Apparatus and method for optical inspecting three or more sides of a component

Abstract

This invention describes an apparatus for inspecting a component, comprising an adjustable optical element for image detection in two steps: focusing on a second (or bottom) surface of the component and focusing on a side surface. This allows for reduction of image degradation in one or more of the images.

Description

Technical Field

[0001] Traditionally, component handling and processing systems and equipment have performed quality control by optically inspecting several samples after handling and processing. However, this means that defect correction and prevention can be less efficient because a larger number of components may require secondary processing. Prior Technology

[0002] In recent years, inspection processes have been developed for components such as grains to inspect not only the bottom surface, but also one or more sides to detect defects such as cracks. These defects are usually present on the face and / or sides, due to mechanical processes such as cutting used to separate and monolithize grains from each other and from the wafer.

[0003] US Patent 10,324,044 B2 discloses an apparatus, method, and computer program product for detecting defects in a workpiece. At least one light source is provided, which generates illumination light in a wavelength range under which the workpiece is transparent. A camera, aided by a lens, images light from at least one surface of the workpiece onto a detector of the camera. A stage is used to move the workpiece and to fully image at least one side or surface of a semiconductor device by means of the camera.

[0004] Inspection systems are known to have significant defects when inspecting five or more sides (e.g., four sides and top or bottom) of monolithic components or semiconductor devices.

[0005] For example: ● Inspecting more sides or surfaces usually reduces the processing volume; ● Different focal points between the side and bottom surfaces can affect image quality; ● Image resolution on one or more sides typically requires a relatively large field of view, which can limit the usable pixel resolution; ● Furthermore, non-critical contamination may be indistinguishable from real defects due to insufficient resolution.

[0006] Interim inspections are preferable, but because each component is inspected, it may be necessary to reduce the impact on throughput by limiting or eliminating one or more inspection steps. Summary of the Invention

[0007] One objective of this invention is to provide an inspection device that can accurately detect lateral defects in monolithic components and also accurately detect internal defects without incurring significant processing losses.

[0008] In a first aspect of the present invention, a preferred optical component inspection apparatus as claimed in claim 1 is provided.

[0009] By modifying one or more optical paths, image detection can be performed in two steps: focusing on the second (or bottom) surface of the component and focusing on the upper side. This allows for a reduction in the degree of image degradation in one or more of the images.

[0010] A particular advantage is the use of liquid lenses as adjustable optical elements, which allow for electrical changes in shape and focus. Refocusing with a liquid lens can take only tens of milliseconds, which is typically faster than the movement of any complex mechanical component. A focusing time of approximately 20 ms is possible.

[0011] In another embodiment of the invention, a component inspection device as claimed in claim 6 is provided.

[0012] Using a third optical reflector is advantageous because it provides greater freedom in the placement of the second image detector in the determination device.

[0013] In another embodiment of the invention, a component inspection device as claimed in claim 7 is provided.

[0014] Depending on the degree of deviation from the square component, it may be advantageous to modify one or more focus parameters to optimize the image focus on the side.

[0015] In yet another embodiment of the invention, a component inspection device as claimed in claim 16 is provided.

[0016] Using four mirrors allows a single image to consist of a face 660 and four sides 610, 620, 640, and 640. Simple Explanation of the Diagram

[0017] Other advantages and features of the present invention are illustrated in the following figures: [Figures 1A and 1B] show schematic diagrams of the first inspection position included within the component inspection equipment; [Figure 1C] depicts a perspective view of two different types of components, namely, a roughly square component and a roughly rectangular component; [Figures 2A and 2B] show schematic diagrams of the second inspection position included within the component inspection equipment; [Figure 2C] depicts another view of the second inspection location; [Figure 2D] depicts another view of the second inspection position, the same view as Figure 2C, except that the rectangular grain 151 has been rotated ninety degrees around the third axis 930; [Figure 3] Depicts a sample image obtained using the setup depicted in Figures 2A, 2B, or 2C; [Figure 4A] and [Figure 4B] depict a second inspection position included in another component inspection device; [Figures 5A and 5B] show another schematic diagram of the second inspection position included in the grain inspection equipment; [Figure 6A] and [Figure 6B] depict the second inspection position 820 included in another grain inspection device 120; and [Figures 7A and 7B] show further schematic diagrams of the second inspection position included within the grain inspection apparatus 130. Implementation

[0018] In the drawings, a first axis 910, a second axis 920, and a third axis 930 are depicted to facilitate the association of different views and different parts by those skilled in the art. The first axis 910 is substantially perpendicular to the second axis 920, and the third axis 930 is substantially perpendicular to both the first axis 910 and the second axis 920.

[0019] It can be conveniently assumed that the first axis 910 is in the X direction, the second axis 920 is in the Y direction, and the third axis 930 is in the Z direction.

[0020] Technically, the first axis 910 and the second axis 920 are completely interchangeable in specific embodiments of the present invention. Many functions operating along the direction of the third axis 930 are interchangeable with equivalent operations along the direction of the first axis 910. Many functions operating along the direction of the third axis 930 are interchangeable with equivalent operations along the direction of the second axis 920.

[0021] Figures 1A and 1B illustrate schematic diagrams of a first inspection position 810 included within a component inspection apparatus such as die inspection apparatus 100. Where appropriate, die inspection apparatus 100 may be included in a device configured and arranged for handling and / or processing of a die, such as a die bonder. Alternatively, any other object having three or more sides / faces may be inspected, such as a semiconductor package, wafer, integrated circuit, or substrate.

[0022] Figure 1A depicts a view in a plane that includes: a first axis 910, nominally indicated as having a positive direction from left to right; and a third axis 930, nominally indicated as having a positive direction from bottom to top. A second axis 920 is nominally indicated as having a positive direction for entering the page.

[0023] A die attachment portion 130, such as a die bonder head, is provided, which is movable 935 in both positive and negative directions along a third axis 930. Dies 150, 151 are further positioned along the third axis 930 such that the die attachment portion 130 is movable (935) towards or away from the dies 150, 151 along the third axis 930.

[0024] Depending on the circumstances, after being attached to the dies 150, 151, the die attachment portion 130 may be configured and arranged to rotate about the third axis 920 (not shown).

[0025] Figure 1A further depicts a first image detector 510, which is configured to capture an image of at least a portion of the first surface 650 of the dies 150, 151. A first light source 210 may be provided, if applicable. As depicted, the first light source may be integrated with the first image detector 510. Alternatively, the light source may be positioned at any convenient location that allows at least a portion of the light to be reflected and / or scattered from at least a portion of the first surface 650 of the dies 150, 151. The degree of scattering may also occur. If applicable, one or more optical elements, such as an objective lens, may be included in the first image detector 510.

[0026] Figure 1B depicts another view of a first inspection position 810 in a plane, which includes: a first axis 910 having a positive direction from left to right; and a second axis 920 having a positive direction from bottom to top. A third axis 930 has a positive direction for entering the page.

[0027] Grains 150 and 151 are depicted with the second grain face 660 facing the front of the figure. The grain attachment portion 130 is hidden in Figure 1B. For clarity, the first light source 210 and the first image detector 510 are not depicted in Figure 1B. This view can also be described as being viewed in the positive direction along the third axis 930 towards the bottom face 660 of grains 150 and 151. For clarity, only the generally square grain 150 is depicted, but technically this specific example will also operate with the generally rectangular grain 151.

[0028] After being attached to dies 150 and 151, the die attachment portion 130 is configured to move 925 in the direction of the second axis 920. Depending on the situation, after being attached to dies 150 and 151, the die attachment portion 130 may be configured to move 915 in the direction of the second axis 920.

[0029] Depending on the circumstances, after being attached to dies 150 and 151, the die attachment portion 130 may be configured to rotate about a first axis 910 (not shown). Alternatively, after being attached to dies 150 and 151, the die attachment portion 130 may be configured to rotate about a second axis 920 (not shown).

[0030] Figure 1C depicts a perspective view of two different types of grains, namely a generally square grain 150 and a generally rectangular grain 151. This can be described as a grain to be inspected, having a generally square or generally rectangular longitudinal grain cross-section in a plane containing the first axis 910 and the second axis 920. In other words, during the inspection depicted in the figure, the grain has a generally square 150 or a generally rectangular transverse device cross-section in a plane containing the first axis 910 and the second axis 920.

