Substrate treatment apparatus having heating unit

Abstract

This invention relates to a substrate processing apparatus equipped with a heating unit, comprising: a substrate holding unit, a processing liquid supply unit, a heating unit, a partition plate, an upper sensor, and a lower sensor. The substrate holding unit holds and rotates the substrate; the processing liquid supply unit supplies processing liquid to the upper or lower surface of the substrate held in the substrate holding unit; the heating unit heats the substrate from below; the partition plate is disposed in the substrate holding unit and located above the heating unit, capable of transmitting light toward the substrate and preventing processing liquid from flowing into the heating unit; the upper sensor is disposed on the upper side with the partition plate as its center, constituting one of a light-transmitting portion and a light-receiving portion; the lower sensor is disposed on the lower side with the partition plate as its center, constituting the other of a light-transmitting portion and a light-receiving portion. The upper and lower sensors measure the light transmittance of the partition plate by measuring the amount of light irradiated from the light-transmitting portion and reaching the light-receiving portion. The upper and lower sensors used to measure light transmittance are installed together with the substrate processing device, so that the light transmittance of the partition plate does not need to be measured in a separate location when the partition plate is separated, thus maintaining high productivity.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus equipped with a heating unit, and more specifically, to a substrate processing apparatus equipped with a heating unit that can measure the light transmittance of a partition plate through which the radiant heat of the heating unit passes. Prior Technology

[0002] A substrate processing apparatus is an apparatus that uses a processing solution to perform vapor deposition, development, etching, and cleaning on substrates such as semiconductor wafers, display substrates, optical disc substrates, magnetic disk substrates, photomask substrates, ceramic substrates, and solar cell substrates.

[0003] The cleaning process is a process of removing foreign objects or particles present on the substrate. A representative cleaning process includes the following steps: when the substrate is supported on a substrate holding unit such as a chuck base (rotating head) and rotates at high speed, rinsing liquid is supplied to the surface or back of the substrate for treatment.

[0004] In this case, if a heating unit such as a light-emitting diode (LED) or a laser irradiation device is installed on the underside of the substrate, and the substrate is rotated and processed while being heated, a rapid reaction will be triggered, thereby reducing the amount of processing liquid used, thus minimizing environmental pollution. In addition, the processing time can be shortened to improve productivity, and power consumption can be significantly reduced.

[0005] Figure 1 shows a representative example of the substrate processing apparatus equipped with the heating unit, and the structure is briefly described below.

[0006] A chuck pin 5 is provided on the upper surface of the chuck base 1, and a processing liquid supply unit 7 is provided on the upper part of the substrate W fixed to the chuck pin 5, so that the processing liquid can be sprayed onto the upper surface of the substrate W. At the lower center of the chuck base 1, the rear nozzle assembly 2 is erected through the chuck base 1, so that the processing liquid can be sprayed toward the bottom surface of the substrate W.

[0007] Furthermore, a partition plate 4 made of quartz or the like is provided on the chuck base 1 between the heating unit 3 and the substrate W to prevent the processing liquid sprayed from the processing liquid supply unit 7 or the rear nozzle assembly 2 from flowing into the heating unit 3 and causing a short circuit, and to allow the radiant heat of the heating unit 3 to pass through smoothly.

[0008] On the other hand, hydrofluoric acid (HF) is used for various purposes such as etching substrates W. The hydrofluoric acid has the property of corroding (melting) quartz. As corrosion occurs, the light transmittance tends to decrease due to the heat of corrosion.

[0009] When hydrofluoric acid is sprayed from the processing liquid supply unit 7 onto the upper part of the substrate W, the partition plate 4 exposed by the substrate W is relatively small, so the amount of corrosion is less. However, when hydrofluoric acid is sprayed from the rear nozzle assembly 2, it will bounce off the bowl-shaped piece 8 provided on the bottom surface of the substrate W and around the substrate W, thereby generating a large amount of mist or smoke, and the corrosion that occurs is faster and more severe.

[0010] On the other hand, Figure 2 shows a graph of the temperature of the substrate W changing with the output of the heating unit 3 when the light transmittance of the light-transmitting component constituting the partition plate 4 is 88% and 94%, and Figure 3 shows a graph of the light transmittance of the light-transmitting component exposed to hydrofluoric acid changing with time according to the concentration of hydrofluoric acid.

