Heat dissipation module and server

Abstract

This invention relates to a heat dissipation module and a server, including a memory module; a heat-conducting mechanism installed on the memory module and in heat transfer cooperation with the memory module; and a liquid cooling plate installed on the heat-conducting mechanism and in heat transfer cooperation with the heat-conducting mechanism. This solution uses the heat-conducting mechanism to directly cooperate with the memory module and the liquid cooling plate for heat transfer, quickly and effectively transferring the heat generated by the memory module to the liquid cooling plate to achieve heat dissipation for the memory module. This eliminates the need for a large number of liquid cooling pipes, reduces the difficulty of liquid cooling pipe layout, and eliminates the safety hazard of pipe leakage, improving the safety and reliability of the heat dissipation module and the server. Furthermore, this solution shortens the heat conduction path, allowing heat to be dissipated more quickly by the liquid cooling plate, improving the heat dissipation efficiency of the heat dissipation module.

Description

Technical Field

[0001] This invention relates to the technical field of computing devices, and in particular to a heat dissipation module and a server. Prior Technology

[0002] Air cooling systems are a common heat dissipation technology for servers due to their advantages such as low cost, ease of maintenance and installation. They can effectively control the server's temperature and maintain its normal operation. Air cooling systems typically consist of fans and cold plates. The fans blow air into the server and cool it through the cold plates, thereby reducing the server's temperature.

[0003] However, with the continuous increase in data processing volume, the power consumption of devices in the server is also constantly increasing to meet computing demands, making effective heat dissipation of high-power devices a difficult problem to solve. For example, when using a cold plate to cool the memory module, the cold plate uses a large number of liquid cooling pipes for coolant circulation, which not only makes the layout of the liquid cooling pipes difficult but also poses a significant risk of leakage, affecting the reliability and safety of the server. Furthermore, the long coolant flow path limits the heat dissipation effect on the memory module, thus restricting the memory module's heat dissipation capacity. Summary of the Invention

[0004] Therefore, it is necessary to provide a heat dissipation module and server to address the problems of difficult liquid cooling pipeline layout, leakage risk, and poor heat dissipation effect in traditional technologies.

[0005] A first aspect of the present invention provides a heat dissipation module comprising:

[0006] Memory module;

[0007] A heat-conducting mechanism is installed with the memory module, and the heat-conducting mechanism and the memory module are in heat-transfer cooperation.

[0008] A liquid cooling plate is installed on the heat-conducting mechanism, and the liquid cooling plate and the heat-conducting mechanism are in heat transfer cooperation.

[0009] In this heat dissipation module, a heat-conducting mechanism is installed alongside the memory module, allowing for heat transfer between them. Furthermore, the heat-conducting mechanism is integrated with a liquid cooling plate, enabling heat transfer between them. When the memory module generates heat during operation and requires cooling, the heat is directly transferred to the heat-conducting mechanism, which then transfers it to the liquid cooling plate. The coolant flowing within the liquid cooling plate absorbs and carries away the heat, thus achieving cooling of the memory module. Compared to traditional technologies, this solution uses a heat-conducting mechanism that directly works with the memory module and liquid cooling plate to transfer heat. This allows the heat generated by the memory module to be quickly and effectively transferred to the liquid cooling plate to achieve heat dissipation. This eliminates the need for a large number of liquid cooling pipes, reduces the difficulty of liquid cooling pipe layout, and eliminates the safety hazard of pipe leakage. This greatly improves the safety and reliability of the heat dissipation module and server. In addition, this solution greatly shortens the heat conduction path, allowing the heat to be dissipated by the liquid cooling plate more quickly, significantly improving the heat dissipation efficiency of the heat dissipation module.

[0010] The technical solution of the present invention will be further described below:

[0011] In one embodiment, the heat-conducting mechanism includes a heat-conducting carrier plate and a heat-conducting component, the heat-conducting component is mounted on the heat-conducting carrier plate and is thermally connected to the memory module, and the liquid cooling plate is mounted on the heat-conducting carrier plate.

[0012] In one embodiment, the heat-conducting component and the liquid cooling plate are located on the same plate surface in the thickness direction of the heat-conducting carrier plate.

