Resin composition

Abstract

This invention provides a resin composition. The resin composition includes an epoxy resin (A), a curing agent (B), a colorant (C), a modifier (D), an accelerator (E), and a filler (F). The curing agent (B) comprises a compound having a cyanate ester group.

Description

Technical Field

[0001] This invention relates to a resin composition. Prior Technology

[0002] With the increasing demand for high-performance, small electronic devices, the requirements for high-performance insulating materials used in semiconductor packaging are also increasing. Currently, most common insulating layers are formed by curing resin compositions. However, when this insulating layer is applied to sealing components, its low dielectric loss factor often leads to problems such as dimensional expansion and warping, thus affecting the performance of electronic products made using it. Summary of the Invention

[0003] The present invention provides a resin composition that has good heat resistance and dielectric properties.

[0004] One resin composition of the present invention includes an epoxy resin (A), a curing agent (B), a colorant (C), a modifier (D), an accelerator (E), and a filler (F). The curing agent (B) comprises a compound having a cyanate ester group.

[0005] In one embodiment of the present invention, the cyanate ester equivalent of the above-mentioned compound having a cyanate ester group is from 100 g / eq to 250 g / eq.

[0006] In one embodiment of the present invention, the above-mentioned compounds having cyanate groups include alkyl groups having 1 to 3 carbon atoms, alkenyl groups having 2 to 4 carbon atoms, alkyl groups having 1 to 3 carbon atoms, aryl groups having 6 to 10 carbon atoms, or combinations thereof.

[0007] In one embodiment of the present invention, the above-mentioned compound having a cyanate group includes a compound represented by the following formula (B-1). Equation (B-1)

[0008] In one embodiment of the present invention, the weight average molecular weight of the epoxy resin (A) is 200 g / mole to 600 g / mole.

[0009] In one embodiment of the present invention, the epoxy equivalent of the epoxy resin (A) is from 100 g / eq to 300 g / eq.

[0010] In one embodiment of the present invention, the epoxy resin (A) comprises an epoxy group, an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 20 carbon atoms, an ether group, or a combination thereof.

[0011] In one embodiment of the present invention, based on the total amount of non-volatile components used in the above-mentioned resin composition being 100 parts by weight, the amount of epoxy resin (A) being used is 5 to 10 parts by weight, and / or the amount of hardener (B) being used is 4 to 9 parts by weight.

[0012] In one embodiment of the present invention, the colorant (C) includes carbon black, phthalocyanine blue, crystal violet, naphthalene black, or a combination thereof.

[0013] In one embodiment of the present invention, the modifier (D) includes a rubber modifier, a silicone modifier, a coupling agent, a flexible epoxy modifier, or a combination thereof.

[0014] In one embodiment of the present invention, the aforementioned accelerator (E) includes pyridine compounds, imidazole compounds, amine compounds, peroxides, or combinations thereof.

[0015] In one embodiment of the present invention, in the above-mentioned resin composition, the content of colorant (C) is 1 phr to 3 phr, the content of modifier (D) is 1 phr to 5 phr, and / or the content of accelerator (E) is 0.01 phr to 2 phr.

[0016] In one embodiment of the present invention, the filler material (F) includes silicon dioxide, titanium dioxide, boron nitride, aluminum nitride, silicon carbide, or a combination thereof.

[0017] In one embodiment of the present invention, the total amount of non-volatile components used in the above-mentioned resin composition is 100 parts by weight, and the amount of filler material (F) used is 75 parts by weight or more.

[0018] In one embodiment of the present invention, the average particle size of the filler material (F) is 0.1 micrometers to 10 micrometers.

[0019] Based on the above, the resin composition of the present invention includes epoxy resin (A), a curing agent (B), a colorant (C), a modifier (D), an accelerator (E), and a filler (F), wherein the curing agent (B) comprises a compound having a cyanate ester group. This allows the resin composition to possess good heat resistance and dielectric properties.

[0020] To make the above features and advantages of the present invention more apparent and understandable, specific embodiments are described in detail below. Simple Explanation of the Diagram

[0021] none. Implementation

[0022] The following are embodiments that describe the contents of this invention in detail. The implementation details presented in the embodiments are for illustrative purposes only and are not intended to limit the scope of protection of this invention. Anyone skilled in the art can modify or change these implementation details according to the needs of actual implementation.