[0011] As shown in the figure, compared with the case of 94% transmittance, the temperature of substrate W will be significantly reduced when the transmittance is 88%. Compared with exposure to low concentration of hydrofluoric acid, the transmittance will decrease significantly over time when exposed to high concentration of hydrofluoric acid.

[0012] As described above, when the light transmittance decreases, the temperature of the substrate W cannot rise to the target temperature, and the heating unit 3 cannot achieve the intended purpose. Therefore, preferably, the partition plate 4 should maintain a light transmittance of more than 90%, and it needs to be replaced when it cannot present the intended light transmittance.

[0013] However, in the past, since a partition plate 4 was provided in the substrate processing apparatus, in order to measure the light transmittance of the partition plate 4 exposed to hydrofluoric acid, the partition plate 4 could only be separated from the substrate processing apparatus and the measurement had to be carried out in a separate place. As a result, the time required for disassembly and assembly increased, which led to a decrease in productivity.

[0014] To address this issue, when the partition plate 4 is replaced periodically based on the usage time of the substrate processing apparatus, it is possible to replace the partition plate 4 even if it is in good condition. This results in the waste of expensive partition plates 4. Furthermore, when the partition plate 4 is placed, it is replaced after multiple substrates W have become defective, which also has a significant impact on the yield and leads to a reduction in productivity. Summary of the Invention

[0015] The present invention addresses the problems of the prior art. The object of the present invention is to provide a substrate processing apparatus equipped with a heating unit, wherein the device for measuring light transmittance is provided together with the substrate processing apparatus, thereby eliminating the need to measure the light transmittance of the partition plate in a separate location while the partition plate is separated, thus maintaining high productivity.

[0016] To achieve the aforementioned objective, the substrate processing apparatus of the present invention is characterized by comprising: a substrate holding unit, a processing liquid supply unit, a heating unit, a partition plate, an upper sensor, and a lower sensor. The substrate holding unit holds and rotates the substrate; the processing liquid supply unit supplies processing liquid to the upper or lower surface of the substrate held in the substrate holding unit; the heating unit heats the substrate from below; the partition plate is disposed in the substrate holding unit and located above the heating unit, capable of transmitting light toward the substrate and preventing processing liquid from flowing into the heating unit; the upper sensor is disposed on the upper side with the partition plate as its center, constituting one of a light-transmitting portion and a light-receiving portion; the lower sensor is disposed on the lower side with the partition plate as its center, constituting the other of a light-transmitting portion and a light-receiving portion. The transmittance of the partition plate is measured by measuring the amount of light irradiated from the light-transmitting portion and reaching the light-receiving portion.

[0017] The present invention is characterized in that the upper sensor and the lower sensor are connected to the light generation measuring device via optical fibers, and the light generation measuring device is connected to the control unit.

[0018] The present invention is characterized in that the upper sensor and the lower sensor are configured as at least two sets, and are respectively arranged at different positions in the radial direction relative to the center of the substrate.

[0019] The present invention is characterized in that lens portions for focusing light are respectively provided on the upper sensor and the lower sensor.

[0020] The present invention is characterized in that the light source suitable for the light-transmitting part is a light-emitting diode or a laser lamp.

[0021] The present invention is characterized in that the measurement is performed while the substrate is kept rotating, thereby enabling the measurement of the light transmittance on the concentric circles of the partition plate.

[0022] The present invention is characterized in that the lower sensor is disposed on the lower side of the substrate holding unit, and a first light-transmitting port and a second light-transmitting port are respectively formed through the substrate holding unit and the heating unit to allow light irradiated from the light-transmitting part to pass through.

[0023] The invention is characterized in that the first light-transmitting opening formed in the substrate holding unit extends circumferentially from the center of the substrate and is formed into an arc shape that includes the position of the lower sensor.

[0024] The present invention is characterized in that the upper sensor and the lower sensor are capable of reciprocating in a radial direction relative to the center of the substrate, and the first light-transmitting port and the second light-transmitting port are respectively extended along the radial direction.

