Photosensitive components, curing films using them, color filters, optical filters, image display devices, solid-state imaging elements, and infrared sensors.

Abstract

A photosensitive composition comprising: a pigment, an adhesive resin, a polymerizable compound, a photopolymerization initiator, a resin-type dispersant, and a leveling agent, wherein the adhesive resin comprises an alkali-soluble adhesive resin containing a constituent unit having a block isocyanate group, and the photopolymerization initiator comprises an O-acryloyl oxime ester-based photopolymerization initiator.

Description

Technical Field

[0001] One embodiment of the present invention relates to a photosensitive composition capable of low-temperature curing. Prior Technology

[0002] In recent years, organic electroluminescence (EL) display elements, which offer advantages in thinness and flexibility compared to previous liquid crystal display elements and are theoretically more efficient in light utilization, have attracted much attention as display elements for mobile devices or televisions. For outdoor mobile devices, EL display elements are envisioned to include a circular polarizer as an anti-reflective film to prevent reduced visibility due to reflection of external light. However, this circular polarizer not only blocks external light but also blocks the light emitted by the EL display element, thus significantly reducing light utilization efficiency. Furthermore, increasing the element's thickness is also disadvantageous from the perspective of thinness and flexibility. Therefore, there is a growing demand for the development of EL display elements that offer good outdoor visibility even without a circular polarizer. Patent Document 1 discloses a flexible display that uses a color filter instead of a circular polarizer.

[0003] A color filter for suppressing external light reflection is deposited on a display device having the aforementioned organic EL display element. Because the organic light-emitting layer has low heat resistance, it needs to be calcined at low temperatures to form the color pixels of the color filter on the organic EL element. Previously, the color pixels of the color filter deposited on liquid crystal display elements were calcined at a very high temperature of 230°C, but sometimes at even lower temperatures, such as below 100°C. However, if the calcination temperature of the color pixels is lowered, the curing becomes insufficient, and problems such as peeling or surface roughness of the color pixels due to the solvent contained in the applied color composition occur during the next step of color pixel formation. On the other hand, even when the exposure is increased, although the reaction of the cross-linking components contained in the color pixels proceeds and curing occurs, it is very difficult to form a good pattern shape.

[0004] To address the aforementioned problem, photosensitive resin compositions that provide excellent solvent resistance even when curing at low temperatures have been disclosed, including: compositions comprising an alkali-soluble resin having block isocyanate groups and a reactive diluent (Patent Document 2); compositions comprising a polyfunctional thiol containing hydroxyl groups in an alkali-soluble resin having block isocyanate groups (Patent Document 3); and compositions comprising isocyanate groups and hydroxyl groups having specific block structures in the same component or different types of components (Patent Document 4).

[0005] However, none of the compositions described in Patent Documents 1 to 4 satisfy all the requirements of developability, substrate adhesion, pattern shape, and solvent resistance after the low-temperature calcination step. [Existing Technical Documents] [Patent Literature]

[0006] Patent Document 1: Korean Patent Publication No. 10-2013-0134494 Patent Document 2: International Publication No. 2019 / 026547 Patent Document 3: Japanese Patent Application Publication No. 2016-084464 Patent Document 4: Japanese Patent Application Publication No. 2021-102759 Summary of the Invention

[0007] [The problem that the invention aims to solve] One embodiment of the present invention aims to provide a photosensitive composition that can form a hardened film with excellent developability, substrate adhesion, pattern shape, and solvent resistance after a low-temperature calcination step. Another embodiment of the present invention aims to provide a hardened film as a photosensitive composition, and color filters, optical filters, image display devices, solid-state imaging elements, and infrared sensors having the hardened film. [Methods for solving problems]

[0008] One embodiment of the present invention relates to a photosensitive composition comprising: a pigment, an adhesive resin, a polymerizable compound, a photopolymerization initiator, a resin-type dispersant, and a leveling agent, wherein the adhesive resin comprises an alkali-soluble adhesive resin containing constituent units having block isocyanate groups, and the photopolymerization initiator comprises an O-acryloyl oxime ester-based photopolymerization initiator.

[0009] Another embodiment of the present invention relates to the photosensitive composition, wherein a film with a thickness of 3 μm is formed by coating the photosensitive composition and drying it at 90°C for 1 minute, and then exposing it to ultraviolet light at an illuminance of 500 mW / cm² and an irradiation dose of 200 mJ / cm², followed by heating at 90°C for 30 minutes, results in a hardened film with a residual film rate of 75% or more. The residual film rate is a value obtained by dividing the thickness of the hardened film formed by heating at 90°C for 30 minutes by the thickness of the hardened film exposed to ultraviolet light before heating at 90°C for 30 minutes.

[0010] In addition, another embodiment of the present invention relates to the photosensitive composition, wherein the polymeric compound comprises a polymeric compound containing a base-soluble group.

[0011] Another embodiment of the present invention relates to the photosensitive composition, wherein the resin-type dispersant comprises an acidic resin-type dispersant.

[0012] In addition, another embodiment of the present invention relates to the photosensitive composition, wherein the acidic resin type dispersant comprises a photocrosslinking acidic resin type dispersant.

[0013] Another embodiment of the present invention relates to the photosensitive composition, wherein the O-acetylgoxime ester photopolymerization initiator comprises a compound with at least one structure selected from the group consisting of general formulas (1), (2), (3), (4), (5), (6), and (7). [Chemistry 1] In general formula (1), R1 and R2 independently represent hydrogen atoms, a straight-chain or branched alkyl group having 2 to 20 carbon atoms, a cyclic alkyl group having 3 to 20 carbon atoms, or a phenyl group; R3 represents -COR 5, hydrogen atoms, a straight-chain or branched alkyl group having 1 to 20 carbon atoms, a cyclic alkyl group having 3 to 20 carbon atoms, an alkyl group, a nitro group, or a sulfonyl group; R5 represents a phenyl group with substituents, and a thiophene group; R4 is a hydrogen atom, a straight-chain or branched alkyl group having 1 to 20 carbon atoms; the alkyl, cyclic alkyl, alkyl, and phenyl groups of R1 to R4 can be substituted with substituents selected from the group consisting of halogen atoms, alkoxy groups having 1 to 10 carbon atoms, and phenyl groups; furthermore, the hydrogen atoms of the substituents in R1 to R4 can also be further substituted with other substituents R6; R 6 represents a halogen atom, a fluorine atom, an alkyl group, a cyclic alkyl group, a cellulose group, a nitro group, a sulfonyl group, and a phenyl group; In general formula (2), R1 and R2 independently represent a hydrogen atom, a straight-chain or branched alkyl group having 1 to 20 carbon atoms, a cyclic alkyl group having 3 to 20 carbon atoms that may have substituents, or a phenyl group; R3 represents a hydrogen atom, a group having an O-acyloxime structure, a straight-chain or branched alkyl group having 1 to 20 carbon atoms, a cyclic alkyl group having 3 to 20 carbon atoms, an acyl group, a nitro group, an acetoxy group, or a sulfonyl group; the alkyl group, cyclic alkyl group, acyl group, and phenyl group of R1 to R3 may be substituted with substituents selected from the group consisting of halogen atoms, alkoxy groups having 1 to 10 carbon atoms, and phenyl groups; R4 is a hydrogen atom, a straight-chain or branched alkyl group having 1 to 20 carbon atoms, or an aryl group having 6 to 30 carbon atoms, or an arylalkyl group having 7 to 30 carbon atoms; the hydrogen atom of the aryl group or arylalkyl group represented by R4 may be further substituted with R21, -OR 21, -COR 21, hydroxyl, nitro, cyano, halogen atom, or -COOR 21 substitution, R 21 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an arylalkyl group having 7 to 30 carbon atoms. The hydrogen atom of the alkyl, aryl, or arylalkyl group represented by R 21 may be further substituted with a hydroxyl, nitro, cyano, halogen atom, hydroxyl, or carboxyl group; the alkyl, acetyl, and phenyl groups may be substituted with substituents selected from the group consisting of halogen atoms, alkoxy groups having 1 to 10 carbon atoms, and phenyl groups; furthermore, the hydrogen atom of the substituents in R 1 to R 4 may also be further substituted with other substituents. [Chemistry 2] In general formula (3), R1 and R2 independently represent hydrogen atoms, a straight-chain or branched alkyl group having 1 to 20 carbon atoms, a cyclic alkyl group having 3 to 20 carbon atoms, or a phenyl group; R3 and R5 independently represent hydrogen atoms, a straight-chain or branched alkyl group having 1 to 20 carbon atoms, a cyclic alkyl group having 3 to 20 carbon atoms, an acyl group, a nitro group, or a sulfonyl group; the alkyl, acyl, and phenyl groups of R1 to R3 may be substituted with substituents selected from the group consisting of halogen atoms, alkoxy groups having 1 to 10 carbon atoms, and phenyl groups; R4 represents hydrogen atoms, a straight-chain or branched alkyl group having 1 to 20 carbon atoms, a heterocyclic group having 4 to 20 carbon atoms, or -COR 6; R6 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 4 to 20 carbon atoms; furthermore, R The hydrogen atoms of the substituents in 1~R6 can also be further substituted by other substituents. [Chemistry 3] [In general formula (4), R1 and R2 independently represent hydrogen atoms, a straight-chain or branched alkyl group having 1 to 20 carbon atoms, a cyclic alkyl group having 3 to 20 carbon atoms, or a phenyl group; R3 and R5 independently represent hydrogen atoms, a straight-chain or branched alkyl group having 1 to 12 carbon atoms, a cyclic alkyl group having 3 to 20 carbon atoms, an alkyl group, a nitro group, or a sulfonyl group; R4 is a hydrogen atom or an alkoxy group, which may also include a straight-chain or branched alkyl group having 1 to 20 carbon atoms or a hydroxyl group; the alkyl group, alkyl group, and phenyl group may be substituted with substituents selected from the group consisting of halogen atoms, alkoxy groups having 1 to 10 carbon atoms, and phenyl groups; furthermore, the hydrogen atoms of the substituents in R1 to R5 may also be further substituted with other substituents] [Chemistry 4] In general formula (5), R1 and R2 independently represent R11 or -COR11, R 11 represents a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an arylalkyl group with 7 to 30 carbon atoms, or a heterocyclic group with 4 to 20 carbon atoms. The alkyl portion of the alkyl, aryl, arylalkyl, or heterocyclic group represented by R 11 may have branched side chains or may be a cyclic alkyl group. R 3 represents an alkyl group with 1-20 carbon atoms, an aryl group with 6-30 carbon atoms, an arylalkyl group with 7-30 carbon atoms, or a heterocyclic group with 4-20 carbon atoms. The alkyl portion of the alkyl, aryl, arylalkyl, or heterocyclic group represented by R 3 may have branched side chains or may be a cyclic alkyl group. The hydrogen atom of the aryl, arylalkyl, or heterocyclic group represented by R 3 may be further substituted with R 21, -OR 21, -COR 21, -SR 21, -NR 22R 23, -CONR 22R 23, -NR 22-OR 23, -NCOR 22-OCOR 23, -NR 22COR 21, -OCOR 21, -SCOR 21, -OCSR 21, -COSR 21, -CSOR 21, hydroxyl, nitro, cyano, halogen atom, or -COOR 21. R 21, R 22, and R 23 independently represent a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an arylalkyl group with 7 to 30 carbon atoms, or a heterocyclic group with 4 to 20 carbon atoms, respectively. The hydrogen atoms of the alkyl, aryl, arylalkyl, or heterocyclic groups represented by R 21, R 22, and R 23 may be further substituted with hydroxyl, nitro, cyano, halogen atoms, hydroxyl, or carboxyl groups. The alkyl moiety of the alkyl, aryl, arylalkyl, or heterocyclic groups represented by R 21, R 22, and R 23 may also contain 1 to 5 -O-, -S-, -COO-, -OCO-, -NR 24-, -NR 24CO-, -NR 24COO-, -OCONR 24-, -SCO-, -COS-, -OCS-, or -CSO-, provided that the oxygen atoms are not adjacent. R 24 represents a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an arylalkyl group with 7 to 30 carbon atoms, or a heterocyclic group with 4 to 20 carbon atoms. The alkyl portion of the alkyl, aryl, arylalkyl, or heterocyclic group represented by R 24 may have branched side chains or may be a cyclic alkyl group. R 4 represents a hydrogen atom, hydroxyl group, cyano group, nitro group, or halogen atom, and n represents 0 or 1; In general formula (6), R1, R2 and R3 independently represent hydrogen atom, straight-chain or branched alkyl group with 3 to 20 carbon atoms, aryl group with 6 to 20 carbon atoms, alkoxy group with 1 to 20 carbon atoms, arylalkyl group with 7 to 30 carbon atoms or heterocyclic group with 4 to 20 carbon atoms, respectively. [Chemistry 5] In general formula (7), R1 and R2 are independently hydrogen atoms, straight-chain or branched alkyl groups with 3 to 20 carbon atoms, and aryl groups with 6 to 20 carbon atoms, respectively. R 3 represents a hydrogen atom, a straight-chain or branched alkyl group having 1 to 20 carbon atoms, a cyclic alkyl group having 3 to 20 carbon atoms, an alkyl group, a nitro group, an acetoxy group, or a sulfonyl group; R 4 represents a hydrogen atom, a straight-chain or branched alkyl group having 1 to 20 carbon atoms, or a cyclic alkyl group having 3 to 20 carbon atoms that may have substituents, such as alkyl, phenyl, tolyl, or xylyl; m is 0 or 1.

[0014] Another embodiment of the present invention relates to a hardened film, which is a hardened form of the photosensitive composition.

[0015] Another embodiment of the present invention relates to a color filter having the aforementioned hardened film.

[0016] Another embodiment of the present invention relates to an optical filter having the aforementioned hardened film.

[0017] Another embodiment of the present invention relates to an image display device having the aforementioned hardening film.

[0018] Another embodiment of the present invention relates to a solid-state imaging element having the aforementioned hardened film.

[0019] Another embodiment of the present invention relates to an infrared sensor having the aforementioned hardened film. [The effects of the invention]

[0020] According to one embodiment of the present invention, a photosensitive composition can be provided, which can form a hardened film with excellent developability, substrate adhesion, pattern shape, and solvent resistance after a low-temperature calcination step. Furthermore, according to another embodiment of the present invention, a hardened film as a photosensitive composition, a color filter, an optical filter, an image display device, a solid-state imaging element, and an infrared sensor having the hardened film can be provided. Simple Explanation of the Diagram

[0021] Figure 1 shows a schematic cross-sectional view of an image display device including the hardened film of this embodiment. Figure 2 shows a schematic cross-sectional view of an infrared sensor including the hardened film of this embodiment. Implementation

[0022] The form of the photosensitive composition used to implement the present invention will be described in detail below. The embodiments of the present invention are not limited to the following embodiments, and can be modified within the scope that can solve the problem.

[0023] In this specification, unless otherwise specified, "(meth)acrylic", "(meth)acrylate", "(meth)acrylic acid", "(meth)acrylate", or "(meth)acrylamide" respectively refer to "acrylic and / or methacrylic", "acrylate and / or methacrylate", "acrylic acid and / or methacrylic acid", "acrylate and / or methacrylate", or "acrylamide and / or methacrylamide". Additionally, "CI" refers to the Colour Index (CI; published by The Society of Dyers and Colourists). Polymerizable unsaturated groups are groups containing vinyl unsaturated double bonds. Monomers are compounds containing vinyl unsaturated bonds that can be polymerized to form resins. Monomers are unreacted compounds, and monomer units are the partial structures of resins formed after the monomers polymerize. Regarding the molecular weight of the compounds in this embodiment, for low molecular weight compounds with a definite molecular weight, it is a value calculated or determined by electrospray ionization-mass spectrometry (ESI-MS); for compounds with a molecular weight distribution, it is the weight-average molecular weight converted from polystyrene determined by gel permeation chromatography with tetrahydrofuran as solvent.

[0024] [Photosensitive components] The photosensitive composition of this embodiment can be used to form a hardened film for a color filter or optical filter, wherein the color filter or optical filter has a hardened film formed by a heating step at 180°C or below after a pattern is formed using photolithography. The photosensitive composition includes: a pigment (hereinafter also referred to as "pigment (A)"), an adhesive resin (hereinafter also referred to as "adhesive resin (B)"), a polymerizable compound (hereinafter also referred to as "polymerizable compound (C)"), a photopolymerization initiator (hereinafter also referred to as "photopolymerization initiator (D)"), a resin-type dispersant (hereinafter also referred to as "resin-type dispersant (Z)"), and a leveling agent (hereinafter also referred to as "leveling agent (E)"). The adhesive resin (B) comprises an alkali-soluble adhesive resin containing a constituent unit having a block isocyanate group (hereinafter also referred to as "alkali-soluble adhesive resin (Bb)"), and the photopolymerization initiator (D) comprises an O-acryloxime ester-based photopolymerization initiator (hereinafter also referred to as "O-acryloxime ester-based photopolymerization initiator (D1)").

[0025] [Pigment (A)] The photosensitive component of this embodiment contains a pigment (A). This allows for control of transmittance in various wavelength regions, making it easy to control the transmittance wavelength of the cured film, which is the photosensitive component. Furthermore, the area for transmittance control can be outside the visible region; as long as transmittance is controlled, it can also be colorless and transparent.

[0026] Pigment (A) can be any of the following: pigment, dye, or near-infrared absorbing pigment. These can be used together.

[0027] (pigment) Pigments are compounds classified as pigments in the dye index. Examples of pigments include: red pigments, orange pigments, blue pigments, green pigments, purple pigments, black pigments, etc.

[0028] Examples of red pigments include: CI Pigment Red 1, 2, 3, 4, 5, 6, 7, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 37, 38, 41, 47, 48, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 50:1, 52:1, 52:2, 53, 53:1, 53:2, 53:3, 57, 57:1, 57:2, 58:4, 60, 63, 63:1, 63:2, 6 4, 64:1, 68, 69, 81, 81:1, 81:2, 81:3, 81:4, 83, 88, 90:1, 101, 101:1, 104, 108, 108:1, 109, 112, 113, 114, 122, 123, 144, 146, 147, 149, 151, 166, 168, 169, 170, 172, 173, 174, 175, 176, 177, 178, 179, 181, 1 84, 185, 187, 188, 190, 193, 194, 200, 202, 206, 207, 208, 209, 210, 214, 216, 220, 221, 224, 230, 231, 232, 233, 235, 236, 237, 238, 239, 242, 243, 245, 247, 249, 250, 251, 253, 254, 255, 256, 257, 258, 259, 2 Pigments described in Japanese Patent Application Publication No. 2014-134712 and Japanese Patent Publication No. 6368844, etc. Of these, from the viewpoints of heat resistance, light resistance, and transmittance, the preferred pigments are CI Pigment Red 48:1, 122, 177, 224, 242, 269, 254, 291, 295, 296, the pigments described in Japanese Patent Application Publication No. 2014-134712, and the pigments described in Japanese Patent Application Publication No. 6368844, and even more preferably CI Pigment Red 177, 254, 291, 295, 296, the pigments described in Japanese Patent Application Publication No. 2014-134712, and the pigments described in Japanese Patent Application Publication No. 6368844.

[0029] Examples of orange pigments include: CI Pigment Orange 36, 38, 43, 64, 71, 73, etc.

[0030] Examples of yellow pigments include: CI Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 12, 13, 14, 15, 16, 17, 18, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 126, 127, 128, 129, 13 Pigments described in Japanese Patent Application Publication No. 2012-226110 and Japanese Patent Application Publication No. 2017-171915, etc. Among these, the preferred are pigments CI Yellow 138, 139, 150, 185, 231, 233, the pigments described in Japanese Patent Application Publication No. 2012-226110, and the pigments described in Japanese Patent Application Publication No. 2017-171915.

[0031] Examples of green pigments include CI pigment green 1, 2, 4, 7, 8, 10, 13, 14, 15, 17, 18, 19, 26, 36, 37, 45, 48, 50, 51, 54, 55, 58, 59, 62, and 63. Among these, CI pigment green 7, 36, 58, 59, 62, and 63 are preferred.

[0032] Examples of blue pigments include CI pigment blue 1, 1:2, 9, 14, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 17, 19, 25, 27, 28, 29, 33, 35, 36, 56, 56:1, 60, 61, 61:1, 62, 63, 66, 67, 68, 71, 72, 73, 74, 75, 76, 78, and 79. Among these, CI pigment blue 15, 15:1, 15:2, 15:3, 15:4, and 15:6 are preferred.

[0033] Examples of purple pigments include: CI pigment violet 1, 1:1, 2, 2:2, 3, 3:1, 3:3, 5, 5:1, 14, 15, 16, 19, 23, 25, 27, 29, 31, 32, 37, 39, 42, 44, 47, 49, 50, etc. Among these, CI pigment violet 19 and 23 are preferred.

[0034] Examples of black pigments include CI Pigment Black 1, 6, 7, 12, 20, and 31. Alternatively, at least two pigments selected from red, yellow, blue, green, and purple pigments can be used as black colorants.

[0035] Inorganic pigments, as a type of pigment, can be listed as follows: titanium dioxide, barium sulfate, zinc white, lead sulfate, chrome yellow, zinc yellow, iron oxide (red iron oxide (III)), cadmium red, ultramarine, Prussian blue, chromium oxide green, cobalt green, brown earth, synthetic iron black, etc.

[0036] (dye) Examples of dyes include: acid dyes, direct dyes, basic dyes, salt-forming dyes, oil-soluble dyes, disperse dyes, reactive dyes, mordant dyes, vat dyes, and sulfur dyes. Additionally, derivatives of these dyes, as well as lake pigments formed by lake treatment of dyes, can be used in pigments (A).

[0037] Acid dyes preferably have acidic groups such as sulfonic acid and carboxylic acid. Alternatively, it is preferable to use a salt-forming compound, i.e., a salt of an acid dye and a nitrogen-containing compound such as a quaternary ammonium salt, tertiary amine, secondary amine, or primary amine, in pigment (A). It is also preferable to use a resin component having these functional groups and a salt of the acid dye to form a salt-forming compound. Furthermore, by sulfonating the salt-forming compound to a sulfonylurea compound, a photosensitive composition with excellent resistance (lightfastness, solvent resistance) can be easily obtained. Furthermore, acid dyes and salts of compounds containing onium groups are preferred due to their excellent resistance (lightfastness, solvent resistance). Moreover, compounds containing onium groups are preferably resins containing cationic groups.

[0038] Basic dyes can be used directly, but salt-forming compounds that form salts with organic acids, perchloric acid, and their metal salts are preferred. Salt-forming compounds of basic dyes are preferred due to their excellent lightfastness and solvent resistance, as well as their affinity for pigments. Furthermore, in the salt-forming compounds of basic dyes, the anionic component that functions as the relative ion is preferably a salt-forming compound obtained by salting organic sulfonic acids, organic sulfuric acids, phosphorus anionic compounds containing fluorine groups, boron anionic compounds containing fluorine groups, nitrogen anionic compounds containing cyano groups, anionic compounds containing conjugate bases of organic acids with halogenated hydrocarbon groups, or acidic dyes. Moreover, if the salt-forming compound contains polymerizable unsaturated groups in its molecule, its lightfastness is further improved.

[0039] The chemical structures of dyes can be exemplified by those derived from azo dyes, diazo dyes, azomethyl base dyes (indoaniline dyes, indophenol dyes, etc.), dipyrrole methylene dyes, quinone dyes (benzoquinone dyes, naphthoquinone dyes, anthraquinone dyes, anthraquinone dyes, anthraquinone dyes, etc.), carbonium dyes (diphenylmethane dyes, triphenylmethane dyes, xanthones dyes, acridine dyes, etc.), quinone imine dyes (oxazine dyes, thiazine dyes, etc.), acridine dyes, and poly(ethylene) dyes. The pigment structures of dyes in methyl dyes (oxocyanine dyes, cyanine dyes, arylidene dyes, styryl dyes, cyanine dyes, squaric acid endomonium dyes, croconium dyes, etc.), quinophthalone dyes, phthalocyanine dyes, subphthalocyanine dyes, violet ketone dyes, indigo dyes, thioindigo dyes, quinoline dyes, nitro dyes, nitroso dyes, rhodamine dyes, and their metal complex dyes, etc.

[0040] From the viewpoint of color characteristics such as hue, color separation, and color unevenness, the pigment structure is preferably derived from pigments selected from azo dyes, oxalite dyes, cyanide dyes, triphenylmethane dyes, anthraquinone dyes, dipyrrole methylene dyes, squaric acid lacton dyes, quinoline ketone dyes, phthalocyanine dyes, and phthalocyanine dyes; more preferably, the pigment structure is derived from pigments selected from oxalite dyes, cyanide dyes, triphenylmethane dyes, anthraquinone dyes, dipyrrole methylene dyes, and phthalocyanine dyes.

[0041] (Near-infrared absorbing pigment) Near-infrared absorbing pigments are compounds that exhibit maximum absorption in the wavelength range of 700 nm to 2,000 nm. Near-infrared absorbing pigments are either pigments (also known as near-infrared absorbing pigments) or dyes (also known as near-infrared absorbing dyes). Furthermore, near-infrared absorbing pigments and near-infrared absorbing dyes can be used in combination. Moreover, from the viewpoint of heat resistance, near-infrared absorbing pigments are preferred. The solubility of the near-infrared absorbing pigment is preferably less than 2 g relative to 100 g of propylene glycol monomethyl ether acetate at 25°C, more preferably less than 1 g, and even more preferably less than 0.5 g.

[0042] Examples of near-infrared absorbing pigments include: anthocyanin compounds, phthalocyanine compounds, naphthyl phthalocyanine compounds, indigo compounds, ammonium compounds, anthraquinone compounds, pyrrolopyrrole compounds, squaric acid endonium compounds, and ketone endonium compounds. Among these, from the viewpoint of heat resistance, naphthyl phthalocyanine compounds, pyrrolopyrrole compounds, and squaric acid endonium compounds are preferred, with naphthyl phthalocyanine compounds and squaric acid endonium compounds being even more preferred.

[0043] Anthocyanin compounds can be listed in International Patent Publication No. 2006 / 006573, International Patent Publication No. 2010 / 073857, Japanese Patent Application Publication No. 2013-241598, Japanese Patent Application Publication No. 2016-113501, and Japanese Patent Application Publication No. 2016-113504, etc.; phthalocyanine compounds can be listed in Japanese Patent Application Publication No. Hei 4-23868, Japanese Patent Application Publication No. Hei 06-192584, and Japanese Patent Application Publication No. 2000-63691, etc. Compounds described in publications such as Japanese Patent Application Publication No. 2014 / 208514; naphthalene phthalocyanine compounds include those described in Japanese Patent Application Publication No. 11-152414, Japanese Patent Application Publication No. 2000-86919, Japanese Patent Application Publication No. 2009-29955, and International Publication No. 2018 / 186490; indigo compounds include those described in Japanese Patent Application Publication No. 2013-230412; ammonium ionide compounds include those described in Japanese Patent Application Publication No. 2005-3. Compounds described in Japanese Patent Publication No. 36150, Japanese Patent Application Publication No. 2007-197492, and Japanese Patent Application Publication No. 2008-88426, etc.; anthraquinone compounds include compounds described in Japanese Patent Application Publication No. Sho 62-903 and Japanese Patent Application Publication No. Hei 1-172458, etc.; pyrrolopyrrole compounds include compounds described in Japanese Patent Application Publication No. 2009-263614, Japanese Patent Application Publication No. 2010-90313, and Japanese Patent Application Publication No. 2011-068731. The compounds described in the publications; examples of squaric acid endothelium compounds include those described in Japanese Patent Application Publication No. 2011-132361, Japanese Patent Application Publication No. 2016-142891, International Publication No. 2017 / 135359, International Publication No. 2018 / 225837, Japanese Patent Application Publication No. 2019-001987, and International Publication No. 2020 / 054718; examples of ketone endothelium compounds include those described in International Publication No. 2019 / 021767.

[0044] ((squamic acid lacton compound)) Squamous acid endothelium compounds are preferably compounds represented by the following general formula (SQ1).

[0045] [Chemistry 6]

[0046] In the general formula (SQ1), R1 to R4 independently represent halogen atoms, cyano, nitro, alkyl, alkenyl, alkynyl, aryl, heteroaryl, aralkyl, -OR 10, -COR 11, -COOR 12, -OCOR 13, -NR 14R 15, -NHCOR 16, -CONR 17R 18, -NHCONR 19R 20, -NHCOOR 21, -SR 22, -SO 2R 23, -SO 2OR 24, -NHSO 2R 25, -SO 2NR 26R 27, -B(OR 28) 2, or -NHBR 29R 30. R10 to R30 independently represent hydrogen atoms, alkyl, alkenyl, alkynyl, aryl, heteroaryl, and aralkyl groups that may have substituents. Furthermore, when R12 in -COOR 12 is hydrogen (i.e., a carboxyl group), the hydrogen atom can dissociate (i.e., a carbonate group) and can also be in a salt state. Additionally, when R24 in -SO 2OR 24 is hydrogen (i.e., a sulfonyl group), the hydrogen atom can dissociate (i.e., a sulfonate group) and can also be in a salt state. Furthermore, R1 and R2, and R3 and R4 can bond together to form a ring.

[0047] Examples of substituents include: halogen atoms, cyano, nitro, alkyl, alkenyl, alkynyl, aryl, heteroaryl, aralkyl, -OR 100, -COR 101, -COOR 102, -OCOR 103, -NR 104R 105, -NHCOR 106, -CONR 107R 108, -NHCONR 109R 110, -NHCOOR 111, -SR 112, -SO 2R 113, -SO 2OR 114, -NHSO 2R 115, or -SO 2NR 116R 117. R 100 to R 117 independently represent a hydrogen atom, alkyl, alkenyl, alkynyl, aryl, heteroaryl, or aralkyl group. Furthermore, when R 102 in -COOR 102 is hydrogen (i.e., a carboxyl group), the hydrogen atom can dissociate (i.e., a carbonate group) or be in a salt state. Additionally, when R 114 in -SO 2OR 114 is hydrogen (i.e., a sulfonyl group), the hydrogen atom can dissociate (i.e., a sulfonate group) or be in a salt state.

[0048] Examples of halogen atoms include: fluorine, chlorine, bromine, and iodine. The alkyl group preferably has 1 to 20 carbon atoms, more preferably 1 to 12, and even more preferably 1 to 8. The alkyl group can be straight-chain, branched, or cyclic. The alkenyl group preferably has 2 to 20 carbon atoms, more preferably 2 to 12, and even more preferably 2 to 8. The alkenyl group can be straight-chain, branched, or cyclic. The number of carbon atoms in the alkynyl group is preferably 2 to 20, more preferably 2 to 12, and even more preferably 2 to 8. The alkynyl group can be straight-chain, branched, or cyclic. The number of carbon atoms in the aryl group is preferably 6 to 25, more preferably 6 to 15, and even more preferably 6 to 10. The alkyl portion of the aralkyl group is the same as the alkyl group. The aryl portion of the aralkyl group is the same as the aryl group. The number of carbon atoms in the aralkyl group is preferably 7 to 40, more preferably 7 to 30, and more preferably 7 to 25. The heteroaryl group is preferably a monocyclic or condensed ring, more preferably a monocyclic or condensed ring with 2 to 8 condensation numbers, and even more preferably a monocyclic or condensed ring with 2 to 4 condensation numbers. The number of heteroatoms in the ring constituting the heteroaryl group is preferably 1 to 3. The heteroatoms in the ring constituting the heteroaryl group are preferably nitrogen, oxygen, or sulfur atoms. The heteroaryl group is preferably a 5-membered or 6-membered ring. The number of carbon atoms in the ring constituting the heteroaryl group is preferably 3 to 30, more preferably 3 to 18, and even more preferably 3 to 12. Alkyl, alkenyl, alkynyl, aryl, heteroaryl, and aralkyl groups may have substituents or may not be substituted. Examples of substituents include the aforementioned "substituents".

[0049] From the viewpoint of lightfastness and heat resistance, the squaric acid lactone compound is preferably a compound represented by the following general formula (SQ2).

