Multi-press, multi-temperature control workpress module and semiconductor package component testing device equipped with the same

Abstract

This invention discloses a multi-point pressure application and multi-point temperature control downpressure module and a semiconductor package component testing apparatus equipped with the downpressure module. It can simultaneously apply multiple downpressures of the same or different magnitudes to multiple wafers on a semiconductor package component, and simultaneously produce the same or different temperature control effects on these wafers. Specifically, multiple downpressure generating units drive multiple pressing blocks to apply downpressure to the wafers on the semiconductor package component; and the temperature regulating units on each pressing block heat or cool the wafers respectively.

Description

Technical Field

[0001] This invention relates to a pressure module and a semiconductor packaging component testing apparatus having the pressure module, and more particularly to a semiconductor packaging component testing apparatus for a pressure module capable of applying multiple pressures and generating multiple temperature control effects. Prior Technology

[0002] In traditional semiconductor package component testing technology, most use a single pressure probe and a single temperature controller. By contacting the chip with the pressure probe and applying downward pressure, in addition to allowing the temperature controller to heat up or cool down the chip, the downward pressure can also ensure complete electrical contact between the semiconductor package component and the test socket.

[0003] However, with the continuous advancement of advanced packaging technologies, 2.5D and 3D packaging technologies have now been developed. Currently well-known advanced packaging technologies include Integrated Fan-Out (InFO) and Chip-on-Wafer-on-Substrate (CoWoS) packaging, both of which can be used to package multiple chips assembled side-by-side. In other words, a semiconductor package using advanced packaging technologies will have multiple chips on its surface, and these chips may differ not only in area and thickness but also in thermal design power (TDP).

[0004] Therefore, traditional testing equipment using a single pressure probe and a single temperature controller is no longer suitable for advanced packaged semiconductor components. This is because a single pressure probe may not be able to fully contact all the wafers on the semiconductor package, nor can it independently control the temperature of individual wafers. However, this deficiency has a greater impact on wafers with different thermal design power, as it will cause uneven temperature distribution throughout the package structure, potentially leading to thermal crosstalk. This will affect the reliability of the semiconductor package structure and the detection accuracy of the testing equipment. Summary of the Invention

[0005] In view of this, the present invention provides a multi-point pressure application and multi-point temperature control downpressure module and a semiconductor packaging component testing device equipped with the downpressure module, which can simultaneously apply multiple downpressures of the same or different magnitudes to multiple wafers on the semiconductor packaging component and simultaneously produce multiple similar or different temperature control effects.

[0006] One embodiment of this invention provides a multi-point pressure application and multi-point temperature control downpressure module. The module mainly includes a plurality of pressure blocks, a plurality of pressure generating units, a plurality of temperature regulating units, and a controller. The pressure blocks correspond to a plurality of wafers on a semiconductor package component; the pressure generating units are respectively coupled to the plurality of pressure blocks; the temperature regulating units are respectively disposed on the pressure blocks; and the controller is electrically connected to the pressure generating units and the temperature regulating units. The controller is adapted to control the pressure generating units to drive the pressure blocks to apply pressure to the wafers on the semiconductor package component; and the controller is also adapted to control the temperature regulating units to heat or cool the plurality of wafers on the semiconductor package component.

[0007] Another embodiment of this invention provides a multi-point pressure and multi-point temperature control downpressure module, which mainly includes a plurality of pressing blocks, a plurality of downpressure generating units, a plurality of temperature regulating units, actuators, and a controller. The pressing blocks correspond to a plurality of wafers on a semiconductor package component; the downpressure generating units are coupled to the pressing blocks; the temperature regulating units are respectively disposed on the pressing blocks; and the controller is electrically connected to the temperature regulating units and the actuators. The controller is adapted to control the actuators to drive the pressing blocks to press against the wafers on the semiconductor package component, thereby driving the downpressure generating units to apply a plurality of downpressures to the wafers on the semiconductor package component; furthermore, the controller is adapted to control the temperature regulating units to heat or cool the wafers on the semiconductor package component.

[0008] Another embodiment of this invention provides a semiconductor package component testing apparatus. The apparatus mainly includes a fixed base, a test base, a sliding frame, the aforementioned multi-point pressure and multi-point temperature control-capable pressure module, and a sliding generation device. The test base is used to accommodate the semiconductor package component and is disposed on the fixed base; the pressure module is disposed on the sliding frame; the sliding generation device is electrically connected to a controller and is assembled in at least one of the fixed base and the sliding frame. The controller is adapted to control the sliding generation device to drive the sliding frame to slide, allowing the pressure module to selectively correspond to or move away from the test base.

