Methods and apparatus for processing an electrostatic chuck

Abstract

The invention describes a technique and apparatus for processing an electrostatic chuck under controlled procedural conditions, including, for example, a step of processing an electrostatic chuck during which an adhesive is cured to form a bond between two layers of the electrostatic chuck.

Description

Technical Field

[0001] The following description relates to techniques and apparatus for processing an electrostatic chuck, including, for example, processing an electrostatic chuck during a step of forming a bond between two layers of the electrostatic chuck with an adhesive. Prior Technology

[0002] Electrostatic chucks (also simply "chucks") are used in the handling of semiconductor and microelectronic devices. A chuck is used to hold a workpiece, such as a semiconductor wafer or a microelectronic device substrate, in place to perform a process on one surface of the workpiece. Electrostatic chucks are adapted to support and hold the workpiece on one of the upper surfaces of the chuck by generating an electrostatic attraction between the workpiece and the chuck. A voltage is applied to electrodes contained within the chuck to induce charges of opposite polarities in the workpiece and the chuck.

[0003] A chuck encompasses various structures, devices, and designs that allow the chuck to perform or improve its performance. A typical electrostatic chuck assembly is a multi-component, multi-layer structure, which may include: an upper layer having an upper surface supporting a workpiece; a base layer supporting the upper layer; an adhesive forming a bond between the upper and base layers; electrical components, such as electrodes, a conductive coating, and grounding connections, for controlling the electrostatic charge on the chuck and a supported workpiece; and one or more cooling systems for controlling the temperature of the chuck and a supported workpiece. Various other components may include measuring probes, movable pins for supporting a workpiece or changing the position of the workpiece relative to the chuck, and structures (e.g., "protrusions") supporting the workpiece at a small height above a flat upper surface.

[0004] A typical feature of an electrostatic chuck is that it contains a base with a cooling system. The cooling system includes an array of channels or passages formed inside the chuck, which allows a cooling fluid (e.g., gas, water, or another liquid) to flow through the interior of the chuck to remove heat from the chuck during processing and to control the temperature of a supported workpiece.

[0005] In a typical design of an electrostatic chuck, an adhesive layer is included as one layer of the chuck, such as bonding an upper layer to a lower base layer. The adhesive is typically of a chemically curable type. The adhesive is placed between the two layers of the chuck in an uncured state and then allowed or caused to cure over a period of time (a "curing time" or "curing period") to form a strong adhesive bond between the layers. Summary of the Invention

[0006] The following disclosure relates to techniques and equipment (apparatus) for processing an electrostatic chuck, and more particularly to processing an electrostatic chuck during a step of forming a bond between two layers of the electrostatic chuck with an adhesive.

[0007] The applicant has determined that the conditions for curing an adhesive layer of an electrostatic chuck can affect the quality of the chuck. Maintaining curing conditions within the desired range can produce chucks with individually improved quality and reduce the scrap rate and rework rate of chucks after a curing step. Curing conditions outside the desired range can produce chucks of lower quality and can lead to an increased scrap rate and the need for rework of individual chucks. One procedural condition that can affect chuck quality is the temperature of the adhesive during the curing step. The relative humidity in a curing atmosphere also affects the quality of the electrostatic chuck. During a curing step, especially when the chuck temperature decreases during curing, curing a chuck in an atmosphere with too much moisture can cause condensation of moisture (liquid water) on the chuck surface.

[0008] In one embodiment, this document discloses an apparatus for handling an electrostatic chuck. The apparatus includes: a chamber containing a chamber atmosphere; a chamber purge gas source adapted to supply chamber purge gas to the chamber; a temperature control fluid source adapted to supply temperature control fluid to the chamber; and a temperature sensor for measuring a temperature inside the chamber.

[0009] In another embodiment, this paper discloses a method for processing an electrostatic chuck. The electrostatic chuck includes: a first layer; a second layer; and an adhesive between the first layer and the second layer. The method includes: with the chuck positioned in a closed chamber, the chamber including: a chamber atmosphere, a temperature sensor; and using an electronic controller to control a temperature of the chuck and to control the humidity in the chamber.

[0010] In another embodiment, this document discloses an apparatus for handling an electrostatic chuck. The electrostatic chuck includes: a first layer; a second layer; a fluid flow channel passing through at least one of the two layers; and an adhesive between the first layer and the second layer. The apparatus includes: a temperature-controlled fluid source connected to the fluid flow channel; and a purge gas source connected to the fluid flow channel. Simple Explanation of the Diagram

[0011] Figure 1 shows an example of a chamber of one of the devices as described.

[0012] Figure 2 shows an example of a device comprising one of multiple chambers as described.

[0013] Figure 3 shows an example of one of the components of the device as described, and the electronic connections between some of the components. Implementation

[0014] The following disclosure relates to techniques and apparatus for handling an electrostatic chuck in a closed chamber using controlled procedural conditions (such as a controlled temperature and a controlled humidity level of the chuck). The techniques and apparatus allow the use of sensors, flow control, and electronic procedural control adapted to perform one or more of the following functions: setting or maintaining one or more procedural conditions, monitoring one or more procedural conditions, setting a time period of the program, and recording data of the procedural conditions at the start of and during the program.

[0015] The electrostatic chuck that can be processed by the device can be of any design and structure. A specific example is an electrostatic chuck design containing two layers bonded together by a chemically curable adhesive, which can be effectively cured by maintaining the adhesive at a constant temperature. The adhesive can be a chemically curable adhesive, such as a thermosetting polymer adhesive; an example is an epoxy-based curable adhesive. When used to bond the layers of an electrostatic chuck, the adhesive can ideally cure at a curing temperature below ambient temperature, maintaining the temperature of the chuck and the adhesive at a reduced (below ambient) temperature during the curing period. Other adhesives can be optimally cured by maintaining the adhesive temperature at or above ambient temperature. The adhesive may be uncured (including partially cured) before the chuck is processed using the device described, and may be processed by the device to allow the adhesive to cure under controlled (curing) conditions provided by the device, which is capable of setting, controlling, monitoring or recording the conditions of the device and the electrostatic chuck during one of the curing processes of the adhesive.

[0016] One layer of a chuck may be an upper layer of an electrostatic chuck, comprising a surface positioned adjacent to a bottom surface of a supported workpiece during chuck use. A second layer may be a lower layer, such as a base layer, supporting multiple layers above the base layer, including the upper layer. A curable adhesive is located between the upper and lower layers. One or more additional layers or devices (e.g., electrodes) may also be located between the upper and base layers.

