Cutting device for cutting composite materials

Abstract

This invention discloses a cutting device for cutting composite materials, comprising a support module and a laser generating module. The support module supports the composite material. The laser generating module provides a laser beam and includes a laser projector for providing a laser light source and a laser path adjuster located on the projection path of the laser light source. The projection path of the laser beam is adjusted by the laser path adjuster or by the movement of the composite material through the support module, so that the cutting area formed by the laser beam projected onto the composite material is offset parallel to the laser beam. The pulse width of the laser light source is in the femtosecond range (10-15 seconds), the pulse width is less than 500 fs, and the pulse repetition frequency is greater than 1 MHz. Therefore, the cutting device for cutting composite materials of this invention can cut composite materials.

Description

Technical Field

[0001] This invention relates to a cutting device, and more particularly to a cutting device for cutting composite materials. Prior Technology

[0002] Current semiconductor processing technologies, such as wafer dicing, trenching, and patterning, primarily rely on metal cutting blades. While these blades can cut semiconductor materials like gallium arsenide and silicon carbide, the feed rate must be controlled within a certain range to avoid damaging the cut surface, making it difficult to improve production efficiency. Therefore, lasers are now being applied to wafer processing and dicing technologies to improve production efficiency.

[0003] Furthermore, due to continuous advancements in wafer manufacturing technology, it has become possible to sputter and deposit layered films of various materials on the wafer surface to form composite materials. However, composite materials are thicker than existing wafers. Although existing laser cutting technology can still cut composite materials, it easily causes deformation of the cut surface, which in turn affects subsequent processing. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a cutting device for cutting composite materials, which addresses the shortcomings of the prior art.

[0005] To address the aforementioned technical problems, the present invention provides a cutting device for cutting composite materials, comprising a support module and a laser generating module. The support module supports the composite material. The laser generating module provides a laser beam and includes a laser projector for providing the laser light source and a laser path adjuster located on the projection path of the laser light source. The projection path of the laser beam is adjusted by the laser path adjuster or by the movement of the composite material through the support module, so that the cutting area formed by the laser beam projected onto the composite material is offset parallel to the laser beam. The laser light source has a pulse width in the femtosecond range (10-15 seconds), a pulse width less than 500 fs, and a pulse repetition frequency greater than 1 MHz.

[0006] The beneficial effect of the present invention is that the cutting device for cutting composite materials provided by the present invention can form a cutting area on the composite material through the technical solution of "a support module for supporting the composite material; a laser generating module for providing a laser beam, the laser generating module including a laser projector for providing a laser light source and a laser path adjuster located on the projection path of the laser light source; the projection path of the laser beam is adjusted by the laser path adjuster or the composite material is moved by the support module, so that the cutting area formed by the laser beam projected on the composite material is offset in parallel; the pulse width of the laser light source is in the femtosecond range (10-15 seconds), the pulse width of the laser light source is less than 500 fs, and the pulse repetition frequency of the laser light source is greater than 1 MHz", and gradually deepen the cutting depth by repeatedly projecting the laser beam and offsetting the laser beam, thereby cutting the composite material.

[0007] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention. Simple Explanation of the Diagram

[0008] Figure 1 is a schematic diagram of the structure of a cutting device for cutting composite materials according to the first embodiment of the present invention.

[0009] Figure 2 is a schematic diagram of the structure of the laser projector of the cutting device for cutting composite materials according to the first embodiment of the present invention.

[0010] Figure 3 is a first top view of the cutting device for cutting composite materials according to the first embodiment of the present invention, which forms a cutting area on the composite material by means of a laser beam.

[0011] Figure 4 is a second top view of the cutting device for cutting composite materials according to the first embodiment of the present invention, in which a cutting area is formed on the composite material by a laser beam.

[0012] Figure 5 is a third top view of the cutting device for cutting composite materials according to the first embodiment of the present invention, in which a cutting area is formed on the composite material by a laser beam.

