Exposure apparatus, exposure method, and manufacturing method of electronic components

Abstract

The exposure apparatus of the present invention comprises: an illumination optical system; a spatial light modulator illuminated by light from the illumination optical system; a projection optical system illuminating an exposure object with light emitted from the spatial light modulator; a stage for holding the exposure object and moving it relative to the projection optical system in a predetermined scanning direction; and a control unit for controlling the spatial light modulator. The spatial light modulator has a plurality of mirrors, which can be switched to: an ON state, where the mirrors are tilted to emit light into the projection optical system; and an OFF state, where light is not emitted into the projection optical system. The control unit controls the spatial light modulator by switching the plurality of mirrors between a first state and a second state. At least one of the mirrors in the ON state is different in the first and second states, and the light emitted from the spatial light modulator in the first state and the light emitted from the spatial light modulator in the second state form an exposure pattern of the same shape.

Description

[Technical Field]

[0001] This invention relates to an exposure apparatus, an exposure method, and a method for manufacturing electronic components. This application claims priority based on Japanese Patent Application No. 2021-111770, filed on July 5, 2021, the contents of which are incorporated herein by reference. [Previous Technology]

[0002] Conventionally, as an exposure apparatus for illuminating a substrate with illumination light via an optical system, there is a known exposure apparatus that passes light modulated by a spatial light modulator into a projection optical system, so that an image formed by the light is imaged onto a photoresist coated on the substrate and exposed thereto (see, for example, Patent Document 1). [Prior Art Documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2005-266779 [Summary of the Invention]

[0004] According to a first aspect of the present invention, an exposure apparatus is provided, comprising: an illumination optical system; a spatial light modulator illuminated by light from the illumination optical system; a projection optical system irradiating an exposure object with light emitted from the spatial light modulator; a stage on which the exposure object is placed, such that the exposure object and the projection optical system move relative to each other in a predetermined scanning direction; and a control unit controlling the spatial light modulator, the spatial light modulator having a plurality of mirrors, the plurality of mirrors being switchable to: an ON state, in which the tilt is adjusted to allow light to be emitted toward the projection optical system; and an OFF state, in which light is not emitted toward the projection optical system, the control unit controlling the spatial light modulator in such a way as to switch the plurality of mirrors to a first state and a second state, the first state and the second state being at least one of the mirrors in the ON state being different from each other, and light emitted from the spatial light modulator in the first state and light emitted from the spatial light modulator in the second state forming an exposure pattern of the same shape.

[0005] According to a second aspect of the present invention, an exposure method is provided for exposing the above-described exposure object using the above-described exposure apparatus.

[0006] According to a third aspect of the present invention, a method for manufacturing an electronic component is provided, which includes exposing the object to be exposed by the above-described exposure method.

Implementation Method

[0008] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The following detailed description of the present invention is merely illustrative and is not intended to limit the scope. The same or identical reference numerals are used throughout the drawings and the following detailed description.

[0009] [Exposure Apparatus] FIG1 is a schematic diagram showing the external structure of the exposure apparatus 1 according to this embodiment. The exposure apparatus 1 is an apparatus for irradiating a target object with modulated light. In a particular embodiment, the exposure apparatus 1 is a projection exposure apparatus, i.e., a scanner, that uses a rectangular (square) glass substrate used in electronic components such as liquid crystal display devices (flat panel displays) as the target object in a step-scan manner. The target object is the glass substrate, at least one side of which has a length or diagonal length of 500 mm or more. The target object, i.e., the glass substrate, can be a substrate for a flat panel display. The target object exposed by the exposure apparatus 1 (e.g., a substrate for a flat panel display) is provided in a product by being developed. Photoresist is formed on the surface of the target object. The apparatus body of the exposure apparatus 1 is constructed in the same manner as the apparatus body disclosed in U.S. Patent Application Publication No. 2008 / 0030702.