[0023] A range may be expressed herein as from “about” a specific value to “about” another specific value, or it may be directly expressed as a specific value and / or to another specific value. In expressing the range, another embodiment includes from that specific value and / or to another specific value. Similarly, when a value is expressed as an approximation by using the antecedent “about,” it will be understood that the specific value forms another embodiment. It will be further understood that each endpoint of a range may be obviously related to or unrelated to another endpoint.

[0024] In this document, non-limiting terms (such as: may, can, for example, or other similar terms) are non-essential or optional implementations, inclusions, additions, or existences.

[0025] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will also be understood that terms (such as those defined in commonly used dictionaries) shall be interpreted as having the same meaning as in the relevant technical context and shall not be interpreted in an idealized or overly formal sense, unless expressly defined herein.

[0026] In this paper, a "monovalent organic group" is an organic group with one bonding position, and a "monovalent organic group" can form one chemical bond through this one bonding position. A "divalent organic group" is an organic group with two bonding positions, and a "divalent organic group" can form two chemical bonds through these two bonding positions.

[0027] This invention provides a resin composition comprising an epoxy resin (A), a curing agent (B), a colorant (C), a modifier (D), an accelerator (E), and a filler (F). Furthermore, the resin composition of this invention may further include other suitable additives as needed. The various components described above will be described in detail below.

[0028] Epoxy resin [A] [)]

[0029] There are no particular limitations on the epoxy resin (A), and a suitable epoxy resin can be selected according to requirements. In this embodiment, epoxy resin (A) may include epoxy groups, alkyl groups having 1 to 6 carbon atoms (e.g., methylene, ethyl, propyl, or butyl), aryl groups having 6 to 20 carbon atoms (e.g., phenyl, naphthyl, diphenyl, naphthyl, or anthracene), ether groups, or combinations thereof. For example, epoxy resin (A) may include at least one of the compounds represented by formulas (A-1) to (A-3) below, preferably a compound represented by formula (A-2). Epoxy resin (A) may be used alone or in combination.

[0030] Equation (A-1)

[0031] Equation (A-2)

[0032] Equation (A-3)

[0033] Specific examples of commercially available epoxy resins (A) may include HP-6000 (trade name; epoxy equivalent of about 250 g / eq, weight average molecular weight (Mw) of about 477 g / mole) or HP-4032D (trade name; epoxy equivalent of about 140 g / eq, weight average molecular weight of about 273 g / mole) manufactured by DIC Corporation; NPPN-260 (trade name; epoxy equivalent of about 200 g / eq, weight average molecular weight of about 369 g / mole) manufactured by Nan Ya Plastics Industrial Co., Ltd.; or other suitable epoxy resins.

[0034] The weight average molecular weight of epoxy resin (A) can be from about 200 g / mol to about 600 g / mol, more preferably from about 250 g / mol to about 500 g / mol. The epoxy equivalent of epoxy resin (A) can be from about 100 g / eq to about 300 g / eq, more preferably from about 130 g / eq to about 260 g / eq.

[0035] Based on a total amount of 100 parts by weight of non-volatile components in the resin composition, the amount of epoxy resin (A) used can be from about 5 parts by weight to about 10 parts by weight, preferably from about 6 parts by weight to about 8 parts by weight. For example, the non-volatile components in the resin composition may include epoxy resin (A), curing agent (B), colorant (C), modifier (D), accelerator (E), and filler (F). Based on a total amount of 100 parts by weight of epoxy resin (A) and curing agent (B) in the resin composition, the amount of epoxy resin (A) used can be from about 40 parts by weight to about 65 parts by weight, preferably from about 50 parts by weight to about 60 parts by weight. [ ]

[0036] [hardener()] [B] [)]

[0037] The curing agent (B) includes compounds having a cyanate ester group or other suitable curing agents. The cyanate ester group may be NCO-*, where * indicates the bond position. For example, the curing agent (B) may further include compounds having at least one selected from hydroxyl, amino, ester, naphthyl, phenyl, and phenolic groups. The aforementioned amino, ester, naphthyl, phenyl, and phenolic groups may be monovalent or divalent organic groups. The curing agent (B) may be used alone or in combination.

