The electro-conductive contact pin

Abstract

The present invention provides a conductive contact needle with further improved physical or electrical properties.

Description

[Technical Field]

[0001] This invention relates to a conductive contact needle. [Previous Technology]

[0002] A conductive contact pin is a contact pin that comes into contact with the object being tested to perform testing on the object. The conductive contact pin can be used in a probe card or a test socket.

[0003] Conductive contact pins for probe cards can be manufactured by cutting a thin metal sheet using a laser beam. For example, a method for manufacturing probes can be used to cut a thin metal sheet made of conductive material using a laser beam. The laser beam can cut the metal sheet along a specific contour corresponding to the conductive contact pin, and sharp edges are formed on the conductive contact pin through different operations. However, laser cutting technology for manufacturing conductive contact pins by cutting a thin metal sheet along a contour corresponding to the final shape of the conductive contact pin has the following problems: limitations in improving the dimensional precision of the conductive contact pin, and limitations in the shapes that can be manufactured.

[0004] On the other hand, among the existing detection sockets, there are spring-type sockets and rubber-type sockets.

[0005] The spring-type socket has the following structure: a contact pin is formed by embedding a coil spring into a separately manufactured cylindrical body with a circular cross-section, and by attaching plungers to the upper and lower parts of the coil spring. The external terminals of the semiconductor package are electrically connected to the terminals of the detection device via the plungers and the spring. The spring-type socket presses the contact pin into a through hole formed in the housing in an interference fit configuration. Due to this manufacturing process, it is difficult to manufacture the contact pin length to be less than 3 mm. Although the length of the spring-type socket should be shortened to correspond to the high frequency range above GHz, it is difficult to shorten the contact pin length in the case of the spring-type socket, which results in a longer current path from the terminals of the detection device to the external terminals of the semiconductor package.

[0006] Furthermore, in order to improve the contact effect between the contact pins of the spring-loaded socket and the contact object, it has a sharp tip. However, in response to the narrow pitch of semiconductor packages, the size of the external terminals of the semiconductor package is also made smaller, and the sharp tip will produce indentations or grooves at the external terminals of the semiconductor package after inspection. This damages the contact shape of the external terminals of the semiconductor package, causing visual inspection errors, and also causing problems that reduce the reliability of the external terminals in subsequent processes such as soldering. Therefore, the existing spring-loaded socket is not only unfavorable for high-frequency characteristic inspection of semiconductor packages, but also has limitations in terms of corresponding to the narrow pitch of semiconductor package terminals.

[0007] On the other hand, the rubber-type socket has the form of containing multiple conductive particles inside a support plate with elasticity, such as silicon, and has a structure in which the contact pin and the support plate are integrated. Since this type of rubber-type socket is manufactured by preparing a molding material in which conductive particles are distributed within a flowing elastic substance, inserting the molding material into a specific mold, and then applying a magnetic field in the thickness direction to align the conductive particles in the thickness direction to create the contact pin, the length of the contact pin can be shortened. Therefore, the current path from the terminal of the self-detection device to the terminal of the semiconductor package can be shortened. Because the current path can be shortened, the rubber-type socket is more advantageous in detecting the high-frequency characteristics of semiconductor packages.

[0008] However, if the spacing between magnetic fields is narrowed to accommodate the narrow pitch of the external terminals of semiconductor packages, it causes irregular alignment of conductive particles, resulting in signal flow in the planar direction. Furthermore, the narrowing of the spacing between contact pins weakens the rigidity of the support plate positioned between adjacent contact pins. Consequently, since contact stability can only be ensured by applying excessive pressure to this type of rubber-type socket, the contact pins deform in the width direction due to the pressure, causing further deformation of the support plate and potentially damaging it during prolonged use. Therefore, rubber-type sockets face limitations in aligning with the trend towards narrow-pitch technology.

[0009] To address this issue, a method using microelectromechanical systems (MEMS) technology can be considered when manufacturing conductive contact pins. The process of fabricating conductive contact pins using MEMS processes is described below. First, photoresist is coated onto the surface of a conductive substrate, and then the photoresist is patterned. Next, the photoresist is used as a mold, and metal material is deposited within the opening using electroplating. Finally, the photoresist and the conductive substrate are removed, resulting in the conductive contact pin.

[0010] However, in reality, to date, conductive contact pins fabricated using MEMS processes have not been able to further improve their physical or electrical properties. [Prior Art Documents] [Patent Documents]

[0011] [Patent Document 1] Korean Patent Registration No. 10-0449308 [Summary of the Invention]

[0012] The present invention is proposed to solve the problems of the prior art mentioned above. The purpose of the present invention is to provide a conductive contact needle with further improved physical or electrical properties.

[0013] In order to achieve this objective of the present invention, the conductive contact needle according to the present invention is a conductive contact needle formed by stacking a first metal layer and a second metal layer, wherein the first metal layer comprises a first metal and is formed in a plate shape, the second metal layer comprises a second metal and is formed in a plate shape, wherein the first metal layer is disposed on the upper surface and the lower surface of the conductive contact needle, the second metal layer is disposed inside the conductive contact needle, and the first metal layer protrudes from the second metal layer at at least one end of the conductive contact needle, so that the second metal layer does not contact the contact object at the one end.

[0014] In addition, the first metal layer and the second metal layer are alternately stacked.

[0015] In addition, the first metal is a metal with relatively high wear resistance or strength compared to the second metal, and the second metal is a metal with relatively high electrical conductivity compared to the first metal.

[0016] In addition, the first metal includes metals selected from the following: rhodium (Rh), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (P) or alloys thereof, or palladium-cobalt (PdCo) alloys, palladium-nickel (PdNi) alloys or nickel-phosphorus (NiP) alloys, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten (NiW) alloys, and the second metal includes metals selected from copper (Cu), silver (Ag), gold (Au) or alloys thereof.

[0017] In addition, the end is at least one of the two ends in the length direction of the conductive contact needle, or at least one of the two ends in the width direction of the conductive contact needle.

[0018] On the other hand, the conductive contact needle according to the present invention is a conductive contact needle formed by stacking a first metal layer and a second metal layer, wherein the first metal layer comprises a first metal and is formed in a plate shape, the second metal layer comprises a second metal and is formed in a plate shape, wherein the first metal layer is disposed on the upper surface and the lower surface of the conductive contact needle, the second metal layer is disposed inside the conductive contact needle, the first metal layer protrudes from the second metal layer to form a groove between adjacent first metal layers, and the groove is disposed at at least one end of the conductive contact needle.

[0019] On the other hand, the conductive contact needle according to the present invention is a conductive contact needle formed by stacking a first metal layer and a second metal layer, wherein the first metal layer comprises a first metal and is formed in a plate shape, the second metal layer comprises a second metal and is formed in a plate shape, wherein the first metal layer is disposed on the upper surface and the lower surface of the conductive contact needle, the second metal layer is disposed inside the conductive contact needle, the first metal layer protrudes from the second metal layer to form a groove between adjacent first metal layers, and the groove is continuously disposed along the side periphery of the conductive contact needle.

[0020] In addition, the grooves are spaced apart from each other in the height direction of the conductive contact pins and are arranged in multiples.

[0021] The present invention provides a conductive contact needle with further improved physical or electrical properties.

Implementation Method

[0023] The following content is merely illustrative of the principles of the invention. Therefore, even if not explicitly described or illustrated in this specification, those skilled in the art can implement the principles of the invention and invent various devices included within the concept and scope of the invention. In addition, all terms and embodiments listed in this specification should be understood in principle as being for the purpose of clearly understanding the concept of the invention only, and are not limited to the embodiments and states specifically listed above.

[0024] The objectives, features and advantages described herein will become even more apparent from the following detailed description in relation to the accompanying drawings, and thus the technical ideas of the invention can be readily implemented by those skilled in the art to which it pertains.

