Imaging lens assembly module and electronic device

Abstract

An imaging lens module defines an optical axis and includes an optical element. The optical element includes a light-shielding portion and an anti-reflective film. The light-shielding portion is opaque and is located closer to the optical axis than other parts of the optical element. The anti-reflective film is disposed at least on the surface of the light-shielding portion and includes a nanostructure layer and at least one interlayer. The nanostructure layer has a plurality of non-directionally extending ridges, with a bottom of each ridge closer to the optical element than a top, and each ridge tapers from bottom to top. The interlayer is disposed between the nanostructure layer and the optical element. The nanostructure layer is primarily composed of aluminum oxide and further includes a metal dopant, which is distributed at least within one interior of each ridge. This provides excellent low reflectivity performance.

Description

Technical Field

[0001] This disclosure relates to an imaging lens module, and more particularly to an imaging lens module used in portable electronic devices. Prior Technology

[0002] In recent years, portable electronic devices have developed rapidly, such as smart devices and tablets, which have become ubiquitous in modern life. As a result, imaging lens modules mounted on these devices have also flourished. However, with the advancement of technology, users have increasingly higher demands for the quality of imaging lens modules. Therefore, developing an imaging lens module that provides excellent low reflectivity while maintaining the anti-reflective properties of the anti-reflective film has become an important and urgent problem for the industry. Summary of the Invention

[0003] This disclosure provides an imaging lens module and electronic device that, through ridge protrusions and nanostructure layers, can provide excellent low reflectivity performance and reduce the impact of environmental changes on the film structure, while maintaining the anti-reflective properties of the anti-reflective film.

[0004] According to one embodiment of this disclosure, an imaging lens module is provided, defining an optical axis and including an optical element. The optical element includes a light-shielding portion and an anti-reflective film. The light-shielding portion is opaque and is closer to the optical axis than other parts of the optical element. The anti-reflective film is disposed at least on the surface of the light-shielding portion and includes a nanostructure layer and at least one interlayer. The nanostructure layer has a plurality of non-directionally extending ridges, with a bottom of each ridge closer to the optical element than a top, and each ridge tapers from bottom to top. The average structural height of the ridges is greater than 108 nm and less than 368 nm. The interlayer is disposed between the nanostructure layer and the optical element. The main component of the nanostructure layer is aluminum oxide, and the nanostructure layer further includes a metal dopant. The metal dopant is distributed at least within one of the ridges, and the metal dopant includes at least one of titanium, vanadium, chromium, titanium oxide, vanadium oxide, and chromium oxide.

[0005] According to the imaging lens module of the embodiment described above, the shortest distance between the light-shielding part and the optical axis is DO, which can satisfy the following conditions: 0.01 mm ≤ DO ≤ 6.8 mm.

[0006] According to the imaging lens module of the embodiment described above, the light-shielding part may include an object-side side, an image-side side, and a connecting surface. The object-side side is located near the object-side direction of the imaging lens module. The image-side side is disposed opposite to the object-side side. The connecting surface connects the object-side side and the image-side side. The connecting surface is closer to the optical axis than the object-side side and the image-side side, and an anti-reflective film is at least disposed on the connecting surface.

[0007] According to the imaging lens module of the embodiment described above, the range of the anti-reflective film can be further extended to the object side or the image side.

[0008] According to the imaging lens module of the embodiment described above, the light-shielding part may include a first end face and a second end face. The first end face is obliquely disposed relative to the optical axis. The second end face is connected to the first end face, and a turning angle is formed between the first end face and the second end face. The turning angle is closer to the optical axis than the first end face and the second end face, and an anti-reflective film is disposed at least at the turning angle, and the angle of the turning angle is θC, which can satisfy the following condition: 9 degrees < θC < 162 degrees.

[0009] According to the imaging lens module of the embodiment described above, the range of the anti-reflective film can be further extended to the first end face and the second end face.

[0010] In the imaging lens module according to the embodiments described above, the main component of the intermediate layer may be silicon oxide.

[0011] In the imaging lens module according to the embodiments described above, the main components of the intermediate layer may be the same as some of the components that make up the nanostructure layer.

[0012] According to the imaging lens module of the embodiment described above, the metal dopants may be further distributed on one surface of each ridge protrusion.

[0013] According to the imaging lens module of the embodiment described above, the metal dopants distributed inside the ridge protrusions can be tapered away from the optical elements.

[0014] According to the imaging lens module of the embodiment described above, the coverage thickness of the metal dopant on the surface of each ridge protrusion is TM, which can satisfy the following condition: 1 nm ≤ TM ≤ 40 nm. Additionally, it can satisfy the following condition: 1 nm ≤ TM ≤ 30 nm.

[0015] In the imaging lens module according to the embodiments described above, the metal dopant may be titanium or titanium oxide.

[0016] According to the imaging lens module of the embodiment described above, the anti-reflective film may further include a dark layer disposed between the intermediary layer and the optical element, for giving the optical element a dark appearance.

[0017] According to one embodiment of the present disclosure, an electronic device is provided, comprising an imaging lens module as described in the foregoing embodiments. Simple Explanation of the Diagram