[0013] In one embodiment, the heat-conducting component and the liquid cooling plate are respectively disposed on opposite side plates in the thickness direction of the heat-conducting carrier plate; and in the thickness direction of the heat-conducting carrier plate, the heat-conducting component and the liquid cooling plate are arranged aligned or staggered.

[0014] In one embodiment, the heat-conducting component includes multiple heat-conducting plates, which are arranged side-by-side at intervals along the length or width of the heat-conducting carrier plate, with a receiving groove formed between adjacent heat-conducting plates;

[0015] The memory module includes multiple memory modules, which are inserted into the receiving slots one by one, and the memory modules are heat-conductingly connected to the two heat-conducting plates on both sides.

[0016] In one embodiment, the heat-conducting component further includes a first heat transfer medium disposed on the heat-conducting plate and heat-conductingly connected to the memory.

[0017] In one embodiment, the heat-conducting mechanism further includes a second heat transfer medium disposed on the heat-conducting carrier plate, and the second heat transfer medium is heat-transfer connected to the liquid cooling plate.

[0018] In one embodiment, the liquid-cooled plate includes an inlet pipe, a plate body, and an outlet pipe. The inlet pipe is connected to the inlet of the plate body, and the outlet pipe is connected to the outlet of the plate body. The interior of the plate body forms a flow divider, a plurality of liquid-cooled channels arranged side by side, and a flow merger. The flow divider communicates with the inlet and the plurality of liquid-cooled channels, and the flow merger communicates with the plurality of liquid-cooled channels and the outlet.

[0019] In one embodiment, the heat dissipation module further includes a motherboard and a connecting pipe. At least two memory modules, heat conduction mechanisms, and liquid cooling plates are provided. Each heat conduction mechanism is connected to at least one memory module and at least one liquid cooling plate. Adjacent liquid cooling plates are connected through the connecting pipe. One of the two adjacent liquid cooling plates is provided with a liquid inlet pipe, and the other of the two adjacent liquid cooling plates is provided with a liquid outlet pipe. All memory modules are mounted on the motherboard.

[0020] In a second aspect, the present invention also provides a server comprising a heat dissipation module as described in any of the above embodiments. Simple Explanation of the Diagram

[0021] The drawings that form part of this invention are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an improper limitation of the invention.

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort. Figure 1 is a schematic diagram of the server structure according to an embodiment. Figure 2 is a structural schematic diagram from another perspective of Figure 1. Figure 3 is a schematic diagram of the rear view structure of the server in Figure 1. Figure 4 is a top view of the structure shown in Figure 1. Figure 5 is a schematic diagram of the cross-sectional structure at point AA in Figure 4. Figure 6 is a magnified schematic diagram of the local structure at point B in Figure 5. Figure 7 is a schematic diagram of the assembly structure of the memory module, heat conduction mechanism and liquid cooling plate in one embodiment. Figure 8 is a partial exploded structure diagram of Figure 7. Figure 9 is a schematic diagram of the internal structure of a liquid cooling plate according to an embodiment. Implementation

[0023] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0024] In the description of this invention, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0025] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0026] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can be a mechanical connection or an electrical connection; they can be a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0027] In this invention, unless otherwise explicitly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact, or indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0028] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. Where applicable, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this invention are for illustrative purposes only and do not represent the only possible implementation.

[0029] Referring to Figures 1, 2, and 4 to 8, a heat dissipation module 10 is shown in one embodiment of the present invention. In application, it is installed inside the chassis 20 of the server 100 and is mainly used to cool the memory module 11. In addition, it can also provide auxiliary heat dissipation for power-consuming devices such as the CPU.

[0030] For example, the heat dissipation module 10 includes a memory module 11, a heat conduction mechanism 12, and a liquid cooling plate 13. The memory module 11 provides data storage function. When the memory module 11 works for a long time, it will generate a lot of heat. If the memory module 11 is not cooled down in time, it will inevitably affect the service life and reliability of the memory module 11 if it is in a high-temperature working environment for a long time.

