Substrate processing method

Abstract

This invention relates to a substrate processing method for suppressing cracks and defects in multilayer substrates manufactured by bonding multiple substrates, and particularly to a technique for applying a filler to the gaps formed between the edges of the multiple substrates constituting the multilayer substrate. The substrate processing method includes the steps of: applying a first filler (F1) to the gap (G) between the edge (E1) of a first substrate (W1) and the edge (E2) of a second substrate (W2); and applying a second filler (F2) to the gap (G) between the edge (E1) of the first substrate (W1) and the edge (E2) of the second substrate (W2) after applying the first filler (F1); wherein the viscosity of the first filler (F1) is lower than that of the second filler (F2).

Description

Technical Field

[0001] This invention relates to a substrate processing method that suppresses cracking and defects in a multilayer substrate manufactured by bonding multiple substrates, and particularly to a technique for applying a filler to the gaps formed between the edges of the multiple substrates constituting the multilayer substrate. Prior Technology

[0002] In recent years, to achieve further increases in the density and functionality of semiconductor devices, a three-dimensional mounting technology is being developed that integrates multiple substrates in three dimensions. In this three-dimensional mounting technology, for example, the component side of a first substrate, on which integrated circuits and electrical wiring are formed, is bonded to the component side of a second substrate, also on which integrated circuits and electrical wiring are formed. Furthermore, after bonding the first substrate to the second substrate, the second substrate is thinned using a grinding or lapping apparatus. In this way, integrated circuits can be deposited in a direction perpendicular to the component sides of both the first and second substrates.

[0003] In three-dimensional mounting technology, three or more substrates can be bonded together. For example, after thinning a second substrate that has been bonded to a first substrate, a third substrate can be bonded to the second substrate, and then the third substrate can be thinned again. In this specification, the form of multiple substrates that have been bonded together is sometimes referred to as a "layered substrate".

[0004] To prevent cracking or peeling, the edges of the substrate are typically pre-ground into rounded or chamfered shapes. If a second substrate with this shape is ground, a sharp edge is formed on it. This sharp edge (hereinafter referred to as the cutting edge) is formed by the back surface of the ground second substrate and its outer peripheral surface. Such a cutting edge is prone to damage due to physical contact, potentially causing breakage of the laminate itself during transport. Furthermore, if the first and second substrates are not properly bonded, the second substrate may crack during grinding.

[0005] Therefore, to prevent cracking (fissures) and defects (peeling) of the cutting edge, a filler is applied to the edge of the multilayer substrate before grinding the second substrate. The filler is applied in the gap between the edge of the first substrate and the edge of the second substrate. The filler supports the cutting edge formed after grinding the second substrate, preventing cracking and defects of the cutting edge. [Previous Technical Documents] [Patent Literature]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 5-304062 Summary of the Invention

[0007] [The problem that the invention aims to solve] However, when the filler is applied to the gap between the edges of the first substrate and the second substrate, there is a particular issue where the filler cannot penetrate the tiny gaps near the bonding surfaces of the multilayer substrates. Furthermore, the filled filler may dissolve due to the processing solutions used in subsequent processing steps such as polishing or cleaning. If the filler dissolves, there are concerns that this could damage the multilayer substrate during subsequent processing steps, negatively impacting both the multilayer substrate and the process performance.

[0008] Therefore, the purpose of this invention is to provide a substrate processing method that can reliably fill the gap between the edge of the first substrate and the edge of the second substrate in a short time without adverse effects on subsequent processing steps, and can properly protect the edge of the multilayer substrate.

[0009] [Methods for solving problems] In one embodiment, a substrate processing method is provided, which involves applying a filler to a multilayer substrate formed by bonding a first substrate and a second substrate. The method includes: applying a first filler to the gap between the edge of the first substrate and the edge of the second substrate; and applying a second filler to the gap after applying the first filler; wherein the viscosity of the first filler is lower than that of the second filler. In one embodiment, the aforementioned substrate processing method further includes: a step of hardening the aforementioned first filler after coating the first filler; the step of coating the second filler is performed after the aforementioned first filler has hardened. In one state sample, the aforementioned first filler contains particles, the diameter of which is less than 1 μm.

[0010] In one state, the aforementioned second filler contains particles, and the diameter of the aforementioned particles contained in the aforementioned second filler is greater than the diameter of the aforementioned particles contained in the aforementioned first filler. In the first state sample, the aforementioned first filler does not contain particles. In one state sample, the viscosity of the aforementioned first filler is less than 5 Pa·s. In one sample, the width of the first filler applied in the radial direction is smaller than the width of the second filler applied in the radial direction.

[0011] In one embodiment, the aforementioned substrate processing method further includes: a step of applying a third filler to the aforementioned gap after applying the aforementioned second filler; and a subsequent processing step of processing the aforementioned multilayer substrate after applying the aforementioned third filler; wherein the aforementioned third filler has chemical resistance and will not dissolve due to the processing liquid used in the aforementioned subsequent processing step. In one embodiment, the aforementioned substrate processing method further includes the step of applying a third filler to the aforementioned gap after applying the aforementioned second filler; wherein the viscosity of the aforementioned third filler is higher than that of the aforementioned second filler. In one embodiment, the aforementioned substrate processing method further includes: a step of hardening the aforementioned coated second filler after coating the aforementioned second filler; the step of coating the aforementioned third filler is performed after the aforementioned second filler has hardened. In one sample, the width of the previously coated second filler in the radial direction is greater than the width of the previously coated third filler in the radial direction.

[0012] In one embodiment, a substrate processing method is provided, which involves applying a filler to a multilayer substrate formed by bonding a first substrate and a second substrate. The method includes: applying a first filler to the gap between the edges of the first substrate and the edges of the second substrate; applying a second filler to the gap after applying the first filler; and a subsequent processing step of processing the multilayer substrate after applying the second filler. The second filler has chemical resistance and will not dissolve due to the processing liquid used in the subsequent processing step. In one embodiment, the aforementioned substrate processing method further includes: a step of hardening the aforementioned first filler after coating the first filler; the step of coating the second filler is performed after the aforementioned first filler has hardened. In one state sample, the aforementioned first filler contains particles, the diameter of which is less than 1 μm. In the first state sample, the aforementioned first filler does not contain particles.

[0013] In one embodiment, the steps of applying the first filler and the second filler are performed while rotating the aforementioned stacked substrate, which is kept in a longitudinal position. In one embodiment, the aforementioned step of applying the third filler is performed while rotating the aforementioned laminated substrate, which is held vertically.

