Pressure bar assembly, upper mold device and pressing equipment

Abstract

This invention provides a pressure bar assembly, an upper mold device, and a pressing device; the pressure bar assembly includes: a pressure bar with a bar body and a pressure seat at one end of the bar body; a pressure block disposed on the pressure seat; the pressure seat has a fixing surface for fixing the pressure block and a recessed area for providing deformation space for the pressure block; at least one fixing member for fixing the pressure block to the fixing surface; at least one adjusting member for adjusting the deformation of the pressure block in the recessed area; thereby improving the packaging quality by changing the shape of the pressure block.

Description

Technical Field

[0001] This invention relates to a pressure rod assembly, an upper mold device, and a pressing device, particularly to a pressure rod assembly, an upper mold device, and a pressing device for pressing integrated circuit elements covered with an upper cover. Prior Technology

[0002] In the packaging process of integrated circuit components, there is often a need for an upper mold device and a lower mold device of a pressing equipment to work together to press the integrated circuit component covered with a top cover. The upper mold device is provided with a pressure rod assembly on an upper mold base. The pressure rod assembly is mainly provided with a pressure block at one end of the pressure rod that can press against the top cover. The lower mold device is provided with a lower module that can hold the integrated circuit component on a lower mold base. The upper mold device can be driven by a first driving force to move downward relative to the lower mold device, so that the pressure block can first press against the top cover. Then, a second driving force drives the pressure rod assembly to move downward relative to the upper mold base, so that the pressure block can apply a force to press the top cover against the integrated circuit component.

[0003] Please refer to Figures 13 and 14. The integrated circuit element W2' covered by the upper cover W1' can be placed on the lower module 1. The upper cover W1' can be, for example, a heat sink, and the integrated circuit element W2' can be, for example, a substrate W22' carrying the chip W21'. A thermal interface material W3' can be filled between the upper cover W1' and the chip W21' for heat dissipation of the chip W21'. An adhesive material W4' can be filled between the periphery of the upper cover W1' and the substrate W22' for bonding between the upper cover W1' and the substrate W22'. The pressure rod assembly Component 2 is provided with a pressure block 21 at one end of the pressure rod 22. The pressure rod 22 is constructed of a rod-shaped and narrow rod body 221 and a block-shaped and wide pressure seat 222. In the desired state, the bottom surfaces of the pressure block 21 and the pressure seat 222 are approximately parallel to the top surfaces of the lower module 1 and the upper cover W1'. Under the drive of the first driving force F1', the pressure block 21 can flatly press against the upper cover W1'. Under the drive of the second driving force F2', the pressure block 21 can uniformly apply a force to the upper cover W1' to press against the integrated circuit element W2'.

[0004] However, during the pressing process, as shown in Figure 15, the pressing block 21 and the pressing seat 222 are prone to deforming into a shape with the concave surface facing upwards and the convex surface facing downwards. This is partly because the outer portion of the pressing seat 222 is thinner than the middle portion, and the rod 221 is connected to the middle portion of the pressing seat 222. Therefore, when the second driving force F2' drives the pressing rod assembly 2 to move downwards, the outer portion of the pressing seat 222 will warp upwards relative to the middle portion, causing the pressing block 21 to deform along with it. Furthermore, because during the pressing process, it is necessary to... When the top cover W1' and / or the integrated circuit element W2' are heated, the pressure base 222 will expand due to the heat and increase the warping range. Referring to Figure 16, when the pressure block 21, which is deformed into a concave-upward and convex-downward shape, applies force to the top cover W1', it will also deform the top cover W1' into a concave-upward and convex-downward shape, resulting in damage to the chip W21' or the periphery of the top cover W1' failing to adhere to the substrate W22', ultimately causing poor packaging quality. It can be seen that there are still areas for improvement in the prior art. Summary of the Invention

[0005] Therefore, the object of the present invention is to provide a pressure bar assembly that can improve upon at least one of the disadvantages of the prior art.