[0050] [Chemistry 7]

[0051] In the general formula (SQ2), R5 to R8 independently represent halogen atoms, cyano, nitro, alkyl, alkenyl, alkynyl, aryl, heteroaryl, aralkyl, -OR 50, -COR 51, -COOR 52, -OCOR 53, -NR 54R 55, -NHCOR 56, -CONR 57R 58, -NHCONR 59R 60, -NHCOOR 61, -SR 62, -SO 2R 63, -SO 2OR 64, -NHSO 2R 65 or -SO 2NR 66R 67, -B(OR 68) 2, and -NHBR 69R 70. R50 to R70 independently represent hydrogen atoms, alkyl, alkenyl, alkynyl, aryl, heteroaryl, and aralkyl groups that may have substituents. Furthermore, when R52 in -COOR 52 is hydrogen (i.e., a carboxyl group), the hydrogen atom can dissociate (i.e., a carbonate group) and can also be in a salt state. Additionally, when R64 in -SO 2OR 64 is hydrogen (i.e., a sulfonyl group), the hydrogen atom can dissociate (i.e., a sulfonate group) and can also be in a salt state. Furthermore, R5 and R6, and R7 and R8 can bond together to form a ring.

[0052] The "substituent" in general formula (SQ2) has the same meaning as the "substituent" in general formula (SQ1).

[0053] The following are specific examples of squaric acid lacton compounds. However, this embodiment is not limited to these.

[0054] [Chemistry 8]

[0055] [Chemistry 9]

[0056] ((pyrrolopyrrole compounds)) Pyrrolopyrrole compounds are preferably those represented by the following general formula (PP1).

[0057] [Chemistry 10]

[0058] In the general formula (PP1), R1x and R1y independently represent alkyl, aryl, or heteroaryl groups, respectively; R2 and R3 independently represent hydrogen atoms or substituents, respectively; R2 and R3 can bond together to form a ring; R4 represents a hydrogen atom, alkyl, aryl, heteroaryl group, -BR4xR4y, or a metal atom; R4 can be covalently or coordinately bonded to at least one of the groups selected from R1x, R1y, and R3; and R4x and R4y independently represent substituents. Compounds represented by the general formula (PP1) include those described in Japanese Patent Application Publication No. 2009-263614, Japanese Patent Application Publication No. 2011-68731, and International Publication No. 2015 / 166873.

[0059] R1x and R1y are preferably aryl or heteroaryl, and more preferably aryl. Furthermore, the alkyl, aryl, and heteroaryl groups represented by R1x and R1y may have substituents or may be unsubstituted. Examples of substituents include: alkoxy, hydroxyl, halogen atom, cyano, nitro, -OCOR 11, -SOR 12, -SO 2R 13, etc. R11 to R13 each independently represent a hydrocarbon group or a heteroaryl group. Additionally, examples of substituents include those described in paragraphs 0020 to 0022 of Japanese Patent Application Publication No. 2009-263614. Among these, alkoxy, hydroxyl, halogen atom, cyano, nitro, -OCOR 11, -SOR 12, and -SO 2R 13 are preferred substituents. The groups represented by R1x and R1y are preferably alkoxy groups having branched alkyl groups, or aryl groups having groups represented by -OCOR 11 as substituents. The branched alkyl group preferably has 3 to 30 carbon atoms, more preferably 3 to 20.

[0060] At least one of R2 and R3 is preferably an electron-withdrawing group, more preferably R2 represents an electron-withdrawing group and R3 represents a heteroaryl group. The heteroaryl group is preferably a 5-membered or 6-membered ring. Furthermore, the heteroaryl group is preferably a monocyclic or condensed ring, more preferably a monocyclic or condensed ring with 2 to 8 condensation numbers, and even more preferably a monocyclic or condensed ring with 2 to 4 condensation numbers. The number of heteroatoms constituting the heteroaryl group is preferably 1 to 3, more preferably 1 to 2. Examples of heteroatoms include nitrogen, oxygen, and sulfur atoms. The heteroaryl group preferably has one or more nitrogen atoms. The two R2s in the general formula (PP1) may be the same or different. Similarly, the two R3s in the general formula (PP1) may be the same or different.

[0061] R4 is preferably a hydrogen atom, alkyl, aryl, heteroaryl, or a group represented by -BR 4xR 4y, more preferably a hydrogen atom, alkyl, aryl, or a group represented by -BR 4xR 4y, and even more preferably a group represented by -BR 4xR 4y. As a substituent represented by R 4xR 4y, it is preferably a halogen atom, alkyl, alkoxy, aryl, or heteroaryl, more preferably alkyl, aryl, or heteroaryl, and even more preferably aryl. These groups may also have further substituents. The two R4s in the general formula (PP1) may be the same or different from each other.

[0062] The following are specific examples of pyrrolopyrrole compounds. In the following structural formulas, Me represents methyl and Ph represents phenyl. Other pyrrolopyrrole compounds may include those described in paragraphs 0016-0058 of Japanese Patent Application Publication No. 2009-263614, paragraphs 0037-0052 of Japanese Patent Application Publication No. 2011-68731, paragraphs 0014-0027 of Japanese Patent Application Publication No. 2014-130343, and paragraphs 0010-0033 of International Publication No. 2015 / 166873. However, this embodiment is not limited to these.

[0063] [Chemistry 11]

[0064] ((Naphthalenephthalocyanine compound)) Naphthalenephthalocyanine compounds are preferably those represented by the following general formula (NPc1).

[0065] [Chemistry 12]

[0066] In the general formula (NPc1), R1 to R24 independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 20 carbon atoms with or without a substituent, an aryl group having 6 to 20 carbon atoms with or without a substituent, a heterocyclic group having 4 to 20 carbon atoms with or without a substituent, and -OR25 or -SR26, where R25 and R26 independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms with or without a substituent, and an aryl group having 6 to 20 carbon atoms with or without a substituent.

[0067] The halogen atoms represented by R1 to R24 in the general formula (NPc1) can be, for example, fluorine, chlorine, bromine, and iodine atoms.

[0068] There are no particular restrictions on the alkyl group with 1 to 20 carbon atoms represented by R1 to R24 of the general formula (NPc1), as long as it is a saturated aliphatic hydrocarbon group with 1 to 20 carbon atoms. The alkyl group may be branched and may also form a ring.

[0069] Specific examples of alkyl groups with 1 to 20 carbon atoms represented by R1 to R24 in the general formula (NPc1) include: methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, dibutyl, tributyl, n-pentyl, isopentyl, neopentyl, 1,2-dimethyl-propyl, n-hexyl, isohexyl, dihexyl, n-heptyl, isoheptyl, diheptyl, n-octyl, 2-ethylhexyl, 3-methyl-1-isopropylbutyl, 1-tert-butyl-2-methylpropyl, n-nonyl, 3,5,5-trimethylhexyl, n-decyl, n-dodecyl, cyclohexyl, cyclopentyl, cyclohexylmethyl, cyclohexylethyl, cyclopentylmethyl and cyclopentylethyl, etc.

[0070] The alkyl group represented by R1 to R24 of the general formula (NPc1) having 1 to 20 carbon atoms is preferably a straight-chain or branched alkyl group having 1 to 12 carbon atoms, and more preferably a straight-chain or branched alkyl group having 1 to 8 carbon atoms.

[0071] The alkyl groups with 1 to 20 carbon atoms represented by R1 to R24 in the general formula (NPc1) may also have substituents. Examples of substituents that may be present include: alkoxy, halogen, amino, cyano, nitro, etc., but are not limited to these.

[0072] Furthermore, in this embodiment, the phrase "substituented" in an alkyl group having 1 to 20 carbon atoms means that one or more hydrogen atoms of a saturated aliphatic hydrocarbon group having 1 to 20 carbon atoms are substituted with substituents such as alkoxy, halogen, amino, cyano, nitro, etc., and the phrase "unsubstituted" means that the hydrogen atoms of a saturated aliphatic hydrocarbon group having 1 to 20 carbon atoms are not substituted with substituents such as alkoxy, halogen, amino, cyano, nitro, etc. In this embodiment, the phrases "substituented" and "unsubstituted" will henceforth be used with the same meaning as described herein.

[0073] The aryl group represented by R1 to R24 of the general formula (NPc1) having 6 to 20 carbon atoms is not particularly limited as long as it is a residue formed by removing one hydrogen atom from an aromatic ring having 6 to 20 carbon atoms. Specific examples include: phenyl, phenethyl, o-tolyl, m-tolyl or p-tolyl, 2,3-xylyl or 2,4-xylyl, mesitylene, naphthyl, anthracene, phenanthryl, biphenyl, diphenylmethyl, triphenylmethyl and pyrene, etc., with phenyl being particularly preferred.

[0074] The aryl groups with 6 to 20 carbon atoms represented by R1 to R24 of general formula (NPc1) may also have substituents. Examples of such substituents are those that are the same as those that may be present in alkyl groups with 1 to 20 carbon atoms represented by R1 to R24 of general formula (NPc1).

[0075] The heterocyclic groups represented by R1 to R24 of the general formula (NPc1), having 4 to 20 carbon atoms, are not particularly limited as long as they are residues formed by removing one hydrogen atom from a heterocycle having 4 to 20 carbon atoms. Specific examples include: pyridyl, pyrroleyl, oxazolyl, isoxazolyl, thiazolyl, isothiazolyl, imidazoleyl, oxadiazolyl, thiadiazolyl, triazolyl, tetrazolyl, pyrazolyl, pyrimidinyl, pyrazinyl, triazinyl, indoleyl, isoindoleyl, benzimidazoleyl, benzoxazolyl, benzothiazolyl, quinolinyl, isoquinolinyl, purinyl, carbazoleyl, acridineyl, benzimidazinyl, and benzimidazinyl, with pyridyl being particularly preferred.

[0076] Heterocyclic groups with 4 to 20 carbon atoms represented by R1 to R24 of general formula (NPc1) may also have substituents. Examples of such substituents are those that are the same as those that may be present in alkyl groups with 1 to 20 carbon atoms represented by R1 to R24 of general formula (NPc1).

[0077] As alkyl groups representing 1 to 20 carbon atoms as R 25 and R 26 of general formula (NPc1), the same groups as alkyl groups representing 1 to 20 carbon atoms as R 1 to R 24 of general formula (NPc1) can be listed.

[0078] Alkyl groups having 1 to 20 carbon atoms, represented by R 25 and R 26 of general formula (NPc1), may also have substituents. Examples of such substituents are those that are the same as those that may be present in alkyl groups having 1 to 20 carbon atoms, represented by R 1 to R 24 of formula (NPc1).

[0079] As aryl groups with 6 to 20 carbons represented by R 25 and R 26 of general formula (NPc1), the same groups as aryl groups with 6 to 20 carbons represented by R 1 to R 24 of general formula (NPc1) can be listed. The aryl groups with 6 to 20 carbon atoms represented by R 25 and R 26 of general formula (NPc1) may also have substituents. Examples of such substituents are the same as those that can be present in alkyl groups with 1 to 20 carbon atoms represented by R 1 to R 24 of general formula (NPc1).

[0080] R1 to R24 in the general formula (NPc1) are preferably hydrogen atoms or aryl groups with substituents or unsubstituted carbons having 6 to 20 carbons. More preferably, all of R1 to R24 are hydrogen atoms, or R1, R2 to R5, R7, R8 to R11, R13, R14 to R17, R19 and R20 to R23 are hydrogen atoms, and R6, R12, R18 and R24 are unsubstituted aryl groups having 6 to 20 carbons, or R2 to R5, R6, R8 to R11, R12, R14 to R17, R18, R20 to R23 and R24 are hydrogen atoms, and R1, R7, R13 and R19 are unsubstituted aryl groups having 6 to 20 carbons. Preferably, R1 to R24 are all hydrogen atoms, or R1, R2 to R5, R7, R8 to R11, R13, R14 to R17, R19 and R20 to R23 are hydrogen atoms and R6, R12, R18 and R24 are phenyl atoms, or R2 to R5, R6, R8 to R11, R12, R14 to R17, R18, R20 to R23 and R24 are hydrogen atoms and R1, R7, R13 and R19 are phenyl atoms.

[0081] In the general formula (NPc1), M represents two hydrogen atoms, a metal atom, a metal oxide, or a metal halide. When M represents two hydrogen atoms, a structure is formed in which the NMN part of the general formula (NPc1) is represented as two NH atoms. Metal atoms represented by M in the general formula (NPc1) can include: iron, magnesium, nickel, cobalt, copper, palladium, zinc, vanadium, titanium, indium, and tin, etc. Metal oxides represented by M in the general formula (NPc1) include titanium dioxide and vanadium oxide, among others. Metal halides represented by M in the general formula (NPc1) include: aluminum chloride, indium chloride, germanium chloride, tin(II) chloride, tin(IV) chloride, and silicon chloride. M in the general formula (NPc1) is preferably copper, zinc, cobalt, nickel, iron, vanadium oxide, titanium dioxide, indium chloride or tin(II) chloride, more preferably copper, zinc, vanadium oxide or titanium dioxide, and especially preferably vanadium oxide.

[0082] Next, the method for manufacturing the compound represented by the general formula (NPc1) will be described. There are no particular limitations on the method for manufacturing the compound represented by the general formula (NPc1), and previously known methods can be appropriately utilized. For example, it is known that a method is used to synthesize a naphthalene phthalocyanine with a metal center by a direct cyclization reaction from the corresponding naphthalene dicarboxylic acid or its derivatives (anhydride, diamide, dionitrile, etc.) in the presence of a metal compound (see, for example, "Chemistry-A European Journal" (Vol. 9, pp. 5123-5134 (published in 2003))). In this case, it is preferable to coexist a catalyst (e.g., ammonium molybdate) with urea. Alternatively, a metal-free form of naphthalene phthalocyanine can be synthesized in one step using a lithium compound, followed by synthesis using a metal compound as described later.

[0083] The cyclization reaction can be carried out without a solvent, but is preferably carried out in an organic solvent. There are no particular limitations on the organic solvent that can be used for the cyclization reaction, as long as it has low reactivity with the naphthalene dicarboxylic acid or its derivatives as the starting material; preferably, it is an inert solvent that does not exhibit reactivity. Examples of organic solvents include: inert solvents such as benzene, toluene, xylene, nitrobenzene, monochlorobenzene, o-chlorotoluene, dichlorobenzene, trichlorobenzene, 1-chloronaphthalene, 1-methylnaphthalene, ethylene glycol, and benzonitrile; alcohols such as methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 1-hexanol, 1-pentanol, and 1-octanol; and aprotic polar solvents such as pyridine, N,N-dimethylformamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone, N,N-dimethylacetophenone, triethylamine, tri-n-butylamine, dimethyl sulfoxide, and cyclobutane. Among these, 1-chloronaphthalene, 1-methylnaphthalene, 1-octanol, dichlorobenzene, benzonitrile, and cyclobutane are preferred, and 1-octanol, dichlorobenzene, benzonitrile, and cyclobutane are even more preferred. These solvents may be used alone or in combination of two or more.

[0084] The amounts of naphthalene dicarboxylic acid or its derivatives and the metal compound used in the cyclization reaction are not particularly limited as long as the reaction is carried out. For example, relative to 100 parts by mass of the organic solvent, the naphthalene dicarboxylic acid or its derivatives are typically used in the range of 1 to 500 parts by mass, preferably 10 to 350 parts by mass. And relative to 1 mol of the naphthalene dicarboxylic acid or its derivative, the metal compound is typically used in the range of 0.25 to 0.5 mol, preferably 0.25 to 0.4 mol. Furthermore, the conditions for the cyclization reaction are not particularly limited. The reaction temperature is preferably in the range of 30°C to 250°C, more preferably in the range of 80°C to 200°C. The reaction time is preferably 1 hour to 30 hours. Additionally, the cyclization reaction can be carried out in an atmospheric environment, but it is preferably carried out in an inert gas environment (e.g., under a flow of nitrogen, helium, argon, etc.).

[0085] Regarding the ratio of raw materials used in the synthesis of compounds represented by general formula (NPc1) using the metal-free form of naphthalene phthalocyanine and a metal compound, it is preferable to use 0.1 to 10 mol of the metal compound relative to 1 mol of the metal-free form of naphthalene phthalocyanine, more preferably 0.5 to 5 mol, and even more preferably 1 to 3 mol. As the metal compound, inorganic metal compounds and organometallic compounds can be used. Specific examples include halides (e.g., chlorides, bromides), sulfates, acetates, and metal acetone bodies, with halides and acetates being more preferred, and halides being even more preferred. The compound obtained by the reaction can also be subjected to crystallization, filtration, washing, drying, etc., according to previously known methods. This operation allows for the efficient and high-purity acquisition of naphthalene phthalocyanine compounds represented by the general formula (NPc1).

[0086] The following are specific examples of compounds represented by the general formula (NPc1), but this embodiment is not limited to these.

[0087] [Chemistry 13]

[0088] [Chemistry 14]

[0089] [Chemistry 15]

[0090] [Chemistry 16]

[0091] The naphthalene phthalocyanine compounds represented by the general formula (NPc1) can be used alone or in combination. As a naphthalene phthalocyanine compound represented by the general formula (NPc1), it is preferably a compound having a maximum absorption wavelength in the wavelength region of 750 nm to 1500 nm, and more preferably a compound having a maximum absorption wavelength in the wavelength region of 780 nm to 1000 nm.

[0092] In addition, the naphthalene phthalocyanine compound is preferably a compound represented by the following general formula (NPc2).

[0093] [Chemistry 17]

[0094] In the general formula (NPc2), R1 to R24 independently represent hydrogen atom, halogen atom, nitro group, nitrile group, carboxyl group, uryl group, alkyl group with substituent, aryl group with substituent, cycloalkyl group with substituent, alkoxy group with substituent, aryloxy group with substituent, alkylthio group with substituent, arylthio group with substituent, alkylamine group with substituent, arylamine group with substituent, or aminesulfonyl group with substituent. Z represents either a polymeric portion containing a monolithic unit as represented by the general formula (NPc3) or a phosphorus compound portion as represented by the general formula (NPc4).

[0095] [Chemistry 18]

[0096] In the general formula (NPc3), X represents -CONH-R 25-, -COO-R 26-, -CONH-R 27-O-, or -COO-R 28-O-, and R 25~R 28 represent alkyl or aryl groups that can be linked to carbon atoms via -O-, -CO-, -COO-, -OCO-, -CONH-, or -NHCO-. R 31 represents a hydrogen atom or a methyl group. n is 0 or an integer from 1 to 10. * represents a bond with Al in the general formula (NPc2). In general formula (NPc4), R29 and R30 independently represent a hydroxyl group, a potentially substituent alkyl group, a potentially substituent aryl group, a potentially substituent alkoxy group, or a potentially substituent aryloxy group, respectively. R29 and R30 can also bond to each other to form a ring. * indicates a bond with Al in general formula (NPc2).

[0097] The following are specific examples of compounds represented by the general formula (NPc2). However, this embodiment is not limited to these.

[0098] [Chemistry 19]

[0099] Near-infrared absorbing pigments can be used alone or in combination with two or more. When using two or more in combination, it is preferable to use at least two compounds with different maximum absorption wavelengths. This results in a wider absorption spectrum compared to using a single near-infrared absorbing pigment, allowing absorption of a broader range of near-infrared wavelengths.

[0100] Pigment (A) can be used alone or in combination with two or more.

[0101] The content of pigment (A) in 100 parts by mass of non-volatile components of the photosensitive composition is preferably 0.5% to 80% by mass, more preferably 1% to 55% by mass. By appropriately adjusting the type and content of pigment (A), the stability and reliability of the photosensitive composition can be improved.

[0102] (Pigment miniaturization) The pigment is preferably used for micronization. The micronization method is not particularly limited; for example, wet milling, dry milling, or solvent extraction can be used. Of these, salt milling, a type of wet milling, is preferred. The average primary particle size of the micronized pigment, as determined by transmission electron microscopy (TEM), is preferably 5 nm to 90 nm. Furthermore, from the viewpoint of dispersibility and contrast ratio, the average primary particle size is more preferably 10 nm to 70 nm.

[0103] Salt milling refers to the following process: using a kneader, two-roll mill, three-roll mill, ball mill, attritor, or sand mill, a mixture of pigments, water-soluble inorganic salts, and water-soluble organic solvents is mechanically mixed while heated. The mixture is then washed with water to remove the water-soluble inorganic salts and organic solvents. The water-soluble inorganic salts act as a breaking agent; their high hardness during salt milling breaks down the pigments. By optimizing the conditions for salt milling pigments, pigments with extremely fine primary particle sizes, narrow particle distributions, and sharp particle size distributions can be obtained.

[0104] Examples of water-soluble inorganic salts include sodium chloride, potassium chloride, and sodium sulfate. In terms of price, sodium chloride (table salt) is preferred. Regarding both processing and production efficiency, the optimal amount of water-soluble inorganic salt used per 100 parts by weight of pigment is 50 to 2,000 parts by weight, more preferably 300 to 1,000 parts by weight.

[0105] Water-soluble organic solvents are not particularly limited as long as they function to wet the pigments and water-soluble inorganic salts, and are dissolved (mixed) in water without substantially dissolving the inorganic salts used. However, for safety reasons, high-boiling-point solvents with a boiling point of 120°C or higher are preferred, as the solvent is prone to evaporation during salt milling due to the increased temperature. Examples of solvents that can be used include: 2-methoxyethanol, 2-butoxyethanol, 2-(isopentyloxy)ethanol, 2-(hexyloxy)ethanol, diethylene glycol, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, triethylene glycol, triethylene glycol monomethyl ether, liquid polyethylene glycol, 1-methoxy-2-propanol, 1-ethoxy-2-propanol, dipropylene glycol, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, and liquid polypropylene glycol. The amount of water-soluble organic solvent used is preferably 5 to 1,000 parts by weight, and more preferably 50 to 500 parts by weight, relative to 100 parts by weight of pigment.

[0106] During the salt milling process, resin may be added as needed. The type of resin is not particularly limited, but examples include: natural resin, modified natural resin, synthetic resin, and synthetic resin modified from natural resin. Preferably, these are solids at room temperature and water-insoluble, and preferably partially soluble in the organic solvent. The amount of resin added is preferably 2 to 200 parts by weight relative to 100 parts by weight of pigment.

[0107] (Metal removal) If specific metallic elements, other than the components of pigments, are present in large quantities in the coloring composition, they will hinder the dispersion stability over time. Additionally, they may sometimes reduce heat resistance or cause a decrease in sensitivity. Furthermore, color filters made using this material may sometimes produce foreign matter, which can easily lead to a decrease in brightness. The total content of Li, Na, K, Mg, Ca, Fe, Al, and Cr (hereinafter also referred to as specific metallic elements) in the photosensitive composition is preferably less than 500 ppm by mass relative to the total amount of the photosensitive composition.

[0108] Relative to the total amount of the photosensitive composition, the total content of the specific metal element contained in the photosensitive composition is preferably 300 ppm by mass or less, and more preferably 200 ppm by mass or less. Furthermore, there is no particular limitation on the lower limit of the total content of the specific metal element, but it is preferably 1 ppm by mass or more, and more preferably 5 ppm by mass or more. Within this range, a photosensitive composition that can suppress costs, exhibit excellent storage stability, and form a color filter that suppresses the formation of foreign matter and reduces brightness can be obtained.

[0109] Relative to the total amount of photosensitive components, the content of each specific metal element contained in the photosensitive components is preferably less than 100 ppm by mass, and more preferably less than 50 ppm by mass.

[0110] Furthermore, it is preferable that both the metals constituting the pigment, such as Ni, Zn, Cu, Al, Fe, Fe, Co, and Co, and impurities that cannot effectively perform their functions are few, and can be removed in the same way as specific metal elements by the following methods. Moreover, substances such as Mn, Cs, Ti, Co, Si, and Pd that may be introduced through materials used in the manufacturing process of various raw materials of the photosensitive composition (e.g., catalysts) are preferably in low concentrations.

[0111] Methods for removing pigment (A) or metal mixed into the device during the manufacturing process include, for example, the water washing method described in Japanese Patent Application Publication No. 2010-83997, Japanese Patent Application Publication No. 2018-36521, Japanese Patent Application Publication No. Hei 7-198928, Japanese Patent Application Publication No. Hei 8-333521, and Japanese Patent Application Publication No. 2009-7432, and the removal of magnetic foreign matter using a magnet described in Japanese Patent Application Publication No. 2011-48736. These methods can be used alone or multiple methods can be used appropriately.

[0112] The content of specific metal elements can be determined by inductively coupled plasma luminescence spectrophotometry (ICP).

[0113] [Pigment derivatives] Pigment derivatives may be used in photosensitive components as needed. Pigment derivatives are compounds containing acidic, basic, or neutral groups in organic pigment residues. Examples of pigment derivatives include: compounds with acidic substituents such as sulfonyl, carboxyl, or phosphate groups, and their amine salts; compounds with basic substituents such as sulfonamide groups or tertiary amine groups at the end; and compounds with neutral substituents such as phenyl or phthalimide alkyl groups.

[0114] Examples of organic pigments include: diketopyrrole-based pigments; anthraquinone-based pigments; quinacridone-based pigments; dioxazine-based pigments; violet ketone-based pigments; perylene-based pigments; thiamethoxam-indigo-based pigments; triazine-based pigments; benzimidazolone-based pigments; indole-based pigments such as benzimidazol; isoindoline-based pigments; isoindolineone-based pigments; quinoline ketone-based pigments; naphthol-based pigments; reduction-based pigments; metal complex-based pigments; and azo-based pigments such as azo, diazo, and polyazo.

[0115] Specifically, diketopyrrolopyrrole pigment derivatives include those described in Japanese Patent Application Publication No. 2001-220520, International Publication No. 2009 / 081930, International Publication No. 2011 / 052617, International Publication No. 2012 / 102399, and Japanese Patent Application Publication No. 2017-156397; phthalocyanine pigment derivatives include those described in Japanese Patent Application Publication No. 2007-226161, International Publication No. 2016 / 163351, Japanese Patent Application Publication No. 2017-165820, and Japanese Patent No. 5753266; anthraquinone pigment derivatives include those described in Japanese Patent Application Publication No. 2001-220520, International Publication No. 2009 / 081930, International Publication No. 2011 / 052617, International Publication No. 2012 / 102399, and Japanese Patent Application Publication No. 2017-156397. The pigment derivatives described in Japanese Patent Publication No. 63-264674, Japanese Patent Publication No. 09-272812, Japanese Patent Publication No. 10-245501, Japanese Patent Publication No. 10-265697, Japanese Patent Publication No. 2007-079094, and International Publication No. 2009 / 025325; quinacridone-based pigment derivatives include those described in Japanese Patent Publication No. 48-54128, Japanese Patent Publication No. 03-9961, and Japanese Patent Publication No. 2000-273383; dioxazine-based pigment derivatives include those described in Japanese Patent Publication No. 2011-162662. Thiazide-indigo pigment derivatives include those described in Japanese Patent Application Publication No. 2007-314785; triazine pigment derivatives include those described in Japanese Patent Application Publication No. 61-246261, No. 11-199796, No. 2003-165922, No. 2003-168208, No. 2004-217842, and No. 2007-314681; benzo[a]isoindole pigment derivatives include those described in Japanese Patent Application Publication No. 2009-57478; quinoline pigment derivatives include those described in Japanese Patent Application Publication No. 2009-57478. Pigment derivatives described in Japanese Patent Publication No. 2003-167112, Japanese Patent Publication No. 2006-291194, Japanese Patent Publication No. 2008-31281, and Japanese Patent Publication No. 2012-226110; Naphthol-based pigment derivatives include those described in Japanese Patent Publication No. 2012-208329 and Japanese Patent Publication No. 2014-5439; Azo-based pigment derivatives include those described in Japanese Patent Publication No. 2001-172520 and Japanese Patent Publication No. 2012-172092; Acidic substituents include those described in Japanese Patent Publication No. 2004-307854.Examples of basic substituents include pigment derivatives described in Japanese Patent Application Publications Nos. 2002-201377, 2003-171594, 2005-181383, and 2005-213404. Furthermore, in these documents, pigment derivatives are sometimes referred to as derivatives, pigment derivatives, dispersants, pigment dispersants, or simply compounds, etc. The compounds having substituents such as acidic, basic, or neutral groups in the organic pigment residues have the same meaning as pigment derivatives.

[0116] These pigment derivatives can be used alone or in combination of two or more.

[0117] The amount of pigment derivative used is preferably 1 to 100 parts by weight relative to 100 parts by weight of pigment (A), more preferably 3 to 70 parts by weight, and even more preferably 5 to 50 parts by weight.

[0118] By adding pigment derivatives to pigment (A) and performing pigmentation treatments such as acid gelatinization, acid slurrying, dry milling, salt milling, and solvent salt milling, the pigment derivatives are adsorbed onto the pigment surface. Compared with the case where no pigment derivatives are added, the primary particles of the pigment can be further refined.

[0119] By adding pigment derivatives to pigment (A) and performing wet dispersion treatments such as two-roller, three-roller, and bead dispersion, the pigment derivatives are adsorbed onto the pigment surface. The polarity of the pigment surface promotes the adsorption of resin-based dispersants, improving compatibility with pigments, pigment derivatives, resin-based dispersants, solvents, and other additives. This results in improved dispersion stability and long-term viscosity stability when producing colored or color-curing compositions. Furthermore, improved compatibility leads to excellent long-term stability of the coating film when the color-curing composition is applied to glass substrates, etc. The stability of pattern shape, characteristic dependence, and linewidth sensitivity stability become better compared to the waiting time from coating to exposure (post-coating delay (PCD)) and the waiting time from exposure to heat treatment (post-exposure delay (PED)). Additionally, the adsorption and coating of pigment derivatives and resin-based dispersants on the pigment surface suppresses crystallization caused by pigment aggregation and sublimation during heating and calcining of the coating film. Consequently, development time deviation and development residue are also suppressed.

[0120] [Resin-type dispersant (Z)] The photosensitive composition of this embodiment contains a resin-type dispersant (Z). The resin-type dispersant (Z) is preferably used for dispersing a pigment (A). The resin-type dispersant (Z) includes: a pigment (A) affinity site having the property of adsorbing onto the pigment (A), and a moderating site having affinity for components other than the pigment (A). Examples of resin-type dispersants (Z) include: urethane dispersants such as polyurethane esters; polycarboxylic acid esters such as polyacrylates; unsaturated polyamides; polycarboxylic acids; polycarboxylic acid (partial) amine salts; polycarboxylic acid ammonium salts; polycarboxylic acid alkylamine salts; polysiloxanes; long-chain polyurethane phosphates; polycarboxylic acid esters containing hydroxyl groups; or modified forms thereof; oily dispersants such as amides or their salts formed by the reaction of poly(lower alkylimides) with polyesters having free carboxyl groups; (meth)acrylate-styrene copolymers; (meth)acrylate-(meth)acrylate copolymers; styrene-maleic acid copolymers; water-soluble resins or water-soluble polymers such as polyvinyl alcohol and polyvinylpyrrolidone; polyesters; modified polyacrylates; ethylene oxide / propylene oxide addition compounds; phosphate esters, etc. These can be used alone or in combination of two or more.

[0121] The preferred resin-type dispersant (Z) is a grafted resin (also known as a comb resin) or a block copolymer. The term "grafted resin" refers to a resin in which a polymer, different from the main chain, serves as a side chain on the main chain. For example, it could be a polymer in which (AA…AA) forms the main chain and (BB…BB) forms the side chain. Conversely, the term "block copolymer" refers to a copolymer comprising multiple different homopolymers as partial components (blocks), such as having a structure like (AA…AA)-(BB…BB)-(AA…AA). The main chain may comprise polymers, preferably polyesters.

[0122] By using a grafted resin or block copolymer rather than a random copolymer, the resin-type dispersant (Z) can further fulfill its function as a resin-type dispersant (Z). That is, it is speculated that in grafted resins and block copolymers, both affinity and moderating sites are concentrated, thus facilitating the dispersing function.

