Modified maleimide resin and resin composition

Abstract

This invention provides a modified maleimide resin and a resin composition. The modified maleimide resin has a structure represented by the following formula (1). In formula (1), R1 to R7, n, m, and p are defined as in the specification. Formula (1)

Description

Technical Field

[0001] This invention relates to a maleimide resin, and more particularly to a modified maleimide resin and resin composition. Prior Technology

[0002] Bismaleimide resins possess excellent heat resistance, moisture resistance, dielectric constant (Dk), and dielectric loss (Df), making them commonly used as insulating materials in high-performance electronic substrates. However, the dielectric constant and dielectric loss of currently used bismaleimide resins are still relatively high, limiting their application in 5G electronic products and thus affecting the performance of such products. Summary of the Invention

[0003] The present invention provides a modified maleimide resin capable of forming good heat resistance, peel resistance, moisture resistance and dielectric properties, and resin compositions comprising the thereof.

[0004] A modified maleimide resin of the present invention has a structure represented by the following formula (1). Equation (1), In equation (1), R1, R2, and R3 each represent an aryl, alkyl, ether, or a combination thereof. R4, R5, R6, and R7 each represent an alkyl group having 1 to 10 carbon atoms. n, m, and p each represent an integer greater than or equal to 0.

[0005] In one embodiment of the present invention, R1, R2 and R3 each represent a phenyl group, an alkyl group having 1 to 10 carbon atoms, an ether group or a combination thereof.

[0006] In one embodiment of the present invention, R1, R2 and R3 each represent an alkyl group having 1 to 10 carbon atoms, a divalent organic group represented by formula (1A), a divalent organic group represented by formula (1B), or a combination thereof: Equation (1A), Equation (1B), In equations (1A) and (1B), * indicates the location of the bond.

[0007] In one embodiment of the present invention, the modified maleimide resin has a weight average molecular weight of 3,000 g / mole to 25,000 g / mole.

[0008] One resin composition of the present invention includes an epoxy resin, a bismaleimide resin, the above-mentioned modified maleimide resin, and a curing agent.

[0009] In one embodiment of the present invention, the epoxy resin includes naphthol-type epoxy resin, biphenyl-type epoxy resin, bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, or a combination thereof.

[0010] In one embodiment of the present invention, the above-mentioned bismaleimide resin includes N,N'-(4,4'-methylenediphenyl)bismaleimide, phenylmethane maleimide polymer, N,N'-(1,3-epenylphenyl)bismaleimide, 2,2'-bis[4-(4-maleiminophenoxy)phenyl]propane, bis(3-ethyl-5-methyl-4-maleiminophenyl)methane, N,N'-(4-methyl-1,3-epenylphenyl)bismaleimide, or combinations thereof.

[0011] In one embodiment of the present invention, the curing agent includes phenolic varnish resin, benzoxazine resin, acid anhydride, or a combination thereof.

[0012] In one embodiment of the present invention, based on a total usage of 100 parts by weight of the above-mentioned resin composition, the amount of epoxy resin used is 10 to 30 parts by weight, the amount of bismaleimide resin used is 30 to 50 parts by weight, the amount of modified maleimide resin used is 5 to 20 parts by weight, and / or the amount of hardener used is 25 to 45 parts by weight.

[0013] In one embodiment of the present invention, the above-mentioned resin composition further includes an accelerator, a filler, or a combination thereof.

[0014] In one embodiment of the present invention, the above-mentioned accelerator includes imidazole compounds, amine compounds, peroxides, or combinations thereof.

[0015] In one embodiment of the present invention, the filler material includes a filler material having epoxy groups, amino groups or a combination thereof.

[0016] In one embodiment of the present invention, the filler material includes carbon black, silicone, silicon dioxide, boron nitride, aluminum oxide, aluminum nitride, or a combination thereof.

[0017] In one embodiment of the present invention, the particle size of the filler material is 0.01 micrometers to 5 micrometers.

[0018] In one embodiment of the present invention, the content of the accelerator in the above-mentioned resin composition is from 0.2 phr to 1.2 phr.