[0017] Each layer may be made of a material used as an upper or lower (base) layer of an electrostatic chuck. Examples of materials used for either layer include metals (including metal alloys) and ceramic materials. Preferably, and as described herein, a primary example of a chuck that can be efficiently handled using a device as described: the base layer may include a cooling channel extending through the interior of the layer; the base layer may be made of a metal such as aluminum or an aluminum alloy; the upper layer may be made of ceramic; and an adhesive contacts both the base layer and the upper layer to form an adhesive bond between the two layers.

[0018] According to an example method of the present invention, an electrostatic chuck can be processed under programmed conditions that are set, controlled, or both, and the programmed conditions are monitored and recorded, as appropriate and preferably, during the processing of an electrostatic chuck. Programmed conditions may include one or more of the following: a temperature of the chuck, humidity in the chamber, and the amount of time allowed to execute a program or individual, separate portions of a program.

[0019] A process for preparing an electrostatic chuck is performed within a chamber of an apparatus as described, under desired process conditions (such as the temperature of the chuck and the humidity of the curing atmosphere) for a required amount of time to allow the process to begin and complete. Process conditions may be generated at the beginning or early part of the process and then maintained (controlled) for all or part of the process, and may be monitored and recorded, preferably, during the process until completion. The amount of time for the process to be performed (i.e., the duration of the process) and the amount of time for specific steps of the entire process may be a predetermined time period required for curing an adhesive.

[0020] During the processing of an electrostatic chuck, for example for curing an adhesive that is part of the chuck, the electrostatic chuck can be maintained at a desired constant processing temperature ("curing temperature"), either below a maximum temperature or above a minimum temperature, or within a temperature range. The processing temperature can be any temperature, which can be ambient temperature, above ambient temperature (heating), or below ambient temperature (cooling).

[0021] For a specific instance of an electrostatic chuck, and for a process of curing an adhesive for the chuck, a useful process temperature (curing temperature) can be the temperature at which the adhesive is allowed to fully and effectively cure during a curing period. A curing temperature can vary for adhesives with different chemical properties, with a widely used range from -25°C to 100°C. For certain epoxy adhesives currently used or preferably used for bonding electrostatic chucks, a curing temperature can be below ambient temperature (room temperature), for example, below 25 or 20°C, such as within the range of 5 to 25°C or 10 to 20°C.

[0022] For certain examples of electrostatic chucks used under operating conditions including a chuck temperature below ambient temperature, the chuck adhesive is designed to be stable under operating conditions below ambient temperature. According to the described method, an adhesive for a chuck can be cured at a temperature that is the same as the temperature the chuck will maintain during chuck use, which can be below ambient temperature. As a separate advantage, a curing temperature below ambient temperature can also produce a desired shape on the surface of an electrostatic chuck.

[0023] The specific temperature for curing an adhesive in an electrostatic chuck can be selected based on the type of adhesive being cured, the chuck and adhesive being designed to operate at a specific temperature, and other characteristics of the curing step (such as the amount of time the curing temperature is maintained during a curing step).

[0024] To control and maintain a desired temperature of a chuck during processing, a temperature control fluid is provided to the interior of a chamber and is used to maintain and retain the temperature of the chuck within the chamber by placing the temperature control fluid in thermal contact with the electrostatic chuck. In a preferred embodiment, the temperature control fluid may be a liquid, such as water, which flows into the chamber and is placed in direct contact with the chuck by any useful method. In a particular example embodiment, the temperature control fluid may be used to control the chuck temperature by flowing through a channel extending through the interior of a layer of the chuck (e.g., through a base layer of the chuck). The temperature control fluid flows in thermal contact with the chuck at a flow rate and temperature that maintains the chuck at a desired temperature for processing (e.g., curing an adhesive), a temperature that is substantially the same as the temperature of a cooling fluid.

[0025] A temperature-controlled fluid (e.g., cooling fluid) may be supplied from a temperature-controlled fluid source (such as a "cooler" or a "heater") to the interior of a chamber. The temperature-controlled fluid may flow through a conduit leading from the temperature-controlled fluid source and into the chamber, wherein the temperature-controlled fluid may be placed in thermal contact with the chuck. In an example method, the conduit is connected to an opening ("inlet") in the electrostatic chuck, which connects to a channel (sometimes referred to as a "fluid flow channel" or a "cooling channel") extending through a layer of the electrostatic chuck. The channel includes a second opening ("outlet"). A second conduit has one end connected to the second opening (channel "outlet") of the channel and a second end positioned outside the chamber. During operation, the temperature-controlled fluid flows through the entire path of the first conduit, the inlet, and the channel within the chuck, exiting the channel through the outlet and being received by the second conduit. The second conduit carries the temperature-controlled fluid out of the chamber, for example, back to the temperature-controlled fluid source.

[0026] The device includes one or more temperature sensors (e.g., thermocouples or other temperature sensing devices) inside the chamber, which can be used to measure and, as needed, monitor a temperature within the chamber during a procedure. The measured and, as needed, temperature may be related to the electrostatic chuck and can be measured directly or indirectly during chuck processing to determine whether the chuck is at a desired processing temperature, such as within a temperature range above or below a desired curing temperature, which may be equal to or approximately equal to the temperature of a temperature control fluid (e.g., a cooling fluid).

[0027] A temperature measurement location and a method of temperature measurement can be useful as needed and for a specific procedure, electrostatic chuck, device, chamber, etc. A temperature sensor can measure the surface temperature of a chuck, for example, by positioning it on or reading the temperature of the chuck surface. Alternatively, a temperature sensor can measure the temperature of a temperature control fluid in thermal contact with the chuck, for example, when a temperature control fluid enters, passes through, or exits a fluid flow channel of an electrostatic chuck. Multiple temperature sensors can be useful.

[0028] According to a currently preferred embodiment of the apparatus and method, an apparatus may include two temperature sensors positioned within a chamber. One temperature sensor may be positioned and configured to measure the temperature of a temperature-controlled fluid (e.g., cooling water) as fluid flows through an inlet (including a nearby conduit) of a cooling channel of an electrostatic chuck. A second temperature sensor may be positioned and configured to measure the temperature of the temperature-controlled fluid (e.g., cooling water) as fluid flows from the cooling channel (e.g., through an outlet (including a nearby conduit) of the cooling channel of the electrostatic chuck.

