Electronic package, substrate structure and manufacturing method thereof

Abstract

An electronic package and its substrate structure and manufacturing method are disclosed. The electronic components are disposed on a substrate structure having a plurality of electrical contact pads and metal sheets by means of solder material. The insulating protective layer of the substrate structure has an opening that exposes the plurality of electrical contact pads, so that the metal sheets are disposed around the electrical contact pads and form a space between them, thereby reducing the amount of solder paste that expands outward and preventing short circuits from occurring on each electrical contact pad due to the expansion of the solder material.

Description

Technical Field

[0001] This invention relates to a semiconductor packaging technology, and more particularly to a flip-chip electronic package and its substrate structure and manufacturing method. Prior Technology

[0002] With the development of the electronics industry, today's electronic products are trending towards thinner, smaller, and more versatile designs, and semiconductor packaging technology has also developed different packaging forms accordingly. In order to meet the requirements of high integration and miniaturization of semiconductor devices, in addition to traditional wire bonding semiconductor packaging technology, flip chip technology can also be used to increase wiring density.

[0003] Figure 1 is a cross-sectional schematic diagram of a conventional flip-chip semiconductor package 1. As shown in Figure 1, the insulating protective layer 13 of a package substrate 10 has a plurality of openings 130 corresponding to the exposed circuit layers 14, so that the semiconductor wafer 11 is bonded to the electrical contact pads 140 of the circuit layer 14 through the openings 130 via a plurality of solder bumps 110 to electrically connect the conductive traces 141 of the circuit layer 14. Then, an undercoat 12 is formed between the semiconductor wafer 11 and the package substrate 10 to cover the solder bumps 110.

[0004] However, the circuit layer 14 of the conventional package substrate 10 is of the bump-on-trace (BOT) type. Therefore, when copper material (such as copper sheet or conductive trace 141) is distributed around the electrical contact pad 140 to provide grounding, the solder paste of the solder bump 110 will spread outward, which can easily form a short circuit between the electrical contact pads 140, resulting in a decrease in product yield.

[0005] Therefore, overcoming the problems of the aforementioned conventional technologies has become a pressing issue that the industry urgently needs to address. Summary of the Invention

[0006] In view of the various deficiencies of the prior art, the present invention provides a substrate structure comprising: a substrate body having a plurality of electrical contact pads and a metal sheet, wherein a notch is formed on one side of the metal sheet so that at least one of the electrical contact pads is located in the notch, and the opposite ends of the electrical contact pads contact the metal sheet, thereby forming a gap between one side of the electrical contact pad and the notch of the metal sheet; and an insulating protective layer formed on the substrate body and having an opening exposing the plurality of electrical contact pads.

[0007] The present invention also provides a method for manufacturing a substrate structure, comprising: providing a substrate body having a plurality of electrical contact pads and at least one metal sheet, wherein a notch is formed on one side of the metal sheet so that at least one of the electrical contact pads is located in the notch, and the opposite ends of the electrical contact pads contact the metal sheet, thereby forming a gap between one side of the electrical contact pads and the notch of the metal sheet; and forming an insulating protective layer on the substrate body, wherein the insulating protective layer has an opening exposing the plurality of electrical contact pads.

[0008] In the aforementioned substrate structure and manufacturing method, the substrate body has an insulating layer to bond the plurality of electrical contact pads and the metal sheet.

[0009] In the aforementioned substrate structure and manufacturing method, extensions are formed at both ends of the electrical contact pad to be embedded in the metal sheet.

[0010] In the aforementioned substrate structure and manufacturing method, one of the opposite ends of the electrical contact pad is formed with an extension section to be embedded in the metal sheet.

[0011] The present invention also provides an electronic package comprising: a substrate structure as described above; and electronic components, which are attached to and electrically connected to the plurality of electrical contact pads by conductive bumps.

[0012] The present invention also provides a method for manufacturing an electronic package, comprising: providing a substrate structure as described above; and attaching an electronic component to the plurality of electrical contact pads by means of a plurality of conductive bumps, thereby electrically connecting the electronic component to the plurality of electrical contact pads.

[0013] In the aforementioned electronic package and its manufacturing method, the plurality of conductive bumps contain solder material.

[0014] As can be seen from the above, the electronic package and its substrate structure and manufacturing method of the present invention mainly rely on the metal sheet to be disposed on the periphery of the electrical contact pad to reduce the amount of solder paste that expands outward. Therefore, compared with the prior art, the electrical contact pads of the electronic package of the present invention can avoid the problem of short circuit caused by the expansion of the solder material, thereby improving the product yield. Simple Explanation of the Diagram

[0015] Figure 1 is a cross-sectional schematic diagram of a conventional semiconductor package.

[0016] Figures 2A to 2C are cross-sectional schematic diagrams illustrating the manufacturing process of the electronic package of the present invention.

