Circuit board with embedded component and fabricating method of the same

Abstract

This application discloses an embedded component circuit board and its manufacturing method. The embedded component circuit board includes a circuit board substrate, a metal plate, multiple electronic components, insulating material, and two circuit layers. The circuit board substrate includes receiving slots connecting opposite sides of the circuit board substrate, and the metal plate is disposed within the receiving slots of the circuit board substrate and connected to the circuit board substrate. The metal plate includes a groove, the opening of which faces one side of the circuit board substrate. The electronic components are disposed within the groove of the metal plate and connected to the metal plate. The insulating material is disposed on the circuit board substrate and covers the metal plate, the electronic components, and a portion of the circuit board substrate. The circuit layers are respectively disposed on opposite sides of the circuit board substrate, and the metal plate, electronic components, and insulating material are located between the circuit layers, with one of the circuit layers electrically connected to the electronic components.

Description

Technical Field

[0001] This invention relates to a circuit board with embedded electronic components and a method for manufacturing the same. Prior Technology

[0002] The common method for embedding electronic components (e.g., chips or bare dies) in circuit boards involves placing the electronic component within a recess in the circuit board and filling the recess with sufficient molding compound to cover the component, thus embedding it within the circuit board. However, because electronic components vary in size and height, it is difficult to precisely control the amount of molding compound filled, easily leading to insufficient filling. Therefore, it cannot be guaranteed that the electronic component will be completely embedded in the circuit board, thereby reducing the reliability of the embedded component circuit board. Furthermore, during the placement of electronic components within the recesses of the circuit board, an adhesive film, such as polyimide (PI) film, is needed to support the component. Residue can easily remain after removing the adhesive film, resulting in poor electrical properties after encapsulation. Summary of the Invention

[0003] At least one embodiment of the present invention provides a circuit board with embedded components, which helps to improve the reliability of the circuit board.

[0004] At least one embodiment of the present invention provides a method for manufacturing the above-described embedded component circuit board.

[0005] The embedded component circuit board provided in at least one embodiment of the present invention includes a circuit board substrate, a metal plate, a plurality of first electronic components, an insulating material, and two circuit layers. The circuit board substrate includes a receiving slot, which connects opposite sides of the circuit board substrate. The metal plate is disposed within the receiving slot of the circuit board substrate and is connected to the circuit board substrate. The metal plate includes a first groove, the opening of which faces one side of the circuit board substrate. The first electronic components are disposed within the first groove of the metal plate and are connected to the metal plate. The insulating material is disposed on the circuit board substrate and covers the metal plate, the first electronic components, and a portion of the circuit board substrate. The circuit layers are respectively disposed on opposite sides of the circuit board substrate. The metal plate, the first electronic components, and the insulating material are located between the circuit layers, and one of the circuit layers is electrically connected to the first electronic component.

[0006] In at least one embodiment of the present invention, the embedded component circuit board further includes a plurality of second electronic components disposed in a second groove of a metal plate and connected to the metal plate. The opening of the second groove faces away from the opening of the first groove, and the second electronic components are electrically connected to one of the circuit layers.

[0007] In at least one embodiment of the present invention, the embedded component circuit board further includes a plurality of conductive holes disposed in an insulating material. The circuit layer is electrically connected to the first electronic component through the conductive holes.

[0008] In at least one embodiment of the present invention, the metal plate further includes a fixing element. This fixing element is disposed in the circuit board, and the metal plate is fixed in the receiving slot of the circuit board by means of this fixing element.

[0009] In at least one embodiment of the present invention, each of the first electronic components has a first end face and a second end face opposite to the first end face, and the first end face is connected to a first groove of a metal plate, while the second end faces of each of the first electronic components are flush with each other.

[0010] In at least one embodiment of the present invention, a bottom surface of a first groove in a metal plate includes a plurality of connection areas spaced apart from each other, which are respectively connected to a first end face of a first electronic component. A gap exists between one of the circuit layers and each of the connection areas, and at least two of these gaps are of different sizes.

