Protective shield, electronic device and manufacturing method of protective shield

Abstract

The protective cover of the present invention comprises: a frame portion; a cover portion covering one end of the frame portion; and a connecting portion connecting the frame portion and the cover portion. The cover portion has a first surface that contacts one end of the frame portion via the connecting portion. The first surface has a first anti-reflective film. The first anti-reflective film has a contact portion that contacts the frame portion. The surface roughness Sa of the contact portion is 0.1~1.0 nm.

Description

Technical Field

[0001] This invention relates to a protective cover, an electronic device, and a method for manufacturing the protective cover. Prior Technology

[0002] Electronic devices equipped with electronic components such as LEDs have been used in various fields such as lighting and communication for reasons such as long lifespan and energy saving.

[0003] In this type of electronic device, in order to protect the electronic components, a protective cover is sometimes placed over the substrate on which the electronic components are mounted, so that the electronic components are housed inside. For example, as disclosed in Patent Document 1, the protective cover has: a frame (second member) surrounding the electronic components; and a cover (cover member) covering one end opening of the frame.

[0004] The protective cover is constructed as a single unit by joining the frame and the cover. One method for joining the frame and the cover is to "fuse a portion of the frame and a portion of the cover together by irradiating the contact area between the frame and the cover with a laser." Another technique for joining two components by laser is disclosed in Patent Document 2, which involves "overlapping a first substrate and a second substrate, and forming a fused portion (fusion portion) in the interface area by irradiating the interface area with a laser." [Previous Technical Documents] [Patent Literature]

[0005] [Patent Document 1] International Publication No. 2015 / 190242 [Patent Document 2] Japanese Patent Application Publication No. 2021-88468 Summary of the Invention

[0006] [The problem that this invention aims to solve]

[0007] However, when the electronic component is a light-emitting element such as an LED, in order to improve the light extraction efficiency, it is considered to form an anti-reflection film on the cover. For example, when the anti-reflection film is formed on the entire front and back surfaces of the cover, when the frame and cover are overlapped for bonding, a portion of the anti-reflection film will come into contact with the frame.

[0008] When laser bonding is performed in this state, the anti-reflective film between the frame and the cover may cause insufficient welding between the frame and the cover.

[0009] The present invention was developed in view of the above circumstances, and the technical objective was to "appropriately join the frame and the cover even when the anti-reflective film is disposed between the frame and the cover". [Methods used to solve problems]

[0010] The present invention addresses the aforementioned problems by providing a protective cover for protecting electronic components. The protective cover is characterized by comprising: a frame portion; a cover portion covering one end of the frame portion; and a connecting portion connecting the frame portion and the cover portion. The cover portion has a first surface that contacts the aforementioned end of the frame portion via the connecting portion. The first surface has a first anti-reflective film. The first anti-reflective film has a contact portion that contacts the frame portion. The surface roughness Sa of the contact portion is 0.1 to 1.0 nm.

[0011] According to this configuration, the surface roughness Sa of the contact portion of the first anti-reflection film is set to 0.1~1.0 nm, thereby improving the adhesion between the contact portion and the frame portion. Therefore, by irradiating the contact portion with a laser, a joint with sufficient bonding strength can be formed. Furthermore, even when the protective cover requires airtightness, sufficient airtightness of the joint can be ensured.

[0012] The aforementioned cover may also have a second surface located on the opposite side of the aforementioned first surface, and the aforementioned second surface may also have a second anti-reflection film. This allows for improved light extraction efficiency when using a protective cover to fabricate an electronic device that emits light.

[0013] The electronic device of the present invention is characterized by comprising: electronic components; a substrate on which the aforementioned electronic components are mounted; and a protective cover that is coupled to the aforementioned substrate in a manner that houses the aforementioned electronic components internally. In this way, it can enjoy the same functional effects as the protective cover described above.

[0014] This invention relates to a method for manufacturing the aforementioned protective cover, characterized by comprising: a film-forming process, wherein a first anti-reflective film is formed on the aforementioned first surface of the cover portion using a film-forming apparatus employing physical vapor deposition; and a bonding process, wherein the aforementioned first surface of the cover portion is bonded to the aforementioned end portion of the frame portion. The film-forming apparatus comprises: a holder for holding the cover portion and moving it in a predetermined direction; a target for scattering particles of the material forming the aforementioned first anti-reflective film; and a shielding member for restricting the scattering direction of the particles scattering from the target. In the aforementioned film-forming process, while the shielding member shields a portion of the particles scattering from the target, particles that scatter without contacting the shielding member adhere to the aforementioned first surface of the cover portion while it is being held in the holder.