[0025] The invention is characterized in that the first light-transmitting opening also extends in a circumferential direction relative to the center of the substrate, and the first light-transmitting opening has a shape that intersects the radial direction along the circumferential direction.

[0026] Compared with the efficacy of previous technologies According to the present invention with the described structure, the invention is characterized by comprising: an upper sensor disposed on the upper side centered on the partition plate, constituting at least one of a light-transmitting portion and a light-receiving portion; and a lower sensor disposed on the lower side centered on the partition plate, constituting the other of a light-transmitting portion and a light-receiving portion. The upper and lower sensors measure the light transmittance of the partition plate by measuring the amount of light irradiated from the light-transmitting portion and reaching the light-receiving portion. Since the upper and lower sensors for measuring the light transmittance are disposed together with the substrate processing apparatus, it is not necessary to measure the light transmittance of the partition plate in a separate location while the partition plate is separated, thus maintaining high productivity.

[0027] Furthermore, according to the present invention, when the upper sensor and the lower sensor are configured as at least two sets and are respectively arranged at different positions along the radial direction relative to the center of the substrate, the light transmittance can be measured at different positions in the radial direction to make a more accurate judgment on the time point for the replacement of the partition plate.

[0028] Furthermore, according to the present invention, lens portions for focusing light are respectively provided on the upper sensor and the lower sensor, thereby enabling more accurate measurement of light transmittance.

[0029] Furthermore, according to the present invention, the measurement can be performed while the substrate is rotated, thereby allowing the light transmittance to be measured at multiple locations within the concentric circular region of the partition plate.

[0030] Furthermore, according to the present invention, the lower sensor is disposed on the lower side of the substrate holding unit, and a first light-transmitting port and a second light-transmitting port through which light irradiated from the light-transmitting portion passes are formed in the substrate holding unit and the heating unit respectively, thereby making the installation of the lower sensor even easier.

[0031] Furthermore, according to the present invention, the first light-transmitting opening formed in the substrate holding unit is formed in an arc shape centered on the center of the substrate, which includes the position of the lower sensor. This allows for the measurement of light transmittance and other parameters at multiple positions on the concentric circle of the partition plate while the substrate holding unit is rotated by a predetermined angle.

[0032] Furthermore, according to the present invention, the upper sensor and the lower sensor can reciprocate along the radial direction relative to the center of the substrate, and the first light-transmitting port and the second light-transmitting port extend along the radial direction. Thus, when the upper sensor and the lower sensor are vertically aligned and move a predetermined distance along the radial direction relative to the center of the substrate, the light transmittance at multiple different positions in the radial direction of the partition plate can be measured. Simple Explanation of the Diagram

[0033] Figure 1 is a longitudinal sectional view showing a representative example of a substrate processing apparatus equipped with a heating unit. Figure 2 is a graph showing the temperature of the substrate W as a function of the heating unit output when the light transmittance of the light-transmitting component is 88% and 94%. Figure 3 is a graph showing the change in light transmittance of a light-transmitting component exposed to hydrofluoric acid over time, depending on the concentration of hydrofluoric acid. Figure 4 is a longitudinal sectional view of a substrate processing apparatus according to an embodiment of the present invention. Figure 5 is a top view of a substrate processing apparatus according to an embodiment of the present invention. Figure 6 is a longitudinal sectional view of a substrate processing apparatus according to another embodiment of the present invention. Figure 7 is a top view of a substrate processing apparatus according to another embodiment of the present invention. Figure 8 is a top view illustrating the range of light transmittance that can be measured in a substrate processing apparatus according to another embodiment of the present invention. Implementation

[0034] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the appended specification.

[0035] As shown in Figures 4 and 5, a substrate processing apparatus 1000 according to an embodiment of the present invention includes: a substrate holding unit, a processing liquid supply unit, a heating unit, a partition plate, an upper sensor, and a lower sensor. The substrate holding unit 100 is adapted to hold and rotate a substrate W; the processing liquid supply unit 200 supplies processing liquid to the upper or lower surface of the substrate W held in the substrate holding unit 100; the heating unit 300 heats the substrate W from below; the partition plate 400 is disposed in the substrate holding unit 100 and located above the heating unit 300, capable of transmitting light toward the substrate W and preventing processing liquid from flowing into the heating unit 300; the upper sensor 510 is disposed on the upper side with the partition plate 400 as the center, constituting one of a light-transmitting part and a light-receiving part; the lower sensor 520 is disposed on the lower side with the partition plate 400 as the center, constituting the other of a light-transmitting part and a light-receiving part.

