Substrate holding apparatus and substrate processing apparatus

Abstract

The substrate holding device 150 includes a substrate holding section 200, a rotation drive section 300, and a power supply section 400. The rotation drive section 300 rotates the substrate holding section 200. The power supply section 400 supplies power to the substrate holding section 200. The substrate holding section 200 has a rotating base 210, a clamping member 220, and an opening / closing drive section 230. The opening / closing drive section 230 moves the clamping member 220. The power supply section 400 has a power receiving section 420 and a power transmitting section 410. The power receiving section 420 is disposed in the substrate holding section 200 and supplies power to the opening / closing drive section 230. The power transmitting section 410 supplies power to the power receiving section 420 non-contactly. The rotating base 210 has an internal space S for accommodating the power receiving section 420.

Description

Technical Field

[0001] This invention relates to a substrate holding device and a substrate processing device. Prior Technology

[0002] Previously, a substrate processing apparatus was known, comprising a substrate holding section for holding and rotating the substrate, and a rotation drive section for rotating the substrate holding section (see, for example, JP2022-86362 A). The substrate processing apparatus described in JP2022-86362 A includes: a rotary table configured to rotate about a vertical axis; a rotation drive mechanism for rotating the rotary table in a horizontal plane; and a holding mechanism for holding the substrate in a horizontal position, spaced apart from the upper surface of the rotary table. The holding mechanism includes: a plurality of support pins abutting against the periphery of the substrate; a first magnetic section for rotating the support pins; and a second magnetic section for imparting a magnetic field to the first magnetic section.

[0003] However, in a substrate processing apparatus such as JP2022-86362 A, since the substrate holding part holds the substrate while rotating, it is difficult to supply power to the substrate holding part from the outside. Furthermore, while a slip ring could be considered as a method for supplying power to the substrate holding part, dust is generated as the slip ring wears.

[0004] The present invention was made in view of the above-mentioned problems, and its object is to provide a substrate holding device and a substrate processing device that can supply power to the substrate holding part. Summary of the Invention

[0005] According to a first aspect of the present invention, a substrate holding device includes a substrate holding section, a rotation driving section, and a power supply section. The substrate holding section holds the substrate and rotates the substrate. The rotation driving section rotates the substrate holding section. The power supply section supplies power to the substrate holding section. The substrate holding section has a rotating base, a contact holding section, and an opening / closing driving section. The rotating base faces the substrate. The contact holding section is disposed on the rotating base and holds the substrate by contacting it. The opening / closing driving section moves the contact holding section between a closed position where it contacts the substrate and holds the substrate, and an open position where it is separated from the substrate and does not hold the substrate. The power supply section has a power receiving section and a power transmitting section. The power receiving section is disposed on the substrate holding section and supplies power to the opening / closing driving section. The power transmitting section is separately disposed from the substrate holding section and supplies power to the power receiving section non-contactly. The rotating base has an internal space for accommodating the power receiving section.

[0006] In one embodiment, the opening / closing drive unit detects the force applied from the substrate to the abutting and holding portion. The opening / closing drive unit adjusts the force by which the abutting and holding portion holds the substrate.

[0007] In one embodiment, the substrate holding portion includes a temperature sensor that detects the temperature of the substrate. Based on the detection result of the temperature sensor, the opening / closing drive portion adjusts the force by which the abutting holding portion holds the substrate.

[0008] In one embodiment, the substrate holding portion includes a power storage portion electrically connected to the switching drive portion. When the power storage portion does not supply power to the switching drive portion from the power receiving portion, it supplies power to the switching drive portion.

[0009] In one embodiment, the aforementioned contact holding part remains in the aforementioned closed position when no power is supplied from the aforementioned power receiving part to the aforementioned opening and closing drive part.

[0010] In one embodiment, the aforementioned abutting and retaining portion has a plurality of movable retaining portions that can move between the aforementioned closed position and the aforementioned open position. The aforementioned opening and closing drive portion is provided for each of the aforementioned movable retaining portions.

[0011] In one embodiment, the rotating base has a bottom wall facing the rotating drive unit. The power receiving unit is disposed above the bottom wall and has a receiving coil wound around the rotation axis of the substrate holding unit. The rotating drive unit has an upper wall facing the substrate holding unit. The power transmitting unit is disposed below the upper wall and has a transmitting coil wound around the rotation axis of the substrate holding unit.

[0012] According to a second embodiment of the present invention, the substrate processing apparatus includes the aforementioned substrate holding device and a nozzle. The nozzle sprays processing liquid onto the substrate held in the substrate holding portion.

[0013] In one embodiment, after the cleaning liquid, which is the processing liquid, is sprayed out from the nozzle, the substrate holding part is rotated by the rotary drive unit to perform a rotary drying process in which the cleaning liquid is thrown off the substrate and the substrate is dried.

[0014] According to the present invention, a substrate holding device and a substrate processing device are provided that can supply power to the substrate holding portion. Simple Explanation of the Diagram

[0015] Figure 1 is a schematic side cross-sectional view showing the interior of a substrate processing apparatus with a substrate holding device according to this embodiment. Figure 2 is a side sectional view showing the structure around the substrate holding part of the substrate holding device in this embodiment. Figure 3 is a top view schematically showing the substrate holding part of this embodiment. Figure 4 is an enlarged top view of the periphery of the clamping member of the substrate holding part. Figure 5 is a top view that schematically shows the power transmitting and receiving units. Figure 6 is a block diagram of the substrate processing device. Figure 7 is a top view showing the wear condition of one of the four clamp components. Figure 8 is an enlarged top view showing the worn chuck component. Figure 9 is a side sectional view showing the structure around the substrate holding part of the substrate holding device in the third variation of the substrate holding device. Figure 10 is a side sectional view showing the structure around the substrate holding part of the substrate holding device in the fourth variation of the substrate holding device. Figure 11 is an enlarged top view showing the periphery of the clamping member of the substrate holding device in the fifth variation. Implementation

[0016] Hereinafter, embodiments of the substrate holding apparatus and substrate processing apparatus of the present invention will be described with reference to the accompanying drawings. Furthermore, the same or equivalent reference numerals will be used to label the same or equivalent parts in the drawings without repetition of the description. Additionally, in this specification, the Z-axis is sometimes referred to for ease of understanding of the invention. Typically, the Z-axis is parallel to the vertical direction.