[0006] Another object of the present invention is to provide an upper mold device that can improve upon at least one of the shortcomings of the prior art.

[0007] Another object of the present invention is to provide a pressing device that can improve upon at least one of the disadvantages of the prior art.

[0008] According to the present invention, a pressure bar assembly includes: a pressure bar having a bar body and a pressure seat at one end of the bar body; a pressure block disposed on the pressure seat; the pressure seat having a fixing surface for fixing the pressure block and a recessed area for providing deformation space for the pressure block; at least one fixing member for fixing the pressure block to the fixing surface; and at least one adjusting member for adjusting the deformation of the pressure block in the recessed area.

[0009] According to another objective of the present invention, the upper mold device includes: an upper mold, at least one pressing mechanism on an upper mold base, the pressing mechanism having the pressing rod assembly as described above.

[0010] According to another object of the present invention, a pressing device is suitable for pressing an integrated circuit element covered by a top cover. The pressing device is provided with a lower mold device and an upper mold device. The lower mold device is provided with at least one lower module that can support the integrated circuit element. The upper mold device is provided with at least one pressure rod assembly as described above. The pressure rod assembly applies a force to the top cover towards the integrated circuit element by means of the pressure block.

[0011] The present invention includes a pressure bar assembly, an upper mold device, and a pressing device, which improve the packaging quality by changing the shape of the pressure block. Simple Explanation of the Diagram

[0012] Figure 1 is a cross-sectional view illustrating that the compressible material in an embodiment of the present invention is an integrated circuit element covered with a top cover. Figure 2 is an exploded perspective view illustrating that the integrated circuit element has a chip on a substrate, and a thermal interface material is formed on the top surface of the chip, while an adhesive material is formed on the periphery of the top surface of the substrate. Figure 3 is a three-dimensional exploded view, illustrating that the compressible system is arranged in a complex matrix on the carrier disk. Figure 4 is a perspective view illustrating the pressing device according to an embodiment of the present invention. Figure 5 is a front view illustrating the actuation relationship between the upper and lower mold devices of the pressing equipment. Figure 6 is a three-dimensional view illustrating the pressing mechanism of the upper mold device. Figure 7 is a perspective view illustrating the pressure bar assembly of the molding mechanism. Figure 8 is a sectional view illustrating section AA of Figure 7. Figure 9 is an exploded three-dimensional view, illustrating that the pressure bar assembly includes a pressure bar and a pressure block. Figure 10 is a three-dimensional view illustrating the pressure seat of the pressure rod from an inverted angle. Figure 11 is a schematic diagram illustrating the deformation of the pressure block into a concave-down shape. Figure 12 is a schematic diagram illustrating the situation where the pressure block, which is deformed into a concave shape, applies a force to the top cover to press against the integrated circuit element. Figure 13 is a schematic diagram illustrating the situation where the pressure block has not yet deformed in the prior art. Figure 14 is a schematic diagram illustrating the situation in the prior art where the undeformed pressure block applies a force to the top cover to press against the integrated circuit element. Figure 15 is a schematic diagram illustrating the shape of the pressing block in the prior art, with the concave side facing up and the convex side facing down. Figure 16 is a schematic diagram illustrating the situation in the prior art where the pressure block, which is deformed into a shape with its concave side facing up and its convex side facing down, applies a force to the top cover to press against the integrated circuit element. Implementation

[0013] Please refer to Figures 1 and 2. The pressure rod assembly, upper mold device, and pressing equipment of this embodiment are suitable for pressing the material W to be pressed as shown in the figure. The material W to be pressed is an integrated circuit (IC) element W2 covered with a top cover W1 (Lid, Heatsink, or Heat Slug). The integrated circuit element W2 has a chip W21 on a substrate W22. A thermal interface material W3 (TIM), such as a film, metal, or liquid metal, will be formed on the top surface of the chip W21. Tim), the thermal interface material W3 can be a composition made of materials such as indium, graphite, silicon, gold, silver, copper, tin, lead, etc., for heat transfer between the chip W21 and the top cover W1. The integrated circuit element W2 will have multiple layers of adhesive material W4 applied around the top surface of the substrate W22 for bonding between the substrate W22 and the top cover W1; the adhesive material W4 can be, for example, thermosetting adhesive; in the embodiments of the present invention, the definition of the chip W21 is to broadly cover, for example, a chip stacking architecture (e.g., Cow, Chip on wafer) consisting of one or more dies or chips combined with a conductive layer (RDL Interposer), and the substrate W22 can be, for example, a printed circuit board (PCB Substrate).

