Optical package structure and manufacturing method thereof

Abstract

This invention discloses an optical packaging structure and its manufacturing method, which mainly provides a first optical packaging unit and a second optical packaging unit, and connects the first optical packaging unit and the second optical packaging unit with an optical transmission element to improve signal communication performance.

Description

Technical Field

[0001] This invention relates to a semiconductor packaging structure, and more particularly to an optical packaging structure with optical elements and its manufacturing method. Prior Technology

[0002] With the booming development of the electronics industry, electronic products are gradually moving towards multifunctionality and high performance. The application of current fifth-generation (5G) communication technology has expanded to various fields such as the Internet of Things (IoT), Industrial Internet of Things (IIoT), cloud computing, artificial intelligence (AI), autonomous vehicles, and medical care. As applications expand, a massive amount of data needs to be efficiently transmitted, processed, and stored. The demand for data transmission, in particular, is surging, leading industries to replace electricity with light as the data transmission medium. This aims to improve transmission capacity, efficiency, and distance while reducing energy consumption during transmission. Against this backdrop, co-packaged optical devices have become a future trend in semiconductor and packaging technology.

[0003] Please refer to Figures 1A and 1B, which are top view and partial cross-sectional view of a conventionally packaged optical device 1.

[0004] As shown in Figure 1A, in a conventional co-packaged optical device 1, a plurality of optical engines 11 and a conversion chip 12 are integrated on a circuit board 10. As shown in Figure 1B, the conversion chip 12 is first disposed on a substrate 13 and then connected to the circuit board 10 through the substrate 13. Each optical engine 11 includes a semiconductor chip 112 formed in a package structure 111 and an optical chip 113 connected to the package structure 111. One end of the optical chip 113 is connected to an optical fiber 14, and a shelf 15 is provided below the junction of the optical chip 113 and the optical fiber 14 to facilitate the transmission of optical signals to the photoelectric engine 11 for communication.

[0005] However, the optical chip and conversion chip in the aforementioned co-packaged optical device must transmit signals through the metal lines in the circuit board and substrate. Not only is the overall size of the device too large and thick, which is not conducive to the miniaturization of electronic products, but its signal transmission path is also too long, which can easily lead to signal loss and cause problems in the application of end products. In addition, there is also the risk of the bracket being suspended, resulting in insufficient support for the optical fiber and breakage.

[0006] Therefore, how to overcome the problems of the aforementioned conventional technologies has become an urgent issue that needs to be addressed. Summary of the Invention

[0007] In view of the various deficiencies of the prior art, the present invention provides an optical packaging structure comprising: a first optical packaging unit including a first electronic component and a first optical engine; a second optical packaging unit including a second electronic component and a second optical engine; and an optical transmission element having one end connected to the first optical engine of the first optical packaging unit and the other end connected to the second optical engine of the second optical packaging unit.

[0008] The present invention further provides a method for manufacturing an optical packaging structure, comprising: providing a first optical packaging unit, which includes a first electronic component and a first optical engine; providing a second optical packaging unit, which includes a second electronic component and a second optical engine; and connecting the first optical packaging unit and the second optical packaging unit with an optical transmission element, wherein one end of the optical transmission element is connected to the first optical engine of the first optical packaging unit, and the other end is connected to the second optical engine of the second optical packaging unit.

[0009] In the aforementioned optical packaging structure and its manufacturing method, the first electronic component is a system single-chip.

[0010] In the aforementioned optical packaging structure and its manufacturing method, the optical transmission element is an optical waveguide element or a dielectric planar waveguide.

[0011] In the aforementioned optical packaging structure and manufacturing method, the first optical packaging unit further includes a carrier plate for mounting the first electronic component and the first optical engine. The carrier plate is an intermediary plate with a plurality of conductive through holes.

[0012] In the aforementioned optical packaging structure and manufacturing method, the first optical packaging unit further includes a covering layer that covers the first optical engine and the first electronic component.

[0013] In the aforementioned optical packaging structure and its manufacturing method, each of the first optical engine and the second optical engine includes an optical element and a semiconductor element stacked on the optical element. The optical element has a plurality of vias. The optical element is an optical chip or an optical module. The semiconductor element is an integrated circuit element. The first optical engine and the second optical engine further include optical elements disposed on the optical element.

[0014] In the aforementioned optical packaging structure and manufacturing method, the second optical packaging unit further includes another carrier plate for receiving the second electronic component and the second optical engine.

[0015] In the aforementioned optical packaging structure and its manufacturing method, the second electronic component is a high-bandwidth memory.