[0029] Depending on the circumstances, a chamber may also include one or more pressure sensors to monitor the pressure of a temperature-controlled fluid (e.g., a liquid cooling fluid) flowing within the chamber. According to a currently preferred embodiment and method, an apparatus may include two pressure sensors positioned within a chamber to monitor the pressure of the temperature-controlled fluid at two locations. One pressure sensor may be positioned and configured to measure the pressure of the temperature-controlled fluid (e.g., cooling water) as the fluid flows through an inlet (including a nearby conduit) of a cooling channel of an electrostatic chuck. A second pressure sensor may be positioned and configured to measure the pressure of the temperature-controlled fluid (e.g., cooling water) as the fluid flows through an outlet (including a nearby conduit) of the cooling channel of the electrostatic chuck.

[0030] During the use of an apparatus for handling an electrostatic chuck, another procedural condition that can be controlled and, as appropriate, monitored and recorded during the use of the apparatus is the relative humidity of a chamber atmosphere within a closed chamber. The term "controlling" humidity, broadly defined, refers to any method of maintaining a sufficiently low relative humidity of a chamber atmosphere to prevent moisture contained in the gaseous atmosphere from forming on a surface of a cooled electrostatic chuck within the atmosphere. A method of "controlling" humidity does not require measuring and maintaining a specific humidity level (i.e., a percentage of relative humidity at a specific temperature) or a maximum humidity level within a closed chamber during a procedural step. "Controlling" humidity specifically does not require (but may include, if necessary) a feedback control system or a step of quantitatively measuring and adjusting the amount of gaseous moisture in a chamber atmosphere, such as by measuring and maintaining the humidity of a chamber atmosphere within a specified or predetermined relative humidity range, or at a desired relative humidity "setpoint," or below a maximum relative humidity value, or similar.

[0031] Humidity control to prevent condensation on a chuck surface can be achieved non-feedback methods, such as qualitative control of the amount of moisture contained in a chamber atmosphere. In a particular example method, humidity control of a chamber atmosphere can be achieved by adding dry gas (purge gas) to the chamber during a process step. Humidity control may involve maintaining a consistent (e.g., continuous or semi-continuous) flow of dry purge gas into the chamber during a process step. The amount (volume, volumetric flow rate) of purge gas delivered to a chamber can be determined empirically (e.g., by trial and error) or based on calculations. The amount of purge gas delivered to the chamber can be controlled and monitored as needed using a flow meter connected to a process controller (described herein).

[0032] In one particular example method, at the start of a process, a closed chamber initially contains an electrostatic chuck, which is contained (e.g., supported) within a chamber atmosphere consisting entirely of ambient air, such as the ambient air contained within a cleanroom housing the chamber. The air initially contained within the closed chamber will have a relative humidity and temperature typical of a cleanroom, with the relative humidity ranging from below 10% to approximately 50% at an ambient temperature (e.g., from 20 to 23 degrees Celsius), for example, from 30% to 40%. To achieve this relative humidity, the ambient air constituting the chamber atmosphere contains a sufficient concentration of moisture (gaseous water) such that if the electrostatic chuck is to be cooled to a sufficiently low temperature below atmospheric temperature within the chamber's air atmosphere, such as during a process of curing an adhesive on the chuck below ambient temperature, the moisture in the air will condense into liquid water on one surface of the chuck.

[0033] To prevent moisture from condensing into liquid water on one surface of the chuck during electrostatic chuck cooling within the chamber, the moisture concentration in the chamber atmosphere can be controlled during processing steps. At the start of a process step, a chamber atmosphere can be supplied to the chamber, or the chamber atmosphere can be adjusted within the chamber to exhibit a relative humidity that does not cause liquid water condensation on the chuck surface during processing that includes lowering the chuck temperature.

[0034] When the chamber atmosphere in a chamber consists of ambient air (e.g., air contained in a cleanroom), the moisture concentration in the ambient air atmosphere can be reduced to prevent condensation on a chuck surface cooled to a temperature below ambient. For example, during the handling of an electrostatic chuck, by adding a certain amount of additional gas to the air to reduce the concentration of water vapor in the air constituting the chamber atmosphere, the relative humidity of a chamber atmosphere contained in a closed chamber can be reduced and controlled to a level that does not cause condensation on a chuck surface. The added gas is called a "chamber purge gas" and contains a reduced amount of water relative to ambient air, preferably water-free, for example, less than 5% by volume, 2% by volume, or 1% by volume of water vapor, and is considered a "dry" gas. A chamber purge gas can be any type of gas that, when added to a chamber atmosphere (e.g., ambient air), reduces the concentration of moisture (water vapor) in the chamber atmosphere. Examples include dry (moisture-free) gases such as dry nitrogen and clean dry air (CDA).

[0035] During and throughout a process, chamber purge gas can be added to a chamber in a continuous or semi-continuous manner. The amount of chamber purge gas added to the chamber (e.g., a volumetric flow rate or velocity) can be such that the relative humidity level of the chamber atmosphere is maintained at a level that will not cause condensation of liquid water on a surface of the electrostatic chuck being processed within the chamber at a processing temperature (e.g., curing temperature) of an electrostatic chuck.

[0036] During the processing of an electrostatic chuck, after the chuck is placed in a chamber and the chamber is closed, chamber purge gas can be added to the chamber. The amount and type of chamber purge gas added to the chamber atmosphere will increase the concentration of chamber purge gas in the chamber and decrease the concentration of water vapor in the chamber atmosphere. During a process, an electrostatic chuck in the chamber can be processed by a step including reducing the chuck temperature, by means of a useful flow of chamber purge gas into the chamber, without causing moisture (water vapor) contained in the chamber atmosphere to condense into liquid water on the cooled chuck surface. During the process, the relative humidity of the chamber atmosphere does not need to be measured, used in a feedback control loop, or specifically set or maintained at a specific (quantitative) level or maintained below a set maximum value. Humidity control can be achieved by adding a certain amount of purge gas (e.g., as a measured and controlled flow rate) to the chamber during the process, wherein the amount is sufficient to generate and maintain a chamber atmosphere that does not cause moisture to condense on the cooled chuck surface.

[0037] A useful amount of chamber purge gas can be added to the chamber by controlling or measuring the flow rate of chamber purge gas entering the chamber during a procedure. The amount of chamber purge gas can be any amount used to prevent condensation on a surface of the chuck during a specific procedure performed on the chuck within the chamber.

[0038] One method involves adding purge gas to a chamber. During a process, the purge gas can be added to the chamber continuously or semi-continuously via a flow meter that measures the amount of fluid entering the chamber (by volume, mass, or other means). The amount of gas added to the chamber is calculated or empirically determined to reduce the relative humidity of the chamber atmosphere to a desired level that will not cause condensation during processing.