[0013] Figure 6 is a fourth top view of the cutting device for cutting composite materials according to the first embodiment of the present invention, in which a cutting area is formed on the composite material by a laser beam.

[0014] Figure 7 is a fifth top view of the cutting device for cutting composite materials according to the first embodiment of the present invention, in which a cutting area is formed on the composite material by a laser beam.

[0015] Figure 8 is a first schematic diagram of a cutting device for cutting composite materials according to the first embodiment of the present invention, which cuts composite materials by means of a laser beam.

[0016] Figure 9 is a second schematic diagram of a cutting device for cutting composite materials according to the first embodiment of the present invention, which cuts composite materials by means of a laser beam.

[0017] Figure 10 is a third schematic diagram of a cutting device for cutting composite materials according to the first embodiment of the present invention, which cuts composite materials by means of a laser beam.

[0018] Figure 11 is a fourth schematic diagram of a cutting device for cutting composite materials according to the first embodiment of the present invention, which cuts composite materials by means of a laser beam.

[0019] Figure 12 is a first schematic diagram of a cutting device for cutting composite materials according to a second embodiment of the present invention, which cuts composite materials by means of a laser beam.

[0020] Figure 13 is a second schematic diagram of a cutting device for cutting composite materials according to a second embodiment of the present invention, which cuts composite materials by means of a laser beam.

[0021] Figure 14 is a third schematic diagram of a cutting device for cutting composite materials according to a second embodiment of the present invention, which cuts composite materials using a laser beam.

[0022] Figure 15 is a fourth schematic diagram of a cutting device for cutting composite materials according to the second embodiment of the present invention, which cuts composite materials by means of a laser beam.

[0023] Figure 16 is a schematic diagram of the architecture of the monitoring module of the cutting device for cutting composite materials according to the third embodiment of the present invention.

[0024] Figure 17 is a functional block diagram of the artificial intelligence module of the cutting device for cutting composite materials according to the third embodiment of the present invention.

[0025] Figure 18 is a schematic diagram of the cleaning module of the cutting device for cutting composite materials according to the third embodiment of the present invention. Implementation

[0026] The following specific embodiments illustrate the implementation of the "cutting device for cutting composite materials" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated beforehand. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0027] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the associated listed items.

[0028] [First Embodiment]

[0029] Please refer to Figures 1 to 11, which are respectively schematic diagrams of the cutting device for cutting composite materials according to the first embodiment of the present invention, schematic diagrams of the laser projector of the cutting device for cutting composite materials according to the first embodiment of the present invention, first to fifth top views of the cutting device for cutting composite materials according to the first embodiment of the present invention forming a cutting area on the composite material by means of a laser beam, and first to fourth schematic diagrams of the cutting device for cutting composite materials according to the first embodiment of the present invention cutting composite materials by means of a laser beam. As shown in the figures, the first embodiment of the present invention provides a cutting device Z for cutting composite materials, which includes a support module 1 and a laser generating module 2. The support module 1 is used to support the composite material B. The laser generating module 2 is used to provide a laser beam L1, and the laser generating module 2 includes a laser projector 20 for providing a laser light source L0 and a laser path adjuster 21 located on the projection path of the laser light source L0. The projection path of the laser beam L1 is adjusted by the laser path adjuster 21 or the composite material B is moved by the support module 1, so that the cutting area A formed by the laser beam L1 projected on the composite material B is offset parallel.

