The electro-conductive contact pin and manufacturing method thereof

Abstract

This invention provides a conductive contact needle with further improved physical or electrical properties. Additionally, this invention provides a method for manufacturing a conductive contact needle that improves productivity.

Description

[Technical Field]

[0001] This invention relates to a conductive contact needle and a method for manufacturing the same. [Previous Technology]

[0002] A conductive contact pin is a contact pin that comes into contact with the object being tested to perform testing on the object. The conductive contact pin can be used in a probe card or a test socket.

[0003] Conductive contact pins for probe cards can be manufactured by cutting a thin metal sheet using a laser beam. For example, a method for manufacturing probes can be used to cut a thin metal sheet made of conductive material using a laser beam. The laser beam can cut the metal sheet along a specific contour corresponding to the conductive contact pin, and sharp edges are formed on the conductive contact pin through different operations. However, laser cutting technology for manufacturing conductive contact pins by cutting a thin metal sheet along a contour corresponding to the final shape of the conductive contact pin has the following problems: limitations in improving the dimensional precision of the conductive contact pin, and limitations in the shapes that can be manufactured.

[0004] To address this issue, a method using microelectromechanical systems (MEMS) technology can be considered when manufacturing conductive contact pins. The process of fabricating conductive contact pins using MEMS processes is described below. First, photoresist is coated onto the surface of a conductive substrate, and then the photoresist is patterned. Next, the photoresist is used as a mold, and metal material is deposited within the opening using electroplating. Finally, the photoresist and conductive substrate are removed, resulting in the conductive contact pin.

[0005] However, in reality, to date, conductive contact pins manufactured using MEMS processes have not been able to further improve their physical or electrical properties, nor have they been able to improve the manufacturability of conductive contact pins. [Prior Art Documents] [Patent Documents]

[0006] [Patent Document 1] Korean Patent Registration No. 10-0449308 [Summary of the Invention]

[0007] [The problem the invention aims to solve]

[0008] The present invention is proposed to solve the problems of the prior art mentioned above. The purpose of the present invention is to provide a conductive contact needle with further improved physical or electrical properties.

[0009] Furthermore, an object of the present invention is to provide a method for manufacturing a conductive contact pin that improves productivity. [Means for Solving the Problem]

[0010] In order to achieve the purpose of the present invention, the method for manufacturing a conductive contact pin according to the present invention is a method for manufacturing a conductive contact pin formed by stacking multiple metal layers, wherein the metal layers of the same material among the multiple metal layers are formed simultaneously by the same plating process.

[0011] In addition, the plurality of metal layers are formed using a mold.

[0012] In addition, the stacking direction of the metal layer is the same as the width direction of the mold.

[0013] In addition, the method includes the following steps: forming a first space in the mold and forming a first metal layer using the first space; and forming a second space in the mold and forming a second metal layer using the second space.

[0014] In addition, the first space is configured as a plurality of spaces that are separated from each other.

[0015] In addition, the second space is configured as a space that is interconnected with each other.

[0016] On the other hand, the conductive contact pin according to the present invention is a conductive contact pin formed by stacking multiple metal layers, wherein the metal layers of the same material among the multiple metal layers are formed simultaneously by the same plating process.

[0017] In addition, the plurality of metal layers include a first metal layer containing a first metal and formed in a plate shape, and a second metal layer containing a second metal and formed in a plate shape. The second metal layer is disposed on the left side and the right side in the width direction of the conductive contact pin, and the first metal layer is disposed inside the conductive contact pin.

[0018] In addition, the first metal layer and the second metal layer are alternately stacked.

[0019] In addition, the first metal is a metal with relatively high electrical conductivity compared to the second metal, and the second metal is a metal with relatively high wear resistance or hardness compared to the first metal.

[0020] In addition, the first metal includes a metal selected from copper (Cu), silver (Ag), gold (Au) or alloys thereof, and the second metal includes a metal selected from: rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (Ph) or alloys thereof, or palladium-cobalt (PdCo) alloys, palladium-nickel (PdNi) alloys or nickel-phosphorus (NiPh) alloys, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten (NiW) alloys.

[0021] On the other hand, the conductive contact pin according to the present invention is a conductive contact pin formed by stacking multiple metal layers, wherein a protrusion or recess is disposed at the interface of adjacent metal layers.

[0022] In addition, the uneven portion is continuously formed at the interface between the metal layers, and the uneven portion constituting the uneven portion extends in the same shape in the thickness direction of the conductive contact pin.

[0023] In addition, the concave and convex portions are configured with a pattern of repeating mountains and valleys.

[0024] In addition, the end of the conductive contact pin is formed of the same material as one of the materials of the metal layer constituting the main body of the conductive contact pin.

[0025] In addition, the end of the conductive contact pin is formed of a material different from the material of the metal layer constituting the main body of the conductive contact pin.

[0026] In addition, the width of at least one of the ends of the conductive contact pin is smaller than the width of the main body of the conductive contact pin.

[0027] In addition, the end of the conductive contact pin is formed of a single material.

[0028] In addition, at least a portion of at least one of the ends of the conductive contact pins is embedded in the main body of the conductive contact pin.

[0029] Additionally, a slot is provided, which exposes a single metal layer in the left and right side walls and multiple metal layers in the upper and lower side walls. [Effects of the Invention]

[0030] The present invention provides a conductive contact needle with further improved physical or electrical properties.

[0031] In addition, the present invention provides a method for manufacturing a conductive contact needle that improves productivity.

Implementation Method

[0033] The following content is merely illustrative of the principles of the invention. Therefore, even if not explicitly described or illustrated in this specification, those skilled in the art can implement the principles of the invention and invent various devices included within the concept and scope of the invention. In addition, all terms and embodiments listed in this specification should be understood in principle as being for the purpose of clearly understanding the concept of the invention only, and are not limited to the embodiments and states specifically listed above.

[0034] The objectives, features and advantages described herein will become even more apparent from the following detailed description in relation to the accompanying drawings, and thus the technical ideas of the invention can be readily implemented by those skilled in the art to which it pertains.