[0009] Based on the above, the multi-point pressure application and multi-point temperature control downpressure module and the semiconductor package component testing device equipped with the downpressure module proposed in this case can apply downpressure to individual wafers or regions on the semiconductor package component according to actual needs. These downpressures can be set to be the same or different, and the temperature of each individual wafer or region can be independently controlled. For example, it is applicable to different wafers (such as SoC and HBM) or regions on semiconductor package components using 2.5D or 3D advanced packaging, and provides the required burn-in temperature and predetermined downpressure for each wafer or region. Simple Explanation of the Diagram

[0010] Figure 1 is a system block diagram of a multi-point pressure and multi-point temperature control downpressure module according to some embodiments of this case. Figure 2A is a schematic diagram of a multi-point pressure and multi-point temperature control downpressure module according to some embodiments of this case. Figure 2B is a schematic diagram of a multi-point pressure and multi-point temperature control downpressure module according to some embodiments of this case. Figure 3A is a schematic diagram of a multi-point pressure and multi-point temperature control downpressure module according to some embodiments of this case. Figure 3B is a schematic diagram of a multi-point pressure and multi-point temperature control downpressure module according to some embodiments of this case. Figure 4A is a schematic diagram of a semiconductor packaging component testing device according to some embodiments of this case, wherein a pressure module capable of multi-point pressure application and multi-point temperature control is located at the testing position. Figure 4B is a schematic diagram of a semiconductor packaging component testing device according to some embodiments of this case, wherein the pressure module capable of multi-point pressure application and multi-point temperature control is located in the pick-and-place position. Figure 5 is a schematic diagram of the test socket in the semiconductor packaging component testing apparatus according to some embodiments of this case. Figure 6 is a system block diagram of a multi-point pressure and multi-point temperature control downpressure module according to some embodiments of this case. Figure 7 is a top view of the semiconductor packaging component testing apparatus according to some embodiments of this case after removing the pressure module that can apply pressure at multiple points and control temperature at multiple points. Figure 8 is a perspective view of the multi-point pressure and multi-point temperature control downpressure module according to some embodiments of this case. Figure 9A is a perspective view of the first pressing block in the multi-point pressure and multi-point temperature control pressing module according to some embodiments of this case. Figure 9B is a perspective view of the second pressing block in the multi-point pressure and multi-point temperature control pressing module according to some embodiments of this case. Figure 10 is a front view of a multi-point pressure and multi-point temperature control downpressure module according to some embodiments of this case. Figure 11 is a top view of the first and second pressing blocks in the multi-point pressure and multi-point temperature control pressing module according to some embodiments of this case. Figure 12 is a perspective view of the first and second pressing blocks in the multi-point pressure and multi-point temperature control pressing module according to some embodiments of this case. Implementation

[0011] Various embodiments are described in detail below. These embodiments are merely illustrative and do not limit the scope of protection intended by the present invention. Furthermore, some elements are omitted in the drawings of the embodiments to clearly show the technical features of the present invention. Moreover, the same reference numerals will be used to denote the same or similar elements in all drawings, and the drawings of the present invention are for illustrative purposes only and are not necessarily drawn to scale, and not all details may be shown in the drawings.

[0012] Please refer to Figures 1 and 2A simultaneously. Figure 1 is a system block diagram of a multi-point pressure and multi-point temperature control downpressure module 1 according to some embodiments of this invention, and Figure 2A is a schematic diagram of a multi-point pressure and multi-point temperature control downpressure module 1 according to some embodiments of this invention. The figures show a multi-point pressure and multi-point temperature control downpressure module, hereinafter referred to as downpressure module 1, which mainly includes multiple pressing blocks 2, multiple downpressure generating units 3, multiple temperature regulating units 4, and a controller 5. The pressing blocks 2 are mainly used to correspond to a plurality of wafers 91 on a semiconductor package component 9, as shown in Figure 5. As shown in Figure 5, the semiconductor package component 9 adopts advanced packaging technology, and its upper surface is configured with multiple wafers 91, such as a central processing unit (CPU), a graphics processing unit (GPU), high bandwidth memory (HBM), or other various chiplets; in other embodiments, the semiconductor package component 9 can also be a heterogeneous integration semiconductor package structure or a silicon photonics package component.

[0013] Additionally, the figure shows multiple crimp blocks 2, each corresponding to a plurality of wafers 91 on the semiconductor package component 9; three crimp blocks 2 are shown in the figure, each corresponding to one of the three rows of wafers 91 on the semiconductor package component 9 in Figure 5. However, this is not limited to three crimp blocks 2. In other embodiments, the number and position of the crimp blocks 2 can be configured according to the specifications or characteristics of the wafers 91, for example, by configuring crimp blocks 2 of appropriate size, number, and position according to the size and thermal design power (TDP) of each individual wafer 91.

[0014] Furthermore, the figure shows multiple downward pressure generating units 3, each coupled to one of the multiple pressing blocks 2. In some embodiments, the number of downward pressure generating units 3 is the same as the number of pressing blocks 2; in other embodiments, the number may differ, for example, multiple downward pressure generating units 3 may be configured for larger pressing blocks 2. Additionally, in some embodiments, the downward pressure generating unit 3 may be, but is not limited to, a linear actuator, such as a linear motor, hydraulic cylinder, or pneumatic cylinder.