[0017] First, referring to FIG1, the substrate processing apparatus 100 of this embodiment having a substrate holding device 150 will be described. FIG1 is a schematic side cross-sectional view showing the interior of the substrate processing apparatus 100 of this embodiment having a substrate holding device 150.

[0018] As shown in Figure 1, the substrate processing apparatus 100 processes the substrate W. The substrate processing apparatus 100 processes the substrate W by means of etching, surface treatment, imparting properties, forming a processing film, removing at least a portion of the film, and washing at least one of the following:

[0019] The substrate W is used as a semiconductor substrate. The substrate W contains a semiconductor wafer. For example, the substrate W is generally circular. Here, the substrate processing apparatus 100 processes the substrate W one by one.

[0020] The substrate processing apparatus 100 includes a chamber 110, a substrate holding section 200, a rotation drive section 300, and a processing liquid supply section 130. The chamber 110 houses at least a portion of the substrate holding section 200 and the processing liquid supply section 130.

[0021] The chamber 110 is roughly box-shaped with an internal space. The chamber 110 houses the substrate W. Here, the substrate processing apparatus 100 is a single-piece type that processes substrates W one by one, and houses substrates W one by one in the chamber 110.

[0022] The substrate holding section 200 holds the substrate W. The substrate holding section 200 holds the substrate W horizontally with its upper surface (surface) Wa facing upwards and its lower surface (back surface) Wb facing vertically downwards. Furthermore, the substrate holding section 200 can rotate the substrate W while holding it. The upper surface Wa of the substrate W can also be planarized. Furthermore, a device surface or a columnar laminate with grooves can be provided on the upper surface Wa of the substrate W. Detailed construction of the substrate holding section 200 will be described later.

[0023] The rotation drive unit 300 rotates the substrate holding unit 200. The rotation drive unit 300 includes a shaft 310, an electric motor 320, and a housing 330.

[0024] Shaft 310 is, for example, a hollow shaft. Shaft 310 extends vertically along the axis of rotation AX1. The substrate holding portion 200 is coupled to the upper end of shaft 310.

[0025] An electric motor 320 imparts rotational force to the shaft 310. The electric motor 320 causes the substrate W and the substrate holding portion 200 to rotate about the rotation axis AX1 by rotating the shaft 310 in the rotational direction. A housing 330 surrounds the shaft 310 and the electric motor 320. Specifically, the housing 330 has an upper wall 331 facing the substrate holding portion 200 and a side wall 332 extending downward from the periphery of the upper wall 331. An opening for the shaft 310 to pass through is formed in the center of the upper wall 331. The side wall 332 has a generally cylindrical shape surrounding the sides of the shaft 310 and the electric motor 320.

[0026] Furthermore, in this embodiment, the maximum speed at which the rotary drive unit 300 rotates the substrate holding unit 200 is, for example, 1500 rpm or more. The maximum speed at which the rotary drive unit 300 rotates the substrate holding unit 200 is preferably 2000 rpm or more, and more preferably 2500 rpm or more.

[0027] The processing liquid supply unit 130 supplies processing liquid to the substrate W. Specifically, the processing liquid supply unit 130 supplies processing liquid to the upper surface Wa of the substrate W held in the substrate holding unit 200.

[0028] The processing solution can be an etching solution used to etch the substrate W. Examples of etching solutions include fluorine nitrate (a mixture of hydrofluoric acid (HF) and nitric acid (HNO3)), hydrofluoric acid, buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), and phosphoric acid (H3PO4). There are no particular limitations on the type of etching solution; it can be acidic or alkaline.

[0029] Furthermore, the treatment solution can be a cleaning solution. Examples of cleaning solutions include deionized water (DIW), carbonated water, electrolyzed water, ozone water, ammonia water, diluted hydrochloric acid water, and reduced water (hydrogen water).

[0030] Alternatively, the treatment solution may be an organic solvent. Typically, organic solvents are more volatile than cleaning solutions. Examples of organic solvents include isopropyl alcohol (IPA), methanol, ethanol, acetone, hydrofluoroether (HFE), propylene glycol monoethyl ether (PGEE), and propylene glycol monomethyl ether acetate (PGMEA).

[0031] The processing fluid supply unit 130 includes a piping 132 and a nozzle 136. Processing fluid from a supply source flows through the piping 132. The nozzle 136 is connected to the downstream end of the piping 132. The processing fluid supply unit 130 may also include, for example, a valve for opening and closing the flow path within the piping 132, and / or a pump (not shown) for delivering processing fluid from the supply source. Through the flow of processing fluid in the nozzle 136, the nozzle 136 sprays the processing fluid onto the upper surface Wa of the substrate W. Alternatively, the processing fluid supply unit 130 may also have a plurality of nozzles 136 that spray a plurality of different processing fluids.

[0032] Furthermore, the nozzle 136 is configured to be movable relative to the substrate W. Specifically, the substrate processing apparatus 100 includes a moving mechanism (not shown) that moves the nozzle 136 relative to the substrate W in the horizontal and / or vertical directions. For example, the moving mechanism includes a ball screw mechanism and an electric motor that applies driving force to the ball screw mechanism.