[0031] The generally square grain 150 includes a first grain surface 650 extending generally along a first axis 910 and a second axis 920. The dimension along the first axis 910 can be considered as the width, and the dimension along the second axis 920 can be considered as the length. The grain 150 is described as "square" because its extent (or size) along the first axis 910 and the second axis 920 is approximately the same.

[0032] Due to the typical orientation of the device, the first face 650 can be considered as the top face. The grain is further contained in the second face 660, which is hidden in Figure 1C and can be considered as the bottom face.

[0033] Generally, the first surface 650 and the second surface 660 are located on opposite surfaces of the grain 150. Technically, the first surface 650 and the second surface 660 of the grain 150 are completely interchangeable in specific embodiments of the present invention.

[0034] In cases where the first surface 650 and the second surface 660 of the die 150 are configured differently and / or operation is performed on only one surface, the terms top and bottom may be considered non-interchangeable. For example, if the attachment portion 130 is a die bonder, it is attached (picked up) to the die on the top surface 650 of the die 150, which has been treated with semiconductor technology, and the bottom surface 660 of the die 150 is configured and arranged for attachment (picking up) to another substrate during bonding.

[0035] The square grain 150 also extends along the third axis 930. The dimension along the third axis 930 can be considered as height or thickness. The square grain 150 includes a first side 610, a second side 620, a third side 630 (hidden in FIG. 1C), and a fourth side 640 (hidden in FIG. 1C).

[0036] Generally, a surface is a flat surface of a delimiting solid, and a side is a flat surface of a delimiting solid adjacent to a surface. A side can also be described as an edge. The terms "surface" and "side" are used in this invention because these terms will be familiar to those skilled in the art.

[0037] As depicted, the first side 610 and the third side 630 are on opposite sides of the grain 150; and the second side 620 and the fourth side 640 are on different opposite sides of the grain 150. The first side 610 is adjacent to the second side 620, and the third side 630 is adjacent to the fourth side 640. The first side 610, the second side 620, the third side 630, and the fourth side 640 are disposed adjacent to the first surface 650 and the second surface 660. Technically, in specific embodiments of the present invention, references to the first side 610, the second side 620, the third side 630, and the fourth side 640 are fully interchangeable.

[0038] Due to the typical orientation of the device, the first side 610, the second side 620, the third side 630, and the fourth side 640 can be regarded as the first side 610, the second side 620, the third side 630, and the fourth side 640, respectively. The first side 610, the second side 620, the third side 630, and the fourth side 640 are arranged adjacent to the top surface 650 and the bottom surface 660.

[0039] Typically, the die (and semiconductor package and component) is flat, with a thickness much smaller than its width and length. The die is depicted in the drawings as having two faces and four sides (or edges). However, those skilled in the art will recognize that the specific examples described in this invention, operated by a square die 150 or a rectangular die 151, can be set and configured to operate by dies having very different relative dimensions, including cubic and generally cubic shapes. For examination using the specific examples described in this invention, the die is considered to comprise five or more flat surfaces, which include faces, sides, and any combination thereof.

[0040] In accordance with the present invention, if the inspection can be performed in both the first and second orientations in the second inspection position (depicted in Figures 2A and 2B) without significant change to one or more focus settings, the grain can be considered square, wherein the second orientation is reached after rotating the grain 90 degrees or 270 degrees (or multiples of 90 degrees and / or 270 degrees) around the third axis 930 from the first orientation.

[0041] For example, if the difference between the positions of the grain edge in the first and second orientations is less than the field depth of the imaging optics, then the grain can be considered as a square.

[0042] The roughly rectangular grain 151 is described as "rectangular" because its extent (or size) along the first axis 910 is smaller than its extent along the second axis 920.

[0043] In some technical fields, a rectangle can be considered as a quadrilateral with four right angles. In those cases, the use of a rectangle in this invention should be understood as an elongated elliptical rectangle, an extended rectangle, and / or a non-square rectangle.

[0044] The rectangular grain 151 is the same as the square grain, the difference being in their relative size.

[0045] In this invention, if it is impossible to perform an inspection in both the first and second orientations while in the second inspection position (depicted in Figures 2A and 2B) without significantly altering one or more focus settings, the grain can be considered a square or rectangular shape, wherein the second orientation is reached after rotating the grain 90 degrees or 270 degrees (or multiples of 90 degrees and / or 270 degrees) around the third axis 930 from the first orientation. In other words, the inspection in the first orientation cannot be repeated in the second orientation without significantly altering one or more focus settings.

[0046] Before inspection at the first inspection position 810, dies 150 and 151 are transferred (not depicted) to the first inspection position 810. This is a position where at least a portion of the first surface 650 is positioned within the imaging range of the first image detector 510. For example, if the inspection equipment 100 is included in the die bonder, dies 150 and 151 may still be on the wafer during inspection at the first inspection position 810.

[0047] Depending on the situation, the first light source 210 is activated, thereby reflecting and / or scattering at least a portion of the light from the first surface 650 of the grains 150 and 151 toward the first image detector 510. The degree of scattering may also occur.

[0048] One or more inspection images are then composed of at least a portion of the first surface 650 of the grains 150 and 151.

[0049] After capturing the image at the first inspection position 810, the die attachment portion 130 moves 935 in the negative direction of the third axis 930 until it reaches the top surface 650 of the dies 150 and 151. The dies 150 and 151 are attached to the die attachment portion 130 and move 925 in the direction of the second axis 920 to the second inspection position (depicted in Figures 2A and 2B).

[0050] Depending on the circumstances, grains 150 and 151 may also be moved 915 in the direction of the first axis 910. Alternatively, grains 150 and 151 may be moved 935 in the direction of the third axis 930.

[0051] Figures 2A and 2B show schematic diagrams of the second inspection position 820 included within the die inspection apparatus 100. The second inspection position 820 may also be described as an edge (or side) inspection position 820.

[0052] Figure 2A depicts a view in a plane that includes: a first axis 910, whose positive direction is from left to right; and a third axis 930, whose positive direction is from bottom to top. A second axis 920 has a positive direction of entry into the page. It schematically represents a longitudinal cross-section through the grain inspection device 100 at the second inspection position 820.

[0053] In the second inspection position 820, the dies 150 and 151 are positioned between the first optical reflector 710 and the second optical reflector 720, thereby positioning the two opposing sides 610 and 630 facing the first optical reflector 710 and the second optical reflector 720, respectively. The dies 150 and 151 are further positioned on the optical axis 800, which extends in the direction of the third axis 930.

[0054] Depending on the circumstances, the grain attachment portion 130 can be used to hold the grains 150 and 151 in the correct position.

[0055] The second inspection position 820 further includes, as appropriate, a third optical reflector 730 further positioned along the optical axis 800 in the negative direction of the third axis 930, which is configured to image the second surface (or bottom surface) 660 of the grains 150, 151. For example, the third optical element 730 may be a mirror or a beam deflector. This is advantageous because it provides greater freedom in the placement of the second image detector 520 in the judgment devices 100, 110. The third optical reflector 730 is preferably highly reflective to the wavelength used for illumination. In addition, the surface quality is preferably high enough that the image quality of the inspection is not significantly reduced. For example, a λ / 10 first surface mirror from Edmund Optics: www.edmundoptics.com / -f / lambda10-first-surface-mirrors / 13759 / has a surface flatness of λ / 10 and a surface quality of 20 to 10.

[0056] Depending on the circumstances, if one or more light sources 240 are positioned in the negative direction at a location farther along the third axis 930, a beam splitter or translucent mirror can be used as described below. This can also be described as providing illumination 240 below the third optical reflector 730. In such cases, the third optical reflector 730 can be further positioned and configured to couple to these additional light sources 240 to provide tilt-compensated illumination. The beam splitter is preferably optimized for the wavelength used for illumination. Additionally, the surface quality is preferably high enough that the image quality of the inspection is not significantly degraded. For example, a plate beam splitter from Edmund Optics: www.edmundoptics.com / f / plate-beamsplitters / 12424 / has a surface quality of 80 to 50 and a surface flatness of 4 to 6λ.

[0057] Depending on the circumstances, instead of including a third optical reflector 730 in the device 100, the second image detector 520 may be further positioned along the third axis 930 in the negative direction from the chips 150, 151.

[0058] If the ambient light is insufficient, at least one light source is required – at least one first light source 210 or at least one fourth light source 240.