[0015] Furthermore, the figure shows multiple temperature regulating units 4, which are respectively disposed on the pressing blocks 2. In some embodiments, each temperature regulating unit 4 may be a heating unit or a cooling unit, or a component, device, or system that includes both heating and cooling units. The heating unit may be a heater 24 composed of an electric heating element, a resistive heating source, or other equivalent elements that can be controlled to rise in temperature. In other embodiments, the heating unit may also be composed of a pipe or chamber through which a high-temperature fluid flows.

[0016] Additionally, in the embodiment shown in the figure, the cooling unit may consist of a temperature-controlled fluid channel 233, which is connected to a coolant supply unit 15, responsible for supplying coolant to the temperature-controlled fluid channel 233 of the temperature regulating units 4. In some embodiments, the coolant supply unit 15 may be a cooling distribution unit (CDU) or a chiller. In other embodiments, the cooling unit may also be a thermoelectric module or a vapor-compression refrigeration system (VCRS). In some embodiments, the cooling unit may also serve as a condenser, for example, a meandering channel through which a refrigerant flows within the press block 2; the refrigerant may be liquid nitrogen, ethylene glycol, halogenated hydrocarbons, ammonia, sulfur dioxide, methane, or other cryogenic fluids.

[0017] Furthermore, the figure shows a controller 5 electrically connected to the pressure generating units 3 and the temperature regulating units 4. In some embodiments, the controller 5 may be, but is not limited to, a central processing unit (CPU), a microcontroller unit (MCU), a digital signal processor (DSP), a programmable logic controller (PLC), an application-specific integrated circuit (ASIC), a programmable logic device (PLD), or other similar devices or combinations thereof. In other embodiments, the controller 5 may also implement various operational functions through hardware circuitry, examples including but not limited to: workstations, laptops, client terminals, servers, distributed computing systems, handheld devices, or any other computing system or device. In its most basic configuration, the controller 5 may include at least one processor and system memory.

[0018] The controller 5 is adapted to control the pressure generating units 3, thereby driving the pressing blocks 2 to apply pressure to the wafers 91 on the semiconductor package component 9. In other words, the controller 5 can control the pressure generating units 3 to simultaneously apply multiple pressures of the same or different magnitudes to multiple wafers 91 on the semiconductor package component 9; it can even generate different travel strokes according to the different heights of multiple wafers 91, so as to ensure that each pressing block 2 can fully contact the upper surface of each wafer 91.

[0019] On the other hand, the controller 5 is also adapted to control the temperature regulation units 4 to heat or cool the wafers 91 on the semiconductor package component 9 respectively. In other words, in some embodiments, the controller 5 can control the temperature regulation units 4 to produce different temperature control effects for each wafer 91 according to the thermal design power (TDP) of each wafer 91, for example, to maintain all wafers 91 at the same temperature, or to maintain different temperatures for individual wafers 91. In one embodiment, for example, in a burn-in test, the controller 5 can control the heater 24 to heat all wafers 91 on the semiconductor package component 9 to and maintain a specific burn-in temperature.

[0020] Referring to Figure 2A, in some embodiments, each pressing block 2 may be equipped with a force sensing unit 6 and a temperature sensing unit 7. The force sensing unit 6 and the temperature sensing unit 7 are electrically connected to the controller 5. The force sensing units 6 can be controlled to measure the downward pressure applied by each pressing block 2 to the wafers 91 on the semiconductor package component 9, thereby ensuring that the downward pressure generating units 3 apply sufficient downward pressure to the wafers 91. Furthermore, the temperature sensing units 7 can be controlled to measure the temperature of the wafers 91 on the semiconductor package component 9, in conjunction with the temperature regulating units 4 to regulate the temperature of each wafer 91, thereby ensuring that each wafer 91 is maintained at a predetermined temperature value.

[0021] In some embodiments, the temperature value detected by the temperature sensing unit 7 is transmitted to the controller 5; when the detected temperature value is abnormal, the controller 5 will control the temperature regulating units 4 to increase or decrease the temperature of the pressing block 2, so as to further heat up or cool down the wafers 91 on the semiconductor package component 9, for example, by adjusting the temperature and flow rate of the coolant or the power of the heater 24. If the abnormal temperature situation continues to occur, the controller 5 will immediately send an alarm message and stop the test program.

[0022] Furthermore, in the embodiment shown in FIG2A, a coupling block 25 is disposed between each pressure generating unit 3 and each pressing block 2, and a force sensing unit 6 may be disposed between the coupling block 25 and the pressing block 2. The force sensing unit 6 may be, for example, but not limited to, a load cell, a capacitive pressure sensor, a piezoresistive pressure sensor, or any other type of pressure sensor.

[0023] Please refer to Figure 2B, which is a schematic diagram of a multi-point pressure and multi-point temperature control pressure module 1 according to some embodiments of this invention. In the embodiment shown in Figure 2B, a thin-film pressure sensing element 61 is disposed on one of the contact surfaces 21 of each pressure block 2. This contact surface 21 is used to contact the surface of the wafer 91 on the semiconductor package component 9. More specifically, the thin-film pressure sensing element 61 may be disposed between the lower surface of the pressure block 2 and the thermal interface material (TIM) 41.