[0019] In one embodiment of the present invention, the total amount of non-volatile components used in the above-mentioned resin composition is 100 parts by weight, and the amount of filler material used is 50 to 70 parts by weight.

[0020] Based on the above, the present invention provides a modified maleimide resin having a structure represented by formula (1). This allows resin compositions comprising the modified maleimide resin to possess good heat resistance, peel resistance, moisture resistance, and dielectric properties.

[0021] To make the above features and advantages of the present invention more apparent and understandable, specific embodiments are described in detail below. Simple Explanation of the Diagram

[0022] none. Implementation

[0023] The following are embodiments that describe the contents of this invention in detail. The implementation details presented in the embodiments are for illustrative purposes only and are not intended to limit the scope of protection of this invention. Anyone skilled in the art can modify or change these implementation details according to the needs of actual implementation.

[0024] A range may be expressed herein as from “about” a specific value to “about” another specific value, or it may be directly expressed as a specific value and / or to another specific value. In expressing the range, another embodiment includes from that specific value and / or to another specific value. Similarly, when a value is expressed as an approximation by using the antecedent “about,” it will be understood that the specific value forms another embodiment. It will be further understood that each endpoint of a range may be obviously related to or unrelated to another endpoint.

[0025] In this document, non-limiting terms (such as: may, can, for example, or other similar terms) are non-essential or optional implementations, inclusions, additions, or existences.

[0026] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will also be understood that terms (such as those defined in commonly used dictionaries) shall be interpreted as having the same meaning as in the relevant technical context and shall not be interpreted in an idealized or overly formal sense, unless expressly defined herein.

[0027] In this paper, a "divalent organic group" is an organic group with two bonding positions, and a "divalent organic group" can form two chemical bonds through these two bonding positions.

[0028] A modified maleimide resin according to this embodiment has a structure represented by the following formula (1).

[0029] Equation (1)

[0030] In equation (1), R1, R2, and R3 each represent an aryl, alkyl, ether, or a combination thereof. R4, R5, R6 and R7 each represent an alkyl group having 1 to 10 carbon atoms, preferably an alkyl group having 1 to 5 carbon atoms, and more preferably propyl, butyl or pentyl; n, m, and p each represent integers greater than or equal to 0, preferably integers between 2 and 10.

[0031] In this embodiment, R1, R2, and R3 preferably represent phenyl groups, alkyl groups having 1 to 10 carbon atoms, ether groups, or combinations thereof; more preferably, they each represent alkyl groups having 3 to 6 carbon atoms, divalent organic groups represented by formula (1A), divalent organic groups represented by formula (1B), or combinations thereof. Alkyl groups having 1 to 10 carbon atoms may include methylene, ethyl, propyl, butyl, or pentyl. Butyl groups represented by R1 to R7 may include n-butyl, isobutyl, dibutyl, or tributyl.

[0032] Equation (1A)

[0033] Equation (1B)

[0034] In equations (1A) and (1B), * indicates the location of the bond.

[0035] When p represents an integer of 2 or greater than 2, multiple R2s can each represent the same or different divalent organic groups, multiple R6s can each represent the same or different divalent organic groups, and multiple R7s can each represent the same or different divalent organic groups.

[0036] The modified maleimide resin has a weight average molecular weight (Mw) of 3,000 g / mol to 25,000 g / mol, preferably 8,000 g / mol to 15,000 g / mol.

[0037] An exemplary embodiment of the present invention provides a resin composition comprising an epoxy resin, a bismaleimide resin, the aforementioned modified maleimide resin, and a curing agent. Furthermore, the resin composition of the present invention may, if desired, further include accelerators, fillers, or other suitable additives. The various components described above will be described in detail below.

