Glue coating and developing module and apparatus

Abstract

This invention relates to a coating and developing module and apparatus. The coating and developing module includes: a process assembly comprising multiple process units for heat-processing or liquid-processing wafers; a process robot equipped with multiple independently moving actuators for adsorbing and moving wafers; the process units are symmetrically arranged on opposite sides of the process robot about a center line; the process robot is used to move wafers into or out of the process unit on either side; the process robot is configured to rotate about its rotation axis so that the actuators face the process unit on one side. This coating and developing module improves the flexibility of the process robot to increase the utilization rate of the process assembly.

Description

Technical Field

[0001] This invention relates to the field of coating and developing in semiconductor manufacturing, and more particularly to a coating and developing module and apparatus. Prior Technology

[0002] In existing semiconductor lithography processes, the resist coating unit, lithography unit, and developing unit respectively complete the resist coating process, the lithography process, and the developing process. With the improvement of semiconductor processing technology, the market generally adopts the method of connecting the resist coating and developing unit with the lithography unit to complete the entire lithography process. In this case, the resist coating process and the developing process are usually integrated into the same unit.

[0003] Currently, commonly used coating and developing equipment employs a symmetrical architecture, meaning both the liquid processing module and the heat treatment module are symmetrically arranged along their length. In the liquid processing module, two robotic arms synchronously transport wafers in a symmetrical manner along the length direction. If a single liquid processing unit in the module is damaged, the robotic arms will no longer feed a wafer into that unit, and the undamaged liquid processing units on its symmetrical side will also be unable to be fed into the wafer. Similarly, if a single heat treatment unit in the heat treatment module is damaged, the undamaged heat treatment units on its symmetrical side will also be unable to be fed into the wafer. The production efficiency of both the liquid processing and heat treatment modules is limited by the synchronously symmetrical movement of the robotic arms. Therefore, there is an urgent need for a coating and developing module and apparatus to improve upon these problems. Summary of the Invention

[0004] Technical issues

[0005] The technical problem to be solved by the present invention is to provide a coating and developing module and apparatus that can improve the flexibility of process robots to improve the utilization rate of process components.

[0006] Technical solution

[0007] To address the aforementioned technical problems, according to a first aspect of the present invention, a coating and developing module is provided, comprising: a process assembly including a plurality of process units for heat treatment or liquid treatment of wafers; a process robot equipped with a plurality of independently moving actuators for adsorbing and moving wafers; the process units are symmetrically arranged on opposite sides of the process robot about a dividing line; the process robot is used to move wafers into or out of the process unit on either side; the process robot is configured to rotate about its rotation axis so that the actuators face the process unit on one side.

[0008] Optionally, the plurality of actuators may include a first actuator and a second actuator with the same orientation, for removing processed wafers from the process unit they are oriented towards at different times, or sending wafers to be processed into the process unit they are oriented towards.

[0009] Optionally, when the coating and developing module is used in a liquid treatment process, the process component can be a liquid treatment component, and the process robot can be a liquid treatment robot; when the coating and developing module is used in a heat treatment process, the process component can be a heat treatment component, and the process robot can be a heat treatment robot.

[0010] Optionally, each of the process components may further include multiple layered process frames stacked along the height direction; the multiple process robots are respectively disposed in the multiple layered process frames.

[0011] Optionally, the actuators on the same process robot can be configured to move asynchronously.

[0012] Optionally, when the process frame in the coating and developing module is used for liquid treatment, it may include at least one layer of infeed liquid treatment frame and at least one layer of return liquid treatment frame; when the process frame in the coating and developing module is used for heat treatment, it may include at least one layer of infeed heat treatment frame and at least one layer of return heat treatment frame.

[0013] Optionally, the wafer loading liquid treatment frame may be equipped with a photoresist coating unit; the photoresist coating unit can be used to coat the wafer surface with photoresist; the liquid treatment robot in the wafer loading liquid treatment frame can be used to move the wafer into the photoresist coating unit, or to move the wafer with photoresist coating on its surface to the wafer loading heat treatment frame.

[0014] Optionally, a soft baking unit may be provided within the wafer loading heat treatment frame; the soft baking unit can be used to remove residual solvent from the photoresist on the wafer surface; the heat treatment robot in the wafer loading heat treatment frame can be used to move the wafer into the soft baking unit, or to move the wafer with the residual solvent removed to the photolithography machine.

[0015] Optionally, the wafer return heat treatment frame may be equipped with a hard baking unit; the hard baking unit can be used to cure the coating on the wafer surface; the heat treatment robot in the wafer return heat treatment frame can be used to move the wafer into the hard baking unit, or to move the wafer with the surface coating already cured to the wafer return liquid treatment frame.

