Fixtures, semiconductor systems, and methods for positioning process kit components within reaction chambers

Abstract

A fixing device includes a spacer configured for fixing relative to a reaction chamber of a semiconductor processing system. A slider is slidably supported by the spacer and is translatable along a transport axis extending into the reaction chamber. A threaded member is attached to the slider and is rotatable about a mounting axis angled relative to the transport axis. A paddle is attached to the threaded member, defined along the transport axis, and fixed relative to the slider to transport an assembly of a process kit into the reaction chamber using the translation of the slider. The paddle is free relative to the slider along the mounting axis to position the process kit assembly within the reaction chamber using the rotation of the threaded member. A semiconductor processing system and a method for positioning a process kit assembly within a reaction chamber of the semiconductor processing system are also described.

Description

[Technical Field]

[0001] This disclosure generally relates to semiconductor processing systems. More specifically, this disclosure relates to components for positioning process assemblies within the reaction chamber of a semiconductor processing system. [Previous Technology]

[0002] Semiconductor processing systems are commonly used to deposit films onto substrates, such as during the manufacture of semiconductor devices like very large-scale integrated circuits and power electronics. Film deposition in such systems is generally achieved by supporting a substrate within a reactor, allowing a precursor flow through the reactor and across the substrate, and using the precursor flow to deposit a film onto the substrate. The reactor typically maintains environmental conditions and precursor flow patterns within its interior suitable for depositing films onto substrates using the precursor flow.

[0003] In some reactors, the positioning of structures within the reactor is established manually. For example, individual workpiece parts may be transferred into the reactor sequentially. Once transferred into the reactor, subsequent workpiece parts can be further positioned relative to the preceding structure using alignments established from outside the reactor. While generally satisfactory for the intended purpose, such techniques can be relatively time-consuming due to the need to transfer structures individually into the reactor. Such techniques may also require a relatively high level of skill and experience to position various structures in the desired locations. Such techniques may carry a risk of injury to individuals performing the transfers and positioning within the reactor. Furthermore, such techniques may carry an additional risk of damage to the structure itself and / or the reactor during the transfer, positioning of various structures within the reactor, and / or repositioning of certain structures within the reactor for matching purposes.

[0004] Such systems and their intended purposes are generally satisfactory. However, there is still a need in the art for improved fixtures, semiconductor processing systems, and methods for positioning process assembly components within the reaction chamber of a semiconductor processing system. This disclosure provides a solution to this need. [Summary of the Invention]

[0005] A fixing device is provided. The fixing device includes a paddle, a standoff, a slider, and a threaded member. The paddle is disposed along a transport axis. The standoff is angled relative to the transport axis and slidably supports the slider. The threaded member is attached to the slider and defines a mounting axis angled relative to the transport axis. The paddle extends from the threaded member, defines the transport axis, and is fixed along the transport axis relative to the slider to transport a process assembly into a reaction chamber of a semiconductor processing system, and the paddle is free along the mounting axis relative to the slider to mount the process assembly within the reaction chamber of the semiconductor processing system.

[0006] In some instances, a bushing may be housed in a clearance. The bushing may extend about a sliding element. The bushing may protrude from the clearance along the transport axis to limit the yaw and pitch of the propeller.

[0007] In some embodiments, the slider may be a first slider, and the fixing device may further include a second slider. The second slider may be slidably supported by a spacer. The second slider may be fixed relative to the first slider to limit the roll of the paddle.

[0008] In some instances, a buffer may be placed in a spacer. The spacer may be parallel to the slide to limit the translation of the paddle along the transport axis.

[0009] In some instances, a threaded block may be attached to a male threaded component. The threaded block may couple the paddle component to the sliding component. The threaded block may translate along the mounting axis according to the rotation of the male threaded component about the mounting axis.

[0010] In some instances, a carrier shaft position sensor may be operatively associated with a slider to indicate the position of the paddle along the carrier shaft. A mounting shaft position sensor may be operatively associated with a threaded element to indicate the position of the paddle along the mounting shaft.

[0011] In some instances, a droop / tilt pin may be associated with the propeller to indicate the droop and tilt of the propeller. A droop / tilt controller may be operatively associated with the propeller to control the droop and tilt of the propeller.

[0012] In some instances, a threaded block may be attached to a male threaded member. A guide pin may be fixed relative to a sliding member, configured parallel to the male threaded member, and slidably received in the threaded block. A pivot bracket may be pivotally attached to the threaded block and couples the paddle member to the threaded block.

[0013] In some instances, the pivot support may be defined with an indicator slot having an arcuate shape. An indicator pin may be disposed in the threaded block and protrude into the indicator slot to indicate the tilt of the paddle.

[0014] In some instances, a trunnion pin may be housed in a threaded block. The trunnion pin pivotally couples the pivot support to the threaded block. A sag / tilt adjustment screw may be threaded into the threaded block and abut against the pivot support. The sag / tilt adjustment screw may abut against the pivot support at a location offset from at least one of the mounting shaft and the transport shaft, so as to adjust the sag and / or tilt of the propeller by pivoting the pivot support about the trunnion pin.

[0015] In some instances, the propeller may be a central propeller having a slot conforming to a process sleeve assembly. One or more lateral propellers may extend from a threaded member. One or more lateral propellers may have a ledge conforming to another process sleeve assembly.

[0016] In some instances, the process kit assembly may be mounted on a multipod. The multipod may be supported on a paddle. A base may be mounted on the multipod and carried by the paddle through it. The base may be aligned with the multipod to position the base, multipod, and base within the reaction chamber using a base / multipod alignment established outside the reaction chamber.

[0017] In some instances, the process assembly may be an outer ring. The outer ring may be supported on a paddle. An intermediate shelf may be mounted on the outer ring and carried by the paddle through it. The intermediate shelf may be aligned with the outer ring to position the unit and the outer ring within the reaction chamber using an intermediate shelf / outer ring alignment established outside the reaction chamber.

[0018] A semiconductor processing system is provided. The semiconductor processing system includes a reaction chamber, an injection flange, a process sleeve assembly, and a fixing device, as described above. The reaction chamber has an injection end and an opposing vent end. The injection flange is connected to the injection end of the reaction chamber. A gap is supported by the injection flange and connected to the reaction chamber therethrough. The process sleeve assembly is supported by a paddle outside the reaction chamber for transporting and positioning within the reaction chamber using the fixing device.

[0019] In some instances, the process kit assembly may be a single process kit assembly.

[0020] In some instances, the process kit assembly may be a multipod, and the semiconductor processing system may include a base. The base may be supported by the multipod in a multipod-to-multipod alignment for transport and placement within the reaction chamber in alignment with the multipod.

[0021] In some instances, the process kit assembly may be a base, and the semiconductor processing system may include an intermediate shelf. The intermediate shelf may be supported by a fixing device and aligned with the base for transport and placement within the reaction chamber.