[0031] For example, memory module 11 specifically includes a mounting base and memory 111. One end of memory 111 with pins is inserted into the mounting base. The pins make contact with the contacts in the mounting base to conduct electricity, thereby enabling the installation and normal use of memory 111.

[0032] The heat conduction mechanism 12 is installed on the memory module 11, and the heat conduction mechanism 12 and the memory module 11 are in heat transfer cooperation; the liquid cooling plate 13 is installed on the heat conduction mechanism 12, and the liquid cooling plate 13 and the heat conduction mechanism 12 are in heat transfer cooperation.

[0033] In summary, implementing the technical solution of this embodiment will achieve the following beneficial effects: In the heat dissipation module 10 of this solution, by using a heat conduction mechanism 12 to install with the memory module 11, the heat conduction mechanism 12 can cooperate with the memory module 11 for heat transfer; on this basis, the heat conduction mechanism 12 is further installed with the liquid cooling plate 13 so that the heat conduction mechanism 12 can cooperate with the liquid cooling plate 13 for heat transfer; when the memory module 11 generates heat during operation and needs to be cooled down, the heat generated by the memory module 11 can be directly conducted to the heat conduction mechanism 12 through heat transfer, and then the heat conduction mechanism 12 further conducts the heat to the liquid cooling plate 13. The coolant flowing in the liquid cooling plate 13 absorbs the heat and carries it away, thereby achieving the cooling effect of the memory module 11.

[0034] Compared to traditional technologies, this solution uses a heat-conducting mechanism 12 to directly transfer heat to the memory module 11 and the liquid cooling plate 13. This allows the heat generated by the memory module 11 to be quickly and effectively transferred to the liquid cooling plate 13 to achieve heat dissipation for the memory module 11. This eliminates the need for the installation and use of a large number of liquid cooling pipes, reduces the difficulty of liquid cooling pipe layout, and eliminates the safety hazard of pipe leakage. This greatly improves the safety and reliability of the heat dissipation module 10 and the server 100. In addition, this solution greatly shortens the heat conduction path, allowing the heat to be dissipated by the liquid cooling plate 13 more quickly, significantly improving the heat dissipation efficiency of the heat dissipation module 10.

[0035] Please refer to Figures 6 to 8. In one embodiment, the heat-conducting mechanism 12 includes a heat-conducting carrier plate 121 and a heat-conducting component 122. The heat-conducting component 122 is mounted on the heat-conducting carrier plate 121 and is thermally connected to the memory module 11. The liquid cooling plate 13 is mounted on the heat-conducting carrier plate 121. The heat-conducting carrier plate 121 serves to load and fix the heat-conducting component 122 and the liquid cooling plate 13, so that the assembly structure of the heat-conducting mechanism 12 and the liquid cooling plate 13 is compact, reducing the installation space occupied, shortening the heat conduction path, and improving the heat dissipation efficiency.

[0036] By connecting the memory module 11 to the heat-conducting component 122 for heat transfer, the heat generated by the memory module 11 during operation can be conducted to the heat-conducting component 122 in a basic heat transfer manner. Then, the heat-conducting component 122 conducts the heat to the heat-conducting carrier plate 121, and the heat-conducting carrier plate 121 further conducts the heat to the liquid cooling plate 13. The coolant flowing in the liquid cooling plate 13 absorbs the heat and carries it away from the liquid cooling plate 13, thereby achieving cooling and temperature reduction of the memory module 11.

[0037] Furthermore, based on the above embodiments, the heat-conducting component 122 and the liquid cooling plate 13 are located on the same surface of the heat-conducting carrier plate 121 in the thickness direction. More specifically, both the heat-conducting component 122 and the liquid cooling plate 13 are mounted on the surface of the heat-conducting carrier plate 121 facing the memory module 11. This fully utilizes the space between the heat-conducting carrier plate 121 and the memory module 11, reducing the overall height of the heat dissipation module 10 and facilitating the miniaturization design of the server 100. In addition, the heat-conducting carrier plate 121 covers the heat-conducting component 122 and the liquid cooling plate 13, providing some protection for both and preventing accidental scratches to the heat-conducting component 122 and the liquid cooling plate 13 by tools during installation.