[0014] Please refer to Figure 3. The compound to be compressed, W, can be carried on a carrier plate S and transported. The carrier plate S has a rectangular appearance and is provided with a plurality of placement areas S1 arranged in a matrix and a plurality of cutouts S2 corresponding to the placement areas S1. The placement areas S1 are surrounded by a plurality of positioning pins S11 arranged in a rectangular shape. The compound to be compressed, W, can be arranged in a plurality of matrices on the carrier plate S, and each placement area S1 is for placing one of the compound to be compressed, W.

[0015] Please refer to Figure 4. An embodiment of the present invention can be described using a pressing device as shown in the figure. The carrier plate S carrying the material to be pressed W can be transported to the pressing device so that the material to be pressed W is pressed. The pressing device is provided with an upper mold device A and a lower mold device B.

[0016] Please refer to Figures 4 and 5. The upper mold device A and the lower mold device B are arranged vertically on a frame C with a gap between them. The frame C has a base C1 and a top seat C2, which are supported by a plurality of pivot rods C3. A pivot C4 is provided between the base C1 and the top seat C2. The pivot C4 can be driven by a first driving force F1 provided by an upper mold driver C5 on the top seat C2, and can move up and down on each pivot rod C3 with a large stroke. An operating area C6 is formed between the lower part of the pivot C4 and the upper part of the base C1. The upper mold device A is located in the operating area C6 of the base C. The upper mold device A is positioned above and below the pivot C4 and is linked to it, allowing it to move up and down relative to the lower mold device B. The upper mold device A has an upper mold A1 and a pressing power source A2. The upper mold A1 has a plurality of pressing mechanisms A11 arranged in a matrix on an upper mold base A12. Each pressing mechanism A11 has a pressing rod assembly D. The pressing power source A2 has a plurality of pressing rod drivers A21 arranged in a matrix and corresponding to each pressing mechanism A11. Each pressing rod driver A21 can drive each pressing rod assembly D to move up and down relative to the upper mold base A12 with a second driving force F2, making a small stroke. The lower mold device B is located in the operating area C6 of the frame C and on the base C1; the lower mold device B has a plurality of lower modules B1 arranged in a matrix on a lower mold base B2, each lower module B1 can pass through each cutout S2 and support each of the objects to be pressed W, so that the substrate W22 of the integrated circuit element W2 (FIG. 1) is placed on the lower module B1.

[0017] Please refer to Figures 6 and 7. The pressing mechanism A11 is provided with a limiting component E for pivoting the pressing rod assembly D. The limiting component E can limit the lateral displacement of the pressing rod assembly D and limit the rotation of the pressing rod assembly D about a rotation axis parallel to the Z-axis. However, the pressing rod assembly D can be driven by the pressing rod driver A21 (Figure 5) to move longitudinally relative to the limiting component E. The pressure bar assembly D is equipped with: A pressure rod D1 has a rod body D11 and a pressure seat D12 located at one end of the rod body D11; A pressure block D2 is provided on the pressure base D12 and can press against the upper cover W1 (Figure 1); The limiting component E is equipped with: A pivot E1 is provided for pivoting the rod D11; A limiting seat E2 is provided above the pivot seat E1 and can restrict the rotation of the rod D11; A pressure sensor E3 is located at the upper end of the rod body D11 and can sense the pressure applied to the rod assembly D by the rod actuator A21 (Figure 5).