[0022] A method is provided for positioning a process sleeve assembly within a reaction chamber in a semiconductor processing system. The method includes: supporting a process sleeve assembly on a paddle relative to a reaction chamber fixed gap at a fixing device as described above; and loading the process sleeve assembly into the reaction chamber via a sliding member through the gap, such that the sliding member translates the paddle assembly along a loading axis. Then, the process sleeve assembly is loaded within the reaction chamber by rotation of a threaded member, the rotation of which translates the paddle assembly along a mounting axis.

[0023] In some instances, the method may include aligning an intermediate shelf with a base, supporting the intermediate shelf on a fixing device, and transporting the intermediate shelf into the reaction chamber in alignment with the base. The base and intermediate shelf are positioned inside the reaction chamber by aligning them with an intermediate shelf / base constructed outside the reaction chamber.

[0024] In some instances, the method may include indicating the tilt of the propeller with a tilt indicator associated with propeller operability, and adjusting the tilt of the propeller with a sag / tilt adjustment screw connected to the propeller operability.

[0025] In some instances, the method may include indicating a carrier shaft position of a paddle along a carrier shaft using a carrier shaft position sensor coupled to a slide member, indicating a placement shaft position of a paddle along a placement shaft using a placement shaft position sensor coupled to a male thread member, and using at least one of the following to match the position of a process assembly within a reaction chamber to another reaction chamber: (a) the carrier shaft position indicated by the carrier shaft position sensor, and (b) the placement shaft position indicated by the placement shaft position sensor.

[0026] This invention is provided to introduce a series of concepts in a simplified form. These concepts will be described in further detail in the embodiments disclosed below. This invention is not intended to identify key or essential features of the claimed subject matter, nor is it intended to limit the scope of the claimed subject matter.

Implementation Method

[0028] Reference will now be made to the accompanying drawings, wherein similar element symbols identify similar structural features or configurations disclosed herein. For purposes of explanation and illustration, and not limitation, partial views of examples of fixtures according to this disclosure are shown in FIG1 and are generally designated by reference element 100. As will be described, FIG2 through FIG12 provide other examples of fixtures, semiconductor processing systems, and methods for positioning process assembly assemblies in a reaction chamber of a semiconductor system according to this disclosure or its configurations. Fixtures, semiconductor processing systems, and methods for positioning process assembly assemblies in a reaction chamber of a semiconductor processing system can be used to position process assembly assemblies in a reaction chamber used to deposit films onto a substrate, such as in atmospheric chemical vapor deposition (CVD) systems used for epitaxial film deposition, although this disclosure is not generally limited to any particular type of semiconductor processing system or epitaxial film deposition technique.

[0029] Referring to FIG1, a semiconductor processing system 10 is shown. The semiconductor processing system includes a reaction chamber 12 for housing a process kit assembly 14, a first precursor source 16, a second precursor source 18, and a rinsing source 20. The first precursor source 18 is connected to the reaction chamber 12 and configured to provide a first precursor 22 to the reaction chamber 12. The second precursor source 18 is also connected to the reaction chamber 12 and configured to provide a second precursor 24 to the reaction chamber 12. The rinsing source 20 is further connected to the reaction chamber 12 to provide a rinsing or carrier gas 26 to the reaction chamber 12. In some embodiments, the first precursor 22 may include a silicon-containing precursor, which is selectively epitaxially deposited as a silicon-containing film 28 onto a substrate 30 supported within the reaction chamber 12. According to some embodiments, the second precursor 24 may include a doped precursor, such as a germanium-containing precursor, for inclusion within the film 28. It is envisioned that, in certain instances, the rinsing or carrier gas may include hydrochloric acid or hydrogen, such as for etching walls and / or controlling deposition on the film 28 to the substrate 30.

[0030] The reaction chamber 12 has an elongated body 32, an open injection end 34, and an open exhaust end 36 longitudinally opposite to the open injection end 34. An exhaust flange 38 is connected to the exhaust end 36 of the reaction chamber 12 and is configured to fluidly couple the interior 40 of the reaction chamber 12 to an exhaust source, such as a scrubber. An injection flange 42 is connected to the injection end 34 of the reaction chamber 12 and is fluidly coupled to the exhaust flange 38 via the interior 40 of the reaction chamber 12. The injection flange 42 also fluidly couples the first precursor source 16, the second precursor source 18, and the rinsing source 20 to the reaction chamber 12. In some embodiments, the reaction chamber 12 may be formed from a transmissive material 44, such as quartz. According to some embodiments, one or more heat lamps 46 may be radiatively coupled to the interior 40 of the reaction chamber 12 for heating the substrate 30 during the deposition of the film 28 onto the surface of the substrate 30. The injection flange 42 may be as shown and described in U.S. Patent Application Publication No. 2020 / 0224309 A1 of Sreeram et al., published on July 16, 2020, the contents of which are incorporated herein by reference in their entirety.

[0031] The process assembly 14 is positioned within the interior 40 of the reaction chamber 12. In some embodiments, the process assembly 14 may be an exhaust end shelf 48. According to some embodiments, the process assembly 14 may be an injection end shelf 50. In further embodiments, the process assembly 14 may be an outer ring 52 or an intermediate shelf 54. According to some embodiments, the process assembly 14 may be a base 56. It is contemplated that, according to some embodiments, the process assembly may be a multi-legged mount 58. It is contemplated that the multi-legged mount 58 is configured to couple the base 56 to a shaft 60, which in turn couples the multi-legged mount 58 and the base 56 therethrough to a drive module 62, and the drive module 62 is configured to rotate the base 56 about a rotation axis 64 during the deposition of the film 28 onto the substrate 30. In this regard, reaction chamber 12 and process kit assembly 14 may be as shown and described in U.S. Patent No. 7,108,753 to Wood, published September 19, 2006, and U.S. Patent No. 6,086,680 to Foster et al., published July 11, 2000, the contents of which are incorporated herein by reference in their entirety. While specific examples of process kit assembly 14 are shown and described herein, it should be understood and appreciated that other types of process kit assemblies and methods may also benefit from this disclosure.

[0032] As explained above, positioning a process assembly within a reaction chamber may require overcoming the structural features of the reaction chamber. For example, regarding reaction chamber 12, positioning a process assembly 14 within reaction chamber 12 generally involves inserting the process assembly through one of the open ends of reaction chamber 12. Once within reaction chamber 12, the process assembly 14 may need to be further manipulated within the interior 40 of reaction chamber 12 to reach its desired position. In some reaction chambers, manipulating the process assembly may require avoiding contact between the process assembly and the interior surfaces of the reaction chamber to avoid damage to the reaction chamber, such as scratching the interior surfaces and / or generating particulate contamination from unintended component contact within the reaction chamber. Furthermore, the process assembly may need to be manipulated from a built-to-print position to a desired as-built position, such as for performance matching between reaction chambers. Furthermore, protective measures may be required for positioning process assembly components to limit the risk of injury to technicians positioning process assembly components within the reaction chamber, such as due to space constraints and interference within the reaction chamber. A fixing device 100 is provided to facilitate the positioning of process assembly component 14 within the reaction chamber 12, limit (or eliminate) the risk of injury to individuals(s) positioning process assembly component 14 within the reaction chamber 12, limit (or eliminate) the probability of damage to the reaction chamber 12 during the positioning of process assembly component 14 within the reaction chamber 12, and / or control the position of process assembly component 14 within the interior 40 of the reaction chamber 12.

