Method for manufacturing conductive elastic waves with controlled deformation and thermoforming apparatus

Abstract

A method for manufacturing conductive wave springs with controlled deformation includes: arranging warp yarns and conductive wires alternately; weaving weft yarns into the warp yarns and conductive wires to weave a substrate; immersing the substrate in a resin solution; drying the substrate; placing the substrate between a pressing mold and a forming mold of a thermoforming apparatus; hot-pressing conductive wave springs onto the substrate using an upper conductive wave spring forming part and a lower conductive wave spring forming part; hot-pressing a force-balancing part onto the substrate using a force-balancing part forming protrusion and a force-balancing part forming groove; and separating the conductive wave springs from the substrate while retaining the force-balancing part on the substrate. In this way, the force-balancing part can control the degree of wrinkling force borne by the conductive wave spring forming area, thereby controlling the degree of deformation of the conductive wave springs.

Description

Technical Field

[0001] This invention relates to a method for manufacturing elastic wires and a hot pressing forming apparatus, particularly a method for manufacturing elastic wires and a hot pressing forming apparatus for controlling the degree of deformation. Prior Technology

[0002] A typical moving-coil loudspeaker produces sound by utilizing the principle that the reaction force of a fixed magnetic field causes another magnetic field to move in the opposite direction (i.e., opposite poles attract, like poles repel). More specifically, the alternating current from the power amplifier is transmitted to the voice coil via wires to change the polarity of the magnetic field, causing the voice coil to generate a reaction force relative to the fixed magnetic field created by the magnet. A positive pulse causes the diaphragm to move outward relative to the magnet, while a negative pulse causes the diaphragm to move inward relative to the magnet. As the voice coil drives the diaphragm in this reciprocating motion, the diaphragm pushes air, changing the air pressure and creating sound waves. A spider is used to hold the voice coil in the correct position within the gap in the magnet's core, ensuring that the voice coil reciprocates along its axis when under force. A suspension is placed between the diaphragm and the outer frame to support the diaphragm.

[0003] A conventional method for manufacturing a conductive spring includes the following steps: combining and weaving a plurality of warp yarns, a plurality of weft yarns, and a plurality of conductive wires into a substrate; immersing the substrate in a resin solution; drying the substrate; heating and pressing a conductive spring forming block on the substrate to form a conductive spring; and separating the conductive spring from the substrate.

[0004] However, since the shrinkage force of the conductive wave forming block is distributed across the entire substrate when heated and pressurized, the degree of shrinkage force borne by the conductive wave forming block cannot be controlled, resulting in the deformation degree of the conductive wave being uncontrollable.

[0005] Furthermore, conventional wire bobbin manufacturing methods are automated and continuous, and the substrate has a certain degree of elasticity. Therefore, during the heating and pressurizing process, each flat wire bobbin forming block wrinkles into a wavy shape. This wrinkling force pulls each subsequent wire bobbin forming block forward a short distance, causing the positions of subsequent unformed wire bobbin forming blocks to slightly deviate from their original preset positions. As a result, the thermoforming device forms wire bobs at these slightly deviated positions, rather than precisely at the original positions, leading to a larger spacing between subsequently formed wire bobs than initially intended. Since substrate between adjacent wire bobs will form waste, the aforementioned problem generates more waste than originally anticipated, resulting in significant waste.

[0006] Furthermore, when the two-wire elastic wave forming blocks are continuously formed into two-wire elastic waves, the yarns between these elastic wave forming blocks will be pulled and broken by two wrinkling forces at the same time, further causing the substrate to be torn. Summary of the Invention

[0007] The main objective of this invention is to provide a method for manufacturing conductive wave springs and a hot pressing forming apparatus for controlling the degree of deformation, which can control the degree of wrinkling force borne by the conductive wave spring forming block, thereby achieving the purpose of controlling the degree of deformation of the conductive wave spring.

[0008] Another objective of this invention is to provide a method for manufacturing a conductive wave spring and a hot pressing forming apparatus for controlling the degree of deformation, which can ensure that the position of the conductive wave spring forming block remains unchanged.

[0009] Another objective of this invention is to provide a method for manufacturing a conductive wave with controlled deformation and a hot pressing forming apparatus, so that the substrate will not be torn.

