Probe card device

Abstract

A probe card device includes a test circuit board, a space converter, and a probe head. The space converter is electrically connected to the test circuit board, and the probe head is electrically connected to the space converter. The probe head includes an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate has a plurality of first through holes, and the lower guide plate is disposed on the upper guide plate and has a plurality of second through holes. The plurality of probes are mounted on the upper guide plate. Each probe includes a body, a tail, and a tip. The body passes sequentially through the first and second through holes. The body has a first end and a second end opposite to the first end. The body also has a first side and a second side connected to the first side in a cross-section parallel to the lower guide plate, and the length of the first side is less than the length of the second side. The tail is connected to the first end, and the tip is connected to the second end.

Description

Technical Field

[0001] This invention relates to a probe card device, and more particularly to a probe card device that can improve the alignment accuracy of probes during detection. Prior Technology

[0002] In modern semiconductor manufacturing, before wafers undergo dicing and packaging processes, probe cards are used to perform electrical tests on the dies to ensure yield and eliminate defective products to reduce costs. Existing probe cards can be divided into cantilever probe cards and vertical probe cards. Among vertical probe card devices, commonly used probes can be broadly categorized by their manufacturing method into microelectromechanical systems (MEMS) probes, cobra probes, and wire probes. Cobra and wire probes have circular needles and holes on their guide plates, and these holes are mostly created using mechanical drilling. In contrast, MEMS probes have nearly square needles and holes on their guide plates, and these holes are mostly created using laser drilling.

[0003] Compared to traditional probe cards, probe cards using microelectromechanical (MEMS) probes can increase signal transmission rates and probe density, thereby improving testing efficiency. The cross-sectional dimensions of existing MEMS probes (i.e., the probe body's cross-section) typically range from 22μm×22μm to 50μm×50μm to accommodate the spacing or size of various conductive metal contacts (metal pads or gold bumps) on different test objects (UTDs). When the spacing between the conductive metal contacts is large, MEMS probes with larger cross-sectional dimensions (e.g., 50μm×50μm) can be used to reduce testing costs without affecting probe alignment accuracy. However, when the spacing between the conductive metal contacts is small, MEMS probes with smaller cross-sectional dimensions (e.g., below 30μm×30μm) must be used. In this case, misalignment between the probe and the pinholes on the guide plate can easily occur, such as unexpected probe rotation, leading to the probe failing to accurately contact the corresponding conductive metal contacts on the UTD. Therefore, a probe card device is still needed to improve the problems of the existing technology. Summary of the Invention

[0004] To address the aforementioned problems, embodiments of the present invention provide a probe card device, including a test circuit board, a space converter, and a probe head. The space converter is electrically connected to the test circuit board, and the probe head is electrically connected to the space converter. The probe head includes an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate has a plurality of first through holes, and the lower guide plate is disposed on the upper guide plate and has a plurality of second through holes. The plurality of probes are mounted on the upper guide plate. Each probe includes a needle body, a needle tail, and a needle tip. The needle body passes sequentially through the first through holes and the second through holes. The needle body has a first end and a second end relative to the first end. In a cross-section parallel to the lower guide plate, the needle body also has a first side and a second side connected to the first side, and the length of the first side is less than the length of the second side. The needle tail is connected to the first end and mounted on the upper guide plate, and the needle tip is connected to the second end.

[0005] According to the probe card device of the present invention, since the length of the first side of the probe body in the cross section parallel to the lower guide plate is less than the length of the second side, when the probe body passes through the through hole of the lower guide plate, the probe body will be tightly confined within the second through hole to reduce the offset. Therefore, the alignment accuracy of the probe with the metal pad on the test object can be improved during detection. Simple Explanation of the Diagram

[0006] Figure 1 is a schematic diagram of a probe card device according to an embodiment of the present invention.

[0007] Figure 2 is a three-dimensional structural diagram of the probe head in the probe card device according to the embodiment of Figure 1.

[0008] Figure 3 is a schematic diagram of the probe structure in the probe card device according to the embodiment of Figure 2.

[0009] Figure 4 is a three-dimensional structural diagram of multiple probes and a lower guide plate in the probe card device according to the embodiment of Figure 2.

[0010] Figure 5 is a schematic cross-sectional view of the probe in the probe card device according to the embodiment of Figure 4.

[0011] Figure 6 is a partial structural schematic diagram of the upper guide plate in the probe card device according to the embodiment of Figure 2.

[0012] Figure 7 is a partial structural schematic diagram of the lower guide plate in the probe card device according to the embodiment of Figure 2.

[0013] Figure 8 is a side view of the second end of the probe in the probe card device according to the embodiment of Figure 2.

