Wiring board, module and image display device

Abstract

The disclosed wiring substrate comprises: a substrate including a first surface and a second surface located opposite to the first surface; a plurality of grid wiring portions arranged spaced apart from each other on the first surface of the substrate; and a power supply portion electrically connected to the grid wiring portions. The wiring substrate has electromagnetic wave transmission and reception functions. The substrate is transparent. The grid wiring portions are configured as antennas. A plurality of first notches extending in a linear fashion are formed in the power supply portions.

Description

Technical Field

[0001] The present disclosure relates to a wiring board, a module, and an image display device. Prior Technology

[0002] Currently, mobile terminal devices such as smartphones, tablets, and smart glasses (AR (Augmented Reality), MR (Mixed Reality), etc.) are developing towards higher functionality, miniaturization, thinner designs, and lighter weights. Because these mobile terminal devices use multiple communication bandwidths, they require multiple antennas corresponding to those bandwidths. For example, mobile terminal devices may carry multiple antennas, including antennas for telephones, WiFi (Wireless Fidelity), 3G (Generation), 4G (Generation), 5G (Generation), LTE (Long Term Evolution), Bluetooth (trademark), and NFC (Near Field Communication). However, with the miniaturization of mobile terminal devices, the space available for antenna installation is limited, restricting the freedom of antenna design. Furthermore, because the antenna is housed within a limited space, it may not be able to meet the requirements for electromagnetic insensitivity.

[0003] Therefore, a thin-film antenna that can be mounted on the display area of ​​a mobile terminal device is developed. In this thin-film antenna, an antenna pattern is formed on a transparent substrate. The antenna pattern is formed by a conductor portion that forms an opaque conductive layer and a grid-like conductive mesh layer that forms multiple openings that are not formed portions. [Previous Technical Documents] [Patent Literature]

[0004] Patent Document 1: Japanese Patent Application Publication No. 2011-66610 Patent Document 2: International Publication No. 2019 / 163087

[0005] However, in thin-film antennas, a power supply line is connected to the power supply unit used to electrically connect the conductive mesh layer to an external machine. In this case, it is desirable to improve the connectivity between the power supply unit and the power supply line.

[0006] Furthermore, it is believed that, based on the relationship between the outer periphery shape of the conductive mesh layer and the distance between the wiring, the wiring located on the outer periphery of the conductive mesh layer is cut off midway. In this case, there is a risk that the electrical characteristics of the antenna may be reduced, for example, at the outer periphery of the conductive mesh layer. In contrast, it is considered to provide wiring as a boundary line on the outer periphery of the conductive mesh layer (for example, see Patent Document 2). In this case, for example, although the electrical characteristics of the antenna are guaranteed, there is a risk that the wiring located on the outer periphery of the conductive mesh layer is conspicuous and easily visible.

[0007] The purpose of this embodiment is to provide a wiring board, module, and image display device that can improve the connectivity between the power supply line and the power supply unit.

[0008] This embodiment provides a wiring board and an image display device that can suppress the degradation of electrical characteristics of the mesh wiring section and make it difficult to see the wiring located on the periphery of the mesh wiring section. Summary of the Invention

[0009] The implementation of this disclosure pertains to the following[1]~

[32] .

[0010] [1] A wiring board comprising: a substrate including a first surface and a second surface located on the opposite side of the first surface; two or more grid wiring portions arranged spaced apart from each other on the first surface of the substrate; and two or more power supply portions electrically connected to the grid wiring portions; wherein the wiring board has an electromagnetic wave transceiver function, the substrate is transparent, the grid wiring portions are configured as antennas, each of the grid wiring portions is individually connected to each of the power supply portions, and two or more first notches extending in a linear shape are formed in the power supply portions.

[0011] [2] As described in [1], the wiring board has millimeter wave transceiver function, and the grid wiring section is configured as an array antenna.

[0012] [3] As described in [1] or [2], the power supply section has a first end connected to the grid wiring section and a second end opposite to the first end, and the first notch extends from the second end in a direction from the second end toward the first end.

[0013] [4] The wiring board described in any of [1] to [3] further includes a grounding portion disposed on the first surface of the board, and two or more second notches extending in a linear manner are formed in the grounding portion.

[0014] [5] The wiring board described in any of [1] to [4] has a break portion formed in the first notch portion to break the first notch portion.

[0015] [6] The wiring board described in any of [1] to [5], wherein the distance between the above-mentioned grid wiring portions is more than 1 mm and less than 5 mm.

[0016] [7] The wiring board described in any of [1] to [6], wherein around the above-mentioned grid wiring portion, there is a dummy wiring portion that is electrically independent of the above-mentioned grid wiring portion.

[0017] [8] As described in [7], the wiring board is provided with two or more of the above-mentioned dummy wiring portions, and the aperture ratio of the above-mentioned grid wiring portions and the above-mentioned dummy wiring portions increases in stages from the above-mentioned grid wiring portions toward the above-mentioned dummy wiring portions that are far away from the above-mentioned grid wiring portions.

[0018] [9] A module comprising: a wiring board as described in any of [1] to [8]; and a power supply line electrically connected to the power supply section of the wiring board.

[0019]

[10] As described in [9], the power supply line has a substrate and a metal wiring portion laminated on the substrate. Two or more third notches are formed in the metal wiring portion. The width of the third notches is less than the width of the first notches. When viewed from above, the third notches extend along the first notches and overlap with the first notches.

[0020]

[11] As described in [9] or

[10] , the power supply line is electrically connected to the power supply unit via an anisotropic conductive film containing conductive particles, and the width of the first notch is more than 0.5 times and less than 1 times the average particle diameter of the conductive particles.

[0021]

[12] An image display device comprising: a module as described in any of [9] to

[11] ; and a display device having the wiring substrate of the module laminated thereon.

[0022]

[13] A wiring substrate includes: a substrate having transparency; and a grid wiring portion disposed on the substrate having conductivity; wherein the grid wiring portion includes two or more wirings in a first direction and two or more wirings in a second direction, the two or more wirings in the first direction being parallel in a first direction and the two or more wirings in the second direction being parallel in a second direction, and when the periphery of the area where the grid wiring portion is disposed is defined as an imaginary periphery line, the imaginary periphery line is composed of two or more straight sides, the imaginary periphery line forms a closed shape, at least a portion of the imaginary periphery line extends along a third direction, the first direction and the second direction are not parallel to the third direction, in a portion of the imaginary periphery line, the end of each wiring in the first direction and the end of each wiring in the second direction are connected by end connecting wiring, the total length of one side of the imaginary periphery line in the third direction is defined as L a1, and the total length L When the total length between the two ends of the aforementioned terminal connecting wiring contained in a1 is set as Lp, the relationship 0.1L a1≦Lp≦0.5L a1 holds true.

[0023]

[14] As described in

[13] , the wiring board has two or more of the above-mentioned end connection wirings arranged in a dashed line along the third direction.

[0024]

[15] As described in

[13] or

[14] , the wiring board wherein the aforementioned end-connecting wiring extends in a straight line.

[0025]

[16] The wiring board as described in

[13] or

[14] , wherein the aforementioned end-connecting wiring has a zigzag shape or a curved shape.

[0026]

[17] The wiring board described in any of

[13] to

[16] , wherein the line width of the end-connecting wiring is narrower than the line width of the first direction wiring and the line width of the second direction wiring.

[0027]

[18] The wiring board described in any of

[13] to

[17] , wherein the distance between the two or more first direction wirings and the distance between the two or more second direction wirings are 0.01 mm or more and 1 mm or less.

[0028]

[19] The wiring board described in any of

[13] to

[18] , wherein the line width of the first direction wiring and the line width of the second direction wiring are 0.1 μm or more and 5.0 μm or less.

[0029]

[20] The wiring board described in any of

[13] to

[19] has a dummy wiring portion that is electrically independent of the grid wiring portion around the grid wiring portion.

[0030]

[21] The wiring board described in any of

[13] to

[20] , wherein the above-mentioned grid wiring section functions as a millimeter-wave antenna.

[0031]

[22] A wiring substrate includes: a substrate having transparency; and a grid wiring portion disposed on the substrate having conductivity; wherein the grid wiring portion includes two or more closed patterns arranged in a regular manner, each closed pattern being surrounded by wiring in two or more directions, and the closed pattern located on the outer periphery of the grid wiring portion having a shape that enlarges or reduces a portion or all of the closed patterns located outside the outer periphery of the grid wiring portion.

[0032]

[23] As described in

[22] , the wiring board wherein two to five of the closed patterns counted from the outer periphery of the above-mentioned grid wiring portion have a shape that enlarges or reduces all of the closed patterns located outside the outer periphery of the above-mentioned grid wiring portion.

[0033]

[24] The wiring board described in

[22] or

[23] , wherein the closed pattern is a polygon.

[0034]

[25] The wiring board described in any of

[22] to

[24] , wherein the line width of the wiring is 0.1 μm or more and 5.0 μm or less.

[0035]

[26] The wiring board described in any of

[22] to

[25] has a dummy wiring portion that is electrically independent of the grid wiring portion around the grid wiring portion.

[0036]

[27] The wiring board described in any of

[22] to

[26] , wherein the above-mentioned grid wiring section functions as a millimeter-wave antenna.

[0037]

[28] A wiring substrate includes: a substrate having transparency; and a grid wiring portion disposed on the substrate having conductivity; wherein the grid wiring portion includes two or more closed patterns arranged irregularly, each closed pattern being surrounded by wiring in two or more directions, and the closed pattern located on the outer periphery of the grid wiring portion being located on the inner side of the outer periphery of the grid wiring portion.

[0038]

[29] As described in

[28] , the wiring board has a line width of 0.1 μm or more and 5.0 μm or less.

[0039]

[30] As described in

[28] or

[29] , a wiring board is provided around the above-mentioned grid wiring portion, wherein a dummy wiring portion electrically independent of the above-mentioned grid wiring portion is provided.

[0040]

[31] The wiring board described in any of

[28] to

[30] , wherein the above-mentioned grid wiring section functions as a millimeter-wave antenna.

[0041]

[32] An image display device comprising a wiring board as described in any of

[13] to

[31] , and a display device laminated on the wiring board.

[0042] According to the implementation of this disclosure, the connectivity between the power supply line and the power supply unit can be improved.

[0043] According to the embodiment disclosed herein, the reduction in electrical characteristics of the grid wiring section can be suppressed, and the presence of wiring located on the outer periphery of the grid wiring section is not easily visible. Simple Explanation of the Diagram

[0044] Figure 1 is a top view showing the image display device of the first embodiment. Figure 2 is a cross-sectional view of the image display device in the first embodiment (cross-sectional view along line II-II of Figure 1). Figure 3 is a top view showing the wiring board of the first embodiment. Figure 4 is an enlarged top view of the wiring board of the first embodiment. Figure 5 is a cross-sectional view of the wiring board of the first embodiment (the VV line cross-sectional view of Figure 4). Figure 6 is a cross-sectional view of the wiring board of the first embodiment (cross-sectional view along line VI-VI of Figure 4). Figure 7 is a top view of the module in the first embodiment. Figure 8 is a cross-sectional view of the module in the first embodiment (cross-sectional view along line VIII-VIII in Figure 7). Figure 9 shows an exploded perspective view of the module in the first embodiment. Figure 10A is a cross-sectional view showing the manufacturing method of the wiring board of the first embodiment. Figure 10B is a cross-sectional view showing the manufacturing method of the wiring board of the first embodiment. Figure 10C is a cross-sectional view showing the manufacturing method of the wiring board of the first embodiment. Figure 10D is a cross-sectional view showing the manufacturing method of the wiring board of the first embodiment. Figure 10E is a cross-sectional view showing the manufacturing method of the wiring board of the first embodiment. Figure 10F is a cross-sectional view showing the manufacturing method of the wiring board of the first embodiment. Figure 11A is a cross-sectional view showing the manufacturing method of the module in the first embodiment. Figure 11B is a cross-sectional view showing the manufacturing method of the module in the first embodiment. Figure 11C is a cross-sectional view showing the manufacturing method of the module in the first embodiment. Figure 12A is a cross-sectional view showing the manufacturing method of the image display device according to the first embodiment. Figure 12B is a cross-sectional view showing the manufacturing method of the image display device according to the first embodiment. Figure 12C is a cross-sectional view showing the manufacturing method of the image display device according to the first embodiment. Figure 13 is a top view of the wiring board of the first variation example. Figure 14 is an enlarged top view of the wiring board of the second variation example. Figure 15 is a top view of the wiring board of the third variation. Figure 16 shows an enlarged top view of the wiring board of the third variation example. Figure 17 is a top view of the wiring board of the fourth variation. Figure 18 shows an enlarged top view of the wiring board of the fourth variation example. Figure 19 shows a top view of the wiring board of the fifth variation. Figure 20 is a top view of the image display device in the second embodiment. Figure 21 is a top view of the wiring board of the second embodiment. Figure 22 is an enlarged top view of the outer periphery of the grid wiring section in the second embodiment. Figure 23 is a cross-sectional view of the wiring board of the second embodiment (cross-sectional view along line XXIII-XXIII of Figure 22). Figure 24 shows a cross-sectional view of the wiring board of the second embodiment (cross-sectional view along line XXIV-XXIV of Figure 22). Figure 25A is a cross-sectional view showing the manufacturing method of the wiring board in the second embodiment. Figure 25B is a cross-sectional view showing the manufacturing method of the wiring board of the second embodiment. Figure 25C is a cross-sectional view showing the manufacturing method of the wiring board in the second embodiment. Figure 25D is a cross-sectional view showing the manufacturing method of the wiring board in the second embodiment. Figure 25E is a cross-sectional view showing the manufacturing method of the wiring board in the second embodiment. Figure 25F is a cross-sectional view showing the manufacturing method of the wiring board in the second embodiment. Figure 26 is an enlarged top view of the outer periphery of the grid wiring section in the first variation of the second embodiment. Figure 27 is an enlarged top view of the outer periphery of the grid wiring section in the first variation of the second embodiment. Figure 28 is a top view of the wiring board of the second variation of the second embodiment. Figure 29 is an enlarged top view of the outer periphery of the grid wiring section in the second variation of the second embodiment (enlarged view of section XXIX in Figure 28). Figure 30 is a top view of the wiring board of the third variation of the second embodiment. Figure 31 is an enlarged top view of the outer periphery of the grid wiring section in the third variation of the second embodiment (enlarged view of section XXXI in Figure 30). Figure 32 is an enlarged top view of the outer periphery of the grid wiring section in the third embodiment. Figure 33 is an enlarged top view of the outer periphery of the grid wiring section in the first variation of the third embodiment. Figure 34 is an enlarged top view of the outer periphery of the grid wiring section in the second variation of the third embodiment. Figure 35 is an enlarged top view of the outer periphery of the grid wiring section in the third variation of the third embodiment. Figure 36 is an enlarged top view of the outer periphery of the grid wiring section in the fourth variation of the third embodiment. Figure 37 is an enlarged top view of the outer periphery of the grid wiring section in the fourth variation of the third embodiment. Figure 38A is an enlarged top view of the outer periphery of the grid wiring section in the fifth variation of the third embodiment. Figure 38B is an enlarged top view of the outer periphery of the grid wiring section in the fifth variation of the third embodiment. Figure 39A is an enlarged top view of the outer periphery of the grid wiring section in the sixth variation of the third embodiment. Figure 39B is an enlarged top view of the outer periphery of the grid wiring section in the sixth variation of the third embodiment. Figure 40 shows an enlarged top view of the outer periphery of the grid wiring section in the fourth embodiment. Implementation

[0045] (First Implementation) First, an embodiment will be described with reference to Figures 1 to 12C. Figures 1 to 12C are diagrams showing this embodiment.

[0046] The following figures are schematic representations. Therefore, the size and shape of each part have been appropriately exaggerated for ease of understanding. Furthermore, modifications may be made without departing from the technical concept. Additionally, in the following figures, the same symbol may be used for the same part, and detailed descriptions of some parts may be omitted. Furthermore, the dimensions and material names of the components described in this specification are examples of embodiments and are not limited to; appropriate selections may be made. In this specification, terms describing specific shapes or geometric conditions, such as parallel, orthogonal, or perpendicular, are interpreted in addition to their strict meanings, including substantially similar states.

[0047] In the following embodiments, "X direction" refers to a direction parallel to one side of the image display device. "Y direction" refers to a direction perpendicular to the X direction and parallel to the other side of the image display device. "Z direction" refers to a direction perpendicular to both the X and Y directions and parallel to the thickness direction of the image display device. "Front side" refers to the side facing the observer in the Z direction, and the light-emitting side of the image display device. "Back side" refers to the side facing the observer in the Z direction, and the side opposite to the light-emitting side and the side facing the observer of the image display device. Furthermore, in this embodiment, the grid wiring section 20 is described as having radio wave transceiver function (functioning as an antenna), but the grid wiring section 20 may also not have radio wave transceiver function.

[0048] Referring to Figures 1 and 2, the configuration of the image display device of this embodiment will be described.

[0049] As shown in Figures 1 and 2, the image display device 60 of this embodiment includes a module 80A and a display device (display) 61 laminated on the module 80A. The module 80A includes a wiring board 10 and power supply lines 85 electrically connected to the power supply section 40 (described later) on the wiring board 10. Furthermore, the module 80A, the first transparent adhesive layer (first adhesive layer) 95 (described later), and the second transparent adhesive layer (second adhesive layer) 96 (described later) constitute a laminate 70 for the image display device.

[0050] The wiring board 10 of module 80A includes a substrate 11, a grid wiring section 20, and a power supply section 40. As shown in FIG2, the substrate 11 includes a first surface 11a and a second surface 11b located on the opposite side of the first surface 11a. A plurality of grid wiring sections 20 are arranged on the first surface 11a of the substrate 11 (more than two). Furthermore, the power supply section 40 is electrically connected to each grid wiring section 20. Moreover, a communication module 63 is arranged on the negative side in the Z direction relative to the display device 61. The image display device laminate 70, the display device 61, and the communication module 63 are housed within a housing 62.

[0051] The image display device 60 shown in Figures 1 and 2 can transmit and receive radio waves of a specified frequency via a communication module 63, and can perform communication. The communication module 63 may include any of the following: a millimeter-wave antenna, a telephone antenna, a WiFi antenna, a 3G antenna, a 4G antenna, a 5G antenna, an LTE antenna, a Bluetooth antenna, or an NFC antenna. Examples of such image display devices 60 include smartphones, tablets, and other mobile terminal devices.

[0052] As shown in Figure 2, the image display device 60 has a light-emitting surface 64. The image display device 60 includes: a wiring board 10, which is located on the side of the light-emitting surface 64 (positive side in the Z direction) relative to the display device 61; and a communication module 63, which is located on the opposite side of the light-emitting surface 64 (negative side in the Z direction) relative to the display device 61.

[0053] Display device 61 includes, for example, an organic EL (Electro Luminescence) display device.