[0038] In this embodiment, the cyanate ester equivalent of the compound having a cyanate ester group can be from about 100 g / eq to about 250 g / eq, preferably from about 150 g / eq to about 200 g / eq. In addition to the cyanate ester group, the compound having a cyanate ester group may also include alkyl groups having 1 to 3 carbon atoms (e.g., methyl, isopropyl, ethyl, or n-propyl), alkenyl groups having 2 to 4 carbon atoms (e.g., vinyl, propenyl, allyl, methylallyl, or butenyl), alkyl groups having 1 to 3 carbon atoms (e.g., methylene or ethyl), aryl groups having 6 to 10 carbon atoms (e.g., phenyl, tolyl, or xylyl), combinations thereof, or other suitable groups. The compound having a cyanate ester group may include compounds represented by the following formula (B-1). Specific examples of commercially available compounds having cyanate groups may include CL-100 (trade name; cyanate equivalent of about 179 g / eq, weight average molecular weight (Mw) of about 358 g / mol) manufactured by Arxada Corporation, or other suitable compounds having cyanate groups.

[0039] Equation (B-1)

[0040] The curing agent (B) may further comprise a compound / polymer having a phenolic group, wherein the phenolic equivalent may be from about 80 g / eq to about 300 g / eq, preferably from about 100 g / eq to about 250 g / eq. The compound / polymer having a phenolic group may further comprise a triazine group (e.g., a monovalent triazine group bonded to the end of the compound / polymer, and / or a polyvalent triazine group bonded to the middle of the compound / polymer structure (e.g., a divalent triazine group, a trivalent triazine group, etc.)), an amino group, a naphthyl group (e.g., a monovalent naphthyl group bonded to the end of the compound / polymer, and / or a polyvalent naphthyl group bonded to the middle of the compound / polymer structure (e.g., a divalent naphthyl group, a trivalent naphthyl group, etc.)) or a combination thereof. Specific examples of commercially available compounds / polymers containing phenolic groups may include LA-7054 (trade name; phenolic equivalent of about 125 g / eq, weight average molecular weight of about 1729 g / mole) manufactured by DIC Corporation, DFE-317 (trade name; phenolic equivalent of about 221 g / eq, weight average molecular weight of about 1280 g / mole) manufactured by Sichuan Dongcai Technology Group Co., Ltd., or other suitable compounds / polymers containing phenolic groups.

[0041] The curing agent (B) may further comprise a compound / polymer having an ester group, the ester equivalent of which may be from about 100 g / eq to about 500 g / eq, preferably from about 200 g / eq to about 300 g / eq. The compound / polymer having an ester group may further comprise a naphthyl group (e.g., a monovalent naphthyl group bonded to the end of the compound / polymer, and / or a polyvalent naphthyl group bonded to the middle of the compound / polymer structure (e.g., a divalent naphthyl group, a trivalent naphthyl group, etc.)). Specific examples of commercially available compounds / polymers having an ester group may include HPC-8150 (trade name; ester equivalent of about 234 g / eq, weight average molecular weight of about 2705 g / mole) manufactured by DIC Corporation, or other suitable compounds / polymers having an ester group.

[0042] Based on a total amount of 100 parts by weight of non-volatile components in the resin composition, the amount of curing agent (B) can be from about 4 parts by weight to about 9 parts by weight, preferably from about 5 parts by weight to about 8 parts by weight. Based on a total amount of 100 parts by weight of epoxy resin (A) and curing agent (B) in the resin composition, the amount of curing agent (B) can be from about 35 parts by weight to about 60 parts by weight, preferably from about 40 parts by weight to about 55 parts by weight. [ ]

[0043] [Coloring agent()] [C] [)]

[0044] There are no particular limitations on the colorant (C), and an appropriate colorant can be selected according to requirements. In this embodiment, the colorant (C) may include carbon black, phthalocyanine blue, crystal violet, naphthalene black, combinations thereof, or other suitable colorants, preferably carbon black. The colorant (C) may be used alone or in combination.

[0045] Specific examples of commercially available carbon black products may include NO-KAB189 (trade name; a solvent-based nano carbon black paste) manufactured by Taiwan Nanotechnology Co., Ltd.; MA-100 (trade name; a nano carbon black) manufactured by Mitsubishi Chemical Co., Ltd.; or other suitable carbon blacks.