[0015] According to this configuration, by shielding a portion of the particles scattered from the target material, the particles can be uniformly adhered to the first surface of the cover. This minimizes the surface roughness of the first anti-reflection film.

[0016] In this method, the aforementioned target material may also include a first target material and a second target material arranged in parallel, and the aforementioned shielding member may also be disposed between the aforementioned first target material and the aforementioned second target material.

[0017] According to this configuration, by limiting the scattering direction of particles flying from the first target material and particles flying from the second target material by the shielding member, the surface roughness of the first anti-reflection film can be reduced as much as possible.

[0018] In this method, the aforementioned shielding member can also be disposed on the aforementioned holder. By using the shielding member disposed on the holder to shield a portion of the particles scattered from the target material, the surface roughness of the first anti-reflection film can be minimized as much as possible.

[0019] In the aforementioned joining process of this method, the aforementioned first surface of the cover portion can also be brought into contact with the aforementioned end portion of the frame portion, and laser irradiation can be applied to the contact portion to directly join the aforementioned first surface of the cover portion and the aforementioned end portion of the frame portion. This allows for the manufacture of a protective cover with excellent airtightness and high bonding strength. [Effects of the Invention]

[0020] According to the present invention, even when the anti-reflective film is disposed between the frame portion and the cover portion, the frame portion and the cover portion can be appropriately joined. Simple Explanation of the Diagram

[0021] [Figure 1] Cross-sectional view of the protective cover. [Figure 2] A cross-sectional view of the arrow line II-II in Figure 1. [Figure 3] Schematic diagram of the film-forming device. [Figure 4] shows a cross-sectional view of one of the processes in the manufacturing method of the protective cover. [Figure 5] shows a cross-sectional view of one of the processes in the manufacturing method of the protective cover. [Figure 6] shows a plan view of one of the processes in the manufacturing method of the protective cover. [Figure 7] shows a cross-sectional view of one of the processes in the manufacturing method of an electronic device. [Figure 8] shows a schematic diagram of another example of a film-forming device. Implementation

[0022] Hereinafter, with reference to the figures, the embodiments for implementing the present invention will be described. Figures 1 to 8 show one embodiment of the protective cover, electronic device, and method of manufacturing the protective cover of the present invention.

[0023] As shown in Figures 1 and 2, the electronic device 1 includes: an electronic component 2; a substrate 3 on which the electronic component 2 is mounted; a protective cover 4 disposed on the substrate 3 to house the electronic component 2; and a sealing portion 5 to seal the substrate 3 and the protective cover 4.

[0024] As shown in Figure 1, the electronic component 2 is fixed to the substrate 3 and housed within the space inside the protective cover 4. Examples of the electronic component 2 include laser modules, LED light sources, photosensors, camera elements, and optical components such as light switches. In this embodiment, the case where the electronic component 2 is an LED for ultraviolet irradiation is described as an example.

[0025] The substrate 3 has: a first surface 3a supporting the electronic component 2 and the protective cover 4; and a second surface 3b located on the opposite side of the first surface 3a. In this embodiment, the substrate 3 is a plate-like body in which both the first surface 3a and the second surface 3b are composed of planes. Not limited to this shape, the substrate 3 may also have a recess in the portion of the first surface 3a on which the electronic component 2 is mounted.

[0026] The substrate 3 is, for example, composed of a metal, a metal oxide ceramic, an LTCC, or a metal nitride ceramic. Examples of metals include copper and metallic silicon. Examples of metal oxide ceramics include alumina. Examples of LTCCs include those formed by sintering a composite powder containing crystalline glass and refractory fillers.

[0027] Examples of metal nitride ceramics include aluminum nitride. In this embodiment, the substrate 3 is composed of aluminum nitride. The coefficient of thermal expansion of aluminum nitride in the temperature range of 30 to 380°C is, for example, 46 × 10⁻⁷ / °C.

[0028] As shown in Figure 1, the protective cover 4 includes: a frame portion 6; a cover portion 7 covering one end of the frame portion 6; and a connecting portion 8 connecting the frame portion 6 and the cover portion 7.