[0035] The embodiments described in this specification will be described with reference to cross-sectional and / or perspective views, which serve as ideal illustrations of the invention. To effectively illustrate the technical content, the thickness of the films and regions shown in these figures is exaggerated. The shapes of the illustrations may be varied due to manufacturing techniques and / or tolerances. Therefore, the embodiments of the invention are not limited to the specific shapes shown, but also include variations in shapes generated according to the manufacturing process. Technical terms used in this specification are for illustrative purposes only and are not intended to limit the invention. Unless the context clearly specifies otherwise, singular expressions include plural expressions. In this specification, it should be understood that terms such as "comprising" or "having" are intended to specify the presence of the features, numbers, steps, actions, constituent elements, components, or combinations thereof described in this specification, without precluding the presence or additional possibility of one or more other features or numbers, steps, actions, constituent elements, components, or combinations thereof.

[0036] According to a preferred embodiment of the present invention, the conductive contact pin 10 is disposed in a detection device and used to make electrical and physical contact with the object being detected to transmit electrical signals. The detection device may be a detection device for semiconductor manufacturing processes, and as an example, it may be a probe card or a detection socket. The detection device according to the preferred embodiment of the present invention is not limited thereto, and includes any device that applies electricity to confirm whether the object being detected is defective.

[0037] Hereinafter, the first to fourth embodiments and various modifications will be distinguished and described, but embodiments that combine the configurations of each embodiment and modification are also included in the preferred embodiments of the present invention. First Embodiment

[0038] Hereinafter, the conductive contact pin 10 according to a preferred first embodiment of the present invention will be described with reference to FIGS. 1(a) to 1(f) to 8. FIG. 1(a) is a perspective view of the conductive contact pin 10 according to a preferred first embodiment of the present invention, FIG. 1(b) is a cross-sectional view along line A-A' of FIG. 1(a), FIG. 1(c) is a cross-sectional view along line B-B' of FIG. 1(a), FIG. 1(d) is a cross-sectional view along line C-C' of FIG. 1(a), FIG. 1(e) is a cross-sectional view along line D-D' of FIG. 1(a), and FIG. 1(f) is a cross-sectional view along line E-E' of FIG. 1(a). FIG. 2(a) to 2(d) to 7(a) to 7(d) are diagrams for explaining a method of manufacturing the conductive contact pin according to a preferred first embodiment of the present invention, and FIG. 8 is an enlarged view of the conductive contact pin and a portion thereof according to a preferred first embodiment of the present invention.

[0039] First refer to Figure 1(a)-Figure 1(f).

[0040] The conductive contact pin 10 includes a main body 150, a first end portion 141 disposed on one side of the main body 150, and a second end portion 142 disposed on the other side of the main body 150.

[0041] The first end 141 of the conductive contact pin 10 is a portion that contacts the electrode pad on the semiconductor wafer, and the second end 142 may be a portion that contacts the circuit portion of the probe card. Alternatively, the first end 141 may be a portion that contacts the circuit portion of the probe card, and the second end 142 may be a portion that contacts the electrode pad on the semiconductor wafer.

[0042] The conductive contact pin 10 includes a first metal layer 110 and a second metal layer 120, and is formed by stacking multiple metal layers. The first metal layer 110 comprises a first metal and is formed in a flat plate shape, and the second metal layer 120 comprises a second metal and is formed in a flat plate shape. The multiple metal layers may include additional metal layers besides the first metal layer 110 and the second metal layer 120. The multiple metal layers may be formed by at least three layers. In other words, the multiple metal layers may be formed by an odd number or an even number of layers (three or more). However, the number of metal layers is not limited to this.

[0043] A second metal layer 120 is disposed on the left and right sides in the width direction (x direction) of the conductive contact pin 10. A first metal layer 110 is disposed inside the conductive contact pin 10 and between the second metal layers 120.

[0044] The conductive contact pin 10 comprises a first metal layer 110 and a second metal layer 120, and is constructed by stacking multiple metal layers. Each stacked metal layer has a planar shape. The first metal layer 110 and the second metal layer 120 are stacked alternately. The conductive contact pin 10 is arranged in an alternating stacked configuration of the second metal layer 120, the first metal layer 110, and the second metal layer 120, and the number of stacked layers can be three or more. As an example, the first metal layer 110 consists of five layers, and the second metal layer 120 consists of six layers, thereby the conductive contact pin 10 is constructed by stacking eleven metal layers.

[0045] The stacking direction of the plurality of metal layers, including the first metal layer 110 and the second metal layer 120, is the width direction (x direction) of the conductive contact needle. On the yz plane, the planar metal layers are stacked in the width direction (x direction) to form the conductive contact needle 10.

[0046] The first metal is a metal with relatively high electrical conductivity compared to the second metal, and the second metal may be formed from a metal with relatively high wear resistance or hardness compared to the first metal.

[0047] The first metal is preferably formed from a metal selected from copper (Cu), silver (Ag), gold (Au) or an alloy thereof.

[0048] The second metal is preferably formed from a metal selected from the following: rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (Ph) or alloys thereof, or palladium-cobalt (PdCo) alloys, palladium-nickel (PdNi) alloys or nickel-phosphorus (NiPh) alloys, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten (NiW) alloys.

[0049] However, the first metal and the second metal may be made of other metals besides the metals mentioned above, and are not limited to the materials exemplified above.

[0050] The conductive contact pin 100 includes a slot 160 extending vertically through the main body portion 150. The slot 160 extends elongatedly along the length of the conductive contact pin 100 and is configured with an internally open shape. A single metal layer is exposed in the left and right side walls of the slot 160, and multiple metal layers are exposed in the upper and lower side walls of the slot 160. More specifically, a first metal layer 110 is exposed in the left and right side walls of the slot 160, and both the first metal layer 110 and a second metal layer 120 are exposed in the upper and lower side walls of the slot 160.

[0051] Because the slot 40 is formed, the conductive contact pin 100 is easier to deform, so even if the length of the conductive contact pin 100 is shortened, excessive contact pressure will not be caused. Therefore, the overall length of the conductive contact pin 100 can be shortened, which is beneficial for high-frequency signal transmission. In addition, the high-frequency signal transmission area is increased by the configuration of the slot 160, which is beneficial for high-frequency signal transmission.