[0010] The exposure apparatus 1 includes a base 11, a vibration damping table 12, a main column 13, a stage 14, an optical plate 15, an illumination module 16, a projection module 17 (projection optical system), a light source unit 18, an optical fiber 19, a light modulation unit 20 (not shown in Figure 1), and a control unit 21. Hereinafter, a three-dimensional orthogonal coordinate system will be used for explanation as needed: the Z-axis is defined as the direction parallel to the optical axis of the projection module 17, which illuminates the object to be exposed by the light modulated by the light modulation unit 20; the X-axis and Y-axis are defined as the directions of a predetermined plane orthogonal to the Z-axis. The X-axis and Y-axis are mutually orthogonal (intersecting) directions.

[0011] The base 11 is the base of the exposure apparatus 1 and is mounted on the vibration damping table 12. The base 11 supports the stage 14 on which the object to be exposed is placed in a manner that allows it to move in the X-axis and Y-axis directions.

[0012] The stage 14 supports the object to be exposed. During scanning exposure, the stage 14 is used to position the object to be exposed with high precision relative to a plurality of partial images of the circuit pattern projected by the projection module 17. The stage 14 drives the object to be exposed in six degrees of freedom (the aforementioned X-axis, Y-axis and Z-axis directions and the rotational direction relative to each axis).

[0013] The stage 14 moves in the X-axis direction during scanning exposure and in the Y-axis direction when changing the exposure target area on the object to be exposed. Furthermore, the object to be exposed forms a plurality of exposure target areas. The stage 14 moves the object to be exposed relative to the projection module 17 in the scanning direction.

[0014] The exposure apparatus 1 is capable of exposing a plurality of exposure areas on a single object. There are no particular limitations on the configuration of the stage 14; a stage apparatus as disclosed in U.S. Patent Application Publication No. 2012 / 0057140 may be used. The stage apparatus is, for example, a coarse-fine motion stage comprising a two-dimensional coarse motion stage of the gantry type and a fine motion stage slightly driven relative to the two-dimensional coarse motion stage. The coarse-fine motion stage apparatus is capable of moving the object to be exposed in three degrees of freedom in the horizontal plane by means of the coarse motion stage, and is capable of finely moving the object to be exposed in six degrees of freedom by means of the fine motion stage.

[0015] The main column 13 supports the optical plate 15 above the stage 14 (in the positive direction of the Z-axis). The optical plate 15 supports the illumination module 16, the projection module 17 and the light modulation unit 20.

[0016] Figure 2 is a schematic diagram showing the configuration of the lighting module 16, the projection module 17, and the light modulation unit 20. The lighting module 16 is disposed above the optical plate 15 and connected to the light source unit 18 via an optical fiber 19. In one example of this embodiment, the lighting module 16 includes a first lighting module 16A, a second lighting module 16B, a third lighting module 16C, and a fourth lighting module 16D. In the following description, when the first lighting module 16A to the fourth lighting module 16D are not distinguished, they will be collectively referred to as the lighting module 16.

[0017] The first illumination module 16A to the fourth illumination module 16D respectively guide the light emitted from the self-light source unit 18 via the optical fiber 19 to the first light modulation unit 20A, the second light modulation unit 20B, the third light modulation unit 20C, and the fourth light modulation unit 20D. The illumination module 16 illuminates the light modulation unit 20.

[0018] As will be explained in further detail later, the light modulation unit 20 modulates the illumination light from the illumination module 16 based on the circuit pattern to be transferred to the object to be exposed. The modulated light by the light modulation unit 20 is guided to the projection module 17. The first light modulation unit 20A to the fourth light modulation unit 20D are arranged at different positions in the XY plane. In the following description, when the first light modulation unit 20A to the fourth light modulation unit 20D are not distinguished, they will be collectively referred to as the light modulation unit 20.

[0019] The projection module 17 is disposed below the optical plate 15 and illuminates the object to be exposed, which is modulated by the spatial light modulator 201, onto the object to be exposed. The projection module 17 causes the light modulated by the light modulator 20 to image onto the object to be exposed, thereby exposing the object to be exposed. In other words, the projection module 17 projects the pattern on the light modulator 20 onto the object to be exposed. In one example of this embodiment, the projection module 17 includes the first projection module 17A to the fourth projection module 17D, which correspond to the first illumination module 16A to the fourth illumination module 16D and the first light modulator 20A to the fourth light modulator 20D. In the following description, when the first projection module 17A to the fourth projection module 17D are not distinguished, they will be collectively referred to as the projection module 17.

