Substrate processing device

Abstract

The objective of this invention is to provide a substrate processing apparatus capable of efficiently processing substrates. The substrate processing apparatus of this invention includes: a first mechanism having a holding section for holding substrates arranged in a vertical posture with equal pitch; a second mechanism for combining a second group of substrates held by the first mechanism with a first group of substrates pre-delivered from the first mechanism, holding a plurality of substrates arranged with unequal pitches of alternating first intervals and second intervals wider than the first intervals; and a pitch conversion section for receiving the plurality of substrates arranged with unequal pitches from the second mechanism, and converting them with unequal pitches... A plurality of neatly arranged substrates are arranged with a narrow pitch repeating the first interval; a substrate processing unit processes the plurality of neatly arranged substrates with a narrow pitch in batches; and a main conveying mechanism conveys the plurality of neatly arranged substrates with a narrow pitch to the substrate processing unit; a holding part has a holding groove formed along the periphery of the substrate, and the holding groove is provided at a position offset laterally from the center in the width direction along the neat arrangement direction of the substrates towards the first interval when the first substrate group and the second substrate group are combined.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus for processing substrates. Examples of substrates include semiconductor substrates, substrates for FPDs (Flat Panel Displays), glass substrates for photomasks, substrates for optical discs, substrates for magnetic discs, ceramic substrates, and substrates for solar cells. Examples of FPDs include liquid crystal displays and organic EL (electroluminescence) display devices. Prior Technology

[0002] Previously, a substrate processing apparatus for batch processing by immersing multiple substrates in a processing solution was known. This substrate processing apparatus includes a posture conversion mechanism and a push rod (see, for example, Japanese Patent Application Publication No. 2010-93230). The posture conversion mechanism converts the posture of the substrates between a horizontal posture and a vertical posture. The push rod, by moving up and down via a lifting and holding section, can transfer multiple substrates in a vertical posture between itself and the posture conversion mechanism.

[0003] After the posture conversion mechanism delivers 25 substrates to the lifting and holding section, the lifting and holding section rotates 180 degrees around its vertical axis. This 180-degree rotation moves the 25 held substrates by half a pitch. In this state, the posture conversion mechanism delivers another 25 substrates to the lifting and holding section. The 25 subsequently delivered substrates are combined with the 25 previously delivered substrates to form a substrate group of 50 substrates on the lifting and holding section. At this time, adjacent substrates are face-to-face, with their front sides (or back sides) facing each other. By processing the substrates in a face-to-face state, contamination of the device surface of the substrates can be suppressed. Furthermore, the 50 substrates held by the lifting and holding section are neatly arranged at half a pitch, half the substrate holding pitch within the carrier. By processing the substrates neatly arranged at half a pitch in a batch, the amount of processing fluid used can be reduced. Summary of the Invention

[0004] [The problem the invention aims to solve] In order to further reduce the amount of processing liquid (chemical solution and cleaning solution) used in the substrate processing device, it is desirable to arrange multiple substrates neatly with a narrow pitch that is narrower than half a pitch, and intend to process multiple substrates arranged neatly with such a narrow pitch in batches.

[0005] In this situation, the substrate group held in the posture conversion mechanism must be inserted between the substrates of the substrate group previously held in the pitch conversion mechanism at a spacing equivalent to a narrow pitch. Consequently, the gap between the guide member constituting the posture conversion mechanism's holding substrate and the substrate held in the pitch conversion mechanism becomes narrower than before. Therefore, the guide member constituting the posture conversion mechanism's holding substrate may interfere with the substrate previously held in the pitch conversion mechanism. If this interference occurs, the substrates cannot be processed efficiently.

[0006] The industry has explored making the guide component thinner. However, the guide component is already sufficiently thin. Therefore, if the guide component is made even thinner, it is difficult to ensure the dimensional accuracy of the guide component. The aforementioned possibility of interference still remains.

[0007] The present invention was made in view of this situation, and its purpose is to provide a substrate processing apparatus that can process substrates with high efficiency.

[0008] [Technical means to solve the problem] To achieve this objective, the present invention employs the following configuration. That is, the substrate processing apparatus of the present invention is A substrate processing apparatus for processing substrates, comprising: The first mechanism has a holding part that holds a substrate arranged in a vertical position with equal pitch; The second mechanism combines the second substrate group held by the first mechanism with the first substrate group pre-delivered from the first mechanism, and holds a plurality of substrates arranged in a regular pattern with alternating repeating first intervals and second intervals wider than the first intervals; The pitch conversion unit receives the aforementioned plurality of substrates arranged in a neat manner with the aforementioned unequal pitch from the aforementioned second mechanism, and arranges the aforementioned plurality of substrates arranged in a neat manner with a narrow pitch that repeats the aforementioned first interval; The substrate processing unit processes a batch of the aforementioned plurality of substrates arranged neatly with a narrow pitch; and The main conveying mechanism transports the aforementioned plurality of substrates, arranged neatly with the aforementioned narrow pitch, to the aforementioned substrate processing unit; and The aforementioned retaining member It has a retaining groove formed along the periphery of the substrate, and The aforementioned retaining groove is provided at a position offset to the side when the first substrate group and the second substrate group are combined, from the center of the width direction along the neat arrangement direction of the aforementioned substrates, towards the position where the first interval is arranged.

[0009] According to the substrate processing apparatus of the present invention, substrates arranged vertically with equal pitch are arranged with narrow pitch via a first mechanism, a second mechanism, and a pitch conversion unit. Multiple substrates arranged with narrow pitch are batch-processed by the substrate processing unit. This reduces the amount of processing liquid (chemical solution and cleaning solution) used in the substrate processing apparatus. The second mechanism combines a second group of substrates held by the holding unit of the first mechanism with a first group of substrates pre-delivered from the first mechanism, holding multiple substrates arranged with unequal pitches of alternating first intervals and second intervals wider than the first intervals. During this combination, there is a concern that at the points where they are combined with the first interval, the holding unit of the first mechanism or the substrates of the second group of substrates held in the holding unit may interfere with the substrates of the first group of substrates held in the second mechanism. Therefore, a holding groove is provided in the holding part at a position offset laterally from the center in the width direction along the neat arrangement direction of the substrates, towards the position where the first substrate group and the second substrate group are arranged with a first gap. This minimizes interference between the holding part of the first mechanism, the substrates of the first substrate group held in the holding part, and the substrates of the second substrate group held in the second mechanism, even at the position where they are assembled with the first gap. Thus, a substrate processing apparatus that can efficiently process substrates can be provided.

[0010] Furthermore, in the substrate processing apparatus of the present invention, it is preferred to be The aforementioned first mechanism is a posture conversion mechanism, which includes: a pair of horizontal holding parts that arrange the end shelves of the horizontally positioned substrate at the aforementioned equal pitch, and a pair of vertical holding parts that arrange the holding members of the vertically positioned substrate at the aforementioned equal pitch. The posture of the plurality of substrates is converted between a vertical posture and a horizontal posture by rotating and displacing the aforementioned pair of horizontal holding parts and the aforementioned pair of vertical holding parts. The aforementioned second mechanism is a push rod mechanism having the aforementioned push rod member. The aforementioned push rod member combines the aforementioned second substrate group held in the aforementioned vertical posture by the aforementioned pair of vertical holding portions with the aforementioned first substrate group in the aforementioned vertical posture pre-transferred from the aforementioned pair of vertical holding portions, thereby holding the aforementioned plurality of substrates neatly arranged with the aforementioned unequal pitch. The aforementioned retaining member It has a retaining groove formed along the periphery of the substrate in the aforementioned vertical orientation, and The aforementioned holding groove is provided at a position offset to the side of the first interval when the aforementioned first substrate group and the aforementioned second substrate group are combined, from the center of the aforementioned width direction along the previously mentioned vertical orientation of the neatly arranged substrates. Therefore, when substrates of the second substrate group held in a pair of vertical holding portions are assembled at a first interval to substrates of the first substrate group pre-transferred from the pair of vertical holding portions to the push rod member, interference between the holding members of the pair of vertical holding portions, the substrates of the second substrate group held in the holding members, and the substrates of the first substrate group held in the push rod member can be minimized. Thus, a substrate processing apparatus capable of efficiently processing substrates can be provided.

[0011] Furthermore, in the substrate processing apparatus of the present invention, it is preferred to be The aforementioned retaining components The deepest part of the aforementioned retaining groove is located at a position offset from the center in the aforementioned width direction toward the side offset of the aforementioned first interval when the aforementioned first substrate group and the aforementioned second substrate group are combined. This allows the substrate to be held at the deepest part of the holding groove, offset to a position where the first spacing is positioned when the first substrate group and the second substrate group are assembled. Therefore, even at the part where the first spacing is used, interference between the holding member of the first mechanism holding the substrate and the substrate held in the second mechanism is unlikely to occur. Thus, a substrate processing apparatus that can efficiently process substrates can be provided.

[0012] Furthermore, in the substrate processing apparatus of the present invention, it is preferred to be The aforementioned retaining member includes: The first retaining wall portion retains one end of the peripheral portion of the substrate that is inserted into the aforementioned retaining groove; and The second retaining wall portion retains the other end of the peripheral portion of the aforementioned substrate that is inserted into the aforementioned retaining groove; and The thickness in the width direction is different at the same groove depth position of the first retaining wall and the second retaining wall. To minimize interference between the retaining members of a pair of vertical retaining portions, or between the substrate of the second substrate group held in the retaining member and the substrate of the first substrate group held in the push rod member, it is considered to reduce the thickness in the width direction of both the first and second retaining wall portions by the same dimension. However, if the thickness in the width direction of both retaining wall portions is reduced by the same dimension, the rigidity of the retaining member decreases on both sides of the first and second retaining wall portions. Consequently, the retaining member is prone to deformation, making it difficult to maintain the dimensional accuracy of the retaining member. In this invention, the thickness in the width direction at the same groove depth position of the first and second retaining wall portions constituting the retaining member is different. This prevents the rigidity of the retaining member from decreasing in either the first or second retaining wall portion. As a result, the retaining member is less prone to deformation, and the dimensional accuracy of the retaining member is easily maintained.

[0013] Furthermore, in the substrate processing apparatus of the present invention, it is preferred to be The thickness of the first retaining wall portion in the aforementioned width direction is thinner than the thickness of the second retaining wall portion in the aforementioned width direction located at the same groove depth; and The first retaining wall portion is provided on the side where the first interval is disposed when the first substrate group and the second substrate group are combined; The second retaining wall is provided on the side where the second interval is arranged when the first substrate group and the second substrate group are combined. In this invention, the thickness of the first retaining wall portion on the side where the first interval is disposed is thinner than the thickness of the second retaining wall portion, and the thickness of the second retaining wall portion on the side where the second interval is disposed is thicker than the thickness of the first retaining wall portion. This prevents a decrease in the rigidity of the retaining member between the first and second retaining wall portions. As a result, the retaining member is less prone to deformation, and its dimensional accuracy is easily maintained. Furthermore, even in the portion where the first interval is used, the thickness of the first retaining wall portion is thin, thus minimizing interference between the retaining portion of the first mechanism, the substrate of the first substrate group held in the retaining portion, and the substrate of the second substrate group held in the second mechanism.

[0014] Furthermore, in the substrate processing apparatus of the present invention, it is preferred to be The aforementioned retaining components The thickness in the width direction from the deepest part of the aforementioned retaining groove to the outer side of the aforementioned first retaining wall is thinner than the thickness in the width direction from the deepest part of the aforementioned retaining groove to the outer side of the aforementioned second retaining wall. This ensures the rigidity of the retaining member from the deepest part of the retaining groove to the upper surface of the retaining groove. Furthermore, since the thickness of the first retaining wall portion from the deepest part of the retaining groove to the upper surface of the retaining groove becomes thinner, it is difficult for interference to occur between the retaining part of the first mechanism or the substrate of the first substrate group held in the retaining part and the substrate of the second substrate group held in the second mechanism.

[0015] Furthermore, in the substrate processing apparatus of the present invention, it is preferred to be The aforementioned retaining components The thickness in the width direction from the deepest part of the aforementioned retaining groove to the outer side of the aforementioned first retaining wall is the same as the thickness in the width direction from the deepest part of the aforementioned retaining groove to the outer side of the aforementioned second retaining wall, and The thickness in the width direction from a depth position shallower than the aforementioned deepest part to the outer side of the aforementioned first retaining wall is different from the thickness in the width direction from the same depth position to the outer side of the aforementioned second retaining wall. As a result, the thickness of the first retaining wall portion at a depth position shallower than the deepest part of the retaining groove becomes thinner, thus making it difficult for interference to occur between the retaining portion of the first mechanism or the substrate of the first substrate group held in the retaining portion and the substrate of the second substrate group held in the second mechanism.

[0016] Furthermore, in the substrate processing apparatus of the present invention, it is preferred to be The aforementioned retaining components The thickness in the width direction from the deepest part of the aforementioned retaining groove to the outer side of the aforementioned first retaining wall is the same as the thickness in the width direction from the deepest part of the aforementioned retaining groove to the outer side of the aforementioned second retaining wall, and The thickness in the width direction from a depth position shallower than the aforementioned deepest part to the outer side of the aforementioned first retaining wall is thinner than the thickness in the width direction from the same depth position to the outer side of the aforementioned second retaining wall. This ensures the rigidity of the retaining member at a depth shallower than the deepest part of the retaining groove. Furthermore, the thickness of the first retaining wall at a depth shallower than the deepest part of the retaining groove is reduced, thus making it difficult for interference to occur between the retaining part of the first mechanism or the substrate of the first substrate group held in the retaining part and the substrate of the second substrate group held in the second mechanism.

[0017] Furthermore, in the substrate processing apparatus of the present invention, it is preferred to be The aforementioned retaining components When the aforementioned first retaining wall portion and the aforementioned second retaining wall portion are cut along the width direction of the aforementioned retaining member in the direction of neat arrangement along the aforementioned substrate, their cross-sectional shape is asymmetrical with respect to the center line passing through the deepest part of the aforementioned retaining groove. This ensures that the rigidity of the components is maintained.