[0052] Since the conductive contact pin 10 is constructed by multi-layered stacking of multiple metal layers, the thickness of each first metal layer 110 formed by multi-layered stacking is thinner compared to the case formed by a single material. When the first metal layer 110 is constructed by a single material instead of multi-layered stacking, when transmitting high-frequency signals, the high-frequency signals are transmitted mainly along the skin depth on the surface of the first metal layer 110 due to the skin effect, resulting in portions inside the first metal layer 110 that are not transmitted. Conversely, according to the preferred first embodiment of the present invention, when the conductive contact pin 10 transmits high-frequency signals, the current flowing through the first metal layer 110 has a greater amount of current flowing through the surface of the first metal layer 110 due to the skin effect compared to the current flowing inside the first metal layer 110. At this time, due to the skin effect of the multiple first metal layers 110 formed with a thin thickness, the transmission paths of high-frequency signals are increased, and the portion of the first metal layer 110 not used for signal transmission is minimized, thereby maximizing the current density within the first metal layer 110. This improves the electrical characteristics of the conductive contact needle 10. Thus, by forming the conductive contact needle 10 using multiple metal layers that alternately deposit a first metal layer 110 with relatively high conductivity compared to the second metal layer 120 and a second metal layer 120 with relatively low conductivity compared to the first metal layer 110, it is advantageous to measure high-frequency signals using the conductive contact needle 10 according to the present invention. Here, the frequency of the high-frequency signal can be 0.1 GHz or higher and 20 GHz or lower, but it is not limited to this.

[0053] Referring to FIG8, a wave-shaped portion 130 is disposed at the interface between adjacent metal layers. The wave-shaped portion 130 is continuously formed at the interface between metal layers. More specifically, a protrusion-contour portion 130 is disposed at the interface between the first metal layer 110 and the second metal layer 120. Such a protrusion-contour portion 130 can be disposed at all interfaces where the first metal layer 110 and the second metal layer 120 are in contact with each other.

[0054] The protrusions 131 constituting the protrusions 130 extend in the same shape in the thickness direction (z direction) of the conductive contact pin 100.

[0055] As described above, the uneven portion 130 is configured with a repeating pattern of hills and valleys with a depth of 20 nm or more and 1 μm or less, thus increasing the surface area at the interface between metal layers. By constructing the uneven portion 130, the surface area for current flow is increased through the skin effect, and the density of the current flowing along the conductive contact needle 100 is increased, thereby facilitating the measurement of high-frequency signals by the conductive contact needle 100. Furthermore, this uneven portion 130 enhances the bonding force between metal layers, thereby preventing interface peeling.

[0056] Hereinafter, with reference to FIG2(a)-FIG2(d) to FIG7(a)-FIG7(d), a method for manufacturing a conductive contact pin 100 according to a preferred first embodiment of the present invention will be described.

[0057] A method for manufacturing a conductive contact pin 100 according to a preferred first embodiment of the present invention includes the following steps: forming a first space 30 in a mold 10 and forming a first metal layer 110 using the first space 30; and forming a second space 40 in the mold 10 and forming a second metal layer 120 using the second space 40.

[0058] Referring to Figure 2(a)-Figure 2(d), Figure 2(a) is a plan view of mold 10, Figure 2(b) is a cross-sectional view of A-A' of Figure 2(a), Figure 2(c) is a cross-sectional view of B-B' of Figure 2(a), and Figure 2(d) is a cross-sectional view of C-C' of Figure 2(a).

[0059] First, prepare mold 10.

[0060] The mold 10 may be formed from an anodized film, photoresist, silicon wafer, or a similar material. However, it is preferred that the mold 10 be formed from an anodized film material. An anodized film refers to a film formed by anodizing a metal as a base material, and pores refer to holes formed during the anodizing process of forming an anodized film on a metal. For example, if the base metal is aluminum (Al) or an aluminum alloy, an anodized film of aluminum oxide (Al2O3) is formed on the surface of the base material when the base material is anodized. The anodized film formed as described above is vertically divided into a barrier layer in which no pores are formed inside, and a porous layer in which pores are formed inside. In the base material on which an anodized film with a barrier layer and a porous layer is formed on the surface, if the base material is removed, only the anodized film of aluminum oxide (Al2O3) is retained. Anodized films can be formed by removing the barrier layer formed during anodizing and having pores that are continuous from top to bottom, or by retaining the barrier layer formed during anodizing and sealing one end of the pores at the top or bottom.

[0061] The anodic oxide film has a coefficient of thermal expansion of 2 ppm / ℃ to 3 ppm / ℃. Therefore, when exposed to high-temperature environments, the thermal deformation caused by temperature is small. Therefore, even in high-temperature environments, precision conductive contact pins 100 can be manufactured without thermal deformation.

[0062] When the conductive contact pin 10 is manufactured by using a mold 10 made of anodized film material instead of a photoresist mold, it is possible to achieve a precise and fine shape that was previously limited when the photoresist mold was used.

[0063] When using a photoresist material mold instead of an anodized film material mold 10, it is difficult to ensure sufficient thickness, so multiple photoresists must be laminated to form the mold simultaneously. Therefore, alignment errors occur between the upper and lower laminated photoresists, resulting in the disadvantage that it is difficult to manufacture conductive contact pins 10 with vertical sides. Conversely, using the applicant's technology, even using only anodized film, the thickness of the anodized film material mold 10 can be formed to be 70 μm or more and 300 μm or less, thus enabling the manufacture of conductive contact pins 10 with vertical sides.

[0064] A seed layer 20 is disposed on the lower surface of the mold 10. The seed layer 20 can be disposed on the lower surface of the mold 10 before the internal space of the mold 10 is formed. On the other hand, forming a support substrate 25 at the lower part of the mold 10 can improve the operability of the mold 10. Alternatively, in this case, the seed layer 20 can also be formed on the upper surface of the support substrate 25 and the mold 10 can be bonded to the support substrate 25 for use. The seed layer 20 can be formed of copper (Cu) and can be formed by a deposition method. When forming a metal layer by electroplating, the seed layer 20 is used to improve the plating quality of the metal layer.

[0065] Next, refer to Figures 3(a)-3(d), where Figure 3(a) is a plan view of the mold 10 having the first space 30, Figure 3(b) is a cross-sectional view along line A-A' of Figure 3(a), Figure 3(c) is a cross-sectional view along line B-B' of Figure 3(a), and Figure 3(d) is a cross-sectional view along line C-C' of Figure 3(a).

[0066] A first space 30 is formed in the mold 10.

