Method for manufacturing wire springs that control the spacing of wire assemblies

Abstract

A method for manufacturing a conductor spring with controlled spacing of conductor assemblies includes: arranging a plurality of warp yarns and a plurality of conductor assemblies at intervals; weaving a plurality of weft yarns along the warp yarns and conductor assemblies to form a substrate; immersing the substrate in a resin solution; drying the substrate; placing the substrate between a pressing surface and a molding surface, while a plurality of first pressing members press against the inner and outer sides of the substrate of the conductor assemblies outside two ends of the conductor spring forming block; hot-pressing the conductor spring onto the conductor spring forming block of the substrate using the pressing surface and the molding surface; and separating the conductor spring from the substrate. Thus, during hot-pressing, the method of the present invention can control the spacing of the conductor assemblies, preventing misalignment of the conductor assemblies.

Description

Technical Field

[0001] This invention relates to a method for manufacturing a conductor spring, and more particularly to a method for manufacturing a conductor spring that controls the spacing of a conductor assembly. Prior Technology

[0002] A typical moving-coil loudspeaker produces sound by utilizing the principle that the reaction force of a fixed magnetic field causes another magnetic field to move in the opposite direction (i.e., opposite poles attract, like poles repel). More specifically, the alternating current from the power amplifier is transmitted to the voice coil via wires to change the polarity of the magnetic field, causing the voice coil to generate a reaction force relative to the fixed magnetic field created by the magnet. A positive pulse causes the diaphragm to move outward relative to the magnet, while a negative pulse causes the diaphragm to move inward relative to the magnet. As the voice coil drives the diaphragm in this reciprocating motion, the diaphragm pushes air, changing the air pressure and creating sound waves. A spider is used to hold the voice coil in the correct position within the gap in the magnet's core, ensuring that the voice coil reciprocates along its axis when under force. A suspension is placed between the diaphragm and the outer frame to support the diaphragm.

[0003] A conventional method for manufacturing conductive springs includes the following steps: combining and weaving a plurality of warp yarns, a plurality of weft yarns, and a plurality of conductive wires into a substrate; immersing the substrate in a resin solution; drying the substrate; heating and pressing a conductive spring forming block on the substrate to form a conductive spring; and separating the conductive spring from the substrate.

[0004] However, since the two ends of these wire assemblies are not fixed, the substrate and the wire assemblies will shrink during the heating and pressurization process, causing the wire assemblies to misalign.

[0005] Furthermore, since the conductor assembly is made of multiple twisted or braided metal yarns, the pressing surface of the pressing mold and the forming surface of the forming mold will heat and press the conductor assembly during the heating and pressing process, causing damage to the conductor assembly. In particular, the damage to the two ends of the conductor assembly is especially severe. Summary of the Invention

[0006] The main objective of this invention is to provide a method for manufacturing a conductor spring that controls the spacing of conductor assemblies, thereby preventing misalignment of the conductor assemblies.

[0007] Another object of the present invention is to provide a method for manufacturing a conductor spring that controls the spacing of the conductor assembly, thereby preventing the conductor assembly from being damaged by pressure.

[0008] To achieve the aforementioned objective, the present invention provides a method for manufacturing a wire elastic wave that controls the spacing of wire assemblies, comprising the following steps: (a) spaced apart a plurality of warp yarns and a plurality of wire assemblies, wherein the warp yarns and the wire assemblies extend in a straight line along a first direction and are parallel to each other, wherein each wire assembly is composed of a plurality of wires, and each wire is a monofilament; (b) weaving a plurality of weft yarns along a second direction into the warp yarns and the wire assemblies to weave a substrate, wherein the first direction is perpendicular to the second direction, and the substrate has a wire elastic wave forming block; (c) immersing the substrate. (d) The substrate is dried in a resin solution to form a solid resin layer on the substrate; (e) The substrate is placed between a pressing surface of a pressing mold of a thermoforming apparatus and a forming surface of a forming mold of the thermoforming apparatus, while a plurality of first pressing members press the inner and outer sides of the substrate of the conductor assembly outside the two ends of the conductor spring forming block; and an upper conductor spring forming part of the pressing surface and a lower conductor spring forming part of the forming surface are heated and pressed together on the conductor spring forming block to form a conductor spring; and (f) The conductor spring is separated from the substrate.

[0009] In some embodiments, each of the first pressure members is a roller.

