Wafer Inspection System and Inspection Method

Abstract

A chip testing system and method thereof includes a testing apparatus, a controller, a tester, a digital measuring instrument, and an electronic device. A chip under test is placed on the chip test socket of the testing apparatus. The electronic device issues commands to switch the on / off states of the Bluetooth module and / or the WIFI module of the chip under test. The digital measuring instrument is then controlled to measure the voltage value of the substrate. If the substrate voltage value is less than a set value, the electronic device determines that the chip under test is an abnormal chip; conversely, if the substrate voltage value is higher than or equal to the set value, the testing application determines that the chip under test is a normal chip.

Description

Technical Field

[0001] This invention relates to a wafer inspection system and method, particularly an inspection system and method for detecting defects in wafer hardware circuit design. Prior Technology

[0002] Today, Bluetooth and Wi-Fi technologies are widely used to meet the needs of wireless connectivity. Although each technology has its unique functions and advantages, integrated chips are very important in order to meet the needs of portable devices. Therefore, for designers, it is necessary to determine whether technologies such as Bluetooth and Wi-Fi should be integrated into a single chip.

[0003] The applicant in this case has developed this type of integrated chip. However, when customers use this type of integrated chip, Bluetooth disconnection or restart occurs frequently, or the throughput of Wi-Fi drops to zero instantly. Such problems require the entire batch of chips to be recalled for testing.

[0004] Therefore, this invention designs a testing system and method to detect whether the chip will experience Bluetooth disconnection / restart or Wi-Fi throughput dropping to zero instantaneously. By testing and screening using the testing system and method of this invention, if no problems are detected, the chip can be shipped. Thus, this invention should be the best solution. Summary of the Invention

[0005] The present invention discloses a chip inspection system comprising: an inspection apparatus having at least one test circuit board having at least one chip test socket, wherein the test circuit board further has at least one voltage test terminal, a first connection terminal, and a second connection terminal; a chip body to be tested being placed in the chip test socket, the chip body being electrically connected to the test circuit board, and the chip body having at least one Bluetooth module and one Wi-Fi module; a controller being electrically connected to the first connection terminal for transmitting commands to the chip body; a tester being electrically connected to the second connection terminal for testing the Bluetooth module and / or the Wi-Fi module; and a digital measuring instrument being electrically connected to the voltage test terminal for measuring a substrate voltage value (Bulk). A voltage sensor and an electronic device electrically connected to the controller, the tester, and the digital measuring instrument. The electronic device has a built-in test application program that issues multiple commands to turn on or off the Bluetooth module and / or the WIFI module of the chip under test, and measures the voltage value of the substrate through the digital measuring instrument. If the substrate voltage value is less than a set value, the test application program determines that the chip under test is an abnormal chip. Conversely, if the substrate voltage value is higher than or equal to the set value, the test application program determines that the chip under test is a normal chip.

[0006] More specifically, the testing device further includes a pressure tool for uniformly pressing down on the chip body under test, so that the chip body under test can make close contact with the chip test socket, so that the chip body under test can be electrically connected to the test circuit board.

[0007] More specifically, the test application can first start the Bluetooth function module through the controller, and after loading a Bluetooth firmware into the Bluetooth function module, it can then shut down the Bluetooth function module. After that, the test application sends a first measurement voltage command to the digital measuring device to obtain at least one substrate voltage value, and determines whether it is less than a set value based on the at least one substrate voltage value or the average of multiple substrate voltage values. If the substrate voltage value is less than the set value, the test application determines that the chip under test is an abnormal chip.

[0008] More specifically, if the substrate voltage value is higher than or equal to the set value, the test application determines that the chip under test is a normal chip. Then, the Bluetooth module can be turned on, and the tester can be used to test whether the WIFI module can operate normally. After the test, the WIFI module and the Bluetooth module are turned off, and the test application sends a second voltage measurement command to the digital measuring instrument to obtain at least one substrate voltage value. The test application then determines whether the substrate voltage value is lower than the set value based on the at least one substrate voltage value or the average of multiple substrate voltage values. If the substrate voltage value is lower than the set value, the test application determines that the chip under test is an abnormal chip.