[0067] The first space 30 can be formed by wet etching of a mold 10 made of anodized film material. For this purpose, a photoresist can be disposed on the upper surface of the mold 10 and patterned thereon. Then, the anodized film in the patterned, open area reacts with an etching solution to form the first space 30. Specifically, before forming the first space 30, a photosensitive material can be disposed on the upper surface of the mold 10, followed by an exposure process and a development process. The photosensitive material can form an open area through the exposure and development processes, and at least a portion of it is patterned and removed. The mold 10 made of anodized film material performs an etching process by removing the open area of ​​the photosensitive material using a patterning process, and removes the anodized film at the position corresponding to the first space 30 using an etching solution, thereby forming the first space 30.

[0068] The first space 30 is configured as multiple spaces that are separated from each other.

[0069] Next, referring to Figures 4(a)-4(d), Figure 4(a) is a plan view of the mold 10 forming the first metal layer 110 in the first space 30, Figure 4(b) is a cross-sectional view along A-A' of Figure 4(a), Figure 4(c) is a cross-sectional view along B-B' of Figure 4(a), and Figure 4(d) is a cross-sectional view along C-C' of Figure 4(a).

[0070] The step of performing an electroplating process in the first space 30 of the mold 10 to form a first metal layer 110 using a first metal.

[0071] The first metal includes metals selected from copper (Cu), silver (Ag), gold (Au), or alloys thereof. However, it is not limited to this.

[0072] The first space 30 is configured with multiple spaces spaced apart from each other, and the first metal is completely filled into these multiple spaces to form multiple first metal layers 110. Thus, since the first metal layers 110 formed from the first metal are formed simultaneously using the same plating process, the plating quality of each first metal layer 110 is consistent. Furthermore, since multiple first plating layers 110 are formed using a single plating process, the productivity of the first plating layers 110 is improved.

[0073] When the plating process is completed, a planarization process may be performed. The first metal layer 110 protruding to the upper surface of the mold 10 is removed and planarized by a chemical mechanical polishing (CMP) process.

[0074] Next, refer to Figures 5(a)-5(d), where Figure 5(a) is a plan view of the mold 10 having the second space 40, Figure 5(b) is a cross-sectional view along line A-A' of Figure 5(a), Figure 5(c) is a cross-sectional view along line B-B' of Figure 5(a), and Figure 5(d) is a cross-sectional view along line C-C' of Figure 5(a).

[0075] A second space 40 is formed in the mold 10.

[0076] The second space 40 can be formed by wet etching of the mold 10 made of anodized film material. For this purpose, a photoresist can be disposed on the upper surface of the mold 10 and patterned thereon. Then, the anodized film in the patterned, open area reacts with an etching solution to form the second space 40. Specifically, before forming the second space 40, a photosensitive material can be disposed on the upper surface of the mold 10, followed by an exposure process and a development process. The photosensitive material can form an open area through the exposure and development processes, and at least a portion of it is patterned and removed. The mold 10 made of anodized film material performs an etching process by removing the open area of ​​the photosensitive material using a patterning process, and removes the anodized film at the position corresponding to the second space 40 using an etching solution, thereby forming the second space 40.

[0077] The second space 40 is configured as a space that is interconnected with each other. A first metal layer 110 is disposed inside the second space 40.

[0078] Next, refer to Figures 6(a)-6(d). Figure 6(a) is a plan view of the mold 10 forming the second metal layer 120 in the second space 40, Figure 6(b) is a cross-sectional view along A-A' of Figure 6(a), Figure 6(c) is a cross-sectional view along B-B' of Figure 6(a), and Figure 6(d) is a cross-sectional view along C-C' of Figure 6(a).

[0079] The step of forming a second metal layer 120 by performing an electroplating process using the first metal in the second space 40 of the mold 10 is performed.

[0080] The second metal includes metals selected from the following: rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (Ph) or alloys thereof, or palladium-cobalt (PdCo) alloys, palladium-nickel (PdNi) alloys or nickel-phosphorus (NiPh) alloys, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten (NiW) alloys. However, it is not limited to this.

[0081] The second spaces 40 are configured to be interconnected, and the second metal is completely filled into these second spaces 40 to form a plurality of second metal layers 120. Thus, since the second metal layers 120 formed from the second metal are formed simultaneously through the same plating process, the plating quality of each second metal layer 120 is consistent. Furthermore, since multiple second plating layers 120 are formed in a single plating process, the productivity of the second plating layers 110 is improved.

[0082] When the plating process is completed, a planarization process can be performed. The second metal layer 120 protruding to the upper surface of the mold 10 is removed and planarized by a chemical mechanical polishing (CMP) process.

[0083] Next, refer to Figures 7(a)-7(d). Figure 7(a) is a plan view of the conductive contact pin 100, Figure 7(b) is a cross-sectional view along line A-A' of Figure 7(a), Figure 7(c) is a cross-sectional view along line B-B' of Figure 7(a), and Figure 7(d) is a cross-sectional view along line C-C' of Figure 7(a).

[0084] The process of removing the mold 10, seed layer 20, and support substrate 25 is performed after the previous steps. If the mold 10 is made of anodized film material, the mold 10 is removed using a solution that selectively reacts with the anodized film material. If the seed layer 20 is made of copper (Cu) material, the seed layer 20 is removed using a solution that selectively reacts with copper (Cu).

[0085] The anodic oxide film has a large number of pores with a diameter of 20 μm or more and 1 nm or less. When this anodic oxide film is used as mold 10, if wet etching is performed on the anodic oxide film using the pore structure, the side of the pores opens and the side of the pores opens toward the first space 30. In this state, if the first metal layer 110 is formed by a plating process, the metal layer is also formed inside the pores in the sidewall of the first space 30. Thereafter, by removing the anodic oxide film in contact with the first metal layer 110 and forming the second metal layer 120 at that location by a plating process, a bump 130 is provided at the interface between the first metal layer 110 and the second metal layer 120. By actively utilizing the pores of this anodic oxide film to provide the bump 130 at the interface between the first metal layer 110 and the second metal layer 120, the bonding performance and high-frequency signal transmission performance can be improved.

[0086] The conductive contact pin 100 according to the first embodiment is formed of a second metal whose two ends 140 are made of the same metal material. The two ends 140 of the conductive contact pin 100 are formed simultaneously when the second metal layer 120 of the main body portion 150 is formed.

