Cold plate having opening and related systems

Abstract

An electronic assembly with a cold plate having openings is provided. In one aspect, a system includes an array of electronic components, a control board, and a cold plate having multiple openings therethrough. The cold plate can be arranged between the array of electronic components and the control board. The cold plate can cool the array of electronic components. The system may also include multiple through connectors arranged in the openings in the cold plate and configured to connect the array of electronic components to the control board. The cold plate can also be used to cool the control board electronics and the through connectors.

Description

[Technical Field]

[0001] This invention generally relates to cooling elements and electronic assemblies having cooling elements. Cross-Reference to Related Applications This application claims the benefit of U.S. Provisional Patent Application No. 63 / 260,387, filed August 18, 2021, entitled “ELECTRONIC ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME,” the disclosure of which is incorporated herein by reference in its entirety for all purposes. [Previous Technology]

[0002] A system-on-wafer (SoW) assembly may include a SoW and a heat dissipation structure coupled to the SoW. In some applications, the SoW may include a voltage regulation module (VRM) and a thermal interface material between the heat dissipation structure and the SoW. A cold plate may be positioned near the VRM to cool the VRM during operation. There are technical challenges regarding implementing a cold plate in an electronic assembly with a limited area while providing the desired amount of cooling. [Summary of the Invention]

[0003] In one aspect, a system is provided, comprising: an array of electronic components; a printed circuit board assembly; a cold plate having a plurality of openings therethrough, the cold plate being disposed between the array of electronic components and the printed circuit board assembly, and the cold plate being configured to cool the array of electronic components; and a plurality of pass-through connectors disposed in the openings of the cold plate and configured to connect the array of electronic components to the printed circuit board assembly. In some embodiments, the cold plate includes a cold plate body, the cold plate body including an array of cooling elements, each of which is configured to cool at least one of the electronic components, and each of the cooling elements receiving an assembly of heat sinks (fins). In some embodiments, the cold plate further includes an inlet port configured to receive coolant and an outlet port configured to discharge coolant. In some embodiments, the cold plate further includes: an inlet manifold connected to the inlet port, an outlet manifold connected to the outlet port, and a plurality of flow channels connecting the inlet manifold to the cold plate body and connecting the cold plate body to the outlet manifold. In some embodiments, cooling elements are arranged in a plurality of parallel coolant flow paths, each of the flow channels being connected to a cold plate body via a corresponding orifice, and each orifice having a diameter for providing substantially equal flow rates through the parallel coolant flow paths. In some embodiments, inlet and outlet manifolds are arranged in a plane different from the cold plate body. In some embodiments, the heat sink is arranged in one of the following configurations: parallel, serpentine, cylindrical, or staggered. In some embodiments, the through connector includes a pogo pin. In some embodiments, the through connector is further configured to provide one or more of electrical, thermal, or communication conductivity between the array of electronic components and the printed circuit board assembly. In some embodiments, the electronic components are voltage regulation modules (VRMs). In some embodiments, the printed circuit board assembly includes an array of integrated circuit dies, and the through connector is further configured to connect the array of integrated circuit dies to the array of voltage regulation modules.On the other hand, a cold plate is provided for cooling an array of electronic components, the cold plate comprising: a body including an array of cooling components, wherein the body has a plurality of openings formed therethrough, each of the openings being configured to receive at least one through connector; an inlet port configured to receive coolant; an inlet manifold configured to receive coolant from the inlet port; a plurality of inlet channels configured to route coolant from the inlet manifold to the body; an outlet port configured to discharge coolant; an outlet manifold configured to route coolant to the outlet port; and a plurality of outlet channels configured to route coolant from the body to the outlet manifold. In some embodiments, the inlet manifold and the outlet manifold are arranged in a plane different from the body. In another aspect, a cold plate is provided for cooling an array of electronic components, the cold plate comprising: a body including an array of cooling elements, wherein the body has a plurality of openings formed therethrough, each of the openings being configured to receive at least one through connector; an inlet port configured to receive and supply coolant to the body; and an outlet port configured to discharge coolant from the body. In some embodiments, the cold plate further comprises: an inlet manifold configured to receive coolant from the inlet port; a plurality of inlet channels configured to route coolant from the inlet manifold to the body; an outlet manifold configured to route coolant to the outlet port; and a plurality of outlet channels configured to route coolant from the body to the outlet manifold, wherein the inlet manifold and the outlet manifold are arranged in a plane different from the body. In some embodiments, each of the cooling elements is configured to cool a corresponding electronic component arranged adjacent to the cooling element. In some embodiments, each of the cooling elements accommodates an assembly of heat sinks configured to increase heat transfer to the coolant. In some embodiments, the heat sink is arranged in one of the following configurations: parallel, serpentine, cylindrical, or staggered. In some embodiments, the cooling element is arranged in a plurality of parallel coolant flow paths, each of the inlet channels being connected to the body via a corresponding orifice, and each of the orifices having a diameter for providing substantially equal flow rates through the parallel coolant flow paths. In another aspect, a system is provided comprising: an electronic component; a cold plate having an opening therethrough and configured to cool the electronic component; and a through connector extending through the opening and electrically connected to the electronic component. In some embodiments, the system further comprises: a printed circuit board assembly arranged such that the cold plate is positioned between the electronic component and the printed circuit board assembly, wherein the through connector is configured to electrically connect the electronic component to the printed circuit board assembly. In some embodiments, the through connector includes a spring pin.In some embodiments, the cold plate houses an assembly of heat dissipation components.

