Substrate processing apparatus

Abstract

This invention relates to a substrate processing apparatus, and more particularly to a substrate processing apparatus for performing a high-pressure process, comprising: an inner tube (100) having a processing space (S1) formed inside which a plurality of substrates are stacked in a vertical direction for processing; a heater section (200) surrounding at least a portion of the inner tube (100), forming a heating space (S2) between the heater section (100) and the heater section (200), and receiving power from the outside to generate heat; and an outer tube (300) having the heater section (200) disposed inside, forming an internal space (S3) between the heater section (200) and the heater section (200), and having at least one switchable opening (302) on its side to allow access to the internal space (S3) from the outside; wherein the heater section (200) is electrically connected to a power supply section (700) that transmits power through the outer tube (300) at a position corresponding to the opening (302).

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus, and more specifically, to a substrate processing apparatus for performing a high-pressure process. Prior Technology

[0002] A substrate processing apparatus is an apparatus for processing substrates such as wafers. In order to perform processes such as deposition, etching, and heat treatment on multiple substrates, a reactor utilizing a crystal boat can be used.

[0003] Traditional substrate processing devices in this reactor configuration use a single or double tube to perform substrate processing by inserting multiple substrates through a crystal boat, and have a heater at the outermost periphery to supply heat to create the process temperature environment.

[0004] In addition, for various substrate processes, especially the annealing process to remove residues on the substrate surface and inside, and to improve the film quality through recrystallization of the substrate surface, it is necessary to form a high temperature of over 800°C and a high pressure of over 2ATM to process the substrate.

[0005] However, traditional substrate processing devices use dual tubes to protect against tube breakage under high pressure conditions above 2 ATM. However, quartz materials are at greater risk of damage under high pressure, resulting in lower durability. If damaged, they may cause pollution problems due to gas leakage.

[0006] Furthermore, when the material of the dual tubes is strengthened to address the aforementioned issues, it is difficult to achieve the necessary high-temperature conditions for substrate processing due to the low heat transfer rate of the material, which makes it difficult to receive the heat supplied by the outermost heater.

[0007] Therefore, in order to have sufficient rigidity under high pressure and improve the heating efficiency required for process temperature, a heater is installed inside the tube. However, in this case, there is a problem that the heater is difficult to repair and maintain.

[0008] In particular, the terminals configured to supply power to the heater from the outside and the contact parts connected to the power cord may frequently suffer from damage, poor contact, etc., which necessitates repair and maintenance. However, since the heater is located inside the tube, there is a problem of difficulty in accessing and maintaining the heater. Summary of the Invention

[0009] The Problem to be Solved The object of the present invention is to provide a substrate processing apparatus that facilitates maintenance of the internal heater section in order to solve the problems described above.

[0010] Problem-solving methods The present invention is proposed to achieve the above-described objectives. The present invention provides a substrate processing apparatus, comprising: an inner tube forming a processing space inside, wherein a plurality of substrates are stacked in a vertical direction for processing; a heater section surrounding at least a portion of the inner tube, forming a heating space between the heater section and the inner tube, and receiving power from the outside to generate heat; and an outer tube disposed inside the heater section, forming an internal space between the heater section and the outer tube, and having at least one switchable opening on its side to allow access to the internal space from the outside; wherein the heater section is electrically connected to a power supply section that transmits power through the outer tube at a position corresponding to the opening.

[0011] The heater section can expose its connection portion to the power supply section when the opening is opened.

[0012] The heater section may include: a side heat insulation section surrounding the inner tube; a heating section disposed on the inner surface of the side heat insulation section, which generates heat through the applied electricity; and a terminal section disposed on the outer surface of the side heat insulation section and electrically connected to both ends of the heating section.

[0013] The terminal portion can be configured at a height corresponding to the opening portion.

[0014] The terminal portion may include: a connecting terminal disposed outside the side heat insulation portion for engaging with the heating portion; and a connecting rod extending from the connecting terminal to the opening side for engaging with the power supply portion.

[0015] The connecting rod may extend from the connecting terminal located beyond the opening, such that its end, which engages with the power supply unit, is located at a position corresponding to the opening.

[0016] The connecting terminal and the connecting rod can be integrated.

[0017] The opening may be formed at a height corresponding to the terminal portion.

[0018] The connecting terminals can be arranged in a plurality of up-down directions to overlap in a plane; the connecting rod may include at least one of a horizontal rod and a vertical rod, the horizontal rod extending in a horizontal direction to prevent overlap with the remaining connecting terminals other than the extended connecting terminals, and the vertical rod extending in a vertical direction.

[0019] The terminal portion has a plurality of heating areas distinguished by the vertical direction, and each heating area is provided with at least one terminal portion.

[0020] A single opening may correspond to a plurality of terminal portions.

[0021] The openings may be arranged in a plurality of vertical directions on the outside of the outer tube.

[0022] The outer tube may include: a container portion forming the internal space and having an opening on a side; a side flange disposed in the container portion at a position corresponding to the opening; and a door portion disposed on the side flange to open and close the opening.

[0023] The outer tube may include at least one first connection portion, which is connected to the power supply portion on the side to transmit the power to the heater portion from the outside.

