form a second piezoelectric actuator configuration 366 of the optical system 300A, which facilitates tilting movements K3 and K4 about the y-direction.

[0125] Figures 11 and 12 each show a schematic perspective view of another specific embodiment of the optical system 300B, wherein the faceted element 304 is not depicted in Figure 11. The difference between the optical system 300B and the optical system 300A is only that the optical system 300B represents a possible structural embodiment of the optical system 300A, which is only shown schematically in Figures 7-9.

[0126] Two strip coupling elements 368 and 370 (specifically, the first coupling element 368 and the second coupling element 370) are assigned to each piezoelectric actuator 308, 310, 312, and 314, wherein the respective piezoelectric actuators 308, 310, 312, and 314 are arranged between and securely connected to their assigned strip coupling elements. In Figure 11, only the coupling elements 368 and 370 of the first piezoelectric actuator 308 are indicated by element symbols.

[0127] The coupling elements 368 and 370 may be made of the same material as the substrate 302. Only the first coupling element 368 of the first piezoelectric actuator 308 is firmly connected to the substrate along its entire length. For example, the first coupling element 368 of the first piezoelectric actuator 308 is integrally connected to the substrate 302, particularly in terms of material.

[0128] In this example, "integral" or "monolithic" means that the substrate 302 and the first coupling element 368 of the first piezoelectric actuator 308 form a common component, rather than being assembled from different components. In this example, "integral in terms of material" means that the first coupling element 368 of the first piezoelectric actuator 308 and the substrate 302 are all made of the same material. All other coupling elements 368, 370 are not connected to the substrate 302. The function of the optical system 300B corresponds to the function of the optical system 300A.

[0129] Figures 13 and 14 each show schematic perspective views of another specific embodiment of optical system 300C, wherein the faceted element 304 is not shown in Figure 13. Structurally, optical system 300C corresponds to the structure of optical system 300B, the difference being that the cross-sectional area of ​​coupling elements 368 and 370 in optical system 300C is larger than that in optical system 300B. Optical systems 300B and 300C have the same function.

[0130] To manage high heat loads, it is advantageous to design the piezoelectric actuators 308, 310, 312, 314 and the connection points 322, 328, 334 to have the lowest possible overall thermal resistance. For this purpose, the cross-sectional areas of the connection points 322, 328, 334 should be chosen to be as large as possible. Furthermore, wide piezoelectric actuators 308, 310, 312, 314 are advantageous because they reduce thermal resistance while causing only minor damage to the maximum achievable tilt angle of the faceted element 304.

[0131] The described optical systems 300A, 300B, and 300C can be realized using conventional microelectromechanical manufacturing methods. In this case, different coating methods, microstructuring and etching techniques, and bonding methods are used to realize the three-dimensional microstructure constructed from multiple substrates (especially those made of silicon).

[0132] The advantages of optical systems 300A, 300B, and 300C are explained below. Piezoelectric actuators 308, 310, 312, and 314 facilitate the achievement of large tilt angles. These large tilt angles are achieved due to the use of piezoelectric actuators 308, 310, 312, and 314 with high force density, and because the bending of piezoelectric actuators 308, 310, 312, and 314 is directly converted into corresponding tilting movements K1, K2, K3, and K4 of the faceted element 304.

[0133] The piezoelectric actuators 308, 310, 312, and 314 require very little space, thus leaving ample room for the integration of the sensor system. For example, sensors can be provided to record the position of the faceted element 304. Therefore, an adjustment system can be constructed. The optical systems 300A, 300B, and 300C are readily manufacturable because their respective designs contain only a few structurally simple components, all arranged in a common plane E. It provides additional flexibility through the options of the stroke movements H1 and H2 of the faceted element 304.

[0134] Although the invention has been described based on exemplary embodiments, it may be modified in various ways.