[0010] In some embodiments, the spacing between two adjacent first pressure members is equal to the diameter of each wire assembly.

[0011] In some embodiments, step (b) further includes: the substrate has a force-balancing portion forming block, the force-balancing portion forming block being located around the conductor elastic forming block; wherein, step (e) further includes: a force-balancing portion forming protrusion located around the upper conductor elastic forming portion on the pressing surface and a force-balancing portion forming groove located around the lower conductor elastic forming portion on the forming surface are heated and pressurized together on the force-balancing portion forming block to form a force-balancing portion; wherein, step (f) further includes: the force-balancing portion being retained on the substrate.

[0012] In some embodiments, step (e) further includes: two blocks of a force-balancing portion forming protrusion around the upper conductor elastic forming portion on the pressing surface and two grooves of a force-balancing portion forming groove around the lower conductor elastic forming portion on the forming surface are heated and pressed together on the force-balancing portion forming block to form two eaves of a force-balancing portion, wherein the blocks, the grooves and the eaves are all U-shaped or semi-circular, and two connecting blocks are formed between the eaves, and the conductor assembly extends through the connecting blocks; wherein, step (f) further includes: the eaves are retained on the substrate.

[0013] In some embodiments, step (b) further includes: the conductor elastic forming block has a central lead-out block, the central lead-out block including four conductor lead-out positions; wherein, step (e) further includes: the upper conductor elastic forming part includes a pressing wave part, a pressing middle part and two conductor protection grooves, the pressing wave part surrounds the outside of the pressing middle part, the pressing middle part has a positioning protrusion, the positioning protrusion is elongated elliptical, the positioning protrusion extends from one side of the pressing middle part to the other side of the pressing middle part. On one side and through the axis of the pressing surface, a limiting insertion hole is recessed at the axis of the pressing surface. The wire protection grooves extend through the pressing wave portion and the pressing middle portion, respectively disposed on both sides of the positioning protrusion, and their length direction is parallel to the length direction of the positioning protrusion; the lower wire elastic wave forming portion includes a forming wave portion, a forming middle portion and two wire positioning grooves. The forming wave portion surrounds the outside of the forming middle portion. The forming middle portion is recessed with a positioning groove, which is elongated elliptical in shape. The positioning groove extends from... One side of the molded middle portion extends to the other side of the molded middle portion and passes through the axis of the molded surface. A central protrusion is provided at the axis of the molded surface. The conductor positioning grooves extend through the molded wave portion and the molded middle portion, respectively disposed on both sides of the positioning groove, and their length direction is parallel to the length direction of the positioning groove. The pressing wave portion and the molded wave portion together form a wave portion of the conductor wave on the conductor wave forming block. The pressing middle portion and the molded middle portion together form a central hole of the conductor wave on the conductor wave forming block. The positioning protrusion presses down the portion from one side of the center wire exit block to the other side of the center wire exit block into the positioning groove. The central protrusion presses up the axis of the center wire exit block further into the limiting insertion hole. The conductor protection grooves and the conductor positioning grooves together form two conductor limiting channels to restrict the deformation and shrinkage of the conductor wave forming block, so that the conductor assembly is adjusted to the conductor exit position and located in the conductor limiting channels.

[0014] In some embodiments, step (f) further includes: moving the substrate between an upper cutter and a lower cutter of a cutting device, while a plurality of second clamping members press against the substrate on the inner and outer sides of the conductor assembly outside the two ends of the conductor spring; and the upper cutter and the lower cutter cut the conductor spring from the substrate, such that the conductor spring is separated from the substrate.

[0015] In some embodiments, each of the second pressure members is a roller.

[0016] In some embodiments, the spacing between two adjacent second pressure members is equal to the diameter of each wire assembly.

[0017] The advantage of this invention is that, during hot pressing, the method of this invention can control the spacing of the wire assemblies and prevent misalignment of the wire assemblies.