[0024] The first connection part can electrically connect an external power supply line and an internal power supply line in the power supply part. The external power supply line is connected to the outside of the outer tube, and the internal power supply line is arranged and connected in the internal space.

[0025] The outer tube may include at least one second connection portion configured for electrically connecting a temperature sensor disposed on the side through the heater portion to the outside.

[0026] The substrate processing apparatus may further include a cooling section disposed on at least a portion outside the outer tube and in which a heat transfer medium flows.

[0027] The internal space and the heating space can be interconnected.

[0028] The inner tube may contain quartz, and the outer tube may contain SUS.

[0029] The internal space can maintain a higher pressure than the processing space.

[0030] The heating space can maintain a temperature above 800°C for at least a portion of the time during the process performed within the processing space.

[0031] The internal space is designed to maintain a pressure of 2 ATM or higher for at least a portion of the time during the process performed within the processing space.

[0032] The Effects of Invention According to the substrate processing apparatus of the present invention, a processing container capable of operating at a high voltage of 2 ATM or higher without damage is used at the outermost periphery, thereby improving the protection function, and through the inner tube close to the heater section, it has the advantage of improving heating efficiency.

[0033] Furthermore, according to the substrate processing apparatus of the present invention, the heater section disposed inside the outer tube can be easily accessed through the opening disposed on the side of the processing container, thus having the advantage of being easy to repair and maintain the heater section.

[0034] In particular, in order to supply power to the heater section, the terminal section connected to the power supply section is connected to the power supply section at a height corresponding to the opening section, thus having the advantage of making it easy to repair and maintain the contact parts. Simple Explanation of the Diagram

[0035] Figure 1 is a perspective view showing the substrate processing apparatus according to the present invention; [ ] Figure 2 is a front view showing the configuration of the substrate processing apparatus in Figure 1; Figure 3 is an enlarged view showing the shape of the opening in the substrate processing apparatus of Figure 2; and Figure 4 is a cross-sectional view showing the configuration of the substrate processing apparatus of Figure 1. Implementation

[0036] Referring to the accompanying drawings, the substrate processing apparatus according to the present invention will be described in detail below.

[0037] As shown in Figures 1 and 2, the substrate processing apparatus according to the present invention includes: an inner tube 100, which forms a processing space S1 inside, wherein the processing space S1 is for processing multiple substrates stacked in a vertical direction; a heater section 200, which is configured to surround at least a portion of the inner tube 100 to form a heating space S2 between itself and the inner tube 100, and receives electricity from the outside to generate heat; and an outer tube 300, which houses the heater section 200 inside, forms an internal space S3 between itself and the heater section 200, and forms at least one switchable opening 302 on its side to allow access to the internal space S3 from the outside.

[0038] Furthermore, the substrate processing apparatus according to the present invention includes a cooling gas supply unit 400 for supplying cooling gas to the heating space S2.

[0039] Additionally, the substrate processing apparatus according to the present invention may also include a damper 500, which conveys the exhaust gas discharged from the heating space S2 to the outside.

[0040] In addition, the substrate processing apparatus according to the present invention may also include a cooling section 600, which is at least a portion disposed outside the outer tube 300 and in which a heat medium flows.

[0041] Here, the substrate being processed can be understood to include all substrates such as substrates used in display devices such as LED, LCD, and OLED, semiconductor substrates, solar cell substrates, and glass substrates.

[0042] Furthermore, for processes performed by the substrate processing apparatus according to the present invention, any process previously disclosed can be applied as long as it is a substrate processing process. For example, processes such as deposition, etching, and heat treatment can be performed.

[0043] For example, the substrate processing apparatus according to the present invention can perform annealing and the like to improve the quality of thin films on substrates such as wafers. In particular, it can effectively improve the quality of thin films by promoting recrystallization or migration of the substrate surface through effective removal of impurities that remain or form weak bonds on and inside the substrate or thin film.

[0044] At this time, according to the substrate processing apparatus of the present invention, the processing space S1 for performing substrate processing can repeatedly perform a high-pressure process with a high pressure of more than atmospheric pressure, for example, more than 2 ATM, and a low-pressure process with a vacuum state, and can perform heat treatment at a high temperature of more than 800°C as required.

[0045] The inner tube 100 is a structure that forms a processing space S1 inside, and can have various structures.

[0046] At this time, the inner tube 100 is configured as a vertical cylinder with an arched top, forming a processing space S1 inside, and the lower part is open for the entry and exit of a crystal boat 40 that can load a plurality of substrates described later.

[0047] That is, the lower part of the inner tube 100 is open, and a sealed processing space S1 is formed when a crystal boat 40 containing a plurality of substrates is inserted through the lower part to perform substrate processing. After the substrate processing is completed, the crystal boat 40 can be lowered to the lower side and removed.

[0048] At this time, the crystal boat 40 may include: a support portion 43, which supports a plurality of substrates at intervals in the vertical direction; a heat insulation portion 42, which is disposed on the lower side of the support portion 43 to prevent the heat of the processing space S1 from being dissipated to the outside; and a cover flange 41, which supports the heat insulation portion 42 and the substrate support portion 43 at the lower part of the heat insulation portion 42.