[0010] To achieve the aforementioned objectives, the present invention provides a method for manufacturing a conductive elastic wave that controls the degree of deformation, comprising the following steps:

[0011] (a) A plurality of warp yarns and a plurality of conductors are arranged at intervals, the warp yarns and the conductors extending in a straight line along a first direction and parallel to each other, wherein each conductor assembly consists of a plurality of conductors and each conductor is a monofilament.

[0012] (b) A plurality of weft yarns are interwoven along a second direction with the warp yarns and the conductors to weave a substrate, wherein the first direction is perpendicular to the second direction, and the substrate has a conductor elastic forming area and a force balancing forming area, the force balancing forming area being located around the conductor elastic forming area.

[0013] (c) Immerse the substrate in a resin solution.

[0014] (d) Dry the substrate to form a resin solid layer on the substrate.

[0015] (e) The substrate is placed between a pressing surface of a pressing mold of a thermoforming apparatus and a forming surface of a forming mold of the thermoforming apparatus; an upper wire bob forming portion of the pressing surface and a lower wire bob forming portion of the forming surface are heated and pressed together on the wire bob forming area to form a wire bob; and a force balancing portion forming protrusion located around the upper wire bob forming portion of the pressing surface and a force balancing portion forming groove located around the lower wire bob forming portion of the forming surface are heated and pressed together on the force balancing portion forming area to form a force balancing portion.

[0016] (f) The conductor spring is separated from the substrate, and the force-balanced part remains on the substrate.

[0017] In some embodiments, step (e) further includes: a block of the force-balancing part forming protrusion and a groove of the force-balancing part forming groove are heated and pressed together on the force-balancing part forming area to form an eave of the force-balancing part, wherein the block, the groove and the eave are all annular; wherein, step (f) further includes: the eave is retained on the substrate.

[0018] In some embodiments, step (e) further includes: the two blocks of the force balancing portion forming protrusion and the two grooves of the force balancing portion forming groove are heated and pressed together on the force balancing portion forming block to form the two eaves of the force balancing portion, the blocks, the grooves and the eaves are all U-shaped or semi-circular, two connecting blocks are formed between the eaves, and the wire assembly extends through the connecting blocks; wherein, step (f) further includes: the eaves are retained on the substrate.

[0019] In some embodiments, step (e) further includes: the four blocks of the force balancing part forming protrusion and the four grooves of the force balancing part forming groove are heated and pressed together on the force balancing part forming block to form the four eaves of the force balancing part, the blocks, the grooves and the eaves are all L-shaped or arc-shaped, and a connecting block is formed between two adjacent eaves, and the wire assembly extends through two of the connecting blocks; wherein, step (f) further includes: the eaves are retained on the substrate.

[0020] To achieve the aforementioned objectives, the present invention provides a hot-press forming apparatus for controlling the degree of deformation of a conductive spring wave, comprising a pressing mold and a forming mold. The pressing mold includes a pressing surface, which includes an upper conductive spring wave forming portion and a force-balancing portion forming protrusion, the force-balancing portion forming protrusion being located around the upper conductive spring wave forming portion. The forming mold includes a forming surface, which includes a lower conductive spring wave forming portion and a force-balancing portion forming groove, the force-balancing portion forming groove being located around the lower conductive spring wave forming portion. The upper and lower conductive spring wave forming portions are heated and pressurized together on a conductive spring wave forming area of ​​a substrate to form a conductive spring wave. The force-balancing portion forming protrusion and the force-balancing portion forming groove are heated and pressurized together on a force-balancing portion forming area of ​​the substrate to form a force-balancing portion.

[0021] In some embodiments, the force-balancing part forming protrusion includes a block that is annular, and the force-balancing part forming groove includes a groove that is annular; wherein the block and the groove are heated and pressed together on the force-balancing part forming area to form an eave of the force-balancing part, and the eave is annular.