[0016] Optionally, a developing unit may be provided within the return solution processing frame; the developing unit may be used to apply developing solution to the wafer surface; the liquid processing robot in the return solution processing frame may be used to move the wafer into the developing unit, or to move the wafer with photoresist coated on its surface to the wafer cassette module.

[0017] Optionally, all actuators on the same process robot can be connected to the same control unit; the control unit can be used to control the actuators on the process robot to move without interfering with each other.

[0018] According to a second aspect of the present invention, a coating and developing apparatus is provided, comprising: a wafer cassette module, an interface module, and two coating and developing modules as described in the first aspect; the two coating and developing modules are respectively configured as a liquid processing module and a heat treatment module; the wafer cassette module is connected to the liquid processing module; the wafer cassette module is provided with an infeed loading port and a return loading port; the infeed loading port is used to store wafers to be moved to the liquid processing module; the return loading port is used to store wafers from the liquid processing module; the interface module is connected to the heat treatment module; the interface module is provided with a front washing unit and a back washing unit; the front washing unit is used to clean the front side of the wafer, and the back washing unit is used to clean the back side of the wafer.

[0019] Optionally, the number of wafer-in liquid treatment frames in the liquid treatment module can be the same as the number of wafer-in heat treatment frames in the heat treatment module, and they can be connected in a one-to-one correspondence; the number of wafer-return liquid treatment frames in the liquid treatment module can be the same as the number of wafer-return heat treatment frames in the heat treatment module, and they can be connected in a one-to-one correspondence.

[0020] Optionally, the wafer cassette module may include a wafer cassette cold tray tower, a wafer infeed interface, and a wafer return interface; the interface module may include an interface cold tray tower; corresponding to the N-layer liquid treatment frame in the liquid treatment module, the wafer cassette cold tray tower may have N branch interfaces, where N is a positive integer greater than 1; corresponding to the N-layer heat treatment frame in the heat treatment module, the interface cold tray tower may have N branch interfaces.

[0021] Beneficial effects

[0022] Compared with the prior art, the technical solution of the present invention can achieve at least the following beneficial effects:

[0023] This invention utilizes a process unit symmetrically arranged on opposite sides of a process robot about a center line, with the process robot configured to rotate about its rotation axis so that the actuator faces one of the process units. This allows the robot to independently move the wafers on both sides, ensuring that the normal operation of the symmetrical process unit is not affected when one process unit fails. This avoids the production efficiency of the process unit being constrained by the synchronously symmetrical movement of the robot. Simple Explanation of the Diagram

[0024] Figure 1 is a schematic diagram of the structure of a coating and developing module provided by the present invention. Figure 2 is a top view of a coating and developing apparatus provided by the present invention. Figure 3 is a cross-sectional view of a coating and developing apparatus provided by the present invention. Figure 4 is a schematic diagram of the structure at BB in Figure 2 provided by the present invention. Figure 5 is a schematic diagram of the structure at DD in Figure 2 provided by the present invention. Figure 6 is a schematic diagram of the structure at point AA in Figure 2 provided by the present invention. Figure 7 is a schematic diagram of the structure at EE in Figure 2 provided by the present invention. Figure 8 is a schematic diagram of the structure at FF in Figure 2 provided by the present invention. Figure 9 is a schematic diagram of the structure at point GG in Figure 2 provided by the present invention. Figure 10 is a schematic diagram of the structure at CC in Figure 2 provided by the present invention. Implementation

[0025] To make the technical problems, technical solutions, and beneficial effects of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art. The terms "comprising" and similar expressions used herein mean that the components or objects preceding the word cover the components or objects listed following the word and their equivalents, but do not exclude other components or objects.

[0026] To address the problems existing in the prior art, as shown in Figure 1, a first embodiment provides a coating and developing module 6, including: a process assembly 61 comprising multiple process units for heat treatment or liquid treatment of wafers; a process robot 62 equipped with multiple independently moving actuators for adsorbing and moving wafers; the process units are symmetrically arranged on opposite sides of the process robot about a center line; the process robot is used to move wafers into or out of the process unit on either side; the process robot is configured to rotate about its rotation axis so that the actuators face the process unit on one side. The compact, symmetrical layout of the process assembly in this embodiment helps reduce the overall footprint of the device. Due to the use of multiple independently operating robots and the symmetrical layout of the process assembly, the entire module can process wafers more quickly. The independently moving actuators reduce the risk of single points of failure; even if one process assembly fails, the others can continue to operate.