[0036] In this case, the partition plate 400 can be disposed in the substrate holding unit 100 and rotate together with it, and the substrate holding unit 100 can be rotated by a drive motor M.

[0037] The heating unit 300 can be a non-rotating body or it can be configured to rotate within a specified angle range. Even when the heating unit 300 can rotate, it will not be linked with the substrate holding unit 100 and will not rotate together with it.

[0038] The upper sensor 510 and the lower sensor 520 are mounted on the sensor bracket 560.

[0039] Based on this structure, the light transmittance of the partition plate 400 can be determined by measuring the amount of light that shines from the light-transmitting part and reaches the light-receiving part.

[0040] As shown in Figure 4, the upper sensor 510 and the lower sensor 520 can be connected to the light generation measuring device 540 via optical fiber 530, and the light generation measuring device 540 can be connected to the control unit 550.

[0041] The light generation and measurement device 540 is a device that generates light, amplifies it, and transmits it to the light-transmitting part, and measures the amount of light returned from the light-receiving part that receives the light irradiated from the light-transmitting part.

[0042] The amount of light generated by the light generation measuring device 540 is preset (measured) and transmitted to the light transmission part through the optical fiber 530. The light irradiated from the light transmission part passes through the partition plate 400 and reaches the light receiving part where the amount of light is detected. The amount of light returning from the light receiving part through the optical fiber 530 is measured by the light generation measuring device 540.

[0043] The control unit 550 calculates the light transmittance based on the brightness of the light-transmitting part and the amount of light detected by the light-receiving part.

[0044] The control unit 550 can also visually confirm the light transmittance calculated by connecting a display device or a computer.

[0045] As described above, the substrate processing apparatus 1000 according to the present invention is provided together with the substrate processing apparatus 1000, so that the light transmittance of the partition plate 400 can be measured at any time point without separating the partition plate 400, thereby maintaining high productivity.

[0046] As shown in Figures 4 and 5, the upper sensor 510 and the lower sensor 520 are configured as two or more groups, and can be respectively set at different positions in the radial direction relative to the center of the substrate W (first measurement position and second measurement position).

[0047] As described above, the light transmittance is measured at different positions in the radial direction, thereby enabling a more accurate determination of the replacement time of the partition panel 400.

[0048] In this case, since the upper sensor 510 and the lower sensor 520 form multiple groups, when measurements are taken at multiple locations, the determination of the replacement time point of the partition plate 400 can be made by using whether the average value of the light transmittance at multiple locations reaches a set value, or by using whether the light transmittance at individual locations reaches a set value.

[0049] Furthermore, preferably, lens portions (not shown) for focusing light are respectively provided on the upper sensor 510 and the lower sensor 520, thereby enabling more accurate measurement of light transmittance. In this case, the lens portions can be respectively located at the front end of the light-transmitting part and the rear end of the light-receiving part.

[0050] Furthermore, the light source suitable for the light-transmitting part can be a light-emitting diode or a laser lamp.

[0051] On the other hand, the light transmittance on the concentric circles of the partition plate 400 can be measured by rotating the substrate holding unit 100.

[0052] That is, after measuring the transmittance at one location, when measuring the transmittance while the substrate holding unit 100 and the partition plate 400 are rotated by a specified angle, the transmittance can be measured at multiple locations in the concentric circle region.

[0053] This is feasible when the lower sensor 520 is positioned between the bottom of the heating unit 300 and the substrate holding unit 100.

[0054] However, when it is difficult to achieve this structure due to interference from peripheral components such as data cables or power cables, the lower sensor 520 can be disposed on the lower side of the substrate holding unit 100, and a first light-transmitting port 110 and a second light-transmitting port 310 can be formed through the substrate holding unit 100 and the heating unit 300 respectively to allow light irradiated from the light-transmitting part to pass through.