[0038] Understandably, both the heat-conducting component 122 and the heat-conducting carrier plate 121 are made of materials with excellent heat transfer performance, such as metals (e.g., copper, copper alloys, etc.). The specific materials can be flexibly selected according to actual needs.

[0039] It should also be noted that the heat-conducting carrier plate 121 and the heat-conducting component 122 can be an integral structure or a detachable assembly; when the two are detachable assembly connection structures, the specific installation method can be any one of screw connection, snap connection, adhesive connection, etc., and can be flexibly selected, without specific limitations here.

[0040] Alternatively, as an alternative to the above embodiments, in another optional embodiment, the heat-conducting component 122 and the liquid-cooling plate 13 are respectively disposed on opposite sides of the heat-conducting carrier plate 121 in the thickness direction; and in the thickness direction of the heat-conducting carrier plate 121, the heat-conducting component 122 and the liquid-cooling plate 13 are aligned or staggered. Compared to the case where the heat-conducting component 122 and the liquid-cooling plate 13 are located on the same side of the heat-conducting carrier plate 121, the heat conducted from the heat-conducting component 122 needs to travel a longer path along the length or width direction of the heat-conducting carrier plate 121 before reaching the liquid-cooling plate 13. By installing the heat-conducting component 122 and the liquid-cooling plate 13 on opposite sides of the thickness direction of the heat-conducting carrier plate 121, the heat conducted from the heat-conducting component 122 only needs to travel along the thickness path of the heat-conducting carrier plate 121 to reach the liquid-cooling plate 13 more quickly, thereby more effectively shortening the heat conduction path length and improving the heat dissipation efficiency of the heat dissipation module 10.

[0041] It should be noted that, considering the issue of heat conduction efficiency, the thickness of the heat-conducting carrier plate 121 can be made as thin as possible while meeting the necessary strength requirements. At the same time, the heat-conducting component 122 and the liquid cooling plate 13 are arranged as close as possible, which is more conducive to shortening the heat conduction path.

[0042] Please continue referring to Figures 6 to 8. Based on any of the above embodiments, the heat-conducting component 122 includes multiple heat-conducting plates 1221. The multiple heat-conducting plates 1221 are arranged side by side at intervals along the length or width direction of the heat-conducting carrier plate 121, and a receiving groove 1222 is formed between adjacent heat-conducting plates 1221. For example, in this invention, the heat-conducting carrier plate 121 is rectangular, and the multiple heat-conducting plates 1221 are arranged equidistantly side by side along the length direction of the heat-conducting carrier plate 121.

[0043] The memory module 11 includes multiple memory modules 111, which are also installed side-by-side and spaced apart in the mounting base along the length of the heat-conducting carrier plate 121. During installation, the heat-conducting mechanism 12 is placed on the memory module 11, so that the memory modules 111 can be inserted into the receiving slots 1222 one by one, and the memory modules 111 are thermally connected to the two heat-conducting plates 1221 on both sides. In this way, on the one hand, the multiple heat-conducting plates 1221 can be adapted and assembled with multiple memory modules 111 at the same time, thereby meeting the need for simultaneous heat dissipation and cooling of multiple memory modules 111 and improving the heat dissipation capacity of the heat dissipation module 10 in large storage scenarios; on the other hand, the two heat-conducting plates 1221 that are in contact with the memory modules 111 on both sides provide two heat transfer paths for each memory module 111, which allows the heat of the memory module 111 to be conducted away more quickly and effectively, enhancing the heat dissipation effect of the memory module 111.

[0044] 6 to 8. Furthermore, in order to further enhance the performance of heat conduction from memory 111 to the heat transfer plate 1221, in one embodiment, the heat conduction assembly 122 also includes a first heat transfer medium 14 disposed on the heat transfer plate 1221 , and the first heat transfer medium 14 is connected to the memory 111 heat transfer. For example, the first heat transfer medium 14 may be, but is not limited to, a heat transfer adhesive.