[0024] In other embodiments, referring to Figure 1, a monitoring unit 20, such as a tilt sensor and a proximity sensor, can be further configured on each crimping block 2. This monitoring unit 20 can be paired with a force sensing unit 6 to transmit sensing signals back to the controller 5, thereby monitoring the contact between each crimping block 2 and the surface of the wafer 91. Further explanation: the tilt sensor can be used to monitor the posture of the crimping block 2 before and after contact with the semiconductor package component 9 to determine whether tilting has occurred; while the proximity sensor can be used to monitor whether there is complete contact between the crimping block 2 and the semiconductor package component 9. If the sensing signals detected by the monitoring unit 20 and the force sensing unit 6 are abnormal, such as excessive pressure or abnormal contact between the crimping block 2 and the semiconductor package component 9, the controller 5 can issue a control signal to stop the multiple pressure generating units 3 from pressing down, in order to avoid damage to the wafers 91 on the semiconductor package component 9. Furthermore, even if the sensing signals detected by the monitoring unit 20 and the force sensing unit 6 are in an abnormal state, but the horizontal position and downward pressure of the crimping block 2 do not exceed the set maximum threshold value, the controller 5 can send a control signal to a specific downward pressure generating unit 3 to adjust the appropriate downward pressure of the crimping block 2, so as to ensure that each crimping block 2 makes perfect contact with the wafers 91 on the semiconductor package component 9 before testing.

[0025] Please refer to Figure 3A, which is a schematic diagram of a multi-point pressure and multi-point temperature control downpressure module 1 according to some embodiments of this case. The difference between the embodiment shown in Figure 3A and the embodiment shown in Figure 2A is that the downpressure module 1 further includes an actuator 8, a lifting frame 16, a mounting frame 17, and multiple buffers 18. The lifting frame 16 is connected to the actuator 8, and the downpressure generating units 3 are disposed on the mounting frame 17; the mounting frame 17 is coupled to the lifting frame 16 and can slide up and down relative to it, and the buffers 18 are disposed between the lifting frame 16 and the mounting frame 17.

[0026] In other words, in some embodiments, the actuator 8 provides vertical displacement to the pressing blocks 2 through the lifting frame 16 and the mounting frame 17, allowing the pressing blocks 2 to approach or directly press against the wafers 91 on the semiconductor package component 9 to a considerable extent. Then, the downward pressure generating units 3 can apply downward pressure to the wafers 91. However, the buffer 18 provides a buffering effect, preventing the pressing blocks 2 from impacting the wafers 91 and causing damage to the semiconductor package component 9 during the process of the actuator 8 driving the pressing blocks 2 to descend. In some embodiments, the actuator 8 can be regarded as a master actuator, which can provide a large range of vertical movement; while the downward pressure generating unit 3 can be regarded as a slave actuator, which can provide a small vertical movement and apply downward pressure.

[0027] Please refer to Figure 3B, which is a schematic diagram of the multi-point pressure and multi-point temperature control downcomer module 1 according to some embodiments of this invention. Similarly, the difference between the embodiment shown in Figure 3B and the embodiment shown in Figure 2B is that this embodiment further includes an actuator 8, a lifting frame 16, a mounting frame 17, and multiple buffers 18, and the operating principle and function of these components are as described above. In addition, in some embodiments, the actuator 8 can be a linear actuator, such as a linear motor, hydraulic cylinder, or pneumatic cylinder; also, the actuator 8 can be composed of a composite mechanism, such as a motor combined with a ball screw or with transmission elements such as gears and racks.

[0028] Please refer to Figures 4A, 4B, and 5 simultaneously; Figure 4A is a schematic diagram of the semiconductor packaging component testing device 10 according to some embodiments of this invention, wherein the multi-point pressure and multi-point temperature control pressure module 1 is located in the testing position; Figure 4B is a schematic diagram of the semiconductor packaging component testing device 10 according to some embodiments of this invention, wherein the multi-point pressure and multi-point temperature control pressure module 1 is located in the pick-and-place position; Figure 5 is a schematic diagram of the test holder 11 in the semiconductor packaging component testing device 10 according to some embodiments of this invention.

[0029] The embodiments shown in Figures 4A and 4B provide a semiconductor packaging component testing device 10, which mainly includes a fixing base 12, a testing base 11, a sliding frame 13, and a pressing module 1. The fixing base 12 can be fixed on the working area of ​​the machine tool; in some embodiments, the fixing base 12 can be a U-shaped structural component, which may include a base plate 121 and two side plates 122.

[0030] Referring to Figure 5, the test socket 11 can be disposed on the base plate 121. In some embodiments, the test socket 11 can be composed of four positioning plates 111, which, together with the base plate 121, define an accommodating space for accommodating the semiconductor package component 9. Moreover, the accommodating space is also provided with a plurality of probes (not shown in the figure), which are mainly used for electrically contacting the contacts on the lower surface of the semiconductor package component 9 to facilitate the transmission of power and signals.

[0031] In addition, Figures 4A and 4B show a sliding frame 13, which is coupled to the fixed base 12 by means of guide rails and guide grooves, and the pressing module 1 can be disposed on the sliding frame 13. That is to say, the sliding frame 13 can slide relative to the fixed base 12, and the pressing module 1 can also move above the base plate 121 of the fixed base 12 along with the sliding frame 13.