[0016] In the aforementioned optical packaging structure and its manufacturing method, the first optical packaging unit and the second optical packaging unit are disposed on a circuit board.

[0017] As can be seen from the above, the optical packaging structure and its manufacturing method of the present invention mainly involve placing electronic components on a carrier plate, and sequentially stacking optical components and semiconductor components on the carrier plate to form a three-layer vertically stacked optical engine. Simultaneously, through the plurality of vias formed in the optical components and the plurality of conductive vias formed in the carrier plate, the optical components, semiconductor components, electronic components, and carrier plate can be directly electrically connected to each other through the plurality of vias and conductive vias, thereby shortening the signal transmission path between them and improving the transmission rate. Furthermore, the optical components are supported by the optical components and the carrier plate, reducing the risk of breakage of the optical components. Moreover, the optical packaging unit, composed of electronic components and the optical engine mounted on the carrier plate, can be mounted on a circuit board together with another optical packaging unit, and an optical transmission element can be used to connect the optical packaging unit and the other optical packaging unit, realizing optical communication between the plurality of optical packaging units, thereby improving signal communication performance. Simple Explanation of the Diagram

[0018] Figures 1A and 1B are a plan view and a partial cross-sectional view of a conventional co-packaged optical device.

[0019] Figures 2A to 2E are cross-sectional and top views of the optical packaging structure and its manufacturing method of the present invention. Implementation

[0020] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0021] It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," "third," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of the present invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the present invention.

[0022] Please refer to Figures 2A to 2E, which are cross-sectional and top views of the optical packaging structure and its manufacturing method of the present invention.

[0023] As shown in Figure 2A, a carrier plate 20 is provided, and a first electronic component 21 and an optical component 23 are disposed and electrically connected on the carrier plate 20, and a semiconductor component 24 and an optical component 25 are disposed and electrically connected on the optical component 23.

[0024] The carrier plate 20 is, for example, an intermediate plate, and has a plurality of conductive through-holes 200 (e.g., conductive silicon through-holes) formed inside it. The carrier plate 20 has a first side 20a and a second side 20b opposite to each other. The first electronic component 21 and the optical component 23 are disposed on the first side 20a, and a plurality of conductive components 26 (e.g., solder bumps or copper bumps) can be implanted on the second side 20b of the carrier plate 20.

[0025] In this embodiment, the first electronic component 21 is a system-on-a-chip (SoC), such as a switch ASIC, which can be mounted and electrically connected to the carrier board 20 through a plurality of conductive bumps.

[0026] The optical element 23 has a plurality of through holes 230 formed therein, and can be connected to the carrier plate 20 through a plurality of conductive bumps.

[0027] In this embodiment, the optical element 23 is, for example, an optical chip (photonic integrated circuit, PIC) or an optical module (PIC module), which may selectively include a coupler, an optical chip, a total reflection mirror, a fiber array unit (FAU), etc.

[0028] The semiconductor element 24 is, for example, an electronic integrated circuit (EIC) element, which can be disposed and electrically connected to the optical element 23 through a plurality of conductive bumps.

[0029] The optical element 25, such as a fiber optic slot, lens, or bracket, is attached to the optical element 23 and supported by the optical element 23 and the carrier plate 20 to reduce the risk of breakage of the optical element 23 or the optical element 25. In other embodiments, the optical element 25 may be integrated into the optical element 23.

[0030] As shown in Figure 2B, which is a top view of Figure 2A, in this embodiment, the optical element 23 and the semiconductor element 24 (and the optical element 25) constitute a first optical engine (OE) 2a, wherein the first electronic element 21 and the first optical engine 2a are disposed on the same side of the carrier plate 20 and are arranged adjacent to each other.

[0031] The present invention utilizes a plurality of vias 230 formed in the optical element 23 to directly stack and electrically connect the semiconductor element 24, the optical element 23 and the carrier plate 20, thereby forming a 3D stacked structure to shorten the interconnection distance between the optical element 23 (PIC) and the semiconductor element 24 (EIC) and improve signal transmission efficiency. At the same time, the present invention utilizes a plurality of conductive vias 200 formed in the carrier plate 20 (intermediate plate) to integrate the first electronic component 21 (SoC) and the first optical engine 2a (OE) to further shorten the signal transmission distance.

[0032] As shown in Figure 2C, a packaging process is performed to form a covering layer 27 on the carrier plate 20, which covers the first optical engine 2a and the first electronic component 21. The covering layer 27 can be thinned so that the optical component 25 is exposed outside the covering layer 27, thereby forming the first optical packaging unit 2b. In this embodiment, the upper surface of the semiconductor component 24 and the upper surface of the first electronic component 21 are also exposed outside the covering layer 27.