[0055] According to this structure, the upper sensor 510 is disposed on the upper side of the substrate W setting position, and the lower sensor 520 is disposed on the lower side of the substrate holding unit 100. Therefore, the setting operation of the upper sensor 510 and the lower sensor 520 can be easily performed. The light irradiated from the light-transmitting part can pass through the first light-transmitting port 110 and the second light-transmitting port 310 in sequence and smoothly reach the light-receiving part through the partition plate 400.

[0056] Of course, when the light-transmitting part and the light-receiving part are set in opposite positions, the light irradiated from the light-transmitting part passes through the partition plate 400 and then reaches the light-receiving part through the second light-transmitting port 310 and the first light-transmitting port 110.

[0057] As shown in FIG5, the first light-transmitting opening 110 formed in the substrate holding unit 100 can be formed into an arc shape that includes the position of the lower sensor 520 at the center of the center portion of the substrate W.

[0058] Therefore, the light transmittance at other positions on the concentric circles of the partition plate 400 can be measured while the substrate holding unit 100 is rotated by a predetermined angle.

[0059] As shown in the figure, multiple arc-shaped first light-transmitting openings 110 can be formed on concentric circles.

[0060] On the other hand, as shown in Figures 6 and 7, the upper sensor 510 and the lower sensor 520 can reciprocate in the radial direction relative to the center of the substrate W, and the first light-transmitting port 110' and the second light-transmitting port 310' can be formed by extending in the radial direction at the bottom of the substrate holding unit 100 and the heating unit 300, respectively.

[0061] According to this structure, when the upper sensor 510 and the lower sensor 520 are in a state of vertical correspondence, the light transmittance at multiple different positions in the radial direction of the partition plate 400 is measured by moving a predetermined distance relative to the center of the substrate W in the radial direction.

[0062] The upper sensor 510 and the lower sensor 520 can be mounted on the telescopic sensor brackets 570 and 580 and can move along the radial direction.

[0063] The telescopic sensor brackets 570 and 580 can be made using transfer bolts and LM guides driven by pressure cylinders or motors, or other known structures can be used.

[0064] The figure shows that the telescopic sensor brackets 570 and 580 are set as one group, but multiple groups can also be set apart along the circumferential direction with the center of the substrate W as the center.

[0065] Furthermore, a first light-transmitting opening 110 is formed at the bottom of the substrate holding unit 100, extending in an arc shape with the center of the substrate W as the center and including the position of the lower sensor 520. This allows the light transmittance at multiple different positions on the concentric circles of the partition plate 400 to be measured while the substrate holding unit 100 is rotated by a predetermined angle.

[0066] Specifically, Figure 8 shows the following situation: the upper sensor 510 and the lower sensor 520 are mounted on telescopic sensor brackets 570' and 580' and can move along the radial direction. Therefore, the light transmittance can be measured by the first light-transmitting opening 110' and the second light-transmitting opening 310' formed by the substrate holding unit 100 and the heating unit 300 extending along the radial direction, respectively. At the same time, the arc-shaped first light-transmitting opening 110 is formed with the center of the substrate W as the center to include the position of the lower sensor 520, so that the light transmittance of the partition plate 400 can be measured at multiple positions on the concentric circle.

[0067] In this case, preferably, the area that can be measured by the upper sensor 510 and the lower sensor 520 is a first light-transmitting opening 110' extending along the radial direction and an arc-shaped first light-transmitting opening 110 intersecting with the first light-transmitting opening 110' extending along the radial direction. The first light-transmitting opening 110' extending along the radial direction and the arc-shaped first light-transmitting opening 110 form the range for measuring light transmittance.

[0068] The figure shows that the telescopic sensor brackets 570' and 580' are formed as one group, but multiple groups can also be arranged around the center of the substrate W in the surrounding direction.

[0069] Furthermore, as shown in the figure, the arc-shaped first light-transmitting opening 110 can be set at two or more different positions in the radial direction relative to the center of the substrate W.

[0070] As described above, according to the structure of the present invention, the upper sensor 510 and the lower sensor 520 for measuring light transmittance are provided together with the substrate processing apparatus 1000, so that it is not necessary to measure the light transmittance of the partition plate 400 in a separate location while the partition plate 400 is separated, thus maintaining high productivity.