[0014] Figure 9 is a three-dimensional structural diagram of the probe head in a probe card device according to another embodiment of the present invention.

[0015] Figure 10 is a three-dimensional structural diagram of multiple probes and a lower guide plate in the probe card device according to the embodiment of Figure 9.

[0016] Figure 11 is a schematic cross-sectional view of the probe in the probe card device according to the embodiment of Figure 9.

[0017] Figure 12 is a top view of the second end of the probe in the probe card device according to the embodiment of Figure 9.

[0018] Figure 13 is a partial structural schematic diagram of the upper guide plate in the probe card device according to the embodiment of Figure 9.

[0019] Figure 14 is a partial structural schematic diagram of the lower guide plate in the probe card device according to the embodiment of Figure 9. Implementation

[0020] Various embodiments will be described below, and those skilled in the art should readily understand the spirit and principles of the invention by referring to the description and accompanying drawings. However, while specific embodiments will be described in detail herein, these embodiments are merely illustrative and are not intended to be limiting or exhaustive in any respect. Therefore, various changes and modifications to the invention will be readily apparent and easily achievable by those skilled in the art without departing from the spirit and principles of the invention.

[0021] In various embodiments of the present invention, "upper," "lower," "left," "right," "front," or "back" are used herein to describe the relationship between one element and another, and are only used to illustrate the orientation presented in the illustrations, not to limit their actual positions. The orientation or orientation of the elements in the device in the drawings is not limited by the rotation of the device.

[0022] Figure 1 is a schematic diagram of a probe card device according to an embodiment of the present invention. Please refer to Figure 1. The probe card device 10 of this embodiment includes a test circuit board 20, a space converter 30, and a probe head 40. For ease of explanation of the structure of the probe card device 10, the components are not drawn to scale. In reality, the thickness of the test circuit board 20 may be greater than the thickness of the space converter 30. The space converter 30 is electrically connected to the test circuit board 20, and the probe head 40 is electrically connected to the space converter 30. The test circuit board 20 can transmit test signals to the probe head 40 via the space converter 30, and can also transmit test result signals from the probe head 40 to the test circuit board 20 via the space converter 30. The test circuit board 20 is, for example, a printed circuit board, which can provide test signals or receive test result signals from the probe head 40. The space converter 30 has a second surface 31 and a third surface 32 opposite to the second surface 31. The second surface 31 has a plurality of contacts for electrically connecting to a plurality of contacts on the test circuit board 20. The third surface 32 also has a plurality of contacts for electrically connecting to the probe head 40. Since the distribution of contacts on the test circuit board 20 is not the same as the position distribution of probes 43 (shown in FIG. 2) on the probe head 40, the space converter 30 is required to perform spatial conversion of the internal circuit so that the test circuit board 20 can be electrically connected to the probes 43 on the probe head 40.

[0023] Figure 2 is a three-dimensional structural diagram of the probe head in the probe card device according to the embodiment of Figure 1, and Figure 3 is a structural diagram of the probe in the probe card device according to the embodiment of Figure 2. Please refer to Figures 1 to 3. The probe head 40 includes an upper guide plate 41, a lower guide plate 42, and a plurality of probes 43. The upper guide plate 41, for example, has a plurality of first through holes 410 (shown in Figure 6) for the probes 43 to pass through. The lower guide plate 42 is disposed on the side of the upper guide plate 41 away from the space converter 30 and has a plurality of second through holes 420 (shown in Figures 4 and 7) for the probes 43 to pass through. The probes 43 are mounted on the upper guide plate 41, and each probe 43 includes a needle body 46, a needle tail 44, and a needle tip 45. Furthermore, the needle body 46 sequentially passes through the first through hole 410 of the upper guide plate 41 and the second through hole 420 of the lower guide plate 42. The needle body 46 includes a first end 461 and a second end 462 opposite to the first end 461. The needle tail 44 is connected to the first end 461 to mount and fix the probe 43 to the upper guide plate 41, so that the probe 43 can be electrically connected to multiple contacts on the third surface 32 of the space converter 30. The needle tip 45 is connected to the second end 462. In this embodiment, the upper guide plate 41 is, for example, parallel to the lower guide plate 42, and the probes 43 are parallel to each other in a direction perpendicular to the lower guide plate 42 to avoid interference between the probes 43.