[0032] Furthermore, in the embodiments shown in Figures 4A and 4B, a sliding generating device 14 is disposed on each of the two side plates 122 of the fixed base 12, which is electrically connected to the controller 5 and connected to the sliding frame 13. In other embodiments, the sliding generating device 14 may also be disposed on the sliding frame 13 and connected to the fixed base 12. In some embodiments, the sliding generating device 14 may be a linear actuator, such as a linear motor, hydraulic cylinder, or pneumatic cylinder.

[0033] In other words, the controller 5 can control the sliding generating device 14 to drive the sliding frame 13 to slide, allowing the pressure module 1 to selectively correspond to or move away from the test socket 11. As shown in Figure 4A, the pressure module 1 corresponds to the test socket 11, meaning it is located in a test position directly above the test socket 11. In this case, the pressure module 1 can apply downward pressure and temperature control to the semiconductor package component 9 on the test socket 11. On the other hand, as shown in Figure 4B, the pressure module 1 is located away from the test socket 11 in a pick-and-place position; in this case, the test socket 11 will not be obstructed by the pressure module 1, allowing a pick-and-place device (not shown) to remove the completed semiconductor package component 9 or place the semiconductor package component 9 to be tested.

[0034] Please also refer to Figures 6, 7, and 8; Figure 6 is a system block diagram of the multi-point pressure and multi-point temperature control downpressure module 1 according to some embodiments of this invention; Figure 7 is a top view of the semiconductor packaging component testing apparatus 10 after removing the multi-point pressure and multi-point temperature control downpressure module 1 according to some embodiments of this invention; Figure 8 is a perspective view of the multi-point pressure and multi-point temperature control downpressure module 1 according to some embodiments of this invention. In the embodiments shown in these figures, the downpressure module 1 mainly includes two pressing blocks 2, multiple downpressure generating units 3, two temperature regulating units 4, a controller 5, two force sensing units 6, two temperature sensing units 7, two monitoring units 20, and an actuator 8.

[0035] As shown in the figure, the pressing blocks 2 correspond to a plurality of wafers 91 on the semiconductor package component 9; the pressure generating unit 3 is coupled to the pressing blocks 2; the temperature regulating unit 4, the temperature sensing unit 7, the monitoring unit 20 and the force sensing unit 6 are respectively disposed on the pressing blocks 2; and the controller 5 is electrically connected to the temperature regulating unit 4, the force sensing unit 6, the temperature sensing unit 7, the monitoring unit 20 and the actuator 8.

[0036] In some embodiments, the controller 5 is adapted to control the actuator 8 to drive the pressing blocks 2 to press against the wafers 91 on the semiconductor package member 9, thereby driving the pressure generating units 3 to apply multiple pressures to the wafers 91 on the semiconductor package member 9. As for the configuration and function of the temperature regulating unit 4, the force sensing unit 6, the monitoring unit 20 and the temperature sensing unit 7, see the foregoing embodiments.

[0037] In the embodiment shown in FIG8, the pressing module 1 further includes a pressure plate 81, and the pressing blocks 2 include a first pressing block 22 and a second pressing block 23; wherein, the lower surface of the first pressing block 22 corresponds to the wafer 91 located in the middle on the semiconductor packaging component 9 (see FIG5), and the lower surface of the second pressing block 23 corresponds to the wafers 91 located in the two side rows on the semiconductor packaging component 9 (see FIG5).

[0038] The downward pressure generating units 3 include a plurality of first elastic elements 31 and a plurality of second elastic elements 32, wherein the first elastic elements 31 are located between the pressure plate 81 and the first pressing block 22, and the second elastic elements 32 are located between the pressure plate 81 and the second pressing block 23. The first elastic elements 31 and the second elastic elements 32 may be compression springs and may have different permissible compression amounts. Furthermore, in some embodiments, the first elastic elements 31 may be disposed at the four corners of the first pressing block 22; similarly, the second elastic elements 32 may be disposed at the four corners of the second pressing block 23.

[0039] When the actuator 8 is controlled to drive the pressure plate 81 toward the first pressure block 22 and the second pressure block 23, the first elastic members 31 and the second elastic members 32 will respectively apply different or the same downward pressure to the wafers 91 on the semiconductor packaging component 9 through the first pressure block 22 and the second pressure block 23.

[0040] Furthermore, please refer to Figure 5. The test stand 11 shown in the figure is composed of four positioning plates 111. In some embodiments, these positioning plates 111 are matched with the first pressing block 22 and the second pressing block 23, especially in the height direction. That is, when the pressing module 1 is pressed down, these positioning plates 111 can respectively limit the pressing depth of the first pressing block 22 and the second pressing block 23, so as to prevent the chip 91 from being damaged due to excessive pressing.

