Heater assembly with process gap control for batch processing chambers

Abstract

A heater assembly having a top seal and a second seal is configured to address handling height deviations and motor runoff from the heater support. The top seal is located between a shield and a top plate, and the bottom seal is located between the heater mounting base and the heater support.

Description

Technical Field

[0001] Embodiments of this invention generally relate to heater assemblies for batch processing chambers. In particular, embodiments of this invention relate to heater assemblies including integrated thermal isolation shields. Prior Technology

[0002] In some chamber designs used for atomic layer deposition (ALD) or chemical vapor deposition (CVD) processes, precursors and gases are simultaneously delivered to the surfaces of a large substrate support or multiple substrate supports through multiple gas distribution plates. The gas distribution plates are spaced apart from the substrate surface, and vice versa, forming one or more operating gaps. Such chambers can be highly sensitive to the consistency and uniformity of gaps between different processing stations, and as the chamber is used over time. For some multi-station deposition systems with gaps of approximately 1 mm, processes performed in individual stations are highly susceptible to the effects of minute gap deviations.

[0003] Many processing systems and tools operate within very tight space requirements. For example, multi-substrate ALD chambers can perform processing with a gap of 0.8 to 1.5 mm between the substrate surface and the gas distribution system. These small spaces minimize chemical consumption by reducing processing volume, minimizing ALD cycle time and cleaning time, and maximizing throughput.

[0004] Large-volume batch processing chambers are frequently affected by variations in the alignment of the heater assembly relative to the processing station, resulting in deviations in processing clearance and volume between the heater assembly and the processing station. These deviations affect processing repeatability and the thermal uniformity of the heaters. Traditional processing chamber leveling systems and methods use complex and expensive systems to measure and align the heaters. These electrical systems are prone to failure due to normal wear and tear on components, leading to chamber downtime for repairs and preventative maintenance.

[0005] Therefore, there is a need in the art for apparatus and methods for controlling the gap between a substrate support and a gas distribution assembly. Summary of the Invention

[0006] One or more embodiments of the present invention relate to a heater assembly including a heater, a heater support, a shielding shaft, and a shielding plate. The heater has a supporting surface and a bottom surface of defined thickness. The top end of the heater support contacts the bottom surface of the heater. The shielding shaft has a top end and a bottom end, an inner surface and an outer surface surrounding an open internal region. The heater support is located within the open internal region, with the top end of the heater support extending above the top end of the shielding shaft. The shielding plate has a top surface, a bottom surface, and an outer peripheral edge. The shielding plate also includes an opening extending internally from the top surface to the bottom surface. The bottom surfaces of the heater support and the heater, extending through the opening in the shielding plate, are spaced apart from the top surface of the shielding plate. The top surface of the shielding plate has a groove having an inner surface and an outer surface extending around a peripheral portion of the shielding plate. The outer surface of the shielding plate is spaced apart from the outer peripheral edge of the shielding plate.

[0007] Additional embodiments of the present invention relate to a base plate support having a central base, a heater assembly, and a top plate. A plurality of arms extend therefrom, each arm having an inner end and an outer end contacting the central base. A heater assembly is connected to the outer end of each arm and includes a heater, a heater support, a shielding shaft, and a shielding plate. The heater has a support surface and a bottom surface with defined thickness. The top end of the heater support contacts the bottom surface of the heater. The shielding shaft has a top end and a bottom end, an inner surface and an outer surface surrounding an open internal region. The heater support is located within the open internal region, and the top end of the heater support extends above the top end of the shielding shaft. The shielding plate has a top surface, a bottom surface, and an outer peripheral edge. The shielding plate also includes an opening extending internally from the top surface to the bottom surface. The bottom surfaces of the heater support and the heater, extending through the opening in the shielding plate, are spaced apart from the top surface of the shielding plate. The top surface of the shielding plate has a groove having an inner surface and an outer surface extending around a peripheral portion of the shielding plate. The outer surface of the shielding plate is spaced apart from the outer peripheral edge of the shielding plate. The top plate has a top surface and a bottom surface that define the thickness of the top plate, and the top plate has an opening through the thickness to allow the heater to pass through the opening. The bottom surface of the top plate is in contact with the fluid seal. Simple Explanation of the Diagram

[0008] To gain a more detailed understanding of the foregoing features of this invention, a more specific description of the invention (which has been briefly summarized above) can be obtained by referring to the embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the drawings only show typical embodiments of the invention and should not be considered as limiting its scope, as the invention may allow for other equally effective embodiments.

[0009] Figure 1 shows a cross-sectional isometric view of a processing chamber according to one or more embodiments of the present disclosure;

[0010] Figure 2 shows a cross-sectional view of a processing chamber according to one or more embodiments of the present disclosure;

[0011] Figure 3 shows a bottom perspective view of a support assembly according to one or more embodiments of the present disclosure;

[0012] Figure 4 shows a top perspective view of a support assembly according to one or more embodiments of the present disclosure;

[0013] Figure 5 shows a top perspective view of a support assembly according to one or more embodiments of the present disclosure;

[0014] Figure 6A shows a schematic cross-sectional view of a support assembly according to one or more embodiments of the present disclosure;

[0015] Figure 6B shows a schematic cross-sectional view of a support assembly according to one or more embodiments of the present disclosure;

[0016] Figure 7 shows a front perspective view of a heater assembly according to one or more embodiments of the present disclosure;

[0017] Figure 8 shows a cross-sectional view of a heater assembly according to one or more embodiments of the present disclosure;

[0018] Figure 9 shows a detailed cross-sectional view of a heater assembly according to one or more embodiments of the present disclosure;

[0019] Figure 10 shows a detailed cross-sectional view of a heater assembly according to one or more embodiments of the present disclosure;

[0020] Figure 11 shows a schematic cross-sectional view of a heater assembly according to one or more embodiments of the present disclosure;

[0021] Figure 12 shows a schematic cross-sectional view of a heater assembly according to one or more embodiments of the present disclosure; and

[0022] Figure 13 shows a schematic diagram of a processing platform according to one or more embodiments of the present disclosure. Implementation

[0023] Before describing several exemplary embodiments of the present invention, it should be understood that the present invention is not limited to the details of the construction or processing steps set forth in the following description. The present invention can have other embodiments and can be practiced or performed in various ways.

