Closed-loop temperature control system and temperature control method thereof

Abstract

This invention provides a closed-loop temperature control system and a temperature control method using the closed-loop temperature control system. The closed-loop temperature control system includes a main heating plate, a temperature compensation unit, a main control unit, a power regulation unit, a power feedback unit, and a temperature feedback unit. The main control unit, the power regulation unit, and the temperature compensation unit are sequentially and electrically connected, the power feedback unit is connected in parallel with the power regulation unit, and the temperature feedback unit is electrically connected to the main control unit and the temperature compensation unit. This enables dual closed-loop control of power and temperature, and effectively controls the temperature uniformity of the semiconductor substrate with minimal manufacturing and maintenance costs.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a closed-loop temperature control system and temperature control method. Prior Technology

[0002] Currently, substrate baking equipment is frequently used in semiconductor substrate processing. In the heating and baking process, the temperature uniformity of the substrate is crucial to achieving the desired process parameters. Existing technologies, such as the Chinese patent application with publication number CN103792974A, employ optimized heater heating circuitry and appropriately increased heater partitions to improve the temperature uniformity of the hot plate.

[0003] However, increasing the number of heater zones will significantly increase the heater development cycle and R&D costs, significantly increase the cost of the temperature control component, occupy more installation hardware space, and impose stricter control requirements on the heater manufacturing process, which may lead to a decrease in heater yield and thus increase heater costs.

[0004] This approach, which involves optimizing the heating circuit by adding zones, results in more wiring designs, making the wiring more complex and increasing the difficulty of designing the surrounding structure of the heater.

[0005] Therefore, it is necessary to develop new closed-loop temperature control systems and temperature control methods to solve the above-mentioned problems existing in the current technology. Summary of the Invention

[0006] The purpose of this invention is to provide a closed-loop temperature control system and a temperature control method using the closed-loop temperature control system, so as to effectively control the temperature uniformity of a semiconductor substrate with the lowest possible manufacturing and maintenance costs.

[0007] To achieve the above objectives, the closed-loop temperature control system of the present invention includes: Main heating plate; A temperature compensation unit is provided corresponding to the main heating plate; The main control unit includes a main control unit, a power regulation unit, a power feedback unit, and a temperature feedback unit; The main control unit is electrically connected to the main heating plate for temperature regulation; The main control unit, the power adjustment unit, and the temperature compensation unit are electrically connected in sequence. Under the control of the main control unit, the power adjustment unit outputs compensation control information that can drive the temperature compensation unit to adjust the temperature of the main heating plate. The power feedback unit is electrically connected in parallel with the power regulation unit to send the compensation control message in opposite phase to the power regulation unit; The temperature feedback unit is electrically connected to the main control unit and the temperature compensation unit to collect real-time temperature information from the temperature compensation unit and feed it back to the main control unit.

[0008] The beneficial effects of the closed-loop temperature control system of the present invention are as follows: In the main control unit, the main control unit, the power adjustment unit, and the temperature compensation unit are sequentially and electrically connected. Under the control of the main control unit, the power adjustment unit outputs a compensation control message that can drive the temperature compensation unit to perform temperature compensation adjustment on the main heating plate. The power feedback unit is connected in parallel with the power adjustment unit to send the compensation control message in opposite phase to the power adjustment unit to realize power closed-loop control. The temperature feedback unit is electrically connected to the main control unit and the temperature compensation unit to collect real-time temperature information from the temperature compensation unit and feed it back to the main control unit to realize temperature closed-loop control. It can be seen that the closed-loop temperature control system can realize dual closed-loop control of power and temperature, and can effectively control the temperature uniformity of the semiconductor substrate with minimal manufacturing and maintenance costs.

[0009] Preferably, the power feedback unit and the power regulation unit form a closed-loop negative feedback.

[0010] Preferably, the power adjustment unit includes a pulse width modulation unit to adjust the duty cycle according to the pulse width modulation signal output by the main control unit and output the compensation control message.

[0011] More preferably, the power feedback unit includes an output feedback optocoupler electrically connected in parallel with the pulse width modulation unit to feed back an inverted pulse width modulation signal to the pulse width modulation unit as an inverted compensation control message.

