Substrate support apparatus, substrate packaging apparatus and method for determining characteristic of leaning stack of substrates

Abstract

The substrate support apparatus may include a monitoring device configured to monitor the position of a plurality of suction devices. In some embodiments, a substrate packaging apparatus for encapsulating a tilted substrate stack may include a substrate support structure and a clamping device. In some embodiments, the method may include the steps of: stacking a plurality of substrates to form a tilted substrate stack, imaging features of the tilted substrate stack, and using information obtained during imaging to determine characteristics of the tilted substrate stack. In some embodiments, the method may include the steps of: stacking an additional substrate on the tilted substrate stack, and determining characteristics of the tilted substrate stack using the substrate support apparatus while the substrate support apparatus engages the additional substrate.

Description

[Technical Field]

[0001] This application claims priority under the Patent Act to U.S. Provisional Application No. 63 / 049,852, filed July 9, 2020, the contents of which are incorporated herein by reference in their entirety.

[0002] This application generally relates to substrate equipment and methods; more specifically, this application relates to substrate support equipment, substrate packaging equipment and methods. [Previous Technology]

[0003] It is known to store substrates as tilted substrate stacks. Typically, tilted substrate stacks are created by continuously placing individual substrates abutting against each other until stacking is complete. In some embodiments, the tilted substrate stack may be packaged for transport, storage, and / or processing. During stacking processing, undesirable fanning may occur, in which one or more substrates in the tilted substrate stack are not parallel to one or more other substrates in the substrate stack, such that the thickness at one location of the tilted substrate stack differs from the thickness at another location. It is necessary to control the fanning of the tilted substrate stack to maintain the correct positioning of all substrates in the tilted stack and / or protect one or more substrates in the tilted substrate stack from damage due to excessive stress concentration, which may be inherent due to excessive fanning. [Summary of the Invention]

[0004] The following is a simplified overview of the present application to provide a basic understanding of some of the embodiments described in the present application.

[0005] In some embodiments, the substrate support device for stacking substrates on an inclined substrate stack can also be used to determine the characteristics of the inclined substrate stack (e.g., fan-shaped unfolding). Because each substrate is stacked on the inclined substrate stack using the substrate support device, this dual function allows the characteristics to be determined using the substrate support device. Therefore, the step of determining the characteristics can be performed in a reduced amount of time and can be performed after each additional substrate is stacked.

[0006] In some embodiments, the clamping device can be used to reduce fan-out when stacking substrates to form a tilted substrate stack. In some embodiments, a single clamping cycle may be provided, which can be beneficial in reducing fan-out while minimizing the time required for the clamping process. In a further embodiment, the clamping process may include two clamping cycles after each substrate is stacked. Two clamping cycles can further reduce fan-out compared to a single clamping cycle. During each of the two clamping cycles, a reduced fan-out can also be achieved with a reduced clamping pressure compared to a single clamping cycle using a larger clamping pressure, thereby reducing potential stress fracture.

[0007] In some embodiments, the substrate support device may include a base and a plurality of suction devices. Each of the plurality of suction devices is movably mounted to the base. The substrate support device may further include a monitoring device configured to monitor the position of the suction devices among the plurality of suction devices.

[0008] In some embodiments, the monitoring device is configured to monitor the position of the suction device relative to the base.

[0009] In some embodiments, the monitoring device may include an ultrasonic sensor.

[0010] In some embodiments, the ultrasonic sensor may be fixedly mounted to the base.

[0011] In some embodiments, each of the plurality of suction devices is movably mounted to the base to translate relative to the base in an adjustment direction.

[0012] In some embodiments, the plurality of suction devices may include a row of suction devices. Each suction device in a row of suction devices may be spaced apart from another suction device in the row of suction devices along a row axis perpendicular to the adjustment direction.

[0013] In some embodiments, at least one of the plurality of suction devices may be moved independently relative to at least one additional suction device of the plurality of suction devices.

[0014] In some embodiments, a substrate packaging apparatus for encapsulating a tilted substrate stack may include a substrate support structure configured to support the tilted substrate stack. The substrate support structure may include a rear surface of a main surface of the substrates of the tilted substrate stack configured to support the substrates. The substrate support structure may further include a lower surface extending away from the rear surface and a lower edge of the substrates of the tilted substrate stack configured to support the substrates. The substrate packaging apparatus may further include a clamping device including a clamping shaft extending along the width of the rear surface.

[0015] In some embodiments, the substrate packaging apparatus may include a plurality of actuators configured to apply force to the lower portion of a substrate stack that is tilted along the clamping axis.

[0016] In some embodiments, the clamping device may include a plurality of actuators configured to apply varying forces to the lower portion of a substrate stack inclined along the clamping axis.

[0017] In some embodiments, at least one of the plurality of actuators may operate independently of at least another of the plurality of actuators.

[0018] In some embodiments, the clamping device may include a plurality of holes communicating with a fluid pressure chamber.

[0019] In some embodiments, the method may include the step of stacking a plurality of substrates on a substrate support structure to form an inclined substrate stack. The method may further include the steps of imaging the characteristics of the inclined substrate stack and using information obtained during imaging to determine the characteristics of the inclined substrate stack.

[0020] In some embodiments, the characteristics of the tilted substrate stack may include the fan-shaped unfolding of the tilted substrate stack.

[0021] In some embodiments, the method may further include the following steps: stacking the additional substrate on the inclined substrate stack using a substrate support device that supports the additional substrate, and clamping the inclined substrate stack by engaging the additional substrate with a clamping device.

[0022] In some embodiments, when pressing the tilted substrate stack, the pressing device may apply pressure along the pressing axis.

[0023] In some embodiments, when pressing the inclined substrate stack, the pressing shaft can be positioned along the lower portion of the inclined substrate stack.

[0024] In some embodiments, when pressing the inclined substrate stack, the pressing device may apply varying pressure to the additional substrate along the pressing axis.

[0025] In some embodiments, when the inclined substrate stack is pressed, the pressing device can create a fluid pad between the additional substrate and the pressing device.

[0026] In some embodiments, the substrate support device can be used to press the additional substrate while supporting it.

[0027] In some embodiments, the method may further include the step of detaching the substrate support device from the additional substrate.

[0028] In some embodiments, the substrate support device can be detached from the additional substrate while the inclined substrate stack is being pressed with a clamping device.

[0029] In some embodiments, the method may further include the step of disengaging the clamping device from the additional substrate.

[0030] In some embodiments, the method may further include the step of re-engaging the additional substrate to the clamping device.

[0031] In some embodiments, the method may include the step of stacking an additional substrate on a tilted substrate stack, wherein a substrate support device engages the additional substrate. The method may further include the step of determining the characteristics of the tilted substrate stack using the substrate support device while the substrate support device engages the additional substrate.

[0032] In some embodiments, when additional substrates are stacked on an inclined substrate stack, a plurality of suction devices of the substrate support device may be removably attached to the additional substrates.

[0033] In some embodiments, the step of determining the characteristics may include the following steps: moving one of the plurality of suction devices relative to another suction device among the plurality of suction devices.

[0034] In some embodiments, determining characteristics may include the following steps: monitoring the position of a suction device.

[0035] In some embodiments, an ultrasonic sensor may be used to monitor the position of a suction device.

[0036] In some embodiments, the method may further include the step of: pressing the tilted substrate stack with a pressing device pressed against an additional substrate.

[0037] In some embodiments, the step of pressing the inclined substrate stack may include the following steps: applying pressure to the additional substrate along the pressing axis using a pressing device.