[0024] As used in this specification and the accompanying claims, the term "substrate" refers to a surface or part thereof on which the treatment is performed. Those skilled in the art will also understand that reference to a substrate may also refer to only a portion of the substrate, unless the context clearly indicates otherwise. Furthermore, reference to deposition on a substrate can refer to a bare substrate and a substrate having one or more films or features deposited or formed thereon.

[0025] As used herein, "substrate" means any substrate on which a film treatment is performed during manufacturing processes, or a material surface formed on a substrate. For example, substrate surfaces on which treatments can be performed include materials such as silicon, silicon oxide, strained silicon, silicon-on-insulator (SOI), carbon-doped silicon oxide, amorphous silicon, doped silicon, germanium, gallium arsenide, glass, sapphire, and any other materials such as metals, metal nitrides, metal alloys, and other conductive materials, depending on the application. Substrates include, but are not limited to, semiconductor wafers. Substrates may be exposed to pretreatment processes such as polishing, etching, reduction, oxidation, hydroxylation, annealing, UV curing, electron beam curing, and / or baking of the substrate surface. In addition to performing film treatments directly on the surface of the substrate itself, any film treatment steps disclosed in this disclosure may also be performed on an underlayer formed on the substrate as disclosed in more detail below, and the term "substrate surface" is intended to include the underlayer as indicated by the context. Thus, for example, when a film / layer or a portion of a film / layer has been deposited onto the substrate surface, the exposed surface of the newly deposited film / layer becomes the substrate surface.

[0026] As used in this specification and the accompanying claims, the terms "precursor," "reactant," "reactive gas," etc., are used interchangeably to refer to any gaseous substance capable of reacting with the surface of the substrate or with a thin film formed on the surface of the substrate.

[0027] Some embodiments of the present invention advantageously provide a cost-effective solution for using O-rings to level heaters for processing gap control without requiring complex motorized systems. Some embodiments provide a way to integrate heaters with thermal isolation shields, heater leveling capabilities, and / or processing volume isolation for individual wafers within a multi-wafer processing chamber.

[0028] Some embodiments of the present disclosure provide a heater assembly integrated into a thermal shielding assembly (also referred to as a heater shielding assembly) to form a uniform cavity around a heater support. The heater shielding assembly includes a shielding plate and a shielding shaft. The heater shielding assembly also includes a fluid seal between the shielding plate and the shielding shaft, the fluid seal being configured to seal against leakage and maintain vacuum integrity. The thermal shielding of some embodiments increases the uniformity of temperature loss around the heater.

[0029] This disclosure provides a substrate support for use with single-substrate or multi-substrate (also referred to as batch processing) processing chambers. Figures 1 and 2 illustrate a processing chamber 100 according to one or more embodiments of the present disclosure. Figure 1 illustrates a processing chamber 100 illustrated as a cross-sectional isometric view according to one or more embodiments of the present disclosure. Figure 2 shows a cross-section of a processing chamber 100 according to one or more embodiments of the present disclosure. Figures 3 through 6 illustrate a support assembly 200 according to one or more embodiments of the present disclosure.

[0030] The processing chamber 100 has an outer shell 102 with side walls 104 and a chamber floor 106. The outer shell 102, together with the chamber cover 300, defines a processing volume 109, also referred to as an internal volume 109.

[0031] The illustrated processing station 110 includes three main components: a chamber cover 300 (also referred to as a cover), a pump / cleaning insert 330, and a gas injector 112. The processing chamber 100 also includes a plurality of processing stations 110. The processing stations 110 are located within the internal volume 109 of the housing 102 and are positioned in a circular arrangement about a rotation axis 211 of the substrate support 200. Each processing station 110 includes a gas distribution plate 112 (also referred to as a gas injector) having a front surface 114. In some embodiments, the front surfaces 114 of each gas injector 112 are substantially coplanar. A processing station 110 is defined as an area where processing can be performed. For example, in some embodiments, a processing station 110 is defined as the area defined by the support surface 231 of the substrate support 200 and the front surface 114 of the gas injector 112, as described below. In the illustrated embodiment, a heater 230 acts as a substrate support surface and forms part of the substrate support 200. Each heater 230 includes a support surface 231 and a bottom surface 232 defining the thickness of the heater 230. In some embodiments, the support surface 231 further includes supplying at least three lifting pins for extending through the support surface 231.

[0032] Processing station 110 can be configured to perform any suitable process and provide any suitable processing conditions. The type of gas distribution plate 112 used will depend, for example, on the type of process being performed and the type of nozzle or gas injector. For example, processing station 110 configured to operate as an atomic layer deposition apparatus may have a nozzle or a vortex gas injector. However, processing station 110 configured to operate as a plasma station may have one or more electrodes and / or ground planes configured to generate plasma while allowing plasma gas to flow to the substrate. The embodiments shown in Figure 2 have different types of processing stations 110 on the left side of the figure (processing station 110a) and on the right side of the figure (processing station 110b). Suitable processing stations 110 include, but are not limited to, heat treatment stations, microwave plasma, three-electrode CCP, ICP, parallel plate CCP, UV exposure, laser processing, pump chambers, annealing stations, and metering stations.

[0033] Figures 3 through 6 illustrate a support assembly 200 according to one or more embodiments of the present disclosure. The support assembly 200 includes a rotatable central base 210. The rotatable central base 210 may have a symmetrical or asymmetrical shape and defines a rotation axis 211. The rotation axis 211, as shown in Figure 6, extends along a first direction. The first direction may be referred to as a vertical direction or along the z-axis; however, it should be understood that the term "vertical" used in this way is not limited to a direction perpendicular to gravity.

[0034] The support assembly 200 includes at least two support arms 220, which are connected to and extend from a central base 210. Each support arm 220 has an inner end 221 and a heater mounting base 222. The inner end 221 contacts the central base 210 such that when the central base 210 rotates about a rotation axis 211, the support arm 220 also rotates. The support arm 220 may be connected to the central base 210 at its inner end 221 by fasteners (e.g., bolts) or by being integrally formed with the central base 210.