[0033] The substrate processing apparatus 100 further includes a cup 180. The cup 180 collects the processing liquid that spills from the substrate W. The cup 180 moves up and down. For example, during the period when the processing liquid supply unit 130 supplies processing liquid to the substrate W, the cup 180 rises vertically upward to the side of the substrate W. In this case, the cup 180 collects the processing liquid that spills from the substrate W due to the rotation of the substrate W. Furthermore, when the period during which the processing liquid supply unit 130 supplies processing liquid to the substrate W ends, the cup 180 descends vertically downward from the side of the substrate W.

[0034] The substrate processing apparatus 100 includes a power supply unit 400. The power supply unit 400 supplies power to the substrate holding unit 200. Specifically, the power supply unit 400 includes a power transmitting unit 410 and a power receiving unit 420. The power transmitting unit 410 is disposed below the substrate holding unit 200. In this embodiment, the power transmitting unit 410 is disposed on the rotation drive unit 300. On the other hand, the power receiving unit 420 is disposed on the substrate holding unit 200. The power transmitting unit 410 and the power receiving unit 420 are disposed separately from each other. The power transmitting unit 410 supplies power to the power receiving unit 420 without contact. Furthermore, in this embodiment, the power transmitting unit 410 can transmit and receive signals with the power receiving unit 420. The detailed structure of the power supply unit 400 will be described later.

[0035] The substrate processing apparatus 100 includes a control device 101. The control device 101 controls various operations of the substrate processing apparatus 100. The control device 101 includes a control unit 102 and a memory unit 104. The control unit 102 has a processor. The control unit 102 may, for example, have a central processing unit (CPU). Alternatively, the control unit 102 may also have a general-purpose computer.

[0036] The memory unit 104 includes a main memory device and an auxiliary memory device. The main memory device is, for example, a semiconductor memory. The auxiliary memory device is, for example, a semiconductor memory and / or a hard disk drive. The memory unit 104 may also include removable media. The control unit 102 executes the computer program stored in the memory unit 104 and performs board processing operations.

[0037] Memory unit 104 stores data. This data includes process recipe data. The process recipe data contains information representing multiple process recipes. Each of the multiple process recipes specifies the processing content and sequence for substrate W.

[0038] In this embodiment, the substrate holding device 150 is composed of a substrate holding part 200, a rotation drive part 300, a power supply part 400, and a control device 101.

[0039] Next, referring to Figures 2 to 4, the substrate holding portion 200 will be further described. Figure 2 is a side cross-sectional view schematically showing the structure around the substrate holding portion 200 of the substrate holding device 150 of this embodiment.

[0040] As shown in Figure 2, the substrate holding portion 200 includes a rotating base 210, a clamping member 220, and an opening / closing drive portion 230. The clamping member 220 is an example of the "abutment holding portion" of this invention. The rotating base 210 has, for example, a hollow, generally disc-shaped, hollow, generally cylindrical, or hollow, annular shape. The rotating base 210 faces the substrate W. The rotating base 210 has a diameter slightly larger than that of the substrate W. Specifically, the rotating base 210 has an upper wall 211, an inner side wall 212, an outer side wall 213, and a bottom wall 214.

[0041] The upper wall 211 has a generally circular plate facing the lower surface Wb of the substrate W. A circular opening is formed in the center of the upper wall 211. The inner wall 212 has a generally cylindrical shape and extends downward from the inner periphery of the upper wall 211. The outer wall 213 has a generally cylindrical shape and extends downward from the outer periphery of the upper wall 211. In this embodiment, for example, the upper wall 211, the inner wall 212, and the outer wall 213 are composed of a single component. The bottom wall 214 has a generally circular plate covering the area below the upper wall 211. A circular opening is formed in the center of the bottom wall 214. The bottom wall 214 connects the inner wall 212 and the outer wall 213. The upper wall 211, the inner wall 212, the outer wall 213, and the bottom wall 214 form an internal space S. In this embodiment, the internal space S is a closed space. For example, a sealing member (not shown) is disposed between the bottom wall 214 and the inner side wall 212, and a sealing member (not shown) is disposed between the bottom wall 214 and the outer side wall 213.

[0042] Figure 3 is a schematic top view showing the substrate holding portion 200 of this embodiment. Figure 4 is an enlarged top view showing the periphery of the clamping member 220 of the substrate holding portion 200. As shown in Figures 2 and 3, the clamping member 220 is disposed on the rotating base 210. Typically, a plurality of (four in this case) clamping members 220 are disposed on the rotating base 210. The clamping members 220 are disposed around the substrate W and hold the substrate W horizontally by abutting against the outer periphery of the substrate W.

[0043] Specifically, as shown in FIG4, the chuck member 220 has a plurality of movable chucks 220a that can rotate around a rotation axis AX2 extending in the vertical direction. Furthermore, the movable chucks 220a are an example of the "movable holding part" of the present invention. The movable chucks 220a move (rotate) between a closed position (where they abut against the outer peripheral surface of the substrate W and hold the substrate W in place, as shown by the solid and dashed lines in FIG4) and an open position (where they separate from the outer peripheral surface of the substrate W and do not hold the substrate W in place, as shown by the two-point chain line in FIG4). In this embodiment, all of the plurality of chuck members 220 (here, four) are movable chucks 220a.

[0044] As shown in Figure 2, a plurality of opening and closing drive units 230 are provided (four in this case). In this embodiment, the opening and closing drive unit 230 is provided for each movable chuck 220a.

[0045] The opening / closing drive unit 230 includes a drive motor 231 and a shaft 232. The drive motor 231 is, for example, a servo motor. The drive motor 231 rotates the shaft 232. The shaft 232 is fixed to the chuck member 220. By rotating the shaft 232 by a predetermined angle through the drive motor 231, the chuck member 220 rotates by a predetermined angle around the rotation axis AX2.