[0049] Accordingly, when the crystal boat 40 rises into the processing space S1 inside the inner tube 100, the cover flange 41 is in close contact with the lower end of the manifold 20. The clamps 30 that clamp the edge of the lower end of the cover flange 41 and the manifold 20 are combined to form a closed processing space S1.

[0050] In particular, the clamp 30 clamps and fixes the manifold 20 and the cover flange 41, preventing the cover flange 41 from moving downward due to the internal high pressure when a high pressure process of 2 ATM or more is performed in the processing space S1, and maintaining the sealed state of the processing space S1.

[0051] On the other hand, the inner tube 100 is supported by the open lower end manifold 20 and communicates with the manifold 20. At this time, process gas can be received from the external first gas supply unit 80 through the supply port formed in the manifold 20.

[0052] In addition, the inner pipe 100 discharges process gas to the first exhaust section 70 outside through the exhaust port formed on the manifold 20, thereby allowing the processing space S1 to be vented.

[0053] The inner tube 100 is made of non-metallic material and can be made of quartz. As mentioned above, it can be configured to have an arched top, but it is not limited to this. Of course, it can also be configured to have a cylindrical shape with a flat top.

[0054] The heater section 200 may be a structure that surrounds at least a portion of the inner tube 100 and forms a heating space S2 between the heater section and the inner tube 100.

[0055] That is, the heater section 200 may be a structure in which an inner tube 100 is arranged inside and a heating space S2 is formed between the inner tube 100 and the heater section to heat the processing space S1 to create a process temperature environment.

[0056] Therefore, the heater section 200 may include: a side heat insulation section 210 configured to surround the inner tube 100; a heating section 220 configured on the inner surface of the side heat insulation section 210 and heated by an applied power source; and an upper heat insulation section 230 configured on the upper end of the side heat insulation section 210 and forming an exhaust channel 231 for discharging exhaust gas from the heated space S2, which is combined with the damper section 500.

[0057] Additionally, the heater section 200 may include a terminal section 240, which is disposed outside the side heat insulation section 210 and electrically connected to both ends of the heating section 220.

[0058] The side heat insulation portion 210 is a structure that surrounds the inner tube 100, and may be a structure that forms the side of the heater portion 200.

[0059] At this time, the side heat insulation part 210 can be a structure that forms the side through a plurality of heat insulation materials, or it can be a structure in which the heating part 220 is arranged on the inner surface to concentrate heat to the heating space S2 and the processing space S1 and minimize the heat loss to the outside of the side heat insulation part 210.

[0060] In addition, the side heat insulation part 210 may be composed of multiple stacked annular components. In this case, multiple gas supply ports (not shown) formed in a radial direction are arranged between the annular components or between the annular components. The internal space S3 is connected to the heating space S2, and the cooling gas supplied from the cooling gas supply part 400 can be guided to be transported into the heating space S2.

[0061] The heating element 220 is a structure that is heated by an applied power source and disposed on the inner surface of the side heat insulation element 210. It can have various structures.

[0062] At this time, the heating element 220 is a structure that generates heat through the resistance heat generated by the applied current in the resistive body. By appropriately adjusting the applied current, the heat generation and temperature can be adjusted.

[0063] On the other hand, at this time, a plurality of heating elements 220 can be arranged in the vertical direction on the inner surface of the side heat insulation portion 210, and the heating elements 220 can receive power from the outside through the terminal portion 240 arranged outside the side heat insulation portion 210 through the end of the side heat insulation portion 210.

[0064] The upper heat insulation part 230 may be a structure disposed on the upper end of the side heat insulation part 210 and forming an exhaust channel 231 for discharging exhaust gas from the heated space S2.

[0065] That is, the upper heat insulation part 230 is a structure that forms the upper top of the heater part 200, and includes a plurality of heat insulation plates disposed on the upper end of the side heat insulation part 210, thereby preventing heat loss from the heating space S2 to the upper side.

[0066] On the other hand, the upper heat insulation part 230 may form a discharge channel 231 to discharge the cooling gas supplied to the heating space S2 to the outside; for example, the discharge channel 231 extends from the discharge port formed on the bottom surface of the upper heat insulation part 230 (i.e., the top surface of the heater part 200) to the side of the upper heat insulation part 230, thereby guiding the discharge gas, which is the cooling gas that completes the heat exchange, to the outside.

[0067] At this time, the upper heat insulation part 230 can be combined with the damper part 500 which is connected to the exhaust channel 231 on the side, thereby guiding the exhaust gas, which is the cooling gas supplied to the heating space S2 for heat exchange, to be transported to the damper part 500 through the exhaust channel 231.

[0068] Additionally, the heater section 200 may include: a cover section disposed on the outermost periphery of the side heat insulation section 210 and forming a through hole communicating with the cooling gas supply section 400 described later; and a connecting flange protruding from the through hole corresponding to the cover section and engaging with the cooling gas supply section 400.

[0069] At this time, the cover portion is a structure that forms the outermost side of the heater portion 200. It is made of the same heat insulation material as the side heat insulation portion 210 and can be arranged on the outermost side. As another example, it can also be a cover that surrounds the side heat insulation portion 210.