[0035] In some embodiments, the support arm 220 extends perpendicular to the rotation axis 211, such that one of the inner end 221 or the heater mounting base 222 is further away from the rotation axis 211 than the other of the inner end 221 and the heater mounting base 222 on the same support arm 220. In some embodiments, the inner end 221 of the support arm 220 is closer to the rotation axis 211 than the heater mounting base 222 of the same support arm 220.

[0036] The number of support arms 220 in the support assembly 200 can vary. In some embodiments, there are at least two support arms 220, at least three support arms 220, at least four support arms 220, or at least five support arms 220. In some embodiments, there are three support arms 220. In some embodiments, there are four support arms 220. In some embodiments, there are five support arms 220. In some embodiments, there are six support arms 220.

[0037] The support arms 220 can be arranged symmetrically around the central base 210. For example, in a support assembly 200 with four support arms 220, each support arm 220 is positioned at 90° intervals around the central base 210. In a support assembly 200 with three support arms 220, the support arms 220 are positioned at 120° intervals around the central base 210. In other words, in the embodiment with four support arms 220, the support arms are arranged to provide fourfold symmetry about the rotation axis 211. In some embodiments, the support assembly 200 has n support arms 220 and the n support arms 220 are arranged to provide nfold symmetry about the rotation axis 211.

[0038] The heater 230 is located at the heater mounting base 222 of the support arm 220. In some embodiments, each support arm 220 has a heater 230. The center of the heater 230 is located at a distance from the rotation axis 211, such that the heater 230 moves along a circular path when the central base 210 rotates.

[0039] The heater 230 has a support surface 231 that can support a substrate. In some embodiments, the heater 230 and the support surface 231 are substantially coplanar. As used in this way, "substantially coplanar" means that the plane formed by each support surface 231 is within ±5°, ±4°, ±3°, ±2° or ±1° of the plane formed by the other support surface 231.

[0040] In some embodiments, the heater 230 is positioned directly on the heater mounting base 222 of the support arm 220. In some embodiments, as shown, the heater 230 is raised above the heater mounting base 222 of the support arm 220 via a heater support 234. The heater support 234 has a generally cylindrical body and can be of any size and length to increase the height of the heater 230.

[0041] In some embodiments, channel 236 is formed in one or more of the central base 210, support arm 220, and / or heater support 234. Channel 236 can be used to route electrical connections or provide airflow.

[0042] The heater can be any suitable type of heater known to those skilled in the art. In some embodiments, the heater is a resistance heater having one or more heating elements within a heater body.

[0043] In some embodiments, as shown in FIG4, the shielding plate 240 is disc-shaped and positioned around each heater 230. In the illustrated embodiment, the shielding plate 240 is located below the heater 230 such that the top surface 241 of the shielding plate 240 is below the support surface 231 of the heater.

[0044] Some embodiments of the heater 230 include additional components. For example, some embodiments of the heater include an electrostatic chuck. The electrostatic chuck may include various wires and electrodes, thereby holding a substrate located on the support surface 231 in place while the heater is being moved. This allows the substrate to be clamped onto the heater at the start of processing and held in the same position on the same heater as it is moved to different processing areas. In some embodiments, the wires and electrodes are routed through channels 236 in the support arm 220. The electrostatic chuck is configured to be disposed on a chuck surface within the heater 230.

[0045] In some embodiments, as shown in FIG. 5, a top plate 245 is a single component surrounding all heaters 230, having at least one opening 242 to allow access to the support surface 231 of the heaters 230. The top plate 245 has a top surface 246 and a bottom surface 249 defining the thickness of the top plate 245. The opening 242 allows the heaters 230 to pass through the top plate 245. In some embodiments, the top plate 245 is fixed so that it moves vertically and rotates with the heaters 230.

[0046] As shown in FIG6A, in some embodiments, the top plate 245 has a top surface 246 forming a principal plane 248, which is substantially parallel to a principal plane 247 formed by the support surface 231 of the heater 230. In some embodiments, the top plate 245 has a top surface 246 forming the principal plane 248, which is a distance D above the principal plane 247 of the support surface 231. In some embodiments, the distance D is substantially equal to the thickness of the substrate 390 to be processed, such that the support surface 231 and the top surface 246 of the top plate 245 are coplanar, as shown in FIG6B. As used in this way, the term "substantially coplanar" refers to the coplanarity of the principal planes formed by the surfaces of the substrate 390 within ±1 mm, ±0.5 mm, ±0.4 mm, ±0.3 mm, ±0.2 mm, or ±0.1 mm.

[0047] Figure 7 shows an isometric view of a portion of a support assembly 200 having a heater assembly 205 according to one or more embodiments of the present disclosure. Figure 8 shows a cross-sectional view of a portion of the support assembly 200 having the heater assembly 205 as shown in Figure 7, taken along line 8-8'. The shading in the figures is used to help distinguish different components and does not imply any particular structural material. In some embodiments, the heater assembly 205 includes a heater 230, a heater support 234, and a shield consisting of a shielding shaft 250 and a shielding plate 240.

[0048] The shielding shaft 240 has an outer surface 255 and an inner surface 257, the inner surface 257 surrounding each heater support 234. The shielding shaft 250 has a top end 252 and a bottom end 258 defining the length of the shielding shaft 250. In some embodiments, the shielding shaft 250 has a shape concentric with the shape of the support 234. In some embodiments, the shielding shaft 250 has a generally cylindrical body. When used in this way, the term "generally cylindrical" means that the shape gives an overall cylindrical appearance and includes an elongated ellipse.

[0049] In some embodiments, the bottom end 258 of the shielding shaft 250 includes a bottom flange 267. In some embodiments, the bottom flange 267 has a top surface 260 and a bottom surface 262 with defined thicknesses. In some embodiments, the bottom flange 267 extends outward from the outer surface 255. In some embodiments, the bottom flange 267 provides space for fasteners or other components.

