Connector assembly, electronic assembly and method of manufacturing electrical connector

Abstract

This specification provides a connector assembly for forming a connection to a subassembly such as a processor card, which may include signal contact tips formed of a material different from that of an associated cable conductor. These signal contact tips may be formed of a hyperelastic material such as nickel-titanium. The connector assembly may include ground contact tips that similarly form a pressure contact to allow the electrical component to be electrically connected to a shielding element of a cable shield. Cable shielding housing modules interlocked or interfaced with a support member can be used to manufacture connectors having any desired number of signal and ground contact tips arranged in any suitable number of rows and columns. Each module may terminate a cable and provide a pressure-mounted connection between the signal conductor of the cable and the shielding element and a conductive pad on the subassembly, with a conductive or lossy grounding structure surrounding the conductive element carrying the signal through the module.

Description

Technical Field

[0001] The specific examples disclosed pertain to the design, materials, and usage methods of intermediate board connector assemblies. [Related Applications] []

[0002] This application claims the benefit of U.S. Provisional Application No. 62 / 902,820, filed September 19, 2019, pursuant to 35 USC § 119(e), which is incorporated herein by reference in its entirety. Prior Technology

[0003] Electrical connectors are used in many electronic systems. It is generally easier and more economical to manufacture systems as individual electronic subassemblies (such as printed circuit boards; PCBs) that can be coupled with electrical connectors. Separable connectors allow for the easy assembly of components from electronic systems manufactured by different companies. Separable connectors also allow for the easy replacement of components after system assembly, to replace defective components or upgrade the system with more efficient components.

[0004] A known configuration for joining several printed circuit boards (PCBs) is to have one PCB act as a baseboard. Other PCBs, referred to as "daughterboards," "daughter cards," or "intermediate boards," can be connected via the baseboard. The baseboard is a PCB to which numerous connectors can be mounted. Conductive traces in the baseboard can be electrically connected to signal conductors in the connectors so that signals can be routed between the connectors. Daughter cards may also have connectors mounted thereon. Connectors mounted on daughter cards can be inserted into connectors mounted on the baseboard. In this way, signals can be routed between daughter cards via the baseboard. Daughter cards can be inserted into the baseboard at right angles. Connectors used for such applications may therefore include right-angle bends and are often referred to as "right-angle connectors."

[0005] Connectors can also be used in other configurations for interconnecting printed circuit boards. Sometimes, one or more smaller printed circuit boards can be connected to another larger printed circuit board. In such configurations, the larger printed circuit board can be called the "main board," and the printed circuit boards connected to it can be called daughter boards. Also, boards of the same or similar size can sometimes be aligned parallel to each other. Connectors used in these applications are often called "stack connectors" or "mezzanine connectors."

[0006] Connectors can also be used to transmit signals to or from electronic devices. Connectors (called "I / O connectors") are typically mounted to a printed circuit board at the edge of the board. They can be configured to accommodate a plug at one end of the connector assembly, allowing cables to be connected to the printed circuit board via the I / O connector. The other end of the connector assembly can be connected to another electronic device.

[0007] Cables are also used for connections within the same electronic device. Cables can be used to carry signals from I / O connectors to processor assemblies located inside a printed circuit board, away from the edge where the I / O connectors are mounted. In other configurations, both ends of the cable can be connected to the same printed circuit board. Cables can be used to carry signals between components mounted to a printed circuit board, with each end of the cable connected to the printed circuit board near those components.

[0008] Transmitting signals via cables rather than printed circuit boards is advantageous because cables provide a high signal integrity path, particularly for high-frequency signals (such as signals above 40 Gbps using the NRZ protocol). Cables are known to have one or more signal conductors wrapped around a dielectric material, which in turn is wrapped around a conductive layer. A protective sheath, often made of plastic, may surround these components. Additionally, other parts of the sheath or cable may include fibers or other structures for mechanical support.

[0009] A type of cable, known as a "twin cable," is constructed to support differential signal transmission and has a pair of balanced signal wires embedded in a dielectric material and surrounded by a conductive layer. This conductive layer is typically formed using a foil such as aluminum polyester film (Mylar). Twin cables may also have bleed wires. Unlike signal wires, which are typically surrounded by a dielectric material, bleed wires may be uncoated, allowing them to contact the conductive layer at multiple points along the cable's length. At the end of the cable to be terminated to a connector or other termination structure, the protective sheath, dielectric material, and foil can be removed, exposing portions of the signal wires and bleed wires at the cable end. These wires can be attached to the termination structure, such as a connector. The signal wires can be attached to conductive elements that act as mating contacts in the connector structure. The foil can be attached directly or via the bleed wires (if present) to the ground conductor in the termination structure. In this way, any ground return path from the cable to the termination structure can continue.

[0010] High-speed, high-bandwidth cables and connectors have been used to route signals to or from processors and other electrical components that handle large volumes of high-speed, high-bandwidth signals. These cables and connectors reduce the attenuation of signals transmitted to or from these components to a fraction of the attenuation that might occur when the same signal is routed through a printed circuit board. Summary of the Invention

[0011] In some specific examples, a connector assembly having at least one cable including at least one first cable conductor and an electrical connector includes: a first contact tip including a superelastic conductive material configured to mate with a first signal contact of a circuit board; and a first conductive coupler that mechanically couples the first contact tip to the first cable conductor. The first conductive coupler at least partially surrounds the periphery of the first contact tip and the periphery of the first cable conductor.

[0012] In some specific examples, the connector assembly includes: a plurality of cables, each of the plurality of cables including at least one cable conductor having one end; a plurality of contact tips, wherein each of the plurality of contact tips includes an end adjacent to the end of the respective cable conductor and is made of a material different from the respective cable conductor; and a plurality of conductive couplers. Each of the plurality of conductive couplers includes a first end with teeth at least partially surrounding one of the plurality of contact tips and a second end with teeth at least partially surrounding the end of the respective cable conductor.

[0013] In some specific examples, a connector assembly includes: a first contact tip; a first cable conductor electrically connected to the contact tip; a first conductive coupler including a first end mechanically coupled to the first contact tip and a second end coupled to the first cable conductor; and a housing including an opening therethrough, wherein the opening includes a first end defined by a first wall and a second end defined by a second wall, and the first contact tip passes through the first wall, the first cable conductor passes through the second wall, and the first conductive coupler is disposed in the opening.

[0014] In some specific examples, an electrical connector includes: a housing including a first surface and a first side surface transverse to the first surface; an electrical contact tip protruding from the cable connector housing and exposed at the first surface; and at least one member configured to accommodate a socket therein, wherein the socket is defined by a second side surface. A first portion of the first side surface includes a second surface having an angle greater than 0 degrees and less than 90 degrees relative to the first surface. A second portion of the second side surface includes a third surface parallel to the second surface and positioned to engage the second surface when the housing is accommodated in the socket.

[0015] In some specific examples, a method of connecting a cable to a substrate includes: positioning a housing, wherein a first surface of the housing faces a surface of the substrate; applying a first force to the housing in a first direction, wherein the first direction is parallel to the surface of the substrate; engaging a second surface on the housing with a third surface on the socket, such that a second force is generated on the housing in a second direction perpendicular to the first direction; using the second force to push a grounding contact tip against a grounding contact disposed on the surface of the substrate; and using the second force to push a first electrical contact tip against a first signal contact disposed on the surface of the substrate.

[0016] In some specific examples, a method of manufacturing an electrical connector includes: mechanically and electrically connecting a first cable conductor formed of a first material to a first electrical contact tip formed of a conductive superelastic material different from the first material; attaching a component to the first cable conductor and / or the first electrical contact tip; and positioning the component in the housing, wherein the first electrical contact tip is exposed in a surface of the housing and the first cable conductor extends from the housing.

[0017] In some specific examples, an electrical connector includes a first contact tip formed of a first material, a first cable conductor formed of a second material different from the first material and electrically connected to the first contact tip at a joint, and a housing including an opening therethrough, wherein the joint is disposed in the opening, wherein the opening is defined by an inner surface of the housing, and at least a portion of the inner surface is coated with a conductor.

[0018] In some specific examples, an electrical connector kit includes: a contact tip; a conductive coupler including a first end configured to be mechanically coupled to the first contact tip and a second end configured to be mechanically coupled to a cable conductor; and a housing including an opening therethrough, wherein the opening includes a first end defined by a first wall and a second end defined by a second wall. The housing is configured to receive the first contact tip via the first wall, the housing is configured to receive the cable conductor via the second wall, and the opening is configured to receive the conductive coupler.

[0019] In some specific examples, an electrical connector includes: a first contact tip formed of a first material; a first cable conductor formed of a second material different from the first material; a capacitor electrically connecting the first contact tip to the first cable conductor; and a housing including an opening therethrough, wherein the capacitor is disposed in the opening.

[0020] In some specific examples, a connector assembly includes: a circuit board including a first signal contact, wherein the first signal contact includes a groove; and a first contact tip comprising a superelastic conductive material configured to mate with the first signal contact. The first signal contact is configured to align the first contact tip with a longitudinal centerline of the groove when the first contact tip mates with the first signal contact.

[0021] It should be understood that the foregoing concepts and the additional concepts discussed below can be configured in any suitable combination, as the invention is not limited in this respect. Furthermore, other advantages and novel features of the invention will become apparent when considered in conjunction with the accompanying drawings and the following detailed description of various non-limiting specific examples. Simple Explanation of the Diagram

[0022] The accompanying illustrations are not intended to be drawn to scale. In the illustrations, every identical or nearly identical component depicted in different figures may be represented by the same number. For clarity, not every component is labeled in every illustration. In the illustrations:

[0023] [Figure 1] is a perspective view of a portion of an exemplary specific example of an electronic system having a cable that winds signals between the I / O connector and the intermediate board area;

[0024] [Figure 2] is a side view of the system in Figure 1;

[0025] [Figure 3] is a perspective view of another illustrative specific example of an electronic system, showing the connection between the connector assembly and the top and bottom surfaces of the substrate of the processor sub-assembly that can be mounted in the middle board portion of the electronic system;

[0026] [Figure 4] is a perspective view of an exemplary specific example of a portion of a connector assembly having a connector that can be connected to the top surface of a sub-assembly;

[0027] [Figure 5] is a perspective view of an exemplary specific example of a portion of a connector assembly having a connector that can be connected to the bottom surface of a sub-assembly;

[0028] [Figure 6] is a perspective view of a portion of an exemplary specific example of an electronic system in which cables are connected to the top and bottom surfaces of a substrate within the electronic system;

[0029] [Figure 7] is a side view of the cable and connector assembly in Figure 6;

[0030] [Figure 8] is a perspective view of a specific example of a connector for connecting a cable to the top surface of the sub-assembly in Figure 6;

[0031] [Figure 9] is a cross-sectional view of the connector assembly connected to the substrate in Figure 6;

[0032] [Figure 10] is a perspective view of an illustrative specific example of a connector, wherein a portion of the connector housing has been removed to expose the mating interface of the connector;

[0033] [Figure 11] is an enlarged perspective view of the pairing of the signal contact tip and the ground contact tip of the mating interface in Figure 10;

[0034] [Figure 12A] is a plot of representative stress-strain curves for known materials and hyperelastic materials;

[0035] [Figure 12B] is a graph showing the contact force varying according to deflection for an illustrative example of a contact tip undergoing hyperelastic deformation;

[0036] [Figure 13] is a perspective view of an illustrative specific example of a non-bleeding twin-strand cable;

[0037] [Figure 14A] is a top view of a portion of an exemplary specific example of a substrate having a conductive pad to which a middle plate connector can be connected;

[0038] [Figure 14B] is a bottom view of the substrate in Figure 14A;

[0039] [Figure 15] is an exploded view of an exemplary specific example of a connector module having a coupler, a signal contact tip, and a ground contact tip;

[0040] [Figure 16] is a perspective view of the coupler in Figure 15;

[0041] [Figure 17] is an exploded view of another specific example of a connector module having a coupler, a signal contact tip, and a ground contact tip;

[0042] [Figure 18] is a cross-sectional view of the coupler, signal contact tip, and ground contact tip of Figure 15;

[0043] [Figure 19] is an enlarged cross-sectional view of the coupler, signal contact tip, and ground contact tip in Figure 18;

[0044] [Figure 20] is a top perspective view of the coupler, signal contact tip, and ground contact tip of Figure 18;

[0045] [Figure 21] is a perspective view of another specific example of the connector assembly;

[0046] [Figure 22] is a perspective view of an illustrative specific example of a connector socket;

[0047] [Figure 23] is a cross-sectional view of the connector in Figure 21 and the connector socket in Figure 22 in the uncoupled state;

[0048] [Figure 24] is a cross-sectional view of the connector assembly of Figure 21 and the connector socket of Figure 22 in the coupled state;

[0049] [Figure 25] is an enlarged perspective view of a specific example of the mating interface of a connector module;

[0050] [Figure 26] is an enlarged side view of the mating interface in Figure 25;

[0051] [Figure 27] is a cross-sectional view of an exemplary specific example of a connector assembly secured in a connector socket using a spring latch;

[0052] [Figure 28] is a side view of the connector assembly and spring latch of Figure 27;

[0053] [Figure 29] is a perspective view of an exemplary specific example of a connector assembly with multiple rows of contact tips;

[0054] [Figure 30] is a cross-sectional view of the connector assembly in Figure 29 taken along line 30-30;

[0055] [Figure 31] is a perspective view of an exemplary specific example of a portion of a connector formed by a housing module;

[0056] [Figure 32] is a perspective view of an exemplary specific example of a portion of the connector forming the two columns of the housing module of Figure 31;

[0057] [Figure 33] is a perspective view of a portion of the connector of Figure 32, including the top metal sheet;

[0058] [Figure 34] is a front view of the connector assembly in Figure 33;

[0059] [Figure 35] is a perspective view of the connector of Figure 32, including the support member for retaining the connector module;

[0060] [Figure 36] is a perspective view of a portion of a connector having a housing module according to another specific example;

[0061] [Figure 37] is an enlarged view of the outer shell module in Figure 36;

[0062] [Figure 38] is a perspective view of an exemplary specific example of a connector module including electronic components;

[0063] [Figure 39A] is a first bottom perspective view of an exemplary specific example of a coupler including a capacitor;

[0064] [Figure 39B] is a top perspective view of the coupler and capacitor in Figure 39A;

[0065] [Figure 40] is a cross-sectional view of another specific example of a connector having conductors coupled via capacitors;

[0066] [Figure 41] is a perspective view of another specific example of a connector module;

[0067] [Figure 42] is an exploded view of the connector module in Figure 41; and

[0068] [Figure 43] is an exploded view of a portion of the connector assembly including the connector module of Figure 41;

[0069] [Figure 44A] is a top view of a specific example of a conductive pad that can mate with the contact tip of an intermediate board connector;

[0070] [Figure 44B] is a cross-sectional view of the conductive pad in Figure 44A taken along line 44B-44B; and

[0071] [Figure 45] is a cross-sectional view of a specific example of the contact tip of an intermediate board connector that mates with the conductive pads of Figures 44A to 44B. Implementation

[0072] The inventors have recognized and understand designs for cable connectors used to enable the efficient manufacture of small, high-performance electronic devices (such as servers and switches). These cable connectors support high-density, high-speed signal connections to processors and other components in the middleboard area of ​​the electronic device. The other end of the cable terminated at the connector can be connected to an I / O connector or to another location away from the middleboard, allowing the connector assembly cable to carry high-speed signals with high signal integrity over long distances.

[0073] Connectors support pressure-mount interfaces to substrates (e.g., PCBs or semiconductor wafer substrates) that carry processors or other components that process large amounts of high-speed signals. Connectors can be incorporated into a relatively small volume to provide a large number of pressure-mount interconnect points. In some specific examples, connectors can support mounting on the top and bottom of daughter cards or other substrates that are shortly separated from the motherboard, thereby providing high-density interconnects. Additionally, connectors can have highly flexible contact tips, for example, those with extremely small diameters that still generate sufficient and constant contact force to provide a reliable electrical connection, even if the force applied towards the substrate varies.

[0074] The connector can terminate multiple cables, wherein the contact tips for each conductor in each cable are designed to couple to a signal conductor of a grounding structure within the cable and one or more contact tips. For non-bleeding twin-strand cables, for example, the connector may have two contact tips electrically coupled to the cable conductor and one or two contact tips coupled to a shield surrounding the cable conductor for each cable.

[0075] Based on the illustrative examples described herein, any appropriately sized cable conductor can be used and coupled to an appropriately sized contact tip. In some examples, the cable conductor may have a diameter of 30 AWG or less. In other examples, the cable conductor may have a diameter of 36 AWG or less.

[0076] Contact tips can be connected directly or via one or more intermediate components to conductive structures within the cable. For signal conductors, contact tips can be connected, for example, via couplers. Couplers can hold the cable conductor and contact tip in an axially aligned manner. Each of the tip and cable conductor can be secured to the coupler, such as by fusion, soldering, or crimping, which can electrically and mechanically couple the tip and cable conductor. In some specific instances, the coupler can be configured to hold electronic components such as surface-mount capacitors, such that the capacitors are coupled between the tip and the cable conductor. Grounding tips can be coupled to the cable shielding via a flexible conductive member such as a conductive elastomer.

