Detection circuit substrate for detecting driver backplane of micro-led display

What is AI technical title?
AI technical title is built by Patsnap AI team. It summarizes the technical point description of the patent document.
The detection circuit board addresses the inability of existing test pads to test conductive connection holes by forming a detection circuit that verifies the integrity of pad pairs and connection holes, enhancing the yield and functionality of micro LED displays.

TWI934870BActive Publication Date: 2026-08-01AU OPTRONICS CORP

4 Cites 0 Cited by

Patent Information

Application Number: TW114152308
Authority / Receiving Office: TW · TW
Patent Type: Patents
Current Assignee / Owner
Filing Date: 2025-12-31
Publication Date: 2026-08-01
Estimated Expiration: 2045-12-30

Application Information

Patent Timeline

31 Dec 2025

Application

TW114152308

01 Aug 2026

Publication

TWI934870B

IPC: G01R31/28; G01R31/44; H10H29/30

Get more patent work done with AI

Run novelty searches—or use them for FTO, design risk, drafting and technical problem-solving.

AI Tagging

Application Domain

Electronic circuit testing Lamps testing

Technology Topics

LED display Materials science

Explore More Agents

Novelty Search
Search existing technologies and assess novelty
↗
FTO
Analyze whether a product may infringe others' patents
↗
Design FTO
Check prior-design risk for exterior design
↗
Drafting
Draft patent application text based on a technical solution
↗
Find Solutions with TRIZ
Generate feasible solution to solve your technical challenge
↗
IP MCP Servers
Connect trusted patent search and cited evidence to Claude, Cursor or your own AI workflow
↗

AI Technical Summary

Technical Problem

Existing test pads on miniature LED display driving backplanes cannot effectively test the conductive connection holes between pad pairs and driving elements, which are crucial for ensuring the driving capability and yield of micro LED displays.

Method used

A detection circuit board with detection pads, conductive lines, and bumps is used to align and bond with the micro LED display driver backplane, allowing for the detection of pad pairs and conductive connection holes, forming a detection circuit to verify the functionality and integrity of the backplane.

Benefits of technology

Ensures the yield of micro LED display driver backplanes by accurately testing the conductive connection holes and pad pairs, thereby preventing defects and ensuring proper electrical connectivity.

✦ Generated by Eureka AI based on patent content.

Patent Text Reader

Abstract

A detection circuit board for testing a micro-LED display driver backplane includes a substrate, detection pads, conductive lines, and conductive bumps disposed on the substrate. The conductive lines electrically connect to the detection pads, and the conductive bumps electrically connect to the conductive lines. The substrate is used to align and bond with the micro-LED display driver backplane, such that the detection pads electrically connect to the pad pairs of the micro-LED display driver backplane, and the conductive bumps electrically connect to a first test pad of the micro-LED display driver backplane, thereby forming a detection circuit with the detection pads, pad pairs, conductive lines, conductive bumps, and the first test pad.

Need to check novelty before this filing date? Find Prior Art