[0029] The frame portion 6 is a cylindrical body with a through-hole (hole) H at its center. The frame portion 6 surrounds the electronic component 2, which is housed in the space corresponding to the through-hole (hole) H. Although the frame portion 6 is composed of four corner tubes, it can also be other shapes such as cylinders.

[0030] The frame portion 6 has: a first end face 6a, fixed to the cover portion 7; and a second end face 6b, fixed to the substrate 3. The surface roughness Sa (arithmetic mean surface height) of the first end face 6a is preferably set to 0.1~1.0 nm. The surface roughness Sa of the second end face 6b is preferably set to 0.1~1.0 nm. Furthermore, the surface roughness Sa is measured according to ISO 25178 (the same applies below).

[0031] The frame 6 is made of a light-transmitting material, such as glass with a coefficient of thermal expansion of 30×10⁻⁷ to 100×10⁻⁷ / ℃ over a temperature range of 30 to 380℃. It is preferable that the glass material of the frame 6 be ultraviolet-transmitting glass.

[0032] The thickness of the frame 6 is preferably greater than that of the electronic component 2, and it is better if it is 0.01~1mm greater than that of the electronic component 2, even better if it is 0.05~0.5mm greater than that of the electronic component 2, and best if it is 0.1~0.2mm greater than that of the electronic component 2.

[0033] The cover portion 7 is made of a light-transmitting substrate. Specifically, the cover portion 7 is made of a glass substrate, including quartz glass, borosilicate glass, aluminum silicate glass, and other types of glass, a sapphire substrate, a resin substrate, etc.

[0034] In this embodiment, the use of a quartz glass substrate with high ultraviolet transmittance in the cover portion 7 is described. The quartz glass contains fused silica and synthetic silica. The coefficient of thermal expansion of fused silica glass in the temperature range of 30–380°C is, for example, 6.3 × 10⁻⁷ / °C, and the coefficient of thermal expansion of synthetic quartz glass in the same temperature range is, for example, 4.0 × 10⁻⁷ / °C.

[0035] The thickness of the cover 7 is preferably 0.1~1.0mm, even better is 0.2~0.8mm, and optimal is 0.3~0.6mm.

[0036] The cover 7 has: a first surface 7a, which is fixed to the frame 6; and a second surface 7b, which is located on the opposite side of the first surface 7a.

[0037] The first surface 7a has a reflective anti-reflection film (hereinafter referred to as "first reflective anti-reflection film") 9 as a functional film. The first reflective anti-reflection film 9 may have, for example, a multilayer film structure formed by alternatingly depositing a silicon oxide film (SiO 2) as a low refractive index layer and a hafnium oxide film (HfO 2) as a high refractive index layer, but the material of the reflective anti-reflection film is not limited to this embodiment.

[0038] The first surface 7a contacts one end (first end face 6a) of the frame portion 6 via the joining portion 8 and the first anti-reflective film 9. The first anti-reflective film 9 has a contact portion 9a that contacts the frame portion 6. The surface roughness of the contact portion 9a is 0.1~1.0 nm, more preferably 0.1~0.8 nm, and even more preferably 0.2~0.5 nm. By setting the surface roughness Sa of the contact portion 9a to 1.0 nm or less, the weldability between the cover portion 7 and the frame portion 6 is improved, ensuring sufficient airtightness of the joining portion 8. Furthermore, by setting the surface roughness Sa of the contact portion 9a to 0.1 nm or more, the effectiveness of the anti-reflective film can be ensured. In addition, it is preferable that the surface roughness Sa of the first anti-reflective film 9, excluding the contact portion 9a, is also 0.1~1.0 nm.

[0039] The second surface 7b is a surface that forms part of the outer surface of the protective cover 4. The second surface 7b has a reflective anti-reflection film (hereinafter referred to as "second reflective anti-reflection film") 10 as a functional film. The second reflective anti-reflection film 10 may have, for example, a multilayer film structure formed by alternating lamination of a silicon oxide film (SiO2) as a low refractive index layer and a hafnium oxide film (HfO2) as a high refractive index layer, but the material of the second reflective anti-reflection film 10 is not limited to this embodiment.

[0040] The joint 8 that joins the frame 6 and the cover 7 is formed by directly welding the frame 6 and the cover 7 together to a weld 11. The weld 11 is formed by laser bonding. Specifically, the weld 11 is formed in the laser irradiation area by "melting at least one of the frame 6 and the cover 7 and then solidifying the molten portion". That is, it is preferable that the weld 11 is made of, for example, the material of at least one of the frame 6 and the cover 7, and does not substantially contain any material other than the frame 6 and the cover 7.