[0014] [Effects of the Invention] According to the present invention, by applying multiple layers of fillers with different viscosities and particle diameters to the gap between the edges of the first substrate and the edges of the second substrate, the filler can be reliably filled into the gap in a short time. Furthermore, by applying a filler with chemical resistance that will not dissolve due to the processing liquid used in subsequent processing steps, there will be no adverse effects in subsequent processing steps, and the edges of the multilayer substrate can be properly protected. Simple Explanation of the Diagram

[0015] Figure 1A is an enlarged cross-sectional view of the edge of the display substrate. Figure 1B is an enlarged cross-sectional view of the edge of the display substrate. Figure 2 is an enlarged cross-sectional view showing the edge of the multilayer substrate. Figure 3 is an enlarged cross-sectional view showing the edge of a multilayer substrate without filler in the tiny gaps. Figure 4 is a top view of one embodiment of the display substrate processing apparatus. Figure 5 is a side view of one embodiment of the display substrate processing apparatus. Figure 6 is a schematic diagram showing one embodiment of the coating apparatus. Figure 7 is a flowchart of one embodiment of the display substrate processing method. Figure 8 is an enlarged cross-sectional view of the edge of a multilayer substrate filled with the first filler and the second filler. Figure 9 is a top view of another embodiment of the display substrate processing apparatus. Figure 10 is a flowchart of another embodiment of the display substrate processing method. Figure 11 is an enlarged cross-sectional view of the edge of a multilayer substrate filled with the first, second and third fillers. Figure 12 is an enlarged cross-sectional view showing another embodiment of the edge portion of a multilayer substrate filled with the first filler and the second filler. Figure 13 is a schematic diagram showing another embodiment of the filler coating module. Figure 14 is a top view of another embodiment of the display substrate processing apparatus. Figure 15 is a side view of the substrate processing apparatus shown in Figure 14. Figure 16 is a side view of another embodiment of the display substrate processing apparatus. Figure 17 is a view taken from the direction indicated by arrow A in Figure 16. Figure 18 is a side view of another embodiment of the display substrate processing apparatus. Figure 19 is a view taken from the direction indicated by arrow B in Figure 18. Implementation

[0016] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Figures 1A and 1B are enlarged cross-sectional views of the edge portion E of substrate W. Specifically, Figure 1A is a cross-sectional view of a so-called straight-angle substrate W, and Figure 1B is a cross-sectional view of a so-called round-corner substrate W. The edge portion E is the outermost surface inclined relative to the flat surfaces (surface and back) of substrate W, and it has an arc shape or a chamfered shape. In substrate W of Figure 1A, the edge portion E is the outermost peripheral surface of substrate W formed by the upper inclined portion (upper inclined surface) B1, the lower inclined portion (lower inclined surface) B2, and the apex portion B3. In substrate W of Figure 1B, the edge portion E is the portion with a curved cross-section constituting the outermost peripheral surface of substrate W. The edge portion E is sometimes also referred to as the inclined surface.

[0017] Figure 2 is an enlarged cross-sectional view of the multilayer substrate Ws. The multilayer substrate Ws has a structure in which a first substrate W1 and a second substrate W2 are joined at a bonding surface P. In this embodiment, the first substrate W1 and the second substrate W2 are circular. The multilayer substrate Ws of this embodiment has the structure formed by joining a rounded first substrate W1 and a second substrate W2 as shown in Figure 1B. However, in one embodiment, the multilayer substrate Ws may also have the structure formed by joining a beveled first substrate W1 and a second substrate W2 as shown in Figure 1A. In this specification, the edge portion of the multilayer substrate Ws refers to the outer edge portion of the multilayer substrate Ws including the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2. Edge portions E1 and E2 are sometimes also referred to as beveled portions. A gap G is formed between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2. This gap G is formed around the entire circumference of the multilayer substrate Ws.

[0018] The filler applied to the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2 mainly consists of a binder, a solvent, and particles, with the particles dispersed in the binder dissolved in the solvent. The purpose of using the particles is to increase the volume of the filler and adjust its viscosity. The gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2 becomes very small, especially near the bonding surface P of the multilayer substrate Ws. Figure 3 is an enlarged cross-sectional view showing the edge of the multilayer substrate Ws where the tiny inner end of the gap G is not filled with filler F. If the viscosity of filler F is high, filler F will not enter the tiny inner end of the gap G, resulting in an area Fn without filler F.

[0019] Therefore, in this embodiment, by applying fillers with different viscosities, even the tiny gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 can be reliably coated with fillers.

[0020] Figure 4 is a top view showing one embodiment of the substrate processing apparatus 1, and Figure 5 is a side view showing one embodiment of the substrate processing apparatus 1. The substrate processing apparatus 1 is an apparatus for filling a first filler F1 and a second filler F2 onto a multilayer substrate Ws formed by bonding a first substrate W1 and a second substrate W2. The substrate processing apparatus 1 includes: a filler coating module 9 configured to coat the first filler F1 and the second filler F2 onto the multilayer substrate Ws; and an operation control unit 10 for controlling the operation of the filler coating module 9. The filler coating module 9 includes: a substrate holding unit 2 for holding the multilayer substrate Ws; a first coating device 3A for coating the first filler F1; a second coating device 3B for coating the second filler F2; and a curing device 4 for curing the coated first filler F1 and second filler F2.

[0021] The substrate holding section 2 is a stage that holds the back side of the multilayer substrate Ws by vacuum adsorption. The filler coating module 9 further includes: a rotation shaft 7 connected to the central part of the substrate holding section 2; and a rotation mechanism 8 that rotates the substrate holding section 2 and the rotation shaft 7. The multilayer substrate Ws is placed on the substrate holding section 2 with the center of the multilayer substrate Ws aligned with the axis of the rotation shaft 7. The rotation mechanism 8 includes a motor (not shown in the figure), and as shown in Figure 4, the rotation mechanism 8 is configured such that the substrate holding section 2 and the multilayer substrate Ws rotate together in the direction indicated by the arrow, with the central axis Cr of the multilayer substrate Ws as the center.

[0022] The first coating apparatus 3A is located radially outside the laminated substrate Ws on the substrate holding portion 2, and is configured to apply a first filler F1 to the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2 on the laminated substrate Ws. The second coating apparatus 3B is located radially outside the laminated substrate Ws on the substrate holding portion 2, and is configured to apply a second filler F2 to the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2 on the laminated substrate Ws. In this embodiment, the first coating apparatus 3A is disposed upstream of the second coating apparatus 3B in the rotational direction of the laminated substrate Ws. However, in one embodiment, the first coating apparatus 3A may also be disposed downstream of the second coating apparatus 3B in the rotational direction of the laminated substrate Ws.

[0023] Figure 6 is a schematic diagram showing one embodiment of the coating apparatus. Figure 6 illustrates the configuration of the first coating apparatus 3A. The first coating apparatus 3A includes: a syringe 21 that dispenses a first filler F1; a piston 22 that can move back and forth within the syringe 21; and a horizontal movement mechanism (not shown) that moves the syringe 21 closer to or further away from the multilayer substrate Ws. This horizontal movement mechanism allows adjustment of the distance between the multilayer substrate Ws and the filler outlet 21a of the first coating apparatus 3A. In one embodiment, the horizontal movement mechanism may be omitted. In this case, the distance between the multilayer substrate Ws and the filler outlet 21a is predetermined in order to properly inject the first filler F1 into the gap G of the multilayer substrate Ws.