[0027] It is worth noting that the process robot is equipped with a bidirectional rotatable actuator. In some specific embodiments, the process assembly 61 includes a symmetrically arranged first process unit 601 and a second process unit 602. Each process robot is used at different times to perform the action of feeding the wafer into the first process unit 601 and the second process unit 602.

[0028] In this embodiment, within a limited floor space, the multiple process components 61 are symmetrically arranged on both sides of the process robot about the center line, which can increase the number of process components 61 and make the distribution positions of the process components on both sides consistent, thereby improving process uniformity and facilitating increased production efficiency.

[0029] In some embodiments, the plurality of actuators includes a first actuator and a second actuator with the same orientation, for removing processed wafers from the process unit they are oriented towards at different times, or for feeding wafers to be processed into the process unit they are oriented towards.

[0030] In some specific embodiments, when the first actuator removes a wafer from the process cell it is facing, the second actuator places the wafer into the process cell it is facing; conversely, when the second actuator removes a wafer from the process cell it is facing, the first actuator places the wafer into the process cell it is facing. In this embodiment, when one actuator removes a wafer that has completed its process processing from a process cell, another actuator can immediately place the wafer to be processed into that process cell, reducing the time the process cell waits for wafer replacement.

[0031] In some examples, both the first and second actuators are oriented in the horizontal Y direction. After the process robot rotates 180 degrees around its vertical axis of rotation, both the first and second actuators are oriented in the opposite horizontal Y direction.

[0032] In some embodiments, each of the process components further includes a plurality of layered process frames stacked along the height direction; the plurality of process robots are correspondingly disposed in the plurality of layered process frames. This embodiment, by stacking multiple process frames along the height direction, can realize more processing bits within a limited space, thereby improving the space utilization of the device.

[0033] In some embodiments, when the coating and developing module is used in a liquid treatment process, the process component is a liquid treatment component, and the process robot is a liquid treatment robot; when the coating and developing module is used in a heat treatment process, the process component is a heat treatment component, and the process robot is a heat treatment robot. Because the actuators on the liquid treatment robot and the heat treatment robot in this embodiment move independently, it is beneficial to fully utilize the liquid treatment component and the heat treatment component, and to avoid the liquid treatment unit in the liquid treatment component and the heat treatment unit in the heat treatment component being idle due to the symmetrically moving robot.

[0034] In some specific embodiments, a liquid processing robot located at the bottom layer is used to transfer the liquid-processed wafer to a heat-processing robot located at the bottom layer. In other specific embodiments, a heat-processing robot located at the top layer is used to transfer the heat-processed wafer to a liquid processing robot located at the top layer.

[0035] In some embodiments, the actuators on the same process robot are configured to move asynchronously. This embodiment avoids interference between actuators by setting the actuators to move asynchronously, which is beneficial for the safe transport of wafers.

[0036] As shown in Figures 1 and 2, in some specific embodiments, the liquid handling robot located in the top liquid handling frame is equipped with two actuators, namely a first liquid handling actuator 211 and a second liquid handling actuator 212. The first liquid handling actuator 211 and the second liquid handling actuator 212 are configured to move asynchronously.

[0037] In some examples, the liquid treatment second actuator 212 remains stationary when the liquid treatment first actuator 211 moves. In other examples, the liquid treatment first actuator 211 remains stationary when the liquid treatment second actuator 212 moves. In still other examples, the liquid treatment first actuator 211 is capable of moving relative to the liquid treatment second actuator 212 in the height direction Z.

[0038] In other specific embodiments, the heat treatment robot located on the top heat treatment frame is equipped with two actuators, namely a first heat treatment actuator 41 and a second heat treatment actuator 42. The first heat treatment actuator 41 and the second heat treatment actuator 42 are configured to move asynchronously.

[0039] In some examples, the heat treatment second actuator 42 remains stationary when the heat treatment first actuator 41 moves. In other examples, the heat treatment first actuator 41 remains stationary when the heat treatment second actuator 42 moves. In still other examples, the heat treatment first actuator 41 is capable of moving relative to the heat treatment second actuator 42 in the height direction Z.

[0040] In some embodiments, when the process frame in the coating and developing module is used for liquid treatment, it includes at least one inlet liquid treatment frame and at least one return liquid treatment frame; when the process frame in the coating and developing module is used for heat treatment, it includes at least one inlet heat treatment frame and at least one return heat treatment frame.

[0041] In some specific embodiments, the 6-layer liquid processing frame includes a 3-layer wafer entry liquid processing frame and a 3-layer wafer return liquid processing frame; the 6-layer thermal processing frame includes a 3-layer wafer entry thermal processing frame and a 3-layer wafer return thermal processing frame. This embodiment, by separating the wafer entry frame and the wafer return frame, enables efficient wafer transfer at different processing stages. For example, in the liquid processing process, the wafer entry liquid processing frame is used to receive and perform initial processing (such as the coating process), while the wafer return liquid processing frame is used for subsequent processing (such as the developing process). This helps reduce the waiting time of the wafer between various processing steps, thereby improving overall processing efficiency.