Implementation Method

[0005] The following detailed description of certain embodiments presents various descriptions of particular embodiments. However, the innovations described herein can be embodied in a variety of different ways, such as as defined and covered by the claims. Reference is made in this specification to the accompanying drawings, wherein similar reference numerals and / or terms may indicate the same or functionally similar elements. It will be understood that the elements illustrated in the figures are not necessarily drawn to scale. Furthermore, it will be understood that some embodiments may include more elements than those illustrated in the drawings and / or a subset of the elements illustrated in the drawings. Additionally, some embodiments may incorporate any suitable combination of features from two or more drawings. The headings provided herein are merely for convenience and are not intended to affect the meaning or scope of the claims. Electrically connected System-on-Wafer (SoW) assemblies in electronic assemblies are examples of electronic assemblies. A SoW assembly may include a SoW and a cooling system connected to the SoW. The SoW may include an array of integrated circuit dies. A SoW assembly may include a wafer-level package structure. The SoW and the cooling system may include an array of electronic components or modules (such as voltage regulation modules (VRMs)) positioned therebetween. Thermal interface material (TIM) can be positioned between electronic components and a cooling system. As discussed below, the cooling system may include a cold plate configured to cool the VRM. One or more aspects of this application correspond to a two-sided cold plate in the case of a power and signal delivery system. Coolant flowing through microchannels within the cold plate enables cooling of high-power components on both sides of the cold plate. In some embodiments, the cold plate may be implemented or otherwise incorporated into openings or slots that can accommodate through connectors, such as compliant connectors (e.g., as spring pins, flexible pins, spring contacts, etc.), sockets and plugs, and / or male and female connectors. Such connectors may be embedded in a housing or magazine that can be press-fitted into the slots in the cold plate. The assembly method and form factor of the pins—as well as their number and size—may vary depending on the implementation. Connectors can be used to transmit power and / or data signals through a cold plate between electronic components. In some embodiments, the cold plate includes inlet and outlet coolant manifolds at both ends. The cold plates disclosed herein can provide liquid cooling to electronic components on opposite sides of the respective cold plate. For example, the cold plate can provide cooling to both a voltage regulation module on one side of the cold plate and electronic components on a control board on the opposite side of the cold plate. Such a cold plate can also cool a through connector between electronic components on opposite sides, wherein the through connector is positioned in an opening in the cold plate. The cold plates disclosed herein can provide structural stiffness and / or rigidity to the central region of a system-on-a-wafer assembly.In some applications, the cold plate disclosed herein can be used to cool arrays of electronic components on opposite sides. A cold plate according to any suitable principles and advantages disclosed herein can cool individual electronic components on each opposite side. Figure 1 is a schematic cross-sectional side view of a system-on-wafer (SoW) assembly 10 coupled to a cold plate 200, wherein a VRM 16 is on one side of a SoW 14 and a control board 20 is on the other side. Figure 2 illustrates an exploded perspective view of a cold plate 200 according to an aspect of this disclosure. In some implementations, the cold plate 200 may be inverted compared to the illustrated view when mounted in the electronic assembly 10. As illustrated in Figure 1, the SoW assembly 10 includes a heat dissipation structure 12, a SoW 14, a VRM 16, a cold plate 200, and a control board 20. The heat dissipation structure 12 may be a heat sink, a heat radiator, or any other suitable structure for heat dissipation. In some embodiments, the SoW assembly 10 may further include a TIM (not shown) between the cold plate 200 and the VRM 16. SoW 14 may include an array of integrated circuit die segments. VRM 16 can convert high voltage, low current to a lower voltage level at a higher current to provide a power supply voltage for the integrated circuit die segments of SoW 14. The array of VRM 16 is an example of an array of electronic components that can be arranged as shown in Figure 1. The arrangement of Figure 1 can be applied to a variety of different electronic components. Control board 20 may include an array of electronic components 22. The control board is an example of a printed circuit board (PCB). In Figure 1, the PCB assembly includes control board 20 and electronic components 22. Electronic components 22 may be control circuits, each configured to control a corresponding one of the VRM 16. For example, electronic components 22 may be configured to provide power and / or control signals to the corresponding VRM 16 to operate the VRM 16. Cold plate 200 may include multiple openings therein having through connectors 24. For example, through connectors 24 may be spring pins. Where through connectors 24 extend through openings in cold plate 200, through connectors 