[0030] Specifically, the cutting device Z for cutting composite materials of the present invention includes a support module 1 and a laser generating module 2. The support module 1 can be a support platform of a general cutting device and is used to support the object to be cut. In this embodiment, the object to be cut is composite material B as an example, but it is not limited thereto. The laser generating module 2 can provide a laser beam L1 for cutting composite material B. The laser generating module 2 includes a laser projector 20 and a laser path adjuster 21. The laser projector 20 is a light source device for providing a laser light source L0, and the laser path adjuster 21 can be located on the projection path of the laser light source L0. Furthermore, as shown in FIG2, the laser projector 20 may include a laser generating unit 200, a beam expanding unit 201, a polygonal rotating mirror unit 202, a first reflector group 203, and a second reflector group 204. The laser generation unit 200 provides a laser source L0 with a pulse width in the femtosecond range (10-15 seconds), less than 500 fs, and a pulse repetition frequency greater than 1 MHz (but not limited thereto). This maintains a small heat-affected zone (HAZ), effectively improving the precision of laser processing. The laser source L0 can be an adjustable wavelength laser source, which can be changed according to the material of the target object to be cut (such as composite material B). The polygonal mirror unit 202 can be a polygonal mirror structure with multiple reflective surfaces. The beam expander unit 201 is located between the laser generation unit 200 and the polygonal mirror unit 202, and is used to change the diameter of the laser source L0, for example, to amplify the beam of the laser source L0. Furthermore, a first mirror group 203 is provided between the laser generation unit 200 and the beam expander unit 201, and a second mirror group 204 is provided between the polygonal mirror unit 202 and the beam expander unit 201. Therefore, after the laser generating unit 200 provides the laser light source L0, the laser light source L0 is projected onto the beam expanding unit 201 by reflection from the first reflector group 203. Next, the beam expanding unit 201 selectively adjusts or maintains the beam size of the laser light source L0, and the laser light source L0 is projected onto the polygon mirror unit 202 by reflection from the second reflector group 204. Finally, the polygon mirror unit 202 rotates, causing the laser light source L0 to be sequentially projected onto different reflective surfaces of the polygon mirror unit 202. The reflective surfaces shift with the rotation of the polygon mirror unit 202 per unit time, thus enabling the laser light source L0 to generate incident light at different angles and reflected light at corresponding angles per unit time. That is, as the polygon mirror unit 202 continues to rotate, the laser light source L0 can be sequentially and repeatedly projected from the polygon mirror unit 202 through reflection from multiple reflective surfaces to form a laser beam L1.

[0031] Therefore, before performing the cutting operation, the cutting device Z for cutting composite materials of the present invention can place the composite material B on the support module 1; wherein, in this embodiment, the composite material B can be a composite structure with multiple layers of materials (such as oxide layer B1, nitride layer B2 and carbide layer B3, etc.) covering the substrate B4 (such as a semiconductor wafer with a thickness of less than 100 μm), but is not limited thereto.

[0032] Next, during the cutting operation, the cutting device Z for cutting composite materials of the present invention can repeatedly project a laser beam L1 onto the composite material B on the supporting module 1 via the laser generating module 2, thereby forming multiple cutting areas A on the composite material B. In this embodiment, while the laser generating module 2 repeatedly projects the laser beam L1 onto the composite material B, the cutting device Z can adjust the projection path of the laser beam L1 via the laser path adjuster 21, allowing the laser beam L1 to be parallelly offset, thus forming cutting areas A at different positions on the composite material B; that is, the laser beam L1 can be parallelly offset relative to the composite material B through the adjustment of the laser path adjuster 21. Furthermore, as shown in Figures 3 to 11, after the laser generating module 2 projects a laser beam L11 onto the composite material B, a cutting area A1 is formed on the composite material B. Then, when the laser generating module 2 projects a laser beam L12 onto the composite material B, the laser path adjuster 21 adjusts the laser path to ensure that the cutting area A2 formed by the laser beam L12 on the composite material B is at a different position than the cutting area A1, but their ranges partially overlap. Similarly, when the laser generating module 2 projects a laser beam L13 onto the composite material B, the laser path adjuster 21 adjusts the laser path to ensure that the cutting area A3 formed by the laser beam L13 on the composite material B is at a different position than the cutting areas A1 and A2, but the ranges of the cutting area A3 and cutting area A2 partially overlap.

