Monitoring device measurable temperature in low temperature environment

Abstract

This disclosure presents a temperature monitoring device capable of measuring temperature in low-temperature environments. The monitoring device includes a first cover, a circuit board, and multiple electronic components. The first cover is disposed on the object to be monitored, and a groove is formed on the first cover. A portion of the circuit board is inserted into the groove. The electronic components are disposed on the circuit board. A thermal barrier layer is disposed within the groove, and a portion of the thermal barrier layer corresponding to a specific electronic component on the circuit board is inserted into the groove to block heat transfer from the object to be monitored to the specific electronic component. The circuit board is located on the thermal barrier layer, and due to the thermal barrier layer, the specific electronic component operates normally in sub-zero environments.

Description

Technical Field

[0001] The purpose of this disclosure is to provide a monitoring device that can measure temperature in low-temperature environments. Prior Technology

[0002] Electrostatic chucks, used to support wafers, control the temperature distribution of the wafer by lowering its temperature. A monitoring device has been developed to verify whether the electrostatic chuck can effectively control the wafer's temperature distribution. However, this monitoring device can only monitor the temperature of the electrostatic chuck in environments above freezing. This is because some of the electronic components in the monitoring device cannot function properly in environments below freezing.

[0003] Recently, semiconductor devices have shifted from planar to three-dimensional structures, with critical dimensions shrinking to the nanometer scale. Consequently, the temperature of electrostatic chucks has been decreasing, necessitating monitoring at sub-zero temperatures, particularly in cryogenic environments. For example, as semiconductor devices move towards three-dimensional structures, deeper vias need to be formed. However, in environments above freezing, the depth of via formation is limited. To address this issue, techniques are being developed to maintain wafer temperatures below zero, thereby preserving anisotropic etching characteristics during via etching. However, because this process takes place in a sub-zero environment, conventional monitoring devices cannot verify whether the electrostatic chuck can correctly control the wafer's temperature distribution. Summary of the Invention

[0004] The purpose of this disclosure is to provide a monitoring device that can measure temperature in low-temperature environments.

[0005] The monitoring device disclosed in this embodiment includes a first cover, a circuit board, and multiple electronic components. The first cover is disposed on the object to be monitored, and a groove is formed on the first cover. A portion of the circuit board is inserted into the groove. Multiple electronic components are disposed on the circuit board. A thermal barrier layer is disposed in the groove, and a portion of the thermal barrier layer corresponding to a specific electronic component on the circuit board is inserted into the groove to block heat transfer from the object to be monitored to the specific electronic component. The circuit board is located on the thermal barrier layer, and due to the thermal barrier layer, the specific electronic component operates normally in a sub-zero environment.

[0006] The monitoring device disclosed in another embodiment includes a first cover, a second cover, a third cover, a circuit board, and a plurality of electronic components. The second cover is disposed on the first cover. The third cover is disposed on the second cover. The circuit board is disposed on the first cover. The electronic components are disposed on the circuit board. A first hole is formed in the second cover, at least some of the electronic components are inserted into the first hole, and a first filler fills the area in the first hole excluding the corresponding electronic component.

[0007] The monitoring device disclosed in another embodiment includes a cover, a circuit board, and a plurality of electronic components. The circuit board is disposed on the cover. The electronic components include a temperature sensor for measuring the temperature of the object to be monitored. A hole is formed in the area surrounding the portion of the temperature sensor on the circuit board to prevent heat generated by the circuit board from being transferred to the temperature sensor.

[0008] The monitoring device disclosed herein can be equipped with a thermal barrier layer in the hole where an electronic component malfunctions in a low-temperature environment, thereby blocking heat transferred from the object to be monitored to the electronic component. Therefore, the monitoring device can normally measure the temperature of the object to be monitored in a low-temperature environment.

[0009] Furthermore, holes are formed in the surrounding area of ​​the temperature sensor portion of the circuit element, preventing heat generated by the circuit element or circuit board from being transferred to the temperature sensor. Therefore, the temperature sensor can accurately measure the temperature of the object being monitored without being affected by heat.

