The electro-conductive contact pin

Abstract

The present invention provides a conductive contact pin that prevents fatigue failure at pores by dispersing stress concentration at pores.

Description

Technical Field

[0001] This invention relates to a conductive contact pin. Prior Technology

[0002] Electrical characteristic testing of semiconductor devices is performed by bringing the test object (semiconductor wafer or semiconductor package) close to a test apparatus with multiple conductive contact pins, ensuring that the conductive contact pins contact the corresponding electrode pads (or solder balls or bumps) on the test object. After initial contact is achieved, a further approach is performed. This process is called overdrive. Overdrive involves elastically deforming the conductive contact pins, ensuring that all conductive contact pins maintain contact even with variations in electrode pad height or pin height. Furthermore, the elastic deformation of the conductive contact pins during overdrive causes their leading edges to move across the electrode pad, thus scrubbing. This scrubbing removes oxide film from the electrode pad surface and reduces contact resistance.

[0003] Recently, there has been a demand to develop test devices such as probe cards capable of transmitting signals with frequencies exceeding 1 GHz. Here, shortening the length of the conductive contact leads transmitting signals with frequencies exceeding 1 GHz to less than 10 mm reduces inductance and improves the high-frequency characteristics of the detected signal. However, when shortening the length of the conductive contact leads to less than 10 mm, ensuring sufficient overdrive leads results in plastic deformation of the conductive contact leads during overdrive. Additionally, there is a risk of damage causing permanent damage to the electrode pads.

[0004] On the other hand, by reducing the thickness of the conductive contact pins, stress during overdrive can be suppressed. However, reducing the thickness of the conductive contact pins also reduces their cross-sectional area, resulting in a drop in pin voltage and degradation of allowable time current characteristics during overdrive.

[0005] To address this problem, a technique has been developed to incorporate apertures within the conductive contact pins. For example, the conductive contact pins disclosed below include apertures in: U.S. Patent Publication No. 2006-0170440, German Patent Publication No. 10-2008-023761, Japanese Patent Publication No. 2012-173263, Japanese Patent Publication No. 2013-007700, U.S. Registered Patent Publication No. 9702904, Japanese Patent Publication No. 6457814, and German Patent Publication No. 10-2017-209510.

[0006] Figure 1 is a diagram showing a conductive contact pin (P) with a perforation (H) according to the prior art. Referring to Figure 1, in the conductive contact pin (P) used to transmit high-frequency signals, the construction of the perforation (H) makes the elastic deformation of the conductive contact pin easier, thereby achieving the effect of preventing excessive needle pressure on the electrode pad.

[0007] The existing conductive contact pin (P) uses photoresist as a mold and is manufactured by electroplating. Photoresist is present in the area that later becomes the aperture (H) during electroplating, and is removed after electroplating to form the aperture (H). If the width of the photoresist is less than 10 μm, it cannot be formed exactly as intended or has a uniform shape. Therefore, the width of the photoresist forming the aperture (H) should be 10 μm or more, and the final aperture (H) width should be 10 μm or more. Thus, the width of the fabricable aperture (H) is limited, which also limits the design dimensions of the leaf width, thus limiting the ability to address stress concentration caused by leaf deformation. Furthermore, the limited width of the fabricable aperture (H) also limits the deformation rate of the conductive contact pin (10) based on the force-displacement relationship, which is composed of multiple blades.

[0008] The end of the aperture (H) is rounded. This rounding, compared to a right-angled end, aims to alleviate stress concentration. However, repeated compressive forces applied to the conductive contact pins can cause stress concentration at the rounded end of the aperture (H), potentially leading to fatigue failure. Therefore, simply rounding the end of the aperture (H) has limitations in addressing stress concentration. [Existing Technical Documents] [Patent Literature]

[0009] [Patent Document 1] U.S. Patent Publication No. 2006-0170440 [Patent Document 2] U.S. Patent and Trademark Office No. 9702904 [Patent Document 3] Japanese Patent Publication No. 2012-173263 [Patent Document 4] Japanese Patent Publication No. 2013-007700 [Patent Document 5] Japanese Patent Publication No. 6457814 [Patent Document 6] German Patent Publication No. 10-2008-023761 [Patent Document 7] German Patent Publication No. 10-2017-209510 Summary of the Invention

[0010] This invention is proposed to solve the above-mentioned problems, and aims to provide a conductive contact pin that disperses stress concentration in pores to prevent fatigue failure in pores.

[0011] To achieve this objective of the present invention, the conductive contact pin according to the present invention is a conductive contact pin having a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface, including a cavity portion that penetrates the first surface and the second surface along the length direction of the conductive contact pin and is formed inside the conductive contact pin, the cavity portion including a central cavity portion and an end cavity portion that communicates with the central cavity portion and extends to the end side of the conductive contact pin, the end cavity portion having a width smaller than the width of the central cavity portion.

[0012] In addition, the end aperture portion includes an aperture width reduction portion whose width gradually decreases towards the end side of the conductive contact pin.