[0041] Please refer to Figures 9A and 9B together. Figure 9A is a perspective view of the first pressing block 22 in the multi-point pressure and multi-point temperature control pressing module 1 according to some embodiments of this invention. Figure 9B is a perspective view of the second pressing block 23 in the multi-point pressure and multi-point temperature control pressing module 1 according to some embodiments of this invention. In some embodiments, the first pressing block 22 includes a central protrusion 221 for contacting the wafer 91 located in the middle of the semiconductor package component 9 (see Figure 5); while the second pressing block 23 includes two protruding frame portions 231 and a central slot 232. The two protruding frame portions 231 are respectively disposed on two corresponding sides of the central slot 232; the two protruding frame portions 231 are used to contact the wafers 91 located in two rows on the sides of the semiconductor package component 9 (see also Figure 5).

[0042] Furthermore, the central protrusion 221 of the first crimping block 22 is located within the central slot 232 of the second crimping block 23. The two are loosely fitted, meaning that the first crimping block 22 and the second crimping block 23 can operate independently without interfering with each other. In some embodiments, a plurality of buffer springs 33 (see Figure 8) may also be arranged between the first crimping block 22 and the second crimping block 23 to prevent them from colliding with each other and to assist them in resetting and maintaining a specific distance.

[0043] In the embodiments shown in Figures 9A and 9B, the temperature regulating unit 4 includes a temperature-controlled fluid chamber 222 and a temperature-controlled fluid channel 233. The temperature-controlled fluid chamber 222 is disposed within the central protrusion 221 of the first pressing block 22, while the temperature-controlled fluid channel 233 is disposed on the second pressing block 23. Accordingly, by supplying high-temperature or low-temperature temperature-controlled fluids to the temperature-controlled fluid chamber 222 and the temperature-controlled fluid channel 233 respectively, the first pressing block 22 and the second pressing block 23 can respectively heat up or cool down the wafer 91 on the semiconductor packaging component 9. In some embodiments, a cooling distribution unit (CDU) or a chiller can be used to supply low-temperature fluids to the temperature-controlled fluid chamber 222 and the temperature-controlled fluid channel 233.

[0044] Referring also to Figures 7 and 8, in the embodiments shown in these figures, the pressure plate 81 includes two vertical portions 811 and a base plate portion 812; the vertical portions 811 are vertically connected to the base plate portion 812, and each vertical portion 811 includes an inclined groove 813, one end of which is adjacent to the base plate portion 812, and the other end is away from the base plate portion 812. Additionally, the actuator 8 includes a linear displacement generating unit 82, a horizontal slider 83, and a guide rod 84, with the horizontal slider 83 coupled to the linear displacement generating unit 82, and one end of the guide rod 84 connected to the horizontal slider 83, and the other end located within the inclined groove 813 of the vertical portion 811.

[0045] Accordingly, when the linear displacement generating unit 82 drives the horizontal slider 83 to slide horizontally, it can drive the guide rod 84 to slide within the inclined groove 813, thereby driving the pressure plate 81 to move closer to or away from the first pressing block 22 and the second pressing block 23. In other words, through the above mechanism design, the horizontal driving action of the linear displacement generating unit 82 can be converted into the lifting action of the pressure plate 81, thereby making the entire mechanism assembly more compact, especially significantly reducing the height.

[0046] Please also refer to Figure 10, which is a front view of the multi-point pressure and multi-point temperature control pressure module 1 according to some embodiments of this invention. The main difference between the embodiment shown in Figure 10 and the embodiment shown in Figure 8 is that, in the embodiment shown in Figure 10, the first elastic members 31 are located between the pressure plate 81 and the first pressing block 22, while the second elastic members 32 are located between the first pressing block 22 and the second pressing block 23.

[0047] When the controller 5 controls the actuator 8 to drive the pressure plate 81 toward the first pressure block 22 and the second pressure block 23, the first elastic members 31 will be driven to apply downward pressure to the wafer 91 on the semiconductor package component 9 through the first pressure block 22; at the same time, the first elastic members 31 and the second elastic members 32 can also be driven to apply another downward pressure to other wafers 91 on the semiconductor package component 9 through the second pressure block 23.

[0048] To further explain, the first pressing block 22 is only affected by the compressive force of the first elastic elements 31, while the second pressing block 23 is affected by the combined compressive force of the first elastic elements 31 and the second elastic elements 32. Therefore, the first pressing block 22 and the second pressing block 23 will generate two downward forces of different magnitudes.

[0049] Please refer to Figure 11, which is a top view of the first crimping block 22 and the second crimping block 23 in the multi-point pressure and multi-point temperature control crimping module 1 according to some embodiments of this invention. As shown in Figure 11, the first crimping block 22 includes two fluid flow ports 223, both of which are connected to the temperature-controlled fluid chamber 222 inside the first crimping block 22 (see Figure 9A). In addition, the second crimping block 23 includes two fluid channel ports 234, both of which are connected to the temperature-controlled fluid channel 233 inside the second crimping block 23 (see Figure 9B).