[0033] Referring to FIG2, a reaction chamber 12, an injection flange 42, and a fixing device 100 are shown. In the illustrated example, the fixing device 100 includes a spacer plate 102, a spacer bracket 104, a spacer 106, a first bushing 108, and a second bushing 110. The fixing device 100 also includes a buffer 112, a first slider 114, a second slider 116, an end plate 118, and an end block 120. The fixing device 100 further includes a bearing configuration 122, a male threaded member 124, a first guide pin 126, a second guide pin 128, and a threaded block 130. The fixing device 100 additionally includes a trunnion pin 132 (shown in FIG6), a droop / tilt indicator 134 (shown in FIG6), a droop / tilt controller 136 (shown in FIG6), a pivot bracket 138, and a cantilever plate 140. As shown in Figure 2, the fixing device 100 includes a central propeller 142, a first lateral propeller 144, and a second lateral propeller 146.

[0034] The fixing device 100 is fixed relative to the reaction chamber 12 and disposed along the transport shaft 148. The transport shaft 148 extends through the injection flange 42 and the reaction chamber 12, and spans the injection end 34 and the exhaust end 36 of the reaction chamber 12. The fixing of the fixing device 100 relative to the reaction chamber 12 is achieved by a spacer plate 102 connected to the injection flange 42 and substantially orthogonal to the transport shaft 148. A spacer bracket 104 is attached to the spacer plate 102, extends from the spacer plate 102 along the transport shaft 148 in a direction relative to the reaction chamber 12, and supports a spacer 106. The spacer 106 is angled relative to the transport shaft 148 and disposed above the reaction chamber 12. As those skilled in the art will understand from this disclosure, the fixing via the injection flange 42 limits the load applied to the reaction chamber 12 during positioning of the process assembly 14 within the reaction chamber 12.

[0035] Referring to FIG3, a first bushing 108 and a second bushing 110 are disposed in a spacer 106. The first bushing 108 extends parallel to the transport shaft 148 and is elongated relative to the axial width of the spacer 106. The first bushing 108 further protrudes from the spacer 106 along the transport shaft 148 in at least one direction to limit the roll and pitch of the propellers (e.g., one or more of the center propeller 142, the first lateral propeller 144, and / or the second lateral propeller 146) during movement within the reaction chamber 12. The second bushing 110 is similar to the first bushing 108, parallel to the first bushing 108, and spaced apart from the first bushing 108 such that each is offset from the transport shaft 148 by a common offset distance.

[0036] A first slider 114 is slidably received in a first bushing 108 and is translatable relative to the first bushing 108 along a transport axis 148. A second slider 116 is slidably received in a second bushing 110 and is translatable relative to the second bushing 110 along a transport axis 148. It is contemplated that the second slider 116 is parallel to and fixed relative to the first slider 114, thereby allowing the first slider 114 and the second slider 116 to be translatably moved along the transport axis 148 via the first bushing 108 and the second bushing 110, respectively. As those skilled in the art will understand from this disclosure, the support provided by the elongated length of the first bushing 108 and / or the second bushing 110 can limit the roll of the paddles during movement within the reaction chamber 12, such as one or more of the central paddle 142, the first lateral paddle 144, and the second lateral paddle 146. In the illustrated example, the second slider 116 is fixed to the first slider 114 by the end plate 118 and the end block 120. The end plate 118 fixes the inner ends of the first slider 114 and the second slider 116 to each other above the reaction chamber 12, and the end block 120 fixes the opposite outer ends of the first slider 114 and the second slider 116 to each other on the side opposite to the gap 106 and the end plate 118.

[0037] A buffer 112 is disposed in a spacer 106 between a first slider 114 and a second slider 116, protruding from the spacer 106 toward an end block 120 along a transport axis 148. The end block 120 axially overlaps the spacer 106, thereby restricting the translation of the first slider 114 and the second slider 116 within the reaction chamber 12 along the transport axis 148. It is envisioned that the buffer 112 is positioned a buffer length from the spacer 106, the buffer length being selected to restrict the travel of the first slider 114 and the second slider 116 along the transport axis 148. In some instances, the length of the buffer is selected to prevent the end of one or more of the center paddle 142 (shown in FIG. 7), the first lateral paddle 144 (shown in FIG. 7), and the second lateral paddle 146 (shown in FIG. 7) from contacting the exhaust end 36 (shown in FIG. 1) and / or the exhaust flange 38 (shown in FIG. 1) during the loading and / or positioning of the process assembly 14 (shown in FIG. 1) within the reaction chamber 12.

[0038] Referring to FIG4, end block 120 is attached to the outer ends of first slider 114 and second slider 116, and a bearing configuration 122, a first guide pin 126, and a second guide pin 128 are disposed thereon. A male threaded member 124 is attached to end block 120 along mounting shaft 150, and is attached thereto to the first slider 114 and second slider 116. The male threaded member 124 is further angled relative to the first slider 114 and second slider 116, extending vertically between end block 120 and transport shaft 148, and has a male thread 152 (shown in FIG5). The first guide pin 126 and the second guide pin 128 are similarly attached to end block 120, the first guide pin 126 extending parallel to the male threaded member 124, and the second guide pin 128 extending parallel to the first guide pin 126 on the side opposite to the male threaded member 124 and the first guide pin 126. It is envisioned that the mounting knob 154 is operably connected to the male threaded part 124 for rotating the male threaded part 124 about the mounting shaft 150.

[0039] Referring to FIG5, the threaded block 130 is attached to the male threaded member 124. In this respect, the threaded block 130 has a female threaded hole 156 with a female thread, the threaded block receiving the male threaded member 124 in the female threaded hole 156 and threadedly engaging with the male thread 152 of the male threaded member 124 via the female threaded hole 156. The threaded block 130 further has a first guide pin hole 158 and a second guide pin hole 160, the first guide pin 126 being slidably received in the first guide pin hole 158 and the second guide pin 128 being slidably received in the second guide pin hole 160. It is envisioned that the first guide pin 126 and the second guide pin 128 cooperate with the male threaded member 124 such that rotation of the male threaded member 124 about the mounting axis 150 will translate the threaded block 130 along the mounting axis 150, for example, toward or away from the transport axis 148. In some instances, the threaded block 130 and the threaded element 124 may include a linear actuator, such as a ball screw assembly, as described in non-limiting embodiments.