[0039] Depending on the circumstances, but not required by any of the methods or apparatuses described, a pressure sensor may be included inside the chamber to measure the pressure of the gaseous chamber atmosphere when purge gas is added to the chamber. The amount of chamber purge gas added to the chamber may be an amount that generates a desired positive pressure within the closed chamber, such as a pressure in the range of 1.2 to 4.0 atmospheres (absolute value), for example, from 1.5 to 3.5 atmospheres (absolute value).

[0040] Another program condition that can be set and monitored is the amount of time for executing a program or a program step. For a program that cures an adhesive, various individual steps are performed at different time periods throughout the program. Example steps include: a step of controlling the chuck temperature by contacting the chuck with a temperature-controlled fluid; a step of allowing purge gas to flow into the chamber; a step of allowing a channel of purge gas to pass through a channel of the chuck; and other steps. In example methods, a timer can be used to measure and control the amount of time a chuck is held in a chamber under controlled or monitored program conditions. A program performed on an electrostatic chuck within a chamber and a controlled chamber environment can be executed by several steps, each effective for a predetermined time period.

[0041] During an example process of curing an adhesive for an electrostatic chuck, an electronic controller may control one or more of the following: a chuck temperature and a time duration of contact with a temperature-controlled fluid; a flow rate of the temperature-controlled fluid; a temperature of the temperature-controlled fluid; a time duration of chamber purge gas flowing into the chamber; a flow rate of the chamber purge gas; a time duration of passage of a channel purge gas through a channel of a chuck; a flow rate of the channel purge gas; and others.

[0042] For an example procedure involving the curing of a chemically curable adhesive under uniform conditions in a chamber of one of the described apparatuses, the example curing period and the amount of time a cooling fluid passes through a cooling channel of a chuck can be at least 30 minutes, 60 minutes, or 90 minutes, such as at least 3, 5, or 10 hours, or up to or more than 12, 16, or 24 hours. During a curing period, the chuck is retained in a closed chamber, the chamber atmosphere is controlled to prevent condensation on a surface of the cooling chuck (e.g., by means of chamber purge gas flowing into the chamber), and the chuck temperature is controlled using a temperature-controlled fluid and monitored as needed to ensure that the chuck temperature is maintained within a desired curing temperature range, such as below a maximum temperature.

[0043] After the procedure has been executed under controlled conditions for a desired duration, the flow of the temperature-controlled fluid through the chamber and through the chuck channel can be stopped. While the chuck remains inside the chamber, a liquid form of the temperature-controlled fluid (such as liquid water) can be removed from the channel, i.e., the channel is "purged," and the channel can be dried. Removal of the temperature-controlled fluid from the channel and drying of the channel can be performed in any manner and by any of one or more steps. In one example method, a temperature-controlled fluid can be removed from the channel and the channel can be dried by passing a channel purge gas through the channel. The duration of the channel purge gas passage and the flow rate of the channel purge gas can be controlled by an electronic processor.

[0044] The purge gas can be passed through the same flow conduit used to allow temperature control fluid to pass through the electrostatic chuck. For example, a purge gas can flow through a conduit leading from a purge gas source and into a chamber, wherein the conduit is connected to an opening ("inlet") in the electrostatic chuck, which connects to a channel (sometimes referred to as a "fluid flow channel" or a "cooling channel") extending through a layer of the electrostatic chuck. The channel includes a second opening ("outlet"). A second conduit is connected at one end to the second opening and at a second end to the outside of the chamber. The purge gas can be allowed to flow through the entire path of the first conduit, the inlet, and the channel within the chuck, and ultimately exit the channel through the outlet and be received by the second conduit. The second conduit carries the purge gas outside the chamber, for example, back to the purge gas source. The inlet and outlet can be located on either surface of the electrostatic chuck (top or bottom, upper or lower), and both the inlet and outlet can be on the same surface or on different surfaces.

[0045] A channel purge gas can be any gas capable of removing liquid from a channel of a chuck or drying a channel of a chuck and preferably removing trace amounts of moisture from the surface of the channel to leave a dry channel. The channel chamber purge gas may preferably contain a small amount of water (moisture), and preferably contains no water, for example, less than 5% by volume, 2% by volume, or 1% by volume of water vapor, and is considered a "dry" gas. Examples of channel purge gases include dry (moisture-free) gases such as dry nitrogen and clean dry air (CDA). The channel purge gas source may be the same as the purge gas source for one of the chambers or one of the chambers of the device described.

[0046] During a process performed on an electrostatic chuck, within a chamber and under controlled conditions, the process conditions present during the process can be monitored and recorded. One purpose of monitoring the conditions occurring during a process is to ensure that the process conditions are within a desired range and to allow for adjustment or termination of the process if a condition exceeds a set range. For example, if the temperature of a chuck is monitored during a curing process and that temperature is outside a desired range (e.g., exceeding a maximum or minimum temperature), a device (e.g., via an electronic controller) can issue a warning or alarm to notify an operator of the device that the temperature is out of range. An out-of-range temperature can indicate a malfunction of the device, such as a leak in the temperature control fluid or a source of failure in the temperature control fluid (e.g., a "cooler").

[0047] Alternatively, or additionally, a relative humidity sensor, which may be optional, can monitor the relative humidity of a chamber atmosphere during chamber use. If the relative humidity within the chamber falls outside a desired range, a device (e.g., by means of an electronic program control) can issue a warning or alarm to notify an operator of the device that the relative humidity is out of range. An out-of-range relative humidity can indicate a malfunction of the device, such as a failure or depletion of the chamber purge gas source.

[0048] Similarly, other sensors, such as pressure sensors, can be monitored within the chamber, and if a pressure falls outside a desired (preset) range, the device can generate a signal, such as a warning or alarm, to notify one of the operators of the device that the pressure or other conditions are out of range.

[0049] Preferably, the program conditions monitored during a procedure performed on a particular electronic chuck can be recorded. In the event that a chuck is subsequently tested or used and found to be defective, the conditions at appropriate locations in the chamber when processing the particular chuck (e.g., chuck temperature, relative humidity) can be checked to determine whether the conditions during processing the particular chuck were appropriate or outside the acceptable range.

[0050] According to a specific example, a method can be performed in one of the described apparatuses to cure an adhesive of an electrostatic chuck under controlled and monitored procedural conditions. The method may include placing an electrostatic chuck in a chamber, as described. One design of the electrostatic chuck may include a chemically curable adhesive bonding two layers of the chuck together. The chuck may include a first layer, a second layer, and an adhesive bonding the first layer to the second layer. The adhesive may be uncured, meaning completely uncured or partially cured (pre-cured). Partially cured adhesives may be allowed to cure within a short period of time, allowing for partial curing. Depending on the adhesive, an example of a pre-curing timeframe may range from 30 minutes to 3 hours.