[0054] The display device 61 may include, for example, a metal layer (not shown), a support substrate, a resin substrate, a thin-film transistor (TFT), and an organic EL layer. A touch sensor (not shown) may be disposed on the display device 61. Furthermore, a wiring substrate 10 is disposed on the display device 61, separated by a second transparent bonding layer 96. The display device 61 is not limited to an organic EL display device. For example, the display device 61 may also be other display devices with its own light-emitting function, or a microLED display device including microLED (Light Emitting Diode) elements. Additionally, the display device 61 may also be a liquid crystal display device including liquid crystal.

[0055] A glass cover 75 is disposed on the wiring substrate 10, separating the first transparent adhesive layer 95. Alternatively, a decorative film (not shown) and a polarizing plate may be disposed between the first transparent adhesive layer 95 and the glass cover 75.

[0056] The first transparent adhesive layer 95 is an adhesive layer that directly or indirectly bonds the wiring substrate 10 to the glass cover 75. This first transparent adhesive layer 95 is located on the first surface 11a of the substrate 11. The first transparent adhesive layer 95 has optical transparency and can be an OCA (Optical Clear Adhesive) layer. The OCA layer is, for example, a layer manufactured as follows: First, a liquid curable adhesive composition containing a polymeric compound is coated onto a release film such as polyethylene terephthalate (PET). Then, it is cured using, for example, ultraviolet light (UV), thereby obtaining an OCA sheet. After the OCA sheet is adhered to an object, the release film is peeled off, thereby obtaining the aforementioned OCA layer. The material of the first transparent adhesive layer 95 can be an acrylic resin, a silicone resin, or a urethane resin, etc. In particular, the first transparent adhesive layer 95 can contain an acrylic resin. In this case, the second transparent adhesive layer 96 is preferably composed of an acrylic resin. This effectively eliminates the difference in refractive index between the first transparent adhesive layer 95 and the second transparent adhesive layer 96, and more effectively suppresses the reflection of visible light at the interface B3 between the first transparent adhesive layer 95 and the second transparent adhesive layer 96.

[0057] The transmittance of visible light of the first transparent adhesive layer 95 can be 85% or more, preferably 90% or more. Furthermore, there is no particular upper limit to the transmittance of visible light of the first transparent adhesive layer 95; for example, it can be 100% or less. By setting the transmittance of visible light of the first transparent adhesive layer 95 to the above range, the transparency of the laminate 70 for the image display device can be improved, making it easier to see the display device 61 of the image display device 60. Visible light refers to light with a wavelength of 400 nm to 700 nm. Moreover, a transmittance of visible light of 85% or more means that when measuring the absorbance of the measured component (e.g., the first transparent adhesive layer 95), the transmittance is 85% or more across the entire wavelength range of 400 nm to 700 nm. The absorbance measurement can be performed using a well-known spectrophotometer (e.g., the spectrophotometer (UV-Vis-IR spectrophotometer): V-670 manufactured by Nippon Spectrophotometer Co., Ltd.). Alternatively, the transmittance of a specified area of ​​the wiring board 10 can also be measured using the aforementioned UV-Vis-IR spectrophotometer "V-670". When measuring the transmittance of the area where the grid wiring portion 20 exists, the measurement is performed in a manner that covers the entire measurement range (10 mm × 3 mm) of the aforementioned UV-Vis-IR spectrophotometer, including the grid wiring portion 20.

[0058] As described above, the wiring substrate 10 is disposed on the light-emitting surface 64 side relative to the display device 61. In this case, the wiring substrate 10 is located between the first transparent bonding layer 95 and the second transparent bonding layer 96. More specifically, a portion of the substrate 11 of the wiring substrate 10 is disposed in a portion of the area between the first transparent bonding layer 95 and the second transparent bonding layer 96. In this case, the first transparent bonding layer 95, the second transparent bonding layer 96, the display device 61, and the glass cover 75 each have an area larger than the substrate 11 of the wiring substrate 10. Thus, by disposing of the substrate 11 of the wiring substrate 10 in a portion of the image display device 60 when viewed from above, rather than the entire surface, the overall thickness of the image display device 60 can be reduced.

[0059] As described above, the wiring board 10 includes a transparent substrate 11, a plurality of (two or more) grid wiring portions 20 spaced apart from each other on a first surface 11a of the substrate 11, and a plurality of (two or more) power supply portions 40. The power supply portions 40 are electrically connected to the grid wiring portions 20. In this case, each grid wiring portion 20 and each power supply portion 40 are individually connected. The power supply portions 40 are electrically connected to the communication module 63 via power supply lines 85. Furthermore, a portion of the wiring board 10 is not disposed between the first transparent bonding layer 95 and the second transparent bonding layer 96, but protrudes outward (to the negative side of the Y direction) from between the first transparent bonding layer 95 and the second transparent bonding layer 96. Specifically, the area in the wiring board 10 where the power supply portions 40 are located protrudes outward. This facilitates easy electrical connection between the power supply portions 40 and the communication module 63. On the other hand, the area in the wiring board 10 where the grid wiring portion 20 is provided is located between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. Further details regarding the wiring board 10 and the power supply line 85 will be described below.

[0060] The second transparent adhesive layer 96 is an adhesive layer that directly or indirectly connects the display device 61 to the wiring substrate 10. The second transparent adhesive layer 96 is located on the second surface 11b of the substrate 11. The second transparent adhesive layer 96, like the first transparent adhesive layer 95, has optical transparency and is an OCA (Optical Clear Adhesive) layer. The material of the second transparent adhesive layer 96 can be acrylic resin, silicone resin, or urethane resin, etc. In particular, the second transparent adhesive layer 96 can also contain acrylic resin. This substantially eliminates the difference in refractive index between the first transparent adhesive layer 95 and the second transparent adhesive layer 96, and more effectively suppresses visible light reflection at the interface B3 between the first transparent adhesive layer 95 and the second transparent adhesive layer 96.

[0061] The transmittance of visible light (light with wavelengths between 400 nm and 700 nm) of the second transparent adhesive layer 96 can be 85% or more, preferably 90% or more. Furthermore, there is no particular upper limit to the transmittance of visible light of the second transparent adhesive layer 96; for example, it can be 100% or less. By setting the transmittance of visible light of the second transparent adhesive layer 96 to the above range, the transparency of the laminate 70 for the image display device can be improved, making it easier to see the display device 61 of the image display device 60.

[0062] In this image display device 60, the difference between the refractive index of the substrate 11 and the refractive index of the first transparent adhesive layer 95 is 0.1 or less, preferably 0.05 or less. Furthermore, the difference between the refractive index of the substrate 11 and the refractive index of the second transparent adhesive layer 96 is 0.1 or less, preferably 0.05 or less. Moreover, the difference between the refractive index of the first transparent adhesive layer 95 and the refractive index of the second transparent adhesive layer 96 is preferably 0.1 or less, more preferably 0.05 or less. For example, when the materials of the first transparent adhesive layer 95 and the second transparent adhesive layer 96 are acrylic resins with a refractive index of 1.49, the refractive index of the substrate 11 is set to 1.39 or more and 1.59 or less. Examples of such materials include fluoropolymers, silicone resins, polyolefin resins, polyester resins, acrylic resins, polycarbonate resins, polyimide resins, and cellulose resins.

[0063] Thus, by suppressing the difference between the refractive index of substrate 11 and the refractive index of the first transparent adhesive layer 95 to less than 0.1, the reflection of visible light at the interface B1 between substrate 11 and the first transparent adhesive layer 95 can be suppressed, making substrate 11 difficult to see with the naked eye. Furthermore, by suppressing the difference between the refractive index of substrate 11 and the refractive index of the second transparent adhesive layer 96 to less than 0.1, the reflection of visible light at the interface B2 between substrate 11 and the second transparent adhesive layer 96 can be suppressed, making substrate 11 difficult to see with the naked eye. Moreover, by suppressing the difference between the refractive index of the first transparent adhesive layer 95 and the second transparent adhesive layer 96 to less than 0.1, the reflection of visible light at the interface B3 between the first transparent adhesive layer 95 and the second transparent adhesive layer 96 can be suppressed. Therefore, the first transparent adhesive layer 95 and the second transparent adhesive layer 96 are difficult to see with the naked eye.

[0064] In particular, it is preferable that the materials of the first transparent adhesive layer 95 and the second transparent adhesive layer 96 are the same. This can further reduce the difference in refractive index between the first transparent adhesive layer 95 and the second transparent adhesive layer 96, and suppress the reflection of visible light at the interface B3 between the first transparent adhesive layer 95 and the second transparent adhesive layer 96.

[0065] In Figure 2, the thickness of at least one of the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 can be at least 1.5 times the thickness T1 of the substrate 11, preferably at least 2 times, and even more preferably at least 2.5 times. Thus, by making the thickness T3 of the first transparent adhesive layer 95 or the thickness T4 of the second transparent adhesive layer 96 sufficiently thicker than the thickness T1 of the substrate 11, in the area overlapping with the substrate 11, the first transparent adhesive layer 95 or the second transparent adhesive layer 96 deforms in the thickness direction, absorbing the thickness of the substrate 11. This suppresses the generation of a step difference in the first transparent adhesive layer 95 or the second transparent adhesive layer 96 at the periphery of the substrate 11, making it difficult for an observer to discern the presence of the substrate 11.

[0066] The thickness of at least one of the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 is preferably less than 10 times the thickness T1 of the substrate 11, and more preferably less than 5 times. This prevents the thickness T3 of the first transparent adhesive layer 95 or the thickness T4 of the second transparent adhesive layer 96 from becoming excessively thick, thus reducing the overall thickness of the image display device 60.

[0067] In Figure 2, the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 can also be the same. In this case, the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 can be at least 1.5 times the thickness T1 of the substrate 11, preferably at least 2.0 times. That is, the total thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 (T3 + T4) is at least 3 times the thickness T1 of the substrate 11. Thus, by making the total thickness T3 and T4 of the first transparent adhesive layer 95 and the second transparent adhesive layer 96 sufficiently thicker than the thickness T1 of the substrate 11, the first transparent adhesive layer 95 and the second transparent adhesive layer 96 deform (shrink) in the thickness direction in the area overlapping with the substrate 11. In this way, the first transparent adhesive layer 95 and the second transparent adhesive layer 96 absorb the thickness of the substrate 11. Therefore, the step difference generated in the first transparent adhesive layer 95 or the second transparent adhesive layer 96 at the periphery of the substrate 11 can be suppressed, making it difficult for the observer to identify the existence of the substrate 11.

[0068] When the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 are the same, the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 can be less than 5 times the thickness T1 of the substrate 11, preferably less than 3 times. In this way, the thicknesses T3 and T4 of the first transparent adhesive layer 95 and the second transparent adhesive layer 96 will not become excessively thick, and the overall thickness of the image display device 60 can be reduced.

[0069] Specifically, the thickness T1 of the substrate 11 can be, for example, 2 μm or more, or 10 μm or more, preferably 15 μm or more. By setting the thickness T1 of the substrate 11 to 2 μm or more, the strength of the wiring substrate 10 can be maintained, making it less prone to deformation of the first direction wiring 21 and the second direction wiring 22 described later in the mesh wiring section 20. Furthermore, the thickness T1 of the substrate 11 can be, for example, 200 μm or less, or 50 μm or less, preferably 25 μm or less. By setting the thickness T1 of the substrate 11 to 200 μm or less, the step difference between the first transparent adhesive layer 95 and the second transparent adhesive layer 96 at the periphery of the substrate 11 can be suppressed, making it difficult for an observer to discern the presence of the substrate 11. Furthermore, by setting the thickness T1 of the substrate 11 to less than 50 μm, the step difference between the first transparent adhesive layer 95 and the second transparent adhesive layer 96 at the periphery of the substrate 11 can be suppressed, making it more difficult for the observer to identify the presence of the substrate 11.

[0070] The thickness T3 of the first transparent adhesive layer 95 can be, for example, 15 μm or more, preferably 20 μm or more. The thickness T3 of the first transparent adhesive layer 95 can be, for example, 500 μm or less, preferably 300 μm or less, and even more preferably 250 μm or less. The thickness T4 of the second transparent adhesive layer 96 can be, for example, 15 μm or more, preferably 20 μm or more. The thickness T4 of the second transparent adhesive layer 96 can be, for example, 500 μm or less, preferably 300 μm or less, and even more preferably 250 μm or less.

[0071] Referring again to Figure 2, the glass cover plate 75 is disposed directly or indirectly on the first transparent adhesive layer 95. The glass cover plate 75 is a light-transmitting glass component. The glass cover plate 75 is plate-shaped, and its shape can be rectangular when viewed from above. The thickness of the glass cover plate 75 can be, for example, 200 μm to 1000 μm, preferably 300 μm to 700 μm. The length of the long side (Y direction) of the glass cover plate 75 is, for example, 20 mm to 500 mm, preferably 100 mm to 200 mm. The length of the short side (X direction) of the glass cover plate 75 is 20 mm to 500 mm, preferably 50 mm to 100 mm.

[0072] As shown in Figure 1, the image display device 60 is generally rectangular in shape when viewed from above, with its long side parallel to the Y-direction and its short side parallel to the X-direction. The length L4 of the long side (Y-direction) of the image display device 60 can be selected within, for example, a range of 20 mm to 500 mm, preferably 100 mm to 200 mm. The length L5 of the short side (X-direction) of the image display device 60 can be selected within, for example, a range of 20 mm to 500 mm, preferably 50 mm to 100 mm. Alternatively, the planar shape of the image display device 60 can also be a rectangle with rounded corners.

[0073] Next, the structure of the wiring board will be described with reference to Figures 3 to 6. Figures 3 to 6 are diagrams showing the wiring board of this embodiment.

[0074] The wiring substrate 10 of this embodiment is used in the substrate of the image display device 60 (see Figures 1 and 2). The wiring substrate 10 can be disposed on the side closer to the light-emitting surface 64 of the display device 61, between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. As shown in Figure 3, this wiring substrate 10, as described above, includes a transparent substrate 11, a plurality of grid wiring portions 20 arranged spaced apart from each other on the substrate 11, and a plurality of power supply portions 40. Furthermore, the power supply portions 40 are electrically connected to the grid wiring portions 20. Each grid wiring portion 20 and each power supply portion 40 are individually connected.

[0075] The substrate 11 is generally rectangular when viewed from above. In the illustrated example, its long side is parallel to the X-direction, and its short side is parallel to the Y-direction. The substrate 11 is transparent and generally flat, with a generally uniform thickness. The length L1 of the substrate 11 in the long side direction (Y-direction) of the image display device 60 (see Figures 1 and 3) can be selected in the range of, for example, 10 mm to 200 mm. The length L2 of the substrate 11 in the short side direction (X-direction) of the image display device 60 (see Figure 1) can be selected in the range of, for example, 3 mm to 100 mm. Alternatively, the planar shape of the substrate 11 can also be a rectangle with rounded corners.

[0076] The material of substrate 11 can be any material that is transparent and electrically insulating in the visible light region. Preferably, organic insulating materials such as polyester resins, acrylic resins, polycarbonate resins, polyimide resins, polyolefin resins, cellulose resins, or fluorine resins are used as the material of substrate 11. Polyester resins can be polyethylene terephthalate, etc. Acrylic resins can be polymethyl methacrylate, etc. Polyolefin resins can be cycloolefin polymers, etc. Cellulose resins can be triacetyl cellulose, etc. Fluorine resins can be PTFE (polytetrafluoroethylene) or PFA (soluble polytetrafluoroethylene), etc. For example, organic insulating materials such as cycloolefin polymers (e.g., ZF-16 manufactured by Zeon Corporation of Japan) or polynorbornene polymers (manufactured by Sumitomo Bakelite) can also be used as the material of substrate 11. Furthermore, glass or ceramics can also be appropriately selected as the material of substrate 11 depending on the application. Furthermore, the illustrated substrate 11 is an example of a single layer, but it is not limited to this; it may also be a structure with multiple substrates or layers. Additionally, the substrate 11 may be a thin film or a plate.

[0077] The dielectric loss tangent of substrate 11 can be 0.002 or less, preferably 0.001 or less. Furthermore, there is no particular limitation on the lower limit of the dielectric loss tangent of substrate 11, and it can also exceed 0. By setting the dielectric loss tangent of substrate 11 to the above range, especially when the electromagnetic waves (e.g., millimeter waves) transmitted and received by the grid wiring section 20 are high-frequency waves, the loss (reduction in sensitivity) accompanying the gain of the transmitted and received electromagnetic waves can be reduced.

[0078] The relative permittivity of substrate 11 is preferably 2 or higher and 10 or lower. Having a relative permittivity of 2 or higher increases the material options available for substrate 11. Furthermore, having a relative permittivity of 10 or lower reduces the gain loss associated with transmitting and receiving electromagnetic waves. That is, when the relative permittivity of substrate 11 increases, the thickness of substrate 11 has a greater impact on electromagnetic wave propagation. Also, when there is an adverse effect on electromagnetic wave propagation, the dielectric loss tangent of substrate 11 increases, potentially increasing the gain loss associated with transmitting and receiving electromagnetic waves. In contrast, having a relative permittivity of 10 or lower reduces the impact of substrate 11 thickness on electromagnetic wave propagation. Therefore, the gain loss associated with transmitting and receiving electromagnetic waves can be reduced. In particular, when the electromagnetic waves (e.g., millimeter waves) transmitted and received by the mesh wiring layer 20 are high-frequency waves, the gain loss associated with transmitting and receiving electromagnetic waves can be reduced.

[0079] The dielectric loss tangent and relative permittivity of substrate 11 can be determined according to IEC 62562. Specifically, firstly, a portion of substrate 11 without the mesh wiring layer 20 is cut out to prepare a test piece. The dimensions of the test piece are set to a width of 10 mm to 20 mm and a length of 50 mm to 100 mm. Next, the dielectric loss tangent or relative permittivity is determined according to IEC 62562.

[0080] In this embodiment, the substrate 11 is transparent. In this specification, "transparent" means that the transmittance of visible light (light with wavelengths between 400 nm and 700 nm) is 85% or higher. The transmittance of visible light of the substrate 11 can be 85% or higher, and preferably 90% or higher. Furthermore, there is no particular upper limit to the transmittance of visible light of the substrate 11; for example, it can be 100% or lower. By setting the transmittance of visible light of the substrate 11 to the above range, the transparency of the wiring substrate 10 can be improved, making it easier to view the display device 61 of the image display device 60.

[0081] In this embodiment, the grid wiring section 20 includes an antenna pattern that functions as an antenna. This grid wiring section 20 can be configured as an array antenna. Thus, when the grid wiring section 20 is configured as an array antenna, the performance of millimeter-wave antennas with high transmit / receive linearity can be improved. Furthermore, an array antenna refers to an antenna in which a plurality of antenna elements (radiating elements) are regularly arranged, and the amplitude and phase of the excitation of these elements can be independently controlled.

[0082] As shown in Figure 3, a plurality of mesh wiring portions 20 are formed on the substrate 11. Preferably, four or more mesh wiring portions 20 are provided. In the illustrated example, four mesh wiring portions 20 are formed on the substrate 11 (see Figure 1). Furthermore, as shown in Figure 3, the mesh wiring portions 20 may not exist throughout the entire substrate 11, but may only exist in a portion of the substrate 11. Each mesh wiring portion 20 may have the same shape as the others. In this case, it is preferable that the error in the length (Y-direction distance) La and the error in the width (X-direction distance) Wa of the front end portion 20b of each mesh wiring portion 20 are both within 10%. This effectively improves the performance of millimeter-wave antennas.