[0038] In some embodiments, when pressing the inclined substrate stack, the pressing shaft can be positioned along the lower portion of the inclined substrate stack.

[0039] In some embodiments, when pressing the inclined substrate stack, the pressing device may apply varying pressure to the additional substrate along the pressing axis.

[0040] In some embodiments, when the inclined substrate stack is pressed, the pressing device can create a fluid pad between the inclined substrate stack and the pressing device.

[0041] In some embodiments, the substrate support device can be clamped at the same time as the additional substrate is engaged.

[0042] In some embodiments, the method may further include the following steps: stopping the application of pressure to the additional substrate with the clamping device for a period of time, and then reapplying pressure to the additional substrate with the clamping device along the clamping axis.

[0043] In some embodiments, the method may include the step of: disengaging the substrate support device from the additional substrate before reapplying pressure. Reapplying pressure may be performed while the substrate support device is disengaging from the additional substrate.

[0044] Additional features and advantages of the embodiments disclosed herein will be set forth in the following [Description], and those skilled in the art will clearly understand some of these additional features and advantages from the following [Description] or by practicing the embodiments described herein, including the following [Description], the claims, and the accompanying drawings. It should be understood that both the foregoing [Summary] and the following [Description] present embodiments intended to provide an overview or framework for understanding the nature and features of the embodiments disclosed herein. The accompanying drawings are included to provide further understanding and are incorporated in and form part of this specification. The accompanying drawings illustrate various embodiments of the present application and, together with the description, explain the principles and operation of the various embodiments of the present application.

Implementation Method

[0064] The embodiments will now be described more fully below with reference to the accompanying drawings in which exemplary embodiments are shown. Wherever possible, the same element symbols will be used throughout the accompanying drawings to refer to the same or similar parts. However, this application may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

[0065] In some embodiments, methods for handling substrates in substrate packaging processes can be provided to help monitor the stacking condition and improve the quality of the substrate stack. The substrate of this application may include a glass substrate, although it may be a glass-ceramic, ceramic, silicon substrate, or other substrate material. In some embodiments, the substrate may include a glass substrate having multiple compositions, including but not limited to soda-lime glass, borosilicate glass, aluminoborosilicate glass, alkali-containing glass, or alkali-free glass. In some embodiments, the glass substrate may be produced by separating the glass substrate from a glass ribbon produced by glass manufacturing equipment or other glass ribbon manufacturing equipment, such as a channeling device, a floating channeling device, a pull-down device, an up-pull device, a rolling device, or a pressing device. A substrate containing a glass substrate may be suitable for further processing into desired applications, such as display applications. For example, the glass substrate can be used in a wide range of display applications, including liquid crystal displays (LCDs), electrophoretic displays (EPDs), organic light-emitting diode displays (OLEDs), and plasma display panels (PDPs). It may be necessary to transport the glass substrate from one location to another. The substrate (e.g., the glass substrate) may be transported as a tilted substrate stack throughout the scope discussed in this application. In addition, an intermediate material may optionally be placed between each substrate (e.g., a glass substrate) to help prevent contact and thus maintain the original surface of the substrate.

[0066] As shown in Figures 1 and 2, the substrate 101 (e.g., a glass substrate) may include a length "L" and a width "W" perpendicular to the length. As shown in Figure 2, the substrate 101 may include an outer periphery, which includes a rectangular shape, wherein the length "L" may be defined between two parallel end edges 201a, 201b, and the width "W" may be defined between two parallel side edges 203a, 203b. As shown, each end edge 201a, 201b may extend in a direction perpendicular to the direction in which each side edge 203a, 203b extends. In some embodiments, the width "W" of the substrate 101 may be greater than or equal to about 20 mm, such as greater than or equal to about 50 mm, such as greater than or equal to about 100 mm, such as greater than or equal to about 500 mm, such as greater than or equal to about 1000 mm, such as greater than or equal to about 2000 mm, such as greater than or equal to about 3000 mm, and such as greater than or equal to about 4000 mm, although other widths less than or greater than the above widths may be provided in further embodiments. For example, in some embodiments, the width "W" of the substrate 101 may be about 20 mm to about 4000 mm, such as about 50 mm to about 4000 mm, such as about 100 mm to about 4000 mm, such as about 500 mm to about 4000 mm, such as about 1000 mm to about 4000 mm, such as about 2000 mm to about 4000 mm, such as about 3000 mm to about 4000 mm, such as about 20 mm to about 3000 mm, such as about 50 mm to about 3000 mm, such as about 100 mm to about 3000 mm, such as about 500 mm to about 3000 mm, such as about 1000 mm to about 3000 mm, such as about 2000 mm to about 3000 mm, such as about 2000 mm to about 2500 mm, and all ranges and subranges therein.

[0067] The substrate 101 (e.g., a glass substrate) may include a first main surface 103a and a second main surface 103b, the second main surface 103b facing opposite directions and defining the thickness "T" (e.g., average thickness) of the substrate 101. In some embodiments, the thickness "T" of the substrate 101 may be less than or equal to about 2 millimeters (mm), less than or equal to about 1 millimeter, less than or equal to about 0.5 millimeters, for example less than or equal to about 300 micrometers (μm), less than or equal to about 200 micrometers, or less than or equal to about 100 micrometers, but other thicknesses may be provided in further embodiments. For example, in some embodiments, the thickness "T" of substrate 101 may be about 50 μm to about 750 μm, about 100 μm to about 700 μm, about 200 μm to about 600 μm, about 300 μm to about 500 μm, about 50 μm to about 500 μm, about 50 μm to about 700 μm, about 50 μm to about 600 μm, about 50 μm to about 500 μm, about 50 μm to about 400 μm, from about 50 μm to about 300 μm, about 50 μm to about 200 μm, about 50 μm to about 100 μm, which includes all ranges and subranges of thickness therein.

[0068] Figures 1, 3-4, 6-8, and 17-18 illustrate embodiments of a substrate support 107 of a substrate packaging apparatus 105, 401 according to the present application. The substrate support 107 may be configured to support an inclined stack 109 of substrates 101. The substrate support 107 may include a rear surface 111 configured to support the main surface 103b of the substrates 101 of the inclined substrate stack 101. For example, as shown, in some embodiments, a rear plate 113 may include the rear surface 111. The rear plate 113 may include a continuous plate or grid defining support members of the rear surface 111. The substrate support 107 may further include a lower surface 115 extending away from the rear surface 111 and configured to support the lower edge of the substrates 101 of the inclined substrate stack 101. For example, as shown, in some embodiments, the lower plate 117 may include the lower surface 115. The lower plate 117 may include a continuous plate or grid defining a support member for the lower surface 115. As shown, the lower surface 115 may extend away from the rear surface 111 at approximately 90°, although in further embodiments, the lower surface 115 may extend away from the rear surface 111 at other angles. The rear plate 113 and / or the lower plate 117 may include stainless steel, plastic, wood, or other materials capable of supporting the inclined stack of substrates 101 109. As shown in FIG1, the rear surface 111 may extend at an angle "A" relative to the direction of gravity "G". The angle "A" may range from greater than 0° to about 60°, such as from greater than 0° to about 45°, such as from greater than 0° to about 30°, such as from greater than 0° to 20°, such as from greater than 0° to 20°, and all ranges and subranges between the above ranges. In a further embodiment, the angle "A" may range from about 10° to about 60°, such as from about 10° to about 45°, such as from about 10° to about 30°, such as from about 10° to about 20°, and all ranges and subranges thereof. In a further embodiment, the angle "A" may range from about 20° to about 60°, such as from about 20° to about 45°, such as from about 20° to about 30°, and all ranges and subranges thereof. For the purposes of this application, a substrate stack is considered to be a "tilted substrate stack" if the substrates in the substrate stack have a main surface oriented at any of the aforementioned angles "A" relative to gravity "G". Therefore, by stacking substrates against a rear surface 111 (the rear surface 111 extends at an angle "A" relative to the direction of gravity "G" within the aforementioned range), the substrate stack may include a tilted substrate stack supported by a substrate support 107. For example, the main surface of the rear substrate in an inclined substrate stack can be supported by the rear surface 111, and like the rear surface 111, the main surface of the rear surface can be supported at an orientation in which the main surface of the rear surface extends at an angle "A" relative to the direction of gravity "G" within the range described above.Therefore, the substrate stack will be considered as a tilted substrate stack, since at least the main surface of the rear substrate extends at an angle "A" relative to the direction of gravity "G" within the range described above.