[0123] Resin-type dispersants (Z) can be categorized into acidic resin-type dispersants (ZA) and basic resin-type dispersants (ZB) based on the difference in polar groups.

[0124] (Acidic resin type dispersant (ZA)) Acidic resin-type dispersants (ZA) include, for example, resin-type dispersants having an aromatic carboxylic acid structure. Acidic resin-type dispersants (ZA) can be manufactured by known methods as disclosed in International Patent Publication No. 2008 / 007776, Japanese Patent Application Publication No. 2008-029901, Japanese Patent Application Publication No. 2009-155406, Japanese Patent Application Publication No. 2010-185934, Japanese Patent Application Publication No. 2011-157416, Japanese Patent Application Publication No. 2009-251481, Japanese Patent Application Publication No. 2007-23195, and Japanese Patent Application Publication No. Hei 8-143651. Examples of acidic resin dispersants (ZA) include photocrosslinking acidic resin dispersants (ZAUV-1) with photocrosslinking groups and non-photocrosslinking acidic resin dispersants (ZA-2) without photocrosslinking groups.

[0125] ((Photocrosslinking acidic resin dispersant (ZAUV-1))) Photocrosslinking acidic resin type dispersants (ZAUV-1) include, for example, dispersants having an aromatic carboxylic acid structure in the main chain and a vinyl polymer portion containing (meth)acrylic groups in the side chain. Photocrosslinking acidic resin type dispersants (ZAUV-1) can be synthesized by, for example, the following methods: (1) reacting an anhydride group selected from the group consisting of tetracarboxylic anhydrides and tricarboxylic anhydrides with a hydroxyl group in a separately synthesized vinyl polymer; (2) reacting a hydroxyl-containing thiol with the anhydride group in the anhydride, and then polymerizing the monomer starting from the thiol group of the thiol to form the vinyl polymer portion. In other words, photocrosslinking acidic resin type dispersants (ZAUV-1) are dispersants comprising a polyester portion having a carboxyl group and a vinyl polymer portion formed by monomer polymerization, and are dispersants having (meth)acrylic groups in the vinyl polymer portion. Photocrosslinkable acidic resin dispersants (ZAUV-1) include, for example, the comb-type dispersant disclosed in Japanese Patent Application Publication No. 2011-157416. Alternatively, the comb-type dispersant disclosed in Japanese Patent Application Publication No. 6782309 may also be used as another method.

[0126] Examples of tetracarboxylic dianhydrides include: 1,2,3,4-butanetetracarboxylic dianhydride, 1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,3-dimethyl-1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,2,3,4-cyclopentanetetracarboxylic dianhydride, 2,3,5-tricarboxycyclopentylacetic dianhydride, 3,5,6-tricarboxynorbornane-2-acetic dianhydride, 2,3,4,5-tetrahydrofurantetracarboxylic dianhydride, 5-(2,5-dioxotetrahydrofuranyl)-3-methyl-3-cyclohexene-1,2-dicarboxylic dianhydride, and bicyclic [2.2.2]. -Octo-7-ene-2,3,5,6-tetracarboxylic dianhydride and other aliphatic tetracarboxylic dianhydrides, pyromellitic dianhydride, ethylene glycol diphenyltricarboxylic anhydride ester, propylene glycol diphenyltricarboxylic anhydride ester, butanediol diphenyltricarboxylic anhydride ester, 3,3',4,4'-benzophenone tetracarboxylic dianhydride, 3,3',4,4'-biphenyl ether tetracarboxylic dianhydride, 3,3',4,4'-dimethyldiphenylsilane tetracarboxylic dianhydride, 3 3',4,4'-Tetraphenylsilanetetracarboxylic dianhydride, 1,2,3,4-furantetracarboxylic dianhydride, 4,4'-bis(3,4-dicarboxyphenoxy)diphenyl sulfide dianhydride, 4,4'-bis(3,4-dicarboxyphenoxy)diphenyl dianhydride, 4,4'-bis(3,4-dicarboxyphenoxy)diphenylpropane dianhydride, 3,3',4,4'-perfluoroisopropylidene phthalic acid dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, bis(phthalic acid)phenylphosphine oxide dianhydride, p-phenyl-bis(triphenylphthalic acid) Aromatic tetracarboxylic acid dianhydrides include dianhydrides such as m-phenyl-bis(triphenylphthalic acid) dianhydride, bis(triphenylphthalic acid)-4,4'-diphenyl ether dianhydride, bis(triphenylphthalic acid)-4,4'-diphenylmethane dianhydride, 9,9-bis(3,4-dicarboxyphenyl)fluorene dianhydride, 9,9-bis[4-(3,4-dicarboxyphenoxy)phenyl]fluorene dianhydride, 3,4-dicarboxy-1,2,3,4-tetrahydro-1-naphthous succinic acid dianhydride, or 3,4-dicarboxy-1,2,3,4-tetrahydro-6-methyl-1-naphthous succinic acid dianhydride. Among these, aromatic tetracarboxylic acid dianhydrides are preferred for their excellent adsorption properties for colorants, and more preferably tetracarboxylic acid dianhydrides having two or more aromatic rings.

[0127] Examples of tricarboxylic anhydrides include: phenyltricarboxylic anhydride (1,2,3-phenyltricarboxylic anhydride, trimellitic anhydride [1,2,4-phenyltricarboxylic anhydride], etc.), naphthalenetricarboxylic anhydride (1,2,4-naphthalenetricarboxylic anhydride, 1,4,5-naphthalenetricarboxylic anhydride, 2,3,6-naphthalenetricarboxylic anhydride, 1,2,8-naphthalenetricarboxylic anhydride, etc.), 3,4,4'-benzophenone tricarboxylic anhydride, 3,4,4'-biphenyl ether tricarboxylic anhydride, 3,4,4'-biphenyltricarboxylic anhydride, 2,3,2'-biphenyltricarboxylic anhydride, 3,4,4'-biphenylmethane tricarboxylic anhydride, 3,4,4'-biphenyl sulfonate tricarboxylic anhydride, etc. Among these, trimellitic anhydride is preferred.

[0128] (((vinyl polymeric sites containing (meth)acrylic groups))) The vinyl polymer portion containing (meth)acrylic groups can be synthesized by reacting the isocyanate groups in the monomer containing isocyanate groups with the hydroxyl groups of the vinyl polymer portion. This imparts photocurability to the vinyl polymer portion, which serves as a moderating site.

[0129] Monomeric forms containing isocyanate groups include, for example, 2-methacryloxyethyl isocyanate, 2-acryloxyethyl isocyanate, 1,1-bis(acryloxymethyl)ethyl isocyanate, etc.

[0130] Thiols containing hydroxyl groups are preferably compounds having two hydroxyl groups and one thiol group. Examples of thiols containing hydroxyl groups include: 1-mercapto-1,1-methanediol, 1-mercapto-1,1-ethanediol, 3-mercapto-1,2-propanediol (thioglycerol), 2-mercapto-1,2-propanediol, 2-mercapto-2-methyl-1,3-propanediol, 2-mercapto-2-ethyl-1,3-propanediol, 1-mercapto-2,2-propanediol, 2-mercaptoethyl-2-methyl-1,3-propanediol, or 2-mercaptoethyl-2-ethyl-1,3-propanediol, etc.

[0131] Monomers used in the synthesis of vinyl polymer sites may include, for example, at least one thermally crosslinking functional group selected from the group consisting of hydroxyl, oxetyl, tributyl and block isocyanate, monomers containing carboxyl groups, and other monomers.

[0132] Examples of monoisocyanates containing hydroxyl groups include: 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate or 3-hydroxypropyl methacrylate, 2-hydroxybutyl methacrylate or 3-hydroxybutyl methacrylate or 4-hydroxybutyl methacrylate, cyclohexanediol mono(meth)acrylate, and other hydroxyalkyl methacrylates, as well as alkyl-α-hydroxyalkyl acrylates such as ethyl-α-hydroxymethyl acrylate; Examples of (meth)acrylamide monomers containing hydroxyl groups include: N-(2-hydroxyethyl)(meth)acrylamide, N-(2-hydroxypropyl)(meth)acrylamide, N-(2-hydroxybutyl)(meth)acrylamide, and other N-(hydroxyalkyl)(meth)acrylamides. Examples of vinyl ether monomers containing hydroxyl groups include: 2-hydroxyethyl vinyl ether, 2-hydroxypropyl vinyl ether or 3-hydroxypropyl vinyl ether, 2-hydroxybutyl vinyl ether or 3-hydroxybutyl vinyl ether or 4-hydroxybutyl vinyl ether, etc., which are hydroxyalkyl vinyl ethers. Examples of allyl ether monomers containing hydroxyl groups include: 2-hydroxyethyl allyl ether, 2-hydroxypropyl allyl ether or 3-hydroxypropyl allyl ether, 2-hydroxybutyl allyl ether or 3-hydroxybutyl allyl ether or 4-hydroxybutyl allyl ether, etc.

[0133] Examples of monoalkyl oxetanes containing oxetane include: (vinyloxyalkyl)alkyloxetane, (meth)acryloxyalkyloxetane, [(meth)acryloxyalkyl]alkyloxetane, and (3-ethyloxetane-3-yl)methyl methacrylate. Of these, (3-ethyloxetane-3-yl)methyl methacrylate is preferred.

[0134] Monomers containing a third butyl group include, for example, tert-butyl methacrylate and tert-butyl acrylate.

[0135] Monomers containing block isocyanate groups include, for example, 2-(O-[1'-methylpropylamino]carboxyamino)ethyl methacrylate and 2-[(3,5-dimethylpyrazolyl)carbonylamino]ethyl methacrylate.

[0136] The amount of the monomer containing the thermally crosslinking functional group used is preferably 1 to 90 parts by mass, more preferably 5 to 60 parts by mass, among all monomers. If used in appropriate amounts, the solvent resistance of the coating is further improved.

[0137] Examples of monomers containing a carboxyl group include (meth)acrylic acid, crotonic acid, α-chloroacrylic acid, and cinnamic acid. Among these, (meth)acrylic acid is preferred.

[0138] Other monomers include: (meth)acrylates, nitrogen-containing monomers, and vinyl monomers. Examples of (meth)acrylates include: methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, 2-ethylhexyl methacrylate, cyclohexyl methacrylate, stearyl methacrylate, lauryl methacrylate, and other alkyl methacrylates; cyclohexyl methacrylate, tributylcyclohexyl methacrylate, dicyclopentyl methacrylate, and dicyclopentenyl methacrylate. Aliphatic cyclic methacrylates such as esters and isobornyl methacrylate; aromatic methacrylates such as phenyl methacrylate, benzyl methacrylate, phenoxyethyl methacrylate, and diethylene glycol methacrylate; heterocyclic methacrylates such as tetrahydrofurfuryl methacrylate and 3-methyl-3-oxetanebutyl methacrylate; and alkoxy polyalkylene glycol methacrylates such as methoxypolypropylene glycol methacrylate and ethoxy polyethylene glycol methacrylate.

[0139] Examples of nitrogen-containing monomers include: N-substituted (meth)acrylamide, N,N-dimethyl (meth)acrylamide, N,N-diethyl (meth)acrylamide, N-isopropyl (meth)acrylamide, diacetone (meth)acrylamide, acrylmorpholine, and other N-substituted (meth)acrylamides; N,N-dimethylaminoethyl (meth)acrylate, N,N-diethylaminoethyl (meth)acrylate, and other (meth)acrylates containing amino groups; and nitriles such as (meth)acrylonitrile.

[0140] Examples of vinyl monomers include: styrene, α-methylstyrene and other styrene derivatives; vinyl ethers such as ethyl vinyl ether, n-propyl vinyl ether, isopropyl vinyl ether, n-butyl vinyl ether, isobutyl vinyl ether and other vinyl ether derivatives; and vinyl esters of fatty acids such as vinyl acetate and vinyl propionate.

[0141] ((Non-photocrosslinking acidic resin dispersant (ZA-2))) The non-photocrosslinking acidic resin-type dispersant (ZA-2) is preferably a dispersant having an aromatic carboxylic acid structure in the main chain and a vinyl polymer site in the side chain that does not contain a (meth)acrylic group. The resin-type dispersant (ZA-2) is preferably a structure obtained by removing the (meth)acrylic group from the structure of the resin-type dispersant (ZAUV-1). Examples of resin-type dispersants (ZA-2) include the comb-type dispersants described in Japanese Patent No. 4396777 and Japanese Patent No. 5181664. By using resin-type dispersants (ZAUV-1) and resin-type dispersants (ZA-2) together, the photocurability of the film can be appropriately adjusted.

[0142] From the viewpoint of developability, the amount of acidic resin-type dispersant (ZA) prepared is preferably 20 parts by mass or more per 100 parts by mass of resin-type dispersant (Z).

[0143] In addition, from the viewpoint of solvent resistance, the amount of resin-type dispersant (ZAUV-1) prepared is preferably 40 parts by weight or more of acidic resin-type dispersant (ZA) in 100 parts by weight.

[0144] (Alkaline resin type dispersant (ZB)) Examples of basic resin-type dispersants (ZB) include graft copolymers containing nitrogen atoms, acrylic block copolymers containing nitrogen atoms with functional groups such as tertiary amine groups, quaternary ammonium salt groups, and nitrogen-containing heterocycles in their side chains, and carbamate-based polymeric dispersants.

[0145] In addition, as disclosed in Japanese Patent Application Publication No. 2009-185277, resin-type dispersants having aromatic carboxyl groups and vinyl resins having tertiary amine groups (which have the function of resin-type dispersants) can also be cited as preferred examples.

[0146] From the perspective of developability and pigment dispersibility, the amine value (mgKOH / g) of the resin-type dispersant (Z) is preferably 10 mgKOH / g to 200 mgKOH / g, and more preferably 20 mgKOH / g to 150 mgKOH / g. The "amine value" refers to the amount of potassium hydroxide (mg) equivalent to hydrochloric acid required to neutralize the basic nitrogen contained in 1 g of the dispersant solid component. It can be determined by potentiometric titration according to American Society for Testing Material (ASTM) D 2074.

[0147] (Other resin-based dispersants) Resin-type dispersants (Z) can be used in conjunction with other dispersants besides those described above. Other dispersants include, for example: urethane dispersants such as polyurethane esters, polycarboxylic acid esters such as polyacrylates, unsaturated polyamides, polycarboxylic acids, polycarboxylic acid (partial) amine salts, polycarboxylic acid ammonium salts, polycarboxylic acid alkylamine salts, polysiloxanes, long-chain polyurethane phosphates, polycarboxylic acid esters containing hydroxyl groups, or modified forms thereof, oily dispersants such as amides or their salts formed by the reaction of poly(lower alkylimides) with polyesters having free carboxyl groups, (meth)acrylic acid-styrene copolymers, (meth)acrylic acid-(meth)acrylate copolymers, styrene-maleic acid copolymers, polyvinyl alcohol, polyvinylpyrrolidone and other water-soluble resins or water-soluble polymers, polyesters, modified polyacrylates, ethylene oxide / propylene oxide addition compounds, phosphate esters, etc.

[0148] Resin-type dispersants (Z) can be used alone or in combination with two or more.

[0149] The preferred amount of resin-type dispersant (Z) is 3 to 200 parts by weight, more preferably 5 to 100 parts by weight, relative to 100 parts by weight of pigment (A). Appropriate use further improves film-forming properties.

[0150] In another embodiment, the content of the resin-type dispersant (Z) is preferably 2% to 33% by mass of 100 parts by mass of the non-volatile components of the photosensitive composition.

[0151] Regarding the weight-average molecular weight of polystyrene converted for resin-type dispersants (Z), the molecular weight need not be strictly adhered to as long as the problem can be solved. However, from the viewpoints of dispersion stability, developing spots, solvent resistance, and developing speed, it is preferable to be 4,000 or more and less than 100,000, and even more preferably 5,000 or more and less than 30,000.

[0152] [Adhesive Resin (B)] As an adhesive resin (B), it includes an alkali-soluble adhesive resin (Bb) containing a constituent unit having a block isocyanate group, and as an optional component, it may further include an alkali-soluble adhesive resin (B1) that does not contain a constituent unit having a block isocyanate group.

[0153] Alkali-soluble adhesive resins (Bb) are preferably random copolymers. Random copolymers typically have a chain-like molecular structure. The term "random copolymer" refers to a copolymer in which two or more constituent units are arranged in a disordered manner.

[0154] It is speculated that block polymers and comb polymers, due to their functional sites such as pigment adsorption sites and steric repulsion sites, easily aggregate due to intermolecular forces between these functional sites. On the other hand, random polymers, with two or more constituent units arranged in a disordered manner, exhibit weak intermolecular forces, allowing molecules to easily expand amorphously. In the photosensitive composition, the random polymer diffuses as a whole. Therefore, the photosensitive composition of this embodiment can form a film with a smooth surface and high cohesion. This helps to improve substrate adhesion, pattern shape, and solvent resistance after low-temperature calcination.

[0155] (Base-soluble adhesive resin (Bb) containing building blocks with block isocyanate groups) The photosensitive composition of this embodiment uses an alkali-soluble binder resin (Bb) containing a constituent unit having block isocyanate groups as binder resin (B), thereby obtaining a cured film with good developability, substrate adhesion, pattern shape, and solvent resistance after a low-temperature calcination step when the film formed using the photosensitive composition is cured by processes such as exposure.

[0156] ((The building block containing block isocyanate groups (Bb-1))) The building block (Bb-1) containing a block isocyanate group is derived from a monomer containing a block isocyanate group. The monomer containing a block isocyanate group is a compound formed by block-modifying the isocyanate group in a monomer containing an isocyanate group using a block-modifying agent. The reaction between the isocyanate compound and the block-modifying agent can be carried out regardless of the presence or absence of a solvent. When a solvent is used, it is necessary to use a solvent that is inert to the block isocyanate group. In the block-modification reaction, organometallic salts such as tin, zinc, and lead, tertiary amines, etc., can also be used as catalysts. The reaction can usually be carried out at -20°C to 150°C, preferably at 0°C to 100°C. Examples of monomers containing a block isocyanate group include compounds represented by the following formula (8).

[0157] [Chemistry 20]

[0158] In formula (8), R1 represents a hydrogen atom or a methyl group, and R2 represents -CO-, -COOR 3- (here, R3 is an alkyl group with 1 to 6 carbon atoms) or -COO-R4O-CONH-R5- (here, R4 is an alkyl group with 2 to 6 carbon atoms, and R5 is an alkyl group with 2 to 12 carbon atoms or an aryl group with 6 to 12 carbon atoms that may have substituents). R2 is preferably -COOR 3-, and here, R3 is preferably an alkyl group with 1 to 4 carbon atoms.

[0159] Examples of compounds represented by formula (8) include: ethyl 2-isocyanate (meth)acrylate, propyl 2-isocyanate (meth)acrylate, propyl 3-isocyanate (meth)acrylate, methyl 1-isocyanate (meth)acrylate, 1,1-dimethyl 2-isocyanate (meth)acrylate, cyclohexyl 4-isocyanate (meth)acrylate, and methacrylic acid isocyanate. Alternatively, an isomolar (1 mole:1 mole) reaction product of 2-hydroxyalkyl methacrylate and a diisocyanate compound can also be used. The alkyl group of the 2-hydroxyalkyl methacrylate is preferably ethyl or n-propyl, more preferably ethyl. Examples of such diisocyanate compounds include: hexamethylene diisocyanate, 2,4-tolylene diisocyanate or 2,6-tolylene diisocyanate (TDI), 4,4'-diphenylmethane diisocyanate (MDI), 3,5,5-trimethyl-3-isocyanomethylcyclohexyl isocyanate (isophorone diisocyanate (IPDI)), m-xylene diisocyanate or p-xylene diisocyanate, 1,3-bis(isocyanomethyl)cyclohexane or 1,4-bis(isocyanomethyl)cyclohexane, lysine diisocyanate, etc.

[0160] Among these isocyanate compounds, ethyl 2-isocyanate, propyl 2-isocyanate, propyl 3-isocyanate, ethyl 2-isocyanate-1-methyl ethyl 2-isocyanate, ethyl 2-isocyanate-1,1-dimethyl ethyl 2-isocyanate, cyclohexyl 4-isocyanate, and methacrylic acid isocyanate are preferred, and ethyl 2-isocyanate and propyl 2-isocyanate are even more preferred.

[0161] Examples of such block agents include: ε-caprolactam, δ-valerolactam, γ-butyrolactam, β-propiolactam, and other lactamine-based agents; methanol, ethanol, propanol, butanol, ethylene glycol, methyl cellosolve, butyl cellosolve, methyl carbitol, benzyl alcohol, phenyl cellosolve, furfuryl alcohol, cyclohexanol, and other alcohol-based agents; phenol, cresol, 2,6-xylenol, 3,5-xylenol, ethylphenol, o-isopropylphenol, etc. Phenolic compounds such as butylphenol (p-tert-butylphenol), octylphenol (p-tert-butylphenol), nonylphenol, dinonylphenol, styrylated phenol, methyl 2-hydroxybenzoate, methyl 4-hydroxybenzoate, thymol, naphthol, p-nitrophenol, and p-chlorophenol; active methylene compounds such as dimethyl malonate, diethyl malonate, methyl acetoacetate, ethyl acetoacetate, and acetoacetone; thiol compounds such as butyl thiol, thiophenol, and tert-dodecyl thiol; amine compounds such as diphenylamine, phenylnaphthylamine, aniline, and carbazole; acid-amine compounds such as acetanilide, acetanisidide, acetate, and benzoylamine; acid-amine compounds such as succinate imine and maleate imine; and compounds such as imidazole, 2-methylimidazole, and 2-ethylimidazole. Imidazole series such as imidazole; pyrazole series such as pyrazole and 3,5-dimethylpyrazole; urea series such as urea, thiourea, and ethylene urea; carbamate series such as N-phenylaminocarbamate and 2-oxazolidinone; imine series such as ethyleneimine and polyethyleneimine; oxime series such as formaldehyde oxime, acetaldehyde oxime, acetyl oxime, methyl ethyl ketone oxime, methyl isobutyl ketone oxime, and cyclohexanone oxime; and bisulfite series such as sodium bisulfite and potassium bisulfite.

[0162] The block agent protects the highly reactive isocyanate groups, which are then regenerated by heating and dissociating. In this embodiment, the isocyanate groups react with reactive functional groups, i.e., acid groups, or hydroxyl or amine groups as needed, contained in the resin-type dispersant (Z), adhesive resin (B), and polymeric compound (C) to form a hardened film with high crosslinking density.

[0163] The dissociation rate of the block isocyanate groups in (meth)acrylates containing block isocyanate groups during heat treatment at 100°C for 30 minutes is preferably 5% to 99% by mass, more preferably 8% to 97% by mass, and even more preferably 10% to 95% by mass. Furthermore, the dissociation rate of the block isocyanate groups in the (meth)acrylates containing block isocyanate groups is determined by preparing a 20% by mass solution of the (meth)acrylate containing block isocyanate groups in n-octanol, adding 1% by mass of dibutyltin laurylate and 3% by mass of phenanthridine (polymerization inhibitor) to the solution, and then analyzing the mass reduction ratio of the (meth)acrylate containing block isocyanate groups after heating at 100°C for 30 minutes using high performance liquid chromatography (HPLC). If a (meth)acrylate containing block isocyanate groups with a dissociation rate within the aforementioned range is used, the stability of the copolymer during synthesis can be sufficiently ensured, and sufficient solvent resistance can be obtained even when the heating temperature during the preparation of the curing coating is below 180°C. Examples of block agents containing block isocyanate groups with such a dissociation rate include: γ-butyrolactone, 1-methoxy-2-propanol, 2,6-dimethylphenol, diisopropylamine, methyl ethyl ketoxime, 3,5-dimethylpyrazole, and diethyl malonate. Among these block agents, diethyl malonate, 3,5-dimethylpyrazole, and methyl ethyl ketoxime are preferred from the viewpoint of low-temperature curing properties.

[0164] The dissociation temperature of the block isocyanate groups is preferably 80°C or higher. Using (meth)acrylates containing block isocyanate groups with a dissociation temperature of 80°C or higher ensures the stability of the copolymer during synthesis and reduces unexpected crosslinking reactions during the subsequent modification reaction. Conversely, if the dissociation temperature of the block isocyanate groups is below 160°C, the baking temperature can be sufficiently reduced, and the solvent resistance of the cured coating can also be sufficiently ensured. The dissociation temperature of the block isocyanate groups is preferably 80°C to 160°C, more preferably 80°C to 120°C, and particularly preferably 80°C to 100°C. Furthermore, regarding the dissociation temperature of the block isocyanate group, a 20% by mass solution of the (meth)acrylate containing the block isocyanate group was prepared in n-octanol. 1% by mass of dibutyltin laurylate and 3% by mass of phenanthridine (polymerization inhibitor) were added to the solution, and the mixture was heated at a specified temperature. The mass reduction ratio of the (meth)acrylate containing the block isocyanate group after 30 minutes was determined by HPLC analysis. The temperature at which the mass reduction ratio reached 80% or more was set as the dissociation temperature of the block isocyanate group.

[0165] Examples of (meth)acrylates containing block isocyanate groups include: Karenz MOI-DEM (a reaction product of methacryloxyethyl isocyanate and diethyl malonate, manufactured by Showa Denko Co., Ltd., represented by formula (21) below, with a block isocyanate group dissociation temperature of 90°C and a dissociation rate of 90% by mass); and Karenz MOI-BP (methacryloxyethyl isocyanate) represented by formula (22) below. The reaction product of esters and 3,5-dimethylpyrazole, manufactured by Showa Denko Co., Ltd., with a dissociation temperature of 110°C and a dissociation rate of 70% by mass), methacrylates such as Karenz MOI-BM (the reaction product of methacryloyloxyethyl isocyanate and methyl ethyl ketoxime, manufactured by Showa Denko Co., Ltd., with a dissociation temperature of 130°C and a dissociation rate of 18% by mass) as represented by the following formula (23), and the corresponding acrylates, etc. These (meth)acrylates containing block isocyanate groups can be used alone or in combination of two or more.

[0166] [Chemistry 21]

[0167] There is no particular limitation on the proportion of block isocyanate-containing constituent units (Bb-1) in the adhesive resin (B), but it is preferably 1 mol% to 40 mol%, more preferably 2 mol% to 30 mol%, and most preferably 3 mol% to 25 mol%. If the proportion of block isocyanate-containing constituent units (Bb-1) is 1 mol% to 40 mol%, the solvent resistance of the cured coating is improved, and the storage stability of the adhesive resin (B) is also maintained.

[0168] From the viewpoint of developing speed, solvent resistance, and developing speed, the weight average molecular weight of polystyrene containing alkali-soluble adhesive resin (Bb) with block isocyanate groups is preferably 5,000 or more and less than 80,000, and more preferably 6,000 or more and less than 50,000.

[0169] From the viewpoint of reproducibility, the acid value of alkali-soluble adhesive resins (Bb) containing building blocks with block isocyanate groups is preferably 20 mgKOH / g to 200 mgKOH / g, more preferably 40 mgKOH / g to 150 mgKOH / g. The "acid value" refers to the number of mg of potassium hydroxide required to neutralize 1 g of solid resin components, and can be determined by potentiometric titration according to Japanese Industrial Standards (JIS) K 0070.

[0170] (Alkali-soluble adhesive resin (B1)) Alkali-soluble adhesive resin (B1) is any resin that is soluble in alkaline developing solution, and any known resin can be used.

[0171] The alkali-soluble adhesive resin (B1) is preferably a resin with a transmittance of 80% or more, and more preferably 95% or more, in the entire wavelength region of 400 nm to 700 nm. Examples of alkali-soluble adhesive resins (B1) include thermoplastic resins and active energy line-curing resins having vinyl unsaturated double bonds. Furthermore, the alkali-soluble adhesive resin (B1) may have thermosetting groups. Examples of thermosetting groups include epoxy groups and oxocyclobutyl groups.

[0172] ((Thermoplastic resin)) Examples of thermoplastic resins include resins having acidic groups such as carboxyl, urethane, and phosphate groups. Specifically, examples of resins include acrylic resins, α-olefin / maleic anhydride copolymers, styrene / styrene sulfonic acid copolymers, ethylene / (meth)acrylic acid copolymers, or isobutylene / maleic anhydride copolymers. Among these, at least one resin selected from acrylic resins having acidic groups and styrene / styrene sulfonic acid copolymers, especially alkali-soluble resins having acidic groups and / or hydroxyl groups, are suitable for use due to their high developability, solvent resistance, and transparency.

[0173] Methods for adding alkali-soluble adhesive resin (B1) to ethylene unsaturated double bonds can be exemplified by methods (i) to (iii) shown below.

[0174] <Method(i)> There is a method (i) for adding an epoxy group to an epoxy monomer containing an epoxy group in an alkali-soluble adhesive resin (B1) to a carboxyl group containing a carboxyl group.

[0175] Examples of monoisocyanates containing epoxy groups include: glycidyl (meth)acrylate, methyl glycidyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate glycidyl ether, 3,4-epoxybutyl (meth)acrylate, 3-methyl-3,4-epoxybutyl (meth)acrylate, 3-ethyl-3,4-epoxybutyl (meth)acrylate, 4-methyl-4,5-epoxypentyl (meth)acrylate, 5-methyl-5,6-epoxyhexyl (meth)acrylate, α-ethyl glycidyl acrylate, allyl glycidyl ether, crotonyl glycidyl ether, (iso)crotonic acid glycidyl ether, (3,4-epoxycyclohexyl)methyl (meth)acrylate, N-(3,5-dimethyl-4-glycidyl)benzylacrylamide, o-ethylene α-Methyl-o-vinylbenzyl glycidyl ether, α-m-vinylbenzyl glycidyl ether, α-methyl-m-vinylbenzyl glycidyl ether, α-methyl-p-vinylbenzyl glycidyl ether, 2,3-diglycidyloxymethylstyrene, 2,4-diglycidyloxymethylstyrene, 2,5-diglycidyloxymethylstyrene, 2,6-diglycidyloxymethylstyrene, 2,3,4-triglycidyloxymethylstyrene, 2,3,5-triglycidyloxymethylstyrene, 2,3,6-triglycidyloxymethylstyrene, 3,4,5-triglycidyloxymethylstyrene, 2,4,6-triglycidyloxymethylstyrene, etc. In terms of ease of obtaining industrial products, glycidyl methacrylate and 4-hydroxybutyl methacrylate glycidyl ether, represented by the following general formula (9), are preferred. In terms of increasing the concentration of vinyl unsaturated groups and facilitating UV curing in coatings formed from photosensitive components, glycidyl methacrylate is even more preferred.

[0176] [Chemistry 22]

[0177] In general formula (9), R6 is a hydrogen atom or a methyl group, and l is an integer of 0 or 1.

[0178] Examples of monomers containing a carboxyl group include: acrylic acid, methacrylic acid, crotonic acid, itaconic acid, maleic acid, and fumaric acid. Among these, acrylic acid and methacrylic acid are preferred.

[0179] The site formed by adding an epoxy group to a monomer containing an epoxy group and then reacting it with a polyacid anhydride is called the constituent unit (b1-2) derived from the polyacid anhydride. From the viewpoint of reproducibility, the constituent unit (b1-2) is preferred to be the constituent unit (b1-1) derived from the monomer containing an epoxy group.

[0180] Examples of polyacid anhydrides include: tetrahydrophthalic anhydride, phthalic anhydride, hexahydrophthalic anhydride, succinic anhydride, maleic anhydride, etc.

[0181] [Derived from the building block (b1-1) of a monomer containing an epoxy group] Regarding the content of the constituent unit (b1-1) derived from the monomer containing epoxy groups, from the viewpoint of developability and substrate adhesion, it is preferably set to 2 moles to 90 moles, based on the mole percentage of all constituent units in the alkali-soluble adhesive resin (B1), and from the viewpoint of solvent shock resistance and developability. Furthermore, from the viewpoint of heat resistance, it is preferably adjusted to a double bond equivalent of 200 to 1200, more preferably 200 to 800, and even more preferably 200 to 700. The so-called double bond equivalent is the weight of one mole of vinyl unsaturated double bonds in the resin, which can be calculated by the following formula. Double bond equivalent = weight of resin (g) / amount of vinyl unsaturated double bonds in resin (mol)

[0182] <Method (ii)> Methods (ii) can be listed for the addition of carboxyl groups to the carboxyl groups of the constituent units (b4) contained in the alkali-soluble adhesive resin (B1) to form an epoxy group containing an epoxy group monomer.