[0010] The foregoing description is not intended to represent various embodiments or aspects of this disclosure. Rather, it merely provides examples of some novel aspects and features set forth herein. The above-described features and advantages, as well as other features and advantages, will become apparent when taken in conjunction with the accompanying drawings and the appended claims, through the following representative embodiments and methods for carrying out this invention. Other aspects of this disclosure will become apparent to those skilled in the art from the detailed description of the embodiments with reference to the accompanying drawings, and a brief explanation of the drawings is provided below. Simple Explanation of the Diagram

[0011] The exemplary embodiments of this disclosure will become clearer through a detailed description with reference to the accompanying drawings, in which: Figure 1 is a schematic diagram of a chamber according to an embodiment of this disclosure. Figure 2 is a schematic diagram of a monitoring device according to an embodiment of this disclosure. Figure 3 is a schematic diagram of an installation structure of a circuit board according to an embodiment of this disclosure. Figure 4 is a schematic diagram of the second cover of an embodiment of this disclosure. Figure 5 is a schematic diagram of an array of cover and circuit board according to an embodiment of this disclosure. Figures 6 and 7 are schematic diagrams of a circuit board according to an embodiment of this disclosure. Implementation

[0012] In this specification, singular expressions include plural expressions unless they have a distinct meaning in the context. Terms such as "comprising" or "including" should not be construed as including all elements or operations. That is, some elements or operations may not be included, while other additional elements or operations may be further included. Furthermore, terms such as "unit" and "module" used in this specification can be used for elements that perform at least one function or action and can be implemented as hardware, software, or a combination of hardware and software.

[0013] This disclosure relates to a monitoring device capable of measuring the temperature distribution, slope, etc., of an object under monitoring in both below-freezing and above-freezing environments, wherein the object under monitoring is, for example, an electrostatic chuck used in semiconductor or display manufacturing processes. Here, the above-freezing and below-freezing environments can be determined based on the heat generated by the object under monitoring. For example, a low-freezing environment can refer to an environment where the heat transferred to the object under monitoring is at a temperature of 0°C or lower (below zero).

[0014] Unlike conventional techniques that cannot properly measure the temperature of the object under monitoring in low-temperature environments, the monitoring device disclosed herein can measure the temperature of the object under monitoring in low-temperature environments, especially in ultra-low temperature environments of -70°C.

[0015] In one embodiment, the monitoring device can be a wafer-type monitoring device, wherein all electronic components can operate normally in low-temperature environments to measure the temperature distribution of the object to be monitored. Of course, the monitoring device can also measure the temperature distribution of the object to be monitored normally in environments above freezing.

[0016] The following will describe in detail, with reference to the accompanying drawings, various embodiments disclosed herein.

[0017] Figure 1 is a schematic diagram of a chamber according to an embodiment of the present disclosure; Figure 2 is a schematic diagram of a monitoring device according to an embodiment of the present disclosure; Figure 3 is a schematic diagram of an installation structure of a circuit substrate according to an embodiment of the present disclosure; Figure 4 is a schematic diagram of a second cover according to an embodiment of the present disclosure; Figure 5 is a schematic diagram of an array of covers and circuit substrates according to an embodiment of the present disclosure; Figures 6 and 7 are schematic diagrams of a circuit substrate according to an embodiment of the present disclosure.

[0018] In Figure 1, for example, the suction cup of electrostatic suction cup 102 may be located in the lower portion, while the shower head may be located in the upper portion and an internal space of the chamber 100.

[0019] In one embodiment, the monitoring device 104 may be located on the electrostatic chuck 102, and the temperature control device for heating / cooling the wafer may be configured in the electrostatic chuck 102.

[0020] The monitoring device 104 can measure process parameters, particularly the temperature distribution of the object to be monitored (e.g., the electrostatic chuck 102). Specifically, the monitoring device 104 can measure the temperature distribution of the object to be monitored in a low-temperature environment. Furthermore, the monitoring device 104 can measure the temperature distribution within the chamber 100 during semiconductor manufacturing processes in a plasma environment.