[0020] The unit consisting of the first illumination module 16A, the first light modulation unit 20A, and the first projection module 17A is referred to as the first exposure module. Similarly, the unit consisting of the second illumination module 16B, the second light modulation unit 20B, and the second projection module 17B is referred to as the second exposure module. Each exposure module is positioned at a different location on the XY plane, allowing the pattern to be exposed at different locations on the object to be exposed, which is placed on the stage 14. By moving relative to the exposure modules in the scanning direction, i.e., the X-axis direction, the stage 14 can scan and expose the entire surface of the object to be exposed or the entire surface of the area to be exposed.

[0021] Furthermore, the lighting module 16 is also referred to as the lighting system. The lighting module 16 (lighting system) illuminates the spatial light modulator 201 (spatial light modulator element) described below for the light modulation unit 20. Also, the projection module 17 is also referred to as the projection unit. The projection module 17 (projection unit) can be an equal-magnification system that projects an image of the pattern on the light modulation unit 20 at an equal magnification, or it can be an enlargement system or a reduction system. Furthermore, the projection module 17 is preferably made of one or two types of glass materials (especially quartz or fluorite).

[0022] As shown in Figure 1, the light source unit 18 is provided with a pair (light source unit R18R and light source unit L18L). The light source unit 18 can be a light source unit using a laser with high interference properties, a light source unit using a UV-LD such as a semiconductor laser, or a light source unit utilizing a relay lens type delay unit. The light source 18a provided in the light source unit 18 can be, for example, a lamp or laser diode emitting wavelengths such as 405 nm or 365 nm.

[0023] In addition to the components described above, the exposure apparatus 1 also includes a position measuring unit (not shown) composed of an interferometer or encoder, which measures the relative position of the stage 14 relative to the optical plate 15. In addition to the components described above, the exposure apparatus 1 also includes an AF (Auto Focus) unit (not shown) that measures the Z-axis position of the stage 14 or the object to be exposed on the stage 14. Furthermore, the exposure apparatus 1 includes an alignment unit (not shown) that measures the relative position of each pattern when exposing a pattern already exposed on the object to be exposed to overlap with other patterns. The AF unit and / or the alignment unit may be configured as TTL (Through the lens) measurement via the projection module 17.

[0024] Figure 3 is a diagram showing the general structure of the exposure module. Taking the first exposure module as an example, an example of the specific structure of the illumination module 16, the light modulation unit 20 and the projection module 17 will be described.

[0025] The lighting module 16 includes a module baffle 161 and an lighting optical system 162. The module baffle 161 switches whether to guide the pulsed light supplied from the optical fiber 19 to the lighting optical system 162.

[0026] The illumination optical system 162 illuminates the light modulation unit 20 substantially uniformly by emitting pulsed light supplied from the optical fiber 19 to the light modulation unit 20 via a collimating lens, a compound eye lens, and a condenser lens. The compound eye lens performs wavefront separation on the pulsed light incident on it, and the condenser lens causes the wavefront-separated light to overlap onto the light modulation unit. Furthermore, the illumination optical system 162 may also have an integrating rod instead of a compound eye lens.

[0027] The light modulation unit 20 is equipped with a mask. The mask is a spatial light modulator (SLM).

[0028] The light modulation unit 20 includes a spatial light modulator 201 and a deflecting light absorption plate 202. The spatial light modulator 201 is a digital mirror element (digital micromirror device, DMD). The spatial light modulator 201 can spatially and temporally modulate the illumination light.

[0029] Figure 4 is a schematic diagram showing the configuration of the spatial light modulator 201 of this embodiment. In Figure 4, a three-dimensional orthogonal coordinate system of Xm-Ym-Zm axis is used for explanation. The spatial light modulator 201 includes a plurality of micromirrors 203 (mirrors) arranged in the XmYm plane. The micromirrors 203 constitute the elements (pixels) of the spatial light modulator 201. The spatial light modulator 201 can change its tilt angle around the Xm axis and Ym axis respectively. For example, as shown in Figure 5, the micromirrors 203 are in the ON state by tilting around the Ym axis, and as shown in Figure 6, they are in the OFF state by tilting around the Xm axis. The micromirrors 203 in the ON state emit light towards the projection module 17. The micromirrors 203 in the OFF state do not emit light towards the projection module 17.