[0011] In at least one embodiment of the present invention, the bottom surface of the first groove of the metal plate further includes a plurality of partition areas distributed between the connecting areas, and these partition areas are recessed into the connecting areas.

[0012] The manufacturing method of the embedded component circuit board provided in at least one embodiment of the present invention includes: providing an initial metal plate, the initial metal plate including a plurality of first grooves; disposing a plurality of first electronic components in the first grooves of the initial metal plate respectively; after disposing the first electronic components, cutting the initial metal plate to form a plurality of metal plate module units, each of the metal plate module units including a metal plate and at least one of the first electronic components; providing a circuit board substrate; removing a portion of the circuit board substrate to form a receiving slot on the circuit board substrate, the receiving slot communicating with opposite sides of the circuit board substrate; disposing the metal plate module unit in the receiving slot, the opening of the first groove of the metal plate facing one of the circuit board substrates. On one side, a metal plate is connected to a circuit board; after a metal plate module unit is disposed in an accommodating slot, an insulating material is formed on the circuit board, a portion of which is located in the accommodating slot, and the insulating material covers the first electronic component, the metal plate, and part of the circuit board; after the insulating material is formed, a composite substrate is attached to opposite sides of the circuit board, each of the composite substrates comprising an insulating layer and a metal layer, and the insulating layer and the metal plate module unit are located between the metal layers; after the composite substrates are attached, one of the metal layers is electrically connected to the first electronic component; and after the metal layer is electrically connected to the first electronic component, the metal layer is patterned to form two circuit layers.

[0013] In at least one embodiment of the present invention, the method for manufacturing an embedded component circuit board further includes: before cutting an initial metal plate, respectively disposing of a plurality of second electronic components in a plurality of second grooves of the initial metal plate, wherein the openings of the second grooves of the initial metal plate face away from the openings of the first grooves.

[0014] In at least one embodiment of the present invention, electrically connecting one of the metal layers to the first electronic element comprises: forming a plurality of conductive holes in an insulating material, wherein the conductive holes connect one of the metal layers and the first electronic element.

[0015] Based on the above, a first electronic component (and a second electronic component) are disposed within a groove in a metal plate to form a metal plate module unit, which is then placed within a receiving groove in a circuit board substrate. Since the metal plate occupies a certain volume within the receiving groove, the amount of insulating material can be reduced, thereby mitigating the risk of insufficient adhesive in the molding process due to inadequate insulating material and improving packaging reliability. Furthermore, during the packaging process, the metal plate module unit can be fixed within the receiving groove of the circuit board substrate using fixing components. Therefore, it is unnecessary to use adhesive film to fix the electronic components within the receiving groove of the circuit board during the manufacturing process. This avoids residual adhesive affecting the electrical connection between the electronic components and the circuit board, thereby improving the electrical reliability of the embedded component circuit board. Simple Explanation of the Diagram

[0016] The nature of the invention can be understood from the following detailed description and accompanying drawings. It should be noted that many features are not drawn to industry-standard scale. In fact, for clarity of discussion, the dimensions of various features may be arbitrarily increased or decreased. Figure 1 shows a partial cross-sectional view of an embedded component circuit board according to at least one embodiment of the present invention. Figure 2 shows a top view of a method for manufacturing an embedded component circuit board according to at least one embodiment of the present invention. Figures 3A to 3C illustrate cross-sectional views of a method for manufacturing an embedded component circuit board according to at least one embodiment of the present invention. Figures 4A to 4D illustrate cross-sectional views of a method for manufacturing an embedded component circuit board according to at least one embodiment of the present invention. Implementation

[0017] In the following text, to clearly present the technical features of this application, the dimensions (e.g., length, width, thickness, and depth) of the elements (e.g., layers, films, substrates, and regions) in the drawings will be enlarged proportionally, and the number of some elements may be reduced. Therefore, the description and explanation of the embodiments below are not limited to the number of elements in the drawings or the size and shape of the elements, but should cover the size, shape, and deviations from both caused by actual manufacturing processes and / or tolerances. For example, a flat surface shown in the drawings may have rough and / or non-linear characteristics, and an acute angle shown in the drawings may be rounded. Therefore, the elements presented in the drawings of this application are mainly for illustration and are not intended to accurately depict the actual shape of the elements, nor are they intended to limit the scope of the claims in this application.