[0009] More specifically, if the substrate voltage value determined by the second measurement voltage command is higher than or equal to the set value, the test application determines that the chip under test is a normal chip.

[0010] More specifically, the test application determines that the chip under test is a normal chip, and then tests whether the Bluetooth module can operate normally.

[0011] More specifically, the chip test socket is further covered with a shielding device, which is used to cover the chip under test body, so as to avoid interference with the chip under test bodies of other chip test sockets when the Bluetooth function module and / or the WIFI function module are turned on.

[0012] More specifically, the set value is 1.0V~1.3V.

[0013] A wafer inspection method, comprising the following steps: (1) A chip body to be tested is placed on a chip test socket of a testing device, wherein the chip body to be tested has at least a Bluetooth function module and a WIFI function module; (2) The Bluetooth module is activated via an electronic device, and after a Bluetooth firmware is loaded into the Bluetooth module, the Bluetooth module is then deactivated. (3) A first measurement voltage command is sent to a digital measuring instrument through a test application of the electronic device to obtain at least one substrate voltage value; (4) The test application determines whether the voltage value of at least one substrate or the average value of multiple substrates is less than the set value. If the voltage value of the substrate is less than the set value, the test application determines that the chip under test is an abnormal chip.

[0014] More specifically, if the substrate voltage value is higher than or equal to the set value, the test application determines that the chip under test is a normal chip, and then the next stage of testing can be performed, the steps of which are as follows: (1) First, enable the Bluetooth function module; (2) Test the WIFI module with a tester to see if it can work properly. After the test, turn off the WIFI module and the Bluetooth module. (3) Then, the test application sends a second voltage measurement command to the digital measuring device to obtain at least one substrate voltage value; (4) The test application determines whether the voltage value of at least one substrate or the average value of multiple substrates is less than the set value. If the voltage value of the substrate is less than the set value, the test application determines that the chip under test is an abnormal chip. Simple Explanation of the Diagram

[0015] [Figure 1] is a schematic diagram of the overall architecture of the wafer inspection system and inspection method of the present invention. [Figure 2A] is a schematic diagram of the placement of the wafer body under test in the wafer inspection system and inspection method of the present invention. [Figure 2B] is a schematic diagram of the electrical connection of the wafer body under test in the wafer testing system and testing method of the present invention. [Figure 3A] is a front view of the test circuit board of the wafer inspection system and inspection method of the present invention. [Figure 3B] is a schematic diagram of the back of the test circuit board of the wafer inspection system and inspection method of the present invention. [Figure 4] is a schematic diagram of the connection between the wafer inspection system and the controller of the present invention and inspection method. [Figure 5] is a schematic diagram of the wiring between the wafer inspection system and inspection method of the present invention and the tester. [Figure 6] is a schematic diagram of the wiring between the wafer inspection system and inspection method of the present invention and the digital measuring instrument. [Figure 7] is a schematic diagram of the electronic device architecture of the wafer inspection system and inspection method of the present invention. [Figure 8] is a schematic diagram of the first stage of testing for the wafer inspection system and inspection method of the present invention. [Figure 9A] is a schematic diagram of the Bluetooth switch switching circuit of the wafer inspection system and inspection method of the present invention. [Figure 9B] is a schematic diagram of the peripheral circuit of the wafer test socket of the wafer inspection system and inspection method of the present invention. [Figure 10] is a schematic diagram of the second-stage testing process of the wafer inspection system and inspection method of the present invention. [Figure 11] is a schematic diagram of the application of the shielding device in the wafer inspection system and inspection method of the present invention. Implementation

[0016] Other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the preferred embodiments with reference to the accompanying drawings.

[0017] The electrical connection described below in this invention refers to a connection behavior generated through wired or wireless connection methods, which enables electronic components to generate one-way and / or two-way transmission of digital signals and / or analog signals.