[0018] Figure 1A shows a perspective view of the imaging lens module according to the first embodiment of this disclosure; Figure 1B illustrates a schematic diagram of the imaging lens module according to the first embodiment of Figure 1A; Figure 1C shows a perspective view of the optical element according to the first embodiment of Figure 1A; Figure 1D shows a partial enlarged view of the optical element according to the first embodiment of Figure 1C; Figure 1E illustrates a schematic diagram of the anti-reflective film and the light-shielding portion according to the first embodiment of Figure 1A; Figure 1F shows a TEM cross-sectional view of the anti-reflective film and the light-shielding portion in the first embodiment according to Figure 1E; Figure 1G shows an image of the aluminum element in the antireflective film according to the first embodiment of Figure 1F; Figure 1H illustrates a silicon element image of the antireflective film according to the first embodiment of Figure 1F; Figure 1I shows a titanium element image of the antireflective film according to the first embodiment in Figure 1F; Figure 2A shows a perspective view of the imaging lens module according to the second embodiment of this disclosure; Figure 2B shows an exploded view of the imaging lens module according to the second embodiment of Figure 2A; Figure 2C illustrates a schematic diagram of the imaging lens module according to the second embodiment of Figure 2A; Figure 2D shows a perspective view of the optical element according to the second embodiment of Figure 2A; Figure 2E shows a partial enlarged view of the optical element according to the second embodiment of Figure 2D; Figure 2F shows a perspective view of the optical element according to the second embodiment of Figure 2A; Figure 2G illustrates a partial schematic diagram of the optical elements according to the second embodiment of Figure 2F; Figure 3A shows an exploded view of the imaging lens module according to the third embodiment of this disclosure; Figure 3B illustrates a schematic diagram of the imaging lens module according to the third embodiment of Figure 3A; Figure 3C shows a perspective view of the optical element and the reflective element according to the third embodiment of Figure 3A; Figure 3D illustrates a schematic diagram of the combination of optical and reflective elements according to the third embodiment of Figure 3A; Figure 3E illustrates a schematic diagram of the optical elements according to the third embodiment of Figure 3A; Figure 3F shows a perspective view of the optical element according to the third embodiment of Figure 3A; Figure 3G illustrates another perspective view of the optical element according to the third embodiment of Figure 3A; Figure 3H illustrates a schematic diagram of the optical elements according to the third embodiment of Figure 3F; Figure 4A shows a perspective view of the imaging lens module according to the fourth embodiment of this disclosure; Figure 4B shows an exploded view of the imaging lens module according to the fourth embodiment of Figure 4A; Figure 4C illustrates a schematic diagram of the imaging lens module according to the fourth embodiment of Figure 4A; Figure 4D shows a perspective view of the optical element according to the fourth embodiment of Figure 4A; Figure 4E illustrates a schematic diagram of the optical elements according to the fourth embodiment of Figure 4D; Figure 4F shows a schematic diagram of the anti-reflective film and the light-shielding part according to the fourth embodiment of Figure 4D; Figure 4G illustrates a perspective view of the optical element according to the fourth embodiment of Figure 4A; Figure 4H illustrates a schematic diagram of the optical elements according to the fourth embodiment of Figure 4G; Figure 5A illustrates a schematic diagram of the imaging lens module according to the fifth embodiment of this disclosure; Figure 5B shows a perspective view of the optical element according to the fifth embodiment of Figure 5A; Figure 5C illustrates a schematic diagram of the optical element according to the fifth embodiment of Figure 5A; Figure 6A illustrates a schematic diagram of the imaging lens module according to the sixth embodiment of this disclosure; Figure 6B shows a perspective view of the optical element according to the sixth embodiment of Figure 6A; Figure 6C illustrates a schematic diagram of the optical element according to the sixth embodiment of Figure 6A; Figure 7A illustrates a schematic diagram of the imaging lens module according to the seventh embodiment of this disclosure; Figure 7B shows a perspective view of the optical elements and lens elements according to the seventh embodiment of Figure 7A; Figure 7C shows a partial cross-sectional view of the optical element and lens element according to the seventh embodiment of Figure 7B; Figure 7D illustrates a schematic diagram of the optical elements and lens elements according to the seventh embodiment of Figure 7A; Figure 8A illustrates a schematic diagram of an electronic device according to the eighth embodiment of this disclosure; Figure 8B illustrates another schematic diagram of an electronic device according to the eighth embodiment of Figure 8A; Figure 8C illustrates a schematic diagram of an image captured by an electronic device according to the eighth embodiment of Figure 8A; Figure 8D illustrates another image captured by the electronic device according to the eighth embodiment of Figure 8A; Figure 8E illustrates another image captured by the electronic device according to the eighth embodiment of Figure 8A; Figure 9 illustrates a schematic diagram of an electronic device according to a ninth embodiment of this disclosure; Figure 10A illustrates a schematic diagram of an imaging lens module according to the tenth embodiment of this disclosure applied to a vehicle; Figure 10B illustrates a schematic diagram of the imaging lens module configured in a vehicle according to the tenth embodiment of Figure 10A; and Figure 10C illustrates another schematic diagram of the imaging lens module configured in a vehicle according to the tenth embodiment of Figure 10A. Implementation

[0019] This disclosure provides an imaging lens module defining an optical axis and including an optical element. The optical element includes a light-shielding portion and an anti-reflective film. The light-shielding portion is opaque and is closer to the optical axis than other parts of the optical element. The anti-reflective film is disposed at least on the surface of the light-shielding portion and includes a nanostructure layer and at least one interlayer. The nanostructure layer has a plurality of non-directionally extending ridges, with a bottom of each ridge closer to the optical element than a top. Each ridge tapers from bottom to top, and the average height of the ridge is greater than 108 nm and less than 368 nm. The interlayer is disposed between the nanostructure layer and the optical element. The nanostructure layer is primarily composed of aluminum oxide and further includes a metal dopant, wherein the metal dopant is at least distributed within the interior of each ridge. The metal dopant includes at least one of titanium, vanadium, chromium, titanium oxide, vanadium oxide, and chromium oxide, and the primary component may refer to the component with the highest weight percentage.

[0020] The ridge-like protrusions help create a gradient refractive index, providing excellent low reflectivity for different wavelengths of light and different incident angles. Furthermore, since stray light easily generates in the light-shielding areas near the optical axis, the addition of an anti-reflective film helps improve image quality. The presence of metal dopants in the nanostructure layer helps improve its tolerance to environmental changes, thereby reducing the impact of environmental variations on the film structure while maintaining the anti-reflective properties of the film.

[0021] Furthermore, the metal dopants can also be selected from tantalum, zirconium, niobium, tantalum oxide, zirconium oxide, niobium oxide, and environmental changes can be temperature, humidity, or other chemical interferences, and are not limited to these.

[0022] Furthermore, the height of a ridge can be the vertical distance from the absolute bottom (foot portion) of the ridge to the top (summit portion) of the ridge when viewed in cross-section (destructive measurement). The heights of individual ridges may vary, and at least three or more ridges can be used to calculate the average height of the structure, with priority given to ridges whose outlines can be discerned.

[0023] Metal dopants can be detected using X-ray energy-dispersive X-ray spectroscopy (EDS) with a transmission electron microscope (TEM) or a scanning electron microscope (SEM). Regardless of whether the metal dopant exists in the form of a metal element or an oxide, the distribution of the metal element is the primary basis for judgment.

[0024] In detail, the steps and conditions for TEM and EDS analysis are as follows: (1) Deposit a 10 nm to 20 nm conductive layer for SEM observation and to find the measurement location. The conductive layer can be platinum (Pt). (2) Perform focused ion beam microscopy (FIB) sectioning with a thickness of about 50 nm to 100 nm. (3) Take a sample with a probe and place the sample on a copper grid. Then perform EDS detection with TEM. (4) The type of transmission electron microscope is a field emission transmission electron microscope (FE-TEM). Its accelerating voltage is 200 KeV. The sampling time for EDS is 400 seconds, and the corresponding energy intensity is given according to the material of the structure.

[0025] The surface of optical components can be roughened, such as by sandblasting or laser treatment, to scatter stray light. The surface of the nanostructure layer can have multiple pores, which allow for a more linear change in the equivalent refractive index of the nanostructure layer. There are no other components obstructing the light-shielding part between it and the optical axis.

[0026] The light-shielding part may include an object side, an image side, and a connecting surface, wherein the object side is close to the object side direction of the imaging lens module, the image side is disposed opposite to the object side, the connecting surface connects the object side and the image side, the connecting surface is closer to the optical axis than the object side and the image side, and an anti-reflective film is disposed at least on the connecting surface.

[0027] The anti-reflective film can be further extended to the object side or image side. This further suppresses stray light in the object side or image side direction.

[0028] The light-shielding portion may further include a first end face and a second end face, wherein the first end face is offset relative to the optical axis, the second end face is connected to the first end face, and a turning angle is formed between the first end face and the second end face. The turning angle is closer to the optical axis than the first end face and the second end face, and an anti-reflective film is disposed at least at the turning angle, and the angle of the turning angle is θC, which can satisfy the following conditions: 9 degrees < θC < 162 degrees. The offset of the first end face from the optical axis helps to change the reflection path of stray light, thereby avoiding stray light from affecting image quality. The turning angle can reduce the probability of stray light reflection, and the extension of the anti-reflective film to the turning angle can further reduce stray light reflection. The turning angle is closer to the optical axis, making it easier to reflect stray light. In detail, the turning angle can be a chamfer, rounded corner, or edge, etc., connecting the two end faces.

[0029] The application range of the anti-reflective film can be further extended to the first end face and the second end face.

[0030] The primary component of the interposer can be silicon oxide. This helps improve the stability of the connection between the antireflective film and the optical element. Furthermore, the number of interposers can be multiple to form a multilayer structure, which, through the alternating stacking of high- and low-refractive-index films, can form a thin-film interference structure, thereby helping to reduce reflectivity.