[0183] <Method (iii)> Examples include (iii) methods for reacting the isocyanate group of a monomer containing an isocyanate group with the hydroxyl group of a monomer unit containing a hydroxyl group contained in an alkali-soluble adhesive resin (B1).

[0184] Examples of monomethyl methacrylates containing hydroxyl groups include: 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate or 3-hydroxypropyl methacrylate, 2-hydroxybutyl methacrylate or 3-hydroxybutyl methacrylate or 4-hydroxybutyl methacrylate, glycerol mono(meth)acrylate, or cyclohexanediol mono(meth)acrylate, etc.

[0185] Monomeric forms containing isocyanate groups include, for example, 2-(meth)propenylethyl isocyanate, 2-(meth)propenyloxyethyl isocyanate, or 1,1-bis[methpropenyloxy]ethyl isocyanate.

[0186] The epoxy group-containing monomer can be used as a copolymer in the step of forming the adhesive resin (B), or it can be introduced into the adhesive resin by adding to the carboxyl groups present in the adhesive resin. The epoxy group, or the hydroxyl group generated in the addition reaction with the carboxyl group, contributes to the dispersion stability of the pigment and can improve solvent shock resistance.

[0187] [Building unit (b2) with aromatic ring groups] The alkali-soluble adhesive resin (B1) may also contain a constituent unit (b2) having an aromatic ring group. The constituent unit (b2) having an aromatic ring group has a ring structure formed by an aromatic ring group represented by general formula (10) or general formula (11), and functions as an affinity site for pigments and dyes, or pigment compositions containing pigments and dyes and dispersants. The content of the constituent unit (b2) having an aromatic ring group is preferably 2 mol% to 80 mol% among all the constituent units of the adhesive resin (B). This improves developability and further suppresses solvent shock.

[0188] [Chemistry 23]

[0189] In general formulas (10) and (11), R is a hydrogen atom or an alkyl group having 1 to 20 carbon atoms that may have a benzene ring. The dashed part in general formula (11) represents a cyclic structure adjacent to the benzene ring and containing one or more saturated or unsaturated heterocycles that may have substituents.

[0190] Monomers constituting the constituent unit (b2) having an aromatic ring group can be listed as: styrene, α-methylstyrene, divinylbenzene, indene, acenaphthene, benzyl acrylate, benzyl methacrylate, bisphenol A diglycidyl ether di(meth)acrylate, hydroxymethylated melamine (meth)acrylate and other monomers / oligomers, or monomers represented by general formula (12).

[0191] [Chemistry 24]

[0192] In general formula (12), R1 is a hydrogen atom or a methyl group, R2 is an alkyl group with 2 or 3 carbon atoms, R3 is an alkyl group with 1 to 20 carbon atoms that may have a benzene ring, and n is an integer from 1 to 15.

[0193] Examples of monomers represented by general formula (12) include: New Frontier CEA [ethylene oxide (EO) modified cresol acrylate, R1: hydrogen atom, R2: ethyl, R3: methyl, n=1 or 2], NP-2 [nonylphenoxy polyethylene glycol acrylate, R1: hydrogen atom, R2: ethyl, R3: nonyl, n=2], N-177E [nonylphenoxy polyethylene glycol acrylate, R1: hydrogen atom, R2: ethyl, R3: nonyl, n=16~17], or PHE [phenoxyethyl acrylate, R1: hydrogen atom, R2: ethyl, R3: hydrogen atom, n=1]. Daicel Inc. manufactures IRR169 [ethoxylated phenyl acrylate (EO1mol), R1: hydrogen atom, R2: ethyl, R3: hydrogen atom, n=1] or Ebecryl 110 [ethoxylated phenyl acrylate (EO2mol), R1: hydrogen atom, R2: ethyl, R3: hydrogen atom, n=2]. Dong-A Synthetic Co., Ltd. manufactures the following Aronix products: M-101A [phenol EO-modified (n≒2) acrylate, R1: hydrogen atom, R2: ethyl, R3: hydrogen atom, n≒2], M-102 [phenol EO-modified (n≒4) acrylate, R1: hydrogen atom, R2: ethyl, R3: hydrogen atom, n≒4], M-110 [p-cumylphenol EO-modified (n≒1) acrylate, R1: hydrogen atom, R2: ethyl, R3: p-cumyl, n≒1], M-111 [n-nonylphenol EO-modified (n≒1) acrylate, R1: hydrogen atom, R2: ethyl, R3: n-nonyl, n≒1], and M-113 [n-nonylphenol EO-modified (n≒4) acrylate, R1: hydrogen atom, R2: ethyl, R3: n-nonyl, n≒1]. R1: Hydrogen atom, R2: Ethylene, R3: Nonyl, n≒4], or M-117 [Nonylphenol PO modified (n≒2.5) acrylate, R1: Hydrogen atom, R2: Ethylenepropyl, R3: Nonyl, n≒2.5], Kyoei Chemical Co., Ltd. manufactures the following lightacrylates: PO-A (phenoxyethyl acrylate, R1: hydrogen atom, R2: ethyl, R3: hydrogen atom, n=1), P-200A (phenoxy polyethylene glycol acrylate, R1: hydrogen atom, R2: ethyl, R3: hydrogen atom, n≒2), NP-4EA (nonylphenol EO adduct acrylate, R1: hydrogen atom, R2: ethyl, R3: n-nonyl, n≒4), or NP-8EA (nonylphenol EO adduct acrylate, R1: hydrogen atom, R2: ethyl, R3: n-nonyl, n≒8), or lightester PO (phenoxyethyl methacrylate, R1: methyl, R2: propyl, R3: hydrogen atom, n=1). The following products manufactured by Nichiyu Corporation are: Blemmer ANE-300 (nonylphenoxy polyethylene glycol acrylate, R1: hydrogen atom, R2: ethyl, R3: n-nonyl, n≒5), ANP-300 (nonylphenoxy polyethylene glycol acrylate, R1: hydrogen atom, R2: propyl, R3: n-nonyl, n≒5), 43ANEP-500 (nonylphenoxy-polyethylene glycol-polypropylene glycol-acrylate, R1: hydrogen atom, R2: ethyl and propyl, R3: n-nonyl, n≒5+5), and 70ANEP-550 (nonylphenoxy-polyethylene glycol-polypropylene glycol-acrylate, R1: hydrogen atom, R2: ethyl and propyl, R3: n-nonyl, n≒5+5). 3: n-Nonyl, n≒9+3〕, 75ANEP-600 [Nonylphenoxy-polyethylene glycol-polypropylene glycol-acrylate, R1: hydrogen atom, R2: ethyl and propyl, R3: n-Nonyl, n≒5+2〕, AAE-50 [Phenoxy-polyethylene glycol acrylate, R1: hydrogen atom, R2: ethyl, R3: hydrogen atom, n=1〕, AAE-300 [Phenoxy-polyethylene glycol acrylate, R1: hydrogen atom, R2: ethyl, R3: hydrogen atom, n≒5.5〕, PAE-50 [Phenoxy-polyethylene glycol methacrylate, R1: methyl, R2: ethyl, R3: hydrogen atom, n=1〕, PAE-100 [Phenoxy-polyethylene glycol methacrylate, R1: methyl, R2: ethyl, R3: hydrogen atom, R4: methyl, R5: methyl, R6: methyl, R7: methyl, R8: methyl, R9 ... 3: Hydrogen atom, n=2], or 43PAPE-600B [phenoxy-polyethylene glycol-polypropylene glycol-methacrylate, R1: methyl, R2: ethyl and propyl, R3: hydrogen atom, n≒6+6], Shin-Nakamura Chemical Industry Co., Ltd. manufactures the following NK esters: AMP-10G [phenoxyethylene glycol acrylate (EO1mol), R1: hydrogen atom, R2: ethyl, R3: hydrogen atom, n=1], AMP-20G [phenoxyethylene glycol acrylate (EO2mol), R1: hydrogen atom, R2: ethyl, R3: hydrogen atom, n≒2], AMP-60G [phenoxyethylene glycol acrylate (EO6mol), R1: hydrogen atom, R2: ethyl, R3: hydrogen atom, n≒6], and PHE-1G [phenoxyethylene glycol methacrylate (EO1mol), R1: methyl, R2: ethyl, R3: hydrogen atom, n=1]. Viscoat #192 [phenoxyethyl acrylate, R1: hydrogen atom, R2: ethyl, R3: hydrogen atom, n=1] manufactured by Osaka Organic Chemicals Co., Ltd., or SR-339A (2-phenoxyethylene glycol acrylate, R1: hydrogen atom, R2: ethylenyl, R3: hydrogen atom, n=1) or SR-504 (ethoxylated nonylphenol acrylate, R1: hydrogen atom, R2: ethylenyl, R3: n-nonyl) manufactured by Nippon Kayaku Co., Ltd.

[0194] In the monolith represented by general formula (12), the alkyl group of R3 preferably has 1 to 20 carbon atoms, more preferably 1 to 10. The alkyl group includes not only straight-chain alkyl groups, but also branched alkyl groups and alkyl groups with benzene rings as substituents. When the alkyl group of R3 has 1 to 10 carbon atoms, the alkyl group acts as a barrier, inhibiting the approach of resins to each other and promoting the adsorption / orientation to the pigment. If the number of carbon atoms exceeds 10, the stereobarrier effect of the alkyl group becomes higher, showing a tendency to even hinder the adsorption / orientation of the benzene ring to the pigment. This tendency becomes more significant as the carbon chain length of the alkyl group of R3 increases. If the number of carbon atoms exceeds 20, the adsorption / orientation of the benzene ring is extremely reduced. Examples of alkyl groups with benzene rings represented by R3 include benzyl, 2-phenyl(iso)propyl, etc. By adding a side-chain benzene ring, the solvent affinity and pigment orientation are further improved, resulting in improved dispersibility and developability.

[0195] In the monolith represented by general formula (12), n is preferably an integer from 1 to 15. If n exceeds 15, the hydrophilicity increases, the solvent effect decreases, and the viscosity of the vinyl resin increases, as does the viscosity of the coloring composition using it, sometimes affecting the flowability. From the viewpoint of solvent treatment, n is further preferably 1 to 4.

[0196] From the perspective of copolymerization with other precursors and pigment dispersibility, the precursor having an aromatic ring unit (b2) is preferably styrene, α-methylstyrene, benzyl acrylate, benzyl methacrylate, or a monomer represented by general formula (12). By introducing a benzene ring into the side chain of the resin (B1), the side chain benzene ring aligns with the pigment, thus promoting the adsorption of the resin to the pigment, and thereby inhibiting pigment aggregation. Furthermore, from the perspective of developability, dispersion stability, and solvent impact, benzyl acrylate and / or benzyl methacrylate are preferred.

[0197] From the viewpoint of solvent shock resistance and developability, the content of the aromatic ring-based constituent unit (b2) in the alkali-soluble adhesive resin (B1) is preferably 2 mol% to 80 mol%, more preferably 2 mol% to 60 mol%, and even more preferably 2 mol% to 40 mol%. If it is present in an appropriate amount, the developability and substrate adhesion are further improved.

[0198] [Building unit with aliphatic ring group (b3)] The alkali-soluble adhesive resin (B1) may also contain a constituent unit (b3) having an aliphatic ring group. The constituent unit (b3) having an aliphatic ring group has a cyclic structure formed by the aliphatic ring groups represented by formulas (b31) and (b32) below. These are affinity sites for pigments and dyes, and incompatible with alkaline developers. The content of the constituent unit (b3) having an aliphatic ring group is preferably 2 mol% to 80 mol% of all the monomer units of the adhesive resin (B1). This improves developability and further suppresses solvent shock.

[0199] Regarding the aliphatic cyclic unit (b3) in the structure with a dicyclopentane site, the ring will not take a planar structure, which can be expected to produce steric hindrance to the aggregation state of molecules in the filter segment.

[0200] [Chemistry 25]

[0201] As precursors of the constituent unit (b3) having an aliphatic ring group, examples include monomorphs represented by general formula (b33) or monomorphs represented by general formula (b34).

[0202] [Chemistry 26]

[0203] In general formulas (b33) and (b34), R4 is a hydrogen atom or a methyl group, R5 is an alkyl group with 2 or 3 carbon atoms, and m is an integer from 0 to 2.

[0204] Examples of monomers represented by general formula (b33) include: Fancryl FA-513A (dicyclopentyl acrylate, R1: hydrogen atom, R2: none, m=0) or FA-513M (dicyclopentyl methacrylate, R1: hydrogen atom, R2: none, m=0) manufactured by Showa Denko Materials Co., Ltd., but are not limited to these. In addition, two or more may be used together.

[0205] Examples of monotonous substances represented by general formula (b34) include: Fancryl FA-511A (dicyclopentenyl acrylate, R1: hydrogen atom, R2: none, m=0), FA-512A (dicyclopentenyloxyethyl acrylate, R1: hydrogen atom, R2: ethyl, m=1), FA-512M (dicyclopentenyloxyethyl methacrylate, R1: methyl, R2: ethyl, m=1), or FA-512MT (dicyclopentenyloxyethyl methacrylate, R1: methyl, R2: ethyl, m=1), etc., manufactured by Showa Denko Materials Co., Ltd.

[0206] The content of the aliphatic ring-based constituent unit (b3) in all monomeric units of the alkali-soluble adhesive resin (B1) is preferably 2 mol% to 80 mol%, more preferably 2 mol% to 60 mol%, and more preferably 2 mol% to 40 mol%. If present in appropriate amounts, developability, developability resistance, and substrate adhesion are improved, and solvent shock can be further suppressed.

[0207] [Building unit containing carboxyl group (b4)] The carboxyl-containing unit (b4) has a carboxyl group and functions as an alkali-soluble site during development. The carboxyl-containing unit (b4) accounts for 2 mol% to 60 mol% of all monomer units in the alkali-soluble adhesive resin (B1). If present in moderation, it can improve developability, development resistance, and substrate adhesion.

[0208] Precursors containing the carboxyl group (b4) can be listed as monocarboxylates containing a carboxyl group, such as (meth)acrylic acid, crotonic acid, or α-chloroacrylic acid, or unsaturated dicarboxylic acids such as maleic acid or fumaric acid. Additionally, compounds formed by half-esterifying anhydrides of unsaturated dicarboxylic acids such as maleic anhydride with (meth)acrylic acid compounds containing hydroxyl groups, such as hydroxyalkyl methacrylic acid esters, can also be listed. From the viewpoint of polymerizability (ease of control over molecular weight, etc.), (meth)acrylic acid is preferred, and methacrylic acid is even more preferred.

[0209] Even if the raw material is a compound containing carboxyl groups, the change of carboxyl groups to ester bonds or the like in the step of forming adhesive resin (B) does not correspond to the constituent unit (b4).

[0210] [Other constituent units (b5)] Alkali-soluble adhesive resin (B1) may contain other constituent units (b5) besides constituent units (b1) to (b4). Among them, constituent units (Bb-1) having block isocyanate groups are excluded. Monomers forming other constituent units (b5) include, for example, methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, tributyl methacrylate, 2-ethylhexyl methacrylate, stearyl methacrylate, lauryl methacrylate, phenyl methacrylate, benzyl methacrylate, phenoxyethyl methacrylate, phenoxydiethylene glycol (meth)acrylate, methoxypolypropylene glycol (meth)acrylate, ethoxypolyethylene glycol (meth)acrylate, and other (meth)acrylates. Hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate or 3-hydroxypropyl methacrylate, 2-hydroxybutyl methacrylate or 3-hydroxybutyl methacrylate or 4-hydroxybutyl methacrylate, glycerol mono(meth)acrylate, or cyclohexanediol mono(meth)acrylate, etc., are hydroxyl-containing methacrylates. Polyether mono(meth)acrylates formed by the addition polymerization of hydroxyalkyl methacrylates with ethylene oxide, propylene oxide, and / or butane oxide, etc., or polyester mono(meth)acrylates formed by the addition polymerization of poly(γ-valerolactone), poly(ε-caprolactone), and / or poly(12-hydroxystearic acid), etc.; (Meth)acrylamide, N,N-dimethyl (meth)acrylamide, N,N-diethyl (meth)acrylamide, N-isopropyl (meth)acrylamide, diacetone (meth)acrylamide, or acrylamide morpholine and other (meth)acrylamide derivatives; Vinyl ethers such as ethyl vinyl ether, n-propyl vinyl ether, isopropyl vinyl ether, n-butyl vinyl ether, or isobutyl vinyl ether; Vinyl acetate or vinyl propionate, and other fatty acid vinyl esters; Phenylacetinimide, Methylmaleimide, Ethylmaleimide, 1,2-Dimaleimide ethane, 1,6-Dimaleimide hexane, 3-maleimide propionic acid, 6,7-Methylenedioxy-4-methyl-3-maleimide coumarin, 4,4'-Dimaleimide diphenylmethane, bis(3-ethyl-5-methyl-4-maleimidephenyl)methane, N,N'-1,3-Phenylbenzene dimaleimide, N,N'-1,4-Phenylidene dimaleimide, N-(1-pyrene)maleimide, N-(2,4,6-trichlorobenzene) N-substituted maleimides include N-(4-aminophenyl)maleimide, N-(4-nitrophenyl)maleimide, N-benzylmaleimide, N-bromomethyl-2,3-dichloromaleimide, N-succinimino-3-maleimide benzoate, N-succinimino-3-maleimide propionate, N-succinimino-4-maleimide butyrate, N-succinimino-6-maleimide hexanoate, N-[4-(2-benzimidazolyl)phenyl]maleimide, and 9-maleimide acridine. 2-(meth)propenyloxyethyl acid phosphate, compounds formed by reacting a phosphate esterifying agent such as phosphoric acid ester or polyphosphate with the hydroxyl group of the (meth)acrylate, and other (meth)acrylates containing phosphate ester groups.

[0211] The raw materials for synthesizing alkali-soluble adhesive resin (B1) can be used individually or in combination of two or more.

[0212] From the viewpoint of developability and substrate adhesion, the content of alkali-soluble adhesive resin (B1) in 100 parts by weight of alkali-soluble adhesive resin (B) is preferably 5 parts by weight to 95 parts by weight or less, and more preferably 10 parts by weight to 90 parts by weight or less.

[0213] Alkali-soluble adhesive resins (B1) can be used alone or in combination with two or more.

[0214] From the viewpoints of development spots, solvent resistance, and development speed, the weight-average molecular weight of the alkali-soluble adhesive resin (B1) converted from polystyrene is preferably 5,000 or more and less than 80,000, and more preferably 6,000 or more and less than 17,000.

[0215] From the viewpoints of developing spots, solvent resistance, and developing speed, the glass transition temperature (hereinafter also referred to as Tg) of the alkali-soluble adhesive resin (B1) is preferably -50°C to 150°C, more preferably -10°C to 150°C, and even more preferably -10°C to 80°C.

[0216] The glass transition temperature (Tg) can be determined by measurement. Specifically, Tg can be determined using differential scanning calorimetry (DSC). In cases where it is difficult to measure due to resin decomposition, etc., Tg is calculated using the following formula. 1 / Tg=W 1 / Tg 1+W 2 / Tg 2+･････+W n / Tg n Here, regarding the resin being calculated, it is assumed that n monomeric components W1 to Wn are copolymerized, where Wn is the weight fraction of the nth monomer, and Tgn is the glass transition temperature (absolute temperature) of the homopolymer of the nth monomer. Furthermore, the glass transition temperatures of the homopolymers of each monomer (hereinafter also referred to as homopolymers) are values ​​shown in "Polymer Handbook, Third Edition, John Wiley & Sons, 1989," edited by Brandrup, J., and Immergut, EH.

[0217] From the viewpoint of developability and substrate adhesion, the alkali-soluble adhesive resin (B1) is preferably one containing a (meth)acrylic group. The (meth)acrylic group is preferably a constituent unit derived from an epoxy group-containing monomer (b1-1). Preferably, it contains 2 mol% to 90 mol% of a constituent unit derived from an epoxy group-containing monomer (b1-1) in all constituent units, 2 mol% to 80 mol% of a constituent unit containing an aromatic ring (b2) in all constituent units, and 2 mol% to 80 mol% of a constituent unit containing an aliphatic ring (b3) in all constituent units. Furthermore, the constituent unit derived from the epoxy group-containing monomer is a constituent unit obtained by reacting the epoxy group in the epoxy group-containing monomer with a carboxyl group.

[0218] From the viewpoint of developability, the acid value of the alkali-soluble adhesive resin (B1) is preferably 20 mgKOH / g to 200 mgKOH / g, and more preferably 40 mgKOH / g to 150 mgKOH / g.

[0219] (Alkali-soluble adhesive resin (B2)) The photosensitive composition of this embodiment may contain an alkali-soluble adhesive resin (B2) other than the alkali-soluble adhesive resin (B1) as the adhesive resin (B), to the extent that it does not impair the effect of this embodiment.

[0220] The content of adhesive resin (B) is preferably 1% to 80% by mass in 100 parts by mass of non-volatile components of the photosensitive composition.

[0221] From the viewpoint of developing spots, the mass ratio of resin with block isocyanate groups (X) to resin without block isocyanate groups (Y), i.e., resin with block isocyanate groups (X) / resin without block isocyanate groups (Y), is preferably 0.04 to 0.95, more preferably 0.07 to 0.90, and particularly preferably 0.12 to 0.85.

[0222] Adhesive resin (B) can be used alone or in combination with two or more.

[0223] [Polymerizing compound (C)] The photosensitive component of this embodiment includes a polymeric compound (C). The polymeric compound (C) mainly contributes to improving the pattern shape and solvent resistance after the low-temperature calcination step.

[0224] The polymerizable compound (C) is a monomer or oligomer with a molecular weight of less than 2,000 and having a polymerizable unsaturated group. Furthermore, the molecular weight is typically 100 or higher. Examples of polymerizable unsaturated groups include vinyl, (meth)allyl, (meth)acrylyl, and (meth)acryloxy groups. Among these, (meth)acrylyl is preferred for improving chemical resistance.

[0225] The polymeric compound (C) is preferably a polymeric compound having 2 to 5 polymeric unsaturated groups, more preferably a compound having 2 to 4 polymeric unsaturated groups, and even more preferably a compound having 2 to 3 polymeric unsaturated groups. This further improves chemical resistance. Furthermore, if a polymeric compound having six or more polymeric unsaturated groups is used, sufficient chemical resistance may not be obtained after heating below 180°C. Therefore, polymeric compounds containing six or more polymeric unsaturated groups are preferably used within the scope that does not impair the effects of this embodiment. Furthermore, polymeric compounds having a polymerizable unsaturated group can be used for purposes such as introducing functional groups to the ends of polymeric components during photopolymerization reactions in exposure steps. By appropriately using polymeric compounds having a polymerizable unsaturated group containing an acid group or a steric hindrance group, developability and chemical resistance can be improved.

[0226] Polymerizable compounds (C) include, for example: styrene, vinyl acetate, (meth)acrylamide, N-vinylmethamide, acrylonitrile, methyl (meth)acrylate, ethyl (meth)acrylate, cyclohexyl (meth)acrylate, benzyl (meth)acrylate, phenoxydiethylene glycol acrylate, polyethylene glycol di(meth)acrylate, 2-ethylhexyl (meth)acrylate, ethoxylated o-phenylphenol acrylate, neopentyl glycol di(meth)acrylate, tripropylene glycol diacrylate, tricyclodecanediethanol diacrylate, tricyclodecyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, ethoxylated Bisphenol A diacrylate, ethoxylated glycerol triacrylate, tri-(2-acryloyloxyethyl)isocyanurate, 1,6-hexanediol di(meth)acrylate, pentaerythritol hexa(meth)acrylate, glycerol tri(meth)acrylate, carbamate acrylate and other various (meth)acrylates, triethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, di-trimethylolpropane tetra(meth)acrylate, ethylene glycol divinyl ether, pentaerythritol trivinyl ether, 2-ethylhexyl vinyl ether, 3-ethyl-3-[(ethoxy)methyl]oxetane, etc., but not limited to these. Furthermore, although the reason is unclear, trimethylolpropane triacrylate, trimethylolpropane propylene oxide (PO) modified triacrylate, and trimethylolpropane EO modified triacrylate cannot solve the problem due to their poor solvent resistance. Therefore, it is preferable to use polymeric compounds that do not introduce trimethylolpropane into (meth)acrylate, or compounds that introduce alkyl ions into trimethylolpropane into (meth)acrylate as polymeric compounds (C).

[0227] Commercially available polymerizable compounds (C) include: Aronix M-101A, M-111, M-140, M-208, M-211B, M-215, M-220, M-240, M-408, M-460, M-930, MT-3547, and M-5300 manufactured by Toa Synthetic Co., Ltd.; KAYARAD DPEA-12 manufactured by Nippon Kayaku Co., Ltd.; and NK esters (NK...) manufactured by Shin-Nakamura Chemical Industry Co., Ltd. Ester A-9300, ABE-300, A-DOG, A-DCP, A-BPE-4, 701A, A-GLY-3E, A-HD-N, A-NPG, A-200, APG-200, A-9200YN, AMP-20GY, A-LEN-10, A-SA; Viscoat #195, #310HP, #540, #700HV, 1,4-BDDA manufactured by Osaka Organic Chemicals Co., Ltd.; Light acrylate 1,6-HX-A, 1,6-ND-A, MPD-A, NP-A, THF-A, MEDOL-10 manufactured by Kyoeisha Chemical Co., Ltd.; EHVE, EOXTVE manufactured by Maruzen Petrochemical Co., Ltd., etc., but not limited to these.

[0228] (Polymerizable compounds with base-soluble groups (C1)) Furthermore, the polymerizable compound (C) preferably has a base-soluble group. Examples of base-soluble groups include: hydroxyl, phenolic hydroxyl, carboxylic acid, fluorinated alcohol, sulfonic acid, sulfonamide, sulfonimide, (alkylsulfonyl)(alkylcarbonyl)methylene, (alkylsulfonyl)(alkylcarbonyl)imide, bis(alkylcarbonyl)methylene, bis(alkylcarbonyl)imide, bis(alkylsulfonyl)methylene, bis(alkylsulfonyl)imide, tri(alkylcarbonyl)methylene, tri(alkylsulfonyl)methylene, epoxyalkyl, phosphate, lactone modification site, and carbamate bonding site. Examples of these include: hydroxyl groups, phenolic hydroxyl groups, carboxylic acid groups, fluorinated alcohol groups (preferably hexafluoroisopropyl), sulfonyl imine groups, bis(alkylcarbonyl)methylene groups, and epoxy alkyl groups (e.g., groups having ethylene oxide chains or propylene oxide chains). By including these, the developability and pattern-forming properties are further improved.

[0229] Furthermore, the alkali-soluble group is preferably an acid group such as a carboxyl group or a carboxylic anhydride group. When the polymeric compound (C) contains an acid group, the acid value is preferably 10 mgKOH / g to 300 mgKOH / g, more preferably 10 mgKOH / g to 200 mgKOH / g, and even more preferably 10 mgKOH / g to 120 mgKOH / g. If the acid value is within this range, developing residue is suppressed, and the pattern shape is improved.

[0230] ((polymeric compounds with acid groups)) Examples of polymeric compounds with acid groups include: 2-(meth)propenyloxyethyl succinic acid, 2-(meth)propenyloxyethyl phthalic acid, 2-(meth)propenyloxyethyl hexahydrophthalic acid, 2-(meth)propenyloxyethyl-2-hydroxyethyl phthalic acid, 2-(meth)propenyloxyethyl acid phosphate, β-carboxyethyl (meth)acrylate, etc.

[0231] Commercially available examples of polymeric compounds containing acid groups include: Viscoat #2500P manufactured by Osaka Organic Chemical Industry Co., Ltd.; Aronix M-5400, M-5700, M-510, M-520, and M-521 manufactured by Toa Synthetic Co., Ltd.; and Lightacrylates HOA-MPL(N), HOA-HH(N), HOA-MPE(N), HOMS(N), P-1A, P-1M, and P-2M manufactured by Kyoei Chemical Co., Ltd.

[0232] ((polymeric compounds containing hydroxyl groups)) Examples of polymerizable compounds containing hydroxyl groups include: N-hydroxymethyl (meth)acrylamide, 1,4-cyclohexanediethanol monoacrylate, bisphenol A diglycidyl ether di(meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, trimethylolpropane di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol caprolactone-modified penta(meth)acrylate, and diglycerides. Methacrylates, bis-(2-acryloxyethyl)isocyanurate, 2-hydroxy-3-methacrylate propyl acrylate, 2-(meth)acryloxyethyl-2-hydroxypropyl phthalate, 2-(meth)acryloxyethyl-2-hydroxyethyl phthalate, 2-hydroxyethyl vinyl ether, 2-hydroxybutyl vinyl ether, diethylene glycol monovinyl ether, neopentyl glycol diglycidyl ether di(meth)acrylate, 1,6-hexanediol diglycidyl ether di(meth)acrylate, etc.

[0233] Commercially available examples of polymerizable compounds containing hydroxyl groups include: KAYARAD R-128H manufactured by Nippon Kayaku Co., Ltd., and Aronix MT-3560, M-305, M-306, M-313, M-315, M-400, M-402, M-403, M-404, M-405, M-406, and M-406 manufactured by Toa Seizo Co., Ltd. 50, M-920, M-934, MT-2513, MT-2514, MT-3041, MT-3042, MT-3547, MT-3548, MT-3571, MT-3549, M-1100, M-1200, M-5700, M-6100, M-6500, M-7100, M-9050, NK Ester A-9200YN manufactured by Shin-Nakamura Chemical Industry Co., Ltd., Lightacrylate HO-MPP(N) and HOA-HH(N) manufactured by Kyoeisha Chemical Co., Ltd., HEVE, HBVE, DEGV, etc. manufactured by Maruzen Petrochemical Co., Ltd.

[0234] ((polymeric compounds modified with lactones)) Lactone-modified polymeric compounds are compounds that have an intramolecular structure modified by lactones. Using lactone-modified polymeric compounds improves heat resistance. Lactone-modified polymeric compounds can be obtained by esterifying polyols such as trimethylolethane, di-trimethylolethane, trimethylolpropane, di-trimethylolpropane, pentaerythritol, tripentaerythritol, glycerol, dipropylene glycol, and trimethylolmelamine with (meth)acrylic acid and ε-caprolactone or other lactone compounds. Preferably, lactone-modified polymeric compounds are those represented by the following general formula (13).

[0235] [Chemistry 27]

[0236] In general formula (13), all six R are bases represented by general formula (14) below, or one to five of the six R are bases represented by general formula (14) below, and the remainder are bases represented by general formula (15) below.

[0237] [Chemistry 28]

[0238] In general formula (14), R1 represents a hydrogen atom or a methyl group, m is an integer of 1 or 2, and * represents a bond bonded to the oxygen atom in general formula (13).

[0239] [Chemistry 29]

[0240] In general formula (15), R1 represents a hydrogen atom or a methyl group, and * represents a bond bonded to an oxygen atom in general formula (13).

[0241] Polymerizable compounds modified with lactones, such as the KAYARAD DPCA series manufactured by Nippon Kayaku Co., Ltd., are commercially available. Examples include: DPCA-20 (a compound in which m=1 in general formulas (13) to (15), the number of groups represented by general formula (14)=2, and R1 is all hydrogen atoms), DPCA-30 (a compound in which m=1 in general formulas (13) to (15), the number of groups represented by general formula (14)=3, and R1 is all hydrogen atoms), DPCA-60 (a compound in which m=1 in general formulas (13) to (15), the number of groups represented by general formula (14)=6, and R1 is all hydrogen atoms), and DPCA-120 (a compound in which m=2 in general formulas (13) to (15), the number of groups represented by general formula (14)=6, and R1 is all hydrogen atoms).