[0024] The syringe 21 has a hollow structure, which is configured to be internally filled with a first filler F1. A piston 22 is disposed inside the syringe 21. The syringe 21 has a filler nozzle 21a at its front end for dispensing the first filler F1. The front end of the syringe 21, including the filler nozzle 21a, can also be configured to be detachable. The shape of the filler nozzle 21a can be selected appropriately according to the physical properties (e.g., viscosity) of the first filler F1 to be coated. The filler nozzle 21a is configured to face the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2.

[0025] The first coating apparatus 3A is connected to a gas supply source via a gas supply line 25. If gas (e.g., dry air or nitrogen) is supplied from the gas supply source to the syringe 21, the piston 22 advances within the syringe 21. As the piston 22 advances, the first filler F1 within the syringe 21 is ejected from the filler nozzle 21a.

[0026] A pressure regulating device 26 and an on / off valve 27 are provided on the gas supply line 25. The on / off valve 27 is an actuator-driven valve such as an electric valve or a solenoid valve. When the on / off valve 27 is opened, gas is supplied from the gas supply source to the first coating apparatus 3A, and the first coating apparatus 3A coats the first filler F1 onto the multilayer substrate Ws. When the on / off valve 27 is closed, the gas supply to the first coating apparatus 3A is stopped, thereby stopping the coating of the first filler F1. The pressure regulating device 26 can adjust the amount of the first filler F1 discharged from the filler nozzle 21a per unit time by adjusting the gas pressure supplied from the gas supply source to the first coating apparatus 3A. The operation of the pressure regulating device 26 and the on / off valve 27 is controlled by the operation control unit 10.

[0027] Figure 6 illustrates the configuration of the first coating apparatus 3A, but the second coating apparatus 3B has the same configuration as the first coating apparatus 3A, so its description is omitted. The second coating apparatus 3B is configured such that a second filler F2 is filled inside the syringe 21, and the second filler F2 is coated onto the multilayer substrate Ws. The operation of the second coating apparatus 3B is controlled by the operation control unit 10. In one embodiment, the gas supply source connected to the second coating apparatus 3B may be the same as the gas supply source connected to the first coating apparatus 3A. In this case, the gas supply source may be connected to the gas supply line 25 of the first coating apparatus 3A and the gas supply line 25 of the second coating apparatus 3B, respectively.

[0028] In one embodiment, the first coating apparatus 3A and the second coating apparatus 3B may also be equipped with a screw feeder to replace the combination of syringe 21 and piston 22.

[0029] As shown in Figures 4 and 5, the curing device 4 is located radially outside the laminated substrate Ws on the substrate holding portion 2. The curing device 4 is disposed downstream of the first coating apparatus 3A and the second coating apparatus 3B in the rotation direction of the laminated substrate Ws, and is configured to cure the first filler F1 and the second filler F2 coated onto the laminated substrate Ws by the first coating apparatus 3A and the second coating apparatus 3B. The first filler F1 and the second filler F2 can be cured by the curing device 4 while the laminated substrate Ws is rotated. In this embodiment, the first filler F1 and the second filler F2 are thermosetting fillers. Examples of such fillers include thermosetting resins.

[0030] The curing device 4 is an air heater configured to blow hot air toward the first filler F1 and the second filler F2 coated on the multilayer substrate Ws. The curing device 4 is configured to allow adjustment of the air pressure and temperature of the blown hot air. The first filler F1 and the second filler F2, heated by the hot air, harden due to a cross-linking reaction. If the first filler F1 and the second filler F2 contain solvent, the solvent will evaporate upon heating. The curing device 4 is not limited to an air heater; it can also be a lamp heater or other configurations, as long as it can heat the first filler F1 and the second filler F2 to harden them.

[0031] In this embodiment, the first filler F1 and the second filler F2 are thermosetting fillers. However, in another embodiment, the first filler F1 and the second filler F2 may also be UV-curing fillers. In this case, the curing device 4 may also be a UV irradiation device that cures the first filler F1 and the second filler F2 by irradiating them with ultraviolet light. When the first filler F1 and the second filler F2 contain solvent, they may also be heated using an air heater or the like to evaporate the solvent.

[0032] The operation of the filler coating module 9, which includes the first coating device 3A, the second coating device 3B, the hardening device 4, the rotating mechanism 8, the pressure adjusting device 26, and the on / off valve 27, is controlled by the motion control unit 10. The motion control unit 10 is composed of at least one computer. The motion control unit 10 includes: a memory device 10a, which stores a program for controlling the operation of the filler coating module 9; and a processing device 10b, which executes calculations according to the commands contained in the program. The memory device 10a includes a main memory device such as random access memory (RAM) and an auxiliary memory device such as a hard disk drive (HDD) or a solid-state drive (SSD). Examples of the processing device 10b include a central processing unit (CPU) and a graphics processing unit (GPU). However, the specific configuration of the motion control unit 10 is not limited to these examples.

[0033] Figure 7 is a flowchart of one embodiment of the display substrate processing method. In step S101, the motion control unit 10 issues a command to the rotation mechanism 8 of the filler coating module 9 to rotate the substrate holding unit 2 and the laminated substrate Ws at a predetermined rotation speed. In step S102, the motion control unit 10 issues a command to the on / off valve 27 connected to the first coating apparatus 3A, causing the on / off valve 27 to open and supply gas to the first coating apparatus 3A from the gas supply source. This action injects the first filler F1 into the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2 of the rotating multilayer substrate Ws. Alternatively, after applying the first filler F1, the syringe 21 of the first coating apparatus 3A can be moved away from the multilayer substrate Ws. In step S103, the motion control unit 10 issues a command to the hardening device 4 of the filler coating module 9 to heat the laminated substrate Ws so that the coated first filler F1 hardens.

[0034] In step S104, the motion control unit 10 issues a command to the on / off valve 27 connected to the second coating apparatus 3B, causing the on / off valve 27 to open and supply gas to the second coating apparatus 3B from the gas supply source. This action injects the second filler F2 into the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2 of the rotating multilayer substrate Ws. The second filler F2 is applied by overlapping the hardened first filler F1. Alternatively, after applying the second filler F2, the syringe 21 of the second coating apparatus 3B can be moved away from the multilayer substrate Ws. In step S105, the motion control unit 10 issues a command to the hardening device 4 of the filler coating module 9 to heat the laminated substrate Ws so that the coated second filler F2 hardens.

[0035] Figure 8 is an enlarged cross-sectional view of the multilayer substrate Ws filled with first filler F1 and second filler F2. The second filler F2 is coated in a manner that covers the first filler F1 in the radial direction outside of the first filler F1. The first filler F1 and the second filler F2 are composed of binder, solvent and particles, with the particles dispersed in the binder dissolved in the solvent.

[0036] Examples of adhesives include inorganic adhesives containing alkali metal silicates and organic adhesives composed of polysiloxane or epoxy resins. Adhesives may also contain solvents. Examples of particles include inorganic particles such as silica and alumina.

[0037] The viscosity of the first filler F1 is lower than that of the second filler F2. The gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2 becomes very small, especially near the bonding surface P of the laminated substrates Ws. Since fillers with low viscosity can easily enter these small gaps, the first filler F1 can also have a low viscosity of 5 Pa·s or less. The viscosities of the first filler F1 and the second filler F2 can be adjusted by the amount of solvent, the amount of particles, and the particle diameter. In one embodiment, the first filler F1 may also be particle-free.