[0025] The embodiments described in this specification will be described with reference to cross-sectional and / or perspective views, which serve as ideal illustrations of the invention. To effectively illustrate the technical content, the thickness of the films and regions shown in these figures is exaggerated. The shapes of the illustrations may be varied due to manufacturing techniques and / or tolerances. Therefore, the embodiments of the invention are not limited to the specific shapes shown, but also include variations in shapes generated according to the manufacturing process. Technical terms used in this specification are for illustrative purposes only and are not intended to limit the invention. Unless the context clearly specifies otherwise, singular expressions include plural expressions. In this specification, it should be understood that terms such as "comprising" or "having" are intended to specify the presence of the features, numbers, steps, actions, constituent elements, components, or combinations thereof described in this specification, without precluding the presence or additional possibilities of one or more other features or numbers, steps, actions, constituent elements, components, or combinations thereof.

[0026] According to a preferred embodiment of the present invention, a conductive contact pin (10) is disposed in a detection device and used to make electrical and physical contact with the object being detected to transmit electrical signals. The detection device may be a detection device for semiconductor manufacturing processes, and as an example, it may be a probe card or a detection socket. The detection device according to the preferred embodiment of the present invention is not limited thereto, and includes any device that applies electricity to confirm whether the object being detected is defective.

[0027] Hereinafter, as an example of a detection device, the conductive contact pin (10) of the preferred first to third embodiments of the present invention is a conductive contact pin (10) that can be used for a probe card, and the conductive contact pin (10) of the fourth embodiment can be a conductive contact pin (10) that can be used for a detection socket. However, it is not limited to this. The conductive contact pin (10) of the first to third embodiments can be used for a detection socket, and the conductive contact pin (10) of the fourth embodiment can be used for a probe card.

[0028] The conductive contact pins (10) according to the first to fourth embodiments can be fabricated using MEMS processes. More specifically, conductive contact pins (10) formed by stacking multiple metal layers can be fabricated by using a mold with an internal space and filling the internal space with metal material by electroplating. The mold here can be a photoresist, a semiconductor wafer or an anodized film.

[0029] Hereinafter, the first to fourth embodiments will be distinguished and described, but embodiments that combine the configurations of each embodiment are also included in the preferred embodiments of the present invention. First Embodiment

[0030] Hereinafter, the conductive contact pin (10) according to the preferred first embodiment of the present invention will be described with reference to FIG1(a), FIG1(b) to FIG4. FIG1(a) and FIG1(b) are diagrams showing the probe head of a probe card having the conductive contact pin (10) according to the preferred first embodiment of the present invention, FIG2 is a perspective view of the conductive contact pin (10) according to the preferred first embodiment of the present invention, FIG3 is a perspective view showing one end of the conductive contact pin (10) according to the preferred first embodiment of the present invention, and FIG4 is a cross-sectional view along line A-A' of FIG3.

[0031] First, refer to Figure 1(a) and Figure 1(b). The probe card is composed of a probe head and a circuit section (3). The probe head is composed of a first guide plate (1), a second guide plate (2), and conductive contact pins (10). The electrical characteristic test of the semiconductor device is performed by bringing the semiconductor wafer (W) close to the probe card on which multiple conductive contact pins (10) are formed and making each conductive contact pin (10) contact the corresponding electrode pad (WP) on the semiconductor wafer (W). After the conductive contact pin (10) reaches the position of contacting the electrode pad (WP) (Figure 1(a)), the wafer (W) can be raised an additional predetermined height toward the circuit section (3) of the probe card (Figure 1(b)). The conductive contact pin (10) is a structure that can be elastically deformed between the first guide plate (1) and the second guide plate (2).

[0032] As a preferred first embodiment of the present invention, the conductive contact pin (10) may be configured as a pre-deformed structure, i.e., a cobra pin, or configured to deform the pin by horizontally moving the first guide plate (1), the second guide plate (2), or an additional movable plate disposed between the first guide plate (1) and the second guide plate (2). Therefore, although the conductive contact pin (10) is shown as a cobra pin in FIG2, it is not limited thereto. As shown in FIG1(a), the structure of the conductive contact pin (10) having a bend in the central part of the conductive contact pin (10) is also included in the structure of the preferred first embodiment of the present invention.

[0033] The first end (31) of the conductive contact pin (10) is a part that contacts the electrode pad (WP) on the semiconductor wafer (W), and the second end (32) may be a part that contacts the circuit part (3) of the probe card. Alternatively, the first end (31) may be a part that contacts the circuit part (3) of the probe card, and the second end (32) may be a part that contacts the electrode pad (WP) on the semiconductor wafer (W).

[0034] The conductive contact pin (10) is formed by depositing multiple metal layers by using a mold with an internal space and by using electroplating to fill the internal space of the mold with metal material.

[0035] The conductive contact pin (10) comprises a first metal layer (11) and a second metal layer (13) and is formed by stacking multiple metal layers, wherein the first metal layer (11) comprises a first metal and is formed in a plate shape, and the second metal layer (13) comprises a second metal and is formed in a plate shape. The multiple metal layers may include additional metal layers besides the first metal layer (11) and the second metal layer (13). The multiple metal layers may be formed by at least three layers. In other words, the multiple metal layers may be formed by an odd number or an even number of layers, or more than three layers. However, the number of metal layers is not limited to this.

[0036] A first metal layer (11) is disposed on the upper and lower surfaces of the conductive contact needle (10), and a second metal layer (13) is disposed inside the conductive contact needle (10).

[0037] The conductive contact pin (10) comprises a first metal layer (11) and a second metal layer (13) and is constructed by stacking multiple metal layers. Each stacked metal layer has a planar shape. The stacking direction of the multiple metal layers, including the first metal layer (11) and the second metal layer (13), is the height direction (z direction) of the conductive contact pin. On the xy plane, the planar metal layers are stacked in the height direction (z direction) to form the conductive contact pin (10). Since the conductive contact pin (10) deforms in the width direction (x direction), the stacking direction (z direction) of the multiple metal layers is perpendicular to the deformation direction of the conductive contact pin (10).

[0038] The first metal is a metal with relatively high wear resistance or hardness compared to the second metal, and the second metal may be formed from a metal with relatively high electrical conductivity compared to the first metal.

[0039] The first metal is preferably formed of a metal selected from the following: rhodium (Rh), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (P) or alloys thereof, or palladium-cobalt (PdCo) alloys, palladium-nickel (PdNi) alloys or nickel-phosphorus (NiP) alloys, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten (NiW) alloys. The first metal layer (11) may be formed of the same material as the first metal or of different materials.

[0040] The second metal is preferably formed of a metal selected from copper (Cu), silver (Ag), gold (Au), or an alloy thereof. The second metal layer (12) may be formed of a second metal of the same material or a second metal of a different material.

[0041] However, the first metal and the second metal may be made of other metals besides the metals mentioned above, and are not limited to the materials exemplified above.

[0042] The first metal layer (11) and the second metal layer (13) are alternately stacked. The first metal layer (11) is disposed on the upper surface and the lower surface of the conductive contact pin (10) in the height direction (z direction), and the second metal layer (13) is disposed between the first metal layer (11). The conductive contact pin (10) is arranged in an alternating stacked order of the first metal layer (11), the second metal layer (13), and the number of stacked layers can be three or more. Referring to Figures 2 to 4, the first metal layer (11) consists of five layers, and the second metal layer (13) consists of four layers, so the conductive contact pin (10) is composed of nine stacked metal layers.

[0043] Since the conductive contact pin (10) is constructed by multi-layer stacking of multiple metal layers, the thickness of each second metal layer (13) formed by multi-layer stacking is thinner compared to the case formed by a single material. When the second metal layer (13) is constructed in a bulk form by a single material rather than by multi-layer stacking, when transmitting high-frequency signals, the high-frequency signals are mainly transmitted along the skin depth on the surface of the second metal layer (13) due to the skin effect, and thus appear in the part inside the second metal (230) where transmission does not occur. Conversely, according to the preferred first embodiment of the present invention, when the conductive contact pin (10) transmits high-frequency signals, the current flowing through the second metal layer (13) has a greater amount of current flowing through the surface of the second metal layer (13) due to the skin effect compared to the current flowing inside the second metal layer (13). At this time, due to the skin effect of the multiple second metal layers (13) formed with a thin thickness and the skin effect of each of the multiple second metal layers (13), the transmission paths of high-frequency signals are increased, and the portion of the second metal layer (13) not used for signal transmission is minimized, thereby maximizing the current density within the second metal layer (13). This improves the electrical characteristics of the conductive contact needle (10). Thus, by forming the conductive contact needle (10) using multiple metal layers that alternately stack a second metal layer (13) with relatively high conductivity compared to the first metal layer (11) and a first metal layer (11) with relatively low conductivity compared to the second metal layer (13), it is advantageous to measure high-frequency signals using the conductive contact needle (10) according to the present invention. Here, the frequency of the high-frequency signal can be 0.1 GHz or higher and 20 GHz or lower. However, it is not limited to this.