[0018] Please refer to Figures 7, 8, 9, and 10. In this embodiment of the invention, the material of the pressure block D2 allows it to deform slightly relative to the pressure rod D1 when subjected to external force. The pressure rod D1 can be made of, for example, steel, while the pressure block D2 can be made of, for example, polyetherimide (PEI) plastic or silicon carbide (SiC) ceramic or alumina (Al2O3) ceramic. The pressure base D12 has a fixing surface D121 for fixing the pressure block D2 and a recessed area D122 for providing deformation space for the pressure block D2; the pressure block D2 is fixed to the fixing surface D121 by at least one fixing member D3 (four in this embodiment) and the deformation of the pressure block D2 in the recessed area D122 is adjusted by at least one adjusting member D4 (four in this embodiment); the fixing member D3 and the adjusting member D4 can be, for example, screws in this embodiment. The fixing surface D121 is located on the periphery of the recessed area D122. Specifically, the recessed area D122 is a circular region located in the middle of the pressure seat D12 that is recessed towards the rod body D11. The fixing surface D121 is divided into an outer fixing surface D1211 and an inner fixing surface D1212 by a ring-shaped groove D123. The outer fixing surface D1211 and the inner fixing surface D1212 are located on the same horizontal plane. The recessed area D122 is divided into an outer recessed area D1221 and an inner recessed area D1222 by a ring-shaped partition rib D124. The height of one rib surface D1241 of the partition rib D124 is slightly higher than that of the outer fixing surface D1211 and the inner fixing surface D1212. In this embodiment of the invention, the height difference between the rib surface D1241 and the outer fixing surface D1211 and the inner fixing surface D1212 will be preset to be between 0.1 and 2 mm according to the specification difference of the compound W to be pressed. The groove D123, the outer recessed area D1221 and the inner recessed area D1222 can be connected by at least one channel D125. In this embodiment of the invention, the channel D125 is arranged in a cross shape with multiple intersecting directions. The rod body D11 has an air passage D111 communicating with the inner recessed area D1222. The pressure seat D12 has a plurality of exhaust holes D126 communicating with the groove D123 and the outer recessed area D1221. The air passage D111 can introduce gas and discharge it through the exhaust holes D126 to help the pressure seat D12 of the pressure rod D1 dissipate heat. The pressure base D12 is provided with at least one first through hole D127 (in this embodiment, four holes are symmetrically distributed at the four corners of the pressure base D12) for the fixing member D3 to pass through, and at least one second through hole D128 (in this embodiment, four holes are symmetrically distributed around the periphery of the rod body D11) for the adjusting member D4 to pass through. The first through hole D127 has a wider upper hole section D1271 located at the top and a narrower lower hole section D1272 located at the bottom. The second through hole D128 has a wider upper hole section D1281 located at the top and a narrower lower hole section D1282 located at the bottom. The first through hole D127 corresponds to the outer fixing surface D1211 of the fixing surface D121, and the second through hole D128 corresponds to the outer recessed area D1221 of the recessed area D122. The pressure block D2 is divided into a fixed part D21 corresponding to the fixed surface D121 and a deformable part D22 corresponding to the recessed area D122. The fixed part D21 is located around the deformable part D22. The pressure block D2 is provided with at least one first screw hole D23 (four in this embodiment) corresponding to the first through hole D127 in the fixed part D21 and at least one second screw hole D24 (four in this embodiment) corresponding to the second through hole D128 in the deformable part D22. The first screw hole D23 is provided in a first threaded bushing D25, and the second screw hole D24 is provided in a second threaded bushing D26. The fastener D3 has a wider fixing head D31 and a narrower fixing body D32. The outer periphery of the fixing body D32 is threaded. The fastener D3 can pass through the first through hole D127 and be locked into the first threaded hole D23. The adjusting member D4 has a wider adjusting head D41 and a narrower adjusting body D42. The outer periphery of the adjusting body D42 is threaded. The adjusting member D4 can pass through the second through hole D128 and be locked into the second threaded hole D24.

