Wafer processing methods
The wafer processing method uses a dicing apparatus to register and mark information on the wafer backside, addressing the loss of traceability in component chips by ensuring each chip retains past information.
TWI934008BActive Publication Date: 2026-08-01DISCO CORP
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Patent Information
- Application Number
- TW111131421
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2021-08-25
- Filing Date
- 2022-08-22
- Publication Date
- 2026-08-01
- Estimated Expiration
- 2042-08-21
AI Technical Summary
Technical Problem
Component chips lose traceability after wafer division due to the inability to inherit past information.
Method used
A wafer processing method involving a dicing apparatus with a chuck stage, dicing blade, X/Y/Z-axis feed means, imaging, and control means to register and mark information on the wafer backside before dicing, ensuring each component chip retains past information.
Benefits of technology
Ensures each component chip inherits past information, maintaining traceability through marked identifiers.
✦ Generated by Eureka AI based on patent content.
Abstract
[Problem] To provide a wafer processing method that enables each component wafer to inherit past information and ensures the traceability of each component wafer. [Solution] The wafer processing method includes: a dicing apparatus preparation step; an information registration step, which registers the information to be marked in the control means of the dicing apparatus; a holding step, which holds the front side of the wafer 38 on the chuck stage 4 of the dicing apparatus and exposes the back side 38b side of the wafer 38, the wafer 38 having a front side divided by a plurality of components 42 by a predetermined dicing line 40; a position registration step, which uses the imaging means 8 of the dicing apparatus to photograph the wafer 38 held on the chuck stage 4, and specifies the position of each component 42 to be marked in X and Y coordinates and registers it in the control means; and a marking step, which, based on the X and Y coordinates registered in the position registration step, marks the information registered in the information registration step on the back side of each component 42 with a dicing blade 22.
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