[0024] Figure 4 is a three-dimensional structural diagram of multiple probes and a lower guide plate in the probe card device according to the embodiment of Figure 2, and Figure 5 is a cross-sectional structural diagram of the probes in the probe card device according to the embodiment of Figure 4. Please refer to Figures 2 to 5. Multiple probes 43 are arranged adjacent to each other, with a gap between two adjacent probes 43, wherein the second end 462 of the probe body 46 passes through the second through hole 420 of the lower guide plate 42. In this embodiment, the cross-section of the probe body 46 in the plane parallel to the lower guide plate 42 is trapezoidal, but not limited to this. In other preferred embodiments, the cross-section of the probe body 46 in the plane parallel to the lower guide plate 42 may also be rectangular. The cross-section of the probe body 46 in the plane parallel to the lower guide plate 42 has a first side 463 and a second side 464 connected to the first side 463, wherein the length L1 of the first side 463 is less than the length L2 of the second side 464. In this way, in conjunction with the first through-hole 410 and the second through-hole 420 (described later), the needle body 46 can be tightly confined within the first through-hole 410 and the second through-hole 420, reducing offset. Therefore, the alignment accuracy of the probe 43 with the metal pads on the test object can be improved during detection. Furthermore, compared to traditional MEMS probe cards, it can detect test objects with smaller metal pad spacing. For example, the length L1 is, for example, 18 μm, and the length L2 is, for example, 30 μm.

[0025] Please refer to Figures 4 and 5. The plurality of probes 43 includes, for example, a first probe 431 and a second probe 432 adjacent to the first probe 431. The needle body of the first probe 431 has a third end 4311 and a fourth end 4312 relative to the third end 4311 in a cross-section parallel to the lower guide plate 42. The third end 4311 is, for example, parallel to the fourth end 4312. The needle body of the second probe 432 has a fifth end 4321 and a sixth end 4322 relative to the fifth end 4321 in a cross-section parallel to the lower guide plate 42. The angle θ between the line X1 connecting the third end 4311 and the fourth end 4312 and the line X2 connecting the fifth end 4321 and the sixth end 4322 is an acute angle. In other words, the line X1 connecting the third end 4311 and the fourth end 4312 is not parallel to the line X2 connecting the fifth end 4321 and the sixth end 4322. As a result, the probe 43 of the probe card device 10 can contact the corresponding metal pad (pad or bump, for example, made of metal materials such as gold, not shown) on the chip on plastic (COP) object through the first through hole 410 and the second through hole 420.

[0026] Figure 6 is a partial structural schematic diagram of the upper guide plate in the probe card device according to the embodiment of Figure 2, and Figure 7 is a partial structural schematic diagram of the lower guide plate in the probe card device according to the embodiment of Figure 2. Please refer to Figures 2 to 7. The upper guide plate 41, for example, has a plurality of first through holes 410, wherein each first through hole has a third side 411 and a fourth side 412 connecting the third side 411, and the length L3 of the third side 411 is less than the length L4 of the fourth side. In this embodiment, the shape of the first through hole 410 is, for example, trapezoidal, but not limited thereto; in other preferred embodiments, the shape of the first through hole 410 can also be rectangular. Furthermore, the lower guide plate 42, for example, has a plurality of second through holes 420, wherein each second through hole 420 has a fifth side 421 and a sixth side 422 connecting the fifth side 421, and the length L5 of the fifth side 421 is less than the length L6 of the sixth side 422. In this embodiment, the shape of the second through hole 420 is, for example, trapezoidal, but not limited thereto; in other preferred embodiments, the shape of the second through hole 420 can also be rectangular. Furthermore, the number of first through-holes 410 is, for example, equal to the number of second through-holes 420, and each first through-hole 410 is located opposite a second through-hole 420, to help the probes 43, which are sequentially inserted through the first through-holes 410 and the second through-holes 420, to uniformly contact the corresponding metal pads (not shown) on the plastic flip-chip packaged test object. For example, lengths L3 and L5 are, for example, 20 μm, and lengths L4 and L6 are, for example, 40 μm.

[0027] Please refer to Figures 2 through 7. The position of the first through hole 410 on the upper guide plate 41 and the position of the second through hole 420 on the lower guide plate 42 correspond, for example, to the position of the metal pad on the object to be tested, to guide the probe 43 for alignment. When the needle body 46 of the probe 43 passes through the first through hole 410 and the second through hole 420 in sequence, the third side 411 of the first through hole 410 and the fifth side 421 of the second through hole 420 are located on the first side 463 of the needle body 46, and the fourth side 412 of the first through hole 410 and the sixth side 422 of the second through hole 420 are located on the second side 464 of the needle body 46. That is, the long side of the needle body 46 faces the long side of the first through hole 410 and the second through hole 420, and the short side of the needle body 46 faces the short side of the first through hole 410 and the second through hole 420. Compared to the square pinholes on the guide plate of a traditional probe card, in this embodiment, the length L1 of the first side 463 of the needle body 46 is close to the length L3 of the third side 411 of the first through hole 410 and the length L5 of the fifth side 421 of the second through hole 420. Therefore, the needle body 46 can be tightly confined within the first through hole 410 and the second through hole 420 to reduce offset, thereby improving the testing reliability of the probe card device 10.