[0031] The main components of the intermediate layer can be the same as some of the components that make up the nanostructure layers. This facilitates the connection of the nanostructure layers. Specifically, the aforementioned identical components can be aluminum, titanium, vanadium, chromium, aluminum oxide, titanium oxide, vanadium oxide, or chromium oxide.

[0032] Metal dopants can be further distributed on one surface of each ridge protrusion. This helps protect the ridge protrusions, preventing them from changing their structure due to environmental changes, thereby maintaining their anti-reflective properties. Furthermore, the metal dopants distributed on the surface of the ridge protrusions and the metal dopants distributed inside the ridge protrusions can be of the same composition or different compositions.

[0033] The metallic dopants distributed within the ridge-like protrusions taper away from the optical elements. This helps to adjust the internal equivalent refractive index, allowing the ridge-like protrusions to improve weather resistance while maintaining anti-reflective properties.

[0034] The metal dopant can be titanium or titanium oxide. Specifically, using titanium as the metal dopant helps to make the antireflective film more stable.

[0035] The anti-reflective film may further include a dark layer disposed between the interlayer and the optical element to give the optical element a dark appearance. This alters the appearance color of the optical element, aiding in light absorption. Furthermore, the dark layer may be a black ink spraying layer formed from epoxy resin-based quick-drying ink, a blackened coating layer formed by chemical vapor deposition, a photoresistive coating layer, or other dark coatings with light-absorbing properties.

[0036] The shortest distance between the light-shielding part and the optical axis is DO, which satisfies the following condition: 0.01 mm ≤ DO ≤ 6.8 mm. This helps to control stray light around the optical axis. Additionally, it satisfies the following condition: 0.5 mm ≤ DO ≤ 5.2 mm.

[0037] The thickness of the metal dopant covering the surface of each ridge protrusion is TM, which must satisfy the following condition: 1 nm ≤ TM ≤ 40 nm. By using appropriate thickness conditions, the morphological structure of the ridge protrusions can be preserved while improving their weather resistance. Specifically, the coverage thickness can be calculated by taking thickness values ​​from multiple points and then averaging the thickness. Furthermore, it must satisfy the following condition: 1 nm ≤ TM ≤ 30 nm.

[0038] The various technical features in the imaging lens module disclosed above can be combined and configured to achieve corresponding effects.

[0039] This disclosure provides an electronic device comprising the aforementioned imaging lens module.

[0040] Based on the above implementation methods, specific embodiments are presented below and described in detail with reference to the accompanying drawings.

[0041] <First Embodiment>

[0042] Please refer to Figures 1A and 1B, where Figure 1A shows a perspective view of the imaging lens module 100 according to the first embodiment of this disclosure, and Figure 1B shows a schematic diagram of the imaging lens module 100 according to Figure 1A. As shown in Figures 1A and 1B, the imaging lens module 100 defines an optical axis X and includes an optical element 110, a lens element 141, and an electronic photosensitive element 142. The optical element 110 is a lens barrel used to house the lens element 141, and the electronic photosensitive element 142 is disposed on an imaging surface IMG of the imaging lens module 100. Specifically, the surface of the optical element 110 can be roughened, such as by sandblasting or laser treatment, to scatter stray light.

[0043] Please refer to Figures 1C to 1E, where Figure 1C shows a perspective view of the optical element 110 according to the first embodiment of Figure 1A, Figure 1D shows a partially enlarged view of the optical element 110 according to the first embodiment of Figure 1C, and Figure 1E shows a schematic diagram of the anti-reflective film 130 and the light-shielding portion 120 according to the first embodiment of Figure 1A. As shown in Figures 1A and 1C to 1E, the optical element 110 includes a light-shielding portion 120 and an anti-reflective film 130. The light-shielding portion 120 is opaque and is located closer to the optical axis X than other parts of the optical element 110. The anti-reflective film 130 is at least disposed on the surface of the light-shielding portion 120, and the anti-reflective film 130 includes a nanostructure layer 131 and at least one interlayer 133, wherein the interlayer 133 is disposed between the nanostructure layer 131 and the optical element 110. The nanostructure layer 131 has a plurality of non-directionally extending ridge protrusions 132, with one bottom of each ridge protrusion 132 being closer to the optical element 110 than one top, and each ridge protrusion 132 tapering from bottom to top.

[0044] The ridge-like protrusions 132 help to form a gradient refractive index, providing excellent low reflectivity performance for different wavelengths of light and different incident angles of light. Furthermore, since the light-shielding part 120 near the optical axis X is prone to generating stray light, the anti-reflective film 130 helps to improve image quality.

[0045] Furthermore, the surface of the nanostructure layer 131 may have multiple pores, through which the equivalent refractive index change of the nanostructure layer 131 can be made more linear.

[0046] It must be noted that the dotted mesh bottom of the ridge protrusion 132 in Figure 1E represents the area of ​​the metal dopant 134.

[0047] Please refer to Figures 1F to 1I, where Figure 1F shows a TEM cross-sectional view of the antireflective film 130 and the light-shielding portion 120 in the first embodiment according to Figure 1E, Figure 1G shows an aluminum elemental image of the antireflective film 130 in the first embodiment according to Figure 1F, Figure 1H shows a silicon elemental image of the antireflective film 130 in the first embodiment according to Figure 1F, and Figure 1I shows a titanium elemental image of the antireflective film 130 in the first embodiment according to Figure 1F. As can be seen from Figures 1F to 1I, the main component of the nanostructure layer 131 is aluminum oxide, and the nanostructure layer 131 further contains a metal dopant 134, and the metal dopant 134 is at least distributed in one interior of each ridge protrusion 132, wherein the metal dopant 134 is titanium oxide (TiO2) to help make the antireflective film 130 more stable, and the main component refers to the component with the highest weight percentage.

[0048] The presence of metal dopants 134 in the composition of the nanostructure layer 131 helps to improve the tolerance of the nanostructure layer 131 to environmental changes, thereby reducing the impact of environmental changes on the film structure and maintaining the anti-reflective properties of the anti-reflective film 130. Furthermore, environmental changes can be temperature, humidity, or other chemical disturbances, and are not limited to these.

[0049] As shown in Figure 1D, the light-shielding portion 120 may include a first end face 121 and a second end face 122, wherein the first end face 121 is offset relative to the optical axis X, the second end face 122 is connected to the first end face 121, and a turning angle 123 is formed between the first end face 121 and the second end face 122. The offset of the first end face 121 relative to the optical axis X helps to change the reflection path of stray light, thereby avoiding stray light from affecting the image quality.

[0050] The turning angle 123 is closer to the optical axis X than the first end face 121 and the second end face 122, and the anti-reflective film 130 is disposed at least at the turning angle 123, wherein the turning angle 123 is an angle, and the disposed range of the anti-reflective film 130 can be further extended to the first end face 121 and the second end face 122. The turning angle 123 can reduce the probability of stray light reflection, and the extension of the anti-reflective film 130 to the turning angle 123 can further reduce stray light reflection. Furthermore, the turning angle 123 is closer to the optical axis X, making it easier to reflect stray light.

[0051] As shown in Figure 1H, the main component of the interposer 133 can be silicon oxide (SiO2). This helps to improve the connection stability between the antireflective film 130 and the optical element 110. Furthermore, the number of interposers 133 can also be multiple to form a multilayer structure, which, through the alternating stacking of high and low refractive index films, can form a thin-film interference structure, thereby helping to reduce reflectivity.

[0052] As shown in Figures 1E, 1F, and 1I, the metal dopant 134 can be further distributed on one surface of each ridge protrusion 132. This helps protect the ridge protrusion 132, preventing its structure from changing due to environmental variations, thereby maintaining its anti-reflective properties. Furthermore, the metal dopant 134 distributed on the surface of the ridge protrusion 132 and the metal dopant 134 distributed inside the ridge protrusion 132 can have the same composition or different compositions.