[0050] In some embodiments, at least three holes 259 extend through the thickness of the bottom end 258. In some embodiments, holes 259 extend through the thickness of a flange 267 that is part of the bottom end 258. In some embodiments, at least three holes 259 are spaced apart around the central axis 253 of the shielding shaft 250. In some embodiments, at least three holes 259 are equidistantly spaced around the central axis 253. In some embodiments, there are three holes 259 equidistantly spaced around the central axis 253 such that, measured from the central axis 253, the holes 259 are positioned at 120-degree intervals. In some embodiments, at least four holes extend through the thickness of the bottom end 258, and the at least four holes are arranged in a square planar configuration around the central axis of the shielding shaft 250, wherein each of the at least four holes is positioned at a 90-degree angle to each other.

[0051] In some embodiments, a leveling fastener 261 is disposed within each of at least three holes 259. In some embodiments, the leveling fastener 261 is used to level and secure the shielding shaft 250 to the top surface 223 of the outer end 224 of the support arm 220. The leveling fastener 261 is configured to adjust the shielding shaft 250 vertically relative to the top surface 223 of the heater mounting base 222. In other words, in some embodiments, the leveling fastener 261 is configured to allow adjustment of the shielding shaft 250 such that the central axis 253 of the shielding shaft is substantially perpendicular (±2°) to the top surface 223 of the heater mounting base 222.

[0052] In some embodiments, as explained in further detail below, when calibrating the shielding shaft 250 relative to the outer end 224 of the support arm 220, one or more shims (not shown) of variable thickness are positioned around the leveling fastener 261. In some embodiments, one or more shims are located between the outer end 224 of the support arm 220 and the bottom surface 262 of the shielding shaft 250.

[0053] The heater support 234 includes a top end 235 and a bottom end 237. The top end 235 of the heater support 234 contacts the bottom surface 232 of the heater 230. The bottom end 237 of the heater support 234 contacts the support mounting base 310. In some embodiments, the support mounting base 310 is configured to secure the heater support 234 to the outer end 224 of the support arm 220. In some embodiments, the heater support 234 has an open internal channel 239 to allow electrical connections 244 to be connected to one or more thermal elements 219 or electrodes 217 of the electrostatic chuck within the heater 230. Those skilled in the art will be familiar with the construction of the heater and the electrostatic chuck, and will understand that the arrangement of the thermal and electrical components within the heater 230 can vary.

[0054] In the illustrated embodiment, the top end 235 of the heater support 234 is above the top end 252 of the shielding shaft 250. In some embodiments, the top end 252 of the shielding shaft 250 extends above the top end 235 of the heater support 234. In some embodiments, the top end 252 of the shielding shaft 250 extends to the top end 235 of the heater support 234.

[0055] As shown in Figures 8 and 9, the shielding plate 240 has a top surface 270 and a bottom surface 272 with a defined thickness. The shielding plate 240 also includes an opening 271 extending from the top surface 270 to the bottom surface 272. In some embodiments, as shown, the bottom surface 232 of the heater 230 is spaced apart from the top surface 270 of the shielding plate 240 by a certain distance. In some embodiments, the distance between the bottom surface 232 of the heater 230 and the top surface 270 of the shielding plate 240 is in the range of 0.01 mm to 50 mm, or in the range of 0.25 mm to 40 mm, or in the range of 0.5 mm to 30 mm, or in the range of 1 mm to 20 mm.

[0056] The shielding plate 240 has an inner portion 274, an outer portion 275, and an outer peripheral edge 281. In some embodiments, the outer portion 275 is thicker than the inner portion 274. In some embodiments, the bottom surface 272 of the shielding plate 240 contacts the top end 252 of the shielding shaft 250 and is secured by fasteners 256 extending through at least three holes 254 extending through the top end 252. In some embodiments, the bottom surface 272 is welded to the top end 252 of the shielding shaft 250. In some embodiments, the bottom surface 272 of the shielding plate 240 has a greater thickness, wherein the top end 252 contacts the bottom surface 272 of the shielding plate 240. The greater thickness is to accommodate fastener holes configured to receive the fasteners 256.

[0057] Figure 9 shows a portion of the outer edge of a heater 230 having a top plate 245 and a shielding plate 240. In the illustrated embodiment, the shielding plate 240 is located below at least one of the openings 242 of the top plate 245. The top surface 270 of the shielding plate 240 also includes a groove 278 having an inner surface 279 and an outer surface 280 extending around a peripheral portion 276 of the shielding plate 240, the outer surface 280 being spaced apart from the peripheral edge 281 of the shielding plate 240 by a distance.

[0058] At each of at least one opening 242, the bottom surface 249 of the top plate 245 contacts the peripheral portion 276 of the top surface 270 of the shield plate 240. A first fluid seal 392 (also referred to as a "top fluid seal") is disposed within an annular groove 278 of the peripheral edge 281 to maintain low-pressure conditions within the processing station 110. The first fluid seal 392 is configured to compress unevenly around the periphery of the shield plate 240, such that even when uneven pressure is applied between the shield plate 240 and the top plate 245, the first fluid seal 392 still maintains atmospheric conditions within the processing station.

[0059] In some embodiments, an annular gasket 350 having thickness is located between the top surface 241 of the shielding plate 240 (which is below the support surface 231 of the heater 230) and the bottom surface 249 of the top plate 245. The annular gasket 350 is configured to compress a first fluid seal 392 located at least partially within a groove 278 of the shielding plate 240. In some embodiments, the thickness of the annular gasket 350 may be configured to accommodate a variable distance between the top surface 241 of the shielding plate 240 and the bottom surface 249 of the top plate 245. In some embodiments, the annular gasket 350 has a variable thickness around the periphery of the ring. In some embodiments, the annular gasket 350 comprises a plurality of individual components assembled into a ring.

[0060] In some embodiments, a gas chamber 283 is formed between the annular gasket 350 and the top plate 245. The gas chamber 283 can be any suitable shape and / or size that will be understood by one of ordinary skill in the art. In some embodiments, the gas chamber 283 is connected to a vacuum source (e.g., a vacuum pump, a foreline) to prevent process gases from leaking out of the processing area in the processing station.