24 may be included in the central region of SoW assembly 10. As illustrated, the through connector 24 can be positioned in a corresponding region of each integrated circuit die corresponding to SoW 14. The through connector 24 can electrically connect the electronic components 22 on the control board 20 to the VRM 16. For example, each opening in the cold plate 200 can be configured to receive a plurality of through connectors 24, which can be housed in a housing such as a box. The through connector 24 can be configured to connect electrical components arranged on opposite sides of the cold plate 200 to provide power and / or control signals between them.According to further aspects of this application, the structure of the cold plate 200 of this application allows for simultaneous, efficient cooling and data / power delivery, enabling a compact design. Some applications have demanding space requirements, allowing any space savings within the assembly's footprint to be utilized to improve processing power. For example, in VRM scenarios, higher computational density and / or processing power can be achieved where the footprint used by the array VRM is larger than that used by other components. Some SoW assemblies provide a separate physical area on the board for providing power and / or signal delivery. However, this design (1) limits the cold plate size, which typically negatively impacts thermal performance and the supported power, thus limiting the overall performance of the system; and / or (2) increases the board area, which affects the system's volumetric efficiency and compactness. Avoiding increases in board size can prevent performance degradation due to increased computational latency associated with larger board sizes. The aspects of this disclosure can address at least some of these problems by providing cooling and power delivery and / or signal transmission through the cold plate without limiting the size of the cold plate and / or increasing the plate area. Although aspects of this disclosure are described in conjunction with the SoW assembly 10 including multiple VRMs, this disclosure can also be employed in other applications, such as for dense servers, mezzanine boards, etc. Referring now to FIG2, an embodiment of the cold plate 200 of this application will be described. The illustrated cold plate 200 includes an inlet port 202, an inlet manifold 204, a mechanical support 206, a flow channel 208, a body 209, a heat sink 210 within the body 209, an outlet manifold 212, and an outlet port 214. The cold plate 200 also includes an opening 216 (also referred to as a receptacle or slot) for a through connector (e.g., a spring pin) that provides thermal, power, and / or communication connectivity through the cold plate 200. In some implementations, the cold plate body 209 may be formed from a machined copper component that has been soldered. The cold plate body 209 may be formed from any other suitable material. The cold plate body 209 may include an array of cooling elements 400 (e.g., labeled in FIG. 3), each of which surrounds a heat sink 210. FIG. 3 is a plan view illustrating the flow of coolant 218 through the cold plate 200 of FIG. 2 according to an aspect of the present disclosure. As shown in FIG. 3, in some implementations, the cold plate 200 may form a plurality of parallel coolant flow paths 220 through which coolant 218 may flow. The arrows of the parallel coolant flow paths 220 indicate the general direction of coolant flow, although coolant may flow through corners of the cooling elements 400 as it flows between adjacent cooling elements 400 in the coolant flow paths.The coolant flow from inlet port 202 to outlet port 214 can be controlled for a substantially equal distribution using different orifice sizes (see Figures 6A and 6B). Inlet manifold 204, together with flow channel 208, can provide substantially equal coolant flow to each of the coolant flow paths 220. As the coolant cools adjacent electronic components by flowing through heat sink 210 (see Figure 2), the coolant 218 is gradually heated. Outlet manifold 212 can route the coolant 218 to outlet port 214. Coolant 218 can be discharged from outlet port 214. Figure 3 also illustrates how the body 209 of the cold plate 200 is formed as an array of cooling elements 400. Referring to Figures 2 and 3, each cooling element 400 includes a portion of the body 209 that defines the volume accommodating the heat sink 210. Furthermore, each cooling element 400 is fluidly connected to one or more of its adjacent cooling elements 400 in the same coolant flow path 220 near the corner of the cooling element 400, such that coolant 218 flows around the opening 216 in the cold plate 200. Figures 4A-4D illustrate the cold plate 200 in various stages of a system assembly with additional components attached thereto. Figure 4A illustrates the assembled cold plate 200, Figure 4B illustrates the cold plate 200 with dripless quick disconnect devices attached to the inlet and outlet, Figure 4C illustrates the connector assembly mounted into the opening in the cold plate 200, and Figure 4D illustrates the control plate attached to one side of the cold plate 200. Referring to Figures 4A-4D, the dripless quick disconnect device 302 can be attached to each of the inlet port 202 and the outlet port 214, respectively. The dripless quick disconnect device 302 simplifies the process of attaching the cold plate 200 to the coolant supply / drain device. An opening 216 in the cold plate 200 can receive a connector housing 