[0040] Referring to Figure 6, the trunnion pin 132 is housed in the threaded block 130. In this respect, the end of the trunnion pin 132 protrudes from the threaded block 130 at a location offset from the mounting shaft 150 and is positioned between the male threaded member 124 and the end plate 118 (shown in Figure 2). The pivot bracket 138 is attached to the trunnion pin 132, pivotally supported by the trunnion pin 132, and couples the overhang plate 140 to the threaded block 130 via the trunnion pin 132. The pivot bracket 138 further extends along the transport shaft 148 from the threaded block 130 toward the end plate 118 (shown in Figure 2). It is envisioned that the pivot support 138 is adjacent to a first pivot stop 162 and a second pivot stop 164 (shown in FIG. 5) protruding from the first lateral surface 166 and the second lateral surface 168 of the threaded block 130, the first pivot stop 162 and the second pivot stop 164 being pivotally constraining the rotation of the pivot support 138 about the trunnion pin 132.

[0041] Referring to FIG7, the overhang plate 140 is attached to the pivot bracket 138 (shown in FIG2) and extends from the pivot bracket 138 along the transport axis 148 toward the end plate 118 (shown in FIG2). The overhang plate 140 further couples one or more paddles (e.g., the center paddle 142, the first lateral paddle 144, and the second lateral paddle 146) to the pivot bracket 138. It is envisioned that one or more paddles extend from the overhang plate 140 toward the end plate 118 along the transport axis 148, are fixed along the transport axis 148 relative to the first slider 114 (shown in FIG2) and the second slider 116 (shown in FIG2), and are free along the mounting axis 150 (shown in FIG4) relative to the first slider 114 and the second slider 116.

[0042] The center propeller 142 is configured to support the process kit assembly 14 (shown in FIG. 1). In this regard, the center propeller 142 is connected at its outer end to a cantilever plate 140, defining a transport shaft 148, and extends along the transport shaft 148 toward an end plate 118 (shown in FIG. 2). In some embodiments, the center propeller 142 may be configured to support a multi-legged mount 58 (shown in FIG. 1). In such embodiments, the center propeller 142 may have an axial groove 172 and / or a bevel groove 174, the axial groove 172 conforming to a handle of the multi-legged mount 58, and the bevel groove 174 conforming to an arm of the multi-legged mount 58. According to some embodiments, the center propeller 142 may be configured to support a base 56 (shown in FIG. 1). In such instances, the center paddle 142 may have a center ledge 176 conforming to the base 56 for supporting the base 56 either alone or in alignment with the multipod 58 when supported (at least partially) by the multipod 58.

[0043] The first lateral paddle 144 is also configured to support the process assembly 14 (shown in FIG. 1). In this respect, the first lateral paddle 144 is connected to the overhang plate 140 at its outer end, is laterally offset from the central paddle 142 and the transport shaft 148, and extends along the transport shaft 148 toward the end plate 118 (shown in FIG. 2). In some instances, the first lateral paddle 144 may be configured to support the intermediate shelf 54 (shown in FIG. 1). In such instances, the first lateral paddle 144 may have a first lateral wall 178 conforming to the periphery of the intermediate shelf 54 for supporting the intermediate shelf 54. In such instances, the first lateral wall 178 may be positioned relative to the central paddle 142 such that the intermediate shelf 54 is supported in alignment with the base 56 (shown in FIG. 1). According to some instances, a first fork member 180 may be connected to the first lateral paddle 144. In such an example, the first fork component 180 may have a first fork surface 182 conforming to the lower surface of one or more of the outer ring 52 (shown in FIG. 1), the injection end shelf 50 (shown in FIG. 1), and / or the exhaust end shelf 48 (shown in FIG. 1) to support the process kit assembly thereon.

[0044] The second lateral paddle 146 is similarly configured to support the process assembly 14 (shown in FIG. 1). In this respect, the second lateral paddle 146 is connected to the overhang plate 140 at its outer end, laterally offset from the center paddle 142 and the transport shaft 148 relative to the first paddle 144, and extends along the transport shaft 148 toward the end plate 118 (shown in FIG. 2). In some embodiments, the second lateral paddle 146 may also be configured to support the intermediate shelf 54 (shown in FIG. 1). In such embodiments, the second lateral paddle 146 may have a second lateral ledge 184 conforming to the periphery of the intermediate shelf 54 for supporting the intermediate shelf 54, the second lateral ledge 184 being a mirror image of the first lateral ledge 178 with respect to the transport shaft 148. According to some embodiments, a second fork member 186 may be connected to the second lateral paddle 146. The second fork component 186 may have a second fork surface 188 that conforms to the lower surface of one or more of the outer ring 52 (shown in FIG. 1), the injection end shelf 48 (shown in FIG. 1), and / or the exhaust end shelf 50 (shown in FIG. 1) to support the process kit assembly thereon.

[0045] As will be understood by those skilled in the art in light of this disclosure, the overhang support provided by the overhang plate 140 to the process assembly 14 (shown in FIG. 1) is pivotally induced by gravity to cause the pivot bracket 138 (shown in FIG. 2) around the trunnion pin 132. In some instances, the load transferred by the overhang plate 140 may engage with the axial length(s) of the propeller(s) to cause the propeller to sag relative to gravity. To control such sag, tilting is also required, and the fixing device 100 (shown in FIG. 1) includes a sag / tilt controller 136 (shown in FIG. 6) and a sag / tilt indicator 134 (shown in FIG. 6).

[0046] Referring again to FIG6, the droop controller 136 is associated with the propellers of the fixing device 100 (shown in FIG1), such as one or more of the center propeller 142 (shown in FIG2), the first lateral propeller 144 (shown in FIG2), and / or the second lateral propeller 146 (shown in FIG2), for adjusting the droop and tilt of the propellers. In the illustrated example, the droop controller 136 is operatively pivotable about the pivot bracket 138 about the trunnion pin 132 in a direction relative to gravity, and the droop controller includes a first droop / tilt adjustment screw 190 and a second droop / tilt adjustment screw 192 (shown in FIG5). The pivoting is achieved via the first droop / tilt adjustment screw 190, which is threaded into a first pivot stop 162 at a location along the mounting shaft 150 between the trunnion pin 132 and the overhang plate 140, extends axially along the transport shaft 148, and abuts the pivot bracket 138. In this configuration, advancing the first sag / tilt adjustment screw 190 along the transport shaft 148 (i.e., in the direction inward toward the end plate 118) reduces the sag of the overhang plate 140 and the attached propeller(s) thereto (or increases the tilt). Conversely, retracting the first sag / tilt adjustment screw 190 along the transport shaft 148 in the direction outward away from the transport plate 118 reduces the tilt of the overhang plate 140 and the attached propeller(s) thereto (or increases the sag).