[0018] As used in this text, the articles “one,” “a,” and “any” refer to the grammar of one or more (i.e., at least one) items. For example, “an element” means one element or more.

[0019] The microprocessor described below in this invention is an MCU (Micro Controller Unit). An MCU includes at least a CPU, memory (e.g., ROM and RAM), and peripheral devices (e.g., ADC, DAC, GPIO, PWM). The actions, instructions, variables, and other data that can be programmed through procedures can be written into the memory, and then the CPU can execute these programmed actions sequentially.

[0020] The wafer inspection system and method of the present invention, as shown in Figure 1, includes an inspection tool 1, a controller 2, a tester 3, a digital measuring instrument 4, and an electronic device 5.

[0021] As shown in Figures 2A and 2B, the testing device 1 has at least one test circuit board 11, which has at least one chip test socket 111, and the test circuit board 11 further has at least one voltage test terminal, a first connection terminal and a second connection terminal.

[0022] The chip under test body 6 can be placed in the chip test socket 111. The chip under test body 6 is electrically connected to the test circuit board 11. The chip under test body 6 has at least a Bluetooth function module and a WIFI function module.

[0023] The testing device 1 further includes a pressure plate 12. The lower pressure member 121 at the front end of the pressure plate 12 is used to uniformly press down the chip body 6 under test. The pins of the chip body 6 under test can make close contact with the pins on the chip test socket 111 so that the chip body 6 under test can be reliably electrically connected to the test circuit board 11.

[0024] The test circuit board 11 also has a power connection terminal 110 for connecting to the input power supply.

[0025] As shown in Figures 3A and 3B, these are schematic diagrams of the front and back circuits of the test circuit board 11 (Figure 3B is a flip of Figure 3A to the right to show the back). The test circuit board 11 has an electronic pressure component on its front side. When pressed down, it powers the circuit board; when pulled up, it completely de-energizes the circuit board. The electronic pressure component is electrically connected to the power supply terminal 110 and controls the power supply or de-energization through the electronic pressure component.

[0026] As shown in Figures 3A and 4, a first wire 71 is connected to the first connection terminal 112 (corresponding to 112 shown in Figure 3A) on the test circuit board 11, and the other end of the first wire 71 is electrically connected to the controller 2.

[0027] Because the testing in this case requires the electronic device 5 to issue commands to turn the functional modules (Bluetooth functional module and / or WIFI functional module) on or off, and because the electronic device 5 is connected to the test circuit board 11 through the controller 2, the control commands can be transmitted to the chip under test 6 to inform the chip under test 6 to turn the functional modules (Bluetooth functional module and / or WIFI functional module) on or off, the following descriptions of the electronic device 5 turning the functional modules (Bluetooth functional module and / or WIFI functional module) on or off are all about the circuit connection created by the controller 2 so that the control commands can be transmitted to the chip under test 6.

[0028] In addition, the above control commands are not limited to commands to turn function modules on or off.

[0029] In this implementation, as shown in Figure 4, the controller 2 has a power connection terminal 20, a relay 21, and a USB port 22. The USB port 22 is electrically connected to the electronic device 5 through a USB cable (not shown in the figure). The electronic device 5 can send a Bluetooth turn-on command to the controller 2. The controller 2 can start the Bluetooth function module through the relay 21. After the Bluetooth function module loads a Bluetooth firmware, the chip under test 6 can send a Bluetooth turn-off command to the controller 2 so that the controller 2 can turn off the Bluetooth function module.

[0030] Furthermore, the connection steps for performing a Bluetooth test are as follows: (1) Electronic device 5 sends a command to controller 2, and controller 2 connects the Bluetooth test circuit path of the relay. (2) After that, the electronic device 5 sends a command to the chip body 6 under test via the relay 21 to turn on the Bluetooth. (3) The electronic device 5 then sends a command to the controller 2, which switches the relay 21 to connect the Bluetooth circuit. The electronic device 5 controls the chip body 6 under test through the connected circuit.