[0012] More preferably, the closed-loop temperature control system further includes an alarm unit electrically connected to the output feedback optocoupler and the pulse width modulation unit, so as to obtain and determine whether to output an alarm message by comparing the first duty cycle information of the pulse width modulation signal output by the pulse width modulation unit and the second duty cycle information of the pulse width modulation signal output by the output feedback optocoupler.

[0013] Preferably, the closed-loop temperature control system further includes a uniformity feedback unit electrically connected to the main control unit and the main heating plate, in order to acquire and feed back real-time temperature information of the main heating plate to the main control unit.

[0014] Preferably, the closed-loop temperature control system further includes a signal isolation unit electrically connected to the main control unit and the power regulation unit, so as to isolate the signal output by the main control unit before sending it to the power regulation unit.

[0015] More preferably, the signal isolation unit is an optical isolation unit or a magnetic coupling isolation unit.

[0016] Preferably, the temperature compensation unit includes at least one sub-temperature compensation unit, and the at least one sub-temperature compensation unit is respectively arranged corresponding to different areas of the main heating plate.

[0017] The temperature control method of the present invention includes: A closed-loop temperature control system is provided, comprising a main heating plate, a temperature compensation unit, and a main control unit. The temperature compensation unit is correspondingly arranged with respect to the main heating plate, and the main control unit includes a main control unit, a power adjustment unit, a power feedback unit, and a temperature feedback unit. The temperature of the main heating plate is adjusted by the main control unit. The main control unit controls the power adjustment unit, causing the power adjustment unit to output compensation control messages to drive the temperature compensation unit to perform temperature compensation adjustment on the main heating plate. The power feedback unit acquires and sends an inverse compensation control message to the power regulation unit according to the compensation control message, so as to realize closed-loop control of the compensation control message; The temperature feedback unit acquires and feeds back the real-time temperature information of the temperature compensation unit to the main control unit. The main control unit adjusts the control information output to the power regulation unit according to the real-time temperature information of the temperature compensation unit to achieve closed-loop temperature control.

[0018] The beneficial effects of the temperature control method described in this invention are as follows: the power feedback unit acquires and sends an inverse compensation control message to the power adjustment unit according to the compensation control message, thereby achieving closed-loop control of the compensation control message; the temperature feedback unit acquires and feeds back the real-time temperature message of the temperature compensation unit to the main control unit; the main control unit adjusts the control message output to the power adjustment unit according to the real-time temperature message of the temperature compensation unit, thereby achieving closed-loop temperature control. It can be seen that the temperature control method can achieve dual closed-loop control of power and temperature, and can effectively control the temperature uniformity of the semiconductor substrate with minimal manufacturing and maintenance costs.

[0019] Preferably, the step of controlling the power adjustment unit through the main control unit includes: sending a pulse width modulation signal to the pulse width modulation unit through the main control unit; the power adjustment unit adjusting the duty cycle of the pulse width modulation signal and outputting a pulse width modulation signal as the compensation control message.

[0020] Preferably, the step of the main control unit adjusting the control message output to the power regulation unit according to the real-time temperature information of the temperature compensation unit includes: the main control unit adjusting the pulse width modulation signal according to the real-time temperature information of the temperature compensation unit through a PID control algorithm.

[0021] Preferably, the temperature control method further includes: the alarm unit acquiring a first duty cycle message of the pulse width modulation signal output by the pulse width modulation unit and a second duty cycle message of the pulse width modulation signal output by the output feedback optocoupler; the alarm unit determining that the first duty cycle message and the second duty cycle message are non-complementary messages, and then outputting an alarm message.

[0022] Preferably, the main control unit pre-stores target temperature information, and the temperature control method further includes: after the main control unit controls the power adjustment unit to drive the output power of each of the sub-temperature compensation units to 0, the power adjustment unit sequentially drives each of the sub-temperature compensation units to perform temperature compensation adjustment on the main heating plate with a specific output power, and performs temperature uniformity adjustment according to the acquired real-time information and the target temperature information.