[0038] The radial width x1 of the first coated filler F1 is smaller than the radial width x2 of the second coated filler F2. In one embodiment, the volume of the first coated filler F1 is smaller than the volume of the second coated filler F2. For fillers with low viscosity, the amount of solvent contained is greater, resulting in a smaller volume of filled filler after curing. Therefore, when filling the same volume of filler, a lower viscosity filler requires a larger coating amount than a higher viscosity filler. Furthermore, a large amount of solvent needs to evaporate. Therefore, when filling the same volume of filler, the coating and curing time for a lower viscosity filler is longer than that for a higher viscosity filler. Therefore, by coating a second filler F2, which has a higher viscosity than the first filler F1, into a volume larger than the first filler F1, the filler can be filled in a shorter time.

[0039] The thickness of the first filler F1 (the dimension along the thickness direction of the laminated substrate Ws) can be 10 μm or less. In one example, the particle diameter of the first filler F1 is 1 μm or less. This allows the first filler F1 to fill the vicinity of the bonding surface P without gaps. The particle diameter of the second filler F2 is greater than that of the particles in the first filler F1. The larger particle diameter can efficiently increase the volume of the second filler F2 and improve its mechanical strength.

[0040] In one embodiment, the first filler F1 and / or the second filler F2 may also be free of particles.

[0041] Next, another embodiment of the substrate processing method will be described. The multilayer substrate Ws, filled with the first filler F1 and the second filler F2, will be processed through subsequent processing steps such as a polishing step (e.g., chemical mechanical polishing) and a cleaning step. The polishing step involves supplying polishing slurry to the polishing surface while sliding the multilayer substrate Ws against the polishing surface, thereby polishing the surface of the multilayer substrate Ws. The cleaning step involves supplying cleaning slurry to the polished multilayer substrate Ws to clean its surface.

[0042] Subsequent processing steps will use alkaline polishing slurry and acidic cleaning solution. The second filler F2 is located at the outermost edge of the gap G in the multilayer substrate Ws and may dissolve due to the processing solution used in subsequent processing steps. If the second filler F2 dissolves, there are concerns that it may damage the multilayer substrate Ws and adversely affect the performance of the multilayer substrate and the process.

[0043] Therefore, in this embodiment, a filler with chemical resistance that will not dissolve due to the processing liquid used in subsequent processing steps is further coated on the outer layer in the radial direction, thereby effectively protecting the multilayer substrate Ws.

[0044] Figure 9 is a top view showing another embodiment of the substrate processing apparatus 1. Unless otherwise specified, the configuration of the substrate processing apparatus 1 in this embodiment is the same as that of the substrate processing apparatus 1 in the embodiments described above with reference to Figures 4 and 5, therefore, a repetition of the description is omitted. In this embodiment, the filler coating module 9 further includes a third coating device 3C, which is used to coat the third filler F3 onto the multilayer substrate Ws.

[0045] The third coating apparatus 3C is located radially outside the laminated substrate Ws on the substrate holding portion 2, and is configured to apply the third filler F3 to the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2 of the laminated substrate Ws. In this embodiment, the third coating apparatus 3C is disposed downstream of the first coating apparatus 3A and the second coating apparatus 3B in the rotational direction of the laminated substrate Ws, but the positional relationship of the first coating apparatus 3A, the second coating apparatus 3B, and the third coating apparatus 3C is not limited to this. In one embodiment, the third coating apparatus 3C may also be disposed upstream of the first coating apparatus 3A and the second coating apparatus 3B in the rotational direction of the laminated substrate Ws.

[0046] The third coating apparatus 3C has the same configuration as the first coating apparatus 3A described with reference to FIG6, therefore its repeated description is omitted. The third coating apparatus 3C is configured such that a third filler F3 is filled inside the syringe 21, and the third filler F3 is coated onto the multilayer substrate Ws. The operation of the third coating apparatus 3C is controlled by the operation control unit 10. In one embodiment, the gas supply source connected to the third coating apparatus 3C may also be the same as the gas supply source connected to the first coating apparatus 3A. In this case, the gas supply source may also be connected to the gas supply line 25 of the first coating apparatus 3A and the gas supply line 25 of the third coating apparatus 3C respectively.

[0047] In one embodiment, the first coating apparatus 3A, the second coating apparatus 3B, and the third coating apparatus 3C may also be equipped with screw feeders to replace the combination of syringe 21 and piston 22.

[0048] Figure 10 is a flowchart of another embodiment of the display substrate processing method. In step S201, the motion control unit 10 issues a command to the rotation mechanism 8 of the filler coating module 9 to rotate the substrate holding unit 2 and the laminated substrate Ws at a predetermined rotation speed. In step S202, the motion control unit 10 issues a command to the on / off valve 27 connected to the first coating apparatus 3A, causing the on / off valve 27 to open and supply gas to the first coating apparatus 3A from the gas supply source. This action injects the first filler F1 into the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2 of the rotating multilayer substrate Ws. Alternatively, after applying the first filler F1, the syringe 21 of the first coating apparatus 3A can be moved away from the multilayer substrate Ws. In step S203, the motion control unit 10 issues a command to the hardening device 4 of the filler coating module 9 to heat the laminated substrate Ws so that the coated first filler F1 hardens.

[0049] In step S204, the motion control unit 10 issues a command to the on / off valve 27 connected to the second coating apparatus 3B, causing the on / off valve 27 to open and supply gas to the second coating apparatus 3B from the gas supply source. This action injects the second filler F2 into the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2 of the rotating multilayer substrate Ws. The second filler F2 is applied by overlapping the hardened first filler F1. Alternatively, after applying the second filler F2, the syringe 21 of the second coating apparatus 3B can be moved away from the multilayer substrate Ws. In step S205, the motion control unit 10 issues a command to the hardening device 4 of the filler coating module 9 to heat the laminated substrate Ws so that the coated second filler F2 hardens.

[0050] In step S206, a command is issued to the on / off valve 27 connected to the third coating apparatus 3C, causing the valve 27 to open and supply gas to the third coating apparatus 3C from the gas supply source. This action injects the third filler F3 into the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2 of the rotating multilayer substrate Ws. The third filler F3 is applied by overlapping the hardened second filler F2. Alternatively, after applying the third filler F3, the syringe 21 of the third coating apparatus 3C can be moved away from the multilayer substrate Ws. In step S207, the motion control unit 10 issues a command to the hardening device 4 of the filler coating module 9 to heat the laminated substrate Ws so that the coated third filler F3 hardens.

[0051] Figure 11 is an enlarged cross-sectional view of a multilayer substrate Ws filled with a first filler F1, a second filler F2, and a third filler F3. The second filler F2 is located radially outside the first filler F1 and is coated to cover the first filler F1. The third filler F3 is located radially outside the second filler F2 and is coated to cover the second filler F2. The first filler F1 and the second filler F2 are the same as those described with reference to FIG8, so their description is omitted. The third filler F3 is composed of a binder, a solvent, and particles, with the particles dispersed in the binder dissolved in the solvent. In one embodiment, the third filler F3 may also be free of particles.