[0041] As shown in Figure 2, the welded portion 11 may be formed in multiple layers (two in the example) in a concentric ring shape along the through portion (hole) H, but it may also be a single layer. The multiple welded portions 11 may be separate from each other, but they may also overlap. Each welded portion 11 may be configured as a rectangular ring in top view, but it is not limited to this and may be configured as a circular ring or other ring shapes.

[0042] The welded portion 11 is formed by continuously spanning the frame portion 6 and the cover portion 7 in the thickness direction. Furthermore, in this embodiment, there is no interface between the frame portion 6 and the cover portion 7 inside the welded portion 11. Of course, an interface may also remain between the frame portion 6 and the cover portion 7 inside the welded portion 11.

[0043] The width S1 of the welded portion 11 is preferably 10~200μm, more preferably 10~100μm, and best preferably 10~50μm. The thickness S2 of the welded portion 11 is preferably 10~200μm, more preferably 10~150μm, and best preferably 10~100μm.

[0044] The sealing portion 5 that seals the frame portion 6 of the substrate 3 and the protective cover 4 is not particularly limited, but in this embodiment, it is provided with a metallization layer 12 and a solder layer 13 sequentially from the second end face 6b side of the frame portion 6.

[0045] The metallization layer 12 refers to a metal film formed on the second end face 6b of the frame portion 6 of the protective cover 4 by means of, for example, physical vapor deposition. The metallization layer 12 has the function of improving adhesion to the solder layer 13. As the metallization layer 12, materials such as Cr, Ti, Ni, Pt, Au, Co, and multilayer films containing these alloy layers or these metals and alloys can be used.

[0046] As the solder layer (soldering material) 11, it can be made of materials such as Au, Sn, Ag, Pb, and alloys containing these metals, i.e., Au-Sn solder, Sn-Ag solder, Pb solder, etc. The coefficient of thermal expansion of Au-Sn solder in the temperature range of 30~380℃ is, for example, 175×10⁻⁷ / ℃.

[0047] The following describes a method for manufacturing the electronic device 1 with the above-described configuration. Furthermore, the method for manufacturing the electronic device 1 includes a method for manufacturing the protective cover 4.

[0048] The manufacturing method of electronic device 1 includes: a preparation process for preparing a protective cover 4; and a sealing process for fixing the protective cover 4 to a substrate 3.

[0049] The preparation process is the process (method) for manufacturing the protective cover 4. The preparation process includes: a film-forming process, which forms anti-reflective films 9 and 10 on the cover portion 7; and a bonding process, which joins the frame portion 6 and the cover portion 7 after the film-forming process.

[0050] In the film formation process, anti-reflection films 9 and 10 are formed on the first surface 7a and the second surface 7b of the cover portion 7 using a film formation apparatus that performs physical vapor deposition. Hereinafter, with reference to FIG3, the situation of "forming a first anti-reflection film 9 on the first surface 7a by means of film formation apparatus 14" will be explained.

[0051] In this embodiment, a sputtering apparatus such as a magnetron sputtering apparatus is used as the film forming apparatus 14. However, the present invention is not limited to this configuration, and other film forming apparatuses for performing physical vapor deposition methods such as vacuum evaporation can also be used.

[0052] The film-forming apparatus 14 includes: a vacuum chamber 15; a holder 16 and a holder cover 7; a rotating body 17 (rotating cylinder) and a support holder 16; target materials 18a and 18b to disperse particles that form the material of the first reflective anti-film 9; and a shielding member 19 to limit the dispersion direction of particles dispersed from the target materials 18a and 18b.

[0053] The vacuum chamber 15 houses the retainer 16, the rotating body 17, and the targets 18a and 18b. The internal space of the vacuum chamber 15 is set to a predetermined vacuum level by a vacuum pump. An inert gas such as argon can be supplied into the vacuum chamber 15.

[0054] The retainer 16 is used to hold the cover 7 in a state where the first surface 7a of the cover 7 is exposed, allowing it to be easily attached and detached. Although the retainer 16 is made of metal, the material of the retainer 16 is not limited to this embodiment.

[0055] The rotating body 17 is configured in a circular shape and can be detachably attached to and detachably held by a plurality of retainers 16 on its outer circumference. The rotating body 17 rotates about its central axis 17a, thereby causing the retainers 16 to move along its circumference.