[0013] Additionally, it includes an aperture width fixing part that communicates with the aperture width reduction part and extends to the end side of the conductive contact pin, and whose width is fixed.

[0014] In addition, the end of the end hole has a rounded shape.

[0015] In addition, the width of the end pore portion is more than 1 μm and less than 10 μm.

[0016] On the other hand, the conductive contact pin according to the present invention is a conductive contact pin having a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface, including a plurality of pores extending through the first surface and the second surface along the length direction of the conductive contact pin and formed inside the contact pin, and an internal blade disposed between the two pores including a central post and a root extending from the central post toward the end side of the conductive contact pin, the root having a width greater than the width of the central post.

[0017] Additionally, the root portion includes a blade-width-increasing portion whose width gradually increases toward the end side of the conductive contact pin.

[0018] Additionally, it includes a blade width fixing portion that extends from the blade width increasing portion toward the end side of the conductive contact pin and has a fixed width.

[0019] Additionally, it includes microgrooves that are elongated along the thickness direction of the contact pin on the side of the internal blade.

[0020] In addition, the depth of the micro-grooves is greater than 20 nm and less than 1 μm.

[0021] In addition, the width of the root is more than 1 μm and less than 30 μm.

[0022] On the other hand, the conductive contact pin according to the present invention is a conductive contact pin having a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface, including a plurality of blades formed by placing an aperture portion therebetween along the length direction of the conductive contact pin, the blades including outer blades disposed outside the aperture portion and inner blades disposed between the aperture portion, the inner blades including a central post portion and a root portion extending from the central post portion toward the end side of the conductive contact pin, the root portion having a width greater than the width of the central post portion.

[0023] Additionally, there are fine grooves that are formed along the thickness direction of the contact pin on the sides of the outer blade and the inner blade.

[0024] This invention provides a conductive contact pin that disperses stress concentration in pores to prevent fatigue failure in pores. Simple Explanation of the Diagram

[0025] Figure 1 is a diagram showing conductive contact pins with apertures according to the prior art. Figures 2 and 3 are diagrams illustrating the conductive contact pins of the aperture portion having a preferred first embodiment of the present invention. Figures 4(a) and 4(b) are diagrams showing the stress analysis results of conductive contact pins according to the prior art and conductive contact pins according to a preferred first embodiment of the present invention. Figures 5 and 6 are diagrams illustrating the conductive contact pins of the aperture portion having a preferred second embodiment of the present invention. Figures 7(a)-7(c) to 9(a)-9(c) are diagrams illustrating a method for manufacturing conductive contact pins according to a preferred embodiment of the present invention. Figure 10 is a photograph taken from the side of the conductive contact pin of a preferred embodiment of the present invention. Implementation

[0026] The following content is merely illustrative of the principles of the invention. Therefore, even if not explicitly described or illustrated in this specification, those skilled in the art can implement the principles of the invention and invent various devices encompassed within the concept and scope of the invention. Furthermore, all terms and embodiments listed in this specification should be understood in principle as being for the purpose of clearly understanding the concept of the invention only, and are not limited to the embodiments and states specifically listed above.

[0027] The objectives, features, and advantages described herein will become even clearer from the following detailed description in conjunction with the accompanying drawings, so that those skilled in the art to which the invention pertains can readily implement the inventive concept.

[0028] The embodiments described in this specification will be explained with reference to cross-sectional and / or perspective views, which serve as ideal illustrative diagrams of the invention. To effectively illustrate the technical content, the thickness of the films and regions shown in these figures is exaggerated. The shapes of the illustrative figures may be distorted due to manufacturing techniques and / or tolerances. Furthermore, the number of molded objects shown in the figures is only illustratively represented in part. Therefore, the embodiments of the present invention are not limited to the specific shapes shown, but also include variations in shapes produced according to the manufacturing process.

[0029] In describing the various embodiments, even if the embodiments differ, for convenience, the constituent elements that perform the same function are given the same names and the same reference numerals. Furthermore, for convenience, the components and operations already described in other embodiments will be omitted.

[0030] In a preferred embodiment of the present invention, conductive contact pins (100) are provided in a testing apparatus and used for electrical and physical contact with a test object to transmit electrical signals. The testing apparatus includes conductive contact pins (100) that contact the test object. The testing apparatus may be a testing apparatus for semiconductor manufacturing processes, and as an example, it may be a probe card or a test socket. The testing apparatus of the preferred embodiment of the present invention is not limited thereto, and includes any apparatus for applying electricity to confirm whether the test object is defective.

[0031] In a preferred embodiment of the present invention, the conductive contact pin can be a conductive contact pin capable of transmitting signals with a frequency greater than 1 GHz, and the overall length of the conductive contact pin can be formed to be less than 10 mm.