[0018] Secondly, the terms "approximately," "approximately," or "substantially" used in this document not only cover explicitly stated numerical values ​​and ranges, but also the permissible deviation range understood by someone skilled in the art to which this invention pertains. This deviation range can be determined by errors that occur during measurement, such as those arising from limitations of the measurement system or process conditions. Furthermore, "approximately" can indicate a deviation within one or more standard deviations of the aforementioned numerical values, such as ±30%, ±20%, ±10%, or ±5%. The terms "approximately," "approximately," or "substantially" used in this document can be chosen based on optical, etching, mechanical, or other properties to select an acceptable deviation range or standard deviation, and are not applied to all optical, etching, mechanical, and other properties using a single standard deviation. Additionally, for clarity in the following embodiments, components with the same or similar functions are indicated by the same designation.

[0019] Figure 1 is a partial cross-sectional view of an embedded component circuit board 100 according to at least one embodiment of the present invention. The embedded component circuit board 100 includes a circuit board 110, a metal plate 120, a plurality of first electronic components 140a, 140b and 140c, an insulating material 160, and two circuit layers 180a and 180b. The circuit board 110 includes an insulating layer 112 and circuit layers 114a and 114b, wherein the insulating layer 112 is disposed between the circuit layers 114a and 114b. The circuit board 110 includes a receiving slot 115, and this receiving slot 115 connects opposite sides of the circuit board 110. Specifically, the receiving slot 115 extends from the circuit layer 114a through the insulating layer 112 and extends to the circuit layer 114b.

[0020] A metal plate 120 is disposed within a receiving slot 115 of a circuit board 110 and is connected to the circuit board 110. The metal plate 120 includes a recess 122, the opening of which faces one side of the circuit board 110 (i.e., the opening of the recess 122 faces upwards in FIG. 1). In this embodiment, the thickness t1 of the circuit board 110 is greater than the thickness t2 of the metal plate 120, but the invention is not limited thereto. In other embodiments, the thickness t1 of the circuit board 110 may also be less than or equal to the thickness t2 of the metal plate 120. The metal plate 120 may be, for example, a steel plate or a similar metal sheet.

[0021] First electronic components 140a, 140b, and 140c are disposed within and connected to the groove 122 of the metal plate 120. Each first electronic component has two opposing end faces. Specifically, first electronic component 140a has a first end face 141a and a second end face 142a opposite to the first end face 141a, and the first end face 141a is connected to the groove 122 of the metal plate 120. First electronic component 140b has a first end face 141b and a second end face 142b opposite to the first end face 141b, and the first end face 141b is connected to the groove 122 of the metal plate 120. First electronic component 140c has a first end face 141c and a second end face 142c opposite to the first end face 141c, and the first end face 141c is connected to the groove 122 of the metal plate 120. It is worth mentioning that the second end face 142a of the first electronic component 140a, the second end face 142b of the first electronic component 140b, and the second end face 142c of the first electronic component 140c are flush with each other.

[0022] The bottom surface 122b of the groove 122 of the metal plate 120 includes multiple connecting areas C1, C2, and C3. These connecting areas C1, C2, and C3 are spaced apart from each other and respectively connect the first end face 141a of the first electronic component 140a, the first end face 141b of the first electronic component 140b, and the first end face 141c of the first electronic component 140c. In addition, the bottom surface 122b of the groove 122 of the metal plate 120 also includes multiple separating areas DR, which are distributed between the connecting areas C1, C2, and C3. Notably, the separating areas DR are recessed into the connecting areas C1, C2, and C3.