[0083] The mesh wiring section 20 has a base-side portion (power transmission section) 20a on the power supply section 40 side and a front-side portion (transmitter / receiver section) 20b connected to the base-side portion 20a. The base-side portion 20a is connected to the power supply section 40. The shape of the base-side portion 20a and the shape of the front-side portion 20b are approximately rectangular when viewed from above. In this case, the length (distance in the Y direction) of the front-side portion 20b is approximately the same as the length (distance in the Y direction) of the base-side portion 20a, and the width (distance in the X direction) of the front-side portion 20b is wider than the width (distance in the X direction) of the base-side portion 20a.

[0084] The front end portion 20b of the mesh wiring section 20 corresponds to a specified bandwidth. That is, the length (distance in the Y direction) La of the front end portion 20b corresponds to the specified bandwidth. Furthermore, the lower the frequency of the corresponding bandwidth, the longer the length La of the front end portion 20b. In addition to millimeter-wave antennas, the mesh wiring section 20 can also correspond to any of the following: telephone antennas, WiFi antennas, 3G antennas, 4G antennas, 5G antennas, LTE antennas, Bluetooth antennas, NFC antennas, etc. Furthermore, the lengths of multiple front end portions 20b can be different, corresponding to different bandwidths. Alternatively, when the wiring board 10 does not have radio wave transceiver functionality, each mesh wiring section 20 can perform functions such as hovering (the function that allows the user to operate without directly touching the display), fingerprint authentication, a heater, and noise cancellation (shielding). The hovering function refers to the function that allows the user to operate without directly touching the display.

[0085] The long side of the front-end portion 20b is parallel to the X-direction, and the short side is parallel to the Y-direction. The length La in the Y-direction of the front-end portion 20b can be selected, for example, within the range of 1 mm to 100 mm. The width Wa in the X-direction of the front-end portion 20b can be selected, for example, within the range of 1 mm to 100 mm. In particular, when the grid wiring section 20 is a millimeter-wave antenna, the length La of the front-end portion 20b is preferably 1 mm or more, and more preferably 1.5 mm or more. When the grid wiring section 20 is a millimeter-wave antenna, the length La of the front-end portion 20b is preferably 10 mm or less, and more preferably 5 mm or less.

[0086] The distance between the mesh wiring sections 20 is preferably 1 mm to 5 mm. That is, the distance D 20b between the front-end side sections 20b (see Figure 3) is preferably 1 mm to 5 mm. By ensuring that the distance D 20b between the front-end side sections 20b is 1 mm or more, accidental interference of electromagnetic waves between antenna elements can be suppressed. By ensuring that the distance D 20b between the front-end side sections 20b is 5 mm or less, the overall size of the array antenna formed by the mesh wiring sections 20 can be reduced. For example, when the mesh wiring section 20 is a 28 GHz millimeter-wave antenna, the distance D 20b between the front-end side sections 20b can also be 3.5 mm. Furthermore, when the mesh wiring section 20 is a 60 GHz millimeter-wave antenna, the distance D 20b between the front-end side sections 20b can also be 1.6 mm.

[0087] As shown in Figure 4, each of the grid wiring sections 20 has a pattern shape in which metal wires are arranged in a grid or mesh shape. This pattern shape is repeated in the X and Y directions. That is, the grid wiring section 20 has a pattern shape formed by a portion extending in a first direction (e.g., the Y direction) (the first direction wiring 21 described later) and a portion extending in a second direction (e.g., the X direction) (the second direction wiring 22 described later).

[0088] The grid wiring section 20 has a plurality of (two or more) wirings. Specifically, the grid wiring section 20 has a plurality of (two or more) first-direction wirings 21 and a plurality of (two or more) second-direction wirings 22 connecting the plurality of first-direction wirings 21. The plurality of first-direction wirings 21 and the plurality of second-direction wirings 22 are integrated to form a grid-like or mesh-like shape. Each first-direction wiring 21 extends in the long side direction (Y direction) of the grid wiring section 20. Each second-direction wiring extends linearly in the width direction (X direction) of the grid wiring section 20. Alternatively, the first-direction wirings 21 and the second-direction wirings 22 may extend in directions that are not parallel to either the X or Y direction.

[0089] In the grid wiring section 20, a plurality of openings 23 are formed by being surrounded by adjacent first-direction wirings 21 and adjacent second-direction wirings 22. The planar shape of each opening 23 is approximately rhomboid when viewed from above. The transparent substrate 11 is exposed from each opening 23. This improves the overall transparency of the wiring substrate 10.

[0090] In the grid wiring section 20, a plurality of openings 23 are formed by being surrounded by adjacent first-direction wirings 21 and adjacent second-direction wirings 22. Furthermore, the first-direction wirings 21 and second-direction wirings 22 are arranged at equal intervals. That is, the spacing P1 between the plurality of first-direction wirings 21 can be set to, for example, a range of 0.01 mm to 1 mm. Similarly, the spacing P2 between the plurality of second-direction wirings 22 can be set to, for example, a range of 0.01 mm to 1 mm. Thus, by arranging the plurality of first-direction wirings 21 and the plurality of second-direction wirings 22 at equal intervals, the size of the openings 23 within the grid wiring section 20 is consistent, making the grid wiring section 20 difficult to see with the naked eye. Furthermore, the distance P1 between the first-direction wirings 21 and the distance P2 between the second-direction wirings 22 are equal. Therefore, each opening 23 is approximately square in shape when viewed from above, and the transparent substrate 11 is exposed through each opening 23. Thus, by increasing the area of ​​each opening 23, the overall transparency of the wiring substrate 10 can be improved. Furthermore, the length L3 of one side of each opening 23 can be set to, for example, a range of 0.01 mm to 1 mm. Additionally, each first-direction wiring 21 and each second-direction wiring 22 are orthogonal to each other, but are not limited to this; they can also intersect at acute or obtuse angles. Moreover, the shape of the openings 23 is preferably uniform in shape and size, but can also be varied depending on the location or other factors.

[0091] As shown in Figure 5, the cross-section (X-direction cross-section) perpendicular to the long side direction of each first-direction wiring 21 has a generally rectangular or generally square shape. In this case, the cross-sectional shape of the first-direction wiring 21 is generally uniform along the long side direction (Y-direction) of the first-direction wiring 21. As shown in Figure 6, the cross-section (Y-direction cross-section) perpendicular to the long side direction of each second-direction wiring 22 is a generally rectangular or generally square shape, having a shape that is generally the same as the cross-sectional shape (X-direction cross-section) of the first-direction wiring 21 described above. In this case, the cross-sectional shape of the second-direction wiring 22 is generally uniform along the long side direction (X-direction) of the second-direction wiring 22. The cross-sectional shapes of the first-direction wiring 21 and the second-direction wiring 22 may not necessarily be generally rectangular or generally square. For example, the cross-sectional shape of the first direction wiring 21 and the cross-sectional shape of the second direction wiring 22 can also be a roughly trapezoidal shape in which the front side (positive side in the Z direction) is narrower than the back side (negative side in the Z direction), or a shape in which the sides are curved on both sides in the long side direction.

[0092] In this embodiment, the linewidth W1 of the first-direction wiring 21 (see Figure 5) and the linewidth W2 of the second-direction wiring 22 (see Figure 6) are not particularly limited and can be appropriately selected according to the application. Here, the linewidth W1 of the first-direction wiring 21 is the width (X-direction distance) in a cross-section perpendicular to its long side direction, and the linewidth W2 of the second-direction wiring 22 is the width (Y-direction distance) in a cross-section perpendicular to its long side direction. For example, the linewidth W1 of the first-direction wiring 21 can be selected in the range of 0.1 μm to 5.0 μm, preferably 0.2 μm to 2.0 μm. Similarly, the linewidth W2 of the second-direction wiring 22 can be selected in the range of 0.1 μm to 5.0 μm, preferably 0.2 μm to 2.0 μm.

[0093] The heights H1 (see Figure 5) of the first-direction wiring 21 and H2 (see Figure 6) of the second-direction wiring 22 are not particularly limited and can be appropriately selected according to the application. Here, the heights H1 of the first-direction wiring 21 and H2 of the second-direction wiring 22 are the lengths in the Z direction. The heights H1 of the first-direction wiring 21 and H2 of the second-direction wiring 22 can each be selected in a range of, for example, 0.1 μm or more, preferably 0.2 μm or more. The heights H1 of the first-direction wiring 21 and H2 of the second-direction wiring 22 can each be selected in a range of, for example, 5.0 μm or less, preferably 2.0 μm or less.

[0094] The materials for the first-direction wiring 21 and the second-direction wiring 22 can be any conductive metallic material. In this embodiment, the material for the first-direction wiring 21 and the second-direction wiring 22 is copper, but it is not limited to this. The materials for the first-direction wiring 21 and the second-direction wiring 22 can be, for example, metallic materials such as gold, silver, copper, platinum, tin, aluminum, iron, or nickel, or alloys containing such metals. Furthermore, the first-direction wiring 21 and the second-direction wiring 22 can also be plating layers formed by electrolytic plating.

[0095] The aperture ratio At of the entire mesh wiring section 20 can be, for example, 87% or more but less than 100%. By setting the aperture ratio At of the entire mesh wiring section 20 within this range, the conductivity and transparency of the wiring substrate 10 can be ensured. The aperture ratio At of the entire mesh wiring section 20 can be set to 87% or more, 90% or more, or 95% or more. The aperture ratio At of the entire mesh wiring section 20 can be set to less than 100%, 98% or less, or 96% or less. By setting the aperture ratio At of the entire wiring substrate 10 within this range, the conductivity of the wiring substrate 10 can be ensured, and the transparency of the wiring substrate 10 can be improved. Furthermore, the aperture ratio refers to the percentage (%) of the area of ​​the open area to the unit area of ​​a specified area (e.g., the entire area of ​​the mesh wiring section 20). The open area refers to the area where the substrate 11 is exposed because there are no metal portions such as the first direction wiring 21 and the second direction wiring 22.

[0096] Alternatively, although not shown in the figure, a protective layer can be formed by covering the first surface 11a of the substrate 11 and the grid wiring portion 20. The protective layer protects the grid wiring portion 20 and is formed by covering at least the grid wiring portion 20 in the substrate 11. As a material for the protective layer, colorless and transparent insulating resins such as copolymers of acrylic resins and modified resins such as poly(methyl)acrylate and poly(ethyl)acrylate, polyester, polyvinyl alcohol, polyvinyl acetate, polyvinyl acetal, polyvinyl butyral and other polyethylene resins and their copolymers, urethane, epoxy resin, polyamide, and chlorinated polyolefin can be used.

[0097] Referring again to Figures 3 and 4, a power supply section 40 is electrically connected to the grid wiring section 20. This power supply section 40 comprises a generally rectangular conductive sheet-like member. The long side of the power supply section 40 is parallel to the X-direction, and the short side is parallel to the Y-direction. The power supply section 40 has a first end 41 connected to the grid wiring section 20 and a second end 42 on the opposite side of the first end 41.

[0098] The length Lb of the short side (Y direction) of the power supply section 40 (see Figure 3) can be selected within a range of, for example, 1 mm to 100 mm. The width Wb of the long side (X direction) of the power supply section 40 (see Figure 3) can be, for example, 0.2 mm or more. Here, when the width Wb of the power supply section 40 is 0.2 mm or more, and the width Wb of the power supply section 40 is a specified value or more, according to the skin effect described later, the current flowing through the power supply section 40 only flows through a portion of the outer surface side of the power supply section 40. On the other hand, in this embodiment, as described later, a first notch 45 is formed in the power supply section 40. Therefore, when the width Wb of the power supply section 40 is 0.2 mm or more, the area where the current flows in the power supply section 40 can also be expanded. Therefore, the current flowing through the power supply section 40 can be dispersed. As a result, the deterioration of the power supply section 40 can be suppressed. The width Wb of this power supply section 40 can be selected within a range of, for example, 0.2 mm to 100 mm.

[0099] Furthermore, the power supply unit 40 is disposed at the end of the long side direction (the negative end in the Y direction) of the substrate 11. The material of the power supply unit 40 may be, for example, metals such as gold, silver, copper, platinum, tin, aluminum, iron or nickel, or alloys containing such metals.

[0100] When the wiring board 10 is assembled into the image display device 60 (see Figures 1 and 2), the power supply unit 40 is electrically connected to the communication module 63 of the image display device 60 via the power supply line 85. The power supply unit 40 is disposed on the first surface 11a of the substrate 11, but is not limited thereto; a portion or all of the power supply unit 40 may be located further outward than the periphery of the substrate 11. Alternatively, the power supply unit 40 may be flexibly formed and wrapped around the side or back of the image display device 60. In this case, the power supply unit 40 may also be electrically connected to the communication module 63 on the side or back of the image display device 60.

[0101] As shown in Figure 4, in the power supply section 40, a plurality of first-direction wirings 21 are electrically connected on the positive side of the Y direction. In this case, the power supply section 40 and the grid wiring section 20 are integrally formed. The thickness T5 (distance in the Z direction, see Figure 6) of the power supply section 40 can be set to be the same as the height H1 (see Figure 5) of the first-direction wirings 21 and the height H2 (see Figure 6) of the second-direction wirings 22, for example, it can be selected in the range of 0.1 μm to 5.0 μm.

[0102] Here, a plurality of first notches 45 extending linearly are formed in the power supply section 40. When the power supply wire 85 is installed in the power supply section 40, the first notches 45 allow the resin material of the anisotropic conductive film 85c (described later) to escape between the power supply wire 85 and the power supply section 40. Furthermore, when the power supply wire 85 is installed in the power supply section 40, the first notches 45 allow air entering between the power supply wire 85 and the power supply section 40 to escape between them. That is, due to the formation of the first notches 45 in the power supply section 40, when the power supply wire 85 is pressed into the power supply section 40, the resin material of the anisotropic conductive film 85c and the air entering between the power supply wire 85 and the power supply section 40 flow along the first notches 45. In this way, when the power supply line 85 is installed on the power supply section 40, air can be prevented from entering between the resin material of the anisotropic conductive film 85c and the power supply section 40, which is called bubble formation, and the adhesion between the power supply line 85 and the power supply section 40 can be improved.

[0103] Furthermore, when the power supply cable 85 is installed in the power supply section 40, a portion of the resin material of the power supply cable 85 enters the first notch 45. Moreover, the portion of the resin material entering the first notch 45 hardens within the first notch 45. The hardened resin material within the first notch 45 acts as an anchor. Therefore, the power supply cable 85 is securely and tightly attached to the power supply section 40, preventing the power supply cable 85 from detaching from the power supply section 40.

[0104] Furthermore, by forming the first notch 45 in the power supply section 40, the degradation of the power supply section 40 can be suppressed. That is, by forming the first notch 45 in the power supply section 40, according to the skin effect described later, the area of ​​current flow in the power supply section 40 is expanded. Therefore, the current flowing through the power supply section 40 can be dispersed. As a result, the degradation of the power supply section 40 can be suppressed.

[0105] Generally, when alternating current flows in a conductor, the higher the frequency, the less likely the current is to flow to the center of the conductor; instead, the current flows through the outer surface. This phenomenon, where alternating current flows only to the outer surface of a conductor, is called the skin effect. Furthermore, the skin depth refers to the depth from the outer surface of the conductor where the current flows most easily, attenuating by 1 / e (approximately 0.37) times. This skin depth δ can generally be calculated using the following formula.

[0106] [Number 1]

[0107] Furthermore, in the above formula, ω refers to the angular frequency (=2πf), μ refers to the magnetic inductance (4π×10⁻⁷ [H / m] in vacuum), and σ refers to the conductivity of the conductor (5.8×10⁻⁷ [S / m] in the case of copper). The skin depth δ of a copper conductor is approximately 2.3 μm at a frequency of 0.8 GHz, approximately 1.3 μm at a frequency of 2.4 GHz, approximately 1.0 μm at a frequency of 4.4 GHz, and approximately 0.85 μm at a frequency of 6 GHz. Also, the radio waves (millimeter waves) transmitted and received by 5G antennas are, for example, at higher frequencies (28 GHz to 39 GHz) compared to those transmitted and received by 4G antennas. And, for example, when the frequency of the current is between 28 GHz and 39 GHz, δ is approximately 0.3 μm to approximately 0.4 μm.

[0108] Thus, the current flows through a depth equivalent to the skin depth δ from the outer surface of the conductor. Therefore, especially when the radio waves transmitted and received by the grid wiring section 20 are high-frequency (e.g., above 28 GHz and below 39 GHz), the skin depth δ becomes smaller, so it is preferable to smooth the outer surface of the power supply section 40. On the other hand, the power supply line 85 is connected to the power supply section 40. Therefore, it is preferable to improve the adhesion between the power supply section 40 and the power supply line 85. As described above, in this embodiment, a plurality of first notches 45 are formed in the power supply section 40. Therefore, even when the outer surface of the power supply section 40 is smoothed, the adhesion between the power supply section 40 and the power supply line 85 can be improved.

[0109] Next, the first notch 45 will be described in detail. As shown in Figures 3 and 4, in the illustrated example, seven first notches 45 are formed in the power supply section 40. The first notches 45 penetrate the power supply section 40 in the thickness direction (Z direction), and the transparent substrate 11 is exposed from each of the first notches 45. Furthermore, the number of first notches 45 formed in the power supply section 40 is not limited to this. For example, two or more, or six or fewer, first notches 45 may be formed in the power supply section 40, or eight or more may be formed.

[0110] Multiple first notches 45 can extend along the long side direction (Y direction) of the grid wiring section 20. In this case, the first notches 45 extend in the direction of current flow. Therefore, the current flowing through the power supply section 40 can be effectively dispersed. In this case, each first notch 45 can extend in a straight line. The length L6 of the first notch 45 in the long side direction (Y direction) of the grid wiring section 20 (see Figure 4) can be set, for example, in the range of 0.5 mm to 99.9 mm.

[0111] Furthermore, the width W6 of the first notch 45 in the short side direction (X direction) of the mesh wiring section 20 (see Figure 4) is preferably 0.5 to 1 times the average particle diameter of the conductive particles 85d described later in the power supply line 85. This prevents interference between the conductive particles 85d of the anisotropic conductive film 85c and the first notch 45 when the power supply line 85 is connected to the power supply section 40 and the resin material of the anisotropic conductive film 85c flows. Therefore, the first notch 45 can suppress the movement of the conductive particles 85d of the anisotropic conductive film 85c. The width W6 of the first notch 45 can be set, for example, in the range of 0.01 mm to 0.5 mm.