[0021] In Figure 2, the monitoring device 104 of this embodiment may include a first cover 200, a second cover 202, a third cover 204, a circuit board 206, at least one electronic component 208, a first filler 210, a second filler 212, a first electromagnetic interference shielding layer 214, a second electromagnetic interference shielding layer, and a heat blocking layer 218.

[0022] The third cover 204 is an upper cover that can protect the electronic components on the circuit board 206 from the influence of the external environment, such as a plasma environment.

[0023] In one embodiment, the third cover 204 may have the same circular shape as the wafer and a plane surface, and be made of materials such as silicon or glass commonly used in semiconductor manufacturing processes. Alternatively, the third cover 204 may be made of silicon carbide, sapphire, ceramic-based materials including yttrium oxide (Y2O3), vanadium oxide (YOF), and aluminum oxide (Al2O3), or engineering plastics such as Teflon, polyetheretherketone (PEEK), and carbon fiber.

[0024] The second cover 202 is an intermediate cover disposed between the third cover 204 and the first cover 200, and can be processed into a constant shape to individually separate the electronic components 208. The thermal properties (coefficient of thermal expansion, thermal conductivity) of the second cover 202 can be similar to those of the third cover 204, and the second cover 202 can be made of silicon, glass, silicon carbide, sapphire, yttrium oxide, vanadium oxide, aluminum oxide, Teflon, polyetheretherketone, and carbon fiber, etc.

[0025] The first cover 200 is the lower cover and is used to protect the electronic component 208 from the influence of the external environment. The first cover 200 may have properties similar to those of the third cover 204 or the second cover 202 (coefficient of thermal expansion, thermal conductivity), and may be made of silicon, glass, silicon carbide, sapphire, yttrium oxide, vanadium oxide, aluminum oxide, Teflon, polyetheretherketone, and carbon fiber, etc. In addition, the first cover 200 can directly contact the electrostatic chuck 102, which is the object to be monitored, so that it has the same flatness as the silicon wafer.

[0026] In one embodiment, as shown in FIG. 3, a groove 300 may be formed on the first cover 200, and the circuit board 206 may be partially inserted into the groove 300. In this case, the height of the upper surface of the circuit board 206 may be the same as or greater than the top of the groove 300. For example, the thickness of the circuit board 206 may be greater than the depth of the groove 300. The circuit board 206 may be made of a flexible printed circuit board (PCB), FR-4, or a glass substrate, etc.

[0027] Electronic components 208 may be located on the circuit board 206, including a microprocessor, at least one sensor, a signal processing device, a wireless communication device, a battery, or a wireless charging device. Here, the temperature sensor, acting as a sensor, can measure the temperature distribution of the object to be monitored.

[0028] In one embodiment, an electronic component 208 can be disposed on the circuit board 206 according to its respective recess 300. Of course, two or more electronic components 208 can be disposed on the circuit board 206 according to their respective recesses 300. Due to the presence of the recesses 300, the circuit board 206 can maintain a constant arrangement. Because the circuit board 206 is inserted into the recesses 300, the monitoring device 104 can be made thinner. Furthermore, the recesses 300 can dissipate heat generated by the circuit board 206 to the first cover 200 or the second cover 202 and the third cover 204.

[0029] However, some electronic components cannot function properly in low-temperature environments. For example, microprocessors, batteries, communication ICs, and charging ICs may not work properly in low-temperature environments.

[0030] In one embodiment, to address this issue, a thermal barrier layer 218 can be disposed in a recess 300, into which a portion of a circuit board 206 containing an electronic component 208a susceptible to low-temperature environments is inserted. The thermal barrier layer 218, located between the object to be monitored and the circuit board 206, prevents heat generated by the object from being transferred to the electronic component 208a, thus allowing the electronic component 208a to operate normally even in low-temperature environments, especially ultra-low-temperature environments. In this case, during the plasma process, heat generated by the third cover 204 due to collisions between ions and the third cover 204 is transferred to the electronic component 208a. Therefore, due to the transferred heat and the effect of the thermal barrier layer 218, the electronic component 208a can operate normally in ultra-low-temperature environments. Furthermore, the thickness of the thermal barrier layer 218 can be varied depending on the amount of heat transferred by the object to be monitored.