[0019] In the implementation of this invention, when assembling the pressure rod assembly D, the fixing body D32 of the fixing member D3 passes through the first lower hole section D1272 of the first through hole D127 and is locked into the first screw hole D23, and the fixing head D31 is inserted into the first upper hole section D1271. By locking the fixing member D3 into the first screw hole D23, the fixing member D3 can provide the fixing part D21 with force against the fixing surface D121, thereby fixing the pressure block D2 onto the pressure base D12. Next, the adjusting body D42 of the adjusting member D4 passes through the second lower hole section D1282 of the second through hole D128 and is locked into the second screw hole D24, while the adjusting head D41 is inserted into the second upper hole section D1281. By locking the adjusting member D4 into the second screw hole D24, the deformable part D22 is subjected to force and pulled up relative to the fixed part D21, so that the adjusting member D4 can provide the force for the deformable part D22 to deform and retract into the recessed area D122. The depth of the adjusting member D4 being locked into the second screw hole D24 can be adjusted. By changing the deformation range of the pressure block D2, the deeper it is locked in, the greater the range to which the deformable part D22 is pulled up. The deformable part D22 can be pulled up until it abuts against the rib surface D1241 of the partition rib D124. Since the fixing part D21 is located on the periphery of the deformable part D22, when the fixing part D21 is fixed and the deformable part D22 is pulled up, the bottom of the pressure block D2 will be deformed into a concave surface D27 with the notch facing downward (as shown in Figure 11), that is, the outer part of the pressure block D2 is lower than the middle part of the pressure block D2. When the pressing equipment presses the material to be pressed W, the carrier plate S carrying the material to be pressed W can be transported to the operating area C6 between the upper mold device A and the lower mold device B, and the carrier plate S carrying the material to be pressed W is placed on the lower mold device B, so that each lower module B1 passes through each cutout S2 and supports the integrated circuit element W2 of each material to be pressed W from below; Next, the upper mold device A moves downward under the action of the first driving force F1, so that the pressing block D2, which is in the shape of the concave surface D27 facing downward, presses against the upper cover W1 of the material to be pressed W. At this time, the outer part of the pressing block D2 presses against the outer part of the upper cover W1, and the middle part of the pressing block D2 does not press against the middle part of the upper cover W1. That is, a buffer space D28 (Figure 12) is formed between the concave surface D27 and the upper cover W1. Specifically, the pressing block D2 with the concave surface D27 presses against the position of the upper cover W1 above the adhesive material W4, but does not press against the position of the upper cover W1 above the wafer W21. Next, each of the pressure rod assemblies D in the upper mold device A moves downward under the action of the second driving force F2, so that the pressure block D2, which is shaped into a concave surface D27 facing downward, applies a force to press the upper cover W1 against the integrated circuit element W2 (as shown in Figure 12), which helps the periphery of the upper cover W1 to adhere to the substrate W22 and reduces damage to the wafer W21; wherein, during the pressing process, the pressure block D2 and / or the lower module B1 can heat the upper cover W1 and / or the integrated circuit element W2 via a heater not shown in the figure. Since the heating part is not the focus of the present invention, it will not be described in detail here.

[0020] The pressure bar assembly, upper mold device, and pressing equipment of this invention improve the packaging quality by changing the shape of the pressure block D2.

[0021] However, the above description is merely an embodiment of the present invention and should not be construed as limiting the scope of the present invention. Any simple equivalent changes and modifications made in accordance with the scope of the patent application and the contents of the patent specification shall still fall within the scope of the patent of the present invention.