[0077] The inventors have recognized and understand that, at the levels required for high-density interconnects, more reliable pressure-mounted connections can be achieved by suppressing slippage of the cable conductors and / or tips relative to the insulation structure of the cable and / or connector housing. A component can be attached to the cable conductors and / or tips to prevent such slippage. The component can abut against the connector housing or cable insulation to block slippage. For example, the component can be fitted into an opening in the connector housing such that slippage in both directions along the axial direction of the cable is suppressed. A coupler electrically coupling the cable conductors and contact tips can act as a component suppressing slippage.

[0078] To support high signal integrity interconnects, portions of cable connectors extending beyond the cable shield may be partially or completely surrounded by a grounding structure to ensure minimal impedance variation within the connector. Such grounding structures may include portions of the connector housing plated with metal (e.g., via a PVD process). These grounding structures may include contact tips or metal sheets connected to the surface of a substrate to which the cable and / or connector are mounted. In some specific examples, the grounding structure may include a conductive elastomer and / or electrically lossy components.

[0079] The mating force can be generated by a camming structure based on the force on the connector parallel to the substrate surface. This camming structure generates a force that pushes the connector toward the substrate. The camming structure can be implemented on surfaces on the connector housing and mounted to the substrate, these surfaces being inclined relative to the substrate. These surfaces can be positioned to engage when the connector is inserted into the socket, allowing the mating force to be generated by simple movement and without the need for fastening screws or other mechanisms to generate the force toward the substrate. Generating force via the camming structure reduces the need for mechanical components above or below the connector, thus expanding the area where the connector can be used in compact electronic devices. Furthermore, the mating caused by the parallel-to-substrate movement causes the connector contact tips to rub along the substrate surface, removing contaminants at the interface between the tips and the substrate and forming a more reliable electrical connection.

[0080] Pressure-mount connectors can also be relatively thin, thereby further expanding the area where the connector can be used. The connector can be thin enough to be mounted below a heatsink mounted on a chip, for example, or mounted to the upper and / or lower surfaces of a card containing a processor (such as a daughter card spaced relatively close to the motherboard). Mounting the connector to the upper and lower surfaces of the card increases contact density, thereby increasing the number of contacts per linear inch of the card edge and, similarly, per square inch of the card used for the mating interface between the connector assembly and the intermediate board of the electronics.

[0081] High contact density can also be achieved through the use of modules. Each module can couple contact tips to conductive structures within a finite number of cables (such as a single cable). Each module can have an insulating member with openings through which the conductors of the cables are spliced ​​to the contact tips. Contact tips of the shielding coupled to the cables can be mounted on the outer side of the insulating member. Modules can be aligned in one or more columns to create an array of contact tips. Modules can be closely spaced without being separated by the walls of the connector housing because the grounding structures on the outer sides of adjacent modules can touch each other, further increasing the density of the tip array. The grounding contact tips of adjacent modules can pass through the same openings in the insulating member of adjacent modules.

[0082] Electronic systems can be significantly improved by providing pressure-mounted electrical connectors that incorporate shape memory materials (referred to as hyperelastic materials in this paper) that exhibit hyperelastic properties (also known as pseudoelasticity).

[0083] Hyperelastic materials can be characterized by the strain required for them to yield, whereby hyperelastic materials must withstand higher strains before yielding. Furthermore, the shape of the stress-strain curves used for hyperelastic materials includes the "hyperelastic" region. Figure 12A shows illustrative stress-strain curves for both conventional and hyperelastic materials.

[0084] Hyperelastic materials can include shape memory materials that undergo a reversible martensitic phase transformation when a suitable mechanical driving force is applied. The phase transformation can be a diffusionless solid-to-solid phase transformation with associated shape change; this shape change allows hyperelastic materials to accommodate relatively large strains compared to conventional (i.e., non-hyperelastic) materials, and therefore hyperelastic materials often exhibit a much greater elastic limit than conventional materials. The elastic limit is defined herein as the maximum strain to which a material can be reversibly deformed without buckling.

[0085] Hyperelasticity is exhibited by many shape memory materials that possess a shape memory effect. Similar to hyperelasticity, the shape memory effect involves a reversible transformation between an austenite phase and a martensite phase, resulting in a corresponding shape change. However, the transformation in the shape memory effect is driven by temperature changes, rather than by mechanical deformation as in hyperelasticity. Specifically, materials exhibiting a shape memory effect can reversibly transform between two predetermined shapes after a temperature change intersecting with the transformation temperature. For example, a shape memory material can be "trained" to have a first shape at a low temperature (below the transformation temperature) and a second, different shape above the transformation temperature. Training a specific shape for a shape memory material can be accomplished by constraining the material's shape and performing appropriate heat treatments.

[0086] Depending on the specific instance, a hyperelastic material may possess a suitable intrinsic conductivity or may become appropriately conductive by coating or attaching it to a conductive material. For example, a suitable conductivity may be in the range of about 1.5 μΩcm to about 200 μΩcm. Examples of hyperelastic materials that may possess a suitable intrinsic conductivity include, but are not limited to, metal alloys such as copper-aluminum-nickel, copper-aluminum-zinc, copper-aluminum-manganese-nickel, nickel-titanium (e.g., nickel-titanium intermetallic compounds), and nickel-titanium-copper. Additional examples of potentially suitable metallic alloys include Ag-Cd (approximately 44-49 at% Cd), Au-Cd (approximately 46.5-50 at% Cd), Cu-Al-Ni (approximately 14-14.5 wt%, approximately 3-4.5 wt% Ni), Cu-Au-Zn (approximately 23-28 at% Au, approximately 45-47 at% Zn), Cu-Sn (approximately 15 at% Sn), Cu-Zn (approximately 38.5-41.5 wt% Zn), Cu-Zn-X (X = Si, Sn, Al, Ga, approximately 1-5 at% X), Ni-Al (approximately 36-38 at% Al), Ti-Ni (approximately 49-51 at% Ni), Fe-Pt (approximately 25 at% Pt), and Fe-Pd (approximately 30 at% Pd).

[0087] In some specific instances, a particular hyperelastic material may be selected based on its mechanical response rather than its electronic properties, and the hyperelastic material may not possess a suitable inherent conductivity. In such instances, the hyperelastic material may be coated with a highly conductive metal, such as silver, to improve conductivity. For example, chemical vapor deposition (CVD), particle vapor deposition (PVD), or any other suitable coating process may be used to apply the coating, as the invention is not limited thereto. Coated hyperelastic materials can also be particularly advantageous in high-frequency applications where most electrical conduction occurs near the surface of the conductor. As described in more detail below, in some specific instances, the conductivity of a connector element including a hyperelastic material can be improved by attaching the hyperelastic material to a known material that has a higher conductivity than the hyperelastic material. For example, the hyperelastic material may be used only in a portion of the connector element that is likely to undergo significant deformation, while other portions of the connector that do not deform significantly may be made of a known (high conductivity) material.

[0088] In some specific examples, contact pads mounted on a substrate (e.g., a PCB) may include recesses configured to receive contact tips and align the contact tips with the contact pads. The inventors have recognized the benefits of this configuration, which ensures a consistent electrical connection between the contact tips and the contact pads. In some cases, misalignment of the contact tips and contact pads can degrade signal activation and impedance at the interface between the contact tips and contact pads. That is, impedance and signal carrying capacity can be adjusted based on the specific location of the contact tips and contact pads. Therefore, if the contact pads align with the contact tips when the contact tips engage, the expected impedance and signal characteristics can be reliably achieved. In some specific examples, the contact pads may include semi-circular or additionally curved recesses configured to generate a normal force aligning the contact tips with the longitudinal centerline of the recess. In other specific examples, the contact pads may include V-grooves having sloping walls configured to generate a normal force aligning the contact tips with the longitudinal centerline of the groove. Recessed contact pads can be used for signal contact pads and / or ground contact pads, as the invention is not limited thereto.

[0089] Turning to the figures, specific non-limiting examples are described in more detail. It should be understood that the various systems, components, features, and methods described with respect to these specific examples may be used individually and / or in any desired combination, as the invention is not limited to the specific examples described herein.

[0090] Figures 1 and 2 show a perspective view and a side view, respectively, of an illustrative electronic system 100 in which a connector mounted at the edge 104 of a printed circuit board 102 (here, the motherboard) forms a cable connection with an intermediate board connector assembly 112A that mates with a printed circuit board (here, a daughter board 106 mounted in an intermediate board area above the printed circuit board 102). In the illustrated example, the intermediate board connector assembly 112A provides a low-loss path for transmitting electrical signals between one or more components (such as component 108) mounted to the daughter board 106 and locations outside the printed circuit board. For example, component 108 may be a processor or other integrated circuit chip. However, any suitable component on the daughter board 106 may receive or generate signals through the intermediate board connector assembly 112A.

[0091] In the illustrated example, the intermediate board connector assembly 112A couples signals to and from component 108 via I / O connectors 120 mounted in the panel 104 of the housing. The I / O connectors can mate with transceivers terminating active optical fiber assemblies that route signals to or from another device. Panel 104 is shown orthogonal to circuit board 102 and daughterboard 106. This configuration is common in many types of electronic devices because high-speed signals frequently pass through the panel of a housing containing a printed circuit board and must be coupled to high-speed components (such as processors or ASICs) located further from the panel than can be propagated through the printed circuit board with acceptable attenuation. However, the intermediate board connector assembly can be used to couple signals between locations within the printed circuit board and one or more other locations (inside or outside the housing).

[0092] In the example of Figure 1, the intermediate board connector assembly 112A, mounted at the edge of the daughterboard 106, is configured to support connection to the I / O connector 120. As can be seen, cable connectors are provided for connecting at least some of the signals from the I / O connectors in the panel 104 to other parts of the system. For example, a second connector (i.e., 112B) is present for connection to the daughterboard 106.

[0093] Cables 114A and 114B can electrically connect intermediate board connector assemblies 112A and 112B to locations remote from component 108 or further away from the location of intermediate board connector assemblies 112A or 112B attached to daughterboard 106. In the specific example illustrated in Figures 1 and 2, the first end 116 of cables 114A and 114B is connected to intermediate board connector assembly 112A or 112B, and the second end 118 of the cable is connected to I / O connector 120. However, connector assembly 120 may have any suitable function and / or configuration, as the invention is not limited thereto. In some specific examples, higher frequency signals (such as signals greater than 10 GHz, 25 GHz, 56 GHz, or 112 GHz) may be connected via cable 114, which may be additionally sensitive to signal loss at distances greater than or approximately equal to six inches.

[0094] Cable 114B may have a first end 116 attached to intermediate board connector assembly 112B and a second end 118 attached to another location, which may be a connector similar to connector assembly 120 or other suitable configuration. Cables 114A and 114B may have lengths that allow intermediate board connector assembly 112A to be spaced apart from the second end 118 at connector assembly 120 by a first distance. In some specific examples, this first distance may be longer than a second distance, and signals passing through cable 114A at a given frequency may propagate along traces within PCB 102 and daughterboard 106 within this second distance with acceptable loss. In some specific examples, the first distance may be at least 6 inches, in the range of 1 to 20 inches, or any value such as in the range between 6 and 20 inches. However, the upper limit of the range may depend on the size of PCB 102.

[0095] Using intermediate board connector assembly 112A as an example, the intermediate board connector assembly can mate with a printed circuit board (such as daughter card 106) adjacent to a component (such as component 108) that receives or generates signals via cable 114A. As a specific example, intermediate board connector assembly 112A can be mounted within a six-inch component 108, and in some specific examples, within a four-inch component 108 or a two-inch component 108. Intermediate board connector assembly 112A can be mounted at any suitable location on the intermediate board, which can be considered as the internal area of ​​daughter board 106, recessed by the same distance from the edge of daughter board 106 to occupy less than 100% of the area of ​​daughter board 106. This configuration provides a low-loss path via cable 114. In the electronic device illustrated in Figures 1 and 2, the distance between intermediate board connector assembly 112A and processor 108 can be on the order of one inch or less.

[0096] In some specific instances, the intermediate board connector assembly 112A can be configured to mate with daughterboard 106 or other PCBs in a manner that allows for easy routing of signals coupled via the connector assembly. For example, an array of signal pads that mate with the contact tips of the intermediate board connector assembly 112A can be spaced apart from the edge of daughterboard 106 or another PCB, allowing traces to be routed from the other part of the occupied area in all directions (e.g., toward assembly 108).

[0097] According to the specific examples in Figures 1 and 2, the intermediate board connector assembly 112A includes eight cables 114A aligned in multiple columns at a first end 116. In the depicted specific example, the cables are configured in a 2×4 (i.e., two columns, four rows) array at the first end 116 of the intermediate board connector assembly 112A. This configuration, or another suitable configuration selected for the intermediate board connector assembly 112A, can produce relatively short break zones that maintain signal integrity when connected to adjacent components, compared to the winding patterns that might be required for the same signals wound from an array with more columns and fewer rows.

[0098] As shown in Figure 2, the intermediate board connector assembly 112A can be fitted into a space that may otherwise be unusable within the electronic device 100. In this example, a heatsink 110 is attached to the top of the processor or component 108. The heatsink 110 may extend beyond the periphery of the processor 108. When the heatsink 110 is mounted above the daughterboard 106, a space exists between a portion of the heatsink 110 and the daughterboard 106. However, this space has a height H, which can be relatively small, such as 5 mm or less, and conventional connectors may not be able to fit into this space or may not have sufficient clearance for mating. However, the intermediate board connector assembly 112A and other connectors of the exemplary specific examples described herein can be fitted into this space adjacent to the processor 108. For example, the thickness of the connector housing may be between 3.5 mm and 4.5 mm. This configuration utilizes less space on the printed circuit daughterboard 106 compared to mounting the connectors outside the periphery of the heatsink 110 to the printed circuit daughterboard 106. This configuration allows more electronic components to be mounted to the printed circuit board connected to the intermediate board connector, thereby increasing the functionality of the electronic device 100. Alternatively, printed circuit boards such as daughter board 106 can be smaller, thereby reducing their cost. Furthermore, the integrity of signal transmission from the intermediate board connector assembly 112A to the processor 108 can be increased relative to electronic devices in which conventional connectors are used to terminate cable 114A, due to the reduced length of the signal path via the daughter board 106 of the printed circuit board.

[0099] Although the specific examples in Figures 1 and 2 depict connector assemblies connected to daughter cards at the intermediate board location, it should be noted that the connector assemblies of the illustrative specific examples described herein can be used to form connections to other substrates and / or other locations within an electronic device.

[0100] As discussed herein, middleboard connector assemblies can be used to form connections to processors or other electronic components. These components can be mounted to printed circuit boards or other substrates to which the middleboard connectors can be attached. These components can be implemented as integrated circuits having one or more processors, for example, in an integrated circuit package, including commercially available integrated circuits known in the art as CPU chips, GPU chips, microprocessors, microcontrollers, or coprocessors. Alternatively, the processor can be implemented in custom circuitry (such as ASICs) or semi-custom circuitry generated by configurable programmable logic devices. As yet another alternative, the processor can be part of a larger circuit or semiconductor device, whether commercially available, semi-custom, or custom. As a particular example, some commercially available microprocessors have multiple cores in a package, such that one or a subset of those cores can constitute a processor. However, a processor can be implemented using circuitry of any suitable format.

[0101] In the specific example described, the processor is illustrated as a packaged assembly, such as one individually attached to daughter card 106 via a surface mount soldering operation. In this context, daughter card 106 acts as a substrate that mates with the intermediate board connector assembly 112A. In some specific examples, the connector may mate with other substrates. For example, semiconductor devices such as processors are often fabricated on substrates such as semiconductor wafers. Alternatively, one or more semiconductor wafers may be attached to a wiring board, such as in a flip-chip bonding process, and the wiring board may be a multilayer ceramic, resin, or composite structure. The wiring board may act as a substrate. The substrate used to manufacture the semiconductor device may be the same substrate that mates with the intermediate board connector.

[0102] Figure 3 is a perspective view of another specific example of a sub-board 106 connected to other sub-assemblies within an electronic device using intermediate board connector assemblies 112 and 113. Similar to the specific examples of Figures 1 and 2, the sub-board of Figure 3 includes a processor 108 with a heatsink 110 on top, which extends beyond the periphery of the processor and creates a narrow gap (e.g., less than 10 mm, less than 7.5 mm, less than 5 mm, etc.) between the heatsink and the sub-board. As shown in Figure 3, the intermediate board connector assembly 112 mates with the top surface of the sub-card within the space between the heatsink and the sub-board, as in the examples of Figures 1 and 2. In the example of Figure 3, the sub-card is mounted on a bracket 300 that physically couples the sub-card to an associated printed circuit board, such as a motherboard or another sub-board. In this case, the bracket creates another narrow gap between the bottom surface of the sub-board and the lower PCB. The intermediate board connector assembly 113 is configured to mate with the bottom surface of the sub-board and is assembled between the sub-board and the lower PCB. The connector housings of the intermediate board connector assemblies 112 and 113 are suitably thin or low-profile to fit within narrow gaps and can be fitted with a movement parallel to the surface of the daughter board, requiring only a small amount of clearance above and below the daughter board for fitting. As a result, the size of the electronic device can be reduced or the density of electrical components (such as processor 108) within the electronic device can be increased. In the specific example described, the thickness of the housings of the intermediate board connector assemblies 112 and 113 can be between 3.5 mm and 4.5 mm to achieve this fit.