[0047] The second droop / tilt adjusting screw 192, similar to the first droop / tilt adjusting screw 190, is additionally threaded into the second pivot stop 164 (shown in FIG. 5). More specifically, the second droop / tilt adjusting screw 192 is threaded into the second pivot stop 164 at a location along the mounting shaft 150 between the trunnion pin 132 and the overhang plate 140, extending axially along the transport shaft 148 and abutting the pivot bracket 138, such that advancing the second droop / tilt adjusting screw 192 reduces the droop (or increases the tilt) of the overhang plate 140, and retracting the second droop / tilt adjusting screw 192 reduces the tilt (or increases the droop) of the overhang plate 140. It is worth noting that while the second droop / tilt adjustment screw 192 may mate with the first droop / tilt adjustment screw 190, it is also contemplated that the second droop / tilt adjustment screw 192 may operate relative to the first droop / tilt adjustment screw 190, for example, to induce swaying relative to the reaction chamber 12 within the overhang plate 140. As those skilled in the art will understand from this disclosure, such swaying may be necessary when the process assembly 14 needs to be positioned within the reaction chamber 12 in a location matching the build position of a similar process assembly in other conditions, such as a different build position than the illustrated build position of a similar process assembly in other conditions. In some instances, the droop controller 136 may provide droop / tilt between approximately + / - 45 degrees in the paddle(s) coupled to the threaded block 130 via the overhang plate 140.

[0048] The droop / tilt indicator 134 is associated with one or more paddles of the fixing device 100 (shown in FIG. 1), such as the center paddle 142 (shown in FIG. 2), the first lateral paddle 144 (shown in FIG. 2), and / or the second lateral paddle 146 (shown in FIG. 2), to indicate the drooping or tilting of the paddle. In the illustrated example, the droop / tilt indicator 134 includes an indicator pin 194, a first arcuate groove 196, and a second arcuate groove 198 laterally relative to the first arcuate groove 196 (shown in FIG. 5). The first arcuate groove 196 and the second arcuate groove 198 extend through the pivot bracket 138, have a protruding shape, and extend along the transport shaft 148. The indicator pin 194 is positioned in the threaded block 130 at a location between the trunnion pin 132 and the overhang plate 140 along the mounting shaft 150. It shares a common axial position with the trunnion pin 132 along the transport shaft 148 and protrudes at opposite ends into both the first arcuate groove 196 and the second arcuate groove 198 to indicate the sag or tilt of the overhang plate 140.

[0049] It is envisioned that the protruding opposite ends of the indicator pin 194 are disposed within the first arcuate groove 196 and the second arcuate groove 198 to indicate the sag or tilt of the overhang plate 140 (and the (multiple) propellers connected thereto). For example, if the protruding end of the indicator pin 196 is disposed in the inner portion A of the first arcuate groove 196, it indicates that the overhang plate 140 and the (multiple) propellers attached thereto are tilted relative to gravity. If the protruding end of the indicator pin 194 is disposed in the outer portion B of the first arcuate groove 196, it indicates that the overhang plate 140 and the (multiple) propellers attached thereto are sag relative to gravity. If the protruding end of the indicator pin 194 is disposed in the minimum portion of the first arcuate groove 196, it indicates that the overhang plate 140 is horizontal relative to gravity, that is, neither sags nor tilts. As those skilled in the art will understand from this disclosure, controlling sag and / or tilt can limit the risk of damage during positioning of the process assembly 14 (shown in FIG. 1) within the reaction chamber, for example by limiting (or eliminating) the risk of contact between the propeller and the internal surface of the reaction chamber 12 (shown in FIG. 1). In some embodiments, the protruding shapes of the first arcuate groove 196 and the second arcuate groove 198 correspond to a propeller sag / tilt range of approximately + / - 45 degrees.

[0050] Referring to FIG8, a transport axis sensor 101 and a placement axis sensor 103 are shown. The transport axis sensor 101 is configured to indicate the position of the process sleeve assembly 14 within the reaction chamber 12 along the transport axis 148 (shown in FIG2). It is contemplated that the transport axis sensor 101 is associated (e.g., coupled) with a first slider 114 (shown in FIG2) and a second slider 116 (shown in FIG2) to indicate the transport position 66 based on the sliding of the first slider 114 and the second slider 116 respectively via the first bushing 108 and the second bushing 110. In some instances, the transport axis sensor 101 may include a laser displacement sensor. Examples of suitable laser displacement sensors include the LK-G5000 series laser displacement sensors, which are available from Keyence Corporation, Osaka, Japan.

[0051] The mounting axis sensor 103 is configured to indicate the position of the process sleeve assembly 14 within the reaction chamber 12 along the mounting axis 150 (shown in FIG. 4). In this regard, the mounting axis sensor 193 is associated with a male threaded member 124 (shown in FIG. 2) and a second slider 116 (shown in FIG. 2), and is used to indicate the mounting axis position 68 of the process sleeve assembly 14 based on the rotational position of the male threaded member 124 about the mounting axis 150. In some instances, the transport axis sensor 103 may also include a laser displacement sensor or a rotary position sensor. Examples of suitable laser displacement sensors include the LK-G5000 series laser displacement sensors, which are available from Keyence Corporation, Osaka, Japan. Examples of suitable rotary position sensors include the Vishay Model 657 industrial rotary position sensor, which is available from Vishay Intertechnology Inc., Malvern, Pennsylvania.

[0052] Referring to Figures 9A to 11E, the fixing device 100 is shown positioning the process kit assembly 14 within the reaction chamber 12. Referring to Figures 9A to 9D, the fixing device 100 can be used to position the process kit assembly 14 as a single process kit assembly within the reaction chamber 12. As shown in Figure 9A, the fixing device 100 is first fixed relative to the reaction chamber 12. The fixing device 100 to the reaction chamber 12 can be achieved by fastening the spacer 106 to the injection flange 42 (shown in Figure 1) via the spacer bracket 104 (shown in Figure 2) and the spacer plate 102 (shown in Figure 2). The process kit assembly 14 is then supported on a propeller, such as one or more of the center propeller 142 (shown in Figure 2), the first lateral propeller 144 (shown in Figure 2), or the second lateral propeller 146 (shown in Figure 2), for delivery into the reaction chamber 12. For example, a multi-legged mount 58 (shown in FIG. 1) or a base 56 (shown in FIG. 1) can be supported on the central propeller 142. Alternatively, an outer ring 52 (shown in FIG. 1) or an intermediate shelf 54 (shown in FIG. 1) can be supported on the first lateral propeller 144 and the second lateral propeller 146.