304 configured to connect an array of electronic components (not shown) disposed beneath the cold plate 200 to a printed circuit board assembly 306. Specifically, each housing 304 can accommodate multiple through connectors (e.g., spring pins) that provide thermal, power, and / or communication connections between the electrical components and the printed circuit board assembly 306. In some implementations, the through connectors can provide relatively high levels of current, causing them to generate significant amounts of heat. Therefore, the cold plate can also cool the through connectors inserted into the opening 216 in the cold plate 200. For example, thermal contact for heat transfer can be created by press-fitting the connector housing 304 into the cold plate 200. Furthermore, a thermal interface material can be added between the connector housing 304 and the cold plate 200 to improve heat transfer. In some examples, the electrical components may include a VRM configured to receive power and control signals from the printed circuit board assembly 306.Printed circuit board assembly 306 may include a printed circuit board (such as a control board) and an array of electronic components on the printed circuit board. Furthermore, the inlet manifold 204 and outlet manifold 212 may be located in a different plane than the body 209 of the cold plate 200, as shown in Figures 4A-4D. By arranging the inlet manifold 204 and outlet manifold 212 in different planes, compared to an implementation where the inlet manifold 204 and outlet manifold 212 are formed in the same plane as the body 209 of the cold plate 200, the overall footprint of the cold plate 200 can be reduced. Therefore, aspects of this disclosure can increase the volumetric efficiency and compactness of the system. Figures 5A-5D all illustrate various thermal diagrams of embodiments of a heat sink 210 within a cooling element 400 of the cold plate 200 array of Figure 2. In Figure 5A, the heat sinks 210 are arranged parallel to each other. Figure 5B illustrates a serpentine arrangement of the heat sink 210. Figure 5C illustrates an embodiment where the heat sink 210 is cylindrical. Figure 5D illustrates an embodiment in which the heat sinks 210 are staggered. According to the embodiment, the cold plate 200 and the heat sinks 210 are designed to increase heat transfer to the coolant 218 and decrease the flow rate of the coolant 218. In some embodiments, the heat transfer to the coolant 218 may be greater than a threshold heat transfer rate, and the coolant flow rate may be less than a threshold flow rate. The cold plate 200 also includes flow paths near the corners of each cooling element 400, these flow paths connecting the elements to form parallel coolant flow paths 220 (see Figure 3). Figures 6A and 6B illustrate the inlet manifold 204 according to aspects of the present disclosure and the flow of coolant 218 through the inlet manifold 204 and flow channel 208. Figure 6A shows an enlarged view of the inlet port 202, inlet manifold 204, and flow channel 208 of the cold plate 200. Figure 6B illustrates the flow of coolant 218 through the inlet port 202, inlet manifold 204, and flow channel 208 shown in Figure 6A. Each of the flow channels 208 is connected to the body 209 of the cold plate 200 via a corresponding orifice 602. In some embodiments, the orifices 602 have different dimensions (e.g., diameters) to control the flow rate of coolant 218 through each orifice 602. For example, the pressure of coolant 218 may decrease for flow paths further away from the inlet port 202, and therefore, the diameter of the orifice 602 may increase with increasing distance from the inlet port 202. In some embodiments, the diameter of the orifice 602 is selected to provide substantially equal flow rates through each parallel coolant flow path 220. Thus, the size of the orifice 602 can equalize the flow rates through the parallel coolant flow paths 220 in the cold plate 200. FIG7 illustrates a cross-sectional view of a portion of a SoW assembly including the cold plate 200 according to an aspect of the present disclosure. Referring to FIG7, the cold plate 200 is attached to an array of VRM 16.A TIM 701 is located above each VRM 16, between the VRM 16 and the cold plate 200. The VRM 16 is arranged on a SoW 14, which is coupled to a heat dissipation structure 702. The cold plate 200 can be attached to the heat dissipation structure 702 via a plurality of bolts 704 extending through the SoW 14. The TIM 701 can reduce the heat transfer resistance between the VRM 16 and the cold plate 200. Figure 8 is a perspective view of a cold plate 200 including a plurality of through connectors 24 arranged in openings in the cold plate 200 according to an aspect of the present disclosure. In the illustrated embodiment, the through connectors 24 are implemented as spring pins housed in a housing. The spring pins can be used to provide power and / or communication connections to connect the VRM 16 to a control board 20 (e.g., as shown in Figure 1). Figure 9 is a plan view illustrating the flow of coolant 218 through the cold plate 900 according to one embodiment. In contrast to the embodiment of Figure 3, the cold plate 900 is without a manifold. The cold plate 900 is formed by a plurality of cooling elements 400, each fluidly connected to all its adjacent cooling elements 400. Therefore, instead of forming multiple parallel coolant flow paths 220, the coolant 218 can flow vertically and horizontally to produce a substantially diagonal flow through