[0032] The main body of the conductive contact pin (100) may be formed of a conductive material. Here, the conductive material may be selected from at least one alloy of platinum (Pt), rhodium (Rh), palladium (Pd), copper (Cu), silver (Ag), gold (Au), iridium (Ir), or nickel-cobalt (NiCo) alloy, palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy, or nickel-phosphorus (NiP) alloy. The main body of the conductive contact pin (100) may have a multilayer structure with multiple conductive material layers. Each conductive layer formed of different materials may be selected from platinum (Pt), rhodium (Rh), palladium (Pd), copper (Cu), silver (Ag), gold (Au), iridium (Ir), or alloys of platinum (Pt), rhodium (Rh), palladium (Pd), copper (Cu), silver (Ag), gold (Au), iridium (Ir), or palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy, or nickel-phosphorus (NiP) alloy. As an embodiment, the main body of the conductive contact pin (100) may have a multilayer structure with a first to a fourth conductive layer. Here, the first conductive layer is made of platinum (Pt), the second conductive layer is made of rhodium (Rh), the third conductive layer is made of palladium (Pd), and the fourth conductive layer can be formed of a nickel-cobalt (NiCo) alloy.

[0033] On the other hand, the main body of the conductive contact pin (100) may have an external coating layer. The external coating layer may be formed of a material with a higher hardness than the internal conductive material. As an embodiment, the external coating layer may be selected from at least one alloy of rhodium (Rh), platinum (Pt), iridium (Ir) or the like, or nickel-cobalt (NiCo) alloy, palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy or nickel-phosphorus (NiP) alloy.

[0034] The main body of the conductive contact pin (100) has a rectangular cross-section. In this case, the guide holes of the upper guide plate and the lower guide plate can be formed with rectangular cross-sections corresponding to the cross-sectional shape of the main body. By constructing the main body with a rectangular cross-section and the guide holes with a rectangular cross-section, the conductive contact pin (100) is prevented from rotating within the guide holes and interference between the contact pins (100) is prevented, thereby achieving a narrow pitch.

[0035] The conductive contact pin (100) has a first surface (110), a second surface (not shown) opposite to the first surface (110), and a side surface (130) connecting the first surface (110) and the second surface (not shown). The conductive contact pin (100) includes a cavity (200) that extends through the first surface (100) and the second surface (not shown) along its length and is formed by a space vacated inside the contact pin (100).

[0036] By including the aperture (200) formed inside the conductive contact pin (100), the cross-sectional area of ​​the conductive contact pin (100) can be ensured even if the thickness of the conductive contact pin (100) is reduced. Therefore, the desired overdrive amount can be ensured, and the overall length can be shortened while ensuring the desired pin pressure or allowable time current characteristics. Since the overall length of the conductive contact pin (100) can be shortened, the inductance of the conductive contact pin (100) is reduced, thereby improving high-frequency characteristics.

[0037] Furthermore, by having an end pore (230) with a width smaller than that of the central pore (210) in the pore portion (200), and a root portion (330) with a width larger than that of the central column portion (310) in the blade (L), the stress concentration generated from the end of the previous pore portion (H) is resolved.

[0038] Hereinafter, the conductive contact pins of the preferred first embodiment of the present invention will be described with reference to Figures 2 to 4(a) and Figure 4(b).

[0039] Referring to Figure 2, it is shown that two pores (200) are formed, but the number of pores (200) is not limited to this, and one or more pores (200) can be formed.

[0040] The pore portion (200) includes a central pore portion (210) and an end pore portion (230) that communicates with the central pore portion (210) and extends toward the end side of the conductive contact pin (100).

[0041] The central aperture (210) extends upward and downward with reference to the center of the conductive contact pin (100) along its length direction. The width of the central aperture (210) is the same as the length of the entire conductive contact pin, spanning the entire length.

[0042] The end pore (230) is formed in communication with the central pore (210) and has a width smaller than that of the central pore (210). The end of the end pore (230) has a rounded shape.

[0043] At least one end aperture (230) may be formed on the upper or lower side of the central aperture (210). Preferably, the end aperture (230) includes a first end aperture (230a) disposed on the upper side of the central aperture (210) and a second end aperture (230b) disposed on the lower side of the central aperture (210). The first end aperture (230a) and the second end aperture (230b) have a width smaller than the width of the central aperture (210).

[0044] Referring to Figures 2 and 3, the end aperture portion (230) includes: an aperture width reducing portion (231) whose width gradually decreases toward the end side of the conductive contact pin (100); and an aperture width fixing portion (235) which communicates with the aperture width reducing portion (231) and extends toward the end side of the conductive contact pin (100) with a fixed width.

[0045] The width of the aperture reduction portion (231) decreases proportionally to its length as it moves toward the end of the conductive contact pin (100). One end of the aperture width fixing portion (235) is connected to the aperture width reduction portion (231), and its width is fixed in the length direction. The aperture width reduction portion (231) is formed between the central aperture portion (210) and the aperture width fixing portion (235), and performs the function of dispersing the stress concentration at the end of the central aperture portion (210) to the aperture width fixing portion (235).

[0046] The first end aperture portion (230a) includes: a first aperture width reducing portion (231a) whose width gradually decreases towards the end side of the conductive contact pin (100); and a first aperture width fixing portion (235a) that communicates with the first aperture width reducing portion (231a) and extends towards the end side of the conductive contact pin (100) with a fixed width. The end of the first aperture width fixing portion (235a) has a rounded shape and is sealed.