[0069] As shown in the figure, the support 119 can be designed to support the rear surface 111 at a desired angle "A". For example, the support 119 can support the position of the rear plate 113 and the lower plate 117 relative to each other, and support the weight of the rear plate 113, the lower plate 117, and the inclined substrate 101 stack 109. In some embodiments, the support 119 may include a support surface 120, which is positioned on a horizontal surface such that the support surface 120 is perpendicular to the direction of gravity "G". In some embodiments, the angle "B" between the support surface 120 and the rear surface 111 may be equal to the angle "A" subtracted from 90°.

[0070] The substrate packaging apparatus 105 shown in FIG. 1 may include a substrate support device 121 configured to help construct an inclined stack 109 of substrates 101 on a substrate support frame 107. In some embodiments, as shown, the substrate support device 121 may include a plurality of suction devices 123 mounted to a base 125. FIG. 5 shows one embodiment of the base 125 as viewed along line 5-5 of FIG. 1. As shown, the base 125 may include parallel side rails 503a, 503b that support the suction devices 123 along corresponding rows of suction devices. The parallel side rails 503a, 503b may be mounted to a central rail 505 that can be manipulated by a robot 129 (see FIG. 1). In some embodiments, each suction device 123 may include a suction cup 127. The suction cups 127 may be positioned in communication with a fluid source to control the suction associated with each suction cup 127 to induce selective attachment and release of a first primary surface 103a of the substrate 101. In some embodiments, a vacuum (e.g., from a negative pressure source) may be associated with one or more suction cups. The vacuum can be used to increase the adhesion between the suction cups and the first primary surface 103a. In a further embodiment, the vacuum source may be adjustable to increase or decrease the adhesion force. In some embodiments, the fluid source may include a positive pressure source to eject the substrate from the suction cups as the substrate is properly placed on an inclined substrate stack. In some embodiments, the fluid source (e.g., a positive pressure source and / or a negative pressure source) may provide the same positive pressure / vacuum force to all suction cups in each row or may provide the same positive pressure / vacuum force to all suction cups in all rows. In a further embodiment, one or more suction cups may have suction forces that can operate independently of other suction cups.

[0071] In operation, robot 129 can move base 125 and corresponding suction device 123 to pick up substrates 101 to be stacked. The substrate to be picked up may travel along a conveyor belt, may be separated from the belt after it is generated, or may be in other locations. In order to pick up substrate 101, robot 129 may manipulate base 125 until suction cup 127 of suction device 123 engages with the first main surface 103a of substrate 101. It should be understood that suction cup 127 may engage adjacent to the outer edges 203a, 203b of substrate (see FIG. 2) to help maintain the original properties of the central portion of the main surface 103a of substrate 101. As shown in FIG. 1, robot may move substrate 101 into position such that substrate 101 is added to the inclined substrate 101 stack 109 with an inclined orientation.

[0072] After a large number of substrates 101 have been stacked, fan-shaped expansion may unfortunately occur, wherein a position of the tilted stack 109 has a maximum thickness "Tl" in a direction perpendicular to the rear surface 111, and the maximum thickness "Tl" is greater than the minimum thickness "T2" of another position of the tilted stack 109 in the direction perpendicular to the rear surface 111. As shown, the position with the maximum thickness "Tl" may be located in the middle of the tilted stack 109, although the maximum thickness "Tl" may be located near or at the upper end of the tilted stack 109, or near or at the lower end of the tilted stack 109. Throughout the application, fan-shaped expansion is considered to be the difference between the maximum thickness "Tl" and the minimum thickness "T2".

[0073] In some embodiments, the overall fan-shaped unfolding may exist across the entire surface area of ​​the inclined substrate stack 109, wherein the entire inclined substrate stack 109 includes a single maximum thickness "T1" and a single minimum thickness "T2", wherein the overall fan-shaped unfolding of the inclined substrate stack 109 is considered to be the difference between the single maximum thickness "T1" and the single minimum thickness "T2". In a further embodiment, the longitudinal fan-shaped unfolding may vary at different locations along the width "W" of the substrate 101. For example, the longitudinal fan-shaped unfolding may exist at a location along the width, the width being along a linear longitudinal axis that extends through the location in the direction of the length "L" of the outer substrate 101 of the inclined substrate stack 109. In such an example, the longitudinal fan-shaped unfolding at the location along the width "W" is considered to be the difference between the maximum thickness "T1" along the linear longitudinal axis passing through the location and the minimum thickness "T2" along the linear longitudinal axis passing through the location.

[0074] Figures 4 and 6 through 8 illustrate additional embodiments of the substrate support device 403 of the substrate packaging apparatus 401. The substrate support device 403 may include a base 125 (e.g., as shown and described with reference to Figure 5) and a plurality of suction devices 405. Each of the plurality of suction devices 405 may be movably mounted to the base 125. In some embodiments, each of the plurality of suction devices 405 may be movably mounted to the base 125 to translate relative to the base 125 along an adjustment direction. For example, as shown in Figure 4, each of the plurality of suction devices 405 may translate along a first adjustment direction 407a to extend relative to the base 125 and / or translate along a second adjustment direction 407b to retract relative to the base 125. As shown, in some embodiments, each suction device 405 may include a guide rod 409; the guide rod 409 may be slidably mounted to a base 125 via a suction cup 127 positioned at one end of the guide rod 409. In some embodiments, although not shown, each suction device 405 may include a biasing device (e.g., a compression spring) that may bias each suction device 405 to the extended position shown in FIG. 4 in a first adjustment direction 407a.

[0075] As shown in FIG. 4, the substrate support device 403 may also include a base. For example, the base 125 discussed above with respect to FIG. 5 may also include the base of the substrate support device 403 as shown in line 5-5 of FIG. 4. The base 125 may include parallel side rails 503a, 503b that may support the suction devices 405 along the respective rows of suction devices. Although two rows of suction devices are illustrated, in a further embodiment, three or more rows of suction devices may be provided. For example, the base 125 may include three or more parallel side rails that may support the suction devices. In some embodiments, a plurality of suction devices 405 (see FIG. 4) may include suction devices 405 positioned along a first row axis 501a of the first row of the first row. In some embodiments, a plurality of suction devices 405 may further include suction devices 405 positioned along a second row axis 501b of the second row of the second row of the second row. Although not shown, in some embodiments, a plurality of suction devices may include three or more rows of suction devices positioned along corresponding row axes. As shown in FIG5, each of the plurality of suction devices 405 may be spaced apart from another suction device 405. For example, each suction device 405 may be positioned between a pair of suction devices 405, each of the pair of suction devices 405 being adjacent to another suction device 405. Row axes 501a, 501b may be perpendicular to the adjustment directions 407a, 407b of the suction devices 405. In some embodiments, parallel side rails 503a, 503b may be mounted to a central rail 505 that can be manipulated by the robot 129. Two parallel side rails 503a, 503b are shown simultaneously; in further embodiments, three or more parallel side rails that can be manipulated by the robot 129 may be provided (e.g., mounted to the central rail 505). Each parallel side rail may be provided along a corresponding row axis, wherein the suction devices may be spaced apart along the corresponding row axis. In some embodiments, each of the suction devices 405 may include a suction cup 127. The suction cup 127 may be positioned in communication with a fluid source to induce selective attachment and release of the first primary surface 103a of the substrate 101.