the cold plate 900. In some implementations, each of the cooling elements 400 may surround an assembly of heat sinks to further facilitate diagonal flow. In one embodiment, the heat sinks may be distributed substantially uniformly to increase performance. Because the coolant 218 flows between opposite corners of the cold plate 900, the cold plate 200 can be implemented without a manifold (e.g., see the inlet manifold 204 and outlet manifold 212 of Figure 2). This reduces the size of the cold plate 900 and lowers assembly complexity compared to a manifold design. However, in some applications, a manifold-equipped cold plate 200 can achieve increased cooling compared to a manifold-less design 900. Any suitable principles and advantages disclosed herein can be applied to wafer-level packaging and / or high-density multi-die packaging. While the embodiments disclosed herein use a VRM as an example, any suitable electrical modules, components, dies, wafers, etc., can be mounted on a wafer and utilize any suitable principles and advantages disclosed herein. Any suitable combination of features of two or more embodiments disclosed herein can be implemented. The SoW assembly disclosed herein can be included in a processing system. Features of this disclosure (such as any of the features of the cold plate disclosed herein) can be implemented in any suitable processing system. The processing system can include, for example, the SoW assembly 10 of FIG. 1. The processing system can have high computational density and can dissipate the heat generated by the processing system. In some applications, the processing system can perform trillions of operations per second.The processing system can be used and / or specifically configured for high-performance computing and / or compute-intensive applications, such as neural network training and / or processing, machine learning, artificial intelligence, etc. The processing system can be redundant. In some applications, the processing system can be used to perform neural network training to generate data for autonomous driving systems, other autonomous vehicle functions, or advanced driver assistance systems (ADAS) functions for vehicles (e.g., automobiles). Furthermore, while aspects of this disclosure are described in conjunction with arrays of electronic components, aspects of this disclosure can be applied to cold plates configured to cool individual electronic components on one side. For example, a cold plate configured to cool electronic components may include one or more openings formed therethrough. One or more openings may receive one or more through connectors configured to provide thermal, power, and / or communication connections between the electronic component and a printed circuit board or other electronic components, wherein the cold plate is arranged between the electronic component and the printed circuit board or other electronic components. In summary, unless the context clearly requires otherwise, throughout this specification and claims, the terms “comprising,” “including,” “containing,” “comprise,” “including,” etc., shall be interpreted in an inclusive sense, as opposed to an exclusive or exhaustive sense; that is, in the sense of “including but not limited to.” The term “coupled” as commonly used herein refers to two or more elements that can be directly connected or connected by one or more intermediate elements. Similarly, the term “connected” as commonly used herein refers to two or more elements that can be directly connected or connected by one or more intermediate elements. Additionally, when used in this application, the terms “in this document,” “above,” “below,” and similar terms shall refer to the entire application and not to any particular part of the application. Where the context permits, the use of singular or plural terms in the above detailed description may also include either the plural or the singular, respectively. The term “or” in relation to a list of two or more projects encompasses all of the following interpretations: any one of the items in the list, all the items in the list, and any combination of the projects in the list. Furthermore, the conditional language used herein (among others, such as "may," "can," "possibly," "may," "for example," "like," etc.), unless otherwise specifically stated or understood in the context in which they are used, is generally intended to convey that certain embodiments include certain features, elements, and / or states, while other embodiments do not include certain features, elements, and / or states. Therefore, such conditional language is generally not intended to imply that features, elements, and / or states are necessary in any way for one or more embodiments. The foregoing description has been described with reference to specific embodiments. However, the illustrative discussion above is not intended to be exhaustive or to limit the invention to the precise forms described. Many modifications and variations are possible in light of the above teachings.Therefore, this enables others skilled in the art to best utilize the described technology and various embodiments with various modifications suitable for various uses. Although this disclosure and examples have been described with reference to the accompanying drawings, various changes and modifications will become apparent to those skilled in the art. Such changes and modifications are to be understood as being included within the scope of this disclosure. [Simplified Explanation of the Diagram]