[0022] In some embodiments, the force-balancing portion forming protrusion includes two blocks, each block being U-shaped or semi-circular, and the force-balancing portion forming groove includes two grooves, each groove being U-shaped or semi-circular; wherein, the blocks and the grooves are heated and pressed together on the force-balancing portion forming area to form two eaves of the force-balancing portion, each eave being U-shaped or semi-circular, and two connecting blocks are formed between the eaves, the connecting blocks being used for a plurality of conductor combinations of the substrate to extend through.

[0023] In some embodiments, the force-balancing part forming protrusion includes four blocks, each block being L-shaped or arc-shaped, and the force-balancing part forming groove includes four grooves, each groove being L-shaped or arc-shaped; wherein, the blocks and the grooves are heated and pressed together on the force-balancing part forming area to form the four eaves of the force-balancing part, each eave being L-shaped or arc-shaped, and a connecting block is formed between two adjacent eaves, two of which are used for a plurality of wire combinations of the substrate to extend through.

[0024] The advantage of this invention is that the force balancing part can partially or completely disperse the wrinkling force of the wire elastic forming block when it is heated and pressurized within the range of the wire elastic forming block, thus achieving the following advantages:

[0025] Firstly, the force balance section can control the degree of shrinkage force borne by the conductor wave forming block, thereby achieving the purpose of controlling the degree of conductor wave deformation.

[0026] Secondly, the force balance section can ensure that the position of the wire bouncy forming block remains unchanged, so that the position of multiple subsequent wire bouncy forming blocks that have not yet been formed can remain unchanged, and the interval distance can also remain fixed, without any deviation problem, thus reducing the generation of waste.

[0027] Third, when the next conductor wave forming block forms the next conductor wave, the shrinkage force of the conductor wave forming block when heated and pressurized is effectively limited by the force balance part. Therefore, the warp yarns, conductor combinations and weft yarns between two adjacent force balance parts will not be torn, and the substrate will not be torn. Simple Explanation of the Diagram

[0028] Figure 1 is a flowchart of the method of the present invention. Figure 2 is a schematic diagram of steps S10 and S20 of the first embodiment of the method of the present invention. Figure 3 is a schematic diagram of steps S30 and S40 of the first embodiment of the method of the present invention. Figure 4 is a schematic diagram of step S50 of the first embodiment of the method of the present invention. Figure 5 is a perspective cross-sectional view of the first embodiment of the pressing mold of the present invention. Figure 6 is a perspective cross-sectional view of the first embodiment of the molding die of the present invention. Figure 7 is a schematic diagram of the first embodiment of the hot pressing molding apparatus of the present invention, in which the substrate is heated and pressurized to form a wire elastic wave and a force-balanced part. Figure 8 is a schematic diagram of step S60 of the first embodiment of the method of the present invention. Figure 9 is a schematic diagram of step S50 of the second embodiment of the method of the present invention. Figure 10 is a perspective cross-sectional view of a second embodiment of the pressing mold of the present invention. Figure 11 is a perspective cross-sectional view of a second embodiment of the molding die of the present invention. Figure 12 is a schematic diagram of a second embodiment of the hot pressing molding apparatus of the present invention, in which a conductor elastic wave and a force-balanced part are formed by heating and pressing on a substrate. Figure 13 is a schematic diagram of step S60 of the second embodiment of the method of the present invention. Figure 14 is a schematic diagram of step S50 of the third embodiment of the method of the present invention. Figure 15 is a perspective cross-sectional view of a third embodiment of the pressing mold of the present invention. Figure 16 is a perspective cross-sectional view of a third embodiment of the molding die of the present invention. Figure 17 is a schematic diagram of the third embodiment of the hot pressing molding apparatus of the present invention, in which the substrate is heated and pressurized to form a wire elastic wave and a force-balanced part. Figure 18 is a schematic diagram of step S60 of the third embodiment of the method of the present invention. Figure 19 is a schematic diagram of steps S10 and S20 of the fourth embodiment of the method of the present invention. Figure 20 is a schematic diagram of steps S10 and S20 of the fifth embodiment of the method of the present invention. Implementation

[0029] The following description, in conjunction with the accompanying drawings and component symbols, provides a more detailed account of the embodiments of the present invention, so that those skilled in the art can implement them after studying this specification.