[0023] More preferably, the real-time information includes multiple average real-time temperature messages of different regions in the main heating plate and temperature response messages of each of the sub-temperature compensation units to the main heating plate. The step of adjusting the temperature uniformity based on the acquired real-time information includes: the uniformity feedback unit acquiring and feeding back the multiple average real-time temperature messages to the main control unit; the temperature feedback unit acquiring and feeding back the temperature response messages to the main control unit; the main control unit generating multiple sets of initial temperature compensation messages based on the multiple average real-time temperature messages, the temperature response messages, and the target temperature messages, and performing iterative calculations on each set of initial compensation messages until multiple sets of temperature compensation messages are obtained. Simple Explanation of the Diagram

[0024] Figure 1 is a first functional block diagram of a closed-loop temperature control system according to an embodiment of the present invention; Figure 2 is a second functional block diagram of the closed-loop temperature control system according to an embodiment of the present invention; Figure 3 is a third functional block diagram of the closed-loop temperature control system according to an embodiment of the present invention; Figure 4 is a fourth functional block diagram of the closed-loop temperature control system according to an embodiment of the present invention. Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making progressive efforts are within the scope of protection of the present invention. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art to which this invention pertains. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, but does not exclude other elements or objects.

[0026] Existing technologies typically employ zoned control of the main heating plate to adjust its temperature uniformity. For example, the main heating plate may be divided into seven, thirteen, or fifteen zones. Considering the layout requirements of functional components and wiring limitations, the number of zones on the main heating plate cannot be infinitely large; each zone includes multiple temperature sampling points. For instance, if the temperature uniformity of a certain zone, such as the first zone, does not meet process requirements and temperature adjustment is needed, the first zone will be controlled to increase its temperature. However, this adjustment introduces the following problems: the average temperature of some temperature sampling points within the first zone may be lower than the target temperature, while the temperature of some of these sampling points may be higher than the target temperature, and the temperature difference between them is highly likely to be distinct. Even within temperature-controlled areas where the temperature is lower than the target temperature, the temperature difference between them and the target temperature is also highly likely to be distinct. Therefore, adjusting the temperature of a single zone can easily cause temperature unevenness again across the entire main heating plate.

[0027] In addition, the aforementioned zone control method requires independent temperature control for each zone, which significantly increases the cost of the temperature control component, and the more detailed the zoning, the higher the cost.

[0028] The present invention provides a closed-loop temperature control system and a temperature control method using the closed-loop temperature control system to effectively control the temperature uniformity of a semiconductor substrate with minimal manufacturing and maintenance costs.

[0029] Figure 1 is a first functional block diagram of a closed-loop temperature control system according to an embodiment of the present invention.

[0030] Referring to Figure 1, the closed-loop temperature control system shown in Figure 1 includes a main control unit consisting of a main control unit 11, a power adjustment unit 12, a power feedback unit 15, and a temperature feedback unit 16, a temperature compensation unit 13, and a main heating plate 14.

[0031] In some embodiments, referring to FIG1, the main control unit 11 is electrically connected to the main heating plate 14 for temperature regulation.

[0032] In some specific embodiments, the main control unit 11 is a host computer electrically connected to the main heating plate 14. The specific structure of the main heating plate 14 and the communication mode between the host computer and the main heating plate 14 are common knowledge to those skilled in the art.

[0033] In some embodiments, the temperature compensation unit 13 is provided correspondingly to the main heating plate 14.

[0034] In some specific embodiments, the temperature feedback unit 16 is a resistance temperature detector (RTD) sensor.

[0035] In some embodiments, referring to FIG1, the main control unit 11, the power adjustment unit 12 and the temperature compensation unit 13 are electrically connected in sequence. Under the control of the main control unit 11, the power adjustment unit 12 outputs a compensation control message that can drive the temperature compensation unit 13 to perform temperature compensation adjustment on the main heating plate 14, so as to realize power closed-loop control.