[0053] The metal dopants 134 distributed inside the ridge protrusions 132 can taper away from the optical element 110. This helps to adjust the internal equivalent refractive index, so that the ridge protrusions 132 can improve weather resistance while maintaining anti-reflective properties.

[0054] As shown in Figures 1D and 1F, the shortest distance between the light-shielding part 120 and the optical axis X is DO, the angle of the turning angle 123 is θC, the coverage thickness of the metal dopant 134 on the surface of each ridge protrusion 132 is TM, the vertical height of one of the ridge protrusions 132 is H, and the thickness of the interlayer 133 is HI. The parameters satisfy the conditions in Table 1 below. Table 1. First Embodiment DO (mm) 3.26 H (nm) 240.1 θC (degrees) 70 HI (nm) 96.1 TM (nm) 18.4

[0055] In detail, the average structural height of the ridge protrusions 132 is greater than 108 nm and less than 368 nm, and the height of one of the ridge protrusions 132 can be the vertical height from the absolute bottom (foot portion) of the ridge protrusion 132 to the top (summit portion) of the ridge protrusion 132 when viewed in cross-section (destructive measurement). Furthermore, the heights of the individual ridge protrusions 132 may vary, and at least three or more ridge protrusions 132 can be used to calculate the average structural height, with priority given to ridge protrusions 132 whose outlines can be discerned.

[0056] It must be noted that the structural distribution of the antireflective film 130 and the light-shielding portion 120 in Figures 1G to 1I corresponds to the structural distribution in Figure 1F. The metal dopant 134 can be detected using EDS analysis with TEM or SEM. Regardless of whether the metal dopant 134 exists as a metal element or an oxide, the distribution of the metal element is the primary criterion for judgment. Furthermore, Figure 1I can be used to analyze the distribution of the metal dopant 134 within the nanostructure layer 131.

[0057] <Second Embodiment>

[0058] Please refer to Figures 2A to 2C, where Figure 2A shows a perspective view of the imaging lens module 200 according to the second embodiment of this disclosure, Figure 2B shows an exploded view of the imaging lens module 200 according to Figure 2A in the second embodiment, and Figure 2C shows a schematic diagram of the imaging lens module 200 according to Figure 2A in the second embodiment. As shown in Figures 2A to 2C, the imaging lens module 200 defines an optical axis X and includes optical elements 211 and 212, an imaging lens 242, and an electronic photosensitive element 243. Optical element 211 is a variable aperture housing, and optical element 212 is a variable aperture blade. Optical elements 211 and 212 form a variable aperture module 241, which is disposed on the imaging lens 242, and the electronic photosensitive element 243 is disposed on an imaging surface IMG of the imaging lens module 200.

[0059] Please refer to Figures 2D and 2E, where Figure 2D shows a perspective view of the optical element 211 according to the second embodiment of Figure 2A, and Figure 2E shows a partially enlarged view of the optical element 212 according to the second embodiment of Figure 2D. As shown in Figures 2A, 2B, 2D, and 2E, the optical element 211 includes a light-shielding portion 220 and an anti-reflective film 230. The light-shielding portion 220 is opaque and is located closer to the optical axis X than other parts of the optical element 211. The anti-reflective film 230 is at least disposed on the surface of the light-shielding portion 220, and the anti-reflective film 230 includes a nanostructure layer and at least one interlayer, wherein the interlayer is disposed between the nanostructure layer and the optical element 211. The nanostructure layer has a plurality of non-directionally extending ridge-like protrusions, with one bottom of each ridge-like protrusion closer to the optical element 211 than one top, and each ridge-like protrusion tapering from bottom to top.

[0060] The main component of the nanostructure layer is aluminum oxide. The nanostructure layer further contains a metal dopant, which is distributed at least within each ridge-like protrusion. The metal dopant includes at least one of titanium, vanadium, chromium, titanium oxide, vanadium oxide, and chromium oxide. Further, the metal dopant may also be selected from tantalum, zirconium, niobium, tantalum oxide, zirconium oxide, and niobium oxide.

[0061] As shown in Figure 2E, the light-shielding portion 220 may include a first end face 221 and a second end face 222, wherein the first end face 221 is obliquely disposed relative to the optical axis X, the second end face 222 is connected to the first end face 221, and a turning angle 223 is formed between the first end face 221 and the second end face 222. Furthermore, the turning angle 223 is closer to the optical axis X than the first end face 221 and the second end face 222, and the anti-reflective film 230 is disposed at least at the turning angle 223, wherein the turning angle 223 is an angle, and the disposed range of the anti-reflective film 230 may further extend to the first end face 221 and the second end face 222.

[0062] Please refer to Figures 2F and 2G, where Figure 2F shows a perspective view of the optical element 212 according to the second embodiment of Figure 2A, and Figure 2G shows a partial schematic diagram of the optical element 212 according to the second embodiment of Figure 2F. As shown in Figures 2F and 2G, the optical element 212 includes a light-shielding portion and an anti-reflective film 230. The light-shielding portion may include an object-side surface 224, an image-side surface, and a connecting surface 226. The object-side surface 224 is closer to the object-side direction of the imaging lens module 200, the image-side surface is disposed opposite to the object-side surface 224, and the connecting surface 226 connects the object-side surface 224 and the image-side surface. Furthermore, the connecting surface 226 is closer to the optical axis X than the object-side surface 224 and the image-side surface, and the anti-reflective film 230 is only disposed on the connecting surface 226.

[0063] As shown in Figure 2C, there are no other components obstructing the optical elements 211 and 212 from the optical axis X.

[0064] As shown in Figure 2E, the shortest distance between the light-shielding part 220 and the optical axis X is DO, and the angle of the turning angle 223 is θC. The parameters satisfy the conditions in Table 2 below. Table 2, Second Embodiment DO (mm) 2.4 θC (degrees) 90

[0065] <Third Embodiment>

[0066] Please refer to Figures 3A and 3B, where Figure 3A shows an exploded view of the imaging lens module 300 according to the third embodiment of this disclosure, and Figure 3B shows a schematic diagram of the imaging lens module according to Figure 3A in the third embodiment. As shown in Figures 3A and 3B, the imaging lens module 300 defines an optical axis X and includes optical elements 311 and 312, a lens element 341, an assembly element 342, a reflective element 343, and an electronic photosensitive element 344. The optical element 311 is a lens barrel, and the optical element 312 is a light shield. The optical element 311 is used to house the lens element 341, the reflective element 343, and the optical element 312. The assembly element 342 is used to fix the reflective element 343, and the electronic photosensitive element 344 is disposed on an imaging surface IMG of the imaging lens module 300.

[0067] In detail, the optical axis X can be deflected in the imaging lens module 300 via the reflective element 343, and the deflected optical axis X is still defined as the same optical axis.

[0068] Please refer to Figures 3C to 3E, where Figure 3C shows a perspective view of the optical element 312 and the reflective element 343 according to the third embodiment of Figure 3A, Figure 3D shows a schematic diagram of the combination of the optical element 312 and the reflective element 343 according to the third embodiment of Figure 3A, and Figure 3E shows a schematic diagram of the optical element 312 according to the third embodiment of Figure 3A. As shown in Figures 3C to 3E, the optical element 312 includes a light-shielding portion 320a and an anti-reflective film 330. The light-shielding portion 320a is opaque and is located closer to the optical axis X than other parts of the optical element 312. The anti-reflective film 330 is at least disposed on the surface of the light-shielding portion 320a, and the anti-reflective film 330 includes a nanostructure layer and at least one interlayer, wherein the interlayer is disposed between the nanostructure layer and the optical element 312. The nanostructure layer has a plurality of non-directionally extending ridges, with one bottom of each ridge closer to the optical element 312 than one top, and each ridge tapers from bottom to top.

