Thermally expandable microcapsules, foaming resin compositions and foams

Thermally expandable microcapsules with controlled volatile content and properties enhance foaming performance and appearance in molded articles, addressing issues of dents and reduced density in existing technologies.

TWI934089BActive Publication Date: 2026-08-01SEKISUI CHEMICAL CO LTD
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Patent Information

Application Number
TW112102571
Authority / Receiving Office
TW · TW
Patent Type
Patents
Current Assignee / Owner
Priority Date
2022-02-02
Filing Date
2023-01-19
Publication Date
2026-08-01
Estimated Expiration
2043-01-18

AI Technical Summary

Technical Problem

Thermally expandable microcapsules used as foaming agents often result in molded articles with dents and poor appearance, and reduce foaming performance and density.

Method used

Thermally expandable microcapsules with a polymer shell containing a carbonyl monomer and silicon dioxide, with controlled volatile content and properties such as expansion ratio, aggregation resistance, and heat resistance, to produce high-quality molded articles.

Benefits of technology

The microcapsules achieve high foaming ratios, lightweight, and excellent appearance in molded articles, with improved foaming performance and stability during processing.

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Abstract

This invention provides a thermally expandable microcapsule capable of manufacturing molded articles with high expansion ratio, lightweight and excellent appearance, as well as a foaming resin composition and foam using the thermally expandable microcapsule. The invention relates to a thermally expandable microcapsule containing a volatile expanding agent as a core agent within a shell made of a polymer. The shell comprises a polymer formed by polymerizing a monomer composition containing a carbonyl monomer, and silicon dioxide. The volatile content of the thermally expandable microcapsule after standing at 70°C for 1 hour is 0.55% to 2% by weight.
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