[0031] Furthermore, to explain how to close Bluetooth after the firmware download is complete, the steps are as follows: (1) After Bluetooth firmware download is complete, electronic device 5 will first receive a Bluetooth firmware download completion notification from the chip under test body 6; (2) After that, the electronic device 5 issues a command to turn off Bluetooth through the test circuit connected to the relay 21.

[0032] Furthermore, when the digital meter (digital measuring device 4) begins measuring the Bulk Voltage, the steps are as follows: (1) After Bluetooth firmware download is complete, electronic device 5 will first receive a Bluetooth firmware download completion notification from the chip under test body 6; (2) After that, the electronic device 5 issues a command to measure the Bulk Voltage through the test circuit connected to the relay 21.

[0033] As shown in Figures 3B and 5, a second wire 72 and a second wire 73 are respectively connected to the second connection terminals 113 and 114 (corresponding to 113 and 114 shown in Figure 3B) on the test circuit board 11. The other end of the second wire 72 and the second wire 73 are electrically connected to the tester 3 (not shown in the figure). The tester 3 is used to test the WIFI function module.

[0034] As shown in Figures 3A, 3B and 6, a third wiring 74 and 75 are respectively connected to the voltage test terminals 115 (corresponding to 115 shown in Figure 3B) and 116 (corresponding to 116 shown in Figure 3A) on the test circuit board 11. The other end of the third wiring 74 and 75 is further electrically connected to the digital measuring device 4, which is used to measure the bulk voltage of a substrate.

[0035] The tester 3 and digital measuring device 4 in this case are capable of digital connection and control, and therefore can be electrically connected to the electronic device 5, and the operation of the tester 3 and digital measuring device 4 can be controlled by the electronic device 5 (wherein the tester 3 and electronic device 5 are connected via Ethernet, and the digital measuring device 4 and electronic device 5 are connected via USB cable).

[0036] As shown in the previous figure (Figure 1), the electronic device 5 is electrically connected to the controller 2, the tester 3 and the digital measuring device 4. The electronic device 5 is any computing device capable of calculation and execution control, such as a desktop computer, a notebook computer or a server device.

[0037] As shown in Figure 7, the electronic device 5 includes at least one microprocessor 51 and at least one computer-readable recording medium 52, wherein the computer-readable recording medium 52 contains a test application 521, and the computer-readable recording medium 52 further stores computer-readable instructions, which enable the test application 521 to operate when executed by the microprocessor 51.

[0038] The test application 521 is used to issue multiple commands to turn off the Bluetooth function module and / or the WIFI function module of the chip body 6 under test, and to measure the voltage value of the substrate through the digital measuring instrument 4.

[0039] When the Bluetooth module is turned off, the test application 521 sends a first measurement voltage command to the digital measuring device 4 to obtain at least one substrate voltage value. The test application then determines whether the substrate voltage value is less than a set value (set value is 1.0V~1.3V) based on the at least one substrate voltage value or the average value of multiple substrate voltage values. If the substrate voltage value is less than the set value, the test application determines that the chip body 6 under test is an abnormal chip. Conversely, if the substrate voltage value is higher than or equal to the set value, the test application 521 determines that the chip body 6 under test is a normal chip.

[0040] The above implementation is mainly used to detect Bluetooth. After that, WIFI must be detected. Therefore, the Bluetooth function module can be turned on again through the command, and the WIFI function module can be tested by the tester 3 to see if it can work normally. After the test, the WIFI function module is turned off first, and then the Bluetooth function module is turned off. The test application 521 then sends a second voltage measurement command to the digital measuring device 4 to obtain at least one substrate voltage value again.

[0041] Furthermore, the steps for conducting a Wi-Fi test are as follows: (1) Electronic device 5 sends a command to controller 2, and controller 2 connects the WIFI test line path of the relay. (2) After that, the electronic device 5 sends a command to the chip body 6 under test via the relay 21 to turn on the WIFI. (3) When WIFI is turned on, the electronic device 5 will receive a notification that the WIFI function is turned on, and then send an instruction to the tester 3 to perform the test.