[0046] In the resin composition, the content of colorant (C) can be from about 1 phr to about 3 phr, preferably from about 1.5 phr to about 2.5 phr. Based on the total amount of epoxy resin (A), hardener (B) and filler (F) in the resin composition being 100 parts by weight, the amount of colorant (C) can be from about 0.10 parts by weight to about 0.40 parts by weight, preferably from about 0.25 parts by weight to about 0.30 parts by weight. [ ]

[0047] [Modifier()] [D] [)]

[0048] There are no particular limitations on the modifier (D), and an appropriate modifier can be selected according to requirements. In this embodiment, the modifier (D) includes rubber modifiers, silicone modifiers, coupling agents, flexible epoxy modifiers, combinations thereof, or other suitable modifiers, preferably silicone modifiers, rubber modifiers, or combinations thereof. Modifier (D) can be used alone or in combination.

[0049] Specific examples of commercially available modifiers (D) may include KF-8012 (trade name) manufactured by Shin-Etsu Chemical Co., Ltd.; BY-16-853U (trade name) manufactured by Dow Corning Toray Co., Ltd.; or other suitable modifiers.

[0050] In the resin composition, the content of modifier (D) can be from about 1 phr to about 5 phr, preferably from about 2.5 phr to about 3.5 phr. Based on the total amount of epoxy resin (A), hardener (B) and filler (F) in the resin composition being 100 parts by weight, the amount of modifier (D) can be from about 0.10 parts by weight to about 0.60 parts by weight, preferably from about 0.40 parts by weight to about 0.50 parts by weight.

[0051] [Accelerator()] [E] [)]

[0052] There are no particular limitations on the accelerator (E), and an appropriate accelerator can be selected according to requirements. In this embodiment, the accelerator (E) may include pyridine compounds, imidazole compounds, amine compounds, peroxides, combinations thereof, or other suitable accelerators, preferably pyridine compounds. The accelerator (E) may be used alone or in combination.

[0053] For example, pyridine compounds may include 4-dimethylaminopyridine (DMAP) or other suitable pyridine compounds. Imidazole compounds may include 1-cyanoethyl-2-phenylimidazolium (trade name 2PZ-CN, manufactured by Shikoku Chemical Industry Co., Ltd.), 2-phenyl-4,5-dihydroxymethylimidazolium (trade name 2PHZ-PW, manufactured by Shikoku Chemical Industry Co., Ltd.), 2-phenyl-4-methyl-5-hydroxymethylimidazolium (trade name 2P4MHZ-PW, manufactured by Shikoku Chemical Industry Co., Ltd.), 2-ethyl-4-methylimidazolium (trade name 2E4MZ, manufactured by Shikoku Chemical Industry Co., Ltd.), or other suitable imidazolium compounds. The accelerator (E) is preferably 4-dimethylaminopyridine, 2-ethyl-4-methylimidazolium, or a combination thereof.

[0054] In the resin composition, the content of accelerator (E) can be from about 0.01 phr to about 2 phr, preferably from about 0.5 phr to about 1.5 phr. Based on the total amount of epoxy resin (A), hardener (B) and filler (E) in the resin composition being 100 parts by weight, the amount of accelerator (E) can be from about 0.01 parts by weight to about 0.8 parts by weight, preferably from about 0.3 parts by weight to about 0.5 parts by weight.

[0055] [Fill Material()] [F] [)]

[0056] There are no particular limitations on the filler material (F), and appropriate filler materials can be selected according to requirements. For example, filler material (F) may include organic filler materials, inorganic filler materials, or combinations thereof, preferably inorganic filler materials. In this embodiment, filler material (F) may include silicon dioxide, titanium dioxide, boron nitride, aluminum nitride, silicon carbide, combinations thereof, or other suitable filler materials. Filler material (F) may include surface-modified silicon dioxide, surface-blackened silicon dioxide, or other suitable filler materials. Surface-modified silicon dioxide may include vinyl-modified silicon dioxide or aniline-modified silicon dioxide. Filler material (F) may be used alone or in combination.

[0057] There are no particular restrictions on the shape of the filler material (F), and an appropriate shape can be selected according to requirements. For example, the filler material (F) can be spherical or other suitable shapes. Spherical silicon dioxide can be prepared by synthesis. The particle size (e.g., median particle size (D50)) of the filler material (F) can be from about 0.1 micrometers to about 10 micrometers, preferably from about 0.3 micrometers to about 4.0 micrometers, and more preferably from about 2.0 micrometers to about 4.0 micrometers. The maximum particle size (D100) of the filler material (F) can be from about 5.0 micrometers to about 15.0 micrometers, preferably from about 6.0 micrometers to about 8.0 micrometers.