[0018] Furthermore, in the substrate processing apparatus of the present invention, it is preferred to be The aforementioned retaining components The aforementioned cross-sectional shape of the first retaining wall portion is such that the length from a depth shallower than the aforementioned deepest part to the aforementioned outer side of the first retaining wall portion in the aforementioned width direction is shorter than the length from the same depth position to the aforementioned outer side of the second retaining wall portion in the aforementioned width direction. (Technical Solution 10). In this way, the thickness of the first holding wall portion at a depth position shallower than the deepest part of the holding groove becomes thinner, so it is difficult for interference to occur between the holding portion of the first mechanism or the substrate of the first substrate group held in the holding portion and the substrate of the second substrate group held in the second mechanism.

[0019] Furthermore, in the substrate processing apparatus of the present invention, it is preferred to be The shelf is provided on the side where the second interval is arranged when the first substrate group and the second substrate group are combined. Therefore, since the shelf is located on the side where the second spacing is configured when the first substrate group and the second substrate group are combined, it is difficult for the shelf to interfere with the substrate held in the push rod mechanism when the first substrate group and the second substrate group are combined.

[0020] [Effects of the Invention] According to the substrate processing apparatus of the present invention, since the holding member has a holding groove at a position offset from the center in the width direction along the substrate arrangement direction towards the side where a first interval is arranged when the first substrate group and the second substrate group are combined, interference between the holding part of the first mechanism or the substrate of the second substrate group held in the holding part and the substrate of the first substrate group held in the second mechanism is unlikely to occur. Therefore, a substrate processing apparatus that can process substrates with high efficiency can be provided. Simple Explanation of the Diagram

[0021] Although the illustrations are intended to depict several forms that are considered to be the best available, please understand that the invention is not limited to the configurations and solutions shown in the illustrations. Figure 1 is a top view showing the schematic configuration of the substrate processing apparatus of Embodiment 1. Figure 2 is a top view showing the structure of the transfer block and its surroundings. Figure 3 is a side view of the display substrate operating mechanism. Figure 4 shows a side view of the posture conversion unit. Figure 5 is a cross-sectional view of the posture conversion mechanism shown in Figure 4 cut by the yy line. Figure 6A is a side view of a pair of horizontal holding parts and a pair of vertical holding parts in a horizontal posture. Figure 6B is a cross-sectional view of the retaining member shown in Figure 5 cut by the y1-y1 line. Figure 7 is a top view of one pair of horizontal holding parts and one pair of vertical holding parts in a vertical posture. Figure 8 shows a side view of the push rod mechanism. Figure 9 is a side view of the push rod component shown in longitudinal section. Figure 10 shows a side view of the junction mechanism and two pitch conversion parts as seen by arrow AA in Figure 2. Figure 11 is a top view showing the main infeed and outfeed mechanisms. Figure 12 is a top view of the intermediary organization. Figure 13 is a side view showing a schematic configuration of the pitch conversion section of a plurality of substrates arranged in a neat manner with unequal pitches. Figure 14 is a side view showing the schematic configuration of the pitch conversion section of a plurality of substrates arranged in a narrow pitch. Figure 15 is a bottom view showing the telescopic mechanism of the pitch conversion section that maintains a plurality of substrates arranged in a neat manner with unequal pitches. Figure 16 is a bottom view showing the telescopic mechanism of the pitch conversion section for maintaining a plurality of substrates arranged neatly with a narrow pitch. Figure 17 is a flowchart illustrating the operation of the first half of the substrate processing device. Figures 18A, 18B, and 18C are side views used to illustrate the operation of the substrate processing apparatus. Figures 19A, 19B, and 19C are side views used to illustrate the operation of the substrate processing apparatus. Figures 20A, 20B, and 20C are side views used to illustrate the operation of the substrate processing apparatus. Figures 21A and 21B are side views used to illustrate the operation of the substrate processing apparatus. Figures 22A and 22B are side views used to illustrate the operation of the substrate processing apparatus. Figures 23A and 23B are side views used to illustrate the operation of the substrate processing apparatus. Figures 24A and 24B are side views illustrating the characteristic parts of the operation of the substrate processing apparatus. Figure 25 is a top view of the posture conversion unit and push rod mechanism performing the action shown in Figure 24A. Figure 26 is a top view of the posture transition section and push rod mechanism before the action shown in Figure 24B is performed. Figure 27A is a cross-sectional view of the vertical retaining part shown in Figure 25 cut by the y2-y2 line. Figure 27B is a cross-sectional view of the previous vertical retaining part shown in Figure 26 cut along line y3-y3. Figure 28 is an enlarged view of the retaining member surrounded by the two-point chain line in Figure 27A. Figure 29 is a flowchart illustrating the operation of the latter half of the substrate processing device. Figures 30A and 30B are side views used to illustrate the operation of the substrate processing apparatus. Figures 31A and 31B are side views used to illustrate the operation of the substrate processing apparatus. Figures 32A and 32B are side views used to illustrate the operation of the substrate processing apparatus. Figures 33A, 33B, and 33C are side views used to illustrate the operation of the substrate processing apparatus. Figures 34A, 34B, and 34C are side views used to illustrate the operation of the substrate processing apparatus. Figures 35A, 35B, 35C, and 35D are sectional views showing the retaining member in a variation example. Figures 36A and 36B are sectional views showing the retaining member in a modified example. Implementation

[0022] The present invention will be described below with reference to various embodiments. [Example 1]

[0023] Hereinafter, Embodiment 1 of the present invention will be described with reference to the figures. Figure 1 is a top view showing the schematic configuration of the substrate processing apparatus 1 of Embodiment 1. Figure 2 is a top view showing the configuration of the transfer block 5 and its surrounding area.

[0024] In this specification, for convenience, the direction in which the transfer block 5 and the processing block 7 are arranged is referred to as the "front-back direction X". The front-back direction X is horizontal. The direction in the front-back direction X, for example, from the processing block 7 towards the transfer block 5, is called "front". The opposite direction to the front is called "rear". The horizontal direction orthogonal to the front-back direction X is called the "width direction Y". One direction of the "width direction Y" is appropriately called "right". The opposite direction to the right is called "left". The direction perpendicular to the horizontal direction is called the "vertical direction Z". The vertical direction Z is represented by "above" and "below". In the figures, for reference, front, rear, right, left, top, and bottom are appropriately shown.

[0025] <1. Composition of the substrate processing apparatus> Referring to Figure 1, the substrate processing apparatus 1 processes substrates W. The substrate processing apparatus 1 is a batch processing apparatus that processes multiple substrates W (e.g., 50, 75, or 100) at a time. The substrate processing apparatus 1 performs processes such as chemical treatment, washing, and drying on the substrates W. The substrate processing apparatus 1 includes a storage block 2, a mounting shelf 3, a transfer block 5, a processing block 7, and a batch substrate transport area 8.

[0026] <1-1. Storage Block> Storage block 2 accommodates at least one carrier C. Storage block 2 is adjacent to transfer block 5 in front of it. Carrier C stores a plurality of substrates (e.g., 25) in a horizontal orientation with a predetermined interval (e.g., 10 mm). In other words, carrier C stores N (e.g., 25) substrates W arranged in a standard pitch in a horizontal orientation. Furthermore, "N" in N substrates W is a natural number of 2 or more. In addition, the reference pitch is a repeating reference interval TN9 (e.g., 10 mm). That is, when the reference interval TN9 is 10 mm, the reference pitch is a 10 mm pitch. The N substrates W in carrier C are arranged in a straight line along the vertical direction Z or the thickness direction of each substrate W. As carrier C, for example, a FOUP (Front Opening Unify Pod) is used, but it is not limited to this.

[0027] The storage block 2 includes a plurality of (e.g., two) wafer loading / unloading machines 9. The two wafer loading / unloading machines 9 are arranged along the width direction Y. In this embodiment, the two wafer loading / unloading machines 9 are used for loading and unloading the racks C. Furthermore, the storage block 2 includes at least one storage shelf 11 and a rack transport robot 13. The racks C are placed in the storage shelf 11.

[0028] The rack transport robot 13 transports racks C between two wafer loading / unloading machines 9, storage shelves 11, and loading shelves 3. The rack transport robot 13 has a holding part 15 that holds, for example, a protrusion provided on the upper surface of the rack C. The rack transport robot 13 can move the holding part 15 in the horizontal direction (front-back direction X and width direction Y) and the vertical direction Z. The rack transport robot 13 is driven by one or more electric motors.

[0029] The mounting shelf 3 is positioned in the area of ​​the storage block 2. The mounting shelf 3 is adjacent to the transfer block 5 in front of it. The mounting shelf 3 supports the mounting rack C.

[0030] <1-2. Transfer Block> Referring to Figures 1 and 2, the transfer block 5 includes a substrate operation mechanism (robot) HTR, a posture conversion mechanism 19, a push rod mechanism 21, a transfer mechanism 23, and two pitch conversion parts 25 and 26.

[0031] The substrate handling mechanism HTR is positioned behind the mounting shelf 3. The substrate handling mechanism HTR horizontally transports a plurality of substrates (e.g., 25) W between the carrier C placed on the mounting shelf 3 and the posture conversion mechanism 19. As shown in Figure 3, the substrate handling mechanism HTR has a plurality of (e.g., 25 or 13) hands 27. Each hand 27 holds one substrate W. The plurality of hands 27 are arranged along the vertical direction Z at a reference pitch. Therefore, the 25 substrates W held by, for example, 25 hands 27 are neatly arranged at a reference pitch. Furthermore, the reference pitch is a repeating reference interval TN9 (e.g., 10 mm).

[0032] Furthermore, in Figure 3 and the like, for ease of illustration, it is assumed that the substrate operating mechanism HTR has 5 hands 27. Also, it is assumed that the pair of horizontal holding parts 37 and the pair of vertical holding parts 39, described later, hold 5 substrates W. Also, it is assumed that the push rod member 55, described later, supports 10 substrates W.

[0033] The substrate handling mechanism HTR further includes a hand support 29, a forward / backward movement part 31, and a lifting / rotating part 33. The hand support 29 supports a plurality of hands 27. The forward / backward movement part 31 moves the plurality of hands 27 forward and backward via the hand support 29. The lifting / rotating part 33 rotates around a vertical axis AX1 to change the direction of the hands 27. The lifting / rotating part 33 is fixed to the ground. Furthermore, both the forward / backward movement part 31 and the lifting / rotating part 33 are equipped with electric motors. Additionally, the substrate handling mechanism HTR may include, in addition to the hands 27, a movable hand (not shown) for transporting only one substrate W.

[0034] The posture conversion mechanism 19 converts multiple (e.g., 25) substrates W between a horizontal posture and a vertical posture. The posture conversion mechanism 19 is located to the left of the substrate operation mechanism HTR. As shown in FIG4, the posture conversion mechanism 19 includes a support stage 35, a pair of horizontal holding parts 37, a pair of vertical holding parts 39, and a rotation drive unit 41.

[0035] The support platform 35 is rotatably supported about a horizontal axis AX2 extending in the front-rear direction X. A pair of horizontal holding portions 37 and a pair of vertical holding portions 39 are configured to extend at right angles from the support surface 35A. When the plurality of substrates W are in a horizontal position, the pair of horizontal holding portions 37 holds the plurality of substrates W. In other words, when the plurality of substrates W are in a horizontal position, the plurality of substrates W are placed on the pair of horizontal holding portions 37. Furthermore, when the plurality of substrates W are in a vertical position, the pair of vertical holding portions 39 holds the plurality of substrates W.

[0036] Both the pair of horizontal holding portions 37 and the pair of vertical holding portions 39 are arranged along the front-rear direction X (see Figure 2). Furthermore, when the pair of horizontal holding portions 37 holds a plurality of substrates W in a horizontal position, the pair of vertical holding portions 39 is arranged on the side closer to the push rod mechanism 21 than the pair of horizontal holding portions 37. The pair of horizontal holding portions 37 has a plurality of pairs (e.g., 25 pairs, 38 pairs, 50 pairs) of shelves 37A arranged at a reference pitch along the direction DR1 extending from the pair of horizontal holding portions 37. The pair of vertical holding portions 39 has a plurality of pairs (e.g., 25 pairs, 38 pairs, 50 pairs) of holding members 39A arranged at a reference pitch along the direction DR1 extending from the pair of vertical holding portions 39. The holding members 39A have holding grooves 39C, described later. The direction DR1 extending from the pair of horizontal holding portions 37 and the pair of vertical holding portions 39 is the same as the arrangement direction of the substrates W.

[0037] Furthermore, the posture conversion mechanism 19 further includes an axial movement section 51 and a receiving movement section 53. The axial movement section 51 moves the pair of horizontal holding sections 37 by a preset small distance along the direction DR1 extending from the pair of horizontal holding sections 37. The receiving movement section 53 moves the pair of vertical holding sections 39 closer to or further away from the pair of horizontal holding sections 37. For example, when a plurality of substrates W are held in a horizontal posture by the pair of horizontal holding sections 37, the receiving movement section 53 can move the pair of vertical holding sections 39 in the width direction Y. The rotation drive section 41 converts the posture of the support platform 35 between a vertical support posture and a horizontal support posture. That is, the posture conversion mechanism 19 converts the postures of the pair of horizontal holding sections 37 and the pair of vertical holding sections 39 between a vertical support posture and a horizontal support posture. In this way, the posture conversion mechanism 19 converts the plurality of substrates W held by the pair of horizontal holding sections 37 and the pair of vertical holding sections 39 between a horizontal posture and a vertical posture.

[0038] Furthermore, the rotary drive unit 41 is equipped with, for example, an electric motor. The axial movement unit 51 and the housing movement unit 53 are each equipped with a cylinder or an electric actuator. The electric actuator is equipped with an electric motor.

[0039] Refer to Figures 5, 6A, 6B, and 7. Figure 5 is a cross-sectional view of the posture conversion mechanism 19 shown in Figure 4, cut along the yy line. Figure 6A is a side view of a pair of horizontal holding parts 37 and a pair of vertical holding parts 39 in the horizontal posture. Figure 6A is a cross-sectional view of the holding member 39A shown in Figure 5, cut along the y1-y1 line. Figure 7 is a diagram showing the shelf 37A and the holding member 39A in the vertical posture.