[0038] [Epoxy Resin]

[0039] There are no particular limitations on the epoxy resin used; an appropriate epoxy resin can be selected according to requirements. In this embodiment, the epoxy resin may include naphthol-type epoxy resin, biphenyl-type epoxy resin, bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, or other suitable epoxy resins, preferably naphthol-type epoxy resin, biphenyl-type epoxy resin, or a combination thereof. Commercially available epoxy resins may include 7050, HP4710, HP-4700, HP-6000, HP-7200, or N-695 manufactured by DIC Corporation; NC7000L, NC3000, or NC3500 manufactured by Nippon Kayaku Co., Ltd.; ESN475V or ESN485 manufactured by Nippon Steel Chemical Co., Ltd.; YX4000 or YL7760 manufactured by Mitsubishi Chemical Co., Ltd.; NPES-903, NPEL-128E, or NPEL-170 manufactured by Nan Ya Plastics Co., Ltd.; or other suitable epoxy resins. Epoxy resins may be used alone or in combination.

[0040] Based on a total amount of 100 parts by weight of resin components, the amount of epoxy resin used can be from 10 parts by weight to 30 parts by weight, preferably from 15 parts by weight to 25 parts by weight.

[0041] [Dimaleimide resin]

[0042] There are no particular limitations on bismaleimide resins; appropriate bismaleimide resins can be selected according to requirements. In this embodiment, the bismaleimide resin may include N,N'-(4,4'-methylenediphenyl)bismaleimide (4,4'-bismaleimidodiphenylmethane; CAS No.: 13676-54-5), phenylmethane maleimide polymer (phenylmethane maleimide; CAS No.: 67784-74-1), and N,N'-(1,3-epenylphenyl)bismaleimide (N,N'-1,3-phenylene) bismaleimide (CAS No.: 3006-93-7), 2,2'-bis[4-(4-maleimidophenoxy)phenyl]propane (CAS No.: 79922-55-7), bis(3-ethyl-5-methyl-4-maleimidophenyl)methane (CAS No.: 105391-33-1), N,N'-(4-methyl-1,3-phenylene)bismaleimide (CAS No.: 6422-83-9) or other suitable bismaleimide resins, preferably N,N'-(4,4'-methylenediphenyl)bismaleimide. Commercially available examples of bismaleimide resins may include BMI-1000 (trade name; manufactured by Yamato Chemical Industries, Ltd.), BMI-2000 (trade name; manufactured by Yamato Chemical Industries, Ltd.), BMI-2300 (trade name; manufactured by Yamato Chemical Industries, Ltd.), BMI-3000 (trade name; manufactured by Yamato Chemical Industries, Ltd.), BMI-4000 (trade name; manufactured by Yamato Chemical Industries, Ltd.), BMI-5100 (trade name; manufactured by Yamato Chemical Industries, Ltd.), BMI-7000 (trade name; manufactured by Yamato Chemical Industries, Ltd.), or other suitable bismaleimide resins. Bismaleimide resins can be used alone or in combination.

[0043] Based on a total usage of 100 parts by weight of resin components, the usage of bismaleimide resin can be 30 to 50 parts by weight, preferably 35 to 45 parts by weight.

[0044] [Modified maleimide resin]

[0045] The modified maleimide resin is the modified maleimide resin having the structure represented by formula (1) described above. Based on a total amount of 100 parts by weight of resin composition, the amount of modified maleimide resin used can be from 5 parts by weight to 20 parts by weight, preferably from 8 parts by weight to 15 parts by weight. When the resin composition includes a modified maleimide resin with a specific structure, the resin composition can possess good heat resistance and dielectric properties.

[0046] [hardener]

[0047] There are no particular limitations on the hardener; an appropriate hardener can be selected according to requirements. In this embodiment, the hardener may include phenolic varnish resin, benzoxazine resin, acid anhydride, or other suitable hardeners, preferably phenolic varnish resin, benzoxazine resin, or a combination thereof. A single hardener may be used, or multiple hardeners may be used in combination.

[0048] For example, phenolic varnish resin may include phenolic novolac resin, cresol novolac resin, bisphenol A novolac resin, benzoxazine resin, biphenyl novolac type phenolic resin, aminotriazine novolac type phenolic resin, or other suitable phenolic varnish resin. Acid anhydrides may include pyromellitic anhydride, trimellitic anhydride, benzophenonetetracarboxylic dianhydride, or other suitable acid anhydrides.

[0049] Based on the total amount of resin components used being 100 parts by weight, the amount of hardener used can be from 25 parts by weight to 45 parts by weight, preferably from 30 parts by weight to 40 parts by weight.