[0023] An insulating material 160 is disposed on the circuit board 110, and this insulating material 160 covers the metal plate 120, the first electronic components 140a, 140b, and 140c, and a portion of the circuit board 110. Specifically, the insulating material 160 fills the groove 122 of the metal plate 120 and covers the partition region DR of the bottom surface 122b of the groove 122. Furthermore, the insulating material 160 covers the side surfaces of the first electronic components 140a, 140b, and 140c, and the insulating material 160 covers the circuit layers 114a and 114b of the circuit board 110, respectively.

[0024] The circuit layers 180a and 180b of the embedded component circuit board 100 are respectively disposed on opposite sides of the circuit substrate 110, that is, the circuit substrate 110 is located between the circuit layers 180a and 180b. In addition, the metal plate 120, the first electronic components 140a, 140b, and 140c, and the insulating material 160 are located between the circuit layers 180a and 180b. As shown in FIG1, the embedded component circuit board 100 also includes a plurality of conductive vias 170, which are disposed on the circuit layers 180a and 180b, and the circuit layer 180a can be electrically connected to the first electronic components 140a, 140b, and 140c through the conductive vias 170.

[0025] On the other hand, the first electronic components 140a, 140b and 140c also include a plurality of pads 144. These pads 144 are disposed on the first end face 141a of the first electronic component 140a, the first end face 141b of the first electronic component 140b and the first end face 141c of the first electronic component 140c, and the conductive hole 170 is electrically connected to the first electronic components 140a, 140b and 140c through these pads 144.

[0026] It is worth mentioning that, although not shown in the figures, the circuit layers 180a and 180b in various embodiments of the present invention can also be connected to the circuit layers 114a and 114b of the circuit substrate 110 through other conductive holes, so as to achieve electrical connection between the circuit layers 180a and 180b and the circuit substrate 110.

[0027] In this embodiment, the embedded component circuit board 100 further includes second electronic components 150a and 150b, and the metal plate 120 of the embedded component circuit board 100 further includes a recess 124. The opening of this recess 124 faces away from the opening of the recess 122. The second electronic components 150a and 150b are disposed in the recess 124 and connected to the metal plate 120, and the second electronic components 150a and 150b are electrically connected to the circuit layer 180b through conductive vias 170. In various embodiments of the present invention, the number of first and second electronic components in the embedded component circuit board 100 is not limited to this embodiment.

[0028] It is worth noting that there are gaps between the circuit layer 180a and the connection areas C1, C2, and C3, and at least two of these gaps are of different sizes. Specifically, there is a gap d1 between the circuit layer 180a and the connection area C1, a gap d2 between the circuit layer 180a and the connection area C2, and a gap d3 between the circuit layer 180a and the connection area C3. The sizes of gaps d1, d2, and d3 depend on the sizes of the first electronic components 140a, 140b, and 140c connected to the connection areas C1, C2, and C3.

[0029] In this embodiment, since the first electronic components 140a, 140b, and 140c are of different sizes, the spacings d1, d2, and d3 must be different in order to make the second end faces 142a of the first electronic component 140a, 142b of the first electronic component 140b, and 142c of the first electronic component 140c flush with each other. However, the present invention is not limited to this; in other embodiments, the spacings d1, d2, and d3 can be exactly the same.

[0030] In some embodiments of the present invention, the metal plate 120 may further include a fixing element 126. This fixing element 126 is disposed on the circuit board 110, and the metal plate 120 is fixed within the receiving slot 115 of the circuit board 110 by means of this fixing element 126. For example, the fixing element 126 may be a flange structure. As shown in FIG1, since the flange protrudes from the side surface of the circuit board 110 adjacent to the receiving slot 115, the metal plate 120 can be fitted onto the circuit board 110. However, the present invention is not limited thereto, and in various embodiments, the fixing element 126 may be other similar elements.