[0242] From the viewpoint of coating resistance, the lactone-modified polymeric compound is preferably a compound of the general formulas (13) to (15) in which m=1, the number of groups represented by the general formula (14) is 2 to 6, and all R1 are hydrogen atoms; more preferably a compound of the general formulas (13) to (15) in which m=1, the number of groups represented by the general formula (14) is 2 or 3, and all R1 are hydrogen atoms.

[0243] From the viewpoint of heat resistance, the content of the lactone-modified polymeric compound is preferably 5 to 80 parts by mass, more preferably 10 to 70 parts by mass, and even more preferably 20 to 60 parts by mass per 100 parts by mass of polymeric compound (C).

[0244] Commercially available examples of lactone-modified polymeric compounds include KAYARAD DPCA-20, DPCA-30, DPCA-60, and DPCA-120 manufactured by Nippon Kayaku Co., Ltd.

[0245] (Polymerizable compounds containing carbamate bonds) From the viewpoint of pattern formation, the photosensitive composition of this embodiment is preferably a polymeric compound containing a carbamate bond as a polymeric compound (C).

[0246] Polymerizable compounds having urethane bonds include, for example, urethane (meth)acrylates obtained by reacting a polyfunctional isocyanate with a (meth)acrylate having a hydroxyl group, or urethane (meth)acrylates obtained by reacting a polyfunctional isocyanate with a polyol and then with a (meth)acrylate having a hydroxyl group.

[0247] Examples of hydroxyl-containing (meth)acrylates include: 2-hydroxyethyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, trimethylolpropane di(meth)acrylate, pentaerythritol tri(meth)acrylate, di-trimethylolpropane tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol ethylene oxide modified penta(meth)acrylate, dipentaerythritol propylene oxide modified penta(meth)acrylate, dipentaerythritol caprolactone modified penta(meth)acrylate, glycerol acrylate methacrylate, glycerol dimethacrylate, 2-hydroxy-3-propenylpropyl methacrylate, reaction products of compounds containing epoxy groups and carboxyl (meth)acrylates, and polyol polyacrylates containing hydroxyl groups.

[0248] Examples of such multifunctional isocyanates include: toluene diisocyanate, diphenylmethylene diisocyanate, xylene diisocyanate as aromatic diisocyanates; trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate as aliphatic diisocyanates; isophorone diisocyanate as alicyclic diisocyanate; or biuret forms, isocyanate ureates, trimethylolpropane adducts, etc.

[0249] From the viewpoint of reproducibility, polymeric compounds having carbamate bonds are also preferably those having acid groups. Examples of acid groups include sulfonic acid groups, carboxyl groups, and phosphate groups. Among these, carboxyl groups are preferred.

[0250] One method for introducing an acid group into a polymeric compound having an urethane bond is, for example, to first react the hydroxyl-containing (meth)acrylate with the polyfunctional isocyanate. Subsequently, it can be synthesized by adding a carboxyl-containing thiol compound to the product.

[0251] Examples of thiol compounds containing a carboxyl group include: mercaptoacetic acid, 2-mercaptopropionic acid, 3-mercaptopropionic acid, o-mercaptobenzoic acid, 2-mercaptonicotinic acid, and mercaptosuccinic acid.

[0252] From the viewpoint of pattern formation, the number of polymerizable unsaturated groups in polymerizable compounds having carbamate bonds is preferably 2 to 10, more preferably 2 to 8.

[0253] From the viewpoint of pattern formation, the content of the polymeric compound having carbamate bonds is preferably 1 to 70 parts by mass, more preferably 2 to 50 parts by mass, and even more preferably 3 to 40 parts by mass in 100 parts by mass of polymeric compound (C).

[0254] Commercially available polymeric compounds containing carbamate bonds include: AH-600, AT-600, AH-600, UA-306H, UA-306T, UA-306I, and UA-1100H manufactured by Kyoei Chemical Co., Ltd., and Aronix M-1100, M-1200, and M-1600 manufactured by Toa Synthetic Co., Ltd.

[0255] From the viewpoint of developability and pattern formation, the content of the polymeric compound (C1) having an alkali-soluble group is preferably 5 to 95 parts by mass, and more preferably 5 to 90 parts by mass, per 100 parts by mass of the polymeric compound (C).

[0256] (Polymerizing compounds with an amine structure (C2)) The amine structure of the polymeric compound (C2) having three or more (meth)acrylic acid groups and amine structures includes a primary amine, a secondary amine, or a tertiary amine, preferably a tertiary amine. Furthermore, the amine structure of the polymeric compound (C2) does not include amide structures, amide-imine structures, or carbamate structures in which a carbonyl group is directly bonded to a nitrogen atom.

[0257] There is no particular limitation on the number of (meth)acrylic groups in the polymeric compound (C2) as long as there is one or more, but from the point of view of pattern formation, it is preferred to have three or more and sixteen or less.

[0258] Polymers (C2) can be used alone or in combination with two or more.

[0259] From the viewpoint of pattern-forming properties and solvent resistance, the content of the polymeric compound (C2) is preferably 0.5 parts by mass or more in 100 parts by mass of the polymeric compound (C), more preferably 1 part to 80 parts by mass, and particularly preferably 2 parts to 60 parts by mass.

[0260] Examples of polymerizable compounds (C2) include: tris(acryloxyethyl)amine, tris(methacryloxyethyl)amine, tris(2-hydroxy-3-methacryloxypropyl)amine, and Michael addition reaction products of (meth)acrylate compounds (X) and amine compounds (Y).

[0261] (Meth)acrylate compounds (X) include, for example: glyceryl tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, di-trimethylolpropane tri(meth)acrylate, di-trimethylolpropane tetra(meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, diglyceryl tri(meth)acrylate, diglyceryl tetra(meth)acrylate, trimethylolpropane epoxy Alkane-modified tri(meth)acrylate, di-trimethylolpropane epoxy alkyl-modified tri(meth)acrylate and di-trimethylolpropane epoxy alkyl-modified tetra(meth)acrylate, pentaerythritol epoxy alkyl-modified tri(meth)acrylate and pentaerythritol epoxy alkyl-modified tetra(meth)acrylate, diglycerol epoxy alkyl-modified tri(meth)acrylate and diglycerol epoxy alkyl-modified tetra(meth)acrylate, dipentaerythritol epoxy alkyl-modified tetra(meth)acrylate, dipentaerythritol epoxy alkyl-modified penta(meth)acrylate and dipentaerythritol epoxy alkyl-modified hexa(meth)acrylate, etc. Examples of epoxy alkane units in the epoxy alkane modification include: ethylene oxide, propylene oxide, and butane oxide. In addition, (meth)acrylate compounds (X) with acidic groups can also be listed.

[0262] (Meth)acrylate compound (X) can be used alone or in combination with two or more.

[0263] Examples of amine compounds (Y) include: n-propylamine, n-butylamine, n-hexylamine, benzylamine, aminohexanoic acid, monoethanolamine, 2-(2-aminoethoxy)ethanol, o-aminophenol, m-aminophenol, p-aminophenol, and other primary amines; Dimethylamine, diethylamine, dipropylamine, diisopropylamine, dibutylamine, cyclohexylamine, morpholine, piperidine, 1-methylpiperazine, purine, N-methylethanolamine, N-acetylethanolamine, diethanolamine, 3-anilinephenol, 4-anilinephenol, and other secondary amines.

[0264] Amine compound (Y) can be used alone or in combination with two or more.

[0265] There are no particular limitations on the method for producing the product of the Michael addition reaction of (meth)acrylate compound (X) and amine compound (Y), and known methods can be used. For example, methods described in International Publication No. 2006 / 075754, Japanese Patent Publication No. 2008-545859, and Japanese Patent Publication No. 2017-066347 can be cited.

[0266] Polymer compounds (B1) having three or more (meth)acrylic and amine structures may have acidic groups and / or hydroxyl groups. Examples of methods for introducing acidic groups and / or hydroxyl groups include: using compounds with acidic groups and / or hydroxyl groups in (meth)acrylate compounds (X) or amine compounds (Y), or adding an anhydride after a Michael addition reaction.

[0267] Commercially available polymeric compounds (C2) include: Aronix MT-3041, 3042 and Aron DA manufactured by Dong-A Synthetic Co., Ltd.; EBECREL 80 and 7100 manufactured by Daicel-Allnex Co., Ltd.; CN371, CN550 and CN551 manufactured by SARTOMER Co., Ltd.

[0268] Polymerizing compound (C) can be used alone or in combination with two or more.

[0269] From the viewpoint of developability, pattern-forming properties and heat resistance, the polymeric compound (C) may also include one or more of the group consisting of polymeric compounds modified with lactone and polymeric compounds having urethane bonds.

[0270] The amount of polymeric compound (C) is preferably 5 to 400 parts by mass relative to 100 parts by mass of pigment (A), and more preferably 10 to 300 parts by mass from the viewpoint of photocurability and developability.

[0271] In addition, in one embodiment, the content of the polymeric compound (C) is preferably 15% to 60% by mass of 100 parts by mass of the non-volatile components of the photosensitive composition.

[0272] The mass ratio of polymeric compound (C) to adhesive resin (B), i.e., polymeric compound (C) / adhesive resin (B), is preferably 0.01 or more, and more preferably 0.83 or more from the viewpoint of developing spots.

[0273] [Photopolymerization Initiator (D)] The photosensitive component of this embodiment includes an O-acyloxime ester-based photopolymerization initiator (D1). The O-acyloxime ester-based photopolymerization initiator (D1) causes the NO bond of the oxime to break upon absorption of ultraviolet light, generating imine radicals and alkoxy radicals. These radicals further decompose to generate highly reactive radicals, thus allowing patterning with less exposure.

[0274] (O-Azoxyoxime Ester Photopolymerization Initiator (D1)) O-acetylated oxime ester photopolymerization initiators (D1) include, for example, compounds represented by the following general formulas (1) to (7).

[0275] ((The oxime-based photopolymerization initiator represented by general formula (1) (D1-1)))

[0276] [Chemistry 30]

[0277] In general formula (1), R1 and R2 independently represent a hydrogen atom, a straight-chain or branched alkyl group having 2 to 20 carbon atoms, a cyclic alkyl group having 3 to 20 carbon atoms, or a phenyl group. R3 represents -COR 5, a hydrogen atom, a straight-chain or branched alkyl group having 1 to 20 carbon atoms, a cyclic alkyl group having 3 to 20 carbon atoms, an alkyl group, a nitro group, or a sulfonyl group. R5 represents a phenyl group with a substituent, and a thiophene group. R4 is a hydrogen atom and a straight-chain or branched alkyl group having 1 to 20 carbon atoms. The alkyl, cyclic alkyl, alkyl, and phenyl groups of R1 to R4 may be substituted with substituents selected from the group consisting of halogen atoms, alkoxy groups having 1 to 10 carbon atoms, and phenyl groups. Furthermore, the hydrogen atoms of the substituents in R1 to R4 may also be further substituted with other substituents R6. R 6 represents a halogen atom, a fluorine atom, an alkyl group, a cyclic alkyl group, a acetyl group, a nitro group, a sulfonyl group, and a phenyl group.

[0278] Examples of linear or branched alkyl groups with 1 to 20 carbon atoms represented by R1 to R4 in general formula (1) include: ethyl, propyl, isopropyl, butyl, isobutyl, dibutyl, tributyl, pentyl, isopentyl, tripentyl, hexyl, heptyl, octyl, isooctyl, 2-ethylhexyl, trioctyl, nonyl, isononyl, decyl, isodecyl, undecyl, dodecyl, tetradecyl, hexadecyl, octadecyl, eicosyl, cyclopentyl, cyclopentylmethyl, cyclopentylethyl, cyclohexyl, cyclohexylmethyl, cyclohexylethyl, etc. Furthermore, as a compound with R1 being methyl, OXE-02 (acetone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-, 1-(O-acetylgoxime)) can be listed, but since the problem cannot be solved due to the poor lightfastness of the coating, it does not contain a methyl group.

[0279] In addition, the phenyl groups represented by R 5 in the general formula (1) can be exemplified by, for example, p-chlorophenyl, mesitylene, tolyl, xylyl, and the group represented by chemical formula (1-A).

[0280] [Chemistry 31]

[0281] In the general formula (1), * represents a bond.

[0282] Examples of cyclic alkyl groups with 3 to 20 carbon atoms represented by R1 to R4 in the general formula (1) include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cyclododecyl, etc.

[0283] Examples of oxime-based photopolymerization initiators (D1-1) represented by general formula (1) include: 1-[9-ethyl-6-benzoyl-9.H.-carbazole-3-yl]-octane-1-one oxime-O-acetate, 1-[9-ethyl-6-(2-methylbenzoyl)-9.H.-carbazole-3-yl]-ethane-1-one oxime-O-acetate, 1-[9 [9-ethyl-6-(2-methylbenzoyl)-9.H.-carbazole-3-yl]-ethane-1-ketooxime-O-benzoate, 1-[9-ethyl-6-(2,4,6-trimethylbenzoyl)-9.H.-carbazole-3-yl]-ethane-1-ketooxime-O-benzoate, 1-[9-n-butyl-6-(2-ethylbenzoyl)-9.] H.-Carbazole-3-yl]-Ethyl-1-one oxime-O-benzoate, ethyl ketone, 1-[9-ethyl-6-(3-methylbenzoyl)-9H-carbazole-3-yl]-,1-(O-acetyl oxime), ethyl ketone, 1-(9-ethyl-6-benzoyl-9H-carbazole-3-yl)-,1-(O-acetyl oxime), ethyl ketone, 1-[9-ethyl [9-ethyl-6-(2-methyl-4-tetrahydropyranylbenzoyl)-9H-carbazole-3-yl]-,1-(O-acetylgoxime), acetone, 1-[9-ethyl-6-(2-methyl-4-tetrahydropyranylbenzoyl)-9H-carbazole-3-yl]-,1-(O-acetylgoxime), acetone, 1-[9-ethyl-6-(2-methyl-5 ... [9-ethyl-6-(2-methyl-5-tetrahydropyranylbenzoyl)-9H-carbazole-3-yl]-,1-(O-acetylgoxime), acetone, 1-[9-ethyl-6-{2-methyl-4-(2,2-dimethyl-1,3-di-di-2-methyl-4-(2,2-dimethyl-1,3 ... [9-[9-ethyl-6-(2-methyl-4-tetrahydrofuranylmethoxybenzoyl)-9H-carbazole-3-yl]-1-(O-acetylgoxymethyl), acetone, 1-[9-ethyl-6-(2-methyl-4-tetrahydropyranylmethoxymethyl]-1-(O-acetylgoxymethyl), acetone, 1-[9-ethyl-6-(2-methyl-4-tetrahydropyranylmethoxymethyl]-1-(O-acetylgoxymethyl), acetone, 1-[9-ethyl-6-(2-methyl-4-tetrahydropyranylmethoxymethyl]-1-(O-acetylgoxymethyl]-1-(O-acetylgoxymethyl]-1-(O-acetylgoxymethyl]-1-(O-acetylgoxymethyl) ...) acetone, 1-[9-ethyl-6-(2-methyl-4-tetrahydropyranylmethoxymethyl]-1-(O-acetylgoxymethyl]-1-(O-acetylgoxymethyl) acetone, 1-[9-ethyl-6-(2-methyl-4-tetrahydropyranylmethoxymethyl]-1-(O-acetylgoxymethyl]-1-(O-acetylgoxymethyl]-1-(O-acetylgoxymethyl) acetone, 1-[9-ethyl-6-(2-methyl-4-tetrahydropyran [9-ethyl-6-(2-methyl-5-tetrahydropyranylmethoxybenzoyl)-9H-carbazole-3-yl]-,1-(O-acetyloxime), acetone, 1-[ ...acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, acetone, H-carbazole-3-yl]-,1-(O-acetylgoxime), acetone, 1-[9-ethyl-6-{2-methyl-4-(2,2-dimethyl-1,3-dioxacyclopentyl)methoxybenzoyl}-9H-carbazole-3-yl]-,1-(O-acetylgoxime) and compounds represented by the following chemical formulas (1-1) to (1-10).

[0284] [Chemistry 32]

[0285] ((The oxime-based photopolymerization initiator represented by general formula (2) (D1-2)))

[0286] [Chemistry 33]

[0287] In general formula (2), R1 and R2 independently represent a hydrogen atom, a linear or branched alkyl group having 1 to 20 carbon atoms, a cyclic alkyl group having 3 to 20 carbon atoms that may have substituents, or a phenyl group. R3 represents a hydrogen atom, a group having an O-acyloxime structure, a linear or branched alkyl group having 1 to 20 carbon atoms, a cyclic alkyl group having 3 to 20 carbon atoms, an acyl group, a nitro group, an acetoxy group, or a sulfonyl group. The alkyl group, cyclic alkyl group, acyl group, and phenyl group of R1 to R3 may be substituted with substituents selected from the group consisting of halogen atoms, alkoxy groups having 1 to 10 carbon atoms, and phenyl groups. R4 is a hydrogen atom, a linear or branched alkyl group having 1 to 20 carbon atoms, or an aryl group having 6 to 30 carbon atoms, or an arylalkyl group having 7 to 30 carbon atoms. The hydrogen atom of the aryl or arylalkyl group represented by R 4 may be further substituted with R 21, -OR 21, -COR 21, hydroxyl, nitro, cyano, halogen atom, or -COOR 21. R 21 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an arylalkyl group having 7 to 30 carbon atoms. The hydrogen atom of the alkyl, aryl, or arylalkyl group represented by R 21 may be further substituted with hydroxyl, nitro, cyano, halogen atom, hydroxyl, or carboxyl group. The alkyl, acetyl, and phenyl groups may be substituted with substituents selected from the group consisting of halogen atoms, alkoxy groups having 1 to 10 carbon atoms, and phenyl groups. Furthermore, the hydrogen atom of the substituents in R 1 to R 4 may also be further substituted with other substituents.

[0288] Examples of linear or branched alkyl groups with 1 to 20 carbon atoms represented by R1 to R4 in general formula (2) include: methyl, ethyl, propyl, isopropyl, butyl, isobutyl, dibutyl, tributyl, pentyl, isopentyl, tripentyl, hexyl, heptyl, octyl, isooctyl, 2-ethylhexyl, trioctyl, nonyl, isononyl, decyl, isodecyl, undecyl, dodecyl, tetradecyl, hexadecyl, octadecyl, eicosyl, cyclopentyl, cyclopentylmethyl, cyclopentylethyl, cyclohexyl, cyclohexylmethyl, cyclohexylethyl, etc.

[0289] Examples of cyclic alkyl groups with 3 to 20 carbon atoms represented by R1 to R4 in the general formula (2) include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cyclododecyl, etc.

[0290] The base having an O-acetylated oxime structure represented by R 3 in the general formula (2) is preferably represented by general formula (2-B).

[0291] [Chemistry 34]

[0292] In the general formula (2-B), * represents a bond.

[0293] The aryl groups represented by R4 and R21 in the general formula (2) with 6 to 30 carbon atoms can be listed as follows: phenyl, tolyl, xylyl, ethylphenyl, naphthyl, anthracene, phenanthryl, phenyl, biphenyl, naphthyl, anthracene, etc., which are substituted with one or more of the alkyl groups.

[0294] The aryl alkyl group represented by R 4 in the general formula (2) with 7 to 30 carbon atoms can be exemplified by, for example, benzyl, α-methylbenzyl, α,α-dimethylbenzyl, phenylethyl, etc.

[0295] The oxime-based photopolymerization initiators (D1-2) represented by general formula (2) can be exemplified by compounds represented by the following chemical formulas (2-1) to (2-6).

[0296] [Chemistry 35]

[0297] ((The oxime-based photopolymerization initiator represented by general formula (3) (D1-3)))

[0298] [Chemistry 36]

[0299] In general formula (3), R1 and R2 independently represent a hydrogen atom, a straight-chain or branched alkyl group having 1 to 20 carbon atoms, a cyclic alkyl group having 3 to 20 carbon atoms, or a phenyl group. R3 and R5 independently represent a hydrogen atom, a straight-chain or branched alkyl group having 1 to 20 carbon atoms, a cyclic alkyl group having 3 to 20 carbon atoms, an acetyl group, a nitro group, or a sulfonyl group. The alkyl, acetyl, and phenyl groups of R1 to R3 may be substituted with substituents selected from the group consisting of halogen atoms, alkoxy groups having 1 to 10 carbon atoms, and phenyl groups. R4 represents a hydrogen atom, a straight-chain or branched alkyl group having 1 to 20 carbon atoms, a heterocyclic group having 4 to 20 carbon atoms, or -COR 6. R6 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 4 to 20 carbon atoms. Furthermore, the hydrogen atoms of the substituents in R1 to R6 can also be further substituted by other substituents.

[0300] Examples of linear or branched alkyl groups with 1 to 20 carbon atoms represented by R1 to R5 in the general formula (3) include: methyl, ethyl, propyl, isopropyl, butyl, isobutyl, dibutyl, tributyl, pentyl, isopentyl, tripentyl, hexyl, heptyl, octyl, isooctyl, 2-ethylhexyl, trioctyl, nonyl, isononyl, decyl, isodecyl, undecyl, dodecyl, tetradecyl, hexadecyl, octadecyl, eicosyl, cyclopentyl, cyclopentylmethyl, cyclopentylethyl, cyclohexyl, cyclohexylmethyl, cyclohexylethyl, etc.

[0301] Examples of cyclic alkyl groups with 3 to 20 carbon atoms represented by R1 to R5 in the general formula (3) include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cyclododecyl, etc.

[0302] Examples of heterocyclic groups with 4 to 20 carbon atoms represented by R4 and R7 in the general formula (3) include: benzofuran, isobenzofuran, pyridinyl, pyrimidinyl, furanyl, thiopheneyl, tetrahydrofuranyl, dioxazolyl, benzoxazol-2-yl, tetrahydropyranyl, pyrrolidinyl, imidazodinyl, pyrazolidinyl, thiazodinyl, isothiazolidyl, oxazolidyl, isoxazolidyl, piperidinyl, piperazinyl, morpholinyl, etc., which are 5 to 7-membered heterocycles.

[0303] The aryl group represented by R 6 in the general formula (3) with 6 to 30 carbon atoms can be exemplified by: phenyl, tolyl, xylyl, ethylphenyl, naphthyl, anthracene, phenanthryl, phenyl with one or more alkyl substitutions, biphenyl, naphthyl, anthracene, etc.

[0304] The aryl alkyl group with 7 to 30 carbon atoms represented by R 6 in the general formula (3) can be exemplified by, for example, benzyl, α-methylbenzyl, α,α-dimethylbenzyl, phenylethyl, etc.

[0305] The oxime-based photopolymerization initiators (D1-3) represented by general formula (3) can be exemplified by compounds represented by the following chemical formulas (3-1) to (3-3).

[0306] [Chemistry 37]

[0307] ((The oxime-based photopolymerization initiator represented by general formula (4) (D1-4)))

[0308] [Chemistry 38]

[0309] In general formula (4), R1 and R2 independently represent a hydrogen atom, a straight-chain or branched alkyl group having 1 to 20 carbon atoms, a cyclic alkyl group having 3 to 20 carbon atoms, or a phenyl group. R3 and R5 independently represent a hydrogen atom, a straight-chain or branched alkyl group having 1 to 20 carbon atoms, a cyclic alkyl group having 3 to 20 carbon atoms, an alkyl group, a nitro group, or a sulfonyl group. R4 is a hydrogen atom or an alkoxy group, which may also include a straight-chain or branched alkyl group having 1 to 20 carbon atoms or a hydroxyl group. The alkyl group, alkyl group, and phenyl group may be substituted with substituents selected from the group consisting of halogen atoms, alkoxy groups having 1 to 10 carbon atoms, and phenyl groups. Furthermore, the hydrogen atoms of the substituents in R1 to R5 may also be further substituted with other substituents.

[0310] Examples of linear or branched alkyl groups with 1 to 20 carbon atoms represented by R1 to R5 in the general formula (4) include: methyl, ethyl, propyl, isopropyl, butyl, isobutyl, dibutyl, tributyl, pentyl, isopentyl, tripentyl, hexyl, heptyl, octyl, isooctyl, 2-ethylhexyl, trioctyl, nonyl, isononyl, decyl, isodecyl, undecyl, dodecyl, tetradecyl, hexadecyl, octadecyl, eicosyl, cyclopentyl, cyclopentylmethyl, cyclopentylethyl, cyclohexyl, cyclohexylmethyl, cyclohexylethyl, etc.

[0311] Examples of cyclic alkyl groups with 3 to 20 carbon atoms represented by R1, R2, R3 and R5 in the general formula (4) include: cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cyclododecyl, etc.

[0312] Examples of oxime-based photopolymerization initiators (D1-4) represented by general formula (4) include: 1,2-heptanedione, 1-[4-(phenylthio)phenyl]-,2-(O-benzoyl oxime), 1,2-octanedione, 1-[4-(phenylthio)phenyl]-,2-(O-benzoyl oxime), 1,2-octanedione, 1-[4-(benzoyl)phenyl]-,2-(O-benzoyl oxime), acetone, 1-[4-(phenylthio)phenyl]-octane-1-one-2-one oxime-O-acetate, 1-[4-(2-methylphenylthio)phenyl]-octane-1-one-2-one oxime-O-acetate, 1-[4-(2,4,6-trimethylphenylthio)phenyl]- -Octan-1-one-2-ketooxime-O-acetate, 1-[4-(2-ethylphenylthio)phenyl]-octan-1-one-2-ketooxime-O-acetate, 1-[4-(phenylthio)phenyl]-octan-1-one-2-ketooxime-O-benzoate, 1-[4-(2-methylphenylthio)phenyl]-octan-1-one-2-ketooxime-O-benzoate, 1-[4-(2,4,6-trimethylphenylthio)phenyl]-octan-1-one-2-ketooxime-O-benzoate, 1-[4-(2-ethylphenylthio)phenyl]-octan-1-one-2-ketooxime-O-benzoate and compounds represented by the following chemical formulas (4-1) to (4-6).

[0313] [Chemistry 39]

[0314] ((The oxime-based photopolymerization initiator represented by general formula (5) (D1-5)))

[0315] [Chemistry 40]

[0316] In general formula (5), R1 and R2 independently represent R11 or -COR11, R 11 represents a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an arylalkyl group with 7 to 30 carbon atoms, or a heterocyclic group with 2 to 20 carbon atoms. The alkyl portion of the alkyl, aryl, arylalkyl, or heterocyclic group represented by R 11 may have branched side chains or may be a cyclic alkyl group. R 3 represents an alkyl group with 1-20 carbon atoms, an aryl group with 6-30 carbon atoms, an arylalkyl group with 7-30 carbon atoms, or a heterocyclic group with 2-20 carbon atoms. The alkyl portion of the alkyl, aryl, arylalkyl, or heterocyclic group represented by R 3 may have branched side chains or may be a cyclic alkyl group. The hydrogen atom of the aryl, arylalkyl, or heterocyclic group represented by R 3 may be further substituted with R 21, -OR 21, -COR 21, -SR 21, -NR 22R 23, -CONR 22R 23, -NR 22-OR 23, -NCOR 22-OCOR 23, -NR 22COR 21, -OCOR 21, -SCOR 21, -OCSR 21, -COSR 21, -CSOR 21, hydroxyl, nitro, cyano, halogen atom, or -COOR 21. R 21, R 22, and R 23 independently represent a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an arylalkyl group with 7 to 30 carbon atoms, or a heterocyclic group with 4 to 20 carbon atoms, respectively. The hydrogen atoms of the alkyl, aryl, arylalkyl, or heterocyclic groups represented by R 21, R 22, and R 23 may be further substituted with hydroxyl, nitro, cyano, halogen atoms, hydroxyl, or carboxyl groups. The alkyl moiety of the alkyl, aryl, arylalkyl, or heterocyclic groups represented by R 21, R 22, and R 23 may also contain 1 to 5 -O-, -S-, -COO-, -OCO-, -NR 24-, -NR 24CO-, -NR 24COO-, -OCONR 24-, -SCO-, -COS-, -OCS-, or -CSO-, provided that the oxygen atoms are not adjacent. R 24 represents a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an arylalkyl group with 7 to 30 carbon atoms, or a heterocyclic group with 2 to 20 carbon atoms. The alkyl portion of the alkyl, aryl, arylalkyl, or heterocyclic group represented by R 24 may have branched side chains or may be a cyclic alkyl group. R 4 represents a hydrogen atom, hydroxyl group, cyano group, nitro group, or halogen atom, and n represents 0 or 1.

[0317] The alkyl groups with 1 to 20 carbon atoms represented by R3, R11, R21, R22, R23 and R24 in the general formula (5) can be listed as follows: methyl, ethyl, propyl, isopropyl, butyl, isobutyl, dibutyl, tributyl, pentyl, isopentyl, tripentyl, hexyl, heptyl, octyl, isooctyl, 2-ethylhexyl, trioctyl, nonyl, isononyl, decyl, isodecyl, undecyl, dodecyl, tetradecyl, hexadecyl, octadecyl, eicosyl, cyclopentyl, cyclopentylmethyl, cyclopentylethyl, cyclohexyl, cyclohexylmethyl, cyclohexylethyl, etc.

[0318] The aryl groups represented by R3, R11, R21, R22, R23 and R24 in the general formula (5) with 6 to 30 carbon atoms can be listed as follows: phenyl, tolyl, xylyl, ethylphenyl, naphthyl, anthracene, phenanthryl, phenyl, biphenyl, naphthyl, anthracene, etc., which are substituted with one or more of the alkyl groups.

[0319] The aryl alkyl groups with 7 to 30 carbon atoms represented by R3, R11, R21, R22, R23 and R24 in the general formula (5) can be exemplified by, for example, benzyl, α-methylbenzyl, α,α-dimethylbenzyl, phenylethyl, etc.

[0320] Examples of heterocyclic groups with 2 to 20 carbon atoms represented by R3, R11, R21, R22, R23 and R24 in the general formula (5) include: pyridinyl, pyrimidinyl, furanyl, thiopheneyl, tetrahydrofuranyl, dioxacyclopentyl, benzoxazol-2-yl, tetrahydropyranyl, pyrrolidinyl, imidazolidinyl, pyrazolidinyl, thiazolidinyl, isothiazolidinyl, oxazolidinyl, isoxazolidinyl, piperidinyl, piperazinyl, morpholinyl and other 5 to 7-membered heterocycles.

[0321] There are no particular limitations on the method for manufacturing the oxime-based photopolymerization initiator (D1) represented by general formula (5), and known methods may be used. For example, the method described in International Publication No. 2015 / 152153 may be used.

[0322] The oxime-based photopolymerization initiators (D1-5) represented by general formula (5) can be exemplified by compounds represented by the following chemical formulas (5-1) to (5-3).

[0323] [Chemistry 41]

[0324] (The oxime-based photopolymerization initiator represented by general formula (6) (D1-6))

[0325] [Chemistry 42]

[0326] In general formula (6), R1, R2 and R3 independently represent hydrogen atoms, straight-chain or branched alkyl groups with 3 to 20 carbon atoms, aryl groups with 6 to 20 carbon atoms, alkoxy groups with 1 to 20 carbon atoms, arylalkyl groups with 7 to 30 carbon atoms or heterocyclic groups with 4 to 20 carbon atoms.

[0327] The oxime-based photopolymerization initiators (D1-6) represented by general formula (6) can be listed as compounds represented by the following chemical formulas (6-1) to (6-4).

[0328] [Chemistry 43]

[0329] (The oxime-based photopolymerization initiator represented by general formula (7) (D1-7))

[0330] [Chemistry 44]

[0331] In general formula (7), R1 and R2 are independently hydrogen atoms, a straight-chain or branched alkyl group with 3 to 20 carbon atoms, and an aryl group with 6 to 20 carbon atoms, respectively. R 3 represents a hydrogen atom, a straight-chain or branched alkyl group having 1 to 20 carbon atoms, a cyclic alkyl group having 3 to 20 carbon atoms, an alkyl group, a nitro group, an acetoxy group, or a sulfonyl group. R 4 represents a hydrogen atom, a straight-chain or branched alkyl group with 1 to 20 carbon atoms, or a cyclic alkyl group with 3 to 20 carbon atoms that may have substituents, such as alkyl, phenyl, tolyl, or xylyl. m is 0 or 1.

