A stamp comprising cooling layer and an electronic element transfer device and method including the same
The mold with a cooling layer and buffer layer design addresses heat and positioning issues in electronic component transfer, ensuring precise and damage-free transfer of components.
TWI934689BActive Publication Date: 2026-08-01AU OPTRONICS CORP
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Patent Information
- Application Number
- TW114124435
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2025-06-27
- Publication Date
- 2026-08-01
- Estimated Expiration
- 2045-06-26
AI Technical Summary
Technical Problem
Existing electronic component transfer technologies face issues such as damage to components and molds due to heat generated by laser irradiation, inaccurate positioning, and reduced precision and accuracy during the transfer process.
Method used
A mold with a cooling layer and buffer layer design that includes openings and cooling structures to dissipate heat and control laser light irradiation, enhancing process margin and accuracy.
Benefits of technology
The solution prevents damage to components and molds, improves transfer precision, and increases the density and accuracy of electronic components during the transfer process.
✦ Generated by Eureka AI based on patent content.
Abstract
This invention relates to a mold having a cooling layer and an electronic component transfer apparatus and method comprising the same. The mold includes a first substrate, a cooling layer, and a buffer layer. The cooling layer is disposed on one side of the first substrate and includes a plurality of openings. The buffer layer is disposed on one side of the first substrate such that the first substrate is sandwiched between the cooling layer and the buffer layer, or the cooling layer is sandwiched between the first substrate and the buffer layer. The buffer layer includes a plurality of columnar structures, wherein the vertical projections of the plurality of columnar structures onto the cooling layer are misaligned with the plurality of openings.
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