[0033] The above-described cutting process can be considered as the first cutting procedure performed by the laser generating module 2. The laser generating module 2 can also perform a second cutting procedure. That is, during the second cutting procedure, the cutting area A formed on the composite material B by the laser beam L1 initially projected can be at the same position as cutting area A1 or cutting area A3, and the number of cutting areas A formed by the laser generating module 2 in the second cutting procedure can be the same as in the first cutting procedure. Therefore, the cutting device Z for cutting composite materials of the present invention performs multiple cutting procedures by the laser generating module 2 and adjusts the projection path of the laser beam L1 by the laser path adjuster 21, gradually increasing the cutting depth, thereby cutting the composite material B.

[0034] In this way, the cutting device Z for cutting composite materials of the present invention repeatedly and continuously projects multiple laser beams L1 through the laser generating module 2, and adjusts the projection path of the laser beams L1 through the laser path adjuster 21, thereby forming multiple cutting areas A in the composite material B and gradually increasing the cutting depth, thereby cutting the composite material B.

[0035] In the above embodiments, the laser light source L0 can be infrared (IR), ultraviolet (UV) or green laser, but is not limited thereto.

[0036] [Second Embodiment]

[0037] Please refer to Figures 12 to 15, which show the first to fourth schematic diagrams of the cutting device for cutting composite materials according to the second embodiment of the present invention, which cuts composite materials using a laser beam. Also refer to Figures 1 to 11. As shown, in this embodiment, the composite material B is parallelly offset relative to the laser generating module 2 by the movement of the supporting module 1. Further, a portion of the laser beam L1 is projected onto the same position of the composite material B. A portion of the laser beam L1 is projected onto different positions of the composite material B.

[0038] For example, the cutting device Z for cutting composite materials in this embodiment is similar in structure and operating principle to the cutting device Z for cutting composite materials in the first embodiment described above. The cutting device Z for cutting composite materials in this embodiment also includes a support module 1 and a laser generating module 2. The support module 1 can be a support platform of a general cutting device and is used to support the object to be cut. In this embodiment, the object to be cut is also taken as composite material B, but this is not a limitation. The laser generating module 2 can provide a laser beam L1 for cutting composite material B. The laser generating module 2 includes a laser projector 20 and a laser path adjuster 21. The laser projector 20 is a light source device for providing a laser light source L0. The pulse width of the laser light source L0 can be in the femtosecond range (10-15 seconds), the pulse width can be less than 500 fs, and the pulse repetition frequency of the laser light source can be greater than 1 MHz, but this is not a limitation. The laser path adjuster 21 can be located on the projection path of the laser light source L0.

[0039] Therefore, in this embodiment, the cutting device Z for cutting composite materials can also place the composite material B on the support module 1 before performing the cutting operation. The composite material B can be a composite structure of a substrate B4 (such as a semiconductor wafer with a thickness of less than 100 μm) covered with multiple layers of materials (such as an oxide layer B1, a nitride layer B2, and a carbide layer B3), but is not limited thereto.

[0040] The difference between the cutting device Z for cutting composite materials in this embodiment and the cutting device Z for cutting composite materials in the first embodiment is that, when performing the cutting operation, the cutting device Z for cutting composite materials in this embodiment can utilize the movement of the supporting module 1 to generate a parallel offset relative to the laser generating module 2, so that the cutting area A formed by the laser beam L1 projected on the composite material B is offset in parallel, and then multiple laser beams L1 are sequentially projected onto the composite material B to cut the composite material B.