[0076] In some embodiments, at least one of the plurality of suction devices 405 may be moved independently relative to at least one additional suction device among the plurality of suction devices 405. For example, as shown in FIG4, at least one suction device 405 may be moved along adjustment directions 407a, 407b while one or more of the remaining suction devices among the plurality of suction devices remain stationary relative to the base 125. In some embodiments, each suction device may be moved independently relative to the remaining suction devices (e.g., along adjustment directions 407a, 407b).

[0077] As shown in Figures 4 and 6 to 8, the substrate support device 403 may also include a monitoring device 411 configured to monitor the position of one of the plurality of suction devices 405. In some embodiments, the monitoring device 411 may be configured to monitor the position of the suction device 405 relative to the base 125. For example, the monitoring device may be designed to monitor the position of the guide rod 409 relative to the base 125. In some embodiments, the monitoring device may be designed to directly monitor the suction cup 127 of the suction device 405, or to monitor the suction cup 127 of the suction device 405 by means of the position of the guide rod 409 relative to the base 125. In some embodiments, the monitoring device may include a proximity sensor capable of monitoring the position of the suction device 405 relative to the base 125 without physical contact, although a physical contact sensor may also be incorporated according to the present application. Embodiments of the proximity sensor may include an optical sensor (e.g., a laser sensor), an ultrasonic sensor, or other types of proximity sensors. As schematically shown in Figure 4, in some embodiments, the monitoring device 411 may include an ultrasonic sensor 413 configured to monitor the position of the suction device 405 relative to the base 125 without requiring physical contact between the suction device 405 and the base 125 to monitor its position. In some embodiments, a proximity sensor (e.g., the ultrasonic sensor 413) may be fixedly mounted to the base 125 to monitor the position of a portion of the suction device 405 relative to the base. In some embodiments, the end of the guide rod 409 may be provided with a marker 415 extending across the sensing path of the proximity sensor. For example, as shown, an ultrasonic wave 417a may propagate to intersect the marker 415 positioned across the sensing path of the ultrasonic sensor 413. A reflected ultrasonic wave 417b reflected from the marker 415 may then return to be sensed by the ultrasonic sensor 413. The signal may then be sent back to the processor 137 to calculate the position of the marker 415 of the suction device 405 relative to the base 125. Although not shown, the ultrasonic sensor may be mounted to a guide rod (e.g., at the end of the guide rod), where ultrasonic waves are reflected from the base 125. However, fixing the ultrasonic sensor to the base 125 simplifies the construction of the device because the communication path from the ultrasonic sensor 413 to the processor 137 can be supported by the base 125.

[0078] As shown, the monitoring device can monitor the position of one or any of the plurality of suction devices. For example, as shown in FIG. 4, the monitoring device 411 can monitor the position of each of the plurality of suction devices 405 relative to the base 125. For example, as shown, each of the plurality of suction devices 405 may be provided with a proximity sensor (e.g., an ultrasonic sensor). In embodiments where one or all of the suction devices 405 can move independently relative to each other, providing a sensor (e.g., a proximity sensor) for each suction device 405 allows for independent tracking of each suction device.

[0079] In some embodiments, the substrate packaging apparatus 105, 401 may be provided with clamping devices. For discussion purposes, embodiments of the substrate packaging apparatus 401 of Figures 4 and 6 through 18 will be discussed as optionally including clamping devices 701 (Figures 9 through 12) and 1301 (Figures 13 through 16). Although not shown, the substrate packaging apparatus 105 of Figures 1 and 3 may also include clamping devices 701 and 1301, which have similar or identical characteristics and functions as discussed more fully below. As shown in Figures 9 and 13, clamping devices 701 and 1301 may include a clamping shaft 901 extending along the width "WR" of the rear surface 111. In some embodiments, the outer surface of the pressing member may include the clamping shaft. As shown in Figures 9 and 13, the width "WR" of the rear surface 111 may be substantially the same as the width "W" of the substrate 101 (see Figure 2), but in other embodiments, the width "WR" of the rear surface 111 may be greater than or less than the width "W" of the substrate 101. Setting the width "WR" of the rear surface 111 to be greater than or equal to the width "W" of the substrate 101 helps to fully support the entire width of the substrate 101, thereby reducing stress concentration and potential damage to the substrate 101. In some embodiments, the clamping shaft 901 may include a substantially straight clamping shaft 901. For example, in some embodiments, the rear surface 111 may include a substantially flat surface, wherein a substantially straight clamping shaft 901 helps to distribute the clamping force evenly across the width of the substrate 101 throughout the clamping process. In other embodiments, the rear surface 111 may include a convex or concave surface, wherein a flat surface (represented by the straight line at 111 in Figures 9 and 13) would be curved and represented by an arcuate line. Setting the rear surface as convex or concave can facilitate bending the substrate stack into a curved shape corresponding to the convex or concave rear surface. Bending the substrate into a curved orientation can strengthen the substrate and / or help prevent movement of the substrate relative to the rear surface 111. In embodiments where the rear surface 111 is concave or convex, the clamping shaft 901 may include a bending shaft having a shape along the width "WR" of the rear surface that matches the curved shape of the convex or concave rear surface.

[0080] In some embodiments, the clamping device may include at least one actuator. For example, as shown in FIG7, the base member 703 of the clamping device may include at least one actuator configured to extend and retract pressing members 705, 1305, which define a clamping shaft 901 of the clamping device 701, 1301. As shown, in some embodiments, the clamping devices 701, 1301 may include abutting devices 904, 1304, which include pressing members 705, 1305. In some embodiments, the actuator of the base member 703 may provide extension of the abutting devices 904, 1304 in direction 707a and retraction in direction 707b. In some embodiments, directions 707a, 707b may be substantially perpendicular to the rear surface 111. In other embodiments, in addition to or in place of the actuators of the base members, the abutment devices 904, 1304 may include one or more actuators 903 (see FIG. 9) configured to provide extension / retraction of the pressing members 705, 1305 relative to the support member 907 in directions 707a, 707b. In some embodiments, as shown, one or more actuators 903 may selectively extend the rod 902 and the pressing members 705, 1305 associated with the rod 902 in direction 707a. As shown, in some embodiments, the clamping devices 701, 1301 may include a plurality of actuators configured to apply force along the clamping axis 901 toward the lower portion of the inclined substrate 101 stack 109.