[0050] [Accelerator]

[0051] There are no particular limitations on the accelerator; an appropriate accelerator can be selected according to requirements. In this embodiment, the accelerator may include imidazole compounds, amine compounds, peroxides, or other suitable accelerators, preferably imidazole compounds. An accelerator can be used alone or in combination.

[0052] For example, imidazole compounds may include 1-methylimidazolium, 2-methylimidazolium, 2-ethylimidazolium, 2-isopropylimidazolium, 2-n-propylimidazolium, 2-undecylimidazolium, 2-heptadecanylimidazolium, 1,2-dimethylimidazolium, 2-ethyl-4-methylimidazolium, 2-phenylimidazolium, 2-phenyl-4-methylimidazolium, 1-benzyl-2-methylimidazolium, 1-benzyl-2-phenylimidazolium, 1-isopropyl-2-methylimidazolium, and 1-cyanoethyl-2-methylimidazolium. 1-Cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 1,2-diphenyl-4-methyl-5-hydroxymethylimidazole, 1-dodecyl-2-methylimidazole, 1-cyanoethyl-2-phenyl-4,5-di(2-cyanoethoxy)methylimidazole or other suitable imidazole compounds.

[0053] In the resin composition, the content of the accelerator can be from 0.2 phr to 1.2 phr, preferably from 0.3 phr to 0.8 phr.

[0054] [Filling Material]

[0055] There are no particular limitations on the filler material; appropriate fillers can be selected according to requirements. For example, the filler material may include organic fillers, inorganic fillers, or combinations thereof, with inorganic fillers being preferred. In this embodiment, the filler material may include fillers having epoxy groups, amino groups, or combinations thereof. Inorganic fillers may include carbon black, silica gel, silicon dioxide, boron nitride, aluminum oxide, aluminum nitride, or other suitable inorganic fillers. A single filler material may be used, or multiple fillers may be used in combination.

[0056] The particle size of the filler material can be from about 0.01 micrometers to about 5 micrometers, preferably from about 0.5 micrometers to about 1 micrometer.

[0057] Based on a total usage of 100 parts by weight of non-volatile components in the resin composition, the amount of filler used can be 50 to 70 parts by weight, preferably 55 to 65 parts by weight. For example, the non-volatile components in the resin composition may include epoxy resin, bismaleimide resin, modified maleimide resin, and a curing agent. Based on a total usage of 100 parts by weight of epoxy resin, bismaleimide resin, modified maleimide resin, and curing agent in the resin composition, the amount of filler used can be 50 to 70 parts by weight, preferably 55 to 65 parts by weight.

[0058] [Preparation method of resin composition]

[0059] There are no particular limitations on the preparation method of the resin composition. For example, the components of the resin composition are placed in a stirrer and stirred until they are uniformly mixed into a solution. A solvent may be added if necessary. After mixing evenly, the resin composition is obtained.

[0060] It should be noted that the resin composition of the present invention can be processed into prepreg and / or copper foil substrate according to actual design requirements. Therefore, the prepreg and copper foil substrate made using the resin composition of the present invention also have good heat resistance, peel resistance, moisture resistance and dielectric properties, and thus have good applicability. More specifically, the dielectric constant of the prepreg and copper foil substrate made of the resin composition can be from about 3.24 to about 3.75, the dielectric loss can be less than about 0.00079 (e.g., from about 0.0063 to about 0.0079), and it can have a coefficient of thermal expansion of less than about 6 ppm / ℃ (e.g., from about 3.70 ppm / ℃ to about 5.97 ppm / ℃) and a glass transition temperature of more than about 300℃.

[0061] The invention will be described in detail below with reference to examples. The following examples are provided to illustrate the invention, and the scope of the invention includes the scope described in the following claims, as well as their substitutions and modifications, but is not limited to the scope of the examples.