[0046] Furthermore, at least a portion of the opening / closing drive unit 230 is housed within the internal space S of the rotating base 210. In this embodiment, a portion of the opening / closing drive unit 230 is housed within the internal space S of the rotating base 210. Specifically, the entire drive motor 231 is housed within the internal space S of the rotating base 210. The lower part of the shaft 232 is housed within the internal space S, while the upper part of the shaft 232 protrudes outside the internal space S.

[0047] The substrate holding portion 200 further includes a control device 240. In this embodiment, the control device 240 is housed within the internal space S of the rotating base 210. In this embodiment, the power receiving portion 420 is configured to be smaller than the diameter of the rotating base 210 when viewed from above. Therefore, space for the control device 240 can be easily secured within the internal space S of the rotating base 210. According to the configuration of this embodiment, even in a configuration without wiring connecting the outside and inside of the rotating base 210, the opening / closing drive portion 230 can be easily controlled and driven by the control device 240. The control device 240 controls each part of the substrate holding portion 200. In this embodiment, the control device 240 controls the opening / closing drive portion 230. The control device 240 is, for example, constructed using a microcomputer. Details regarding the control device 240 will be described later.

[0048] Next, referring to Figures 2 and 5, the power supply unit 400 will be further described. Figure 5 is a schematic top view showing the power transmitting unit 410 and the power receiving unit 420. Since the power transmitting unit 410 and the power receiving unit 420 have the same structure, they are depicted in one figure.

[0049] As shown in Figures 2 and 5, the power transmission unit 410 is disposed in the rotary drive unit 300. The power transmission unit 410 has a power transmission coil wound around the rotation axis AX1 of the substrate holding unit 200. The center of the power transmission coil is substantially aligned with the rotation axis AX1.

[0050] Specifically, the power transmission unit 410 is disposed within the rotary drive unit 300. In this embodiment, the power transmission unit 410 is disposed below the upper wall 331 of the rotary drive unit 300. The power transmission unit 410 is disposed substantially horizontally and substantially parallel to the upper wall 331. Furthermore, at least the portion of the upper wall 331 above the power transmission unit 410 is formed, for example, of resin.

[0051] The power receiving unit 420 is electrically connected to the switching drive unit 230 and supplies power to the switching drive unit 230. The power receiving unit 420 has a receiving coil wound around the rotation axis AX1 of the substrate holding unit 200. The center of the receiving coil is substantially aligned with the rotation axis AX1.

[0052] Specifically, the power receiving unit 420 is disposed within the internal space S of the rotating base 210. In this embodiment, the power receiving unit 420 is disposed above the bottom wall 214 of the substrate holding portion 200. The power receiving unit 420 is disposed substantially horizontally and substantially parallel to the bottom wall 214. Furthermore, at least the portion of the bottom wall 214 below the power receiving unit 420 is formed of resin, for example.

[0053] Next, referring to FIG6, the substrate processing apparatus 100 will be further described. FIG6 is a block diagram of the substrate processing apparatus 100.

[0054] As shown in Figure 6, the control unit 102 controls the rotary drive unit 300, the processing fluid supply unit 130, the cup 180, and the power supply unit 400. Specifically, the control unit 102 controls the rotary drive unit 300, the processing fluid supply unit 130, the cup 180, and the power supply unit 400 by sending control signals to them. Furthermore, in this embodiment, the control unit 102 controls the substrate holding unit 200. Specifically, the control unit 102 controls the substrate holding unit 200 by sending control signals to it via the power supply unit 400.

[0055] The control unit 102 controls the start of rotation, the change of rotation speed, and the stop of rotation of the substrate holding part 200 by controlling the rotation drive unit 300. For example, the control unit 102 can control the rotation drive unit 300 to change the rotation speed of the substrate holding part 200. Specifically, the control unit 102 can change the rotation speed of the substrate holding part 200 by changing the rotation speed of the electric motor 320 of the rotation drive unit 300. For example, the control unit 102 can make the substrate holding part 200 rotate at a rotation speed of tens of rpm or more but less than hundreds of rpm, or make the substrate holding part 200 rotate at a rotation speed of thousands of rpm or more but less than thousands of rpm.

[0056] The control unit 102 can control the processing liquid supply unit 130 to spray the processing liquid from the nozzle 136 toward the substrate W, or to stop the spraying of the processing liquid.

[0057] For example, after the control unit 102 performs the step of spraying the cleaning solution, which is a processing liquid, onto the substrate W from the nozzle 136, the substrate holding unit 200 is rotated by the rotation drive unit 300 to perform a rotary drying process in which the cleaning solution is spun off from the substrate W and the substrate W is dried. In this case, the control unit 102 may also spray etching solution or the like onto the substrate W from the nozzle 136 before spraying the cleaning solution onto the substrate W. Furthermore, when performing the rotary drying process, the control unit 102 rotates the substrate holding unit 200 at a rotational speed of, for example, 2000 rpm or more and 2500 rpm or less.

[0058] The control unit 102 controls the cup 180 to move relative to the substrate W. Specifically, during the period when the processing liquid supply unit 130 supplies processing liquid to the substrate W, the control unit 102 raises the cup 180 vertically upward to the side of the substrate W. Furthermore, when the period when the processing liquid supply unit 130 supplies processing liquid to the substrate W ends, the control unit 102 lowers the cup 180 vertically downward from the side of the substrate W.

[0059] The control unit 102 controls the power supply unit 400 to supply power to the substrate holding unit 200. Specifically, the control unit 102 controls the power supply unit 400 to supply power from the power transmitting unit 410 to the power receiving unit 420 without contact.