[0028] Figure 8 is a side view of the second end of the probe in the probe card device according to the embodiment of Figure 2. Please refer to Figures 2 to 8. The probe body 46 of the probe 43 is manufactured using microelectromechanical technology. It is fabricated by defining the shape layer by layer through processes such as electroplating, photolithography, and vapor deposition, for example, by sequentially depositing copper and palladium-cobalt layers. In detail, the probe body 46 includes a bottom layer 465 stacked on top of each other, a top layer 466 opposite to the bottom layer 465, and a plurality of intermediate layers 467, wherein the intermediate layers 467 are located between the bottom layer 465 and the top layer 466. As shown in Figures 5 and 8, the number of intermediate layers 467 is, for example, six, but the present invention is not limited to this, and the number of intermediate layers 467 may also be five or less or seven or more. Furthermore, as shown in Figures 4 and 8, the needle 45 is connected to the second end 462, and the needle 45 is disposed in the intermediate layer 467 to make electrical contact with the corresponding metal pad of the test object. However, in other preferred embodiments, the needle 45 may also be disposed between the bottom layer 465 and the intermediate layer 467 or between the top layer 466 and the intermediate layer 467. The present invention does not limit this.

[0029] Figure 9 is a three-dimensional structural diagram of the probe head in a probe card device according to another embodiment of the present invention. Figure 10 is a three-dimensional structural diagram of multiple probes and a lower guide plate in the probe card device according to the embodiment of Figure 9. Figure 11 is a cross-sectional structural diagram of the probe in the probe card device according to the embodiment of Figure 9. Figure 12 is a top view of the second end of the probe in the probe card device according to the embodiment of Figure 9. Please refer to Figures 9 to 12. The probe head 40A of this embodiment can be applied to the probe card device 10. The probe head 40A is similar to the probe head 40 of the aforementioned embodiment, and the same elements are indicated by the same reference numerals, which will not be described again here. The difference between the probe head 40A and the probe head 40 is that in the probe head 40A, the lines connecting the center points of the needle bodies 46A of these probes 43A on these cross sections parallel to the lower guide plate 42 form an M-shape. In detail, Figure 11 schematically illustrates the needle bodies 46A of nine probes 43A on a cross section parallel to the lower guide plate 42. However, the present invention is not limited to this, and in fact, the probe head 40A may have more probes 43A. In addition, each cross section of the probe body 46A of these probes 43A has a center point CA, CB, CC, CD, CE, CF, CG, CH and CI, and the line X3 connecting these center points presents an M shape. In this way, these probes 43A can more accurately target the corresponding metal pad on the test object located in the plastic flip-chip package.

[0030] In addition, please continue to refer to Figures 9 to 12. The needle body 46A includes a bottom layer 465 stacked on top of each other, a top layer 466 relative to the bottom layer 465, and a plurality of intermediate layers 467A located between the bottom layer 465 and the top layer 466. In this embodiment, the number of intermediate layers 467A is four, and the positions of the needles 45A on each probe 43A are different from each other. For example, the probes 43A in this embodiment include a third probe 433A, a fourth probe 434A, a fifth probe 435A, a sixth probe 436A, and a seventh probe 437A arranged adjacent to each other but not in contact. The tip 45A of the third probe 433A is disposed on the top layer 466 and the adjacent intermediate layer 467A, the tip 45A of the fourth probe 434A is disposed on two adjacent intermediate layers 467A, the tip 45A of the fifth probe 435A is disposed on the bottom layer 465 and the adjacent intermediate layer 467A, the tip 45A of the sixth probe 436A is disposed on two adjacent intermediate layers 467A, and the tip 45A of the seventh probe 437A is disposed on the top layer 466 and the adjacent intermediate layer 467A. In this way, these probes 43A can be aligned with the corresponding metal pads on the test object located in the plastic flip-chip package via the first through-hole 410A and the second through-hole 420A.