[0061] In some embodiments, both the annular gasket 350 and the first fluid seal 392 are configured to seal against gas leakage into or out of the processing station and to maintain vacuum integrity within the processing station. In some embodiments, the first fluid seal 392 is configured to seal against vertical processing gap variations of up to 1.5 mm, 1.25 mm, 1 mm, 0.75 mm, or 0.5 mm within the processing station 110. The vertical processing gap is defined by the vertical distance between the support surface 231 and the front surface 114 of each gas injector 112. In some embodiments, a gasket 350 with a larger thickness is provided when the processing gap is too small. In some embodiments, a gasket 350 with a smaller thickness is provided when the processing gap is too large. Similarly, the first fluid seal 392 may be oversized to address excessively small processing gaps. In some embodiments, the first fluid seal is configured to seal against leakage and maintain vacuum integrity within the chamber with a vertical gap variation of up to 1 mm.

[0062] The first fluid seal 392 can be any suitable compressible component known to those skilled in the art and compatible with the process gas and process conditions. In some embodiments, the first fluid seal 392 is configured to have a maximum compression of 12% to 13%. In some embodiments, the first fluid seal 392 is configured to have a maximum compression in the range of 1% to 15%, or 5% to 14%, or 10% to 13% of the initial thickness of the first fluid seal 392.

[0063] The first fluid seal 392 is configured to compress unevenly to accommodate planar variations in the support surface 231. Planar variations may occur due to motor runout or variations in the mechanical tolerances of one or more of the heater support 234, shield shaft 250, support mounting base 310, support arm 220, shield plate 240, and top plate 245. In some embodiments, the first fluid seal is configured to accommodate vertical gap variations of up to 0.5 mm between the shield plate 240 and the top plate 245.

[0064] Referring to FIG10, in some embodiments, a support mounting base 310 is connected to the bottom end 237 of the heater support 234 and the bottom end 258 of the shielding shaft 250. The support mounting base 310 is configured to secure the heater support 234 and the shielding shaft 250 to the outer end 224 of the support arm 220. The support mounting base 310 has a top end 312 and a bottom end 314, the diameter of the top end 312 being larger than the diameter of the bottom end 314. The top surface 316 of the top end 312 contacts the bottom of the heater support 234.

[0065] The bottom end 314 of the support mounting base 310 is configured to cross within the opening 225 of the top surface 223 of the support arm 220. In some embodiments, the bottom end 314 extends to a certain depth into the opening 225 of the support arm 220. In some embodiments, the bottom end 314 is press-fitted or tight-fitted within the opening 225.

[0066] In some embodiments, the bottom end 258 of the shielding shaft 250 has an opening 251 to allow the lower portion 238 of the support mounting base 310 to extend through.

[0067] In some embodiments, the top end 312 of the support mounting base 310 further includes a plurality of stepped surfaces 315. In some embodiments, each of the plurality of stepped surfaces 315 has a diameter that gradually decreases from the top surface 316 of the support mounting base 310 to the bottom surface 318 of the support mounting base 310. Each of the plurality of stepped surfaces 315 has a bottom surface 317 that contacts a corresponding step of the inner flange 264 of the shielding shaft 250. In some embodiments, one or more of the bottom surfaces 318 of the plurality of stepped surfaces 315 further include a channel 313 for receiving a plurality of fluid seals 311. The plurality of fluid seals 311 are configured to maintain a low atmospheric environment within the shielding shaft 250 when the plurality of fluid seals 311 are compressed between the bottom surface 317 of each of the plurality of stepped surfaces 315 and the corresponding step of the inner flange 264 of the shielding shaft 250. In some embodiments, the top surface 316 is partially recessed into the top end 312 of the support mounting base 310.

[0068] In embodiments having a plurality of processing stations 110, the support arm 220 includes an outer end 221 as described above. In embodiments having a single processing station, the heater mounting base 222 includes a top surface 223 adjacent to the bottom surface 262 of the shielding shaft 250. The top surface 223 of the heater mounting base 222 includes an opening 225 connecting to an open internal region of the heater mounting base 222. The opening 225 extends partially through the top surface 223. The opening 225 is concentrically located on the central axis of the heater mounting base 222. The opening 225 is configured to allow passage for cables, fluid passages, and gas passages through the open internal region of the heater mounting base 222 and into the open internal passage of the heater support 234 via the support mounting base 310. In some embodiments, the opening 225 is configured to receive a bottom portion 314 of the support mounting base 310.

[0069] The top surface 223 also includes an annular groove 227 for receiving a second fluid seal 229 (also referred to as a "bottom fluid seal") disposed around the opening 225. The second fluid seal 229 contacts the bottom surface 268 of the shielded shaft 250. The second fluid seal 229 is configured to allow movement of the shielded shaft 250 relative to the top surface 223 of the heater mounting base 222.

[0070] The second fluid seal 229 is configured to allow at least one gasket (not shown) to be positioned between the bottom surface 268 of the shielding shaft 250 and the top surface 223 of the heater mounting base 222. In some embodiments, the at least one gasket is an annular gasket positioned around the opening 225. In some embodiments, the at least one gasket is located between fasteners securing the bottom end 258 of the shielding shaft 250 to the top surface 223 of the support arm 220.

[0071] In some embodiments, the first fluid seal 392 and the second fluid seal 229 are O-rings. In some embodiments, the first fluid seal 392 and the second fluid seal 229 are V-rings. In some embodiments, the first fluid seal 392 and the second fluid seal 229 are L-rings.

[0072] The shielding plate 240 and the shielding shaft 250 form a uniform heater shielding assembly. The heater shielding assembly forms a uniform cavity sealed by a first fluid seal 392 and a second fluid seal 299 to prevent leakage, while maintaining the vacuum integrity within the uniform cavity. The heater shielding assembly (also referred to as a thermal shielding assembly) increases the loss of temperature uniformity around the heater 230.

[0073] As shown in Figures 11 and 12, each support surface 231 of the heater 230 is substantially coplanar with each of the other support surfaces 231 of the heater 230. In some embodiments, the support surface 231 is at an angle θ relative to the heater support 234, which is calibrated to be 90 degrees, thereby providing a horizontal surface for the support surface 231.

[0074] As shown in Figure 12, motor deflection can cause the support surface 231 and heater support 234 to be misaligned, where the angle θ is no longer essentially 90 degrees. Continuous cycling and torque scanning can also cause misalignment, resulting in oscillation, variations in the internal volume of the processing chamber, or variations in the separation gap distance.