[0042] Then, based on at least one substrate voltage value or the average of multiple substrate voltage values, it is determined whether it is less than the set value. If the substrate voltage value is less than the set value, the test application 521 determines that the chip under test is an abnormal chip. Conversely, if the substrate voltage value determined by the second measurement voltage command is higher than or equal to the set value, the test application determines that the chip under test is a normal chip.

[0043] After two tests, if the test application 521 determines that the chip under test 6 is a normal chip, then the Bluetooth module can be tested to see if it can work properly.

[0044] As shown in Figure 8, the first stage of the wafer inspection method in this case involves the following steps: (1) A chip body to be tested is placed on a chip test socket of a testing device, wherein the chip body to be tested has at least a Bluetooth function module and a WIFI function module 801; (2) Start the Bluetooth module, and after loading a Bluetooth firmware into the Bluetooth module, shut down the Bluetooth module 802; (3) A first measurement voltage command is sent to a digital measuring instrument through a test application of the electronic device to obtain at least one substrate voltage value 803; (4) The test application determines whether the voltage value of at least one substrate or the average value of multiple substrates is less than the set value. If the voltage value of the substrate is less than the set value, the test application determines that the chip under test is an abnormal chip 804.

[0045] Further explanation of the above steps is as follows (the equipment and parameters mentioned in the examples below are limited to a specific implementation, but are not limited to other implementations and can be adjusted as needed): (1) Step 802, wherein the Bluetooth function module is activated by the test application of the electronic device sending an instruction to the relay control board so that the first connection terminal (terminal line (5) and terminal line (3)) in Figure 9A can be connected to activate the Bluetooth function and keep the Bluetooth function module at a high potential (e.g., 1.8V). (2) Step 802, in which the Bluetooth functional module loads a Bluetooth firmware, the steps of which are briefly described and exemplified below: (a) Reset Bluetooth functionality; (b) Increase the baud rate setting to 2 Mbps; (c) Download the Bluetooth driver (.hcd file, provided by the IC manufacturer); (d) Download the configuration file and write it to memory (the configuration file is an instruction provided by the IC manufacturer); (e) Execute instructions provided by the IC manufacturer; (f) The transmission rate is reduced to 115200 bps. (3) Step 802, turning off the Bluetooth function module is caused by the test application of the electronic device sending an instruction to the relay control board so that the first connection endpoint (endpoint line (3) and endpoint line (1)) in Figure 3A can be connected to turn off the Bluetooth function. In this state, the Bluetooth has not been powered off and the FW firmware is still in memory. (4) Step 803, in which at least one substrate voltage value is obtained, is briefly described with an example as follows: (a) First, set the digital measuring device 4 (in this embodiment, the digital measuring device 4 is a digital meter, such as GW GDM-8341), wherein the meter unit is set (e.g., DC 5V), the meter sampling rate configuration is set (e.g., Medium), and the time for measuring the integrated voltage of the output is set (e.g., every 0.5s). (b) Measure the contact points (the second connection endpoints to be measured, as shown in Figure 9B, 115 (the contact between L6 and C104), 116 (TP1_GND)), measure several times and take the average value (for example, measure 3 times and take the average value); (c) If the average voltage value is greater than or equal to 1V, the test application will determine PASS. (d) When the average voltage value is less than 1V, the test application determines FAIL and instructs the digital measuring instrument to stop the test.

[0046] As shown in Figure 10, in the second stage of the chip testing method of this case, if the substrate voltage value is higher than or equal to the set value, the test application determines that the chip under test is a normal chip, and then the next stage of testing can be performed. The steps are as follows: (1) First, enable the Bluetooth function module 101; (2) Then test the WIFI module to see if it can work properly. After the test, turn off the WIFI module and the Bluetooth module. (3) Then, the test application sends a second voltage measurement command to the digital measuring device to obtain at least one substrate voltage value 103; (4) The test application determines whether the voltage value of at least one substrate or the average value of multiple substrates is less than the set value. If the voltage value of the substrate is less than the set value, the test application determines that the chip under test is the abnormal chip 104.