[0044] The conductive contact pin (10) has two ends in the length direction (y direction) and two ends in the width direction (x direction).

[0045] One end of the conductive contact pin (10) in the length direction (y direction) is configured such that the first metal layer (11) protrudes beyond the second metal layer (13) such that the second metal layer (13) does not contact the contact object at one end. Here, one end of the conductive contact pin (10) may be either one of the two ends in the length direction of the conductive contact pin (10), namely the first end (31) and the second end (32).

[0046] The second metal layer (13) is not protruding at one end. This can be achieved by etching the second metal layer (13) at one end using a solution that selectively reacts with the second metal layer (13) after the plating process is completed and multiple metal layers are deposited.

[0047] A first metal layer (11) protrudes beyond a second metal layer (13) to form a groove (20) between adjacent first metal layers (11), and the groove (20) is disposed at one end of the conductive contact pin (10). The groove (20) is formed by the first metal layer (11) forming its sidewall and the second metal layer (13) forming its bottom surface, thereby extending elongatedly in the width direction (x direction) of the conductive contact pin (10). In addition, since there are multiple first metal layers (11) and second metal layers (13), multiple grooves (20) are disposed parallel to each other in the height direction (z direction) of the conductive contact pin (10).

[0048] Since the second metal layer (13) has a lower hardness than the first metal layer (11), the durability of the conductive contact pin (10) may decrease if either the first metal layer (11) or the second metal layer (13) does not protrude and is disposed on the same plane, due to wear of the second metal layer (13). However, according to the preferred first embodiment of the present invention, by adopting a configuration in which the second metal layer (13) does not protrude more than the first metal layer (11) so that the second metal layer (13) does not come into contact with the contact object, the wear resistance due to non-contact can be improved.

[0049] At the first end (31), the second metal layer (13) is positioned inward in a stepped manner without protruding from the first metal layer (11). In this way, the electrode pads (WP) of the semiconductor wafer (W) can contact the first metal layer (11) but not the second metal layer (13). Therefore, by increasing the number of contact points with the electrode pads (WP) of the semiconductor wafer (W), contact stability is improved.

[0050] At least one end of the conductive contact pin (10) is configured in a convex shape along the length of the conductive contact pin (10). During the overdrive process shown in FIG1(b), since the first end (31) of the conductive contact pin (10) with the convex shape allows the position of the contact surface to change along the surface of the contact object (WP) and slide in contact with the contact object (WP), excessive pressure is not applied to the contact object (WP) during the overdrive process. Thus, by making one end of the conductive contact pin (10) have a convex shape, damage to the contact object (WP) is prevented during the overdrive process.

[0051] On the other hand, the conductive contact pin (10) includes a slot (40) that extends long along its length and is internally open. The slot (40) exposes multiple metal layers constituting the conductive contact pin (10). Because of the formation of the slot (40), the conductive contact pin (10) is easier to deform, so even if the length of the conductive contact pin (10) is shortened, excessive contact pressure will not be caused. Therefore, the overall length can be shortened by the conductive contact pin (10), which is beneficial for high-frequency signal transmission. Furthermore, the high-frequency signal transmission area is increased by the configuration of the slot (40), which is beneficial for high-frequency signal transmission. Second Embodiment

[0052] Next, a second embodiment of the present invention will be described. However, the embodiments described below focus on characteristic constituent elements compared with the first embodiment, and descriptions of constituent elements that are the same as or similar to those in the first embodiment are omitted as much as possible.

[0053] Hereinafter, a conductive contact pin (10) according to a preferred second embodiment of the present invention will be described with reference to FIGS. 5 and 6. FIG. 5 is a perspective view of the conductive contact pin (10) according to a preferred second embodiment of the present invention, and FIG. 6 is a perspective view showing one end of the conductive contact pin (10) according to a preferred second embodiment of the present invention.

[0054] The first embodiment differs from the first embodiment in that the second metal layer (13) does not contact the contact object at only one end in the length direction (y direction) in the following aspects: the first metal layer (11) protrudes from the second metal layer (13) at both ends in the length direction (y direction) of the conductive contact pin (10) and the second metal layer (13) does not contact the contact object at one end.

[0055] At the first end (31), the second metal layer (13) is positioned inward in a stepped manner without protruding from the first metal layer (11). In this way, the electrode pads (WP) of the semiconductor wafer (W) can contact the first metal layer (11) but not the second metal layer (13). Therefore, by increasing the number of contact points with the electrode pads (WP) of the semiconductor wafer (W), contact stability and wear resistance are improved.

[0056] Furthermore, at the second end (32), the second metal layer (13) is positioned inward in a stepped manner without protruding from the first metal layer (11). In this way, the circuit section (3) of the probe card can contact the first metal layer (11) but not the second metal layer (13). Therefore, by increasing the number of contact points with the circuit section (3) of the probe card, contact stability and wear resistance are improved. Third Embodiment

[0057] Next, a third embodiment of the present invention will be described. However, the embodiments described below focus on characteristic constituent elements compared with the second embodiment, and descriptions of constituent elements that are the same as or similar to those in the second embodiment are omitted as much as possible.

[0058] Hereinafter, the conductive contact pin (10) according to the preferred third embodiment of the present invention will be described with reference to FIG7 and FIG8(a) and FIG8(b). FIG7 is a perspective view of the conductive contact pin (10) according to the preferred third embodiment of the present invention, FIG8(a) is a cross-sectional view along line A-A' of FIG7, and FIG8(b) is a cross-sectional view along line B-B' of FIG7.

[0059] The second embodiment differs from the second embodiment in that the second metal layer (13) does not contact the contact object only at both ends in the length direction (y direction) in the following aspects: the first metal layer (11) also protrudes from the second metal layer (13) at both ends in the width direction (x direction) of the conductive contact pin (10) and the second metal layer (13) does not contact the contact object at one end.

[0060] The first metal layer (11) protrudes from the second metal layer (13) to form a groove (20) between adjacent first metal layers (11), and the groove (20) is continuously arranged along the side periphery of the conductive contact pin (10).

[0061] At the first end (31), the second metal layer (13) is positioned inward in a stepped manner without protruding from the first metal layer (11). In this way, the electrode pad (WP) of the semiconductor wafer (W) can contact the first metal layer (11) but not the second metal layer (13). Therefore, by increasing the number of contact points with the electrode pad (WP) of the semiconductor wafer (W), contact stability and wear resistance are improved.

[0062] Furthermore, at the second end (32), the second metal layer (13) is positioned inward in a stepped manner without protruding from the first metal layer (11). In this way, the circuit section (3) of the probe card can contact the first metal layer (11) but not the second metal layer (13). Therefore, by increasing the number of contact points with the circuit section (3) of the probe card, contact stability and wear resistance are improved.

[0063] Furthermore, at the third end (33) and the fourth end (34), the second metal layer (13) is positioned in a stepped manner towards the inside without protruding from the first metal layer (11). This allows the inner walls of the holes in the first guide plate (1) and the second guide plate (2) to contact the first metal layer (11) but not the second metal layer (13). Therefore, the wear resistance of the conductive contact pin (10) is ensured, thereby extending its lifespan.

[0064] Furthermore, the second metal layer (13) inside the slot (40) is not protruding from the first metal layer (11) and is positioned in a stepped manner towards the inside. In this way, when transmitting high-frequency signals, the transmission area of ​​high-frequency signals is increased, which is beneficial for the transmission of high-frequency signals.