[0332] The oxime-based photopolymerization initiators (D1-7) represented by general formula (7) can be listed as compounds represented by the following chemical formulas (7-1) to (7-7).

[0333] [Chemistry 45]

[0334] Among these, 1,2-octanedione, 1-[4-(phenylthio)phenyl]-,2-(O-benzoyl oxime), acetone, 1-[9-ethyl-6-(2-methyl-4-tetrahydrofuranylmethoxybenzoyl)-9H-carbazole-3-yl]-,1-(O-acetyl oxime), acetone, 1-[9-ethyl-6-{2-methyl-4-(2,2-dimethyl-1,3-dioxacyclopentyl)methoxybenzoyl}-9H-carbazole-3-yl]-,1-(O-acetyl oxime).

[0335] Commercially available products include: 1,2-octanedione, 1-[4-(phenylthio)phenyl-,2-(O-benzoyloxime)] (IRGACURE OXE-01), IRGACURE OXE-03, IRGACURE OXE-04, and IRGACURE OXE-05 manufactured by BASF Japan Co., Ltd.; and N-1919, NCI-730, NCI-831, and NCI-... manufactured by ADEKA Co., Ltd. 930, including TRONLY TR-PBG-304, TRONLY TR-PBG-305, TRONLY TR-PBG-314, TRONLY TR-PBG-3057, TRONLY TR-PBG-309, TRONLY TR-PBG-345, and TRONLY TR-PBG-3054 manufactured by Changzhou TRONLY Electronic New Materials Co., Ltd.; SPI-02, SPI-02, SPI-03, SPI-05, and SPI-07 manufactured by Samyang Corporation; and DFI-020 manufactured by Daito Chemix Co., Ltd. In addition, examples of oxime compounds can also be cited in Japanese Patent Application Publication No. 2007-210991, Japanese Patent Application Publication No. 2009-179619, Japanese Patent Application Publication No. 2010-037223, Japanese Patent Application Publication No. 2010-215575, Japanese Patent Application Publication No. 2011-020998, and International Publication No. 2015 / 036910.

[0336] Among these, from the viewpoint of pattern formation and substrate adhesion, IRGACURE OXE-05, NCI-730, NCI-930, IRGACURE OXE-04, SPI-05, NCI-831, TRONLY TR-PBG-345, and chemical formula (7-3) are preferred, and SPI-05, NCI-831, and TRONLY TR-PBG-345, and chemical formula (7-3) are even more preferred.

[0337] From the viewpoints of developing spots, chemical resistance, and cone shape, the content of O-acetylgoxime ester photopolymerization initiator (D1) is preferably 0.4 parts to 10 parts by weight, and more preferably 0.5 parts to 5 parts by weight per 100 parts by weight of photopolymerization initiator (D).

[0338] <Other photopolymerization initiators> Other photopolymerization initiators besides those mentioned include, for example: 4-phenoxydichloroacetophenone, 4-tert-butyl-dichloroacetophenone, diethoxyacetophenone, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropane-1-one, 1-hydroxycyclohexylphenyl ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinylpropane-1-one, 2-(dimethylamino)-1-[4-(4-morpholinyl)phenyl]-2-(phenylmethyl)-1-butanone, or 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4- [4-morpholino]phenyl-1-butanone and other acetophenone compounds; benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, or benzyl dimethyl acetal and other benzoin-based compounds; benzophenone, benzoylbenzoic acid, methyl benzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4-benzoyl-4'-methyl diphenyl sulfide, or 3,3',4,4'-tetra(tert-butylperoxycarbonyl)benzophenone and other benzophenone-based compounds; thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropylthioxanthone 2,4-Diisopropylthioxanthione, or 2,4-diethylthioxanthione, and other thioxanthone compounds; 2,4,6-trichloro-triazine, 2-phenyl-4,6-bis(trichloromethyl)-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-triazine, 2-piperyl-4,6-bis(trichloromethyl)-triazine, 2,4-bis(trichloromethyl)-6-styryl-triazine, 2-(naphtho-1-yl)-4,6-bis(trichloromethyl)-triazine, 2 Triazine compounds such as -(4-methoxy-naphtho-1-yl)-4,6-bis(trichloromethyl)-triazine, 2,4-trichloromethyl-(piperyl)-6-triazine, or 2,4-trichloromethyl-(4'-methoxystyryl)-6-triazine; phosphine compounds such as bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide or diphenyl-2,4,6-trimethylbenzoylphosphine oxide; quinone compounds such as 9,10-phenanthroquinone, camphorquinone, and ethylanthraquinone; borate ester compounds; carbazole compounds; imidazole compounds; or titanium ceramsite compounds, etc.

[0339] Photopolymerization initiator (D) can be used alone or in combination with two or more.

[0340] From the viewpoints of development speed, solvent resistance, substrate adhesion, development spots, and cone shape, the content of photopolymerization initiator (D) is preferably 0.02 parts by mass to 200 parts by mass, and more preferably 0.05 parts by mass to 100 parts by mass, relative to 100 parts by mass of pigment (A). If appropriately formulated, solvent resistance, substrate adhesion, and development spots are further improved.

[0341] In another embodiment, the content of photopolymerization initiator (D) is preferably 0.2% to 15% by mass per 100 parts by mass of the non-volatile components of the photosensitive composition.

[0342] [Leveling agent (E)] The photosensitive composition of this embodiment may contain a leveling agent (E). This further improves the wettability and drying properties of the substrate during coating. Examples of leveling agents (E) include silicone-based surfactants, fluorinated surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, and amphoteric surfactants. Furthermore, photosensitive compositions containing alkali-soluble binder resins (Bb) with block isocyanate groups may easily produce spots (development spots) on the surface of the coated film after development, perhaps due to the high affinity of the block isocyanate groups for the developer. However, it has been found that this can be significantly improved by using an O-acryloyl oxime ester-based photopolymerization initiator (D1) in conjunction with the leveling agent.

[0343] (Silicone-based surfactant (E1)) Examples of silicone surfactants include linear polymers containing siloxane bonds and modified siloxane polymers with organic groups introduced into the side chains or ends.

[0344] Commercially available products include: BYK-300, 306, 310, 313, 315N, 320, 322, 323, 330, 331, 333, 342, 345, 346, 347, 348, 349, 370, 377, 378, 3455, UV3510, and 3570 manufactured by BYK-Chemie; and Toray Dow Corning. The following models are manufactured by Corning: FZ-7002, 2110, 2122, 2123, 2191, 5609; and by Shin-Etsu Chemical Industry Co., Ltd.: X-22-4952, X-22-4272, X-22-6266, KF-351A, KF-354L, KF-355A, KF-945, KF-640, KF-642, KF-643, X-22-4515, KF-6004, KP-341, etc.

[0345] (Fluoropolymer surfactants (E2)) Fluorine-based surfactants include, for example, surfactants or leveling agents with fluorocarbon chains.

[0346] Commercially available products include: Surflon S-242, 243, 420, 611, 651, and 386 manufactured by AGC Seimi Chemical Co., Ltd.; Megafac F-253, 477, 551, 552, 554, 555, 558, 560, 570, 575, 576, R-40-LM, R-41, RS-72-K, and DS-21 manufactured by DIC Co., Ltd.; FC-4430 and 4432 manufactured by Sumitomo 3M Co., Ltd.; and EF-PP31N manufactured by Mitsubishi Materials Electronics & Chemical Co., Ltd. 09. EF-PP33G1, EF-PP32C1, Ftergent 601ADH2, 602A manufactured by NEOS Corporation, Fluorotech FS-7024, FS-7025, FS-7026, FS-7027, FS-7031, FS-7032 manufactured by Fluorotech Corporation, and KY-1203, KY-1207, KY-1211, X-71-1203E manufactured by Shin-Etsu Chemical Industry Co., Ltd., etc.

[0347] Examples of nonionic surfactants include: polyoxyethylene lauryl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene alkyl ether, polyoxyethylene myristyl ether, polyoxyethylene octyl dodecyl ether, polyoxyethylene alkyl alkyl ether, polyoxyethylene phenyl styrene phenyl ether, polyoxyethylene tribenzyl phenyl ether, polyoxyethylene polyoxypropylene glycol, polyoxyethylene alkyl alkenyl ether, polyoxyethylene nonyl phenyl ether, polyoxyethylene alkyl ether phosphate, sorbitol monolaurate, sorbitol monopalmitate, sorbitol monostearate, sorbitol distearate, sorbitol tristearate, and sorbitol monostearate. Oleate, sorbitol trioleate, sorbitol sesquioleate, polyoxyethylene sorbitol monolaurate, polyoxyethylene sorbitol monopalmitate, polyoxyethylene sorbitol monostearate, polyoxyethylene sorbitol tristearate, polyoxyethylene sorbitol monooleate, polyoxyethylene sorbitol triisostearate, tetraoleic polyoxyethylene sorbitol, glycerol monostearate, glycerol monooleate, polyethylene glycol monolaurate, polyethylene glycol monostearate, polyethylene glycol distearate, polyethylene glycol monooleate, polyoxyethylene cured castor oil, polyoxyethylene alkylamine, alkylalkanolamide, alkylimidazoline, etc.

[0348] Commercially available products include, for example, Emulgen manufactured by Kao Corporation: 103, 104P, 106, 108, 109P, 120, 123P, 130K, 147, 150, 210P, 220, 306P, 320P, 350, 404, 408, 409PV, 420, 430, 705, 707, 709, 1108, 1118S-70, 1135S-70, 1150S-60, 2020G- HA, 2025G, LS-106, LS-110, LS-114, MS-110, A-60, A-90, B-66, PP-290, Latemul PD-420, PD-430, PD-430S, PD-450, Rheodol SP-L10, SP-P10, SP-S10V, SP-S20, SP-S30V, SP-O10V, SP-O30V, Super SP-L10, AS-10V, AO-10V, AO-15V, TW-L120, TW-L106, TW-P120, TW-S120V, TW-S320V, TW-O120V, TW-O106V, TW-IS399C, Super TW-L120, 430V, 440V, 460V, MS-50, MS-60, MO-60, MS-165V, Emano 1112, 3199V, 3299V, 3299RV, 4110, CH-25, CH-40, CH-60(K), Amiet 102, 105, 105A, 302, 320, Aminon PK-02S, L-02, Homogenol L-95, and Adeka Pronik manufactured by ADEKA Corporation. Pluronic L-23, 31, 44, 61, 62, 64, 71, 72, 101, 121, TR-701, 702, 704, 913R, and Polyflow No. 75, No. 90, No. 95, etc., manufactured by Kyoei Chemical Co., Ltd.

[0349] Examples of cationic surfactants include: alkylamine salts, lauryltrimethylammonium chloride, stearyltrimethylammonium chloride, cetyltrimethylammonium chloride, and other alkyl quaternary ammonium salts or their ethylene oxide adducts.

[0350] Commercially available products include, for example, Acetamin 24, Quartamin 24P, 60W, and 86P CONC manufactured by Kao Corporation.

[0351] Examples of anionic surfactants include: polyoxyethylene alkyl ether sulfates, sodium dodecylbenzene sulfonate, alkali salts of styrene-acrylic acid copolymers, sodium alkylnaphthalene sulfonate, sodium alkyl diphenyl ether disulfonate, monoethanolamine lauryl sulfate, triethanolamine lauryl sulfate, ammonium lauryl sulfate, monoethanolamine stearate, sodium stearate, sodium lauryl sulfate, monoethanolamine of styrene-acrylic acid copolymers, polyoxyethylene alkyl ether phosphates, etc.

[0352] Commercially available products include: Ftergent 100 and 150 manufactured by NEOS Corporation, and ADEKA HOPE YES-25, ADEKA COL TS-230E, PS-440E, EC-8600, etc. manufactured by ADEKA Corporation.

[0353] Examples of amphoteric surfactants include: lauric aminopropyl betaine, lauryl betaine, cocamidopropyl betaine, stearyl betaine, alkyl dimethylaminoacetic acid betaine and other alkyl betaines, lauryl dimethylamine oxide and other alkyl amine oxides, etc.

[0354] Commercially available products include: Amphitol 20AB, 20BS, 24B, 55AB, 86B, 20Y-B, ​​20N, etc., manufactured by Kao Corporation.

[0355] Leveling agent (E) can be used alone or in combination with two or more.

[0356] The leveling agent (E) content is preferably 0.001 to 3.0 parts by weight, and more preferably 0.005 to 1.2 parts by weight, per 100 parts by weight of the non-volatile components of the photosensitive composition. If present in appropriate amounts, the balance between the coatability and adhesion, the resistance to developing spots, and the solvent resistance of the photosensitive composition is further improved. From the viewpoint of developing spots, silicone-based surfactants (E1) and fluorinated surfactants (E2) are particularly preferred.

[0357] Among these, from the viewpoint of developing spots and cone shape, BYK-330, BYK-323, and 348 manufactured by BYK-Chemie; FZ-2122 and SH-8400 manufactured by Toray Dow Corning; Ftergent 601ADH2 and 602A manufactured by NEOS Corporation; FluoroSurf FS-7024, FS-7025, FS-7026, FS-7027, FS-7031, and FS-7032 manufactured by Fluorotech Corporation; KY-1203 and KY-1211 manufactured by Shin-Etsu Chemical Co., Ltd.; and Megafac F-554 manufactured by DIC Corporation are preferred.

[0358] [Hot alkali generating agent (F)] The photosensitive composition of this embodiment may also include an alkali-soluble adhesive resin (Bb) containing building blocks with block isocyanate groups and a thermal alkali generating agent. By including both the alkali-soluble adhesive resin (Bb) containing building blocks with block isocyanate groups and the thermal alkali generating agent (F), the effect of promoting the release of the block isocyanate groups from the block agent and thus accelerating the curing speed can be achieved. As a heat-alkali generating agent (F), known and conventional hardening accelerators can be used without particular limitation, such as: 1,8-diazabicyclo[5.4.0]undecene-7 (DBU) and its salts (e.g., phenolates, octanoates, p-toluenesulfonates, formates, tetraphenylborates); 1,5-diazabicyclo[4.3.0]nonene-5 (DBN) and its salts (e.g., phenolates, octanoates, p-toluenesulfonates, formates, tetraphenylborates); tertiary amines such as benzyl dimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, and N,N-dimethylcyclohexylamine; imidazoles such as 2-ethyl-4-methylimidazole and 1-cyanoethyl-2-ethyl-4-methylimidazole; phosphate esters, triphenylphosphine (triphenyl) Phosphine (TPP) and its salts (e.g., tetrafluoroborate, triphenylborane salts) and other phosphine derivatives; tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium tetra(p-tolyl)borate and other phosphonium compounds; organometallic salts such as tin octoate, zinc octoate and other organometallic salts; metal chelates, etc. These can be used alone or in combination of two or more.

[0359] Commercially available products include: U-CAT SA 1, U-CAT SA 506, U-CAT SA 102, U-CAT 5003, U-CAT 1102, U-CAT 18X, U-CAT 12XD, and U-CAT 3512T manufactured by San-Apro Co., Ltd.; TPP-K and TPP-MK manufactured by Hokuko Chemical Industry Co., Ltd.; and PX-4ET manufactured by Nippon Chemical Industry Co., Ltd.

[0360] [Sensenizer (G)] From the viewpoint of pattern formation, the photosensitive component of this embodiment preferably contains a sensitizer (G).

[0361] Sensitive agents (G) can be exemplified by: unsaturated ketones represented by chalcone compounds and dibenzylacetone; 1,2-diketone compounds represented by azobenzene and camphorquinone; benzoin compounds; fluorene compounds; naphthoquinone compounds; anthraquinone compounds; xanthones compounds; thioxanthones compounds; xanthonesone compounds; thioxanthonesone compounds; coumarin compounds; coumarin ketone compounds; anthocyanin compounds; oxacyanin compounds; polymethyl pigments such as oxazine compounds; acridine compounds; azazine compounds; thiazine compounds; oxazine compounds; indoline compounds; azulene compounds; azulenium compounds; and squaric acid lacton compounds. Compounds, including porphyrin compounds, tetraphenylporphyrin compounds, triarylmethane compounds, tetrabenzoporphyrin compounds, tetrapyrazinoporphyrazine compounds, phthalocyanine compounds, tetraazaporphyrazine compounds, tetraquinoxolinoporphyrazine compounds, naphthylphthalocyanine compounds, phthalocyanine compounds, pyranonium compounds, thiopyrylium compounds, tetraphyrin compounds, annulene compounds, spiropyranium compounds, spiroxazine compounds, thiospiropyranium compounds, metal aromatic hydrocarbon complexes, organorruthenium complexes, or benzophenone compounds, etc. Among these, from the viewpoint of pattern formation, thioxanthone compounds or benzophenone compounds are preferred, and thioxanthone compounds are even more preferred.

[0362] (Thioxanthone compounds (G1)) Examples of thioxanthone compounds (G1) include: 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-dichlorothioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone, 1-chloro-4-propoxythioxanthone, etc. Among these, 2,4-diethylthioxanthone is preferred.

[0363] Commercially available products include: Omnirad DETX manufactured by IGM RESINS, and KAYACURE DETX-S manufactured by Nippon Kayaku Co., Ltd.

[0364] (Benzophenone compounds (G2)) Examples of benzophenone compounds (G2) include 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, and 2-aminobenzophenone. Among these, 4,4'-bis(diethylamino)benzophenone is preferred.

[0365] Commercially available products include CHEMARK DEABP manufactured by CHEMARK CHEMICAL.

[0366] Sensitizers (G) can be used alone or in combination with two or more.

[0367] From the viewpoint of pattern formation, the content of sensitizer (G) is preferably 10 to 1000 parts by mass, and more preferably 20 to 800 parts by mass, relative to 100 parts by mass of photopolymerization initiator (D).

[0368] [Thermosetting compound (H)] The photosensitive component of this embodiment may contain a thermosetting compound (H). In this way, the thermosetting compound (H) reacts during the heating step, increasing the crosslinking density and thus improving heat resistance.

[0369] The thermosetting compound (H) can be a low-molecular-weight compound or a high-molecular-weight compound like a resin. Examples of thermosetting compounds (H) include: epoxy compounds, oxetane compounds, benzoguanidine compounds, rosin-modified maleic acid compounds, rosin-modified fumaric acid compounds, melamine compounds, urea compounds, and phenolic compounds. Among these, epoxy compounds and oxetane compounds are preferred.

[0370] (Epoxy compound (H1)) Examples of epoxy compounds (H1) include: bisphenols (bisphenol A, bisphenol F, bisphenol S, bisphenol, bisphenol AD, etc.), phenols (phenol, alkyl-substituted phenols, aromatic-substituted phenols, naphthol, alkyl-substituted naphthols, dihydroxybenzene, alkyl-substituted dihydroxybenzene, dihydroxynaphthalene, etc.) and condensations of various aldehydes (formaldehyde, acetaldehyde, alkyl aldehydes, benzaldehyde, alkyl-substituted benzaldehyde, hydroxybenzene, naphthal, glutaraldehyde, o-phthalaldehyde, crotonaldehyde, cinnamaldehyde, etc.); phenols and various diene compounds (dicyclopentadiene, terpenes, vinylcyclohexene, norbornene, vinylnorbornene, tetrahydroindene, divinylbenzene, divinylbiphenyl, diisopropenylbiphenyl, butadiene, isoprene, etc.). Polymers of phenols (such as alkenes); condensation polymers of phenols and ketones (acetone, methyl ethyl ketone, methyl isobutyl ketone, acetophenone, benzophenone, etc.); condensation polymers of phenols and aromatic dimethyl alcohols (benzyl dimethyl alcohol, α,α,α',α'-benzyl dimethyl alcohol, biphenyl dimethyl alcohol, α,α,α',α'-biphenyl dimethyl alcohol, etc.); condensation polymers of phenols and aromatic dichloromethyl alcohols (α,α'-dichloroxylene, dichloromethyl biphenyl, etc.); condensation polymers of bisphenols and various aldehydes; glycidyl ether epoxy resins, alicyclic epoxy resins, heterocyclic epoxy resins, aliphatic epoxy resins, glycidyl amine epoxy resins, glycidyl ester epoxy resins, etc., prepared by glycidylating alcohols, etc.

[0371] Commercially available products include: Epicoat 807, 815, 825, 827, 828, 190P, and 191P manufactured by Mitsubishi Chemical Corporation; TECHMORE VG3101L manufactured by Mitsui Chemicals Co., Ltd.; EPPN-201, 501H, 502H, EOCN-102S, 103S, 104S, and 1020 manufactured by Nippon Kayaku Co., Ltd.; Epicoat 1004, 1256, JER1032H60, 157S65, 157S70, 152, and 154 manufactured by Mitsubishi Chemical Corporation; Celloxide 2021 and EHPE-3150 manufactured by Daicel Chemical Industries Co., Ltd.; TTA3150 manufactured by Tetrachem Co., Ltd.; and Nagase Chemical Co., Ltd. The following are DENACOL products manufactured by ChemteX Co., Ltd.: EX-211, 212, 252, 313, 314, 321, 321L, 411, 421, 512, 521, 611, 612, 614, 614B, 622, 711, and 721; and TEPIC-L, H, and S products manufactured by Nissan Chemical Industries, Ltd.

[0372] From the viewpoint of the heat resistance of the hardened film, the content of epoxy compound (H1) is preferably 0.5 parts by mass to 30 parts by mass, and more preferably 1.0 parts by mass to 20 parts by mass, relative to 100 parts by mass of the non-volatile components of the photosensitive component.

[0373] (Oxycyclic butane compounds (H2)) Oxycyclic butane compounds (H2) are known compounds containing an oxycyclic butane group. Examples of oxycyclic butane compounds include: monofunctional oxycyclic butane compounds, difunctional oxycyclic butane compounds, and trifunctional or higher oxycyclic butane compounds.

[0374] Examples of functional oxetane compounds include: (3-ethyloxetane-3-yl) methyl acrylate, (3-ethyloxetane-3-yl) methyl methacrylate, 3-ethyl-3-hydroxymethyloxetane, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(phenoxymethyl)oxetane, 3-ethyl-3-(2-methacryloxymethyl)oxetane, 3-ethyl-3-{[3-(triethoxysilyl)propoxy]methyl}oxetane, etc.

[0375] Commercially available products include, for example, OXE-10 and 30 manufactured by Osaka Organic Chemical Industry Co., Ltd., and OXT-101 and 212 manufactured by Toa Synthetic Co., Ltd.

[0376] Examples of difunctional oxetane compounds include: 4,4'-bis[(3-ethyl-3-oxetane)methoxymethyl]biphenyl, 1,4-bis[(3-ethyl-3-oxetane)methoxymethyl]benzene, 1,4-bis{[(3-ethyl-3-oxetane)methoxymethyl]benzene, di[1-ethyl(3-oxetane)]methyl ether, di[1-ethyl(3-oxetane)]methyl ether, 3-ethyl 3-Hydroxymethyloxetane, 3-Ethyl-3-(2-Ethylhexyloxymethyl)oxetane, 3-Ethyl-3-(2-phenoxymethyl)oxetane, 3,7-bis(3-oxetane-butyl)-5-oxa-nonane, 1,2-bis[(3-ethyl-3-oxetane-butylmethoxy)methyl]ethane, 1,3-bis[(3-ethyl-3-oxetane-butylmethoxy)methyl]propane, ethylene glycol bis(3-ethyl- 3-Oxetrazolyl butyl methyl ether, dicyclopentenyl bis(3-ethyl-3-oxetrazolyl methyl) ether, triethylene glycol bis(3-ethyl-3-oxetrazolyl methyl) ether, tetraethylene glycol bis(3-ethyl-3-oxetrazolyl methyl) ether, 1,4-bis(3-ethyl-3-oxetrazolyl methoxy)butane, 1,6-bis(3-ethyl-3-oxetrazolyl methoxy)hexane, polyethylene glycol bis(3-ethyl-3-oxetrazolyl) methyl ethers, ethylene oxide (EO) modified bisphenol A bis(3-ethyl-3-oxetanebutylmethyl) ethers, propylene oxide (PO) modified bisphenol A bis(3-ethyl-3-oxetanebutylmethyl) ethers, EO modified hydrogenated bisphenol A bis(3-ethyl-3-oxetanebutylmethyl) ethers, PO modified hydrogenated bisphenol A bis(3-ethyl-3-oxetanebutylmethyl) ethers, EO modified bisphenol F (3-ethyl-3-oxetanebutylmethyl) ethers, etc.

[0377] Commercially available products include, for example, OXBP and OXTP manufactured by UBE Corporation, and OXT-121 and 221 manufactured by Dong-A Synthetic Co., Ltd.

[0378] Examples of trifunctional or higher-functional oxetane compounds include: pentaerythritol tris(3-ethyl-3-oxetane butylmethyl) ether, pentaerythritol tetra(3-ethyl-3-oxetane butylmethyl) ether, dipentaerythritol hexa(3-ethyl-3-oxetane butylmethyl) ether, dipentaerythritol penta(3-ethyl-3-oxetane butylmethyl) ether, dipentaerythritol tetra(3-ethyl-3-oxetane butylmethyl) ether, and caprolactone-modified dipentaerythritol hexa(3-ethyl-3-oxetane butylmethyl) ether. Polymers obtained by free radical polymerization of 3-oxetane tetra(3-ethyl-3-oxetane butyl methyl) ether, caprolactone-modified dipentaerythritol penta(3-ethyl-3-oxetane butyl methyl) ether, di-trimethylolpropane tetra(3-ethyl-3-oxetane butyl methyl) ether, resins containing oxetane (e.g., oxetane-modified phenolic varnish resin as disclosed in Japanese Patent No. 3783462) and (meth)acrylic acid monomers such as OXE-30.

[0379] The content of oxobutane compound (H2) in 100 parts by weight of the non-volatile components of the photosensitive component is preferably 0.5 parts by weight to 50 parts by weight, more preferably 1 part by weight to 40 parts by weight.

[0380] Melamine compounds are compounds having a melamine ring structure. Preferably, the melamine compound is a hydroxymethyl or ether type compound, and more preferably, a melamine compound in which the average number of hydroxymethyl and / or ether groups in each melamine ring is 5.0 or more. A suitable number of hydroxymethyl or ether groups readily yields appropriate heat resistance.

[0381] Commercially available products include: Nikarac MW-30HM, MW-390, MW-100LM, MX-750LM, MW-30M, MW-30, MW-22, MS-21, MS-11, MW-24X, MS-001, MX-002, MX-730, MX-750, MX-708, MX-706, MX-042, MX-45, MX-500, MX-520, MX-43, MX-417, and MX-410 manufactured by Sanwa Chemical Co., Ltd.; and Cymel 232, 235, 236, 238, 285, 300, 301, 303, 350, and 370 manufactured by Japan Cytec Industries Co., Ltd.

[0382] Among these, Nicalac MW-30HM, MW-390, MW-100LM, MX-750LM, MW-30M, MW-30, MW-22, MS-21, MS-11, MW-24X, and MW-45 manufactured by Sanwa Chemical Co., Ltd., with an average of 5.0 or more hydroxymethyl and / or ether groups per melamine ring, and Cymel 232, 235, 236, 238, 300, 301, 303, and 350 manufactured by Japan Cytec Industries Co., Ltd., are better in terms of increasing crosslinking density.

[0383] Thermosetting compounds (H) can be used alone or in combination with two or more.

[0384] [Curing agent (curing accelerator)] To facilitate the curing of the thermosetting compound (H), the photosensitive component of this embodiment may be used in conjunction with a curing agent (curing accelerator). Examples of curing agents include: amine compounds, acid anhydrides, active esters, carboxylic acid compounds, sulfonic acid compounds, etc. Examples of curing agents include: amine compounds (e.g., dicyandiamide, benzyldimethylamine, 4-(dimethylamino)-N,N-dimethylbenzylamine, 4-methoxy-N,N-dimethylbenzylamine, 4-methyl-N,N-dimethylbenzylamine, etc.), quaternary ammonium salt compounds (e.g., triethylbenzylammonium chloride, etc.), block isocyanate compounds (e.g., dimethylamine, etc.), imidazole derivative bicyclic amidine compounds and their salts (e.g., imidazole, 2-methylimidazolium, 2-ethylimidazolium, 2-ethyl-4-methylimidazolium, etc.). Examples of such compounds include imidazolium, 2-phenylimidazolium, 4-phenylimidazolium, 1-cyanoethyl-2-phenylimidazolium, 1-(2-cyanoethyl)-2-ethyl-4-methylimidazolium, phosphorus compounds (e.g., triphenylphosphine), and S-triazine derivatives (e.g., 2,4-diamino-6-methacryloxyethyl-S-triazine, 2-vinyl-2,4-diamino-S-triazine, 2-vinyl-4,6-diamino-S-triazine-isocyanuric acid adduct, 2,4-diamino-6-methacryloxyethyl-S-triazine-isocyanuric acid adduct, etc.).

[0385] Hardeners can be used alone or in combination with two or more.

[0386] The content of the curing agent is preferably 0.01 to 15 parts by weight relative to 100 parts by weight of the thermosetting compound (H).

[0387] [Thiol chain transfer agent (I)] The photosensitive composition of this embodiment may contain a thiol-based chain transfer agent (I). If the thiol-based chain transfer agent (I) is used in conjunction with a photopolymerization initiator (D), sulfur free radicals that are not easily hindered by oxygen-induced polymerization are generated during free radical polymerization after light irradiation, thereby increasing the photosensitivity of the photosensitive composition.

[0388] The thiol-based chain transfer agent (I) is preferably a polyfunctional thiol having two or more thiol groups (SH groups), and more preferably a polyfunctional thiol having four or more thiol groups (SH groups). Increasing the number of functional groups facilitates photocuring from the surface to the deepest part of the film.

[0389] Examples of polyfunctional thiols include: hexanedithiol, decanedithiol, 1,4-butanediol dithiopropionate, 1,4-butanediol dithioglycolate, ethylene glycol dithioglycolate, ethylene glycol dithiopropionate, trimethylolpropane trithioglycolate, trimethylolpropane trithiopropionate, trimethylolpropane tri(3-mercaptobutyrate), pentaerythritol tetrathioglycolate, pentaerythritol tetrathiopropionate, tri(2-hydroxyethyl) isocyanurate trimercaptopropionate, 1,4-dimethylmercaptobenzene, 2,4,6-trimercapto-triazine, 2-(N,N-dibutylamino)-4,6-dimercapto-triazine, etc., preferably including: ethylene glycol dithiopropionate, trimethylolpropane trithiopropionate, pentaerythritol tetrathiopropionate, etc.

[0390] Thiol chain transfer agents (I) can be used alone or in combination with two or more.

[0391] The content of thiol chain transfer agent (I) in 100 parts by weight of the non-volatile components of the photosensitive composition is preferably 0.1 parts by weight to 10 parts by weight, more preferably 1 part by weight to 10 parts by weight, and even more preferably 2 parts by weight to 8 parts by weight. If it is present in an appropriate amount, the photosensitivity is improved, and wrinkles are less likely to form on the surface of the hardened film.

[0392] [Seam-bonding enhancer (J)] The photosensitive composition of this embodiment may contain an adhesion enhancer (J). This improves the adhesion between the hardened film and the substrate. Furthermore, narrow patterns can be easily formed using photolithography.