[0071] Furthermore, the transmittance can be measured at multiple locations on a concentric circle centered on the center of the substrate W, and at multiple locations in the radial direction centered on the center of the substrate W.

[0072] When light transmittance is measured at multiple locations on the partition panel 400, the replacement time of the partition panel 400 can be determined based on the user's own reference. For example, it can be set to the average light transmittance measured at multiple locations reaching the set value or the light transmittance measured at a portion of each measurement location reaching the set value.

[0073] Furthermore, the transmittance can be measured periodically over time, or periodically based on the number of substrates W processed.

[0074] Unspecified reference numeral 800 refers to a bowl-shaped component that receives the processing liquid from the substrate W.

[0075] The embodiments of the present invention are merely illustrative examples. Anyone skilled in the art to which this invention pertains will understand that various modifications and equivalent embodiments can be implemented within the scope of the invention claims.

[0076] 1: Chuck base 2: Rear Nozzle Assembly 3: Heating Unit 4: Partition board 5: Chuck pin 7: Processing fluid supply unit 8: Bowl-shaped piece 100: Substrate holding unit 110, 110': First light-transmitting opening 200: Processing fluid supply unit 300: Heating unit 310, 310': Second light-transmitting opening 400: Partition Board 510: Upper sensor 520: Lower sensor 530: Optical Fiber 540: Light Generation Measurement Apparatus 550: Control Department 560: Sensor Bracket 570, 570', 580, 580': Telescopic sensor bracket 800: Bowl-shaped component 1000: Substrate processing apparatus M: Drive motor W: substrate

Claims

1. A substrate processing apparatus, comprising: A substrate holding unit, suitable for holding and rotating a substrate; A processing liquid supply unit supplies processing liquid to the upper or lower surface of the substrate held in the substrate holding unit; a heating unit heats the substrate from below; a partition plate is disposed in the substrate holding unit and located above the heating unit, capable of transmitting light toward the substrate to prevent the processing liquid from flowing into the heating unit; an upper sensor is disposed on the upper side centered on the partition plate, forming one of a light-transmitting part and a light-receiving part; and a lower sensor is disposed on the lower side centered on the partition plate, forming the other of the light-transmitting part and the light-receiving part. The lower sensor is disposed on the lower side of the substrate holding unit, and forms a first light-transmitting port and a second light-transmitting port through the substrate holding unit and the heating unit, respectively, allowing light irradiated from the light-transmitting part to pass through. The light transmittance of the partition plate is measured by measuring the amount of light irradiated from the light-transmitting part and reaching the light-receiving part.

2. The substrate processing apparatus as described in claim 1, wherein, The upper sensor and the lower sensor are connected to the light generation measuring device via optical fibers, and the light generation measuring device is connected to the control unit.

3. The substrate processing apparatus as described in claim 1, wherein, The upper sensor and the lower sensor are configured as at least two sets, and are respectively arranged at different positions in the radial direction relative to the center of the substrate.

4. The substrate processing apparatus as described in claim 1, wherein, Lens sections for focusing light are respectively provided on the upper sensor and the lower sensor.

5. The substrate processing apparatus as described in claim 1, wherein, The light source suitable for the light-transmitting part is a light-emitting diode or a laser lamp.

6. The substrate processing apparatus as described in claim 1, wherein, The measurement is performed while the substrate is kept rotating, thereby enabling the measurement of the light transmittance on the concentric circles of the partition plate.

7. The substrate processing apparatus as described in claim 1, wherein, The first light-transmitting opening formed in the substrate holding unit extends circumferentially from the center of the substrate and is formed into an arc shape that includes the position of the lower sensor.

8. The substrate processing apparatus as claimed in claim 1, wherein, The upper sensor and the lower sensor are capable of reciprocating along the radial direction relative to the center of the substrate, and the first light-transmitting port and the second light-transmitting port are respectively extended along the radial direction.

9. The substrate processing apparatus as described in claim 8, wherein, The first light-transmitting opening also extends in a circumferential direction relative to the center portion of the substrate, and the first light-transmitting opening has a shape that intersects the radial direction along the circumferential direction.

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