[0052] Examples of adhesives include inorganic adhesives containing alkali metal silicates and organic adhesives composed of polysiloxane or epoxy resins. Adhesives may also contain solvents. Examples of particles include inorganic particles such as silica and alumina.

[0053] The third filler, F3, possesses chemical resistance and will not dissolve due to the treatment solutions used in subsequent processing steps. The term "will not dissolve" here not only means that the third filler, F3, will not dissolve at all, but also includes that the third filler, F3, will not collapse.

[0054] The radial width x1 of the first coated filler F1 is smaller than the radial width x2 of the second coated filler F2. In one embodiment, the volume of the first coated filler F1 is smaller than the volume of the second coated filler F2. Low-viscosity fillers contain more solvent, resulting in a smaller final filler volume after curing. Therefore, when filling the same volume of filler, a lower-viscosity filler requires a larger coating amount than a higher-viscosity filler. Furthermore, a large amount of solvent needs to evaporate. Therefore, when filling the same volume of filler, the coating and curing time for a lower-viscosity filler is longer than that for a higher-viscosity filler. Therefore, by coating a second filler F2, which has a higher viscosity than the first filler F1, into a volume larger than the first filler F1, filler can be filled in a shorter time.

[0055] The width x2 of the coated second filler F2 in the radial direction is greater than the width x3 of the coated third filler F3 in the radial direction. In one embodiment, the volume of the coated second filler F2 is greater than the volume of the coated third filler F3. If the volume of the third filler F3, which has high chemical resistance to the processing solution used in subsequent processing steps, is large, it will be difficult to easily remove the third filler F3 from the multilayer substrate Ws in subsequent steps. Therefore, by coating the third filler F3 to a volume smaller than that of the second filler F2, the second filler F2 can be properly protected in subsequent processing steps, and the third filler F3 can be easily removed from the multilayer substrate Ws.

[0056] Referring to the embodiments illustrated in Figures 9 to 11, the use of three different fillers is not particularly limited to fillers having the aforementioned properties. In one embodiment, the three fillers are fillers with different viscosities, with the second filler F2 having a higher viscosity than the first filler F1, and the third filler F3 having a higher viscosity than the second filler F2. The viscosities of the first filler F1, the second filler F2, and the third filler F3 can be adjusted by the type of binder, the amount of solvent, the amount of particles, the particle diameter, etc.

[0057] Figure 12 is an enlarged cross-sectional view showing another embodiment of the edge of the multilayer substrate Ws filled with the first filler F1 and the second filler F2. In this embodiment, a third filler F3, which has chemical resistance as described with reference to Figure 11, is coated as the second filler F2. The configuration of the substrate processing apparatus 1 in this embodiment is the same as that of the substrate processing apparatus 1 in the embodiment described with reference to Figures 4 and 5, therefore, its repeated description is omitted.

[0058] The second filler F2 is located radially outside the first filler F1, and it is applied in a manner that covers the first filler F1. The first filler F1 and the second filler F2 are composed of a binder, a solvent, and particles, with the particles dispersed in the binder dissolved in the solvent.

[0059] Examples of adhesives include inorganic adhesives containing alkali metal silicates and organic adhesives composed of polysiloxane or epoxy resins. Adhesives may also contain solvents. Examples of particles include inorganic particles such as silica and alumina.

[0060] The thickness of the first filler F1 (the dimension along the thickness direction of the laminated substrate Ws) can be 10 μm or less. In one example, the particle diameter of the first filler F1 is 1 μm or less. In this way, the first filler F1 fills the vicinity of the bonding surface P without gaps.

[0061] The second filler F2 possesses chemical resistance, meaning it will not dissolve due to the processing solutions used in subsequent processing steps. The term "will not dissolve" here refers not only to the complete dissolution of the second filler F2 but also to its non-substantial degradation. In subsequent steps where the filler is further removed from the multilayer substrate Ws, the radial width x2 of the coated second filler F2 can also be a width that does not impede the removal of the second filler F2.

[0062] In one embodiment, the first filler F1 and / or the second filler F2 may also be free of particles.

[0063] Figure 13 is a schematic diagram showing another embodiment of the coating apparatus. In this embodiment, the filler coating module 9 has only one coating device 3. The configuration of the filler coating module 9, unless otherwise specified, is the same as that of the first coating device 3A described with reference to Figure 6, so its repeated description is omitted.

[0064] The coating apparatus 3, as illustrated in FIG8, is a coating apparatus for coating the first filler F1 and the second filler F2. The syringe 21 of the coating apparatus 3 is sequentially filled with the first filler F1 and the second filler F2, starting from the side near the filler nozzle 21a.

[0065] The coating apparatus 3 is connected to a gas supply source via a gas supply line 25. When gas (e.g., dry air or nitrogen) is supplied from the gas supply source to the syringe 21, the piston 22 advances within the syringe 21. Due to the advance of the piston 22, the first filler F1 within the syringe 21 is ejected first from the filler nozzle 21a. Once the first filler F1 has been completely ejected, the second filler F2 is then ejected from the filler nozzle 21a.

[0066] The coating apparatus 3, as illustrated in FIG11, can also be configured to coat the first filler F1, the second filler F2, and the third filler F3. In this case, the syringe 21 of the coating apparatus 3 is sequentially filled with the first filler F1, the second filler F2, and the third filler F3, starting from the side closest to the filler nozzle 21a.

[0067] According to this embodiment, only one coating device 3 is required, so the device configuration is not complicated and there is no need to replace the syringe 21, thus reducing the number of processes.

[0068] In another embodiment of the filler coating module 9, the first filler F1, the second filler F2 and the third filler F3 can also be filled into different syringes 21. By changing the syringes 21 installed in the filler coating module 9, the filler to be coated can be changed.

[0069] Figure 14 is a top view showing another embodiment of the substrate processing apparatus 1. Figure 15 is a side view of the substrate processing apparatus 1 shown in Figure 14. The configuration of this embodiment, unless otherwise specified, is the same as that of the embodiment described with reference to Figures 4 and 5, and therefore, repeated descriptions are omitted. In this embodiment, the filler coating module 9 includes a substrate holding device 30 instead of the substrate holding part 2, the rotating shaft 7, and the rotating mechanism 8.

[0070] The substrate holding device 30 includes: three or more rollers 31 (four in this embodiment) that can contact the periphery of the laminated substrate Ws; a roller rotation mechanism (not shown) that rotates each roller 31 around its axis; and a roller moving mechanism (not shown) that moves each roller 31. In this embodiment, the substrate holding device 30 includes four rollers 31, but the substrate holding device 30 may also include three or five or more rollers.

[0071] Four rollers 31 are arranged around the reference center point O of the substrate holding device 30. The rollers 31 contact the periphery of the laminated substrate Ws, forming a horizontal holding configuration for the laminated substrate Ws. That is, the laminated substrate Ws is held in a horizontally positioned state by means of the rollers 31 of the substrate holding device 30. As shown in FIG14, if the laminated substrate Ws is held in a horizontally positioned state by means of the rollers 31 of the substrate holding device 30, the upper and lower surfaces of the laminated substrate Ws are respectively located within virtual surfaces extending in the horizontal direction.