[0103] Figure 4 is a perspective view of a specific example of an intermediate board connector assembly 112 including a plurality of cable ends 116A above it. As shown in Figure 4, the connector assembly includes a connector housing comprising a first segment 124A and a second segment 126A. The cable ends 116A enter the connector housing at the second segment 126A. One or more conductive elements (such as signal conductors and shielding) within each of the cables are at least partially connected to contact tips in the first housing segment 124A, as will be further discussed below. According to the specific example depicted, the first and second segments are tilted at an angle of approximately 30 degrees relative to each other. This configuration can help improve clearance between the cables and connector housing and other electrical components in the electronic device (such as components mounted to the motherboard). In other specific examples, other relative angles between the first and second segments can be used, such as between 15 degrees and 60 degrees.

[0104] As shown in Figure 4, the connector housing includes lugs 121 configured to align the intermediate board connector assembly 112 with the edge of the PCB. When the mating surface 131 of the connector is flush with the surface of the PCB, the lugs protrude above the PCB, allowing the lugs to contact the edge of the PCB and orient the connector assembly. According to a specific example shown in Figure 4, the connector assembly includes a connector and a separate connector socket 123 for receiving the connector. The connector socket may include one or more surfaces guiding contact and alignment between the mating surface 131 on the connector and the PCB, as will be further discussed with reference to the exemplary specific examples shown in Figures 21 through 24.

[0105] Figure 5 is a perspective view of the lower intermediate board connector assembly 113. Similar to the upper intermediate board connector assembly in Figure 4, the lower intermediate board connector assembly includes a connector housing having a first section 124B. In contrast to the upper intermediate board connector assembly, in this example, the lower intermediate board connector assembly does not include a second housing section inclined relative to the first housing section 124B. However, the lower intermediate board connector assembly still includes a housing portion having a mating surface 131 and a housing surface for positioning a plurality of cables for winding. In the specific example of Figure 5, the cable ends 116B of the plurality of cables enter the first section of the connector housing at an angle of approximately 30 degrees relative to the housing section. This configuration similarly improves the clearance around cables surrounding components that can be mounted on a lower PCB. Of course, the cables can enter the connector housing at any suitable angle (including angles between 15 and 60 degrees), as the invention is not limited thereto. As shown in Figure 5, the signal conductors in the cable end 116B are each connected to a separate contact tip 122B, which engages with a sub-board or PCB to transmit signals between one or more components and the associated cable.

[0106] Figures 6 and 7 are perspective and side views, respectively, of a specific example of connector assemblies 612 and 613 with cables 114. As shown in Figure 6, the connector assembly is configured to connect two substrates, which may be printed circuit boards 102A and 102B. For example, the connector assembly of Figures 6 and 7 can interconnect two high-frequency sub-assemblies, which can be formed by components mounted on separate PCBs 102A and 102B. The first (e.g., upper) connector assembly 612 includes a first housing section 124A and a second housing section 126A, similar to the specific example of Figure 4, with the second housing section inclined relative to the first housing section. The first cable end 116A enters the second section of the housing of one connector assembly, and the second cable end 116B enters the second section of the housing of another connector assembly. Similarly, the second (i.e., lower) connector assembly 613 also includes a first housing section 124B and a second housing section 126B. The first end 116B of the cable enters each of the second housing sections, and the second end 118B enters another second housing section. Similar to the first connector assembly, the second section 126B of the housing is inclined relative to the first section 124B to improve the clearance between the housing and the cable. As shown in Figures 6 and 7, the cables for the upper and lower connector assemblies are arranged in parallel, one on top of the other, and can be cut and / or wired together.

[0107] As shown in Figure 7, each of the upper connector assembly 612 and the lower connector assembly 613 mates with PCBs 102A and 102B. Specifically, the mating surfaces 131A and 131B of each connector assembly press against the PCB to create a mating interface. In the specific example of Figure 7, the mating surfaces are located on the first housing sections 124A and 124B of the upper and lower connector assemblies. As will be further discussed with reference to Figure 8, the connector assemblies are secured to the upper and lower connector assemblies by screw fasteners that secure them to the PCBs 102A and 102B.

[0108] Figure 8 is a perspective view of a specific example of the connector assembly 612 of Figure 6, wherein the connector 111 is detached from the PCB 102. In this configuration, the footprint for the connector assembly is visible on the surface of the PCB 102. The footprint includes a contact 800. The contact 800 serves as a contact pad that mates with a signal conductor within the connector assembly 612. Other portions of the footprint may have a ground pad, or a large portion of the footprint (away from the signal pad) may be a ground plane. Ground conductors within the connector assembly 612 may mate with such grounding structures on the surface of the PCB 102.

[0109] To support mating with this occupied area, connector 111 may have contact tips that connect to signal and / or ground conductive structures of the cable. These contact tips may be positioned to press against corresponding conductive structures within the occupied area on PCB 102. In the configuration of FIG. 8, the mating surface of connector 111 is located on the lower portion of the first segment 124. Although not visible in FIG. 8, these contact tips may extend beyond the surface of the first segment 124 facing PCB 102 in a resting state. When connector 111 is pressed against PCB 102, these contact tips may deflect, thereby generating contact force between the contact tips and pads or other conductive structures on the surface of PCB 102. In the specific example illustrated, connector 111 uses mounting components to press against the PCB, which, when actuated, force connector 111 against the surface of PCB 102. The mounting components are illustrated in Figure 8 as PCB fasteners 134 (specifically screws in this example), which can be tightened to force connector 111 against PCB 102.

[0110] As shown in Figure 8 and discussed previously, connector 111 includes a first segment 124 and a second segment 126 inclined relative to the first segment. The connector includes a mating surface 131 configured to press against PCB 102. In the specific example shown in Figure 8, PCB fastener 134 is screwed into and secured in a hole 802 on the PCB such that the mating surface is flush with the PCB. Therefore, contact tips extending from the mating surface of the connector are moved to contact a plurality of contacts 800 on the PCB. When the mating surface is flush with the PCB, the first segment 124 of the housing is parallel to the PCB, while the second segment 126 is inclined relative to the PCB to allow cables to be easily routed away from the PCB and to provide clearance for other components that may be on or near the PCB.

[0111] The housing is formed of multiple segments held together, allowing the internal components of connector 111 to be configured before being surrounded by the housing. Here, upper segment 128 and lower segment 130 are fastened together to form a housing module. The two housing segments are shaped to assemble around a first end 116 of a cable that can enter the housing. Inside the housing, conductive elements of the cable can be connected to contact tips. The upper and lower segments can be joined together by housing fasteners 132, which provide clamping force to hold the connector components together.

[0112] As shown in Figure 8, the PCB includes a plurality of contacts 800 formed on the PCB and through holes 802 configured to accommodate PCB fasteners 134. As mentioned above, the PCB fasteners can be screwed into the through holes 802 so that the connector 111 can be fastened to the PCB, and the electrical contact tips of the connector will engage the plurality of contacts 800 to electrically couple the associated cable conductors to the PCB.

[0113] As shown in Figure 8, connector 111 also includes a metal plate 136 configured to stabilize and secure the connector housing. As will be discussed below, the contact tips of the connector can generate a spring force to push the connector away from the PCB when the connector engages with the PCB. Therefore, when the connector is held to the PCB at the lateral end of the connector (i.e., PCB fastener 134), the biasing force can cause the connector to bend (i.e., fold) along the lateral axis of the connector. The metal plate is configured to increase the rigidity of the connector to suppress bending along the lateral axis of the connector and to promote constant engagement of the contact tips, regardless of where the contact tips are positioned in the lateral direction relative to the fastener. In the example of Figure 8, the metal plate engages with the housing at multiple locations in the lateral direction. Engagement with multiple housing plate engagement protrusions 138 is achieved in this example to allow the metal plate to prevent bending of the connector housing when the connector is coupled to the PCB 102.

[0114] Figure 9 is a cross-sectional view of the connector assemblies 612 and 613 of Figure 6, showing signal contact tips 932A and 932B electrically coupled to cable conductors 930A and 930B at the first cable end 116. As previously mentioned, the first end 116 of the cable enters the second sections 126A and 126B of their respective housings. Each of the cables includes at least one cable conductor 930A or 930B carrying an electrical signal. Although it should be understood that each cable may include more than one conductor, such as a pair of conductors, each conductor being surrounded by an insulator, as is common in two-strand cables.

[0115] The housing can hold inserts 910A and 910B. Each insert can support the end of a cable conductor and signal contact tips 932A and 932B electrically and mechanically coupled to the end of the cable conductor. First couplers 920A and second couplers 920B are shown to couple a cable conductor to a contact tip, which can be similarly supported by the inserts. First couplers 920A and second couplers 920B are configured to electrically and physically couple cable conductors 930A and 930B to signal contact tips 932A and 932B, so that electrical signals can be transmitted from PCB 102 to the individual cable conductors via the contact tips. Additionally, the inserts can support ground contact tips, which can be electrically and, in some specific instances, physically coupled to the cable's shielding structure.

[0116] The coupler can be connected to the contact tip and conductor using, for example, soldering, welding, and / or crimping. The coupler can appropriately connect the signal contact tip 932A, which can be formed of a first material (such as a superelastic material similar to nickel-titanium), to a cable conductor formed of a second material (such as a high-conductivity material similar to copper).

[0117] Couplers can be fixed to or mounted within an insert, restricting their movement in a direction parallel to the elongation axis of the cable conductor. The inventors recognize and understand that the cable conductor can slide within the insulation surrounding it. In configurations where the end of the cable conductor is attached to a contact tip, such sliding of the conductor can alter the position of the contact tip relative to the surface of the substrate to which it will mate, thereby reducing connector reliability. According to a specific example in FIG9, the first coupler 920A and the second coupler 920B can also be used to suppress piston movement (i.e., longitudinal or axial movement) of the cable conductor and / or contact tip. Alternatively or additionally, other anti-piston configurations can be used, such as beads fixed to the contact tip and / or cable conductor, mounted within the insert to restrict bead movement. These beads can be formed, for example, by molding plastic or depositing solder.

[0118] Integrating the insert into the connector housing simplifies connector manufacturing. The insert connects the conductors of a cable to contact tips outside the connector housing, allowing for easier tooling and clamping. For example, the cable end can be stripped of its outer sheath and the shielding surrounding a pair of signal conductors. These signal conductors can be insulated within the cable, but the insulation can also be stripped at the ends, leaving exposed conductors. These exposed conductors can be inserted from one direction into an opening through the insert. Contact tips can be inserted from opposite directions into these openings, such that the ends of the cable conductors and the ends of the contact tips face each other at an internal portion of the insert. This internal portion may include a window exposing the joint between the cable conductors and the contact tips, allowing them to be joined, for example, by fusion or soldering. In a specific instance using a coupler, the window may open to a cavity in the insert where the coupler can be positioned. Grounding contact tips can similarly be integrated into the insert and coupled to the shielding of the cable terminated by the insert. After terminating the cable using the tip in this manner, the insert can be inserted into the housing or otherwise attached to the housing.

[0119] Figure 10 is a perspective view of a specific example of a connector assembly, where the connector housing is removed to expose a plurality of inserts, each terminating a cable. In this example, the modular structure of the connector assembly is achieved by inserts aligned side-by-side in a column. Two columns are illustrated here.

[0120] Figure 10 illustrates a plurality of signal contact tips 932, cable conductors 930, and ground contact tips 934 for forming an effective electrical connection via a plurality of contact pads 800 disposed on PCB 102. As shown in Figure 10, the connector assembly includes a plurality of inserts 910, each supporting the mating of the cable conductors 930, signal contact tips 932, and ground contact tips 934. This configuration is advantageous for two-strand or double-conductor cable systems because one insert will be used with each cable. Each insert includes a ground contact tip holder T having an opening that receives and supports one of the ground contact tips 934. Additionally, the insert includes an opening 914 configured to receive two couplers 920 for creating two separate mating surfaces between the two cable conductors 930 disposed in each insert and the two signal contact tips 932. The opening 914 can be divided into two cavities, each cavity holding one coupler. Insert 910 may be made of an insulating material, such as molded plastic, so that the couplers within opening 914 are electrically insulated from each other.

[0121] As shown in Figure 10, each insert also includes a mating portion 916, which includes a contact surface configured to abut the PCB 102 when the connector mates with the PCB. A contact tip protrudes below the mating portion to engage a contact pad 800. According to a specific example of Figure 10, the connector assembly can be used with a cable having a grounding shield surrounding an internal cable conductor. Therefore, the connector assembly includes a mechanism for electrically coupling the grounding contact tip 934 and the cable shield. In this example, each of the inserts includes a flexible conductive member that presses against both the grounding contact tip 934 and the shield. The flexible conductive member can be formed, for example, from an elastomer filled with conductive particles (such as conductive fibers, beads, or sheets). The force that causes the flexible conductive member to press against the grounding contact tip 934 and the shield can be generated by compression of the member between the housing portions.

[0122] Therefore, each of the contact tips can be connected to a separate cable conductor, and each of the grounding contact tips can be connected to a grounding shield. The body of the insert shown in Figure 10 can be formed of a dielectric material so that the individual contact tips and cable conductor combinations can be separated from each other.

[0123] Figure 11 is a perspective view of the signal contact tip 932 and ground contact tip 934 of the connector of Figure 10 engaging with the contact pads of PCB 102. As shown in Figure 11, the contact pads include two signal pads 1100 and a ground pad 1102. Each of the contact tips (shown as the mating portion of the insert shown in Figure 10 and viewed in cross-section in Figure 11) contacts the respective signal pad 1100. In contrast, both ground contact tips 934 are electrically coupled to the same ground pad 1102. In the specific example described, the surface of PCB 102 in the connector's occupied area has a larger ground pad with openings in which the signal pads 1100 are disposed. The signal pads 1100 are disposed in pairs in the openings of the ground pads such that each pair of signal pads can be contacted by the contact tip of the insert. Therefore, such rows of mating can exist when the inserts are configured to terminate two-strand cables in a row. Figure 11 shows portions of two such rows. As shown in Figure 11, the pairs in adjacent columns are offset relative to each other in the column direction, such that a pair in one column is between pairs in another column. In other specific embodiments, the columns may be aligned or the grounding contacts may have individual contact pads, as the invention is not limited thereto.

[0124] In the specific example depicted, to mate the connector with the PCB 102, the signal contact tip and the ground contact tip elastically deform against the contact pad 800. This elastic deformation ensures good electrical continuity between the PCB 102 and the associated cable conductor. The inventors recognize and understand that it may be necessary to form the signal contact tip 932 and / or the ground contact tip with a hyperelastic material such as nickel-titanium. For example, a hyperelastic material ensures a relatively constant contact force for the deflection range of the contact tip, thereby allowing for greater tolerances when manufacturing the connector assembly. As will be discussed further with reference to Figures 12A and 12B, the contact tip may have an elastic deformation range in which increased elastic deformation does not increase the spring force generated by the contact tip. Alternatively or additionally, the use of a hyperelastic material allows for the use of small-diameter conductors to form the contact tip, such as 30 AWG, 32 AWG, 34 AWG, or smaller diameter wires.

[0125] Figure 12A depicts representative stress-strain curves for both conventional and hyperelastic materials, which can be used for contact tips and / or grounding contact tips in the illustrative examples described herein. In this example, the hyperelastic material is a material undergoing a reversible martensitic transformation from austenite to martensite. The stress-strain curve 1200 for the conventional material shows elastic properties up to the yield point 1202, corresponding to an elastic limit 1204. The stress-strain curve for the hyperelastic material is depicted as stress-strain curve 1200; the arrows on the curve indicate the stress-strain response to loading and unloading. During loading, the hyperelastic material exhibits elastic properties up to the first transformation point 1216A, after which the transformation from austenite to martensite begins and the stress-strain curve shows a characteristic flat region 1218A, referred to herein as the hyperelastic state. In the hyperelastic state, the shape change associated with the martensitic transformation allows the material to adapt to additional strain, resulting in a significant corresponding increase in stress. When all the hyperelastic material has been converted to martensite, the hyperelastic material can reach the yield point 1212 corresponding to the elastic limit 1224. During unloading, the martensitic phase transforms back to the austenitic phase; the transformation begins at the second transformation point 1216B and can be carried out at lower stresses compared to the transformation during loading, as indicated by the second flat region 1218B.

[0126] As described above, the elastic limit of hyperelastic materials can be substantially greater than that of conventional materials. For example, some hyperelastic materials can deform to about 7% to 8% strain or greater without buckling; in contrast, many conventional materials, such as metal alloys commonly used in electrical connectors, buckle at 0.5% strain or less. Therefore, the use of hyperelastic materials in the design of separable electrical connectors can utilize relatively large local deformations, which would be impractical to use conventional materials without buckling and associated permanent damage to the connector. Specifically, the inventors have recognized and understand that the larger elastic limit of hyperelastic materials can be beneficial for providing a reliable connection in the mating interface of electrical connectors. For example, the substantially mild stress-strain response of hyperelastic materials in a hyperelastic state allows components made from hyperelastic materials to provide the same contact force over a large deformation range. Therefore, hyperelastic components allow for larger design tolerances compared to those feasible for conventional materials.

[0127] In some specific instances, the flat region 1218A in the stress-strain response of hyperelastic materials enables connector designs characterized by substantially constant mating forces over an extended range of deformation. Specifically, as described above, when a hyperelastic material deforms in its hyperelastic state, it can adapt to additional applied strain via a phase transformation from austenitic to martensitic phase without a significant increase in applied stress. This response allows for easier and / or more reliable connections between components in an interconnect system. For example, in some specific instances, the initial deformation applied to a connector element made of a hyperelastic material during the initial stages of the mating process is sufficient to deform the connector element into a hyperelastic state. Therefore, the remainder of the mating process, including subsequent deformation of the hyperelastic connector element, can be carried out with minimal (if any) additional required force. In contrast, connector elements made of conventional materials may require progressively increasing forces to achieve additional deformation.