[0036] Furthermore, the power feedback unit 15 is electrically connected in parallel with the power adjustment unit 12 to send the compensation control message in opposite phase to the power adjustment unit 12, forming a closed-loop negative feedback. The temperature feedback unit 16 is electrically connected to the main control unit 11 and the temperature compensation unit 13 to collect real-time temperature information from the temperature compensation unit 13 and feed it back to the main control unit 11 to achieve closed-loop temperature control. As can be seen, the closed-loop temperature control system shown in Figure 1 can achieve dual closed-loop control of power and temperature, and can effectively control the temperature uniformity of the semiconductor substrate with minimal manufacturing and maintenance costs.

[0037] In some embodiments, the power adjustment unit 12 includes a pulse width modulation unit to adjust the duty cycle according to the pulse width modulation signal output by the main control unit 11 and output the compensation control message.

[0038] In some embodiments, the pulse width modulation unit is an AC pulse width modulation unit or a DC pulse width modulation unit.

[0039] In some specific embodiments, the AC pulse width modulation unit is an AC power regulator.

[0040] In some specific embodiments, the DC pulse width modulation unit is a DC power regulator.

[0041] In some embodiments, the temperature compensation unit 13 includes at least one sub-temperature compensation unit, which is respectively arranged in different areas of the main heating plate 14.

[0042] In some embodiments, the power feedback unit 15 is an output feedback optocoupler electrically connected in parallel with the pulse width modulation unit, so as to feed back the inverted pulse width modulation signal to the pulse width modulation unit as the inverted compensation control message.

[0043] Figure 2 is a second functional block diagram of the closed-loop temperature control system according to an embodiment of the present invention.

[0044] Referring to Figures 1 and 2, compared to the closed-loop temperature control system shown in Figure 1, the closed-loop temperature control system shown in Figure 2 further includes an alarm unit 17 electrically connected to the power feedback unit 15 and the power regulation unit 12. This alarm unit acquires and determines whether to output an alarm message by comparing a first duty cycle message of the pulse width modulation signal output by the pulse width modulation unit with a second duty cycle message of the pulse width modulation signal output by the output feedback optocoupler. Specifically, the power feedback unit 15 is the output feedback optocoupler, and the power regulation unit 12 is the pulse width modulation unit.

[0045] In some embodiments, the alarm unit 17 may also be electrically connected to the main control unit 11, and the main control unit 11 may decide whether to adjust the signal sent to the power regulation unit 12 based on the alarm message.

[0046] In some specific embodiments, the alarm unit 17 is a gate logic chip.

[0047] In some specific embodiments, the alarm unit 17 is an OR gate logic chip.

[0048] Figure 3 is a third functional block diagram of the closed-loop temperature control system according to an embodiment of the present invention.

[0049] Referring to Figures 1 and 3, compared to the closed-loop temperature control system shown in Figure 1, the closed-loop temperature control system shown in Figure 3 further includes a uniformity feedback unit 18 electrically connected to the main control unit 11 and the main heating plate 14, in order to obtain and feed back the real-time temperature information of the main heating plate 14 to the main control unit 11.

[0050] In some embodiments, the uniformity feedback unit 18 comprises a temperature-sensing wafer and temperature sensors electrically connected to different regions of the temperature-sensing wafer. The temperature-sensing wafer is bonded to the main heating plate 14 to achieve heat conduction between them. The temperature sensors in different regions are all electrically connected to the main control unit 11 to collect and feed back the average temperature of different regions of the temperature-sensing wafer to the main control unit 11.

[0051] Figure 4 is a fourth functional block diagram of the closed-loop temperature control system according to an embodiment of the present invention.

[0052] Referring to Figures 1 and 4, compared to the closed-loop temperature control system shown in Figure 1, the closed-loop temperature control system shown in Figure 4 further includes a signal isolation unit 19 electrically connected to the main control unit 11 and the power regulation unit 12, so as to isolate the signal output by the main control unit 11 before sending it to the power regulation unit 12.

[0053] In some embodiments, the signal isolation unit 19 is an optical isolation unit or a magnetic coupling isolation unit.

[0054] In some specific embodiments, the optical isolation unit is an optical coupler, used to optically isolate the signals output by the main control unit 11.

[0055] In some specific embodiments, the magnetic coupling isolation unit is a magnetic coupling isolator to magnetically isolate the signals output by the main control unit 11.