[0059] The second inspection position 820 further includes a second image detector 520, which is configured to capture an image of at least a portion of the second surface 660 of the dies 150, 151. The second image detector 520 includes a second light source 220, which is configured to cooperate with the third optical reflector 730 to provide direct illumination of the second surface 660 of the dies 150, 151.

[0060] The second image detector 520 can also be described as a direct image detector 520, in other words, a detector suitable for imaging using another light source. The second light source 220 can also be described as another light source 220, in other words, a light source suitable for producing direct light.

[0061] For example, as depicted, light from the second light source 220 is directed (310) to the third optical reflector 730 in the negative direction of the first axis 910. In other words, the second light source 220 provides a second illumination beam 310 when in use, which can also be described as a direct illumination beam 310.

[0062] For example, as depicted, the third optical reflector 730 is positioned at approximately a 45-degree angle to the optical axis 800, whereby light from the second light source 220 is received (310) and guided substantially parallel to the optical axis 800 to the second surface 660 of the dies 150, 151. The return light from the second surface 660 is received (310) substantially parallel to the optical axis 800 and guided (310) to the second image detector 520.

[0063] In the context of this invention, direct illumination of the second surface 660 means that light from the second light source 220 is received by the third optical reflector 730 and directed toward the second surface of the dies 150 and 151 in the positive direction of the third axis 930 (substantially parallel to the optical axis 800). The reflected and / or scattered light 310 from the second surface 660 of the dies 150 and 151 is guided along the third axis 930 in the negative direction substantially parallel to the optical axis 800 and coupled to the second image detector 520 by the third optical reflector 730.

[0064] In this example, the reflected and / or scattered light coupled to the image detector includes reflected and / or scattered direct illumination light. Alternatively, if one or more alternative light sources are used to illuminate the second surface 660, the reflected and / or scattered light coupled to the image detector may include reflected and / or scattered light from one or more alternative sources.

[0065] Depending on the circumstances, one or more optical elements, such as an objective lens, may be included in the second image detector 520. It may be advantageous for the second image detector 520 to be configured and set up to produce orthophotos of the following: ● At least a portion of the second side 660; ● At least a portion of 610 and 620 on the first side; ● At least a portion of the second side 630, 640; or ● Any combination thereof.

[0066] For example, the objective lens can be set and configured to be telecentric.

[0067] The first optical reflector 710 and the second optical reflector 720 are positioned along the first axis 910 on opposite sides of the grains 150 and 151, with each side facing one of the grain sides 610 and 630 respectively.

[0068] The first optical reflector 710 and the second optical reflector 720 are each configured and arranged to cooperate with the third optical reflector 730 to image at least a portion of one of the sides 610 and 630. For example, the first optical element 710 and / or the second optical element 720 may be a mirror or a beam deflector.

[0069] The third optical reflector 730 is further configured and arranged to cooperate with the first optical reflector 710 and the second optical reflector 720 to image at least a portion of each of the sides 610 and 630.

[0070] The second image detector 520 is further configured to capture at least a portion of the image of each of the sides 610 and 630. In conjunction with the third optical reflector 730, the second image detector 520 is further configured to provide direct illumination to each of the sides 610 and 630.

[0071] For example, as depicted, the third optical reflector 730 is positioned at approximately a 45-degree angle to further guide light from the second light source 220 substantially parallel to the optical axis 800 to the first optical reflector 710 and the second optical reflector 720. The first optical reflector 710 and the second optical reflector 720 guide light from the third optical reflector 730 to each of the two sides. The returning light from each side is received by the first optical reflector 710 or the second optical reflector 720 and is guided (310) to the third optical reflector 730 substantially parallel to the optical axis 800. The returning light from the third optical reflector 730 is guided (310) to the second image detector 520.

[0072] In the context of this invention, one or more sides of direct illumination means that light from the second light source 220 is received by the third optical reflector 730 and is also guided in a direction substantially parallel (310) to the positive direction of the optical axis 800 along the third axis 930 to the first optical reflector 710 and / or the second optical reflector 720. The reflected and / or scattered light 310 from the first optical reflector 710 and / or the second optical reflector 720 is guided along the third axis 930 in a direction substantially parallel to the negative direction of the optical axis 800 and coupled to the second image detector 520 via the third optical reflector 730.

[0073] In this example, the reflected and / or scattered light coupled to the image detector includes reflected and / or scattered direct illumination light. Alternatively, if one or more alternative light sources are used to illuminate one or more die sides 610, 630, the reflected and / or scattered light coupled to the image detector may include reflected and / or scattered light from one or more alternative sources.

[0074] The second inspection position 820 may further include one or more third light sources 230a, 230b, selected as appropriate, positioned between the second surface 660 of the grains 150, 151 and the third optical reflector 730. The third light sources 230a, 230b are set and configured to provide indirect illumination of the second surface 660 of the grains 150, 151 to aid in the observation of, for example, dust particles.

[0075] The angle can be predetermined and / or controlled to optimize the imaging of the particles. Alternatively, the distance from the second surface 660 of the grains 150, 151 can be predetermined and / or controlled to receive sufficient light energy on the second surface 660. Alternatively, the emitted wavelength can be predetermined and / or controlled to optimize the imaging of the particles.

[0076] If more than one third light source 230a, 230b is provided, the plurality of third light sources 230a, 230b can be set and configured in the same, similar and / or different ways. The plurality of third light sources 230a, 230b can be used simultaneously, alternately and / or intermittently.

[0077] For example, as depicted in Figure 2A, two LEDs or LED bars 230a and 230b can be used, which are symmetrically positioned around the second surface 660 of the inspected dies 150 and 151. For example, in the case where there is one LED / LED bar 230a and 230b on each side of the optical axis 800, as depicted, source "a" is on the left side of the observer's optical axis 800, and source "b" is on the right side of the observer's optical axis 800.

[0078] In the context of this invention, the indirect lighting component is positioned close to the optical axis 800 and close to the second surface 660, whereby at least a portion of the light is directed to the second surface 660 at a relative tilt angle.

[0079] Figure 5A depicts selected elements and topographic features of the grain inspection equipment 100 depicted in Figure 2A. For clarity, several elements and topographic features of Figure 2A related to the other light source 220 and the second image detector 520 are not depicted.

[0080] Grains 150 and 151 are positioned on optical axis 800, which extends in the direction of third axis 930. A longitudinal cross-section through first plane 860 is depicted, which includes second (or bottom) plane 660 of grains 150 and 151 and intersects optical axis 800.

[0081] A longitudinal cross-section through the second plane 830a is depicted, which includes (in use) a portion of the light from the third light source 230a. The second plane 830a intersects the third light source 230a, the first plane 860, and the optical axis 800. During use, a portion of the light from the third light source 230a is transmitted along the second plane 830a intersecting the second surface 660, thereby providing indirect illumination to the second surface 660. In the longitudinal cross-section through the first plane 860 and the second plane 830a, the angle between the first plane 860 and the second plane 830a is 45 degrees or less. It is advantageous to predetermine and / or control the angle of the longitudinal cross-section between the first plane 860 and the second plane 830a within the range of approximately 20 degrees to approximately 45 degrees.

[0082] A longitudinal cross-section through the third plane 830b is depicted, which includes (in use) a portion of the light from the third light source 230b. The third plane 830b intersects the third light source 230b, the first plane 860, and the optical axis 800. During use, a portion of the light from the third light source 230b is transmitted along the third plane 830b, which intersects the second plane 660, thereby providing indirect illumination to the second plane 660. In the longitudinal cross-section through the first plane 860 and the third plane 830b, the angle between the first plane 860 and the third plane 830b is 45 degrees or less. It is advantageous to predetermine and / or control the angle of the longitudinal cross-section between the first plane 860 and the third plane 830b within the range of approximately 20 degrees to approximately 45 degrees.

[0083] The light reflected and / or scattered from the second surface 660 includes light providing direct illumination and / or light providing indirect illumination. This light is reflected and / or scattered along the third axis 930 in a negative direction substantially parallel to the optical axis 800, and coupled to the second image detector (not depicted) via the third optical reflector 730. At least the following illumination modes can be used for inspection: ● Direct illumination of the second surface 660 is enabled, while indirect illumination 230a-b of the second surface 660 is not enabled. Direct illumination 310, via reflection and / or scattering, is coupled to the second image detector; or ● The direct illumination of the second surface 660 is activated, and the indirect illumination 230a-b of the second surface 660 is activated. The direct illumination 310 and the indirect illumination 230a-b, which are reflected and / or scattered, are coupled to the second image detector; or ● The direct illumination of the second surface 660 is not enabled, while the indirect illumination 230a-b of the second surface 660 is enabled and coupled to the second image detector via reflection and / or scattering.