[0128] Accordingly, in some specific instances, connectors may be designed with a nominal mating state in which the crossbars or other components made of hyperelastic materials deflect near the center of the hyperelastic region. Due to manufacturing tolerances in the connector and in systems in which it may be mounted, the components in the connector may deflect more or less than those designed for the nominal mating state. In connectors made of hyperelastic components, more or less deflection will still occur on the components operating in their hyperelastic region over a relatively wide operating range. Therefore, the contact force provided by those components will be substantially the same throughout the operating range. Despite variations attributable to manufacturing tolerances, this uniform force provides a more reliable electrical connector and electronic systems using those connectors.

[0129] Figure 12B is a graph illustrating a specific example of a contact tip subjected to hyperelastic deformation. During mating, the hyperelastic contact tip moves and engages with the contact pad, causing the contact tip to deflect, as indicated by point P1. This deflection generates a force that increases until a hyperelastic state is reached, as indicated by point P2. Further deflection occurs within the hyperelastic state, as indicated by the curve between points P2 and P3. The deflected shape of the hyperelastic contact tip provides a restoring force necessary to generate the contact force required to form a reliable electrical connection. Furthermore, this force is sufficient to break through any oxides on the surface of the connector portion where contact begins. When not mated, the hyperelastic wire can return to its original, undeformed geometry.

[0130] As shown in Figure 12B, when the contact tip is within the hyperelastic range, the hyperelastic contact tip can deflect from 0.05 mm to 0.1 mm with minimal increase in contact force. This configuration allows for greater tolerance in manufacturing connector assemblies and / or pressing the connector assembly against the substrate, because the contact force that would result in a weak electrical connection or permanent deformation of the contact tip does not change accordingly when the contact tip can deflect within the range. Here, the contact force is constant within a sufficiently large deflection range to cover variations in deflection expected across the real system. In specific embodiments of the invention, the contact force can be maintained within 5% of the tip deflection range of 0.03 mm to 0.15 mm. Of course, other contact force ranges for a given desired tip deflection range can be used, as the invention is not limited thereto. It should also be understood that in these specific embodiments, the use of hyperelastic components enables designs where local strain in the hyperelastic component will exceed the elastic limits of known materials, and therefore, it would be impractical to use known materials in these specific embodiments without causing permanent deformation and associated damage to the connector. In some specific examples, pressure-mount connectors can be designed to have a nominal deformation of the contact tip during mating operation, sufficient to place the contact tip in a hyperelastic region during mating. As can be seen from Figures 12A and 12B, in this configuration, the connector will still provide predictable and repeatable mating force with minimal variation, even if the actual deformation is less or greater than the nominal value.

[0131] Figure 13 is a perspective view of a specific example of a cable terminated by a connector as described herein. For example, the conductors of this cable may be physically and electrically coupled to the contact tips of an insert. In this example, the cable is a non-bleeding twin-strand cable (e.g., 114) that can be used with the connector assembly of the exemplary specific example described herein. As shown in Figure 13, the non-bleeding twin-strand cable includes two cable conductors 930 that are electrically and physically coupled to the contact tips of an associated connector assembly. Each of the cable conductors is surrounded by a dielectric insulator 1302 that electrically isolates the cable conductors from each other. A grounding shield 1300 surrounds the cable conductors and the dielectric insulator. The shield may be formed of metal foil and may completely surround the periphery of the cable conductors. The shield may be coupled to one or more grounding contact tips via a flexible conductive member. An insulating sheath 1304 surrounds the shield. Of course, although a non-bleeding double-strand cable is shown in Figure 13, cable configurations (including configurations with more or fewer than two cable conductors, one or more bleed wires and / or shielding in other configurations) can be used, as the invention is not limited thereto.

[0132] Figures 14A and 14B are top and bottom plan views, respectively, of a specific example of a PCB 102 (e.g., daughterboard, motherboard, orthogonal PCB, etc.) including a plurality of contact pads 800. Similar to the specific example in Figure 11, each of the contact pads includes two signal contact pads and a ground contact pad. The contact pads can be arranged in a dense array to allow a plurality of signals to be transmitted over a plurality of cables at a high bandwidth. According to the specific example in Figures 14A and 14B, the PCB has 128 individual contact pads 800 arranged between the top and bottom sides of the PCB.

[0133] As shown in Figure 14A, contact pads are arranged in two primary offset columns (in the y-direction), each primary column having alternating offset contact pads in the y-direction (i.e., contact pads in the primary column are arranged in first and second secondary columns). In each column, adjacent contacts are offset from each other by a distance D1 in the y-direction and a distance D2 in the x-direction. According to specific examples in Figures 14A and 14B, distance D1 may be between 0.5 mm and 1.5 mm, and distance D2 may be between 1.5 mm and 2.5 mm. Each primary column may include 32 contact pads, and each primary column is offset from the adjacent primary column by a distance D3, which in the specific examples in Figures 14A and 14B may be between 3.5 mm and 5.5 mm. Of course, in some specific examples, contact pads may not be arranged in secondary columns (i.e., D1 will be zero).

[0134] In some specific instances, the PCB may include 256 contact pads with increased or equivalent pad density. Of course, any suitable number of contact pads can be used on any suitable PCB surface, as the invention is not limited thereto. The corresponding connector assembly may have a number and density of contact tips corresponding to the number and density of contact pads. In a specific instance where each cable terminates in the insert, the insert may be similarly held within a housing or other support structure to conform, at least at the engaging surface of the insert, to a pattern with offset primary and secondary columns as shown in Figures 14A or 14B.

[0135] Figure 15 is an exploded view of a specific example of the coupler 920, signal contact tip 932, and ground contact tip 934 of the connector assembly. As shown in Figure 15, the connector assembly includes inserts 910 configured to receive the signal contact tip 932 and the ground contact tip 934. The inserts can be modularly secured in channels formed in a housing. A suitable number of inserts can be used in various connector housings having a desired number of channels for a given number of contact tips. For example, a housing may have 64 individual channels to support 64 individual inserts.

[0136] The insert includes a ground contact tip holder 912, which includes an opening configured to receive and hold a ground contact tip 934. The ground contact tip holder 912 may be formed of an insulating material, which may be the same material used to form other portions of the insert 910. Alternatively or additionally, the ground contact tip holder 912 may be formed of a destructive material. The insert also includes an opening 914 configured to receive one or more couplers 920 for electrically coupling a cable conductor 930 to a signal contact tip 932. In this example, two such couplers are fitted within the opening 914 and are electrically isolated from each other.

[0137] The assembly also includes a conductive shield 1300 configured to contact both the grounding contact tip 934 and the cable 114, electrically coupling the flexible conductive member of the grounding contact tip and the shield. In this example, the end of the grounding contact tip 934 is fitted between the shield 1300 and the flexible conductive member 918. Compression of the flexible conductive member 918 forms an electrical connection with both the grounding contact tip 934 and the shield 1300, thereby electrically connecting them.

[0138] Figure 16 is a perspective view of a coupler 920 used with the insert 910 of Figure 15. The coupler 920 may be formed of metal, such that it is conductive and self-crimping deformable, or may be formed into an intermetallic body with cable conductors and / or contact tips. According to a specific example of Figure 16, the coupler is configured to allow cable conductors to be fused to signal contact tips and cable conductors. The coupler includes an arm 1600 surrounding a large portion of housing the contact tips and / or cable conductors. The arm functions to stabilize and support the contact tips and cable conductors in the coupler before and after the contact tips and cable conductors are fused together. The arm also serves as a fusion area for the inserted contact tips and cable conductors. One set of arms may be spot-welded (e.g., using laser) to the inserted cable conductor, and another set of arms may be spot-fused to the inserted contact tips. After spot welding, the cable conductor and contact tip can be fastened together and electrically coupled via a coupler and / or any direct contact between the contact tip and the cable conductor.

[0139] In some specific instances, the arms may also be crimped around the cable conductors and signal contacts to secure the signal contacts and cable conductors before or alternatively when using fusion to attach them to the coupler. Alternatively, the conductors may be alternatively or additionally soldered to the coupler 920. The coupler also includes a cup-shaped channel 1602 that supports the contact tips and cable conductors along the length of the portion inserted into the coupler.

[0140] Coupler 920 is described to have openings between arms 1600. Cable conductors and contact tips inserted into channel 1602 can abut against each other in those openings. In some specific instances, instead of fusion welding between the cable conductors and contact tips and each of the arms 1600, or in addition to fusion welding between the cable conductors and contact tips and each of the arms 1600, energy from a laser or another source can be applied to the joint between the cable conductors and contact tips, thereby forming a fusion weld between the cable conductors and contact tips. As another alternative, the cable conductors and contact tips can be inserted into channel 1602 with a fusible material (such as solder balls or solder paste) between them. Heat can be applied to solder the cable conductors to the contact tips.

[0141] The coupler also includes a flat end 1604 that can be used for reverse piston movement in an insert or other housing, as will be further discussed with reference to Figures 18 and 19.

[0142] Figure 17 is an exploded view of a connector module having another specific example of a coupler 1700, signal contacts 932, and ground contact tips 934. Similar to the specific example of Figure 15, the connector module of Figure 17 includes an insert 910 that accommodates two signal conductors 930, signal contact tips 932, and ground contact tips 934. The ground contact tips are supported by ground contact holders 912 electrically coupled to cable shielding 1300 via flexible conductive members 918. In contrast to the specific example of Figure 15, the coupler 1700 is formed with solder cups configured to receive solder or solder paste to electrically couple the contact tips to the individual cable conductors.

[0143] In some specific instances, the surface of the insert 910 can be coated with a conductive material (e.g., metal) such as via a particle vapor deposition (PVD) process. The conductive surface can be connected to ground. Thus, the coated surface can be the nearest ground to the signal conductor, establishing a signal-to-ground gap for other portions of the conductor within the insert, which in turn establishes the impedance of those other portions of the conductor. This configuration allows impedance matching (e.g., within + / -5% or + / -10%) of portions of the conductor within the insert to the impedance within the cable, where the cable conductor is surrounded by a shield. The coating can be on an inner or outer surface. Advantageously, the insert can be sized and shaped such that the surface coated with the conductor is positioned at a distance from the conductor center that varies based on other conductive structures attached to the conductor. For example, in the presence of solder or couplers, increasing the metallic mass around the conductor's axis, the plated surface can be spaced further away from the center of the cable conductor to match the impedance of the cable conductor. Matched impedance improves the signal fidelity of high-frequency signals.

[0144] While the specific examples in Figures 15 and 17 illustrate contact tips and cable conductors electrically and physically coupled via fusion or welding, it should be understood that any suitable technique can be used alone or in combination to physically and electrically secure contact tips and cable conductors together. For example, any of fusion, welding, and crimping can be used alone or in combination to secure contact tips to the cable conductors in a cable conductor assembly.

[0145] Figure 18 is a cross-sectional view of the coupler 920, signal contact tip 932, and ground contact tip 934 of Figure 15. As shown in Figure 18, the coupler is disposed in an opening 914 formed in the insert 910. Both the signal contact tip 932 and the cable conductor are disposed in the coupler 920 and secured to the cable conductor by spot welding. Therefore, neither the contact tip nor the cable conductor can move relative to the coupler. As shown in Figure 18, the coupler includes an end 1604 that is flat in this case but may have other shapes in other specific embodiments. The opening 914 is defined at a first end by a first wall 1900A and at a second end by a second wall 1900B. The signal contact tip extends from the coupler 920 via the first wall 1900A and extends out of the mating portion 916 of the insert. The cable conductor extends from the coupler 920 toward the rest of the associated cable via the second wall 1900B.

[0146] The components can be sized and shaped to ensure that the amount of contact tip extending from the housing at the mating interface is not significantly affected by cable movement. This design utilizes the fact that the coupler does not pass through holes formed in the first and second walls for assembly. In practice, the end 1604 of the coupler contacts the first wall 1900A and the second wall 1900B to suppress movement of the coupler relative to the insert 910. The insert can be securely positioned in the connector housing such that the insert does not move relative to the housing, and therefore the coupler does not move relative to the housing. Accordingly, movement of the signal contact tip 932 and the cable conductor 930 relative to both the insert 910 and the associated connector housing can also be suppressed. Thus, each coupler and insert cooperate to prevent movement of the signal contact tip and cable conductor relative to the connector housing and / or the insulation of the associated cable. Alternatively, the coupler can be fitted into the housing at either end such that any movement of the cable conductor and contact tips is minimized and spaced out, or the coupler can be positioned to prevent movement of the cable conductor away from the mating interface, allowing a sufficient number of contact tips to extend from the mating portion 916 to form a reliable and repeatable contact. It should be noted that in some specific embodiments, the first and second walls may be formed directly in the connector housing rather than in the insert 910.

[0147] Figure 19 is an enlarged cross-sectional view of the coupler 920, signal contact tip 932, and ground contact tip 934 of Figure 18, preferably showing the alignment of the coupler end 1604 with the first wall 1900A and the second wall 1900B. As shown in Figure 19, the first wall 1900A is adjacent to the other end 1604 of the coupler, and the second wall 1900B is adjacent to the other end 1604 of the coupler. Therefore, if the coupler is pulled along its longitudinal axis, one of the ends 1604 will contact the first wall or the second wall to inhibit movement.

[0148] Figure 20 is a top perspective view of the couplers, signal contact tips, and cable conductors of a specific example of Figure 15, showing how the paired couplers are positioned in the opening 914 formed in the insert 910. As shown in Figure 20, the first coupler 920A is adjacent to and parallel to the second coupler 920B. Each of the couplers includes an assembly of arms 1600A, 1600B that have been spot-fused to the respective signal contact tips 932A, 932B or cable conductors 930A, 930B. The couplers are separated from each other by a dielectric isolator 2000 formed in the insert.

[0149] Figure 21 is a perspective view of another specific example of the connector assembly 2112. In the specific example of Figure 21, the force on the connector assembly 2112 (forcing the contact tip against the occupied area on the substrate) is generated by a pushing mechanism formed by the pressure of the connector assembly against the surface of the component mounted to the substrate. In the illustrated specific example, a surface extending from the side of the connector assembly 2112 engages with the surface of the socket mounted to the substrate and into which the connector is inserted for mating.

[0150] As shown in Figure 21, the connector assembly includes a first segment 124 and a second segment 126 inclined relative to the first segment. The housing is formed by assembling a lower segment 130 and an upper segment 132 to form the connector housing. In other embodiments, the housing may be integral. In some embodiments, the connector housing may be integrally formed with a plurality of inserts, while in other embodiments, the connector housing may accommodate and hold individually formed inserts. According to the embodiment shown in Figure 21, the lower segment 130 of the housing includes a first protrusion 2100 having a first engagement surface 2102 and a second protrusion 2104 having a second engagement surface 2106. On the upper segment 132, the connector housing includes a recess 2018. The engagement surfaces (of which two such surfaces 2102 and 2106 are shown) are inclined relative to the mating surface of the connector. These surfaces are angled downward toward the front surface of the connector, with their direction relative to the direction in which the cable extends from the connector. As will be discussed further below, the first engagement surface, the second engagement surface, and the groove cooperate with the connector socket to releasably secure the connector to the PCB or other substrate so that the contact tip of the connector can be electrically coupled to the contact pad of the PCB.

[0151] Figure 22 is a perspective view of a specific example of a connector socket 2200 that can be mounted on a PCB such as a motherboard or daughterboard. The connector socket has a cavity whose shape generally corresponds to the shape of the first section of the connector assembly in Figure 21.

[0152] The connector socket includes a mounting surface 2250 designed to abut against a surface of a substrate, such as a PCB. An edge 2252 of the socket extends perpendicularly from the mounting surface 2250 and presses against an edge of the substrate, thereby positioning the socket relative to the edge. The socket can be fastened to the substrate. In this specific example, the socket includes a hole 2254 through which a fastener (such as a screw) can be inserted to fasten the socket to the substrate.

[0153] In a specific example of Figure 22, the mounting surface 2250 has an opening 2202 through which a portion of the substrate is exposed. The socket can be configured such that a connector-occupied area on the substrate (e.g., shown in Figures 14A or 14B) is exposed through the opening 2202. The socket can be shaped and mounted to the substrate such that when the connector assembly 2112 is fully inserted into and engaged with the socket, the contact tips on the mating surface of the connector press against the pads of the connector-occupied area exposed through the opening 2202. In this configuration, when the connector socket receives the connector assembly, the signal and ground contact tips of the connector assembly are electrically coupled to the contact pads.

[0154] The connector socket includes features that generate force on the connector assembly 2112 inserted into the socket. This force pushes the connector assembly toward the substrate, causing a contact tip extending through the mating surface to deflect, thereby generating a contact force. In this specific example, the connector socket includes a socket surface 2204 and a socket surface 2206 configured to engage a first engagement surface and a second engagement surface of the connector housing. When the connector housing slides into the connector socket, the force on the connector housing in a direction parallel to the substrate is converted into a downward force to push the connector housing toward the substrate.

