GPU modules and processing equipment

The GPU module with a redistribution layer and substrate layer addresses space and power constraints by enabling multiple GPUs on a motherboard, enhancing interconnect density and reducing power consumption.

TWI934306BActive Publication Date: 2026-08-01MOORE THREADS TECHNOLOGY (CHENGDU) CO LTD
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Patent Information

Application Number
TW113138537
Authority / Receiving Office
TW · TW
Patent Type
Patents
Current Assignee / Owner
Priority Date
2023-10-11
Filing Date
2024-10-09
Publication Date
2026-08-01
Estimated Expiration
2044-10-08

AI Technical Summary

Technical Problem

Current technologies limit the number of GPUs that can be installed in a server due to space and power consumption constraints, necessitating a solution that reduces power consumption while saving space.

Method used

A GPU module comprising multiple GPU units, a redistribution layer, a substrate layer, and a PCB, with a substrate layer fixed to the PCB by substrate bumps, and a redistribution layer connecting GPU units to the substrate via wires, allowing flexible configuration and improved interconnect density.

Benefits of technology

The solution significantly increases the number of GPUs that can be deployed on a motherboard while reducing space and power consumption, achieving an interconnect density at least six times that of existing methods, with flexible configuration options.

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Abstract

This disclosure relates to a GPU module and processing device. The GPU module includes: multiple GPU units, a redistribution layer, a substrate layer, and a PCB. The substrate layer includes multiple substrates and an interlayer dielectric that fixes the multiple substrates together and is located between adjacent substrates. Multiple substrate bumps are provided on the bottom surface of each substrate. The redistribution layer is disposed on the top surface of the substrate layer. Each GPU unit is soldered and fixed above the redistribution layer and to a corresponding substrate position via multiple chip bumps provided on the bottom surface. Each chip bump is connected to a corresponding substrate bump via wires in the redistribution layer and wires in the substrate. The substrate layer is soldered and fixed to the top surface of the PCB using the substrate bumps. Each substrate has at least one GPU unit on top, which significantly increases the number of GPUs that can be deployed in the GPU module and reduces the motherboard space occupied by the GPU module and the power consumption.
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