[0031] This invention provides a method for manufacturing an embedded component circuit board. Taking the embedded component circuit board 100 as an example, this manufacturing method may include several steps as shown in Figures 3A to 3C and Figures 4A to 4D. Referring to Figures 2 and 3A together, firstly, an initial metal plate 220 is provided. Figure 2 shows a top view of the initial metal plate 220, while Figure 3A shows a cross-sectional view of the initial metal plate 220 in Figure 2 along line segment AA. As shown in Figures 2 and 3A, this initial metal plate 220 includes a plurality of grooves 122.

[0032] The method of providing the initial metal plate 220 may include: first providing a metal plate (not shown), and forming a plurality of grooves 122 and grooves 124 on the metal plate by means of, for example, mechanical (e.g., CNC machining) or laser grooving, to form the initial metal plate 220, wherein the opening of the groove 124 faces away from the opening of the groove 122. Next, referring to FIG3B, a plurality of first electronic components 140a, 140b and 140c are respectively disposed in the grooves 122 of the initial metal plate 220.

[0033] In detail, this step includes: firstly, by means of dispensing, applying a bonding material 301 to the connection areas C1, C2, and C3 of the bottom surface 122b (shown in FIG. 1) of each groove 122. This bonding material 301 can be, for example, UV adhesive or a similar adhesive. Then, first electronic components 140a, 140b, and 140c are applied to each bonding material 301, wherein the first end face 141a of the first electronic component 140a, the first end face 141b of the first electronic component 140b, and the first end face 141c of the first electronic component 140c face the bottom surface 122b of the groove 122. In some embodiments, after applying the first electronic components 140a, 140b, and 140c to the bonding material 301, the first electronic components 140a, 140b, and 140c can be fixed to the connection areas C1, C2, and C3 by means of, for example, light or heat.

[0034] Referring to Figure 3C, after setting the first electronic components 140a, 140b, and 140c, the initial metal plate 220 can be cut by means of, for example, laser cutting to form multiple metal plate module units 305. Each metal plate module unit 305 includes the metal plate 120 as shown in Figure 1 and the first electronic components 140a, 140b, and 140c.

[0035] It is worth mentioning that the manufacturing method of the embedded component circuit board 100 may also include: before cutting the initial metal plate 220, setting a plurality of second electronic components 150a and 150b in the groove 124 of the initial metal plate 220 respectively. Since the way of setting the second electronic components 150a and 150b in the groove 124 can be the same as the way of setting the first electronic components 140a, 140b and 140c in the groove 122, it will not be repeated here.

[0036] Referring to Figure 4A, the manufacturing method of the embedded component circuit board 100 includes providing a circuit board 110. Then, a portion of the circuit board 110 is removed by means of, for example, mechanical (e.g., CNC machining) or laser grooving to form an accommodating slot 115 on the circuit board 110.

[0037] Referring to Figure 4B, the metal plate module unit 305, completed as shown in Figures 3A to 3C, is disposed within the receiving slot 115, with the opening of the groove 122 of the metal plate 120 facing one side of the circuit board 110, and the opening of the groove 124 facing the other side of the circuit board 110. The metal plate 120 can be connected to the circuit board 110, for example, by fitting together.

[0038] Referring to Figure 4C, after the metal plate module unit 305 is placed within the receiving slot 115, an insulating material 460 is formed on the circuit board 110. A portion of this insulating material 460 is located within the receiving slot 115, and the insulating material 460 covers the first electronic components 140a, 140b, and 140c, the metal plate 120, and a portion of the circuit board 110. The method of forming the insulating material 460 may include: firstly placing the insulating material (not shown) on one side of the circuit board 110 (i.e., the upper side of Figure 4C), and then hardening the insulating material by baking, drying, or UV irradiation to form the insulating material 460.

[0039] It is worth mentioning that since the insulating material is in a fluid state before curing, after the insulating material is filled into the receiving slot 115, it can pass through the gap between the inner wall of the receiving slot 115 and the metal plate 120 and flow to the other side of the circuit board 110 (i.e. the lower side of Figure 4C).