[0060] In this embodiment, the control unit 102 controls the power supply unit 400 to supply power from the power transmitting unit 410 to the power receiving unit 420 during both the periods when the substrate holding unit 200 and the power receiving unit 420 are stopped rotating and during the periods when the substrate holding unit 200 and the power receiving unit 420 are rotating. Specifically, the control unit 102 also supplies power from the power transmitting unit 410 to the power receiving unit 420 during the rotation drying process. Therefore, situations where power cannot be supplied to the opening / closing drive unit 230 or where it cannot be controlled by the control unit 242 can be suppressed.

[0061] The control unit 102 controls the substrate holding unit 200 by controlling the control device 240. The control device 240 includes a control unit 242 and a memory unit 244. The control unit 242 has a processor. The control unit 242 may have a central processing unit (CPU), for example. Alternatively, the control unit 242 may also have a general-purpose computer.

[0062] The memory unit 244 includes a main memory device and an auxiliary memory device. The main memory device is, for example, a semiconductor memory. The auxiliary memory device is, for example, a semiconductor memory and / or a hard disk drive. The memory unit 244 may also include removable media. The control unit 242 executes the computer program stored in the memory unit 244 and controls the opening / closing drive unit 230. Specifically, the control unit 242 controls the opening / closing drive unit 230 to move (rotate) the clamp member 220 between a closed position and an open position.

[0063] The control unit 102 controls the substrate holding unit 200 by controlling the control unit 242. Specifically, the control unit 102 controls the control unit 242 by sending a control signal from the power transmitting unit 410 to the power receiving unit 420, thereby controlling the substrate holding unit 200.

[0064] The control unit 242 controls the opening and closing drive unit 230 to move (rotate) the chuck member 220 between the open position and the closed position.

[0065] In this embodiment, as described above, the power supply unit 400 includes: a power receiving unit 420 disposed on the substrate holding unit 200; and a power transmitting unit 410 that supplies power to the power receiving unit 420 without contact. Therefore, power can be easily supplied to the substrate holding unit 200. Furthermore, since power is supplied to the power receiving unit 420 without contact, unlike the case where contact components such as slip rings are used, dust generation associated with wear of contact components can be suppressed.

[0066] Furthermore, the rotating base 210 has an internal space S for housing the power receiving unit 420. Therefore, unlike the case where the power receiving unit 420 is disposed outside the rotating base 210, it is not necessary to provide a through hole in the rotating base 210 for the wiring to supply power from the power receiving unit 420 to the switching drive unit 230. Therefore, it is possible to prevent external air from entering the rotating base 210. As a result, it is possible to prevent external air from the rotating base 210 from adversely affecting the components disposed within the rotating base 210, such as the switching drive unit 230 and / or the power receiving unit 420. As described in this embodiment, this is particularly effective in substrate processing apparatus 100 that uses processing liquids such as etching solutions.

[0067] Furthermore, as described above, the chuck member 220 has a plurality of movable chucks 220a that can move between a closed position and an open position, and the opening / closing drive unit 230 is provided for each movable chuck 220a. Therefore, the movable chucks 220a can be operated individually.

[0068] Furthermore, as described above, the power receiving unit 420 is disposed above the bottom wall 214 and has a receiving coil wound around the rotation axis AX1 of the substrate holding unit 200. The power transmitting unit 410 is disposed below the upper wall 331 and has a transmitting coil wound around the rotation axis AX1 of the substrate holding unit 200. Therefore, even during the rotation of the substrate holding unit 200 and the power receiving unit 420, the positional relationship between the power transmitting unit 410 and the power receiving unit 420 does not change, thus power can be easily supplied from the power transmitting unit 410 to the power receiving unit 420.

[0069] Furthermore, as described above, the substrate processing apparatus 100 rotates the substrate holding section 200 via the rotation drive section 300 to perform a rotary drying process, in which the cleaning fluid is spun off from the substrate W, thereby drying the substrate W. In this embodiment, since the power transmitting section 410 supplies power to the power receiving section 420 without contact, even when the substrate holding section 200 and the power receiving section 420 rotate at high speeds (e.g., 2000 rpm or more), power can be stably transmitted from the power transmitting section 410 to the power receiving section 420. Therefore, power can be supplied from the power transmitting section 410 to the power receiving section 420 even during the rotary drying process. Additionally, for example, when using a slip ring, the rotation speed of the substrate holding section 200 must be set to approximately 100 rpm or less to ensure stable power transmission.

[0070] (Example 1 of the variations) Next, the substrate holding device 150 of the first variation of the present invention will be described. In the first variation, unlike the embodiment described above, an example of adjusting the force of holding the substrate W will be described.

[0071] In the first variation, the opening / closing drive unit 230 detects the force applied from the substrate W to the chuck member 220. The detection result of the opening / closing drive unit 230 is sent to the control unit 242. Specifically, a predetermined relationship is established between the force applied from the substrate W to the chuck member 220 and the torque applied to the drive motor 231. Furthermore, a predetermined relationship is established between the torque applied to the drive motor 231 and the current flowing through the drive motor 231. The opening / closing drive unit 230 sends a signal corresponding to the current flowing through the drive motor 231 to the control unit 242. Thereby, the control unit 242 calculates the force applied from the substrate W to the chuck member 220.

[0072] Furthermore, the opening / closing drive unit 230 adjusts the force by which the clamp member 220 holds (fixes) the substrate W. Specifically, the control unit 242 controls the opening / closing drive unit 230, for example, to keep the force by which the clamp member 220 holds the substrate W constant. Also, the control unit 242 controls the opening / closing drive unit 230, for example, to change the force by which the clamp member 220 holds the substrate W according to the material of the substrate W.

[0073] In the first variation, as described above, the opening / closing drive unit 230 adjusts the force with which the clamp member 220 holds the substrate W. Therefore, for example, it is possible to suppress the force with which the clamp member 220 holds the substrate W from increasing or decreasing. Furthermore, for example, depending on the material of the substrate W, the force with which the clamp member 220 holds the substrate W can be changed, thereby suppressing the formation of notches or cracks on the outer periphery of the substrate W.