[0081] As shown in Figures 9 and 13, in some embodiments, one or more actuators 903 of the clamping devices 701, 1301 may include a plurality of actuators 903. As shown, in some embodiments, the plurality of actuators 903 may include a row of actuators 903, which are sequentially spaced apart from each of the plurality of actuators 903, and are positioned adjacent to an adjacent actuator or between two adjacent actuators. In some embodiments, each of the plurality of actuators 903 is configured to apply a varying force along the clamping axis 901 toward the lower portion of the inclined substrate 101 stack 109, but in further embodiments each actuator may apply the same force. Furthermore or alternatively, in some embodiments, at least one or all of the plurality of actuators may operate dependently or independently of at least one other actuator (e.g., all other actuators). For example, if the pressing member comprises a single rigid pressing member, all actuators of the plurality of actuators 903 can operate simultaneously and provide the same force, causing the length of the pressing member to move in the extension / retraction directions 707a, 707b. In a further embodiment, as shown in Figures 11 and 12, the pressing member 705 may include a flexible pressing member, wherein a portion of the pressing member is movable relative to another portion of the pressing member in the extension / retraction directions 707a, 707b. In a further embodiment, the pressing member may include segmented pressing members, wherein a plurality of segments of the pressing member are configured to move relative to each other. For example, as shown in Figure 13, the pressing member 1305 may include segments 1307a, 1307b, 1307c, which are movable relative to each other in the extension / retraction directions 707a, 707b.

[0082] In some embodiments, as shown in FIG10, the pressing member 705 may be designed to physically contact the lower portion of the outer substrate of the inclined substrate stack 101 109 when force is applied to the lower portion of the inclined substrate stack 101 109. In an alternative embodiment, as shown in FIG14, the pressing member 1305 may be designed to apply force to the lower portion of the inclined substrate stack 101 109 in a non-contact manner, in which the pressing member 1305 generates a fluid pad 1401 that applies force to the lower portion of the outer substrate of the inclined substrate stack 109 without the pressing member 1305 physically contacting the outer substrate of the inclined substrate stack 101 109. Applying force in a non-contact manner helps prevent damage to the substrates, which would otherwise result in physical contact between the pressing member and (multiple) substrates. As shown in FIGS. 15 and 16, the clamping device may provide the pressing member 1305 with a plurality of holes 1501 communicating with a fluid pressure chamber 1601. As shown in Figure 15, the plurality of orifices may include a pattern of spaced-apart orifices 1501 to provide a desired fluid pad configuration in use. Furthermore, as shown in Figure 16, in some embodiments, the fluid pressure chamber 1601 may include a plurality of fluid pressure chambers, but in further embodiments a single fluid pressure chamber may be provided. Each pressure chamber 1601 may include one or more inlets 1602 to pressurize fluid to enter the pressure chamber 1601. If a plurality of pressure chambers are provided, the pressurized fluid in each chamber can be modulated relative to each other to provide a fluid pad with characteristics varying along the total length of the pressing member 1305. As shown in Figure 16, each segment 1307a, 1307b may include one or more pressure chambers; one or more pressure chambers may be pressurized independently to allow each segment to apply a unique fluid pad. Providing a plurality of orifices 1501 associated with corresponding pressure chambers can also help to provide greater control over the characteristics of the fluid pad (e.g., the pressure distribution applied by the fluid pad).

[0083] In some embodiments, the method of this application may include the step of stacking a plurality of substrates 101 on a substrate support structure (e.g., substrate support frame 107) to form an inclined substrate 101 stack 109. In some embodiments, a robot 129 may be configured to pick up a single substrate 101 (e.g., a glass substrate) from a conveyor belt or other location, or to support the substrate while it is separating from the belt during belt (e.g., glass ribbon) formation. The robot 129 may then manipulate the substrate to an appropriate orientation such that, as shown in FIG1, the substrate 101 supported by the substrate support device 121 is substantially parallel to the rear surface 111 and / or the existing inclined substrate stack 109. As shown in FIG1, in some embodiments, a plurality of suction cups 127 may be removably attached to the substrate 101 while supporting and moving the substrate to stack with other substrates in the inclined substrate stack 109. In some embodiments, a negative pressure source may be positioned in communication with the suction area of ​​the suction cups to further enhance and maintain the attachment of the suction cups to the substrate, helping to prevent unintentional detachment of the suction cups from the substrate 101. Once the robot 129 has correctly positioned the supported substrate, the suction cup can release the substrate. For example, a positive pressure source can increase the pressure within the suction area of ​​the suction cup, causing the suction cup to release the substrate into place. The robot can then be retrieved from the vicinity of the tilted substrate stack 109 as shown in Figure 3.

[0084] In some embodiments, the method of this application may further include the step of determining the characteristics of the tilted substrate stack without contacting any substrate 101. For example, as shown in FIG3, a robot 129 may be removed from the vicinity of the tilted substrate stack 109. Then, an imaging device 131 may be used to image the characteristics of the substrate 101 (e.g., the outermost substrate), and the information obtained during imaging may be used to determine the characteristics of the tilted substrate stack 109. In some embodiments, the characteristics of the tilted substrate stack 109 may include a fan-shaped unfolding of the tilted substrate stack 109. In some embodiments, the fan-shaped unfolding may include the overall fan-shaped unfolding of the tilted substrate stack 109. For example, the overall fan-shaped unfolding may include "T2" subtracted from "T1", wherein the maximum thickness "T1" of the tilted substrate stack 109 may not be aligned with the minimum thickness "T2" along the same linear axis (which extends along the direction of length "L"). Thus, the overall fan-shaped unfolding may include a value associated with the surface area of ​​the main surface of the outermost substrate. In a further embodiment, the fan-shaped unfolding may include a longitudinal fan-shaped unfolding, which may include "T2" subtracted from "T1", wherein "T1" is aligned with "T2" along the same linear axis extending in the direction of length "L". In such an embodiment, the inclined substrate 101 stack 109 may include a longitudinal fan-shaped unfolding at each location along the width of the inclined stack 109 of substrate 101.

[0085] In one embodiment, as shown in Figures 1 and 3, the fan-shaped unfolding can be determined by the imaging device 131. In some embodiments, the imaging device 131 may include the illustrated digital image correlation apparatus, which may include a light source 133 and a pair of cameras 135. An available imaging device 131 may include an ARAMIS digital image correlation apparatus available from Trilion Quality Systems. The digital image correlation apparatus may be designed to determine the three-dimensional positions of various markers associated with the outer surface of the inclined substrate 101 stack 109. In some embodiments, the markers may include reflective sheets adhered to the main surface of the substrate 101. For example, referring to Figure 2, a plurality of markers 205 may be aligned in two rows 207a, 207b along linear axes 209a, 209b extending in a direction 211 of length "L". In such an example, the imaging device 131 may determine the longitudinal fan-shaped unfolding at two locations along the width "W" of the substrate 101. In some embodiments, the markers 205 may be provided on one or more substrates 101. In another embodiment, the substrate including marker 205 can be reused for multiple periodic measurements. For example, the substrate including marker 205 can be placed together with substrate support device 121 for fan-shaped unfolding measurements. Once imaging device 131 has completed the measurement, substrate support device 121 can remove the substrate including marker 205 and then continue stacking additional substrates (if appropriate). Such measurements can be designed to measure fan-shaped unfolding after stacking a selected number of substrates (e.g., after stacking 10, 20, 40, 60, etc.). Furthermore, although the marked substrate can include the same type of substrate as the substrates in the tilted substrate stack 109, in a further embodiment, the substrate with marker 205 can include a different material that may be more durable or cheaper than the substrates stacked in the tilted substrate stack 109.