[0056] The targets 18a and 18b comprise a first target 18a and a second target 18b arranged side by side within the vacuum chamber 15. The first target 18a and the second target 18b are made of a material used to form the first anti-reflection film 9.

[0057] The shielding member 19 is made of a plate-shaped metal component, but is not limited to that material and shape. The shielding member 19 is disposed between the rotating body 17 and each of the targets 18a and 18b. Furthermore, the shielding member 19 is disposed between the first target 18a and the second target 18b arranged side by side.

[0058] In the film formation process, while rotating the rotating body 17, a portion of the particles scattered from the target materials 18a and 18b are shielded by the shielding member 19, and at the same time, the particles that are scattered without contacting the shielding member 19 are attached to the first surface 7a of the cover 7, which is moving while being held in the holder 16.

[0059] Specifically, as shown in Figure 3, a portion of the particles scattered from each target material 18a and 18b, as indicated by arrow D1, scatter towards the rotating body 17 without contacting the shielding member 19. Conversely, another portion of the particles scattered from each target material 18a and 18b, as indicated by arrow D2, scatters in contact with the shielding member 19.

[0060] In this way, by shielding the particles scattered from each of the target materials 18a and 18b by the shielding member 19, the angle of incidence of the particles relative to the first surface 7a of the cover portion 7 held by the retainer 16 is limited. In this way, the particles can be uniformly attached to the first surface 7a of the cover portion 7.

[0061] By rotating the rotating body 17 multiple times, particles scattered from each target material 18a, 18b are deposited on the first surface 7a, thereby forming a film with a predetermined thickness. In the case where the first anti-reflective film 9 has a multilayer film structure, target materials corresponding to the materials constituting each layer are prepared, and the above film-forming process is repeated multiple times. This forms the first anti-reflective film 9 on the first surface 7a of the cover portion 7.

[0062] In the film-forming process, the second anti-reflection film 10 can be formed on the second surface 7b of the cover portion 7 by means of the film-forming device 14, in the same manner as the film-forming of the first anti-reflection film 9. The order of film formation of the first anti-reflection film 9 and the second anti-reflection film 10 is not particularly limited, and the second anti-reflection film 10 can also be formed before the first anti-reflection film 9.

[0063] In the joining process of the frame portion 6 and the cover portion 7, the first surface 7a of the cover portion 7 is joined to one end of the frame portion 6, namely the first end face 6a. That is, in the joining process, the first surface 7a of the cover portion 7 is brought into contact with the first end face 6a of the frame portion 6, and the contact portion is irradiated with laser, thereby directly fusing the first surface 7a of the cover portion 7 and the first end face 6a of the frame portion 6.

[0064] Specifically, firstly, as shown in FIG4, a cover portion 7 is prepared to contact a frame portion 6 having a metallization layer 12 and a solder layer 13 formed thereon. Secondly, the first surface 7a of the cover portion 7 is brought into contact with the first end face 6a of the frame portion 6. In this case, the contact portion 9a of the first anti-reflective film 9 formed on the first surface 7a of the cover portion 7 will contact the first end face 6a of the frame portion 6.

[0065] In this state, as shown in FIG. 5, the laser irradiation device 20 focuses the laser L and irradiates the contact portion between the frame portion 6 and the cover portion 7. The laser L irradiates from at least one side of the frame portion 6 and the cover portion 7. In this embodiment, the laser L irradiates from the cover portion 7 side. Thereby, the contact portion between the frame portion 6 and the cover portion 7 is fused to form a fusion portion 11, and the frame portion 6 and the cover portion 7 are joined by the fusion portion 11.

[0066] As for laser L, an ultrashort pulse laser with a pulse width in the picosecond or femtosecond range is appropriately used.

[0067] The wavelength of the laser (L) is not particularly limited as long as it is the wavelength that can pass through the glass component, but for example, 400~1600nm is preferred, and 500~1300nm is even better. The pulse width of the laser (L) is preferably below 10ps, even better than 5ps, and optimally between 200fs and 3ps. The focusing diameter of the laser (L) is preferably below 50μm, even better than 30μm, and even better than 20μm.

[0068] The repetition frequency of the laser L must be such that continuous heat accumulation is generated. Specifically, 100kHz or higher is preferred, 200kHz or higher is even better, and 500kHz or higher is still even better.