[0155] The mechanism for generating the mating force can be positioned in multiple locations to provide a constant position along the mating interface. In the specific examples illustrated in Figures 21 and 22, the connector socket includes a tab 2208 configured to engage a recess 2018 of the connector housing. This tab can be positioned in the central portion of the mating portion. The tab 2208 and / or the recess 2018 may have a tapered surface to generate a force on the connector housing in a direction toward the substrate, similar to the force generated by the engaging surfaces on the sides of the connector. In some specific examples, the tab 2208 may alternatively or additionally have a hook or other locking feature that engages with a complementary surface within the recess 2018.

[0156] Figure 23 is a cross-sectional view of the connector assembly 112 of Figure 21 and the connector socket 2200 of Figure 22 when mounted to PCB 102. In Figure 23, the connector and socket are shown in a decoupled state. Figure 24 shows the connector inserted into the socket, preferably showing the engagement between the various surfaces of the connector housing and the connector socket. As previously discussed, the connector assembly includes a first engagement surface 2102 formed on the first protrusion 2100, a second engagement surface 2106 formed on the second protrusion 2104, and a groove formed in the upper segment 132 of the connector housing. As shown in Figure 23, the first engagement surface and the second engagement surface are inclined relative to the surface of the PCB at a constant angle from the first segment 124 of the housing toward the second segment 126 of the housing. According to a specific example of Figure 23, the first socket surface 2204 and the second socket surface 2206 are inclined at equal angles relative to the surface of PCB 102. Therefore, when the connector housing is received in the connector socket, the first engaging surface 2102 engages the first socket surface 2204 and the second engaging surface 2104 engages the second socket surface 2206, so that when the connector housing slides into the connector socket, the connector housing will be forced closer to the contact surface of the PCB 102. This pushing action between the inclined planes formed on the surfaces of the connector assembly and the connector socket will generate a mating force between the associated contact tip and the contact pad 800 disposed on the contact surface. As a result, the first force applied to the connector housing to move the connector housing into the connector socket will be partially converted into a second force in a direction perpendicular to the direction of the first force, which forces the connector housing toward the contact surface. The connector engaging surface and the connector socket surface may be disposed on two sides of the connector housing and the connector socket, as shown in FIG23.

[0157] The connector assembly 112 engages with contact pads on the surface of the printed circuit board using movement parallel to the surface of the board, allowing the connector to engage without any open space above the mounting location. This configuration enables a more compact electronic system. Additionally, it allows for more reliable mating. According to a specific example in Figure 23, the connector assembly 112 and connector socket 2200 are configured such that when the connector assembly moves parallel to the surface of the printed circuit board 102 to engage with the connector socket, the associated signal and ground contact tips wipe over the contact pad 800. When the lower segment 130 of the connector housing slides across the opening 2202 and the engaging surfaces and socket surfaces engage with each other, the signal and ground contact tips can wipe the contact pad 800 as it becomes electrically coupled. This configuration helps remove oxide layers or other deposits on the contact tips and / or contact pads to ensure a good electrical connection.

[0158] In some specific examples, the first engaging surface 2102 and the second engaging surface 2106 may be tilted relative to the PCB 102 at an angle greater than 0 degrees and less than 90 degrees relative to the mating surface of the connector. In one specific example, the engaging surfaces may be tilted between 2 and 10 degrees relative to the mating surface of the connector. The connector socket surface may have an angle corresponding to the angle of the engaging surface of the connector housing. The angle of the socket surface may be measured with respect to the mounting surface of the socket and / or the PCB to which the socket is mounted. Alternatively, in some specific examples, the connector socket may have a connector socket surface that is tilted at an angle different from that of the engaging surface of the connector housing or not tilted at all. In other specific examples, the connector socket surface may be tilted relative to the PCB, while the connector engaging surface is not tilted or has a different tilt relative to the PCB. In some specific examples, the connector housing may include a single continuous engaging surface or any suitable number of dissimilar engaging surfaces. Similarly, in some specific examples, the connector socket may include any suitable number of dissimilar socket surfaces. In some specific instances, each dissimilar connector engagement surface and / or socket surface may be tilted relative to PCB 102 at the same or different angles.

[0159] Figure 24 is a cross-sectional view of the connector assembly 112 of Figure 21 and the connector socket 2200 of Figure 22 in the coupled state. As shown in Figure 24, the first engaging surface 2102 of the connector assembly engages with the first socket surface 2204 to press the connector assembly against the PCB. Similarly, the second engaging surface 2106 engages with the second socket surface 2206 to further press against the PCB 102 to secure the connector. Finally, the tab 2208 engages with the groove 2018 to prevent bending of the central portion of the connector assembly and / or to generate a downward force on the central portion of the connector assembly. Thus, in the specific example described, the connector assembly engages the connector socket with five distinct contact areas, thereby providing a constant engagement force across the extended mating interface of the connector.

[0160] To remove the connector assembly from the connector socket, the connector assembly can slide out of the connector socket in a direction parallel to the plane formed by PCB 102. Movement in any other direction is limited by various engaging surfaces. As will be discussed with reference to Figures 27 and 28, the connector assembly can be selectively prevented from sliding out of the spring latch.

[0161] While the specific examples in Figures 21 to 24 are shown as connector housings with protrusions and connector sockets with corresponding shapes accommodating such protrusions, it should be understood that any suitable configuration of the engaging surfaces can be used. In some specific examples, for example, the engaging surface on the socket may be formed on the protrusion, and the engaging surface may be recessed within a channel in the housing. Any suitable combination of recesses and protrusions can be used on the connector housing and connector socket, as the invention is not limited thereto.

[0162] Figure 25 is an enlarged perspective view of the mating portion of a specific example of the insert 910 used with the connector assemblies of Figures 23 and 24. As shown in Figure 25, the insert is similar to the insert of Figure 15 or Figure 17 and houses two signal contact tips 932 and two ground contact tips 934. Both the signal contact tips and the ground contact tips extend beyond the insertion mating surface 2500. The insert 910 can be held within the connector assembly such that when the connector assembly mates with the substrate, the mating surface 2500 is parallel to the socket surface of the substrate. In the example of Figure 23, for example, the mating surface 2500 will be parallel to the lower surface of the mating portion. In the specific example of Figure 25, the ground contact tips protrude further from the mating surface 2500 than the signal contact tips, so that the ground contact tips are electrically coupled to the ground contact pads before the signal contact tips are electrically coupled to the signal contact pads.

[0163] Figure 26 is an enlarged side view of the insert of Figure 25 showing the parallax of the protrusions of the signal contact tip 932 and the ground contact tip 934. When measured in a direction perpendicular to the insertion mating surface 2500, the signal contact tip protrudes a distance D4, which is less than the distance D5 protruding from the ground signal contact. D4 and D5 can be any suitable values ​​to achieve appropriate tip deflection and contact force. As a specific example, the contact tip can extend a distance in the range of 0.04 mm to 0.15 mm. For contact tips formed of the material shown in Figure 12B, this extension in this range causes the tip to deflect a certain amount when the mating surface presses against the substrate, placing the contact in a hyperelastic state. In some specific examples, the connector can be designed to deflect near the center of this range (e.g., between 0.05 and 0.1 mm), resulting in a constant contact force even with manufacturing tolerances. This positioning ensures repeatable and reliable mating for both the signal and ground contact tips. Of course, in other specific instances, the signal contact tip and the ground contact tip may protrude by the same distance from the insertion engagement surface (or another surface of the connector housing), as the invention is not limited thereto.

[0164] In some specific instances, the connector assembly and / or mounting components (such as connector socket 2200) may include a latching assembly for holding the connector assembly 2112 in a position where it presses against the substrate. For example, the latching assembly may be used to hold the connector assembly in a position within the socket where the connector is aligned with a contact pad exposed in opening 2202, and the mating surfaces of the connector assembly and socket are engaged such that the mating surface of the connector presses against the substrate. Figures 27 and 28 are cross-sectional and side views, respectively, of a specific example of the connector assembly 2112 and a spring latch 2700 configured to selectively prevent the connector assembly from sliding out of the connector socket and to generate force on the connector assembly 2112 to push it into a mating position within the connector socket 2200. The spring latch 2700 is configured as a bias arm connected to the connector socket and configured to rotate to engage or disengage with the connector assembly. Specifically, the spring latch is configured to rotate into a spring latch socket 2704 on a spring latch tab 2702 formed on the lower surface of the connector housing. When the spring latch is positioned in the recess, it prevents the connector assembly from sliding out of the connector socket. To decouple the connector assembly, the arm can be rotated out of the spring latch socket so that the connector assembly can slide out of the connector socket. Although the spring latch is shown in Figures 27 and 28, other releasable latching configurations may be used alternatively or otherwise, as the invention is not limited thereto.

[0165] Figure 28 is a partial cross-sectional view showing the connector socket 2200, which is hardware-held, mounted to a substrate (here, printed circuit board 102). In this example, the socket is mounted using screws 2810 that pass through the PCB 102 and engage holes in the connector socket 2200. The connector socket 2200 can be positioned by screws relative to a berthing area on the surface of the PCB 102, the screws passing through holes drilled through the PCB 102 at locations oriented relative to the berthing area, such that the berthing area is positioned in an opening 2202 for proper mating with the connector assembly 2112 when inserted into the socket. Alternatively or additionally, the socket can be positioned relative to a berthing area having other features (such as an edge 2252) that positions the connector socket 2200 relative to an edge of the PCB 102. The connector berthing area can be positioned relative to the same edge such that the connector socket 2200 is aligned relative to the berthing area.

[0166] The connector assembly described herein may have a different number and configuration of contact tips than those explicitly depicted. For example, the contact tips may be arranged in multiple rows. Figure 29 is a perspective view of another specific example of a connector assembly 2900 including two rows of contact tips. As shown in Figure 29, the connector assembly includes a first housing section 2902 and a second housing section 2904 inclined relative to the first housing section. The connector assembly also includes an inclined engagement surface configured to move the connector assembly closer to the PCB when it moves into the connector socket. As shown in Figure 29, a plurality of cables are arranged in two offset rows to enter the second section 2904 of the connector housing.

[0167] Figure 30 is a cross-sectional view of the connector of Figure 29 taken along line 30-30. As shown in Figure 30, the connector assembly 2900 includes two rows of inserts and associated couplers, cable conductors, and contact tips. In the first row, a first insert 910A is disposed in the connector housing and holds a first coupler 920A. The first coupler 920A also accommodates a first cable conductor 930A and a first signal contact tip 932A and electrically and physically couples them together. Similarly, in the second row, a second insert 910B holds a second coupler 920B, which electrically and physically couples a second cable conductor 930B and a second signal contact tip 932B. When the second section of the housing is tilted, the first and second rows are disposed in the connector at equal angles. This allows the first and second rows to be stacked one on top of the other. Multiple rows can be beneficial for increasing the number and / or density of contact tips on the contact surface along the edge of the PCB or other substrate.

[0168] Figure 31 is a perspective view of specific examples of interlocking housing modules 3100 and 3110 for use in connector assemblies. As previously mentioned, the connector assemblies of the exemplary embodiments herein can be modular, wherein the connector can be assembled from multiple inserts (acting as hose modules) to provide a number of signal and ground contact tips for electrical coupling to electronic devices and multiple cables. For example, each housing module can terminate a cable, thereby coupling the contact tips to each signal conductor within the cable. In some embodiments, the inserts can be secured together by inserting them into openings in the outer housing. In some embodiments, modules in other configurations can be used and / or modules can be positioned and held together with other support structures.

[0169] According to a specific example in Figure 31, interlocking housing modules can be linked together into a single unit, which is then secured to a support structure, for example, by insertion into an outer housing. The outer housing need not have a separate cavity to accommodate the inserts, and therefore the spacer walls that might be used in other examples to position individual inserts can be omitted. This assembly technique reduces the spacing between modules, further increasing the contact density of the connector assembly. Figure 31 shows two such modules, but any number of housing modules can be held together in a row. The first housing module 3100 includes an opening 3102 configured to accommodate two couplers 920 and associated signal contact tips 932 and cable conductors. The contact tips extend through surface 3106 a sufficient distance to deflect and provide a contact force when included within a connector mating with a substrate. The first housing module also includes a ground contact tip holder 3104 having an opening configured to accommodate and support a ground contact tip (similarly positioned to contact the substrate).

[0170] Similar to the first housing module, the second housing module 3110 also includes an opening 3112, a ground contact tip holder 3114, and a module surface 3116. However, the ground contact tip holder 3114 is offset from the ground contact tip holder 3104 of the first module, so that the housing modules can interlock while the housing modules are aligned in the same plane.

[0171] Figure 32 is a perspective view of a specific example of a connector assembly including housing modules 3100 and 3110 of Figure 31 with the outer housing removed. As shown in Figure 32, the interlocking housing modules are configured in two columns of four, but this number of columns and modules is for illustrative purposes only. For example, the connector assembly may include 64 pairs of signal contacts in one column and may have more or fewer columns than two.

[0172] The first housing module 3100 and the second housing module 3110 alternate to form a row of housing modules, each row having a total of eight signal contact tips. As shown in FIG32, the ground contact tip 934 is held in ground contact tip holders 3104 and 3114. According to the specific example of FIG31, the ground contact tip holders are configured to attach to the ground contact tips associated with each individual housing module and adjacent housing modules. Housing modules can be interlocked and secured to each other via adjacent ground contact tips. Adjacent ground contact tips are electrically connected and are bundled together by the first ground contact tip holder 3104 and the second ground contact tip holder 3114. In the specific example described, the diameter of the ground contact tip is smaller than that of the signal contact tip. In the specific example described (where two ground contact tips are bundled), the diameter can be selected such that one bundle provides the same contact force as the signal contact tip, or other suitable contact force. In other specific instances, the interlocking housing modules can be directly fastened to each other rather than indirectly fastened via contact tips, as the invention is not limited thereto.

[0173] One or more structures may be used to couple the grounding contact tip to the cable shield. These structures may also provide shielding and / or impedance control for signal conductors within each of the modules. For example, conductive sheets (such as those possibly stamped from metal) may be used for this purpose. In other specific instances, flexible conductive and / or lossy materials, as described elsewhere herein, may be used to connect the grounding structure.

[0174] As shown in Figure 32, the connector assembly includes a bottom metal sheet 3200 supporting interlocking housing modules 3100, 3110 arranged in a first row and electrically connecting each of the ground contact tips 934 to the other ground contact tips. In addition to the ground contact tip holders of the housing modules, the metal sheet also includes a ground contact tip holder 3202 that also accommodates the ground contact tips. The ground contact tip holder 3202 is shown formed by pressing a tab from the metal sheet upwards to create an opening between the tab and the body of the metal sheet into which the contact tip can be inserted. The tab can then press against the contact tip, thereby clamping it in place. Alternatively or additionally, other types of connections may be used in some specific instances. For example, the contact tip may be soldered or otherwise attached to a tab extending from the metal sheet, or to another part of the sheet.

[0175] In some specific instances, the metal sheet can also electrically couple the grounding contact tip to the shield of each of the associated cables.

[0176] In the specific example described, the interlocking housing module is indirectly fastened to the metal sheet via a grounding contact tip. In other specific examples, the housing module may be directly fastened to the metal sheet or held in place by the engagement of the connector assembly's housing with the metal sheet.

[0177] Figure 32 illustrates a module row with a lower metal sheet. In some specific instances, the module row may be positioned between two metal sheets. Figure 33 is a perspective view of the connector assembly of Figure 32, which includes a top metal sheet 3300 in addition to the bottom metal sheet. As shown in Figure 33, the stop metal sheet is fitted onto the complete row of interlocking housing modules such that each row of housing modules is held together around and / or by the metal sheet. The top metal sheet has a shape complementary to that of the bottom metal sheet 3200. A hole 3302 may be formed in the top metal sheet so that a ground contact tip holder 3202 can pass through the upper sheet from the bottom sheet. The ground contact tip inserted into the ground contact tip holder 3202 locks the top sheet to the bottom sheet.

[0178] Figure 34 is a front view of the connector assembly of Figure 33, illustrating how the interlocking array of housing connector modules interlocks. As shown in Figure 34, the first housing module 3100 and the second housing module 3110 are interlocked at the first ground contact tip holder 3104 and the second ground contact tip holder 3114. The ground contact tips are adjacent to each other and disposed in the interlocking ground contact tip holders 3104, 3114. Each column of the housing module is surrounded by a top metal sheet 3300 and a bottom metal sheet 3200. The bottom metal sheet includes a ground contact tip holder 3202, which interlocks with the top metal sheet. Each layer of the connector assembly can be accumulated in this manner until a connector assembly with the desired number of columns is formed.

[0179] Each column can have the desired number of connector modules. Figure 24 shows four modules per column, but the column can extend with additional modules and metal sheets extending in the column direction to surround any additional modules. Figure 34 does not show the ends of the column. The top and bottom metal sheets can be fused or welded, glued, or otherwise secured to each other at the ends of the column. Similarly, these metal sheets can be secured to each other and / or secured to the grounding conductor between the modules.

[0180] The modules, co-held in the sub-assembly shown in Figure 34, can be inserted into or otherwise attached to the support structure. Figure 35 is a perspective view of the connector assembly of Figures 33 and 34 held in the connector housing 3500. As shown in Figure 35, the connector housing is a clamshell formed by first segments 3502 and second segments 3504 that surround the rows of housing modules together. As shown in Figure 35, each row of the housing modules is longitudinally offset from the other rows so that each of the ground and signal contact tips can be electrically coupled to the PCB when the housing mating surface 3506 is flush with and parallel to the PCB. The connector housing 3500 holds the modules in place for mating with an occupied area on the substrate and provides other functions such as protecting the connector components from damage. Although not shown in Figure 35, the connector housing 3500 may include features that interact with a mounting mechanism to align the connector 3512 with the occupied area on the substrate and press the connector against the substrate. The housing can also press against the cable extending from the rear of the housing, thereby reducing strain at the joint between the cable conductor and the contact tip. Other support structures, including an integral housing, may be used to perform some or all of these functions, as the invention is not limited to the specific configuration shown.