[0069] The main component of the nanostructure layer is aluminum oxide. The nanostructure layer also contains a metal dopant, and the metal dopant is distributed at least inside each ridge protrusion. The metal dopant includes at least one of titanium, vanadium, chromium, titanium oxide, vanadium oxide, and chromium oxide.

[0070] As shown in Figure 3D, the light-shielding portion 320a may include an object-side surface 324, an image-side surface 325, and a connecting surface 326. The object-side surface 324 is close to the object-side direction of the imaging lens module 300, the image-side surface 325 is disposed opposite to the object-side surface 324, and the connecting surface 326 connects the object-side surface 324 and the image-side surface 325. Furthermore, an anti-reflective film 330 is disposed at least on the connecting surface 326. Moreover, the anti-reflective film 330 may extend further to the object-side surface 324 to further suppress stray light in the object-side direction.

[0071] As can be seen from Figures 3C and 3E, the optical element 312 may further include an adhesive G, wherein the adhesive G is disposed on the object side 324, and the optical element 312 can be fixed to the reflective element 343 by means of the adhesive G.

[0072] Please refer to Figures 3F to 3H, where Figure 3F shows a perspective view of the optical element 311 according to the third embodiment of Figure 3A, Figure 3G shows another perspective view of the optical element 311 according to the third embodiment of Figure 3A, and Figure 3H shows a schematic diagram of the optical element 311 according to the third embodiment of Figure 3F. As can be seen from Figures 3F to 3H, the optical element 311 includes a light-shielding portion 320b and an anti-reflective film 330, and the light-shielding portion 320b may include a first end face 321 and a second end face 322, wherein the first end face 321 is obliquely disposed relative to the optical axis X, the second end face 322 is connected to the first end face 321, and a turning angle 323 is formed between the first end face 321 and the second end face 322. Furthermore, the turning angle 323 is closer to the optical axis X than the first end face 321 and the second end face 322, and the anti-reflective film 330 is at least disposed at the turning angle 323, wherein the turning angle 323 is an angle, and the disposed range of the anti-reflective film 330 can be further extended to the first end face 321 and the second end face 322.

[0073] As shown in Figures 3D and 3H, the shortest distance between the light-shielding parts 320a and 320b and the optical axis X is DO, and the angle of the turning angle 323 in the light-shielding part 320b is θC. The parameters satisfy the conditions in Table 3 below. Table 3, Third Embodiment DO (mm) (Light shielding part 320a) 0.05 θC (degrees) 45 DO (mm) (Light-shielding section 320b) 0.77

[0074] <Fourth Embodiment>

[0075] Please refer to Figures 4A to 4C, where Figure 4A shows a perspective view of the imaging lens module 400 according to the fourth embodiment of this disclosure, Figure 4B shows an exploded view of the imaging lens module 400 according to Figure 4A in the fourth embodiment, and Figure 4C shows a schematic diagram of the imaging lens module 400 according to Figure 4A in the fourth embodiment. As can be seen from Figures 4A to 4C, the imaging lens module 400 defines an optical axis X and includes optical elements 411 and 412, a lens element 441, and a reflective element 442. The optical element 411 is a housing, and the optical element 412 is a retainer. The optical element 411 is used to house the optical element 412, the lens element 441, and the reflective element 442. The optical element 412 and the reflective element 442 are correspondingly arranged.

[0076] Please refer to Figures 4D to 4F, where Figure 4D shows a perspective view of the optical element 411 according to the fourth embodiment of Figure 4A, Figure 4E shows a schematic diagram of the optical element 411 according to the fourth embodiment of Figure 4D, and Figure 4F shows a schematic diagram of the anti-reflective film 430 and the light-shielding portion 420a according to the fourth embodiment of Figure 4D. As shown in Figures 4D to 4F, the optical element 411 includes a light-shielding portion 420a and an anti-reflective film 430. The light-shielding portion 420a is opaque and is located closer to the optical axis X than other parts of the optical element 411. The anti-reflective film 430 is at least disposed on the surface of the light-shielding portion 420a, and the anti-reflective film 430 includes a nanostructure layer 431 and at least one interlayer 433, wherein the interlayer 433 is disposed between the nanostructure layer 431 and the optical element 411. The nanostructure layer 431 has a plurality of non-directionally extending ridge protrusions 432, with one bottom of each ridge protrusion 432 being closer to the optical element 411 than one top, and each ridge protrusion 432 tapering from bottom to top.

[0077] The main component of the nanostructure layer 431 is aluminum oxide. The nanostructure layer 431 further contains a metal dopant 434, and the metal dopant 434 is distributed at least inside each of the ridge protrusions 432. The metal dopant 434 contains at least one of titanium, vanadium, chromium, titanium oxide, vanadium oxide, and chromium oxide.

[0078] In detail, the intermediate layer 433 is made of titanium oxide (TiO2), and the metal dopant 434 is made of chromium oxide (CrxOy). The main components of the intermediate layer 433 may be partially the same as those constituting the nanostructure layer 431, and these same components may be aluminum, titanium, vanadium, chromium, aluminum oxide, titanium oxide, vanadium oxide, or chromium oxide. This helps to improve the adhesion of the nanostructure layer 431.

[0079] As shown in Figures 4D and 4E, the light-shielding portion 420a may include an object-side surface 424a, an image-side surface 425a, and a connecting surface 426a. The object-side surface 424a is closer to the object-side direction of the imaging lens module 400, the image-side surface 425a is disposed opposite to the object-side surface 424a, and the connecting surface 426a connects the object-side surface 424a and the image-side surface 425a. Furthermore, the connecting surface 426a is closer to the optical axis X than the object-side surface 424a and the image-side surface 425a, and the anti-reflective film 430 is at least disposed on the connecting surface 426a. Further, the area where the anti-reflective film 430 is disposed may extend to both the object-side surface 424a and the image-side surface 425a.

[0080] As shown in Figure 4F, the anti-reflective film 430 may further include a dark layer 435, wherein the dark layer 435 is disposed between the interposer layer 433 and the optical element 411, and the dark layer 435 is used to give the optical element 411 a dark appearance. This alters the appearance color of the optical element 411, aiding in light absorption. Furthermore, the dark layer 435 may be a black ink layer formed from a quick-drying ink based on epoxy resin, a blackened coating layer formed by chemical vapor deposition, a photoresist ink layer, or other dark coatings with light-absorbing effects.

[0081] It must be noted that the optical element 411 is made of metal, and the dotted mesh bottom of the ridge protrusion 432 in Figure 4F is the area of ​​the metal dopant 434.

[0082] Please refer to Figures 4G and 4H, where Figure 4G shows a perspective view of the optical element 412 according to the fourth embodiment of Figure 4A, and Figure 4H shows a schematic diagram of the optical element 412 according to the fourth embodiment of Figure 4G. As shown in Figures 4G and 4H, the optical element 412 includes a light-shielding portion 420b and an anti-reflective film 430. The light-shielding portion 420b may include an object-side surface 424b, an image-side surface 425b, and a connecting surface 426b. The object-side surface 424b is closer to the object-side direction of the imaging lens module 400, the image-side surface 425b is disposed opposite to the object-side surface 424b, and the connecting surface 426b connects the object-side surface 424b and the image-side surface 425b. Furthermore, the connecting surface 426b is closer to the optical axis X than the object-side surface 424b and the image-side surface 425b, and the anti-reflective film 430 is at least disposed on the connecting surface 426b. Furthermore, the area where the anti-reflective film 430 is installed can be further extended to the image side 425b.