[0058] Specific examples of commercially available inorganic filler materials may include SC2300-SVJ (trade name: spherical silica synthesized by liquid phase with vinyl surface modification, D50 of about 0.5 micrometers) manufactured by ADMATECHS Co., Ltd.; EQH1003-SKS (trade name: spherical silica synthesized by liquid phase with aniline surface modification, D50 of about 0.86 micrometers, D100 of about 3.52 micrometers) manufactured by Zhejiang Sanshiji Technology Co., Ltd.; or other suitable inorganic filler materials.

[0059] Based on a total usage of 100 parts by weight of non-volatile components in the resin composition, the amount of filler (F) used may be about 75 parts by weight or more, preferably about 80 parts by weight or about 90 parts by weight. Based on a total usage of 100 parts by weight of epoxy resin (A), hardener (B), and filler (F) in the resin composition, the amount of filler (F) used may be about 75 parts by weight or more, preferably about 80 parts by weight or about 90 parts by weight. Based on a total usage of 100 parts by weight of epoxy resin (A) and hardener (B) in the resin composition, the amount of filler (F) used may be about 300 parts by weight or more, preferably about 500 parts by weight or about 700 parts by weight.

[0060] [Preparation method of resin composition]

[0061] There are no particular limitations on the preparation method of the resin composition. For example, the components of the resin composition are placed in a stirrer and stirred until they are uniformly mixed into a solution. A solvent may be added if necessary. After mixing evenly, the resin composition is obtained.

[0062] It should be noted that the resin composition of the present invention can be processed into prepregs and metal-clad laminates (e.g., copper clad laminates, CCLs) according to actual design requirements. Therefore, the prepregs and metal-clad laminates made using the resin composition of the present invention also have good heat resistance and dielectric properties, and thus good applicability. More specifically, the dielectric constant of the prepregs and metal-clad laminates made from the resin composition can be about 3.0 or less (e.g., about 2.2 to about 2.7), the dielectric loss factor can be about 0.004 or less (e.g., about 0.0031 to about 0.0038), and can have a coefficient of thermal expansion of about 10 ppm / ℃ or less (e.g., about 6.6 ppm / ℃ to about 9.8 ppm / ℃) and a glass transition temperature of about 150℃ or more (e.g., about 155℃ to about 166℃).

[0063] The invention will be described in detail below with reference to examples. The following examples are provided to illustrate the invention, and the scope of the invention includes the scope described in the following claims, as well as their substitutions and modifications, but is not limited to the scope of the examples.

[0064] [Examples of Resin Compositions]

[0065] Examples 1 to 8 and Comparative Examples 1 to 4 of the resin composition are described below:

[0066] [Example] [1] [To the Example] [8] [And comparative examples] [1] [To the comparative example] [4]

[0067] Based on the contents of Table 1, the components of the resin composition for each experimental example were mixed with a mixed solution of toluene and methyl ethyl ketone (weight ratio 1:1) to form a varnish. The varnish was then applied to a substrate (e.g., PET film) using a die coater at 25°C and allowed to dry to form a resin film. Next, the resin film was heated at 140°C for 120 minutes to obtain a cured film with a thickness of approximately 45 micrometers. The obtained cured films were evaluated using the following methods, and the results are shown in Table 1.

[0068] [Table 1] Ingredients (Unit: parts by weight) Example 1 2 3 4 5 6 7 8 Epoxy resin (A) HP-6000 4.3 5.6 8.3 6.9 -- -- -- -- HP-4032D 10.2 9.8 18.6 15.5 20.6 20.6 15.7 15.4 NPPN-260 27.6 26.7 33.4 27.8 43.9 43.9 33.8 33.0 Hardener (B) LA-7054 3.2 -- -- -- -- -- -- -- HPC-8150 19.6 21.9 -- -- -- -- -- -- DFE-317 -- 8.4 -- -- -- -- -- 12.2 DA-BPF -- -- -- -- -- -- -- -- CL-100 35.1 27.6 39.7 49.8 35.5 35.5 50.5 39.4 Colorant (C) NO-KAB189 -- -- -- -- -- 1.8 phr 1.8 phr 1.8 phr MA-100 2.0 phr 2.0 phr 2.0 phr 2.0 phr 2.0 phr -- -- -- Modifier (D) KF-8012 3.0 phr 3.0 phr 3.0 phr 3.0 phr 3.0 phr -- -- -- Accelerator (E) DMAP 1.0 phr 1.0 phr 1.0 phr 1.0 phr 1.0 phr 1.0 phr 1.0 phr 1.0 phr Filler material (E) SC2300-SVJ 12.90% -- -- -- 12.90% -- 12.90% -- EQH1003-SKS 73.10% 86.00% 86.00% 86.00% 73.10% 86.00% 73.10% 86.00% evaluate result Electrical (10GHz) Dk 2.2 2.3 2.4 2.2 2.7 2.7 2.6 2.6 Df 0.0037 0.0034 0.0036 0.0037 0.0038 0.0031 0.0035 0.0037 CTE (ppm / ℃) TMA 8.3 9.6 8.7 6.6 9.6 9.8 7.5 9.1 Tg (°C) TMA 160.8 160.0 161.6 155.2 160.2 165.8 159.4 162.4