[0018] Furthermore, during hot pressing, the wire protection grooves can protect the wire assemblies and prevent them from being damaged by the pressing mold 71. Simple Explanation of the Diagram

[0019] Figures 1A, 1B, and 1C are flowcharts of the method of the present invention. Figure 2 is a schematic diagram of steps S10 and S20 of the first embodiment of the method of the present invention. Figure 3 is a perspective view of steps S30 and S40 of the first embodiment of the method of the present invention. Figure 4 is a perspective view of step S50 of the first embodiment of the method of the present invention. Figure 5 is a cross-sectional view of line VV in Figure 4. Figure 6 is a three-dimensional cross-sectional view of the pressing mold of the present invention. Figure 7 is a three-dimensional cross-sectional view of the molding die of the present invention. Figure 8A is a cross-sectional view of the hot pressing forming apparatus of the present invention heating and pressing on a substrate to form a wire elastic wave and a force-balanced part. Figure 8B is a schematic diagram of region A in Figure 8A. Figure 8C is a schematic diagram of region B in Figure 8A. Figure 8D is a schematic diagram of region C in Figure 8A. Figure 9 is a perspective view of the hot pressing molding apparatus of the present invention heating and pressing on a substrate to form a wire elastic wave and a force-balanced part. Figure 10 is a perspective view of step S60 of the first embodiment of the method of the present invention. Figure 11 is a schematic diagram of steps S10 and S20 of the second embodiment of the method of the present invention. Figure 12 is a schematic diagram of steps S10 and S20 of the third embodiment of the method of the present invention. Implementation

[0020] The following description, in conjunction with the accompanying drawings and component symbols, provides a more detailed account of the embodiments of the present invention, so that those skilled in the art can implement them after studying this specification.

[0021] Figures 1A, 1B, and 1C are flowcharts of the method of the present invention. Figure 2 is a schematic diagram of steps S10 and S20 of the first embodiment of the method of the present invention. Figure 3 is a perspective view of steps S30 and S40 of the first embodiment of the method of the present invention. Figure 4 is a perspective view of step S50 of the first embodiment of the method of the present invention. Figure 5 is a cross-sectional view of line VV in Figure 4. Figure 6 is a perspective cross-sectional view of the pressing mold 71 of the present invention. Figure 7 is a perspective cross-sectional view of the molding mold 72 of the present invention. Figure 8A is a cross-sectional view of the hot pressing molding apparatus 70 of the present invention heating and pressing on the substrate 40 to form the wire elastic wave 100 and the force balancing part. Figure 8B is a schematic diagram of region A in Figure 8A. Figure 8C is a schematic diagram of region B in Figure 8A. Figure 8D is a schematic diagram of region C in Figure 8A. Figure 9 is a perspective view of the hot pressing molding apparatus 70 of the present invention heating and pressing on the substrate 40 to form the wire elastic wave 100 and the force balancing part. Figure 10 is a perspective view of step S60 of the first embodiment of the method of the present invention. This invention provides a method for manufacturing a conductor spring wave that controls the spacing of a conductor assembly, comprising the following steps:

[0022] In step S10, as shown in Figures 1A and 2, a plurality of warp yarns 10 and a plurality of conductor combinations 20 are spaced apart. The warp yarns 10 and conductor combinations 20 extend in a straight line along a first direction and are parallel to each other. Each conductor combination 20 consists of a plurality of conductors 21, each conductor 21 being a monofilament, and the conductors 21 are spaced apart from each other. Preferably, the warp yarns 10 are bamboo fiber, cotton fiber, silk fiber, hemp fiber, wool fiber, polyester fiber, acrylic fiber, polyvinyl naphthenic fiber, rayon fiber, rubber fiber, nylon fiber, elastic fiber, acetate fiber, or a combination thereof.

[0023] In step S20, as shown in Figures 1A and 2, a plurality of weft yarns 30 are interwoven along a second direction with the warp yarns 10 and the conductor combination 20 to weave a substrate 40. The first direction is perpendicular to the second direction. As shown in Figures 3 and 4, the substrate 40 has a conductor elasticated section 41. Preferably, the weft yarns 30 are bamboo fiber, cotton fiber, silk fiber, hemp fiber, wool fiber, polyester fiber, acrylic fiber, polyethylene naphthenic fiber, rayon fiber, rubber fiber, nylon fiber, elastic fiber, acetate fiber, or a combination thereof.

[0024] In step S30, as shown in Figures 1A and 3, the substrate 40 is immersed in a resin solution 51 within a resin tank 50, causing the warp yarns 10, the conductors 21, and the weft yarns 30 to absorb and adhere to the resin. The resin contains solids such as alcohol and water, accounting for more than 50% of the liquid resin content. The resin components are selected from one or a combination of phenolic resin, epoxy resin, polyester resin, rubber, and silicone, or other resin materials with similar properties.