[0017] Figure 3A is a partial top view of Figure 2A.

[0018] Figures 3B and 3C are partial top views of other embodiments of Figure 3A.

[0019] Figure 4 is a partial top view of Figure 2B. Implementation

[0020] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0021] It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of the present invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the present invention.

[0022] Figures 2A to 2C are cross-sectional schematic diagrams illustrating the manufacturing process of the electronic package 2 of the present invention.

[0023] As shown in Figures 2A and 2B, a substrate structure 2a is fabricated. First, a substrate body 20 is provided, and then an insulating protective layer 22 is formed on the substrate body 20.

[0024] The substrate body 20 has a first surface 20a and a second surface 20b opposite to each other, and a plurality of electrical contact pads 200 and at least one metal sheet 201 are formed on the first surface 20a.

[0025] In this embodiment, the substrate body 20 is a packaging substrate with a core layer and circuit structure, a packaging substrate with a coreless circuit structure, a silicon interposer (TSI) with through-silicon vias (TSVs), or other board types.

[0026] Furthermore, the substrate body 20 is formed using a redistribution layer (RDL) fabrication method, and it has at least one insulating layer 202 to bond the plurality of electrical contact pads 200 and the metal sheet 201. For example, the material forming the electrical contact pads 200 is copper, and the material forming the insulating layer 202 and the metal sheet 201 is a dielectric material such as polybenzoxazole (PBO), polyimide (PI), or prepreg (PP).

[0027] Furthermore, the metal sheet 201 is disposed on the periphery of the electrical contact pad 200, as shown above, below, and to the left in FIG3A. A notch 203 is formed on one side of the metal sheet 201 so that the electrical contact pad 200 is located in the notch 203, and the opposite ends of the electrical contact pad 200 (as shown above and below in FIG3A) contact the metal sheet 201, so that a gap space S is formed between one side of the electrical contact pad 200 and the notch 203 of the metal sheet 201.

[0028] In addition, at least one of the opposite ends of the electrical contact pad 200 may be formed with an extension 300 to be embedded in the metal sheet 201, as shown in FIG3B, with one end embedded in the metal sheet 201, or as shown in FIG3C, with both ends embedded in the metal sheet 201.

[0029] In one embodiment, the edge of the electrical contact pad 200 is not connected to conductive traces or other wiring forms; therefore, the extension 300 is a portion of the electrical contact pad 200, rather than a conductive trace or wiring form. In one embodiment, the electrical contact pad 200 is in the form of a bump-connected circuit (BOT).

[0030] The insulating protective layer 22 is a solder resist layer, such as green paint or graphite, which is disposed on the first surface 20a of the substrate body 20 to cover the metal sheet 201 and forms an opening 220 of a plurality of electrical contact pads 200 exposed, as shown in FIG4.

[0031] As shown in Figure 2C, the electronic component 21 is attached to the plurality of electrical contact pads 200 by means of a plurality of conductive bumps 23.

[0032] The electronic component 21 is an active component, a passive component, or a combination thereof, wherein the active component is, for example, a semiconductor wafer, and the passive component is, for example, a resistor, a capacitor, or an inductor.

[0033] In this embodiment, the electronic component 21 is a semiconductor wafer with an opposing active surface 21a and a non-active surface 21b, and the conductive bump 23 is attached to its active surface 21a.

[0034] Furthermore, the conductive bump 23 contains solder material 230, such as solder paste. For example, the conductive bump 23 has a metal pillar 231, such as a copper pillar, for bonding the working surface 21a, so that the solder material 230 is formed thereon, so that the electronic component 21 is disposed on the plurality of electrical contact pads 200 in a flip-chip manner.

[0035] Therefore, in the manufacturing method of the electronic package 2 of the present invention, the metal sheet 201 of the substrate body 20 of the substrate structure 2a is mainly disposed on the periphery of the electrical contact pad 200, so that the electrical contact pad 200 and the metal sheet 201 form the gap space S. When the solder material 230 is bonded, the gap space S can reduce the amount of solder paste that spreads outward from the solder material 230. Therefore, compared with the prior art, the electronic package 2 of the present invention can prevent the solder material 230 from spreading to other areas, and thus the problem of short circuit between each electrical contact pad 200 can be avoided.

[0036] The present invention also provides a substrate structure 2a, which includes: a substrate body 20 and an insulating protective layer 22 formed on the substrate body 20.

[0037] The substrate body 20 has a plurality of electrical contact pads 200 and at least one metal sheet 201, such that the metal sheet 201 is disposed around the electrical contact pads 200. A notch 203 is formed on one side of the metal sheet 201, such that at least one electrical contact pad 200 is located in the notch 203, and the opposite ends of the electrical contact pad 200 contact the metal sheet 201, so that a gap space S is formed between one side of the electrical contact pad 200 and the notch 203 of the metal sheet 201.