[0069] Furthermore, it is preferable to use a method of "dividing one pulse into multiple pulses and further shortening the pulse interval for irradiation" (burst mode). This makes it easier to generate heat accumulation and stably form the joint 8.

[0070] As shown in Figure 6, the laser L scans outside the through-hole (hole) H by tracing an annular track T along the through-hole (hole) H. In this case, the laser L scans by overlapping its irradiation area R on the annular track T once around the annular track T. Alternatively, the laser L scans by traversing its annular track T multiple times. Furthermore, when multiple welded portions 11 are formed in a concentric ring, multiple annular tracks T of the scanning laser L are also set in a concentric ring.

[0071] A protective cover 4 is manufactured by forming a predetermined number of welded portions 11, which are joined by the joint portion 8 to the frame portion 6 and the cover portion 7.

[0072] In the sealing process of fixing the protective cover 4 to the substrate 3, firstly, as shown in FIG. 7, the protective cover 4 obtained in the preparation process and the substrate 3 on which the electronic component 2 is mounted are prepared. Secondly, the second end face 6b of the frame portion 6 is brought into contact with the first surface 3a of the substrate 3 via the metallization layer 12 and the solder layer 13. By heating in this state, the solder layer 13 is softened and flowed (reflow soldering), and the frame portion 6 and the substrate 3 are joined by the solder layer 13. In addition, the solder layer 13 can also be heated using a heating furnace or a laser. In this way, a sealing portion 5 is formed to seal the substrate 3 and the protective cover 4.

[0073] Figure 8 illustrates another example of the film-forming apparatus 14. In this example, the shielding members 19a and 19b of the film-forming apparatus 14 are disposed on the holder 16. The shielding members 19a and 19b include a first shielding member 19a and a second shielding member 19b configured to clamp a cover 7, which is held in the holder 16. Each shielding member 19a and 19b is a metal plate-shaped member, which is detachably mounted relative to the holder 16. Each shielding member 19a and 19b is configured to face the direction of travel of the holder 16 (the direction of rotation of the rotating body 17).

[0074] In this example, during the film formation process, a portion of the particles scattered from each of the shielding members 19a and 19b can be shielded by the shielding members 18a and 18b disposed in the holder 16.

[0075] According to the manufacturing method of the protective cover 4 and electronic device 1 of this embodiment described above (manufacturing method of protective cover 4), in the film formation process, the direction of particle dispersion from each shielding member 18a, 18b is restricted by the shielding members 19, 19a, 19b, thereby allowing the particles to be uniformly accumulated on the first surface 7a of the cover portion 7.

[0076] Therefore, the surface roughness Sa of the contact portion 9a of the first anti-reflection film 9 is set to 0.1~1.0 nm. Thus, when the contact portion 9a of the first anti-reflection film 9 comes into contact with the first end face 6a of the frame portion 6, the adhesion is improved. In this state, by irradiating the contact portion with a laser L, a joint portion 8 with sufficient bonding strength can be formed. This joint portion 8 also ensures sufficient airtightness of the protective cover 4.

[0077] Furthermore, this invention is not limited to the above-described embodiments or the described effects. Various modifications can be made to this invention without departing from the spirit of this disclosure.

[0078] In the above embodiment, although an example is shown where "a metallization layer 12 and a solder layer 13 are formed on the frame portion 6 of the protective cover 4, and the substrate 3 is sealed to the protective cover 4", the present invention is not limited to this configuration. For example, a metallization layer and a solder layer may be formed in advance on the first surface 3a of the substrate 3, and the second end face 6b of the frame portion 6 of the protective cover 4 may be sealed to the first surface 3a of the substrate 3.

[0079] Alternatively, the second end face 6b of the frame portion 6 can be made to directly contact the first surface 3a of the substrate 3 without using the aforementioned metallization layer and solder layer, and the contact portion can be directly fused together by laser irradiation. [Example]

[0080] The following describes embodiments and comparative examples of the present invention. Both the embodiments and comparative examples use a substrate-shaped synthetic quartz as the cover and a quadrangular cylindrical synthetic quartz as the frame.