[0022] This invention A: Upper mold device A1: Upper mold A11: Pressing mechanism A12: Upper mold base A2: Pressing Power Source A21: Pressure lever actuator B: Lower mold device B1: Next Module B2: Lower mold base C: Frame C1: Base C2: Top Seat C3: Pivot C4: Pivot C5: Upper mold driver C6: Operating Range D: Compression bar assembly D1: Compression bar D11: Rod D111: Airway D12: Pressing seat D121: Fixed surface D1211: External fixing surface D1212: Internal fixing surface D122: Recessed area D1221: Recessed Area D1222: Recessed area D123: Trench D124: Rib D1241: Rib surface D125: Channel D126: Exhaust port D127: First through hole D1271: First upper hole section D1272: First lower hole section D128: Second through hole D1281: Second upper hole section D1282: Second lower hole section D2: Pressing block D21: Fixing part D22: Deformation section D23: First screw hole D24: Second screw hole D25: First threaded bushing D26: Second threaded bushing D27: Concave surface D28: Buffer Space D3: Fasteners D31: Fix the head D32: Fixed Body D4: Adjustment parts D41: Adjust the head D42: Adjust body E: Limiting component E1: Pivot E2: Limiting seat E3: Pressure Sensor F1: First Drive F2: Second Drive S: Carrier disk S1: Placement Area S11: Positioning pin S2: Cutout W: Compressible material W1: Top Cover W2: Integrated circuit element W21: Chip W22:Substrate W3: Thermal interface material W4: Adhesive Material Prior Technology 1: Next Module 2: Compression bar assembly 21: Pressed block 22: Compression bar 221: Rod 222: Pressure seat F1': First Drive F2': Secondary driving force W1': Top cover W2': Integrated circuit element W21': Chip W22':Substrate W3': Thermal interface material W4': Adhesive Material

Claims

1. A pressure bar assembly, comprising: a pressure bar having a bar body and a pressure seat at one end of the bar body; a pressure block disposed on the pressure seat; the pressure seat having a fixing surface for fixing the pressure block and a recessed area for providing deformation space for the pressure block; at least one fixing member for fixing the pressure block to the fixing surface; and at least one adjusting member for adjusting the deformation of the pressure block in the recessed area.

2. The lever assembly as described in claim 1, wherein, The pressure block is divided into a fixing part corresponding to the fixing surface and a deformable part corresponding to the recessed area, with the fixing part located on the periphery of the deformable part.

3. The strut assembly as described in claim 2, wherein, The fastener provides the force for the fixed part to adhere to the fixed surface, and the adjusting part provides the force for the deformable part to deform and retract into the recessed area.

4. The strut assembly as described in claim 3, wherein, The deformation of the deformable part into the recessed area is due to the deformation of the deformable part being pulled up relative to the fixed part by the force applied to it.

5. The strut assembly as described in claim 1, wherein, The pressure bar is made of metal, while the pressure block is made of plastic or ceramic.

6. The strut assembly as described in claim 1, wherein, The pressure base is provided with at least one first through hole through which the fixing member passes and at least one second through hole through which the adjusting member passes; the pressure block is provided with at least one first screw hole corresponding to the first through hole and at least one second screw hole corresponding to the second through hole; the fixing member can pass through the first through hole and be locked into the first screw hole, and the adjusting member can pass through the second through hole and be locked into the second screw hole.

7. The strut assembly as described in claim 6, wherein, The first through hole and the first screw hole correspond to the fixing surface, and the second through hole and the second screw hole correspond to the recessed area.

8. An upper mold assembly comprising: an upper mold having at least one pressing mechanism on an upper mold base, the pressing mechanism having a pressing rod assembly as described in any one of claims 1 to 7.

9. The upper mold assembly as described in claim 8, wherein, The upper mold device is also provided with a pressing power source, which is provided with at least one pressure rod driver corresponding to the pressing mold mechanism. The pressure rod driver can drive the pressure rod assembly to move up and down relative to the upper mold base.

10. A pressing apparatus suitable for pressing an integrated circuit element covered by a top cover, the pressing apparatus comprising a lower mold device and an upper mold device; the lower mold device having at least one lower module for supporting the integrated circuit element, the upper mold device having at least one pressure bar assembly as described in any one of claims 1 to 7, the pressure bar assembly applying a force to the top cover toward the integrated circuit element by means of the pressure block.

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