[0040] As shown in Figure 5, shelf 37A extends from the portion indicated by the dashed line to the boundary with the section line indicated by the right descending slant line. In the area where the holding member 39A overlaps with the substrate W from the portion indicated by the dashed line, a holding groove forming portion 39D forms a holding groove 39C. The portion indicated by the dashed line is the deepest part 39Ca of the holding groove 39C. From the deepest part 39Ca to the boundary with the section line indicated by the left descending slant line, the holding member 39A has a holding groove support portion 39E that supports the holding groove forming portion 39D. In the area indicated by the section line indicated by the left descending slant line, the holding member 39A has a vertical holding body 39F that supports the holding groove support portion 39E. That is, the holding member 39A extends from the vertical holding body 39F in the front-rear direction X.

[0041] As shown in Figure 6A, the substrate W is placed on the mounting surface 37B of the shelf 37A. The holding member 39A forms a holding groove 39C. Furthermore, the substrate W placed on the mounting surface 37B is inserted into the holding groove 39C.

[0042] As shown in Figure 6B, one example of the retaining groove 39C is a groove with a V-shaped cross-section. Hereinafter, the retaining groove 39C is also referred to as a V-shaped groove. The retaining groove 39C has two inclined surfaces 39C3. The upper side of the two inclined surfaces 39C3 is referred to as the first inclined surface 39C3a, and the lower side is referred to as the second inclined surface 39C3b. The retaining member 39A is the area with the cross-section line attached. Taking the two-point chain line z1 in the retaining member 39A as the boundary, the side of the substrate W is referred to as the retaining groove forming part 39D, and the opposite side is referred to as the retaining groove support part 39E.

[0043] Specifically, the retaining groove 39C is formed along the periphery Wa of the horizontally oriented substrate W. Specifically, the retaining groove 39C contacts the upper and lower portions of the periphery Wa of the vertically oriented substrate W.

[0044] The retaining groove 39C is positioned offset upwards from the center 39Ba in the width direction of the direction extending along the pair of horizontal retaining portions 37 and the pair of vertical retaining portions 39, i.e., the direction of the arrangement of the substrates W. The direction extending along the direction DR1 of the pair of horizontal retaining portions 37 and the pair of vertical retaining portions 39, the direction of the arrangement of the substrates W held in the vertical position by the pair of vertical retaining portions 39, and the width direction of the retaining member 39A are the same. The arrangement direction of the vertically positioned substrates W is also referred to by the symbol DR1. For example, the retaining groove 39C is located above the center 39Ba. The mounting surface 37B is located within the width of the retaining groove 39C in the vertical direction.

[0045] When viewed from the HTR side of the substrate operating mechanism, the retaining groove 49C has a deepest part 39Ca on the deep side (paper deep side). The deepest part 39Ca is located offset upward from the center 39Ba. The deepest part 39Ca is located above the mounting surface 37B.

[0046] The width of the retaining groove 39C in the vertical direction is greater than the width of the substrate W in the vertical direction (the thickness of the substrate W). The retaining groove 39C overlaps with the shelf 37A when viewed from the substrate operating mechanism HTR side. For example, a portion of each end of the retaining groove 39C in the front-to-back direction x overlaps with the horizontal retaining portion 37. Specifically, the end of the lower second inclined surface 39C3b, which is closer to the deepest part 39Ca of the retaining groove 39C, overlaps with the end of the shelf 37A. The upper first inclined surface 39C3a, which is closer to the deepest part 39Ca of the retaining groove 39C, does not overlap with the shelf 37A.

[0047] Furthermore, viewed from the HTR side of the substrate operating mechanism, the retaining groove 39C and the shelf 37A can be separated in the horizontal direction so that the retaining groove 39C and the shelf 37A do not overlap.

[0048] As shown in Figure 7, when the shelf 37A and the holding member 39A are in a vertical position, the shelf 37A is located to the right of the substrate W (on the side of the posture conversion mechanism 19). The substrate W is the substrate W placed when the shelf 37A is in a horizontal position. As will be described later, after the shelf 37A becomes vertical, it moves away from the substrate W to the right. That is, the vertical shelf 37A does not directly hold the substrate W. In addition, the shelf 37A can also support the substrate W which is tilted from the vertical position.

[0049] Refer back to the descriptions of Figures 1 and 2. The push rod mechanism 21 is positioned to the left of the posture conversion mechanism 19. As shown in Figure 8, the push rod mechanism 21 includes a push rod component 55, a rotating shaft 57, a push rod rotating part 59, a push rod horizontal moving part 61, a lifting platform 63, and a push rod lifting part 65.

[0050] As shown in Figure 9, the push rod member 55 holds a plurality of substrates (e.g., 50, 75, or 100) arranged in a vertical position with alternating intervals of unequal pitch, namely a first interval TN1 (e.g., 3.333 mm) and a second interval TN2 (e.g., 6.666 mm). The second interval TN2 is wider than the first interval TN1 (second interval TN2 > first interval TN1). Furthermore, the first interval TN1 is also referred to as the narrow interval, and the second interval TN2 is also referred to as the wide interval.

[0051] As shown in Figure 9, the push rod member 55 has a plurality of (e.g., 50, 75, or 100) vertical holding slots 67 in order to hold the plurality of substrates W in a vertical position. The plurality of vertical holding slots 67 are arranged, for example, with unequal pitches of alternating first interval TN1 and second interval TN2. The sum of the first interval TN1 (e.g., 3.333 mm) and the second interval TN2 (e.g., 6.666 mm) is the reference interval TN9 (e.g., 10 mm).

[0052] Referring to Figure 8, the lower surface of the push rod member 55 is connected to the upper end of the rotation shaft 57. The push rod rotating part 59 rotates the push rod member 55 and the rotation shaft 57 about the vertical axis AX3 passing through the rotation shaft 57. This allows a plurality of substrates W supported by the push rod member 55 in a vertical position to rotate about the vertical axis AX3. The push rod rotating part 59 includes, for example, an electric motor. The push rod rotating part 59 is located below the push rod member 55. Furthermore, the push rod rotating part 59 is mounted on the upper surface of the lifting platform 63 via the push rod horizontal moving part 61.

[0053] The horizontal moving part 61 of the push rod includes two guide rails 61A extending in the width direction Y, a slider 61B, and an electric motor (not shown). The two guide rails 61A are disposed on the upper surface of the lifting platform 63. The slider 61B moves along the two guide rails 61A in the width direction Y. The slider 61B is driven by the electric motor. The lifting part 65 of the push rod raises and lowers the lifting platform 63 in the vertical direction Z, thereby raising and lowering the push rod member 55. The lifting part 65 of the push rod includes, for example, an electric actuator.

[0054] Referring to Figure 2, the two pitch conversion sections 25 and 26 are positioned to the left of the push rod mechanism 21. Furthermore, if the two pitch conversion sections 25 and 26 are arranged in the vertical direction Z, the substrate processing apparatus 1 would unnecessarily become taller. To address this, the two pitch conversion sections 25 and 26 are arranged in the front-rear direction X. That is, the first pitch conversion section 25 is positioned behind the second pitch conversion section 26 when viewed from above. Therefore, unnecessarily increasing the height of the substrate processing apparatus 1 can be prevented. The transfer mechanism 23, for example, transports a plurality of substrates W arranged in a neat manner with unequal pitches between the push rod member 55 and the two pitch conversion sections 25 and 26.

[0055] Referring to Figures 2 and 10. Figure 10 is a side view showing the transfer mechanism 23 and the two pitch conversion sections 25 and 26 as viewed as indicated by arrow AA in Figure 2. The transfer mechanism 23 includes an infeed mechanism 71, an intermediary mechanism 73, and an outfeed mechanism 75. The infeed mechanism 71 transports a plurality of substrates W arranged in a neat manner with unequal pitches from the push rod member 55 toward the first pitch conversion section 25. The intermediary mechanism 73 transports a plurality of substrates W arranged in a neat manner with narrow pitches from the first pitch conversion section 25 toward the first transfer position P1. The outfeed mechanism 75 transports a plurality of substrates W arranged in a neat manner with unequal pitches from the second pitch conversion section 26 toward the push rod member 55. The infeed mechanism 71, the intermediary mechanism 73, and the outfeed mechanism 75 are respectively equipped with clamps 77, 78, and 79.

[0056] As shown in Figure 10, the loading mechanism 71 is positioned at the loading height position H1. The loading mechanism 71 is, for example, positioned to the side of the lifting section 141 of the second pitch conversion section 26. The clamp 78 of the intermediary mechanism 73 is positioned above the first pitch conversion section 25. Furthermore, the clamp 78 of the intermediary mechanism 73 is positioned between the loading height position H1 and the first junction position P1. The first junction position P1 is a position higher than both the loading height position H1 and the unloading height position H2. The unloading mechanism 75 is positioned at the unloading height position H2, which is higher than the loading height position H1. The loading mechanism 71 and the unloading mechanism 75 are each configured such that the plurality of substrates W held by the unloading mechanism 75 do not interfere with the plurality of other substrates W held by the loading mechanism 71.

[0057] Figure 11 is a top view showing the loading mechanism 71 and the unloading mechanism 75. The loading mechanism 71 is located behind the unloading mechanism 75. That is, the loading mechanism 71 is located on the processing block 7 side, and the unloading mechanism 75 is located on the storage block 2 side. The loading mechanism 71 includes a clamp 77, an opening and closing part 81, a forward and backward moving part 83, and a width moving part 85.

[0058] The clamp 77 holds a plurality of substrates W arranged in a vertical position with unequal pitches. The clamp 77 includes a pair of clamping members 77A and 77B extending along the width direction Y. Each pair of clamping members 77A and 77B has a plurality of pairs (e.g., 50 pairs, 75 pairs, 100 pairs) of retaining slots 87 and 88 arranged with unequal pitches. Furthermore, the unequal pitches alternate between a first interval TN1 (e.g., 3.333 mm) and a second interval TN2 (e.g., 6.666 mm). A plurality of retaining slots 87 arranged with unequal pitches are provided on the first clamping member 77A. Similarly, a plurality of retaining slots 88 arranged with unequal pitches are provided on the second clamping member 77B.

[0059] The opening / closing part 81 supports the two clamping members 77A and 77B in a manner that allows them to move in the front-rear direction X. Furthermore, the opening / closing part 81 opens and closes the two clamping members 77A and 77B in the front-rear direction X. Specifically, the opening / closing part 81 approaches or moves away from the two clamping members 77A and 77B. When the clamp 77 is in the closed state, the clamp 77 can hold a plurality of substrates W in a vertical position. Conversely, when the clamp 77 is in the open state, the clamp 77 can allow a plurality of vertically positioned substrates W to pass between the two clamps 77A and 77B in the vertical direction Z. The opening / closing part 81 includes a cylinder or electric actuator for driving the two clamping members 77A and 77B.

[0060] The forward / backward moving part 83 is positioned on the side of the wider moving part 85, near the two pitch conversion parts 25 and 26. The forward / backward moving part 83 causes the clamp 77 and the opening / closing part 81 to move horizontally in the forward / backward direction X. The wider moving part 85 causes the clamp 77, the opening / closing part 81, and the forward / backward moving part 83 to move horizontally in the wider direction Y. That is, the forward / backward moving part 83 and the wider moving part 85 can move the clamp 77 in both the forward / backward direction X and the wider direction Y (two-dimensional directions). The forward / backward moving part 83 is equipped with, for example, a cylinder or an electric actuator. The wider moving part 85 is equipped with an electric actuator.

[0061] The transfer mechanism 75 includes a clamp 79, an opening / closing part 89, a forward / backward moving part 91, and a width-direction moving part 93. The clamp 79 is constructed in the same manner as the clamp 77. Specifically, the clamp 79 includes a pair of clamping members 79A and 79B extending along the width direction Y. The pair of clamping members 79A and 79B have multiple pairs (e.g., 50 pairs, 75 pairs, 100 pairs) of retaining grooves 95 and 96 arranged with unequal pitches. The forward / backward moving part 91 is located on the side of the width-direction moving part 93 adjacent to the two pitch conversion parts 25 and 26. Apart from this, the opening / closing part 89, the forward / backward moving part 91, and the width-direction moving part 93 are constructed in the same manner as the opening / closing part 81, the forward / backward moving part 83, and the width-direction moving part 85.

[0062] Figure 12 is a top view showing the intermediary mechanism 73. The intermediary mechanism 73 includes a clamp 78, an opening / closing part 101, an arm 103, and a lifting part 105. The clamp 78 includes a pair of clamping members 78A and 78B extending along the width direction Y. The pair of clamping members 78A and 78B has a plurality of pairs (e.g., 50 pairs, 75 pairs, 100 pairs) of retaining slots 107 and 108 arranged with a narrow pitch (e.g., 3.333 mm pitch (1 / 3 pitch)). Specifically, a plurality of retaining slots 107 arranged with a narrow pitch are provided on the first clamping member 78A along the width direction Y. Also, a plurality of retaining slots 108 arranged with a narrow pitch are provided on the second clamping member 78B.

[0063] The opening / closing part 101 is located on the right side of the clamp 78 (towards the push rod mechanism 21). Apart from this, the opening / closing part 101 is constructed in the same manner as the opening / closing part 81. More specifically, the opening / closing part 101 supports a pair of clamping members 78A and 78B in a manner that allows them to move in the front-rear direction X. Furthermore, the opening / closing part 101 opens and closes the pair of clamping members 78A and 78B in the front-rear direction X. When the clamp 78 is in the closed state with the opening / closing part 101, the clamp 78 can hold a plurality of substrates W arranged in a narrow pitch in a vertical position. Conversely, when the clamp 78 is in the open state with the opening / closing part 101, the clamp 78 can allow a plurality of vertically positioned substrates W to pass between the two clamping members 78A and 78B in the vertical direction Z.

[0064] The opening / closing part 101 is mounted on the lifting part 105 via the arm 103. The lifting part 105 causes the clamp 78 and the opening / closing part 101 to rise and fall in the vertical direction Z. The lifting part 105 is equipped with, for example, an electric actuator. Thereby, the intermediate mechanism 73 receives a plurality of substrates W arranged in a vertical position with a narrow pitch from the first pitch conversion part 25, and in order to deliver the plurality of substrates W to the main transport mechanism WTR, the plurality of substrates W can be moved to the first transfer position P1 (see Figure 10).