[0045] Similarly, to further enhance the performance of heat conduction from the heat conduction carrier plate 121 to the liquid cooling plate 13 , in one embodiment, the heat conduction mechanism 12 also includes a second heat transfer medium disposed on the heat conduction carrier plate 121 , and the second heat transfer medium is connected to the liquid cooling plate 13 for heat transfer. For example, a second heat transfer medium may be, but is not limited to, a heat transfer adhesive.

[0046] It should be noted that the first heat transfer medium 14 and the second heat transfer medium adopt heat transfer adhesive, in addition to being used to improve the heat transfer performance, the heat transfer adhesive also provides adhesion, which helps to improve the connection strength of the memory 111 and the heat conductive plate 1221 as well as the heat conductive carrier plate 121 and the liquid cooling plate 13 , thereby improving the overall structural stability of the heat sink module 10 .

[0047] Referring to FIG 2 internally forms a shunt tank 1321 , a plurality of liquid-cooled runners 1322 arranged side by side, and a bus tank 1323 , which is in communication with the inlet as well as a plurality of liquid-cooled runners 1322 , which is in communication with a plurality of liquid-cooled runners 1322 as well as a liquid outlet.

[0048] In use, both the inlet pipe 131 and the outlet pipe 133 are used to connect with the coolant supply device. Understandably, the temperature of the coolant that refluxes from the outlet pipe 133 to the coolant supply device increases due to the absorption of heat from the memory 111 ;

[0049] During operation, the coolant flowing in from the inlet pipe 131 first flows into the distribution tank 1321, which evenly distributes the coolant to multiple liquid cooling channels. The coolant flowing through the liquid cooling channels absorbs heat conducted from the heat-conducting carrier plate 121 through the side wall of the plate body 132. Finally, the coolant carrying heat converges in the manifold 1323 and flows out from the outlet pipe 133. The coolant continuously flowing through the liquid cooling plate 13 continuously absorbs the heat generated by the memory module 111, thus achieving continuous heat dissipation and cooling of the memory module 111, ensuring that the memory module 111 can work safely and reliably for a long time.

[0050] Please refer to Figures 1, 2, 6 to 8. In addition, based on any of the above embodiments, the heat dissipation module 10 also includes a motherboard 15 and a connecting pipe 16. At least two memory modules 11, heat conduction mechanisms 12 and liquid cooling plates 13 are provided. Each heat conduction mechanism 12 is connected to at least one memory module 11 and at least one liquid cooling plate 13. Adjacent liquid cooling plates 13 are connected through the connecting pipe 16. One of the two adjacent liquid cooling plates 13 is provided with a liquid inlet pipe 131, and the other of the two adjacent liquid cooling plates 13 is provided with a liquid outlet pipe 133. All memory modules 11 are mounted on the motherboard 15.

[0051] On the one hand, at least two liquid cooling plates 13 are connected to the heat conduction mechanism 12 at the same time, so that more memory modules 11 can be cooled at the same time, and the heat dissipation module 10 can be applied to large storage capacity application scenarios. On the other hand, two adjacent liquid cooling plates 13 are connected through the liquid path of the connecting pipe 16, so that the coolant can flow through the two adjacent liquid cooling plates 13 in sequence, simplifying the coolant flow path, reducing the number of liquid cooling pipes used and reducing the difficulty of pipe layout.

[0052] For example, in one heat-conducting mechanism 12 of this invention, two heat-conducting components 122 are arranged side-by-side at intervals on the same surface of the heat-conducting carrier plate 121, and the interval between the two heat-conducting components 122 is used to install the liquid cooling plate 13. During operation, the two heat-conducting components 122 are simultaneously connected to the two memory modules 11 for heat transfer. The heat from the two memory modules 11 is conducted to the heat-conducting carrier plate 121 through the corresponding heat-conducting components 122, and then the heat is gathered in the middle of the heat-conducting carrier plate 121 and finally conducted to the liquid cooling plate 13.

[0053] Please refer to Figures 1 and 3. In addition to the above, this invention also proposes a server 100, which includes a heat dissipation module 10 as described in any of the above embodiments. In this invention, the server 100 further includes at least a CPU and a heat sink 30. The heat dissipation module 10 is mounted on one side of the motherboard 15 in the thickness direction, and the CPU is mounted on the other side of the motherboard 15 in the thickness direction. The heat sink 30 is assembled with the CPU to dissipate heat and cool the CPU.