[0030] Figure 1 is a flowchart of the method of the present invention. Figure 2 is a schematic diagram of steps S10 and S20 of the first embodiment of the method of the present invention. Figure 3 is a schematic diagram of steps S30 and S40 of the first embodiment of the method of the present invention. Figure 4 is a schematic diagram of step S50 of the first embodiment of the method of the present invention. Figure 5 is a perspective cross-sectional view of the first embodiment of the pressing mold 71 of the present invention. Figure 6 is a perspective cross-sectional view of the first embodiment of the forming mold 72 of the present invention. Figure 7 is a schematic diagram of the first embodiment of the hot pressing forming apparatus 70 of the present invention, showing heating and pressing on the substrate 40 to form the wire elastic wave 100 and the force balancing part 200. Figure 8 is a schematic diagram of step S60 of the first embodiment of the method of the present invention. The present invention provides a method for manufacturing wire elastic waves with controlled deformation, comprising the following steps:

[0031] In step S10, as shown in Figures 1 and 2, a plurality of warp yarns 10 and a plurality of conductor combinations 20 are spaced apart. The warp yarns 10 and conductor combinations 20 extend in a straight line along a first direction and are parallel to each other. Each conductor combination 20 consists of a plurality of conductors 21, each conductor 21 being a monofilament, and these conductors 21 are spaced apart from each other. Preferably, the warp yarns 10 are bamboo fiber, cotton fiber, silk fiber, hemp fiber, wool fiber, polyester fiber, acrylic fiber, polyvinyl naphthenic fiber, rayon fiber, rubber fiber, nylon fiber, elastic fiber, acetate fiber, or a combination thereof.

[0032] In step S20, as shown in Figures 1 and 2, a plurality of weft yarns 30 are interwoven along a second direction with the warp yarns 10 and the conductor combination 20 to weave a substrate 40. The first direction is perpendicular to the second direction. As shown in Figures 1, 3, and 4, the substrate 40 has a conductor elastic forming block 41 and a force-balancing forming block 42, with the force-balancing forming block 42 located around the conductor elastic forming block 41. Preferably, the weft yarns 30 are bamboo fiber, cotton fiber, silk fiber, hemp fiber, wool fiber, polyester fiber, acrylic fiber, polyethylene naphthenic fiber, rayon fiber, rubber fiber, nylon fiber, elastic fiber, acetate fiber, or a combination thereof.

[0033] In step S30, as shown in Figures 1 and 3, the substrate 40 is immersed in a resin solution 51 within a resin tank 50, causing the warp yarns 10, the conductors 21, and the weft yarns 30 to absorb and adhere to the resin. The resin contains solids such as alcohol and water, accounting for more than 50% of the liquid resin content. The resin components are selected from one or a combination of phenolic resin, epoxy resin, polyester resin, rubber, and silicone, or other resin materials with similar properties.

[0034] In step S40, as shown in Figures 1 and 3, the substrate 40 is moved between an upper baking plate 61 and a lower baking plate 62 of a drying device 60. The substrate 40 is dried by the drying temperature of the upper baking plate 61 and the lower baking plate 62, so that the moisture and volatile substances in the resin on the substrate 40 are removed, thereby drying the substrate 40. At the same time, the resin penetrates into the substrate 40 and adheres to the warp yarns 10, the conductors 21 and the weft yarns 30 to form a resin solidification layer (not shown). The resin solidification layer covers the surface of the warp yarns 10, the conductors 21 and the weft yarns 30, thereby giving the substrate 40 appropriate hardness, elasticity and toughness.

[0035] Step S50, as shown in Figures 1 and 4 to 7, involves placing the substrate 40 between a pressing surface 711 of a pressing mold 71 of a thermoforming apparatus 70 and a forming surface 721 of a forming mold 72 of a thermoforming apparatus 70; an upper conductive wave forming portion 7111 of the pressing surface 711 and a lower conductive wave forming portion 7211 of the forming surface 721 are heated and pressurized together on the conductive wave forming block 41 to form a conductive wave 100; and the conductive wave 100 is formed on the pressing surface 711. A piece 71121 of a force-balancing forming protrusion 7112 surrounding the upper conductor elastic forming part 7111 of 711, and a groove 72121 of a force-balancing forming groove 7212 surrounding the lower conductor elastic forming part 7211 of the forming surface 721, are heated and pressurized on the force-balancing forming block 42 to form an eave 201 of a force-balancing part 200. The piece 71121, the groove 72121, and the eave 201 are all annular. In this way, the force-balancing part 200 can evenly distribute the wrinkling force during heating and pressing within the range of the conductor elastic forming block 41, so that the conductor elastic forming block 41 can evenly bear the wrinkling force, ensuring the integrity of the shape of the conductor elastic 100 and preventing deformation.