[0047] Furthermore, the second end aperture portion (230b) includes: a second aperture width reducing portion (231b), whose width gradually decreases towards the end side of the conductive contact pin (100); and a second aperture width fixing portion (235b), which communicates with the second aperture width reducing portion (231b) and extends towards the end side of the conductive contact pin (100) with a fixed width. The end of the second aperture width fixing portion (235b) has a rounded shape and is sealed.

[0048] Since the conductive contact pin (100) is formed by including a hole (200), the conductive contact pin (100) includes a plurality of blades (L) formed therebetween with the hole (200) placed therebetween.

[0049] At least two or more apertures (200) may be formed on the conductive contact pin (100). In this case, multiple apertures (200) may be arranged in parallel with the same shape in the width direction of the conductive contact pin (100). The number of blades (L) is one more than the number of apertures (200), as shown in Figures 2 and 3. When there are two apertures (200), there are three blades (L). When there are three or more blades (L), the blades (L) include outer blades (400) and inner blades (300). At least one side of the outer blade (400) is a blade that becomes a side of the conductive contact pin (100). The inner blade (300) is a blade with apertures (200) positioned in the two side directions.

[0050] The blades (L) of the conductive contact pin (100) include outer blades (400) disposed outside the aperture portion (200) and inner blades (300) disposed between the aperture portion. Referring to Figures 2 and 3, the conductive contact pin (100) includes two outer blades (400) and an inner blade (300) disposed between the two outer blades (400).

[0051] The internal blade (300) disposed between the two aperture portions includes a central post (310) and a root (330) extending from the central post (310) toward the end side of the conductive contact pin (100). The central post (310) is formed to extend upward and downward with reference to the center of the conductive contact pin (100) in the longitudinal direction. The width of the central post (310) has a length that is substantially the same across the entire length of the conductive contact pin in the longitudinal direction.

[0052] The root (330) is connected to the central column (310) and has a width greater than that of the central column (310).

[0053] The root (330) includes: a blade width increasing portion (331) whose width gradually increases toward the end side of the conductive contact pin (100); and a blade width fixing portion (335) which extends from the blade width increasing portion (331) toward the end side of the conductive contact pin (100) and whose width is fixed.

[0054] The width of the root (330) can be formed to be more than 1 μm and less than 30 μm. The width of the blade width increasing portion (331) gradually increases towards the end of the conductive contact pin (100), and can be formed to a maximum of 30 μm. The blade width fixing portion (335) can be formed to have the same width as the maximum width of the blade width increasing portion (331) (for example, 30 μm).

[0055] At least one root portion (330) may be formed on the upper or lower side of the central column portion (310). Preferably, the root portion (330) includes a first root portion (330a) disposed on the upper side of the central column portion (310) and a second root portion (230b) disposed on the lower side of the central column portion (310). The first root portion (330a) and the second root portion (330b) have a width greater than that of the central column portion (210).

[0056] Referring to Figures 2 and 3, the root (330) includes: a blade width increasing portion (331) whose width gradually decreases towards the end of the conductive contact pin (100); and a blade width fixing portion (335) connected to the blade width increasing portion (331) and extending towards the end of the conductive contact pin (100) with a fixed width.

[0057] The blade width increasing portion (331) increases proportionally in width to length as it moves toward the end of the conductive contact pin (100). One end of the blade width fixing portion (335) is connected to the blade width increasing portion (331), and its width is fixed in the length direction. The blade width increasing portion (331) is formed between the central post portion (310) and the blade width fixing portion (335), and performs the function of dispersing stress concentration at the end of the central post portion (310) to the blade width fixing portion (335).

[0058] The first root portion (330a) includes: a first blade width increasing portion (331a) whose width gradually increases toward the end side of the conductive contact pin (100); and a first blade width fixing portion (335a) which is connected to the first blade width increasing portion (331a) and extends toward the end side of the conductive contact pin (100) and whose width is fixed.

[0059] Additionally, the second root portion (330b) includes: a second blade width increasing portion (331b) whose width gradually increases toward the end side of the conductive contact pin (100); and a second blade width fixing portion (335b) which is connected to the second blade width increasing portion (331b) and extends toward the end side of the conductive contact pin (100) with a fixed width.

[0060] Referring to Figures 4(a) and 4(b), Figure 4(a) shows the stress relief result of a conductive contact pin (10) having a hole (11) according to the prior art, and Figure 4(b) shows the stress analysis result of a conductive contact pin (10) having a hole (200) according to a preferred first embodiment of the present invention.

[0061] As shown in Figure 4(a), the conductive contact pin (P) of the prior art exhibits a sharp change in blade (L) width at the end of the aperture (H), and the end region of the aperture (H) becomes a region of mechanical stress concentration. Therefore, the likelihood of blade (L) breakage at the end region of the aperture (H) increases. Conversely, as shown in Figure 4(b), the conductive contact pin (100) of the preferred first embodiment of the present invention exhibits a gradual change in blade (L) width at the end of the aperture (200), mitigating stress concentration and significantly reducing the likelihood of blade (L) breakage.