[0070] The cover can be configured to form a through hole to communicate with the cooling gas supply section 400. In particular, the through hole is formed at a position corresponding to the groove 201, which is formed by forming a boss inward on the outer side of the side heat insulation section 210 and communicating with the heating space S2, so that cooling gas can be supplied from the cooling gas supply section 400 to the groove 201 side.

[0071] Therefore, a cooling gas supply path can be formed between the cover and the groove 201 formed around the heater section 200.

[0072] On the other hand, the connecting flange is configured to protrude outwards corresponding to the outer side of the through hole forming cover, and can be combined with the cooling gas supply section 400 described later.

[0073] At this time, a sealing component (not shown) may be arranged between the connecting flange and the cooling gas supply section 400.

[0074] On the other hand, the heater section 200 is electrically connected to the power supply section 700, which transmits power through the outer tube 300, at a position corresponding to the opening 302 described later.

[0075] That is, the heater section 200 can be electrically connected at a position corresponding to the opening 302 of the container section 310 formed in the outer tube 300 described later, thereby exposing the connection between the power supply section 700 and the heater section 200 when the opening 302 is open.

[0076] As a result, the connection between the power supply unit 700 and the heater unit 200 is exposed as the opening 302 is opened, and thus becomes easily accessible. Therefore, it has a contact part that is electrically connected to the power supply, and this connection part has the advantage of being easy to repair and maintain.

[0077] The terminal portion 240 is a structure that is disposed outside the side heat insulation portion 210 and electrically connected to both ends of the heating portion 220, and can have various structures.

[0078] That is, the terminal portion 240 is a structure that is connected to the power supply portion 700 to apply power to the heating portion 220. It is the side of the heater portion 200. The two ends of the heating portion 220 that are electrically connected to the side heat insulation portion 210 are provided in the side heat insulation portion 210, or it is provided outside the side heat insulation portion 210 that is connected to the two ends of the heating portion 220.

[0079] On the other hand, the terminal portion 240 can be configured at a height corresponding to the opening 302 formed outside the container portion 310 described later.

[0080] In addition, as another example, as shown in Figures 3 and 4, the terminal portion 240 may include: a connecting terminal 241 disposed outside the side heat insulation portion 210 for connection with the heating portion 220; and a connecting rod 242 extending from the connecting terminal 241 to the opening portion 302 side for connection with the power supply portion 700.

[0081] That is, corresponding to the side heat insulation part 210 and the heating part 220 arranged in a stacked form in the vertical direction, a plurality of terminal parts 240 can be arranged at intervals in the vertical direction. Accordingly, the terminal part 240 may also have a connecting rod 242 so that when it cannot be located at the height corresponding to the opening part 302, its connection point with the power supply part 700 is located at the height corresponding to the opening part 302.

[0082] Therefore, the connecting terminal 241 can be arranged at intervals in the vertical direction outside the heater section 200 to be combined with the heating section 220 outside the side heat insulation section 210, and the connecting rod 242 can be arranged to extend from the connecting terminal 241 to the opening 302 side to be combined with the power supply section 700.

[0083] On the other hand, in this case, the connecting terminal 241 and the connecting rod 242 are integrated, which can prevent poor contact at points other than the connection between the power supply part 700 and the terminal part 240 that are difficult to access from the opening 302.

[0084] Alternatively, as another example, separate components where the connecting terminal 241 and the connecting rod 242 engage with each other can also be used.

[0085] On the other hand, having a plurality of terminal portions 240, for a plurality of heating regions distinguished in the up-down direction, at least one terminal portion 240 may be arranged in each heating region.

[0086] At this time, some of the plurality of terminal portions 240 may consist only of connecting terminals 241, depending on their position at a height corresponding to the opening 302, and the connecting rod 242 may be omitted; the terminal portion 240 located at a height not corresponding to the opening 302 has connecting terminals 241 and connecting rod 242, and its connection portion with the power supply unit 700 can be exposed when the opening 302 is open, through the connecting rod 242.

[0087] Therefore, depending on the distance between the position of the terminal portion 240 and the opening portion 302, the length and shape of the connecting rod 242 can be changed. In particular, considering the terminal portions 240 arranged in the vertical direction and overlapping on the plane, the connecting rod 242 can also be composed of a combination of a horizontal rod 242a and a vertical rod 242b.

[0088] That is, the connecting rod 242 may include: a horizontal rod 242a, which extends horizontally to prevent overlap with the remaining connecting terminals 241 other than the extended connecting terminal 241; and a vertical rod 242b, which extends vertically.

[0089] On the other hand, the opening 302 may have a predetermined area to correspond to a plurality of terminal portions 240; as another example, a plurality of openings 302 may also be formed at heights corresponding to the plurality of terminal portions 240 respectively.

[0090] Regarding the terminal portion 240 described above, it is explained that it is formed outside the side heat insulation portion 210, but it is not limited thereto. When the heater portion 200 is provided with the cover portion described above, it may also be provided outside the cover portion and pass through the cover portion and the side heat insulation portion 210 to be electrically connected to the heating portion 220.