[0041] Furthermore, during the cutting operation, the cutting device Z for cutting composite materials of the present invention can repeatedly project laser beams L1 onto the composite material B on the support module 1 via the laser generating module 2, thereby forming multiple cutting areas A on the composite material B. In this embodiment, during the repeated projection of laser beams L1 onto the composite material B by the laser generating module 2, the cutting device Z can move the support module 1 to cause the composite material B to be offset parallel to the laser generating module 2, thus allowing the laser beam L1 to be offset parallel and forming cutting areas A at different positions on the composite material B. Furthermore, as shown in Figures 3 to 7 and Figures 12 to 15, after the laser generating module 2 projects a laser beam L11 onto the composite material B, the laser beam L11 forms a cutting area A1 on the composite material B. Then, when the laser generating module 2 projects a laser beam L12 onto the composite material B, the supporting module 1 causes the composite material B to shift, so that the cutting area A2 formed by the laser beam L12 on the composite material B is at a different position than the cutting area A1, but their ranges partially overlap. When the laser generating module 2 projects a laser beam L13 onto the composite material B, the supporting module 1 again causes the composite material B to shift, so that the cutting area A3 formed by the laser beam L13 on the composite material B is at a different position than the cutting areas A1 and A2, but the ranges of the cutting area A3 and the cutting area A2 partially overlap.

[0042] The above-described cutting process can be considered as the first cutting procedure performed by the laser generating module 2. The laser generating module 2 can also perform a second cutting procedure. That is, during the second cutting procedure, the cutting area A formed on the composite material B by the laser beam L1 initially projected can be at the same position as cutting area A1 or cutting area A3, and the number of cutting areas A formed by the laser generating module 2 in the second cutting procedure can be the same as in the first cutting procedure. Therefore, the cutting device Z for cutting composite materials of the present invention performs multiple cutting procedures by the laser generating module 2 and adjusts the projection path of the laser beam L1 by the laser path adjuster 21, gradually increasing the cutting depth, thereby cutting the composite material B.

[0043] Therefore, the cutting device Z for cutting composite materials in this embodiment can repeatedly and continuously project multiple laser beams L1 through the laser generating module 2, and form multiple cutting areas A in the composite material B by moving the carrying module 1, and gradually increase the cutting depth, thereby cutting the composite material B.

[0044] In the above embodiments, the laser light source L0 can be infrared (IR), ultraviolet (UV) or green laser, but is not limited thereto.

[0045] [Third Embodiment]

[0046] Please refer to Figures 16 to 18, which are schematic diagrams of the monitoring module, the functional block diagram of the artificial intelligence module, and the schematic diagram of the cleaning module of the cutting device for cutting composite materials according to the third embodiment of the present invention, respectively. Please also refer to Figures 1 to 15. As shown in the figures, the cutting device Z for cutting composite materials in this embodiment is generally similar to the cutting devices Z for cutting composite materials in the above embodiments. Therefore, the arrangement or operation of the same components will not be described again here. The difference between this embodiment and the above embodiments is that, in this embodiment, the cutting device Z for cutting composite materials of the present invention may further include a monitoring module 3. As shown in Figure 16, the monitoring module 3 may include a light emitting unit 30, a first light receiving unit 31, a second light receiving unit 32, an image unit 33, and a control unit 34. The control unit 34 may be electrically connected to the light emitting unit 30, the first light receiving unit 31, the second light receiving unit 32, and the image unit 33. The light emitting unit 30 may be located on the first side of the composite material B and emit a laser beam L2 toward the composite material B. The first light receiving unit 31 can be located on the first side of the composite material B to receive the reflected light L21 of the first laser beam reflected by the composite material B to generate a reflected light signal. The second light receiving unit 32 can be located on the second side of the composite material B to receive the transmitted light L22 of the second laser beam passing through the composite material B to generate a transmitted light signal. The imaging unit 33 can be electrically connected to the first light receiving unit 31 and the second light receiving unit 32 to receive the reflected light L21 and the transmitted light L22, and generate a detection result.

[0047] Furthermore, the monitoring module 3 may also include a first moving device, a second moving device, and a transmitting moving device (not shown in the figure). For example, a first light receiving unit 31 may be connected to the first moving device to allow the first light receiving unit 31 to move in three-dimensional space; a second light receiving unit 32 may be connected to the second moving device to allow the second light receiving unit 32 to move in three-dimensional space; and a light transmitting unit 30 may be connected to the transmitting moving device to allow the light transmitting unit 30 to move in three-dimensional space. This allows adjustment of the light transmitting position of the light transmitting unit 30 and the light receiving positions of the first light receiving unit 31 and the second light receiving unit 32.