[0054] Furthermore, when the server 100 is installed and used normally, the CPU and heat sink 30 are located at the top of the chassis 20, while the heat dissipation module 10 is located at the bottom of the chassis 20. At this time, the server 100 adopts an inverted CPU structure.

[0055] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0056] The embodiments described above are merely examples of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended patent application.

[0057] 100: Server 10: Heat dissipation module 11: Memory Module 111: Memory 12: Heat conduction mechanism 121: Thermal Conductive Plate 122: Thermal conductive components 1221: Heat Dissipation Plate 1222: Receiving slot 13: Liquid cooling plate 131: Inlet pipe 132:Board body 1321: Diversion Channel 1322: Liquid cooling channel 1323: Manifold 133: Discharge tube 14: First heat transfer medium 15: Motherboard 16: Connecting pipe 20: Chassis 30: Heat dissipation plate

Claims

1. A heat dissipation module, comprising: Memory module; A heat-conducting mechanism is installed on the memory module and is in heat-transfer cooperation with the memory module. The heat-conducting mechanism includes a heat-conducting carrier plate and a heat-conducting component. The heat-conducting component is mounted on the heat-conducting carrier plate and is in heat-transfer connection with the memory module. A liquid cooling plate is also included, mounted on the heat-conducting carrier plate of the heat-conducting mechanism and in heat-transfer cooperation with the heat-conducting mechanism.

2. The heat dissipation module as claimed in claim 1, wherein the heat-conducting component and the liquid cooling plate are located on the same plate surface in the thickness direction of the heat-conducting carrier plate.

3. The heat dissipation module as claimed in claim 1, wherein the heat-conducting component and the liquid cooling plate are respectively disposed on opposite side plates in the thickness direction of the heat-conducting carrier plate; and in the thickness direction of the heat-conducting carrier plate, the heat-conducting component and the liquid cooling plate are arranged aligned or staggered.

4. The heat dissipation module as claimed in claim 1, wherein the heat conduction component includes multiple heat conduction plates, the multiple heat conduction plates are arranged side by side at intervals along the length or width direction of the heat conduction carrier plate, and an accommodating groove is formed between two adjacent heat conduction plates; the memory module includes multiple memory modules, the memory modules are inserted into the accommodating grooves one by one, and the memory modules are thermally connected to the two heat conduction plates on both sides.

5. The heat dissipation module as claimed in claim 4, wherein the heat conduction component further includes a first heat transfer medium disposed on the heat conduction plate and the first heat transfer medium is thermally connected to the memory.

6. The heat dissipation module as claimed in claim 1, wherein the heat conduction mechanism further includes a second heat transfer medium disposed on the heat conduction carrier plate, and the second heat transfer medium is heat-transferringly connected to the liquid cooling plate.

7. The heat dissipation module as claimed in claim 1, wherein the liquid cooling plate includes an inlet pipe, a plate body, and an outlet pipe, the inlet pipe being connected to the inlet of the plate body, the outlet pipe being connected to the outlet of the plate body, and the interior of the plate body forming a distribution channel, a plurality of liquid cooling channels arranged side by side, and a confluence channel, the distribution channel communicating with the inlet and the plurality of liquid cooling channels, and the confluence channel communicating with the plurality of liquid cooling channels and the outlet.

8. The heat dissipation module as claimed in claim 1, wherein the heat dissipation module further includes a motherboard and a connecting pipe, and at least two of the memory modules, the heat conduction mechanism and the liquid cooling plate are provided, each of the heat conduction mechanism is connected to at least one of the memory modules and at least one of the liquid cooling plates, adjacent two liquid cooling plates are connected through the connecting pipe, and one of the adjacent two liquid cooling plates is provided with a liquid inlet pipe, and the other of the adjacent two liquid cooling plates is provided with a liquid outlet pipe, and all the memory modules are mounted on the motherboard.

9. A server comprising a heat dissipation module as described in any one of claims 1 to 8.

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