[0036] In step S60, as shown in Figures 1 and 8, the substrate 40 is moved between an upper cutter 81 and a lower cutter 82 of a cutting device 80. The upper cutter 81 and the lower cutter 82 cut the wire spring 100 from the substrate 40, so that the wire spring 100 is separated from the substrate 40, and the eaves 201 remain on the substrate 40.

[0037] Figure 9 is a schematic diagram of step S50 of the second embodiment of the method of the present invention. Figure 10 is a perspective cross-sectional view of the second embodiment of the pressing mold 71A of the present invention. Figure 11 is a perspective cross-sectional view of the second embodiment of the molding mold 72A of the present invention. Figure 12 is a schematic diagram of the second embodiment of the hot pressing molding apparatus 70A of the present invention, in which heat and pressurize the substrate 40 to form the wire elastic wave 100 and the force balancing part 200A. Figure 13 is a schematic diagram of step S60 of the second embodiment of the method of the present invention. As shown in Figures 9 to 13, the difference between the second embodiment and the first embodiment is as follows: First, step S50 further includes: the two blocks 71121A of the force balancing part forming protrusion 7112A and the two grooves 72121A of the force balancing part forming groove 7212A are heated and pressed together on the force balancing part forming block 42 to form the two eaves 201A of the force balancing part 200. The blocks 71121A, the grooves 72121A and the eaves 201A are all U-shaped. Two connecting blocks 43 are formed between the eaves 201A. The wire assembly 20 extends through the connecting blocks 43. Second, step S60 further includes: the eaves 201A are retained on the substrate 40. In this way, the eaves 201A can disperse most of the shrinkage force during heating and pressurization within the range of the wire elastic forming blocks 41, and a small portion of the shrinkage force is dispersed to other blocks of the substrate through the connecting blocks 43. This results in the wire elastic forming blocks 41 being subjected to weaker shrinkage forces closer to the connecting blocks 43, while the remaining parts of the wire elastic forming blocks 41 are subjected to stronger shrinkage forces. Consequently, the deformation of the portion of the wire elastic 100 closer to the connecting blocks 43 is greater than the deformation of the rest of the wire elastic 100.

[0038] In some embodiments, the U-shaped block 71121A can be modified into a semi-circular block, the U-shaped groove 72121A can be modified into a semi-circular groove, and the U-shaped eaves 201A can be modified into a semi-circular eaves, which can also achieve the same effect.

[0039] Figure 14 is a schematic diagram of step S50 of the third embodiment of the method of the present invention. Figure 15 is a perspective cross-sectional view of the third embodiment of the pressing mold 71B of the present invention. Figure 16 is a perspective cross-sectional view of the third embodiment of the molding mold 72B of the present invention. Figure 17 is a schematic diagram of the third embodiment of the hot pressing molding apparatus 70B of the present invention, showing heating and pressing on the substrate 40 to form the wire elastic wave 100 and the force balancing part 200B. Figure 18 is a schematic diagram of step S60 of the third embodiment of the method of the present invention. As shown in Figures 14 to 18, the difference between the third embodiment and the first embodiment is as follows: First, step S50 further includes: the four blocks 71121B of the force balancing part forming protrusion 7112B and the four grooves 72121B of the force balancing part forming groove 7212B are heated and pressed together on the force balancing part forming block 42 to form the four eaves 201B of the force balancing part 200B. The blocks 71121B, the grooves 72121B and the eaves 201B are all L-shaped, and a connecting block 43A is formed between two adjacent eaves 201B. The wire assembly 20 extends through two of the connecting blocks 43A. Second, step S60 further includes: the eaves 201B are retained on the substrate 40. In this way, the eaves 201B can disperse most of the shrinkage force during heating and pressurization within the range of the wire elastic forming blocks 41, and a small portion of the shrinkage force is dispersed to other blocks of the substrate 40 through the connecting blocks 43A. This results in the wire elastic forming blocks 41 being subjected to weaker shrinkage forces closer to the connecting blocks 43A, while the remaining parts of the wire elastic forming blocks 41 are subjected to stronger shrinkage forces. Consequently, the deformation degree of the wire elastic 100 closer to the connecting blocks 43A is greater than the deformation degree of the remaining parts of the wire elastic 100.