[0069] [Table 1] Ingredients (Unit: parts by weight) Comparative example 1 2 3 4 Epoxy resin (A) HP-6000 6.5 6.0 -- -- HP-4032D 10.8 10.1 14.9 17.2 NPPN-260 31.0 28.9 31.9 36.7 Hardener (B) LA-7054 9.7 -- 10.0 -- HPC-8150 42.0 39.1 43.2 -- DFE-317 -- 15.9 -- -- DA-BPF -- -- -- 46.1 CL-100 -- -- -- -- Colorant (C) NO-KAB189 -- -- -- 1.8 phr MA-100 2.0 phr 2.0 phr 2.0 phr -- Modifier (D) KF-8012 3.0 phr 3.0 phr 3.0 phr -- Accelerator (E) DMAP 1.0 phr 1.0 phr 1.0 phr 1.0 phr Filler material (E) SC2300-SVJ -- -- 12.90% 12.90% EQH1003-SKS 86.00% 86.00% 73.10% 73.10% evaluate result Electrical (10GHz) Dk 3.9 3.6 3.7 3.9 Df 0.0045 0.0040 0.0046 0.0041 CTE (ppm / ℃) TMA 12.5 14.1 12.5 11.4 Tg (°C) TMA 145.9 140.1 146.4 150.9 HP-6000: Product name, manufactured by DIC Corporation. It has a structure represented by formula (A-1). HP-4032D: Product name, manufactured by DIC Corporation. It has a structure represented by formula (A-2). NPPN-260: Product name, manufactured by Nan Ya Plastics Industrial Co., Ltd. It has a structure represented by formula (A-3). LA-7054: Product name, manufactured by DIC Corporation. It may include structural units represented by the following formula (B-2). In formula (B-2), * indicates a bond location. Equation (B-2) HPC-8150: Product name, manufactured by DIC Corporation. DFE-317: Product name, manufactured by Sichuan Dongcai Technology Group Co., Ltd. DA-BPF: Trade name, manufactured by Yokkaichi Synthetic Co., Ltd. The phenolic equivalent is approximately 125 g / eq, and the weight-average molecular weight is approximately 280 g / mol. It has a structure represented by the following formula (B-3). Equation (B-3) CL-100: Product name, manufactured by Arxada Corporation. It has a structure represented by formula (B-1). NO-KAB189: Product name, manufactured by Taiwan Nanotechnology Co., Ltd. MA-100: Product name, manufactured by Mitsubishi Chemical Corporation. KF-8012: Product name, manufactured by Shin-Etsu Chemical Industry Co., Ltd. DMAP: 4-Dimethylaminopyridine. SC2300-SVJ: Product name, manufactured by Aduma Technology Co., Ltd. EQH1003-SKS: Product name, manufactured by Zhejiang Sanshiji Technology Co., Ltd. [<] [Evaluation Method] [>] [a.] [Dielectric constant ()] [dielectric constant] [,] [Dk] [)]

[0070] The dielectric constant (Dk) of the prepared hardened film was measured at a frequency of 10 GHz using a dielectric analyzer (model E4991A, manufactured by Agilent Technologies). The smaller the dielectric constant, the better the dielectric properties of the resin composition. [b.] [Dielectric loss factor ()] [dissipation factor] [,] [Df] [)]

[0071] The dielectric loss factor (Df) of the prepared hardened film was measured at a frequency of 10 GHz using a dielectric analyzer (model E4991A, manufactured by Agilent Technologies). The smaller the dielectric loss factor, the better the dielectric properties of the resin composition. [c.] Coefficient of thermal expansion () [coefficient of thermal expansion] [,] [CTE] [)]