[0091] The outer tube 300 has a structure in which an inner tube 100 and a heater section 200 are arranged inside, and an internal space S3 is formed between the outer tube 300 and the heater section 200. Various structures are possible.

[0092] That is, the outer tube 300 is a structure that surrounds the heater section 200, and an internal space S3 can be formed between it and the heater section 200. It can be a vertical cylindrical structure with an arched top corresponding to the inner tube 100 mentioned above.

[0093] On the other hand, the outer tube 300 is disposed outside the inner tube 100 and the heater section 200 surrounding the inner tube 100, which are used for high temperature and high pressure substrate processing, forming an internal space S3 that can serve as a protective space. This can be configured to prevent process gas from leaking to the outside due to damage to the inner tube 100 during high pressure substrate processing and to have sufficient rigidity to withstand high pressure.

[0094] Therefore, the outer tube 300 can be made of a metallic material, for example, it can contain SUS.

[0095] On the other hand, through the internal space S3 formed between the outer tube 300 and the heater section 200, as described above, in order to serve as a protective space, a higher pressure than the processing space S1 can be maintained, and the heater section 200 is configured to allow gas to pass through and is not sealed, so it can communicate with the heating space S2.

[0096] That is, the internal space S3 can maintain a pressure of 2 ATM or more during at least a portion of the time of the process performed in the processing space S1, and can maintain a similar temperature as the heating space S2 is heated and the heating space S2 maintains a temperature of 800°C or more during at least a portion of the time of the process performed in the processing space S1.

[0097] On the other hand, the outer pipe 300 forms separate supply and exhaust ports on its side and is connected to the second gas supply unit 60 and the second gas exhaust unit 50 respectively, receiving gas supply from the outside to the internal space S3, and the internal space S3 can exhaust gas.

[0098] In addition, the heater section 200 and the outer tube 300 are respectively open at their lower ends, and the open lower ends are supported by the base section 10. At this time, the manifold 20 can be combined and set on the bottom surface of the base section 10.

[0099] On the other hand, the outer tube 300 includes: a container section 310, in which a heater section 200 is disposed, forming an internal space S3 between the heater section 200 and the heater section 200, and forming an opening 301 on the side so that the internal space S3 can be accessed from the outside; and a switch section disposed in the container section 310 to open and close the opening 301.

[0100] The container section 310 has a structure that forms an internal space S3 and an opening 301 on the side, and can have various structures.

[0101] For example, the container portion 310 is made of SUS material and has an arched top, into which a heater portion 200 and an inner tube 100 are inserted, and is configured to be supported by the base portion 10 when the lower end is open.

[0102] At this time, the container part 310 may be a structure with an opening 301 formed on the side for access to maintain the damper part 500 provided in the internal space S3, wherein the damper part 500 is provided in the internal space S3 for discharging the cooling gas supplied to the heating space S2 to the outside.

[0103] The flange portion 320 can be formed as a structure that protrudes into the container portion 310 at a position corresponding to the opening 301, and the door portion 330 is provided to open and close the opening 301.

[0104] At this time, the switch door portion 330 may be a structure in which the flange portion 320 can be closed and opened through the first sealing member 332.

[0105] On the other hand, the opening and closing door portion 330 is fastened to the flange portion 320 by bolts through the first sealing member 332 in the middle, and a hinge portion is provided at one end, so that the opening 301 can be opened by rotating the hinge after the bolt is released.

[0106] In addition, the door opening 330 may also include a door opening 331, which is through-hole so that the damper 500 described later can communicate with the outside.

[0107] That is, when the door opening 331 is formed through the door, the door opening 330 is connected to the damper 500 on the inner side of the flange 320 to cover the door opening 331, and an external pipe is connected to the outer side so that the pipe covers the door opening 331, thereby connecting the ventilation door 500 and the heat exchange module 90.

[0108] Furthermore, the switch door portion 330 and the flange portion 320 on which the switch door portion 330 is provided are corresponding to the damper portion 500 described later, and can be formed into a quadrilateral shape on the front side.

[0109] In addition, besides the opening 301 described above, the outer tube 300 of the present invention also forms at least one opening 302 on the outer side of the container portion 310, and may also include a side flange 360 ​​and a door portion 370 corresponding to the opening 302, wherein the door portion 370 is provided on the side flange 360 ​​to open and close the opening 302.

[0110] That is, the container portion 310 may also form at least one opening 302 on the lower side of the opening 301 formed on the side, thereby allowing access to the internal space S3, and may also have a side flange 360 ​​and a door portion 370 for opening and closing the opening 302.

[0111] At this time, the side flange 360 ​​and the door portion 370 are structures for repairing and maintaining the heater portion 200 through the access to the internal space S3. In particular, they can be configured to allow access to the terminal portion and power supply portion provided for supplying power to the heater portion 200 for repairing and maintaining.

[0112] That is, the outer tube 300 includes a side flange 360 ​​disposed in the container section 310 at a position corresponding to the opening 302 and a door section 370 provided on the side flange 360 ​​to open and close the opening 302, and the connection portion between the terminal section 240 and the power supply section 700 is located at a position corresponding to the opening 302, so that the heater section 200 including the terminal section 240 can be easily maintained through the open door section 370.