[0040] Referring to Figure 4D, after the insulating material 460 is formed, composite substrates 490a and 490b can be bonded to opposite sides of the circuit substrate 110 by means of, for example, thermoforming. Each composite substrate includes an insulating layer and a metal layer. Specifically, composite substrate 490a includes an insulating layer 492a and a metal layer 494a, while composite substrate 490b includes an insulating layer 492b and a metal layer 494b. Insulating layers 492a and 492b, along with the metal plate module unit 305, are located between metal layers 494a and 494b. Through thermoforming, the insulating material 460, the insulating layer 492a of composite substrate 490a, and the insulating layer 492b of composite substrate 490b can form the insulating material 160 shown in Figure 1.

[0041] After bonding the composite substrates 490a and 490b, the metal layer 494a is electrically connected to the first electronic components 140a, 140b, and 140c. This step includes forming a plurality of conductive holes 170 (shown in FIG. 1) in the insulating material 160, and these conductive holes 170 connect the metal layer 494a and the first electronic components 140a, 140b, and 140c. Specifically, a plurality of openings (not shown) can be formed on the metal layer 494a by mechanical grinding or mechanical drilling. These openings extend from the metal layer 494a through the insulating material 160 and to the first electronic components 140a, 140b, and 140c. Then, a plurality of conductive holes 170 are deposited in the openings by electroplating.

[0042] On the other hand, the manufacturing method of the embedded component circuit board 100 further includes: after bonding the composite substrates 490a and 490b, forming a plurality of conductive holes 170 in the insulating material 160, and electrically connecting the metal layer 494b to the second electronic components 150a and 150b through these conductive holes 170. After electrically connecting the metal layer 494a to the first electronic components 140a, 140b and 140c, the metal layers 494a and 494b can be patterned by photolithography and etching to form circuit layers 180a and 180b (shown in FIG. 1). Thus, the embedded component circuit board 100 shown in FIG. 1 is substantially formed.

[0043] In summary, electronic components (including a first electronic component and a second electronic component) are placed within the grooves of a metal plate to form a single metal plate module, which is then positioned within the receiving groove of a circuit board. Since the metal plate occupies a certain volume within the receiving groove, the amount of insulating material required can be reduced. This reduces the likelihood of insufficient insulating material leading to incomplete encapsulation, thus improving the reliability of the embedded component circuit board. Furthermore, the metal plate can increase the heat transfer efficiency between the electronic components and the circuit board, thereby enhancing the heat dissipation of the embedded component circuit board.

[0044] During the packaging process, the metal plate module can be fixed within the receiving groove of the circuit board using fixing components. Therefore, adhesive film is not required to fix electronic components within the receiving groove of the circuit board, thus avoiding the impact of residual adhesive on the electrical connection between the electronic components and the circuit board, thereby improving the electrical reliability of the embedded component circuit board. Furthermore, in some embodiments, the metal plate has grooves on both sides to accommodate electronic components, which is beneficial for increasing the number of electronic components in the embedded component circuit board.

[0045] Although this application has been disclosed above with reference to embodiments, it is not intended to limit this application. Those skilled in the art to which this application pertains may make some modifications and refinements without departing from the spirit and scope of this application. Therefore, the scope of protection of this application shall be determined by the appended claims.

[0046] 100: Embedded component circuit board 110: Circuit board 112, 492a, 492b: Insulation layer 114a, 114b, 180a, 180b: Line layers 115: Accommodation slot 120: Metal plate 122, 124: Grooves 122b: Bottom surface 126: Fixed Components 140a, 140b, 140c: First electronic components 141a, 141b, 141c: First end face 142a, 142b, 142c: Second end face 144: Connecting pad 150a, 150b: Second electronic components 160, 460: Insulating materials 170: Conductive hole 220: Initial Metal Plate 301: Bonding material 305: Metal Plate Module Unit 490a, 490b: Composite substrate 494a, 494b: Metal layers C1, C2, C3: Connector Area DR: Separator d1, d2, d3: Spacing t1, t2: thickness