[0065] As a variation of the third embodiment, the following configuration may also exist: the first metal layer (11) protrudes from the second metal layer (13) only at both ends in the width direction (x direction) of the conductive contact pin (10), and the second metal layer (13) does not contact the contact object at one end. Fourth embodiment

[0066] Next, the fourth embodiment of the present invention will be described.

[0067] The conductive contact pin (10) according to the fourth embodiment can be a conductive contact pin (10) that can be used to detect the socket.

[0068] FIG9a is a plan view showing a conductive contact pin (10) according to a preferred fourth embodiment of the present invention, and FIG9b is a perspective view showing a conductive contact pin (10) according to a preferred fourth embodiment of the present invention.

[0069] The conductive contact needle (10) includes a needle part (100), a fixing part (200) and a connecting part (300).

[0070] The needle portion (100) includes a first contact portion (110) disposed on the upper part, a second contact portion (120) disposed on the lower part, and an elastic portion (130) disposed between the first contact portion (110) and the second contact portion (120).

[0071] Previously, spring-type sockets were assembled by separately manufacturing the cylinder and conductive contact pins. However, the conductive contact pin (10) of the preferred fourth embodiment of the present invention differs in the following aspects: the first contact portion (110), the second contact portion (120) and the elastic portion (130) are manufactured in one step by using a plating process, thereby being configured as an integral unit.

[0072] The fixing part (200) serves to fix the conductive contact pin (10) to the support plate, and after the conductive contact pin (10) is placed on the support plate, the conductive contact pin (10) remains fixed to the support plate.

[0073] The connecting part (300) is disposed between the needle part (100) and the fixing part (200) with reference to the width direction (x direction) of the conductive contact needle (10) to connect the needle part (100) and the fixing part (200).

[0074] The needle part (100), the fixing part (200), and the connecting part (300) are configured as a single unit. The needle part (100), the fixing part (200), and the connecting part (300) are manufactured in one step using a plating process. Since the conductive contact needle (10) is formed by filling the internal space with metal material through electroplating using a mold with an internal space, the needle part (100), the fixing part (200), and the connecting part (300) are manufactured as a single unit that is connected to each other.

[0075] The conductive contact pin (10) can be elastically deformed in the length direction (y direction) and also elastically deformed in the width direction (x direction). The conductive contact pin (10) can be elastically deformed in the length direction (y direction) by means of the construction of the elastic part (130) and can be elastically deformed in the width direction (x direction) by means of the construction of the connecting part (300).

[0076] Multiple metal layers are stacked in the height direction (z direction) of the conductive contact pin (10). The multiple metal layers include a first metal layer (11) and a second metal layer (13), wherein the first metal layer (11) contains a first metal and is formed in a plate shape, and the second metal layer (13) contains a second metal and is formed in a plate shape.

[0077] A first metal layer (11) is disposed on the lower surface and the upper surface of the conductive contact pin (10) in the height direction (z direction), and a second metal layer (13) is disposed between the first metal layer (11). For example, the conductive contact pin (10) is disposed in an alternating manner of first metal layer (11), second metal layer (13), and first metal layer (11) in the order of the stacked layers, and the number of stacked layers can be three or more.

[0078] The first metal layer (11) protrudes from the surface side compared to the second metal layer (13). The second metal layer (13) disposed between the first metal layers (11) does not protrude from the surface side compared to the first metal layer (11). This can be achieved by selectively etching only the second metal layer (13) after the plating process is completed. Since the second metal layer (13) has a lower hardness than the first metal layer (11), when the first metal layer (11) and the second metal layer (13) are disposed on the same plane, the second metal layer (13) is subject to wear, and the durability of the conductive contact pin (10) may decrease. Therefore, by ensuring that the second metal layer (13) does not protrude from the first metal layer (11), the second metal layer (13) does not come into contact with external objects, thereby improving the wear resistance due to non-contact.

[0079] The second metal layer (13) not protruding from the first metal layer (11) may be configured on the entire conductive contact pin (10) or selectively configured only at the part of the second metal layer (13) that substantially comes into contact with an external object.

[0080] When the configuration of the second metal layer (13) not protruding from the first metal layer (11) is selectively disposed only at the part where the second metal layer (13) substantially comes into contact with the external object, it is preferable that it may be disposed at the first contact part (110), the second contact part (120), and / or the fixing part (200).

[0081] In the first contact portion (110), the second metal layer (13) is positioned in a stepped manner inwards, without protruding from the first metal layer (111), on the surface that contacts the external terminal of the semiconductor package, more specifically on the inner surface of the first side contact portion (115) in the width direction (x direction) and / or the upper surface of the first lower contact portion (111). In this way, the external terminal of the semiconductor package can contact the first metal layer (11) but not the second metal layer (13). Therefore, by increasing the number of contact points between the external terminal of the semiconductor package and the first contact portion (110), contact stability is improved.

[0082] On the other hand, the detection device includes a circuit board, and the second contact portion (110) is electrically connected to the terminals of the circuit board. At this time, the second metal layer (13) in the lower surface of the second contact portion (110) is positioned in a stepped manner towards the inside without protruding from the first metal layer (11). In this way, the contact stability is improved by increasing the number of contact points.

[0083] On the other hand, the fixing part (200) is fixedly disposed on the support plate, and the second metal layer (13) is positioned in a stepped manner inward on the side of the fixing part (200) opposite to the support plate without protruding from the first metal layer (11). In this way, wear caused by contact can be minimized.

[0084] The first contact portion (110) is located at the upper part of the conductive contact needle (10) in the length direction (y direction), and the second contact portion (120) is located at the lower part of the conductive contact needle (10) in the length direction (y direction).

[0085] The first contact portion (110) includes a first lower contact portion (111) and a first side contact portion (115).

[0086] The first lower contact portion (111) contacts the lower part of the contact object. Therefore, the first lower contact portion (111) can resist the downward displacement of the contact object. Here, the contact object includes an external terminal of the detection object. In the case where the detection object is a semiconductor package, the contact object may be a spherical external terminal disposed in the semiconductor package.

[0087] The first side contact portion (115) contacts the side of the contact object. Therefore, the first side contact portion (115) can resist the lateral displacement of the contact object. More specifically, the first side contact portion (115) is disposed outside the first lower contact portion (111) and contacts the side of the external terminal. By configuring the first lower contact portion (111) that contacts the lower part of the external terminal and the first side contact portion (115) that contacts the side of the external terminal, the contact stability with the external terminal is improved.

[0088] The first lower contact portion (111) includes a first-1 lower contact portion (111a) and a first-2 lower contact portion (111b). The first-1 lower contact portion (111a) and the first-2 lower contact portion (111b) are arranged symmetrically in the width direction (x direction) with reference to the central axis of the needle portion (100) in the length direction (y direction).

[0089] The first-1 lower contact portion (111a) includes a first lower support portion (113a), which contacts a lower portion of the external terminal of the semiconductor package and extends to the left in the width direction (x direction) and upward in the length direction (y direction). The first-2 lower contact portion (111b) includes a second lower support portion (113b), which contacts a lower portion of the external terminal of the semiconductor package and extends to the right in the width direction (x direction) and upward in the length direction (y direction).

[0090] A first neck (112a) is provided at the lower part of the first lower support portion (113a). One end of the first neck (112a) is connected to the upper elastic portion (131), and the other end is connected to the first lower support portion (113a). A second neck (112b) is provided at the lower part of the second lower support portion (113b). One end of the second neck (112a) is connected to the upper elastic portion (131), and the other end is connected to the second lower support portion (113b).

[0091] If the external terminal of the semiconductor package contacts the first-1 lower contact portion (111a) and the first-2 lower contact portion (111b), the first lower support portion (113a) and the second lower support portion (113b) can elastically deform in a direction away from each other and support the lower part of the external terminal. In addition, even if the external terminal of the semiconductor package is not installed in the correct position and is installed eccentrically to one side, the first lower support portion (113a) or the second lower support portion (113b) can still contact the lower part of the external terminal of the semiconductor package. In this way, since the first lower contact portion (111) is formed by the first-1 lower contact portion (111a) and the first-2 lower contact portion (111b) arranged apart from each other, the contact stability with the external terminal of the semiconductor package is further improved.