[0065] Furthermore, the transfer block 5 has two transport paths for transporting a plurality of substrates W between the push rod member 55 (push rod mechanism 21) and the main transport mechanism WTR. Specifically, the first transport path passes through the infeed mechanism 71, the first pitch conversion section 25, and the intermediate mechanism 73. The second transport path passes through the second pitch conversion section 26 and the outfeed mechanism 75. For example, when 50 substrates W are held by the intermediate mechanism 73, the outfeed mechanism 75 can transport the 50 substrates W processed by the chemical treatment tank BT1, etc., to the push rod member 55. Therefore, 50 substrates W (processed substrate group) can be smoothly transported.

[0066] Referring to Figures 10 and 13-16, the two pitch conversion units 25 and 26 each convert the pitch of the plurality of substrates W between unequal pitch and narrow pitch. The unequal pitch alternates between a first interval TN1 (e.g., 3.333 mm) and a second interval TN2 (e.g., 6.666 mm), which is wider than the first interval TN1. The narrow pitch repeats the first interval TN1.

[0067] The first pitch conversion unit 25 arranges a plurality of substrates W, which are arranged in a uniform manner with unequal pitches, into a uniform manner with a narrow pitch. That is, the first pitch conversion unit 25 converts the pitch of the plurality of substrates W before processing by the processing block 7 into a narrow pitch. In contrast, the second pitch conversion unit 26 arranges the plurality of substrates W, which are arranged in a uniform manner with a narrow pitch, into a uniform manner with unequal pitches. That is, the second pitch conversion unit 26 converts the pitch of the plurality of substrates W after processing by the processing block 7 into an unequal pitch.

[0068] Each of the two pitch conversion units 25 and 26 has a pitch conversion body 111. The pitch conversion body 111 has a plurality of (e.g., 25, 38, 50) holding members 113 (113A~113E) and a moving part 115.

[0069] A plurality of holding members 113 hold a plurality of substrates W arranged in a vertical position with unequal pitches. Each of the plurality of holding members 113 has two holding grooves 117 that hold two substrates W of the plurality of substrates W at a first interval TN1 (e.g., 3.333 mm). The two holding grooves 117 are separated by the first interval TN1. The two holding grooves 117 of each holding member 113 are arranged along the width direction Y. For example, when the pitch conversion section 25 has 25 holding members 113, the 25 holding members 113 can hold 50 substrates W. Furthermore, in Figures 13-16, for ease of illustration, it is assumed that each of the two pitch conversion sections 25 and 26 has 5 holding members 113.

[0070] The moving part 115 moves a plurality of holding members 113 along the neat arrangement direction (width direction Y) of the plurality of substrates W, so as to change between an unequal pitch state in which the plurality of substrates W are neatly arranged with unequal pitch and a narrow pitch state in which the plurality of substrates W are neatly arranged with narrow pitch. The moving part 115 includes a base member 119, two guide rails 121, a telescopic mechanism 123, a drive part 125, and a connecting part 127.

[0071] Two guide rails 121 support a plurality of retaining members 113 in a manner that allows them to move along an aligned direction (width direction Y). Each of the two guide rails 121 extends along the width direction. The two guide rails 121 are mounted on the upper surface of the base member 119. Furthermore, the central retaining member 113C among the plurality of retaining members 113 is fixed to the base member 119 by, for example, a screw SW. That is, the central retaining member 113C does not move along the width direction Y. Moreover, the number of guide rails 121 is not limited to two; it can be one or more. That is, the moving part 115 only needs to have one or more guide rails 121.

[0072] The telescopic mechanism 123 causes a plurality of retaining members 113 to extend and retract along a neatly aligned direction (width direction Y). The telescopic mechanism 123 is connected to each retaining member 113. The telescopic mechanism 123 is constructed, for example, by a linkage mechanism. Specifically, the telescopic mechanism 123 is constructed, for example, by a lazy tongs type, a serrated line type, or a similar type. The telescopic mechanism 123, for example, includes a plurality of (five in Figure 13, etc.) linkage members 129, a plurality of (five in Figure 13, etc.) pins 131, and a plurality of (four in Figure 13, etc.) connectors 133. In Figures 15 and 16, for example, five pins 131 are provided on the bottom surface of five retaining members 113. The five linkage members 129 are rotatably mounted on the five pins 131 about a vertical axis. The five pins 131 are located at the five central portions of the five linkage members 129. Each of the four connectors 133 is connected to the end of one of the two adjacent connecting rod members 129.

[0073] For example, the first end of link member 129B is connected to the second end of link member 129A by connector 133A. Also, the second end of link member 129B is connected to the first end of link member 129C by connector 133B.

[0074] The drive unit 125 drives the telescopic mechanism 123. The drive unit 125 is mounted on the lower surface of the base member 119. The drive unit 125 causes the rod-shaped body 125A, which extends along the width direction Y, to extend and retract. The drive unit 125 is equipped with a cylinder or an electric actuator. The connecting part 127 connects the end retaining member 113E of the plurality of retaining members 113 to the front end of the rod-shaped body 125A of the drive unit 125. Furthermore, the connecting part 127 passes through the opening 119A of the base member 119.

[0075] In Figures 13 and 15, for example, when the rod-shaped body 125A of the drive unit 125 extends, the end retaining member 113E moves away from the central retaining member 113C, and the telescopic mechanism 123 moves the other three retaining members 113A, 113B, and 113D away from the central retaining member 113C. Thus, the plurality of substrates W are neatly arranged with unequal pitches. Also, in Figures 14 and 16, for example, when the rod-shaped body 125A of the drive unit 125 retracts, the end retaining member 113E moves closer to the central retaining member 113C, and the telescopic mechanism 123 moves the other three retaining members 113A, 113B, and 113D closer to the central retaining member 113C. Thus, the plurality of substrates W are neatly arranged with a narrow pitch (first interval TN1).

[0076] As shown in Figure 10, the pitch conversion units 25 and 26 each have a lifting unit 141. The lifting unit 141 raises and lowers the pitch conversion body 111 (a plurality of holding members 113 and a moving part 115). The lifting unit 141 has a cylinder or an electric actuator.

[0077] The lifting section 141 of the first pitch conversion section 25 moves the plurality of holding members 113 up and down between a position higher than the clamp 77 (upper surface) of the loading mechanism 71 and a position lower than the clamp 77. Similarly, the lifting section 141 of the second pitch conversion section 26 moves the plurality of holding members 113 up and down between a position higher than the clamp 79 (upper surface) of the unloading mechanism 75 and a position lower than the clamp 79.

[0078] <1-3. Processing Block> Referring to Figure 1, the processing block 7 includes a plurality of (e.g., four) batch processing tanks BT1-BT4 and a drying section 143. The four batch processing tanks BT1-BT4 and the drying section 143 are arranged in a longitudinal direction X along the substrate processing apparatus 1. Each of the four batch processing tanks BT1-BT4 performs batch impregnation processing on a plurality of substrates W (e.g., 50, 75, or 100). Each of the four batch processing tanks BT1-BT4 stores a processing solution (e.g., chemical solution or pure water) for impregnating the plurality of substrates W.

[0079] The four batch processing tanks BT1 to BT4 are, for example, composed of two chemical treatment tanks BT1 and BT3, and two washing treatment tanks BT2 and BT4. Chemical treatment tank BT1 and washing treatment tank BT2 are grouped together, and chemical treatment tank BT3 and washing treatment tank BT4 are grouped together. Furthermore, the combination of chemical treatment tanks and washing treatment tanks is not limited to this example. Also, the number of batch processing tanks is not limited to four; one or more is sufficient.

[0080] Two chemical treatment tanks, BT1 and BT3, each perform etching using a chemical solution. The chemical solution used is, for example, a phosphoric acid solution, but is not limited to it. The chemical solution is heated to a preset temperature. A chemical spray pipe (not shown) is installed at the bottom inner side of each of the chemical treatment tanks BT1 and BT3. Each of the chemical treatment tanks BT1 and BT3 stores the chemical solution supplied from the chemical spray pipe.

[0081] Two cleaning tanks, BT2 and BT4, each perform a cleaning process by rinsing away the chemical residue adhering to multiple substrates W with a cleaning solution (rinsing fluid). The cleaning solution used is, for example, deionized water (DIW). Each of the cleaning tanks BT2 and BT4 stores pure water supplied from a pure water spray pipe (not shown).

[0082] The processing block 7 includes: a lift LF1, which serves as a dedicated transport mechanism for transferring substrates W treated with chemicals in the chemical treatment tank BT1 to the cleaning treatment tank BT2, and a lift LF2, which transfers substrates W treated with chemicals in the chemical treatment tank BT3 to the cleaning treatment tank BT4. Each of the two lifts LF1 and LF2 includes: a substrate holding section that holds a plurality of substrates W arranged neatly with a narrow pitch along the width direction Y in a vertical position; a lifting section that raises and lowers the substrate holding section; and a horizontal moving section that moves the substrate holding section along the front-back direction X.

[0083] The drying unit 143 includes: a substrate holding mechanism that holds a plurality of substrates W (e.g., 50, 75, or 100) arranged neatly along the width direction Y at a narrow pitch in a vertical position; and a processing chamber that houses the plurality of substrates W held by the substrate holding mechanism. The drying unit 143 dries the substrates W by supplying an organic solvent (e.g., isopropanol) to the substrates W in a reduced pressure gas environment, or by using centrifugal force to remove liquid components from the surface of the substrates W.

[0084] <1-4. Batch substrate transfer area> The batch substrate transport area 8 is located behind the storage block 2 and adjacent to the left of the transfer block 5 and the processing block 7. The batch substrate transport area 8 extends in the front-rear direction X. The batch substrate transport area 8 is equipped with a main transport mechanism WTR (main transport robot). The main transport mechanism WTR transports multiple substrates (e.g., 50, 75, or 100) in a vertical posture arranged with a narrow pitch in the width direction Y along the front-rear direction X. Furthermore, the main transport mechanism WTR transports multiple substrates W between the first junction position P1, the second junction position P2, multiple (e.g., 4) batch processing tanks BT1 to BT4, and the drying section 143.

[0085] The main conveying mechanism WTR includes a clamp 145, a clamp lifting unit (not shown), a clamp horizontal moving unit (not shown), and a guide rail 147. The clamp 145 holds a plurality of substrates W arranged neatly along the width direction Y at a narrow pitch in a vertical position. The clamp 145 includes a pair of clamping members 145A and 145B extending along the width direction Y. The pair of clamping members 145A and 145B has a plurality of pairs (e.g., 50 pairs, 75 pairs, or 100 pairs) of retaining grooves arranged at a narrow pitch along the width direction Y. The pair of clamping members 145A and 145B are opened and closed by a clamp opening and closing part (not shown).

[0086] The clamp 145 is capable of moving along the guide rail 147 in the forward-backward direction X. The clamp 145 moves in the forward-backward direction X by means of a clamp horizontal moving part. The clamp 145 rises and falls in the vertical direction Z by means of a clamp lifting part. The clamp horizontal moving part and the clamp lifting part are equipped with, for example, electric actuators. The clamp opening and closing part is equipped with, for example, a cylinder or an electric actuator.

[0087] The main transport mechanism WTR transports multiple substrates arranged neatly with a narrow pitch to the processing block 7.

[0088] <1-5. Control Department> The substrate processing apparatus 1 includes a control unit 151 (see Figure 1) and a memory unit (not shown). The control unit 151 controls each component of the substrate processing apparatus 1. The control unit 151 includes one or more processors, such as a central processing unit (CPU). The memory unit includes at least one of the following: ROM (Read-Only Memory), RAM (Random-Access Memory), and a hard disk. The memory unit stores computer programs required for controlling each component of the substrate processing apparatus 1.

[0089] <2. Operation of the substrate processing device> Next, the operation of the substrate processing apparatus 1 will be described with reference to the flowchart in FIG17. First, with reference to FIG17, the operation of conveying the substrates from the carrier C to the wafer loading and unloading machine 9 to the drying process will be described. In addition, in this embodiment, the substrate processing apparatus 1 processes 50 substrates W taken out from the two carriers C in batch.

[0090] Furthermore, in Figure 18A, the symbol TA represents the surface (device surface or main surface) of substrate W (W1, W2). The back surface of substrate W is the surface opposite to the surface of substrate W. The device surface is the surface in which a device is formed, or the surface in the middle of forming a device. Furthermore, in Figure 18A, for ease of illustration, 5 substrates W1 represent 25 substrates W1, and 5 substrates W2 represent 25 substrates W2.

[0091] [Step S01] Vertical orientation conversion of the first substrate group Referring to Figure 1, an external transport robot (not shown) sequentially transports two racks C to the wafer loading / unloading machine 9. The rack transport robot 13 of storage block 2 transports the first rack C from the wafer loading / unloading machine 9 towards the placement shelf 3. Assume that the first rack C houses, for example, 25 substrates W1 (the first substrate group) neatly arranged at a reference pitch (e.g., 10 mm pitch) with a repeating reference interval TN9. The substrate manipulation mechanism HTR of transfer block 5, using, for example, 25 hands 27, removes the 25 substrates W1 in a horizontal position from the first rack C placed on the placement shelf 3. Then, the substrate manipulation mechanism HTR transports the removed 25 substrates W1 to the posture conversion mechanism 19. Furthermore, the rack transport robot 13 moves the empty first rack C, now containing the 25 substrates W1, from the placement shelf 3 to the storage shelf 11.

[0092] Referring to Figure 18A, the posture conversion mechanism 19 receives 25 substrates W1 neatly arranged at a reference pitch from the substrate operation mechanism HTR. In the posture conversion mechanism 19, the 25 substrates W1 are held (placed) in 25 pairs of shelves 37A of a pair of horizontal holding portions 37. Referring to Figure 18B, the receiving and moving portion 53 of the posture conversion mechanism 19 (refer to Figure 4) moves a pair of vertical holding portions 39 close to a pair of horizontal holding portions 37. Thereby, the periphery of the 25 substrates W1 is received and held in 25 pairs of holding grooves 39C of the pair of vertical holding portions 39.

[0093] Referring to Figure 18C, the posture conversion mechanism 19 then converts the 25 substrates W1 (first substrate group) held at a reference pitch from a horizontal posture to a vertical posture. Specifically, the rotation drive unit 41 of the posture conversion mechanism 19 converts the 25 substrates W1 held by a pair of horizontal holding parts 37 and a pair of vertical holding parts 39 from a horizontal posture to a vertical posture. Then, the axial movement unit 51 of the posture conversion mechanism 19 (refer to Figure 4) moves the pair of horizontal holding parts 37 toward the support surface 35A, so that the 25 pairs of shelves 37A of the pair of horizontal holding parts 37 move away from the 25 substrates W1 in the vertical posture.