[0062] [Synthesis Example of Modified Maleimide Resin]

[0063] The following describes the synthesis examples 1 to 6 of the modified maleimide resin:

[0064] [Synthesis example] [1]

[0065] In a round-bottom reaction flask, 44 parts by weight of bismaleimide resin and 100 parts by weight of propylene glycol monomethyl ether acetate (PMA) were added, mixed, and heated to approximately 110°C. The mixture was then stirred for 15 minutes. Next, 56 parts by weight of siloxane diamine were added, mixed, and heated to approximately 120°C. The mixture was then stirred for another 4 hours to obtain the modified maleimide resin of Synthesis Example 1 (Mw approximately 6,085 g / mole).

[0066] [Synthesis example] [2] [To the example of synthesis] [6]

[0067] The modified maleimide resins of Synthetic Examples 2 to 6 were prepared using the same steps as those of Synthetic Example 1, except that the types and amounts of the modified maleimide resins were changed (as shown in Table 1).

[0068] [Table 1] Ingredients (Unit: parts by weight) Product Name Synthesis example 1 2 3 4 5 6 bismaleimide resin BMI-1000 44 twenty three - - - - BMI-80 - - twenty one 57 32 56 siloxane diamine KF-8012 - - 79 - - - KF-8010 56 - - 43 - - NH 30 D - 77 - - 68 - BY16-853U - - - - - 44 solvent PMA 100 100 100 100 100 100 Weight-average molecular weight (g / mol) 6,085 14,055 23,932 8,153 15,328 8,365 BMI-1000: It has the structure represented by the following formula (2) and is manufactured by Yamato Chemical Industry Co., Ltd. Equation (2) BMI-80: It has the structure represented by the following formula (3) and is manufactured by Keiichi Kasei Co., Ltd. Equation (3) KF-8012: Manufactured by Shin-Etsu Chemical Industry Co., Ltd. KF-8010: Manufactured by Shin-Etsu Chemical Industry Co., Ltd. NH 30 D: Manufactured by Wacker Chemie AG. BY16-853U: Manufactured by Dow Corning Toray Industries, Ltd.

[0069] [Examples of Resin Compositions]

[0070] Examples 1 to 6 of the resin composition and Comparative Example 1 are described below:

[0071] [Example] [1] [To the Example] [6] [And comparative examples] [1]

[0072] Based on the contents of Table 2, the components of the resin composition in each experimental example were mixed with a mixed solution of butanone and cyclohexanone (weight ratio 1:1) to form a varnish of the resin composition. The varnish was impregnated with a fibrous substrate (e.g., fiberglass cloth purchased from Shin-Etsu Co., Ltd., model SQX-Y1078C-04imp) at room temperature, and then dried at 130°C (impregnation machine) for several minutes to obtain a prepreg with a resin content of approximately 70% by weight. Subsequently, 2 to 8 prepreg layers were stacked between two metal foils (e.g., 18 μm thick copper foil), and held at a pressure of, for example, 25 kg / cm² and a temperature of 85°C for 20 minutes. The temperature was then increased to 220°C at a rate of 3°C / min, and held at this temperature for another 120 minutes. Finally, the temperature was slowly cooled to 130°C to obtain a metal-clad laminate (e.g., a copper foil substrate) with a thickness of approximately 0.1 to 0.8 mm, and its properties were evaluated. The resulting copper foil substrate was evaluated using the following methods, and the results are shown in Table 2.