[0092] Furthermore, a space is provided between the first lower contact portion (111a) and the first lower contact portion (111b). More specifically, a space is provided between the first neck (112a) of the first lower contact portion (111a) and the second neck (112b) of the second lower contact portion (111b). Foreign matter detached from the external terminal of the semiconductor package is guided by the first lower support portion (113a) of the first lower contact portion (111a) and the second lower support portion (113b) of the second lower contact portion (111b) into the space provided between the first neck (112a) and the second neck (112b). In this way, by minimizing the possibility of foreign matter remaining on the first lower support portion (113a) of the first lower contact portion (111a) and the second lower support portion (113b) of the second lower contact portion (111b), contact stability is improved. In addition, the possibility of foreign matter flowing into the upper elastic part (131) can be minimized.

[0093] A pair of first side contacts (115) are arranged outside the first lower contact (111) and are configured to contact the side of the external terminal of the semiconductor package. The first side contacts (115) protrude further than the protruding length of the first lower contact (111) towards the upper side of the first lower contact (111). The lower part of the spherical external terminal contacts the first lower contact (111), and its side contacts the first side contacts (115). By making the spherical external terminal contact the first lower contact (111) and the pair of first side contacts (115), the contact stability is improved compared with the existing point contact method.

[0094] The pair of first side contacts (115) can be elastically deformed to a shape in which the spacing between them increases or decreases. For example, if the first lower contact (111) is pressed after it contacts the spherical outer terminal, it can be elastically deformed to a shape in which the spacing between the pair of first side contacts (115) decreases. Or, if the width of the outer terminal of the semiconductor package is larger than the spacing between the pair of first side contacts (115), it can be elastically deformed to a shape in which the spacing between the pair of first side contacts (115) increases.

[0095] The first side contact portion (115) is provided with a protruding tip (116) for improving contact stability. The protruding tip (116) is arranged to protrude inward in the width direction (x direction) and multiple protruding tips (116) may be arranged. At least two or more protruding tips (116) may be arranged. When the first lower contact portion (111) contacts the external terminal of the semiconductor package, a downward pressure is applied by overdrive, and the first side contact portion (115) is displaced in the direction of the external terminal of the semiconductor package at the same time as the fixing portion (200) contacts the first side contact portion (115). At this time, the protruding tip (116) contacts the side of the external terminal of the semiconductor package and the contact stability is improved.

[0096] When the external terminal of the semiconductor package contacts the first contact portion (110), it may not contact the first lower contact portion (111) due to size and positional errors of the external terminal of the semiconductor package, but it can at least contact the first side contact portion (115). Since it is configured to contact the external terminal of the semiconductor package even only through the first side contact portion (115), the contact stability between the external terminal of the semiconductor package and the first contact portion (110) can be ensured even when the downward force of pressing the semiconductor package is small. In the case of the previous rubber-type socket in which conductive microspheres are arranged inside the rubber material, i.e., silicone rubber, a sufficiently large pressure should be applied to press the semiconductor package to achieve the connection between the microspheres. Therefore, depending on the number of conductive contact pins, a downward force of several tons to tens of tons is required. In contrast, in the case of the conductive contact pin (10) according to the preferred fourth embodiment of the present invention, by configuring a first side contact portion (115) that can contact the side of the external terminal of the semiconductor package, the contact stability between the external terminal of the semiconductor package and the first contact portion (110) can be ensured even with a relatively small descent force.

[0097] The elastic portion (130) includes an upper elastic portion (131) and a lower elastic portion (132). A boundary portion (114) is disposed between the upper elastic portion (131) and the lower elastic portion (132). The upper elastic portion (131) is connected to a first contact portion (110), and the lower elastic portion (1232) is connected to a second contact portion (120). The elastic coefficients of the upper elastic portion (131) and the lower elastic portion (132) may be formed differently from each other.

[0098] An upper elastic portion (131) is disposed between the first lower contact portion (111) and the boundary portion (114). The upper elastic portion (131) is formed by alternating connections of multiple upper straight portions (135a) and multiple upper curved portions (137a). The upper straight portions (135a) connect to the upper curved portions (137a) adjacent to the left and right, and the upper curved portions (137a) connect to the upper straight portions (135a) adjacent to the upper and lower sides. The upper straight portions (135a) are arranged at the central part of the upper elastic portion (131), and the upper curved portions (137a) are arranged at the outer part of the upper elastic portion (131). The upper straight portions (135a) are arranged parallel to the width direction (x direction), so that the upper curved portions (137a) can be more easily deformed according to the contact pressure. In this way, the upper elastic portion (131) has an appropriate contact pressure.

[0099] The lower part of the upper elastic part (131) is connected to the boundary part (114). More specifically, the upper curved part (137a) of the upper elastic part (131) is connected to the boundary part (114).

[0100] The upper part of the upper elastic part (131) is connected to the first lower contact part (111). More specifically, since the first lower contact part (111) includes a first-1 lower contact part (111a) and a first-2 lower contact part (111b) that are symmetrically arranged and spaced apart from each other, the upper part of the upper elastic part (131) is connected to the first-1 lower contact part (111a) and the first-2 lower contact part (111b).

[0101] By including the first lower contact portion (111) connected to the upper elastic portion (131), the external terminal can be elastically deformed when it comes into contact with the first lower contact portion (111), and appropriate contact pressure can be provided.

[0102] The first side contact portion (115) may be formed by extending from the connecting portion (300) or by extending from the boundary portion (114).

[0103] The boundary portion (114) is disposed between the upper elastic portion (131) and the lower elastic portion (132) in the length direction (y direction) and between a pair of connecting portions (300) in the width direction (x direction). One side of the boundary portion (114) is connected to the connecting portion (300) located on one side thereon, and the other side of the boundary portion (114) is connected to the connecting portion (300) located on the other side thereon.

[0104] The boundary portion (114) is connected to the upper elastic portion (131) at its upper part and to the lower elastic portion (132) at its lower part, and extends in the width direction (x direction). In other words, the boundary portion (114) is arranged in the form of a plate extending in the width direction (x direction), with the upper elastic portion (131) connected to the upper part of the boundary portion (114), the lower elastic portion (132) connected to the lower part of the boundary portion (114), and connecting portions (300) connected to both sides of the boundary portion (114). In addition, a first side contact portion (115) is connected to the boundary portion (114) and extends upward.

[0105] The boundary portion (114) serves to separate the contact area of ​​the external terminal contact of the semiconductor package from the elastic area of ​​the lower elastic portion (132) that is elastically deformable into independent spaces. By the configuration of the boundary portion (114) located at the upper part of the lower elastic portion (132) and the connecting portions (300) located on both sides of the lower elastic portion (132), the contact area of ​​the external terminal contact of the semiconductor package and the elastic area of ​​the lower elastic portion (132) that is elastically deformable are separated. In this way, foreign matter generated when contacting in the contact area is prevented from flowing into the elastic area side.

[0106] The lower elastic portion (132) is disposed between the boundary portion (114) and the second contact portion (120) in the length direction (y direction) to perform elastic deformation. The uppermost end of the lower elastic portion (132) is connected to the boundary portion (114), and the lowermost end of the lower elastic portion (132) is connected to the second contact portion (120).

[0107] The lower elastic portion (132) is formed by alternating connections of multiple straight portions (135b) and multiple curved portions (137b). The straight portions (135b) connect to the left and right adjacent curved portions (137b), and the curved portions (137b) connect to the upper and lower adjacent straight portions (135b). The curved portions (137b) are arranged in an arc shape.

[0108] A straight portion (135b) is arranged at the center of the lower elastic portion (132), and a curved portion (137b) is arranged at the outer side of the lower elastic portion (132). The straight portion (135b) is arranged parallel to the width direction (x direction), so that the curved portion (137b) can be more easily deformed according to the contact pressure. In this way, the lower elastic portion (132) has an appropriate contact pressure.

[0109] The lower elastic portion (132) connected to the boundary portion (114) is a curved portion (137b) of the lower elastic portion (132), and the lower elastic portion (132) connected to the second contact portion (120) may be a straight portion (135b) of the lower elastic portion (132). One end of the straight portion (135b) at the lowermost end of the lower elastic portion (132) is formed as a free end, while the other end is connected to the curved portion (137b) so that the second contact portion (120) can operate while performing the scrub function.