[0050] In fact, the two fluid flow ports 223 and the two fluid channel ports 234 each include an inlet and an outlet. The inlets allow temperature-controlled fluid to flow into the temperature-controlled fluid chamber 222 (see Figure 9A) and the temperature-controlled fluid channel 233 (see Figure 9B), while the outlets allow the temperature-controlled fluid to flow out. Furthermore, as shown in the figures, the two fluid flow ports 223 and the two fluid channel ports 234 are respectively disposed in a leak-proof groove 26. Accordingly, when leakage occurs at the fluid flow ports 223 and the fluid channel ports 234, the leak-proof groove 26 can accumulate the leaked fluid to prevent it from flowing directly onto the semiconductor package component 9 or other electronic components, thus avoiding a short circuit. In other embodiments, a leak detector 261 can be disposed within the leak-proof groove 26 to detect leakage immediately and report and handle it promptly.

[0051] Please refer to Figure 12, which is a perspective view of the first pressing block 22 and the second pressing block 23 in the multi-point pressure and multi-point temperature control pressing module 1 according to some embodiments of this case; in the embodiment shown in Figure 12, each leak-proof groove 26 may be equipped with a cover 262 to prevent liquid from splashing or overflowing.

[0052] Although the present invention has been disclosed above by way of embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

[0053] 1: Downward pressure module 2: Crimping block 3: Downforce generation unit 4: Temperature control unit 5: Controller 6: Force sensing unit 7: Temperature sensing unit 8: Actuator 9: Semiconductor packaging components 10: Semiconductor Packaging Component Testing Equipment 11: Test socket 12: Fixed base 13: Sliding frame 14: Slip generation device 15: Coolant Supply Unit 16: Lifting Frame 17: Mounting rack 18: Buffer 20: Monitoring Unit 21: Contact Surface 22: First crimping block 23: Second crimping block 24: Heater 25: Coupling Block 26: Leak-proof groove 31: First elastic element 32: Second elastic element 33: Buffer spring 41: Thermal interface materials 61: Thin-film pressure sensing sheet 81: Pressure Plate 82: Linear displacement generation unit 83: Horizontal slider 84: Guide rod 91: Chip 111: Positioning plate 121: Base Plate 122: Side panel 221: Central protrusion 222: Temperature-controlled fluid chamber 223: Fluid flow port 231: Convex frame portion 232: Central slotting 233: Temperature-controlled fluid channel 234: Fluid channel port 261: Leak Detector 262: Cover 811: Vertical part 812: Base Plate 813: Inclined groove

Claims

1. A downpressure module capable of multi-point pressure application and multi-point temperature control, the module comprising: The multiple press blocks correspond to multiple wafers on a semiconductor package component; A plurality of downward pressure generating units are respectively coupled to the plurality of pressing blocks; a plurality of temperature regulating units are respectively disposed on the plurality of pressing blocks; a plurality of force sensing units are respectively disposed on the plurality of pressing blocks; The system also includes a controller electrically connected to the plurality of pressure generating units, the plurality of force sensing units, and the plurality of temperature regulating units; wherein the controller is adapted to control the plurality of pressure generating units to drive the plurality of pressing blocks to apply pressure to the plurality of wafers on the semiconductor package component; the controller is adapted to control the plurality of force sensing units to measure the pressure applied by the plurality of pressing blocks to the plurality of wafers on the semiconductor package component; and the controller is also adapted to control the plurality of temperature regulating units to heat up or cool down the plurality of wafers on the semiconductor package component.

2. A multi-point pressure and multi-point temperature control downpressure module as described in claim 1, wherein, The complex force sensing unit includes a complex thin-film pressure sensing element, which is respectively disposed on the contact surface of one of the complex pressing blocks. The contact surface is used to contact the complex wafers on the semiconductor package component.

3. The multi-point pressure and multi-point temperature control downpressure module as described in claim 1, comprising a plurality of coupling blocks, the plurality of coupling blocks being respectively located between the plurality of downpressure generating units and the plurality of pressing blocks, and the plurality of force sensing units being respectively located between the plurality of coupling blocks and the plurality of pressing blocks.

4. The multi-point pressure and multi-point temperature control downpressure module as described in claim 1 further includes a plurality of temperature sensing units, each disposed on the plurality of pressure blocks and electrically connected to the controller; the controller is adapted to control the plurality of temperature sensing units to measure the temperature of the plurality of wafers on the semiconductor package component.

5. The multi-point pressure and multi-point temperature control downpressure module as described in claim 1, further comprising an actuator electrically connected to the controller; the controller being adapted to control the actuator to drive the plurality of pressure blocks to press against the plurality of wafers on the semiconductor package member.

6. The multi-point pressure and multi-point temperature control downpressure module as described in claim 5 further includes a lifting frame, a mounting frame, and a plurality of buffers, the lifting frame being connected to the actuator, the plurality of downpressure generating units being disposed on the mounting frame, and the mounting frame being coupled to the lifting frame through the plurality of buffers.

7. The multi-point pressure and multi-point temperature control downpressure module as described in claim 1, further comprising a coolant supply unit electrically connected to the controller; the plurality of temperature control units each comprising a temperature-controlled fluid channel and a heater, the temperature-controlled fluid channel being connected to the coolant supply unit; the controller being adapted to control the coolant supply unit to provide coolant to the temperature-controlled fluid channel of the plurality of temperature control units, and the controller being adapted to control the heater to heat the plurality of wafers on the semiconductor package component.