[0112] A plurality of first notches 45 extend from the second end 42 in a direction from the second end 42 toward the first end 41 (the long side direction (Y direction) of the mesh wiring portion 20). This allows the resin material of the anisotropic conductive film 85c and any air entering between the power supply line 85 and the power supply portion 40 to be easily released through the second end 42 when the power supply line 85 is crimped to the power supply portion 40. Furthermore, by forming the first notches 45, according to the skin effect, high-frequency currents, especially millimeter waves, flow through both sides (both sides in the X direction) of the first notches 45. This disperses the current flowing through the power supply portion 40 compared to the case where the first notches 45 are not formed. Therefore, the deterioration of the edges of the power supply portion 40 can be suppressed. In the illustrated example, each first notch 45 is not formed over the entire area of ​​the power supply portion 40 in the Y direction, but only in a portion of the power supply portion 40 in the Y direction. Therefore, each of the first notches 45 terminates midway in the power supply section 40. Alternatively, each of the first notches 45 may also be formed in the Y direction throughout the entire area of ​​the power supply section 40.

[0113] The first notch portions 45 can also be formed at equal intervals. The distance P3 between the first notch portions 45 can be set to a range of 0.01 mm to 0.5 mm. In this way, by forming a plurality of first notches 45 at equal intervals, uneven current distribution in the power supply section 40 can be suppressed.

[0114] Furthermore, the first notch 45 can also extend along the width direction (X direction) of the grid wiring portion 20. Also, the first notch 45 can extend in a direction that is not parallel to either the X or Y direction. Furthermore, each of the first notches 45 can extend in a zigzag, curved, or wavy line shape. Also, each of the first notches 45 can extend in different directions. In particular, the first notch 45 can also extend radially from the center of the power supply portion 40. This improves the flowability of the resin material in the anisotropic conductive film 85c described later when the power supply line 85 is connected to the power supply portion 40.

[0115] Furthermore, the width W6 of the first notch 45 can be varied. In particular, the width W6 of the first notch 45 can widen outward from the center of the power supply section 40. By widening the width W6 outward from the center of the power supply section 40, the flowability of the resin material of the anisotropic conductive film 85c described later can be improved when the power supply line 85 is connected to the power supply section 40.

[0116] Each of the first notches 45 may have the same shape or different shapes. For example, the width W6 of each of the first notches 45 may also be different.

[0117] Next, referring to Figures 7 to 9, the configuration of the module will be described. Figures 7 to 9 are diagrams showing the module of this embodiment.

[0118] As shown in Figure 7, module 80A includes the aforementioned wiring board 10 and a power supply line 85 electrically connected to the power supply unit 40 via an anisotropic conductive film 85c. As described above, when module 80A is assembled into image display device 60 having display device 61, the power supply unit 40 of wiring board 10 is electrically connected to the communication module 63 of image display device 60 via power supply line 85.

[0119] The power supply line 85 has a roughly rectangular shape when viewed from above. In this case, the width (distance in the X direction) of the power supply line 85 can be approximately the same as the width (distance in the X direction) of the power supply section 40. Furthermore, the area of ​​the power supply line 85 can also be approximately the same as the area of ​​the power supply section 40. This allows the resistance of the power supply line 85 and the resistance of the power supply section 40 to be close to each other. Therefore, impedance matching can be easily achieved between the power supply line 85 and the power supply section 40, suppressing any reduction in electrical connectivity between them.

[0120] The power supply line 85 is pressed onto the wiring substrate 10 via an anisotropic conductive film (ACF) 85c. As shown in FIG8, the anisotropic conductive film 85c comprises resin materials such as acrylic resin and epoxy resin and conductive particles 85d. In the illustrated example, the anisotropic conductive film 85c covers a portion of the power supply section 40. This helps to suppress corrosion and other damage to the power supply section 40.

[0121] An anisotropic conductive film 85c is disposed facing the power supply section 40. A portion of the conductive particles 85d are in contact with the power supply section 40. This allows the power supply line 85 to be electrically connected to the power supply section 40. Furthermore, a portion of the anisotropic conductive film 85c may dissolve around the power supply line 85 when the power supply line 85 is pressed onto the wiring substrate 10. The particle diameter of the conductive particles 85d can be between 3 μm and 10 μm, for example, around 7 μm. To measure the average particle diameter of the conductive particles 85d, firstly, by peeling the power supply line 85 from the power supply section 40, a plurality of conductive particles 85d are exposed from the resin material of the anisotropic conductive film 85c. Next, the exposed plurality of conductive particles 85d are photographed using a scanning electron microscope (SEM). Then, the particle diameter of the plurality of conductive particles 85d is measured from the obtained image. The average value of the measured values ​​is set as the average particle diameter of the conductive particles 85d. The number of conductive particles 85d measured is between 10 and 100. Furthermore, if the number of measurable conductive particles 85d in a single power supply line 85 is 9 or less, the average particle diameter of the conductive particles 85d is calculated using the particle diameters of the conductive particles 85d from other power supply lines 85. Additionally, if the conductive particles 85d are not exposed from the resin material of the anisotropic conductive film 85c, the morphology of the conductive particles 85d within the resin material of the anisotropic conductive film 85c is photographed using a scanning electron microscope.

[0122] The power supply line 85 may be, for example, a flexible printed circuit board. As shown in FIG8, the power supply line 85 has a substrate 85a and a metal wiring portion 85b deposited on the substrate 85a. The substrate 85a may also contain, for example, a resin material such as polyimide or a liquid crystal polymer.

[0123] The metal wiring portion 85b may also contain copper, for example. The metal wiring portion 85b is electrically connected to the power supply portion 40 via conductive particles 85d.

[0124] As shown in Figure 9, a plurality of third notches 86 extending linearly can also be formed in the metal wiring portion 85b. This expands the current flow area in the metal wiring portion 85b due to the skin effect. Therefore, the current flowing through the metal wiring portion 85b can be dispersed. As a result, the degradation of the metal wiring portion 85b can be suppressed. Furthermore, for clarity, the anisotropic conductive film 85c is omitted from the illustration in Figure 9.

[0125] Furthermore, the width W7 of the third notch 86 (see Figure 7) can be less than or equal to the width W6 of the first notch 45. When viewed from above, the third notch 86 can extend along or overlap with the first notch 45. Therefore, when the power supply line 85 is connected to the power supply unit 40, even if the resin material of the anisotropic conductive film 85c flows, the conductive particles 85d of the anisotropic conductive film 85c will interfere with the first notch 45 and the third notch 86. Thus, the first notch 45 and the third notch 86 can suppress the movement of the conductive particles 85d of the anisotropic conductive film 85c. The width W7 of the third notch 86 can, for example, be set to a range of 0.002 mm to 2 mm.

[0126] In this case, as shown in Figure 9, seven third notches 86 are formed in the metal wiring portion 85b. The third notches 86 penetrate the metal wiring portion 85b in the thickness direction (Z direction), and the substrate 85a is exposed from each of the third notches 86. Furthermore, the number of third notches 86 formed in the metal wiring portion 85b is not limited to this. For example, two or more, or six or fewer, third notches 86 may be formed in the metal wiring portion 85b, or eight or more.

[0127] A plurality of third notches 86 may extend along the long side (Y direction) of the grid wiring section 20. In this case, the third notches 86 extend in the direction of current flow. Therefore, the current flowing through the metal wiring section 85b can be effectively dispersed.

[0128] The third notch 86 can also extend from the end of the metal wiring portion 85b on the positive side in the Y direction. As shown in FIG7, in the illustrated example, each third notch 86 is not formed over the entire area of ​​the metal wiring portion 85b in the Y direction, but only in a portion of the metal wiring portion 85b. Therefore, each third notch 86 terminates midway in the metal wiring portion 85b. Alternatively, each third notch 86 can also be formed over the entire area of ​​the metal wiring portion 85b in the Y direction. Furthermore, the length L7, spacing P4, and shape of the third notch 86 can be the same as the length L6, spacing P3, and shape of the first notch 45. That is, the third notch 86 can extend along the width direction (X direction) of the grid wiring portion 20. Furthermore, the third notch 86 can also extend in a direction that is not parallel to either the X or Y direction. Furthermore, each of the third notches 86 can extend in a zigzag shape, a curved shape, or a wavy shape. Also, each of the third notches 86 can extend in different directions. In particular, when the power supply line 85 is crimped to the power supply section 40, the third notch 86 can be formed in the metal wiring section 85b in a radial manner extending from the center of the power supply section 40. This improves the flowability of the resin material in the anisotropic conductive film 85c when the power supply line 85 is connected to the power supply section 40.

[0129] Furthermore, the width W7 of the third notch 86 can be varied. In particular, when the power supply line 85 is crimped to the power supply section 40, the third notch 86 can be formed in the metal wiring section 85b by widening the width W7 of the third notch 86 from the center of the power supply section 40 outwards. By widening the width W7 from the center of the power supply section 40 outwards, the flowability of the resin material of the anisotropic conductive film 85c can be further improved when the power supply line 85 is connected to the power supply section 40.

[0130] Each of the third notches 86 may have the same shape or different shapes. For example, the width W 7 of each of the third notches 86 may also be different.

[0131] Next, referring to FIGS. 10A to 12C, the manufacturing methods of the wiring board 10, the module 80A, and the image display device 60 of this embodiment will be described. FIGS. 10A to 10F are cross-sectional views showing the manufacturing method of the wiring board 10 of this embodiment. FIGS. 11A to 11C are cross-sectional views showing the manufacturing method of the module 80A of this embodiment. FIGS. 12A to 12C are cross-sectional views showing the manufacturing method of the image display device 60 of this embodiment.

[0132] First, as shown in FIG10A, a substrate 11 comprising a first surface 11a and a second surface 11b located on the opposite side of the first surface 11a is prepared. The substrate 11 is transparent.

[0133] Next, a grid wiring section 20 and a power supply section 40 connected to the grid wiring section 20 are formed on the first surface 11a of the substrate 11.

[0134] At this point, firstly, as shown in FIG10B, a metal foil 51 is deposited over approximately the entire first surface 11a of the substrate 11. In this embodiment, the thickness of the metal foil 51 can be 0.1 μm or more and 5.0 μm or less. In this embodiment, the metal foil 51 may contain copper.

[0135] Next, as shown in FIG10C, a photocurable insulating resist 52 is applied to approximately the entire surface of the metal foil 51. Examples of the photocurable insulating resist 52 include organic resins such as acrylic resin and epoxy resin.

[0136] Next, as shown in Figure 10D, an insulating layer 54 is formed by photolithography. In this case, the photocurable insulating resist 52 is patterned by photolithography to form the insulating layer 54 (resist pattern). At this time, the insulating layer 54 is formed in such a way that the metal foil 51 corresponding to the first direction wiring 21 and the second direction wiring 22 is exposed.

[0137] Next, as shown in FIG10E, the portion of the metal foil 51 not covered by the insulating layer 54 on the first surface 11a of the substrate 11 is removed. At this time, the metal foil 51 is etched to expose the first surface 11a of the substrate 11 by performing a wet treatment using strong acids such as ferric chloride, copper chloride, sulfuric acid / hydrochloric acid, persulfate, hydrogen peroxide or aqueous solutions of such, or combinations thereof.

[0138] Next, as shown in Figure 10F, the insulating layer 54 is removed. In this case, the insulating layer 54 on the metal foil 51 is removed by wet treatment using a permanganate solution or N-methyl-2-pyrrolidone, an acidic or alkaline solution, or by dry treatment using oxygen plasma.

[0139] Thus, a wiring substrate 10 having a substrate 11 and a grid wiring portion 20 disposed on the first surface 11a of the substrate 11 can be obtained. In this case, the grid wiring portion 20 includes a first-direction wiring 21 and a second-direction wiring 22. At this time, a power supply portion 40 can also be formed by a portion of a metal foil. In this case, when the insulating layer 54 is formed by photolithography, the first notch portion 45 can be formed at the desired position by appropriately setting the shape of the insulating layer 54. Alternatively, a flat plate-shaped power supply portion 40 can be prepared separately and electrically connected to the grid wiring portion 20. In this case, the first notch portion 45 can also be formed by mechanical processing, such as cutting.

[0140] Next, referring to Figures 11A to 11C, the manufacturing method of the module of this embodiment will be described.

[0141] First, as shown in FIG11A, a wiring board 10 is prepared. At this time, for example, the wiring board 10 is fabricated according to the method shown in FIG10A to FIG10F.

[0142] Next, the power supply line 85 is electrically connected to the power supply unit 40 via an anisotropic conductive film 85c containing conductive particles 85d. At this time, firstly, as shown in FIG11B, the anisotropic conductive film 85c is disposed on the wiring substrate 10. The anisotropic conductive film 85c is disposed facing the power supply unit 40.

[0143] Next, as shown in FIG11C, the power supply line 85 is crimped onto the wiring substrate 10. At this time, pressure and heat are applied to the power supply line 85 to crimp it onto the wiring substrate 10. Furthermore, a portion of the conductive particles 85d comes into contact with the power supply section 40. Thus, the power supply line 85 is electrically connected to the power supply section 40. When the power supply line 85 is crimped onto the wiring substrate 10, at least a portion of the power supply section 40 is covered by an anisotropic conductive film 85c. At this time, a portion of the anisotropic conductive film 85c may dissolve into the area surrounding the power supply line 85.

[0144] Furthermore, in this embodiment, a plurality of first notches 45 extending in a linear shape are formed in the power supply section 40. In this way, when the power supply line 85 is pressed onto the power supply section 40, the resin material of the anisotropic conductive film 85c and the air entering between the power supply line 85 and the power supply section 40 escape from between the power supply line 85 and the power supply section 40 along the first notches 45.

[0145] Furthermore, when the power supply cable 85 is installed in the power supply section 40, a portion of the resin material of the power supply cable 85 enters the first notch 45. Moreover, the portion of the resin material entering the first notch 45 hardens within the first notch 45. Therefore, the power supply cable 85 is securely attached to the power supply section 40.

[0146] Thus, a module 80A is obtained, which includes: a wiring board 10; and a power supply line 85, which is electrically connected to the power supply section 40 via an anisotropic conductive film 85c containing conductive particles 85d.

[0147] Next, referring to Figures 12A to 12C, the manufacturing method of the image display device 60 of this embodiment will be described.

[0148] Next, the first transparent adhesive layer 95, the wiring substrate 10 of module 80A, and the second transparent adhesive layer 96 are laminated together. At this time, firstly, as shown in FIG12A, for example, an OCA sheet 900 is prepared, comprising: a polyethylene terephthalate (PET) release film 910; and an OCA layer 920 (either the first transparent adhesive layer 95 or the second transparent adhesive layer 96), which is laminated onto the release film 910. The OCA layer 920 may be a layer in which a liquid curable adhesive layer composition containing a polymeric compound is coated onto the release film 910 and cured using, for example, ultraviolet light (UV). This curable adhesive layer composition contains monomers containing polar groups.

[0149] Next, as shown in Figure 12B, the OCA layer 920 of the OCA sheet 900 is attached to the wiring substrate 10. In this way, the wiring substrate 10 is sandwiched by the OCA layer 920.

[0150] Subsequently, as shown in Figure 12C, by peeling off the OCA layer 920 of the OCA sheet 900 attached to the wiring substrate 10 from the release film 910, the first transparent adhesive layer 95 (OCA layer 920), the wiring substrate 10, and the second transparent adhesive layer 96 (OCA layer 920) that are stacked together can be obtained.

[0151] Thus, a laminate 70 for an image display device having a first transparent adhesive layer 95, a second transparent adhesive layer 96, and a wiring substrate 10 can be obtained.

[0152] Subsequently, by using the image display device stacking 70 to stack the image display device 61, an image display device 60 comprising a module 80A and a wiring substrate 10 stacked on the module 80A can be obtained.

[0153] Next, the function of the implementation form containing this structure will be described.

[0154] As shown in Figures 1 and 2, a wiring board 10 is incorporated into an image display device 60 having a display device 61. At this time, the wiring board 10 is disposed on the display device 61. The grid wiring section 20 of the wiring board 10 is electrically connected to the communication module 63 of the image display device 60 via a power supply section 40 and a power supply line 85. Thus, radio waves of a predetermined frequency can be transmitted and received via the grid wiring section 20, enabling communication using the image display device 60.

[0155] In this embodiment, a plurality of first notches 45 extending in a linear shape are formed in the power supply section 40. This improves the adhesion between the power supply line 85 and the power supply section 40.

[0156] Here, the resin materials of the metal power supply section 40 and the power supply line 85 are different, so their adhesion may not be strong. Therefore, for example, if a notch like the first notch 45 is not formed in the power supply section 40, and the surface of the power supply section 40 is flat, the adhesion between the power supply line 85 and the power supply section 40 may be reduced.

[0157] In contrast, to improve the adhesion between the power supply line 85 and the power supply section 40, a plurality of through holes are formed in the power supply section 40 in the thickness direction (Z direction). In this case, a portion of the resin material of the anisotropic conductive film can enter the through holes. This portion of the resin material entering the through holes acts as an anchor, firmly bonding the power supply line 85 and the power supply section 40. On the other hand, when the power supply section 40 has a plurality of through holes, it may be difficult for air and resin material of the anisotropic conductive film entering between the power supply section 40 and the power supply line 85 to escape from between them.

[0158] In contrast, according to this embodiment, a plurality of first notches 45 extending linearly are formed in the power supply section 40. When the power supply wire 85 is pressed onto the power supply section 40, the resin material of the anisotropic conductive film 85c and the air entering between the power supply wire 85 and the power supply section 40 flow along the first notches 45. Therefore, the resin material of the anisotropic conductive film 85c and the air entering between the power supply wire 85 and the power supply section 40 can escape from between the power supply wire 85 and the power supply section 40. As a result, when the power supply wire 85 is installed on the power supply section 40, air entry between the resin material of the anisotropic conductive film 85c and the power supply section 40 can be suppressed, i.e., the so-called toothed structure, and the adhesion between the power supply wire 85 and the power supply section 40 is improved.

[0159] Furthermore, when the power supply cable 85 is installed in the power supply section 40, a portion of the resin material of the power supply cable 85 enters the first notch 45. Moreover, the portion of the resin material entering the first notch 45 hardens within the first notch 45. The hardened resin material within the first notch 45 acts as an anchor. Therefore, the power supply cable 85 is securely and tightly attached to the power supply section 40, preventing the power supply cable 85 from detaching from the power supply section 40.

[0160] Furthermore, by forming the first notch 45 in the power supply section 40, the degradation of the power supply section 40 can be suppressed. That is, by forming the first notch 45 in the power supply section 40, according to the skin effect, the area of ​​current flow in the power supply section 40 is expanded. Therefore, the current flowing through the power supply section 40 can be dispersed, and the degradation of the power supply section 40 can be suppressed.

[0161] Furthermore, the wiring board 10 includes a substrate 11 and a grid wiring portion 20 disposed on the substrate 11. The substrate 11 is also transparent. Moreover, the grid wiring portion 20 has a conductor portion forming an opaque conductive layer and a grid-like pattern of multiple openings 23. Therefore, the transparency of the wiring board 10 is ensured. Thus, when the wiring board 10 is disposed on the display device 61, the display device 61 can be viewed through the openings 23 of the grid wiring portion 20 without obstructing the visibility of the display device 61.