[0110] The curved portion (137b) has a flat portion (138b) at its upper and lower parts. The flat portion (138b) is formed in a flat planar shape, and the upper and lower adjacent flat portions (138b) make surface contact with each other when the lower elastic portion (132) deforms. During testing, the lower elastic portion (132) is compressed, and the upper and lower adjacent flat portions (138b) make surface contact with each other. In this way, the curved portion (137b) disposed on the outer part of the lower elastic portion (132) can quickly and stably realize the transmission of electrical signals.

[0111] Two straight sections (135b) are connected at each curved section (137b), and the two straight sections (135b) are positioned within a distance not exceeding the length direction (y direction) of each curved section (137b). By connecting one straight section (135b) at the position where it bends downward from the upper part of each curved section (137b), and connecting another straight section (135b) at the position where it bends upward from the lower part of each curved section (137b), the distance between the two straight sections (135b) connected to one curved section (137b) in the length direction (y direction) does not exceed the distance between the two straight sections (135b) in the length direction (y direction) of one curved section (137b). In this way, since more curved sections (137b) and straight sections (135b) can be arranged within the same length range of the lower elastic section (132), sufficient elastic force can be provided to the lower elastic section (132). Therefore, the length of the lower elastic part (132) can be shortened.

[0112] On the other hand, the spacing between the upper and lower adjacent curved portions (137b) is formed in a manner that is shorter than the spacing between the upper and lower adjacent straight portions (135b). In this way, when the lower elastic portion (132) is compressed, the upper and lower adjacent curved portions (137b) first come into contact and form a current path through the curved portions (137b). If an additional overdrive is applied, additional deformation of the lower elastic portion (132) can be caused by the upper and lower separated straight portions (135b).

[0113] The second contact portion (120) is electrically connected to the terminal of the circuit board. Since the second contact portion (120) is configured to be connected to the elastic portion (130) at the lower part of the elastic portion (130), the second contact portion (120) is elastically connected to the terminal of the circuit board.

[0114] The second contact portion (120) has the same width as the lower elastic portion (132) and includes a buffer space portion (125) inside. The buffer space portion (125) is formed as an empty space surrounded by the straight portion (135) of the second contact portion (120) and the lower elastic portion (132). By the configuration of the buffer space portion (125), the second contact portion (120) can be formed with the same width as the lower elastic portion (132). By the configuration of the buffer space portion (125) disposed inside the second contact portion (120), the second contact portion (120) has elasticity.

[0115] The fixing part (200) is disposed on the outermost side of the conductive contact pin (10) in the width direction (x direction) and serves to fix the conductive contact pin (10) to the support plate. After the conductive contact pin (10) is disposed on the support plate, the fixing part (200) remains fixed to the support plate.

[0116] The fixing part (200) includes a protrusion (210) that protrudes outward in the width direction (x direction). The protrusion (210) is disposed on the wall surface of the fixing part (200). The protrusion (210) includes an upper fixing protrusion (211) and a lower fixing protrusion (213). The fixing part (200) is fixedly mounted on the support plate by the configuration of the upper fixing protrusion (211) and the lower fixing protrusion (213).

[0117] A support plate is positioned between the upper fixing protrusion (211) and the lower fixing protrusion (213). The upper fixing protrusion (211) and the lower fixing protrusion (213) are configured as stepped stop ridges so that after the fixing part (200) is inserted into the hole formed in the support plate, the support plate is locked in the upper fixing protrusion (211) and the lower fixing protrusion (213) so that the fixing part (200) will not disengage to the upper and lower sides.

[0118] The fixing part (200) and the connecting part (300) are arranged parallel to each other and spaced apart. The lower end of the fixing part (200) and the lower end of the connecting part (300) are connected by a bending part (400). The outer surface of the bending part (400) has a configuration that is inclined inward in the width direction (x direction). This makes it easier to insert the conductive contact pin (10) into the through hole (31) formed in the support plate. When the conductive contact pin (10) is to be inserted into the through hole (31) disposed in the support plate, the bending part (400) with the inclined outer surface contacts the hole disposed in the support plate, and the bending part (400) is compressed inward in the width direction (x direction) so that it can be naturally inserted into the through hole (31) disposed in the support plate. Furthermore, after insertion, the conductive contact pin (10) comes into close contact with the inner wall of the through hole (31) disposed on the support plate by means of elastic restoring force, and the fixing part (200) is naturally fixed to the support plate by means of the upper fixing protrusion (211) and the lower fixing protrusion (213). In addition, after being fixed, the fixing part (200) also comes into close contact with the inner wall surface of the through hole (31) by means of elastic restoring force, thereby preventing the conductive contact pin (10) from detaching from the support plate.

[0119] The fixing part (200) includes an extending protrusion (220). The extending protrusion (220) is a portion of the fixing part (200) that extends and protrudes towards the upper side of the support plate when the conductive contact pin (10) is provided on the support plate. The extending protrusion (220) may be disposed above the fixing protrusion (211) disposed on the upper part of the fixing part (200). The extending protrusion (220) supports the side of the first side contact (115) when the first side contact (115) deforms outward in the width direction (x direction) to prevent the first side contact (115) from being excessively deformed.

[0120] At least a portion of the elastic portion (130) protrudes outward in the direction below the lower end of the fixed portion (200). That is, at least a portion of the elastic portion (130) protrudes downward and is exposed beyond the fixed portion (200). In addition, at least a portion of the first contact portion (110) protrudes outward in the direction above the upper end of the fixed portion (200). That is, at least a portion of the first contact portion (110) protrudes upward and is exposed beyond the fixed portion (200). In this way, by minimizing the interference between the contact object that contacts the conductive contact needle (10) above and below the conductive contact needle (10) and the fixed portion (200), the contact stability between objects that contact in the longitudinal direction (y direction) of the conductive contact needle (10) is improved.

[0121] A connecting portion (300) is disposed between the needle portion (100) and the fixing portion (200) in the width direction (x direction) to connect the needle portion (100) and the fixing portion (200). The connecting portion (300) extends in the same length direction (y direction) as the fixing portion (200).

[0122] The connecting portion (300) is connected to at least a portion of the needle portion (100) and to the lower end of the fixing portion (200). Preferably, one end of the connecting portion (300) is connected to the boundary portion (114), and the other end is connected to the lower end of the fixing portion (200), and the connecting portion (300) and the fixing portion (200) are connected by a bend (400) having the shape of the letter "U". That is, the fixing portion (200) and the connecting portion (300) are arranged parallel to each other and spaced apart, and the lower end of the fixing portion (200) and the lower end of the connecting portion (300) are connected by the bend (400). The connecting part (300) is arranged separately from the fixing part (200) in the width direction (x direction) inside the fixing part (200). By using the bending part (400) in the shape of "U" (the letter U), the fixing part (200) and the connecting part (300) are connected to each other. This configuration not only allows the needle part (100) to move in the width direction (x direction) but also allows the needle part (100) to move in the length direction (y direction).

[0123] Compared to the boundary portion (114), at a position lower in the length direction (y direction), the lower end of the fixing portion (200) is connected to the lower end of the connecting portion (300) by a bending portion (400), thereby allowing the boundary portion (114) to be relatively displaced relative to the fixing portion (200) in the width direction (x direction). When contacting the external terminal of the semiconductor package at a position above the boundary portion (114), the boundary portion (114) can contact the external terminal while being relatively displaced relative to the fixing portion (200) in the width direction (x direction). In this way, even if the external terminals approach at staggered positions, contact stability can be improved.

[0124] Since the conductive contact pin (10) is elastically allowed to deform in the width direction (x direction), it is easy to install and replace the conductive contact pin (10) on the support plate.