[0074] The other components and effects of the first variation are the same as those of the above-described implementation.

[0075] (Second variation example) Next, referring to FIGS. 7 and 8, the substrate holding device 150 of the second variation of the present invention will be described. In the second variation, an example of suppressing the center of the substrate W from the center of the substrate holding portion 200 will be described.

[0076] In the second variation, similar to the first variation, the opening / closing drive unit 230 detects the force applied from the substrate W to the chuck member 220.

[0077] In the second variation, the opening / closing drive unit 230 detects the amount of movement, i.e., the rotation angle, of the chuck member 220. Specifically, the opening / closing drive unit 230 detects the rotation angle of the chuck member 220 based on the rotation amount of the drive motor 231. The detection result of the opening / closing drive unit 230 is sent to the control unit 242.

[0078] When the substrate W is to be held by the clamping members 220, the control unit 242 controls the opening and closing drive unit 230 to move each clamping member 220 from the open position to the closed position. In this way, the center of the substrate W is located at the center of the substrate holding unit 200, and the force of each clamping member 220 holding the substrate W is equal.

[0079] Here, the wear condition of the chuck member 220 is explained. Figure 7 is a top view showing the wear state of one of the four chuck members 220, chuck member 221. Figure 8 is an enlarged top view showing the worn chuck member 221. Hereinafter, for ease of understanding, the worn chuck member 220 will be referred to as chuck member 221, and chuck member 222, chuck member 223, and chuck member 224 in a clockwise direction from chuck member 221. Furthermore, chuck members 222 to chuck member 224 are not worn.

[0080] As described above, when the substrate W is to be held by the clamp member 220, the control unit 242 controls the opening and closing drive unit 230 to move each clamp member 220 from the open position to the closed position.

[0081] At this time, as shown in Figures 7 and 8, even though the chuck members 222 to 224 are in contact with the substrate W, the worn chuck member 221 is not in contact with the substrate W. At this time, the force applied from the substrate W to the chuck members 221 and 223 is lower than a set value, therefore the chuck members 221 and 223 continue to move (rotate). Therefore, the substrate W is pressed by the chuck member 223, and the center of the substrate W moves towards the chuck member 221 compared to the center of the substrate holding portion 200. Furthermore, as the substrate W moves, the chuck members 222 and 224 also move (rotate) slightly.

[0082] Therefore, in the second variation, the control unit 242 calculates the positional offset of the center of the substrate W relative to the center of the substrate holding portion 200 based on the rotation angle of each clamping member 220 and the force applied from the substrate W to each clamping member 220. Furthermore, the control unit 242 calculates a rotation angle correction amount for each clamping member 220 based on the calculated positional offset. The control unit 242 controls each opening / closing drive unit 230 based on the rotation angle correction amount, causing each clamping member 220 to move (rotate) in a manner that aligns the center of the substrate W with the center of the substrate holding portion 200. Therefore, the offset of the center of the substrate W from the center of the substrate holding portion 200 can be suppressed. Furthermore, in the second variation, various calculation examples performed by the control unit 242 are described, but the present invention is not limited to these. For example, it is also possible for the control unit 242 to send a signal indicating a detection result to the control unit 102, and for the control unit 102 to send the calculated result calculated by the control unit 102 to the control unit 242.

[0083] The other components and effects of the second variation are the same as those of the first variation.

[0084] (Example 3) Next, referring to FIG9, the substrate holding device 150 of the third variation of the present invention will be described. FIG9 is a side cross-sectional view schematically showing the structure around the substrate holding portion 200 of the substrate holding device 150 of the third variation. In the third variation, an example in which the substrate holding portion 200 has a temperature sensor 500 will be described.

[0085] In the third variation, similar to the first and second variations, the opening and closing drive unit 230 detects the force applied from the substrate W to the chuck member 220.

[0086] As shown in Figure 9, in the third variation, the substrate holding portion 200 includes a temperature sensor 500. The temperature sensor 500 detects the temperature of the substrate W. Specifically, the temperature sensor 500 is housed within the internal space S of the substrate holding portion 200. A window 215 is formed in the portion of the upper wall 211 of the rotating base 210 facing the temperature sensor 500. For example, the window 215 allows at least infrared light to pass through. The temperature sensor 500 detects the temperature of the substrate W by facing the substrate W through the window 215. The temperature sensor 500 detects the temperature of the substrate W, for example, by detecting infrared light. The detection result of the temperature sensor 500 is sent to the control unit 242.

[0087] Based on the detection results of the temperature sensor 500, the control unit 242 adjusts the force holding the substrate W by the clamp member 220. For example, when the temperature of the substrate W is higher than a predetermined value, the substrate W will warp to a predetermined degree. Therefore, for example, the control unit 242 controls the opening and closing drive unit 230 based on the detection results of the temperature sensor 500 to reduce the force holding the substrate W by the clamp member 220 by a predetermined value. Alternatively, for example, the control unit 242 can control the opening and closing drive unit 230 based on the detection results of the temperature sensor 500 to adjust the force holding the substrate W by the clamp member 220 to a constant while adjusting the rotation angle of the clamp member 220.

[0088] In the third variation, as described above, the control unit 242 adjusts the force used to hold the substrate W by the clamp members 220 based on the detection results of the temperature sensor 500. Therefore, for example, it can suppress the increase of the load applied to the substrate W, or adjust the rotation angle of each clamp member 220 according to the warping of the substrate W.

[0089] The other components and effects of the third variation are the same as those of the first and second variations.