[0087] On the other hand, as described above, the steps of first forming a first space 30 in the mold 10 and forming a first metal layer 110 using the first space 30 are performed first, followed by the steps of forming a second space 40 in the mold 10 and forming a second metal layer 120 using the second space 40. Alternatively, the configuration could be as follows: first forming a second space 40 in the mold 10 and forming a second metal layer 120 using the second space 40, followed by the steps of forming a first space 30 in the mold 10 and forming a first metal layer 110 using the first space 30. Alternatively, the configuration could be as follows: first forming a second metal layer 120 in the mold 10 using the first space 30, followed by the steps of forming a first metal layer 110 in the mold 10 using the second space 40. Alternatively, the configuration could be as follows: first forming a second space 40 in the mold 10 to form the first metal layer 110, followed by the steps of forming a first space 30 in the mold 10 to form the second metal layer 120.

[0088] In the preferred first embodiment of the present invention, the metal layers of the same material in the plurality of metal layers of the conductive contact pin 100 are formed simultaneously by the same plating process. For example, in the case where the conductive contact pin 100 has a configuration of two stacked metal layers that are different from each other, the conductive contact pin 100 can be manufactured by two plating processes.

[0089] In order to fabricate a conductive contact pin 100 with eleven metal layers, in which the first metal layer 110 and the second metal layer 120 are alternately deposited in the thickness direction (z direction) of the conductive contact pin 100, eleven plating processes should be performed according to the number of metal layers. Conversely, since the manufacturing method of the conductive contact pin 100 according to the preferred embodiment of the present invention forms multiple first metal layers 110 and multiple second metal layers 120 simultaneously in the same plating process, the productivity of the conductive contact pin 100 with multiple metal layers can be improved.

[0090] Furthermore, since multiple metal layers (in other words, the first metal layer 110 and the second metal layer 120) can be formed using a single mold 10, the productivity of the conductive contact pin 100 with multiple metal layers can be improved. When using a photoresist material, the mold 10 can also be formed from a single layer of photoresist to manufacture the conductive contact pin 100. However, since the photoresist is thin, multiple layers of photoresist should be laminated to form the mold 10 in order to manufacture a conductive contact pin 10 with a thicker thickness (e.g., 70 μm or more and 300 μm or less). Conversely, since the thickness of the anodic oxide film can be 70 μm or more and 300 μm or less, the mold 10 can be formed using only one anodic oxide film, thus omitting the mold lamination process and improving the productivity of the conductive contact pin 100.

[0091] Since the first metal layer 110 and the second metal layer 120 are formed using the first space 30 and the second space 40 of the mold 10, the width of each of the first metal layer 110 and the second metal layer 120 is determined by the first space 30 and the second space 40 of the mold 10. Therefore, by making the size of the first space 30 and the second space 40 of the mold 10 uniform, the width of each metal layer constituting the main body 150 can be made uniform. Conversely, when multiple metal layers are arranged in multiple layers in the thickness direction (z direction) of the conductive contact pin 100 in the internal space of the mold 10, the thickness of each metal layer is determined by plating time and / or current density. Thus, compared with the configuration in which the thickness of the metal layer is determined by plating time and / or current density, the configuration according to the preferred first embodiment of the present invention has the effect of reducing the deviation of the width dimension of each metal layer. Modification of the first embodiment

[0092] Next, variations of the first embodiment of the present invention will be described. However, the embodiments described below focus on characteristic constituent elements compared with the first embodiment, and descriptions of constituent elements that are the same as or similar to those in the first embodiment are omitted as much as possible.

[0093] Hereinafter, a modified example of the conductive contact pin 100 according to a preferred first embodiment of the present invention will be described with reference to FIGS. 9(a)-9(c).

[0094] There are differences in the structure as follows: the conductive contact pin 100 according to the first embodiment is composed of metal materials of the two ends 140 being the same material, while the conductive contact pin 100 according to the modified example of the first embodiment is composed of metal materials of the two ends 140 being different materials.

[0095] Referring to FIG9(a), the first end 141 of the conductive contact pin 100 is formed of a second metal, and the second end 142 is formed of a first metal. The first end 141 may be formed simultaneously with the plurality of second metal layers 120 of the main body 150 when forming the plurality of second metal layers 120. The second end 142 may be formed simultaneously with the plurality of first metal layers 110 of the main body 150 when forming the plurality of first metal layers 110. Thus, the first end 141 and the second end 142 of the conductive contact pin 100 may be formed from any of the metal layers constituting the main body 150. For example, in the case where the first metal of the main body 150 is formed of copper (Cu) and the second metal is formed of a palladium-cobalt (PdCo) alloy, the first end 141 may be formed of a palladium-cobalt (PdCo) alloy and the second end 142 may be formed of copper (Cu).

[0096] Referring to FIG9(b), the first end 141 of the conductive contact pin 100 is formed of a second metal, and the second end 142 is formed of a metal other than the metal layer constituting the main body 150. For example, the first metal of the main body 150 is formed of copper (Cu) and the second metal is formed of a palladium-cobalt (PdCo) alloy, while the second end 142 can be formed of gold (Au). In this way, different electrical or physical properties can be applied to the second end 142 depending on the conditions under which the conductive contact pin 100 is used. In this case, by performing the plating process on the second end 142 separately, the conductive contact pin 100 can be manufactured by a total of three plating processes.

[0097] Referring to FIG9(c), the two ends 140 of the conductive contact pin 100 are formed of a metal other than the metal layer constituting the main body 150. For example, if the first metal of the main body 150 is formed of copper (Cu) and the second metal is formed of a palladium-cobalt (PdCo) alloy, the second end 142 may be formed of gold (Au) and the first end 141 may be formed of rhodium (Rd). In this way, different electrical or physical properties can be applied to the first end 141 and the second end 142 depending on the conditions under which the conductive contact pin 100 is used. In this case, by performing the plating process on the first end 141 and the second end 142 separately, the conductive contact pin 100 can be manufactured by a total of four plating processes.

[0098] On the other hand, unlike this, the end portion 140 may not be formed of a single metal, and the end portion 140 may be configured as a plurality of metal layers. This end portion 140 may be formed by extending the first metal layer 110 and the second metal layer 120 constituting the main body portion 150 to the end portion. Furthermore, unlike this, the end portion 140 may be formed using a plating process independent of the main body portion 150, or by laminating a metal different from the metal layers constituting the main body portion 150. Second Embodiment

[0099] Next, a second embodiment of the present invention will be described. However, the embodiments described below focus on characteristic constituent elements compared with the first embodiment, and descriptions of constituent elements that are the same as or similar to those in the first embodiment are omitted as much as possible.