[0162] Furthermore, according to this embodiment, a plurality of first notches 45 extend along the long side of the grid wiring section 20. In this case, the first notches 45 extend in the direction of current flow. Therefore, the current flowing through the power supply section 40 can be effectively dispersed.

[0163] Furthermore, according to this embodiment, the power supply section 40 has a first end 41 connected to the grid wiring section 20 and a second end 42 opposite to the first end 41. Also, a plurality of first notches 45 extend from the second end 42 in a direction from the second end 42 toward the first end 41 (the direction of the long side of the grid wiring section 20). Therefore, when the power supply wire 85 is crimped to the power supply section 40, the resin material of the anisotropic conductive film 85c and the air entering between the power supply wire 85 and the power supply section 40 can easily escape from between the power supply wire 85 and the power supply section 40 via the second end 42. Furthermore, the adverse effects of the first notches 45 on the flow of current can be suppressed.

[0164] Furthermore, according to this embodiment, a plurality of third notches 86 extending linearly are formed in the metal wiring portion 85b of the power supply section 85. This expands the current flow area in the metal wiring portion 85b, thus dispersing the current flowing through it. As a result, degradation of the metal wiring portion 85b can be suppressed. Also, in top view, the third notches 86 extend along and overlap with the first notch 45. Therefore, when the power supply line 85 is connected to the power supply section 40, even when the resin material of the anisotropic conductive film 85c flows, the conductive particles 85d of the anisotropic conductive film 85c interfere with the first notch 45 and the third notches 86. Therefore, the first notch 45 can suppress the movement of the conductive particles 85d of the anisotropic conductive film 85c.

[0165] Next, we will explain a variation of the wiring board.

[0166] Figure 13 shows a first variation of the wiring board. In the variation shown in Figure 13, the difference is that the wiring board 10 further includes a grounding portion 50; the other configurations are largely the same as those shown in Figures 1 to 12C. In Figure 13, the same symbols are used to denote the parts that are identical to those shown in Figures 1 to 12C, and detailed descriptions are omitted.

[0167] In the wiring board 10 shown in Figure 13, the wiring board 10 further includes a ground portion (GND) 50 disposed on the first surface 11a of the substrate 11. In this case, the ground portion 50 can also be disposed in a plurality of them on the first surface 11a of the substrate 11 by inserting the grid wiring portion 20 from both sides in the X direction.

[0168] The grounding portion 50 may include, for example, a generally rectangular conductive sheet-like member. The long side of the grounding portion 50 may be parallel to either the X-direction or the Y-direction. In the example shown, the long side of the grounding portion 50 is parallel to the Y-direction.

[0169] Furthermore, the grounding portion 50 is disposed at the end of the long side of the substrate 11 (the negative end in the Y direction). The grounding portion 50 can be made of metals such as gold, silver, copper, platinum, tin, aluminum, iron, or nickel, or alloys containing such metals. The grounding portion 50 can also be formed by the same method as the power supply portion 40.

[0170] Here, a plurality of second notches 55 extending linearly are formed in the grounding portion 50. This expands the area for current flow in the grounding portion 50 due to the skin effect. Therefore, the current flowing through the grounding portion 50 can be dispersed. As a result, degradation of the grounding portion 50 can be suppressed.

[0171] As shown in Figure 13, in the illustrated example, three second notches 55 are formed in each grounding portion 50. A first notch 45 penetrates the grounding portion 50 in the thickness direction (Z direction), and a transparent substrate 11 is exposed from each of the second notches 55. However, the number of second notches 55 formed in the grounding portions 50 is not limited to this. For example, two second notches 55 may be formed in each grounding portion 50, or four or more may be formed in each grounding portion 50.

[0172] Multiple second notches 55 can extend along the long side (Y direction) of the grid wiring section 20.

[0173] The second notch 55 can extend from the negative end in the Y direction of the end of the grounding portion 50. In the illustrated example, each second notch 55 is not formed over the entire area of ​​the grounding portion 50 in the Y direction, but only in a portion of the grounding portion 50. Therefore, each second notch 55 terminates midway in the grounding portion 50. Alternatively, each second notch 55 can also be formed over the entire area of ​​the grounding portion 50 in the Y direction. Furthermore, the length L 8, width W 8, spacing P 5, and shape of the second notch 55 can be the same as the length L 6, width W 6, spacing P 3, and shape of the first notch 45. That is, the second notch 55 can extend along the width direction (X direction) of the grid wiring portion 20. Furthermore, the second notch 55 can also extend in a direction that is not parallel to either the X or Y direction. Furthermore, each second notch 55 can extend in a zigzag shape, a curved shape, or a wavy shape. Furthermore, each of the second notches 55 can extend in different directions.

[0174] Furthermore, the width W8 of the second notch 55 can vary. Moreover, each of the second notches 55 can have the same shape or different shapes. For example, the width W8 of each of the second notches 55 can also be different.

[0175] Figure 14 shows a second variation of the wiring board. The difference in the variation shown in Figure 14 is that a dividing portion 46 is formed in the first notch 45 to divide the first notch 45. The other configurations are generally the same as those shown in Figures 1 to 13. In Figure 14, the same symbols are used to mark the parts that are the same as those shown in Figures 1 to 13, and detailed descriptions are omitted.

[0176] In the wiring board 10 shown in Figure 14, a dividing portion 46 is formed in the first notch 45 to divide the first notch 45. In this case, the current flowing through the power supply section 40 also flows to the dividing portion 46. This suppresses uneven current distribution in the power supply section 40. The dividing portion 46 can be formed by appropriately setting the shape of the insulating layer 54 (see Figure 10D) when forming the first notch 45. The thickness of the dividing portion 46 can be equal to the thickness T5 (see Figure 6) of the power supply section 40.

[0177] Furthermore, the length L9 of the break portion 46 in the long side direction (Y direction) of the mesh wiring section 20 can be between 0.5 μm and 100 μm; for example, it can be 1 μm. By making the length L9 of the break portion 46 less than 100 μm, air entering between the power supply section 40 and the power supply line 85, as well as the resin material of the anisotropic conductive film, can easily escape from between the power supply section 40 and the power supply line 85.

[0178] Figures 15 and 16 show a third variation of the wiring board. The difference between the variation shown in Figures 15 and 16 is that a dummy wiring section 30 is provided around the grid wiring section 20; the other configurations are largely the same as those shown in Figures 1 to 14. In Figures 15 and 16, the parts that are the same as those shown in Figures 1 to 14 are labeled with the same symbols, and detailed descriptions are omitted.

[0179] In the wiring board 10 shown in Figure 15, a dummy wiring section 30 is provided around the grid wiring section 20. This dummy wiring section 30 is different from the grid wiring section 20 and does not actually function as an antenna.

[0180] As shown in Figure 16, the dummy wiring section 30 is composed of repeated dummy wirings 30a with a prescribed pattern shape. That is, the dummy wiring section 30 includes a plurality of dummy wirings 30a, each of which is electrically independent from the grid wiring section 20 (first direction wiring 21 and second direction wiring 22). Furthermore, the plurality of dummy wirings 30a are regularly arranged throughout the entire area of ​​the dummy wiring section 30. The plurality of dummy wirings 30a are spaced apart from each other in the planar direction and protrude from the substrate 11. That is, each dummy wiring 30a is electrically independent from the grid wiring section 20, the power supply section 40, and other dummy wirings 30a. The shape of each dummy wiring 30a is approximately L-shaped when viewed from above.

[0181] In this case, the dummy wiring 30a has a shape that lacks a portion of the pattern shape of the aforementioned grid wiring portion 20. Therefore, the difference between the grid wiring portion 20 and the dummy wiring portion 30 is not easily discernible by visual inspection, and the grid wiring portion 20 disposed on the substrate 11 is not easily visible. As shown in FIG. 16, the dummy wiring 30a extends parallel to the first direction wiring 21 or the second direction wiring 22. Specifically, the dummy wiring 30a includes a first portion 31a extending parallel to the first direction wiring 21 and a second portion 32a extending parallel to the second direction wiring 22. Thus, by extending the dummy wiring 30a parallel to the first direction wiring 21 or the second direction wiring 22, the grid wiring portion 20 disposed on the substrate 11 is even less easily visible. The aperture ratio of the dummy wiring section 30 can be the same as or different from that of the grid wiring section 20, but it is preferable to be close to the aperture ratio of the grid wiring section 20.

[0182] By providing a dummy wiring section 30, electrically independent of the grid wiring section 20, around the grid wiring section 20 as in this variation, the outer edge of the grid wiring section 20 can be made inconspicuous. This makes the grid wiring section 20 less visible on the surface of the image display device 60, and makes it difficult for the user of the image display device 60 to visually identify the grid wiring section 20.

[0183] Figures 17 and 18 show a fourth variation of the wiring board. The difference between the variation shown in Figures 17 and 18 is that a plurality of dummy wiring layers 30A and 30B with different aperture ratios are provided around the grid wiring section 20. The other configurations are largely the same as those shown in Figures 1 to 16. In Figures 17 and 18, the parts that are the same as those shown in Figures 1 to 16 are marked with the same symbols, and detailed descriptions are omitted.

[0184] In the wiring board 10 shown in Figure 17, a plurality of (in this case, two) dummy wiring sections 30A and 30B (first dummy wiring section 30A and second dummy wiring section 30B) with different aperture ratios are provided around the grid wiring section 20. Specifically, the first dummy wiring section 30A is arranged around the grid wiring section 20, and the second dummy wiring section 30B is arranged around the first dummy wiring section 30A. These dummy wiring sections 30A and 30B are different from the grid wiring section 20 and do not actually function as antennas.

[0185] As shown in Figure 18, the first dummy wiring section 30A is composed of repeated dummy wirings 30a1 with a prescribed pattern shape. Similarly, the second dummy wiring section 30B is composed of repeated dummy wirings 30a2 with a prescribed pattern shape. That is, each of the dummy wiring sections 30A and 30B contains a plurality of dummy wirings 30a1 and 30a2, and each dummy wiring 30a1 and 30a2 is electrically independent from the grid wiring section 20. Furthermore, the dummy wirings 30a1 and 30a2 are arranged regularly throughout the entire area of ​​the dummy wiring sections 30A and 30B. Each dummy wiring 30a1 and 30a2 is spaced apart from each other in the planar direction and protrudes from the substrate 11. Each dummy wiring 30a1 and 30a2 is electrically independent from the grid wiring section 20, the power supply section 40, and other dummy wirings 30a1 and 30a2. The shapes of each dummy wiring 30a1 and 30a2 are roughly L-shaped when viewed from above.

[0186] In this case, the dummy wirings 30a1 and 30a2 have a shape that lacks a portion of the pattern shape of the aforementioned grid wiring portion 20. Therefore, the difference between the grid wiring portion 20 and the first dummy wiring portion 30A, and the difference between the first dummy wiring portion 30A and the second dummy wiring portion 30B, is not easily discernible by visual inspection, and the grid wiring portion 20 disposed on the substrate 11 is not easily visible. As shown in FIG18, the dummy wirings 30a1 and 30a2 extend parallel to the first direction wiring 21 or the second direction wiring 22. Specifically, the dummy wiring 30a1 includes a first portion 31a1 extending parallel to the first direction wiring 21 and a second portion 32a1 extending parallel to the second direction wiring 22. The dummy wiring 30a2 includes a first portion 31a2 extending parallel to the first direction wiring 21 and a second portion 32a2 extending parallel to the second direction wiring 22.

[0187] Furthermore, the area of ​​each dummy wire 30a1 in the first dummy wiring section 30A is larger than the area of ​​each dummy wire 30a2 in the second dummy wiring section 30B. In this case, the linewidth of each dummy wire 30a1 is the same as the linewidth of each dummy wire 30a2, but this is not limited to this; the linewidth of each dummy wire 30a1 may also be thicker than the linewidth of each dummy wire 30a2. Also, since the other configurations of the dummy wires 30a1 and 30a2 are the same as those of the dummy wire 30a in the third variation, detailed explanations are omitted here.

[0188] In this variation, it is preferable that the aperture ratio of the grid wiring portion 20 and the plurality of dummy wiring portions 30A and 30B increases progressively from the grid wiring portion 20 towards the dummy wiring portions 30A and 30B further away from the grid wiring portion 20. In other words, it is preferable that the aperture ratio of each dummy wiring portion gradually increases from those closer to the grid wiring portion 20 towards those further away from the grid wiring portion 20. In this case, it is preferable that the aperture ratio of the first dummy wiring portion 30A is greater than that of the grid wiring portion 20. It is preferable that the aperture ratio of the second dummy wiring portion 30B is greater than that of the first dummy wiring portion 30A. This makes the outer edges of the grid wiring portion 20 and the dummy wiring portions 30A and 30B less noticeable. Therefore, the grid wiring portion 20 is less likely to be seen on the surface of the image display device 60.

[0189] Thus, by configuring dummy wiring sections 30A and 30B that are electrically independent of the grid wiring section 20, the outer edge of the grid wiring section 20 can be made less noticeable. Consequently, the grid wiring section 20 is not easily visible on the surface of the image display device 60, making it difficult for the user of the image display device 60 to identify the grid wiring section 20 with the naked eye. Alternatively, three or more dummy wiring sections with different aperture ratios can be provided around the grid wiring section 20.

[0190] Figure 19 shows the fifth variation of the wiring board. The variation shown in Figure 19 differs in the planar shape of the grid wiring section 20, but the other components are largely the same as those shown in Figures 1 to 18. In Figure 19, the parts that are the same as those shown in Figures 1 to 18 are labeled with the same symbols, and detailed descriptions are omitted.

[0191] In Figure 19, the first direction wiring 21 and the second direction wiring 22 intersect at an angle (not at a right angle), and each opening 23 forms a rhombus shape when viewed from above. The first direction wiring 21 and the second direction wiring 22 are not parallel to either the X direction or the Y direction, but either the first direction wiring 21 and the second direction wiring 22 can be parallel to either the X direction or the Y direction.

[0192] (Second Implementation) Next, the second embodiment will be described with reference to Figures 20 to 25F. Figures 20 to 25F show the second embodiment. In Figures 20 to 25F, parts that are the same as those in the first embodiment shown in Figures 1 to 19 are marked with the same symbols, and detailed descriptions are omitted.

[0193] Furthermore, in the following embodiments, "X direction" refers to the direction perpendicular to the long side of the mesh wiring section and the direction perpendicular to the length corresponding to the bandwidth of the mesh wiring section. "Y direction" refers to the direction perpendicular to the X direction and parallel to the long side of the mesh wiring section and the direction parallel to the length corresponding to the bandwidth of the mesh wiring section. "Z direction" refers to the direction perpendicular to both the X and Y directions and parallel to the thickness direction of the wiring substrate. Also, "front" refers to the surface on the positive side in the Z direction, where the mesh wiring section is provided to the substrate. "Back" refers to the surface on the negative side in the Z direction, opposite to the surface where the mesh wiring section is provided to the substrate. In this embodiment, the example given is that the mesh wiring section has radio wave transceiver function (function as an antenna), but the mesh wiring section 20 may also not have radio wave transceiver function (function as an antenna).

[0194] [Structure of Wiring Board] Referring to Figures 20 to 24, the configuration of the wiring board of this embodiment will be described. Figures 20 to 24 are diagrams showing the wiring board of this embodiment.

[0195] As shown in FIG20, the wiring board 10 of this embodiment is disposed on the display device (display) 91 of the image display device 90. This wiring board 10 includes a transparent substrate 11 and a conductive mesh wiring portion 20 disposed on the substrate 11. Furthermore, a power supply portion 40 is electrically connected to the mesh wiring portion 20.

[0196] As shown in Figure 21, the grid wiring section 20 includes a plurality of first-direction wirings 21 and a plurality of second-direction wirings 22. The plurality of first-direction wirings 21 are parallel to the first direction D1, and the plurality of second-direction wirings 22 are parallel to the second direction D2. When the outer perimeter of the area where the grid wiring section 20 is located is defined as an imaginary outer perimeter line 20S, the imaginary outer perimeter line 20S is composed of a plurality of straight edges 20X1~20X4 and 20Y1~20Y4. The imaginary outer perimeter line 20S forms a closed shape. A portion of the imaginary outer perimeter line 20S extends along a third direction (X direction or Y direction). The first direction D1 and the second direction D2 are not parallel to the third direction (X direction or Y direction). In a portion of the imaginary outer perimeter 20S, the ends 21e of each first-direction wiring 21 and the ends 22e of each second-direction wiring 22 are connected by end-connecting wiring 25. Let the total length of one side of the imaginary outer perimeter of the grid wiring section 20 in the third direction (X or Y direction) be La1, and let the total length between the two ends of the end-connecting wiring 25 included in the total length La1 be Lp. At this time, the relationship 0.1La1≦Lp≦0.5La holds true.

[0197] The substrate 11 is generally rectangular in shape when viewed from above. The long side of the substrate 11 is parallel to the Y-direction, and the short side is parallel to the X-direction. The substrate 11 is transparent and generally flat, with a generally uniform thickness. The length L 11 of the long side (Y-direction) of the substrate 11 can be, for example, in the range of 20 mm to 300 mm, or in the range of 100 mm to 200 mm. The length L 12 of the short side (X-direction) of the substrate 11 can be, for example, in the range of 2 mm to 300 mm, or in the range of 3 mm to 100 mm. Furthermore, the length L 12 of the short side (X-direction) of the substrate 11 can be, for example, in the range of 20 mm to 500 mm, or in the range of 50 mm to 100 mm.

[0198] The substrate 11 is made of a material that is transparent and electrically insulating in the visible light region. In this embodiment, the substrate 11 is made of polyethylene terephthalate, but is not limited to this. The thickness of the substrate 11 is not particularly limited and can be appropriately selected according to the application. As an example, the thickness T 11 (length in the Z direction, see Figure 23) of the substrate 11 can be set to a range of 10 μm to 200 μm.

[0199] In this embodiment, the grid wiring section 20 includes an antenna pattern that functions as an antenna. In Figure 21, one grid wiring section 20 is formed on the substrate 11. This grid wiring section 20 corresponds to a specified bandwidth. That is, the length (length in the Y direction) L 14 of the grid wiring section 20 corresponds to the specified bandwidth. Furthermore, the lower the frequency of the corresponding bandwidth, the longer the length L 14 of the grid wiring section 20. When the wiring substrate 10 is, for example, disposed in the display device 91 of the image display device 90 (see Figure 20), the wiring substrate 10 of each grid wiring section 20 can also have radio wave transmission and reception functions. Alternatively, a plurality of grid wiring sections 20 can be formed on the substrate 11. In this case, the lengths of the plurality of grid wiring sections 20 can also be different, corresponding to different bandwidths.

[0200] The long side of the grid wiring section 20 is parallel to the Y direction, and its short side is parallel to the X direction. The imaginary outer perimeter 20S of the grid wiring section 20 is composed of eight straight sides 20X1~20X4 and 20Y1~20Y4. Sides 20X1~20X4 are parallel to the X direction, and sides 20Y1~20Y4 are parallel to the Y direction. The imaginary outer perimeter 20S forms a closed shape. In this embodiment, the imaginary outer perimeter 20S forms a circle connecting two rectangles of different sizes. In this specification, "third direction" refers to the direction in which a portion of the imaginary outer perimeter 20S extends. In this embodiment, "third direction" means either the X direction or the Y direction. At least a portion of the imaginary outer perimeter 20S extends along the third direction. Specifically, a portion of the imaginary outer perimeter 20S extends in the X direction, and the remaining portion extends in the Y direction.