[0062] Hereinafter, the conductive contact pins of a preferred second embodiment of the present invention will be described with reference to FIGS. 5 and 6. However, the embodiments described below are compared with the first embodiment and are described with a focus on characteristic components, and descriptions of components that are the same as or similar to those in the first embodiment are omitted.

[0063] Referring to Figures 5 and 6, the aperture portion (200) includes a central aperture portion (210) and an end aperture portion (230) that communicates with the central aperture portion (210) and extends toward the end side of the conductive contact pin (100).

[0064] The central aperture (210) extends upward and downward with reference to the center of the conductive contact pin (100) along its length direction. The width of the central aperture (210) is the same as the length of the entire conductive contact pin, spanning the entire length.

[0065] The end pore portion (230) is connected to the central pore portion (210) and has a width smaller than that of the central pore portion (210).

[0066] At least one end aperture (230) may be formed on the upper or lower side of the central aperture (210). Preferably, the end aperture (230) includes a first end aperture (230a) disposed on the upper side of the central aperture (210) and a second end aperture (230b) disposed on the lower side of the central aperture (210). The first end aperture (230a) and the second end aperture (230b) have a width smaller than the width of the central aperture (210).

[0067] The end aperture portion (230) includes an aperture width reduction portion (231) whose width gradually decreases towards the end side of the conductive contact pin (100). The aperture width reduction portion (231) decreases proportionally in width and length towards the end side of the conductive contact pin (100).

[0068] The first end aperture portion (230a) includes a first aperture width reduction portion (231a) whose width gradually decreases towards the end side of the conductive contact pin (100), and the second end aperture portion (230b) includes a second aperture width reduction portion (231b) whose width gradually decreases towards the end side of the conductive contact pin (100).

[0069] Since the conductive contact pin (100) includes an aperture (200), the conductive contact pin (100) includes a plurality of blades (L) formed therebetween, with the aperture (200) disposed therebetween. An inner blade (300) provided between two apertures includes a central post (310) and a root (330) extending from the central post (310) toward the end side of the conductive contact pin (100). The central post (310) extends elongatedly upward and downward with respect to the center of the conductive contact pin (100) along its length direction. The width of the central post (310) has a length that is substantially the same across the entire length of the conductive contact pin along its length direction.

[0070] The root portion (330) is formed by connecting to the central column portion (310) and has a width greater than that of the central column portion (310). The root portion (330) includes a blade width increasing portion (331) whose width gradually increases towards the end side of the conductive contact pin (100). The width of the root portion (330) can be formed to be more than 1 μm and less than 30 μm. The blade width increasing portion (331) gradually increases in width towards the end side of the conductive contact pin (100) and can be formed to a maximum of 30 μm.

[0071] At least one root portion (330) may be formed on the upper or lower side of the central column portion (310). Preferably, the root portion (330) includes a first root portion (330a) disposed on the upper side of the central column portion (310) and a second root portion (230b) disposed on the lower side of the central column portion (310). The first root portion (330a) and the second root portion (330b) have a width greater than the width of the central column portion (210).

[0072] The first root portion (330a) includes a first blade width-increasing portion (331a) whose width gradually increases toward the end side of the conductive contact pin (100), and the second root portion (330b) includes a second blade width-increasing portion (331b) whose width gradually increases toward the end side of the conductive contact pin (100).

[0073] The preferred first and second embodiments of the present invention will be described below with reference to Figures 7(a)-7(c) to 9(a)-9(c). However, for ease of illustration, the end hole (230) and root (330) of the hole (200) are omitted in the figures.

[0074] First, referring to Figures 7(a) to 7(c), Figure 7(a) is a plan view of the anodic oxide film disk (20), Figure 7(b) is an enlarged view of a portion of Figure 7(a), and Figure 7(c) is a cross-sectional view at the first end (111), the middle part (112), and the second end (113) of Figure 7(b).

[0075] As shown in Figures 7(a) to 7(c), a step of equipping one side of an anodized film disk (10) of anodized film material with a seed layer (20) is performed. The anodized film disk (10) may be formed of anodized film material. Anodized film refers to a film formed by anodizing a metal as a base material, and pores refer to holes formed during the process of anodizing a metal to form an anodized film. For example, if the metal as a base material is aluminum (Al) or an aluminum alloy, if the base material is anodized, an anodized film of aluminum oxide (Al₂O₃) material is formed on the surface of the base material. The anodized film formed as described above is divided into a barrier layer in the vertical direction that does not have pores formed inside and a porous layer that has pores formed inside. In the base material on which anodized film with a barrier layer and a porous layer is formed on the surface, if the base material is removed, only the anodized film of aluminum oxide (Al₂O₃) material is retained.

[0076] Anodized films can be formed by removing the barrier layer formed during anodizing and having pores that are continuous from top to bottom, or by retaining the barrier layer formed during anodizing and sealing one end of the pores at the top or bottom.