Claims

1. An embedded component circuit board, comprising: a circuit board having a receiving slot communicating with opposite sides of the circuit board; a metal plate disposed within the receiving slot of the circuit board and connected to the circuit board, wherein the metal plate has a first groove with the opening of the first groove facing one side of the circuit board; a plurality of first electronic components disposed within the first groove of the metal plate and connected to the metal plate; an insulating material disposed on the circuit board and covering the metal plate, the first electronic components, and a portion of the circuit board; two circuit layers disposed on opposite sides of the circuit board, wherein the metal plate, the first electronic components, and the insulating material are located between the circuit layers, and one of the circuit layers is electrically connected to the first electronic component; and a plurality of second electronic components disposed within a second groove of the metal plate and connected to the metal plate, wherein the opening of the second groove faces away from the opening of the first groove, and the second electronic components are electrically connected to one of the circuit layers.

2. The embedded component circuit board as claimed in claim 1 further comprises: a plurality of conductive vias disposed in the insulating material, wherein the circuit layer is electrically connected to the first electronic component through the conductive vias.

3. The embedded component circuit board as claimed in claim 1, wherein the metal plate further comprises: a fixing element disposed in the circuit board substrate, wherein the metal plate is fixed in the receiving slot of the circuit board substrate by the fixing element.

4. The embedded component circuit board as claimed in claim 1, wherein each of the first electronic components has a first end face and a second end face opposite to the first end face, and the first end face is connected to the first groove of the metal plate, and the second end faces of each of the first electronic components are flush with each other.

5. The embedded component circuit board as claimed in claim 4, wherein a bottom surface of the first recess of the metal plate includes: a plurality of connection areas spaced apart from each other and respectively connected to the first end face of the first electronic component, wherein there is a gap between one of the circuit layers and each of the connection areas, and at least two of the gaps are of different sizes.

6. The embedded component circuit board as claimed in claim 5, wherein the bottom surface of the first groove of the metal plate further comprises: a plurality of partition regions distributed between the connection regions, wherein the partition regions are recessed into the connection regions.

7. A method for manufacturing an embedded component circuit board, comprising: providing an initial metal plate, wherein the initial metal plate includes a plurality of first grooves; disposing a plurality of first electronic components in the first grooves of the initial metal plate respectively; after disposing the first electronic components, cutting the initial metal plate to form a plurality of metal plate module units, wherein each of the metal plate module units includes a metal plate and at least one of the first electronic components; and providing a circuit board substrate; A portion of the circuit board is removed to form a receiving slot on the circuit board, and the receiving slot connects the opposite sides of the circuit board; the metal plate module is disposed in the receiving slot, wherein the opening of the first groove of the metal plate faces one side of the circuit board, and the metal plate is connected to the circuit board. After the metal plate module unit is disposed within the receiving slot, an insulating material is formed on the circuit board, wherein a portion of the insulating material is located within the receiving slot, and the insulating material covers the first electronic component, the metal plate, and a portion of the circuit board; after forming the insulating material, a composite substrate is respectively bonded to opposite sides of the circuit board, wherein each of the composite substrates includes an insulating layer and a metal layer, and the insulating layer and the metal plate module unit are located between the metal layers; after bonding the composite substrates, one of the metal layers is electrically connected to the first electronic component; and after electrically connecting one of the metal layers to the first electronic component, the metal layer is patterned to form two circuit layers.

8. The manufacturing method as claimed in claim 7 further comprises: before cutting the initial metal plate, respectively disposing of a plurality of second electronic components in a plurality of second grooves of the initial metal plate, wherein the openings of the second grooves of the initial metal plate face away from the openings of the first grooves.

9. The manufacturing method of claim 7, wherein electrically connecting one of the metal layers to the first electronic component comprises: forming a plurality of conductive holes in the insulating material, wherein the conductive holes connect one of the metal layers and the first electronic component.

Images