[0125] More specifically, the connecting part (300) can move relative to the fixing part (200) to change the spacing space between the fixing part (200) and the connecting part (300). The internal width of the hole formed in the support plate is formed to be smaller than the width and length of the conductive contact pin (10) before insertion. When the conductive contact pin (10) is to be inserted into the through hole (31) disposed in the support plate, the lower end of the conductive contact pin (10) can be compressed in the width direction (x direction) to reduce the width and length of the conductive contact pin (10), thereby making it easier to insert into the through hole (31) disposed in the support plate. In addition, after insertion, the fixing part (200) can be in close contact with the inner wall of the through hole (31) disposed in the support plate by means of the elastic restoring force between the fixing part (200) and the connecting part (300). Thus, by means of the elastic connection structure between the fixing part (200) and the connecting part (300), it becomes easy to set the conductive contact pin (10) on the support plate.

[0126] In addition, the operation of removing the conductive contact pin (10) that has been set on the support plate is also simplified. Since the conductive contact pin (10) is a structure that elastically deforms in the width direction (x direction), the compression fixing part (200) in the width direction (x direction) can be easily removed from the support plate.

[0127] In line with the technological trend of narrower pitch of external terminals, the size of external terminals has also become smaller. Therefore, it is more difficult to align the external terminals, which are made into tiny units, with the conductive contact pin (10). However, according to the preferred fourth embodiment of the present invention, since the pin (100) is elastically allowed to move in the width direction (x direction), it can make more stable contact with the external terminal. Since the connecting part (300) can move relative to the fixing part (200) in the width direction (x direction), and the pin (100) and the connecting part (300) are formed as one piece, the pin (100) can be elastically tilted to the left and right within a certain angle range. Even if the external terminal contacts the first contact part (110) at a misaligned position (due to manufacturing process or transfer error, etc.), the first contact part (110) can also be tilted and contacted by the pressure of the external terminal at the misaligned position. In this way, a stable connection can be achieved even with an external terminal with positional error.

[0128] The boundary portion (114) is configured to be elastically movable in the width direction (x direction) based on the fixing portion (200). The first side contact portion (115) connected to the boundary portion (114) is configured to be elastically movable in the width direction (x direction). The bending portion (400) connecting the fixing portion (200) and the connecting portion (300) is configured to be elastically movable in the width direction (x direction). The fixing portion (200) based on the bending portion (400) is configured to be elastically movable in the width direction (x direction). In this way, by minimizing the pressure exerted by the conductive contact pin (10) on the support plate, even if a narrow pitch is achieved in the through hole (31) formed in the support plate (30), damage to the support plate can be prevented.

[0129] The fixing part (200), the connecting part (300), and the boundary part (114) are formed of flat plate-shaped plates, and at least a portion of the first contact part (110), the elastic part (130), and the second contact part (120) are formed of bent plate-shaped plates. In this way, the conductive contact pin (10) is configured as a whole as a main body by connecting plate-shaped plates with substantially the same width to each other.

[0130] The conductive contact pin (10) is made by electroplating multiple metal layers, and by making the width (t) of the plate-shaped plates constituting the conductive contact pin (10) substantially the same, the overall plating deviation of the conductive contact pin (10) is minimized. In this way, the electrical or physical properties of the conductive contact pin (10) can be made uniform.

[0131] The conductive contact pin (10) of the preferred fourth embodiment of the present invention is a structure formed by integrally connecting plate-shaped plates.

[0132] The conductive contact pin (10) is configured as a single body, including: a pair of fixing portions (200) formed in the form of a plate extending in the length direction (y direction); a pair of connecting portions (300) formed in the form of a plate extending in the length direction (y direction) and connected at the lower ends of each fixing portion (200) by a connecting portion; and a boundary portion (114) connected to each connecting portion (300) and extending in the width direction (x direction). The plate is formed; the upper elastic part (131) is connected to the boundary part (114) or the connecting part (300) and is formed in the form of a plate; the first contact part (110) is connected to the upper elastic part (131) and is formed in the form of a plate; the lower elastic part (132) is connected to the boundary part (114) or the connecting part (300) and is formed in the form of a plate; and the second contact part (120) is connected to the lower elastic part (132) and is formed in the form of a plate.

[0133] More specifically, a pair of fixing parts (200) are formed in the form of plate-like plates extending in the length direction (y direction). In addition, each connecting part (300) connected to the lower end of each fixing part (200) is formed in the form of plate-like plates extending in the length direction (y direction). In addition, the boundary part (114) connecting each connecting part (300) is formed in the form of plate-like plates extending from the upper end of each connecting part (300) in the width direction (x direction). In addition, a half-closed space with a lower opening "П" shape is formed by the pair of connecting parts (300) and the boundary part (114). In addition, in the half-closed space formed by the pair of connecting parts (300) and the boundary part (114), the lower elastic part (132) is formed integrally with at least one of the pair of connecting parts (300) and the boundary part (114) in the form of a plate-like plate bending. The lower elastic portion (132) is formed simultaneously with the curved portion (137) and the straight portion (135) in the form of a plate. In addition, the upper elastic portion (131) is formed integrally with the boundary portion (114) or the connecting portion (300) in the form of a plate. The first contact portion (110) is formed integrally with the upper elastic portion (131) in the form of a plate, and the second contact portion (120) is formed integrally with the lower elastic portion (132) in the form of a plate.

[0134] As described above, the conductive contact pin (10) is configured as a whole by connecting the plate-shaped plates together.

[0135] The conductive contact pin (10) has an overall length dimension (L) in the length direction (y direction), an overall height dimension (H) in the height direction (z direction) perpendicular to the length direction (y direction), and an overall width dimension (W) in the width direction (x direction) perpendicular to the length direction (y direction).

[0136] The plate constituting the conductive contact pin (10) has a width. Here, the width refers to the distance between one side of the plate and the other side opposite to it. The plate constituting the conductive contact pin (10) has a minimum width and a maximum width.

[0137] The actual width (t) of the plate can be the average value of the width based on the whole plate, or the intermediate value of the width based on the whole plate, or the average or intermediate value of the width of the plate based on at least a part constituting the conductive contact pin (10), or the average or intermediate value based on the plate of at least one of the fixing part (200), connecting part (300), boundary part (114) and elastic part (130), or the value of the width when the width of the plate is continuously 10 μm or more with the same width.

[0138] In order to effectively correspond to the high-frequency characteristic detection of semiconductor packages, the overall length (L) of the conductive contact pin (10) should be short. Therefore, the length of the elastic part (130) should also be short. However, if the length of the elastic part (130) is shortened, the contact pressure will increase. In order to shorten the length of the elastic part (130) without increasing the contact pressure, the actual width (t) of the plate constituting the elastic part (130) should be reduced. However, if the actual width (t) of the plate constituting the elastic part (130) is reduced, the elastic part (130) will be easily damaged. In order to shorten the length of the elastic part (130) without increasing the contact pressure and to prevent damage to the elastic part (130), the overall height dimension (H) of the plate constituting the elastic part (130) should be made large.

[0139] The conductive contact pin (10) according to the preferred fourth embodiment of the present invention is formed in such a way that the substantial width (t) of the plate-shaped plate is thinner and the overall height dimension (H) of the plate-shaped plate is also large. That is, the overall height dimension (H) is formed to be larger than the substantial width (t) of the plate-shaped plate. Preferably, the substantial width (t) of the plate-shaped plate constituting the conductive contact pin (10) is arranged in the range of 5 μm or more and 15 μm or less, the overall height dimension (H) is arranged in the range of 70 μm or more and 200 μm or less, and the ratio of the substantial width (t) of the plate-shaped plate to the overall height dimension (H) is arranged in the range of 1:5 to 1:30. For example, the substantial width of the plate-shaped plate is substantially formed to be 10 μm and the overall height dimension (H) is formed to be 100 μm, so that the ratio of the substantial width (t) of the plate-shaped plate to the overall height dimension (H) can be formed to be 1:10.

[0140] In this way, damage to the elastic part (130) can be prevented while the length of the elastic part (130) can be shortened, and even if the length of the elastic part (130) is shortened, an appropriate contact pressure can still be obtained. Furthermore, since the overall height dimension (H) can be increased compared to the actual width (t) of the plate constituting the elastic part (130), the resistance to the torque acting in the front and rear directions of the elastic part (130) is increased, and thus the contact stability is improved.