[0077] The anodic oxide film has a coefficient of thermal expansion of 2 ppm / ℃ to 3 ppm / ℃. Therefore, when exposed to high-temperature environments, there is little thermal deformation caused by temperature. Thus, even in high-temperature environments, precise conductive contact pins (100) can be manufactured without thermal deformation.

[0078] In the case of using anodized film disks (10) made of anodized film material instead of silicon wafers, the precision of the shape of the coating layer (A) can be improved, and selective etching of the anodized film using etchant can be achieved more easily.

[0079] A seed layer (20) is provided on one side of the anodic oxide film disk (20). The seed layer (20) can be formed of copper (Cu) and can be formed by deposition. The seed layer (20) is used to improve the plating quality of the plating layer (A) when the plating layer (A) is formed by electrolytic plating.

[0080] Next, referring to Figures 8(a) to 8(c), Figure 8(a) is a plan view of the anodic oxide film disk (20), Figure 8(b) is an enlarged view of a portion of Figure 8(a), and Figure 8(c) is a cross-sectional view at the first end (111), the middle part (112), and the second end (113) of Figure 8(b).

[0081] As shown in Figures 8(a) to 8(c), the step of etching at least a portion of the anodic oxide film disk (10) to form an opening (11) is performed. The overall shape of the opening (11) corresponds to the shape of the conductive contact pin module. The opening (11) is formed in the area corresponding to the support frame of the contact pin module and the area corresponding to the contact pin (100).

[0082] An island (15) formed of an anodic oxide film material is provided inside the opening (11) in the area corresponding to the contact pin (100). The island (15) is an area in which the anodic oxide film is not removed and is retained when a portion of the anodic oxide film disk (10) is etched to form the opening (11), and is surrounded by an anodic oxide film area enclosed by the opening (11). The thickness of the anodic oxide film disk (10) can be more than 50 μm and less than 100 μm.

[0083] The opening (11) can be formed by etching the anodized film disk (10). For this purpose, a photoresist can be provided on the upper surface of the anodized film disk (10) and patterned thereon. Then, the anodized film in the patterned area that is opened reacts with the etching solution to form the opening (11). Specifically, a photosensitive material can be provided on the upper surface of the anodized film disk (10) before the opening (11) is formed, and then an exposure process and a development process are performed. The photosensitive material can form the opening area by the exposure process and the development process, and at least a portion of it is patterned and removed. At this time, the photoresist on the upper surface of the portion that will later become an island (15) is not removed but is retained. The anodized film disk (10) is etched by removing the photosensitive material in the opening area by the patterning process, and the surrounding anodized film except for the area that will later become an island (15) is removed by the etching solution to form the opening (11).

[0084] The opening (11) and island (15) of the anodized film disk (10) can be determined according to the pattern generated by the patterning process of the photosensitive material disposed on the upper surface. The size and shape of the area where the photosensitive material is patterned are not limited. Therefore, the opening (11) and island (15) are formed by patterning the photosensitive material and performing an etching process on the anodized film disk (10) by using the area removed by the patterning process, so the size and shape of the opening (11) and island (15) are not limited. The opening (11) later forms the contact body (110) of the contact pin (100). Since the opening (11) and the island (15) are formed by etching the anodic oxide film as described above, the width of the contact body (110) includes the width of the aperture (115) and can have a size range of more than 20 μm and less than 100 μm. The width of the aperture (115) can have a size range of more than 1 μm and less than 50 μm within the width range of the contact body (110). The overall length of the contact pin (100) can have a size range of more than 1 mm and less than 10 mm.

[0085] Openings formed by laser or drilling methods typically have a circular cross-section or are shaped without corners where surfaces intersect. Furthermore, laser or drilling methods are difficult to use for forming small holes and must be formed with a pitch interval (P) that accounts for mechanical errors, thus limiting their size and shape. However, according to a preferred embodiment of the invention, the opening (11) can have angular corners and can be formed without shape limitations.

[0086] Alternatively, if the anodic oxide film disk (10) is wet-etched using an etching solution, an opening (11) with a vertical inner wall is formed. Therefore, the vertical cross-section of the contact body (110) of the contact pin (100) can have a rectangular shape.

[0087] The thickness of the anodized film disk (10) can be formed to be 10 μm or more and 150 μm or less. When a photoresist mold is used instead of the anodized film disk (10), since the opening is formed by the exposure process on a thick photoresist, it is difficult to precisely and quickly produce the opening with the vertical side. Therefore, there is a limitation when the thickness of the photoresist mold is increased to 70 μm or more. Conversely, when the opening (11) is formed using the anodized film disk (10), the vertical side can be precisely and quickly produced even if the thickness of the anodized film disk (10) is 70 μm or more.

[0088] Thus, compared with the structure that uses photoresist as a mold, if an anodized film is used as a mold to form the coating layer (A), the precision of the shape of the coating layer (A) is improved, thereby enabling the fabrication of a lead body (110) with a precise microstructure.