[0094] [Step S02] Receiving of the first substrate group by the push rod member Referring to Figure 19A. Then, the push rod lifting portion 65 of the push rod mechanism 21 (refer to Figure 8) raises the push rod member 55 to a position higher than the pair of horizontal holding portions 37 and the pair of vertical holding portions 39. Here, the push rod member 55 receives the 25 substrates W1 (first substrate group) converted to a vertical position. Furthermore, the push rod member 55 holds the 25 substrates W1, neatly arranged at a reference pitch, in a vertical position. In addition, the 50 vertical holding slots 67 are arranged with unequal pitches.

[0095] [Step S03] Movement of the first substrate group performed by the first interval Referring to Figure 19B, the push rod mechanism 21 moves the 25 substrates W1 held by the push rod member 55 along the neatly arranged direction of the 25 substrates W1 by a first interval TN1 (3.333 mm). Specifically, the push rod rotating part 59 of the push rod mechanism 21 (refer to Figure 8) rotates the push rod member 55 180 degrees around the vertical axis AX3. This causes the 25 substrates W1 held by the push rod member 55 to move to the left by the first interval TN1. Furthermore, the movement by the first interval TN1 can be achieved by the 180-degree rotation of the push rod member 55 by the push rod rotating part 59 and the movement of the push rod horizontal moving part 61 (refer to Figure 8) of the push rod member 55 in the width direction Y.

[0096] Furthermore, the posture conversion mechanism 19 rotates the pair of horizontal holding parts 37 by 90 degrees around the horizontal axis AX2. This causes the pair of horizontal holding parts 37 to stand upright. The axial movement part 51 of the posture conversion mechanism 19 (see Figure 4) moves the pair of horizontal holding parts 37 away from the support surface 35A. Also, the receiving movement part 53 of the posture conversion mechanism 19 (see Figure 4) moves the pair of vertical holding parts 39 away from the pair of horizontal holding parts 37.

[0097] [Step S04] Vertical orientation conversion of the second substrate group Figure 1 shows a rack-transfer robot 13 transporting a second rack C from a wafer loading / unloading machine 9 towards a placement shelf 3. Assuming that the second rack C, like the first rack C, houses, for example, 25 substrates W2 neatly arranged at a reference pitch (10 mm pitch). The substrate handling mechanism HTR, using 25 hands 27, removes the 25 substrates W2 in a horizontal position from the second rack C placed on the placement shelf 3. Then, the substrate handling mechanism HTR transports the removed 25 substrates W2 to a posture conversion mechanism 19. Furthermore, the rack-transfer robot 13 moves the empty second rack C, now empty of the 25 substrates W2, from the placement shelf 3 to a storage shelf 11.

[0098] Referring to Figure 19C, the posture conversion mechanism 19 receives 25 substrates W2 neatly arranged at a reference pitch from the substrate operation mechanism HTR. In the posture conversion mechanism 19, the 25 substrates W2 are held in 25 pairs of shelves 37A of a pair of horizontal holding portions 37. Referring to Figure 20A, the receiving and moving portion 53 of the posture conversion mechanism 19 (referring to Figure 4) moves a pair of vertical holding portions 39 close to a pair of horizontal holding portions 37.

[0099] Referring to Figure 20B. Then, the posture conversion mechanism 19 converts the 25 substrates W2 (second substrate group) held at the reference pitch from a horizontal posture to a vertical posture. Then, the axial movement part 51 of the posture conversion mechanism 19 (refer to Figure 4) moves one pair of horizontal holding parts 37 toward the support surface 35A, so that the 25 pairs of shelves 37A of the pair of horizontal holding parts 37 move away from the 25 substrates W1 in the vertical posture.

[0100] [Step S05] Receiving of the second substrate group by the push rod member Referring to Figure 20C, the push rod lifting section 65 of the push rod mechanism 21 (refer to Figure 8) then raises the push rod member 55 to a position higher than the pair of horizontal holding sections 37 and the pair of vertical holding sections 39. Here, the push rod member 55 receives the 25 substrates W2 (second substrate group) that have been converted to a vertical position. Furthermore, the push rod member 55 holds 50 substrates W (W1, W2) arranged neatly with unequal pitches. The 50 substrates W are constructed by alternating 25 substrates W1 and 25 substrates W2.

[0101] The process of raising the push rod member 55 as shown in Figures 20B to 20C will be explained in further detail later with reference to Figures 24 to 28.

[0102] [Step S06] The processing substrate group is transferred from the loading mechanism to the pitch conversion unit. Then, the loading mechanism 71 moves 50 substrates W (processed substrate group) arranged in a unequal pitch from the push rod member 55 toward the first pitch conversion section 25. This operation will be described in detail. Refer to Figure 21A. First, the posture conversion mechanism 19 rotates a pair of horizontal holding parts 37 by 90 degrees around the horizontal axis AX2. This causes the pair of horizontal holding parts 37 to stand upright.

[0103] Referring to Figure 21B. Next, the loading mechanism 71 moves the clamp 77 horizontally from above the first pitch conversion section 25 to below the push rod member 55. The clamp 77 is in a closed state capable of holding 50 substrates W. Then, the push rod mechanism 21 lowers the push rod member 55, which holds the 50 substrates W in a vertical position. As the push rod member 55 passes between the pair of clamp members 77A and 77B of the clamp 77, the 50 substrates W are delivered from the push rod member 55 to the clamp 77. The clamp 77 holds the 50 substrates W, neatly arranged with unequal pitches, in a vertical position.

[0104] Referring to Figure 22A, the loading mechanism 71 then moves the clamp 77 from a position above the push rod member 55 to a position above the first pitch conversion section 25. Referring to Figure 22B, the lifting section 141 of the first pitch conversion section 25 (refer to Figure 10) then raises the pitch conversion body section 111, which includes 25 holding members 113. Thereby, the first pitch conversion section 25 receives 50 substrates W from the loading mechanism 71.

[0105] [Step S07] Pitch conversion of processing substrate groups from unequal pitch to narrow pitch Referring to Figure 23A. Then, the first pitch conversion unit 25 converts the pitch of the 50 substrates W from unequal pitch to a narrow pitch (3.333 mm). In other words, the first pitch conversion unit 25 arranges the 50 substrates W, which were previously arranged with unequal pitch, into a narrow pitch. This operation will be explained in detail.

[0106] The 25 retaining members 113 of the first pitch conversion section 25 each have two retaining grooves 117 that are separated by a first interval (3.333 mm). The first pitch conversion section 25 uses the two retaining grooves 117 of each of the 25 retaining members 113 to hold two substrates W1 and W2 out of 50 substrates W, and uses the 25 retaining members 113 to hold 50 substrates W that are neatly arranged with unequal pitches.

[0107] Furthermore, the moving part 115 of the first pitch conversion part 25 (see Figure 13) changes the unequal pitch state of the 50 substrates W arranged in an unequal pitch to a narrow pitch state of the 50 substrates W arranged in a narrow pitch, thereby moving the 25 holding members 113 along the neat arrangement direction (Y direction) of the 50 substrates W. In addition, the intermediary mechanism 73 pre-sets the clamp 78 to the open state.

[0108] [Step S08] The transfer of the processed substrate group to the first handover location by the intermediary agency. Referring to Figure 23B. Next, the intermediary mechanism 73 lowers the clamp 78 (as shown by the dotted line) to receive the 50 substrates W neatly arranged with a narrow pitch, held by the first pitch conversion unit 25. Then, the intermediary mechanism 73 closes the clamp 78. This establishes a state where the clamp 78 can hold the 50 substrates W.

[0109] Subsequently, the intermediary mechanism 73 raises the clamp 78 to the first handover position P1. Here, the intermediary mechanism 73 can receive 50 substrates W from the first pitch conversion section 25 and deliver the 50 substrates W to the main transport mechanism WTR. Furthermore, the clamp 78 holds the 50 substrates W, neatly arranged with a narrow pitch, in a vertical position.

[0110] [Step S09] Substrate processing and drying Subsequently, the main transport mechanism WTR uses clamp 145 to receive 50 substrates W from the intermediary mechanism 73 and transports the 50 substrates W to one of the two chemical treatment tanks BT1 and BT3. For example, while the main transport mechanism WTR is transporting the 50 substrates W to the chemical treatment tank BT1, the elevator LF1, positioned above the chemical treatment tank BT1, receives the 50 substrates W arranged neatly with a narrow pitch from the transport mechanism WTR. Then, the elevator LF1 lowers the 50 substrates W, immersing them in the chemical solution stored in the chemical treatment tank BT1. In this way, the entire batch of 50 substrates W is treated with the chemical solution.

[0111] Furthermore, after a preset chemical treatment time, the elevator LF1 lifts 50 substrates W from the chemical treatment tank BT1. Then, the elevator LF1 moves the 50 substrates W horizontally from above the chemical treatment tank BT1 to above the cleaning tank BT2. Next, the elevator LF1 lowers the 50 substrates W, immersing them in the pure water stored in the cleaning tank BT2. In this way, the entire batch of 50 substrates W is cleaned. After a preset cleaning time, the elevator LF1 lifts the 50 substrates W from the pure water in the cleaning tank BT2.

[0112] In addition, while the main conveying mechanism WTR transports 50 substrates W to the chemical treatment tank BT3, the elevator LF2's autonomous conveying mechanism WTR receives the 50 substrates W. Then, the elevator LF2 sequentially transports the 50 substrates W towards the chemical treatment tank BT3 and the cleaning treatment tank BT4.

[0113] The main conveyor WTR uses clamp 145 to receive 50 substrates W from one of the two elevators LF1 and LF2, and then transports the 50 substrates W to the drying section 143. The drying section 143 dries the 50 substrates W. Afterwards, the main conveyor WTR receives the 50 dried substrates W from the drying section 143.

[0114] Referring to Figures 24A to 28, the process in which the push rod member 55 is raised relative to the pair of horizontal holding portions 37 and the pair of vertical holding portions 39 in Figures 20B to 20C above, and the substrate W of the second substrate group W1 held in the pair of vertical holding portions 39 is combined with the substrate W of the first substrate group W1 held in the push rod member 55 at a first interval TN1, will be described in further detail.

[0115] Figure 24A is a side view illustrating the characteristic parts of the operation of the substrate processing apparatus 1, and Figure 24B is a side view illustrating the operation of the previous substrate processing apparatus. Figure 25 is a top view of the posture conversion section and push rod mechanism performing the operation shown in Figure 24A. Figure 26 is a top view of the posture conversion section and push rod mechanism performing the operation shown in Figure 24B. Figure 27A is a cross-sectional view of the vertical holding section 39 shown in Figure 25 cut along line y2-y2. Figure 27B is a cross-sectional view of the previous vertical holding section 390 shown in Figure 26 cut along line y3-y3. Figure 28 is an enlarged view of the holding member 39A surrounded by the two-point chain line in Figure 27A.

[0116] As the pusher member 55 shown in Figure 20B rises, as shown in Figure 24A, a pair of vertical holding portions 39 holding 25 substrates W (W2) are inserted into the front end side of the 25 substrates W (W1) held in the pusher member 55. Specifically, the substrates W (W1) are inserted between holding members 39A and 39A. Furthermore, at both ends of the pair of vertical holding portions 39 in the Y direction, the substrates W (W1) are inserted between the inner wall of the pair of vertical holding portions 39 and the holding member 39A. The first substrate group W1 and the second substrate group W2 must be held in the pusher member with unequal pitch. Therefore, the 25 substrates W (W1) held in the pusher member 55 are inserted close to the position of the pair of vertical holding portions 39 holding 25 substrates W (W2).

[0117] As shown in FIG. 25, the retaining member 39A has a retaining groove 39C located at a position offset from the center 39Ba in the width direction along the arrangement direction of the substrates W towards the first interval TN1 when the first substrate group W1 and the second substrate group W2 are combined. Specifically, the deepest part 39Ca of the retaining groove 39C is located at a position offset from the center 39Ba in the width direction of the retaining member 39A towards the first interval TN1. As shown in FIG. 27A and FIG. 27B described later, the retaining member 39A has an outer side surface 39C1s extending downward from the outer end edge 390C1a. In the part where the substrate W (W1) held in the pusher member 55 and the substrate W (W2) held in the retaining member 39A are arranged at the first interval TN1, the gap c1 between the outer side surface 39C1s of the retaining member 39A and the substrate W1 held in the pusher member 55 is sufficiently wider than the previous configuration described later. The gap c1 is the size of the space between the outer side 39C1s of the retaining member 39A and the substrate W1 held in the pusher member 55. Therefore, when the substrate W1 held in the pusher member 55 intends to pass through the side of the retaining member 39A with the substrate W2 held in the retaining member 39A at a first gap TN1, the substrate W1 is unlikely to collide with the outer side 39C1s of the retaining member 39A.

[0118] In response to this, as shown in Figures 24B and 26, the previous retaining member 390A has a retaining groove 370C located at the center 390Ba in the width direction of the retaining member 390A. Specifically, the deepest part 390Ca of the retaining groove 370C is located at the center 390Ba in the width direction of the retaining member 39A. In the portion where the substrate W (W1) held in the push rod member 55 and the substrate W (W2) held in the retaining member 390A are arranged at a first interval TN1, the gap c10 between the outer side 390C1s of the retaining member 390A of the substrate W2 and the substrate W1 held in the push rod member 55 is very narrow. Therefore, when the substrate W1 held in the push rod member 55 intends to pass through the side of the retaining member 390A at the first interval TN1 with the substrate W2 held in the retaining member 390A, there is a risk that the substrate W2 may collide with the outer side 390C1s of the retaining member 390A.

[0119] The retaining member 39A will be described in further detail.