[0040] In some embodiments, the L-shaped block 71121B can be modified into an arc-shaped block, the L-shaped groove 72121B can be modified into an arc-shaped groove, and the L-shaped eaves 201B can be modified into an arc-shaped eaves, which can also achieve the same effect.

[0041] Figure 19 is a schematic diagram of steps S10 and S20 of the fourth embodiment of the method of the present invention. As shown in Figure 19, the difference between the fourth embodiment and the previous embodiment is that the conductors 21 are twisted together so that each conductor combination 20A forms a multifilament body with a circular cross-section.

[0042] Figure 20 is a schematic diagram of steps S10 and S20 of the fifth embodiment of the method of the present invention. As shown in Figure 20, the difference between the fifth embodiment and the previous embodiment is that the conductors 21 are interwoven with each other, so that each conductor combination 20B forms a multifilament body with a flat cross-section.

[0043] In summary, the force balancing units 200, 200A, and 200B can partially or completely disperse the wrinkling force of the wire elastic forming block 41 when it is heated and pressurized within the range of the wire elastic forming block 41, thus achieving the following effects:

[0044] Firstly, the force balancing parts 200, 200A, and 200B can control the degree of shrinkage force borne by the conductor elastic wave forming block 41, thereby achieving the purpose of controlling the degree of deformation of the conductor elastic wave 100.

[0045] Secondly, the force balancing parts 200, 200A, and 200B can ensure that the position of the wire elastic forming block 41 remains unchanged, so that the position of the subsequent multiple wire elastic forming blocks 41 that have not yet been formed can remain unchanged, and the interval distance can also remain fixed, without any deviation problem, thus reducing the generation of waste.

[0046] Third, when the next conductor wave forming block 41 forms the next conductor wave 100, the wrinkling force of the conductor wave forming block 41 when it is heated and pressurized is effectively limited by the force balancing parts 200, 200A, and 200B. Therefore, the warp yarns 10, conductor combinations 20, and weft yarns 30 between adjacent two force balancing parts 200, 200A, and 200B will not be torn, and the substrate 40 will not be broken.

[0047] The above description is merely for explaining preferred embodiments of the present invention and is not intended to limit the present invention in any way. Therefore, any modifications or changes made to the present invention under the same inventive spirit should still be included within the scope of protection intended by the present invention.

[0048] 10: Warp yarn 20, 20A, 20B: Conductor Combinations 21: Conductor 30: Weft yarn 40: Substrate 41: Conductor bouncy forming block 42: Force balance section forming block 43,43A: Connecting blocks 50: Resin tank 51: Resin solution 60: Drying device 61: Upper baking plate 62: Lower baking plate 70, 70A, 70B: Hot pressing forming device 71, 71A, 71B: Pressing molds 711: Pressed Surface 7111: Upper guide wire elastic wave forming part 7112, 7112A, 7112B: Forming protrusions for force balance section 71121, 71121A, 71121B: Blocks 72, 72A, 72B: Molding molds 721: Molded Surface 7211: Lower guide wire elastic wave forming part 7212, 7212A, 7212B: Forming grooves for force balance parts 72121, 72121A, 72121B: Groove 80: Cutting device 81: Upper cutting tool 82: Lowering the cutting tool 100: Wire bounce 200, 200A, 200B: Force balance section 201, 201A, 201B: Eaves S10~S60: Steps