[0042] In other embodiments, the number of the wafer entry liquid treatment frames is the same as the number of the wafer entry heat treatment frames; the number of the wafer return liquid treatment frames is the same as the number of the wafer return heat treatment frames.

[0043] In other specific embodiments, the 6-layer liquid treatment frame includes a 4-layer wafer entry liquid treatment frame and a 2-layer wafer return liquid treatment frame; the 6-layer heat treatment frame includes a 4-layer wafer entry heat treatment frame and a 2-layer wafer return heat treatment frame.

[0044] In some specific embodiments, the 6-layer liquid treatment frame includes a 5-layer wafer entry liquid treatment frame and a 1-layer wafer return liquid treatment frame; the 6-layer heat treatment frame includes a 5-layer wafer entry heat treatment frame and a 1-layer wafer return heat treatment frame.

[0045] As shown in Figures 2 and 3, in some embodiments, an interlayer module 300 is also included, located between the liquid processing module 200 and the heat treatment module 400, for storing wafers; the liquid processing module 200, the heat treatment module 400, and the interlayer module 300 each include adjacent N-layer frames, where N is a positive integer greater than 1; the N-layer frames of the liquid processing module 200 and the N-layer frames of the interlayer module 300 are connected in a one-to-one correspondence; the N-layer frames of the interlayer module 300 and the N-layer frames of the liquid processing module 200 are connected in a one-to-one correspondence.

[0046] Both the liquid treatment module 200 and the heat treatment module 400 are configured as a 6-layer frame. The 6-layer frame is stacked along the vertical Z direction. Along the horizontal X direction, the liquid treatment module 200, the interlayer module 300, and the heat treatment module 400 are arranged sequentially.

[0047] As shown in Figures 3 and 4, in some specific embodiments, the robotic arm within the wafer feed liquid treatment frame includes a coating robot 11, used to move the wafer from the interface with the cooling unit in the interlayer module 300 to the coating unit, and to move the wafer from the coating unit to the interface in the interlayer module 300. In some examples, coating components COT are symmetrically arranged on both sides of the coating robot. Specifically, the coating components COT are configured as coating units symmetrical about the split line or the XZ plane.

[0048] In some embodiments, the wafer loading liquid treatment frame includes a photoresist coating unit; the photoresist coating unit is used to coat the wafer surface with photoresist; and the liquid treatment robot in the wafer loading liquid treatment frame is used to move the wafer into the photoresist coating unit, or to move the wafer with photoresist coated onto its surface to the wafer loading heat treatment frame. In this embodiment, after the wafer has completed photoresist coating, it can be directly fed into the heat treatment frame by the robot in the same liquid treatment frame, reducing the waiting time between different processes and ensuring a continuous processing flow.

[0049] In some specific embodiments, the wafer entry liquid treatment frame is further provided with an anti-reflection unit for coating an anti-reflection layer onto the surface of the wafer; the robotic arm in the wafer entry liquid treatment frame is used to move the wafer from the anti-reflection unit to the interface in the interlayer module 300.

[0050] In other specific embodiments, the coating unit SCR and the anti-reflective unit SCB are stacked. In some examples, within the same substrate preparation frame, the coating unit SCR is located on top of the anti-reflective unit SCB. In other examples, within the same substrate preparation frame, the coating unit SCR is located on the bottom of the anti-reflective unit SCB.

[0051] In some embodiments, a soft baking unit is provided within the wafer loading heat treatment frame; the soft baking unit is used to remove residual solvent from the photoresist on the wafer surface; and a heat treatment robot in the wafer loading heat treatment frame is used to move the wafer into the soft baking unit, or to move the wafer with the residual solvent removed towards the photolithography machine. In this embodiment, after completing the soft baking process, the wafer can be directly fed into the next process by the robot in the same heat treatment frame, reducing the waiting time between different processes and ensuring a continuous processing flow.

[0052] As shown in Figures 3 and 5, in some specific embodiments, the baking robot 21 is used to move the wafer after soft baking to the edge exposure unit WES, and to move the wafer from the edge exposure unit WES to the interfaces PSI8, PSI9 and PSI10 respectively.

[0053] In some embodiments, the wafer feed heat treatment frame is further provided with an anti-reflective baking unit for drying the anti-reflective layer on the wafer surface; the robotic arm in the wafer feed heat treatment frame is used to move the wafer from the interface in the interlayer module 300 to the anti-reflective baking unit, and to move the wafer from the anti-reflective baking unit to the cooling unit in the interlayer module 300.