[0056] This invention also provides a temperature control method implemented through the closed-loop temperature control system, comprising: S1: The temperature of the main heating plate 14 is adjusted by the main control unit 11; S2: The main control unit 11 controls the power adjustment unit 12, causing the power adjustment unit 12 to output compensation control messages to drive the temperature compensation unit 13 to perform temperature compensation adjustment on the main heating plate 14;

[0057] In some embodiments, referring to FIG3, during the execution of step S2, step S3 is also executed: the power feedback unit 15 obtains the compensation control message issued by the power adjustment unit 12 and sends the compensation control message in the opposite phase to the power adjustment unit 12 to realize closed-loop control of the compensation control message.

[0058] In some embodiments, referring to FIG3, during the execution of step S3, step S4 is also executed: the temperature feedback unit 16 acquires and feeds back the real-time temperature information of the temperature compensation unit 13 to the main control unit 11, and the main control unit 11 adjusts the control information output to the power adjustment unit 12 according to the real-time temperature information of the temperature compensation unit 13 to realize temperature closed-loop control.

[0059] As can be seen from the above, the temperature control method described in this embodiment can achieve dual closed-loop control of power and temperature, and can effectively control the temperature uniformity of the semiconductor substrate with minimal manufacturing and maintenance costs.

[0060] In some embodiments, steps S3 and S4 are performed simultaneously.

[0061] In some embodiments, during the execution of step S2, step S4 is executed before step S3.

[0062] In some embodiments, referring to FIG3, the step of controlling the power adjustment unit 12 by the main control unit 11 includes: sending a pulse width modulation signal to the pulse width modulation unit through the main control unit 11; the power adjustment unit 12 adjusting the duty cycle of the pulse width modulation signal and outputting the pulse width modulation signal as the compensation control message.

[0063] In some embodiments, referring to FIG3, the step of the main control unit 11 adjusting the control message output to the power regulation unit 12 according to the real-time temperature information of the temperature compensation unit 13 includes: the main control unit 11 adjusting the pulse width modulation signal according to the real-time temperature information of the temperature compensation unit 13 through a PID control algorithm.

[0064] In some embodiments, referring to Figures 2 and 3, the alarm unit 17 acquires a first duty cycle message of the pulse width modulation signal output by the power adjustment unit 12, which is a pulse width modulation unit, and a second duty cycle message of the pulse width modulation signal output by the power feedback unit 15, which is an output feedback optocoupler; after determining that the first duty cycle message and the second duty cycle message are non-complementary messages, the alarm unit 17 outputs an alarm message.

[0065] In some embodiments, referring to FIG3, the main control unit 11 pre-stores target temperature information, and the temperature control method further includes: after the main control unit 11 controls the power adjustment unit 12 to drive the output power of each of the sub-temperature compensation units to 0, the power adjustment unit 12 sequentially drives each of the sub-temperature compensation units to perform temperature compensation adjustment on the main heating plate 14 with a specific output power, and performs temperature uniformity adjustment according to the acquired real-time information and the target temperature information.

[0066] In some embodiments, referring to FIG3, the real-time information includes several average real-time temperature messages of different regions in the main heating plate 14 and temperature response messages of each of the sub-temperature compensation units to the main heating plate. The step of adjusting the temperature uniformity based on the acquired real-time information includes: the uniformity feedback unit 18 acquiring and feeding back the multiple average real-time temperature messages to the main control unit 11; the temperature feedback unit 16 acquiring and feeding back the temperature response messages to the main control unit 11; the main control unit 11 generating several sets of initial temperature compensation messages based on the multiple average real-time temperature messages, the temperature response messages, and the target temperature messages, and performing iterative calculations on each set of initial compensation messages until multiple sets of temperature compensation messages are obtained.

[0067] In some embodiments, the closed-loop temperature control system further includes a heating cavity. The temperature compensation unit 13 and the main heating plate 14 are disposed within the heating cavity.

[0068] In some embodiments, the other units in the main control unit besides the main control unit 11 constitute a compensation control unit, which is disposed in the heating cavity.

[0069] In some embodiments, the heating cavity is provided with the main heating plate 14, at least one sub-temperature compensation unit, and other units in the main control unit other than the main control unit 11.