[0072] The roller rotation mechanism is connected to four rollers 31, and its configuration allows the four rollers 31 to rotate in the same direction at the same speed. The roller rotation mechanism can be configured arbitrarily as long as it allows three or more rollers 31 to rotate in the same direction at the same speed; conventional rotating mechanisms can be used. Examples of roller rotation mechanisms include combinations of motors, pulleys (and / or gears), and rotating belts.

[0073] The roller moving mechanism is connected to four rollers 31, which are configured to move each roller 31 in a direction approaching the reference center point O of the substrate holding device 30 and in a direction away from the reference center point O. By means of the roller moving mechanism, the four rollers 31 can be moved between a holding position (see the solid line in Figure 14) in which the rollers 31 hold the periphery of the multilayer substrate Ws and a release position (see the dotted line in Figure 14) in which the multilayer substrate Ws is released from the rollers 31.

[0074] The configuration of the roller moving mechanism can be arbitrary as long as it allows the four rollers 31 to move between the holding position and the releasing position. Conventional moving mechanisms can be used as roller moving mechanisms. Examples of roller moving mechanisms include combinations of piston cylinder mechanisms and ball screws with motors (stepper motors).

[0075] The roller rotation mechanism and roller movement mechanism of the substrate holding device 30 are electrically connected to the motion control unit 10. The motion control unit 10 is configured to control the operation of the roller rotation mechanism and roller movement mechanism of the substrate holding device 30.

[0076] The laminated substrate Ws is transported by a transport device (not shown) to a position where the axis of the laminated substrate Ws coincides with the reference center point O of the substrate holding device 30. At this time, the rollers 31 are in the released position. Next, the roller moving mechanism moves the four rollers 31 to the holding position, thereby holding the periphery of the laminated substrate Ws on the four rollers 31. Through this action, the laminated substrate Ws is held on the four rollers 31 in a horizontally placed state. The roller rotating mechanism rotates the four rollers 31 that have moved to the holding position, thereby rotating the laminated substrate Ws around its axis.

[0077] If the four rollers 31 in the holding position are moved to the release position by the roller moving mechanism, the four rollers 31 will move away from the periphery of the multilayer substrate Ws, thus releasing the multilayer substrate Ws from the four rollers 31. The released multilayer substrate Ws is then transported by a transport device (not shown in the figure) for the next process.

[0078] The coating of the first filler F1 by the first coating apparatus 3A, the coating of the second filler F2 by the second coating apparatus 3B, and the curing of the first filler F1 and the second filler F2 by the curing apparatus 4 are performed while rotating the multilayer substrate Ws held horizontally by the substrate holding apparatus 30.

[0079] In one embodiment, the roller rotation mechanism may be configured such that only a portion of the rollers 31 rotate. For example, it may be configured such that the roller rotation mechanism is connected to two of the four rollers 31, causing the two rollers 31 to rotate in the same direction at the same speed. In this case, the other two rollers 31 are free to rotate. When the four rollers 31 are positioned in the holding position, if the two rollers 31 connected to the roller rotation mechanism rotate, the other two rollers 31 will rotate in conjunction with the rollers 31 connected to the roller rotation mechanism through the laminated substrate Ws.

[0080] In one embodiment, the roller moving mechanism may be configured to move only a portion of the rollers 31. For example, it may be configured such that the roller moving mechanism is connected to two of the four rollers 31, allowing these two rollers 31 to move between a holding position and a releasing position. In this case, the other two rollers 31 are pre-fixed in the holding position. The laminated substrate Ws is transported by a transport device to a position where it contacts the two fixed rollers 31 at its periphery. The roller moving mechanism moves the two rollers 31 connected to it to the holding position, thereby holding the laminated substrate Ws in a horizontally positioned state. The roller moving mechanism also moves the two rollers 31 connected to it to the releasing position, thereby releasing the laminated substrate Ws.

[0081] In the above embodiment, the substrate holding part 2 and the roller 31 of the substrate holding device 30 are configured to hold the multilayer substrate Ws horizontally. That is, the multilayer substrate Ws is held in a horizontally placed state by the substrate holding part 2 or the roller 31 of the substrate holding device 30. The coating of the first filler F1 performed by the first coating apparatus 3A and the coating of the second filler F2 performed by the second coating apparatus 3B (and the coating of the third filler F3 performed by the third coating apparatus 3C) are performed while rotating the multilayer substrate Ws, which is held horizontally by the roller 31 of the substrate holding part 2 or the substrate holding device 30. However, as long as the first filler F1, the second filler F2 (and the third filler F3) can be coated in the gap G, the method of holding the multilayer substrate Ws is not limited to the above embodiment. For example, the filler coating module 9 may also have a substrate holding part or a substrate holding device configured to hold the multilayer substrate Ws in a vertical state. If the laminated substrate Ws is kept in a longitudinal position, the upper and lower surfaces of the laminated substrate Ws are located in virtual planes extending in a vertical direction perpendicular to the horizontal direction.

[0082] Figure 16 is a side view showing another embodiment of the substrate processing apparatus 1. Figure 17 is a view taken from the direction indicated by arrow A in Figure 16. The configuration of this embodiment, unless otherwise specified, is the same as that of the embodiment described with reference to Figures 4 and 5, therefore, repeated descriptions are omitted. Figure 16 is a view taken from the back side of the multilayer substrate Ws. In this embodiment, the filler coating module 9 replaces the substrate holding part 2, the rotating shaft 7, and the rotating mechanism 8 with a substrate holding part 35, a rotating shaft 36, and a rotating mechanism 38.

[0083] The substrate holding portion 35 is configured to hold the back side of the multilayer substrate Ws by vacuum adsorption. As shown in FIG17, the holding surface 35a of the substrate holding portion 35 holding the back side of the multilayer substrate Ws is a surface perpendicular to the horizontal plane. The multilayer substrate Ws is held in a state perpendicular to the horizontal plane. That is, the multilayer substrate Ws is held in a vertically placed state by means of the substrate holding portion 35.

[0084] The rotation axis 36 is connected to the central portion of the substrate holding portion 35. The laminated substrate Ws is held on the substrate holding portion 35 with its center aligned with the axis of the rotation axis 36. The rotation mechanism 38 includes a motor (not shown in the figure), and as shown in Figure 16, the rotation mechanism 38 is configured to rotate the substrate holding portion 35 and the laminated substrate Ws together in the direction indicated by the arrow, with the central axis Cr of the laminated substrate Ws as the center.

[0085] The filler coating module 9 includes: a first coating device moving mechanism (not shown) for moving the first coating device 3A; and a second coating device moving mechanism (not shown) for moving the second coating device 3B. The first and second coating device moving mechanisms are connected to the first coating device 3A and the second coating device 3B respectively, and are configured to move the first coating device 3A and the second coating device 3B between a position where filler coating is performed and a standby position where filler coating is stopped. For example, the standby position of the first coating device 3A and the second coating device 3B is set at a position further away from the multilayer substrate Ws than the coating position to avoid interfering with the operation of other equipment such as the transport of the multilayer substrate Ws.