[0031] A thermal barrier layer may not be required in the recess 300 corresponding to the low-temperature environment resistant portion of electronic component 208. This is because electronic component 208 can operate normally even without a thermal barrier layer. Of course, a corresponding thermal barrier layer can be configured in each recess 300.

[0032] Referring to a monitoring device 104 based on a recess 300, an electronic component 208 can be located on a circuit board 206, a first filler 210 surrounds the electronic component 208 on the circuit board 206, a second cover 202 can be located on one left and one right side of the first filler 210, and a first electromagnetic interference shielding layer 214 can be disposed on the first filler 210. That is, the electronic component 208 can be disposed in a first hole 400 formed in the second cover 202, and the first filler 210 can cover the electronic component 208 in the first hole 400. Alternatively, the first filler 210 can fill the area in the first hole 400 other than the electronic component 208.

[0033] The second electromagnetic interference shielding layer 216 can be located below the circuit board 206 within the groove 300, and the thermal barrier layer 218 and the second electromagnetic interference shielding layer 216 can be located below the circuit board 206 where the electronic component 208a, which is susceptible to low temperature environment, is located.

[0034] The circuit board 206, the thermal barrier layer 218, and the second electromagnetic interference shielding layer 216 are all disposed within the aforementioned recess 300. However, the circuit board 206 may also be located on the first cover 200, and the second electromagnetic interference shielding layer 216 may be located within the first cover 200, or between the circuit board 206 and the first cover 200. In this case, the recess may be formed only below the circuit board 206 on the electronic component 208a, which is susceptible to low-temperature environments, and the thermal barrier layer may be disposed within the recess.

[0035] In another embodiment, the thermal barrier layer 218 may not be located within the recess 300, but may instead cover the electronic component 208a, which is susceptible to low-temperature environments. In this case, the first filler 210 may fill the area in the first hole 400 other than the electronic component 208a and the thermal barrier layer covering the electronic component 208a.

[0036] In another embodiment, at least one recess 300 may have different depths. For example, the depth of the recess 300 corresponding to the electronic component 208a susceptible to low-temperature environments may be greater than the depth of the recess 300 corresponding to other electronic components 208. In this case, the thickness of the second electromagnetic interference shielding layer 216 in the recess 300 corresponding to the electronic component 208a susceptible to low-temperature environments may be the same as the thickness of the second electromagnetic interference shielding layer 216 in other recesses 300.

[0037] The first filler 210 can be formed of the same or similar material as the covers 200, 202, or 204. That is, the first filler 210 can have similar thermal or expansion / contraction properties to the covers 200, 202, or 204, so that when an electrical discharge occurs within the chamber 100, the sensor can accurately sense the heat generated from the surface of the third cover due to ion bombardment of one of its surfaces. The first filler 210 can be formed of a material with high thermal conductivity.

[0038] In addition, the first filler 210 can overcome the step difference between the electronic component 208 and the second cover 202.

[0039] In one embodiment, the first filler 210 may be a liquid and may be made of a curable resin-based material, such as a UV-curable material. For example, an epoxy-based material or a silicone-based material may be used. Of course, the first filler 210 may also be a solid.

[0040] The second filler 212 can be filled into another hole 402 of the second cover 202, and it can be formed of the same or similar material as the first filler 210. The second filler 212 is used to promote heat conduction between the covers 200, 202 and 204. Therefore, the second filler 212 can shorten the thermal equilibrium time between the third cover 204 and the first cover 200. Therefore, the heat-sensitive electronic component 208a can be further protected in a low-temperature environment. Specifically, the third cover 204 generates heat due to ion collisions that occur during the plasma process, while the first cover 200 is cooled because it is located on the electrostatic chuck 102, which is the object to be monitored. Thus, a temperature difference is generated between the third cover 204 and the first cover 200. In this example, the second filler 212 can compensate for the temperature difference between the third cover 204 and the first cover 200 to achieve rapid thermal equilibrium.