[0120] As shown in Figures 27A and 28, the retaining groove forming portion 39D, located above the link line z1 between the two points, includes: a first retaining wall portion 39C1 that contacts one end Wa1 of the peripheral portion Wa of the substrate W into which it is inserted into the retaining groove 39C, and a second retaining wall portion 39C2 that contacts the other end Wa2 of the peripheral portion Wa of the substrate W into which it is inserted into the retaining groove 39C. The first retaining wall portion 39C1 is on the first interval TN1 side of the retaining groove forming portion 39D. The second retaining wall portion 39C2 is on the second interval TN2 side of the retaining groove forming portion 39D. The first retaining wall portion 39C1 and the second retaining wall portion 39C2 are provided in the number of retaining grooves 39C.

[0121] The thickness of the first retaining wall portion 39C1 in the width direction refers to the thickness along the width direction (left-right direction y in the illustration) of the neatly arranged direction DR1 of the substrate W. The thickness t1 of the first retaining wall portion 39C1 in the width direction is thinner than the thickness t2 of the second retaining wall portion 39C2 located at the same groove depth. A retaining groove 39C is formed by the inner surfaces of the first retaining wall portion 39C1 and the second retaining wall portion 39C2. The deepest part 39Ca of the retaining groove 39C is the deepest part 39Ca of both the first retaining wall portion 39C1 and the second retaining wall portion 39C2. The thickness t3 in the width direction from the deepest part 39Ca of the first retaining wall portion 39C1 to the outer surface 39C1s of the first retaining wall portion 39C1 is thinner than the thickness t4 in the width direction from the deepest part 39Ca of the second retaining wall portion 39C2 to the outer surface 39C2s of the second retaining wall portion 39C2. In this way, the substrate W2 (center line z2 of substrate W2) held in the holding groove 39C is significantly offset from the center 39Ba of the holding member 39A in the width direction toward the side where the first gap TN1 is provided. That is, the substrate W1, which is separated from the substrate W2 held in the holding groove 39C by the gap TN1, is significantly moved away from the outer side 39C1s of the first holding wall portion 39C1. Therefore, the gap C1 is wider than the previous gap C10.

[0122] In response to this, in the previous retaining member 390A, as shown in FIG27B, the thickness t10 in the width direction of the first retaining wall portion 390C1 is the same as the thickness t20 in the width direction of the second retaining wall portion 390C2 located at the same groove depth. Furthermore, the thickness t30 in the width direction from the deepest part 390Ca of the first retaining wall portion 390C1 to the outer surface 390C1s of the first retaining wall portion 390C1 is the same as the thickness t40 in the width direction from the deepest part 390Ca of the second retaining wall portion 390C2 to the outer surface 390C2s of the second retaining wall portion 390C2. Therefore, the substrate W2 (the center line z2 of the substrate W2) held in the retaining groove 390C is located at the center 390Ba in the width direction of the retaining member 390A. That is, the substrate W1, which is spaced apart from the substrate W2 held in the holding groove 390C by a distance TN1, is closer to the outer side 390C1s of the first holding wall portion 390C1. Therefore, the previous gap C10 is narrower than the gap C1 of the present invention.

[0123] The cross-sectional shapes of the first retaining wall portion 39C1 and the second retaining wall portion 39C2 are asymmetrical with respect to the center line z3 passing through the deepest part 39Ca of the retaining groove 39C. The center line z3 is located on the side where the first gap TN1 is provided, closer to the center 39Ba in the width direction of the retaining member 39A. In contrast, in the previous retaining member 390A, the cross-sectional shapes of the first retaining wall portion 390C1 and the second retaining wall portion 390C2 are symmetrical with respect to the center line z30 passing through the deepest part 390Ca located in the center of the retaining groove 390C. The center line z30 passes through the center of the retaining groove 390C and through the center 390Ba in the width direction of the retaining member 390A. In this invention, since the first retaining wall portion 39C1 and the second retaining wall portion 39C2 do not thin uniformly when the gap C1 is narrowed, the rigidity of the retaining member 39A can be ensured.

[0124] The thickness of the retaining groove forming portion 39D in the width direction is formed to be approximately constant from the base end to the front end. Within the approximately constant width, the thickness of the first retaining wall portion 39C1 is reduced, while the thickness of the second retaining wall portion 39C2 is increased. Since the retaining groove forming portion 39D consists of a thinner first retaining wall portion 39C1 and a thicker second retaining wall portion 39C2, the required rigidity is ensured overall.

[0125] The thickness of the retaining groove support portion 39E in the width direction is greater than the thickness t3 of the first retaining wall portion 39C1. The thickness of the retaining groove support portion 39E in the width direction is greater than the thickness t4 of the second retaining wall portion 39C2. The thickness of the retaining groove support portion 39E in the width direction is equal to the thickness from the outer side 39C1s of the first retaining wall portion 39C1 to the outer side 39C2s of the second retaining wall portion 39C2. The rigidity of the retaining member 39A increases as it approaches the retaining groove support portion 39E.

[0126] The retaining member 39A is formed of a fluorinated resin such as PTFE (polytetrafluoroethylene). Fluorinated resins have excellent heat resistance and chemical resistance. Fluorinated resins are softer than metals. Therefore, when the retaining member 39A formed of fluorinated resin is placed on a horizontally positioned substrate W or holds a vertically positioned substrate W, it is less likely to damage the substrate W. However, since fluorinated resins are also relatively soft among synthetic resins, they are more prone to deformation compared to harder synthetic resins.

[0127] The retaining groove forming member 39D (i.e., the first retaining wall portion 39C1 and the second retaining wall portion 39C2) and the retaining groove support portion 39E are formed integrally. The retaining groove support portion 39E is integrally formed on the vertical retainer 39F. Since fluoropolymer resins are easily deformable, if the first retaining wall portion 39C1 is thinned, the retaining member 39A is easily deformed. As in this invention, by providing a thicker second retaining wall portion 39C2 on the opposite side of the thinner first retaining wall portion 39C1, the rigidity of the retaining member 39A can be improved, making the retaining member 39A less prone to deformation. Furthermore, the retaining groove support portion 39E can also be configured to be joined to the vertical retainer 39F by means of a bonding device such as an adhesive or screws.

[0128] Secondly, referring to Figure 29, the operation of the latter half, from the drying process to the transfer of the carrier C from the wafer loading and unloading machine 9, will be explained.

[0129] [Step S11] The main conveyor mechanism transports the processed substrate group to the second handover position. Referring to Figures 2 and 30A, the main transport mechanism WTR processes the entire batch of 50 substrates W arranged vertically with a narrow pitch in the chemical treatment tank BT1, and transports them to a position above the second pitch conversion section 26. In other words, the main transport mechanism WTR transports the 50 substrates W, which have been dried by the drying section 143, to a position above the second pitch conversion section 26.

[0130] Subsequently, the main transfer mechanism WTR lowers the 50 substrates W held by the clamp 145 to the transfer position P2. Here, the main transfer mechanism WTR transports the 50 substrates W, arranged vertically in a narrow pitch, to the second pitch conversion unit 26. The second pitch conversion unit 26 then receives the 50 substrates W, arranged vertically in a narrow pitch, from the main transfer mechanism WTR. Furthermore, when receiving the 50 substrates W, the second pitch conversion unit 26 pre-moves 25 holding members 113 to arrange the 50 holding slots 117 in a narrow pitch configuration.

[0131] [Step S12] Pitch conversion from narrow pitch to unequal pitch processing substrate group Referring to Figure 30B. Next, the second pitch conversion unit 26 converts the pitch of the 50 substrates W from a narrow pitch to an unequal pitch. This operation will be explained in detail. The second pitch conversion unit 26 holds two substrates W at a first interval TN1 using two holding slots 117, each of the 25 holding members 113 separated by a first interval TN1, and simultaneously holds the 50 substrates W arranged neatly with a narrow pitch using the same 25 holding members 113. The moving unit 115 (referring to Figure 13) moves the 25 holding members 113 along the neatly arranged direction (width direction Y) of the 50 substrates W in a manner that changes the pitch from a narrow pitch state to an unequal pitch state.

[0132] [Step S13] The processing substrate group is transferred to the push rod member by the transfer mechanism. Referring to Figure 31A. Then, the transfer mechanism 75 of the transfer mechanism 23 transfers 50 substrates W, neatly arranged with unequal pitches, vertically from the second pitch conversion section 26 to the push rod member 55. This operation will be explained in detail. The clamp 79 of the transfer mechanism 75 is in the closed state. First, the lifting section 141 of the second pitch conversion section 26 (refer to Figure 10) lowers the pitch conversion body 111, which includes 25 holding members 113. During this descent, the transfer mechanism 75 uses the clamp 79 to receive and hold the 50 substrates W, neatly arranged with unequal pitches in a vertical position.

[0133] Referring to Figure 31B. Next, the transfer mechanism 75 transfers the 50 substrates W held by the clamp 79 from a position above the second pitch conversion section 26 to a position above the push rod member 55. Then, the push rod mechanism 21 raises the push rod member 55 to a position higher than the clamp 79. During this raising, the push rod mechanism 21 uses the push rod member 55 to receive and hold the 50 substrates W from the clamp 79 of the transfer mechanism 75. The push rod member 55 holds the 50 substrates W, which are neatly arranged with unequal pitches, in a vertical position.

[0134] [Step S14] Reception of the second substrate group by the posture conversion unit Referring to Figure 32A. Then, the removal mechanism 75 moves the clamp 79 to a position above the second pitch conversion section 26. Next, the rotation drive unit 41 of the posture conversion mechanism 19 rotates the pair of horizontal holding sections 37 by 90 degrees around the horizontal axis AX2 so that the pair of vertical holding sections 39 can receive 25 substrates W2 (the second substrate group). This brings the pair of horizontal holding sections 37 and the pair of vertical holding sections 39 into a tilted state. Furthermore, the axial movement unit 51 moves the pair of horizontal holding sections 37 closer to the support surface 35A, and the receiving movement unit 53 moves the pair of vertical holding sections 39 closer to the pair of horizontal holding sections 37.

[0135] Refer to Figure 32B. Subsequently, the push rod mechanism 21 lowers the push rod member 55 from a position above the pair of vertical holding portions 39 to a position below them. During this descent, the posture conversion mechanism 19 uses the pair of horizontal holding portions 37 and the pair of vertical holding portions 39 to receive 25 substrates W2 (the second substrate group) from the push rod member 55 out of 50 substrates W (processed substrate group). The pair of vertical holding portions 39 holds the 25 substrates W2 neatly arranged at a reference pitch (10 mm pitch). Then, the axial movement portion 51 moves the pair of horizontal holding portions 37 away from the support surface 35A. Hereby, the 25 pairs of shelves 37A of the pair of horizontal holding portions 37 contact the back surfaces of the 25 substrates W2 respectively.

[0136] Furthermore, as shown in FIG32A, the moving part 115 of the second pitch conversion part 26 moves 25 (24) retaining members 113 by means of 50 retaining slots 117 arranged in a narrow pitch. As shown in FIG32B, the lifting part 141 of the second pitch conversion part 26 raises the pitch conversion body part 111 containing 25 retaining members 113 by means of 50 retaining slots 117 arranged at a position higher than the clamp 79.

[0137] [Step S15] Vertical orientation conversion of the second substrate group See Figure 33A. The posture conversion mechanism 19 rotates a pair of horizontal holding parts 37 by 90 degrees around the horizontal axis AX2. In this way, the posture conversion mechanism 19 converts the 25 substrates W2 from a vertical posture to a horizontal posture. Then, the receiving and moving part 53 moves the pair of vertical holding parts 39 away from the pair of horizontal holding parts 37. In doing so, the periphery of 25 substrates W2 is taken out from the 25 pairs of holding grooves 39C of the pair of vertical holding parts 39.

[0138] As shown in Figure 1, the rack-transfer robot 13 pre-transfers an empty second rack C from the storage shelf 11 to the placement shelf 3. The substrate handling mechanism HTR retrieves 25 substrates W2 (see Figure 33B) that have been converted to a horizontal position by the posture conversion mechanism 19 and are neatly arranged at a reference pitch. Then, the substrate handling mechanism HTR transfers the 25 substrates W2 into the second rack C placed on the placement shelf 3. Afterward, the rack-transfer robot 13 transfers the second rack C containing the 25 substrates W2 from the placement shelf 3 to the wafer loading / unloading machine 9.

[0139] [Step S16] Movement of the first substrate group performed by the first interval Referring to Figure 33B, after the posture conversion mechanism 19 converts the 25 substrates W2 to a horizontal posture, the push rod mechanism 21 raises the push rod member 55 that holds the 25 substrates W1 (the first substrate group).

[0140] Furthermore, the push rod mechanism 21 moves the 25 substrates W1 held by the push rod member 55 along the neatly arranged direction of the 25 substrates W1 by a first interval TN1 (3.333 mm). Specifically, the push rod rotating part 59 of the push rod mechanism 21 (see Figure 8) rotates the push rod member 55 180 degrees around the vertical axis AX3. Thereby, the 25 substrates W1 held by the push rod member 55 move to the right by the first interval TN1. In addition, the movement made by the first interval TN1 can be performed by the 180-degree rotation of the push rod member 55 by the push rod rotating part 59 and the movement of the push rod horizontal moving part 61 (see Figure 8) in the width direction Y of the push rod member 55.

[0141] [Step S17] Reception of the first board group by the posture conversion unit Referring to Figure 33C, the posture conversion mechanism 19 sets the pair of horizontal holding parts 37 and the pair of vertical holding parts 39 to a tilted state. Furthermore, the axial movement part 51 moves the pair of horizontal holding parts 37 closer to the support surface 35A, and the receiving movement part 53 moves the pair of vertical holding parts 39 closer to the pair of horizontal holding parts 37.

[0142] Referring to Figure 34A. Next, the push rod mechanism 21 lowers the push rod member 55 from a position above the pair of vertical holding portions 39 to a position below them. During this descent, the posture conversion mechanism 19 receives the remaining 25 substrates W1 from the push rod member 55 using the pair of horizontal holding portions 37 and the pair of vertical holding portions 39. The pair of vertical holding portions 39 holds the 25 substrates W1 neatly arranged at a reference pitch (e.g., 10 mm pitch). Then, the axial movement portion 51 brings the 25 pairs of shelves 37A of the pair of horizontal holding portions 37 into contact with the back surfaces of the 25 substrates W1.