[0089] Next, referring to Figures 9(a) to 9(c), Figure 9(a) is a plan view of the anodic oxide film disk (20), Figure 9(b) is an enlarged view of a portion of Figure 9(a), and Figure 9(c) is a cross-sectional view at the first end (111), the middle part (112), and the second end (113) of Figure 9(b).

[0090] As shown in Figures 9(a) to 9(c), a step is performed to plate the opening (11) to form a plating layer (A). During electroplating, a seed layer (20) can be used to form the plating layer (A). When the plating process is completed, a planarization process can be performed. The plating layer (A) protruding from the upper surface of the anodic oxide film disk (10) is removed and planarized by a chemical mechanical polishing (CMP) process.

[0091] Subsequently, by removing the anodic oxide film disk (10) and the seed layer (20), a conductive contact pin (100) according to a preferred embodiment of the present invention is obtained. At this time, the islands (15) of the anodic oxide film material of the anodic oxide film disk (10) are removed together to form pores (200).

[0092] Since the conductive contact pins (100) of the preferred first and second embodiments of the present invention described above are manufactured using an anodized film disk (10) as a mold, they include a plurality of micro-grooves (88) formed on at least one side of the contact pins (100).

[0093] Referring to Figure 10, the micro-grooves (88) extend elongated along the thickness direction of the conductive contact pin (100) in the side surface (130) of the conductive contact pin (100), and have the shape of elongated recessed grooves. Here, the thickness direction of the conductive contact pin (100) refers to the direction in which the plating layer (A) grows during electroplating. Although the micro-grooves (88) are formed integrally across the side surface (110) of the conductive contact pin (100), they are not formed on the upper and lower surfaces other than the side surface (110).

[0094] The depth of the micro-groove (88) is in the range of 20 nm or more and 1 μm or less, and the width of the micro-groove (88) is also in the range of 20 nm or more and 1 μm or less. Here, since the micro-groove (88) originates from the pores formed during the fabrication of the anodic oxide film disk (10), the width and depth of the micro-groove (88) are values ​​within the range of the diameter of the pores of the anodic oxide film disk (10). On the other hand, during the formation of the opening (11) in the anodic oxide film disk (10), the micro-groove (88) can be at least partially formed by breaking a portion of the pores of the anodic oxide film disk (10) together with an etching solution. The micro-groove (88) has a depth in a range larger than the range of the diameter of the pores formed during anodizing.

[0095] Since the anodic oxide film disk (10) includes a large number of pores, at least a portion of the anodic oxide film disk (10) is etched to form an opening (11), and a metal layer is formed inside the opening (11) by electrolytic plating. Therefore, the side (130) of the conductive contact pin (100) is equipped with a fine groove (88) that is formed when in contact with the pores of the anodic oxide film disk (10).

[0096] The conductive contact pin (100) includes a cavity (200) formed inside the contact pin (100) in a manner that extends through the first surface (110) and the second surface (not shown). The cavity (200) may be configured in the same way as in the previously described embodiment. In this case, a fine groove (88) is also formed on the side surface (130) constituting the cavity (200) along the thickness direction of the conductive contact pin (100). The fine groove (88) is caused by islands (15) formed during the manufacture of the anodized film mold.

[0097] Thus, the conductive contact pin (100) includes an outer blade (400) and an inner blade (300) by means of the structure of the aperture portion (200), and the side surface (130) of the outer blade (400) and the inner blade (300) includes a micro-groove (88) that is elongated along the thickness direction of the conductive contact pin (100).

[0098] The roughness range of the side surface (130) of the conductive contact pin (100) differs from that of the first surface (110) and the second surface (not shown). Due to the formation of a large number of micro-grooves (88) with a width and depth of tens of nanometers, the roughness range of the side surface (130) of the conductive contact pin (100) is larger than that of the first surface (110) and the second surface (not shown) of the conductive contact pin (100).

[0099] The micro-grooves (88) described above have the effect of increasing the surface area of ​​the side surface (130) of the conductive contact pin (100). In other words, even if the conductive contact pin (100) of the preferred embodiment of the present invention has the same shape and size as the previous conductive contact pin, the surface area of ​​the side surface (130) of the conductive contact pin (100) can be made larger.

[0100] Furthermore, the micro-grooves (88) formed on the side surface (130) of the conductive contact pin (100) enhance the resistance to torsion when the conductive contact pin (100) deforms. During overdrive, the conductive contact pin (100) slides while contacting the inner surface of the guide hole of the guide plate in the bending direction or the opposite direction. At this time, the conductive contact pin (100) may be subjected to torsional load, and the micro-grooves (88) arranged parallel to the pressure surface on the side surface (130) of the conductive contact pin (100) resist the torsion of the conductive contact pin (100). In this way, the conductive contact pin (100) does not twist, and the contact surface is prevented from becoming smaller during sliding, thus minimizing the generation of foreign matter cutting off the side surface.

[0101] In addition, by forming micro-grooves (88) on the side (130) of the conductive contact pin (100), the elastic recovery ability when the conductive contact pin (100) is deformed can be improved.

[0102] In addition, by forming micro-grooves (88) on the side (130) of the conductive contact pin (100), the heat generated in the conductive contact pin (100) can be released quickly, thus suppressing the temperature rise of the conductive contact pin (100).