[0054] In some specific embodiments, the robotic arm 21 located in the bottom wafer feeding heat treatment frame is used to move the wafer from the interface PSI2 to the anti-reflective baking unit BHTB, move the wafer from the anti-reflective baking unit BHTB to the interface SCPC4, and move the wafer from the interface PSI3 to the soft baking unit HLTB.

[0055] In some embodiments, a hard-baking unit is provided within the wafer return heat treatment frame; the hard-baking unit is used to cure the coating on the wafer surface; and a heat treatment robot in the wafer return heat treatment frame is used to move the wafer into the hard-baking unit, or to move the wafer with the surface coating cured to the wafer return liquid treatment frame. In this embodiment, setting both the hard-baking unit and the heat treatment robot within the same heat treatment frame reduces the time the robot spends moving between different heat treatment frames, speeds up wafer processing, and thus improves overall production efficiency.

[0056] In some specific embodiments, the baking robot 26 located in the top-level wafer return heat treatment frame is used to move the wafer from the interface PSI14 to the post-exposure baking unit HAEB, move the wafer from the post-exposure baking unit HAEB to the interface SCPC9, and move the wafer from the interface PSI19 to the hard baking unit DLTB.

[0057] In some embodiments, a developing unit is provided within the return solution processing frame; the developing unit is used to apply developing solution to the wafer surface; and a liquid processing robot in the return solution processing frame is used to move the wafer into the developing unit, or to move a wafer with photoresist coated on its surface to the wafer cassette module 100. In this embodiment, setting the developing unit and the liquid processing robot within the same liquid processing frame can reduce the time the robot spends moving between different liquid processing frames, speed up wafer processing, and thus improve overall production efficiency.

[0058] As shown in Figures 3 and 4, in some specific embodiments, the liquid handling robot within the return liquid handling frame includes a developing robot 16. The developing robot 16 is used to move the wafer from the interface SCPC9 (which has a cooling unit) in the interlayer module 300 to the developing unit SDC, from the developing unit SDC to the interface PSI19, and from the interface PSI20 to the interface PSI23. In some examples, the developing robot has developing units SDC symmetrically arranged on both sides. Specifically, the developing units SDC are configured to be symmetrical about the midline or the XZ plane.

[0059] In some embodiments, the actuators on the same process robot are all connected to the same control unit; the control unit is used to control the actuators on the process robot to prevent them from interfering with each other during movement. In this embodiment, by setting the control unit, the movement trajectory and time of the robot's actuators can be precisely controlled, avoiding collisions or interference between different actuators on the same robot, and reducing the risk of device damage.

[0060] In some specific embodiments, the liquid treatment control unit is configured as a first processor 213, and both the first liquid treatment actuator 211 and the second liquid treatment actuator 212 are electrically connected to the first processor 213. The heat treatment control unit is configured as a second processor 43, and both the first heat treatment actuator 41 and the second heat treatment actuator 42 are electrically connected to the second processor 43.

[0061] In other specific embodiments, the liquid treatment control unit and the heat treatment control unit can be integrated into a main control unit (not shown in the figure).

[0062] As shown in Figures 2 and 3, the second embodiment provides a coating and developing apparatus, including: a wafer cassette module 100, an interface module 500, and two coating and developing modules 6 as described in any of the above embodiments; the two coating and developing modules 6 are respectively configured as a liquid processing module 200 and a heat treatment module 400; the wafer cassette module 100 is connected to the liquid processing module 200; the wafer cassette module 100 is provided with an infeed loading port and a return loading port; the infeed loading port is used to store wafers to be moved to the liquid processing module; the return loading port is used to store wafers from the liquid processing module; the interface module 500 is connected to the heat treatment module 400; the interface module 500 is provided with a front washing unit and a back washing unit; the front washing unit is used to clean the front side of the wafer, and the back washing unit is used to clean the back side of the wafer. This embodiment, by setting the liquid processing module and the heat treatment module to work independently, helps to improve the accuracy and consistency of each process, ensuring that the wafer undergoes accurate processing steps. Optimizing the process and reducing the number of moves during wafer handling helps improve the reliability and stability of the entire system.

[0063] In some embodiments, the number of wafer-in liquid processing frames in the liquid processing module 200 is the same as the number of wafer-in heat processing frames in the heat processing module 400, and they are connected in a one-to-one correspondence; the number of wafer-out liquid processing frames in the liquid processing module 200 is the same as the number of wafer-out heat processing frames in the heat processing module 400, and they are connected in a one-to-one correspondence. This embodiment simplifies the robot's scheduling logic by setting the same number of wafer-in and wafer-out frames, which helps to more effectively arrange the wafer transfer sequence and reduce waiting time during wafer processing.