[0086] In this embodiment, the coating positions of the first coating apparatus 3A and the second coating apparatus 3B are located above the multilayer substrate Ws held on the substrate holding portion 35 and facing the gap G of the multilayer substrate Ws. If the first coating apparatus 3A or the second coating apparatus 3B in the coating position dispenses filler, the filler falls towards the gap G of the multilayer substrate Ws, resulting in the filler being coated in the gap G of the multilayer substrate Ws. In this embodiment, the standby position is set to a position further outward in the radial direction from the coating position than the coating position. Figures 16 and 17 show the state in which the first coating apparatus 3A is positioned in the coating position.

[0087] The substrate holding part 35, the rotating mechanism 38, the first coating device moving mechanism and the second coating device moving mechanism are electrically connected to the motion control part 10, and the motion of the substrate holding part 35, the rotating mechanism 38, the first coating device moving mechanism and the second coating device moving mechanism is controlled by the motion control part 10.

[0088] When the first filler F1 is applied by the first coating apparatus 3A, the first coating apparatus moving mechanism moves the first coating apparatus 3A to the coating position. During the application of the first filler F1 by the first coating apparatus 3A, the second coating apparatus 3B is positioned in a standby position. The first coating apparatus moving mechanism can also be configured to adjust the distance between the first coating apparatus 3A and the multilayer substrate Ws. For example, in order to properly inject the first filler F1 into the gap G of the multilayer substrate Ws, the operation control unit 10 can also adjust the distance between the first coating apparatus 3A and the multilayer substrate Ws by means of the first coating apparatus moving mechanism according to the physical properties of the first filler F1, such as viscosity.

[0089] After the first filler F1 is applied by the first coating apparatus 3A, when the second filler F2 is to be applied by the second coating apparatus 3B, the first coating apparatus moving mechanism moves the first coating apparatus 3A to the standby position, and the second coating apparatus moving mechanism moves the second coating apparatus 3B to the coating position. The second coating apparatus moving mechanism can also be configured to adjust the distance between the second coating apparatus 3B and the multilayer substrate Ws. For example, in order to properly inject the second filler F2 into the gap G of the multilayer substrate Ws, the motion control unit 10 can also adjust the distance between the second coating apparatus 3B and the multilayer substrate Ws by means of the second coating apparatus moving mechanism according to the physical properties such as the viscosity of the second filler F2.

[0090] The coating of the first filler F1 performed by the first coating apparatus 3A, the coating of the second filler F2 performed by the second coating apparatus 3B, and the curing of the first filler F1 and the second filler F2 performed by the curing apparatus 4 are carried out while the longitudinally placed multilayer substrate Ws is rotated by the substrate holding part 35.

[0091] In one embodiment, the filler coating module 9 may not have a first coating device moving mechanism and a second coating device moving mechanism. Instead, the first coating device 3A and the second coating device 3B are arranged adjacent to each other above the multilayer substrate Ws held on the substrate holding portion 35. In this case, the distance between the first coating device 3A and the multilayer substrate Ws and the distance between the second coating device 3B and the multilayer substrate Ws can be predetermined so that the first filler F1 and the second filler F2 can be properly injected into the gap G of the multilayer substrate Ws.

[0092] As shown in Figure 16, the curing device 4 is located radially outside the laminated substrate Ws held on the substrate holding portion 35. The curing device 4 is disposed downstream of the coating positions of the first coating device 3A and the second coating device 3B in the rotation direction of the laminated substrate Ws, and is configured to cure the first filler F1 and the second filler F2 coated on the laminated substrate Ws by the first coating device 3A and the second coating device 3B.

[0093] Figure 18 is a side view showing another embodiment of the substrate processing apparatus 1. Figure 19 is a view taken from the direction indicated by arrow B in Figure 18. The configuration of this embodiment, unless otherwise specified, is the same as that of the embodiment described with reference to Figures 16 and 17, and therefore, repeated descriptions are omitted. In this embodiment, the filler coating module 9 includes a substrate holding device 40 instead of the substrate holding part 35, the rotating shaft 36, and the rotating mechanism 38.

[0094] The substrate holding device 40 includes: three or more rollers 41 (four in this embodiment) that can contact the periphery of the laminated substrate Ws; a roller rotation mechanism (not shown) that rotates each roller 41 around its axis; and a roller moving mechanism (not shown) that moves each roller 41. In this embodiment, the substrate holding device 40 includes four rollers 41, but the substrate holding device 40 may also include three or five or more rollers.

[0095] Four rollers 41 are arranged around the reference center point O of the substrate holding device 40. The rollers 41 contact the periphery of the laminated substrate Ws, forming a vertical holding configuration for the laminated substrate Ws. That is, the laminated substrate Ws is held in a longitudinally positioned state by means of the rollers 41 of the substrate holding device 40. As shown in FIG18, if the laminated substrate Ws is held in a longitudinally positioned state by means of the rollers 41 of the substrate holding device 40, then the upper and lower surfaces of the laminated substrate Ws are respectively located within virtual planes extending in the vertical direction.

[0096] The roller rotation mechanism is connected to four rollers 41, and its configuration causes the four rollers 41 to rotate in the same direction and at the same speed. The configuration of the roller rotation mechanism can be arbitrary, as long as three or more rollers 41 rotate in the same direction and at the same speed; conventional rotation mechanisms can be used. Examples of roller rotation mechanisms include combinations of motors, pulleys (and / or gears), and rotating belts.

[0097] The roller movement mechanism is connected to four rollers 41, and is configured to allow each roller 41 to move in a direction approaching the reference center point O of the substrate holding device 40 and in a direction moving away from the reference center point O. The roller movement mechanism allows the four rollers 41 to move between a holding position (see solid lines in Figure 18) where the rollers 41 hold the periphery of the laminated substrate Ws, and a release position (see dotted lines in Figure 18) where the laminated substrate Ws is released from the rollers 41. The roller movement mechanism can be configured arbitrarily as long as it allows the four rollers 41 to move between the holding and release positions; conventional movement mechanisms can be used. Examples of roller movement mechanisms include combinations of piston-cylinder mechanisms and ball screws with motors (stepper motors).

[0098] The roller rotation mechanism and roller movement mechanism of the substrate holding device 40 are electrically connected to the motion control unit 10, and the operation of the roller rotation mechanism and roller movement mechanism of the substrate holding device 40 is controlled by the motion control unit 10.

[0099] The laminated substrate Ws is transported by a transport device (not shown) to a position where the axis of the laminated substrate Ws coincides with the reference center point O of the substrate holding device 40. At this time, the rollers 41 are in the released position. Next, the roller moving mechanism moves the four rollers 41 to the holding position, thereby holding the periphery of the laminated substrate Ws on the four rollers 41. Through this action, the laminated substrate Ws is held on the four rollers 41 in a longitudinally placed state. The roller rotating mechanism rotates the four rollers 41 that have moved to the holding position, thereby rotating the laminated substrate Ws around its axis.