[0070] In some embodiments, the bottom surface of the main heating plate 14 includes at least one temperature control compensation area. The specific range of the temperature control compensation area and the distance between adjacent temperature control compensation areas are determined by the structural performance, process requirements, and installation conditions of the main heating plate 14 itself.

[0071] In some specific embodiments, several of the temperature control compensation areas are arranged in an array relative to the center of the main heating plate 14. Specific array distribution types include, but are not limited to, ring arrays and rectangular arrays.

[0072] In some embodiments, the top surface of the temperature compensation unit 13 is adjacent to the bottom surface of the main heating plate 14, that is, the top surface of each of the sub-temperature compensation units of the temperature compensation unit 13 and the bottom surface of the main heating plate 14 form a cavity area, so that the wiring in the heating cavity is concentrated between the main heating plate 14 and the temperature compensation unit 13, avoiding complex wiring design and facilitating the disassembly, assembly and maintenance of the semiconductor substrate heating device.

[0073] In some embodiments, the sub-temperature compensation unit is configured corresponding to the temperature control compensation area to perform temperature compensation adjustment on the temperature control compensation area.

[0074] In some specific embodiments, the compensation control unit includes a printed circuit board (PCB), and at least one of the other units of the main control unit besides the main control unit 11 is disposed on the PCB.

[0075] In some specific embodiments, all units of the main control unit except the main control unit 11 are disposed on the PCB.

[0076] In this embodiment, the control implemented for at least one of the sub-temperature compensation units can be synchronous control or independent control.

[0077] In some embodiments, the sub-temperature compensation unit includes a heat-conducting element or a cooling element to heat or cool the temperature compensation area corresponding to the bottom surface of the main heating plate 14.

[0078] In some embodiments, the sub-temperature compensation unit and the main heating plate 14 interact in contact, that is, the distance between the top of the sub-temperature compensation unit and the corresponding temperature control compensation area is equal to 0, so as to achieve mutual contact.

[0079] Although embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of the invention as described in the specification. Furthermore, the present invention described herein may have other embodiments and can be implemented or carried out in various ways.

[0080] 11: Main Control Unit 12: Power Regulation Unit 13: Temperature Compensation Department 14: Main heating plate 15: Power Feedback Unit 16: Temperature feedback unit 17: Alarm Department 18: Uniformity Feedback Unit 19: Signal Isolation Unit

Claims

1. A closed-loop temperature control system, comprising: The system comprises: a main heating plate; a temperature compensation unit corresponding to the main heating plate; a main control unit including a main control unit, a power adjustment unit, a power feedback unit, and a temperature feedback unit; the main control unit is electrically connected to the main heating plate for temperature adjustment; the main control unit, the power adjustment unit, and the temperature compensation unit are sequentially electrically connected, and the power adjustment unit, under the control of the main control unit, outputs a compensation control message that drives the temperature compensation unit to perform temperature compensation adjustment on the main heating plate; the power feedback unit is electrically connected in parallel with the power adjustment unit to send the compensation control message in opposite phase to the power adjustment unit; and the temperature feedback unit is electrically connected to the main control unit and the temperature compensation unit to collect real-time temperature information from the temperature compensation unit and feed it back to the main control unit; the power adjustment unit includes a pulse width modulation unit to adjust the duty cycle according to the pulse width modulation signal output by the main control unit and output the compensation control message.

2. The closed-loop temperature control system according to claim 1, wherein the power feedback unit and the power regulation unit form a closed-loop negative feedback.

3. The closed-loop temperature control system according to claim 1, wherein the power feedback unit includes an output feedback optocoupler electrically connected in parallel with the pulse width modulation unit to feed back an inverted pulse width modulation signal to the pulse width modulation unit as an inverted compensation control message.

4. The closed-loop temperature control system according to claim 3 further includes an alarm unit electrically connected to the output feedback optocoupler and the pulse width modulation unit, so as to obtain and determine whether to output an alarm message by comparing a first duty cycle message of the pulse width modulation signal output by the pulse width modulation unit and a second duty cycle message of the pulse width modulation signal output by the output feedback optocoupler.