[0201] In this specification, "imaginary outer perimeter 20S" refers to the boundary line constituting the outer edge of the grid wiring section 20 from a macroscopic perspective. Furthermore, "a portion of the imaginary outer perimeter 20S" refers to a region within the imaginary outer perimeter 20S that has a length of at least 1 mm. For example, the eight edges 20X1~20X4 and 20Y1~20Y4 each constitute a portion of the imaginary outer perimeter 20S. Additionally, as shown in Figure 22, "a portion of the imaginary outer perimeter 20S" refers to a region that may not exist strictly on the straight line BL constituting the boundary line, but is located within δ = 10 μm relative to the direction orthogonal to the reference straight line BL constituting the boundary line. Furthermore, "at least a portion of the imaginary outer perimeter 20S" can be the entire imaginary outer perimeter 20S, or it can be only a portion of the imaginary outer perimeter 20S.

[0202] As shown in Figure 21, the length L 14 of the long side (Y direction) of the mesh wiring section 20 can be set to a range of 3 mm to 100 mm, for example. The width W 13 of the short side (X direction) of the mesh wiring section 20 (front end portion 20b) can be set to a range of 1 mm to 10 mm, for example. In particular, the mesh wiring section 20 can be a millimeter-wave antenna. When the mesh wiring section 20 is a millimeter-wave antenna, the length L 14 of the mesh wiring section 20 can be 1 mm to 10 mm, and is more preferably selected within the range of 1.5 mm to 5 mm. In addition, Figure 21 shows the shape of the mesh wiring section 20 when it functions as a monopole antenna, but it is not limited to this, and can also be set to the shape of a dipole antenna, a loop antenna, a slot antenna, a microstrip antenna, a patch antenna, etc.

[0203] The mesh wiring section 20 has a base-side portion 20a on the power supply section 40 side and a front-side portion 20b connected to the base-side portion 20a. Both the base-side portion 20a and the front-side portion 20b have a generally rectangular shape when viewed from above. The base-side portion 20a is surrounded by three sides 20Y3, 20X4, and 20Y4. The front-side portion 20b is surrounded by five sides 20X2, 20Y1, 20X1, 20Y2, and 20X3. In this case, the length (distance in the Y direction) of the front-side portion 20b is longer than the length (distance in the Y direction) of the base-side portion 20a. Furthermore, the width (distance in the X direction) of the front-side portion 20b is wider than the width (distance in the X direction) of the base-side portion 20a. The length (length in the Y direction) L15 of the base-side portion 20a can also be set to 0.1 mm or more and 5 mm or less. The width (length in the Y direction) W 14 of the base side portion 20a can also be set to 0.1 mm or more and 5 mm or less. The length (length in the Y direction) L 16 of the front end side portion 20b can also be set to 1 mm or more and 100 mm or less.

[0204] The mesh wiring section 20 consists of metal wires forming a grid shape or a mesh shape, with repeating patterns in the X and Y directions. Specifically, the mesh wiring section 20 has a pattern shape formed by the portion extending in the first direction D1 (first direction wiring 21) and the portion extending in the second direction D2 (second direction wiring 22). In this case, the first direction D1 and the second direction D2 are not parallel to the third direction. That is, the first direction D1 is not parallel to either the X or Y direction, and the second direction D2 is not parallel to either the X or Y direction. Furthermore, in this embodiment, the first direction D1 is inclined at 45° in both the X and Y directions, and the second direction D2 is inclined at 45° in both the X and Y directions. The first direction D1 and the second direction D2 are orthogonal to each other.

[0205] As shown in Figure 22, the grid wiring section 20 includes a plurality of first-direction wirings 21 and a plurality of second-direction wirings 22 connected to the plurality of first-direction wirings 21. Specifically, the plurality of first-direction wirings 21 and the plurality of second-direction wirings 22 are integrated into a grid shape or mesh shape. Each first-direction wiring 21 extends in a first direction D1. Each second-direction wiring 22 extends in a second direction D2 orthogonal to the first-direction wirings 21. The first-direction wirings 21 and second-direction wirings 22 function as antennas by having a length L 14 corresponding to a specified bandwidth (the length of the grid wiring section 20 mentioned above, see Figure 21). Furthermore, each first-direction wiring 21 and each second-direction wiring 22 may intersect at an angle greater than 0° but less than 90°.

[0206] In the grid wiring section 20, a plurality of openings 23 are formed by being surrounded by adjacent first-direction wirings 21 and adjacent second-direction wirings 22. Furthermore, the first-direction wirings 21 and second-direction wirings 22 are arranged at equal intervals. That is, a plurality of first-direction wirings 21 are arranged at equal intervals. The distance P11 between the plurality of first-direction wirings 21 can be set to, for example, a range of 0.01 mm to 1 mm, preferably a range of 0.05 mm to 0.5 mm. Similarly, a plurality of second-direction wirings 22 are arranged at equal intervals. The distance P12 between the plurality of second-direction wirings 22 can be set to, for example, a range of 0.01 mm to 1 mm, preferably a range of 0.05 mm to 0.5 mm. Thus, by arranging a plurality of first-direction wirings 21 and a plurality of second-direction wirings 22 at equal intervals, the size of the openings 23 within the grid wiring section 20 is uniform, making the grid wiring section 20 difficult to see with the naked eye. Furthermore, the distance P11 between the first-direction wirings 21 and the distance P2 between the second-direction wirings 22 are equal. Therefore, each opening 23 is approximately square in top view, and the transparent substrate 11 is exposed from each opening 23. Therefore, by increasing the area of ​​each opening 23, the overall transparency of the wiring substrate 10 can be improved. Additionally, the length L13 of one side of each opening 23 can be set, for example, in the range of 0.01 mm to 1 mm, preferably in the range of 0.05 mm to 0.5 mm. Furthermore, the shape of the openings 23 is preferably uniform in shape and size, except near the imaginary outer perimeter line 20S, but it can also be uniform depending on the location.

[0207] The opening 23 is surrounded by a pair of first-direction wirings 21 and a pair of second-direction wirings 22. Each first-direction wiring 21 and each second-direction wiring 22 intersects at an intersection 24. A plurality of intersections 24 (in this case, four) are located around each opening 23.

[0208] As shown in Figure 22, in this embodiment, in a portion of the imaginary outer perimeter 20S, the ends 21e of each first-direction wiring 21 and the ends 22e of each second-direction wiring 22 are connected by end-connecting wiring 25. Specifically, as shown in Figure 22, on the edge 20Y1 constituting the imaginary outer perimeter 20S, each first-direction wiring 21 has an end 21e, and each second-direction wiring 22 has an end 22e. The ends 21e of each first-direction wiring 21 and the ends 22e of each second-direction wiring 22 are spaced apart from each other in the Y direction (third direction). The end-connecting wiring 25 connects the ends 21e of adjacent first-direction wiring 21 and the ends 22e of second-direction wiring 22. Specifically, the end 21e of the first-direction wiring 21 and the end 22e of the second-direction wiring 22 closer to that end 21e are connected by end-connecting wiring 25. Preferably, a plurality of end-connecting wirings 25 are arranged in a dashed pattern along the Y direction (third direction) on the imaginary outer perimeter 20S. That is, the end-connecting wirings 25 are preferably intermittently present along the Y direction (third direction). The end-connecting wirings 25 extend in a straight line parallel to the Y direction. Alternatively, the end-connecting wirings 25 may be inclined at an angle of more than 0° but less than 10° relative to the Y direction (third direction). The end-connecting wirings 25 may not exist on the straight line BL constituting the imaginary outer perimeter 20S, or they may be located in a region within δ = 10 μm in the X direction relative to the straight line BL.

[0209] As shown in Figure 21, the total length of one side of the imaginary outer perimeter 20S in the Y direction (third direction) is defined as La1. Here, the total length La1 is the length of any one of the sides 20X1~20X4 and 20Y1~20Y4 of the imaginary outer perimeter 20S in the X direction or the Y direction (third direction). In this case, it is the total length of side 20Y1. Also, as shown in Figure 22, on side 20Y1, the total length between the two ends 25e, 25e of the end connecting wiring 25 along the Y direction (third direction) is defined as Lp. In addition, the ends 25e, 25e of the end connecting wiring 25 are respectively aligned with the end 21e of the first direction wiring 21 and the end 22e of the second direction wiring 22. Here, the total length Lp refers to the total length (Lp=∑Lp1) of a portion (edge ​​20Y1) of the imaginary perimeter 20S, obtained by summing the lengths Lp1 between the two ends 25e, 25e of each end connecting wire 25. The length Lp1 of each end connecting wire 25 is the length along the Y direction (third direction) between the center of the linewidth direction of one end 25e of each end connecting wire 25 and the center of the linewidth direction of the other end 25e of each end connecting wire 25. In addition, the length Lp1 of each end connecting wire 25 is also calculated as the length along the Y direction when the end connecting wire 25 is inclined relative to the Y direction (third direction).

[0210] In this case, the relationship 0.1L a1 ≤ Lp ≤ 0.5L a1 holds true between the total length La1 of a portion of the imaginary outer perimeter line 20S and the total length Lp between the two ends 25e, 25e of the end connecting wiring 25 along the Y direction (third direction). That is, the end connecting wiring 25 exists in a region of more than 10% and less than 50% in a portion of the imaginary outer perimeter line 20S (e.g., edge 20Y1). Because the relationship 0.1L a1 ≤ Lp holds true between the total length La1 and the total length Lp, the wiring 21 in the first direction and the wiring 22 in the second direction will not be interrupted in a portion of the imaginary outer perimeter line 20S (e.g., edge 20Y1). This suppresses the degradation of the electrical characteristics of the grid wiring section 20. By ensuring that Lp ≦ 0.5La1 between the total length La1 and the total length Lp, a portion of the imaginary outer perimeter 20S (edge ​​20Y1) that is easily visible to the naked eye can be suppressed, thus limiting the reduction in invisibility to an acceptable range. Furthermore, it is preferable that 0.15La1 ≦ Lp between the total length La1 and the total length Lp, and even more preferably that 0.2La1 ≦ Lp. Moreover, it is preferable that Lp ≦ 0.45La1 between the total length La1 and the total length Lp, and even more preferably that Lp ≦ 0.4La1.

[0211] Furthermore, within the range where the relationship 0.1L a1≦Lp≦0.5L a1 holds, a portion of the end 21e of the first direction wiring 21 and a portion of the end 22e of the second direction wiring 22 may not be connected by the end connection wiring 25. Also, a portion of the end 21e of the first direction wiring 21 and the end 22e of the second direction wiring 22 further away from the end 21e may be connected by the end connection wiring 25. Within a portion of edge 20Y1, there may also be ends 21e and 22e that are not connected by the end connection wiring 25.

[0212] Furthermore, although not illustrated, except for the side 20X4 on the power supply section 40 side, the same applies to all or part of the other sides 20X1, 20X2, 20X3, 20Y2, 20Y3, and 20Y4. The ends 21e of each first-direction wiring 21 and the ends 22e of each second-direction wiring 22 can be connected by end-connecting wiring 25 respectively. In this case, for each side 20X1, 20X2, 20X3, 20Y2, 20Y3, and 20Y4, it is preferable that the relationship 0.1L a1≦Lp≦0.5L a1 holds. Also, the total length of the outer perimeter of the grid wiring section 20 excluding the side 20X4 on the power supply section 40 is set as L at, and the total length between the two ends 25e, 25e of the end-connecting wiring 25 in the entire outer perimeter of the grid wiring section 20 excluding the side 20X4 is set as Lpt. At this point, the optimal relationship is that 0.1L at≦Lpt≦0.5L at holds true.

[0213] Furthermore, regarding only one portion of each of the sides 20X1, 20X2, 20X3, 20Y1, 20Y2, 20Y3, and 20Y4, the end 21e of each first-direction wiring 21 and the end 22e of each second-direction wiring 22 can also be connected by end-connecting wiring 25 respectively. In this case, for this portion, it is preferable that the relationship 0.1L a1≦Lp≦0.5L a1 holds true.

[0214] The linewidth W 15 of the end connection wiring 25 can be set to a range of 0.1 μm to 5.0 μm, or a range of 0.5 μm to 3.0 μm. Furthermore, the linewidth W 15 of the end connection wiring 25 can be thinner than the linewidth W 11 of the first direction wiring 21 and the linewidth W 12 of the second direction wiring 22, as described later. In this case, the linewidth W 15 of the end connection wiring 25 can be set to a range of 0.08 μm to 4.0 μm, or a range of 0.4 μm to 2.4 μm. By making the linewidth W 15 of the end connection wiring 25 thinner than the linewidth W 11 of the first direction wiring 21 and the linewidth W 12 of the second direction wiring 22, the electrical characteristics of the mesh wiring section 20 can be maintained, and the presence of the end connection wiring 25 is less noticeable.

[0215] As shown in Figure 23, the cross-section (cross-section of the second direction D2) perpendicular to the long side direction of each first-direction wiring 21 is approximately rectangular or approximately square. In this case, the cross-sectional shape of the first-direction wiring 21 is approximately uniform along the long side direction (first direction D1). Furthermore, as shown in Figure 24, the cross-section (cross-section of the first direction D1) perpendicular to the long side direction of each second-direction wiring 22 is approximately rectangular or approximately square, and its shape is approximately the same as the cross-sectional shape of the first-direction wiring 21 (cross-section of the second direction D2). In this case, the cross-sectional shape of the second-direction wiring 22 is approximately uniform along the long side direction (second direction D2).

[0216] In this embodiment, the linewidth W11 (length in the second direction D2, see Figure 23) of the first-direction wiring 21 and the linewidth W12 (direction in the first direction D1, see Figure 24) of the second-direction wiring 22 are not particularly limited and can be appropriately selected according to the application. For example, the linewidth W11 of the first-direction wiring 21 can be set to a range of 0.1 μm to 5.0 μm, or it can be set to a range of 0.5 μm to 3.0 μm. Similarly, the linewidth W12 of the second-direction wiring 22 can be set to a range of 0.1 μm to 5.0 μm, or it can be set to a range of 0.5 μm to 3.0 μm. Furthermore, the height H11 (length in the Z direction, see Figure 23) of the first-direction wiring 21 and the height H12 (length in the Z direction, see Figure 24) of the second-direction wiring 22 are not particularly limited and can be appropriately selected according to the application. The height H11 of the first direction wiring 21 and the height H12 of the second direction wiring 22 can be set to, for example, a range of 0.1 μm to 5.0 μm, or 0.2 μm to 2.0 μm.

[0217] The sheet resistance of the mesh wiring section 20 can be 5 Ω / □ or less, or 4 Ω / □ or less. By setting the sheet resistance of the mesh wiring section 20 within the above range, the performance of the mesh wiring section 20 can be maintained. Specifically, the radiation efficiency of the mesh wiring section 20 as an antenna (the proportion of the amount of electrical power emitted by a single unit input to the mesh wiring section 20) can be improved. The sheet resistance (Ω / □) of the mesh wiring section 20 can be obtained as follows: That is, the resistance value R between the two ends of the long side (Y direction) of the mesh wiring section 20 is measured. Then, by dividing this resistance value R by the ratio of the length L 14 to the width W 13 of the mesh wiring section 20 (L 14 / W 13), the sheet resistance value Rs (Ω / □) of the mesh wiring section 20 can be obtained. That is, the sheet resistance value Rs = R × W 13 / L 13.

[0218] Alternatively, although not shown in the figure, a protective layer can be formed by covering the surface of the substrate 11 and the grid wiring portion 20. The protective layer protects the grid wiring portion 20 and is formed by covering at least the grid wiring portion 20 in the substrate 11. As a material for the protective layer, colorless and transparent insulating resins such as copolymers of acrylic resins such as poly(methyl)acrylate and poly(ethyl)acrylate and their modified resins, polyester, polyvinyl alcohol, polyvinyl acetate, polyvinyl acetal, polyvinyl butyral and their copolymers, urethane, epoxy resin, polyamide, and chlorinated polyolefin can be used.

[0219] An undercoat layer (not shown) can be formed between the substrate 11 and the mesh wiring layer 20. The undercoat layer improves the adhesion between the mesh wiring portion 20 and the substrate 11. The undercoat layer can also be applied to approximately the entire surface of the substrate 11. The undercoat layer can be colorless and transparent. Furthermore, the undercoat layer can contain a polymer material. This improves the adhesion between the mesh wiring portion 20 and the substrate 11. Preferably, the undercoat layer contains an acrylic resin or a polyester resin. This further enhances the adhesion to the mesh wiring portion 20. The thickness of the undercoat layer can be set to 0.05 μm or more and 0.5 μm or less. By setting the thickness of the undercoat layer within the above range, the adhesion between the mesh wiring portion 20 and the substrate 11 can be improved, while ensuring the transparency of the wiring substrate 10.

[0220] Referring again to Figure 21, the power supply unit 40 is electrically connected to the grid wiring unit 20. When the wiring board 10 is assembled into the image display device 90 (see Figure 20), the power supply unit 40 is electrically connected to the wireless communication circuit 92 of the image display device 90. Furthermore, by flexibly forming the power supply unit 40, it can also be wound around the side or back of the image display device 90 and electrically connected to the side or back.

[0221] [Manufacturing Method of Wiring Board] Next, referring to FIGS. 25A to 25F, the manufacturing method of the wiring board of this embodiment will be described. FIGS. 25A to 25F are cross-sectional views showing the manufacturing method of the wiring board of this embodiment.

[0222] As shown in Figure 25A, a transparent substrate 11 is prepared.

[0223] Next, a grid wiring portion 20 comprising a plurality of first-direction wirings 21 and a plurality of second-direction wirings 22 connecting the plurality of first-direction wirings 21 is formed on the substrate 11.

[0224] At this point, firstly, as shown in FIG25B, a metal foil 51 is deposited over approximately the entire surface of the substrate 11.

[0225] Next, as shown in Figure 25C, a photocurable insulating resist 52 is applied to approximately the entire surface of the metal foil 51.

[0226] Next, as shown in Figure 25D, an insulating layer 54 is formed by photolithography.

[0227] Next, as shown in FIG25E, the portion of the metal foil 51 not covered by the insulating layer 54 on the surface of the substrate 11 is removed.

[0228] Next, as shown in Figure 25F, the insulating layer 54 is removed.

[0229] Thus, a wiring board 10 having a substrate 11 and a grid wiring section 20 disposed on the substrate 11 can be obtained. In this case, the grid wiring section 20 includes a first direction wiring 21, a second direction wiring 22 and an end connection wiring 25.

[0230] [Function of this implementation] Next, the function of the implementation form containing this structure will be described.