[0033] As shown in Figure 2D, a circuit board 28 is provided, and the first optical packaging unit 2b is disposed on the circuit board 28. The first optical packaging unit 2b can be connected to the circuit board 28 through the plurality of conductive elements 26.

[0034] As shown in FIG2E, a second optical packaging unit 2c is provided and disposed on the circuit board 28 and electrically connected to the circuit board 28. The second optical packaging unit 2c is adjacent to the first optical packaging unit 2b and is communicatively connected to the first optical packaging unit 2b to obtain the optical packaging structure 2 of the present invention.

[0035] The second optical packaging unit 2c is similar in its formation and architecture to the first optical packaging unit 2b. It includes another carrier plate 20' (e.g., an interposer plate with a plurality of conductive vias), and a second electronic component 22' and another optical engine, namely a second optical engine 2a', disposed on the other carrier plate 20'. The second optical engine 2a' includes an optical element with a plurality of vias and semiconductor and optical elements disposed on the optical element, so that the second electronic component 22' and the second optical engine 2a' can be integrated using the other carrier plate 20'. The second electronic component 22' may be the same as the first electronic component 21 (e.g., a system-on-a-chip). In this embodiment, the second electronic component 22' is different from the first electronic component 21, for example, it is a high-bandwidth memory (HBM).

[0036] The first optical packaging unit 2b and the second optical packaging unit 2c can be directly connected to each other through the optical transmission element 29. In this embodiment, one end of the optical transmission element 29 (e.g., an optical waveguide element, a dielectric planar waveguide, or an optical fiber) can be connected to the first optical engine 2a (optoelectronic component) of the first optical packaging unit 2b, and the other end can be connected to the second optical engine 2a' (optoelectronic component) of the second optical packaging unit 2c, so as to realize optical communication between the first optical packaging unit 2b and the second optical packaging unit 2c, avoiding the loss caused by traditional communication using metal lines.

[0037] Through the aforementioned manufacturing method, the present invention further discloses an optical packaging structure 2, which includes: a first optical packaging unit 2b and a second optical packaging unit 2c; and an optical transmission element 29 that communicates with the first optical packaging unit 2b and the second optical packaging unit 2c.

[0038] The first optical packaging unit 2b includes a carrier plate 20, and a first electronic component 21 and a first optical engine 2a disposed on the carrier plate 20.

[0039] The second optical packaging unit 2c includes a carrier plate 20', a second electronic component 22' disposed on the carrier plate 20', and a second optical engine 2a', such that one end of the light transmission element 29 is connected to the first optical engine 2a of the first optical packaging unit 2b, and the other end is connected to the second optical engine 2a' of the second optical packaging unit 2c, thereby realizing optical communication between the first optical packaging unit 2b and the second optical packaging unit 2c. The first optical packaging unit 2b and the second optical packaging unit 2c are disposed on a circuit board 28.

[0040] In summary, the optical packaging structure and manufacturing method of this invention mainly involves placing electronic components on a carrier plate, and sequentially stacking optical elements and semiconductor elements on the carrier plate to form a three-layer vertically stacked optical engine. Simultaneously, by forming multiple vias in the optical elements and multiple conductive vias in the carrier plate, the optical elements, semiconductor elements, electronic components, and carrier plate can be directly electrically connected to each other through these vias and vias, thereby shortening the signal transmission path between them and improving the transmission rate. Furthermore, the optical elements are supported by the optical elements and the carrier plate, reducing the risk of breakage. Moreover, the optical packaging unit, composed of electronic components and the optical engine mounted on the carrier plate, can be mounted on a circuit board together with another optical packaging unit, and an optical transmission element can be used to connect the optical packaging unit and the other optical packaging unit, enabling optical communication between multiple optical packaging units and thus improving signal communication performance.

[0041] The above embodiments are illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as set forth in the following patent claims.