[0113] At this time, the side flange 360 ​​and the door portion 370 are formed into a circular structure on the front side, and at least one, for example two, side flanges 360 and door portions 370 can be arranged at intervals on the lower side of the flange portion 320 corresponding to the opening portion 302.

[0114] At this time, the side flange 360 ​​and the door portion 370 can be described in the same way as the flange portion 320 and the door opening and closing portion 330 described above, so repeated descriptions are omitted.

[0115] Additionally, the outer tube 300 may include: at least one first connecting portion 350, which is connected to the power supply portion 700 on the side to transmit power to the heater portion 200 from the outside; and at least one second connecting portion 390, which is configured to electrically connect a temperature sensor (not shown) provided on the side through the heater portion 200 to the outside.

[0116] At this time, the first connecting part 350 and the second connecting part 390 are feeders configured to maintain the seal of the internal space S3 while realizing the electrical connection between the inside and outside. A plurality of the first connecting parts 350 and the second connecting parts 390 may be respectively configured in the container part 310.

[0117] The first connection part 350 can be a structure that electrically connects the external power supply line 710 and the internal power supply line 720 in the power supply part 700. The external power supply line 710 is connected to the outside of the outer tube 300, and the internal power supply line 720 is configured and connected in the internal space S3. At this time, the internal power supply line 720 is connected to the external power supply line 710 to receive power, and then it can be supplied to the terminal part 240.

[0118] For electrical connection between the temperature sensor provided on the side of the heater section 200 and the outside, at least one second connection portion 390 may be configured, and a plurality of temperature sensors may be configured in the vertical direction corresponding to the side of the heater section 200.

[0119] At this time, the second connection part 390 is provided with a power line for supplying power to the temperature sensor and a signal line for transmitting and receiving signals for the temperature sensing value, thereby realizing an electrical connection between the external device and the temperature sensor.

[0120] The damper 500 has a structure in which one end is connected to the upper heat insulation part 230 and the other end is connected to the opening and closing door part 330, and can have various structures.

[0121] The damper section 500 is a structure that is disposed between the heater section 200 and the external heat exchange module to connect the heating space S2 and the heat exchange module, and can have various structures.

[0122] For example, at least a portion of the damper portion 500 is disposed within the flange portion 320, which can cover the door opening 331, so that one end is connected to the heater portion 200 and the other end is connected to the external heat exchange module, and can be connected to the door opening portion 330.

[0123] At this time, the damper 500 may include: a damper body, which forms a flow path for the flow of discharged gas inside; and a flow regulating part, which is disposed in the damper body to regulate the opening degree of the flow path.

[0124] More specifically, the damper body of the damper portion 500, which forms an internal flow path for the exhaust gas discharged through the exhaust channel 231, can be configured such that one end is connected to the exhaust flow path flange 232, and the other end is connected to and disposed in the opening and closing portion 330, wherein the exhaust flow path flange 232 is formed in communication with the exhaust channel 231 on the side wall of the upper heat insulation portion 230.

[0125] At this time, the damper section 500 serves as a flow regulation section, which includes a drive section and blades inside. The drive section generates power to drive the blades (such as a motor or actuator). The blades control the flow of the exhaust gas in the flow path through the drive section, thereby appropriately regulating the flow rate of the exhaust gas discharged through the damper section 500.

[0126] On the other hand, the damper 500 can be a structure that can be both open and closed, but not completely closed. Instead, it can be continuously connected to the discharge channel 231 and the heat exchange module 90 described later. Accordingly, it can be continuously connected to the heating space S2 and the internal space S3 connected to the heating space S2 to form a high pressure inside and to transport high-temperature exhaust gas.

[0127] The cooling gas supply unit 400 is a structure that supplies cooling gas to the inside of the outer pipe 300 through a switch unit, and can have various structures.

[0128] At this time, the cooling gas supply unit 400 can supply cooling gas to the heating space S2 to cool the heating space S2.

[0129] At this time, the cooling gas supply unit 400 can supply cooling gas to the heating space S2 through the switch unit. More specifically, it can be configured to connect to the heater unit 200 by having a through flange 320 on the lower side of the external part.

[0130] For example, the cooling gas supply unit 400 may include: an external supply pipe 410, which is connected to and disposed on the lower side of the flange 320 to deliver cooling gas from the outside; and an internal supply pipe 420, which is connected to the external supply pipe 410 and disposed inside the flange 320, with one end connected to the side of the heater unit 200 and the other end connected to the inner surface of the flange 320.

[0131] The external supply pipe 410 is a structure that is combined with and disposed on the lower side of the flange 320 to transport cooling gas from the outside, and can have various structures.

[0132] At this time, the cooling gas supplied through the external supply pipe 410 is external gas, and the valve 430 at the end of the external supply pipe 410 is switched to receive the external gas and deliver it to the internal supply pipe 420.

[0133] Alternatively, as another example, the external supply pipe 410 is connected via valve 430 to a separately configured cooling gas supply source (not shown) to receive cooling gas that can be supplied to the internal supply pipe 420 at a flow rate regulated by valve 430.