[0073] [Table 2] Ingredients (Unit: parts by weight) Example Comparative example 1 2 3 4 5 6 1 Epoxy resin HP-6000 20.0 20.0 20.0 20.0 20.0 20.0 22.2 bismaleimide resin DFE-953 17.8 17.8 17.8 17.8 17.8 17.8 19.8 BMI-1000 20.0 20.0 20.0 20.0 20.0 20.0 22.2 Modified maleimide resin Synthesis example 1 10.0 0 0 0 0 0 0 Synthesis example 2 0 10.0 0 0 0 0 0 Synthesis example 3 0 0 10.0 0 0 0 0 Synthesis example 4 0 0 0 10.0 0 0 0 Synthesis example 5 0 0 0 0 10.0 0 0 Synthesis example 6 0 0 0 0 0 10.0 0 hardener KB-610F 32.2 32.2 32.2 32.2 32.2 32.2 35.8 Accelerator 2P4MHZ-PW 0.5 phr 0.5 phr 0.5 phr 0.5 phr 0.5 phr 0.5 phr 0.5 phr Inorganic filler materials EQK0610-SKS 60.5% 60.5% 60.5% 60.5% 60.5% 60.5% 60.5% evaluate result Tg (°C) DMA 317 304 344 349 347 321 320 CTE (ppm / ℃) TMA 4.69 5.97 5.63 3.70 4.49 4.00 6.80 Peel strength (lb / in) 3.77 3.33 3.97 3.89 3.32 3.29 3.35 2 hr PCT Water absorption rate (%) 0.57% 0.64% 0.33% 0.39% 0.66% 0.05% 0.35% 288℃ Heat resistance pass pass pass pass pass pass pass Electrical (10GHz) Dk 3.57 3.24 3.65 3.75 3.69 3.45 4.65 Df 0.0079 0.0070 0.0063 0.0078 0.0078 0.0070 0.0085 HP-6000: Trade name, manufactured by DIC, is a naphthol-type epoxy resin. DFE-953: Product name, manufactured by Dongcai Technology Co., Ltd. BMI-1000: It has a structure represented by formula (2) and is manufactured by Yamato Chemical Industry Co., Ltd. KB-610F: Product name, manufactured by Kunmeng Chemical Industry Co., Ltd. It is a benzoxazine resin. 2P4MHZ-PW: Product name, manufactured by Shikoku Kasei Corporation. EQK0610-SKS: Product name, manufactured by Sanjiki Co., Ltd. Average particle size is approximately 0.8 micrometers. [<] [Evaluation Method] [>] [a.] Glass transfer temperature () [glass transition temperature] [,] [Tg] [)]

[0074] The glass transition temperature (Tg) of the prepared copper foil substrate was measured using a dynamic mechanical analyzer (model DMA 850, manufactured by TA Instruments). A higher Tg indicates that the resin composition has good resistance to phase changes, i.e., good heat resistance. Heating rate: 20℃ / min Temperature range: 20℃~400℃ (heating, cooling, heating) [b.] Coefficient of thermal expansion () [coefficient of thermal expansion] [,] [CTE] [)]

[0075] The coefficient of thermal expansion (CTE) of the prepared copper foil substrate was measured using a thermomechanical analyzer (model TA Q400, manufactured by TA Instruments). The smaller the CTE, the better the resin composition's ability to resist phase changes, i.e., good heat resistance. Heating rate: 20℃ / min Temperature range: 20℃~260℃ [c.] [Peel strength]

[0076] The peel strength of the prepared copper foil substrate was measured using a universal tensile testing machine. A higher peel strength indicates that the resin composition has a good ability to resist peeling from the substrate, i.e., good peel resistance. [d.] Water absorption rate

[0077] The prepared copper foil substrate was placed in a constant temperature and humidity chamber and heated at 120°C and 2 atm for 120 minutes. The weight change before and after heating was calculated, which is the water absorption rate. The lower the water absorption rate, the better the moisture resistance of the resin composition. [e. 288] [℃] [Heat resistance]

[0078] If no delamination occurs after immersing the prepared copper foil substrate in a 288°C soldering furnace for 10 minutes, it is considered to have passed the test. [f.] [Dielectric constant ()] [dielectric constant] [,] [Dk] [)]

[0079] The dielectric constant (Dk) of the fabricated copper foil substrate was measured at a frequency of 10 GHz using a dielectric analyzer (model E4991A, manufactured by Agilent Technologies). A smaller dielectric constant indicates that the copper foil substrate has good dielectric properties. [g.] Dielectric loss () [dissipation factor] [,] [Df] [)]

[0080] The dielectric loss (Df) of the fabricated copper foil substrate was measured at a frequency of 10 GHz using a dielectric analyzer (model E4991A, manufactured by Agilent Technologies). The lower the dielectric loss, the better the dielectric properties of the copper foil substrate. [<] [Evaluation Results] [>]

[0081] As shown in Table 2, when the resin composition includes a modified maleimide resin having the structure represented by formula (1) (Examples 1 to 6), the resin composition simultaneously possesses good heat resistance, peel resistance, moisture resistance and dielectric properties.