[0053] As shown in FIG. 9B, the single-process assembly 14 is then fed into the reaction chamber 12. In some embodiments, the single-process assembly 14 may be fed into the reaction chamber 12 via the injection flange 42. According to some embodiments, the single-process assembly 14 may be fed into the reaction chamber 12 via the exhaust flange 38. The feeding of the process assembly 14 may be achieved, for example, by sliding the first slider 114 (shown in FIG. 2) through the first bushing 108 (shown in FIG. 2) and the second slider 116 (shown in FIG. 2) through the second bushing 110, which translates the center paddle 142 (shown in FIG. 2) and / or the first lateral paddle 144 (shown in FIG. 2) and the second lateral paddle 146 (shown in FIG. 2) along the feed shaft 148. The sliding of the first slider 114 and the second slider 116 may be achieved, for example, using the feed shaft handle 170 (shown in FIG. 2).

[0054] As shown in FIG9C, the single-process assembly 14 is subsequently aligned within the interior 40 of the reaction chamber 12, for example, by calibrating or centering the process assembly 14 relative to axis 60 (shown in FIG1). Once aligned, the single-process assembly 14 is placed within the interior 40 of the reaction chamber 12. Placement can be achieved by rotating the R-threaded member 124 about the rotation axis 150, which causes the process assembly 14 to translate along the placement axis 150 via the threaded member 124 (shown in FIG2), the pivot bracket 138 (shown in FIG2), the overhang plate 140 (shown in FIG2), and the propeller(s) supporting the process assembly 14.

[0055] As shown in FIG9D, thereafter, by sliding the first slider 114 through the first bushing 108 and sliding the second slider 116 through the second bushing 110, the (multiple) paddles, such as the center paddle 142 or the first lateral paddle 144 and the second lateral paddle 146, are retracted from the reaction chamber 12 along the transport shaft 148.

[0056] In some instances, the sag 70 (shown in FIG. 9A) of the center paddle 142 and / or the first lateral paddle 144 and the second paddle 146 associated with the load of the process kit assembly 14 can be adjusted after the process kit assembly 14 is loaded and / or unloaded. For example, the sag 70 associated with the load applied by the single process kit assembly 14 can be reduced (or eliminated) by advancing either (or both) the first sag / tilt adjustment screw 190 (shown in FIG. 5) and the second sag / tilt adjustment screw 192 (shown in FIG. 5). The tilt 72 associated with load reduction can be reduced (or eliminated) by retracting either (or both) the first sag / tilt adjustment screw 190 (shown in FIG. 5) and the second sag / tilt adjustment screw 192 (shown in FIG. 5) after the single process kit assembly 14 has been placed inside the interior 40 of the reaction chamber 12. It has also been envisioned that, according to certain examples, sag and / or tilt adjustment can be indicated by the setting of sag / tilt indicator pin 194 (shown in Figure 6) in the arcuate groove 196 (shown in Figure 6).

[0057] Referring to Figures 10A to 10D, a fixing device 100 can be used to position the process kit assembly pair 74 within the reaction chamber 12. As shown in Figure 10A, the fixing device 100 is first fixed relative to the reaction chamber 12. Next, the first process kit assembly 76 is supported on the fixing device 100. Subsequently, the second process kit assembly 78 is supported on the fixing device 100. As shown in Figure 10B, the process kit assembly pair 74 is then loaded into the reaction chamber 12. As shown in Figure 10C, the process kit assembly pair 74 is then positioned within the reaction chamber 12. As shown in Figure 10D, the propellers, such as the center propeller 142, or one or more of the first lateral propeller 144 and the second lateral propeller 146, are then retracted from the reaction chamber 12. As will be appreciated by those skilled in the art in view of this disclosure, positioning the process kit pair 74 within the reaction chamber 12 during a single pass can limit the time required to assemble the reaction chamber 12 and / or replace process kit components within the reaction chamber 12.

[0058] In some instances, before the process assembly pair 74 is loaded and placed within the reaction chamber 12, the second process assembly 78 may be supported on the fixture 100 in alignment 80 with the first process assembly 76. For example, the process assembly pair 74 may include a multi-legged mount 58 (shown in FIG. 1) and a base 56 (shown in FIG. 1), the multi-legged mount 58 may be supported on a central propeller 142 (shown in FIG. 2), and the base 56 may be supported on the multi-legged mount 58 and the central propeller 142, and the base / multi-legged mount alignment 80 is established when the multi-legged mount 58 and the base 56 are supported on the fixture 100 outside the reaction chamber 12. Alternatively, the process kit assembly pair 74 may include an intermediate shelf 54 (shown in FIG. 1) and a base 56, the base 56 being supported on the central propeller 142, and the intermediate shelf / base alignment 80 being established when the intermediate shelf 54 and the base 56 are supported on the fixture 100 outside the reaction chamber 12. Advantageously, establishing the alignment 80 outside the reaction chamber 12 simplifies the positioning of the process kit assembly pair 74, because the second process kit assembly 78 can be directly aligned with the first process kit assembly 76, avoiding the need for indirect manipulation of the process components of the process kit assembly pair 74 to establish the alignment 80 once inside the reaction chamber 12.

[0059] Referring to Figures 11A to 11D, a fixing device 100 can be used to position the complete process assembly 82 within the reaction chamber 12 during a single stroke to the reaction chamber 12. As shown in Figure 11A, the fixing device 100 is first fixed relative to the reaction chamber 12. Next, a multi-legged support 58 is supported on a central propeller 142 (shown in Figure 2), and an outer ring 52 is supported on a first lateral propeller 144 (shown in Figure 2) and a second lateral propeller 146 (shown in Figure 2). Subsequently, a base 56 is supported on the multi-legged support 58 and the central propeller 142, and an intermediate shelf 54 is supported on the first lateral propeller 144 and the second lateral propeller 146.

[0060] As shown in FIG11B, the complete process kit 82 is then transported into the reaction chamber 12. As shown in FIG11C, the complete process kit 82 is then positioned within the reaction chamber 12. As shown in FIG11D, the center propeller 142, the first lateral propeller 144, and the second lateral propeller 146 are subsequently withdrawn from the reaction chamber 12. As those skilled in the art will understand from this disclosure, positioning the complete process kit 82 within the reaction chamber 12 during a single journey to the reaction chamber 12 can further limit the time required to assemble the reaction chamber 12 and / or replace process kit components within the reaction chamber 12.

[0061] In some embodiments, the base 56 can be aligned with the multipod 58 using a base / multipod alignment 84 when outside the reaction chamber 12. According to some embodiments, the intermediate shelf 54 can be aligned with the base 56 using an intermediate shelf / base alignment 86 when outside the reaction chamber 12. The alignment established outside the reaction chamber 12 can then be used to load and place the complete process assembly 82 within the reaction chamber 12, such as the base / multipod alignment 84 and / or the intermediate shelf / base alignment 86. Advantageously, establishing the base / multipod alignment 84 and the intermediate shelf alignment 86 outside the reaction chamber 12 simplifies the positioning of the complete process assembly 82 within the reaction chamber 12 by avoiding the need for individual manipulation of the process assembly components once inside the reaction chamber 12.