[0051] A process for curing an adhesive is performed within a chamber of an apparatus as described, while one or more process conditions within the chamber are set, controlled, or maintained during adhesive curing. The process conditions may include maintaining the chuck at a temperature below ambient temperature (e.g., below 20 degrees Celsius). The method may also include providing a chamber atmosphere with a relative humidity sufficiently low to prevent moisture (water) from condensing from the chamber atmosphere onto a cooled surface of the electrostatic chuck.

[0052] Example methods may include placing the chuck into a chamber and closing one of the chamber's ports. The chamber will be closed, with its interior sealed, but the chamber is not necessarily hermetically sealed, and a hermetically sealed manner is not required in use according to this description. In some example methods of curing an adhesive on an electrostatic chuck, during the adhesive curing step, a flat, weighted surface, such as a ceramic plate, is placed on the top surface of the electrostatic chuck to maintain the position of the upper layer during the curing step.

[0053] In the example method, when the chamber is first closed at the start of a procedure, the chamber will contain an initial atmosphere of ambient air from the device environment, which may be a clean room. After the chamber is closed, a certain amount of chamber purge gas may be added to the chamber to reduce the humidity of the chamber atmosphere and prevent water from condensing on the chuck surface as it cools. During the procedure, chamber purge gas may be added to the chamber in a continuous or semi-continuous manner to maintain a relatively dry chamber atmosphere that will not cause moisture condensation on the surface of the cooled electrostatic chuck at any time during the procedure.

[0054] The curing process can be performed by maintaining the chuck temperature at a suitable curing temperature within the chamber for a desired amount of time. Throughout the process, the temperature can be controlled to be constant, i.e., uniform, or at least controlled to not exceed a predetermined maximum chuck temperature. Preferably, a cooling fluid (cooling water) flows through a cooling channel that passes through one layer of the chuck to control the chuck temperature during the process.

[0055] During the curing process, an electronic controller is used, and the device can perform one or more of the following: measuring the temperature of a chuck (e.g., directly on a surface of the chuck, by measuring cooling water flowing through a channel of the chuck, or otherwise); measuring the humidity in the chamber using a relative humidity sensor; measuring the pressure of the chamber atmosphere using a pressure sensor; and controlling the duration of the curing step using a timer. If, during the curing process, conditions such as ambient temperature, pressure, or relative humidity fall outside a predetermined operating range, the electronic controller can issue a warning signal that will be detected by an operator of the device.

[0056] After the curing process is complete, while the chuck is still inside the chamber, a channel of purge gas can flow through the chuck's channels. The purge gas removes liquid from the channels, drying them, or both. After the liquid has been removed from the channels and the channels are dry, the chuck is removed from the chamber.

[0057] To perform a procedure as described, a useful device includes one or more chambers, various sensors located in each chamber (for measuring the relative humidity, temperature, and pressure of a liquid or gas), a fluid supply and flow mechanism (chamber purge gas, channel purge gas, temperature control fluid) to and from the chambers, and an electronic controller that receives electronic signals from the sensors or system components. The chambers, sensors, fluid sources, fluid flow controllers (such as valves and flow meters), and electronic controller operate together to process one or more electrostatic chucks under controlled and preferably monitored and recorded procedural conditions.

[0058] A useful controller can be any electronic device (e.g., an electronic control or computing device) capable of electronically receiving and transmitting control signals between devices or components of the described apparatus. The controller can be a computerized control system containing a central processing unit and programmable control software, such as a programmable logic controller ("PLC"), a laptop, a desktop computer, a tablet computer, a smartphone, or the like. A controller in an apparatus (comprising multiple chambers, each chamber having a chamber atmosphere, one or more temperature-controlled fluid sources, and one or more purge fluid (chamber purge fluid or channel purge fluid) sources) can be programmed to run a different program in each chamber. A temperature-controlled fluid supplied to one chamber of the apparatus can have a temperature different from a temperature-controlled fluid supplied to a different chamber of the apparatus; the temperature-controlled fluid can be received from two different temperature-controlled fluid sources, each supplying fluid at a different temperature to the two chambers.

[0059] The controller can also control the flow of cooling fluid through a bypass loop in a chamber, which allows cooling fluid to flow through the chamber but not through the electrostatic chuck. The controller can allow cooling fluid to flow through the bypass loop, for example, when the chamber does not contain an electrostatic chuck being processed, or when cooling fluid flowing through an electrostatic chuck in the chamber stops, such as during channel purging using purge gas. A flow conduit in the bypass loop contains cooling fluid, and the flow rate of this cooling fluid can be the same as the flow rate through the cooling channel of an electrostatic chuck during a process step (such as an adhesive curing step). The cooling fluid flows through the conduit of the bypass loop and returns to the cooling fluid source, and can be recirculated through the system. The bypass loop is used to maintain a controlled flow rate of cooling fluid in the chambers, all of which receive cooling fluid from a single source. The bypass loop also allows the introduction and removal of electrostatic chucks from the chambers without closing the cooling fluid, and sometimes provides a consistent flow of water through the system when the cooler is open.

[0060] More specifically, a useful or preferred device includes one or more chambers, each containing an interior chamber capable of accommodating an electrostatic chuck during processing. A chamber is defined by sidewalls, which are optionally insulated, at least one sidewall including a panel or door that can be opened and closed to allow access to the interior space of the chamber (also referred to as the "interior chamber"), and when opened, to allow an electrostatic chuck to enter the interior space and be held by a support, or to be removed from the interior space. After a substrate is placed inside the interior chamber, the panel or door can be closed to seal the interior chamber.

[0061] A useful chamber may be enclosed and does not need to be “sealed.” An “enclosed” chamber refers to the interior of a space that defines all sides of the enclosure. An enclosed chamber may be unsealed, meaning it is not airtight, but allows some movement of air between the interior and the exterior, such as through small openings or narrow paths located within the chamber structure. The air pressure within the chamber will be approximately equal to the air pressure in the surrounding environment (e.g., a cleanroom), or may be greater due to the inflow of purge gas into the chamber. The chamber does not need to be airtight, which substantially prevents gas from entering or leaving the interior space during use. A useful enclosed chamber according to this description may be specifically enclosed, but not airtight or sealed.