[0134] At this time, the external supply pipe 410 can be configured to be attached to the bottom surface of the quadrilateral flange 320, or more specifically, it can be configured to extend to the side of the flange 320 so that it does not protrude to the opposite side of the container 310 on the plane with reference to the flange 320.

[0135] That is, the external supply pipe 410 can be formed into an "L" shape on the front of the opening and closing door 330, thereby the external supply pipe 410 has the advantages of improving space efficiency and being suitable for compact device structures.

[0136] The internal supply pipe 420 is provided inside the flange portion 320 in communication with the external supply pipe 410, and one end is attached to the side of the heater portion 200, while the other end is attached to the inner surface of the flange portion 320. Various structures are possible.

[0137] That is, as shown in Figure 2, the internal supply pipe 420 is a structure that communicates with the external supply pipe 410 to supply cooling gas to the heater section 200 side, and can be a structure in which at least a portion is disposed within the flange section 320.

[0138] For example, the internal supply pipe 420 may include: a first internal supply pipe that forms a cooling gas delivery path inside and is connected to the connecting flange described above; and a second internal supply pipe, one end of which is connected to the first internal supply pipe and the other end of which is connected to the external supply pipe 410 and disposed on the inner surface of the flange portion 320.

[0139] At this time, the second internal supply pipe is disposed between the bottom surface of the first internal supply pipe of the hexahedron and the inner surface of the flange portion 320, and the cooling gas supplied from the bottom surface of the flange portion 320 is transported to the first internal supply pipe. The cooling gas can be guided to move horizontally through the first internal supply pipe to be transported to the heater portion 200 side.

[0140] On the other hand, the internal supply pipe 420, through its connection with the aforementioned connecting flange, can transport cooling gas through the slot 201 and the side heat insulation part 210 to the heating space S2. In order to ensure that the cooling gas is evenly transported to the heating space S2 in the vertical direction of the side heat insulation part 210, a separate flow path can also be formed in the vertical direction of the side heat insulation part 210.

[0141] On the other hand, the internal supply pipe 420 is connected to the heating space S2 at a height corresponding to the boundary of the side heat insulation part 210 and the upper heat insulation part 230. Moreover, as described above, it can also be connected at a position corresponding to the groove 201, which is formed to have a boss on the outer side of the side heat insulation part 210 and communicate with the heating space S2.

[0142] Additionally, the internal supply pipe 420 may be disposed inside the flange portion 320 below the damper portion 500.

[0143] On the other hand, the cooling gas supply section 400, which includes the external supply pipe 410 and the internal supply pipe 420, can be configured as a pair on both sides with respect to the center of the flange 320 in the front direction. In this case, the external supply pipes 410 can extend in opposite directions to each other.

[0144] At this time, the external supply pipe 410 and the internal supply pipe 420 can be formed as a symmetrical pair on the front with the center of the damper 500 and the door opening / closing section 330 as reference.

[0145] The cooling section 600 is a structure that is at least a portion disposed outside the outer tube 300 and in which a heat medium flows, and can have various structures.

[0146] For example, the cooling section 600 may be configured to contact the outer surface of the container section 310 and have a heat medium flowing inside it, thereby reducing the temperature of the container section 310 through heat exchange between the heat medium and the container section 310.

[0147] Furthermore, the cooling section 600 may be configured to extend around the side of the flange 320 to cool the flange 320, and may also be extended and provided on the side flange 360 ​​as needed.

[0148] For example, the cooling section 600 may include a first cooling pipe 610 and a second cooling pipe 620. The first cooling pipe 610 is disposed outside the outer tube 300 and a heat medium flows inside it. The second cooling pipe 620 extends from the first cooling pipe 610 to surround at least a portion of the flange portion 320 and a heat medium flows inside it. Accordingly, the first cooling pipe 610 and the second cooling pipe 620 may form a single heat medium flow path.

[0149] In this case, the heat medium is supplied to the second cooling pipe 620 side of the high-temperature flange 320 through the damper 500, flows along the second cooling pipe 620, and then flows through the first cooling pipe 610 to the external heat exchanger, thereby improving the cooling efficiency.

[0150] The above description is only a part of the preferred embodiments that can be implemented by the present invention. Therefore, it is well known that the scope of the present invention should not be limited to the above embodiments. The technical ideas and fundamental technical ideas of the present invention described above are all included within the scope of the present invention.

[0151] 100: Inner tube 200: Heater section 201: Groove 210: Side heat insulation section 220: Heating section 230: Upper heat insulation section 231: Emission Channel 232: Flow path flange 240: Terminal section 241: Connecting terminal 242: Connecting rod 242a: Horizontal bar 242b: Vertical bar 300: External pipe 301: Opening 302: Opening 310: Container Department 320: Flange portion 330: Door opening and closing section 331: Door opening 332: First sealing component 350: First connecting part 360: Side flange 370: Door 390: Second connecting part 400: Cooling Gas Supply Department 410: External supply channels 420: Internal supply pipeline 430: Valve 500: Damper Section 600: Cooling section 610: First cooling pipe 620: Second cooling pipe 700: Power Supply Department 710: External power supply line 720: Internal power supply line 10: Base section 20: manifold 30: Fixture 40: Crystal Boat 41: Cover flange 42: Insulation Section 43: Support section 50: Second gas emission section 60: Second Gas Supply Department 70: First exhaust section 80: First Gas Supply Department 90: Heat exchange module S1: Processing Space S2: Heating space S3: Interior Space