[0062] Referring to FIG12, a method 200 for positioning a process assembly in a reaction chamber of a semiconductor processing system is shown, for example, a process assembly 14 (shown in FIG1) in reaction chamber 12 (shown in FIG1) of semiconductor processing system 10 (shown in FIG1). As shown in block 210, method 200 includes securing a spacer to the reaction chamber, for example, spacer 106 (shown in FIG2). As shown in block 220, method 200 further includes supporting the process assembly on paddles of a fixing device, for example, on a central paddle 142 (shown in FIG2) and / or a first lateral paddle 144 (shown in FIG2) and a second lateral paddle 146 (shown in FIG2), as shown in block 220. In some instances, the process assembly may be mounted on a multi-legged mount, for example, multi-legged mount 58 (shown in FIG1), as shown in block 222. In some instances, the process kit assembly may be a base, such as base 56 (shown in FIG. 1), as shown in block 224. It is also conceivable that the process kit assembly may be an outer ring or an intermediate shelf, such as outer ring 52 (shown in FIG. 1) or intermediate shelf 54 (shown in FIG. 1), as shown in blocks 226 and 228.

[0063] As shown in block 230, in some instances, method 200 may include using a sag / tilt indicator pin to indicate paddle tilt or sag, for example, with sag / tilt indicator pin 194 (shown in FIG. 6). As shown in block 240, method 200 may include using sag / tilt adjustment screws to adjust paddle sag or tilt, for example, by advancing or retracting either (or both) a first sag / tilt screw 190 (shown in FIG. 5) and a second sag / tilt screw 192 (shown in FIG. 5). For example, the fixing device may be adjusted to reduce or eliminate paddle sag, which is caused by the process assembly applying a load on the paddle after the paddle's support process assembly. The fixing device may be adjusted to reduce or eliminate paddle tilt, which is caused by a reduction in the load on the paddle after the process assembly is placed in the reaction chamber.

[0064] As shown in block 250, method 200 is envisioned to include transporting the process kit assembly into the reaction chamber. In some instances, an intermediate shelf may be transported into the reaction chamber aligned with a base, as shown in block 254. According to some instances, the base may be transported into the reaction chamber aligned with a multipod, as shown in block 256. In a further instance, during movement within the reaction chamber, a transport axis sensor may be used to indicate the position of the paddles and / or the process kit assembly, for example, using transport axis sensor 101 (shown in FIG. 8), as shown in block 260. As those skilled in the art will understand from this disclosure, indicating the position of the transport axis of the paddles can limit (or eliminate) the possibility of damage during transport of the process kit assembly within the reaction chamber.

[0065] As shown in block 270, method 200 is also envisioned to include placing the process kit assembly into the reaction chamber, for example, by rotating the male threaded member 124 (shown in FIG. 2) about a placement axis 150 (shown in FIG. 4). In some instances, an intermediate shelf may be positioned in the reaction chamber aligned with a base, as shown in block 272. According to some instances, the base may be positioned in the reaction chamber aligned with a multi-legged stand, as shown in block 274. In a further instance, a placement axis sensor may be used to indicate the position of the paddle along the placement axis, for example, using placement axis sensor 103 (shown in FIG. 8), as shown in block 280. As those skilled in the art will understand from this disclosure, indicating the placement axis position of the paddle can limit (or eliminate) the possibility of damage during the transport of the process kit assembly within the reaction chamber.

[0066] As shown in block 290, method 200 may further include matching the position of a process kit assembly in the reaction chamber to the position of a similar process kit assembly in another reaction chamber. As shown in block 292, matching the position of a process kit assembly in the reaction chamber may include matching the feed axis position of the process kit assembly to be matched to the feed position of a similar process kit assembly in the reaction chamber to be matched. As shown in block 294, matching the position of a process kit assembly in the reaction chamber may include matching the placement axis position of the process kit assembly to the placement axis position of a similar process kit assembly in the reaction chamber to be matched. As those skilled in the art will appreciate from this disclosure, positioning the process kit assembly within the reaction chamber to the indicated feed axis position and / or placement axis position can simplify and / or reduce the time required to match reaction chamber performance, for example, by reducing reliance on the skills and experience of maintenance engineers positioning the process kit assembly within the reaction chamber.

[0067] The specific embodiments shown and described are illustrative of the invention and its preferred mode, and are not intended to limit the scope of the embodiments in any way. In fact, for the sake of simplicity, conventional manufacturing, connection, preparation, and other functional aspects of the system may not be described in detail. Furthermore, the connecting lines shown in the various figures are intended to represent exemplary functional relationships and / or physical couplings between various elements. Many alternative or additional functional relationships or physical connections may exist in the actual system, and / or may not exist in some embodiments.

[0068] It should be understood that the configurations and / or methods described herein are exemplary in nature, and such specific embodiments or examples should not be considered limiting, as there are numerous possible variations. The specific routines or methods described herein may represent one or more of any number of processing strategies. Therefore, the various actions illustrated may be performed in the illustrated sequence, in other sequences, or omitted in some cases.

[0069] The subject matter of this disclosure includes all novel and non-obvious combinations and sub-combinations of the various processes, systems and configurations, and other features, functions, actions and / or properties disclosed herein, as well as any and all equivalents thereof. [Simplified Explanation of the Diagram]

[0027] These and other features, features, and advantages of this disclosure will be described below with reference to the accompanying drawings, which are intended to illustrate but not limit certain embodiments of the invention. Figure 1 is a schematic diagram of a fixture for positioning a process kit assembly in a reaction chamber of a semiconductor processor system according to the present disclosure, showing the fixture separated from the reaction chamber of the semiconductor processor system; Figure 2 is a perspective view of the fixture and reaction chamber of Figure 1 according to an example, showing the fixture supported by an injection flange through a spacer and connected to the reaction chamber therethrough; Figure 3 is a perspective view of a portion of the fixture and reaction chamber of Figure 1 according to an example, showing the first and second slide members of the fixture slidably supported by the spacer for transporting the process kit assembly into the reaction chamber; Figure 4 is a perspective view of a portion of the fixture and reaction chamber of Figure 1 according to an example, showing the male threaded members attached to the first and second slide members for placing the process kit assembly in the reaction chamber; Figures 5 and 6 are perspective and side views of a portion of the fixture of Figure 1 according to an example, showing the droop / tilt device and droop / tilt controller for indicating and controlling the drooping and tilting of the paddle of the fixture. Figure 7 is a plan view of a portion of the fixture according to Example 1 of Figure 1, showing the center and lateral paddles of the fixture for loading and placing process kit assemblies in the reaction chamber; Figure 8 is a side view of the reaction chamber and fixture of Figure 1, schematically showing the transport axis position sensor and the placement axis position sensor for indicating the position of the process kit assembly along the transport axis and the placement axis during loading and placing of the process kit assembly in the reaction chamber; Figures 9A to 9D are side views of the reaction chamber and fixture of Figure 1, schematically showing the fixture loading and placing single process kit assemblies in the reaction chamber; Figures 10A to 10D are side views of the reaction chamber and fixture of Figure 1, schematically showing the fixture using alignment established outside the reaction chamber to load and place pairs of process kit assemblies in the reaction chamber. Figures 11A to 11D are side views of the reaction chamber and fixture of Figure 1, schematically illustrating how the fixture uses alignment established outside the reaction chamber to load and position four process kit assemblies within the reaction chamber; and Figure 12 is a block diagram of a method for positioning process kit assemblies within the reaction chamber of a semiconductor processing system, illustrating the operation of a method according to an illustrative and non-limiting example of the method. It should be understood that the elements in the figures are drawn for simplicity and clarity and are not necessarily drawn to scale. For example, the dimensions of some elements in the figures may be particularly enlarged relative to other elements to aid in understanding the illustrated example of this disclosure.