[0062] Each chamber defines an internal space that can be closed to contain a sealed atmosphere ("chamber atmosphere"). During operation of the apparatus for handling electrostatic chucks, characteristics such as the relative humidity and pressure of each of the one or more chamber atmospheres can be controlled, monitored, or recorded as needed. The temperature of one of the electrostatic chucks can be controlled, monitored, or recorded during operation of the apparatus for handling electrostatic chucks (e.g., measured by a temperature-controlled fluid (e.g., cooling water) in thermal contact with the electrostatic chuck). A single chuck can be contained within one or more chambers, and any one or more program conditions within each of the one or more chambers can preferably be controlled separately from any program conditions of one or more chambers.

[0063] In one example apparatus and procedure, an electronic controller receives individual electronic inputs from sensors in one or more chambers. While an electrostatic chuck is being processed within a chamber, the controller can monitor and record each individual electronic input. The controller can independently supply different fluids to each chamber from different sources, wherein the different fluids are delivered at any of the following rates: different flow rates, different quantities, different temperatures, etc.

[0064] The apparatus may include a cooling fluid source that can be used to contact an electrostatic chuck during processing to maintain a desired temperature of the chuck. Depending on the application, the apparatus may include two different cooling fluid sources for delivering different cooling fluid flows to two different chambers of the apparatus. The different cooling fluid sources can be maintained at different temperatures.

[0065] The device may include a gas source (referred to as chamber purge gas) for supplying chamber purge gas to the interior of a chamber.

[0066] The apparatus may include a gas source (referred to as cooling channel purge gas) for supplying the channel purge gas to one channel of an electrostatic chuck to purge or dry the channel. The channel purge gas source may be the same as or different from the chamber purge gas source.

[0067] Referring to Figure 1, an example of one of the devices as described is illustrated. Device 100 includes a chamber 102 having an internal space 104. The internal space 104 is closed ("closed"), but not airtight during use. The internal space 104 houses the electrostatic chuck 110 in a closed chamber atmosphere.

[0068] The electrostatic chuck 110 includes an upper layer 112, a base layer 114, and an adhesive layer 116. At least one of the base layer 114 or the upper layer 112 includes a fluid flow channel (not specifically shown), such as a cooling channel, extending as an array within the layer, through which a fluid (e.g., a liquid such as a cooling liquid) can flow to control the temperature of the chuck 110. An inlet 120 is connected to one end of the channel, and an outlet 122 is connected to a second end of the channel.

[0069] The conduit 124 is connected to the inlet 120 and allows a fluid, such as a temperature-controlled fluid or a purge gas, to flow from an external location to the inlet 120. The external location of the conduit 124 may be connected to a temperature-controlled fluid source 140 (e.g., a cooler supplying cooling water), a purge gas source 142, or both. The flow meter 144 can be used to control, meter, and measure the amount of purge gas added to the space 104.

[0070] The conduit 126 is connected to the outlet 122 and allows a fluid, such as a temperature-controlled fluid or a channel purge gas, to flow from the outlet 122 to an external location. The external location of the conduit 126 may be connected to the temperature-controlled fluid source 140 (e.g., a cooler supplying cooling water), the channel purge gas source 142, or both, using a switch or valve (146, 148).

[0071] Sensors that may be present in chamber 102 (but are not required) may include: a temperature sensor, a gas pressure sensor, a relative humidity sensor, a liquid pressure sensor, or a combination thereof. Device 100 also includes an electronic controller 128 connected to the sensors, fluid sources (e.g., 140, 142), flow meter 144, and switches or valves 146 and 148. Electronic connections between controller 128 and devices or components of device 100 are indicated by dashed lines. Connections may be direct, wired, wireless (e.g., Bluetooth), via a local area network, a virtual private network (VPN), an Ethernet connection, an Internet connection, or similar.

[0072] In the illustrated example device 100, one or more relative humidity sensors 130 (optional, not required) are present within the chamber interior space 104, each sensor 130 capable of sending an electronic signal to the controller 128 to indicate a relative humidity of the chamber atmosphere within space 104. One or more gas pressure sensors (not shown) may also be present within space 104, each sensor capable of sending an electronic signal to the controller 128 to indicate a pressure of the gaseous chamber atmosphere within space 104.

[0073] Furthermore, in example device 100, temperature sensors and liquid pressure sensors measure and monitor the temperature and pressure of a temperature control fluid passing through a cooling channel of conduits 124, 126, and chuck 110. Specifically, temperature sensor 134 measures the temperature of a temperature control fluid as the fluid enters the cooling channel (not shown) from conduit 124 at input 120. A second temperature sensor 134 measures the temperature of the temperature control fluid as the fluid passes through output 122 to conduit 126 from the cooling channel. The temperature measurement is transmitted to processor 128. Liquid pressure sensor 136 measures the pressure of the temperature control fluid as the fluid enters the cooling channel (not shown) from conduit 124 at input 120, or alternatively, a liquid pressure sensor may measure the pressure of the temperature control fluid as the fluid enters chamber 102. A second liquid pressure sensor 136 measures the pressure of the temperature control fluid as the fluid passes through output 122 to conduit 126 from the cooling channel. The liquid pressure measurement is transmitted to the processor 128.

[0074] Also shown is a purge gas source 142, which is part of the apparatus 100 and works in conjunction with the controller 128 and the flow meter 144 to supply chamber purge gas to the space 104 of the chamber 102 in a continuous or discontinuous manner during a procedure.

[0075] Referring to Figure 2, an apparatus 200 is illustrated, comprising three individual chambers 102 in a vertically stacked configuration. The stacked chambers 102 may be supported as part of a single device, for example, connected and supported by a single frame, rack, chassis, or bracket (not shown). In useful or preferred examples, the chambers may be stacked and supported vertically.

[0076] Figure 2 illustrates a device 200 comprising three distinct chambers 102, each chamber adapted to contain a single electrostatic chuck 100 for processing within a controlled atmosphere within a closed chamber interior space 104. The device includes a purge gas source 162 (more sources may be used if necessary) and one or more temperature-controlled fluid sources 160. In Figure 2, apart from sources 140 and 142, the chambers 102 and their constituent components (space 104, chuck 110, sensors, etc.) of the device 200 have a similar structure and numbering to those in Figure 1.