[0090] (Example 4) Next, referring to FIG10, the substrate holding device 150 of the fourth variation of the present invention will be described. FIG10 is a side cross-sectional view schematically showing the structure around the substrate holding portion 200 of the substrate holding device 150 of the fourth variation. In the fourth variation, an example in which the substrate holding portion 200 has a power storage portion 600 will be described.

[0091] As shown in Figure 10, the substrate holding portion 200 has an energy storage portion 600 for storing electricity. The energy storage portion 600 is a battery. The type of energy storage portion 600 is not particularly limited, for example, it is a lithium-ion battery. Alternatively, the energy storage portion 600 may also be a primary battery.

[0092] The energy storage unit 600 is housed within the internal space S of the substrate holding unit 200. The energy storage unit 600 is connected to each switching drive unit 230 via wiring 610. That is, the energy storage unit 600 is electrically connected to each switching drive unit 230.

[0093] Furthermore, in the fourth variation, the energy storage unit 600 is connected to the control unit 242 via wiring not shown. Also, the energy storage unit 600 is controlled by the control unit 242.

[0094] In the fourth variation, the energy storage unit 600 supplies power to the opening / closing drive unit 230 when power is not supplied from the power receiving unit 420 to the opening / closing drive unit 230. Specifically, the control 242 controls the energy storage unit 600 to supply power to the opening / closing drive unit 230 when power is not supplied from the power receiving unit 420 to the opening / closing drive unit 230 due to a power outage, for example. Therefore, for example, during the rotation of the substrate holding unit 200, the movement (rotation) of the clamp member 220 from the closed position to the open position can be prevented. That is, the clamp member 220 remains in the closed position when power is not supplied from the power receiving unit 420 to the opening / closing drive unit 230.

[0095] Furthermore, in the fourth variation, the energy storage unit 600 is connected to the power supply unit 400 via wiring not shown. The control unit 242 controls the power supply unit 400 to supply the remaining power from the power supply unit 400 to the energy storage unit 600. In this way, the residual power (level) of the energy storage unit 600 can be prevented from becoming zero.

[0096] The other components and effects of the fourth variation are the same as those of the above-described embodiments and the first to third variations.

[0097] (5th variation example) Next, referring to FIG11, the substrate holding device 150 of the fifth variation of the present invention will be described. FIG11 is an enlarged top view showing the periphery of the clamp member 220 of the substrate holding device 150 of the fifth variation. In the fifth variation, unlike the fourth variation, an example of maintaining the clamp member 220 in the closed position is described in a configuration where the substrate holding portion 200 does not have the energy storage portion 600.

[0098] As shown in Figure 11, in the fifth variation, the substrate holding portion 200 has an energizing member 700. The energizing member 700 energizes the shaft 232 of the opening / closing drive portion 230 or the clamping member 220 in the direction from the open position to the closed position. In the fifth variation, the energizing member 700 energizes the shaft 232 of the opening / closing drive portion 230 in the direction from the open position to the closed position. Furthermore, in Figure 11, the clockwise direction is the direction from the open position to the closed position of the clamping member 220. On the other hand, the counterclockwise direction is the direction from the closed position to the open position of the clamping member 220. Hereinafter, the direction from the open position to the closed position of the clamping member 220 will be referred to as the closing direction A1, and the direction from the closed position to the open position of the clamping member 220 will be referred to as the opening direction A2.

[0099] Specifically, a rod 233 is provided on the shaft 232 of the opening / closing drive unit 230. The rod 233 is a shaft or plate extending radially from the shaft 232. The energizing member 700 is not particularly limited, for example, it is a compression coil spring. The energizing member 700 energizes the rod 233 in the closing direction A1. Thereby, a force is always applied to the rod 233 in the closing direction. Therefore, the chuck member 220 remains in the closed position when no power is supplied from the power receiving unit 420 to the opening / closing drive unit 230. Specifically, for example, even when no power is supplied from the power receiving unit 420 to the opening / closing drive unit 230 due to a power outage, the force of the energizing member 700 keeps the chuck member 220 in the closed position. Therefore, for example, during the rotation of the substrate holding unit 200, the movement (rotation) of the chuck member 220 from the closed position to the open position can be prevented.

[0100] The other components and effects of the fifth variation are the same as those of the above-described embodiments and the first to third variations.

[0101] The embodiments and variations of the present invention have been described above with reference to the drawings. However, the present invention is not limited to the embodiments and variations described above, and can be implemented in various forms without departing from its spirit. Furthermore, various inventions can be formed by appropriately combining the plurality of constituent elements disclosed in the embodiments and variations. For example, some constituent elements can be deleted from all the constituent elements shown in the embodiments and variations. Also, constituent elements across different embodiments and variations can be appropriately combined. Furthermore, the drawings are shown in a schematic manner with each constituent element as the main body for easy understanding, and the thickness, length, number, spacing, etc. of each constituent element shown may differ from the actual situation due to considerations for making the drawings. Furthermore, the material, shape, size, etc. of each constituent element shown in the embodiments and variations are examples and are not particularly limited, and various changes can be made within the scope of not substantially departing from the effect of the present invention.

[0102] For example, in the above embodiment, all the clamping members 220 are described as movable clamps 220a, but the present invention is not limited thereto. For example, a plurality of abutting and retaining portions (clamping members 220) may also have movable retaining portions (movable clamps 220a) that can move between a closed position and an open position, and non-movable retaining portions (non-movable clamps). Specifically, for example, four clamping members 220 may have two movable clamps 220a and two non-movable clamps.

[0103] Furthermore, in the above embodiment, the example described is that the chuck member 220 moves between the open and closed positions by rotation, but the present invention is not limited thereto. For example, by providing a mechanism that converts rotational motion into linear motion, the chuck member can move linearly between the open and closed positions. Also, for example, the opening / closing drive unit may have a linear motor, and the chuck member may move between the open and closed positions by linear movement.