[0083] As shown in Figures 4E and 4H, the shortest distance between the light-shielding parts 420a and 420b and the optical axis X is DO, and the parameters satisfy the conditions in Table 4 below. Table 4, Fourth Embodiment DO (mm) (Light shielding part 420a) 2.72 DO (mm) (Light-shielding section 420b) 2.38

[0084] <Fifth Embodiment>

[0085] Please refer to Figure 5A, which illustrates a schematic diagram of the imaging lens module 500 according to the fifth embodiment of this disclosure. As shown in Figure 5A, the imaging lens module 500 defines an optical axis X and includes an optical element 510, a lens element 541, a lens barrel 542, and an electronic photosensitive element 543. The optical element 510 is a spacer element, the lens barrel 542 is used to house the optical element 510 and the lens element 541, and the electronic photosensitive element 543 is disposed on an imaging surface IMG of the imaging lens module 500.

[0086] Please refer to Figures 5B and 5C, where Figure 5B shows a perspective view of the optical element 510 according to the fifth embodiment of Figure 5A, and Figure 5C shows a schematic diagram of the optical element 510 according to the fifth embodiment of Figure 5A. As shown in Figures 5B and 5C, the optical element 510 includes a light-shielding portion 520 and an anti-reflective film 530. The light-shielding portion 520 is opaque and is located closer to the optical axis X than other parts of the optical element 510. The anti-reflective film 530 is at least disposed on the surface of the light-shielding portion 520, and the anti-reflective film 530 includes a nanostructure layer and at least one interlayer, wherein the interlayer is disposed between the nanostructure layer and the optical element 510. The nanostructure layer has a plurality of non-directionally extending ridge-like protrusions, with one bottom of each ridge-like protrusion closer to the optical element 510 than one top, and each ridge-like protrusion tapering from bottom to top.

[0087] The main component of the nanostructure layer is aluminum oxide. The nanostructure layer also contains a metal dopant, and the metal dopant is distributed at least inside each ridge protrusion. The metal dopant includes at least one of titanium, vanadium, chromium, titanium oxide, vanadium oxide, and chromium oxide.

[0088] The light-shielding portion 520 may include a first end face 521 and a second end face 522, wherein the first end face 521 is obliquely disposed relative to the optical axis X, the second end face 522 is connected to the first end face 521, and a turning angle 523 is formed between the first end face 521 and the second end face 522. Furthermore, the turning angle 523 is closer to the optical axis X than the first end face 521 and the second end face 522, and the anti-reflective film 530 is disposed at least at the turning angle 523, wherein the turning angle 523 is a combination of an edge and a rounded corner, and the disposed range of the anti-reflective film 530 may further extend to the first end face 521 and the second end face 522.

[0089] As shown in Figure 5C, the shortest distance between the light-shielding part 520 and the optical axis X is DO, and the angle of the turning angle 523 is θC. The parameters satisfy the conditions in Table 5 below. Table 5, Fifth Embodiment DO (mm) 1.55 θC (degrees) 60

[0090] <Sixth Embodiment>

[0091] Please refer to Figure 6A, which illustrates a schematic diagram of the imaging lens module 600 according to the sixth embodiment of this disclosure. As shown in Figure 6A, the imaging lens module 600 defines an optical axis X and includes an optical element 610, a lens element 641, a lens barrel 642, and an electronic photosensitive element 643. The optical element 610 is a light shield, the lens barrel 642 is used to house the optical element 610 and the lens element 641, and the electronic photosensitive element 643 is disposed on an imaging surface IMG of the imaging lens module 600.

[0092] Please refer to Figures 6B and 6C, where Figure 6B shows a perspective view of the optical element 610 according to the sixth embodiment of Figure 6A, and Figure 6C shows a schematic diagram of the optical element 610 according to the sixth embodiment of Figure 6A. As shown in Figures 6B and 6C, the optical element 610 includes a light-shielding portion 620 and an anti-reflective film 630. The light-shielding portion 620 is opaque and is located closer to the optical axis X than other parts of the optical element 610. The anti-reflective film 630 is at least disposed on the surface of the light-shielding portion 620, and the anti-reflective film 630 includes a nanostructure layer and at least one interlayer, wherein the interlayer is disposed between the nanostructure layer and the optical element 610. The nanostructure layer has a plurality of non-directionally extending ridge-like protrusions, with one bottom of each ridge-like protrusion closer to the optical element 610 than one top, and each ridge-like protrusion tapering from bottom to top.

[0093] The main component of the nanostructure layer is aluminum oxide. The nanostructure layer also contains a metal dopant, and the metal dopant is distributed at least inside each ridge protrusion. The metal dopant includes at least one of titanium, vanadium, chromium, titanium oxide, vanadium oxide, and chromium oxide.

[0094] The light-shielding portion 620 may include an object-side surface 624, an image-side surface 625, and a connecting surface 626. The object-side surface 624 is closer to the object-side direction of the imaging lens module 600, the image-side surface 625 is disposed opposite to the object-side surface 624, and the connecting surface 626 connects the object-side surface 624 and the image-side surface 625. Furthermore, the connecting surface 626 is closer to the optical axis X than the object-side surface 624 and the image-side surface 625, and an anti-reflective film 630 is disposed at least on the connecting surface 626. Further, the anti-reflective film 630 may extend to the object-side surface 624.

[0095] In detail, the connecting surface 626 of the light-shielding part 620 can be further processed to make the connecting surface 626 uneven, so as to avoid the connecting surface 626 reflecting stray light.

[0096] As shown in Figure 6C, the shortest distance between the light-shielding part 620 and the optical axis X is DO, and the parameters satisfy the conditions in Table 6 below. Table 6, Sixth Embodiment DO (mm) 2.82

[0097] <Seventh Embodiment>

[0098] Please refer to Figure 7A, which illustrates a schematic diagram of the imaging lens module 700 according to the seventh embodiment of this disclosure. As shown in Figure 7A, the imaging lens module 700 defines an optical axis X and includes an optical element 710, lens elements 741 and 742, a lens barrel 743, and an electronic photosensitive element 744. The optical element 710 is a spacer element, the lens barrel 743 is used to house the optical element 710 and lens elements 741 and 742, and the electronic photosensitive element 744 is disposed on an imaging surface IMG of the imaging lens module 700.

[0099] Please refer to Figures 7B to 7D, where Figure 7B shows a perspective view of the optical element 710 and lens element 742 according to the seventh embodiment of Figure 7A, Figure 7C shows a partial cross-sectional view of the optical element 710 and lens element 742 according to the seventh embodiment of Figure 7B, and Figure 7D shows a schematic diagram of the optical element 710 and lens element 742 according to the seventh embodiment of Figure 7A. As can be seen from Figures 7A to 7D, the lens element 742 can be combined with the optical element 710 by embedding and ejecting to form a molded glass lens.

[0100] As shown in Figures 7B to 7D, the optical element 710 includes a light-shielding portion 720 and an anti-reflective film 730. The light-shielding portion 720 is opaque and is closer to the optical axis X than other parts of the optical element 710. The anti-reflective film 730 is disposed at least on the surface of the light-shielding portion 720, and the anti-reflective film 730 includes a nanostructure layer and at least one interposer layer, wherein the interposer layer is disposed between the nanostructure layer and the optical element 710. The nanostructure layer has a plurality of non-directionally extending ridge-like protrusions, with one bottom of each ridge-like protrusion closer to the optical element 710 than one top, and each ridge-like protrusion tapering from the bottom to the top.