[0181] Figure 36 is a perspective view of another specific example of a housing module 3600 for a connector assembly, shown here as cable-free. As shown in Figure 36, a plurality of housing modules 3600 can be interconnected by interlocking ground contact tip holders 3602 in a manner similar to the previous examples. However, unlike the examples of Figures 31 to 35, the housing modules of Figure 36 are identical, meaning that the ground contact tip holders are not offset from each other. Therefore, the housing module mating surfaces 3604 are not aligned in a single column, but are arranged alternately in two sub-columns. For example, the contact tips can mate with occupied areas such as those shown in Figures 14A and 14B. As shown in Figure 36, each housing module includes two ground contact tips 934 and two signal contact tips 932. Similar to the previous examples, adjacent ground contact tips are held by ground contact tip holders of adjacent housing modules, meaning they are held close to each other. Similar to the previous specific examples, the housing module can be placed between metal sheets and / or placed in a connector housing having any desired number of columns and rows.

[0182] Figure 37 is an enlarged view of the housing module 3600 of Figure 36. As shown in Figure 37, each housing module includes two signal contact tips 932, which are configured to be attached to a cable conductor by welding, soldering, or otherwise (e.g., via via hole 3700 or a suitable coupler). Ground contact tip holders 3602 are each configured to hold the two ground contact tips in a side-by-side configuration. Interlocked housing modules are attached to the ground contact tips associated with adjacent housing modules, such that each interlocked housing module is indirectly attached to its surrounding housing modules.

[0183] Figure 38 is a perspective view of another specific example of connector module 3800. Here, the module is configured as an insert that can be inserted into a connector housing using the techniques described above (including in conjunction with Figure 15). As shown in Figure 38, the connector includes a housing 910 having a ground contact tip retainer 912 and an opening 914. The ground contact tip retainer holds a ground contact tip 934.

[0184] Module 3800 is shown here configured to connect signal conductors and signal contact tips in a cable via electronic components. These components can be surface mount components, such as 0205 type surface mount capacitors. These components can be small enough to be integrated into a coupler.

[0185] In the example of Figure 38, capacitive couplers 3850 are positioned in opening 914, coupling signal contact tips 932 to corresponding cable conductors. The housing 910 also includes a mating portion 916 comprising an engaging mating surface 2500 flush with the PCB or other substrate when the connector is electrically connected to an occupied area on the PCB. The configuration of Figure 38 is desirable when direct electrical connection of the connector to a chip substrate or other electrical components makes it impractical to position capacitors or other electronic components, alternatively integrated into the connector, between the signal contact tips 932 and the components. Therefore, the configuration of Figure 38 improves space savings and the density of components and their individual connectors.

[0186] According to a specific example of Figure 38, the opening 914 can be sized and shaped to accommodate the capacitive coupler 3850 without altering the impedance via an electrical connection between the signal contact tip 932 and its respective cable conductors. In the specific example of Figure 38, the opening is configured such that no dielectric material contacts the capacitive coupler. To maintain a consistent impedance throughout the connector, the dielectric constant of the opening surrounding the capacitive coupler is lower than that of the other parts of the housing that contact and / or are adjacent to the signal contact tip and cable conductors. Alternatively or additionally, other configurations (such as grounding) can be used to maintain a constant impedance throughout the connector, as the invention is not limited thereto.

[0187] Figure 39A is a bottom perspective view of a specific example of a capacitive coupler 3850. The capacitive coupler includes a first conductor socket 3852, which includes a first hole 3854 and a fusion channel 3856. The first hole 3854 is sized and shaped to accommodate a conductor of a corresponding size, such as a signal contact tip or cable conductor. The fusion channel 3856 provides a suitable channel for laser fusion or spot fusion to allow the conductor to be securely and electrically connected to the capacitive coupler. Although the fusion channel is shown in the specific example of Figure 39A, any suitable electrical and / or physical connection, such as soldering or crimping, can be used, as the invention is not limited thereto.

[0188] The first hole 3854 can be formed by bending an arm (such as arm 1600) into a tube. The arm forming the first hole 3854 is shown here as integral with the tab 3853. One end of a capacitor or similar component can be attached to the tab 3853, for example, via surface mount soldering.

[0189] The capacitive coupler also includes a second-side conductor socket 3858, which similarly includes a second hole 3860 and a fusion channel 3862. The second-side conductor socket can also accommodate and secure conductors such as cable conductors or signal contact tips. The arm forming the second hole 3860 is shown here as integral with the tab 3859. A second end of the capacitor or similar component can be attached to the tab 3859.

[0190] As shown in Figure 39A, the capacitive coupling also includes a capacitor housing 3864, which includes ends 3866. For example, the capacitor housing 3864 may be an insulating material molded around the conductors forming conductor sockets 3852 and 3858 and their corresponding tabs 3853 and 3859. In some specific embodiments, the conductor sockets 3852 and 3858 and their corresponding tabs 3853 and 3859 may be stamped and formed from a sheet of metal. These components can initially be held together by a connecting rod. At a certain point, after the capacitor housing 3864 has been molded around these components, the connecting rod can be cut off, thereby electrically separating the tabs 3853 and 3859.

[0191] In some specific examples, when the capacitive coupler is placed in a housing opening, the housing opening may be sized and shaped such that a portion of the housing abuts end 3866 and prevents the capacitive coupler from moving relative to the longitudinal axis of the connected cable conductor inside the connector housing. Accordingly, the attached cable conductor physically secured to the capacitive coupler will also be suppressed from moving (i.e., piston-like movement) relative to the connector housing or cable sheath along its longitudinal axis. In other specific examples, the cable conductor, contact tip, or other conductors secured to the capacitive coupler may include structures for suppressing piston-like movement, such as plastic beads attached to the conductor. In this specific example, the capacitive coupler may not provide any resistance to piston-like movement.

[0192] Figure 39B is a top perspective view of the capacitor coupler 3850 of Figure 39A. In the configuration shown in Figure 39B, the capacitor is housed in a capacitor housing 3864, such that the first conductor socket 3852 is electrically connected to the second conductor socket 3858 via the capacitor. In the illustrated embodiment, the capacitor housing 3864 is then filled, which protects the capacitor and forms solder joints thereto. Here, filler 3686 is shown, which can be a UV-curable conformal coating, such as that sold by DYMAX Corporation.

[0193] In some specific instances, the contact tip and cable conductor can be coupled via an assembly without a separate holder. Figure 40 is a top cross-sectional view of another specific example of coupling via a capacitor 4000. The capacitor of Figure 40 is housed in a connector housing 4002, into which the cable conductor 930 and signal contact tip 932 extend in a relatively collinear direction. The connector housing includes a capacitor socket 4004 sized and shaped to accommodate the capacitor 4050. As shown in Figure 40, the capacitor rests on a base portion 4008 of the connector housing 4002 such that it is offset from the longitudinal axis of the signal contact tip 932 and the cable conductor 930.

[0194] This configuration suppresses piston movement of capacitor 4050, signal conductor 930, and / or signal contact tip 932. The capacitor coupling also includes an anti-piston movement protrusion 4006, which is shaped to correspond to the capacitor to further suppress movement of capacitor 4050, thereby suppressing piston movement of the conductor to which it is attached.

[0195] According to the specific example in Figure 40, the capacitor is electrically and physically connected to the signal contact tip and the cable conductor using solder 4052. Here, the end of the conductor is cut at an angle relative to the longitudinal dimension to expose a larger surface area for attaching the capacitor. In this example, the end of the capacitor 4050 is soldered to the angled end of the conductor.

[0196] Figure 41 is a perspective view of another specific example of module 4100. The module of Figure 41 can be used similarly to the module of Figure 15 to terminate conductors in a cable to signal and ground contact tips. As shown in Figure 41, the connector includes a housing 4110 having an opening 4112 for receiving a conductive coupler 4120. The conductive coupler electrically and physically connects the signal contact tip to the cable conductor. In this example, the conductive coupler 4120 is shown crimped around the contact tip and the cable conductor, but other conductors (including those attached via fusion or incorporated into a capacitor as described above) can be used alternatively.

[0197] The grounding contact tip 934 is at least partially housed in the housing 4110 and electrically connected to the cable shield 1300. In this example, the connection between the shield 1300 and the grounding contact tip is via a flexible conductive member 4116, which can be formed as described above.

[0198] In a specific example of Figure 41, the connector housing includes an electrically lossy (i.e., semi-conductive) region 4106. This electrically lossy region is electrically coupled to a ground contact tip 934. In the illustrated example, the ground contact tip 934 passes through an opening in the electrically lossy region 4106. The module 4100 may also incorporate one or more grounding conductive structures, including, for example, a top shield 4102 (Figure 42).

[0199] The damaged material is electrically connected to both the top shield 4102 and the ground contact tip 934 and / or other grounding structures.

[0200] As shown in the exploded view of Figure 42, module 4100 may include a top shield 4102 covering at least a portion of the signal contact tip, ground contact tip, and cable conductor. The top shield includes fingers 4104 extending beyond the mating portion of module 4100, such that when module 4100 presses against the substrate, fingers 4104 can connect to ground contacts on the substrate. The top shield is electrically connected to ground contact tip 934 and cable shield 1300 via flexible conductive member 4116. As a result, a continuous grounding path exists from the cable shield to the grounding structure of the substrate mating with the module. This grounding path passes through both the top shield and the ground contact tip and is parallel to the signal path. The top shield provides a low-impedance path. This configuration has been found to provide high signal integrity. Additionally, a portion of the electrically degraded region 4106 is coupled to this grounding structure, which further improves signal integrity.

[0201] The top shield is fastened to the housing with pillar 4114 and can also provide the module with increased structural rigidity and / or strength.

[0202] As shown in the exploded view of Figure 42 and discussed above, the connector includes a housing 4110 with an opening 4112. The opening is configured to accommodate conductive couplers 4120, which are further configured to electrically connect signal contact tips 932 to cable conductors 930. The housing also includes posts 4114 that accommodate a top shield 4102 and secure the top shield to the housing. The top shield includes fingers 4104 configured to engage ground contacts mounted on a PCB or other substrate. Similarly, ground contact tips 934 are also configured to electrically connect to ground contacts mounted on a PCB or substrate. Ground contact tips are configured to be partially housed in the housing 4110 and electrically connected to a cable shield 1300 via a conductive flexible member 4116. A destructive material 4106 surrounds the ground contact tips and is also electrically connected to the top shield to suppress resonant signals through ground. In some specific instances, the material that replaces the damaged material 4106 can be a conductive elastomer.

[0203] Figure 43 is an exploded view of the connector assembly 4300 including the module 4100 of Figure 41. The connector assembly includes a first housing section 4302 and a second housing section 4304. The first and second housing sections 4302 and 4304 may be molded from an insulating material such as plastic.

[0204] The first and second housing sections include sockets 4306 sized and shaped to accommodate module 4100. In some specific instances, the housing sections may include multiple sockets for multiple modules, so that any desired number of contacts and grounds are available for the connector assembly. In this configuration, the structure shown in FIG43 can be replicated, for example, as in FIG8. The housing sections can be secured together in any suitable manner, including by using screws, adhesives, or other fasteners.

[0205] In some specific instances, cable clamps 4308 may be used. For example, cable clamps 4308 may compress around the insulating sheath 1304 and a portion of the housing of the cable. The clamps may be rigid (such as crimped metal strips) or flexible, and may be formed by overlaying molded rubber or similar flexible material onto portions of the cable and housing. The connector assembly is suitable for use with a substrate (e.g., a PCB) 102 having one or more contacts.

[0206] Figure 44A is a top view of a specific example of a contact area 4400 that can mate with the contact tips of an intermediate board connector. As shown in Figure 44A, the contact area 4400 is disposed on a substrate (e.g., PCB) 4402. According to the specific example of Figure 44A, the contact area 4400 can be used to electrically connect one or more contact tips of the intermediate board connector. Similar to the contact pads described with reference to Figures 14A to 14B, the contact area 4400 includes a ground contact pad 4404, a first signal contact pad 4406, and a second signal contact pad 4408. As shown in Figure 44A, the ground contact pad 4404 can generally be planar and extend over a relatively large area of ​​the substrate 4402, having an opening in which the signal contact pad is disposed. This ground contact pad can be electrically connected to multiple ground contact tips of the intermediate board connector.

[0207] The first signal contact pad 4406 and the second signal contact pad 4408 are disposed in the opening of the ground contact pad 4404. As will be further discussed with reference to FIG44B, the first signal contact pad 4406 and the second signal contact pad 4408 are concave to align the signal contact pads with the contact tips of the intermediate board connector that engages the signal contact pads with the pads. When a pressure-fit connection is formed between the connector and the substrate 4402, the contact tips are pushed toward the lower point of the recess. In the specific example described, the signal contact pads are formed with a semi-circular recess having a centerline aligned with the center of the signal pad. As explained, the depth of the pad decreases monotonically toward the centerline of the pad. This configuration allows the contact tips in the signal contact pads to be centered. Centering of the contact tips can be further facilitated by using rounded contact tips.

[0208] Figure 44B is a cross-sectional view of the contact area 4400 of Figure 44A taken along line 44B-44B. As shown in Figure 44B, the ground contact pad 4404 is formed as a flat conductive area disposed on the substrate 4402. The first signal contact pad 4406 and the second signal contact pad 4408 are also disposed on the substrate 4402 in the same plane as the ground contact pad 4404. The signal contact pads are shaped with semi-circular recesses, such that the contact tips of the signal contact pads are centered on the longitudinal centerline of the first and second signal contact pads 4406 and 4408. The bending of the signal contact pads uses the normal force between the signal contact tip and the signal contact pad to push the signal contact tip toward the longitudinal centerline of the signal contact pad. Of course, although the first and second signal contact pads 4406 and 4408 are semi-circular in the specific example of Figure 44B, other specific examples may have other recessed shapes for the signal contact pads. For example, in some specific instances, the signal contact pad may have a V-shaped groove, wherein the sloping walls of the V provide a normal force that pushes the signal contact tip toward the longitudinal centerline of the signal contact pad. Therefore, the signal contact pad may have any suitable recessed shape configured to generate a normal force that pushes the signal contact tip toward the longitudinal centerline or other parts of the signal contact pad that need to be contacted. It should also be understood that although this technique is illustrated with regard to the positioning of the signal contact tip, similar methods can be used in conjunction with ground contact tips.

[0209] For example, this configuration can promote low tolerance in the relative positioning of the signal contact tips and the ground contact structure when the connector is pressure-mounted to the substrate. As a result, the impedance of the signal path can be well controlled. This type of impedance control is particularly needed for connectors carrying high-speed signals, such as 56 Gbps (PAM4) or higher, including at 112 Gbps or higher. This type of impedance control can be used, for example, with differential signals, where the contact area has a pair of signal pads surrounded by a ground pad. Reducing the tolerance in the position of the signal contact tips can reduce the impedance variation within the connector to less than 3 ohms, and in some specific instances less than 2 ohms, less than 1 ohm, or in some specific instances less than 0.5 ohms.

[0210] It should be noted that the signal contact pads of Figures 44A and 44B can be formed in any suitable manner. In some specific examples, the signal contact pads can be formed using ball end milling. Ball end milling can be used to process the semi-circular grooves in the signal contact pads. In some other specific examples, the signal contact pads can be etched away in a wet process. Of course, any suitable process can be used, as the invention is not limited thereto.

[0211] Figure 45 is a cross-sectional view of a specific example of the signal contact tip 4502 of the intermediate board connector 4500 connected to the contact pads of Figures 44A to 44B. According to the specific example of Figure 45, the signal contact tip 4502 is supported by a dielectric insert 4504. As shown in Figure 45, the signal contact tip is cylindrical with a rounded end. Similar to the specific examples discussed earlier herein, the signal contact tip can be configured to press against the signal contact pad to apply a normal force to the signal contact pad. The first signal contact pad 4406 is formed with a curved groove to push the signal contact tip into alignment with the signal contact pad by the normal force applied by the signal contact tip 4502. In this example, the first signal contact pad 4406 pushes the signal contact tip 4052 into alignment with the longitudinal centerline of the signal contact pad. In the specific example of Figure 45, the signal contact pad and the signal contact tip have corresponding shapes to allow the signal contact tip to reliably move into alignment with the signal contact pad. In this example, both the signal contact tip and the signal contact pad have curved shapes. Of course, the signal contact tip and the signal contact pad can have any suitable shape, whether the two are the same or different, as the invention is not limited thereto. For example, the signal contact pad can have a V-shaped groove, while the signal contact tip is still formed as a cylinder.

[0212] The various forms of this invention can be used individually, in combination, or in various configurations not specifically discussed in the specific examples described above, and therefore their application is not limited to the details and configurations of the components set forth in the foregoing description or illustrated in the figures. For example, a form described in one specific example can be combined in any way with forms described in other specific examples.

[0213] For example, the use of lossy materials is described. Materials that conduct electricity but have some loss, or non-conductive physical structures that attract electromagnetic energy in the frequency range of interest, are generally referred to herein as "lossy" materials. Electrically lossy materials can be formed from lossy dielectric materials and / or poorly conductive materials and / or lossy magnetic materials.