[0041] The first electromagnetic interference shielding layer 214 is located between the second cover 202, the first filler 210, and the third cover 204, and can protect electronic components from the electrical noise generated by plasma produced during semiconductor manufacturing processes. Here, the first electromagnetic interference shielding layer 214 can be formed by coating liquid material or thin film, and can be formed of gold, silver, copper, nickel, aluminum, or mixtures thereof.

[0042] The second electromagnetic interference shielding layer 216 may be located below the circuit board 206 within the groove 300, and may be formed of the same or similar material as the first EMI shielding layer 214.

[0043] In another embodiment, the first electromagnetic interference shielding layer 214 may be located inside the third cover 204, while the second electromagnetic interference shielding layer 216 may be located inside the first cover 200.

[0044] The following describes the cubic structure of the monitoring device 104 having the aforementioned structure and functions.

[0045] In Figures 4 and 5, a plurality of first holes 400 and a plurality of second holes 402 may be formed in the second cover 202.

[0046] Electronic component 208 is inserted into first hole 400, and first filler 210 can fill the area in first hole 400 other than electronic component 208.

[0047] The second filler 212 fills the second holes 402 to achieve rapid thermal equilibrium between the third cover 204 and the first cover 200. These second holes 402 may not overlap with these first holes 400 and are uniformly distributed on the second cover 202.

[0048] In one embodiment, the outer diameter of the second cover 202 may be the same as the outer diameter of the third cover 204 or the outer diameter of the first cover 200, as shown in FIG. 5. The first hole 400 or the second hole 402 may be set in parallel as shown in FIG. 4. The size of the first hole 400 may be larger than the size of the second hole 402.

[0049] In Figures 6 and 7, a circular third hole 604 can be formed in the peripheral area of ​​the temperature sensor location of the electronic component 208 on the circuit board 206, and the first hole 600 and the second hole 602 can be formed in the remaining areas. Here, the first hole 600 can correspond to the second hole 402 of the second cover 202, and the second filler 212 can fill the first hole 600. The second hole 602 maintains the alignment of the first cover 200 and the circuit board 206. Heat generated by the circuit board 206 can be dissipated to the first cover 200 through the second hole 602.

[0050] Referring to Figure 7, the circuit board 206 is made of metallic materials such as silver, copper, and gold. Metallic materials are sensitive to increases or decreases in heat. Thus, the temperature of the metallic material in the surrounding area and the desired area can be measured, which generates noise. Therefore, a third hole 604 can be formed around the temperature sensor on the circuit board 206 to block the thermal noise generated by the circuit board 206 from being transmitted to the temperature sensor. Here, the third hole 604 surrounds the temperature sensor.

[0051] On the other hand, since the electrical wiring is connected to the temperature sensor, the third hole 604 can be formed in a circle around the temperature sensor, excluding the electrical wiring. Here, the first hole 600 can also eliminate thermal noise generated by the circuit board 206. Of course, the third hole 604 can have various shapes other than a circle, as long as the third hole 604 surrounds the temperature sensor.

[0052] In another embodiment, a thermal barrier layer, instead of the third hole 604, may be formed in the area surrounding the temperature sensor.

[0053] In short, the monitoring device 104 of this embodiment inserts the circuit board 206 into the groove 300 of the first cover 200, wherein the heat barrier layer 218 is disposed in the groove 300, corresponding to the electronic component 208a which is susceptible to low temperature environment, so that the electronic component 208a can operate normally in low temperature environment.

[0054] The components in the above embodiments can be easily understood from a process perspective. That is, each component can also be understood as a separate process. Similarly, the processes in the aforementioned embodiments can also be easily understood from the perspective of the components.