[0101] The main component of the nanostructure layer is aluminum oxide. The nanostructure layer also contains a metal dopant, and the metal dopant is distributed at least inside each ridge protrusion. The metal dopant includes at least one of titanium, vanadium, chromium, titanium oxide, vanadium oxide, and chromium oxide.

[0102] As shown in Figure 7B, the anti-reflective film 730 can be further extended to the lens element 742.

[0103] As shown in Figure 7D, the shortest distance between the light-shielding part 720 and the optical axis X is DO, and the parameters satisfy the conditions in Table 7 below. Table 7, Seventh Embodiment DO (mm) 0.94

[0104] <Eighth Embodiment>

[0105] Please refer to Figures 8A and 8B, where Figure 8A illustrates a schematic diagram of an electronic device 80 according to the eighth embodiment of this disclosure, and Figure 8B illustrates another schematic diagram of the electronic device 80 according to Figure 8A. As shown in Figures 8A and 8B, the electronic device 80 is a smartphone, and includes a user interface 821 and an imaging lens module. More specifically, the imaging lens module is an ultra-wide-angle imaging lens module 822, a high-resolution imaging lens module 823, and telephoto imaging lens modules 824 and 825, and the user interface 821 is a touchscreen, but is not limited thereto. Specifically, the ultra-wide-angle imaging lens module 822 can be the imaging lens module 100 in the first embodiment, the high-pixel imaging lens module 823 can be the imaging lens module 200 in the second embodiment, the telephoto imaging lens module 824 can be the imaging lens module 300 in the third embodiment, and the telephoto imaging lens module 825 can be the imaging lens module 400 in the fourth embodiment, but the content of this disclosure is not limited thereto.

[0106] The user interface 821 has a touch function, and the user can enter the shooting mode through the user interface 821. The user interface 821 is used to display the screen and can be used to manually adjust the shooting angle to switch between different imaging lens modules. At this time, the imaging lens module gathers the imaging light onto an electronic photosensitive element and outputs the relevant electronic signal of the image to the image signal processing element (ISP) 826.

[0107] As shown in Figure 8B, depending on the camera specifications of the electronic device 80, the electronic device 80 may further include an optical image stabilization component (not shown). Furthermore, the electronic device 80 may further include at least one focus assist module (not shown) and at least one sensing element (not shown). The focus assist module may be a color temperature-compensating flash module, an infrared rangefinder, a laser focus module, etc. The sensing element may have the function of sensing physical momentum and kinetic energy, such as an accelerometer, gyroscope, or Hall effect element, to sense the shaking and tremors caused by the user's hand or the external environment. This facilitates the autofocus function of the imaging lens module and the performance of the optical image stabilization component in the electronic device 80, resulting in good image quality. This helps the electronic device 80 according to this disclosure to have multiple shooting modes, such as optimized self-timer, low-light HDR (High Dynamic Range) imaging, and high-resolution 4K video recording. In addition, users can directly view the camera's shooting screen through the user interface 821 and manually operate the framing range on the user interface 821 to achieve the WYSIWYG autofocus function.

[0108] Furthermore, the imaging lens module, optical image stabilization component, sensing element, and focus assist module can be mounted on a flexible printed circuit board (FPC) (not shown), and electrically connected to the imaging signal processing element 826 and other related components via a connector (not shown) to execute the shooting process. Current electronic devices, such as smartphones, are trending towards thinner and lighter designs. By mounting the imaging lens module and related components on a flexible printed circuit board and then using a connector to integrate the circuitry onto the mainboard of the electronic device, the design and circuit layout requirements within the limited internal space of the electronic device can be met, providing greater flexibility. This also allows for more flexible control of the autofocus function of the imaging lens module via the touchscreen of the electronic device. In the eighth embodiment, the electronic device 80 may include multiple sensing elements and multiple focus assist modules. The sensing elements and focus assist modules are mounted on a flexible printed circuit board and at least one other flexible printed circuit board (not shown), and electrically connected to the imaging signal processing element 826 and other related components via corresponding connectors to execute the shooting process. In other embodiments (not shown), the sensing element and auxiliary optical element may also be mounted on the motherboard of the electronic device or other types of carrier boards, depending on the mechanical design and circuit layout requirements.

[0109] Furthermore, the electronic device 80 may further include, but is not limited to, a display unit, a control unit, a storage unit, a temporary storage unit (RAM), a read-only storage unit (ROM), or a combination thereof.

[0110] Figure 8C illustrates an image captured by the electronic device 80 according to the eighth embodiment of Figure 8A. As shown in Figure 8C, the ultra-wide-angle imaging lens module 822 can capture images of a larger area, thus having the function of accommodating more scenery.

[0111] Figure 8D illustrates another image captured by the electronic device 80 according to the eighth embodiment of Figure 8A. As can be seen from Figure 8D, the high-resolution imaging lens module 823 can capture images of a certain range with high resolution, and has the function of high resolution and low distortion.

[0112] Figure 8E illustrates another image captured by the electronic device 80 according to the eighth embodiment of Figure 8A. As can be seen from Figure 8E, the telephoto imaging lens modules 824 and 825 have a high magnification function, which can capture distant images and magnify them to a high degree.

[0113] As shown in Figures 8C to 8E, by using imaging lens modules with different focal lengths for framing and combining them with image processing technology, the electronic device 80 can achieve the function of zooming.

[0114] <Ninth Embodiment>

[0115] Please refer to Figure 9, which illustrates a schematic diagram of an electronic device 90 according to the ninth embodiment of this disclosure. As shown in Figure 9, the electronic device 90 is a smartphone, and the electronic device 90 includes an imaging lens module. More specifically, the imaging lens module is an ultra-wide-angle imaging lens module 921, 922, a wide-angle imaging lens module 923, 924, a telephoto imaging lens module 925, 926, 927, 928, and a TOF module (Time-Of-Flight) 929. The TOF module 929 may also be other types of imaging lens modules, and is not limited to this configuration.

[0116] Specifically, the ultra-wide-angle imaging lens module 921 can be the imaging lens module 100 in the first embodiment, the ultra-wide-angle imaging lens module 922 can be the imaging lens module 700 in the seventh embodiment, the wide-angle imaging lens module 923 can be the imaging lens module 200 in the second embodiment, the wide-angle imaging lens module 924 can be the imaging lens module 600 in the sixth embodiment, the telephoto imaging lens module 925 can be the imaging lens module 500 in the fifth embodiment, the telephoto imaging lens module 926 can be the imaging lens module 300 in the third embodiment, and the telephoto imaging lens module 927 can be the imaging lens module 400 in the fourth embodiment, but the content of this disclosure is not limited thereto.

[0117] Furthermore, telephoto imaging lens modules 927 and 928 are used to change the optical path, but the content of this disclosure is not limited to this.

[0118] Depending on the camera specifications of the electronic device 90, the electronic device 90 may further include an optical image stabilization component (not shown in the figure). Furthermore, the electronic device 90 may further include at least one focus assist module (not shown in the figure) and at least one sensing element (not shown in the figure). The focus assist module may be a color temperature compensated flash module 930, an infrared rangefinder, a laser focus module, etc. The sensing element may have the function of sensing physical momentum and kinetic energy, such as an accelerometer, gyroscope, or Hall effect element, to sense the shaking and tremors caused by the user's hand or the external environment. This facilitates the performance of the autofocus function and optical image stabilization component configured in the imaging lens module of the electronic device 90, resulting in good image quality. This helps the electronic device 90 according to this disclosure to have multiple shooting modes, such as optimized self-timer, low-light HDR (High Dynamic Range) imaging, and high-resolution 4K video recording.