[0084] These modes can be further combined with the lighting modes described below using tilt-compensated lighting.

[0085] The second inspection position 820 may further include one or more fourth light sources 240a to 240f, selected as appropriate, positioned along the third axis 930 in the negative direction from the third optical reflector 730. This can also be described as providing illumination 240a to 240f below the third optical reflector 730.

[0086] In such cases, the third optical reflector 730 may be further configured and positioned to be coupled to the fourth light sources 240a to 240f to provide tilt-compensated illumination, for example, by acting as a beam splitter.

[0087] In the context of this invention, tilt-compensated illumination comprises a plurality of light sources, thereby providing a larger set of incident angles on the grain surface and / or sides compared to direct illumination, thereby illuminating the non-uniform portions of the grain surface and / or sides.

[0088] Tilt-compensated illumination can be set and configured to provide predetermined and / or controlled incident angles of light from one or more fourth light sources 240a to 240f onto one or more sides of the grain. During the dicing process, some grain sides and edges may be diced unevenly. In order to provide satisfactory illumination for such uneven grain sides (or edges), tilt-compensated illumination can be predetermined and / or controlled to provide incident angles of side illumination corresponding to the expected side surface angles appearing on the diced grain sides.

[0089] The required angle of incidence can vary depending on the type of grain, the manufacturer, and the grain cutting process. The angle of incidence can be determined by measurement, estimation, simulation, or any combination thereof.

[0090] For example, as depicted, a plurality of LEDs or LED bars 240a to 240f extend along the direction of the first axis 910. For example, six LEDs / LED bars 240a to 240f may be suitable.

[0091] Figure 5B depicts selected elements and topographic features of the die inspection apparatus 100 depicted in Figure 2A. For clarity, several elements and topographic features of Figure 2A related to the other light source 220, the direct illumination of the second surface 660, the second image detector 520, and one or more third light sources 230a, 230b are not depicted. One or more fourth light sources 240a to 240f comprise six LED / LED rods 240a, 240b, 240c, 240d, 240e, 240f as depicted, with source "a" located on the left side of the observer optical axis 800 and source "f" located on the right side of the observer optical axis 800. Dies 150 and 151 are positioned on the optical axis 800, which extends in the direction of the third axis 930.

[0092] For clarity, only light from one or more fourth light sources 240a to 240f that passes through the third optical reflector 730 toward the first optical reflector 710 and is guided to the second side 620 of the dies 150, 151 is shown. Those skilled in the art will recognize that, in use, light 240a to 240f can also pass through the third optical reflector 730 toward the second optical reflector 720 in a similar manner and be guided by the second optical reflector 720 to the fourth side 640 of the dies 150, 151.

[0093] For clarity, the details of the direct lighting have been limited to arrow 310, which indicates the direct lighting on one or more sides of the main part of Figure 5B. However, in the enlarged view (depicted on the left), more details of the lighting on the second side 620 are depicted.

[0094] The light 310 from the second light source (not depicted) is received by the third optical reflector 730 and guided (310) in a positive direction of the third axis 930 substantially parallel (310) to the optical axis 800 to the first optical reflector 710 and / or the second optical reflector 720.

[0095] A longitudinal cross-section through the fourth plane 840a is depicted, which includes a portion of the light (in use) from the fourth light source 240a. The fourth plane 840a intersects with the fourth light source 240a, the first reflector 710, and the second side 620. During use, a portion of the light from the fourth light source 240a is transmitted along the fourth plane 840a, passes through the third optical reflector 730, is reflected and / or scattered by the first reflector 710, and intersects with the second side 620, thereby providing tilt-compensated illumination of the second side 620 near the second plane 660.

[0096] A longitudinal cross-section through the fifth plane 840f is depicted, which includes a portion of the light (in use) from the fourth light source 240f. The fourth plane 840f intersects with the fourth light source 240f, the first reflector 710, and the second side 620. During use, a portion of the light from the fourth light source 240f is transmitted along the fourth plane 840f, passes through the third optical reflector 730, is reflected and / or scattered by the first reflector 710, and intersects with the second side 620, thereby providing tilt-compensated illumination of the second side 620 near the first surface 660.

[0097] A longitudinal cross-section through the sixth plane 850a is depicted, which includes a portion of the light (in use) from another light source. During use, a portion of the light 310 from another light source (not depicted) is reflected and / or scattered along the sixth plane 850a from the third optical reflector 730, which intersects the first optical reflector 710. This portion of the light 310 is reflected and / or scattered by the first optical reflector 710 along the sixth plane 850a to intersect the second side 620, thereby providing direct illumination of the second side 620 near the second surface 660.

[0098] A longitudinal cross-section through the seventh plane 850b is depicted, which includes a portion of the light from another light source (in use). During use, a portion of the light 310 from the other light source (not depicted) is reflected and / or scattered along the seventh plane 850b from the third optical reflector 730, which intersects the first optical reflector 710. This portion of the light 310 is reflected and / or scattered by the first optical reflector 710 along the seventh plane 850b to intersect with the second side 620, thereby providing direct illumination to the second side 620 near the first plane 650.

[0099] The light reflected and / or scattered from the second side 620 includes light that provides direct illumination and / or light that provides tilt compensation illumination. This light is reflected and / or scattered from the first optical reflector 710 and guided along the third axis 930 in a negative direction substantially parallel to the optical axis 800, and coupled by the third optical reflector 730 to the second image detector (not depicted). At least the following lighting modes can be used for inspection: direct illumination of the second side 620 is enabled, tilt compensation illumination 240a to 240f of the second side 620 is not enabled, and direct illumination 310 is coupled to the second image detector via reflection and / or scattering; or direct illumination of the second side 620 is enabled, tilt compensation illumination 240a to 240f of the second side 620 is enabled, and direct illumination 310 and tilt compensation illumination 240a to 240f are coupled to the second image detector via reflection and / or scattering; or direct illumination of the second side 620 is not enabled, tilt compensation illumination 240a to 240f of the second side 620 is enabled, and tilt compensation illumination 240a to 240f is coupled to the second image detector via reflection and / or scattering.

[0100] Indirect lighting can be used to further combine these patterns with the lighting patterns described above.

[0101] In the longitudinal cross-section passing through the fourth plane 840a and the sixth plane 850a, the angle of incidence of the tilt-compensated illumination on the second side 620 is greater than the angle of incidence of the direct illumination on the second side 620. In other words, the angle between the fourth plane 840a and the sixth plane 850a can be 5 degrees or greater. It is advantageous to predetermine and / or control the angle of the longitudinal cross-section between the fourth plane 840a and the sixth plane 850a within the range of approximately 5 degrees to approximately 15 degrees.

[0102] In the longitudinal cross-section passing through the fifth plane 840b and the seventh plane 850b, the angle of incidence of the tilt-compensated illumination on the second side 620 is greater than the angle of incidence of the direct illumination on the second side 620. In other words, the angle between the fifth plane 840b and the seventh plane 850b can be 5 degrees or greater. It is advantageous to predetermine and / or control the angle of the longitudinal cross-section between the fifth plane 840b and the seventh plane 850b within the range of approximately 5 degrees to approximately 15 degrees.

[0103] Figure 2B depicts another view of the second inspection position 820 in a plane comprising: a first axis 910 having a positive direction from left to right; and a second axis 920 having a positive direction from bottom to top. A third axis 930 has a positive direction of entry into the page. It schematically represents a transverse cross-section through the grain inspection device 100 at the second inspection position 820.

[0104] This is a view of the approximately square grain 150 when inspected at the second inspection position 820. The square grain 150 is depicted with the second grain face 660 facing forward. The grain attachment portion 130 is hidden in Figure 2B. For clarity, the third light sources 230a, 230b, the fourth light source 240, and the third optical reflector 730 are not depicted in Figure 2B. This view can also be described as being viewed in the positive direction along the third axis 930 towards the bottom face 660 of the square grain 150.