Claims

1. A substrate processing apparatus, comprising: An inner tube (100) forms a processing space (S1) inside, wherein a plurality of substrates are stacked in a vertical direction for processing; a heater section (200) surrounds at least a portion of the inner tube (100) outside the inner tube (100), forms a heating space (S2) between the heater section (100) and the inner tube (100), and receives power from the outside to generate heat; and an outer tube (300) houses the heater section (200) inside, forms an internal space (S3) between the heater section (200) and the outer tube (300), and forms at least one switchable opening (302) on the side to allow access to the internal space (S3) from the outside; wherein the heater section (200) is electrically connected to a power supply section (700) that transmits power through the outer tube (300) at a position corresponding to the opening (302).

2. The substrate processing apparatus according to claim 1, wherein, The heater section (200) exposes its connection portion to the power supply section (700) when the opening (302) is opened.

3. The substrate processing apparatus according to claim 1, wherein, The heater section (200) includes: a side heat insulation section (210) surrounding the inner tube (100); a heating section (220) disposed on the inner surface of the side heat insulation section (210) and heated by the applied electricity; and a terminal section (240) disposed on the outside of the side heat insulation section (210) and electrically connected to both ends of the heating section (220).

4. The substrate processing apparatus according to claim 3, wherein, The terminal portion (240) is positioned at a height corresponding to the opening portion (302).

5. The substrate processing apparatus according to claim 3, wherein, The terminal portion (240) includes: a connecting terminal (241) disposed outside the side heat insulation portion (210) for engaging with the heating portion (220); and a connecting rod (242) extending from the connecting terminal (241) to the opening portion (302) for engaging with the power supply portion (700).

6. The substrate processing apparatus according to claim 5, wherein, The connecting rod (242) extends from the connecting terminal (241) located beyond the opening (302) such that its end, which engages with the power supply unit (700), is located at a position corresponding to the opening (302).

7. The substrate processing apparatus according to claim 5, wherein, The connecting terminal (241) and the connecting rod (242) are integrated.

8. The substrate processing apparatus according to claim 3, wherein, The opening (302) is formed at a height corresponding to the terminal portion (240).

9. The substrate processing apparatus according to claim 5, wherein, The connecting terminals (241) are arranged in a vertical direction in a plurality of such that they overlap in a plane; and the connecting rod (242) includes at least one of a horizontal rod (242a) and a vertical rod (242b), wherein the horizontal rod (242a) extends in a horizontal direction to prevent overlap with the remaining connecting terminals (241) other than the extended connecting terminals (241), and the vertical rod (242b) extends in a vertical direction.

10. The substrate processing apparatus according to any one of claims 3 to 8, wherein, The terminal portion (240) has a plurality of heating regions distinguished by the vertical direction, and each heating region is provided with at least one terminal portion (240).

11. The substrate processing apparatus according to claim 10, wherein, Each single opening (302) corresponds to a plurality of terminal portions (240).

12. The substrate processing apparatus according to claim 10, wherein, The openings (302) are arranged in a plurality of vertical directions on the outside of the outer tube (300).

13. The substrate processing apparatus according to claim 1, wherein, The outer tube (300) includes: a container portion (310) forming the internal space (S3) and forming the opening portion (302) on the side; a side flange (360) disposed in the container portion (310) at a position corresponding to the opening portion (302); and a door portion (370) disposed on the side flange (360) to open and close the opening portion (302).

14. The substrate processing apparatus according to claim 1, wherein, The outer tube (300) includes at least one first connection (350) which is connected to the power supply unit (700) on the side to transmit power to the heater unit (200) from the outside.

15. The substrate processing apparatus according to claim 14, wherein, The first connecting part (350) is electrically connected to the external power supply line (710) and the internal power supply line (720) in the power supply part (700). The external power supply line (710) is connected to the outside of the outer tube (300), and the internal power supply line (720) is arranged and connected in the internal space (S3).

16. The substrate processing apparatus according to claim 1, wherein, The outer tube (300) includes at least one second connection (390), which is configured to electrically connect a temperature sensor provided on the side through the heater section (200) to the outside.

17. The substrate processing apparatus according to claim 1, further comprising: A cooling section (600) is disposed on at least a portion outside the outer tube (300) and a heat medium flows inside it.

18. The substrate processing apparatus according to claim 1, wherein, The internal space (S3) and the heating space (S2) are interconnected.

19. The substrate processing apparatus according to claim 1, wherein, The inner tube (100) contains quartz, and the outer tube (300) contains SUS.

20. The substrate processing apparatus according to claim 1, wherein, The internal space (S3) maintains a higher pressure than the processing space (S1).

21. The substrate processing apparatus according to claim 1, wherein, The heating space (S2) maintains a temperature above 800°C for at least a portion of the time during the process performed in the processing space (S1).

22. The substrate processing apparatus according to claim 1, wherein, The internal space (S3) maintains a pressure of 2 ATM or higher for at least a portion of the time during the process performed within the processing space (S1).

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