[0393] Adhesion enhancers (J) include, for example, silane coupling agents. Examples of silane coupling agents include: vinyltrimethoxysilane, vinyltriethoxysilane, and other vinyl silanes; 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane. (Meth)acrylate silanes; 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, etc., epoxy silanes; N-2-(aminoethyl)-3-aminopropyl Methyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethyl-butylene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, N-(vinylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane The silane coupling agents include amino silanes such as methoxysilane hydrochloride; mercapto derivatives such as 3-mercaptopropylmethyldimethoxysilane and 3-mercaptopropyltrimethoxysilane; styryl derivatives such as p-styryltrimethoxysilane; urea derivatives such as 3-ureopropyltriethoxysilane; thioether derivatives such as bis(triethoxysilylpropyl)tetrasulfide; and isocyanate derivatives such as 3-isocyanatepropyltriethoxysilane. Among these, epoxy silanes such as 3-glycidoxypropyltrimethoxysilane and mercapto derivatives such as 3-mercaptopropyltrimethoxysilane are preferred.

[0394] Commercially available products include, for example, KBM-1003, KBE-1003, KBM-403, KBE-403, KBM-503, KBM-5103, KBM-603, KBM-573, KBM-903, KBM-803, KBM-9659, X-12-1048, X-12-1150, X-12-1154, X-12-1156, X-12-981S, and X-12-984S manufactured by Shin-Etsu Chemical Industry Co., Ltd.

[0395] Of these, KBM-403, KBM-803, X-12-1154, X-12-1156, X-12-1048, and X-12-1150 are preferred from the viewpoints of pattern formation, substrate adhesion, and chemical resistance.

[0396] The adhesion enhancer (J) can be used alone or in combination with two or more.

[0397] The content of the adhesion enhancer (J) is preferably 0.01 to 30 parts by mass, and more preferably 0.1 to 20 parts by mass, in 100 parts by mass of the non-volatile components of the photosensitive composition.

[0398] [Polymerization Inhibitor (K)] The photosensitive composition of this embodiment may contain a polymerization inhibitor (K). Polymerization inhibitors (K) include, for example, alkyl catechol compounds such as catechol, resorcinol, 1,4-hydroquinone, 2-methylcatechol, 3-methylcatechol, 4-methylcatechol, 2-ethylcatechol, 3-ethylcatechol, 4-ethylcatechol, 2-propylcatechol, 3-propylcatechol, 4-propylcatechol, 2-n-butylcatechol, 3-n-butylcatechol, 4-n-butylcatechol, 2-tert-butylcatechol, 3-tert-butylcatechol, 4-tert-butylcatechol, 3,5-di-tert-butylcatechol; 2-methylresorcinol, 4-methylresorcinol, 2-ethylresorcinol, 4-ethylresorcinol, 2-propylcatechol, etc. Alkylresorcinol compounds such as resorcinol, 4-propylresorcinol, 2-n-butylresorcinol, 4-n-butylresorcinol, 2-tert-butylresorcinol, and 4-tert-butylresorcinol; alkylhydroquinone compounds such as methylhydroquinone, ethylhydroquinone, propylhydroquinone, tert-butylhydroquinone, and 2,5-di-tert-butylhydroquinone; phosphine compounds such as tributylphosphine, trioctylphosphine, tricyclohexylphosphine, triphenylphosphine, and tribenzylphosphine; phosphine oxide compounds such as trioctylphosphine oxide and triphenylphosphine oxide; phosphite compounds such as triphenylphosphite and trinonylphenylphosphite; pyroglucinol, etc.

[0399] The content of polymerization inhibitor (K) is preferably 0.01 to 0.4 parts by weight of 100 parts by weight of the non-volatile components of the photosensitive component.

[0400] [UV absorber (L)] The photosensitive composition of this embodiment may contain an ultraviolet absorber (L). Ultraviolet absorbers (L) are organic compounds with ultraviolet absorption functions, including: benzotriazole organic compounds, triazine organic compounds, benzophenone organic compounds, salicylic acid ester organic compounds, cyanoacrylate organic compounds, and salicylate organic compounds, etc.

[0401] Examples of benzotriazole compounds include: 2-(5-methyl-2-hydroxyphenyl)benzotriazole, 2-(2-hydroxy-5-tert-butylphenyl)-2H-benzotriazole, 2-[2-hydroxy-3,5-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole, 2-(3-tert-butyl-5-methyl-2-hydroxyphenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-5'-tert-octylphenyl)benzotriazole, and 5% 2-methoxy-1-methylethyl... A mixture of alkyl acetate with 95% phenylpropionic acid and 3-(2H-benzotriazol-2-yl)-(1,1-dimethylethyl)-4-hydroxy and C7-9 side chain and straight chain alkyl esters, 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol, 2-(2H-benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol, methyl 3-(3-(2H-benzotriazol) The reaction products of (2H-benzotriazol-2-yl)-5-tert-butyl-4-hydroxyphenyl)propionate / polyethylene glycol 300, 2-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol, 2,2'-methylenebis[6-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol], 2-(2H-benzotriazol-2-yl)-p-cresol, 2-(5-chloro-2H-benzotriazol-2-yl)-6-tert-butylpropionate Butyl-4-methylphenol, 2-(3,5-di-terpentyl-2-hydroxyphenyl)benzotriazole, 2-[2-hydroxy-5-[2-(methacryloxy)ethyl]phenyl]-2H-benzotriazole, octyl-3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazole-2-yl)phenyl]propionate, 2-ethylhexyl-3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazole-2-yl)phenyl]propionate.

[0402] Commercially available products include: TINUVIN P, PS, 234, 326, 329, 384-2, 900, 928, 99-2, and 1130 manufactured by BASF Japan Co., Ltd.; Adekastab LA-29, LA-31RG, LA-32, and LA-36 manufactured by ADEKA Co., Ltd.; KEMISORB 71, 73, 74, 79, and 279 manufactured by Chemipro Kasei Co., Ltd.; and RUVA-93 manufactured by Otsuka Chemical Co., Ltd.

[0403] Examples of triazine compounds include: 2,4-bis(2,4-dimethylphenyl)-6-(2-hydroxy-4-n-octyloxyphenyl)-1,3,5-triazine, 2-[4,6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl]-5-[3-(dodecyloxy)-2-hydroxypropoxy]phenol, and 2-(2,4-dihydroxyphenyl)-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine with (2-ethylhexyl)-glycidyl ester. The reaction products include 2,4-bis[2-hydroxy-4-butoxyphenyl]-6-(2,4-dibutoxyphenyl)-1,3,5-triazine, 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-(hexyloxy)phenol, 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-[2-(2-ethylhexyloxy)ethoxy]phenol, and 2,4,6-tris(2-hydroxy-4-hexyloxy-3-methylphenyl)-1,3,5-triazine, etc.

[0404] Commercially available products include: KEMISORB 102 manufactured by Chemipro Kasei Co., Ltd.; TINUVIN 400, 405, 460, 477, 479, and 1577ED manufactured by BASF Japan Co., Ltd.; Adekastab LA-46 and LA-F70 manufactured by ADEKA Co., Ltd.; and CYASORB UV-1164 manufactured by Sun Chemical Co., Ltd.

[0405] Examples of benzophenone compounds include: 2,4-di-hydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-methoxybenzophenone-5-sulfonic acid-3-water, 2-hydroxy-4-n-octyloxybenzophenone, 2,2'-di-hydroxy-4-methoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 4-dodecyloxy-2-hydroxybenzophenone, 2-hydroxy-4-octadecyloxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 2,2',4,4'-tetrahydroxybenzophenone, 2-hydroxy-4-methoxy-2'-carboxybenzophenone, etc.

[0406] Commercially available products include: KEMISORB 10, 11, 11S, 12, and 111 manufactured by Chemipro Kasei Co., Ltd.; SEESORB 101 and 107 manufactured by Shipro Kasei Co., Ltd.; Adekastab 1413 manufactured by ADEKA Co., Ltd.; and UV-12 manufactured by Sun Chemical Co., Ltd., etc.

[0407] Examples of salicylic acid ester compounds include: phenyl salicylate, p-octylphenyl salicylate, and p-tert-butylphenyl salicylate.

[0408] The content of ultraviolet absorber (L) is preferably 5 to 90 parts by mass of the total 100 parts by mass of photopolymerization initiator (D) and ultraviolet absorber (L).

[0409] [Antioxidant (M)] The photosensitive composition of this embodiment may contain an antioxidant (M). The antioxidant (M) prevents yellowing caused by oxidation of the photopolymerization initiator (D) or thermosetting compound (I) during thermosetting or indium tin oxide (ITO) annealing. Especially when the concentration of the photosensitive pigment (A) is high, the content of the polymerizable compound (C) is relatively reduced. Therefore, if this is addressed by increasing the amount of photopolymerization initiator (D) or adjusting the thermosetting compound, the cured film is prone to yellowing. Therefore, by including an antioxidant, yellowing of the cured film caused by oxidation during the heating process is prevented. The antioxidant (M) is preferably a compound that does not contain halogen atoms.

[0410] Antioxidants (M) can be exemplified by hindered phenolic, hindered amine, phosphorus, sulfur, and hydroxyamine compounds. Among these, hindered phenolic antioxidants, hindered amine antioxidants, phosphorus antioxidants, and sulfur antioxidants are preferred.

[0411] Hindered phenolic antioxidants include, for example, 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 1,1,3-tris-(2'-methyl-4'-hydroxy-5'-tert-butylphenyl)-butane, 4,4'-butylene-bis-(2-tert-butyl-5-methylphenol), stearyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, pentaerythritol tetra[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, 3,9-bis[2-[3- [(3-tert-butyl-4-hydroxy-5-methylphenyl)propionic]-1,1-dimethylethyl]-2,4,8,10-tetraoxaspiro[5.5]undecane, 1,3,5-tris(3,5-di-tert-butyl-4-hydroxyphenylmethyl)-2,4,6-trimethylbenzene, 1,3,5-tris(3-hydroxy-4-tert-butyl-2,6-dimethylbenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,2'-methylenebis(6-tert-butyl-4-ethylphenol), 2,2'-thiodiethylbis-(3,5-di- -3-butyl-4-hydroxyphenyl)-propionate, N,N-hexamethylenebis(3,5-di-tert-butyl-4-hydroxy-hydroxycinnamate), isooctyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, 4,6-bis(dodecylthiomethyl)-o-cresol, calcium salt of monoethyl 3,5-di-tert-butyl-4-hydroxybenzylphosphonate, 4,6-bis(octylthiomethyl)-o-cresol, bis[3-(3-(methyl-4-hydroxy-5-tert-butylphenyl)propionate] ethyldioxybisethyl ester, 1,6-hexanediol bis[3-(3,5-di-3-butyl-4-hydroxyphenyl)propionate] ethyldioxybisethyl ester 2,4-Bis-(n-octylthio)-6-(4-hydroxy-3,5-di-tert-butylaniline)-1,3,5-triazine, 2,2'-thio-bis-(6-tert-butyl-4-methylphenol), 2,5-di-tert-pentyl-hydroquinone, 2,6-di-tert-butyl-4-nonylphenol, 2,2'-isobutylene-bis-(4,6-dimethylphenol), 2,2'-methylene-bis-(6-(1-methyl-cyclohexyl)-p-cresol), 2,4-dimethyl-6-(1-methyl-cyclohexyl)-phenol, etc.

[0412] Commercially available products include: Adekastab AO-20, AO-30, AO-40, AO-50, AO-60, AO-80, and AO-330 manufactured by ADEKA Corporation; KEMINOX 101, 179, 76, and 9425 manufactured by Chemipro Kasei Corporation; IRGANOX 1010, 1035, 1076, 1098, 1135, 1330, 1726, 1425WL, 1520L, 245, 259, 3114, 5057, and 565 manufactured by BASF Japan Corporation; and CYANOX CY-1790 and CY-2777 manufactured by Sun Chemical Corporation.

[0413] Hindered amine antioxidants include, for example, tetrakis(1,2,2,6,6-pentamethyl-4-piperidinyl)-1,2,3,4-butanetetracarboxylate, tetrakis(2,2,6,6-tetramethyl-4-piperidinyl)1,2,3,4-butanetetracarboxylate, bis(1,2,2,6,6-pentamethyl-4-piperidinyl) sebacate, bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate, bis(1-undecyloxy-2,2,6,6-tetramethylpiperidin-4-yl) carbonate, 1,2,2,6,6-pentamethyl-4-piperidinyl methacrylate, 2,2,6,6- Tetramethyl-4-piperidinyl methacrylate, dimethyl succinate and 1-(2-hydroxyethyl)-4-hydroxy-2,2,6,6-tetramethylpiperidine condensate, poly[[6-[(1,1,3,3-tetramethylbutyl)amino]-triazine-2,4-diyl]-[(2,2,6,6-tetramethyl-4-piperidinyl)imino]-hexamethylene-[(2,2,6,6-tetramethyl-4-piperidinyl)imino]], ester of 4-hydroxy-2,2,6,6-tetramethyl-1-piperidinol and 3,5,5-trimethylhexanoic acid, N,N'-4,7-tetra[4,6-bis[]] N-Butyl-N-(1,2,2,6,6-pentamethyl-4-piperidinyl)amino}-1,3,5-triazin-2-yl]-4,7-diazadecane-1,10-diamine, bis(2,2,6,6-tetramethyl-1-(octyloxy)-4-piperidinyl) sebacate and the reaction product of 1,1-dimethylethyl hydroperoxide with octane, bis(1,2,2,6,6-pentamethyl-4-piperidinyl)[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]butylmalonate, methyl 1,2,2,6,6-pentamethyl-4-piperidinyl sebacate Poly[[6-morpholino-triazine-2,4-diyl]-[(2,2,6,6-tetramethyl-4-piperidinyl)imino]-hexamethylene-[(2,2,6,6-tetramethyl-4-piperidinyl)imino]], 2,2,6,6-tetramethyl-4-piperidinyl-C12-21 and C18 unsaturated fatty acid esters, N,N'-bis(2,2,6,6-tetramethyl-4-piperidinyl)-1,6-hexamethylenediamine, 2-methyl-2-(2,2,6,6-tetramethyl-4-piperidinyl)amino-N-(2,2,6,6-tetramethyl-4-piperidinyl)propionylamine, etc.

[0414] Commercially available products include: Adekastab LA-52, LA-57, LA-63P, LA-68, LA-72, LA-77Y, LA-77G, LA-81, LA-82, LA-87, LA-402F, and LA-502XP manufactured by ADEKA Corporation; KAMISTAB 29, 62, 77, and 94 manufactured by Chemipro Kasei Corporation; Tinuvin 111FDL, 123, 144, 249, 292, and 5100 manufactured by BASF Japan Corporation; and CYASORB UV-3346, UV-3529, and UV-3853 manufactured by Sun Chemical Corporation.

[0415] Examples of phosphorus-based antioxidants include: bis(2,6-di-tert-butyl-4-methylphenyl)pentaerythritol diphosphite, distearate pentaerythritol diphosphite, 2,2'-methylenebis(4,6-di-tert-butylphenyl)2-ethylhexyl phosphite, tris(2,4-di-tert-butylphenyl) phosphite, tris(nonylphenyl) phosphite, and tetra(C12~C15 alkyl)-4,4'-isopropylidene diphenyl diphosphite. Phosphate esters, diphenyl mono(2-ethylhexyl) phosphite, diphenyl isodeyl phosphite, tris(isodecyl) phosphite, triphenyl phosphite, tetrakis(2,4-di-tert-butylphenyl)-4,4-biphenyl diphosphite, tris(tridecyl) phosphite, phenyl isooctyl phosphite, phenyl isodeyl phosphite, phenyl di(tridecyl) phosphite, diphenyl isooctyl phosphite, diphenyl tridecyl phosphite, 4, 4'-Isopropylidene diphenol alkyl phosphite, trinonylphenyl phosphite, tri-dinonylphenyl phosphite, tri(biphenyl) phosphite, di(2,4-di-tert-butylphenyl)pentaerythritol diphosphite, di(nonylphenyl)pentaerythritol diphosphite, phenyl bisphenol A pentaerythritol diphosphite, tetra-tetrazyl-4,4'-butylidene bis(3-methyl-6-tert-butylphenol) diphosphite, hexa-tetrazyl-1 Examples of phosphite include 1,3-tris(2-methyl-4-hydroxy-5-tert-butylphenyl)butane triphosphite, 3,5-di-tert-butyl-4-hydroxybenzyl phosphite diethyl ester, sodium bis(4-tert-butylphenyl)phosphite, sodium 2,2-methylene-bis(4,6-di-tert-butylphenyl)phosphite, 1,3-bis(diphenoxyphosphonoxy)benzene, and ethyl bis(2,4-di-tert-butyl-6-methylphenyl)phosphite.

[0416] Commercially available products include: Adekastab PEP-36, PEP-8, HP-10, 2112, 1178, 1500, C, 135A, 3010, and TPP manufactured by ADEKA Corporation; IRGAFOS 168 manufactured by BASF Japan Corporation; and Hostanox P-EPQ manufactured by Clariant Chemicals Co., Ltd.

[0417] Examples of sulfur-based antioxidants include: 2,2-bis{[3-(dodecylthio)-1-oxopropoxy]methyl}propane-1,3-diylbis[3-(dodecylthio)propionate], 3,3'-thiodipropionate di-tetrazyl ester, 2,2-thio-diethylbis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], 2,4-bis[(octylthio)methyl]-o-cresol, 2,4-bis[(laurylthio)methyl]-o-cresol, etc.

[0418] Commercially available products include, for example, Adekastab AO-412S and AO-503 manufactured by ADEKA Corporation, and KEMINOX PLS manufactured by Chemipro Kasei Corporation.

[0419] Antioxidants (M) can be used alone or in combination of two or more.

[0420] The antioxidant (M) content is preferably 0.5 to 5.0 parts by weight per 100 parts by weight of the non-volatile components of the photosensitive composition. If it is present in an appropriate amount, the transmittance, spectral characteristics, and sensitivity will be improved.

[0421] [Storage stabilizer (N)] The photosensitive composition of this embodiment may contain a storage stabilizer (N). This stabilizes the viscosity of the photosensitive composition over time. Examples of storage stabilizers (N) include: benzyltrimethyl chloride, diethylhydroxylamine and other quaternary ammonium chlorides, organic acids such as lactic acid and oxalic acid and their methyl ethers, tert-butylcatechol, tetraethylphosphine, tetraphenyl and other organophosphines, phosphites, etc.

[0422] The content of storage stabilizer (N) is preferably 0.01 to 5 parts by weight per 100 parts by weight of the non-volatile components of the photosensitive composition.

[0423] [Organic Solvent (Q)] The photosensitive composition of this embodiment may contain an organic solvent (Q). Organic solvents (Q) can be listed as follows: 1,2,3-trichloropropane, allyl alcohol, 1-methoxy-2-propanol, ethyl lactate, ethyl acetate, 2-butanol, 1,3-butanediol, 1,3-butylene glycol, 1,3-butanediol diacetate, 1,4-dioxane, 2-heptanone, 2-methyl-1,3-propanediol, 3,5,5-trimethyl-2-cyclohexen-1-one, 3,3,5-trimethylcyclohexanone, ethyl 3-ethoxypropionate, 3-methyl-1,3-butanediol, 3-methoxy-3-methyl-1-butanol, 3-methoxy-3-methylbutylacetate, 3-methoxybutanol, 3-methoxybutylacetate, 4-heptanone, m-xylene, m-diethylbenzene m-Dichlorobenzene, N,N-Dimethylacetamide, N,N-Dimethylformamide, n-Butyl alcohol, n-Butylbenzene, n-Propyl acetate, N-Methylpyrrolidone, o-Xylene, o-Chlorotoluene, o-Diethylbenzene, o-Dichlorobenzene, p-Chlorotoluene, p-Diethylbenzene, Dibutylbenzene, Tertiary Butylbenzene, γ-Butyrolactone, Isobutyl alcohol, Isophorone, Ethylene glycol diethyl ether, Ethylene glycol dibutyl ether, Ethylene glycol monoisopropyl ether, Ethylene glycol monoethyl ether acetate, Ethylene glycol monotert-butyl ether, Ethylene glycol monobutyl ether, Ethylene glycol monobutyl ether, Ethylene glycol monoisopropyl ether Diethylene glycol monobutyl ether acetate, ethylene glycol monopropyl ether, ethylene glycol monohexyl ether, ethylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, diisobutyl ketone, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol monoisopropyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, diethylene glycol monomethyl ether, cyclohexanol, cyclohexanol acetate, cyclohexanone, dipropylene glycol dimethyl ether, dipropylene glycol methyl ether acetate, dipropylene glycol monoethyl ether, dipropylene glycol monobutyl ether, dipropylene glycol monopropyl ether, dipropylene glycol... Diol monomethyl ether, diacetone alcohol, triacetin, tripropylene glycol monobutyl ether, tripropylene glycol monomethyl ether, propylene glycol diacetate, propylene glycol phenyl ether, propylene glycol monoethyl ether, propylene glycol monoethyl ether acetate, propylene glycol monobutyl ether, propylene glycol monopropyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether propionate, benzyl alcohol, methyl isobutyl ketone, methyl cyclohexanol, n-amyl acetate, n-butyl acetate, isoamyl acetate, isobutyl acetate, propyl acetate, diesters, etc.

[0424] Among these, from the viewpoint of pigment dispersibility and alkali-soluble resin solubility, preferred are glycol acetates such as ethyl lactate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, ethylene glycol monomethyl ether acetate, and ethylene glycol monoethyl ether acetate; alcohols such as benzyl alcohol, diacetone alcohol, propylene glycol monomethyl ether, and propylene glycol monoethyl ether; and ketones such as cyclohexanone.

[0425] To obtain a hardened film formed by a heating step below 180°C after patterning using photolithography, a solvent with higher drying properties is used. The appropriate solvent is selected based on the conditions of the heating step.

[0426] Solvents with higher drying properties include, for example, ethyl acetate (boiling point 77℃), 2-propanol (boiling point 83℃), isobutyl alcohol (boiling point 108℃), propyl acetate (boiling point 102℃), propylene glycol monomethyl ether (boiling point 121℃), n-butyl acetate (boiling point 126℃), isobutyl acetate (boiling point 118℃), allyl alcohol (boiling point 97℃), and 2-butanol (boiling point 100℃). By using these solvents, the heat energy generated during low-temperature heating can be efficiently used for the formation of the hardened film, thus improving solvent resistance.

[0427] Organic solvents (Q) can be used alone or in combination with two or more.

[0428] [Method for manufacturing photosensitive components] The photosensitive composition of this embodiment is prepared by, for example, by adding a pigment (A), a resin-type dispersant (Z), and an organic solvent (Q) and then dispersing them. Subsequently, it can be manufactured by formulating and mixing an adhesive resin (B), a polymerizable compound (C), and a photopolymerization initiator (D) into the dispersion. Furthermore, the timing of formulating each material is arbitrary. Additionally, multiple dispersion steps can be performed.

[0429] Dispersing machines used for dispersion processing include, for example, two-roll mills, three-roll mills, ball mills, horizontal sand mills, vertical sand mills, annular type bead mills, or grinding mills.

[0430] The average dispersed particle size (secondary particle size) of the near-infrared absorbing pigment in the dispersion is preferably 30 nm to 200 nm, and more preferably 40 nm to 200 nm. With a suitable particle size, it is easy to obtain a photosensitive composition with high dispersion stability.

[0431] The method for determining the average dispersed particle size (secondary particle size) is, for example, using the UPA-EX150 microtrack from Nikkiso Corporation, which employs dynamic light scattering (fast Fourier transform, FFT) power spectroscopy. The particle permeability is set to absorption mode, the particle shape to non-spherical, and the D50 particle size to the average diameter. The dilution solvent used for the measurement is the same organic solvent used in the dispersion. If the sample, after being treated with ultrasound, is measured immediately after sample adjustment, it is easier to obtain results with smaller deviations.

[0432] Regarding the photosensitive composition, it is preferable to remove coarse particles of 5 μm or larger, more preferably coarse particles of 1 μm or larger, and even more preferably coarse particles of 0.5 μm or larger, as well as mixed dust, by means of centrifugation, filtration using a sintered filter or a membrane filter. The photosensitive composition of this embodiment preferably does not substantially contain particles larger than 0.5 μm, and more preferably does not contain particles smaller than 0.3 μm.

[0433] The photosensitive component of this embodiment can form a hardened film even by low-temperature firing. In one embodiment, the photosensitive composition can form a good hardened film even when calcined at a low temperature of 100°C. For example, a 3 μm thick film is formed by coating the photosensitive composition and drying it at 90°C for 1 minute. After exposure to ultraviolet light using an ultra-high pressure mercury lamp with an illuminance of 500 mW / cm² and an irradiation dose of 200 mJ / cm², the hardened film formed by heating it at 90°C for 30 minutes has a residual film rate of 75% or more.

[0434] Hardened membrane The hardened film of this embodiment is obtained by curing a film formed using the photosensitive composition of this embodiment through processes such as exposure.

[0435] [Manufacturing method of hardened film] There is no particular limitation on the manufacturing method of the hardening film. For example, it can be made by the following steps: forming a film by coating a photosensitive component on a substrate (1); exposing a photomask on the film to form a pattern (2); forming a patterned hardening film by alkaline development of the unexposed parts (3); and heating the pattern (post-baking) (4).

[0436] The manufacturing method of the hardened film will be described in detail below.

[0437] (Step (1)) In the film formation step (1), the photosensitive components are coated onto the substrate by methods such as spin coating, roller coating, slot coating, casting coating, or inkjet coating. If necessary, an oven or heating plate is used to dry (pre-bake) at a temperature of 50°C to 120°C for 10 to 120 seconds. Examples of substrates include glass substrates and silicon substrates. Silicon substrates, for example, may have imaging elements such as charge-coupled devices (CCDs) or complementary metal-oxide-semiconductor (CMOS) formed on their surfaces. Additionally, depending on requirements, a lower coating layer may be applied to the substrate to improve adhesion to the upper layer, prevent material diffusion, and planarize the substrate surface. Regarding the layer thickness, it is preferable to coat the layer to a thickness of 0.05 μm to 10.0 μm after drying, and more preferably to a thickness of 0.3 μm to 5 μm.

[0438] (Step (2)) In the exposure step, a dielectric mask exposes the film obtained in step (1) to a specific pattern. Exposure is performed, for example, using an exposure device such as a stepper. Examples of radiation used for exposure include gamma rays, h-rays, i-rays, and ultraviolet radiation.

[0439] (Step (3)) After step (2), the film is subjected to alkaline development treatment, and the unexposed part of the film is dissolved into the alkaline aqueous solution, leaving only the hardened part, thereby obtaining a patterned film. Developers can include, for example, sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilate, ammonia, ethylamine, diethylamine, dimethylethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, choline, pyrrole, piperidine, 1,8-diazabicyclo-[5.4.0]-7-undecene, and other alkaline compounds. The concentration of the developer is preferably 0.001% to 10% by mass, and more preferably 0.01% to 1% by mass. The optimal pH for alkaline developers is 11-13, and more preferably 11.5-12.5. Using the developer at a suitable pH level will suppress pattern roughness and peeling, and improve the residual film yield after development.

[0440] Developing methods include, for example, immersion, spraying, and puddle methods. The preferred developing temperature is 15°C to 40°C. Furthermore, after alkaline development, rinsing with pure water is preferable.

[0441] (Step (4)) The heat treatment (post-baking) is to fully harden the patterned film obtained in step (3) by heating. The post-baking temperature is below 180°C, preferably below 160°C, more preferably below 140°C, and even more preferably below 120°C. There is no particular limitation on the lower limit of the post-baking temperature, as long as the film can be hardened. However, if we want to improve it with the current technology, it is preferably 80°C. In addition, the post-baking time is preferably about 2 minutes to 1 hour, more preferably about 5 minutes to 1 hour.

[0442] [Color filters, optical filters] The hardened film of this embodiment can be used in color filters and optical filters. Among optical filters, infrared cut-off filters and infrared transmittance filters are preferred. The color filters and optical filters described in this specification can be manufactured using the same method as the hardened film.

[0443] [Image display device] The hardened film of this embodiment can be used in image display devices. There are no particular limitations on its form in image display devices; it can be used as a near-infrared cutoff filter, a near-infrared filter pass-through, a color filter, or a black matrix. Examples of black matrices include: black edges set around the periphery of image display devices such as solid-state imaging elements and liquid crystal display devices; grid-like and / or striped black portions between red, blue, and green pixels; dot-like and / or line-like black patterns used for light shielding of thin-film transistors (TFTs), etc.

[0444] An example of an image display device according to this embodiment will be described. The image display device includes the hardened film of this embodiment and a light source. Examples of light sources include: cold cathode fluorescent lamps (CCFLs), light-emitting diodes (LEDs), and organic EL elements. FIG1 is a schematic cross-sectional view showing a structural example of an image display device including a hardened film. The image display device 10 shown in FIG1 includes a pair of transparent substrates 11 and 21 arranged separately facing each other, with a liquid crystal LC sealed between them.

[0445] A TFT (thin-film transistor) array 12 is formed on the inner surface of the first transparent substrate 11, and a transparent electrode layer 13, for example containing ITO, is formed thereon. An alignment layer 14 is disposed on the transparent electrode layer 13. In addition, a polarizing plate 15 is formed on the outer surface of the transparent substrate 11.

[0446] On the other hand, a color filter 22 is formed on the inner surface of the second transparent substrate 21. The red, green and blue filter segments constituting the color filter 22 are separated by a black matrix (not shown).

[0447] A color filter 22 is covered, and a transparent protective film (not shown) is formed as needed. Then, a transparent electrode layer 23 containing, for example, ITO is formed on it, and an alignment layer 24 is provided covering the transparent electrode layer 23.

[0448] In addition, a polarizing plate 25 is formed on the outer surface of the transparent substrate 21. Furthermore, a backlight unit 30 is provided below the polarizing plate 15.

[0449] Liquid crystal LCs can be aligned according to driving modes such as twisted nematic (TN), super twisted nematic (STN), in-plane switching (IPS), vertical alignment (VA), and optically compensated birefringence (OCB). A TFT (thin-film transistor) array 12 is formed on the inner surface of the first transparent substrate 11, and a transparent electrode layer 13, for example containing ITO, is formed thereon. An alignment layer 14 is disposed on the transparent electrode layer 13. Furthermore, a polarizing plate 15 is formed on the outer surface of the transparent substrate 11.

[0450] On the other hand, a color filter 22 is formed on the inner surface of the second transparent substrate 21. The red, green and blue filter segments constituting the color filter 22 are separated by a black matrix (not shown).

[0451] A color filter 22 is covered, and a transparent protective film (not shown) is formed as needed. Then, a transparent electrode layer 23 containing, for example, ITO is formed on it, and an alignment layer 24 is provided covering the transparent electrode layer 23.

[0452] In addition, a polarizing plate 25 is formed on the outer surface of the transparent substrate 21. Furthermore, a backlight unit 30 is provided below the polarizing plate 15.

[0453] As a white LED light source 31, there are those with a fluorescent filter formed on the surface of the blue LED or those containing a phosphor in the resin encapsulation of the blue LED. Preferably, it is a white LED light source (LED1) with the following spectral characteristics: having a wavelength (λ3) where the luminous intensity becomes extremely large in the range of 430 nm to 485 nm, a wavelength (λ4) where the luminous intensity becomes extremely large in the range of 530 nm to 580 nm, and a wavelength (λ5) where the luminous intensity becomes extremely large in the range of 600 nm to 650 nm; and the ratio of the luminous intensity I3 at wavelength λ3 to the luminous intensity I4 at wavelength λ4 (I4 / I3) is 0.2 or more and 0.4 or less, and the ratio of the luminous intensity I3 at wavelength λ3 to the luminous intensity I5 at wavelength λ5 (I5 / I3) is 0.1 or more and 1.3 or less. Also, it is a white LED light source (LED1) with the following spectral characteristics: having a wavelength (λ1) where the luminous intensity becomes extremely large in the range of 430 nm to 485 nm, a wavelength (λ4) where the luminous intensity becomes extremely large in the range of 530 nm to 580 nm, and a wavelength (λ5) where the luminous intensity becomes extremely large in the range of 530 nm to 580 nm. A white LED light source (LED2) having a peak wavelength (λ2) of second luminous intensity within the range of nm, and a spectral characteristic of having a ratio (I2 / I1) of luminous intensity I1 at wavelength λ1 to luminous intensity I2 at wavelength λ2 of 0.2 or more and 0.7 or less.