[0031] Figure 13 is a partial structural schematic diagram of the upper guide plate in the probe card device according to the embodiment of Figure 9, and Figure 14 is a partial structural schematic diagram of the lower guide plate in the probe card device according to the embodiment of Figure 9. Please refer to Figures 9 to 14. The upper guide plate 41, for example, has a plurality of first through holes 410A (shown in Figure 13) for probes 43A to pass through, and the lower guide plate 42 is disposed on the side of the upper guide plate 41 away from the space converter 30 and has a plurality of second through holes 420A (shown in Figure 14) for probes 43A to pass through. Probe 43A is mounted on upper guide plate 41. The probe body 46A passes sequentially through the first through hole 410A of upper guide plate 41 and the second through hole 420A of lower guide plate 42. Upper guide plate 41 is parallel to lower guide plate 42. Probes 43A are parallel to each other in a direction perpendicular to lower guide plate 42 to avoid interference. The arrangement and rotation angle of the first through holes 410A on upper guide plate 41 are coordinated with each probe 43A. Similarly, the arrangement and rotation angle of the second through holes 420A on lower guide plate 42 are coordinated with each probe 43A. For example, the line X4 connecting the center points of each of the first through holes 410A forms an M-shape corresponding to the arrangement of probes 43A, and the line X5 connecting the center points of each of the second through holes 420A also forms an M-shape corresponding to the arrangement of probes 43A, enabling probes 43A to more accurately align with the corresponding metal pad on the test object.

[0032] In summary, in the probe card device of the present invention, since the length of the first side of the probe body in the cross section parallel to the lower guide plate is less than the length of the second side, when the probe body passes through the through hole of the lower guide plate, the probe body will be tightly confined within the through hole and the offset will be reduced. Therefore, the alignment accuracy of the probe with the metal pad on the test object can be improved during detection.

[0033] The present invention has been described by the above-described embodiments; however, these embodiments are merely examples for implementing the present invention. It must be noted that the disclosed embodiments do not limit the scope of the present invention. Conversely, modifications and equivalents encompassing the spirit and scope of the claims are all included within the scope of the present invention.

[0034] 10, 10A: Probe card device 20: Test circuit board 30: Space Converter 31: Second Surface 32: Third Surface 40, 40A: Probe head 41: Upper guide plate 410, 410A: First through hole 411: Third side 412: Fourth side 42: Lower guide plate 420, 420A: Second through hole 421: Fifth side 422: Sixth side 43, 43A: Probes 431: First probe 4311: Third end 4312: Fourth End 432: Second probe 4321: Fifth End 4322: Sixth End 433A: Third Probe 434A: Fourth Probe 435A: Fifth Probe 436A: Sixth Probe 437A: Seventh Probe 44: Needle tail 45, 45A: Needle 46, 46A: Needle body 461: First end 462: Second end 463: First side 464: Second side 465: Bottom Layer 466: Top Floor 467, 467A: Intermediate layer CA, CB, CC, CD, CE, CF, CG, CH, CI: Center point L1, L2, L3, L4, L5, L6: Length X1, X2, X3, X4, X5: Connect the lines θ: included angle

Claims

1. A probe card device, comprising: A test circuit board; A space converter is electrically connected to the test circuit board; The device includes a probe head electrically connected to the space converter. The probe head comprises: an upper guide plate having a plurality of first through holes; a lower guide plate disposed on the side of the upper guide plate away from the space converter and having a plurality of second through holes; and a plurality of probes mounted on the upper guide plate, wherein each probe comprises: a needle body sequentially passing through the first through holes and the second through holes, the needle body comprising a plurality of stacked layered structures, the needle body having a first end and a second end relative to the first end, wherein the needle body further has a first side and a second side connected to the first side in a cross section parallel to the lower guide plate, and the length of the first side is less than the length of the second side; a needle tail connected to the first end and mounted on the upper guide plate; and a needle tip connected to the second end and disposed on at least a portion of the layered structures.

2. The probe card device of claim 1, wherein the first through hole has a third side and a fourth side connected to the third side, and the length of the third side is less than the length of the fourth side.

3. The probe card device of claim 1, wherein the second through hole has a fifth side and a sixth side connecting the fifth side, and the length of the fifth side is less than the length of the sixth side.

4. The probe card device as claimed in claim 1, wherein the number of the first through holes is equal to the number of the second through holes.

5. The probe card device of claim 1, wherein the probes further include a first probe and a second probe adjacent to the first probe, the body of the first probe including a third end and a fourth end relative to the third end in a cross section parallel to the lower guide plate, the body of the second probe including a fifth end and a sixth end relative to the fifth end in a cross section parallel to the lower guide plate, and an acute angle being formed between the line connecting the third end and the fourth end and the line connecting the fifth end and the sixth end.

6. The probe card device of claim 1, wherein the probes have a needle body in an M-shape formed by connecting the center points of a plurality of cross sections parallel to the lower guide plate.

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