[0100] Hereinafter, the conductive contact pin 100 according to a preferred second embodiment of the present invention will be described with reference to FIG10.

[0101] There are structural differences in the following aspects: the conductive contact pin 100 according to the first embodiment is configured such that the width of both ends 140 is the same as the width of the main body 150, while the conductive contact pin 100 according to the second embodiment is configured such that at least one of the two ends 140 is smaller than the width of the main body 150.

[0102] According to the second embodiment, the width of the first end portion 141 of the conductive contact pin 100 is smaller than the width of the main body portion 150, and the width of the second end portion 142 is also smaller than the width of the main body portion 150. On the other hand, the thickness of the first end portion 141 is the same as the thickness of the main body portion 150, and the thickness of the second end portion 142 is also the same as the thickness of the main body portion 150.

[0103] With this configuration, the pressure applied to the conductive contact pin 100 is concentrated at the end 140 with a relatively small cross-sectional area, thereby increasing the contact pressure. Modification of the Second Embodiment

[0104] Next, variations of the second embodiment of the present invention will be described. However, the embodiments described below focus on characteristic constituent elements compared to the second embodiment, and descriptions of constituent elements that are the same as or similar to those in the second embodiment are omitted as much as possible.

[0105] Hereinafter, a modified example of the conductive contact pin 100 according to a preferred second embodiment of the present invention will be described with reference to FIGS. 11(a)-11(c).

[0106] There is a difference in the structure in the following aspects: the conductive contact pin 100 according to the second embodiment is composed of metal materials of the two ends 140 being the same material, while the conductive contact pin 100 according to the modified example of the second embodiment is composed of metal materials of the two ends 140 being different materials.

[0107] Referring to FIG11(a), the first end 141 of the conductive contact pin 100 is formed of a second metal, and the second end 142 is formed of a first metal. The first end 141 may be formed simultaneously with the plurality of second metal layers 120 of the main body 150 when forming the plurality of second metal layers 120 of the main body 150. The second end 142 may be formed simultaneously with the plurality of first metal layers 110 of the main body 150 when forming the plurality of first metal layers 110 of the main body 150. Thus, the first end 141 and the second end 142 of the conductive contact pin 100 may be formed from any of the metal layers constituting the main body 150. For example, in the case where the first metal of the main body 150 is formed of copper (Cu) and the second metal is formed of a palladium-cobalt (PdCo) alloy, the first end 141 may be formed of a palladium-cobalt (PdCo) alloy and the second end 142 may be formed of copper (Cu).

[0108] Referring to FIG11(b), the first end 141 of the conductive contact pin 100 is formed of a second metal, and the second end 142 is formed of a metal other than the metal layer constituting the main body 150. For example, the first metal of the main body 150 is formed of copper (Cu) and the second metal is formed of a palladium-cobalt (PdCo) alloy, while the second end 142 can be formed of gold (Au). In this way, different electrical or physical properties can be applied to the second end 142 depending on the conditions under which the conductive contact pin 100 is used. In this case, by performing the plating process of the second end 142 separately, the conductive contact pin 100 can be manufactured by a total of three plating processes.

[0109] Referring to Figure 11(c), the two ends 140 of the conductive contact pin 100 are formed of a metal other than the metal layer constituting the main body 150. For example, if the first metal of the main body 150 is formed of copper (Cu) and the second metal is formed of a palladium-cobalt (PdCo) alloy, the second end 142 may be formed of gold (Au) and the first end 141 may be formed of rhodium (Rd). In this way, different electrical or physical properties can be applied to the first end 141 and the second end 142 depending on the conditions under which the conductive contact pin 100 is used. In this case, by performing the plating process on the first end 141 and the second end 142 separately, the conductive contact pin 100 can be manufactured by a total of four plating processes. Third Embodiment

[0110] Next, a third embodiment of the present invention will be described. However, the embodiments described below focus on characteristic constituent elements compared with the first embodiment, and descriptions of constituent elements that are the same as or similar to those in the first embodiment are omitted as much as possible.

[0111] Hereinafter, the conductive contact pin 100 according to a preferred third embodiment of the present invention will be described with reference to FIG12.

[0112] There are structural differences in the following aspects: the conductive contact needle 100 according to the first embodiment is configured such that the two ends 140 are not embedded in the main body portion 150, while in the conductive contact needle 100 according to the third embodiment, at least a portion of at least one of the ends 140 of the conductive contact needle 100 is embedded in the main body portion 150 of the conductive contact needle 100.

[0113] The conductive contact pin 100 according to the third embodiment is configured such that at least a portion of the metal constituting the end portion 140 is surrounded in the width direction by a metal layer constituting the main body portion 150. More specifically, a first metal layer 110 and / or a second metal layer 120 constituting the main body portion 150 are positioned on the left and right sides of a portion of the metal constituting the end portion 140.

[0114] Therefore, when the conductive contact pin 100 deforms in the width direction of the conductive contact pin 100, the bonding force between the end portion 140 and the main body portion 150 can be increased. Modification of the third embodiment

[0115] Next, variations of the third embodiment of the present invention will be described. However, the embodiments described below focus on characteristic constituent elements compared to the third embodiment, and descriptions of constituent elements that are the same as or similar to those in the third embodiment are omitted as much as possible.

[0116] Hereinafter, a modified example of the conductive contact pin 100 according to a preferred third embodiment of the present invention will be described with reference to Figures 13(a)-13(c).

[0117] There are differences in the structure as follows: the conductive contact pin 100 according to the third embodiment is composed of metal materials of the two ends 140 being the same material, while the conductive contact pin 100 according to the modified example of the third embodiment is composed of metal materials of the two ends 140 being different materials.

[0118] Referring to FIG13(a), the first end 141 of the conductive contact pin 100 is formed of a second metal, and the second end 142 is formed of a first metal. The first end 141 may be formed simultaneously with the plurality of second metal layers 120 of the main body 150 when forming the plurality of second metal layers 120. The second end 142 may be formed simultaneously with the plurality of first metal layers 110 of the main body 150 when forming the plurality of first metal layers 110. Thus, the first end 141 and the second end 142 of the conductive contact pin 100 may be formed from any of the metal layers constituting the main body 150. For example, if the first metal of the main body 150 is formed of copper (Cu) and the second metal is formed of a palladium-cobalt (PdCo) alloy, the first end 141 may be formed of a palladium-cobalt (PdCo) alloy and the second end 142 may be formed of copper (Cu).