[0143] [Step S18] Vertical orientation conversion of the first substrate group Referring to Figure 34B, the posture conversion mechanism 19 rotates the pair of horizontal holding portions 37 by 90 degrees around the horizontal axis AX2. This causes the posture conversion mechanism 19 to convert the 25 substrates W1 from a vertical position to a horizontal position. Referring to Figure 34C, the receiving and moving part 53 then moves the pair of vertical holding portions 39 away from the pair of horizontal holding portions 37.

[0144] As shown in Figure 1, the rack-transfer robot 13 first moves an empty first rack C from the storage shelf 11 to the placement shelf 3. The substrate handling mechanism HTR takes out 25 substrates W1 (see Figure 34C) that have been converted to a horizontal position by the posture conversion mechanism 19 and are neatly arranged at a reference pitch (10 mm pitch) from the posture conversion mechanism 19. Then, the substrate handling mechanism HTR moves the 25 substrates W1 to the first rack C placed in the placement shelf 3. After that, the rack-transfer robot 13 moves the first rack C containing the 25 substrates W1 from the placement shelf 3 to the wafer loading and unloading machine 9. Then, an external transfer robot (not shown) sequentially moves the two racks C from the wafer loading and unloading machine 9 to the next destination.

[0145] Furthermore, the aforementioned "reference pitch" is equivalent to the "equal pitch" of this invention. The aforementioned "holding member 39A" is equivalent to the "holding member" of this invention. The aforementioned "posture conversion mechanism 19" is equivalent to the "first mechanism" of this invention. The aforementioned "push rod mechanism 21" is equivalent to the "second mechanism" of this invention.

[0146] According to this embodiment, the posture conversion mechanism 19 has a pair of vertical holding portions 39 that hold substrates W in a vertical posture arranged neatly at a reference pitch. The push rod mechanism 21 combines the second substrate group W2 held by the posture conversion mechanism 19 with the first substrate group W1 pre-delivered from the posture conversion mechanism 19, holding a plurality of substrates W neatly arranged with unequal pitches alternating between a first interval TN1 and a second interval TN2 wider than the first interval TN1. The pitch conversion portion 25 receives the plurality of substrates W neatly arranged with unequal pitches from the push rod mechanism 21, causing the plurality of substrates W neatly arranged with unequal pitches to be neatly arranged with a narrow pitch that repeats the first interval TN1. The processing block 7 processes the plurality of substrates neatly arranged with narrow pitches in batches. The main transport mechanism WTR transports a plurality of substrates arranged neatly with a narrow pitch to the processing block 7. Each pair of vertical holding parts 39 has a holding groove 39C formed along the periphery Wa of the substrate W in each holding member 39A. The holding groove 39C is provided at the center of each holding member 39A in the width direction along the neat arrangement direction of the substrate W, offset to the side of the first spacing TN when the first substrate group W1 is combined with the aforementioned second substrate group W2.

[0147] As described above, the vertically aligned substrates W, arranged neatly at a reference pitch, are arranged neatly at a narrow pitch via the posture conversion mechanism 19, the push rod mechanism 21, and the pitch conversion section 25. Multiple substrates arranged neatly at a narrow pitch are processed in batches by the processing block 7. This reduces the amount of processing liquid (chemical solution and cleaning solution) used in the processing block 7. The push rod mechanism 21 combines the second substrate group W2 held by the posture conversion mechanism 19 with the first substrate group W1 pre-delivered from the posture conversion mechanism 19, holding multiple substrates W neatly arranged at unequal pitches with alternating first interval TN1 and a second interval TN2 wider than the first interval TN1. During this combination, there is a concern that interference may occur at the location where the substrates W of the second substrate group W2 held by the holding member 39A or the holding member 39A, and the substrates W of the first substrate group W1 held by the push rod member 55. Therefore, a retaining groove 39C is provided on a pair of vertical retaining portions 39 at a position offset laterally from the center of the retaining member 39A along the width direction of the neatly arranged substrate W, towards the position where the first interval TN1 is arranged when the first substrate group W1 and the second substrate group W2 are combined. This makes it difficult for interference to occur between the retaining member 39A or the substrate W of the second substrate group W2 held on the retaining member 39A, and the substrate W of the first substrate group W1 held on the pusher member 55, even at the position where the first interval TN1 is used. Therefore, a substrate processing apparatus 1 that can efficiently process substrate W can be provided.

[0148] Furthermore, the posture conversion mechanism 19 includes: a pair of horizontal holding portions 37 that arrange the shelves 37A at the ends of the horizontally positioned substrate W at a reference pitch, and a pair of vertical holding portions 39 that arrange the holding members 39A that hold the vertically positioned substrate W at a reference pitch. The posture conversion mechanism 19 converts the posture of a plurality of substrates W between a vertical and a horizontal posture by rotating and displacing the pair of horizontal holding portions 37 and the pair of vertical holding portions 39. The push rod mechanism 21 has a push rod member 55, which combines the second group of vertically positioned substrates W2 held by the pair of vertical holding portions 39 with the first group of vertically positioned substrates W1 pre-delivered from the pair of vertical holding portions 30, and holds a plurality of substrates W neatly arranged at unequal pitches. The holding member 39A has a holding groove 39C formed along the periphery Wa of the vertically positioned substrate W. A retaining groove 39C is provided in the retaining member 39A at a position offset from the center along the width direction of the neatly arranged direction DR1 of the substrates W held in a vertical posture, towards the side where the first interval TN1 is arranged when the first substrate group W1 and the second substrate group W2 are combined. This makes it difficult for the substrates W of the second substrate group W2 held in a pair of vertical retaining parts 39 to interfere with the substrates W of the first substrate group W1 pre-delivered from the pair of vertical retaining parts 39 to the pusher member 55 when the retaining member 39A or the substrates W of the second substrate group W2 held in the retaining member 39A and the substrates W of the first substrate group W1 held in the pusher member 55 are to interfere with each other. Therefore, a substrate processing apparatus 1 that can efficiently process substrates W can be provided.

[0149] Furthermore, the holding member 39A is located at the deepest part 39Ca of the holding groove 39C, offset laterally from the center in the width direction towards the position where the first interval TN1 is arranged when the first substrate group W1 and the second substrate group W2 are combined. This allows the substrate W to be held at the deepest part 39Ca of the holding groove 39C, offset laterally towards the position where the first interval TN1 is arranged when the first substrate group W1 and the second substrate group W2 are combined. Therefore, even at the point where the substrate is combined with the first interval TN1, interference between the holding member 39 of the posture conversion mechanism 19 holding the substrate W2 and the substrate held in the second mechanism is unlikely to occur. Therefore, a substrate processing apparatus 1 that can efficiently process substrate W can be provided.

[0150] Furthermore, the retaining member 39A includes: a first retaining wall portion 39C1 at one end of the peripheral portion Wa of the substrate W inserted into the retaining groove 39C, and a second retaining wall portion 39C2 at the other end of the peripheral portion Wa of the substrate W inserted into the retaining groove 39C. The thicknesses in the width direction of the first retaining wall portion 39C1 and the second retaining wall portion 39C2 at the same groove depth position are different. Here, in order to minimize interference between the retaining members 39A of the pair of vertical retaining portions 39 or the substrate W of the second substrate group W2 held in the retaining member 39A and the substrate W of the first substrate group W1 held in the pusher member 55, the thicknesses in the width direction of both the first retaining wall portion 39C1 and the second retaining wall portion 39C2 are reduced by the same dimension. However, if the thickness of the retaining wall portions in the width direction is reduced by the same dimension, the rigidity of the retaining member 39A decreases on both sides of the first retaining wall portion 39C1 and the second retaining wall portion 39C2. Therefore, the retaining member 39A is prone to deformation, making it difficult to maintain the dimensional accuracy of the retaining member 39A. In this invention, the thickness in the width direction at the same groove depth position of the first retaining wall portion 39C1 and the second retaining wall portion 39C2 constituting the retaining member 39A is different. This prevents the rigidity of the retaining member 39 from decreasing in either the first retaining wall portion 39C1 or the second retaining wall portion 39C2. As a result, the retaining member is less prone to deformation, and the dimensional accuracy of the retaining part W material is easily maintained.

[0151] Furthermore, the thickness t1 in the width direction of the first retaining wall portion 39C1 is thinner than the thickness t2 in the width direction of the second retaining wall portion 39C2, which is located at the same groove depth. The first retaining wall portion 39C1 is provided on the side where the first spacer TN1 is arranged when the first substrate group W1 and the aforementioned second substrate group W2 are combined. The second retaining wall portion 39C2 is provided on the side where the second spacer TN2 is arranged when the first substrate group W1 and the second substrate group W2 are combined. This prevents the rigidity of the retaining member 39 from decreasing between the first retaining wall portion 39C1 and the second retaining wall portion 39C2. As a result, the retaining member is less prone to deformation, and the dimensional accuracy of the retaining part W material is easily maintained. Furthermore, even in the portion assembled with the first interval TN1, the thickness t1 of the first retaining wall portion 39C1 is thin, so it is difficult for interference to occur between the retaining member 39A or the substrate W of the second substrate group W2 held in the retaining member 39A and the substrate W of the first substrate group W1 held in the push rod member 55.

[0152] Furthermore, the thickness t3 in the width direction from the deepest part 39Ca of the retaining groove 39C to the outer side 39C1s of the first retaining wall 39C1 is thinner than the thickness t4 in the width direction from the deepest part 39Ca of the retaining groove 39C to the outer side 39C2 of the second retaining wall 39C2. This ensures the rigidity of the retaining member 39A from the deepest part 39Ca of the retaining groove 39C to the upper surface of the retaining groove 39C. Also, because the thicknesses t1 and t3 of the first retaining wall 39C1 from the deepest part 39Ca of the retaining groove 39C to the upper surface of the retaining groove 39C are thinner, interference between the retaining member 39A or the substrate W of the second substrate group W2 held in the retaining member 39A and the substrate W of the first substrate group W1 held in the push rod member 55 is less likely to occur.

[0153] Furthermore, when the retaining member 39A is cut along the width direction of DR1, which is the regular arrangement direction along the substrate W, the cross-sectional shape of the first retaining wall portion 39C1 and the second retaining wall portion 39C2 is asymmetrical with respect to the center line z3 of the deepest part 39Ca of the retaining groove 39C. The cross-sectional shape of the first retaining wall portion 39C1 is approximately a right-angled triangle. The cross-sectional shape of the second retaining wall portion 39C2 is approximately a trapezoid. In this way, the first retaining wall portion 39C1 and the second retaining wall portion 39C2 have the same cross-sectional shape, which ensures the rigidity of the retaining member 39A compared to a configuration that reduces the thickness of the first retaining wall portion 39C1 and the second retaining wall portion 39C2.

[0154] Furthermore, the cross-sectional shape of the first retaining wall portion 39C1 of the retaining member 39A is such that the length t1 from a depth position shallower than the deepest part 39Ca to the width direction of the outer side surface 39C1s of the first retaining wall portion 39C1 is shorter than the length t2 from the same depth position to the width direction of the outer side surface 39C2s of the second retaining wall portion 39C2. Therefore, the thickness of the first retaining wall portion 39C1 at a depth position shallower than the deepest part 39Ca of the retaining groove 39C becomes thinner, thus making it difficult for interference to occur between the retaining member 39A or the substrate W of the second substrate group W2 held in the retaining member 39A and the substrate W of the first substrate group W1 held in the push rod member 55.

[0155] Furthermore, a shelf 37A is provided on the side where the second spacing TN2 is arranged when the first substrate group W1 and the second substrate group W2 are assembled. Therefore, since the shelf 37A is provided on the side where the second spacing TN2 is arranged when the first substrate group W1 and the second substrate group W2 are combined, it is difficult for it to interfere with the substrate held in the push rod mechanism 21 when the first substrate group W1 and the second substrate group W2 are combined.

[0156] The present invention is not limited to the above-described embodiments, and may be implemented in the following variations.

[0157] (1) In Embodiment 1 described above, not only the deepest part 39Ca of the retaining groove 39C, but also the entire retaining groove 39C is disposed near the first spacing TN1 when the first substrate group W1 and the second substrate group W2 are combined, at the center 39Ba in the width direction of the substrate W's alignment direction DR1. However, the configuration of the retaining groove 39C is not limited to this form. That is, as shown in FIG35A, the deepest part 39Ca of the retaining groove 39C only needs to be disposed near the first spacing TN1 at the center 39Ba in the width direction of the substrate W's alignment direction DR1. The retaining groove 39C can be extended to the second spacing TN2 at the center 39Ba in the width direction. Furthermore, the retaining groove 39C can be formed throughout the width direction of the retaining member 39A. For example, the retaining groove 39C shown in FIG35B is formed throughout the width direction of the retaining member 39A. Furthermore, the cross-sectional shapes of the first retaining wall portion 39C1 and the second retaining wall portion 39C2 are asymmetrical relative to the center line z3 of the deepest part 39Ca of the retaining groove 39C.

[0158] (2) In Embodiment 1 above, the retaining groove 39C is a V-shaped groove, but the shape of the retaining groove 39C is not limited to this. The bottom of the retaining groove 39C2, that is, the deepest part 39Ca, may be flat. As shown in FIG. 35C, the deepest part 39Ca of the retaining groove 39C2 may be curved. The retaining groove 39C may not have an inclined surface 39B. For example, as shown in FIG. 35D, the deepest part 39Ca is flat, and the groove is formed at a right angle relative to the deepest part 39Ca. The bottom of the retaining groove 39C may be multi-tiered. The cross-sectional shape of the first retaining wall portion 39C1 and the second retaining wall portion 39C2 is asymmetrical with respect to the center line z3 passing through the deepest part 39Ca of the retaining groove 39C. In FIG. 35D, the deepest part 39Ca of the retaining groove 39C is the center of the width direction along the arrangement direction of the substrate W in the flat deepest part 39Ca.