[0055] Furthermore, the aforementioned technical features can be implemented in the form of program instructions, which can be executed using various computer means and recorded in computer-readable media. Such computer-readable media can include individual or combined program instructions, data files, data structures, etc. The program instructions recorded on the media can be specifically designed and configured for the content of this disclosure, or can be media types known and used by those skilled in the art of computer software. Examples of computer-readable media can include: magnetic media such as hard disks, floppy disks, and magnetic tapes; optical media such as CD-ROMs and DVDs; magneto-optical media such as optical discs; and hardware devices such as ROMs, RAMs, and flash memory. Examples of program instructions can include not only machine language code generated by a compiler, but also high-level language code that can be executed by a computer through an interpreter. The aforementioned hardware can operate as one or more software modules to perform the operations of the embodiments of this disclosure, and vice versa.

[0056] In summary, although this disclosure has been presented above with examples, it is not intended to limit the scope of this disclosure. Those skilled in the art to which this disclosure pertains can make various modifications and refinements without departing from the spirit and scope of this disclosure, and such modifications and refinements are not limited to the examples disclosed herein, but remain within the protection scope of this disclosure. Therefore, the protection scope of this disclosure shall be determined by the appended claims.

[0057] 100: Chamber 102: Electrostatic Chuck 104: Monitoring device 200: First cover 202: Second cover 204: Third cover 206: Circuit board 208, 208a: Electronic components 210: First filler 212: Second filler 214: First electromagnetic interference shielding layer 216: Second electromagnetic interference shielding layer 218: Thermal barrier layer 300: Groove 400, 600: First hole 402, 602: Second hole 604: Third hole

Claims

1. A monitoring device, comprising: A first cover is disposed on an object to be monitored, wherein a groove is formed in the first cover; A circuit board is partially inserted into the recess; and a plurality of electronic components are disposed on the circuit board; wherein a thermal barrier layer is disposed in the recess, a portion of the thermal barrier layer corresponding to a specific electronic element of the circuit board is inserted into the recess to block heat transfer from the object to be monitored to the specific electronic element, and the circuit board is located on the thermal barrier layer, and due to the thermal barrier layer, the specific electronic element operates normally in a sub-zero environment, the specific electronic element being a microprocessor, a battery, a communication IC, or a charging IC; the thermal barrier layer is not disposed in one recess, and a portion of another electronic element is inserted into the recess, while the specific electronic element not on the circuit board is inserted into the recess.

2. The monitoring device as described in claim 1, wherein, The temperature sensor measures the temperature of the object being monitored. Thanks to the thermal barrier layer, the specific electronic component can operate normally even in an environment of -70°C.

3. The monitoring device as claimed in claim 1, wherein a second electromagnetic interference shielding layer is located in the groove, and the thermal barrier layer is not disposed in the groove.

4. The monitoring device as described in claim 1, further comprising: A second cover is disposed on the first cover and has a plurality of first holes and a plurality of second holes spaced apart from each other; wherein, when the electronic components are disposed on the circuit board, the electronic components are inserted into the first holes, a first filler fills the area in each of the first holes except for the corresponding electronic component, and a second filler fills the second holes.

5. The monitoring device as described in claim 4, further comprising: A third cover is disposed on the second cover; And a first electromagnetic interference shielding layer, located between the third cover, the second cover and the first filler; wherein, the top of one of the second covers and the top of one of the first fillers have the same height.

6. The monitoring device as claimed in claim 5, wherein at least one of the first cover, the second cover, and the third cover is made of a ceramic-based material comprising silicon, glass, silicon carbide, sapphire, yttrium oxide (Y2O3), vanadium oxide (YOF), and aluminum oxide (Al2O3), Teflon, polyetheretherketone (PEEK), or carbon fiber, and at least one of the first filler and the second filler is made of an epoxy-based material or a silicon-based material.

7. The monitoring device as claimed in claim 1, wherein a plurality of holes are formed on the circuit board and are arranged with the first cover.

8. The monitoring device as claimed in claim 1, wherein a plurality of holes are formed on the circuit board; and the holes are formed in a surrounding area at a location of a temperature sensor to block heat generated from the circuit board from being transferred to the temperature sensor.

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