[0141] Since the length of the elastic part (130) can be shortened, the overall height dimension (H) and overall length dimension (L) of the conductive contact pin (10) can be configured in the range of 1:3 to 1:9. Preferably, the overall length dimension (L) of the conductive contact pin (10) can be configured in the range of 300 μm or more and 1000 μm or less, and more preferably in the range of 450 μm or more and 600 μm or less. In this way, the overall length dimension (L) of the conductive contact pin (10) can be shortened to easily correspond to high frequency characteristics, and as the elastic recovery time of the elastic part (130) is shortened, the test time can also be shortened.

[0142] In addition, since the actual width (t) of the plate constituting the conductive contact pin (10) is formed to be smaller than the height (H), the bending resistance in the front and rear directions is improved.

[0143] The elastic part (130) is both a structure that undergoes elastic deformation under pressure and a structure in which the bent parts (137a, 137b) come into contact with each other to form a current channel. Therefore, it is preferable that the multiple bent parts (137a, 137b) that are adjacent to each other on the upper and lower sides come into contact with each other as a whole by applying pressure.

[0144] The overall height dimension (H) and overall width dimension (W) of the conductive contact pin (10) are configured in a ratio of 1:1 to 1:5. Preferably, the overall height dimension (H) of the conductive contact pin (10) is configured in a range of 70 μm or more and 200 μm or less, and the overall width dimension (W) of the conductive contact pin (10) is configured in a range of 100 μm or more and 500 μm or less. More preferably, the overall width dimension (W) of the conductive contact pin (10) is configured in a range of 150 μm or more and 400 μm or less. In this way, by shortening the overall width dimension (W) of the conductive contact pin (10), a narrow pitch can be achieved.

[0145] On the other hand, the overall height dimension (H) and overall width dimension (W) of the conductive contact pin (10) can be formed with substantially the same length. Therefore, it is not necessary to join multiple separately manufactured conductive contact pins (10) in the height direction (z direction) to make the overall height dimension (H) and overall width dimension (W) have substantially the same length. In addition, since the overall height dimension (H) and overall width dimension (W) of the conductive contact pin (10) can be formed with substantially the same length, the resistance to the torque acting in the front and rear directions of the conductive contact pin (10) is increased, thereby improving the contact stability. Furthermore, according to the configuration in which the overall height dimension (H) of the conductive contact pin (10) is 70 μm or more and the overall height dimension (H) and overall width dimension (W) are arranged in the range of 1:1 to 1:5, the overall durability and deformation stability of the conductive contact pin (10) are improved, and the contact stability with the external terminal is improved. In addition, since the overall height dimension (H) of the conductive contact pin (10) is formed to be 70 μm or more, the current carrying capacity can be improved.

[0146] For the conductive contact pin (10) previously manufactured using photoresist molds, the overall width dimension (W) is smaller than the overall height dimension (H). For example, since the overall height dimension (H) of the previously manufactured conductive contact pin (10) is less than 50 μm and the ratio of the overall height dimension (H) to the overall width dimension (W) is in the range of 1:2 to 1:10, the resistance to the torque that causes the conductive contact pin (10) to deform in the front and rear directions by contact pressure is weak. Previously, in order to prevent problems caused by excessive deformation of the elastic part in front of and behind the conductive contact pin (10), it was considered to form additional shells in front of and behind the conductive contact pin (10), but according to the preferred fourth embodiment of the present invention, no additional shells are required.

[0147] As described above, although the invention has been described with reference to preferred embodiments, those skilled in the art can make various modifications or variations to the invention without departing from the spirit and scope of the invention as set forth in the following claims. [Simplified Explanation of the Diagram]

[0022] Figures 1(a) and 1(b) are diagrams showing the probe head of a probe card having a conductive contact pin according to a preferred first embodiment of the present invention. Figure 1(a) is a front view showing the state of contact between the detection object and the conductive contact pin, and Figure 1(b) is a front view showing the over-driving process. Figure 2 is a perspective view of a conductive contact pin according to a preferred first embodiment of the present invention. Figure 3 is a perspective view showing one end of a conductive contact pin according to a preferred first embodiment of the present invention. Figure 4 is a cross-sectional view along line A-A' of Figure 3. Figure 5 is a perspective view of a conductive contact pin according to a preferred second embodiment of the present invention. Figure 6 is a perspective view showing one end of a conductive contact pin according to a preferred second embodiment of the present invention. Figure 7 is a perspective view of a conductive contact pin according to a preferred third embodiment of the present invention. Figures 8(a) and 8(b) are cross-sectional views of Figure 7. Figure 8(a) is a cross-sectional view along line A-A' of Figure 7, and Figure 8(b) is a cross-sectional view along line B-B' of Figure 7. Figure 9a is a plan view showing a conductive contact pin according to a preferred fourth embodiment of the present invention. Figure 9b is a perspective view showing a conductive contact pin according to a preferred fourth embodiment of the present invention.

Claims

1. A conductive contact pin, comprising a first metal layer and a second metal layer, and formed by stacking multiple metal layers, wherein the first metal layer comprises a first metal and is formed in a flat plate shape, the second metal layer comprises a second metal and is formed in a flat plate shape, wherein the first metal layer is disposed on an upper surface and a lower surface of the conductive contact pin, the second metal layer is disposed inside the conductive contact pin, the first metal layer protrudes beyond the second metal layer at at least one end of the conductive contact pin such that the second metal layer does not contact a contact object at the one end, the conductive contact pin includes a slot extending along the length direction of the conductive contact pin and having an internal opening, and inside the slot, the second metal layer is positioned inwardly in a stepped manner without protruding beyond the first metal layer.

2. The conductive contact pin as claimed in claim 1, wherein the first metal layer and the second metal layer are alternately stacked.

3. The conductive contact pin as claimed in claim 1, wherein the first metal is a metal with relatively high wear resistance or strength compared to the second metal, and the second metal is a metal with relatively high conductivity compared to the first metal.

4. The conductive contact pin as claimed in claim 1, wherein the first metal comprises a metal selected from the following: rhodium (Rh), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (P), or alloys thereof, or palladium-cobalt (PdCo) alloys, palladium-nickel (PdNi) alloys, or nickel-phosphorus (NiP) alloys, nickel-manganese (NiMn), nickel-cobalt (NiCo), or nickel-tungsten (NiW) alloys, and the second metal comprises a metal selected from copper (Cu), silver (Ag), gold (Au), or alloys thereof.

5. The conductive contact needle as claimed in claim 1, wherein one end is at least one of the two ends in the length direction of the conductive contact needle, or at least one of the two ends in the width direction of the conductive contact needle.

6. A conductive contact pin, comprising a first metal layer and a second metal layer, and formed by stacking multiple metal layers, wherein the first metal layer comprises a first metal and is formed in a flat plate shape, the second metal layer comprises a second metal and is formed in a flat plate shape, wherein the first metal layer is disposed on an upper surface and a lower surface of the conductive contact pin, the second metal layer is disposed inside the conductive contact pin, the first metal layer protrudes beyond the second metal layer to form a groove between adjacent first metal layers, and the groove is disposed at at least one end of the conductive contact pin, the conductive contact pin includes a slot extending along the length direction of the conductive contact pin and having an internal opening, and inside the slot, the second metal layer is not protruding beyond the first metal layer and is positioned inwardly in a stepped manner.

7. A conductive contact pin, comprising a first metal layer and a second metal layer, and formed by stacking multiple metal layers, wherein the first metal layer comprises a first metal and is formed in a flat plate shape, the second metal layer comprises a second metal and is formed in a flat plate shape, wherein the first metal layer is disposed on an upper surface and a lower surface of the conductive contact pin, the second metal layer is disposed inside the conductive contact pin, the first metal layer protrudes beyond the second metal layer to form a groove between adjacent first metal layers, and the groove is continuously disposed along the side periphery of the conductive contact pin, the conductive contact pin includes a slot extending along the length direction of the conductive contact pin and having an internal opening, and inside the slot, the second metal layer is not protruding beyond the first metal layer and is positioned inwardly in a stepped manner.

8. The conductive contact pin as claimed in claim 6 or claim 7, wherein the grooves are spaced apart from each other and are arranged in a plurality in the height direction of the conductive contact pin.

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