[0025] In step S40, as shown in Figures 1A and 3, the substrate 40 is moved between an upper baking plate 61 and a lower baking plate 62 of a drying device 60. The substrate 40 is dried by the drying temperature of the upper baking plate 61 and the lower baking plate 62, so that the moisture and volatile substances in the resin on the substrate 40 are removed, thereby drying the substrate 40. At the same time, the resin penetrates into the substrate 40 and adheres to the warp yarns 10, the conductors 21 and the weft yarns 30 to form a resin solidification layer (not shown). The resin solidification layer covers the surface of the warp yarns 10, the conductors 21 and the weft yarns 30, thereby giving the substrate 40 appropriate hardness, elasticity and toughness.

[0026] In step S50, as shown in Figures 1A, 1B, and 4 to 9, the substrate 40 is placed between a pressing surface 711 of a pressing mold 71 of a thermoforming apparatus 70 and a forming surface 721 of a forming mold 72 of a thermoforming apparatus 70. Simultaneously, a plurality of first pressing members 80 press against the inner and outer sides of the substrate 40 of the conductor assemblies 20 outside the two ends of the conductor elastic forming block 41. An upper conductor elastic forming portion 7111 of the pressing surface 711 and a lower conductor elastic forming portion 7211 of the forming surface 721 are heated and pressurized together on the conductor elastic forming block 41 to form a conductor elastic 100. Thus, during thermoforming, the first pressing members 80 can control the spacing of the conductor assemblies 20, preventing misalignment of the conductor assemblies 20.

[0027] In step S60, as shown in Figures 1C and 10, the substrate 40 is moved between an upper cutter 91 and a lower cutter 92 of a cutting device 90; the upper cutter 91 and the lower cutter 92 cut the wire spring 100 from the substrate 40, so that the wire spring 100 is separated from the substrate 40.

[0028] Preferably, as shown in Figure 4, each of the first pressing elements 80 is a roller. This allows the first pressing elements 80 to provide excellent point-contact pressurization during hot pressing, improving their ability to control the spacing of the wire assemblies 20 and preventing misalignment of the wire assemblies 20.

[0029] Preferably, as shown in FIG5, the spacing between two adjacent first pressing members 80 is equal to the diameter of each wire assembly 20. In this way, during hot pressing, the first pressing members 80 can completely restrict the possibility of the wire assemblies 20 moving along the second direction, improving the effect of the first pressing members 80 in controlling the spacing of the wire assemblies 20 and preventing misalignment of the wire assemblies 20.

[0030] Preferably, step S20 further includes: as shown in Figures 1A, 3 and 4, the substrate 40 has a force-balancing part forming block 42, which is located around the wire elastic forming block 41; step S50 further includes: as shown in Figures 1A, 4 and 6 to 9, a force-balancing part forming protrusion 7112 located around the upper wire elastic forming part 7111 on the pressing surface 711 and a force-balancing part forming groove 7212 located around the lower wire elastic forming part 7211 on the forming surface 721 are heated and pressed together on the force-balancing part forming block 42 to form a force-balancing part 200; step S60 further includes: as shown in Figures 1C and 10, the force-balancing part 200 is retained on the substrate 40. In this way, the force balancing section 200 can evenly distribute the wrinkling force during heating and pressurization within the range of the wire elastic forming block 41, so that the wire elastic forming block 41 can bear the wrinkling force evenly, ensuring the integrity of the shape of the wire elastic 100 and preventing deformation. It is worth mentioning that, during hot pressing, because the wire elastic 100 does not deform, the spacing of the wire assemblies 20 can be further controlled, thereby preventing misalignment of the wire assemblies 20.