[0047] Further explanation of the above steps is as follows (the equipment and parameters mentioned in the examples below are limited to a specific implementation, but are not limited to other implementations and can be adjusted as needed): (1) Step 102: Test the WIFI function module using the tester. A brief example of the steps is as follows: (a) Load the WIFI driver; (b) Load firmware and power settings; (c) Load the driver patch file; (d) Check if the one-time password test content is correct; (e) Read / write test media access address; (f) WIFI wireless function test; (g) Turn off the WIFI function. (2) Step 104: If the substrate voltage value is higher than or equal to the set value, the chip under test is determined to be a normal chip. Then, the Bluetooth module can be tested to see if it can operate normally. A brief example of the steps is as follows: (a) The testing instrument commands the test sample to return data at 11110000, calculates the peak and mean values ​​of its frequency offset, and denoted as Df1max and Df1avg; (b) The testing instrument commands the test sample to return data in groups of 10101010, calculates the peak and mean values ​​of its frequency offset, and denoted as Df2max and Df2avg; (c) Test criteria: at least 99.9% of Df1max meets the requirement of being between 140kHz and 175kHz, and at least 99.9% of Df2max is < 3115 kHz; Df2avg / Df1avg is < 30.8.

[0048] In addition, as shown in Figure 11, a shielding device 8 is further covered above the chip test socket 111. The shielding device 8 is used to cover the chip body 6 under test, so as to avoid interference between the chip bodies under test of other chip test sockets when the Bluetooth function module and / or the WIFI function module are turned on.

[0049] The aforementioned shielding device 8 was developed because, during the setup of the Wi-Fi 6E wireless network function test environment, it was discovered that the factory-side test stations, being in an open space, experienced a packet loss rate exceeding 10% in the receiver sensitivity measurement. This clearly violated the Wi-Fi IEEE 802.11XX standard specifications. Therefore, to prevent mutual interference between test stations and avoid affecting the actual product characteristics and causing misjudgments, and to effectively solve this problem, the shielding device 8 was manufactured and implemented in the factory-side test fixture for production testing.

[0050] By using the shielding device 8, the discrimination results measured by the program have significantly reduced and improved the problem of packet loss rate greater than 10%. The introduction of the shielding device 8 has also greatly improved the production yield and reduced the misjudgment results caused by interference in the test environment.

[0051] Compared with other conventional technologies, the chip testing system and method provided by this invention have designed a testing system and method to detect whether the chip will experience Bluetooth disconnection / restart or Wi-Fi throughput dropping to zero instantly. By testing and screening through the testing system and method of this invention, if there are no problems, the chip can be shipped.

[0052] The present invention has been disclosed above through the above embodiments, but it is not intended to limit the present invention. Anyone skilled in the art should not make any modifications or alterations after understanding the foregoing technical features and embodiments of the present invention.

[0053] 1: Testing equipment 11: Test Circuit Board 110: Power connection terminal 111: Chip Test Socket 112: First connection endpoint 113: Second connection endpoint 114: Second connection endpoint 115: Voltage test endpoint 116: Voltage test endpoint 12: Pressing tool 121: Press-down component 2: Controller 20: Power connection terminal 21: Relay 22: USB port 3: Tester 4: Digital measuring instrument 5: Electronic devices 51: Microprocessor 52: Computer-readable recording media 521: Testing the application 6: The chip under test 71: First connection 72: Second wiring 73: Second wiring 74: Third connection 75: Third connection 8: Shielding device