[0048] In one embodiment, the light emitting unit 30 can emit a first laser beam and a second laser beam toward the composite material B. The wavelength range of the first laser beam and the second laser beam can be 300~2000 nm (e.g., any positive integer between 300 and 2000 nm), and the pulse width range of the first laser beam and the second laser beam can be 50 fs to 50 ns (e.g., any positive integer between 50 fs and 50 ns). The first light receiving unit 31 and the second light receiving unit 32 can be light wavefront sensors. The imaging unit 33 can be a waveform generator, which can generate a first detection waveform and a second detection waveform according to the reflected light signal and the transmitted light signal received by the first light receiving unit 31 and the second light receiving unit 32.

[0049] In another embodiment, the first light receiving unit 31 and the second light receiving unit 32 may be photoelastic sensors. The imaging unit 33 may generate a first stress distribution feature map and a second stress distribution feature map according to the light signals received by the first light receiving unit 31 and the second light receiving unit 32.

[0050] In another embodiment, the first optical receiving unit 31 and the second optical receiving unit 32 may be laser vibration meters, and the image unit 33 may generate a waveform diagram according to the reflected ultrasound waves and transmitted ultrasound waves received by the first optical receiving unit 31 and the second optical receiving unit 32.

[0051] In yet another embodiment, the first light receiving unit 31 and the second light receiving unit 32 may be hyperspectral sensors, and the imaging unit 33 may generate a detection spectrum based on the transmitted light signal and reflected light signal received by the first light receiving unit 31 and the second light receiving unit 32. In this embodiment, the spectral range received by the first light receiving unit 31 and the second light receiving unit 32 may be from 300 nm to 2500 nm (e.g., any positive integer between 300 and 2500 nm), and the spectrum may be a continuous spectrum.

[0052] On the other hand, the cutting device Z for cutting composite materials of the present invention may also include an artificial intelligence module 4, which can be used to learn and pre-train the cutting parameters of the composite material B, and can also be used to automatically select a suitable monitoring module 3 according to the characteristics of the composite material B, and optimize the setting of multiple monitoring parameters of the monitoring module 3. For example, the artificial intelligence module 4 can select a suitable monitoring module 3 according to relevant data on the type, shape, size, thickness, and density of the composite material B.

[0053] For example, as shown in Figure 17, the artificial intelligence module 4 may include at least a database unit 40, a learning and training unit 41, a parameter optimization and setting unit 42, and a monitoring module setting unit 43. The database unit 40 can be used to store relevant data about the composite material B, such as the type, shape, size, thickness, and density of the composite material B. Furthermore, the database unit 40 can be connected to the Internet via a wireless network unit (not shown in the figure) and can further connect to a cloud platform to update relevant data or provide it to the deep learning algorithm used by the learning and training unit 41. The learning and training unit 41 can be connected to the database unit 40 and can learn and pre-train using the relevant data in the database unit 40 through a deep learning algorithm. The parameter optimization and setting unit 42 can be connected to the database unit 40 and can optimize the cutting parameters based on the relevant data about the type, shape, size, thickness, and density of the composite material B. The monitoring module setting unit 43 can be connected to the database unit 40, and can select a suitable monitoring module 3 based on relevant data on the type, shape, size, thickness and density of the composite material B.

[0054] Furthermore, the monitoring module 3 can generate laser light, such as a linear laser or a surface laser, using at least one optical element via the light emitting unit 30. This allows the monitoring module 3 to scan the composite material B using either a linear or surface laser, increasing monitoring efficiency. The monitoring module 3 can also detect the morphological parameters of the composite material B using lasers with different delay times to monitor its cutting status in real time. Furthermore, the parameters of the laser beam L1 projected by the laser projector 20 (e.g., spot shape or beam energy, but not limited thereto) can be adjusted according to the cutting status of the composite material B.