[0031] Preferably, step S50 further includes: as shown in Figures 4, 6 to 9, the two blocks 71121 of the force balancing part forming protrusion 7112 and the two grooves 72121 of the force balancing part forming groove 7212 are heated and pressed together on the force balancing part forming block 42 to form the two eaves 201 of the force balancing part 200. The blocks 71121, the grooves 72121 and the eaves 201 are all U-shaped. Two connecting blocks 43 are formed between the eaves 201. The wire assembly 20 extends through the connecting blocks 43. Step S60 further includes: as shown in Figure 10, the eaves 201 are retained on the substrate 40. Therefore, during hot pressing, the eaves 201 can disperse most of the shrinkage force during heating and pressing within the area of ​​the wire elastic forming blocks 41. A small portion of the shrinkage force is dispersed to other blocks of the substrate 40 by the connecting blocks 43. This results in the wire elastic forming blocks 41 closer to the connecting blocks 43 experiencing weaker shrinkage forces, while the remaining parts of the wire elastic forming blocks 41 experience stronger shrinkage forces. Consequently, the deformation of the wire elastic 100 closer to the connecting blocks 43 is greater than the deformation of the rest of the wire elastic 100. It is worth mentioning that because the connecting blocks 43 can completely confine the wire assemblies 20, the spacing of the wire assemblies 20 can be further controlled, thereby preventing misalignment of the wire assemblies 20.

[0032] In some embodiments, the U-shaped block can be modified into a semi-circular block, the U-shaped groove can be modified into a semi-circular groove, and the U-shaped eaves can be modified into semi-circular eaves, which can also achieve the same effect.

[0033] Preferably, step S20 further includes: as shown in Figures 1A, 3, and 4, the conductor elastic forming block 41 has a central lead-out block 411, and the central lead-out block 411 includes four conductor lead-out positions 4111; step S50 further includes: as shown in Figures 1B, 4, and 6, the upper conductor elastic forming part 7111 includes a pressing wave part 71111, a pressing middle part 71112, and two conductor protection grooves 71113, the pressing wave part 71111 surrounds the outside of the pressing middle part 71112, and the pressing middle part 71112 is provided with a positioning protrusion 711. 14. The positioning protrusion 71114 is elongated elliptical in shape. The positioning protrusion 71114 extends from one side of the pressing middle part 71112 to the other side of the pressing middle part 71112 and passes through the axis of the pressing surface 711. A limiting insertion hole 71115 is recessed at the axis of the pressing surface 711. The wire protection grooves 71113 extend through the pressing wave part 71111 and the pressing middle part 71112, respectively disposed on both sides of the positioning protrusion 71114, and their length direction is parallel to the length direction of the positioning protrusion 71114; as shown in Figures 1B, 4 and 7, the lower wire elastic wave forming part 7211 includes a shaped wave portion 72111, a shaped intermediate portion 72112, and two wire positioning grooves 72113. The shaped wave portion 72111 surrounds the outside of the shaped intermediate portion 72112. The shaped intermediate portion 72112 has a recessed positioning groove 72114, which is elongated elliptical in shape. The positioning groove 72114 extends from one side of the shaped intermediate portion 72112 to the other side and passes through the axis of the shaped surface 721. A central protrusion 72115 protrudes from the axis of the shaped surface 721. The wire positioning grooves 72113 extend... The forming wave portion 72111 and the forming intermediate portion 72112 extend through the forming wave portion 72111 and are respectively disposed on both sides of the positioning groove 72114, and their length direction is parallel to the length direction of the positioning groove 72114; as shown in Figures 1B, 8A, 8B, 8C, 8D and 9, the pressing wave portion 71111 and the forming wave portion 72111 together form a wave portion of the wire elastic wave 100 on the wire elastic wave forming block 41, and the pressing intermediate portion 71112 and the forming intermediate portion 72112 together form a central hole of the wire elastic wave 100 on the wire elastic wave forming block 41;As shown in Figures 1B, 8A, 8B, 8C, and 8D, the positioning protrusion 71114 presses the portion from one side to the other side of the center wire exit block 411 into the positioning groove 72114, and the central protrusion 72115 presses the axis of the center wire exit block 411 further into the limiting insertion hole 71115. The wire protection groove 71113 and the wire positioning groove 72113 together form a two-wire limiting channel 73 to restrict the deformation and shrinkage of the wire elastic forming block 41, so that the wire assembly 20 is adjusted to the wire exit position 4111 and located in the wire limiting channel 73. Therefore, during hot pressing, the combination of the positioning protrusion 71114 and the positioning groove 72114, as well as the combination of the central protrusion 72115 and the limiting insertion hole 71115, can effectively balance the wrinkling forces of the wire elastic forming block 41 and the force-balancing forming block 42, allowing for further control of the spacing of the wire assemblies 20 and stable positioning within the wire limiting channels 73, thereby preventing misalignment of the wire assemblies 20. Furthermore, during hot pressing, the wire protection grooves 71113 can protect the wire assemblies 20, preventing them from being damaged by the pressing mold 71.