[0072] The coefficient of thermal expansion (CTE) of the prepared hardened film was measured using a thermomechanical analyzer (model TA Q400, manufactured by TA Instruments). The smaller the CTE, the better the resin composition's ability to resist phase changes, i.e., good heat resistance. Heating rate: 20℃ / min Temperature range: 20℃~260℃ [d.] Glass transfer temperature () [glass transition temperature] [,] [Tg] [)]

[0073] The glass transition temperature (Tg) of the prepared hardened film was measured using a thermomechanical analyzer (model DMA 850, manufactured by TA Instruments). A higher Tg indicates that the resin composition has good resistance to phase changes, i.e., good heat resistance. Heating rate: 20℃ / min Temperature range: 20℃~350℃ (heating, cooling, heating) [<] [Evaluation Results] [>]

[0074] As shown in Table 1, when the resin composition includes a curing agent (B), and the curing agent (B) includes a compound having a cyanate ester group (Examples 1 to 8), the hardened film formed by the resin composition has both good heat resistance and dielectric properties.

[0075] Furthermore, compared to resin compositions containing curing agents (B) that do not contain compounds having cyanate groups (Comparative Examples 1 to 4), resin compositions containing curing agents (B) that contain compounds having cyanate groups (Examples 1 to 8) have a smaller dielectric constant, a smaller dielectric loss factor, a smaller coefficient of thermal expansion, and a higher glass transition temperature, i.e., better dielectric properties and heat resistance.

[0076] In summary, the resin composition of the present invention includes epoxy resin (A), curing agent (B), colorant (C), modifier (D), accelerator (E), and filler (F), and the curing agent (B) includes a compound having a cyanate ester group, so that the cured film made from the resin composition can have good heat resistance and dielectric properties, and thus have good applicability.

[0077] Although the present invention has been disclosed above by way of embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

[0078] none.

Claims

1. A resin composition comprising: Epoxy resin (A); curing agent (B), including compounds having cyanate groups, wherein the compounds having cyanate groups include compounds represented by the following formula (B-1); colorant (C); modifier (D); accelerator (E); and filler (F): formula (B-1).

2. The resin composition as claimed in claim 1, wherein the cyanate ester equivalent of the compound having a cyanate ester group is from 100 g / eq to 250 g / eq.

3. The resin composition as claimed in claim 1, wherein the epoxy resin (A) has a weight average molecular weight of 200 g / mole to 600 g / mole.

4. The resin composition as claimed in claim 1, wherein the epoxy resin (A) has an epoxy equivalent of 100 g / eq to 300 g / eq.

5. The resin composition as claimed in claim 1, wherein the epoxy resin (A) comprises an epoxy group, an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 20 carbon atoms, an ether group, or a combination thereof.

6. The resin composition as claimed in claim 1, wherein the total amount of non-volatile components in the resin composition is 100 parts by weight, the amount of epoxy resin (A) is 5 to 10 parts by weight, and / or the amount of hardener (B) is 4 to 9 parts by weight.

7. The resin composition as claimed in claim 1, wherein the colorant (C) comprises carbon black, phthalocyanine blue, crystal violet, naphthalene black, or a combination thereof.

8. The resin composition as claimed in claim 1, wherein the modifier (D) comprises a rubber modifier, a silicone modifier, a coupling agent, a flexible epoxy modifier, or a combination thereof.

9. The resin composition as claimed in claim 1, wherein the accelerator (E) comprises pyridine compounds, imidazole compounds, amine compounds, peroxides, or combinations thereof.

10. The resin composition as claimed in claim 1, wherein the colorant (C) is present in a content of 1 phr to 3 phr, the modifier (D) is present in a content of 1 phr to 5 phr, and / or the accelerator (E) is present in a content of 0.01 phr to 2 phr.

11. The resin composition as claimed in claim 1, wherein the filler material (F) comprises silicon dioxide, titanium dioxide, boron nitride, aluminum nitride, silicon carbide, or a combination thereof.

12. The resin composition as claimed in claim 1, wherein the total amount of non-volatile components used in the resin composition is 100 parts by weight, and the amount of filler material (F) used is 75 parts by weight or more.

13. The resin composition as claimed in claim 1, wherein the particle size of the filler material (F) is from 0.1 micrometers to 10 micrometers.

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