[0086] As shown in FIG3, once the substrate with the markers 205 is placed, light 301 emitted from the illumination device 133 of the digital image correlation device is reflected away from each marker 205 for detection along the width "W" (not shown) by a pair of cameras 135 spaced apart from each other. The reflected light received by the cameras 135 is then processed by the processor 137 to determine the position of the marker 205 and output to the output device 303, such as a storage unit for digitally storing data or a display device for visually displaying data. As shown, the results of each periodic measurement using the digital correlation device can be displayed in a graph, where the vertical axis 305 indicates the marker number and the horizontal axis 307 indicates the thickness of the tilted substrate 101 stack 109. As shown, the last measurement shows that the maximum stack thickness "T1" at marker #5 is about 46 and the minimum stack thickness "T2" at marker #1 is about 32, where the longitudinal fan-out at the last measurement is about 14 (i.e., 46-32). In some embodiments, an alarm may be issued if the fan-shaped expansion reaches a predetermined maximum permissible fan-shaped expansion. In a further embodiment, once the fan-shaped expansion reaches the predetermined maximum permissible fan-shaped expansion, the substrate support device 121 may stop loading additional substrates 101.

[0087] Figures 4 and 6 illustrate further embodiments for determining the characteristics of the tilted substrate 101 stack 109. As shown, the substrate support device 403 can be used to stack a plurality of substrates 101, wherein characteristics can be determined as the next substrate is stacked onto the tilted stack 109. For example, Figure 4 shows stacked additional substrates 101 supported and engaged on the tilted substrate stack 109 by the substrate support device 403. In some embodiments, the suction cups 127 of the first and second rows (see Figure 5) can be selectively attached to portions of the main surface of the substrate 101 (e.g., the outer edge portions of the main surface). By engaging the outer portions, the original properties of the central portions of the main surface can be maintained without damage due to scratches or other defects that may be introduced by the suction cups 127. In some embodiments, the suction cups 127 can be positioned in communication with a fluid source to control the suction associated with each suction cup 127, thereby selectively attaching and releasing the first main surface 103a of the substrate 101. In some embodiments, a vacuum source can be associated with one or more suction cups. A vacuum source can be used to provide suction that increases the adhesion between the suction cups and the first primary surface 103a. In a further embodiment, the vacuum source can be adjustable to increase or decrease the adhesion force. In some embodiments, the fluid source may include a positive pressure source to eject the substrate from the suction cups as the substrate is properly placed on an inclined stack of substrates. In some embodiments, the fluid source (e.g., a pressure source and / or a vacuum source) may provide the same pressure / vacuum force to all suction cups in each row, or may provide the same pressure / vacuum force to all suction cups in all rows. In a further embodiment, one or more suction cups may have suction forces that can operate independently of other suction cups.

[0088] In operation, the robot 129 can move the base 125 and the corresponding suction device 123 to pick up substrates 101 to be stacked. The substrate to be picked up may travel along the conveyor belt, may be separated from the belt after production, or may be in other positions. In order to pick up the substrate 101, the robot 129 may manipulate the base 125 until the suction cup 127 of the suction device 123 engages the first main surface 103a of the substrate 101. It should be understood that the suction cup 127 may engage adjacent to the outer edges 203a, 203b of the substrate to help maintain the original properties of the central portion of the main surface 103a of the substrate 101. As shown in FIG1, the robot may move the substrate 101 into position such that the substrate 101 is added to the inclined substrate 101 stack 109 in an inclined direction.

[0089] As shown in FIG. 6, the characteristics of the tilted substrate stack 109 can be determined by the substrate support device 403 when the substrate support device 403 engages the additional substrate 101 and before the placed additional substrate 101 detaches from the substrate support device 403. As previously discussed, a plurality of suction devices 405 of the substrate support device 103 can be removably attached to the additional substrate while stacking the additional substrate on the tilted substrate stack. As shown in FIG. 4, the substrate support device 103 can be moved by the robot 129 in direction 402. In some embodiments, each of the plurality of suction devices 405 can be moved relative to one or more of the other suction devices and relative to the base 125 in a first adjustment direction 407a or a second adjustment direction 407b. Thus, the supported additional substrate 101 can conform to the shape of the outer stacked substrate of the tilted substrate stack 109, while the suction devices 405 can move independently relative to each other and relative to the base 125. In practice, each suction device 405 can be outwardly biased (e.g., by compression springs) so that the suction device compresses and thereby conforms to the supported additional substrate 101 to match the shape of the outermost substrate in the substrate stack. As schematically shown in FIG6, the increased thickness of the substrate 101 stack 109 tilted at "T1" can cause the corresponding suction device 405 to move in the second adjustment direction 407b, causing the corresponding suction cup 127 to retract toward the base 125. As the suction device 405 moves in the second adjustment direction 407b, the corresponding guide rod 409 causes the corresponding mark 415 to move away from the base 125 in the second adjustment direction 407b. In some embodiments, the sensor of the ultrasonic sensor 413, as illustrated, can monitor the position of the suction device 405. For example, as shown in FIG4, an ultrasonic wave 417a can be emitted from the ultrasonic sensor 413, and the ultrasonic wave 417a bounces off the mark 415, and the ultrasonic wave 417a returns to the sensor as a reflected ultrasonic wave 417b to be sensed by the ultrasonic sensor 413. The signal can then be sent back to the processor 137 to calculate the position of the marker 415 of the suction device 405 relative to the base 125. In this way, a corresponding characteristic (e.g., fan-out) can be determined by monitoring the position of each suction device 405. In some embodiments, these positions can be relayed to the output device 303 discussed above, such as a storage unit for digital storage of data or a display device for visualizing data. In some embodiments, an alarm can be issued if the fan-out reaches a predetermined maximum permissible fan-out. In a further embodiment, once the fan-out reaches the predetermined maximum permissible fan-out, the substrate support device 403 can stop loading additional substrates 101.

[0090] In some embodiments, either the imaging device 131 of FIG. 1 or the monitoring device 411 of FIG. 4 can be selected to determine the characteristics of the tilted substrate stack 109 (e.g., fan-shaped unfolding). However, in some embodiments, the monitoring device 411 can monitor each substrate 101 as each substrate 101 is added to the tilted substrate stack 109, and the monitoring device 411 does not need to place substrates with markers 205 for periodic monitoring. Therefore, the monitoring device 411 can provide continuous feedback and thus quickly detect development problems of fan-shaped unfolding without process interruption or the additional cost of providing substrates with markers 205, which can only be used for periodic testing.

[0091] The method of this application may also include a clamping device designed to reduce the fan-shaped unfolding of tilted substrate stacks. In some embodiments, the clamping device of this application may be used in conjunction with the imaging device 131 of Figures 1 to 3. In a further embodiment, the clamping device of this application may be used in conjunction with the substrate support device 403 and the monitoring device 411 of Figure 4.

[0092] Now, embodiments of the pressing devices 701, 1301 used in conjunction with the substrate support device 403 and monitoring device 411 of FIG. 4 will be discussed, with the understanding that the pressing devices can be combined with the imaging device 131 of FIG. 1 to 3 for similar or identical use. Referring to FIG. 7, the substrate support device 403 can place an additional substrate 101 engaged and supported by the suction device 405 on an inclined substrate 101 stack 109. Once placed, as shown in FIG. 7 and FIG. 9, the abutment devices 904, 1304 can be extended in direction 707a by means of the actuator of the base member 703 so as to bring the pressing members 705, 1305 close to the inclined substrate 101 stack 109. As shown in Figure 10, one or more actuators 903 can provide an extension of pressing members 705, 1305 in direction 707a via rod 902 until the pressing members 705, 1305 press and apply force to the substrate 101 engaged and supported by the substrate support device 403. As shown in Figures 8 and 10, the force applied by the pressing members 705, 1305 acts to press the inclined substrate 101 stack 109.