[0075] In some embodiments, a plurality of displacement sensors are used to mechanically correct misalignment, thereby ensuring proper alignment of the support surface 231 with the top plate 245. In some embodiments, mechanical correction includes, but is not limited to, shims filling gaps at the connection points or flanges between the heater support 234 and the heater 230, shims filling gaps at the connection points between the heater support 234 and the support arm 220, and adjusting the fasteners at the top end 252 and bottom end 258 of the shielding shaft 250. Calibration may also include placing shims between the fasteners 256 at the top end 252 of the shielding shaft 250 and between the leveling fasteners 261 at the bottom end 258 of the shielding shaft 250. Mechanical calibration may also include placing or adjusting the thickness of the annular shim 350 to accommodate vertical processing gap deviations.

[0076] In some embodiments, as described in further detail below, the deflection and wobbling caused by the incorrect alignment of the heater support 234 as shown in FIG12 are calibrated. After correcting the deflection and wobbling of the heater support 234 and aligning it correctly, the angle θ is brought into a correct alignment of approximately 90 degrees.

[0077] In some embodiments, the plurality of displacement sensors are preferably laser displacement sensors, whereby laser beams are directed to the support surface 231. The displacement sensors are configured to measure the distance from the sensor to a point on the support surface 231. In some embodiments, the displacement sensors are also configured to measure the distance between the sensor and a point on the top surface 246 of the top plate 245.

[0078] In the described embodiments, the displacement sensor is part of at least a set of three sensors. Each of the three sensors is configured to measure the distance from the sensor to a point on the surface, thereby measuring the distances to three points on the surface. In some embodiments, the set of three sensors is positioned equidistantly from each other in an equilateral triangle configuration located in the xy plane, having a central axis relative to the surface calibrated for coplanarity.

[0079] In the described embodiments, the displacement sensor is configured to measure the parallelism of the support surface 231 relative to a corresponding set of three sensors. The parallelism of the surface relative to the set of three sensors is calculated using the distance between each of the three sensors and a point on the surface, which is in the z-plane relative to the xy-plane of the triangular arrangement of the sensors. In some embodiments, the displacement sensor is configured to measure the parallelism of the support surface 231 relative to two corresponding sets of three sensors. In some embodiments, the displacement sensor is configured to measure the parallelism of multiple support surfaces 231 relative to the displacement sensor. In some embodiments, the displacement sensor is configured to measure the parallelism of the top surface 246 of the top plate 245 relative to a corresponding set of three sensors.

[0080] Figure 14 illustrates a processing platform 400 according to one or more embodiments of the present disclosure. The embodiments shown in Figure 4 represent only one possible configuration and should not be considered as limiting the scope of the present disclosure. For example, in some embodiments, the processing platform 400 has a different number of processing chambers 100, buffer stations 420, and / or robots 430 configurations than those shown in the embodiments.

[0081] An exemplary processing platform 400 includes a central transfer station 410 having a plurality of sides 411, 412, 413, 414. The transfer station 410 shown has a first side 411, a second side 412, a third side 413, and a fourth side 414. Although four sides are shown, those skilled in the art will understand that, depending on, for example, the overall configuration of the processing platform 400, the transfer station 410 may have any suitable number of sides. In some embodiments, the transfer station 410 has three, four, five, six, seven, or eight sides.

[0082] Transfer station 410 has a robot 430 positioned therein. Robot 430 can be any suitable robot capable of moving the substrate during processing. In some embodiments, robot 430 has a first arm 431 and a second arm 432. The first arm 431 and the second arm 432 can move independently of the other arm. The first arm 431 and the second arm 432 can move in the xy plane and / or along the - axis. In some embodiments, robot 430 includes a third arm (not shown) or a fourth arm (not shown). Each arm can move independently of the other arms.

[0083] The illustrated embodiment includes six processing chambers 100, two of which are connected to each of the second side 412, the third side 413, and the fourth side 414 of the central transfer station 410. Each processing chamber 100 can be configured to perform different processes.

[0084] The processing platform 400 may also include one or more buffer stations 420 connected to a first side 411 of the central transfer station 410. Buffer stations 420 may perform the same or different functions. For example, a buffer station may hold a substrate cassette being processed and return the substrate to its original cassette, or one of the buffer stations may hold an unprocessed substrate that is moved to another buffer station after processing. In some embodiments, one or more buffer stations are configured to pre-process, preheat, or clean the substrate before and / or after processing.

[0085] The processing platform 400 may also include one or more slit valves 418 between either the central transfer station 410 or the processing chamber 100. The slit valves 418 can be opened and closed to isolate the internal volume within the processing chamber 100 from the environment within the central transfer station 410. For example, if the processing chamber will generate plasma during processing, closing the slit valve of that processing chamber may be helpful to prevent accidental plasma damage to the robot in the transfer station.

[0086] Processing platform 400 can be connected to factory interface 450 to allow substrates or substrate cassettes to be loaded into processing platform 400. Robots 455 within factory interface 450 can be used to move substrates or substrate cassettes into and out of buffer stations. Substrates or substrate cassettes can be moved within processing platform 400 via robots 430 in central transfer station 410. In some embodiments, factory interface 450 serves as a transfer station for another cluster tool (i.e., another multi-chamber processing platform).

[0087] Controller 495 may be provided and coupled to various components of processing platform 400 to control its operation. Controller 495 may be a single controller controlling the entire processing platform 400, or multiple controllers controlling various parts of processing platform 400. For example, in some embodiments, processing platform 400 includes separate controllers for one or more of individual processing chamber 100, central transfer station 410, plant interface 450, and / or robot 430.

[0088] In some embodiments, the processing chamber 100 further includes a controller 495 connected to a plurality of substantially coplanar support surfaces 231, configured to control one or more of a first temperature or a second temperature. In one or more embodiments, the controller 495 controls the movement speed of the substrate support 200 (FIG. 2).

[0089] In some embodiments, the controller 495 includes a central processing unit (CPU) 496, memory 497, and support circuitry 498. The controller 495 may directly control the processing platform 400 or be controlled via a computer (or controller) associated with a specific processing chamber and / or support system components.