[0105] After being attached to the square die 150, the die attachment portion 130 is configured and positioned to move 925 in the direction of the second axis 920. A small degree of movement along the first axis 910 is possible when the die 150 is positioned between the first optical reflector 710 and the second optical reflector 720. However, more substantial movement along the first axis 910 is only possible after the square die 150 has moved from the second inspection position 820 in the direction of the second axis 920 and / or in the direction of the third axis 930.

[0106] The second light source 220 can be activated to provide direct illumination 310 to the second surface 660 and each of the two grain sides, thereby reflecting and / or scattering the light of the suitable composition from the second surface 660 and each of the two grain sides toward (310) the second image detector 520. The illumination light and the reflected and / or scattered light are redirected by the third optical reflector 730 and the first optical reflector 710 or the second optical reflector 720.

[0107] One or more inspection images are then composed of at least a portion of the second surface 660 and each of the two grain sides of the square grain 150.

[0108] Depending on the situation, third light sources 230a and 230b may be activated to provide an appropriate level of indirect illumination. Alternatively, a fourth light source 240 may be activated to provide an appropriate level of tilt-compensated illumination.

[0109] Generally, each type of illumination provides a different type of image. For example, indirect illumination from third light sources 230a and 230b typically produces an image in which the edges of grains 150 and 151 are identifiable. Similarly, tilt-compensated illumination from a fourth light source 240 typically produces an image in which defects on the sides (or sides) of grains 150 and 151 are identifiable.

[0110] Advantageously, providing two or more types of lighting allows for a wide range of inspection types.

[0111] The lighting mode and / or focus settings can be preset and / or controlled to allow inspection of both surface defects and / or internal defects.

[0112] To complete the inspection at the second inspection position 820, the square die 150 can be rotated 90 degrees or 270 degrees (or multiples of 90 degrees and / or 270 degrees) at the second inspection position 820 by rotating the die attachment portion 130 around the third axis 930. In addition, one or more inspection images are composed of the other two die sides 610 and 630 of the square die 150.

[0113] If the distance between the side of the square die 150 and the first optical element 710 and the second optical element 720 is too small for safe rotation, the die attachment portion 130 can move in the negative direction along the third axis 930. This moves it away from the first optical reflector 710 and the second optical reflector 720. When sufficient space exists, the square die 150 can be rotated 90 degrees by rotating the die attachment portion 130 about the third axis 930. Finally, the die attachment portion 130 can move in the positive direction along the third axis 930, thereby moving the square die 150 back to the second inspection position 820; and / or the die attachment portion 130 can move in the positive or negative direction along the second axis 925. When sufficient space exists, the square die 150 can be rotated approximately 90 degrees (or multiples of 90 degrees) by rotating the die attachment portion 130 about the third axis 930. Finally, the grain attachment portion 130 can move the square grain 150 back to the second inspection position 820 along the second axis 925.

[0114] For example, the device can be set and configured to move the die 150 by 2 mm to 10 mm along the third (or Z) axis 930.

[0115] Alternatively, the device may be set and configured to move the die 150 by 10 mm to 60 mm along the second (or Y) axis 920.

[0116] Generally speaking, if the distance between the first optical reflector 710 and the second optical reflector 720 is greater than the maximum diagonal dimension of the grain 150 in the plane containing the surfaces 650 and 660 of the grain 150, then a safe rotation system is possible.

[0117] The amount of rotation is predetermined and / or controlled to allow rotation between one or more sides; that is, for a four-sided grain, a rotation of approximately 90 degrees (or a multiple of 90 degrees) is appropriate. For grains with a different number of sides, such as hexagonal grains, the amount of rotation can be predetermined and / or controlled to a suitable degree, such as approximately 45 degrees (or a multiple of 45 degrees).

[0118] Preferably, the grain attachment portion 130 is configured and positioned to provide full rotation, allowing imaging of any side in any order.

[0119] Image quality can be further improved by providing small-angle corrections relative to the nominal rotation. For example, corrections within + / - 2 degrees of rotation relative to the nominal rotation can be provided.

[0120] Depending on the circumstances, it may be advantageous to determine the rotational error during the inspection of the second (bottom) grain surface 660 - and then apply appropriate correction when the side (or side) 610, 620, 630, 640 with rotational error is inspected.

[0121] In principle, when one or more images are generated using the second image detector 520, three main optical distances from the second image detector 520 will exist to take into account the focal point. It is assumed that the faces and sides in the optical path and the optical elements are optimally aligned and perpendicular where appropriate.

[0122] The main distance is to one of the second face 660 of the grain 150, to one side of the grain 150, and to the other side of the grain 150.

[0123] The die inspection equipment 100 can be set and configured to position the die 150 at substantially equal distances to the first optical element 710 and the second optical element 720. Therefore, the primary distance subsequently extends to the second surface 660 of the die 150 and to each side of the die 150.

[0124] Choosing the focal point for most accurate side resolution can be advantageous. In some grain handling and / or processing systems, side damage can be a major cause of defects on the second surface 660. Inspection of the second surface 660 is acceptable under poor lighting and / or more blurred imaging conditions because it can be performed with a single image without requiring mechanical, electrical, or optical changes to the optical path length.

[0125] It is advantageous to configure the die inspection equipment 100 such that the distance between the side of the square die 150 and the first optical element 710 and the second optical element 720 is kept as small as possible. This can further reduce the image quality difference between the side of the die 150 and the second surface 660.

[0126] Figure 3 depicts a sample image acquired using the setup shown in Figures 2A, 2B, or 2C. The upper left and right sides are two regions 1610 and 1630 of the image of sides 610 and 630 (also depicted in Figure 1C). These are in focus because they are constructed using an inspection apparatus configured to provide the sides 610 and 630 of the grains 150 and 151 at substantially equal distances from the first optical reflector 710 and the second optical reflector 720. Additionally, the center is a single region 1660, which is an image of the second (or bottom) surface 660 of the grains 150 and 151. Compared to the side images, this image 1660 is unfocused and not uniformly illuminated.

[0127] The grain inspection device 100 can be set and configured to inspect a generally rectangular grain 151, as depicted in FIG1C. The rectangular grain 151 includes two shorter sides 610, 630 and two longer sides 620, 640.

[0128] Figure 2C depicts another view of the second inspection position 820 in a plane, which includes: a first axis 910 having a positive direction from left to right; and a second axis 920 having a positive direction from bottom to top. A third axis 930 has a positive direction for entering the page.

[0129] This is the same view depicted in Figure 2B, except that a roughly rectangular grain 151 is inspected at the second inspection position 820. One of the longer sides 620 faces the first optical reflector 710. The other longer side 640 faces the second optical reflector 720.

[0130] In the orientation depicted in Figure 2C, one or more inspection images are then composed of at least a portion of the second surface 660 and each of the two sides 620, 640 of the rectangular grain 151.

[0131] To complete the inspection at the second inspection position 820, the rectangular die 151 must be rotated ninety degrees. This is depicted in Figure 2D, which is the same view as Figure 2C, except that the rectangular die 151 has been rotated ninety degrees around the third axis 930. The longer sides 620 and 640 no longer face the first optical reflector 710 and the second optical reflector 720. The shorter sides 610 and 630 now face the first optical reflector 710 and the second optical reflector 720, respectively.

[0132] This example is similar to the specific example depicted in Figure 2B - there is sufficient space between the first optical reflector 710 and the second optical reflector 720 to allow the rectangular grain 151 to rotate without the grain 151 moving significantly in the direction 925 of the second axis 920 and / or in the direction of the third axis 930.

[0133] Generally speaking, if the distance between the first optical reflector 710 and the second optical reflector 720 is greater than the maximum diagonal dimension of the grain 151 in the plane containing the grain 151 faces 650 and 660, then a safe rotation system is possible.

[0134] When the second image detector 520 is used to inspect the rectangular die 151, three main optical distances from the second image detector 520 are considered to determine the focal point. It is assumed that the faces and sides of the optical path and the optical elements are optimally aligned and, where appropriate, perpendicular. The main distances are to one of the second face 660 of the die 150, to one of the shorter sides 610 and 630 of the die 150, and to the longer sides 620 and 640 of the die 150.

[0135] After the inspection process is completed and images of all six faces / sides are created, the grains can be further inspected, processed, and disposed of, either completely or partially, by repeating the inspection process described above or any combination thereof.