[0119] Furthermore, the structure and configuration of the remaining components in the ninth embodiment are the same as those in the eighth embodiment, and will not be described again here.

[0120] <Tenth Embodiment>

[0121] Please refer to Figures 10A to 10C, where Figure 10A illustrates a schematic diagram of the imaging lens module 1010 applied to a vehicle 1000 according to the tenth embodiment of this disclosure, Figure 10B illustrates a schematic diagram of the imaging lens module 1010 disposed in a vehicle 1000 according to the tenth embodiment of Figure 10A, and Figure 10C illustrates another schematic diagram of the imaging lens module 1010 disposed in a vehicle 1000 according to the tenth embodiment of Figure 10A. As shown in Figures 10A to 10C, an electronic device (not shown) is applied to the vehicle 1000, and the electronic device includes the imaging lens module 1010. In the tenth embodiment, the number of imaging lens modules 1010 is six, the imaging lens modules 1010 are automotive imaging lens modules, and the imaging lens modules 1010 can be any of the imaging lens modules in the aforementioned first to seventh embodiments, but this disclosure is not limited thereto.

[0122] As shown in Figures 10A and 10B, the two imaging lens modules 1010 are located below the left and right rearview mirrors, respectively, and are used to capture image information at a viewing angle θ. Specifically, the viewing angle θ can satisfy the following condition: 40 degrees < θ < 90 degrees. Therefore, it is mainly used to capture image information within the range of the left and right side lanes.

[0123] As shown in Figures 10B and 10C, the other two imaging lens modules 1010 can be installed inside the vehicle 1000 to help the driver obtain information about the external space outside the cockpit, such as external space information I1, I2, I3, and I4, but are not limited thereto. Specifically, the two imaging lens modules 1010 are respectively installed near the rearview mirror and near the rear window. Furthermore, the imaging lens modules 1010 can also be installed on the non-mirror surfaces of the left and right rearview mirrors of the vehicle 1000, but are not limited thereto.

[0124] The imaging lens module 1010 can be positioned at the front and rear of the vehicle 1000, specifically below the left and right rearview mirrors. This provides a wider field of view, reducing blind spots and improving driving safety. Furthermore, positioning the imaging lens module 1010 around the vehicle 1000 helps identify road conditions outside the vehicle, facilitating the implementation of autonomous driving assistance functions.

[0125] Although the present invention has been disclosed above with reference to embodiments and examples, it is not intended to limit the present invention. Anyone skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

[0126] 100, 200, 300, 400, 500, 600, 700, 1010: Imaging lens module 110,211,212,311,312,411,412,510,610,710: Optical elements 120, 220, 320a, 320b, 420a, 420b, 520, 620, 720: Shading section 121,221,321,521: First end face 122,222,322,522: Second end face 123,223,323,523: Turning angle 130, 230, 330, 430, 530, 630, 730: Anti-reflective film 131,431: Nanostructure layer 132,432: Ridge-like protrusions 133,433: Intermediate layer 134,434: Metal dopant 141,341,441,541,641,741,742: Lens element 142,243,344,543,643,744: Electronic photosensitive element 224, 324, 424a, 424b, 624: Side view of the object 226, 326, 426a, 426b, 626: Connecting surfaces 241: Variable Aperture Module 242: Imaging Lens 325, 425a, 425b, 625: Image from the side 342: Assembly Components 343, 442: Reflective elements 435: Dark Layer 542, 642, 743: Lens tube 80, 90: Electronic devices 821: User Interface 822, 921, 922: Ultra-wide-angle imaging lens module 823: High-resolution imaging lens module 824, 825, 925, 926, 927, 928: Telephoto Imaging Lens Module 826: Imaging signal processing element 923, 924: Wide-angle imaging lens module 929: TOF Module 930: Flash Module 1000: Vehicles G: Adhesive IMG: Imaging Surface I1, I2, I3, I4: External Space Information X: Optical axis θ: perspective DO: Shortest distance between the light-shielding part and the optical axis θC: Angle of the turning angle TM: Thickness of metal dopant covering the surface of each ridge protrusion H: Vertical height of one of the ridges HI: Thickness of the interlayer

Claims

1. An imaging lens module defining an optical axis and comprising: an optical element, including: a light-shielding portion that is opaque and located close to the optical axis relative to other portions of the optical element; and an anti-reflective film disposed at least on the surface of the light-shielding portion, the anti-reflective film comprising: a nanostructure layer having a plurality of non-directionally extending ridge protrusions, a bottom of each ridge protrusion being closer to the optical element than a top of the ridge protrusion, the ridge protrusions tapering from the bottom to the top, and the average structural height of the ridge protrusions being greater than 108 nm and less than 368 nm; and at least one intermediary layer disposed between the nanostructure layer and the optical element; wherein... The main component of the nanostructure layer is aluminum oxide, and the nanostructure layer further contains a metal dopant. The metal dopant is distributed at least inside each of the ridge protrusions. The metal dopant includes at least one of titanium, vanadium, chromium, titanium oxide, vanadium oxide, and chromium oxide.

2. The imaging lens module as claimed in claim 1, wherein the shortest distance between the light-shielding part and the optical axis is DO, which satisfies the following condition: 0.01 mm ≤ DO ≤ 6.8 mm.

3. The imaging lens module as claimed in claim 2, wherein the light-shielding portion comprises: an object-side side, positioned close to the object-side direction of the imaging lens module; an image-side side, disposed opposite to the object-side side; and a connecting surface connecting the object-side side and the image-side side; wherein, The connecting surface is closer to the optical axis than the side of the object and the side of the image, and the anti-reflective film is disposed at least on the connecting surface.

4. The imaging lens module as claimed in claim 3, wherein the anti-reflective film is further extended to the object side or the image side.

5. The imaging lens module as claimed in claim 2, wherein the light-shielding portion comprises: a first end face, disposed obliquely relative to the optical axis; and a second end face, connected to the first end face, wherein the first end face and the second end face form a turning angle; wherein, The turning angle is closer to the optical axis than the first end face and the second end face. The anti-reflective film is disposed at least at the turning angle, and the angle of the turning angle is θC, which satisfies the following condition: 9 degrees < θC < 162 degrees.

6. The imaging lens module as claimed in claim 5, wherein the anti-reflective film extends further to the first end face and the second end face.

7. The imaging lens module as claimed in claim 1, wherein the primary component of the at least one intermediate layer is silicon oxide.

8. The imaging lens module as claimed in claim 1, wherein the main component of the at least one intermediate layer is the same as a portion of the components constituting the nanostructure layer.

9. The imaging lens module as claimed in claim 1, wherein the metal dopant is further distributed on one surface of each of the ridge protrusions.

10. The imaging lens module of claim 9, wherein the metal dopants distributed within the interior of the ridges taper away from the optical element.

11. The imaging lens module as claimed in claim 9, wherein the metal dopant has a coverage thickness of TM on the surface of each of the ridges, satisfying the following condition: 1 nm ≤ TM ≤ 40 nm.

12. The imaging lens module as claimed in claim 11, wherein the metal dopant has a coverage thickness of TM on the surface of each of the ridge protrusions, which satisfies the following condition: 1 nm ≤ TM ≤ 30 nm.

13. The imaging lens module as claimed in claim 1, wherein the metal dopant is titanium or titanium oxide.

14. The imaging lens module of claim 1, wherein the antireflective film further comprises: a dark layer disposed between the at least one intermediary layer and the optical element for giving the optical element a dark appearance.

15. An electronic device comprising: an imaging lens module as described in claim 1.

Images