[0034] Preferably, step S60 further includes: as shown in Figures 1C and 10, a plurality of second pressing members 81 press against the inner and outer substrates 40 of the conductor assemblies 20 outside the two ends of the conductor springs 100. Thereby, during cutting, the second pressing members 81 can control the spacing of the conductor assemblies 20, preventing misalignment of the conductor assemblies 20.

[0035] Preferably, as shown in FIG10, each of the second pressure members 81 is a roller. Thereby, during the cutting process, the second pressure members 81 can provide excellent point contact pressure, improve the effect of the second pressure members 81 in controlling the spacing of the wire assemblies 20, and prevent the wire assemblies 20 from misaligning.

[0036] Preferably, as shown in FIG10, the spacing between two adjacent second clamping members 81 is equal to the diameter of each conductor assembly 20. In this way, during the cutting process, the second clamping members 81 can completely restrict the possibility of the conductor assemblies 20 moving along the second direction, improving the effectiveness of the second clamping members 81 in controlling the spacing of the conductor assemblies 20 and preventing misalignment of the conductor assemblies 20.

[0037] Figure 11 is a schematic diagram of steps S10 and S20 of the second embodiment of the method of the present invention. As shown in Figure 11, the difference between the second embodiment and the first embodiment is that the conductors 21 are twisted together so that each conductor combination 20A forms a multifilament body with a circular cross-section.

[0038] Figure 12 is a schematic diagram of steps S10 and S20 of the third embodiment of the method of the present invention. As shown in Figure 12, the difference between the third embodiment and the first embodiment is that the conductors 21 are interwoven with each other, so that each conductor combination 20B forms a multifilament body with a flat cross-section.

[0039] The above description is merely for explaining preferred embodiments of the present invention and is not intended to limit the present invention in any way. Therefore, any modifications or changes made to the present invention under the same inventive spirit should still be included within the scope of protection intended by the present invention.

[0040] 10: Warp yarn 20, 20A, 20B: Conductor Combinations 21: Conductor 30: Weft yarn 40: Substrate 41: Conductor bouncy forming block 411: Central Outgoing Block 4111: Wire exit position 42: Force balance section forming block 43: Connecting Blocks 50: Resin tank 51: Resin solution 60: Drying device 61: Upper baking plate 62: Lower baking plate 70: Hot pressing forming device 71: Pressing mold 711: Pressed Surface 7111: Upper guide wire elastic wave forming part 71111: Pressed wave section 71112: Pressing Intermediate Section 71113: Wire protection groove 71114: Positioning bump 71115: Limiting socket 7112: Forming protrusion for force balance section 71121: Block 72: Molding mold 721: Molded Surface 7211: Lower guide wire elastic wave forming part 72111: Molded wave section 72112: Molding Intermediate Section 72113: Wire positioning groove 72114: Positioning Groove 72115: Central convex column 7212: Groove for forming the force balance part 72121: Groove 73: Conductor limiting channel 80: First pressing component 81: Second pressing component 90: Cutting device 91: Upgrade the cutting tool 92: Lowering the cutting tool 100: Wire bounce 200: Force balance section 201: Eaves S10~S60: Steps

Claims

1. A method for manufacturing a conductor spring wave that controls the spacing of conductor assemblies, comprising the following steps: (a) spaced apart a plurality of warp yarns and a plurality of conductor assemblies, the warp yarns and conductor assemblies extending in a straight line along a first direction and parallel to each other, wherein, Each of the conductor assemblies consists of a plurality of conductors, and each conductor is a monofilament; (b) a plurality of weft yarns are interwoven with the warp yarns and the conductor assemblies along a second direction to weave a substrate, wherein the first direction is perpendicular to the second direction, and the substrate has a conductor elasticated block; (c) the substrate is immersed in a resin solution; (d) the substrate is dried to form a resin solid layer on the substrate; (e) The substrate is placed between a pressing surface of a pressing mold of a thermoforming apparatus and a forming surface of a forming mold of the thermoforming apparatus, while a plurality of first pressing members press the substrate on the inner and outer sides of the conductor assembly outside the two ends of the conductor spring forming block; and an upper conductor spring forming part of the pressing surface and a lower conductor spring forming part of the forming surface are heated and pressed together on the conductor spring forming block to form a conductor spring; and (f) The substrate is moved between an upper cutter and a lower cutter of a cutting device, while a plurality of second pressing members press the substrate on the inner and outer sides of the conductor assembly outside the two ends of the conductor spring; and the upper cutter and the lower cutter cut the conductor spring from the substrate, so that the conductor spring is separated from the substrate.