[0081] In Examples 1-3, a reflective anti-reflection film consisting of alternating layers of silicon oxide (SiO2) and hafnium oxide (HfO2) was formed on the surface of the cover using the sputtering method of the above-described manufacturing method (film formation process). Furthermore, the length of the shielding member that restricts the scattering direction of particles from the target plate was adjusted, thereby adjusting the surface roughness Sa of the contact portion. The target plate is used to scatter particles of the material forming the first reflective anti-reflection film. On the other hand, in Comparative Example 1, the sputtering method described above was not used; that is, a reflective anti-reflection film consisting of alternating layers of silicon oxide (SiO2) and hafnium oxide (HfO2) was formed on the surface of the cover using a film formation apparatus without the aforementioned shielding member. This yielded samples of the cover portions of Examples 1-3 and Comparative Example 1, where the surface roughness of the reflective anti-reflection film at the contact portion differs between Examples 1-3. In addition, a reflective anti-reflective film with the same surface roughness is also formed on the parts of each sample other than the contact area.

[0082] Subsequently, the cover is placed on the frame by overlapping the contact portion of the cover with one end of the frame, and the overlapping portion is further irradiated with an ultra-short pulse laser to join the frame and the cover, thus creating a sample of the protective cover.

[0083] Subsequently, the adhesion between the cover and frame of the obtained protective cover samples was evaluated using an accelerated degradation test conducted by PCT (Pressure Cooker Test). Specifically, the protective cover samples manufactured as described above were kept at 121°C, 2 atmospheres, and 80% relative humidity for 12 hours. Samples that maintained the adhesion between the cover and frame were then classified as good ("0"), while samples that could not maintain the adhesion were classified as defective ("×"). The results are shown in Table 1.

[0084]

[0085] As can be seen from Table 1, when the surface roughness Sa of the contact part becomes 1.1 or higher, the fit between the cover and the frame deteriorates.

[0086] 1: Electronic devices 2: Electronic components 3: Substrate 4: Protective cover 6: Frame 6a: First end face of the frame 7: Cover 7a: First surface 7b: Second surface 9: First reflection anti-reflection film 9a: Contact part 10: Second anti-reflection film 14: Film Forming Device 16: Keeping 18a: First target material 18b: Second target material 19: Shielding components 19a: First shielding component 19b: Second shielding component L: Laser

Claims

1. A protective cover for protecting electronic components, characterized in that it comprises: a frame portion; a cover portion covering one end of the frame portion; and a connecting portion connecting the frame portion and the cover portion, wherein the cover portion has a first surface that contacts the aforementioned end of the frame portion via the connecting portion, the first surface having a first anti-reflection film, the first anti-reflection film having a contact portion that contacts the frame portion, and the surface roughness Sa of the contact portion being 0.1~1.0 nm.

2. As in request item 1, the protective shield, wherein, The aforementioned cover has a second surface located on the opposite side of the aforementioned first surface, and the aforementioned second surface has a second anti-reflective film.

3. An electronic device, characterized in that it comprises: an electronic component; a substrate on which the electronic component is mounted; and a protective cover as claimed in claim 1 or 2, which is coupled to the substrate in such a way as to house the electronic component therein.

4. A method for manufacturing a protective cover, which is a method for manufacturing a protective cover as claimed in claim 1 or 2, characterized in that it comprises: a film-forming process, wherein a first anti-reflective film is formed on the first surface preceding the cover portion by means of a film-forming apparatus for performing physical vapor deposition; and a bonding process, wherein the first surface preceding the cover portion is bonded to one end of the frame portion, the film-forming apparatus comprising: a holder for holding the cover portion and moving it in a predetermined direction; a target for scattering particles of the material forming the first anti-reflective film; and a shielding member for restricting the scattering direction of the particles scattering from the target material, wherein in the film-forming process, while shielding a portion of the particles scattering from the target material by means of the shielding member, particles scattering without contacting the shielding member are attached to the first surface of the cover portion moving while held in the holder.

5. The method for manufacturing the protective cover as described in claim 4, wherein, The aforementioned target material includes a first target material and a second target material arranged in parallel, and the aforementioned shielding member is disposed between the aforementioned first target material and the aforementioned second target material.

6. The method for manufacturing the protective cover as described in claim 4, wherein, The aforementioned shielding component is disposed on the aforementioned retainer.

7. A method for manufacturing the protective cover as described in any of claims 4 to 6, wherein, In the aforementioned joining process, the aforementioned first surface of the cover portion is brought into contact with the aforementioned end portion of the frame portion, and a laser is irradiated onto the contact portion, thereby directly joining the aforementioned first surface of the cover portion and the aforementioned end portion of the frame portion.

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