[0064] In some specific embodiments, the liquid treatment module 200 includes an infeed liquid treatment frame and a return liquid treatment frame. In some examples, the infeed liquid treatment frame is located on the top side of the return liquid treatment frame. In other examples, the infeed liquid treatment frame is located on the bottom side of the return liquid treatment frame. The heat treatment module 400 includes an infeed heat treatment frame and a return heat treatment frame. In still other examples, the infeed heat treatment frame is located on the top side of the return heat treatment frame. In yet another example, the infeed heat treatment frame is located on the bottom side of the return heat treatment frame.

[0065] In other specific embodiments, the wafer entry solution treatment frame and the wafer entry heat treatment frame are at the same horizontal level. The wafer return solution treatment frame and the wafer return heat treatment frame are at the same horizontal level.

[0066] In some embodiments, corresponding to the N-layer frames in the interlayer module, the wafer cassette module 100 is provided with a wafer loading robot, a wafer return robot, an inbound / outbound robot, F first branch interfaces, and NF second branch interfaces. The wafer return robot is used to move wafers on the branch interfaces to the wafer cassette return interface, and the wafer loading robot is used to move wafers on the wafer cassette loading interface to the branch interfaces. The inbound / outbound robot is used to move wafers on the loading port to the loading interface, or move wafers on the return interface to the return loading port. This embodiment, by setting the same number of branch interfaces as the liquid processing frame and the heat processing frame, ensures that each processing frame has a dedicated interface, allowing wafers to flow flexibly between various processing stages.

[0067] As shown in Figures 4 and 6, in some examples, the number of the first branch interface and the second branch interface are both 3. The number of the total wafer input interface and the total wafer return interface are both set to 1. The wafer on the total wafer input interface PSI1 is moved by the robot 2 to the three first branch interfaces SCPC1, SCPC2 and SCPC3, which are equipped with cooling units, and the wafers on the three second branch interfaces PSI21, PSI22 and PSI23 are moved by the robot 3 to the total wafer return interface PSI24.

[0068] In some examples, an adhesion enhancement unit (ADB) is also provided on one side of the wafer insertion interface (PSI1) to enhance the adhesion of the wafer surface, so that the coating adheres more firmly to the wafer surface. The robotic arm 2 is also used to move the wafer from the wafer insertion interface (PSI1) to the adhesion enhancement unit (ADB).

[0069] In other examples, the wafer cassette module 100 is equipped with an inbound / outbound robot 1 for moving wafers on the first loading interface LP1 to the wafer feed interface PSI1 and moving wafers on the wafer return interface PSI24 to the second loading interface LP2.

[0070] In some embodiments, the interface module 500 further includes a front-washing robot and a back-washing robot; the front-washing robot is used to move the wafer from the lithography machine to the front-washing unit; the back-washing robot is used to feed the wafer that has been back-washed into the lithography machine.

[0071] In some embodiments, corresponding to the N-layer frame, the interface module 500 is provided with an interface robot and N branch interfaces; the interface robot is used to move the wafers on the N branch interfaces to the back washing unit, or to move the wafers in the front washing unit to the N branch interfaces.

[0072] In some examples, N is 6, and the branch interfaces within the interface module 500 are set to interfaces PSI8, PSI9, PSI10, PSI12, PSI13, and PSI14.

[0073] As shown in Figures 5 and 7, in some specific embodiments, the back-washing robot 31 is used to move the wafers on the branch interfaces PSI8, PSI9, and PSI10 to the back-washing unit BS. The forward-washing robot 32 is used to move the wafers on the forward-washing unit PIS to the branch interfaces PSI12, PSI13, and PSI14, respectively.

[0074] In other embodiments, as shown in Figures 7 and 8, interfaces PSI1, PSI21-PSI24, and SCPC1-SCPC3 in the chip cartridge module 100 are integrated into the chip cartridge cooling tower T1. Interfaces PSI8-PSI14 and interface cooling units CPC in the interface module 500 are integrated into the interface cooling tower T3.

[0075] In some embodiments, the interface module further includes a temporary storage unit, an interface cooling unit, and a photolithography output interface; the temporary storage unit is used to store wafers that have undergone back-side cleaning; the interface cooling unit is used to cool wafers that have undergone back-side cleaning; and the photolithography output interface is used to store wafers that have undergone photolithography.