2. A method for manufacturing a conductor spring wave that controls the spacing of the conductor assembly as described in claim 1, wherein, Each of the first pressing components is a roller.

3. A method for manufacturing a conductor spring wave that controls the spacing of the conductor assembly as described in claim 1, wherein, The distance between two adjacent first pressure members is equal to the diameter of each of the wire combinations.

4. A method for manufacturing a conductor spring wave that controls the spacing of the conductor assembly as described in claim 1, wherein, Step (b) further includes: the substrate has a force-balancing part forming block, the force-balancing part forming block being located around the conductor elastic forming block; wherein, step (e) further includes: a force-balancing part forming protrusion located around the upper conductor elastic forming part on the pressing surface and a force-balancing part forming groove located around the lower conductor elastic forming part on the forming surface are heated and pressed together on the force-balancing part forming block to form a force-balancing part; wherein, step (f) further includes: the force-balancing part being retained on the substrate.

5. A method for manufacturing a conductor spring wave that controls the spacing of the conductor assembly as described in claim 4, wherein, Step (e) further includes: two blocks of a force-balancing portion forming protrusion around the upper conductor elastic forming portion on the pressing surface and two grooves of a force-balancing portion forming groove around the lower conductor elastic forming portion on the forming surface are heated and pressed together on the force-balancing portion forming block to form two eaves of a force-balancing portion. The blocks, grooves and eaves are all U-shaped or semi-circular, and two connecting blocks are formed between the eaves. The conductor assembly extends through the connecting blocks. Step (f) further includes: the eaves are retained on the substrate.

6. A method for manufacturing a conductor spring wave that controls the spacing of the conductor assembly as described in claim 1, wherein, Step (b) further includes: the conductor bouncy forming block has a central lead-out section, the central lead-out section including four conductor lead-out positions; wherein, step (e) further includes: the upper conductor bouncy forming part includes a pressing wave part, a pressing middle part and two conductor protection grooves, the pressing wave part surrounds the outside of the pressing middle part, the pressing middle part has a positioning protrusion, the positioning protrusion is elongated elliptical, the positioning protrusion extends from one side of the pressing middle part to the other side of the pressing middle part and passes through... At the center of the pressing surface, a limiting insertion hole is recessed. The wire protection grooves extend through the pressing wave portion and the pressing middle portion, respectively disposed on both sides of the positioning protrusion, with their length direction parallel to the length direction of the positioning protrusion. The lower wire elastic forming portion includes a forming wave portion, a forming middle portion, and two wire positioning grooves. The forming wave portion surrounds the outside of the forming middle portion. The forming middle portion has a recessed positioning groove, which is elongated elliptical in shape. One side of the intermediate portion extends to the other side of the molded intermediate portion and passes through the axis of the molded surface. A central protrusion is provided at the axis of the molded surface. The conductor positioning grooves extend through the molded wave portion and the molded intermediate portion, respectively disposed on both sides of the positioning groove, and their length direction is parallel to the length direction of the positioning groove. The pressing wave portion and the molded wave portion together form a wave portion of the conductor wave on the conductor wave forming block. The pressing intermediate portion and the molded intermediate portion together form a central hole of the conductor wave on the conductor wave forming block. The positioning protrusion presses down the portion from one side of the center wire exit block to the other side of the center wire exit block into the positioning groove. The central protrusion presses up the axis of the center wire exit block further into the limiting insertion hole. The conductor protection grooves and the conductor positioning grooves together form two conductor limiting channels to restrict the deformation and shrinkage of the conductor wave forming block, so that the conductor assembly is adjusted to the conductor exit position and located in the conductor limiting channels.

7. A method for manufacturing a conductor spring wave that controls the spacing of the conductor assembly as described in claim 1, wherein, Each of the second pressing components is a roller.

8. A method for manufacturing a conductor spring wave that controls the spacing of the conductor assembly as described in claim 1, wherein, The spacing between two adjacent second pressure members is equal to the diameter of each of the wire combinations.

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