[0077] Each of the three chambers 102 illustrated is connected to a temperature-controlled fluid source. The source 160 for each chamber may be the same source or a different source. In the exemplary apparatus and method, source 160 supplies cooling water at a cooling water temperature to each of the three chambers 102, and the cooling water to all three chambers is drawn from a single source 160 and delivered at the same cooling water temperature. In an alternative exemplary apparatus and method, one source 160 supplies cooling water at a first cooling water temperature to one of the three chambers 102, and a second source 160 supplies cooling water at a second cooling water temperature to one or two other chambers. Thus, one of the three chambers can process a chuck at the first cooling water temperature, and one of the second chambers and, if applicable, a third chamber can process a chuck at a second cooling water temperature. Depending on the circumstances, a third chamber may be used to process a chuck at the first chuck temperature, the second chuck temperature, or by using a third cooling water source 160 at a third cooling water temperature different from the first and second cooling water temperatures.

[0078] Each of the three chambers 102 shown is connected to a chamber purge gas source 162. The source 162 for each chamber may be the same source or a different source.

[0079] Each of the three chambers 102 shown is also connected to a cooling channel purge gas source 162. In the exemplary apparatus and method, for any single chamber 102, the source 162 supplying purge gas to one of the cooling channels of the chuck 110 may be the same as or different from the source 162 supplying chamber purge gas to the space 104. For the three different chambers, some or all of the different chambers may receive chamber purge gas or cooling gas or both from a single source 162 or alternatively from two or more different purge gas sources; that is, although shown as three separate units, source 162 may be a single unit that supplies source gas to each of the three different chambers, and to each chamber it serves as both cooling purge gas and chamber purge gas.

[0080] Referring to Figure 3, an example of a configuration of electronic components that may be included as part of a device (e.g., 200) described herein or adapted to work with a device is illustrated. In Figure 3, the electronic controller 300 is a PLC that communicates electronically with a device 200 (represented by a frame surrounding the controller 300 and switch 320) (such as a device 200 (e.g., Figure 2)). The device 200 may include two or more individual chambers, sensors associated with each chamber, flow controllers (e.g., flow meters), and fluid sources for the device 200, including one or two coolers 304a and 304b (temperature-controlled fluid sources) and a purge gas source 306. As illustrated, the controller 300 communicates electronically with the electronic switch 320. The controller 300 is a PLC-type controller, but other electronic control devices including a central processing unit (CPU) and programmable control software may also be useful.

[0081] A laptop computer 308 and a connected barcode scanner 302 can be positioned near the device and communicate electronically with the device and a switch 320 that communicates with the controller 300. When processing a chuck, the scanner 302 can scan a barcode or other identification feature of the chuck to be processed, and the laptop computer 308 records the position and timing of placing the chuck into a chamber of the device for processing. Figure 3 also shows a network hardware (server) 310 that communicates with the controller 300, and one or more remote computers 312 that can access the network hardware 310 through a Virtual Private Network (VPN).

[0082] In one first embodiment, an apparatus for handling an electrostatic chuck includes: a chamber containing a chamber atmosphere; a chamber purge gas source adapted to supply chamber purge gas to the chamber; a temperature control fluid source adapted to supply temperature control fluid to the chamber; and a temperature sensor for measuring a temperature inside the chamber.

[0083] According to one of the first state samples, the second state sample further includes a humidity sensor for measuring the humidity of the chamber atmosphere.

[0084] According to one of the first or second states, the third state further includes: a first catheter for supplying temperature-controlled fluid to a chamber; a second catheter for removing temperature-controlled fluid from the chamber, wherein a temperature sensor is adapted to measure the temperature of one of the temperature-controlled fluids at the first catheter; and a second temperature sensor adapted to measure the temperature of one of the temperature-controlled fluids at the second catheter.

[0085] According to any one of the above states, the fourth state further includes a flow meter for controlling the amount of chamber purge gas supplied from the chamber purge gas source to the chamber.

[0086] According to any one of the above states, the fifth state further includes a pressure sensor inside the chamber, which is adapted to measure the pressure of the temperature control fluid inside the chamber.

[0087] According to any one of the above states, the sixth state further includes an electronic controller that communicates with one or more sensors in the chamber, a chamber purge gas source, and a temperature control fluid source.

[0088] According to one of the sixth and seventh states, the electronic controller includes a timer for controlling one or more of the following: supplying temperature control fluid to the chamber for a period of time, supplying chamber purge gas to the chamber for a period of time, or both.

[0089] According to one of the sixth or seventh states, the electronic controller is adapted to record data during operation of the device, including: temperature data from one or more temperature sensors inside the chamber, and humidity data from one humidity sensor inside the chamber.

[0090] According to any one of the above-mentioned states, the ninth state further includes an electrostatic chuck contained within the chamber, the electrostatic chuck comprising: a first layer, a second layer, a fluid flow channel passing through at least one of the two layers, and an adhesive between the first layer and the second layer, wherein a temperature-controlled fluid source is connected to the fluid flow channel.

[0091] According to one of the ninth and tenth states, a conduit is further included to provide a temperature-controlled fluid to an inlet of a fluid flow channel, and a conduit to receive the temperature-controlled fluid from an outlet of a fluid flow channel.

[0092] According to one of the ninth or tenth states, the eleventh state further includes a pressure sensor for measuring the pressure of a temperature-controlled fluid.

[0093] According to one of the ninth to eleventh states, the twelfth state further includes a purge gas source suitable for supplying purge gas to the fluid flow channel.

[0094] According to any one of the above states, the thirteenth state further includes: a second chamber containing a second chamber atmosphere; a chamber purge gas source adapted to supply chamber purge gas to the second chamber; a temperature control fluid source adapted to supply temperature control fluid to the second chamber; and a temperature sensor for measuring a temperature inside the second chamber.

[0095] According to one of the thirteenth and fourteenth state samples, an electronic controller is further included, which communicates with one or more sensors in one chamber, one or more sensors in a second chamber, a chamber purge gas source, and a temperature control fluid source.

[0096] According to one of the thirteenth or fourteenth states, the fifteenth state further includes a second temperature-controlled fluid source, wherein: the temperature-controlled fluid source is adapted to supply temperature-controlled fluid to the chamber, and the second temperature-controlled fluid source is adapted to supply temperature-controlled fluid to the second chamber.

[0097] According to any one of the thirteenth to fifteenth states, the sixteenth state further includes a chassis that vertically stacks and supports one of the chambers and the second chamber, and an electronic controller that communicates with one or more sensors in the first chamber, one or more sensors in the second chamber, a chamber purge gas source, and a temperature control fluid source.

[0098] In a seventeenth embodiment, a method for processing an electrostatic chuck is disclosed, the electrostatic chuck comprising: a first layer, a second layer and an adhesive between the first layer and the second layer, the method comprising: with the chuck positioned in a chamber, the chamber comprising: a chamber atmosphere and a temperature sensor, using an electronic controller to control a temperature of the chuck and to control the humidity in the chamber.