[0136] If the die inspection equipment 100 is included in a device for handling and / or processing dies, such as a die bonder, then the die attachment portion 130 can carry the dies 150, 151 to another handling and / or processing location.

[0137] The first optical reflector 710 and the second optical reflector 720 can be considered to provide a channel or pathway oriented generally parallel to the second axis 920, thus advantageously allowing other disposal and / or processing positions to be positioned along the second axis 920 away from the second inspection position 820. This avoids one or more additional movements along the third axis 930 that could reduce processing volume.

[0138] Figures 4A and 4B depict the second inspection position 820 included in another grain inspection device 110.

[0139] Figures 4A and 4B are the same as Figures 2A and 2B, except that another die inspection device 110 includes a fourth optical reflector 740 and a fifth optical reflector 750. Dies 150 and 151 are positioned between the first optical reflector 710, the second optical reflector 720, the fourth optical reflector 740, and the fifth optical reflector 750, thereby positioning two opposite sides 610 and 630 to face the first optical reflector 710 and the second optical reflector 720, respectively, and positioning the other two opposite sides 620 and 640 to face the fourth optical reflector 740 and the fifth optical reflector 750, respectively. Additionally, dies 150 and 151 are not shown in Figure 4A, as they are obscured by the fourth optical reflector 740.

[0140] Another die inspection device 110 is the same as die inspection device 100, except that the first optical reflector 710, the second optical reflector 720, the fourth optical reflector 740, and the fifth optical reflector 750 can be regarded as a providing box rather than a channel. In addition, the movement of dies 150 and 151 into or out of the second inspection position requires a certain degree of movement along the third axis 930 to avoid possible collisions between dies 150 and 151 and one or more optical reflectors 710, 720, 740, and 750; and one or more inspection images can be composed of at least a portion of the second surface 660 and each of the four sides 610, 620, 630, and 640 of dies 150 and 151.

[0141] Although the square grain 150 is depicted in Figure 4B, optical reflector boxes 710, 720, 740, and 750 can be arranged and configured to provide sufficient space for the rectangular grain 151. Alternatively, the optical reflector boxes can be modified to provide rectangular optical reflector boxes 710, 720, 740, and 750.

[0142] Another die inspection device 110 can therefore be set up and configured to achieve a throughput similar to or even higher than that described in the specific instance of die inspection device 510, since no further movement is required to create images of all faces and sides.

[0143] In known systems that use reflective elements such as mirrors for side imaging, the focal point used is often a compromise between the bottom surface of the grain and the side focal point, in which the user is forced to accept at least one degraded image.

[0144] Depending on the degree of deviation from the square grain, it may be advantageous to modify one or more focusing parameters to optimize the image focusing on the side of the grain inspection apparatus as described herein. For example, by one or more of the following: (A): A second image detector 520 includes an adjustable objective lens 525, also described as an adjustable optics element 525, which is set and configured such that the focal length of the adjustable optics element 525 is suitable for the distance from the optics element 525 to the surface or side of the grain being inspected. For lenses with a non-negligible thickness, the focal length can be considered as the distance from the focal plane to the vertex of the optical surface in front of the optics element 525. The required focal length range depends on the setup and configuration of one or more elements in the device, such as one or more optical paths, the type of adjustable optics element, and the design of the adjustable optics element. For example, a possible focal length range (or z-range) may be approximately 22 mm, with a minimum working distance of approximately 54 mm and a maximum working distance of approximately 77 mm. And / or if the second image detector 520 is set and configured to be movable in the direction of the first axis 910, whereby the optical path length between the second image detector 520 and the grains 150, 151 increases or decreases depending on the surface or side being imaged; (B): The adjustable optical element 525 is set and configured to move in the direction of the first axis 910, thereby adjusting the optical path length between the optical element 525 and the chips 150, 151 to increase or decrease depending on the imaged surface or side; (C): The first optical reflector 710 and / or the second optical reflector 720 are configured to be movable in the direction of the first axis 910, thereby increasing or decreasing the optical path length depending on the side being imaged. In use, the first optical reflector 710 can be positioned relative to the first side 620 or the second side 620. In use, the second optical reflector 720 can be positioned relative to the third side 630 or the fourth side 640; (D): The fourth optical reflector 740 and / or the fifth optical reflector 750 are configured to be movable in the direction of the second axis 920, thereby increasing or decreasing the optical path length depending on the side being imaged; Or any combination of (A), (B), (C) or (D).

[0145] Preferably, one or more suitable motors are provided, through which the control software can set the position of each motor.

[0146] The range of motion can be predetermined and / or controlled to compensate for possible variations in the length of the sides of the die. For rectangular dies, three focal positions may be required. For one or more movable elements, a range of motion of approximately 20 mm to 30 mm may be advantageous.

[0147] For example, a liquid lens can be provided as an adjustable optical element 525, the shape of which can be electrically controlled, and the shape determines the focal length of the optical element 525. For example, refocusing with the liquid lens can take only tens of milliseconds, which is typically faster than any complex mechanical grain movement that can be performed. The focusing time may be approximately 20 ms.

[0148] Suitable liquid lenses can include "tunable acoustic gradient refractive index" (TAG) lenses. These are adaptive optics filled with fluid and driven by acoustic waves. The induced rapid refractive index change produces lenses with a focal length that can be tuned at kHz rates, used for imaging and beamforming. Research from the Arnold Group at Princeton University can be found at: spikelab.mycpanel.princeton.edu / research / TAG_lens.html.

[0149] Suitable liquid lenses may include Optotune focusable lenses. These are shape-changing lenses based on polymer thin-film technology and high-performance optical fluids. They can be manually or electrically actuated. The transmission range is, for example, 240 nm to 2500 nm. The operating temperature range is, for example, -40°C to +85°C and higher. More details and specifications can be found at: www.optotune.com / focus-tunable-lenses. For example: Product Description Light aperture (mm) Size Ø x H (mm) Lens type Optical power range (dpt) Refractive index Electrically adjustable lens 3 10 x 4.0 From plano-convex to plano-concave -13 to +13 1.300 Electrically adjustable lens 10 30 x 9.7 plano-convex +8.3 to +20 1.300 Electrically adjustable lens 10 30 x 20.7 Plano-convex (compensation lens may be selected depending on the situation) +5 to +10 -1.5 to +3.5 1.300 Electrically adjustable lens 10 42 x 41 Plano-convex + plano-concave compensation lens with optical feedback (OF) -2 to +2 1.300 Electrically adjustable lens 16 40 x 11.9 From plano-convex to plano-concave -2 to +3 1.300 Manually adjustable lens 20 37 x 13.2 From plano-convex to plano-concave -18 to +18 1.38

[0150] Suitable liquid lenses may also include Corning Varioptic lenses. These lenses rely on the principle of electrowetting, where the interface between two liquids is modified when a voltage is applied. This eliminates moving parts, resulting in faster focusing. These lenses can be used in industrial applications requiring stable, accurate, fast, and long-lasting lenses. More details and specifications can be found at: www.corning.com / emea / de / innovation / corning-emerging-innovations / corning-varioptic-lenses / variable-focus-lenses-a-series.html

[0151] Therefore, in summary, this provides inspection equipment that allows for high-speed image detection suitable for inline use. Up to five faces and sides can be accurately and quickly imaged at a single inspection location using a single image detector. A sixth face / side can be inspected just before attachment to the die attachment point.

[0152] Compared to known systems, this requires up to five additional imaging systems, each containing an image detector, objective lens, and coaxial illumination, which is more expensive and difficult to calibrate.

[0153] The dimensions of the grains 150 and 151, which can be inspected by the inspection system described in this invention, depend on one or more characteristics, including:

[0154] 1. The field of view (FOV) of the objective lens is included in the second image detector 520. For example, the field of view of a liquid lens objective lens. Preferably, the FOV is predetermined and / or controlled to include a combination of the second grain surface 560 and two or four grain sides 610, 620, 630, 640. For currently available objectives with liquid lenses, the objective lens diameter can be several tens of millimeters. In the inspection apparatus described in this invention, the objective lens diameter can be any suitable size. For example, approximately 21 mm or approximately 42 mm.

[0155] 2. The usable working range of the objective lens included in the second image detector 520. For example, the working range of a liquid lens objective lens. A shorter working distance can be used to inspect the second surface 560 of the grain. A longer working distance may be required to inspect the side. Currently, liquid lenses can be used, where the z-range is at most 350 mm. In the inspection apparatus described in this invention, the z-range is estimated to be approximately 18 mm.