8. The multi-point pressure and multi-point temperature control downpressure module as described in claim 1, further comprising a plurality of monitoring units respectively disposed on the plurality of pressure blocks and electrically connected to the controller; the controller being adapted to control the plurality of monitoring units to sense at least one of the orientation of the plurality of pressure blocks and the contact condition between the plurality of pressure blocks and the semiconductor package component.

9. A downpressure module capable of multi-point pressure application and multi-point temperature control, the module comprising: The multiple press blocks correspond to multiple wafers on a semiconductor package component; A complex pressure generating unit is coupled to the complex pressing block; A plurality of temperature regulating units are respectively disposed on the plurality of pressing blocks; a actuator; a plurality of force sensing units are respectively disposed on the plurality of pressing blocks; The controller is electrically connected to the plurality of temperature regulating units, the plurality of force sensing units, and the actuator; wherein the controller is adapted to control the actuator to drive the plurality of pressing blocks to press against the plurality of wafers on the semiconductor package member, thereby driving the plurality of downward pressure generating units to apply a plurality of downward pressures to the plurality of wafers on the semiconductor package member; the controller is adapted to control the plurality of force sensing units to measure the downward pressures applied by the plurality of pressing blocks to the plurality of wafers on the semiconductor package member; the controller is also adapted to control the plurality of temperature regulating units to heat up or cool down the plurality of wafers on the semiconductor package member.

10. The multi-point pressure and multi-point temperature control downpressure module as described in claim 9, further comprising a pressure plate; the plurality of pressing blocks including a first pressing block and a second pressing block; the plurality of downpressure generating units including a plurality of first elastic elements and a plurality of second elastic elements; the first elastic elements being located between the pressure plate and the first pressing block, and the second elastic elements being located between the pressure plate and the second pressing block; wherein, The controller is adapted to control the actuator to drive the pressure plate toward the first crimping block and the second crimping block, thereby causing the plurality of first elastic members and the plurality of second elastic members to apply the plurality of downward pressures through the first crimping block and the second crimping block respectively.

11. A multi-point pressure and multi-point temperature control downpressure module as described in claim 10, wherein, The first crimping block includes a central protrusion, and the second crimping block includes at least one convex frame and a central slot; the central protrusion of the first crimping block is located within the central slot of the second crimping block; the plurality of temperature regulating units includes a temperature-controlled fluid chamber and a temperature-controlled fluid channel; the temperature-controlled fluid chamber is located within the central protrusion; and the temperature-controlled fluid channel is located within the second crimping block.

12. The multi-point pressure and multi-point temperature control downpressure module as described in claim 10, wherein, The pressure plate includes at least one vertical portion and a base plate portion; the at least one vertical portion is vertically connected to the base plate portion, and the at least one vertical portion includes an inclined groove, one end of which is adjacent to the base plate portion and the other end is away from the base plate portion; the actuator includes a linear displacement generating unit, a horizontal slider and a guide rod, the horizontal slider is coupled to the linear displacement generating unit, one end of which is connected to the horizontal slider and the other end is located in the inclined groove of the at least one vertical portion; the linear displacement generating unit is adapted to drive the horizontal slider to produce horizontal sliding, thereby driving the guide rod to slide in the inclined groove, so as to drive the pressure plate toward or away from the first pressing block and the second pressing block.

13. The multi-point pressure and multi-point temperature control downpressure module as described in claim 9, further comprising a pressure plate; the plurality of pressing blocks including a first pressing block and a second pressing block; the plurality of downpressure generating units including a plurality of first elastic elements and a plurality of second elastic elements; the first elastic elements being located between the pressure plate and the first pressing block, and the second elastic elements being located between the first pressing block and the second pressing block; wherein, The controller is adapted to control the actuator to drive the pressure plate toward the first crimping block and the second crimping block, thereby causing the plurality of first elastic members to apply at least one of the plurality of downward pressures through the first crimping block, and thereby causing the plurality of first elastic members and the plurality of second elastic members to apply at least one of the plurality of downward pressures through the second crimping block.

14. A semiconductor package component testing apparatus, the apparatus comprising: One fixed base; A test socket for accommodating a semiconductor package component, the test socket being disposed on the fixed base; a sliding frame; It is coupled to the fixed base; a multi-point pressure and multi-point temperature control downpressure module as described in any one of claims 1 to 13, which is disposed on the sliding frame; and a sliding generating device electrically connected to the controller and disposed on at least one of the fixed base and the sliding frame; wherein the controller is adapted to control the sliding generating device to drive the sliding frame to slide, so that the multi-point pressure and multi-point temperature control downpressure module can selectively correspond to or move away from the test base.

15. The semiconductor package component testing apparatus as described in claim 14, wherein, The test fixture includes multiple positioning plates, and the mounting base includes a base plate; the multiple positioning plates are disposed on the base plate, and the multiple positioning plates and the base plate define an accommodating space for accommodating the semiconductor packaging component.

Images