[0099] According to one of the seventeenth and eighteenth state samples, the temperature of the chuck is controlled to be maintained below 15 degrees Celsius, and the humidity in the chamber is controlled by adding a certain amount of dry gas to the chamber to prevent condensation from forming on one of the surfaces of the chuck.

[0100] According to one of the seventeenth or eighteenth states, the nineteenth state further includes controlling the temperature of the chuck to a time period sufficient to allow the adhesive to cure.

[0101] According to any one of the seventeenth to nineteenth states, the twentieth state further includes: placing the chuck in the chamber while the adhesive is not cured, and controlling the temperature of the chuck while the chuck is in the chamber, allowing the adhesive to cure for a period of at least 40 minutes.

[0102] According to any one of the seventeenth to twentieth states, in the twenty-first state, the chuck includes a cooling channel passing through at least one of two layers, the chamber includes a temperature-controlled fluid source adapted to supply temperature-controlled fluid to the cooling channel, and a temperature sensor measures the temperature of the temperature-controlled fluid.

[0103] According to one of the twenty-first and twenty-second state samples, the method further includes passing a channel purge gas through a cooling channel to remove liquid from the cooling channel.

[0104] According to any one of the seventeenth to twenty-second states, the twenty-third state further includes: recording the temperature of the chuck.

[0105] According to any one of the seventeenth to twenty-third states, the twenty-fourth state further includes delivering chamber purge gas into the chamber to reduce the relative humidity of the chamber atmosphere.

[0106] According to any one of the seventeenth to twenty-fourth states, the twenty-fifth state is wherein the first layer is ceramic, the second layer is aluminum, and the adhesive is an epoxy adhesive.

[0107] According to any one of the seventeenth to twenty-fifth states, the twenty-sixth state further includes processing the electrostatic chuck and a second electrostatic chuck positioned in a second chamber. The second electrostatic chuck includes: a first layer, a second layer, a fluid flow channel passing through at least one of the two layers, and an adhesive between the first layer and the second layer. The second chamber includes: a second chamber atmosphere, and a temperature sensor for measuring the temperature of the second electrostatic chuck. The method includes: with the second chuck positioned in the second chamber, using an electronic controller to control the temperature of the second chuck and control the humidity in the second chamber.

[0108] In a twenty-seventh embodiment, an apparatus for handling an electrostatic chuck includes: a chamber containing a chamber atmosphere; and an electrostatic chuck comprising: a first layer, a second layer, a fluid flow channel passing through at least one of the two layers, an adhesive between the first layer and the second layer, a temperature-controlled fluid source connected to the fluid flow channel, and a purge gas source connected to the fluid flow channel.

[0109] According to one of the twenty-seventh and twenty-eighth state samples, it further includes: a chamber purge gas source suitable for supplying chamber purge gas to the chamber, and a temperature sensor for measuring the temperature of the electrostatic chuck.

[0110] According to one of the twenty-seventh or twenty-eighth states, the twenty-ninth state further includes a humidity sensor for measuring the humidity of the chamber atmosphere.

[0111] According to any one of the twenty-seventh to twenty-ninth states, the thirtieth state further includes an electronic controller that communicates with a temperature control fluid source and a chamber purge gas source.

[0112] 100: Device 102: Chamber 104: Internal space of the chamber 110: Electrostatic Chuck 112: Upper level 114: Basal layer 116: Adhesive layer 120: Entry / Input 122: Export / Output 124: Catheter 126: Catheter 128: Electronic Controller 130: Relative Humidity Sensor 134: Temperature sensor 136: Liquid pressure sensor 140: Temperature-controlled fluid source 142: Channel purge gas source 144: Flow meter 146: Switch or valve 148: Switch or valve 160: Temperature control fluid source / cooling water source 162: Purge gas source 200: Device 300: Controller 302: Barcode Scanner 304a: Cooler 304b: Cooler 306: Purge gas source 310: Network hardware (server) 312: Remote computer 320: Switch

Claims

1. An apparatus for handling an electrostatic chuck, the apparatus comprising: A chamber containing a chamber atmosphere, a chamber purge gas source adapted to supply chamber purge gas to the chamber, the chamber purge gas system being a dry purge gas, a temperature control fluid source adapted to supply temperature control fluid to the chamber, and a temperature sensor for measuring a temperature inside the chamber.

2. The apparatus of claim 1, further comprising a humidity sensor for measuring the humidity of the chamber atmosphere.

3. The apparatus of claim 1, further comprising: A first conduit for supplying the temperature-controlled fluid to the chamber, a second conduit for removing the temperature-controlled fluid from the chamber, wherein a temperature sensor is adapted to measure the temperature of one of the temperature-controlled fluids at the first conduit, and a second temperature sensor is adapted to measure the temperature of one of the temperature-controlled fluids at the second conduit.

4. The apparatus of claim 1, further comprising a flow meter for controlling the amount of chamber purge gas supplied to the chamber from the chamber purge gas source.

5. The apparatus of claim 1, further comprising a pressure sensor inside the chamber adapted to measure the pressure of the temperature control fluid inside the chamber.

6. The apparatus of claim 1, further comprising an electronic controller that communicates with one or more sensors in the chamber, a source of purging gas for the chamber, and a source of temperature control fluid.

7. The apparatus of claim 1, further comprising an electrostatic chuck contained within the chamber, the electrostatic chuck comprising: A first layer, a second layer, a fluid flow channel passing through at least one of the two layers, and an adhesive between the first layer and the second layer, wherein the temperature-controlled fluid source is connected to the fluid flow channel.

8. The apparatus of claim 1, further comprising: A second chamber containing a second chamber atmosphere, a chamber purge gas source adapted to supply chamber purge gas to the second chamber, a temperature control fluid source adapted to supply temperature control fluid to the second chamber, and a temperature sensor for measuring a temperature inside the second chamber.

9. A method for processing an electrostatic chuck, the electrostatic chuck comprising: The method includes a first layer, a second layer, and an adhesive between the first layer and the second layer, wherein, with the chuck positioned in a chamber, the chamber includes: a chamber atmosphere and a temperature sensor, and an electronic controller is used to control a temperature of the chuck and to control humidity in the chamber.

10. An apparatus for handling an electrostatic chuck, the apparatus comprising: A chamber containing a chamber atmosphere, and an electrostatic chuck comprising: a first layer, a second layer, a fluid flow channel passing through at least one of the two layers, an adhesive between the first and second layers, a temperature-controlled fluid source connected to the fluid flow channel, and a purge gas source connected to the fluid flow channel for supplying a dry purge gas.

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