[0159] (3) In Embodiment 1 described above, the retaining groove 39C is offset from the center 39Ba of the retaining member 39A in the width direction along the arrangement direction DR1 of the substrate W towards the side where the first spacing TN1 is provided. However, the position of the retaining groove 39C in the retaining member 39A is not limited to this. For example, the deepest part 39Ca of the retaining groove 39C shown in FIG. 36A is located at the center 39Ba in the width direction of the retaining member 39A. However, the retaining groove 39C is offset towards the side where the first spacing TN1 is provided in the retaining member 39A as a whole. Therefore, the first retaining wall portion 39C1 and the second retaining wall portion 39C2 are asymmetrical in shape across the center line z3 passing through the deepest part 39Ca of the retaining groove 39C. Furthermore, in FIG. 36, the center line z3 passes through the center 39Ba of the retaining member 39A. The cross-sectional shape of the first retaining wall portion 39C1 and the second retaining wall portion 39C2 is approximately trapezoidal. The second retaining wall portion 39C2 protrudes further towards the center 39Ba than the first retaining wall portion 39C1. That is, the substrate W2 protrudes towards the first retaining wall portion 39C1. The first retaining wall portion 39C1 and the second retaining wall portion 39C2 have the same thickness (t3, t4) at the deepest point 39Ca. However, the thickness (t1, t2) of the first retaining wall portion 39C1 and the second retaining wall portion 39C2 differs at a depth shallower than the deepest point 39Ca. The cross-sectional shapes of the first retaining wall portion 39C1 and the second retaining wall portion 39C2 differ in the width direction length (t1, t2) at a depth shallower than the deepest point 39Ca.

[0160] Furthermore, the deepest part 39Ca of the retaining groove 39C shown in Figure 36B is located at the center 39Ba of the retaining member 39A in the width direction. However, the second retaining wall 39C2 of the retaining groove 39C bulges slightly outward. Therefore, the first retaining wall 39C1 and the second retaining wall 39C2 are asymmetrical in shape across the center line z3 passing through the deepest part 39Ca of the retaining groove 39C. The cross-sectional shape of the first retaining wall 39C1 is approximately a right-angled triangle. The cross-sectional shape of the second retaining wall 39C2 is a quarter circle. The second retaining wall 39C2 protrudes further towards the center 39Ba than the first retaining wall 39C1. That is, the substrate W2 protrudes towards the first retaining wall 39C1. The thicknesses (t3, t4) of the first retaining wall 39C1 and the second retaining wall 39C2 are the same at the depth of the deepest part 39Ca. However, because the first retaining wall portion 39C1 and the second retaining wall portion 39C2 have asymmetrical shapes, their thicknesses (t1, t2) differ at depths shallower than the deepest portion 39Ca. The cross-sectional shapes of the first retaining wall portion 39C1 and the second retaining wall portion 39C2 also differ in width (t1, t2) at depths shallower than the deepest portion 39Ca.

[0161] Thus, the thickness t3 of the retaining member 39A in the width direction from the deepest part 39Ca of the retaining groove 39C to the outer side 39C1s of the first retaining wall 39C1 is the same as the thickness t4 in the width direction from the deepest part 39Ca of the retaining groove 39C to the outer side 39C2s of the second retaining wall 39C2. However, the thickness t1 of the retaining member 39A in the width direction from a depth position shallower than the deepest part 39Ca to the outer side 39C1s of the first retaining wall 39C1 is different from the thickness t2 in the width direction from the same depth position to the outer side 39C2s of the second retaining wall 39C2. Therefore, compared to a configuration where the thicknesses of the first retaining wall 39C1 and the second retaining wall 39C2 are the same, the thickness of the first retaining wall 39C1 at a depth position shallower than the deepest part 39Ca of the retaining groove 39C is thinner. Therefore, it is difficult for interference to occur between the holding member 39A or the substrate W of the second substrate group W2 held in the holding member 39A and the substrate W of the first substrate group W1 held in the push rod member 55.

[0162] Furthermore, the thickness t1 of the retaining member 39A in the width direction from a depth position shallower than the deepest part 39Ca to the outer surface 39C1s of the first retaining wall 39C1 is thinner than the thickness t2 in the width direction from the same depth position to the outer surface 39C2s of the second retaining wall 39C2. This ensures the rigidity of the retaining member 39A at a depth position shallower than the deepest part 39Ca of the retaining groove 39C. Also, the thinner thickness of the first retaining wall 39C1 at a depth position shallower than the deepest part 39Ca of the retaining groove 39C makes interference between the retaining member 39A, the substrate W of the second substrate group W2 held in the retaining member 39A, and the substrate W of the first substrate group W1 held in the pusher member 55 less likely to occur.

[0163] (4) In the above-described embodiment 1, the posture conversion mechanism 19 was described as an example of the "first mechanism" of the present invention. However, any mechanism that has a holding part for holding substrates arranged in a vertical posture with equal pitches does not need to be the posture conversion mechanism 19 of embodiment 1. In the above-described embodiment 1, the push rod mechanism 21 was described as an example of the "second mechanism" of the present invention. However, any mechanism that combines the second substrate group held by the first mechanism with the first substrate group pre-delivered from the first mechanism and holds a plurality of substrates arranged in a unequal pitch with alternating repeating first intervals and second intervals wider than the first intervals does not need to be the push rod mechanism 21 of embodiment 1.

[0164] This invention may be implemented in other specific forms without departing from its idea or essence; therefore, for the purpose of indicating the scope of the invention, reference should be made to the appended claims rather than the above description.

[0165] 1: Substrate processing device 2: Storage block 3: Shelf 5: Transfer Block 7: Processing Block 8: Batch substrate transfer area 9: Wafer loading and unloading machine 11: Storage shelves 13: Carrier transport robot 15: Fixed Section 19: Posture Conversion Mechanism 21: Push rod mechanism 23: Handover Organization 25, 26: Pitch conversion section 27: Hands 29: Hand support section 31: Advancement and Retreat Section 33: Lifting and Rotating Part 35: Support Taiwan 35A: Support surface 37: Leveling section 37A: Shelf 37B: Placement Surface 39: Vertical support section 39A: Retaining Member 39B: Inclined surface 39Ba: Center in the width direction 39C, 87, 88, 95, 96, 107, 108, 117: Retaining groove 39Ca: Deepest part / Deepest part 39C1: First retaining wall portion 39C1a: outer edge 39C1s: Outer surface 39C2: Second retaining wall portion 39C2a: outer edge 39C2s: Outer surface 39C3: Inclined surface 39C3a: First inclined surface 39C3b: Second inclined surface 39D: Retaining groove forming part / Retaining groove forming component 39E: Retaining slot support section 39F: Vertical support 41: Rotary drive unit 51: Axial moving part 55: Push rod component 57: Rotation axis 59: Push rod rotating part 61: Horizontal movement part of the push rod 61A, 121, 147: Guide rails 61B: Slider 63: Lifting Platform 65: Push rod lifting section 67: Vertical holding groove 71: Moving-in agency 73: Intermediary agencies 75: Moving-out agency 77, 78, 79, 145: Fixtures 77A: Fixture component / First fixture component / Fixture / Fixture component 77B: Fixture component / Second fixture component / Fixture / Fixture component 78A: Fixture component / First fixture component 78B: Fixture component / Second fixture component 79A, 79B, 145A, 145B: Fixture components 81: Opening and Closing Section 83, 91: Forward and backward moving parts 85: Width direction moving part 89: Opening and Closing Section 93: Width direction moving part 101: Opening and Closing Section 103: Arm 105: Lifting Unit 111: Pitch conversion body section 113, 113A~113E: Retaining components 115: Mobile Department 119: Base components 119A: Opening 123: Telescopic mechanism 125: Drive Unit 125A: Rod-shaped body 127: Connecting Part 129, 129A, 129B, 129C: Linkage members 131: Sales 133, 133A, 133B: Connectors 141: Lifting Unit 143: Drying Section 151: Control Department 390: Vertical holding part 390A: Retaining Member 390Ba: Center 390C: deepest part 390C1: First retaining wall portion 390C1a: Outer edge 390C1s: Outer side 390C2: Second retaining wall portion 390Ca: deepest part AA: Arrow AX1, AX3: Vertical axes AX2: Horizontal axis C: Carrier / First Carrier / Second Carrier c1, c10: Gap BT1~BT4: Chemical treatment tanks DR1: Direction H1: Loading height position H2: Move out at height position HTR: Substrate Manipulation Mechanism (Robot) LF1, LF2: Elevators P1: First handover position P2: Second handover position / handover location S01~S09, S11~S18: Steps SW: Screw TA: Surface of substrate TN1: First Interval / Interval TN2: Second Interval TN9: Reference Interval t1, t2: thickness / length t3, t4, t10, t20, t30, t40: Thickness W: substrate W1: 1st board group / board W2: 2nd board group / board Wa: Periphery Wa1: One end Wa2: The other end WTR: Main Transport Mechanism X: Forward / backward direction Y: Width direction yy, y1-y1, y2-y2, y3-y3: lines Z: Vertical direction z1: Two-point chain z2, z3, z30: Centerline

Claims

1. A substrate processing apparatus for processing substrates, comprising: a first mechanism having a holding portion for holding substrates in a vertically aligned manner with equal pitch; a second mechanism for combining a second group of substrates held by the first mechanism with a first group of substrates pre-delivered from the first mechanism, and holding a plurality of substrates in an unequal pitch alignment with alternating repeating a first interval and a second interval wider than the first interval; and a pitch conversion unit for receiving the plurality of substrates in the aforementioned unequal pitch alignment from the second mechanism, and aligning the plurality of substrates in the aforementioned unequal pitch alignment with a narrow pitch alignment with repeating the aforementioned first interval. The substrate processing unit processes a batch of the aforementioned plurality of substrates arranged neatly with the aforementioned narrow pitch; and the main conveying mechanism conveys the aforementioned plurality of substrates arranged neatly with the aforementioned narrow pitch to the aforementioned substrate processing unit; and the aforementioned holding unit has a holding groove formed along the periphery of the aforementioned substrate, and the aforementioned holding groove is provided at a position offset from the center in the width direction along the neat arrangement direction of the aforementioned substrates towards the side offset of the aforementioned first interval when the aforementioned first substrate group and the aforementioned second substrate group are combined.

2. The substrate processing apparatus of claim 1, wherein the first mechanism is a posture conversion mechanism, comprising: a pair of horizontal holding portions that arrange the end shelves of the substrates in a horizontal posture at the aforementioned equal pitch, and a pair of vertical holding portions that arrange the holding members of the substrates in a vertical posture at the aforementioned equal pitch, and wherein the posture of a plurality of substrates is converted between a vertical posture and a horizontal posture by rotating and displacing the aforementioned pair of horizontal holding portions and the aforementioned pair of vertical holding portions; the second mechanism is a push rod mechanism having the aforementioned push rod member, wherein the push rod member combines the aforementioned second substrate group in a vertical posture held by the aforementioned pair of vertical holding portions with the aforementioned first substrate group in a vertical posture pre-delivered from the aforementioned pair of vertical holding portions, and holds the aforementioned plurality of substrates arranged neatly at the aforementioned unequal pitch; The aforementioned retaining member has a retaining groove formed along the periphery of the aforementioned vertically oriented substrate, and the aforementioned retaining groove is provided at a position offset from the center of the aforementioned width direction along the neat arrangement direction of the aforementioned substrates held in the aforementioned vertical orientation, toward the position where the aforementioned first interval is arranged when the aforementioned first substrate group and the aforementioned second substrate group are combined.

3. The substrate processing apparatus of claim 2, wherein the deepest part of the aforementioned holding member in the aforementioned holding groove is located at a position offset from the center in the aforementioned width direction toward the side offset of the aforementioned first interval when the aforementioned first substrate group and the aforementioned second substrate group are combined.

4. The substrate processing apparatus of claim 2 or 3, wherein the aforementioned retaining member comprises: a first retaining wall portion that retains one end of the peripheral portion of the substrate before it is inserted into the aforementioned retaining groove; and a second retaining wall portion that retains the other end of the peripheral portion of the substrate before it is inserted into the aforementioned retaining groove; and the thickness of the first retaining wall portion and the second retaining wall portion in the aforementioned width direction is different at the same groove depth position.

5. The substrate processing apparatus of claim 4, wherein the thickness of the first retaining wall portion in the width direction is thinner than the thickness of the second retaining wall portion in the width direction located at the same groove depth; and the first retaining wall portion is provided on the side where the first interval is disposed when the first substrate group and the second substrate group are combined; and the second retaining wall portion is provided on the side where the second interval is disposed when the first substrate group and the second substrate group are combined.

6. The substrate processing apparatus of claim 5, wherein the thickness of the aforementioned retaining member in the width direction from the deepest part of the aforementioned retaining groove to the outer side of the aforementioned first retaining wall is thinner than the thickness in the width direction from the deepest part of the aforementioned retaining groove to the outer side of the aforementioned second retaining wall.

7. The substrate processing apparatus of claim 4, wherein the thickness of the aforementioned retaining member in the width direction from the deepest part of the aforementioned retaining groove to the outer side of the aforementioned first retaining wall is the same as the thickness in the width direction from the deepest part of the aforementioned retaining groove to the outer side of the aforementioned second retaining wall, and the thickness in the width direction from a depth position shallower than the aforementioned deepest part to the outer side of the aforementioned first retaining wall is different from the thickness in the width direction from the same depth position to the outer side of the aforementioned second retaining wall.

8. The substrate processing apparatus of claim 4, wherein the thickness of the aforementioned retaining member in the width direction from the deepest part of the aforementioned retaining groove to the outer side of the aforementioned first retaining wall is the same as the thickness in the width direction from the deepest part of the aforementioned retaining groove to the outer side of the aforementioned second retaining wall, and the thickness in the width direction from a depth position shallower than the aforementioned deepest part to the outer side of the aforementioned first retaining wall is thinner than the thickness in the width direction from the same depth position to the outer side of the aforementioned second retaining wall.

9. The substrate processing apparatus of claim 4, wherein the cross-sectional shape of the aforementioned first retaining wall portion and the aforementioned second retaining wall portion of the aforementioned retaining member is asymmetrical relative to the centerline passing through the deepest part of the aforementioned retaining groove when the aforementioned retaining member is cut along the width direction of the neat arrangement direction of the aforementioned substrate.

10. The substrate processing apparatus of claim 4, wherein the cross-sectional shape of the first retaining wall portion of the aforementioned retaining member is such that the length from a depth position shallower than the aforementioned deepest part to the outer side surface of the first retaining wall portion in the aforementioned width direction is shorter than the length from the same depth position to the outer side surface of the aforementioned second retaining wall portion in the aforementioned width direction.

11. The substrate processing apparatus of claim 2, wherein the shelf is provided on the side where the second interval is disposed when the first substrate group and the second substrate group are combined.