[0104] Furthermore, for example, in the third variation, an example is described where the substrate holding device 150 has a temperature sensor 500, but the present invention is not limited thereto. For example, the substrate holding device 150 may have various sensors. Specifically, the substrate holding device 150 may have a detection sensor that detects the internal or external environment (humidity or oxygen concentration, etc.) of the substrate holding device 150. In this case, the detection result of the detection sensor can be sent from the substrate holding unit 200 to the control unit 102. Alternatively, the opening and closing drive unit 230 may adjust the force of the clamp member 220 holding the substrate W based on the detection result of the detection sensor.

[0105] Furthermore, in the above embodiment, the substrate holding device 150 is described with a control unit 242, but the present invention is not limited thereto. For example, the substrate holding device 150 may not have a control unit 242. In this case, the control unit 102 can directly control the opening and closing drive unit 230, etc., by sending control signals to the opening and closing drive unit 230, etc., via the power supply unit 400.

[0106] Furthermore, in the above embodiment, the example described is that the power transmitting unit 410 has a power transmitting coil wound around the rotation axis AX1, and the power receiving unit 420 has a power receiving coil wound around the rotation axis AX1. However, the present invention is not limited to this. For example, the power transmitting unit 410 may have a plurality of power transmitting coils with a radius smaller than that of the substrate holding unit 150, and the plurality of power transmitting coils may be arranged at approximately equal angular intervals around the rotation axis AX1. Similarly, the power receiving unit 420 may have a plurality of power receiving coils with a radius smaller than that of the substrate holding unit 150, and the plurality of power receiving coils may be arranged at approximately equal angular intervals around the rotation axis AX1.

[0107] The present invention is preferably used in a substrate holding device and a substrate processing device.

[0108] This application asserts priority based on Japanese Patent Application No. 2024-014019, filed on February 1, 2024, the entire contents of which are incorporated herein by reference.

[0109] 100: Substrate processing apparatus 101: Control device 102: Control Department 104: Memory Department 110: Chamber 130: Processing Fluid Supply Department 132:Piping 136: Nozzle 150: Substrate holding device 180: Cup 200: Substrate holding section 210: Rotating base 211:Up the wall 212: Inner wall 213: Lateral wall 214:Bottom wall 215: Window 220: Clamping component 220a: Movable chuck 221: Clamping component 222: Clamping component 223: Clamping component 224: Clamping component 230: Opening and closing drive unit 231: Drive motor 232: Axis 233: Rod 240: Control device 242: Control Department 244: Memory Department 300: Rotary drive unit 310: Shaft 320: Electric motor 330: Housing 331:Upper wall 332: Sidewall 400: Power Supply Department 410: Power Transmission Department 420: Power Receiving Department 500: Temperature sensor 600: Battery Storage Department 610: Wiring 700: Enabling Component A1: Closed direction A2: Turn the steering wheel AX1: Axis of rotation AX2: Axis of rotation S: Interior space W: substrate Wa: upper surface Wb: Lower surface

Claims

1. A substrate holding device comprising: a substrate holding portion that holds a substrate and rotates the substrate; a rotation driving portion that rotates the substrate holding portion; and a power supply portion that supplies power to the substrate holding portion; the substrate holding portion comprising: a rotating base facing the substrate; an abutting holding portion disposed on the rotating base and holding the substrate by abutting against the substrate; and an opening / closing driving portion that moves the abutting holding portion between a closed position holding the substrate against the substrate and an open position separating from the substrate without holding the substrate; the power supply portion comprising: a power receiving portion disposed on the substrate holding portion and supplying power to the opening / closing driving portion; and a power transmitting portion disposed separately from the substrate holding portion and supplying power to the power receiving portion non-contactly; the rotating base having an internal space for receiving the power receiving portion and surrounding the power receiving portion.

2. The substrate holding device of claim 1, wherein the opening / closing drive unit: detects the force applied from the substrate to the abutting holding unit; and adjusts the force by which the abutting holding unit holds the substrate.

3. The substrate holding device of claim 2, wherein the substrate holding part includes: a temperature sensor that detects the temperature of the substrate; and the opening / closing drive part adjusts the force by which the abutting holding part holds the substrate based on the detection result of the temperature sensor.

4. The substrate holding device according to any one of claims 1 to 3, wherein the substrate holding part has: an energy storage part electrically connected to the opening and closing drive part; and the energy storage part supplies power to the opening and closing drive part when no power is supplied from the power receiving part to the opening and closing drive part.

5. The substrate holding device according to any one of claims 1 to 3, wherein the abutting holding portion is maintained in the closed position when no power is supplied from the power receiving portion to the opening / closing driving portion.

6. The substrate holding device according to any one of claims 1 to 3, wherein the abutting holding portion has a plurality of movable holding portions that can move between the closed position and the open position; and the opening and closing drive portion is provided for each of the movable holding portions.

7. A substrate holding device according to any one of claims 1 to 3, wherein the rotating base has a bottom wall facing the rotating drive unit; the power receiving unit is disposed above the bottom wall and has a receiving coil wound around the rotation axis of the substrate holding unit; the rotating drive unit has an upper wall facing the substrate holding unit; the power transmitting unit is disposed below the upper wall and has a transmitting coil wound around the rotation axis of the substrate holding unit.

8. A substrate processing apparatus comprising: a substrate holding device as claimed in claim 1; and a nozzle that sprays a processing liquid onto the substrate held in the substrate holding portion.

9. The substrate processing apparatus of claim 8, wherein after the cleaning liquid, which is the processing liquid, is ejected from the nozzle, the substrate holding part is rotated by the rotary drive unit to perform a rotary drying process in which the cleaning liquid is thrown off the substrate and the substrate is dried.

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