[0004] Embodiments of the present disclosure will now be described by way of non-limiting example with reference to the accompanying drawings. [Figure 1] is a schematic cross-sectional side view of a system-on-wafer (SoW) assembly coupled to a cold plate, wherein a voltage regulation module (VRM) is on the SoW on one side and a control board is on the other side. [Figure 2] illustrates an exploded perspective view of a cold plate according to an aspect of the present disclosure. In some implementations, the cold plate may be inverted compared to the illustrated view when mounted in an electronic assembly. [Figure 3] is a plan view illustrating the flow of coolant through the cold plate of Figure 2 according to an aspect of the present disclosure. [Figures 4A-4D] illustrate cold plates in various stages of a system assembly with additional elements attached thereto. [Figures 5A-5D] all illustrate thermal diagrams associated with various embodiments of a heat sink within an element of the cold plate array of Figure 2. [Figures 6A] and [Figure 6B] illustrate an inlet manifold according to an aspect of the present disclosure and the flow of coolant through the inlet manifold and flow channels. [Figure 7] illustrates a cross-sectional view of a portion of a SoW assembly including a cold plate according to an aspect of the present disclosure. [Figure 8] is a perspective view of a cold plate including a plurality of through connectors arranged in openings in the cold plate according to an aspect of the present disclosure. [Figure 9] is a plan view illustrating the flow of coolant through the cold plate according to an embodiment.