[0100] If the four rollers 41 in the holding position are moved to the release position by the roller moving mechanism, the four rollers 41 will move away from the periphery of the multilayer substrate Ws, thus releasing the multilayer substrate Ws from the four rollers 41. The released multilayer substrate Ws is then transported via a transport device (not shown in the figure) for the next process.

[0101] The coating of the first filler F1 performed by the first coating apparatus 3A, the coating of the second filler F2 performed by the second coating apparatus 3B, and the curing of the first filler F1 and the second filler F2 performed by the curing apparatus 4 are carried out while rotating the stacked substrate Ws held vertically by the substrate holding apparatus 40.

[0102] In one embodiment, the roller rotation mechanism can also be configured to rotate only a portion of the rollers 41. For example, the roller rotation mechanism can be connected to two of the four rollers 41, causing the two rollers to rotate in the same direction at the same speed. In this case, the other two rollers 41 are in a free-rotating state. When the four rollers 41 are positioned in the holding position, if the two rollers 41 connected to the roller rotation mechanism rotate, the other two rollers 41 will rotate through the laminated substrate Ws in conjunction with the two rollers 41 connected to the roller rotation mechanism.

[0103] In one embodiment, the roller moving mechanism can also be configured to move only a portion of the rollers 41. For example, the roller moving mechanism can be connected to two of the four rollers 41, moving these two rollers 41 between a holding position and a releasing position. In this case, the other two rollers 41 are pre-fixed in the holding position. The laminated substrate Ws is transported by a transport device to a position where its periphery contacts the two fixed rollers 41. By moving the two rollers 41 connected to the roller moving mechanism to the holding position using the roller moving mechanism, the laminated substrate Ws can be held in a longitudinally positioned state. By moving the two rollers 41 connected to the roller moving mechanism to the releasing position using the roller moving mechanism, the laminated substrate Ws can be released.

[0104] The embodiments illustrated with reference to Figures 14 to 19 can also be applied to the embodiments illustrated with reference to Figures 9 and 13. For example, in the embodiment illustrated with reference to Figure 9, the embodiments illustrated with reference to Figures 16 and 17 can be used to apply the coating of the first filler F1 performed by the first coating apparatus 3A, the coating of the second filler F2 performed by the second coating apparatus 3B, the coating of the third filler F3 performed by the third filling apparatus 3C, and the curing of the first filler F1, the second filler F2, and the third filler F3 performed by the curing apparatus 4, while rotating the laminated substrate Ws held vertically by the substrate holding portion 35.

[0105] The purpose of describing the above embodiments is to enable those skilled in the art to implement the present invention. Anyone skilled in the art can naturally perform various modifications of the above embodiments, and the technical concept of the present invention can also be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is interpreted as encompassing the maximum scope of the technical concept defined according to the claims. [Industry availability]

[0106] The present invention can be used in a substrate processing method to suppress cracking and defects in multilayer substrates manufactured by bonding multiple substrates, and in particular in the gaps formed between the edges of the multiple substrates constituting the multilayer substrate by applying a filler.

[0107] 1: Substrate processing device 2: Substrate holding section 3: Coating device 3A: First Coating Unit 3B: Second Coating Unit 3C: Third Coating Device 4: Hardening device 7: Rotation axis 8: Rotating mechanism 9: Filler Coating Module 10: Motion Control Department 10a: Memory device 10b: Processing device 21: Syringe 21a: Filler spray nozzle 22: Piston 25: Gas supply line 26: Pressure regulating device 27: On / off valve 30: Substrate holding device 31: Roller 35: Substrate holding section 35a: Maintain surface 36: Rotation axis 38: Rotating mechanism 40: Substrate holding device 41: Roller A: Arrow B: Arrow B1: Upper sloping part B2: Lower sloping section B3: Side Cr: Central axis E: Edge E1: Edge E2: Edge F: Filler F1: First filler F2: Second filler F3: Third filler Fn: Region G: Gap P: Joint surface x1: Width x2: Width x3: Width W: substrate W1: 1st substrate W2: 2nd substrate Ws: Multilayer substrate

Claims

1. A substrate processing method comprising applying a filler to a multilayer substrate formed by bonding a first substrate and a second substrate, the method comprising: applying a first filler to the gap between the edges of the first substrate and the edges of the second substrate; hardening the first filler after applying the first filler; and applying a second filler to the gap after applying the first filler; wherein, The aforementioned step of applying the second filler is performed after the aforementioned first filler has hardened, and the viscosity of the aforementioned first filler is lower than that of the aforementioned second filler.

2. The substrate processing method of claim 1, wherein the first filler comprises particles, the particle diameter being less than 1 μm.

3. The substrate processing method of claim 2, wherein the second filler comprises particles, and the diameter of the particles contained in the second filler is greater than the diameter of the particles contained in the first filler.

4. The substrate processing method of claim 1, wherein the aforementioned first filler does not contain particles.

5. The substrate processing method of claim 1, wherein the viscosity of the aforementioned first filler is 5 Pa·s or less.

6. The substrate processing method of claim 1, wherein the width of the first filler applied in the radial direction is smaller than the width of the second filler applied in the radial direction.

7. The substrate processing method of claim 1 further includes: a step of applying a third filler to the aforementioned gap after applying the aforementioned second filler; and a subsequent processing step of processing the aforementioned multilayer substrate after applying the aforementioned third filler; wherein the aforementioned third filler has chemical resistance and will not dissolve due to the processing liquid used in the aforementioned subsequent processing step.

8. The substrate processing method of claim 1 further includes: a step of applying a third filler to the aforementioned gap after applying the aforementioned second filler; wherein the viscosity of the aforementioned third filler is higher than that of the aforementioned second filler.

9. The substrate processing method of claim 7 further includes: a step of hardening the aforementioned coated second filler after applying the aforementioned second filler; the step of applying the aforementioned third filler is performed after the aforementioned second filler has hardened.

10. The substrate processing method of claim 7, wherein the width of the previously coated second filler in the radial direction is greater than the width of the previously coated third filler in the radial direction.

11. A substrate processing method comprising applying a filler to a multilayer substrate formed by bonding a first substrate and a second substrate, the method comprising: applying a first filler to a gap between an edge portion of the first substrate and an edge portion of the second substrate; applying a second filler to the gap after applying the first filler; and a subsequent processing step of processing the multilayer substrate after applying the second filler; wherein the second filler has chemical resistance and is not dissolved by a processing liquid used in the subsequent processing step.

12. The substrate processing method of claim 11 further includes: a step of hardening the first filler after coating the first filler; the step of coating the second filler is performed after the first filler has hardened.

13. The substrate processing method of claim 11 or 12, wherein the first filler comprises particles, the particle diameter being less than 1 μm.

14. The substrate processing method of claim 11 or 12, wherein the aforementioned first filler does not contain particles.

15. The substrate processing method of claim 1 or 11, wherein the steps of applying the first filler and the second filler are performed while rotating the aforementioned stacked substrate which is held vertically.

16. The substrate processing method of claim 7, wherein the step of applying the third filler is performed while rotating the aforementioned multilayer substrate which is held longitudinally.

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