[0082] Furthermore, compared to resin compositions that do not include modified maleimide resin having the structure represented by formula (1) (Comparative Example 1), resin compositions that include modified maleimide resin having the structure represented by formula (1) (Examples 1 to 6) have a smaller coefficient of thermal expansion, a smaller dielectric constant, and a smaller dielectric loss, i.e., better heat resistance and dielectric properties, while also having good peel resistance and moisture resistance.

[0083] In summary, the resin composition of the present invention includes a modified maleimide resin represented by a specific formula (1), which enables the substrate made from the resin composition to have good heat resistance, peel resistance, moisture resistance and dielectric properties, and thus good applicability.

[0084] Although the present invention has been disclosed above by way of embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

[0085] none.

Claims

1. A modified maleimide resin having a structure represented by the following formula (1): Formula (1), in which R1, R2 and R3 each represent an aryl, alkyl, ether or a combination thereof, R4, R5, R6 and R7 each represent an alkyl group having 1 to 10 carbon atoms, n and m each represent an integer greater than 0, and p represents an integer from 2 to 10.

2. The modified maleimide resin as claimed in claim 1, wherein R1, R2 and R3 each represent an alkyl group, an alkyl group having 1 to 10 carbon atoms, an ether group or a combination thereof.

3. The modified maleimide resin as claimed in claim 1, wherein R1, R2 and R3 each represent an alkyl group having 1 to 10 carbon atoms, a divalent organic group represented by formula (1A), a divalent organic group represented by formula (1B), or a combination thereof: Formula (1A), Formula (1B), In formulas (1A) and (1B), * indicates a bond position.

4. The modified maleimide resin as claimed in claim 1, wherein the modified maleimide resin has a weight average molecular weight of 3,000 g / mole to 25,000 g / mole.

5. A resin composition comprising: Epoxy resin; Bismaleimide resin; The modified maleimide resin as described in any one of claims 1 to 4; And a hardener, wherein the total amount of the resin composition used is 100 parts by weight, the amount of the epoxy resin used is 10 to 30 parts by weight, the amount of the bismaleimide resin used is 30 to 50 parts by weight, the amount of the modified maleimide resin used is 5 to 20 parts by weight, and / or the amount of the hardener used is 25 to 45 parts by weight.

6. The resin composition as claimed in claim 5, wherein the epoxy resin comprises naphthol-type epoxy resin, biphenyl-type epoxy resin, bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, or a combination thereof.

7. The resin composition of claim 5, wherein the bismaleimide resin comprises N,N'-(4,4'-methylenediphenyl)bismaleimide, phenylmethane maleimide polymer, N,N'-(1,3-epenylphenyl)bismaleimide, 2,2'-bis[4-(4-maleiminophenoxy)phenyl]propane, bis(3-ethyl-5-methyl-4-maleiminophenyl)methane, N,N'-(4-methyl-1,3-epenylphenyl)bismaleimide, or combinations thereof.

8. The resin composition as claimed in claim 5, wherein the hardener comprises phenolic varnish resin, benzoxazine resin, acid anhydride, or a combination thereof.

9. The resin composition as described in claim 5, further comprising: Accelerators, fillers, or combinations thereof.

10. The resin composition of claim 9, wherein the accelerator comprises imidazole compounds, amine compounds, peroxides, or combinations thereof.

11. The resin composition as claimed in claim 9, wherein the filler material comprises a filler material having epoxy groups, amino groups, or a combination thereof.

12. The resin composition of claim 9, wherein the filler material comprises carbon black, silicone, silicon dioxide, boron nitride, aluminum oxide, aluminum nitride, or a combination thereof.

13. The resin composition as claimed in claim 9, wherein the particle size of the filler material is from 0.01 micrometers to 5 micrometers.

14. The resin composition as claimed in claim 9, wherein the accelerator content in the resin composition is from 0.2 phr to 1.2 phr.

15. The resin composition as claimed in claim 9, wherein the total amount of non-volatile components in the resin composition used is 100 parts by weight, and the amount of filler material used is 50 to 70 parts by weight.

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