[0231] As shown in Figure 20, the wiring substrate 10 of this embodiment is incorporated into the image display device 90. The image display device 90 includes a display device (display) 91. The display device 91 may be, for example, an organic EL (Electro Luminescence) display device. The display device 91 may include, for example, a metal layer (not shown), a support substrate, a resin substrate, a thin-film transistor (TFT), and an organic EL layer. A touch sensor (not shown) may also be disposed on the display device 91. Furthermore, the display device 91 is not limited to an organic EL display device. For example, the display device 91 may also be other display devices that have their own light-emitting function. The display device 91 may also be a microLED display device that includes microLED elements (light emitters). Moreover, the display device 91 may also be a liquid crystal display device that includes liquid crystal. The wiring substrate 10 is disposed directly or indirectly on the display device 91. Examples of such image display devices 90 include smartphones, tablets, and other mobile terminal devices. The grid wiring section 20 of the wiring board 10 is electrically connected to the wireless communication circuit 92 of the image display device 90 via the power supply section 40. Thus, radio waves of a predetermined frequency can be transmitted and received via the grid wiring section 20, enabling communication using the image display device 90. In this embodiment, an image display device 90 is also provided, comprising such a display device 91 and a wiring board 10 disposed on the display device 91.

[0232] In this embodiment, in a portion of the imaginary outer perimeter line 20S of the grid wiring section 20, the ends 21e of each first-direction wiring 21 and the ends 22e of each second-direction wiring 22 are connected by end-connecting wiring 25. Furthermore, the total length of one side of the imaginary outer perimeter line 20S in the third direction (X or Y direction) is defined as La1, and the total length between the two ends 25e, 25e of the end-connecting wiring 25 in the third direction (X or Y direction) is defined as Lp. At this time, the relationship 0.1La1 ≤ Lp ≤ 0.5La1 holds true. Therefore, even if the intersection point 24 of the imaginary outer perimeter line 20S and the grid wiring section 20 is not identical, the ends 21e of each first-direction wiring 21 and the ends 22e of each second-direction wiring 22 will not be interrupted. This suppresses the degradation of the electrical characteristics of the outer perimeter of the grid wiring section 20. On the other hand, if it is assumed that the end 21e of the first direction wiring 21 and the end 22e of the second direction wiring 22 are not connected and are interrupted at the periphery of the grid wiring section 20, there is a risk of electromagnetic wave radiation from that section, generating noise of extra frequencies.

[0233] Furthermore, according to this embodiment, the end connection wiring 25 is not provided on the entire imaginary outer perimeter line 20S. Therefore, the end connection wiring 25, which faces a direction different from that of each first direction wiring 21 and each second direction wiring 22, is inconspicuous. As a result, the outer perimeter of the grid wiring portion 20 is not easily visible to the naked eye, and the observer cannot discern the existence of the grid wiring portion 20.

[0234] Thus, according to this embodiment, the electrical characteristics of the mesh wiring section 20 can be improved, and the reduction in the invisibility of the mesh wiring section 20 can be suppressed.

[0235] Furthermore, according to this embodiment, a plurality of end-connection wires 25 are arranged in a dotted line shape along a third direction (X or Y direction) around the outer periphery of the grid wiring portion 20. This ensures that the end-connection wires 25 are uniformly arranged along the third direction (X or Y direction). As a result, the end-connection wires 25 are inconspicuous around the outer periphery of the grid wiring portion 20 and are not easily visible to the naked eye.

[0236] Furthermore, according to this embodiment, the wiring board 11 includes a transparent substrate 11 and a grid wiring portion 20 disposed on the substrate 11. Since the grid wiring portion 20 has a grid pattern of conductor portions forming opaque conductive layers and multiple openings, the transparency of the wiring board 10 is ensured. Therefore, when the wiring board 10 is disposed on the display device 91, the display device 91 can be seen from the openings 23 of the grid wiring portion 20, without obstructing the visibility of the display device 91.

[0237] [Example of variation] Next, a variation of the wiring board in this embodiment will be described.

[0238] (Example of the first variation) Figures 26 and 27 show the first variation of the wiring board. The variation shown in Figures 26 and 27 differs in the configuration of the end connection wiring 25; other configurations are largely the same as the embodiments shown in Figures 20 to 25F. In Figures 26 and 27, the same symbols are used for the parts that are the same as those shown in Figures 1 to 25F, and detailed descriptions are omitted.

[0239] In the wiring board 10 shown in Figures 26 and 27, in the edge 20Y1 that forms the imaginary outer perimeter line 20S, the ends 21e of each first-direction wiring 21 and the ends 22e of each second-direction wiring 22 are connected by end-connecting wiring 25. In this case, the end-connecting wiring 25 does not extend in a straight line.

[0240] As shown in Figure 26, the end connection wiring 25 can also have a zigzag shape. Specifically, the end connection wiring 25 can also be V-shaped when viewed from above. The end connection wiring 25 is located inside the grid wiring portion 20 on the outer edge 20Y1. The end connection wiring 25 includes a first wiring portion 25a and a second wiring portion 25b. The first wiring portion 25a can be parallel to the first direction wiring 21. The second wiring portion 25b can be parallel to the second direction wiring 22. Thus, by having a zigzag shape, the extension direction of the end connection wiring 25 is close to the extension direction of the first direction wiring 21 or the second direction wiring 22, making the presence of the end connection wiring 25 less noticeable.

[0241] As shown in Figure 27, the end connection wiring 25 can also have a curved shape. Specifically, the end connection wiring 25 can also have a semi-circular or semi-elliptical shape when viewed from above. The end connection wiring 25 is located inside the grid wiring portion 20 on the outer edge 20Y1. Thus, by having a curved shape, the end connection wiring 25 extends in various directions, making its presence less noticeable.

[0242] In this variation, the relationship 0.1L a1 ≤ Lp ≤ 0.5L a1 also holds true between the total length La1 (Fig. 21) of one side of the imaginary outer perimeter 20S and the total length Lp between the two ends 25e, 25e of the end connection wiring 25 along the Y direction (third direction). In this case, the length Lp1 of each end connection wiring 25 refers to the length along the Y direction (third direction) between the center of the linewidth direction of one end 25e of each end connection wiring 25 and the center of the linewidth direction of the other end 25e of each end connection wiring 25.

[0243] (Second variation example) Figures 28 and 29 show a second variation of the wiring board. The difference between the variation shown in Figures 28 and 29 is that a dummy wiring section 30 is provided around the grid wiring section 20; the other configurations are largely the same as those shown in Figures 20 to 27. In Figures 28 and 29, the parts that are the same as those shown in Figures 20 to 27 are labeled with the same symbols, and detailed descriptions are omitted.

[0244] In the wiring board 10 shown in Figure 28, a dummy wiring section 30 is provided around the grid wiring section 20. This dummy wiring section 30 is different from the grid wiring section 20 and does not actually function as an antenna.

[0245] As shown in Figure 29, the dummy wiring section 30 includes a plurality of first-direction dummy wirings 31 and a plurality of second-direction dummy wirings 32. Each first-direction dummy wiring 31 and each second-direction dummy wiring 32 is electrically independent of the grid wiring section 20 (first-direction wirings 21 and second-direction wirings 22). Furthermore, the first-direction dummy wirings 31 and second-direction dummy wirings 32 are regularly arranged throughout the entire dummy wiring section 30. Each first-direction dummy wiring 31 is parallel to the first direction D1 and located on the extension line of each first-direction wiring 21. Each second-direction dummy wiring 32 is parallel to the second direction D2 and located on the extension line of each second-direction wiring 22. The plurality of first-direction dummy wirings 31 are spaced apart from each other in the planar direction and protrude from the substrate 11. A plurality of second-direction dummy wirings 32 are spaced apart from each other in the planar direction and protrude from the substrate 11. Each first-direction dummy wiring 31 and each second-direction dummy wiring 32 is electrically independent of the grid wiring section 20, the power supply section 40, other first-direction dummy wirings 31, and other second-direction dummy wirings 32. Each first-direction dummy wiring 31 and each second-direction dummy wiring 32 is straight when viewed from above. In addition, the dummy wiring section 30 may also have additional dummy wirings extending in the same direction as the end connection wiring 25. These additional dummy wirings may also extend in a third direction (X direction or Y direction). Alternatively, the additional dummy wirings may also extend in the first direction D1 or the second direction D2.

[0246] In this case, the dummy wirings 31 in the first direction and the dummy wirings 32 in the second direction may not intersect each other. That is, the dummy wiring portion 30 has a shape that corresponds to the missing area of ​​the intersection point 24 of the grid wiring portion 20. In this way, the difference between the grid wiring portion 20 and the dummy wiring portion 30 can not be easily distinguished by visual inspection, and the grid wiring portion 20 disposed on the substrate 11 can not be easily seen. The aperture ratio of the dummy wiring portion 30 may be the same as or different from the aperture ratio of the grid wiring portion 20, but it is preferable to be close to the aperture ratio of the grid wiring portion 20.

[0247] Thus, by arranging a virtual wiring section 30 that is electrically independent of the mesh wiring section 20 around the mesh wiring section 20, the outer edge of the mesh wiring section 20 can be made inconspicuous. As a result, the mesh wiring section 20 is not easily seen on the surface of the image display device 90, and the user of the image display device 90 cannot easily identify the mesh wiring section 20 with the naked eye.

[0248] (Example 3) Figures 30 and 31 show a third variation of the wiring board. The difference in the variation shown in Figures 30 and 31 is that a plurality of dummy wiring sections 30A and 30B with different opening ratios are provided around the grid wiring section 20. Other configurations are largely the same as those shown in Figures 20 to 29. In Figures 30 and 31, the same symbols are used for the parts with the same shape as those shown in Figures 20 to 29, and detailed descriptions are omitted.

[0249] In the wiring board 10 shown in Figure 30, a plurality of (in this case, two) dummy wiring sections 30A and 30B (first dummy wiring section 30A and second dummy wiring section 30B) with different aperture ratios are provided around the grid wiring section 20. Specifically, the first dummy wiring section 30A is arranged around the grid wiring section 20, and the second dummy wiring section 30B is arranged around the first dummy wiring section 30A. Furthermore, the configuration of the first dummy wiring section 30A can be the same as that of the dummy wiring section 30 shown in Figures 28 and 29. The dummy wiring sections 30A and 30B are different from the grid wiring section 20 and do not actually function as antennas.

[0250] As shown in Figure 31, each of the dummy wiring sections 30A and 30B includes a plurality of first-direction dummy wirings 31 and a plurality of second-direction dummy wirings 32. Each first-direction dummy wiring 31 is parallel to the first direction D1 and located on the extension line of each first-direction wiring 21. Each second-direction dummy wiring 32 is parallel to the second direction D2 and located on the extension line of each second-direction wiring 22. When viewed from above, each first-direction dummy wiring 31 and each second-direction dummy wiring 32 is a straight line. Therefore, the difference between the grid wiring section 20 and the first dummy wiring section 30A, and the difference between the first dummy wiring section 30A and the second dummy wiring section 30B, is not easily discernible by visual inspection, and the grid wiring section 20 disposed on the substrate 11 is not easily visible.

[0251] In this case, the length of the first-direction dummy wiring 31 of the second dummy wiring section 30B is shorter than the length of the first-direction dummy wiring 31 of the first dummy wiring section 30A. Similarly, the length of the second-direction dummy wiring 32 of the second dummy wiring section 30B is shorter than the length of the second-direction dummy wiring 32 of the first dummy wiring section 30A. Therefore, the opening ratio of the first dummy wiring section 30A is greater than the opening ratio of the grid wiring section 20, and the opening ratio of the first dummy wiring section 30A is greater than the opening ratio of the second dummy wiring section 30B. Furthermore, three or more dummy wiring sections with different opening ratios can also be provided. In this case, it is preferable that the opening ratio of each dummy wiring section gradually increases from the point closer to the grid wiring section 20 towards the point farther away from the grid wiring section 20.

[0252] Thus, by configuring dummy wiring sections 30A and 30B that are electrically independent of the grid wiring section 20, the outer edge of the grid wiring section 20 can be made less noticeable. As a result, the grid wiring section 20 is not easily visible on the surface of the image display device 90, and the user of the image display device 90 cannot easily identify the grid wiring section 20 with the naked eye.

[0253] (Third Implementation) Next, referring to Figures 32 to 39B, the third embodiment will be described. Figures 32 to 39B show the third embodiment. In Figures 32 to 39B, the same symbols are used for the parts that are the same as those in the first embodiment shown in Figures 1 to 19, or the second embodiment shown in Figures 20 to 31, and detailed descriptions are omitted.

[0254] The wiring board 10 of this embodiment includes a transparent substrate 11 and a grid wiring portion 20 disposed on the substrate 11. The grid wiring portion 20 includes a plurality of closed patterns 26 arranged in a regular pattern. Each closed pattern 26 is surrounded by wirings 21, 22 in two or more directions. The closed patterns 26 located on the outer periphery of the grid wiring portion 20 (on the imaginary outer periphery line 20S) have a shape that enlarges or reduces a portion or all of the closed patterns 26 located outside the outer periphery of the grid wiring portion 20 (on the imaginary outer periphery line 20S). Thereby, the closed patterns 26 located on the outer periphery of the grid wiring portion 20 are located inside the outer periphery of the grid wiring portion 20 (on the imaginary outer periphery line 20S).

[0255] As shown in Figure 32, the grid wiring section 20 includes a plurality of regularly arranged closed patterns 26. In this case, each closed pattern 26 is a polygon, more specifically, a square or parallelogram. Each closed pattern 26 is composed of a pair of first-direction wirings 21 and a pair of second-direction wirings 22 arranged to surround the opening 23. In this specification, "closed pattern" refers to a closed pattern on the substrate 11 surrounded by wirings including straight lines and / or curves. The grid wiring section 20 may be composed of one type of closed pattern 26 or a plurality of closed patterns 26.

[0256] As shown in Figure 32, on the edge 20Y1 constituting the imaginary outer perimeter 20S, the closed shape 26 closest to the edge 20Y1 (hereinafter also referred to as the outer perimeter closed shape 26A) has a different shape from the closed shapes 26 in other rows (hereinafter also referred to as the reference closed shape 26B). That is, the outer perimeter closed shape 26A has a shape that is a partial reduction of the shape of the reference closed shape 26B. Specifically, one pair of edges 26s, 26s in the outer perimeter closed shape 26A located on the side closest to the edge 20Y1 is deformed toward the inside of the grid wiring portion 20. The intersection point 24p of the pair of edges 26s, 26s exists on the edge 20Y1 constituting the imaginary outer perimeter 20S. In addition, the intersection point 24p may also be located in a region within δ=10 μm in the X direction relative to the edge 20Y1.

[0257] In Figure 32, it is assumed that the closed figure 26 closest to edge 20Y1 is the reference closed figure 26B (refer to the imaginary line in Figure 32). At this time, when the intersection point 24p of the reference closed figure 26B closest to edge 20Y1 is located outside of edge 20Y1, the intersection point 24p can also be moved to edge 20Y1, and a part of the reference closed figure 26B can be reduced to set as the outer peripheral closed figure 26A.

[0258] Other configurations of the wiring board 10 may be the same as those in the first embodiment described above.

[0259] In this embodiment, dummy wiring sections 30, 30A, and 30B, which are electrically independent of the grid wiring section 20, can also be provided around the grid wiring section 20 (see Figures 28 to 31).

[0260] In this embodiment, the outer peripheral closed pattern 26A located on the outer periphery of the grid wiring portion 20 has a shape that is a reduction of a portion of the reference closed pattern 26B located outside the outer periphery of the grid wiring portion 20. In this case, the first direction wirings 21 and the second direction wirings 22 are not interrupted on the outer periphery of the grid wiring portion 20. This suppresses the reduction of electrical characteristics on the outer periphery of the grid wiring portion 20. Furthermore, the outer peripheral closed pattern 26A located on the outer periphery of the grid wiring portion 20 has a shape close to that of the reference closed pattern 26B. This makes it difficult for an observer to see the outer periphery of the grid wiring portion 20 with the naked eye, and prevents the observer from recognizing the existence of the grid wiring portion 20.

[0261] [Example of variation] Next, a variation of the wiring board in this embodiment will be described.

[0262] (Example of the first variation) Figure 33 shows the first variation of the wiring board. In Figure 33, the parts with the same shape as those shown in Figure 32 are labeled with the same symbols, and detailed descriptions are omitted.

[0263] In Figure 33, the grid wiring section 20 includes a plurality of regularly arranged closed shapes 26. Among the edges 20Y1 constituting the imaginary outer perimeter 20S, the outer perimeter closed shape 26A closest to edge 20Y1 has a different shape from the reference closed shapes 26B in other rows. That is, the outer perimeter closed shape 26A has a shape that is a partial enlargement of the shape of the reference closed shape 26B. Specifically, a pair of edges 26s, 26s in the outer perimeter closed shape 26A located near edge 20Y1 are deformed towards the outside of the grid wiring section 20. The intersection point 24p of the pair of edges 26s, 26s exists on the edge 20Y1 constituting the imaginary outer perimeter 20S. The intersection point 24p may also be located in a region within δ = 10 μm in the X direction relative to edge 20Y1.

[0264] In Figure 33, it is assumed that the closed figure 26 closest to edge 20Y1 is the reference closed figure 26B (refer to the imaginary line in Figure 33). At this time, when the intersection point 24p of the reference closed figure 26B closest to edge 20Y1 is located inside edge 20Y1, the intersection point 24p can also be moved to edge 20Y1, and a part of the reference closed figure 26B can be enlarged and set as the outer peripheral closed figure 26A.

[0265] (Second variation example) Figure 34 shows a second variation of the wiring board. In Figure 34, the parts with the same shape as those shown in Figure 32 are labeled with the same symbols, and detailed descriptions are omitted.

[0266] In Figure 34, the grid wiring section 20 includes a plurality of regularly arranged closed shapes 26. Among the edges 20Y1 constituting the imaginary outer perimeter line 20S, the outer perimeter closed shape 26A closest to edge 20Y1 has a different shape from the reference closed shapes 26B in other rows. That is, the outer perimeter closed shape 26A has a shape that is a reduction of the shape of the reference closed shape 26B. Specifically, the entire outer perimeter closed shape 26A closest to edge 20Y1 is reduced in the X direction relative to the reference closed shape 26B. One intersection point 24p of the outer perimeter closed shape 26A exists on the edge 20Y1 constituting the imaginary outer perimeter line 20S. The intersection point 24p may also be located within a region of 10 μm or less in the X direction relative to edge 20Y1. Furthermore, one pair of edges 26s1, 26s1 of the second outer perimeter closed shape 26A closest to edge 20Y1 is deformed towards the inner side of the grid wiring section 20.

[0267] In Figure 34, it is assumed that the closed figure 26 closest to edge 20Y1 is the reference closed figure 26B (refer to the imaginary line in Figure 34). At this time, when the intersection point 24p of the reference closed figure 26B closest to edge 20Y1 is located outside of edge 20Y1, the intersection point 24p can also be moved to edge 20Y1, and the entire reference closed figure 26B can be reduced to set as the outer peripheral closed figure 26A.

[0268] (Example 3) Figure 35 shows a third variation of the wiring board. In Figure 35, the parts with the same shape as those shown in Figure 32 are labeled with the same symbols, and detailed descriptions are omitted.