[0055] The cutting apparatus for cutting composite materials of the present invention may further include a cleaning module 5. As shown in FIG. 18, the cleaning module 5 may be disposed above or adjacent to the support module 1. The present invention does not particularly limit the arrangement of the cleaning module 5. The cleaning module 5 may at least include a gas source 50 for storing a cleaning substance 52, and a gas nozzle 51 for supplying the cleaning substance 52 to the support module 1 or the composite material B, the gas nozzle 51 being connected to the gas source 50. For example, the gas source 50 may contain liquid carbon dioxide, which is supplied to the gas nozzle 51 at a pressure between approximately 700 psi and approximately 900 psi (e.g., any positive integer between 700 psi and 900 psi), causing the liquid carbon dioxide to undergo isenthalpic expansion into a stream of solid carbon dioxide particles upon exiting the gas nozzle 51, thereby carrying away impurities from the support module 1 or the composite material B. In one embodiment, the distance between the gas nozzle 51 and the composite material B may be between approximately 0.5 inches and approximately 2 inches (e.g., any positive integer between 0.5 inches and 2 inches). In another embodiment, the gas nozzle 51 and the composite material B may have tilt angles of approximately 15 degrees and 45 degrees (e.g., any positive integer between 15 and 45 inches) to avoid the carbon dioxide particle stream having too high momentum and damaging the composite material B. The laser beam L1 does not pass through the interior of the gas nozzle 51.

[0056] However, the examples given in the above embodiments are merely one possible embodiment and are not intended to limit the present invention.

[0057] [Beneficial Effects of the Examples]

[0058] The beneficial effect of the present invention is that the cutting device Z for cutting composite materials provided by the present invention can form multiple cutting areas A at different positions on the composite material B through the technical solution of "a support module 1 for supporting the composite material B; a laser generating module 2 for providing a laser beam L1, the laser generating module 2 may include a laser projector 20 for providing a laser light source L0 and a laser path adjuster 21 located on the projection path of the laser light source L0; the projection path of the laser beam L1 is adjusted by the laser path adjuster 21 or the composite material B is moved by the support module 1, so that the cutting area A formed by the laser beam L1 projected on the composite material B is offset in parallel; the pulse width of the laser light source L0 is in the femtosecond range (10-15 seconds), the pulse width of the laser light source L0 is less than 500 fs, and the pulse repetition frequency of the laser light source L0 is greater than 1 MHz", and gradually deepen the cutting depth by repeated and continuous projection, thereby cutting the composite material B.

[0059] Furthermore, the cutting device Z for cutting composite materials of the present invention can carry composite material B through a support module 1, and repeatedly and continuously project a laser beam L1 onto the composite material B on the support module 1 through a laser generating module 2, thereby forming multiple cutting areas A on the composite material B. The present invention adjusts the projection path of the laser beam L1 through a laser path adjuster 21, or drives the composite material B to be parallelly offset relative to the laser generating module 2 through the support module 1, so that the cutting areas A formed by the laser beam L1 projected onto the composite material B can be parallelly offset, that is, cutting areas A can be formed at different or the same positions on the composite material B, thereby gradually increasing the cutting depth and cutting the composite material B. Therefore, the cutting device Z for cutting composite materials of the present invention has better cutting efficiency and can maintain the integrity of the cut object compared with conventional cutting devices and methods.

[0060] Furthermore, the cutting device Z for cutting composite materials of the present invention can also monitor the composite material B by using the monitoring module 3 to monitor the cutting status of the composite material B in real time, and the parameters of the laser beam L1 projected by the laser projector 20 (such as the spot shape or beam energy, but not limited thereto) can be adjusted according to the cutting status of the composite material B.

[0061] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification and drawings are included in the scope of the patent application of the present invention.