[0030] The spatial light modulator 201 controls the direction of incident light reflection for each element by switching the tilt direction of each micromirror 203. For example, the digital micromirror element of the spatial light modulator 201 has approximately 4 M pixels and can switch the ON and OFF states of the micromirrors 203 at a period of approximately 10 kHz. The spatial light modulator 201 controls a plurality of elements at predetermined time intervals. When the spatial light modulator 201 is a DMD, the elements are micromirrors 203, and the predetermined time interval is the period of switching the ON and OFF states of the micromirrors 203 (e.g., a period of 10 kHz).

[0031] Referring back to Figure 3, the offset light absorption plate 202 absorbs the light emitted (reflected) from the element set to the OFF state of the spatial light modulator 201 (offset light). The light emitted from the element set to the ON state of the spatial light modulator 201 is guided to the projection module 17.

[0032] The projection module 17 projects light emitted from the element of the spatial light modulator 201 that is in the ON state onto the object to be exposed. The projection module 17 includes a magnification adjustment unit 171 and a focus adjustment unit 172. The light modulated by the spatial light modulator 201 (modulated light) is incident on the magnification adjustment unit 171.

[0033] The magnification adjustment unit 171 adjusts the magnification of the image on the surface of the object to be exposed by driving a portion of the lens in the direction of the optical axis.

[0034] The focus adjustment unit 172 adjusts the imaging position, i.e. the focus, by driving the entire lens group in the optical axis direction and using the modulated light emitted from the spatial light modulator 201 to image the surface of the exposed object measured by the AF unit described above.

[0035] The projection module 17 projects only the image of light emitted from the element of the spatial light modulator 201 that is in the ON state onto the surface of the object to be exposed. Therefore, the projection module 17 can project and expose the image of the pattern formed by the ON element of the spatial light modulator 201 onto the surface of the object to be exposed. That is, the projection module 17 can form spatially modulated light onto the surface of the object to be exposed. Furthermore, the spatial light modulator 201 can switch the ON and OFF states of the micromirror 203 at a predetermined period (frequency) as described above, so the projection module 17 can form time-modulated light onto the surface of the object to be exposed. That is, the exposure device 1 performs exposure by changing the actual pupil state at any exposure position.

[0036] In the spatial light modulator 201 shown in Figures 4 to 6, the Xm axis is parallel to the X-axis, and the Ym axis is parallel to the Y-axis. Therefore, the micromirror 203 in the ON state (the micromirror 203 tilted around the Ym axis) is tilted relative to the scanning direction, i.e., the X-axis direction.

[0037] The Ym axis is also referred to as the first tilt axis T1. In the spatial light modulator 201, a plurality of micromirrors 203 rotate around the first tilt axis T1 (Ym axis), and the plurality of micromirrors 203 adjust their tilt relative to their respective scanning directions to become ON, thereby emitting light into the projection module 17. In addition, in the spatial light modulator 201, the plurality of micromirrors 203 are arranged in a straight line in the scanning direction, and the plurality of micromirrors 203 are also arranged in the direction of the first tilt axis T1.

[0038] As shown in FIG2, the control unit 21 is, for example, a computer having an arithmetic unit such as a CPU and a memory unit. The computer controls each part of the exposure apparatus 1 according to the program that executes the control of each part operating in the exposure process. For example, the control unit 21 controls the operation of the illumination module 16, the light modulation unit 20, the projection module 17 and the stage 14.

[0039] The storage unit is composed of a storage media device such as memory that can be read by a computer. The storage unit stores various information related to the exposure process. For example, the storage unit stores information related to the exposure pattern during exposure processing. The storage unit stores information input via a communication unit or an input unit. The communication unit includes a communication interface for connecting the exposure device to an external device. The input unit includes input devices such as a mouse, keyboard, or touch panel. The input unit receives various information input to the exposure device.