[0156] 3. Dimensions of the optical reflector housings 710, 720, 740, and 750 depicted in Figures 4A and 4B. The optical reflectors are preferably extended sufficiently to image the entire side of the sensor. In the inspection apparatus described in this invention, sides with dimensions up to 3.29 × 22.56 mm² can be inspected.

[0157] Furthermore, the spacing between the optical reflectors is preferably at least as large as the width of the dies 150 and 151. For the optical reflector housings 710, 720, 740, and 750 depicted in Figures 4A and 4B, setting the spacing between the optical reflectors 710, 720, 740, and 750 to be at least as large as the diagonal of the dies 150 and 151 improves the speed of complete inspection. This allows the dies 150 and 151 to rotate around the third axis 930 without removing them from the optical reflector housing.

[0158] In the inspection apparatus described in this invention, the spacing between optical reflectors 710, 720, 740, and 750 is estimated to be approximately 9 mm.

[0159] In practice, a minimum tolerance, for example, approximately 0.5 mm, can be predetermined and / or controlled between the edges of dies 150, 151 and optical reflectors 710, 720, 740, 750. This can also be described as a clearance. Any suitable tolerance can be used, predetermined and / or controlled to compensate for inaccuracies during operation, including placement inaccuracies, deviations in the size of dies 150, 151, and / or their position on the wafer. If the size of dies 150, 151 is extremely constant and / or the positional accuracy is relatively high, the minimum tolerance used can be reduced.

[0160] A time constraint analysis was performed on the bonding process, which includes six-sided inspection (Link). For the optical reflector boxes 710, 720, 740, and 750 depicted in Figures 4A and 4B, the cycle time for the entire pick-up and bonding process is estimated to be between 360 ms and 490 ms, depending on the size of the dies 150 and 151 and their positions on the wafer. In contrast, any time spent adjusting the focus of the objective lens using a liquid lens is estimated to contribute approximately 20 ms to each refocusing step.

[0161] Although the foregoing description describes inspections at first and second inspection positions, those skilled in the art will recognize that this order can be reversed. For example, after inspection at the second position, the die may be moved to the first position where at least part of the die's top surface is inspected, or the die may be released within the imaging range of an image detector. Alternatively, inspection of the die's top surface may be performed before or after bonding.

[0162] Furthermore, those skilled in the art will recognize that the positions of the components depicted in the figures are merely examples and not to scale. Alternatively or concurrently, the positions of one or more components may be interchanged while maintaining the optical relationships. For example, in Figure 2A, the positions of the fourth light source 240 and the second image detector 520 may be interchanged.

[0163] Those skilled in the art will recognize that the specific examples of square or rectangular grain manipulation described in this invention can be set and configured to manipulate grains with very different planar shapes and numbers of sides (generally including triangular, pentagonal, hexagonal, heptagonal, octagonal, nonagonal, decagonal, or any polygonal shape). The nominal rotation applied about a third (or Z-axis) to move between the sides used for imaging is primarily determined by the planar shape of the grain and, in particular, by the number of sides.

[0164] Similarly, specific instances can be set up and configured to operate with grains having multiple faces, such as six faces and / or cubic and / or approximately cubic shapes. The main technical difference between faces and sides is their relative size, and sides may be less flat due to cutting or other processing actions.

[0165] The die inspection equipment described above can be implemented as a stand-alone inspection device. One or more functions of the die inspection equipment can be implemented in a device set up and configured for handling and / or processing of dies, such as a die bonder.

[0166] The die inspection equipment can be fully or partially integrated into the design of this die processor / processor, or an existing die processor / processor can be upgraded by integrating one or more functions. Those skilled in the art can further optimize the die inspection equipment using instructions provided elsewhere in this invention to minimize any loss of throughput.

[0167] As described above, the optical path length can be further modified by providing movement of one or more optical elements in conjunction with adjusting the focal length using adjustable optical elements. However, it may also be advantageous to use one or more of these movements instead of adjusting the focal length using adjustable optical elements.

[0168] In other words: an apparatus (100, 110) for inspecting dies (150, 151), wherein the dies (150, 151) include a first surface (650) and an opposing second surface (660); a first side (610) and an adjacent second side (620); and a third side (630) and an adjacent fourth side (640); wherein the first side (610) is opposite to the third side (630), the second side (620) is opposite to the fourth side (640), and each side (610, 620, 630, 640) is adjacent to the first surface (650) and the second surface (660). 660); wherein the device (100) includes another light source (220) configured to provide a direct illumination beam (310) in use and to direct at least a portion of the illumination beam (310) to a second surface (660), a first optical reflector (710) and a second optical reflector (720); wherein the first optical reflector (710) is configured to direct a portion of the illumination beam (310) to a first side (610) in use; and to receive at least a portion of the illumination beam reflected and / or scattered back from the first side (610). and directs at least a portion of the reflected and / or scattered illumination beam to a second image detector (520), wherein the second image detector (520) is configured and arranged to image at least a portion of the first side (610); wherein the second optical reflector (720) is configured and arranged to direct a portion of the illumination beam (310) to a third side (630) in use; receives at least a portion of the illumination beam reflected and / or scattered back from the third side (630); and directs at least a portion of the reflected and / or scattered illumination beam to the second image detector (520). 20), wherein the second image detector (520) is further configured to image at least a portion of the third side (630); wherein the second image detector (520) is configured to image at least a portion of the second surface (660); at least a portion of the first side (610); and at least a portion of the third side (630); the devices 100, 110 further include one or more optical elements configured to be movable, thereby increasing or decreasing the optical path length of the chips 150, 151.

[0169] The movable optical element may include: a second image detector 520, which is configured to be movable to increase or decrease the optical path length between the second image detector 520 and the chips 150, 151; or an adjustable optical element 525, which is configured to be movable to increase or decrease the optical path length between the adjustable optical element 525 and the chips 150, 151; or a first optical reflector 710, which is configured to be movable to increase or decrease the optical path length between the second image detector 520 and the first side 610 and / or the second side 620; or a second optical reflector 720, which is configured to be movable to increase or decrease the optical path length between the second image detector 520 and the third side 630 and / or the fourth side 640; or any combination thereof.

[0170] Figures 6A and 6B depict the second inspection position 820 included in another grain inspection device 120.

[0171] Figures 6A and 6B are the same as Figures 4A and 4B, except that another die inspection device 120 includes a first optical reflector 710. The other die inspection device 120 does indeed include a second optical reflector 720, a third optical reflector 730, or a fourth optical reflector 740. Dies 150 and 151 are positioned adjacent to the first optical reflector 710, thereby positioning a first side 610 facing the first optical reflector 710. Moving dies 150 and 151 into or out of the second inspection position may require movement along the third axis 930 to avoid potential collisions between dies 150 and 151 and one or more optical reflectors 710. One or more inspection images may consist of at least a portion of the second surface 660 and each of the four sides 610, 620, 630, and 640 of dies 150 and 151.

[0172] Figures 7A and 7B are the same as Figures 4A and 4B, except that another die inspection device 130 includes a first optical reflector 710 and a fifth optical reflector 750. Dies 150 and 151 are positioned adjacent to the first optical reflector 710 and the fifth optical reflector 750, thereby positioning two adjacent sides 610 and 640 facing the first optical reflector 740 and the fifth optical reflector 750, respectively. Moving dies 150 and 151 into or out of the second inspection position may require movement along the third axis 930 to a certain extent to avoid possible collisions between dies 150 and 151 and one or more optical reflectors 710 and 750. One or more inspection images may consist of at least a portion of the second surface 660 and each of the four sides 610, 620, 630, and 640 of dies 150 and 151.