[0062] Z: Cutting device 1: Load-bearing module 2: Laser generation module 20: Laser Projector 200: Laser Generation Unit 201: Beam Expander Unit 202: Polygonal Rotation Mirror Unit 203: First reflecting mirror group 204: Second reflecting mirror group 21: Laser Path Adjuster 3: Monitoring Module 30: Light emitting unit 31: First optical receiving unit 32: Second optical receiving unit 33: Image Unit 34: Control Unit 4: Artificial Intelligence Module 40: Database Unit 41: Learning and Training Unit 42: Parameter Optimization Setting Unit 43: Monitoring Module Setting Unit 5: Cleaning Module 50: Gas source 51: Gas nozzle 52: Cleaning substances B: Composite materials B1: Oxide layer B2: Nitride layer B3: Carbonized layer B4: Substrate A, A1, A2, A3: Cutting areas L1, L11, L12, L13: Laser beams L0: Laser source L2: Laser Beam L21: Reflected light L22: Transmitting Light

Claims

1. A cutting device for cutting composite materials, comprising: A support module for supporting the composite material; The device also includes a laser generating module for providing a laser beam. The laser generating module includes a laser projector for providing a laser light source and a laser path adjuster located on the projection path of the laser light source. The projection path of the laser beam is adjusted by the laser path adjuster or by the movement of the composite material through the carrier module, so that a cutting area formed by the laser beam projected onto the composite material is offset parallel to the laser beam. The laser light source has a pulse width in the femtosecond range (10⁻¹⁵ seconds), a pulse width less than 500 fs, and a pulse repetition frequency greater than 1 MHz. The cutting device further includes a monitoring module for monitoring the cutting status of the composite material. The monitoring module includes a light emitting unit, a light receiving unit, and an imaging unit. The imaging unit is a hyperspectral generator. The light emitting unit emits a first laser beam and a second laser beam toward the composite material. The light receiving unit includes: A first hyperspectral sensor is located on a first side of the composite material, and the first hyperspectral sensor receives reflected light from the first laser beam reflected by the composite material to generate a reflected light signal; and a second hyperspectral sensor is located on a second side of the composite material, and the second hyperspectral sensor receives transmitted light from the second laser beam passing through the composite material to generate a transmitted light signal; wherein, a hyperspectral generator is electrically connected to the first hyperspectral sensor and the second hyperspectral sensor to receive the reflected light signal and generate a first detection spectrum, and to receive the transmitted light signal and generate a second detection spectrum; wherein the first hyperspectral sensor and the second hyperspectral sensor receive a spectral range of 300 nm to 2500 nm, wherein the spectrum is a continuous spectrum.

2. The cutting apparatus as described in claim 1, wherein, The laser beam is offset parallel to the composite material by adjustment of the laser path adjuster; wherein the composite material includes at least one of an oxide layer, a nitrided layer and a carbide layer.

3. The cutting apparatus as described in claim 1, wherein, The composite material is offset parallel to the laser generating module by the movement of the carrier module; wherein the laser source is an infrared, ultraviolet or green laser; wherein the composite material includes a semiconductor wafer with a thickness of less than 100 μm.

4. The cutting apparatus as described in claim 1, wherein, The monitoring module uses monitoring lasers with different delay times to detect the morphological parameters of the composite material in real time to monitor the cutting status of the composite material. The cutting device also includes a cleaning module, which includes a gas source for storing a cleaning substance and a gas nozzle. The gas nozzle is connected to the gas source and supplies the cleaning substance to the support module to remove impurities from the support module or the composite material. The laser beam does not pass through the interior of the gas nozzle.

5. The cutting apparatus as described in claim 4, wherein, The monitoring module also includes a first mobile device connection, a second mobile device, and a transmitting mobile device; wherein, the first hyperspectral sensor is connected to the first mobile device to enable the first hyperspectral sensor to move in a three-dimensional space; wherein, the second hyperspectral sensor is connected to the second mobile device to enable the second hyperspectral sensor to move in the three-dimensional space; wherein, the light emitting unit is connected to the transmitting mobile device to enable the light emitting unit to move in the three-dimensional space.

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