[0119] Referring to FIG13(b), the first end 141 of the conductive contact pin 100 is formed of a second metal, and the second end 142 is formed of a metal other than the metal layer constituting the main body 150. For example, the first metal of the main body 150 is formed of copper (Cu) and the second metal is formed of a palladium-cobalt (PdCo) alloy, while the second end 142 can be formed of gold (Au). In this way, different electrical or physical properties can be applied to the second end 142 depending on the conditions under which the conductive contact pin 100 is used. In this case, by performing the plating process of the second end 142 separately, the conductive contact pin 100 can be manufactured by a total of three plating processes.

[0120] Referring to FIG13(c), the two ends 140 of the conductive contact pin 100 are formed of a metal other than the metal layer constituting the main body 150. For example, if the first metal of the main body 150 is formed of copper (Cu) and the second metal is formed of a palladium-cobalt (PdCo) alloy, the second end 142 may be formed of gold (Au) and the first end 141 may be formed of rhodium (Rd). In this way, different electrical or physical properties can be applied to the first end 141 and the second end 142 depending on the conditions under which the conductive contact pin 100 is used. In this case, by performing the plating process on the first end 141 and the second end 142 separately, the conductive contact pin 100 can be manufactured by a total of four plating processes. Fourth Embodiment

[0121] Next, a fourth embodiment of the present invention will be described. However, the embodiments described below focus on characteristic constituent elements compared with the first embodiment, and descriptions of constituent elements that are the same as or similar to those in the first embodiment are omitted as much as possible.

[0122] Hereinafter, the conductive contact pin 100 according to a preferred fourth embodiment of the present invention will be described with reference to FIG14.

[0123] The difference in configuration lies in the following aspects: According to the first embodiment, the conductive contact pin 100 has both ends 140 with widths equal to the width of the main body 150, and neither end 140 is embedded in the main body 150. Conversely, in the fourth embodiment, at least a portion of at least one of the ends 140 of the conductive contact pin 100 is embedded in the main body 150. The conductive contact pin 100 according to the fourth embodiment is configured such that at least a portion of its end 140 protrudes outward from the center of the main body 150, while the remaining portion of its end is embedded in the center of the main body 150.

[0124] According to the fourth embodiment, the width of the first end portion 141 of the conductive contact pin 100 is smaller than the width of the main body portion 150, and the width of the second end portion 142 is also smaller than the width of the main body portion 150. On the other hand, the thickness of the first end portion 141 is the same as the thickness of the main body portion 150, and the thickness of the second end portion 142 is also the same as the thickness of the main body portion 150.

[0125] Furthermore, the conductive contact pin 100 according to the fourth embodiment is configured such that at least a portion of the metal constituting the end portion 140 is surrounded in the width direction by a metal layer constituting the main body portion 150. More specifically, a first metal layer 110 and / or a second metal layer 120 constituting the main body portion 150 are positioned on the left and right sides of a portion of the metal constituting the end portion 140.

[0126] With this configuration, the pressure applied to the conductive contact pin 100 is concentrated at the end 140, which has a relatively small cross-sectional area, thereby increasing the contact pressure. Furthermore, when the conductive contact pin 100 deforms in its width direction, the engagement force between the end 140 and the main body 150 is increased. Modification of the Fourth Embodiment

[0127] Next, variations of the fourth embodiment of the present invention will be described. However, the embodiments described below focus on characteristic constituent elements compared to the fourth embodiment, and descriptions of constituent elements that are the same as or similar to those in the fourth embodiment are omitted as much as possible.

[0128] Hereinafter, a modified example of the conductive contact pin 100 according to a preferred fourth embodiment of the present invention will be described with reference to Figures 15(a)-15(c).

[0129] There are differences in the structure as follows: the conductive contact pin 100 according to the fourth embodiment is composed of metal materials of the two ends 140 being the same material, while the conductive contact pin 100 according to the modified example of the fourth embodiment is composed of metal materials of the two ends 140 being different materials.

[0130] Referring to FIG15(a), the first end 141 of the conductive contact pin 100 is formed of a second metal, and the second end 142 is formed of a first metal. The first end 141 may be formed simultaneously with the plurality of second metal layers 120 of the main body 150 when forming the plurality of second metal layers 120. The second end 142 may be formed simultaneously with the plurality of first metal layers 110 of the main body 150 when forming the plurality of first metal layers 110. Thus, the first end 141 and the second end 142 of the conductive contact pin 100 may be formed from any of the metal layers constituting the main body 150. For example, in the case where the first metal of the main body 150 is formed of copper (Cu) and the second metal is formed of a palladium-cobalt (PdCo) alloy, the first end 141 may be formed of a palladium-cobalt (PdCo) alloy and the second end 142 may be formed of copper (Cu).

[0131] Referring to FIG15(b), the first end 141 of the conductive contact pin 100 is formed of a second metal, and the second end 142 is formed of a metal other than the metal layer constituting the main body 150. For example, the first metal of the main body 150 is formed of copper (Cu) and the second metal is formed of a palladium-cobalt (PdCo) alloy, while the second end 142 can be formed of gold (Au). In this way, different electrical or physical properties can be applied to the second end 142 depending on the conditions under which the conductive contact pin 100 is used. In this case, by performing the plating process of the second end 142 separately, the conductive contact pin 100 can be manufactured by a total of three plating processes.

[0132] Referring to FIG15(c), the two ends 140 of the conductive contact pin 100 are formed of a metal other than the metal layer constituting the main body 150. For example, if the first metal of the main body 150 is formed of copper (Cu) and the second metal is formed of a palladium-cobalt (PdCo) alloy, the second end 142 may be formed of gold (Au) and the first end 141 may be formed of rhodium (Rd). In this way, different electrical or physical properties can be applied to the first end 141 and the second end 142 depending on the conditions under which the conductive contact pin 100 is used. In this case, by performing the plating process on the first end 141 and the second end 142 separately, the conductive contact pin 100 can be manufactured by a total of four plating processes.

[0133] On the other hand, unlike this, it can be configured such that the end portion 140 is embedded as a whole and does not have a portion protruding outward from the center of the main body portion 150.