[0093] As shown in FIG8, the inclined substrate 101 stack 109 can be pressed using the pressing members 705 and 1305 of the pressing devices 701 and 1301 that press against the substrate 101, so that the inclined substrate 101 stack 109 is pressed while the substrate 101 is still engaged and / or supported by the substrate support device 403. Although not shown, some alternative embodiments may disengage the substrate support device 403 from the supported substrate before the previously supported substrate initially contacts the pressing members 705 and 1305 of the pressing devices 701 and 1301. However, disengaging the substrate support device 403 from the substrate while pressing the inclined substrate stack with the pressing devices can help remove the substrate support device 403 from the inclined substrate stack without unintentionally pulling one or more substrates away from the stack as the substrate support device is removed. In practice, the pressing members 705 and 1305 can function to hold the supported substrate in place while pulling the substrate support device 403 away from the stack, thereby maintaining a compact configuration and reducing unintentional fan-shaped expansion that may occur when the substrate support device 403 is pulled away from the inclined substrate 101 stack 109. Figure 17 illustrates an embodiment in which the substrate support device 403 is pulled away while the pressing member 705 of the pressing devices 701 and 1301 continues to press against the outer substrate in the inclined substrate 101 stack 109.

[0094] FIG18 illustrates the disengagement of clamping devices 701, 1301 from the outer substrate of the inclined substrate 101 stack 109. In some embodiments, the process may include a single clamping cycle, wherein the clamping devices 701, 1301 press against the placed outer substrate for a single time. After the clamping devices 701, 1301 (see FIG18) are disengaged, the substrate support device 403 may place another substrate on the inclined substrate 101 stack 109 and similarly perform, as described above, a single clamping cycle to again press the inclined substrate 101 stack 109 with the clamping devices 701, 1301. The process then continues until stacking is complete after a predetermined number of substrates have been stacked or after a predetermined maximum fan-out level has been detected.

[0095] In an alternative embodiment, two or more clamping cycles may be performed on the substrates placed on the inclined substrate stack. For example, after the clamping members 705, 1305 of the clamping devices 701, 1301 disengage from the outer substrate of the inclined substrate stack 101 109, a second clamping cycle may be performed, wherein the pressing members 705, 1305 re-engage the same outer substrate by extending again along the direction 707a as shown in FIG. 17. In some embodiments, the method may apply pressure to the outer substrate of the inclined substrate stack 101 109 with the pressing members 705, 1305 of the clamping devices 701, 1301 for a period of time to clamp the inclined substrate stack 101 109, then the clamping devices 701, 1301 may stop applying pressure to the substrate for a period of time (e.g., by retracting the pressing members 705, 1305 as shown in FIG. 18), and then reapply pressure to the same substrate with the clamping devices 701, 1301 along the clamping axis 901. In some embodiments, the substrate support device may disengage from the outer substrate before re-pressure is applied, wherein re-pressure is applied while the substrate support device is disengaging from the additional substrate (e.g., see Figure 17). In alternative embodiments, the substrate support device may remain engaged with the outer substrate during two or more compression cycles (e.g., see Figure 8).

[0096] Figures 19 and 20 are graphs comparing experimental results of fan-out (represented by the vertical y-axis, e.g., in millimeters) relative to the number of substrates in a tilted substrate stack (represented by the horizontal x-axis). Figure 19 shows two experimental trials with 330 substrates stacked in a tilted substrate stack, where packaging performance was measured periodically after multiple substrates had been stacked. Curve 1901 represents the experimental trial without compression, while curve 1903 represents the experimental trial with a single compression cycle of 30 psi (207 kPa) applied to the lower portion of the tilted substrate stack after each substrate was stacked. As shown, comparing the stack with a single compression cycle (see curve 1903) to the stack without compression (see curve 1901), the single compression cycle significantly reduced the fan-out from greater than 7 mm to less than 4 mm.

[0097] Figure 20 illustrates two experimental tests of stacking 110 substrates in a tilted substrate stack, where packaging performance was periodically measured after multiple substrates had been stacked. Curve 2001 represents an experimental test in which a single compression cycle of 30 psi (207 kPa) was applied to the lower portion of the tilted substrate stack after each substrate was stacked. Curve 2003 represents an experimental test in which two compression cycles were applied after each substrate was stacked, with each of the two compression cycles applying 10 psi (69 kPa) to the lower portion of the tilted stack, and a 5-second delay between each compression cycle. As shown, comparing a stack with two compression cycles (see curve 2003) to a stack with one compression cycle (see curve 2001), the stack with two compression cycles significantly reduced the fan-out from approximately 12 mm to approximately 6 mm.

[0098] Therefore, as shown in FIG19, a single compression cycle using a pressure of 30 pounds per square inch (207 kPa) applied to the lower portion of the tilted stack provides reduced fan-out compared to a stack without a single compression cycle. Furthermore, as shown in FIG20, performance can be further improved by using two compression cycles, requiring only 1 / 3 of the pressure to be applied to the lower portion of the tilted stack. In some embodiments, a single cycle can be used to reduce fan-out when a rapid formation of a substrate stack with improved fan-out is required. Furthermore, while two cycles may require additional time to produce the substrate stack, performing two cycles at lower pressure after each substrate is placed on the tilted substrate stack further reduces fan-out, while also reducing the chance of stress fracture due to the lower pressure used when compressing the tilted substrate stack.

[0099] As described above, a single compression cycle can apply a pressure of 30 pounds per square inch (207 kPa) to the tilted substrate stack using a pressing member, but in some embodiments, the pressure can range from about 10 pounds per square inch (psi) (69 kPa) to about 80 psi (552 kPa), such as from about 20 psi (138 kPa) to about 40 psi (276 kPa). As described above, each of two compression cycles can apply a pressure of 10 psi (69 kPa) to the tilted substrate stack using a pressing member, but in some embodiments, the pressure can range from about 5 psi (34 kPa) to about 20 psi (138 kPa), such as from about 8 psi (55 kPa) to about 12 psi (83 kPa).

[0100] In some embodiments, the clamping shaft 901 may extend along the outer surface of the pressing members 705, 1305. In a further embodiment, the outer surface of the pressing members 705, 1305 may include the clamping shaft 901, wherein the clamped inclined substrate stack 101 includes applying pressure to the substrate supported by the substrate support device 403 along the clamping shaft 901 using the clamping devices 701, 1301. As shown in Figures 7 and 8, when the inclined substrate stack is clamped, the clamping shaft 901 may be positioned along the lower portion of the inclined substrate stack 101 109. In some embodiments, the lower portion of the inclined substrate stack may include the lower 50%, 40%, 30%, 20%, or 10% of the length "L" of the inclined substrate stack 101 109. Although not shown, the clamping shaft 901 may be located in the central or upper portion of the inclined substrate stack 109. In a further embodiment, a plurality of pressing members may be provided in the lower, central and / or upper portions of the inclined substrate stack 109.