[0040] [Exposure Method] The stage 14 moves the object to be exposed relative to the projection module in a predetermined scanning direction. Thereby, the light irradiated by the projection module scans the object to be exposed based on information related to the exposure pattern stored in the storage unit, thereby forming a predetermined exposure pattern.

[0041] Figure 7 is a schematic diagram showing the configuration of the spatial light modulator 201. Figure 8 is a diagram showing the exposure field of view (PI) on the exposed object 23. As shown in Figure 7, the spatial light modulator 201 has a plurality of micromirrors 203 (mirrors) arranged in the XmYm plane. In Figure 7, the micromirrors 203 are arranged in a 5×5 matrix.

[0042] Hereinafter, one micromirror 203 provided by the spatial light modulator 201 will be referred to as a pixel. For example, the micromirror 203 becomes ON by tilting around the Ym axis and becomes OFF by tilting around the Xm axis. The micromirror 203 that becomes ON is called an "ON pixel". The micromirror 203 that becomes OFF is called an "OFF pixel".

[0043] In the exposure apparatus 1 of this embodiment, the spatial light modulator 201 switches between a first state and a second state in which a predetermined exposure pattern is irradiated onto the exposure object 23.

[0044] In the first state, the control unit 21 sets one or more predetermined micromirrors 203 out of the plurality of micromirrors 203 to the ON state. In FIG7, among the five micromirrors 203 constituting the third column (the third column from the top), the second to fourth micromirrors 203 from the left are in the ON state. Among the five micromirrors 203 constituting the third row (the third row from the left), the second to fourth micromirrors 203 from the top are in the ON state. The total of five micromirrors 203 in the ON state are arranged in a cross shape. These five micromirrors 203 are referred to as the first micromirror group 205.

[0045] As shown in Figure 8, the exposure field of view PI (exposure pattern) on the exposed object 23 becomes a cross shape corresponding to the micromirror 203 in the ON state. The exposure field of view PI is located in the center of the exposed object 23.

[0046] Figure 9 is a schematic diagram showing the configuration of the spatial light modulator 201. Figure 10 is a diagram showing the exposure field of view (PI) on the exposed object 23. The state shown in Figure 9 is the second state of the spatial light modulator 201. Among the five micromirrors 203 constituting the third column (the third column from the top), the third to fifth micromirrors 203 from the left are in the ON state. Among the five micromirrors 203 constituting the fourth row (the fourth row from the left), the second to fourth micromirrors 203 from the top are in the ON state. The total of five micromirrors 203 in the ON state are arranged in a cross shape. The control unit 21 can switch between the first state and the second state.

[0047] The five micromirrors 203 that will be in the ON state are referred to as the second micromirror group 206. The second micromirror group 206 has the same shape as the first micromirror group 205 in the first state (see Figure 7), but a portion of the micromirrors 203 constituting the second micromirror group 206 is different from the micromirrors 203 constituting the first micromirror group 205. Specifically, the second micromirror group 206 is composed of micromirrors 203 offset to the right by one pixel relative to the first micromirror group 205. That is, in the first state and the second state of the spatial light modulator 201, at least one of the micromirrors in the ON state is different, but regardless of the first state or the second state, an exposure pattern of the same shape can be formed. In addition, the exposure patterns of the same shape also include exposure patterns with different magnifications or defocused exposure patterns. For example, by adjusting the magnification adjustment unit 171 of the projection module 17, exposure patterns with different magnifications can be formed. For example, by adjusting the focus adjustment unit 172 of the projection module 17, a defocused exposure pattern is formed.