Claims

1. A wafer inspection system, comprising: A testing apparatus, comprising at least one test circuit board having at least one chip test socket, wherein the test circuit board further comprises at least one voltage test terminal, a first connection terminal, and a second connection terminal; a chip under test (DUT) body for placement within the chip test socket, the DUT body being electrically connected to the test circuit board, and the DUT body comprising at least one Bluetooth module and one Wi-Fi module; a controller electrically connected to the first connection terminal for transmitting commands to the DUT body; a tester electrically connected to the second connection terminal for testing the Bluetooth module and / or the Wi-Fi module; and a digital measuring instrument electrically connected to the voltage test terminal for measuring a substrate voltage value (Bulk). The tester includes a voltage sensor and an electronic device electrically connected to the controller, the tester, and the digital measuring instrument. The electronic device has a built-in test application that issues multiple commands to turn on or off the Bluetooth module and / or the WIFI module of the chip under test, and measures the voltage value of the substrate through the digital measuring instrument. If the substrate voltage value is less than a set value, the test application determines that the chip under test is an abnormal chip; conversely, if the substrate voltage value is higher than or equal to the set value, the test application determines that the chip under test is a normal chip. If the substrate voltage value is higher than or equal to the set value, the test application determines that the chip under test is a normal chip. Then, the Bluetooth module can be turned on, and the tester can be used to test whether the WIFI module can operate normally. After the test, the WIFI module and the Bluetooth module are turned off, and the test application sends a second voltage measurement command to the digital measuring instrument to obtain at least one substrate voltage value. The test application then determines whether the substrate voltage value is lower than the set value based on the at least one substrate voltage value or the average of multiple substrate voltage values. If the substrate voltage value is lower than the set value, the test application determines that the chip under test is an abnormal chip.

2. The wafer inspection system as claimed in claim 1, wherein the inspection device further comprises a pressure tool for uniformly pressing down on the wafer body under test so that the wafer body under test can make close contact with the wafer test socket so that the wafer body under test can be reliably electrically connected to the test circuit board.

3. The chip testing system as described in claim 1, wherein the test application can first start the Bluetooth function module through the controller, and after loading a Bluetooth firmware into the Bluetooth function module, can then shut down the Bluetooth function module. Afterward, the test application sends a first measurement voltage command to the digital measuring device to obtain at least one substrate voltage value, and determines whether it is less than a set value based on the at least one substrate voltage value or the average of multiple substrate voltage values. If the substrate voltage value is less than the set value, the test application determines that the chip under test is an abnormal chip.

4. The wafer testing system as described in claim 1, wherein if the substrate voltage value determined by the second measurement voltage command is higher than or equal to the set value, the test application determines that the wafer under test is a normal wafer.

5. The chip testing system as described in claim 4, wherein the testing application determines that the chip under test is a normal chip, and then can test whether the Bluetooth functional module can operate normally.

6. The chip testing system as described in claim 1, wherein a shielding device is further covered above the chip test socket, the shielding device being used to cover the chip body under test, so as to avoid mutual interference between the chip bodies under test of other chip test sockets when the Bluetooth function module and / or the WIFI function module is turned on.

7. The wafer inspection system as described in claim 1, wherein the set value is 1.0V to 1.3V.

8. A chip testing method, comprising the following steps: placing a chip under test onto a chip test socket of a testing apparatus, wherein the chip under test has at least a Bluetooth module and a Wi-Fi module; activating the Bluetooth module via an electronic device, and after loading Bluetooth firmware into the Bluetooth module, deactivating the Bluetooth module; issuing a first measurement voltage command to a digital measuring instrument via a test application of the electronic device to obtain at least one substrate voltage value; determining whether the substrate voltage value is less than a set value based on the at least one substrate voltage value or the average of multiple substrate voltage values; if the substrate voltage value is less than the set value, the test application determines that the chip under test is an abnormal chip; wherein... If the substrate voltage value is higher than or equal to the set value, the test application determines that the chip under test is a normal chip and can then proceed to the next stage of testing. The steps are as follows: First, turn on the Bluetooth module; then, use a tester to test whether the Wi-Fi module can operate normally. After the test, turn off both the Wi-Fi module and the Bluetooth module; then, the test application sends a second voltage measurement command to the digital measuring instrument to obtain at least one substrate voltage value; the test application determines whether the substrate voltage value is lower than the set value based on the at least one substrate voltage value or the average of multiple substrate voltage values. If the substrate voltage value is lower than the set value, the test application determines that the chip under test is an abnormal chip.

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