[0090] The controller 495 can be one of any type of general-purpose computer processor, which can be used in an industrial environment to control various chambers and subprocessors. The computer-readable medium of the memory 497 or the controller 495 can be one or more readily available types of memory, such as random access memory (RAM), read-only memory (ROM), floppy disk, hard disk, optical storage media (e.g., optical disc or digital video disc), flash drive, or any other form of local or remote digital storage. The memory 497 can hold a set of instructions operable by the processor (CPU 496) to control the parameters and components of the processing platform 400.

[0091] Support circuitry 498 is coupled to CPU 496 for conventional processor support. This circuitry includes cache, power supply, clock circuitry, input / output circuitry, and subsystems. One or more processes can be stored as software routines in memory 498, which, when executed or invoked by the processor, enable the processor to control the operation of processing platform 400 or individual processing chambers in the manner described herein. Software routines can also be stored and / or executed by a second CPU (not shown) located remotely from hardware controlled by CPU 496.

[0092] Some or all of the processes and methods of this disclosure can also be executed in hardware. Therefore, the process can be implemented in software and executed in hardware using a computer system (as, for example, a dedicated integrated circuit or other type of hardware implementation), or as a combination of software and hardware. When executed by a processor, the software routine converts a general-purpose computer into a dedicated computer (controller) that controls the operation of the chamber, thereby executing the process.

[0093] In some embodiments, the controller 495 has one or more configurations to perform individual processes or subprocesses to execute the method. The controller 495 may be connected to an intermediate component and configured to operate the intermediate component to perform the function of the method. For example, the controller 495 may be connected to and configured to control one or more of a pneumatic valve, actuator, motor, slit valve, vacuum control, or other components.

[0094] Power supply 530 is connected to electrodes 521 and 522 to create a voltage difference between electrodes 521 and 522. Power supply 530 is connected to electrodes 521 and 522 via transmission lines 531 and 532. Transmission lines 531 and 532 are electrically isolated by any suitable insulator to prevent short circuits or arcing.

[0095] In some embodiments, the power supply 530 provides a first voltage (also referred to as a potential) to electrode 521 and a second voltage different from the first voltage to electrode 522. In some embodiments, the power supply 530 is configured to provide high-voltage direct current (DC) and low-voltage alternating current (AC) components to electrodes 521 and 522.

[0096] In one or more embodiments of the present invention, the power supply 530 includes or is connected to a capacitance sensor 535. In some embodiments, the capacitance sensor 535 is a separate sensor within the body 502 of the substrate support 500, as shown in FIG2. In some embodiments, the capacitance sensor is part of the electronics of the power supply 530.

[0097] In some embodiments, the controller 590 is connected to at least one heating element 540 and configured to control the power of the at least one heating element 540. In some embodiments, the controller 590 is connected to a temperature sensor (e.g., a pyrometer, thermocouple, etc.) to measure the temperature of the substrate or substrate support 500 and to change the power of the heating element 540 to maintain a predetermined temperature.

[0098] In some embodiments, controller 590 is connected to a displacement sensor and configured to determine at least the deviation of the vertical processing gap. Controller 590 is also configured to determine the coplanarity of support surface 231 and provide shim-filling values ​​for mechanical calibration. Controller 590 is also configured to measure one or more of the following: processing gap between substrate and nozzle, lifting pin actuation plane, top surface flatness, heater support 234 deflection, and deflection of heater support 234 due to vacuum and parallelism between heater and nozzle.

[0099] A method for calibrating a processing chamber 100 under vacuum according to one or more embodiments of the present invention is described. The method includes the steps of: aligning the top surfaces of one or more support surfaces 231 located within an internal volume 109 with a chamber cover 300 to establish a processing gap, the one or more support surfaces 231 being connected to a support post 190 extending through an opening 120 in a chamber floor plate 106 and attached to an opening in a support plate 320 on the bottom surface 118 of the chamber floor plate 106; and creating a vacuum environment within the internal volume 109, causing the chamber floor plate 106 to deflect towards the internal volume 109 while maintaining the processing gap. The processing gap is between 1 mm and 2 mm.

[0100] Referring back to Figures 1, 2, 3A, and 3B, one or more embodiments of the present invention relate to a processing chamber 100. The processing chamber includes a support plate 320 for mitigating the deflection effect of the chamber floor 106 due to low atmospheric conditions within the internal volume 109. A support column 190 extends through the chamber floor 106 and the support plate 320, while a bellows assembly 340 separates the external atmospheric environment of the internal volume 109 from the vacuum or low atmospheric conditions within the internal volume 109.

[0101] Throughout this specification, references to "one embodiment," "some embodiments," "one or more embodiments," or "an embodiment" mean that a particular feature, structure, material, or characteristic described in connection with an embodiment will be included in at least one embodiment of the invention disclosed herein. Therefore, the appearance of phrases such as "in one or more embodiments," "in some embodiments," "in one embodiment," or "in one embodiment" throughout this specification does not necessarily refer to the same embodiment of the invention disclosed. Furthermore, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments.

[0102] Although the disclosure herein has been described with reference to specific embodiments, those skilled in the art will understand that the described embodiments are merely illustrative of the principles and applications of the invention. It will be apparent to those skilled in the art that various modifications and variations can be made to the methods and apparatus of this disclosure without departing from the spirit and scope of the invention. Therefore, this disclosure may include modifications and variations within the scope of the appended claims and their equivalents.