Claims

1. A cooling system for electronic components, comprising: An array of electronic components; Printed circuit board assembly; A cold plate having multiple openings therethrough is disposed between the array of electronic components and the printed circuit board assembly, and the cold plate is configured to cool the array of electronic components. And a plurality of through connectors arranged in the plurality of openings in the cold plate, each of the through connectors being configured to electrically connect a corresponding one of the electronic components to the printed circuit board assembly.

2. The system according to claim 1, wherein: The cold plate includes a cold plate body, the cold plate body includes an array of cooling elements, each of the cooling elements being configured to cool at least one of the electronic components, and each of the cooling elements housing an assembly of heat dissipation components.

3. The system according to claim 2, wherein the cold plate further includes an inlet port configured to receive coolant and an outlet port configured to discharge coolant.

4. The system according to claim 3, wherein the cold plate further comprises: An inlet manifold connected to the inlet port, an outlet manifold connected to the outlet port, and a plurality of flow channels connecting the inlet manifold to the cold plate body and the cold plate body to the outlet manifold.

5. The system according to claim 4, wherein: The cooling elements are arranged in a plurality of parallel coolant flow paths, each of the flow channels being connected to the cold plate body via a corresponding orifice, and each of the orifices having a diameter for providing substantially equal flow rates through the parallel coolant flow paths.

6. The system according to claim 4, wherein the inlet manifold and the outlet manifold are arranged in a plane different from the cold plate body.

7. The system according to claim 3, wherein the heat sink is arranged in one of the following configurations: parallel, serpentine, cylindrical, or staggered.

8. The system according to claim 1, wherein the through connector includes a spring pin.

9. The system according to claim 1, wherein the through connector is further configured to provide one or more of electrical, thermal, or communication conductivity between the array of electronic components and the printed circuit board assembly.

10. The system according to claim 1, wherein the electronic component is a voltage regulation module (VRM).

11. The system according to claim 10, wherein: The printed circuit board assembly includes an array of integrated circuit dies, and the through connector is further configured to connect the array of integrated circuit dies to an array of voltage regulation modules.

12. A cold plate for cooling an array of electronic components, the cold plate comprising: A body comprising an array of cooling elements, wherein the body has a plurality of openings formed therethrough, and each of the openings is configured to receive at least one through connector, wherein each of the through connectors is configured to electrically connect a corresponding one of the electronic elements to a printed circuit board assembly. An inlet port is configured to receive coolant and supply coolant to the body; And an outlet port configured to discharge coolant from the body, wherein the cold plate is configured to cool the array of electronic components.

13. The cold plate according to claim 12, further comprising: An inlet manifold configured to receive coolant from the inlet port; Multiple inlet channels are configured to guide coolant from the inlet manifold to the body; An outlet manifold, configured to guide coolant to the outlet port; And multiple outlet channels configured to guide coolant from the body to the outlet manifold, wherein the inlet manifold and the outlet manifold are arranged in a plane different from the body.

14. The cold plate according to claim 13, wherein: The cooling elements are arranged in a plurality of parallel coolant flow paths, each of the inlet channels being connected to the body via a corresponding orifice, and each of the orifices having a diameter for providing substantially equal flow rates through the parallel coolant flow paths.

15. The cold plate according to claim 12, wherein each of the cooling elements is configured to cool a corresponding electronic component arranged adjacent to the cooling element.

16. The cold plate according to claim 12, wherein each of the cooling elements houses a collection of heat sinks configured to increase heat transfer to the coolant.

17. The cold plate according to claim 16, wherein the heat sink is arranged in one of the following configurations: parallel, serpentine, cylindrical, or staggered.

18. A cooling system for electronic components, comprising: An array of electronic components; Printed circuit board assembly; A cold plate having multiple openings therethrough and configured to cool the electronic components; And multiple through connectors that extend through the opening and electrically connect a corresponding one of the electronic components to the printed circuit board assembly.

19. The system according to claim 18, further comprising: A printed circuit board assembly arranged such that the cold plate is positioned between the electronic components and the printed circuit board assembly.

20. The system according to claim 18, wherein the through connector includes a spring pin.

21. The system according to claim 18, wherein the cold plate accommodates an assembly of heat sinks.

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