[0101] In some embodiments, when clamping the inclined substrate stack, the clamping device may apply a substantially constant pressure along the length of the clamping axis. For example, as shown in FIG. 9, in some embodiments, all actuators 903 may actuate substantially equally in the extension direction 707a of the pressing member 705 such that the entire outer surface of the pressing member 705 simultaneously engages the outer surface of the outer substrate 101 of the inclined stack 109 (e.g., along the entire width "W" of the inclined substrate stack 109). As shown in FIG. 10, the pressing member 705 may maintain a substantially constant clamping pressure along the width "W" of the inclined substrate stack 109 to provide uniform encapsulation along the width "W" of the inclined stack 109. In some embodiments, the pressing member 705 may be substantially rigid to allow the pressing member 705 to apply consistent pressure between the levers 902. In some embodiments, the pressing member 705 may comprise plastic, metal, or other materials.

[0102] In some embodiments, when the inclined substrate stack is clamped, the clamping device may apply varying pressure to the additional substrate along the clamping axis 901. For example, in some embodiments, the pressing member 705 may be flexible or segmented to allow the outer portion of the pressing member 705 to engage the outer substrate at different times. For example, as shown in Figures 11 and 12, the pressing member 705 may begin by contacting one side of the outer substrate and then continue to engage the outer substrate continuously across the width "W" until the other side is reached. In an alternative embodiment, the middle portion of the outer substrate may be engaged, wherein the pressing member 705 continues to engage the additional portion continuously towards the opposite side of the outer substrate in opposite directions. In this way, fan-out can be reduced because gas (e.g., air) can be expelled from the stack without being trapped as an air pocket within the stack. In some embodiments, once engagement is complete, a constant pressure may be maintained across the width "W" of the inclined substrate stack 109 to provide consistent clamping of the inclined stack 109.

[0103] In some embodiments, the method may include the step of pressing without direct contact between the pressing member and the outer substrate. For example, as shown in FIG15, the pressing member 1305 may include a plurality of holes 1501 designed to provide a fluid pad between the pressing member 1305 and the outer substrate. In operation, gas (e.g., compressed air) may be introduced into a fluid pressure chamber 1601 through an inlet port. The fluid pressure chamber 1601 may be supplied with a uniform flow of compressed gas through the holes 1501 in fluid communication with the fluid pressure chamber. As shown, in some embodiments, the pressing member 1305 may include a plurality of segments 1307a, 1307b, 1307c. In some embodiments, the construction of each segment 1307a, 1307b, 1307c may be similar, but in other embodiments different constructions may be provided. Furthermore, although a plurality of segments are shown, a single segment may be provided in a further embodiment. However, the plurality of segments allows for independent control of the pressure within each pressure chamber 1601 of each segment, which can provide different air cushion profiles due to the varying rates at which pressurized gas can flow through the orifice 1501. The plurality of segments also allows for independent movement of each segment 1307a, 1307b, 1307c in direction 707a to allow continuous engagement of the pressing member 1305 with the outer substrate (e.g., to prevent excessive fan-out by avoiding trapped air pockets). As shown in FIG14, when the inclined substrate 101 stack 109 is pressed, the pressing member 1305 can create a fluid pad 1401 (e.g., an air cushion) between the inclined substrate 101 stack 109 and the pressing member 1305 of the pressing device 1301. In some embodiments, the fluid pad 1401 can facilitate the application of force to the inclined substrate 101 stack 109 without actual mechanical contact with any substrate.

[0104] It should be understood that although various embodiments have been described in detail with respect to certain illustrative and specific examples of this application, this application should not be considered as limited thereto, as many modifications and combinations of the disclosed features are possible without departing from the scope of the following claims. [Simplified Explanation of the Diagram]

[0045] These and other features, forms and advantages can be better understood when reading the following [Implementation] with reference to the accompanying drawings, in which:

[0046] Figure 1 is a schematic diagram of a substrate support device according to the present application, which places a supported substrate on an inclined substrate stack.

[0047] Figure 2 shows a plan view of the substrate to be placed on the inclined substrate stack of Figure 1;

[0048] Figure 3 schematically illustrates an imaging device used to determine the characteristics of a tilted substrate stack;

[0049] Figure 4 is a schematic diagram of another substrate support device according to the present application, in which the substrate to be supported is placed on an inclined substrate stack.

[0050] Figure 5 schematically shows the base of the substrate support device taken along line 5-5 of Figures 1 and 4;

[0051] Figure 6 schematically shows the substrate support device of Figure 4 for determining the characteristics of the tilted substrate stack;

[0052] Figure 7 schematically shows the substrate support device of Figure 4 after the supported substrate is placed on the inclined substrate stack using a clamping device that has detached from the inclined substrate stack.

[0053] Figure 8 schematically shows the substrate support device of Figure 7 after the supported substrate is placed on the inclined substrate stack by a pressing device that presses against the supported substrate to press the inclined substrate stack.

[0054] Figure 9 schematically shows a cross-sectional view of the clamping device and the inclined substrate stack taken along line 9-9 of Figure 7;

[0055] Figure 10 schematically shows a cross-sectional view of the clamping device and the inclined substrate stack taken along line 10-10 of Figure 8;

[0056] Figures 11 and 12 illustrate an embodiment of the step of pressing an inclined stack of substrates with the pressing device of Figures 7 to 10;

[0057] FIG13 schematically shows a cross-sectional view of the clamping device and the inclined substrate stack of another embodiment, taken along line 9-9 of FIG7;

[0058] Figure 14 schematically shows a cross-sectional view of the clamping device and the inclined substrate stack of Figure 13, taken along line 10-10 of Figure 8;

[0059] Figure 15 is a partial front view of the clamping device of Figures 13 to 14, taken along line 15-15 of Figure 13;

[0060] Figure 16 is a schematic cross-sectional view of the clamping device of Figures 13 to 15 taken along line 16-16 of Figure 15;

[0061] Figure 17 schematically shows a clamping device that continues to press against a previously supported substrate while the substrate support device is disengaged from the previously supported substrate in the tilted substrate stack.

[0062] Figure 18 schematically shows the clamped tilted substrate stack of Figure 17 after the clamping device has disengaged from the tilted substrate stack; and

[0063] Figures 19 and 20 are graphs comparing experimental results of fan-shaped unfolding relative to the number of substrates when the substrates are stacked in an inclined substrate stack. [Biomaterial Storage]

[0106] Domestic storage information (please note in order of storage institution, date, and number): None. International storage information (please note in order of storage country, institution, date, and number): None.

Claims

1. A substrate support apparatus for generating an inclined substrate stack by sequentially placing individual substrates one by one onto a substrate support structure, the substrate support apparatus comprising: A base; A plurality of suction devices for suctioning the substrate, each of the plurality of suction devices being movably mounted to the base; And a monitoring device configured to monitor an arbitrary position of one of the plurality of suction devices, wherein the fan-shaped unfolding characteristic of the inclined substrate stack is determined by monitoring the arbitrary position of each suction device.

2. The substrate support device as claimed in claim 1, wherein the monitoring device is configured to monitor the position of the suction device relative to the base.

3. The substrate support device as claimed in claim 1, wherein the monitoring device includes an ultrasonic sensor.

4. The substrate support device as claimed in claim 1, wherein each of the plurality of suction devices is movably mounted to the base for translation relative to the base in an adjustment direction.

5. The substrate support device as claimed in claim 4, wherein the plurality of suction devices includes a row of suction devices, wherein each suction device of the row of suction devices is spaced apart from another suction device of the row of suction devices along a row axis perpendicular to the adjustment direction.

6. The substrate support device as claimed in claim 1, wherein the base includes side rails, each of which extends along an outer edge of the substrates, and the suction device is positioned spaced apart from each other along a row axis of each of the side rails.

Images