[0048] As shown in Figure 10, the exposure field of view PI (exposure pattern) on the exposed object 23 becomes a cross shape corresponding to the micromirror 203 in the ON state. The exposure field of view PI shown in Figure 10 has the same shape as the exposure field of view PI shown in Figure 8. By changing the position from the first micromirror group 205 (see Figure 7) to the second micromirror group 206 (see Figure 9), the stage 14 is moved to the right, thereby causing the exposed object 23 to also move to the right. This allows the illumination position to be changed. Furthermore, by changing the position from the first micromirror group 205 (see Figure 7) to the second micromirror group 206 (see Figure 9), the optical components within the projection module 17 are moved, or the stage equipped with the spatial light modulator 201 is moved in the X and / or Y directions, thereby changing the illumination position. That is, the position of the exposure field of view PI in the exposed object 23 can be set to the center, just as in the first state.

[0049] There is no particular limitation on the timing of switching between the first state and the second state of the spatial light modulator 201. The switching between the first state and the second state can be performed during each scan exposure, or periodically at a predetermined time, or between the end of the exposure of the object 23 and the start of the scan exposure of the next object, or even over a longer period.

[0050] If the micromirror 203 remains in the ON state for an extended period, it may become stuck in that state. If the micromirror 203 is stuck in the ON state, there may be instances where specific locations on the object 23 are unnecessarily exposed. That is, the micromirror 203 should be in the OFF state, but because it is stuck in the ON state, locations that should not be exposed may be exposed. However, in this embodiment, by switching the spatial light modulator 201 between the first and second states for exposure (see Figures 8 and 10), it is possible to prevent the micromirror 203 from remaining in the ON state for an extended period. This prevents the micromirror 203 from becoming stuck.

[0051] Furthermore, when the micromirror 203 is fixed, unnecessary exposure may occur at specific locations on the object to be exposed 23. In such cases, a light-shielding member (baffle) can be provided to block the light from the micromirror 203 and suppress unnecessary exposure at specific locations. The light-shielding member may be configured to block at least a portion of the light emitted from the spatial light modulator 201, or it may be configured to block at least a portion of the light incident on the spatial light modulator 201. The light-shielding member may be provided at any of the following locations: between the optical fiber 19 and the illumination optical system 162, within the illumination optical system 162, between the illumination optical system 162 and the spatial light modulator 201, within the projection module 17, or between the projection module 17 and the object to be exposed 23. Also, when the micromirror 203 is fixed, other exposure modules provided with the exposure apparatus 1 may be used to scan and expose the object to be exposed 23. The exposure module used at this time is preferably an exposure module located adjacent to the exposure module with the spatial light modulator 201 fixed by the micromirror 203, or the exposure module to be used can be preset. In this way, for example, it is possible to prevent the exposure device 1 from being stopped in order to change the spatial light modulator 201, and the exposure of the object 23 can be continued.

[0052] The micromirror 203 can also switch between ON and OFF states at times other than during exposure processing. The ratio of the ON state time to the OFF state time can be, for example, 1:2 to 2:1, preferably 1:1. The switching between ON and OFF states can be performed continuously for the entire period of time other than during exposure processing, or it can be performed only during a predetermined period.

[0053] The micromirror 203 can maintain a neutral state between ON and OFF during periods other than the exposure process. This neutral state can be maintained continuously for the entire period outside of the exposure process, or only during a predetermined period. Furthermore, the micromirror 203 can also switch between ON and OFF states in the opposite phase to the switching during scanning exposure during periods other than the exposure process. That is, while switching the ON and OFF states of the micromirror 203 during scanning exposure, the micromirror 203 can be operated by switching between the ON and OFF states during periods other than the exposure process. Through these operations, it is less likely for the micromirror 203 to become stuck.

[0054] When using a spatial light modulator capable of adjusting the tilt of a mirror, the spatial light modulator can calibrate the tilt angle of the mirror by applying a voltage. Furthermore, the power (illuminance) of light from the mirror can be measured, and its variation calibrated.

[0055] As described above, when the same micromirror 203 is in an ON state for an extended period, the micromirror 203 is prone to become stuck. In contrast, in the exposure apparatus 1 of this embodiment, the prolonged ON state of the micromirror 203 can be suppressed, thus preventing the micromirror 203 from becoming stuck. This allows the micromirror 203 to operate normally. Therefore, good exposure processing can be achieved.