[0214] Lossy magnetic materials can include, for example, materials traditionally considered ferromagnetic, such as those with a magnetic loss tangent greater than approximately 0.05 in the frequency range of interest. The "magnetic loss tangent" is generally known as the ratio of the imaginary to the real part of the composite permittivity of a material. Actual lossy magnetic materials, or mixtures containing lossy magnetic materials, can also exhibit useful amounts of dielectric or conductive loss effects within a portion of the frequency range of interest.

[0215] Electrically lossy materials can be formed from materials traditionally considered dielectric materials, such as those with a loss tangent greater than approximately 0.05 in the frequency range of interest. The "loss tangent" is generally known as the ratio of the imaginary to the real part of the composite permittivity of a material. For example, an electrically lossy material can be formed from a dielectric material in which a conductive mesh is embedded, producing a loss tangent greater than approximately 0.05 in the frequency range of interest.

[0216] Electrically lossy materials can be formed from materials that are generally considered to be conductors but are relatively poor conductors in the frequency range of interest, or contain conductive particles or regions that are sufficiently dispersed so that they do not provide high conductivity, or are prepared to have relatively weak bulk conductivity in the frequency range of interest compared to good conductors (e.g., copper).

[0217] Electrically lossy materials typically have a bulk conductivity of about 1 siemens / meter to about 100,000 siemens / meter, and more preferably about 1 siemens / meter to about 10,000 siemens / meter. In some specific examples, materials with a bulk conductivity between about 10 siemens / meter and about 200 siemens / meter can be used. As a specific example, a material with a conductivity of about 50 siemens / meter can be used. However, it should be understood that the conductivity of the material can be selected empirically or through electrical simulation using known simulation tools to determine a suitable conductivity that provides both adequately low crosstalk and adequately low signal path attenuation or insertion loss.

[0218] Electrically lossy materials can be partially conductive materials, such as those with a surface resistivity between 1 ohm / square and 100,000 ohms / square. In some specific examples, electrically lossy materials can have a surface resistivity between 10 ohms / square and 1,000 ohms / square. As a particular example, electrically lossy materials can have a surface resistivity between about 20 ohms / square and 80 ohms / square.

[0219] In some specific instances, electrically lossy materials can be formed by adding a filler containing conductive particles to an adhesive. In this specific instance, the lossy component can be formed by molding or otherwise shaping the adhesive and filler into the desired form. Examples of conductive particles that can be used as fillers to form electrically lossy materials include carbon or graphite formed as fibers, flakes, nanoparticles, or other types of particles. Metals in the form of powders, flakes, fibers, or other particles can also be used to provide suitable electrically lossy properties. Alternatively, combinations of fillers can be used. For example, metallized carbon particles can be used. Silver and nickel can be suitable metals for metallized fibers. Coated particles can be used alone or in combination with other fillers such as carbon flakes. The adhesive or matrix can be any material that will solidify, cure, or can otherwise be used to position the filler material. In some specific instances, the adhesive can be a thermoplastic material traditionally used in the manufacture of electrical connectors to facilitate the molding of electrically lossy materials into the desired shape and into the desired location (as part of the manufacture of the electrical connector). Examples of such materials include liquid crystal polymers (LCPs) and nylon. However, many alternative forms of adhesive materials can be used. Curable materials such as epoxy resins can act as adhesives. Alternatively, materials such as thermosetting resins or adhesives can be used.

[0220] Furthermore, although the aforementioned adhesive materials can be used to generate electrically lossy materials by forming a matrix around conductive particle fillers, the techniques described herein are not limited thereto. For example, conductive particles can be impregnated into or coated onto the formed matrix material, such as by applying a conductive coating to a plastic or metal component. As used herein, the term "adhesive" can encompass materials that encapsulate fillers, are impregnated with fillers, or otherwise act as filler-retaining materials.

[0221] In some specific instances, the volume percentage of filler present is sufficient to allow for a particle-to-particle conductive path. For example, when using metal fibers, the fibers can be present at approximately 3% to 40% by volume. The amount of filler can affect the electrical conductivity of the material.

[0222] The filler material is commercially available, such as the material sold by Celanese under the trademark Celestran®, which can be filled with carbon fiber or stainless steel filaments.

[0223] The damaging component can be formed from a damaging conductive carbon-filled adhesive preform (available from Techfilm, Billerica, Massachusetts, USA) and can be used as a damaging material. This preform may include an epoxy resin adhesive filled with carbon fibers and / or other carbon particles. The adhesive may surround the carbon particles, acting as reinforcement for the preform. This preform can be inserted into a connector lead frame sub-assembly to form all or part of the housing. In some specific examples, the preform may be adhered via an adhesive within the preform, which may be cured during heat treatment. In some specific examples, the adhesive may be in the form of a separate conductive or non-conductive adhesive layer. In some specific examples, alternatively or additionally, the adhesive in the preform can be used to fasten one or more conductive elements, such as foil strips, to the damaging material.

[0224] Various forms of reinforcing fibers, whether woven or non-woven, coated or uncoated, can be used. For example, non-woven carbon fiber can be a suitable reinforcing fiber. As will be understood, other suitable reinforcing fibers can be used in practice or in combination.

[0225] Alternatively, lossy components can be formed in other ways. In some specific examples, lossy components can be formed by interleaving layers of lossy material with layers of conductive material, such as metal foil. These layers can be rigidly attached to each other, such as by using epoxy resin or other adhesives, or can be held together by any other suitable means. These layers can have a desired shape before being fastened to each other, or can be stamped or otherwise shaped after they are held together. Alternatively or additionally, lossy material can be formed by depositing or otherwise forming a diffusion layer of conductive material (such as metal) on an insulating substrate (such as plastic) to provide a composite portion with lossy properties, as described above.

[0226] In the various specific examples described herein, the lossy region may be formed of an electrically lossy material. In some particular examples, the lossy material may have a plastic matrix, allowing the component to be easily molded into the desired shape. The plastic matrix may become partially conductive by incorporating conductive fillers, as described above, thus making the matrix lossy.

[0227] Furthermore, the specific instances described herein can be implemented as methods, examples of which have been provided. The actions performed as part of a method can be ordered in any suitable manner. Thus, specific instances can be constructed in which actions are performed in an order different from the order described, which may include performing some actions simultaneously, even if such actions are shown as consecutive actions in the illustrative specific instances.

[0228] Furthermore, although the various specific examples described herein include one or more components comprising hyperelastic materials, it should be understood that the invention is not limited in this respect. For example, in some cases, such components may comprise technically non-hyperelastic materials, but may include one or more flexible materials that operate below their yield stress (and therefore do not undergo plastic deformation). In other specific examples, non-hyperelastic materials may be included and may operate above their yield stress, and therefore such components may be non-reusable.

[0229] While this teaching has been described with reference to various specific examples and instances, it is not intended to limit this teaching to such specific examples or instances. Rather, as will be appreciated by those skilled in the art, this teaching encompasses various alternatives, modifications, and equivalents. For example, the connector assembly of the exemplary specific examples described herein can be used in silicon-to-silicon applications for data transmission rates greater than or equal to 28 Gbps and 56 Gbps. Additionally, the connector assembly can be used in situations where signal loss from trace signal transmission is too high (e.g., at signal frequencies exceeding 10 GHz, 25 GHz, 56 GHz, or 112 GHz).

[0230] As another example, a specific instance is described in which a metal sheet is positioned above and / or below multiple modules. The metal sheet may be a solid metal, or in some specific instances may be a metal foil supported on a polymer film, such as an aluminum layer less than 5 mils thick on a polyester film.

[0231] Furthermore, features described in conjunction with specific examples can be applied in other specific examples. For instance, coupling cable conductors and contact tips via capacitors can be used in specific examples other than those specifically described as including such options. As another example, various techniques for coupling signals and / or ground conductors are described, and these techniques can be similarly applied in specific examples other than those explicitly described. Similarly, detrimental materials and shielding for the contact substrate of a module can be used in conjunction with specific examples other than those explicitly described therein.

[0232] According to one embodiment of the present invention, a connector assembly is provided, comprising at least one cable including at least one first cable conductor and an electrical connector. The connector assembly includes: a first contact tip comprising a superelastic conductive material, the first contact tip being configured to mate with a first signal contact of a circuit board; and a first conductive coupler mechanically coupling the first contact tip to the first cable conductor, wherein the first conductive coupler at least partially surrounds the periphery of the first contact tip and the periphery of the first cable conductor. The connector assembly further includes a housing having an opening therethrough, wherein: the opening includes a first end and a second end, the first contact tip passes through the first opening, the first cable conductor passes through the second opening, and the first conductive coupler is disposed within the opening of the housing. In the connector assembly, the first conductive coupler is held within the opening such that interference between the first conductive coupler and the first end or the second end of the opening suppresses movement of the first contact tip and the first cable conductor relative to the housing in at least one direction. In the connector assembly, movement of the first contact tip and the first cable conductor is suppressed along the length of the first cable conductor. In the connector assembly, the opening is defined by an inner surface of the housing, and this inner surface is at least partially coated with a conductor. In the connector assembly, the inner surface is separated from the conductive coupler by a distance that provides impedance through the conductive coupler, the impedance matching the impedance of the first cable conductor within the cable of the at least one cable. In the connector assembly, the inner surface is at least partially coated with a metal. The connector further includes a first ground conductor and a first housing module, wherein: the first housing module mechanically couples the first ground conductor to the first contact tip and the first cable conductor, and the first housing module at least partially surrounds the periphery of the first ground conductor. In the connector assembly, the first ground conductor is configured to engage with a first ground contact of the circuit board before the first contact tip engages with the first signal contact. In the connector assembly, the first housing module includes a contact surface, from which the first ground conductor and the first contact tip protrude, wherein the first ground conductor protrudes further from the contact surface in a direction perpendicular to the contact surface compared to the first contact tip. In the connector assembly, the at least one cable further includes a second cable conductor electrically connected to the second contact tip; and the connector assembly further includes: a second contact tip comprising a superelastic conductive material, the second contact tip being configured to mate with a second signal contact of a circuit board; and a second conductive coupler mechanically coupling the second contact tip to the second cable conductor, wherein the second conductive coupler at least partially surrounds the periphery of the second contact tip and the periphery of the second cable conductor.The connector assembly further includes a second ground conductor, wherein: the first housing module mechanically couples the second ground conductor to the second contact tip and the second cable conductor, and the first housing module at least partially surrounds the periphery of the second ground conductor. In the connector assembly, the second ground conductor is configured to engage with a second ground contact of the circuit board before the second contact tip engages with the second signal contact. In the connector assembly, the second ground conductor protrudes further from the contact surface in a direction perpendicular to the contact surface than the second contact. In the connector assembly, the first contact tip, the second contact tip, the first cable conductor, the second cable conductor, the first ground conductor, and the second ground conductor are mechanically supported by the first housing module. The connector assembly further includes a second housing module in which the second conductive coupler is disposed, and wherein the first conductive coupler is disposed within the first housing module. In the connector assembly, the electrical connector includes a plurality of housing modules, including a first housing module and a second housing module. The first and second housing modules mechanically couple a first ground conductor to a second ground conductor. The plurality of housing modules are arranged in at least one column including at least one first column. In the first column, the first housing module has its first ground conductor separated from the second ground conductor in a direction perpendicular to the first column. In the connector assembly, the at least one column includes at least one second column. In the second column, the second housing module has its second housing module separated from the first housing module in the same direction perpendicular to the first column. In the connector assembly, the second ground conductor is configured to engage with a second ground contact of the circuit board before its second contact tip engages with the second signal contact. In the connector assembly, the first signal contact is disposed in a first signal contact row, and the second signal contact is disposed in a second signal contact row, wherein the second signal contact is separated from the first signal contact by a distance between 0.5 mm and 1.5 mm in a direction perpendicular to the first signal contact row. In the connector assembly, the second signal contact is separated from the first signal contact by a distance between 1.5 mm and 2.5 mm in a direction parallel to the first signal contact row. The connector assembly further includes a metal sheet that mechanically couples the first housing module to the second housing module and electrically couples the first ground conductor to the second ground conductor. In the connector assembly, the first cable conductor and the second cable conductor are disposed in a first cable, wherein the first cable conductor and the second cable conductor are surrounded by a first shield. In the connector assembly, the first shield is electrically coupled to the first ground conductor and the second ground conductor.The connector assembly further includes a flexible conductive member that at least partially surrounds the periphery of the first shield, the first ground conductor, and the second ground conductor, and electrically connects the first ground conductor and the second ground conductor to the first shield. The connector assembly further includes: a third contact tip comprising a shape memory alloy conductive material, the third contact tip being configured to mate with a third signal contact of the circuit board; a third cable conductor; a third conductive coupler that mechanically couples the third contact tip to the third cable conductor, wherein the third conductive coupler at least partially surrounds the periphery of the third contact tip and the periphery of the third cable conductor, and the third cable conductor is electrically coupled to the third contact tip; a third ground conductor; and a fourth contact tip comprising a shape memory alloy conductive material. The fourth contact tip is configured to mate with a fourth signal contact of the circuit board; a fourth cable conductor; a fourth conductive coupler that mechanically couples the fourth contact tip to the fourth cable conductor, wherein the fourth conductive coupler at least partially surrounds the periphery of the fourth contact tip and the periphery of the fourth cable conductor, and the fourth cable conductor is electrically coupled to the fourth contact tip; and a fourth ground conductor, wherein the third cable conductor and the fourth cable conductor are disposed in the second cable, and wherein the third cable conductor and the fourth cable conductor are surrounded by a second shield. In the connector assembly, the first conductive coupler and the second conductive coupler are disposed in the first housing module, and the third conductive coupler and the fourth conductive coupler are disposed in the second housing module. In the connector assembly, the second shield is electrically connected to the third ground conductor and the fourth ground conductor. In the connector assembly, the first cable and the second cable are arranged in a row. The connector assembly further includes: a fifth contact tip comprising a shape memory alloy conductive material, the fifth contact tip being configured to mate with a fifth signal contact of the circuit board; a fifth cable conductor electrically connected to the fifth contact tip; a fifth conductive coupler mechanically coupling the fifth contact tip to the fifth cable conductor, wherein the fifth conductive coupler at least partially surrounds the periphery of the fifth contact tip and the periphery of the fifth cable conductor; a fifth ground conductor; a sixth contact tip comprising a shape memory alloy conductive material, the sixth contact tip being configured to mate with a sixth signal contact of the circuit board; a sixth cable conductor electrically connected to the sixth contact tip; a sixth conductive coupler mechanically coupling the sixth contact tip to the sixth cable conductor, wherein the sixth conductive coupler at least partially surrounds the periphery of the sixth contact tip and the periphery of the sixth cable conductor; and a sixth ground conductor, wherein the fifth cable conductor and the sixth cable conductor are disposed in a third cable, and wherein the fifth cable conductor and the sixth cable conductor are surrounded by a third shield. In the connector assembly, the first cable and the second cable are arranged in a first column, and the third cable is arranged in a second column.In the connector assembly, the first cable and the third cable are arranged transversely in one row of the first column. In the connector assembly, the superelastic conductive material is nickel titanium. In the connector assembly, the conductor of the first cable contains copper. In the connector assembly, the first contact tip is configured to apply a constant contact force for deflection between 0.02 mm and 0.15 mm. The connector assembly further includes a housing comprising a surface configured to be mounted adjacent to a circuit board. In the connector assembly, the first contact tip is positioned relative to the surface of the housing configured to be mounted adjacent to the circuit board at an angle between 15 degrees and 60 degrees. In the connector assembly, the first contact tip has a length between 0.1 mm and 5 mm, measured based on the first contact tip extending from the housing to its end. In the connector assembly, the first cable conductor enters the housing at a non-zero angle relative to the surface of the housing configured to be mounted adjacent to the circuit board. The connector assembly further includes a metal reinforcing plate disposed on at least one surface of the housing. In the connector assembly, the metal reinforcing plate is disposed on a surface of the housing perpendicular to the surface of the housing configured to be mounted adjacent to the circuit board. The connector assembly is coupled to a printed circuit board containing a high-speed chip, and the electrical connector is mounted to a surface selected from the group consisting of an upper surface and a lower surface of the circuit board. In the connector assembly, the electrical connector is mounted close to the high-speed chip on the circuit board. The connector assembly is coupled to an I / O connector, wherein a first end of the first cable conductor is disposed in the housing, and a second end of the first cable conductor is disposed in the I / O connector. In the connector assembly, the first cable conductor is at least 6 inches long. In the connector assembly, the first contact tip and the first cable conductor have a diameter less than or equal to 30 AWG. In the connector assembly, the first conductive coupler mechanically couples the first contact tip to the first cable conductor via fusion, soldering, or crimping. In the connector assembly, the first conductive coupler is fused to the first cable connector and the first contact tip. In the connector assembly, the circuit board includes 128 signal contacts for forming 64 differential pairs. In the connector assembly, the thickness of the housing is between 3.5 mm and 4.5 mm.