Claims

1. A fixing device comprising: a spacer configured for fixing relative to a reaction chamber of a semiconductor processing system; a slider slidably supported by the spacer and translatable along a transport axis extending into the reaction chamber; a threaded member attached to the slider and rotatable about a mounting axis angled relative to the transport axis; and a paddle attached to the threaded member and defining the transport axis, wherein the paddle is fixed relative to the slider along the transport axis to transport a process assembly into the reaction chamber by translation of the slider, and wherein the paddle is free relative to the slider along the mounting axis to position the process assembly in the reaction chamber by rotation of the threaded member.

2. The fixing device as claimed in claim 1, further comprising a bushing disposed in the gap and extending about the slider, wherein the bushing protrudes from the gap along the transport shaft to limit the roll and pitch of the paddle.

3. The fixing device as claimed in claim 1, wherein the slider is a first slider, and the fixing device further includes a second slider slidably supported by the gapper, wherein the second slider is fixed relative to the first slider to limit the roll of the paddle.

4. The fixing device as claimed in claim 1, further comprising a buffer disposed in the spacer and parallel to the slider to limit the translation of the paddle along the transport axis.

5. The fixing device as claimed in claim 1, further comprising a threaded block attached to the male threaded member and coupled to the paddle member to the sliding member, the threaded block being translatable along the mounting axis according to rotation of the male threaded member about the mounting axis.

6. The fixing device as claimed in claim 1, further comprising: a carrier shaft position sensor associated with the slider to indicate a position of the paddle along the carrier shaft; and a mounting shaft position sensor associated with the threaded member to indicate a position of the paddle along the mounting shaft.

7. The fixing device as claimed in claim 1, further comprising: a sag / tilt indicator associated with the paddle to indicate sag and tilt of the paddle; and a sag / tilt controller operatively associated with the paddle to control sag and tilt of the paddle.

8. The fixing device as claimed in claim 1, further comprising: a threaded block attached to the male threaded member; a guide pin slidably received in the threaded block and extending parallel to the male threaded member; and a pivot bracket pivotally attached to the threaded block, wherein the pivot bracket couples the paddle member to the threaded block.

9. The fixing device as claimed in claim 8, wherein the pivot support defines an arcuate groove in a protruding shape, the fixing device further comprising an indicator pin disposed in the threaded block and protruding into the arcuate groove to indicate the drooping and tilting of the propeller.

10. The fixing device as claimed in claim 8, further comprising: a trunnion pin disposed in the threaded block and pivotally coupled to the threaded block; and a sag / tilt adjustment screw threadedly received in the threaded block and abutting the pivot support, wherein the sag / tilt adjustment screw abuts the pivot support at a location along the mounting axis between the trunnion pin and the propeller, controlling at least one of sag and tilt of the propeller.

11. The fixing device as claimed in claim 1, wherein the paddle is a central paddle having a groove conforming to one of the process sleeve assemblies, and the fixing device further includes at least one lateral paddle extending from the male threaded member by a lateral bracket conforming to another process sleeve assembly.

12. The fixing device as claimed in claim 1, wherein the process assembly is supported on a multipod on the propeller, and the fixing device further includes a base disposed on the multipod and carried therethrough by the propeller, wherein the base is aligned with the multipod for positioning with a base / multipod established outside the reaction chamber.

13. The fixing device as claimed in claim 1, wherein the process kit assembly is supported on a base on the propeller, and the fixing device further includes an intermediate shelf supported on the fixing device, wherein the intermediate shelf is aligned with the base for alignment with an intermediate shelf / base established outside the reaction chamber.

14. A semiconductor processing system comprising: a reaction chamber having an injection end and an opposing vent end; an injection flange connected to the injection end of the reaction chamber; a fixing device as claimed in claim 1, wherein the spacer is supported by the injection flange and connected thereto to the reaction chamber; and a process sleeve assembly supported by the paddle outside the reaction chamber for transporting and positioning within the reaction chamber using the fixing device.

15. The semiconductor processing system as described in claim 14, wherein the process kit is a single process kit.

16. The semiconductor processing system of claim 14, wherein the process kit assembly is a first process kit assembly, and the semiconductor processing system further includes a second process kit assembly, wherein the second process kit assembly is aligned with the first process kit assembly.

17. A method of positioning a process assembly in a reaction chamber of a semiconductor processing system, the method comprising: at a fixing device including a spacer; a slider slidably supported by the spacer and translatable along a transport axis extending into a reaction chamber; a threaded member attached to the slider and rotatable about a mounting axis angled relative to the transport axis; and a paddle attached to the threaded member and defining the transport axis, the paddle fixed relative to the slider along the transport axis and free relative to the slider along the mounting axis; fixing the spacer relative to the reaction chamber; and supporting a process assembly on the paddle. The process assembly is transported into the reaction chamber by sliding the slider through the gap, and the sliding of the slider translates the paddle along the transport axis; and the process assembly is placed in the reaction chamber by rotating the male threaded member about the placement axis, and the rotation of the male threaded member translates the paddle along the placement axis.

18. The method of claim 17, wherein the process assembly is a base, the method further comprising: supporting an intermediate shelf in alignment with the base on the fixing device; transporting the intermediate shelf into the reaction chamber, with the base positioned in an intermediate shelf / base alignment; placing the intermediate shelf within the reaction chamber, with the base positioned in the intermediate shelf / base alignment, wherein the intermediate shelf / base alignment is established outside the reaction chamber when the intermediate shelf and the base are supported on the fixing device.

19. The method as described in claim 17, further comprising: using a sag / tilt indicator associated with the propeller to indicate sag or tilt of the propeller; and using a sag / tilt controller operatively connected to the propeller to adjust the sag or tilt of the propeller.

20. The method as described in claim 17, further comprising: indicating the position of the paddle along a carrier axis using a carrier axis sensor associated with the slider; indicating the position of the paddle along a placement axis using a placement axis sensor associated with the male thread member; and matching a position of the process assembly in the reaction chamber with another reaction chamber using at least one of the carrier axis position indicated by the carrier axis sensor and the placement axis position indicated by the placement axis sensor.

Images