[0269] In Figure 35, the grid wiring section 20 includes a plurality of closed shapes 26 arranged in a regular pattern. Among the edges 20Y1 constituting the imaginary outer perimeter line 20S, the outer perimeter closed shape 26A closest to edge 20Y1 has a different shape from the reference closed shapes 26B in other rows. That is, the outer perimeter closed shape 26A has a shape that is an enlargement of the entire shape of the reference closed shape 26B. Specifically, the entire outer perimeter closed shape 26A closest to edge 20Y1 is enlarged relative to the reference closed shape 26B in the X direction. One intersection point 24p of the outer perimeter closed shape 26A exists on the edge 20Y1 constituting the imaginary outer perimeter line 20S. The intersection point 24p may also be located within a region of 10 μm or less in the X direction relative to edge 20Y1. Furthermore, one pair of edges 26s1, 26s1 of the second outer perimeter closed shape 26A closest to edge 20Y1 is deformed outwards from the grid wiring section 20.

[0270] In Figure 35, it is assumed that the closed figure 26 closest to edge 20Y1 is the reference closed figure 26B (refer to the imaginary line in Figure 35). At this time, when the intersection point 24p of the reference closed figure 26B closest to edge 20Y1 is located inside edge 20Y1, the intersection point 24p can also be moved to edge 20Y1, and the entire reference closed figure 26B can be enlarged and set as the outer peripheral closed figure 26A.

[0271] (Example 4) Figures 36 and 37 show a fourth variation of the wiring board. In Figures 36 and 37, the parts with the same shape as those shown in Figure 32 are labeled with the same symbols, and detailed descriptions are omitted.

[0272] In Figures 36 and 37, the grid wiring section 20 includes a plurality of closed shapes 26 arranged in a regular pattern. In the edge 20Y1 constituting the imaginary outer perimeter 20S, the two (two rows) outer perimeter closed shapes 26A counting from the outer perimeter side (imaginary outer perimeter 20S side) have shapes different from the reference closed shapes 26B in other rows. That is, the two outer perimeter closed shapes 26A counting from the outer perimeter side have a shape that is either reduced (Figure 36) or enlarged (Figure 37) of the entire shape of the reference closed shape 26B. Specifically, the two rows of outer perimeter closed shapes 26A counting from the edge 20Y1 side are reduced (Figure 36) or enlarged (Figure 37) in the X direction relative to the reference closed shape 26B. One intersection point 24p of the outer perimeter closed shapes 26A closest to the edge 20Y1 exists on the edge 20Y1 constituting the imaginary outer perimeter 20S. The intersection point 24p can also be located in a region within 10 μm in the X direction relative to edge 20Y1. In addition, one of the outer periphery closed shapes 26A near edge 20Y1, the opposite edges 26s1, 26s1 are deformed towards the inner side (Fig. 36) or the outer side (Fig. 37) of the grid wiring portion 20.

[0273] In Figures 36 and 37, it is assumed that the closed figure 26 closest to edge 20Y1 is the reference closed figure 26B (refer to the imaginary lines in Figures 36 and 37). In this case, when the intersection point 24p of the reference closed figure 26B closest to edge 20Y1 is located outside of edge 20Y1 (Figure 36), this intersection point 24p is moved onto edge 20Y1. This also allows the entire first and second outer peripheral closed figures 26A counted from the outer perimeter to be reduced in size. Alternatively, when the intersection point 24p of the reference closed figure 26B closest to edge 20Y1 is located inside of edge 20Y1 (Figure 37), this intersection point 24p is moved onto edge 20Y1. This also allows the entire first and second outer peripheral closed figures 26A counted from the outer perimeter to be enlarged.

[0274] Furthermore, in this variation, the three to five outer peripheral closed patterns 26A counting from the outer periphery can have a shape that is a reduction or enlargement of the entire reference closed pattern 26B. Thus, by reducing or enlarging two or more closed patterns 26 counting from the outer periphery, the deformation of each closed pattern 26 can be suppressed. This suppresses the decrease in the invisibility of the grid wiring portion 20, making it difficult for an observer to identify its presence. Moreover, by reducing or enlarging five or fewer closed patterns 26 counting from the outer periphery, the number of outer peripheral closed patterns 26A with shapes different from the reference closed pattern 26B can be suppressed, thereby suppressing the reduction in the electrical characteristics of the grid wiring portion 20.

[0275] (5th variation example) Figures 38A and 38B show the fifth variation of the wiring board. In Figures 38A and 38B, the parts with the same shape as those shown in Figure 32 are labeled with the same symbols, and detailed descriptions are omitted.

[0276] In Figures 38A and 38B, the grid wiring section 20 includes a plurality of regularly arranged closed shapes 26. Each closed shape 26 is a rectangle or a square. In this case, each first-direction wiring 21 extends parallel to the Y-direction, and each second-direction wiring 22 extends parallel to the X-direction. Among the edges 20Y1 constituting the imaginary outer perimeter 20S, the shape of the row of outer perimeter closed shapes 26A closest to the edge 20Y1 is different from the shape of the reference closed shapes 26B in other rows. That is, the outer perimeter closed shape 26A has a shape that is either reduced in size (Figure 38A) or enlarged in size (Figure 38B) compared to the shape of the reference closed shapes 26B. Specifically, the first-direction wiring 21 located on the side of the outer perimeter closed shape 26A closest to the edge 20Y1 exists on the edge 20Y1 constituting the imaginary outer perimeter 20A. In addition, the first-direction wiring 21 may also be located in a region within 10 μm in the X-direction relative to the edge 20Y1.

[0277] In Figures 38A and 38B, it is assumed that the closed figure 26 closest to edge 20Y1 is the reference closed figure 26B (refer to the imaginary lines in Figures 38A and 38B). In this case, when the first direction line 21 closest to edge 20Y1 is located outside of edge 20Y1 (Figure 38A), the first direction line 21 can be moved onto edge 20Y1, and the entire reference closed figure 26B containing the first direction line 21 can be reduced in size to form the outer peripheral closed figure 26A. Alternatively, when the first direction line 21 closest to edge 20Y1 is located inside edge 20Y1 (Figure 38B), the first direction line 21 can be moved onto edge 20Y1, and the entire reference closed figure 26B containing the first direction line 21 can be enlarged to form the outer peripheral closed figure 26A.

[0278] (Sixth variation example) Figures 39A and 39B show a sixth variation of the wiring board. In Figures 39A and 39B, the parts with the same shape as those shown in Figure 32 are labeled with the same symbols, and detailed descriptions are omitted.

[0279] In Figures 39A and 39B, the grid wiring section 20 includes a plurality of regularly arranged closed shapes 26. Each closed shape 26 is a polygon, more specifically a concave polygon with 12 sides. In this case, each closed shape 26 is surrounded by 12 wirings 21w. Among the edges 20Y1 constituting the imaginary outer perimeter 20S, the shape of the row of outer perimeter closed shapes 26A closest to the edge 20Y1 differs from the shape of the reference closed shapes 26B in other rows. That is, the outer perimeter closed shapes 26A have a shape that is either reduced (Figure 39A) or enlarged (Figure 39B) of the entire shape of the reference closed shapes 26B. Specifically, the two intersection points 24p of the outer perimeter closed shapes 26A exist on the edge 20Y1 constituting the imaginary outer perimeter 20S. Alternatively, the intersection points 24p may also be located in areas within 10 μm in the X direction relative to the edge 20Y1.

[0280] In Figures 39A and 39B, it is assumed that the closed figure 26 closest to edge 20Y1 is the reference closed figure 26B (refer to the imaginary lines in Figures 39A and 39B). In this case, when the intersection point 24p closest to edge 20Y1 is located outside edge 20Y1 (Figure 39A), the intersection point 24p can be moved to edge 20Y1, and the entire reference closed figure 26B containing the intersection point 24p can be reduced in size to become the outer peripheral closed figure 26A. Alternatively, when the intersection point 24p closest to edge 20Y1 is located inside edge 20Y1 (Figure 39B), the intersection point 24p can be moved to edge 20Y1, and the entire reference closed figure 26B containing the intersection point 24p can be enlarged to become the outer peripheral closed figure 26A.

[0281] (Fourth Implementation) Next, referring to FIG40, the fourth embodiment will be described. FIG40 is a view of the outer periphery of the grid wiring section of the fourth embodiment. In FIG40, the same symbols are used for the parts that are the same as those shown in FIG1 to FIG19 in the first embodiment, FIG20 to FIG31 in the second embodiment, or FIG32 to FIG39B in the third embodiment, and detailed descriptions are omitted.

[0282] The wiring substrate 10 of this embodiment includes a transparent substrate 11 and a grid wiring portion 20 disposed on the substrate 11. The grid wiring portion 20 includes a plurality of irregularly arranged closed patterns 26. Each closed pattern 26 is surrounded by wiring 21w in two or more directions. The closed patterns 26 located on the outer periphery (imaginary outer periphery line 20S) of the grid wiring portion 20 are located inside the outer periphery (imaginary outer periphery line 20S) of the grid wiring portion 20.

[0283] As shown in Figure 40, the grid wiring section 20 includes a plurality of irregularly arranged closed shapes 26. In this case, each closed shape 26 is a polygon, and more specifically, each is an irregular quadrilateral. The closed shape 26 may also be a polygon other than a quadrilateral. Each closed shape 26 is composed of a plurality of wirings 21w arranged to surround the opening 23.

[0284] As shown in Figure 40, on the edge 20Y1 that constitutes the imaginary outer perimeter 20S, the intersection point 24p of the closed figure 26 closest to the edge 20Y1 exists on the straight line BL that constitutes the imaginary outer perimeter 20S. Alternatively, the intersection point 24p can also be located in a region within δ=10 μm in the X direction relative to the edge 20Y1.

[0285] Other configurations of the wiring board 10 may be the same as those in the first and second embodiments described above.

[0286] In this embodiment, the closed pattern located on the outer periphery of the grid wiring portion 20 is situated inside the outer periphery of the grid wiring portion 20. In this case, the wiring 21w will not be interrupted on the outer periphery of the grid wiring portion 20. This suppresses the degradation of the electrical characteristics on the outer periphery of the grid wiring portion 20. Furthermore, the plurality of closed patterns 26 located on the outer periphery of the grid wiring portion 20 have irregular shapes. This makes it difficult for an observer to visually perceive the outer periphery of the grid wiring portion 20, preventing the observer from recognizing its existence.

[0287] The multiple constituent elements disclosed in the above embodiments and variations can be appropriately combined as needed. Alternatively, some constituent elements can be deleted from all the constituent elements shown in the above embodiments and variations.

[0288] 10: Wiring board 11:Substrate 11a: Page 1 11b: Page 2 20: Mesh Wiring Section 20a: Basement side portion 20b: Front side portion 20S: Imaginary peripheral line 20X1~20X4: Edge 20Y1~20Y4: Side 21: Wiring in the first direction 21e: End 21w: Wiring 22: Wiring in the second direction 22e: End 23: Opening 24: Intersection 24p: Intersection 25: End connection wiring 25a: Wiring Section 1 25b: Second Wiring Section 25e: Both ends 26: Closed figures 26A: Peripheral closed figure 26B: Baseline Closed Figure 26s:side 26s1:side 30: Dummy Wiring Department 30A: Dummy Wiring Section 30a: Dummy Wiring 30a1: Dummy Wiring 30a2: Dummy Wiring 30B: Dummy Wiring Section 31: Dummy wiring in direction 1 31a: Part 1 31a1: Part 1 31a2: Part 1 32: Dummy wiring in the second direction 32a: Part 2 32a1: Part 2 32a2: Part 2 40: Power Supply Department 41: First end 42: Second end 45: First notch 46:Breaking part 50: Grounding part 51:Metal foil 52: Light-curing insulating and corrosion-resistant agent 54: Insulation layer 55: Second notch 60: Image display device 61: Display device 62: Shell 63: Communication Module 64: Luminous surface 70: Laminates for image display devices 75: Glass cover plate 80A: Module 85: Power supply line 85a: Substrate 85b: Metal wiring section 85c: Anisotropic conductive film 85d: Conductive particles 86: Third gap 90: Image display device 91: Display device 92: Circuits for wireless communication 95: First transparent adhesive layer 96: Second transparent adhesive layer 900:OCA sheet 910: Release film 920: OCA layer B1: Interface B2: Interface B3: Interface BL: Straight Line D1: Direction 1 D2: Second Direction D 20b: Distance H 1: Height H 2: Height H 11: Height H 12: Height L1~L9: Length L11~L16: Length L a: Length L a1: Total length L b: Length Lp1: Length P1~P5: Spacing P 11: Spacing P 12: Spacing T1: Thickness T3: Thickness T4: Thickness T5: Thickness T 11: Thickness W 1: Line width W 2: Line width W 6: Width W 7: Width W 8: Width W 11: Line width W 12: Line width W 13: Width W 14: Width W 15: Line width W a: width W b: width δ: Epidermal depth

Claims

1. A wiring substrate comprising: a substrate including a first surface and a second surface opposite to the first surface; two or more grid wiring sections spaced apart from each other on the first surface of the substrate; and two or more power supply sections electrically connected to the grid wiring sections; wherein the wiring substrate has an electromagnetic wave transceiver function, the substrate is transparent, the grid wiring sections serve as antennas, each of the grid wiring sections is individually connected to each power supply section, and the power supply section has two or more first notches extending linearly.

2. The wiring substrate according to claim 1, wherein the wiring substrate has a millimeter wave transceiver function, and the grid wiring portion is configured as an array antenna.

3. A wiring substrate as claimed in claim 1, wherein the power supply portion has a first end portion connected to the grid wiring portion and a second end portion opposite to the first end portion, and the first notch portion extends from the second end portion in a direction from the second end portion toward the first end portion.

4. The wiring board according to claim 1, further comprising a ground portion disposed on the first surface of the board, wherein the ground portion has two or more second notches extending linearly.

5. The wiring board according to claim 1, wherein a dividing portion is formed in the first notch portion to divide the first notch portion.

6. The wiring substrate of claim 1, wherein the distance between the grid wiring portions is not less than 1 mm and not more than 5 mm.

7. The wiring substrate according to claim 1, wherein a dummy wiring portion electrically independent of the mesh wiring portion is provided around the mesh wiring portion.

8. The wiring substrate according to claim 7, wherein two or more dummy wiring portions are provided, and the aperture ratio of the grid wiring portion and the dummy wiring portion gradually increases from the grid wiring portion toward the dummy wiring portion farther away from the grid wiring portion.

9. A module comprising: the wiring substrate according to any one of claims 1 to 8; and a power supply line electrically connected to the power supply portion of the wiring substrate.

10. A module as claimed in claim 9, wherein the power supply line has a substrate and a metal wiring portion laminated on the substrate, and two or more third notch portions extending linearly are formed in the metal wiring portion, the width of the third notch portion is less than the width of the first notch portion, and when viewed from above, the third notch portion extends along the first notch portion and overlaps with the first notch portion.

11. The module of claim 9, wherein the power supply line is electrically connected to the power supply portion via an anisotropic conductive film containing conductive particles, and the width of the first notch is not less than 0.5 times and not more than 1 times the average particle diameter of the conductive particles.

12. An image display device comprising: the module according to claim 9; and a display device laminated on the wiring substrate of the module.

13. A wiring substrate, comprising: a transparent substrate; and a grid wiring portion, which is arranged on the substrate and has conductivity; and the grid wiring portion includes two or more first-direction wirings and two or more second-direction wirings, the first-direction wirings are parallel to the first direction, the second-direction wirings are parallel to the second direction, when the outer periphery of the area where the grid wiring portion is arranged is set as an imaginary outer periphery, the imaginary outer periphery is composed of two or more straight edges, and the imaginary outer periphery forms a closed figure, at least a portion of the imaginary outer periphery extends along a third direction, the first direction and the second direction are non-parallel to the third direction, in a portion of the imaginary outer periphery, an end portion of each first-direction wiring and an end portion of each second-direction wiring are connected by an end connecting wiring, the total length of one side of the imaginary outer periphery in the third direction is set as L a1, and the total length L When the total length between both ends of the end connection wiring included in a1 is defined as Lp, the relationship of 0.1L a1≦Lp≦0.5L a1 holds.

14. The wiring board according to claim 13, wherein two or more of the end connection wirings are arranged in a dotted line along the third direction.

15. The wiring substrate according to claim 13, wherein the end connecting wiring extends linearly.

16. The wiring substrate according to claim 13, wherein the end connection wiring has a zigzag shape or a curved shape.

17. The wiring substrate according to claim 13, wherein the line width of the end connection wiring is narrower than the line width of the first direction wiring and the line width of the second direction wiring.

18. The wiring board according to claim 13, wherein the distance between the wirings in the first direction and the distance between the wirings in the second direction are not less than 0.01 mm and not more than 1 mm.

19. The wiring substrate according to claim 13, wherein the line width of the first-direction wiring and the line width of the second-direction wiring are not less than 0.1 μm and not more than 5.0 μm.

20. The wiring substrate of claim 13, wherein a dummy wiring portion electrically independent of the grid wiring portion is provided around the grid wiring portion.

21. The wiring substrate according to claim 13, wherein the mesh wiring portion functions as a millimeter wave antenna.

22. A wiring substrate comprising: a transparent substrate; and a conductive grid wiring portion disposed on the substrate; wherein the grid wiring portion comprises two or more regularly arranged closed figures, each closed figure being surrounded by wiring in two or more directions, and the closed figures located on the outer periphery of the grid wiring portion have a shape that is an enlargement or reduction of a portion or all of the closed figures located outside the outer periphery of the grid wiring portion.

23. The wiring substrate of claim 22, wherein two to five of the closed figures counted from the outer periphery of the grid wiring portion have a shape obtained by enlarging or reducing the entire closed figures located outside the outer periphery of the grid wiring portion.

24. The wiring board of claim 22, wherein the closed figure is a polygon.

25. The wiring substrate of claim 22, wherein the line width of the wiring is not less than 0.1 μm and not more than 5.0 μm.

26. The wiring substrate of claim 22, wherein a dummy wiring portion electrically independent of the grid wiring portion is provided around the grid wiring portion.

27. The wiring substrate according to claim 22, wherein the mesh wiring portion functions as a millimeter wave antenna.

28. A wiring substrate comprising: a transparent substrate; and a conductive grid wiring portion disposed on the substrate; wherein the grid wiring portion comprises two or more irregularly disposed closed figures, each closed figure being surrounded by wiring in two or more directions, and the closed figures located at the periphery of the grid wiring portion being located inside the periphery of the grid wiring portion.

29. The wiring substrate of claim 28, wherein the line width of the wiring is not less than 0.1 μm and not more than 5.0 μm.

30. The wiring substrate of claim 28, wherein a dummy wiring portion electrically independent of the grid wiring portion is provided around the grid wiring portion.

31. The wiring substrate of claim 28, wherein the mesh wiring portion functions as a millimeter wave antenna.

32. An image display device comprising: the wiring substrate according to any one of claims 13 to 31; and a display device laminated on the wiring substrate.