[0173] 100, 110, 120: Grain inspection equipment 130: Grain inspection equipment / Grain attachment part 150: Roughly square grain / component / grain as a component 151: Roughly rectangular grains / components / grains as components 210: First Light Source 220: Second light source 230a, 230b: Third light source / LED / LED rod / Indirect lighting 240: Illumination / Fourth Light Source 240a, 240b, 240c, 240d, 240e, 240f: Fourth light source / LED / LED rod / light / tilt compensation lighting 310: First illumination beam / guide / second illumination beam / direct illumination beam / receiver / arrow / reflected and / or scattered light 510: First Image Detector 520: Second Image Detector / Direct Image Detector 525: Adjustable optics / adjustable objective lens 610: First side / Shorter side / First grain side 620: Second side / Longer side / Second grain side 630: Third side / Shorter side / Third grain side 640: Fourth side / Longer side / Fourth grain side 650: First grain face / top face 660: Second grain surface / bottom surface / second surface 700: Optical Axis 710: First optical reflector / optical reflector box / first optical element 720: Second optical reflector / optical reflector box / second optical element 730: Third optical reflector / third optical element 740: Fourth optical reflector / optical reflector box 750: Fifth optical reflector / optical reflector box 800: Optical axis 810: First inspection position 820: Second inspection position 830a: The second plane containing a portion of the light from the third light source 230a. 830b: The third plane containing a portion of the light from the third light source 230b. 840a: The fourth plane containing a portion of the light from the fourth light source 240a. 840b: Third plane 840f: The fifth plane containing a portion of the light from the fourth light source 240b. 850a: The sixth plane containing a portion of the light from the first light source 220 850b: The seventh plane containing a portion of the light from the first light source 220. 860: The first plane containing the second face 910: First axis (X) 915: Move along the first axis (X) 920: Second axis (Y) 925: Direction / Move along the second axis (Y) 930: Third axis (Z) 935: Move along the third axis (Z) 1610: First image of the area / side 1630: Second image of the area / side 1660: Third image of a single region / area

Claims

1. An apparatus (100, 110) for inspecting components (150, 151), wherein the components (150, 151) comprise: a first surface (650) and an opposing second surface (660); a first side (610) and an adjacent second side (620); and a third side (630) and an adjacent fourth side (640); wherein the first side (610) and the third side (630) are opposite each other, the second side (620) and the fourth side (640) are opposite each other, and each side (610, 620, 630, 640) is adjacent to the first surface (650) and the second surface (660); wherein the apparatus (100) comprises a light source (220) configured and arranged to provide an illumination beam (310) in use and to direct at least a portion of the illumination beam (310) to the second surface (660), a first optical reflector (710) and a second optical reflector (720); The first optical reflector (710) is configured to direct a portion of the illumination beam (310) to the first side (610) during use; receive at least a portion of the illumination beam reflected and / or scattered from the first side (610); and direct at least a portion of the reflected and / or scattered illumination beam to a second image detector (520), wherein the second image detector (520) is configured to image at least a portion of the first side (610); wherein the second optical reflector (720) is configured to direct a portion of the illumination beam (310) to the third side (630) during use; receive at least a portion of the illumination beam reflected and / or scattered from the third side (630); and direct at least a portion of the reflected and / or scattered illumination beam to the second image detector (520), wherein the second image detector (520) is further configured to image at least a portion of the third side (630); The second image detector (520) is configured to image at least a portion of the second surface (660); and / or at least a portion of the first side (610); and / or at least a portion of the third side (630); wherein the device (100, 110) is configured to rotate the component (150, 151) or the first optical reflector (710) and the second optical reflector (720), thereby changing the two opposite sides (610, 630, 620, 640) from facing the first optical reflector (710) and the second optical reflector (720) respectively from the first pair of opposite sides (610, 630) to facing the first optical reflector (710) and the second optical reflector (720) respectively from the second pair of opposite sides (620, 640) to facing the first optical reflector (710) and the second optical reflector (720) respectively.

2. The device of claim 1, wherein the device (100, 110) is further configured and set to increase and / or decrease to one of the optical path lengths of the component (150, 151) in use.

3. The device of claim 1 or claim 2, wherein the second image detector (520) further includes an adjustable optical element (525) configured and arranged to: adapt the focal length of the optical element (525) to the distance from the optical element (525) to the second surface (660); and adapt the focal length of the optical element (525) to the distance from the optical element (525) to the first side (610) and to the third side (630).

4. The device as claimed in claim 3, wherein the adjustable optical element (525) is a liquid lens, an electrically adjustable lens, or a manually adjustable lens.

5. The device of claim 1, wherein the second image detector (520) is set and configured to generate orthophotos of at least a portion of the second side (660); at least a portion of the first side (610); at least a portion of the third side (630); or any combination thereof.

6. The device of claim 1, wherein the device (100, 110) further comprises a third optical reflector (730) configured and arranged to receive at least a portion of a direct illumination beam (310) from another light source (220) in use; and to direct at least a portion of the direct illumination beam (310) to the second surface (660), the first optical reflector (710) and the second optical reflector (720).

7. The device of claim 1, wherein the device (100, 110) is set and configured to rotate the component (150, 151).

8. The device of claim 7, wherein the device (100, 110) is further configured to move the member (150, 151) away from the first optical reflector (710) and the second optical reflector (720) before the member (150, 151) rotates; and to move the member (150, 151) toward the first optical reflector (710) and the second optical reflector (720) after the member (150, 151) rotates.

9. The device as requested in item 1, wherein the second face (660) is the bottom face.

10. The device of claim 1, wherein the component (150, 151) to be inspected has a longitudinal component cross-section that is generally square, generally rectangular, generally hexagonal or generally polygonal.

11. The device of claim 1, wherein the device (100, 110) further includes one or more other light sources (230a, 230b) configured and arranged to provide indirect illumination to the second surface (660); wherein the second surface (660) is contained in the first plane (860); The second plane (830a, 830b) intersects with the optical axis (800), the first plane (860), and the one or more other light sources (230a, 230b); In this way, during use, at least a portion of the light from the one or more other light sources (230a, 230b) is transmitted along the second plane (830a, 830b) to intersect with the second surface (600); The angle between the longitudinal cross-section of the first plane (860) and the second plane (830a, 830b) is 45 degrees or less.

12. The device of claim 11, wherein the angle of the longitudinal cross section between the first plane (860) and the second plane (830a, 830b) is in the range of 20 degrees to 45 degrees.

13. The apparatus of claim 1, wherein the apparatus (100, 110) further comprises one or more tilt-compensated light sources (240a to 240f) configured to provide tilt-compensated illumination of the first side (610); wherein a third plane (840a, 840b) intersects the first side (610) and the one or more tilt-compensated light sources (240a to 240f); thereby, during use, at least a portion of the light from the one or more tilt-compensated light sources (240a to 240f) is transmitted along the third plane (840a, 840b) to intersect with the first side (610); wherein, During use, at least a portion of the light from the other light source (220) is transmitted along a fourth plane (850a, 850b) to intersect with the first side (610).

14. The device of claim 13, wherein the angle of the longitudinal cross section between the third plane (840a, 840b) and the fourth plane (850a, 850b) is in the range of -45 degrees to 45 degrees.

15. The device of claim 1, wherein the second image detector (520) is configured to be movable, thereby increasing or decreasing the optical path length between the second image detector (520) and the component (150, 151); or the adjustable optical element (525) is configured to be movable, thereby increasing or decreasing the optical path length between the adjustable optical element (525) and the component (150, 151); or the first optical element... The reflector (710) is configured to be movable, thereby increasing or decreasing the optical path length between the second image detector (520) and the first side (610) and / or the second side (620); or the second optical reflector (720) is configured to be movable, thereby increasing or decreasing the optical path length between the second image detector (520) and the third side (630) and / or the fourth side (640); or any combination thereof.

16. The apparatus of claim 2, wherein the other light source (220) is further configured and arranged to direct at least a portion of the direct illumination beam (310) to a fourth optical reflector (740) and a fifth optical reflector (750) in use; wherein the fourth optical reflector (740) is configured and arranged to direct at least a portion of the direct illumination beam (310) to the second side (620) in use; and to receive at least a portion of the illumination beam reflected from the second side (620); and to direct at least a portion of the reflected illumination beam to the second image detector (520), wherein the second image detector (520) is further configured and arranged to image at least a portion of the second side (620); The fifth optical reflector (750) is configured to, in use, direct a portion of the direct illumination beam (310) to the fourth side (640); receive at least a portion of the illumination beam reflected from the fourth side (640); and direct at least a portion of the reflected illumination beam to the second image detector (520), wherein the second image detector (520) is further configured to image at least a portion of the fourth side (640); wherein the second image detector (520) is further configured to image at least a portion of the second side (620) and at least a portion of the fourth side (640); wherein the adjustable optical element (525) is further configured to: adapt the focal length of the adjustable optical element (525) to the distance from the optical element (525) to the second side (620) and to the fourth side (640).

Images