Film component

The membrane component with a disintegrating material layer addresses issues of low yield and high costs in semiconductor manufacturing by enabling direct attachment to process elements, optimizing laser peelability and flowability, thus enhancing product competitiveness.

TWI934642BActive Publication Date: 2026-08-01ALLIANCE MATERIAL CO LTD
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Patent Information

Application Number
TW114120966
Authority / Receiving Office
TW · TW
Patent Type
Patents
Current Assignee / Owner
Filing Date
2025-06-04
Publication Date
2026-08-01
Estimated Expiration
2045-06-03

AI Technical Summary

Technical Problem

Current temporary functional elements in semiconductor manufacturing, such as liquid and solid-state components, suffer from low yield, high manufacturing costs, long processing times, poor heat resistance, and require additional adhesives, reducing product competitiveness.

Method used

A membrane component comprising a first and second release layer with a disintegrating material layer in between, made of polyimide resin, adhesive resin, and additives, which reduces adhesion under laser irradiation, allowing direct attachment to process elements without additional adhesives, optimizing laser peelability and flowability.

Benefits of technology

This design shortens manufacturing time, reduces costs, and enhances product competitiveness by eliminating the need for additional adhesives and processes, while providing excellent heat resistance and performance.

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Abstract

A film-like component includes a first release layer, a second release layer, and a release material layer. The release material layer is located between the first and second release layers. The release material layer is made of polyimide resin, adhesive resin, additives, and solvents. The additives include light-absorbing dyes, defoamers, leveling agents, lubricants, or combinations thereof, enabling the release material layer to be adhered to a process element, and reducing the adhesion of the release material layer to the process element under laser irradiation.
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