[0056] When the micromirror 203 is in a long-term OFF state, the micromirror 203 is also prone to fixation. However, in the exposure apparatus 1 of this embodiment, it is possible to suppress the micromirror 203 from being set to a long-term OFF state, so the micromirror 203 is less likely to be fixed.

[0057] In the exposure method using the exposure apparatus 1 of this embodiment, a portion of the micromirror 203 that is in the ON state differs between the first and second states of the spatial light modulator 201. Therefore, it is less likely for the micromirror 203 to become stuck. This allows the micromirror 203 to operate normally. Therefore, good exposure processing can be achieved.

[0058] The exposure apparatus 1 of this embodiment may include a master clock (an oscillator that generates the master clock) (not shown) that serves as a reference for synchronization. In the exposure apparatus 1, components such as the stage 14, illumination module 16, projection module 17, and light modulation unit 20 can be driven with reference to the master clock. The control unit 21 can control the operation of each component with reference to the master clock. By referring to the master clock, the operating timing of each component can be adjusted appropriately, and the relationship between the operating timings of multiple components can be appropriately set.

[0059] In the exposure apparatus 1 of this embodiment, the second micromirror group 206 (see Figure 9) is composed of a micromirror 203 that slides one pixel to the right relative to the first micromirror group 205 (see Figure 7), but the position of the second micromirror group relative to the first micromirror group is not limited to this. The second micromirror group may also be positioned that slides two or more pixels relative to the first micromirror group, and the direction of sliding movement is not limited to the right direction of the paper in Figures 7 and 9, but may also be the left direction or the up and down direction. The second micromirror group may also be in a position where it is rotated about the center of the first micromirror group. The second micromirror group may also be a shape that is smaller or larger than the first micromirror group. The first micromirror group and the second micromirror group may differ in at least one micromirror or all micromirrors may be different.

[0060] As shown in FIG10, in the exposure method described above, the control unit 21 moves the object to be exposed 23 to the right by moving to the right of the stage 14 according to the position change from the first micromirror group 205 (see FIG7) to the second micromirror group 206 (see FIG9). As described above, the exposure position on the object to be exposed 23 can be aligned by adjusting the position of the stage 14. The method for aligning the exposure position on the object to be exposed 23 is not limited to this. For example, the control unit 21 can also align the exposure position on the object to be exposed 23 by adjusting the position of the spatial light modulator 201. The control unit 21 can also align the exposure position on the object to be exposed 23 by adjusting the projection position of the projection module 17.

[0061] The exposure device 1 can also be continuously exposed by one projection module 17 (e.g., the first projection module 17A) and another projection module 17 (e.g., the second projection module 17B).

[0062] (Method for manufacturing electronic components) Exposure apparatus 1 can be used to manufacture electronic components such as liquid crystal display devices (flat panel displays) using the exposure method described above.

[0063] Furthermore, all disclosures in the U.S. patent application publications and U.S. patent specifications relating to the exposure apparatus, etc., cited in the above embodiments are part of the description of this specification.

[0064] The invention has been described in detail above with reference to the drawings, but the specific configuration is not limited to the above. Various design changes can be made without departing from the spirit of the invention. [Simplified Explanation of the Diagram]

[0007] [Figure 1] is a diagram showing the general appearance of the exposure apparatus of this embodiment. [Figure 2] is a diagram showing the general structure of the illumination module and the projection module. [Figure 3] is a diagram showing the general structure of the illumination module. [Figure 4] is a diagram showing the general structure of the light modulation unit. [Figure 5] is a diagram showing the general structure of the light modulation unit, showing the ON state of the mirror in the center of the paper. [Figure 6] is a diagram showing the general structure of the light modulation unit, showing the OFF state of the mirror in the center of the paper. [Figure 7] is a diagram showing the general structure of the light modulation unit. [Figure 8] is a diagram showing the exposure field of view on the object to be exposed. [Figure 9] is a diagram showing the general structure of the light modulation unit. [Figure 10] is a diagram showing the exposure field of view on the object to be exposed.