[0103] 100: Processing Chamber 200: Support components 104: Sidewall 106: Chamber floor plate 102: Outer shell 300: Chamber cover 109: Processing volume 109: Internal volume 110: Processing Station 330: Insert 112: Gas Injector 200: Substrate support 211: Rotation axis 114: Front surface 112: Gas distribution plate 231: Supporting surface 230: Heater 232: Bottom surface 110a: Processing Station 110b: Processing Station 210: Central base 220: Support arm 221: Inner End 222: Heater mounting base 236: Channel 240: Shielding plate 241: Top surface 245: Top Plate 242: Opening 246: Top surface 249: Bottom surface 248: Main Plane 247: Main Plane D: Distance 390:Substrate 205: Heater assembly 250: Shielded axis 255: Outer surface 257: Inner surface 234: Heater support 252: Top 258: Bottom 267: Flange 260: Top surface 262: Bottom surface 259: Kong 253: Central Axis 261: Leveling fasteners 224: External 223: Top surface 235: Top 237: Bottom 310: Support mounting base 239: Internal passage 244: Electrical connection 219: Thermal elements 217: Electrode 270: Top surface 272: Bottom surface 271: Opening 274: Internal Part 275: External Part 256: Fasteners 280: Outer surface 279: Inner surface 281: Outer edge 276: Peripheral Area 392: First fluid seal 278: Groove 350: Annular gasket 283: Air Chamber 312: Top 314: Bottom 225: Opening 251: Opening 238: Part 2 315: Stepped surface 316: Top surface 318: Bottom surface 317: Bottom surface 264: Inner flange 311: Fluid seal 313: Channel 221: External 314: Bottom part 229: Second fluid seal 268: Bottom surface 400: Processing Platform 420: Buffer Station 430: Robot 411, 412, 413, 414: Side view 410: Transfer Station 431: First Arm 432: Second Arm 418: Slit Valve 450: Factory Interface 495: Controller 496: Central Processing Unit (CPU) 497: Memory 498: Support Circuit 530: Power Supply 521, 522: Electrodes 531, 532: Transmission lines 535: Capacitive Sensor 502: Main body 590: Controller 540: Heating element 500: Substrate support 190: Support column 120: Opening 118: Bottom surface 320: Support plate 340: Bellows assembly

[0104] Domestic storage information (please note in order of storage institution, date, and number) none Overseas storage information (please note in the order of storage country, institution, date, and number) none

Claims

1. A thermal shield integrated into a heater assembly, comprising: A heater support extending through an open interior region of a shielding shaft and an opening in a shielding plate, a bottom surface of the heater support being spaced apart from a top surface of the shielding plate, the top surface of the shielding plate having a groove having an inner surface and an outer surface extending around a peripheral portion of the shielding plate, the outer surface being spaced apart from an outer peripheral edge of the shielding plate; a first fluid seal disposed within the groove of the shielding plate to maintain low-pressure conditions within a processing station; and a second fluid seal disposed between a bottom surface of the shielding shaft and a top surface of a support arm.

2. The thermal shield as claimed in claim 1, wherein the shielding shaft includes a top flange extending outward from an outside, and the shielding shaft is connected to the shielding plate by fasteners extending through the top flange.

3. The thermal shield as described in claim 1 further includes a support mounting base connected to one bottom end of the heater support.

4. The thermal shield as claimed in claim 3, wherein the support mounting base is connected to the bottom end of the shield shaft.

5. The thermal shield as claimed in claim 4, wherein the bottom end of the shield shaft has an opening to allow a lower portion of the support mounting base to extend through.

6. The thermal shield as claimed in claim 5 further includes a heater mounting base having a top surface, the bottom surface of the shield shaft being positioned adjacent to the top surface of the heater mounting base.

7. The thermal shield as claimed in claim 6, wherein the top surface of the heater mounting base includes an opening connected to a hollow interior region of the heater mounting base.

8. The thermal shield as claimed in claim 7, wherein the lower portion of the support mounting base extends at least partially into the opening in the top surface of the heater mounting base to allow electrical connections to pass through the hollow interior region of the heater mounting base, through the support mounting base, and into an open internal passage of the heater support.

9. The thermal shield as claimed in claim 6, wherein a fluid seal is disposed in a circular groove on the top surface of the heater mounting base, the fluid seal allowing the shield shaft to move perpendicularly relative to the top surface of the heater mounting base.

10. The thermal shield as claimed in claim 9, wherein the bottom surface of the shield shaft includes a bottom flange extending outward from an outside.

11. The heat shield as claimed in claim 10 further includes a plurality of leveling fasteners extending through the bottom flange of the shield shaft into the heater mounting base, the plurality of leveling fasteners being configured to adjust the shield shaft perpendicularly relative to the top surface of the heater mounting.

12. The thermal shield as claimed in claim 1 further includes a top plate having a top surface and a bottom surface defining a thickness of the top plate, the top plate having an opening through the thickness to allow the heater support to pass through the opening, the bottom surface of the top plate contacting a fluid seal in a groove of the top surface of the shield.

13. The heat shield as claimed in claim 12 further includes an annular gasket having a top surface and a bottom surface defining a thickness of the annular gasket, the annular gasket being positioned around the heater and between the top surface of the shield and the bottom surface of the shield.

14. The thermal shield as claimed in claim 13, wherein the fluid seal is configured to seal the atmosphere and maintain vacuum integrity until the vertical gap between the top surface of the shield and the bottom surface of the top plate varies by 1 mm.

15. The thermal shield as claimed in claim 14, wherein the fluid seal is configured to be non-uniformly compressed.

16. The thermal shield as claimed in claim 14, wherein the fluid seal is configured to accommodate a vertical gap variation of up to 0.5 mm between the top surface of the shield and the bottom surface of the top plate.

17. The thermal shield as claimed in claim 14, wherein the fluid seal is configured to have a maximum compression of 12% to 13%.

18. A substrate support member, comprising: A central base having a plurality of arms extending therefrom, each arm having an inner end and an outer end in contact with the central base; A heater assembly connected to the outer end of each arm, the heater assembly comprising: a heater; a heater support extending through an open inner region of a shielding shaft and an opening in a shielding plate, a bottom surface of the heater support spaced apart from a top surface of the shielding plate, the top surface of the shielding plate having a groove having an inner surface and an outer surface extending around a peripheral portion of the shielding plate, the outer surface being spaced apart from an outer peripheral edge of the shielding plate; a bottom surface of the heater spaced apart from a top surface of the shielding plate, the top surface of the shielding plate having a groove having an inner surface and an outer surface extending around a peripheral portion of the shielding plate, the outer surface being spaced apart from the outer peripheral edge of the shielding plate; and a top plate having an opening through a thickness therethrough to allow the heater to pass through the opening.

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