[0134] As described above, although the present invention has been described with reference to preferred embodiments, those skilled in the art can make various modifications or variations to the present invention without departing from the spirit and field of the present invention as described in the following claims. [Simplified Explanation of the Diagram]

[0032] Figures 1(a)-1(f) are diagrams illustrating a conductive contact pin according to a preferred first embodiment of the present invention. Figure 1(a) is a perspective view of the conductive contact pin 10 according to a preferred first embodiment of the present invention. Figure 1(b) is a cross-sectional view along line A-A' of Figure 1(a). Figure 1(c) is a cross-sectional view along line B-B' of Figure 1(a). Figure 1(d) is a cross-sectional view along line C-C' of Figure 1(a). Figure 1(e) is a cross-sectional view along line D-D' of Figure 1(a). Figure 1(f) is a cross-sectional view along line E-E' of Figure 1(a). Figures 2(a)-2(d) to 7(a)-7(d) are diagrams illustrating a method for manufacturing a conductive contact pin according to a preferred first embodiment of the present invention. Figure 8 is an enlarged view of the conductive contact pin and a portion thereof according to a preferred first embodiment of the present invention. Figures 9(a)-9(c) are perspective views of conductive contact pins according to a modified example of a preferred first embodiment of the present invention. Figure 10 is a perspective view of a conductive contact pin according to a preferred second embodiment of the present invention. Figures 11(a)-11(c) are perspective views of conductive contact pins according to a modified example of a preferred second embodiment of the present invention. Figure 12 is a perspective view of a conductive contact pin according to a preferred third embodiment of the present invention. Figures 13(a)-13(c) are perspective views of conductive contact pins according to a modified example of a preferred third embodiment of the present invention. Figure 14 is a perspective view of a conductive contact pin according to a preferred fourth embodiment of the present invention. Figures 15(a)-15(c) are perspective views of conductive contact pins according to a modified example of a preferred fourth embodiment of the present invention.

Claims

1. A method for manufacturing a conductive contact pin, comprising the method of manufacturing a conductive contact pin formed by stacking multiple metal layers, wherein the metal layers of the same material are formed simultaneously by the same plating process, the stacking direction of the multiple metal layers is the width direction of the conductive contact pin, each of the stacked multiple metal layers has a planar shape, and the conductive contact pin has a slot, the slot extending along the length direction of the conductive contact pin and penetrating both vertically, and configured with an internally open shape.

2. A method for manufacturing a conductive contact pin as claimed in claim 1, wherein the plurality of metal layers are formed using a mold.

3. The method for manufacturing a conductive contact pin as claimed in claim 2, wherein the lamination direction of the metal layer is the same as the width direction of the mold.

4. A method for manufacturing a conductive contact pin as claimed in claim 1, comprising the steps of: forming a first space in a mold and forming a first metal layer using the first space; and forming a second space in the mold and forming a second metal layer using the second space.

5. A method of manufacturing a conductive contact pin as claimed in claim 4, wherein the first space is configured as a plurality of spaces spaced apart from each other.

6. A method of manufacturing a conductive contact pin as claimed in claim 4, wherein the second space is configured as a space that is interconnected with each other.

7. A conductive contact pin is formed by stacking multiple metal layers, wherein the metal layers of the same material are formed simultaneously by the same plating process, the stacking direction of the multiple metal layers is the width direction of the conductive contact pin, each of the stacked multiple metal layers has a planar shape, and the conductive contact pin has a slot, the slot extends along the length direction of the conductive contact pin and passes through it both vertically, and is arranged in a hollow shape.

8. The conductive contact pin as claimed in claim 7, wherein the plurality of metal layers include a first metal layer comprising a first metal and formed in a plate shape, and a second metal layer comprising a second metal and formed in a plate shape, the second metal layer being disposed on the left and right sides in the width direction of the conductive contact pin, and the first metal layer being disposed inside the conductive contact pin.

9. The conductive contact pin as claimed in claim 8, wherein the first metal layer and the second metal layer are alternately stacked.

10. The conductive contact pin as claimed in claim 8, wherein the first metal is a metal with relatively high conductivity compared to the second metal, and the second metal is a metal with relatively high wear resistance or hardness compared to the first metal.

11. The conductive contact pin as claimed in claim 8, wherein the first metal comprises a metal selected from copper (Cu), silver (Ag), gold (Au), or alloys thereof, and the second metal comprises a metal selected from rhodium (Rh), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (P), or alloys thereof, or palladium-cobalt (PdCo) alloys, palladium-nickel (PdNi) alloys, or nickel-phosphorus (NiPh) alloys, nickel-manganese (NiMn), nickel-cobalt (NiCo), or nickel-tungsten (NiW) alloys.

12. A conductive contact pin is formed by stacking multiple metal layers, wherein a protrusion or recess is disposed at the interface of adjacent metal layers, the stacking direction of the multiple metal layers is the width direction of the conductive contact pin, each of the stacked multiple metal layers has a planar shape, and the conductive contact pin has a slot that extends along the length direction of the conductive contact pin and passes through it both vertically and horizontally, and is disposed in a shape with an open interior.

13. The conductive contact pin as claimed in claim 12, wherein the protrusions and depressions are continuously formed at the interface between the metal layers, and the protrusions and depressions constituting the protrusions and depressions extend in the same shape in the thickness direction of the conductive contact pin.

14. The conductive contact pin as claimed in claim 12, wherein the protrusions and recesses are configured in a pattern of repeating hills and valleys.

15. The conductive contact pin as claimed in claim 12, wherein the end of the conductive contact pin is formed of the same material as one of the materials of the metal layers constituting the body portion of the conductive contact pin.

16. The conductive contact pin as claimed in claim 12, wherein the end of the conductive contact pin is formed of a material different from the material of the metal layer constituting the body portion of the conductive contact pin.

17. The conductive contact pin as claimed in claim 12, wherein the width of at least one of the ends of the conductive contact pin is smaller than the width of the body portion of the conductive contact pin.

18. The conductive contact pin as claimed in claim 12, wherein the tip of the conductive contact pin is formed of a single material.

19. The conductive contact needle of claim 12, wherein at least a portion of at least one of the ends of the conductive contact needle is embedded in the body portion of the conductive contact needle.

20. The conductive contact pin as claimed in claim 12, wherein the slot exposes a single metal layer in the left and right side walls and multiple metal layers in the upper and lower side walls.

Images