[0076] In other embodiments, corresponding to the N-layer framework, the interface module is provided with a backwashing robot, an interface robot, a forward washing robot, F third branch interfaces, and NF fourth branch interfaces; the backwashing robot is used to move the wafer from the branch interface to the backwashing unit, and to move the wafer from the backwashing unit to the temporary storage unit; the forward washing robot is used to move the wafer from the temporary storage unit to the interface cooling unit, to move the wafer from the lithography output interface to the forward washing unit, and to move the wafer from the forward washing unit to the branch interface; the interface robot is used to feed the wafer in the temporary storage unit into the lithography machine, and to feed the wafer from the lithography machine to the lithography output interface.

[0077] In some specific embodiments, the backwashing robot 31 is also used to move the backwashed wafers from the backwashing unit BS to the temporary storage unit BF. In some examples, the temporary storage unit BF is configured as a 25-layer wafer storage rack.

[0078] In other specific embodiments, the forward washing robot 32 is also used to move the wafer on the temporary storage unit BF to the interface cooling unit CPC, and to move the wafer on the interface PSI11 to the forward washing unit PIS.

[0079] In some other specific embodiments, the interface module 500 further includes an interface robot 33, used to feed the wafer on the interface cooling unit CPC into the lithography machine SCAN, and to move the wafer output from the lithography machine SCAN to the interface PSI11.

[0080] In some embodiments, the wafer cassette module 100 includes a wafer cassette cold tray tower, a wafer infeed interface, and a wafer return interface; the interface module 500 includes an interface cold tray tower; corresponding to the N-layer liquid treatment frame in the liquid treatment module 200, the wafer cassette cold tray tower has N branch interfaces, where N is a positive integer greater than 1; corresponding to the N-layer heat treatment frame in the heat treatment module 400, the interface cold tray tower has N branch interfaces.

[0081] As shown in Figures 3, 8, and 9, in some examples, an adhesion enhancement unit (ADB) is also provided on one side of the wafer interface PSI1 to enhance the adhesion of the wafer surface, so that the coating adheres more firmly to the wafer surface. The robotic arm 2 is also used to move the wafer from the wafer interface PSI1 to the adhesion enhancement unit ADB.

[0082] In other examples, the wafer cassette module 100 is equipped with an inbound / outbound robot 1 for moving wafers on the first loading interface LP1 to the wafer feed interface PSI1 and moving wafers on the wafer return interface PSI24 to the second loading interface LP2.

[0083] In some specific embodiments, the liquid treatment module 200 is located in the X direction of the plate cold plate tower T1, the heat treatment module 400 is located in the X direction of the liquid treatment module 200, and the interface cold plate tower T3 is located in the X direction of the treatment module.

[0084] As shown in Figures 8, 9, and 10, in some embodiments, the interlayer module 300 includes an interlayer cold plate tower T2, which has N interlayer frames. The interlayer cold plate tower T2 is located in the X direction of the liquid treatment module 200, and the heat treatment module 400 is located in the X direction of the interlayer cold plate tower T2. Each interlayer frame has an interface. In some examples, the bottom interlayer frame has interfaces PSI2, PSI3, and SCPC4. The top interlayer frame has interfaces PSI19, PSI20, and SCPC9.

[0085] While embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of the invention as described in the claims. Furthermore, the invention described herein may have other embodiments and can be implemented or carried out in various ways.

[0086] 100: Disc Cartridge Module 200: Liquid treatment module 300: Interlayer Module 400: Heat treatment module 500: Interface Module 211: Liquid treatment first actuator 212: Liquid treatment second actuator 213: First Processor 1, 2, 3: Robotic Arm 11: Coating Robot 26: Baking Robot 31: Backwashing Robotic Arm 32: Forward washing robotic arm 33: Interface Robot Arm 41: Heat treatment first actuator 42: Second actuator for heat treatment 43: Second Processor 6: Coating and developing module 601: First process unit 602: Second process unit 61: Process Components 62: Process Robot ADB: Thickening Unit BHTB: Anti-reflective baking unit BS: Back Wash Unit BF: Temporary storage unit COT: Coating Components CPC: Interface Cooling Unit DLTB: Hard Baking Unit HAEB: Post-exposure baking unit LP1: First loading interface LP2: Second Loading Interface PIS: Forward Washing Unit SCAN: Lithography machine SCR: Coating Unit SCB: Anti-reflective unit SDC: Developing Unit T1: Plate Box Cold Tray Tower T2: Interlayer Cold Tray Tower T3: Interface Cold Plate Tower WES: Edge Exposure Unit

