Package structure

The packaging structure integrates a waveguide and reconfiguration circuit layer to address high-density and cost challenges in HPC, achieving efficient optical signal transmission and reduced substrate size.

TWI932322BActive Publication Date: 2026-07-11UNIMICRON TECH CORP
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Patent Information

Application Number
TW114126146
Authority / Receiving Office
TW · TW
Patent Type
Patents
Current Assignee / Owner
Filing Date
2025-07-10
Publication Date
2026-07-11
Estimated Expiration
2045-07-09

AI Technical Summary

Technical Problem

Current high-performance computing (HPC) packaging structures face challenges in achieving high-density and low-cost solutions due to the limitations of existing build-up package substrates and through-silicon via interposers, which are expensive and require large area for thin-film redistribution layers.

Method used

A packaging structure incorporating a circuit board with a waveguide structure, reconfiguration circuit layer, dedicated integrated circuit assembly, optoelectronic components, and optical fiber assembly, utilizing a reconfiguration circuit structure layer with vias and redistribution circuits to integrate components efficiently, and optical connections through a solid mirror and waveguide.

Benefits of technology

The proposed structure meets high-density requirements, reduces costs, and enhances optical performance by transmitting signals through a waveguide structure, while eliminating the need for expensive interposers and reducing the size of the packaging substrate.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure IMG-2_DRAW_114126146-A0305-14-0001-1
    Figure IMG-2_DRAW_114126146-A0305-14-0001-1
  • Figure IMG-2_DRAW_114126146-A0305-14-0002-2
    Figure IMG-2_DRAW_114126146-A0305-14-0002-2
  • Figure IMG-2_DRAW_114126146-A0305-14-0003-3
    Figure IMG-2_DRAW_114126146-A0305-14-0003-3
Patent Text Reader

Abstract

A packaging structure includes a circuit board, a reconfiguration circuit structure layer, a dedicated integrated circuit assembly, an optoelectronic component, a solid mirror, and an optical fiber assembly. The circuit board includes a waveguide structure. The reconfiguration circuit structure layer is disposed on the circuit board and includes a first via and a second via corresponding to the waveguide structure. The optoelectronic component is disposed on the reconfiguration circuit structure layer and is arranged side-by-side with the dedicated integrated circuit assembly. The optoelectronic component includes a photonic integrated circuit assembly and an electronic integrated circuit assembly. The first via exposes a portion of the photonic integrated circuit assembly. The solid mirror is disposed above the reconfiguration circuit structure layer and corresponds to the second via. The optical fiber assembly is disposed on the circuit board and is optically connected to the photonic integrated circuit assembly through the solid mirror and the waveguide structure.
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