[0135] 100A: EUV lithography device 100B: DUV lithography device 102: Beamforming and Illumination Systems 104: Projection System 106A: EUV light source 106B: DUV light source 108A: EUV radiation 108B: DUV radiation 110: Reflector 112: Reflector 114: Reflector 116: Reflector 118: Reflector 120: Light Mask 122: Reflector 124: Wafer 126: Optical Axis 128: Lens element 130: Reflector 132: Medium 200: Optical Configuration 202: Reflector 204: Reflector 206: Reflector 208: Reflector 210: Deflecting mirror 212: Outer shell 214: Central Focal Point 216: Beam Path 218: Object Plane 220: Object Field 222:Facet 222A-222F: Field-faceted 224: Main Body 226: Optically effective surface 228: Main Body 230A-230F: Pupil Facets 232: Optical Effective Surface 234A-234C: Imaging beam 300A-300C: Optical System 302:Substrate 304: Faceted elements 306: Optically effective surface 308: Piezoelectric actuator 310: Piezoelectric actuator 312: Piezoelectric actuator 314: Piezoelectric actuator 316: Connection point 318: Rear side 320: Front 322: Connection point 324: Rear side 326: Front 328: Connection point 330: Rear side 332: Front side 334: Connection Point 336: Rear side 338: Front 340: Connection part 342: Connection point 344: Carrier layer 346: Piezoelectric layer 348: Electrode 350: Electrode 352: Voltage source 354: Control Unit 356: Sensor 358: Sensor 360: Sensors 362: Sensor 364: Piezoelectric Actuator Configuration 366: Piezoelectric Actuator Configuration 368: Coupling element 370: Coupling element 400: Optical Configuration 402: Radiation source 404:Light collector 406: Intermediate focal plane 408: Faceted Mirror 410: Specular reflector 412: Object plane 414: Object Field 416: Pupil plane E: Plane H: Main range direction H1: Stroke motion H2: Stroke motion K1-K4: Tilt motion M1-M6: Reflectors P1-P3: Tilt position x:x direction y:y direction z: z direction Z1: Status Z2: Status

Claims

1. A faceting system for a lithography apparatus, comprising: a faceted element having an optically effective surface; a first piezoelectric actuator configuration for tilting the faceted element about a first spatial direction; and a second piezoelectric actuator configuration for tilting the faceted element about a second spatial direction perpendicular to the first spatial direction, wherein the first piezoelectric actuator configuration and the second piezoelectric actuator configuration are disposed in a common plane extending from the first spatial direction and the second spatial direction; wherein the first piezoelectric actuator configuration and / or the second piezoelectric actuator configuration are configured to perform a stroke movement of the faceted element in a third spatial direction perpendicular to the optically effective surface.

2. The faceted system as claimed in claim 1, wherein the first piezoelectric actuator is configured to include at least two piezoelectric actuators configured to selectively tilt the faceted element about the first spatial direction in two oppositely oriented tilting movements.

3. The faceted system as claimed in claim 2, wherein the second piezoelectric actuator configuration includes at least two piezoelectric actuators configured to selectively tilt the faceted element about the second spatial direction in two oppositely oriented tilting movements.

4. The faceted system as described in claim 3, wherein the piezoelectric actuators configured by the first piezoelectric actuator and the piezoelectric actuator configured by the second piezoelectric actuator are arranged in a row.

5. The faceted system as described in claim 3 or 4, wherein the piezoelectric actuators configured with the first piezoelectric actuator and the piezoelectric actuators configured with the second piezoelectric actuator are alternately configured.

6. The faceted system as described in claim 3 or 4, wherein the piezoelectric actuators configured with the first piezoelectric actuator are configured to be parallel to each other and spaced apart from each other, and wherein the piezoelectric actuators configured with the second piezoelectric actuator are also configured to be parallel to each other and spaced apart from each other.

7. The faceted system as described in claim 3 or 4, wherein the piezoelectric actuators configured with the first piezoelectric actuator and the piezoelectric actuators configured with the second piezoelectric actuator are arranged at right angles to each other.

8. The faceted system as described in claim 3 or 4 further includes a first piezoelectric actuator, a second piezoelectric actuator, a third piezoelectric actuator, and a fourth piezoelectric actuator, wherein the first piezoelectric actuator and the third piezoelectric actuator are assigned to the first piezoelectric actuator configuration, and wherein the second piezoelectric actuator and the fourth piezoelectric actuator are assigned to the second piezoelectric actuator configuration.

9. The faceted system as described in claim 8 further includes a substrate, wherein only the first piezoelectric actuator is connected to the substrate.

10. The faceted system as claimed in claim 9, wherein the first piezoelectric actuator is connected only to the substrate and the second piezoelectric actuator, wherein the second piezoelectric actuator is connected only to the first piezoelectric actuator and the third piezoelectric actuator, wherein the third piezoelectric actuator is connected only to the second piezoelectric actuator and the fourth piezoelectric actuator, wherein the fourth piezoelectric actuator is connected only to the third piezoelectric actuator and the faceted element.

11. A faceted system as described in any one of claims 1 to 4, wherein the faceted element is square in a plan view.

12. A faceted system as described in any one of claims 1 to 4, wherein a plurality of sensors are integrated into the faceted system.

13. A lithography apparatus comprising a faceting system as described in any one of claims 1 to 12.

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