Claims

1. A method for manufacturing a conductive wave with controlled deformation, comprising the following steps: (a) arranging a plurality of warp yarns and a plurality of conductive strands at intervals, wherein the warp yarns and the conductive strands extend in a straight line along a first direction and are parallel to each other, wherein, Each of the conductor assemblies consists of a plurality of conductors, and each conductor is a monofilament; (b) a plurality of weft yarns are interwoven with the warp yarns and the conductor assemblies along a second direction to weave a substrate, wherein the first direction is perpendicular to the second direction, the substrate having a conductor elastic forming area and a force balancing forming area, the force balancing forming area being located around the conductor elastic forming area; (c) the substrate is immersed in a resin solution; (d) the substrate is dried to form a resin solid layer on the substrate; (e) The substrate is placed between a pressing surface of a pressing mold of a thermoforming apparatus and a forming surface of a forming mold of the thermoforming apparatus; an upper wire bobbin forming portion of the pressing surface and a lower wire bobbin forming portion of the forming surface are heated and pressurized together on the wire bobbin forming block to form a wire bobbin; and a plurality of blocks of a force-balancing forming protrusion located around the upper wire bobbin forming portion of the pressing surface and around the lower wire bobbin forming portion of the forming surface. A plurality of grooves in a force-balancing part forming groove are heated and pressurized on the force-balancing part forming block to form a plurality of eaves of a force-balancing part, wherein the blocks are arranged in a ring, the grooves are arranged in a ring, the eaves are arranged in a ring, and a plurality of connecting blocks are formed between the eaves, and the conductor assembly extends through two of the connecting blocks; and (f) the conductor spring is separated from the substrate, and the force-balancing part and the eaves remain on the substrate.

2. The method as described in request item 1, wherein, Step (e) further includes: the two blocks of the force balancing part forming protrusion and the two grooves of the force balancing part forming groove are heated and pressed together on the force balancing part forming area to form the two eaves of the force balancing part. The blocks, the grooves and the eaves are all U-shaped or semi-circular, and two connecting blocks are formed between the eaves.

3. The method as described in request item 1, wherein, Step (e) further includes: the four blocks of the force balancing part forming protrusion and the four grooves of the force balancing part forming groove are heated and pressed together on the force balancing part forming area to form the four eaves of the force balancing part. The blocks, the grooves and the eaves are all L-shaped or arc-shaped, and a connecting block is formed between two adjacent eaves.

4. A hot pressing forming apparatus for controlling the degree of deformation of a conductive elastic wave, comprising: A pressing mold includes a pressing surface, the pressing surface including an upper conductor elastic forming portion and a force balancing portion forming protrusion, the force balancing portion forming protrusion being located around the upper conductor elastic forming portion and including a plurality of blocks arranged in a ring; and a forming mold including a forming surface, the forming surface including a lower conductor elastic forming portion and a force balancing portion forming groove, the force balancing portion forming groove being located around the lower conductor elastic forming portion and including a plurality of grooves arranged in a ring; The upper conductor elastic forming part and the lower conductor elastic forming part are heated and pressed together on a conductor elastic forming block of a substrate to form a conductor elastic; and the blocks of the force balancing part forming protrusion and the grooves of the force balancing part forming groove are heated and pressed together on a force balancing part forming block of the substrate to form a plurality of eaves of a force balancing part, the eaves are arranged in a ring, a plurality of connecting blocks are formed between the eaves, and two of the connecting blocks are used for the plurality of conductor combinations of the substrate to extend through.

5. The hot pressing forming apparatus as described in claim 4, wherein, The force-balancing part forming protrusion includes two blocks, each of which is U-shaped or semi-circular. The force-balancing part forming groove includes two grooves, each of which is U-shaped or semi-circular. The blocks and grooves are heated and pressed together on the force-balancing part forming area to form the two eaves of the force-balancing part. Each eave is U-shaped or semi-circular, and two connecting blocks are formed between the eaves.

6. The hot pressing forming apparatus as claimed in claim 4, wherein, The force-balancing part forming protrusion includes four blocks, each block being L-shaped or arc-shaped, and the force-balancing part forming groove includes four grooves, each groove being L-shaped or arc-shaped; wherein, the blocks and grooves are heated and pressed together on the force-balancing part forming area to form the four eaves of the force-balancing part, each eave being L-shaped or arc-shaped, and a connecting block is formed between two adjacent eaves.

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