5. The closed-loop temperature control system according to claim 1 further includes a uniformity feedback unit electrically connected to the main control unit and the main heating plate, for acquiring and feeding back the real-time temperature information of the main heating plate to the main control unit.

6. The closed-loop temperature control system according to claim 1 further includes a signal isolation unit electrically connected to the main control unit and the power regulation unit, so as to isolate the signal output by the main control unit before sending it to the power regulation unit.

7. In the closed-loop temperature control system according to claim 6, the signal isolation unit is an optical isolation unit or a magnetic coupling isolation unit.

8. The closed-loop temperature control system according to claim 1, wherein the temperature compensation unit includes at least one sub-temperature compensation unit, the sub-temperature compensation units being respectively arranged corresponding to different areas of the main heating plate.

9. A temperature control method, comprising: A closed-loop temperature control system is provided, comprising a main heating plate, a temperature compensation unit, and a main control unit. The temperature compensation unit is correspondingly configured with respect to the main heating plate. The main control unit includes a main control unit, a power adjustment unit, a power feedback unit, and a temperature feedback unit. The main control unit adjusts the temperature of the main heating plate. The main control unit controls the power adjustment unit to output a compensation control message to drive the temperature compensation unit to perform temperature compensation adjustment on the main heating plate. The power feedback unit acquires and sends an inverse compensation control message to the power adjustment unit based on the compensation control message, thereby achieving closed-loop control of the compensation control message. The temperature feedback unit acquires and feeds back a real-time temperature message from the temperature compensation unit to the main control unit. The main control unit adjusts the control message output to the power adjustment unit based on the real-time temperature message from the temperature compensation unit, thereby achieving closed-loop temperature control. The power adjustment unit includes a pulse width modulation unit. The step of controlling the power adjustment unit through the main control unit includes sending a pulse width modulation signal to the pulse width modulation unit through the main control unit. The power regulation unit adjusts the duty cycle of the pulse width modulation signal and outputs a pulse width modulation signal as the compensation control message.

10. The temperature control method according to claim 9, wherein the main control unit adjusts the control message output to the power regulation unit based on the real-time temperature message from the temperature compensation unit, includes: The main control unit adjusts the pulse width modulation signal using a PID control algorithm based on the real-time temperature information from the temperature compensation unit.

11. The temperature control method according to claim 9, wherein the power feedback unit includes an output feedback optocoupler, the closed-loop temperature control system further includes an alarm unit electrically connected to the output feedback optocoupler and the pulse width modulation unit, and the temperature control method further includes: The alarm unit acquires a first duty cycle message of the pulse width modulation signal output by the pulse width modulation unit and a second duty cycle message of the pulse width modulation signal output by the output feedback optocoupler; after determining that the first duty cycle message and the second duty cycle message are non-complementary messages, the alarm unit outputs an alarm message.

12. The temperature control method according to claim 9, wherein the closed-loop temperature control system further includes a uniformity feedback unit electrically connected to the main control unit and the main heating plate, the temperature compensation unit includes at least one sub-temperature compensation unit respectively disposed corresponding to different areas of the main heating plate, the main control unit pre-stores a target temperature message, and the temperature control method further includes: The main control unit controls the power adjustment unit to drive the output power of each of the sub-temperature compensation units to 0, and then drives each of the sub-temperature compensation units to perform temperature compensation adjustment on the main heating plate with a specific output power. The temperature uniformity is adjusted according to the real-time information and the target temperature information.

13. The temperature control method according to claim 12, wherein the real-time information includes a plurality of average real-time temperature messages of different regions in the main heating plate and temperature response messages of each of the sub-temperature compensation units to the main heating plate, and the step of adjusting the temperature uniformity based on the acquired real-time information includes: The uniformity feedback unit acquires and feeds back these average real-time temperature messages to the main control unit; The temperature feedback unit acquires and feeds back the temperature response message to the main control unit; the main control unit generates a plurality of initial temperature compensation messages based on the average real-time temperature messages, the temperature response message and the target temperature message, and performs an iterative operation on each of the initial compensation messages until a plurality of temperature compensation messages are obtained.

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