[0103] Furthermore, the presence of microgrooves (88) on the sides of both ends that come into contact with the contact object reduces the contact resistance of the contact pins (100) when in contact with the contact object. Additionally, as the conductive contact pins (100) slide up and down within the guide holes of the guide plate, the microgrooves (88) on the sides of the conductive contact pins (100) reduce frictional resistance with the guide holes, resulting in smoother sliding.

[0104] Existing conductive contact pins (P) use photoresist as a mold, and the pins are fabricated by electroplating. During electroplating, photoresist is placed in the area that will later become the aperture (H). After electroplating, the photoresist is removed to form the aperture (H). At this time, if the width of the photoresist is less than 10 μm, it is impossible to form it exactly as intended or to achieve a uniform shape. Therefore, the width of the photoresist that becomes the aperture (H) is 10 μm or more, and the final width of the aperture (H) is 10 μm or more.

[0105] Conversely, according to a preferred embodiment of the present invention, an opening (11) is formed in the anodic oxide film disk (10), and since this is used as a mold to manufacture the conductive contact pin (100), the anodic oxide film disk (10) exists in the area that becomes the pore portion (200). Therefore, by making the width of the pore portion (200) less than 10 μm, the constraints on the width design dimensions of the blade (L) are reduced. Based on this, the pore portion (200) can be made into an end pore portion (230) with a width smaller than that of the central pore portion (210), and the inner blade (300) can be made into a root portion (330) with a width larger than that of the central column portion (310). Therefore, by making it possible to design a blade (L) that can solve the stress concentration phenomenon that occurs in the end region of the pore portion (200), the durability of the conductive contact pin (100) can be improved.

[0106] As described above, although the invention has been described with reference to preferred embodiments, those skilled in the art can make various modifications or variations to the invention without departing from the spirit and scope of the invention as set forth in the following claims.

[0107] 10: Anodized film disc 11: Opening 15: Island 20: Seed layer 88: Micro-grooves 100: Conductive contact pin / contact pin 110: First side / Main body of the foot 130: Side view 200, H: Pore portion 210: Central pore section 230: End pore section 230a: First end pore portion 230b: Second end pore portion 231: Pore width reduction section 231a: First pore width reduction section 231b: Second pore width reduction section 235: Pore width fixing part 235a: First pore width fixing part 235b: Second pore width fixing part 300: Internal blades 310: Central column 330: Root 330a: First root 330b: Second root 331: Blade width increase section 331a: First blade width increase section 331b: Second blade width increase section 335: Blade width fixing part 335a: First blade width fixing part 335b: Second blade width fixing part 400: External blades A: Coating layer L: blade P: Conductive contact pin

Claims

1. A conductive contact pin, configured in a testing device and used to contact a test object to transmit an electrical signal, the conductive contact pin having a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface, the conductive contact pin comprising: Multiple pore portions (200) are formed inside the conductive contact pin, penetrating the first and second surfaces along the length direction of the conductive contact pin. Each of the multiple pore portions (200) includes a central pore portion (210) and an end pore portion (230) communicating with the central pore portion (210) and extending along the end side of the conductive contact pin. The end pore portion (230) includes a pore width reducing portion (231) whose width gradually decreases towards the end side of the conductive contact pin; and a pore width fixing portion (235) communicating with the pore width reducing portion (231) and extending towards the end side of the conductive contact pin with a fixed width. The pore width reducing portion (231) disperses the stress concentration at the end of the central pore portion (210) to the pore width fixing portion (235). Multiple blades (L) are formed along the length direction of the conductive contact pin, wherein the multiple pore portions (200) are disposed between the multiple blades (L). The blade (L) includes an outer blade (400) disposed outside the aperture portion (200) and an inner blade (300) disposed between two adjacent aperture portions (200) among the plurality of aperture portions (200). The inner blade (300) includes a central post portion (310) and a root portion (330) extending from the central post portion (310) toward the end side of the conductive contact. The root portion (330) includes a blade width increasing portion (331) whose width gradually increases toward the end side of the conductive contact. It also includes a blade width fixing portion (335) extending from the blade width increasing portion (331) toward the end side of the conductive contact and whose width is fixed. The blade width increasing portion (331) disperses the stress concentration at the end of the central post portion (310) to the blade width fixing portion (335).

2. The conductive contact pin as claimed in claim 1, wherein the end of the end aperture (230) has a rounded shape.

3. The conductive contact pin as claimed in claim 1, wherein the width of the end aperture (230) is 1 μm or more and 10 μm or less.

4. The conductive contact pin as described in claim 1, comprising: Microgrooves (88) are formed elongated along the thickness direction of the conductive pin on the sides of the outer blade (400) and the inner blade (300).

5. The conductive contact pin as claimed in claim 4, wherein the depth of the micro-groove (88) is greater than 20 nm and less than 1 μm.

6. The conductive contact pin as claimed in claim 1, wherein the width of the root (330) is more than 1 μm and less than 30 μm.

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