Claims

1. A coating and developing module, comprising: Process components, comprising multiple process units for heat treatment or liquid processing of wafers; A process robot arm, equipped with multiple independently moving actuators, is used to pick up and move wafers. The process units are symmetrically arranged on opposite sides of the process robot arm about a center line. The process robot arm is used to move wafers into or out of the process unit on either side. The process robot arm is configured to rotate about its rotation axis so that the actuators face the process unit on one side. The plurality of actuators include a first actuator and a second actuator with the same orientation, used at different times to remove processed wafers from the process unit they face, or to feed wafers to be processed into the process unit they face. Each of the process components also includes multiple layered process frames stacked along the height direction. The plurality of process robots are correspondingly arranged in the plurality of layered process frames. The actuators on the same process robot arm are configured to move asynchronously. Wherein, when the coating and developing module is used in a liquid processing process, the process component is a liquid processing component, and the process robot is a liquid processing robot; and wherein, when the coating and developing module is used in a heat treatment process, the process component is a heat treatment component, and the process robot is a heat treatment robot; wherein, when the process frame in the coating and developing module is used in a liquid processing process, it includes at least one infeed liquid treatment frame and at least one return liquid treatment frame; when the process frame in the coating and developing module is used in a heat treatment process, it includes at least one infeed heat treatment frame and at least one return heat treatment frame.

2. The coating and developing module according to claim 1, wherein, The wafer loading liquid treatment frame is equipped with a photoresist coating unit; the photoresist coating unit is used to coat the wafer surface with photoresist; and the liquid treatment robot in the wafer loading liquid treatment frame is used to move the wafer into the photoresist coating unit, or to move the wafer with photoresist coating on its surface to the wafer loading heat treatment frame.

3. The coating and developing module according to claim 1, wherein, The wafer loading heat treatment frame is equipped with a soft baking unit; the soft baking unit is used to remove residual solvent from the photoresist on the wafer surface; and the heat treatment robot in the wafer loading heat treatment frame is used to move the wafer into the soft baking unit, or to move the wafer with the residual solvent removed to the photolithography machine.

4. The coating and developing module according to claim 1, wherein, The wafer return heat treatment frame is equipped with a hard baking unit; the hard baking unit is used to cure the coating on the wafer surface; and the heat treatment robot in the wafer return heat treatment frame is used to move the wafer into the hard baking unit, or to move the wafer with the surface coating already cured to the wafer return liquid treatment frame.

5. The coating and developing module according to claim 1, wherein, The return solution processing frame includes a developing unit; the developing unit is used to apply developing solution to the wafer surface; and the liquid processing robot in the return solution processing frame is used to move the wafer into the developing unit, or to move the wafer with photoresist coated on its surface to the wafer cassette module.

6. The coating and developing module according to claim 1, wherein, The actuators on the same process robot are all connected to the same control unit; the control unit is used to ensure that the actuators on the process robot do not interfere with each other during movement.

7. A coating and developing apparatus, comprising: Interlayer module, cartridge module, interface module, and two coating and developing modules as described in claim 1; Two of the coating and developing modules are respectively configured as a liquid processing module and a heat treatment module; the wafer cassette module is connected to the liquid processing module; the wafer cassette module has an infeed loading port and a return loading port; the infeed loading port is used to store wafers to be moved to the liquid processing module; the return loading port is used to store wafers from the liquid processing module; the interface module is connected to the heat treatment module; the interface module has a front washing unit and a back washing unit; the front washing unit is used to clean the front side of the wafer, and the back washing unit is used to clean the back side of the wafer; the interlayer module is located between the liquid processing module and the heat treatment module and is used to store wafers; the liquid processing module, the heat treatment module, and the interlayer module all include adjacent N-layer frames, where N is a positive integer greater than 1; the N-layer frames of the liquid processing module and the N-layer frames of the interlayer module are connected in a one-to-one correspondence; the N-layer frames of the interlayer module and the N-layer frames of the liquid processing module are connected in a one-to-one correspondence. The interlayer module also includes multiple interfaces, some of which are equipped with cooling units.

8. The apparatus according to claim 7, wherein, The number of wafer entry liquid treatment frames in the liquid treatment module is the same as the number of wafer entry heat treatment frames in the heat treatment module, and they are connected in a one-to-one correspondence; the number of wafer return liquid treatment frames in the liquid treatment module is the same as the number of wafer return heat treatment frames in the heat treatment module, and they are connected in a one-to-one correspondence.

9. The apparatus according to claim 7, wherein, The wafer cassette module includes a wafer cassette cold tray tower, a wafer infeed interface, and a wafer return interface; the interface module includes an interface cold tray tower; corresponding to the N-layer liquid treatment frame in the liquid treatment module, the wafer cassette cold tray tower has N branch interfaces, where N is a positive integer greater than 1; corresponding to the N-layer heat treatment frame in the heat treatment module, the interface cold tray tower has N branch interfaces.

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