[0042]

[0043] 1: Co-packaged optical devices

[0044] 10: Circuit board

[0045] 11: Optical Engine

[0046] 111: Packaging Structure

[0047] 112: Semiconductor wafer

[0048] 113: Optical chip

[0049] 12: Conversion chip

[0050] 13:Substrate

[0051] 14: Optical Fiber

[0052] 15: Bracket

[0053] 2: Optical Packaging Structure

[0054] 2a: First Optical Engine

[0055] 2a': Second optical engine

[0056] 2b: First optical packaging unit

[0057] 2c: Second optical packaging unit

[0058] 20,20': Support plate

[0059] 20a: First side

[0060] 20b: Second side

[0061] 200: Conductive Through-hole

[0062] 21: First electronic component

[0063] 22': Second electronic component

[0064] 23: Optical Components

[0065] 230: Through hole

[0066] 24: Semiconductor components

[0067] 25: Optical Components

[0068] 26: Conductive elements

[0069] 27: Covering layer

[0070] 28: Circuit Board

[0071] 29: Optical transmission element

Claims

1. An optical packaging structure, comprising: The first optical packaging unit includes a first electronic component and a first optical engine; The second optical packaging unit includes a second electronic component and a second optical engine, wherein the first optical engine and the second optical engine each include an optical element and a semiconductor element stacked on the optical element; And an optical transmission element, one end of which is connected to the first optical engine of the first optical packaging unit, and the other end of which is connected to the second optical engine of the second optical packaging unit.

2. The optical packaging structure as described in claim 1, wherein, The first electronic component is a system-on-a-chip.

3. The optical packaging structure as described in claim 1, wherein, The optical transmission element is an optical waveguide element or a dielectric planar waveguide.

4. The optical packaging structure as described in claim 1, wherein, The first optical packaging unit further includes a carrier plate for mounting the first electronic component and the first optical engine.

5. The optical packaging structure as described in claim 4, wherein, The carrier plate is an intermediate plate with multiple conductive perforations.

6. The optical packaging structure as described in claim 4, wherein, The first optical packaging unit further includes a covering layer that encapsulates the first optical engine and the first electronic component.

7. The optical packaging structure as described in claim 1, wherein, The optical element has multiple vias.

8. The optical packaging structure as described in claim 1, wherein, The optical element is either an optical chip or an optical module.

9. The optical packaging structure as described in claim 1, wherein, This semiconductor device is an integrated circuit element.

10. The optical packaging structure as described in claim 1, wherein, The first optical engine and the second optical engine further include optical elements disposed on the optical element.

11. The optical packaging structure as described in claim 1, wherein, The second optical packaging unit further includes another carrier plate for mounting the second electronic component and the second optical engine.

12. The optical packaging structure as described in claim 1, wherein, The second electronic component is a high-bandwidth memory.

13. The optical packaging structure as described in claim 1, wherein, The first optical packaging unit and the second optical packaging unit are mounted on a circuit board.

14. A method for manufacturing an optical packaging structure, comprising: A first optical packaging unit is provided, which includes a first electronic component and a first optical engine; A second optical packaging unit is provided, which includes a second electronic component and a second optical engine, wherein the first optical engine and the second optical engine each include an optical element and a semiconductor element stacked on the optical element; and the first optical packaging unit and the second optical packaging unit are connected by an optical transmission element, wherein one end of the optical transmission element is connected to the first optical engine of the first optical packaging unit, and the other end is connected to the second optical engine of the second optical packaging unit.

15. A method for manufacturing the optical packaging structure as described in claim 14, wherein, The first electronic component is a system-on-a-chip.

16. A method for manufacturing the optical packaging structure as described in claim 14, wherein, The optical transmission element is an optical waveguide element or a dielectric planar waveguide.

17. A method for manufacturing the optical packaging structure as described in claim 14, wherein, The first optical packaging unit further includes a carrier plate for mounting the first electronic component and the first optical engine.

18. A method for manufacturing the optical packaging structure as described in claim 17, wherein, The carrier plate is an intermediate plate with multiple conductive perforations.

19. A method for manufacturing the optical packaging structure as described in claim 17, wherein, The first optical packaging unit further includes a covering layer that encapsulates the first optical engine and the first electronic component.

20. A method for manufacturing the optical packaging structure as described in claim 14, wherein, The optical element has multiple vias.

21. A method for manufacturing the optical packaging structure as described in claim 14, wherein, The optical element is either an optical chip or an optical module.

22. A method for manufacturing the optical packaging structure as described in claim 14, wherein, This semiconductor device is an integrated circuit element.

23. A method for manufacturing the optical packaging structure as described in claim 14, wherein, The first optical engine and the second optical engine further include optical elements disposed on the optical element.

24. A method for manufacturing the optical packaging structure as described in claim 14, wherein, The second optical packaging unit further includes another carrier plate for mounting the second electronic component and the second optical engine.

25. A method for manufacturing the optical packaging structure as described in claim 14, wherein, The second electronic component is a high-bandwidth memory.

26. A method for manufacturing the optical packaging structure as described in claim 14, wherein, The first optical packaging unit and the second optical packaging unit are mounted on a circuit board.

Images