Claims

1. An exposure apparatus comprising: an illumination optical system; a spatial light modulator illuminated by light from the illumination optical system; a projection optical system irradiating an exposure object with light emitted from the spatial light modulator; a stage on which at least one of a first exposure object and a second exposure object different from the first exposure object is placed, such that the first exposure object and at least one of the second exposure object are movable relative to the projection optical system in a scanning direction; and a control unit controlling the spatial light modulator, the spatial light modulator having a plurality of mirrors switchable to: an ON state, adjusting its tilt to allow light to be emitted towards the projection optical system; and an OFF state, preventing light from being emitted towards the projection optical system, the control unit controlling the spatial light modulator by switching the plurality of mirrors to a first state and a second state, wherein the first state and the second state are different from at least one of the mirrors in the ON state. The light emitted from the spatial light modulator in the first state forms a first exposure pattern on the first exposure object, and the light emitted from the spatial light modulator in the second state forms a second exposure pattern with the same shape as the first exposure pattern on the second exposure object.

2. The exposure apparatus of claim 1, wherein the control unit switches from the first state to the second state and adjusts the position of the stage according to the change in the position of the mirror in the ON state, thereby aligning the exposure position on the second exposure object.

3. The exposure apparatus of claim 1, wherein the control unit switches from the first state to the second state and adjusts the position of the spatial light modulator according to the change in the position of the mirror in the ON state, thereby aligning the exposure position on the second exposure object.

4. The exposure apparatus of claim 1, wherein the control unit switches from the first state to the second state and adjusts the illumination position of the light from the projection optical system according to the change in the position of the mirror in the ON state, thereby aligning the exposure position on the second exposure object.

5. An exposure apparatus as described in any of claims 1 to 4, wherein the control unit switches between the first state and the second state each time a scan exposure is performed.

6. An exposure apparatus as claimed in any of claims 1 to 4, wherein the control unit switches from the first state to the second state between the end of exposure of the first exposure object and the start of exposure of the second exposure object.

7. An exposure device as described in any of claims 1 to 4, wherein the control unit switches between the first state and the second state at a preset time.

8. An exposure apparatus as claimed in any of claims 1 to 4, wherein the control unit switches the ON state and the OFF state of the plurality of mirrors at times other than during exposure processing.

9. The exposure apparatus of claim 8, wherein the time ratio of the ON state time to the OFF state time is 1:2 to 2:

1.

10. The exposure apparatus of claim 8, wherein the switching between the ON state and the OFF state and the switching between the ON state and the OFF state during scanning exposure are in opposite phases.

11. An exposure apparatus as claimed in any of claims 1 to 4, wherein the control unit maintains the plurality of mirrors in a neutral state between the ON state and the OFF state at times other than during exposure processing.

12. The exposure apparatus of any one of claims 1 to 4 further comprises: a light-blocking member that blocks at least a portion of the light incident on the aforementioned spatial light modulator.

13. The exposure apparatus of any one of claims 1 to 4 further comprises: a light-blocking member that blocks at least a portion of the light emitted from the aforementioned spatial light modulator.

14. The exposure apparatus of any one of claims 1 to 4, comprising a plurality of the aforementioned projection optical systems.

15. An exposure method comprising exposing an object to an exposure device using any one of claims 1 to 14.

16. A method for manufacturing an electronic component, comprising exposing an object to be exposed by an exposure method as described in claim 15.

17. An exposure method comprising projecting a first exposure pattern onto a first exposure object by turning the mirrors of a first group of a spatial light modulator to an ON state; and projecting a second exposure pattern of the same shape as the first exposure pattern onto a second exposure object different from the first exposure object by turning the mirrors of a second group of the spatial light modulator, which includes mirrors different from the mirrors of the first group, to an ON state.

18. The exposure method of claim 17, wherein the second exposure pattern is projected onto the second exposure object based on the positional relationship between the mirrors of the first group and the mirrors of the second group, while performing at least one of the following: adjusting the position of the spatial light modulator, adjusting the illumination position of the light from the spatial light modulator by the projection module, and adjusting the position of the stage on which the second exposure object is placed.

19. The exposure method as described in request item 17, wherein, The second exposure pattern mentioned above is an exposure pattern with a different magnification than the first exposure pattern mentioned above, or an exposure pattern that has been defocused.

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