[0038] The insulating protective layer 22 is formed on the substrate body 20 and has openings 220 that expose the plurality of electrical contact pads 200.

[0039] In one embodiment, the substrate body 20 has an insulating layer 202 to bond the plurality of electrical contact pads 200 and the metal sheet 201.

[0040] In one embodiment, extensions 300 are formed at both opposite ends of the electrical contact pad 200 to be embedded in the metal sheet 201.

[0041] In one embodiment, one of the opposite ends of the electrical contact pad 200 is formed with an extension 300 to be embedded in the metal sheet 201.

[0042] The present invention also provides an electronic package comprising: the substrate structure 2a, and at least one electronic component 21 disposed on the substrate structure 2a.

[0043] The electronic component 21 is attached to and electrically connected to the plurality of electrical contact pads 200 by means of conductive bumps 23.

[0044] In one embodiment, the conductive bump 23 comprises solder material 230.

[0045] In summary, the electronic package and its substrate structure and manufacturing method of the present invention reduce the amount of solder paste that expands outward by placing the metal sheet around the electrical contact pad. Therefore, each electrical contact pad of the electronic package of the present invention can avoid short circuits caused by the expansion of solder material, thereby improving product yield.

[0046] The above embodiments are illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as set forth in the following patent claims.

[0047]

[0048] 1: Semiconductor package

[0049] 10: Packaging substrate

[0050] 11: Semiconductor wafers

[0051] 110: Solder bump

[0052] 12: Base rubber

[0053] 13,22: Insulating protective layer

[0054] 130,220: Opening

[0055] 14: Line Layer

[0056] 140, 200: Electrical contact pads

[0057] 141: Conductive traces

[0058] 2: Electronic packaging components

[0059] 2a: Substrate structure

[0060] 20:Substrate body

[0061] 20a: First surface

[0062] 20b: Second surface

[0063] 201: Metal sheet

[0064] 202: Insulation layer

[0065] 203: Gap

[0066] 21: Electronic Components

[0067] 21a: Surface of Action

[0068] 21b: Non-acting surface

[0069] 23: Conductive bumps

[0070] 230: Solder materials

[0071] 231: Metal Column

[0072] 300: Extension

[0073] S: Spacing

Claims

1. A substrate structure comprising: The substrate body has a plurality of electrical contact pads and a metal sheet, wherein a notch is formed on one side of the metal sheet so that at least one of the electrical contact pads is located in the notch, and the opposite ends of the electrical contact pads contact the metal sheet, thereby forming a gap between one side of the electrical contact pad and the notch of the metal sheet; and an insulating protective layer is formed on the substrate body and has an opening that exposes the plurality of electrical contact pads.

2. The substrate structure as described in claim 1, wherein, The substrate body has an insulating layer to bond the plurality of electrical contact pads and the metal sheet.

3. The substrate structure as described in claim 1, wherein, The electrical contact pad has extensions at both ends to be embedded in the metal sheet.

4. The substrate structure as described in claim 1, wherein, One of the opposite ends of the electrical contact pad is formed with an extension to be embedded in the metal sheet.

5. An electronic package, comprising: The substrate structure as described in any of claims 1 to 4; And electronic components are attached to and electrically connected to the plurality of electrical contact pads by a plurality of conductive bumps.

6. The electronic package as described in claim 5, wherein, The complex conductive bump system contains solder material.

7. A method for manufacturing a substrate structure, comprising: A substrate body is provided, having a plurality of electrical contact pads and a metal sheet, wherein a notch is formed on one side of the metal sheet so that at least one of the electrical contact pads is located in the notch, and the opposite ends of the electrical contact pads contact the metal sheet, thereby forming a gap between one side of the electrical contact pads and the notch of the metal sheet; and an insulating protective layer is formed on the substrate body, wherein the insulating protective layer has an opening that exposes the plurality of electrical contact pads.

8. A method for manufacturing the substrate structure as described in claim 7, wherein, The two opposite ends of the electrical contact pad are in contact with the metal sheet.

9. A method for manufacturing the substrate structure as described in claim 7, wherein, The electrical contact pad has extensions at both ends to be embedded in the metal sheet.

10. A method for manufacturing the substrate structure as described in claim 7, wherein, One of the opposite ends of the electrical contact pad is formed with an extension to be embedded in the metal sheet.

11. A method for manufacturing an electronic package, comprising: Provide a substrate structure as described in any of claims 1 to 4; And to attach electronic components to the plurality of electrical contact pads by means of a plurality of conductive bumps, so that the electronic components are electrically connected to the plurality of electrical contact pads.

12. A method for manufacturing an electronic package as described in claim 11, wherein, The complex conductive bump system contains solder material.

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