[0233] According to another embodiment of the present invention, a connector assembly comprises: a plurality of cables, each of the plurality of cables including at least one cable conductor having an end; a plurality of contact tips, wherein each of the plurality of contact tips includes an end adjacent to the end of the respective cable conductor and is made of a material different from the respective cable conductor; and a plurality of conductive couplers, wherein each of the plurality of conductive couplers includes a first end having teeth and a second end having teeth, the first end at least partially surrounding a contact tip of the plurality of contact tips, and the second end having at least partially surrounding the end of the respective cable conductor. In the connector assembly, each of the plurality of conductive couplers is fused to a respective contact tip of the plurality of contact tips and the end of the respective cable conductor of the plurality of cables. In the connector assembly, each of the plurality of conductive couplers is soldered to a respective contact tip of the plurality of contact tips and the end of a respective cable conductor of the plurality of cables. In the connector assembly, each of the plurality of conductive couplers is crimped around a respective contact tip of the plurality of contact tips and the end of a respective cable conductor of the plurality of cables. In the connector assembly, each of the plurality of contact tips comprises nickel-titanium. In the connector assembly, the plurality of cables are arranged in a first column and a second column separate from the first column. In the connector assembly, the plurality of cables are arranged in a plurality of rows, wherein each of the plurality of rows includes cables in the first column and cables in the second column. In the connector assembly, each of the plurality of cables includes a first cable conductor and a second cable conductor surrounded by a shield. In the connector assembly, the plurality of cables comprises 64 cables. In the connector assembly, the plurality of cables comprises 128 cables. The connector assembly further comprises a plurality of ground contact tips, wherein each of the plurality of cables includes a shield surrounding each of the at least one conductor, wherein each of the plurality of ground contact tips is electrically coupled to the shield of the cables in the plurality of cables within the connector assembly. The connector assembly further comprises a plurality of housing modules, wherein at least one of each of the cable conductors, the plurality of contact tips, and the plurality of ground contact tips is disposed in each of the plurality of housing modules. In the connector assembly, each of the plurality of housing modules is interlocked with a neighboring housing module. In the connector assembly, the plurality of ground contact tips of the plurality of housing modules pass through openings formed in each of the respective neighboring housing modules.

[0234] According to another embodiment of the present invention, a connector assembly includes: a housing having an opening, wherein the opening includes a first end defined by a first wall and a second end defined by a second wall, the first wall including a first hole through the opening, and the second wall including a second hole through the opening; an elongation member passing through the first hole and the second hole, wherein the elongation member includes: a first contact tip; a first cable conductor electrically and mechanically coupled to the first contact tip; and a second member mechanically coupled to the elongation member, wherein the second member has a size larger than the first hole and the second hole, and the second member is disposed in the opening. In the connector assembly, the first contact tip comprises a superelastic conductive material. In the connector assembly, the second member is configured to contact the first wall and the second wall such that movement of the elongation member in the direction of the first wall or the second wall is suppressed. The connector assembly further includes: a third elongated member comprising: a second contact tip and a second cable conductor electrically connected to the second contact tip; and a fourth member mechanically coupled to the third elongated member, wherein the fourth member is disposed within the housing, and wherein the fourth member is configured to contact the first wall and the second wall such that movement of the second and third elongated members in the direction of the first wall or the second wall is suppressed. In the connector assembly, the second member and the fourth member are disposed in the opening, wherein the second contact tip passes through the first wall, and the first cable conductor passes through the second wall. In the connector assembly, the fourth member is disposed in a second opening having a first end defined by the first wall and a second end defined by the second wall, wherein the second contact tip passes through the first wall of the second opening, and the first cable conductor passes through the second wall of the second opening. In the connector assembly, the first opening is disposed in a first column, and the second opening is disposed in a second column offset from the first column. In the connector assembly, the first column is separated from the second column by a distance between 4 mm and 5 mm in a direction perpendicular to the first column. In the connector assembly, the first cable conductor and the first contact tip are formed of different types of metal. In the connector assembly, the opening is defined by the inner surface of the housing, and a portion of the inner surface is coated with a conductor. In the connector assembly, this portion of the conductor-coated inner surface is separated from the second member by a distance that provides impedance through the second member, which matches the impedance within the first cable conductor. In the connector assembly, the inner surface is at least partially coated with metal. In the connector assembly, the first cable conductor has a diameter of 30 AWG or less.

[0235] According to another embodiment of the present invention, a method of manufacturing an electrical connector includes: mechanically and electrically connecting a first cable conductor formed of a first material to a first electrical contact tip formed of a conductive hyperelastic material different from the first material; attaching a member to the first cable conductor and / or the first electrical contact tip; and positioning the member in a housing, wherein the first electrical contact tip is exposed in the surface of the housing and the first cable conductor extends from the housing. In the method, mechanically and electrically connecting the first cable conductor to the first electrical contact tip includes fusing the first cable conductor, the first electrical contact tip, and the first conductive coupler together. In the method, the fusing includes emitting lasers at the first cable conductor, the first electrical contact tip, and the first conductive coupler. In the method, mechanically and electrically connecting the first cable conductor to the first electrical contact tip includes placing the first cable conductor in the conductive coupler by placing the first cable conductor in a channel at least partially surrounded by one or more serrations. In the method, placing the first electrical contact tip in the conductive coupler includes placing the first cable conductor in a channel at least partially surrounded by one or more serrations. The method further includes: placing a second cable conductor formed of the first material in a first side of the second conductive coupler; placing a second electrical contact tip formed of the conductive hyperelastic material different from the first material in a second side of the second conductive coupler; and mechanically and electrically connecting the second cable conductor to the second electrical contact tip. The method further includes placing the first and second conductive couplers adjacent to each other in an opening formed in a first housing module. In the method, the first and second cable conductors are disposed in a cable and surrounded by a shield. The method further includes: attaching a first ground contact tip to a first side of the first housing module; and electrically connecting the first ground contact tip to the shield. The method further includes: attaching a second grounding contact tip to a second side of the first housing module; and electrically connecting the second grounding contact tip to the shield. The method further includes placing the first housing module inside the housing.The method further includes: placing a third cable conductor formed of the first material in a first side of a third conductive coupler; placing a third electrical contact tip formed of the conductive hyperelastic material in a second side of the third conductive coupler; mechanically and electrically connecting the third cable conductor to the third electrical contact tip; placing a fourth cable conductor formed of the first material in a first side of a fourth conductive coupler; placing a fourth electrical contact tip formed of the hyperelastic material in a second side of the fourth conductive coupler; mechanically and electrically connecting the fourth cable conductor to the fourth electrical contact tip; placing the adjacent third and fourth conductive couplers in an opening formed in a second housing module; attaching a third grounding contact tip to a first side of the second housing module; and attaching a fourth grounding contact tip to a second side of the second housing module. The method further includes attaching a second grounding contact tip to the first side of the second housing module. The method further includes attaching a third grounding contact to the first side of the first housing module. The method further includes placing the first housing module and the second housing module within a housing. The method further includes covering the first housing module and the second housing module with a metal sheet, wherein covering the first housing module and the second housing module with the metal sheet electrically connects the first grounding contact, the second grounding contact, the third grounding contact, and the fourth grounding contact. The method further includes arranging the first housing module and the second housing module in multiple columns within the housing, wherein the first housing module is positioned in a first column in the direction of its second side surface, and the second housing module is positioned in a second column in the direction of its second side surface, wherein the first column and the second column are parallel. In the method, the first material is copper, and the conductive superelastic material is nickel-titanium.

[0236] According to another embodiment of the present invention, an electrical connector includes: a first contact tip formed of a first material; a first cable conductor formed of a second material different from the first material and electrically connected to the first contact tip at a connector; and a housing including an opening therethrough, wherein the connector is disposed in the opening, wherein the opening is defined by an inner surface of the housing, and at least a portion of the inner surface is coated with a conductor. In the electrical connector, the inner surface is separated from the connector by a distance that provides impedance through the connector, the impedance matching the impedance within the first cable conductor. In the electrical connector, the at least a portion of the inner surface is coated with a metal. In the electrical connector, the first cable conductor has a diameter of 30 AWG or less. In the electrical connector, the first material is copper, and the second material is nickel-titanium.

[0237] According to another embodiment of the present invention, an electrical connector kit includes: a contact tip; a conductive coupler including a first end configured to be mechanically coupled to the first contact tip and a second end configured to be mechanically coupled to a cable conductor; and a housing including an opening therethrough, wherein the opening includes a first end defined by a first wall and a second end defined by a second wall, wherein: the housing is configured to receive the first contact tip via the first wall, the housing is configured to receive the cable conductor via the second wall, and the opening is configured to receive the conductive coupler. In the electrical connector kit, the contact tip is formed of nickel-titanium. The electrical connector kit further includes a ground contact tip, wherein the housing is configured to receive the ground contact tip via the first wall.

[0238] According to another embodiment of the present invention, an electrical connector includes: a housing containing; a first contact tip formed of a first material extending from the housing; a first cable conductor formed of a second material different from the first material extending from the housing; and a capacitor electrically connecting the first contact tip to the first cable conductor. In the electrical connector, the first material is nickel-titanium. In the electrical connector, the capacitor is disposed within the housing; and the electrical connector further includes a shield disposed on the housing and covering the capacitor. In the electrical connector, at least a portion of the housing includes a semi-conductive damaging material electrically connected to the shield. The electrical connector further includes a ground contact tip at least partially disposed within the housing, wherein the ground contact tip is electrically connected to the shield. In the electrical connector, at least a portion of the housing includes a damaging material electrically connected to the ground contact tip.

[0239] According to another embodiment of the present invention, an electronic assembly includes: a substrate having a first surface and an opposing second surface; a semiconductor device on the first surface; and a first connector assembly configured to couple a signal to the semiconductor device, wherein the first connector assembly includes: a first plurality of cables having conductors configured to carry the signal; and a first connector including a first plurality of hyperelastic contact tips electrically connected to the conductors of the first plurality of cables and press-fitted to the first surface. The electronic assembly further includes: a second connector assembly configured to couple a signal to the semiconductor device, wherein the second connector assembly includes: a second plurality of cables having conductors configured to carry the signal; and a second connector including a second plurality of hyperelastic contact tips electrically connected to the conductors of the second plurality of cables and press-fitted to the second surface. In the electronic assembly, the first connector terminates the first plurality of cables at a first end; and the second end of the first plurality of cables is coupled to an I / O connector. In the electronic assembly, the first plurality of cables comprises conductor pairs; the first plurality of hyperelastic contact tips are configured in pairs to be coupled to the conductor pairs of individual cables of the first plurality of cables; and the paired hyperelastic contact tips are pressure-mounted to the first surface in a linear array comprising more than 15 pairs per inch. In the electronic assembly, the first plurality of cables and the second plurality of cables comprise conductor pairs; the first plurality of hyperelastic contact tips are configured as a first pair, the first pair being coupled to the conductor pairs of individual cables of the first plurality of cables; the second plurality of hyperelastic contact tips are configured as a second pair, the second pair being coupled to the conductor pairs of individual cables of the second plurality of cables; the hyperelastic contact tips of the first pair are press-fitted to the first surface in a first linear array parallel to the edge of the substrate; the hyperelastic contact tips of the second pair are press-fitted to the second surface in a second linear array parallel to the edge of the substrate; the first pair and the second pair comprise more than 30 pairs per inch adjacent to the edge of the substrate. In the electronic assembly, the first pair and the second pair comprise at least 40 pairs per inch adjacent to the edge of the substrate. In the electronic assembly, the first plurality of hyperelastic contact tips have a diameter of 36 AWG or less. In the electronic assembly, the electronic assembly further includes a motherboard; and the motherboard includes a sub-card parallel to the motherboard.

[0240] According to another embodiment of the present invention, a connector assembly includes: a plurality of cables, each of the plurality of cables including at least one conductor and a shield; and a plurality of cartridges, each cartridge including: a housing; at least one tip coupled to and extending from the housing of the at least one conductor of the respective cable; and a conductive plate mounted to the housing and electrically coupled to the shield of the respective cable, wherein the conductive plate includes at least one flexible portion extending beyond the housing. The connector assembly further includes a conductive washer that presses against the shield of the respective cable and is electrically connected to the conductive plate. In the connector assembly, the housing includes an insulating portion and a damaged portion. In the connector assembly, the cartridge further includes a grounding tip extending from the housing; and a portion of the grounding tip contacts the damaged portion. In the connector assembly, the at least one tip extends from the housing at the mating interface; and the connector assembly further includes a conductive elastomer having a portion of the shielding of the respective cables that presses against it and a portion at the mating interface. The connector assembly further includes a support member, wherein the plurality of cartridges are attached to the support member in a row. The connector assembly is coupled to a substrate including at least one signal pad and a ground plane, wherein: the flexible portion of the conductive plate contacts the ground plane; and the at least one tip contacts the at least one signal pad.

[0241] According to another embodiment of the present invention, a connector assembly includes: a circuit board including a first contact pad, wherein the first contact pad includes a groove; and a first contact tip including a superelastic conductive material, the first contact tip being configured to mate with the first contact pad, wherein the first contact pad is configured to align the first contact tip with the groove when the first contact tip mates with the first contact pad. In the connector assembly, the groove is a semi-circular recess. In the connector assembly, the groove is a V-groove. In the connector assembly, the groove includes a longitudinal centerline, and the first contact pad is configured to align the first contact tip with the longitudinal centerline when the first contact tip mates with the first contact pad in pressure contact.

[0242] Therefore, the descriptions and diagrams above are only provided by example.

[0243] 100: Electronic systems / electronic devices 102: Printed Circuit Board 102A: Printed Circuit Board 102B: Printed Circuit Board 104: Edge / Panel 106: Sub-board / Sub-card 108: Components / Processors 110: Radiator 111: Connector 112: Connector Assembly 112A: Intermediate board connector assembly 112B: Intermediate board connector assembly 113: Connector Assembly 114: Cable 114A: Cable 114B: Cable 116: End of the first cable 116A: End of the first cable 116B: End of the second cable 118: Second end 118B: Second terminal 120: I / O connector / connector assembly 121: Flange 122B: Contact tip 123: Connector socket 124: First Section 124A: First outer shell section 124B: First outer shell section 126: Second Section 126A: Second shell section 126B: Second shell section 128: Part 1 130: Part 2 131: Mating surface 131A: Mating surface 131B: Mating surface 132: Housing Fasteners / Upper Section 134: PCB Fasteners 136: Metal plate 138: Outer shell plate meshing protrusion 300: Support 612: Connector Assembly 613: Connector Assembly 800: Contact / Contact Pad 802: Hole 910: Insert / Casing 910A: First insert 910B: Second insert 912: Grounding contact tip holder 914: Opening 916: Coordination Part 918: Adaptable to conductive components 920: Coupler 920A: First Coupler 920B: Second Coupler 930: Cable conductor 930A: First cable conductor 930B: Second cable conductor 932: Signal contact tip 932A: First signal contact tip 932B: Second signal contact tip 934: Grounding contact tip 1100: Signal pad 1102: Grounding mat 1200: Stress-strain curve 1202: contraction point 1204: Elastic Limit 1212: contraction point 1216A: The First Turning Point 1216B: The Second Turning Point 1218A: Horizontal Line Area 1218B: Horizontal Line Area 1224: Elasticity Limit 1300: Conductive shielding components / cable shielding components 1302: Dielectric insulator 1304: Insulating Sheath 1600: Arm 1600A: Arm 1600B: Arm 1602: Channel 1604: End 1700: Coupler 1900A: First Wall 1900B: Second Wall 2000: Dielectric separator 2100: First protrusion 2102: First meshing surface 2104: Second protrusion 2106: Second meshing surface 2112: Connector Assembly 2200: Connector socket 2202: Opening 2204: First socket surface 2206: Second socket surface 2208: Protrusion 2250: Mounting surface 2252: Edge 2254: Kong 2500: Mating surface 2700: Spring latch 2702: Spring latch tab 2704: Spring latch socket 2810: Screw 2900: Connector Assembly 2902: First outer shell section 2904: Second outer shell section 3100: First outer casing module 3102: Opening 3104: Grounding contact tip holder 3106: Surface 3110: Second outer shell module 3112: Opening 3114: Grounding contact tip holder 3116: Module surface 3200: Bottom metal sheet 3202: Grounding contact tip holder 3300: Top metal sheet 3302: Kong 3500: Connector Housing 3502: First Segment 3504: Second segment 3506: Mating surface of the outer casing 3512: Connector 3600: Shell Module 3602: Grounding contact tip holder 3604: Meshing surface of the outer shell module 3686: Packing material 3700: Kong 3800: Connector Module 3850: Capacitor Coupler 3852: First conductor socket 3853: protrusion 3854: First hole 3856: Welding Channel 3858: Second conductor socket 3859: protrusion 3860: Second hole 3862: Welding Channel 3864: Capacitor casing 3866: End 4000: Capacitor 4002: Connector Housing 4004: Capacitor socket 4006: Reverse piston movement protrusion 4008: Base section 4050: Capacitor 4052: Solder / signal contact tip 4100: Module 4102: Top shielding component 4104: Finger component 4106: Damaged Materials / Electrical Damage Area 4110: Outer shell 4112: Opening 4114: column 4116: Adapted to conductive components 4120: Conductive Coupler 4300: Connector Assembly 4302: First outer shell section 4304: Second outer shell section 4306: Socket 4308: Cable clamps 4400: Contact Area 4402:Substrate 4404: Grounding contact pad 4406: First signal contact pad 4408: Second signal contact pad 4500: Intermediate Board Connector 4502: Signal contact tip 4504: Dielectric insert D1: Distance D2: Distance D3: Distance D4: Distance D4: Distance H: Height P1: Point P2: Point P3: Point

Claims

1. An electrical connector comprising elements as described in the specification.