[0454] Specifically, LED1 can be exemplified by NSSW306D-HG-V1 and NSSW304D-HG-V1 manufactured by Nichia Chemical Industries, Ltd.

[0455] Specifically, LED2 can be exemplified by products such as NSSW440 and NSSW304D manufactured by Nichia Chemical Industries, Ltd.

[0456] [Solid-state imaging element] The solid-state imaging element of this embodiment has a hardened film. There are no particular limitations on the structure of the solid-state imaging element, as long as it functions as a solid-state imaging element. A preferred solid-state imaging element has, for example, the following structure: a plurality of photodiodes constituting the light-receiving area of ​​a solid-state imaging element (CCD (charge-coupled device) image sensor, CMOS (complementary metal oxide semiconductor) image sensor, etc.) and a transmission electrode containing polysilicon, etc., on a substrate; a light-shielding film having openings only to the light-receiving portion of the photodiodes on the photodiodes and the transmission electrode; a device protective film containing silicon nitride, etc., formed on the light-shielding film to cover the entire surface of the light-shielding film and the light-receiving portion of the photodiodes; and a color filter on the device protective film. Furthermore, structures with a light-concentrating component (e.g., microlens; hereinafter the same) on the device protective film and below the color filter (on the side closest to the substrate) or structures with a light-concentrating component on the color filter can also be cited. Additionally, the color filter is preferably a structure in which each color pixel is embedded in a space divided by isolation walls into, for example, a grid-like structure. In this case, the isolation wall is preferably of low refractive index relative to each colored pixel. Imaging devices including solid-state imaging elements include, for example, those described in Japanese Patent Application Publication No. 2012-227478, Japanese Patent Application Publication No. 2014-179577, and International Publication No. 2018 / 043654. Applications of such imaging devices include not only digital cameras and electronic devices with imaging functions (such as mobile phones), but also vehicle-mounted cameras and surveillance cameras.

[0457] [Infrared sensor] The infrared sensor of this embodiment has a hardened film. FIG2 is a schematic cross-sectional view showing a structural example of the infrared sensor. The infrared sensor 300 shown in FIG2 includes a solid-state imaging element 310.

[0458] The imaging area on the solid-state imaging element 310 is formed by combining an infrared cut-off filter 311 with a color filter 312. The infrared absorption filter 311 allows light in the visible light region (e.g., light with wavelengths of 400 nm to 700 nm) to pass through, while blocking light in the infrared region (e.g., light with wavelengths of 800 nm to 1300 nm). Color filter 312 is a color filter that forms pixels that transmit and absorb light of a specific wavelength in the visible light region, such as a color filter that forms red (R), green (G), and blue (B) pixels.

[0459] A resin film 314 is disposed between the infrared transmission filter 313 and the solid-state imaging element 310, which allows light of the wavelength that passes through the infrared transmission filter 313 to pass through. The infrared transmission filter 313 is a filter that has visible light blocking properties and allows infrared light of a specific wavelength to pass through. It can use a hardened film of this embodiment containing the near-infrared absorbing pigment. The infrared transmission filter 113 is preferably, for example, to block light with wavelengths of 400 nm to 830 nm and allow light with wavelengths of 900 nm to 1300 nm to pass through.

[0460] Microlenses 315 are disposed on the light incident side of the color filter 312 and the infrared transmission filter 313. A planarization film 316 is formed to cover the microlenses 315.

[0461] In the configuration shown in Figure 2, a resin film 314 is provided, but an infrared transmission filter 313 can also be formed to replace the resin film 314.

[0462] In addition to serving as a light-shielding film at the end and / or side of the surface of the infrared cut-off filter 311, the hardened film of this embodiment, when used on the inner wall of an infrared sensor device, prevents internal reflection and / or the incident of meaningless light onto the light receiving part, thereby improving sensitivity.

[0463] This infrared sensor, by simultaneously acquiring image information, enables motion sensing and other functions for recognizing moving objects. Furthermore, because it can acquire distance information, it can also capture images including three-dimensional (3D) information. Moreover, this infrared sensor can also be used as a biometric authentication sensor.

[0464] Furthermore, the hardened film of this embodiment can also be used as a colored spacer. For example, when the spacer is used in a TFT-type liquid crystal display (LCD), the TFT may malfunction as a switching element due to incident light; the colored spacer is used to prevent this. The colored spacer can be formed using the same method as the black matrix, except when using a colored spacer mask.

[0465] Furthermore, the hardened film of this embodiment can also be used in applications such as micro-LEDs (Light Emitting Diodes) and micro-OLEDs (Organic Light Emitting Diodes). Although not particularly limited, it can also be suitably used in components that impart light-shielding and anti-reflective properties, in addition to optical filters and optical films used in micro-LEDs and micro-OLEDs. Examples of micro-LEDs and micro-OLEDs include those described in Japanese Patent Publication No. 2015-500562 and Japanese Patent Publication No. 2014-533890.

[0466] Furthermore, the hardened film of this embodiment can also be used in applications such as quantum dot displays. Although not particularly limited, it can also be suitably used in components that impart light-shielding and anti-reflective properties, in addition to optical filters and optical films used in quantum dot displays.

[0467] Furthermore, embodiments of the present invention include various embodiments not described herein. For example, it includes the structures described below.

[0468] One structure of the present invention is a photosensitive coloring composition comprising: a pigment (A), a binder resin (B), a polymerizable compound (C), a photopolymerization initiator (D), and a leveling agent (E), wherein the photosensitive coloring composition, Adhesive resin (B) comprises an alkali-soluble adhesive resin (Bb) containing constituent units having block isocyanate groups. The photopolymerization initiator (D) is an O-acryloxime ester-based photopolymerization initiator (D1) represented by the general formula (1), general formula (2), general formula (3), general formula (4) or general formula (5).

[0469] Another structure of the present invention is the photosensitive coloring composition, wherein the leveling agent (E) comprises any one of a silicone-based surfactant and a fluorinated surfactant.

[0470] Another structure of the present invention is the photosensitive coloring composition, wherein the adhesive resin (B) further comprises an alkali-soluble adhesive resin (B1) having a weight average molecular weight of 5,000 or more and less than 50,000 when converted from polystyrene (except in the case of alkali-soluble adhesive resin (Bb)).

[0471] Another structure of the present invention is the photosensitive coloring composition, wherein the alkali-soluble adhesive resin (B1) comprises a constituent unit (b3) having an aliphatic ring group.

[0472] Another structure of the present invention is the photosensitive coloring composition, wherein the alkali-soluble adhesive resin (B1) has a constituent unit (b3) having an aliphatic ring group, which has a ring represented by the formula (b31) or (b32).

[0473] Another structure of the present invention is the photosensitive coloring composition, wherein the alkali-soluble adhesive resin (B1) further comprises structures (b1-2) derived from polybasic acid anhydrides.

[0474] Another structure of the present invention is the photosensitive coloring composition, which further comprises a resin-type dispersant (Z).

[0475] Another structure of the present invention is the photosensitive coloring composition, wherein the resin-type dispersant (Z) comprises an acidic resin-type dispersant (ZA).

[0476] Another structure of the present invention is the photosensitive coloring composition, wherein the acidic resin type dispersant (ZA) comprises a photocrosslinking acidic resin type dispersant (ZAUV-1).

[0477] Another structure of the present invention is a hardened film, which is a hardened form of the photosensitive coloring composition.

[0478] Another structure of the present invention is a color filter having the aforementioned hardened film.

[0479] Another structure of the present invention is an optical filter having the hardened film.

[0480] Another structure of the present invention is an image display device having the aforementioned hardened film.

[0481] Another structure of the present invention is a solid-state imaging element having the aforementioned hardened film.

[0482] Another structure of the present invention is an infrared sensor having the hardened film.

[0483] In this specification, the numerical range represented by "~" indicates the range in which the values ​​before and after "~" are respectively the minimum and maximum values. Within the numerical ranges described in stages in this specification, the upper or lower limit of a certain stage's numerical range can be arbitrarily combined with the upper or lower limits of the numerical ranges of other stages.

[0484] This invention relates to the subject matter of Japanese Patent Application No. 2021-148439, filed on September 13, 2021, and all its disclosures are incorporated herein by reference. [Example]

[0485] The present invention will now be described in more detail through examples. However, the present invention is not limited to these examples. Furthermore, "parts" refers to "parts by mass," and "%" refers to "% by mass." Additionally, in the present invention, non-volatile components or non-volatile component concentration refers to the residual mass of the component after standing in an oven at 230°C for 30 minutes.

[0486] Before the examples, each measurement method will be described. The determination of the resin's weight-average molecular weight (Mw), number-average molecular weight (Mn), acid value (mgKOH / g), amine value (mgKOH / g), and glass transition temperature (Tg) is as follows.

[0487] (Average molecular weight of adhesive resins and dispersion resins) The number-average molecular weight (Mn) and weight-average molecular weight (Mw) of the adhesive resin and dispersion resin were determined using gel permeation chromatography (GPC) equipped with a refractive index (RI) detector. An HLC-8220GPC (manufactured by Tosoh Corporation) was used as the apparatus, with two separation columns connected in series. Two "TSK-GEL SUPER HZM-N" gels were connected in the packing material of both columns. The determination was performed at an oven temperature of 40°C, using tetrahydrofuran (THF) solution as the dissolution solution, and a flow rate of 0.35 ml / min. The sample was dissolved in a solvent containing 1 wt% of the dissolution solution, and 20 μL was injected. Molecular weights are converted from polystyrene values.

[0488] (Acid value of adhesive resins and dispersion resins) Acetone (80 ml) and water (10 ml) were added to 0.5 g to 1 g of the adhesive resin and dispersion resin solution, and the mixture was stirred until homogeneous. A 0.1 mol / L potassium hydroxide (KOH) aqueous solution was used as the titrant, and titration was performed using an automatic titration apparatus ("COM-555", manufactured by Hiranuma Co., Ltd.). The acid value (mgKOH / g) was determined according to JIS K 0070. Furthermore, the acid value per unit of non-volatile component of the resin was calculated based on the acid value of the resin solution and the concentration of non-volatile components in the resin solution.

[0489] (Amine value of the dispersion resin) The amine value of the dispersion resin is obtained by converting the measured total amine value (mgKOH / g) into the value of non-volatile components according to the method of American Society for Testing Material (ASTM) D 2074.

[0490] (Glass transfer temperature) The glass transition temperature of the adhesive resin (B) was determined using a differential scanning calorimeter. A 5 mg sample was weighed in the sample pan and heated at a rate of 10 °C / min over a nitrogen flow.

[0491] <Manufacturing of Pigment (A)> <Manufacturing of Micronized Pigments> (Manufacturing of micronized pigment A-R177) 500 parts of anthraquinone-based red pigment CI Pigment Red 177 (Cinilex red SR3C manufactured by CINIC), 500 parts of sodium chloride, and 250 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Manufacturing Co., Ltd.) and kneaded at 120°C for 8 hours. Next, the mixture was added to 5 liters of warm water and stirred for 1 hour while heating to 70°C to form a slurry. The slurry was repeatedly filtered and washed to remove sodium chloride and diethylene glycol, and then dried at 80°C for 24 hours to obtain a refined organic pigment (A-R177).

[0492] (Manufacturing of micronized pigment A-R254) 500 parts of diketopyrrolopyrrole red pigment CI Pigment Red 254 (Irgajin Red L 3630 manufactured by BASF Japan Co., Ltd.), 500 parts of sodium chloride, and 250 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Manufacturing Co., Ltd.) and kneaded at 120°C for 8 hours. Next, the mixture was added to 5 liters of warm water and heated to 70°C while stirring for 1 hour to form a slurry. The slurry was repeatedly filtered and washed to remove sodium chloride and diethylene glycol, and then dried at 80°C for 24 hours to obtain the micronized organic pigment (A-R254).

[0493] (Manufacturing of micronized pigment A-R291) 500 parts of diketopyrrolopyrrole red pigment CI Pigment Red 291, 500 parts of sodium chloride, and 250 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Manufacturing Co., Ltd.) and kneaded at 120°C for 8 hours. Next, the mixture was added to 5 liters of warm water and heated to 70°C while stirring for 1 hour to form a slurry. The slurry was repeatedly filtered and washed to remove sodium chloride and diethylene glycol, and then dried at 80°C for 24 hours to obtain a refined organic pigment (A-R291).

[0494] Manufacturing of Micronized Pigments (A-Y1) to (A-Y3) The following quinoline compounds (a) to (c) were prepared according to the examples disclosed in Japanese Patent Application Publication No. 2012-226110.

[0495] [Chemistry 46]

[0496] (Manufacturing of micronized pigment (A-Y1)) 34 parts of quinoline ketone compound (a), 33 parts of quinoline ketone compound (b), 33 parts of quinoline ketone compound (c), 1200 parts of sodium chloride, and 120 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Manufacturing Co., Ltd.) and kneaded at 60°C for 6 hours, followed by salt milling. The resulting mixture was then added to 3 liters of warm water and heated to 70°C while stirring for 1 hour to form a slurry. The slurry was repeatedly filtered and washed to remove sodium chloride and diethylene glycol, and then dried at 80°C for 24 hours to obtain 98 parts of the refined pigment (A-Y1).

[0497] (Manufacturing of micronized pigment A-Y138) 100 parts of quinoline-based yellow pigment CI Pigment Yellow 138 (Paliotol Yellow K0960-HD manufactured by BASF Japan Co., Ltd.), 700 parts of sodium chloride, and 180 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Manufacturing Co., Ltd.) and kneaded at 80°C for 6 hours. This mixture was then added to 2000 parts of warm water and heated to 80°C while stirring for 1 hour to form a slurry. The slurry was repeatedly filtered and washed to remove salt and solvent, and then dried at 80°C for 24 hours to obtain a finely refined yellow pigment (A-Y138).

[0498] (Manufacturing of micronized pigment A-Y139) 100 parts of isoindoline-based yellow pigment CI Pigment Yellow 139 (Paliotol Yellow D1819 manufactured by BASF Japan Co., Ltd.), 1600 parts of sodium chloride, and 190 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Manufacturing Co., Ltd.) and kneaded at 60°C for 10 hours. Next, the mixture was added to 3 liters of warm water and stirred using a high-speed mixer for about 1 hour while heating to about 80°C to form a slurry. The slurry was repeatedly filtered and washed with water to remove sodium chloride and solvent, and then dried at 80°C for 24 hours to obtain the micronized organic pigment (A-Y139).

[0499] (Micronized Pigment (A-Y150)) 100 parts of a metal complex yellow pigment (CI Pigment Yellow 150 (Lanxess, "Yellow Pigment E4GN")), 1600 parts of sodium chloride, and 190 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (Inoue Manufacturing Co., Ltd.) and kneaded at 60°C for 10 hours. Next, the mixture was added to 3 liters of warm water and stirred at a high speed for about 1 hour while heating to about 80°C to form a slurry. The slurry was repeatedly filtered and washed to remove sodium chloride and solvent, and then dried at 80°C for 24 hours to obtain a micronized organic pigment (A-Y150).

[0500] (Manufacturing of yellow pigment (A-Y4)) (Azobarbituric acid precursor) Azobarbituric acid precursors were prepared according to the synthesis method described in Japanese Patent Application Publication No. 2017-171915. (Instruction 1) At 85°C, 46.2 g of diazobarbituric acid and 38.4 g of barbituric acid were added to 1100 g of distilled water. The pH was then adjusted to approximately pH 5 using a potassium hydroxide aqueous solution, and stirring continued for 90 minutes.

[0501] (Yellow pigment (Y4-1)) The azobarbituric acid precursor (0.3 mol) prepared in Description 1 was mixed with 1500 parts of distilled water at 82°C. The pH was then adjusted to 2-2.5 by adding 10 parts of 30% hydrochloric acid dropwise. Next, 79.4 parts of melamine (0.63 mol) was introduced. Then, a nickel chloride solution with approximately 25% strength (0.3 mol) was added dropwise. After incubation at 82°C for 3 hours, the pH was adjusted to approximately 5.5 using KOH. Next, the mixture was diluted with approximately 100 parts of distilled water at 90°C. Then, 21 parts of 30% hydrochloric acid were added dropwise, and the temperature was maintained at 90°C for 12 hours. Finally, the pH was adjusted to approximately 5 using an aqueous potassium hydroxide solution. Subsequently, the pigment was separated and washed on a suction filter, dried at 80°C in a vacuum drying cabinet, and ground in a standard laboratory mill for 2 minutes (yellow pigment (Y4-1) = adduct of nickel azobarbituric acid and melamine).

[0502] (Yellow pigment (Y4-2)) The "0.3 mol of nickel chloride solution with approximately 25% strength" in the example of manufacturing yellow pigment (Y4-1) was replaced with "a mixed solution of 0.225 mol of nickel chloride with 25% strength + 0.075 mol of copper(II) chloride with 25% strength". Otherwise, yellow pigment (Y4-2) was obtained in the same manner as yellow pigment (Y4-1) (yellow pigment (Y4-2) = melamine adduct of copper / nickel azobarbituric acid, a mixed compound having 25 mol% copper and 75 mol% nickel).

[0503] (Yellow pigment (Y4-3)) The "0.3 mol of nickel chloride solution with approximately 25% strength" in the example of manufacturing yellow pigment (Y4-1) was replaced with "a mixed solution of 0.150 mol of nickel chloride with 25% strength + 0.150 mol of zinc chloride with 25% strength". Otherwise, yellow pigment (Y4-3) was obtained in the same manner as yellow pigment (Y4-1) (yellow pigment (Y4-3) = a melamine adduct of zinc / nickel azobarbituric acid and a mixed compound having 25 mol% Zn and 75 mol% nickel).

[0504] (Yellow pigment (Y4-4)) The "0.3 mol of nickel chloride solution with approximately 25% strength" in the example of manufacturing yellow pigment (Y4-1) was replaced with "a mixed solution of 0.075 mol of nickel chloride with 25% strength + 0.225 mol of zinc chloride with 25% strength". Otherwise, yellow pigment (Y4-4) was obtained in the same manner as yellow pigment (Y4-1) (yellow pigment (Y4-4) = melamine adduct of zinc / nickel azobarbituric acid, a mixed compound having 50 mol% Zn and 50 mol% nickel).

[0505] (Yellow micronized pigment (A-Y4)) 25 parts of yellow pigment (Y4-1), 25 parts of yellow pigment (Y4-2), 25 parts of yellow pigment (Y4-3), 25 parts of yellow pigment (Y4-4), 1000 parts of sodium chloride, and 120 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Manufacturing Co., Ltd.) and kneaded at 70°C for 8 hours. The mixture was then added to 2000 parts of warm water and stirred using a high-speed mixer for about 1 hour while heating to approximately 80°C to form a slurry. The slurry was repeatedly filtered and washed with water to remove salt and solvent. After drying at 80°C for 24 hours, a yellow micro-refined pigment (A-Y4) was obtained.

[0506] (Miniaturized green pigment (A-G58)) 100 parts of CI pigment Green 58 (FASTOGEN Green A110 manufactured by DIC Co., Ltd.), 1,200 parts of sodium chloride, and 120 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Manufacturing Co., Ltd.) and kneaded at 70°C for 6 hours. The mixture was then added to 3,000 parts of warm water and stirred at 70°C using a high-speed mixer for 1 hour to form a slurry. The slurry was repeatedly filtered and washed to remove sodium chloride and diethylene glycol. After drying at 80°C for 24 hours, it was pulverized to obtain a finely refined green pigment (A-G58).

[0507] (Miniaturized green pigment (A-G59)) 100 parts of CI pigment green 59, 1,200 parts of sodium chloride, and 120 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Manufacturing Co., Ltd.) and kneaded at 70°C for 6 hours. The mixture was then added to 3,000 parts of warm water and stirred at 70°C using a high-speed mixer for 1 hour to form a slurry. The slurry was repeatedly filtered and washed to remove sodium chloride and diethylene glycol. After drying at 80°C for 24 hours, it was pulverized to obtain a finely refined green pigment (A-G59).

[0508] (Miniaturized green pigment (A-G62)) 100 parts of CI pigment green 62, 1,200 parts of sodium chloride, and 120 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Manufacturing Co., Ltd.) and kneaded at 60°C for 6 hours. Next, the kneaded mixture was added to warm water and stirred for 1 hour using a high-speed mixer while heating to approximately 80°C to form a slurry. The slurry was then filtered, washed with water to remove sodium chloride and diethylene glycol, dried at 80°C for 24 hours, and then pulverized to obtain a finely refined green pigment (A-G62).

[0509] (Miniaturized green pigment (A-G63)) 100 parts of CI pigment green 63, 1,200 parts of sodium chloride, and 120 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Manufacturing Co., Ltd.) and kneaded at 60°C for 6 hours. Next, the kneaded mixture was added to warm water and stirred for 1 hour using a high-speed mixer while heating to approximately 80°C to form a slurry. After filtration and washing to remove sodium chloride and diethylene glycol, the slurry was dried at 80°C for 24 hours and then pulverized to obtain a finely refined green pigment (A-G63).

[0510] (Miniaturized green pigment (A-G7)) 100 parts of CI pigment green 7 (Lionol green 8390 manufactured by TOYOCOLOR Co., Ltd.), 1,200 parts of sodium chloride, and 120 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded at 60°C for 6 hours. Next, the kneaded mixture was added to warm water and stirred for 1 hour using a high-speed mixer while heating to approximately 80°C to form a slurry. After filtration and washing to remove sodium chloride and diethylene glycol, the slurry was dried at 80°C for 24 hours and then pulverized to obtain a finely refined green pigment (A-G7).

[0511] (Miniaturized green pigment (A-G36)) 100 parts of CI pigment Green 36 (Lionol green 6YK manufactured by TOYOCOLOR Co., Ltd.), 1,200 parts of sodium chloride, and 120 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded at 60°C for 6 hours. Next, the kneaded mixture was added to warm water and stirred for 1 hour using a high-speed mixer while heating to approximately 80°C to form a slurry. After filtration and washing to remove sodium chloride and diethylene glycol, the slurry was dried at 80°C for 24 hours and then pulverized to obtain a finely refined green pigment (A-G36).

[0512] (Miniaturized blue pigment (A-B156)) 100 parts of CI pigment blue 15:6 (Lionol blue ES manufactured by TOYOCOLOR Co., Ltd.), 1,000 parts of sodium chloride, and 100 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Manufacturing Co., Ltd.) and kneaded at 50°C for 12 hours. The mixture was then added to 3,000 parts of warm water and stirred at a high speed for about 1 hour while heating to about 70°C to form a slurry. The slurry was repeatedly filtered and washed with water to remove salt and solvent. After drying at 80°C for 24 hours, it was pulverized to obtain a finely refined blue pigment (A-B156).

[0513] (Miniaturized blue pigment (A-B153)) 100 parts of CI pigment blue 15:3 (Lionol blue FG7351 manufactured by TOYOCOLOR Co., Ltd.), 1,000 parts of sodium chloride, and 100 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Manufacturing Co., Ltd.) and kneaded at 50°C for 12 hours. The mixture was then added to 3,000 parts of warm water and stirred at a high speed for about 1 hour while heating to about 70°C to form a slurry. The slurry was repeatedly filtered and washed with water to remove salt and solvent. After drying at 80°C for 24 hours, it was pulverized to obtain a finely refined blue pigment (A-B153).

[0514] (Miniaturized purple pigment (A-V23)) 100 parts of CI pigment Violet 23 (Lionogen violet FG6140 manufactured by TOYOCOLOR Co., Ltd.), 1,000 parts of sodium chloride, and 100 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded at 50°C for 12 hours. The mixture was then added to 3,000 parts of warm water and stirred at a high speed for about 1 hour while heating to about 70°C to form a slurry. The slurry was repeatedly filtered and washed with water to remove salt and solvent. After drying at 80°C for 24 hours, it was pulverized to obtain a finely refined purple pigment (A-V23).

[0515] <Manufacturing of Resin 1 with Cationic Side Chains> (In a solution of resin 1 with cationic groups on the side chain) In a reaction apparatus equipped with a gas inlet pipe, condenser, stirring blades, and thermometer, 33.2 parts of methyl methacrylate, 27.3 parts of n-butyl methacrylate, and 27.3 parts of 2-ethylhexyl methacrylate were added. The mixture was stirred at 50°C for 1 hour while nitrogen was flowing through it to purge the system with nitrogen. Next, 2.1 parts of ethyl bromoisobutyrate, 1.9 parts of cuprous chloride, and 62.3 parts of propylene glycol monomethyl ether were added. The mixture was heated to 100°C under a nitrogen flow to begin the polymerization of the first block. After 4 hours of polymerization, the polymerization solution was sampled, and the solid content was determined. Based on the non-volatile components, the polymerization conversion rate was confirmed to be above 98%. Next, 8.1 parts of propylene glycol monomethyl ether and 12.2 parts of dimethylaminoethyl methyl chloride methacrylate (as the second block monomer) were added to the reaction apparatus. The mixture was maintained at 100°C under a nitrogen atmosphere and stirred to continue the reaction. Two hours after the addition of dimethylaminoethyl methyl chloride methacrylate, the polymerization solution was sampled and its solid content was determined. Based on the non-volatile components, the polymerization conversion to the second block was confirmed to be above 98%, and the solution was cooled to 50°C. Subsequently, methanol was added to obtain a resin (E-1) with 40% by mass of cationic groups on its side chains. The weight average molecular weight (Mw) of resin (E-1) was 7,300.

[0516] (Manufacturing of dye solutions A-D1 to A-D3) (Dye 1) A solution of resin 1 with cationic side chains, consisting of 30 parts (based on non-volatile components) of resin 1 with 2000 parts water, was added and thoroughly mixed by stirring. The mixture was then heated to 60°C. Meanwhile, an aqueous solution of 10 parts CI Acid Red 52 dissolved in 90 parts water was prepared and added dropwise to the resin solution. After addition, the mixture was stirred at 60°C for 120 minutes to allow the reaction to proceed. To confirm the endpoint of the reaction, the reaction solution was added dropwise to filter paper, and the point at which no more seepage occurred was considered the endpoint, indicating the formation of a salt compound. The mixture was stirred while being allowed to cool to room temperature, then filtered by suction. After washing with water, the remaining salt compound on the filter paper was dried using a dryer, yielding a salt compound of CI Acid Red 52 and resin 1 with cationic side chains, i.e., the colorant (dye 1). At this point, the content of the effective pigment component derived from CI Acid Red 52 in the colorant (dye 1) was 25% by mass.

[0517] (Dye 2) The CI Acid Red 52 was replaced with CI Acid Red 289. Otherwise, the same procedure as for the manufacture of the colorant (dye 1) was followed to obtain a salt compound of CI Acid Red 289 and resin 1 having cationic groups on the side chain, namely the colorant (dye 2). At this time, the content of the effective pigment component derived from CI Acid Red 289 in the colorant (dye 2) was 27% by mass.

[0518] (Dye 3) In a 1 L stainless steel reaction vessel equipped with a circulation tube, under a nitrogen atmosphere, 5.0 parts of Basic Violet CI 10 (BV10: manufactured by Taoka Chemical Industry Co., Ltd.: Rodamine B) and 1.6 parts of hydroxyethyl methacrylate (HEMA) were dissolved in 40 ml of dichloromethane. 2.2 parts of 1-(3-dimethylaminopropyl)-3-ethylcarbodiimide hydrochloride and 0.25 parts of dimethylaminopyridine were added, and the mixture was stirred at room temperature for 24 hours. The resulting dichloromethane solution was washed with water, dried under reduced pressure, and purified using a silicone column to obtain the colorant (dye 3).

[0519] <Preparation of dye solutions A-D1> After mixing the following mixture in a homogeneous manner, filter it using a filter with a pore size of 5.0 μm to prepare the coloring composition (dye solution A-D1). Colorant (Dye 1) 20.0 parts Propylene glycol monomethyl ether acetate (hereinafter referred to as PGMAc) 50.0 parts Solvent (Q) 30.0 parts Furthermore, the solvent (Q) is a mixed solvent (Q) prepared by mixing (Q-1) to (Q-4) in their respective mass parts. (Q-1)PGMAc 33 copies 20 parts of (Q-2)3-methoxybutanol 20 parts of (Q-3) 3-ethoxypropionate ethyl ester (Q-4) 20 parts of butyl acetate

[0520] (Preparation of dye solutions A-D2 and A-D3) Similar to dye solution A-D1, dye solutions A-D2 and A-D3 were prepared using coloring agents (dye 2 and dye 3), respectively.

[0521] Manufacturing of near-infrared absorbing pigments (Near-infrared absorbing pigment (A-NIR1)) 40.0 parts of 1,8-diaminonaphthalene, 32.2 parts of 3,5-dimethylcyclohexanone, and 0.087 parts of p-toluenesulfonic acid monohydrate were mixed in 400 parts of toluene and heated under nitrogen atmosphere with stirring, then refluxed for 3 hours. Water generated during the reaction was removed from the reaction system by azeotropic distillation. After the reaction, the dark brown solid obtained from distilling toluene was extracted with acetone and purified by recrystallization from a mixed solvent of acetone and ethanol. The obtained brown solid was dissolved in a mixed solvent of 240 parts of toluene and 160 parts of n-butanol, and 13.8 parts of 3,4-dihydroxy-3-cyclobutene-1,2-dione were added. The mixture was heated under nitrogen atmosphere with stirring, then refluxed for 8 hours. Water generated during the reaction was removed from the reaction system by azeotropic distillation. After the reaction was completed, the solvent was distilled, and 200 parts of hexane were added while stirring the obtained reaction mixture. After filtering and separating the obtained dark brown precipitate, the mixture was washed successively with hexane, ethanol and acetone, and dried under reduced pressure to obtain the near-infrared absorbing pigment (A-NIR1) represented by the following chemical formula (17). 50 parts of the obtained near-infrared absorbing pigment (A-NIR1), 500 parts of sodium chloride and 60 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Manufacturing Co., Ltd.) and kneaded at 60°C for 12 hours. Next, the kneaded mixture was added to warm water and stirred for 1 hour while heating to about 80°C to form a slurry. After filtration and washing with water to remove sodium chloride and diethylene glycol, the mixture was dried at 80°C for 24 hours and then pulverized to obtain the micronized near-infrared absorbing pigment (A-NIR1).

[0522] [Chemistry 47]

[0523] (Near-infrared absorbing pigment (A-NIR2)) A mixture of 40.0 parts of 1,8-diaminonaphthalene, 50.1 parts of 2-hydroxy-9-fluorenone, and 0.087 parts of p-toluenesulfonic acid monohydrate was prepared in 400 parts of toluene and heated under nitrogen atmosphere with stirring, then refluxed for 3 hours. Water generated during the reaction was removed from the system by azeotropic distillation. After the reaction, the dark brown solid obtained from distilling toluene was extracted with acetone and purified by recrystallization from a mixed solvent of acetone and ethanol. The obtained brown solid was dissolved in a mixed solvent of 240 parts of toluene and 160 parts of n-butanol, and 13.8 parts of 3,4-dihydroxy-3-cyclobutene-1,2-dione were added. The mixture was heated under nitrogen atmosphere with stirring, then refluxed for 8 hours. Water generated during the reaction was removed from the system by azeotropic distillation. After the reaction, the solvent was distilled, and 200 parts of hexane were added while stirring the resulting reaction mixture. After filtering and separating the obtained dark tea-colored precipitate, it was washed sequentially with hexane, ethanol, and acetone, and then dried under reduced pressure to obtain the near-infrared absorbing pigment (A-NIR2) represented by the following chemical formula (18). The near-infrared absorbing pigment (A-NIR2) was then micronized using the same method as A-NIR1 to obtain the micronized near-infrared absorbing pigment (A-NIR2).

[0524] [Chemistry 48]

[0525] (Near-infrared absorbing pigment (A-NIR31)) In a reaction vessel, 890 parts of n-pentyl alcohol, 137 parts of DBU (1,8-diazabicyclo[5.4.0]undec-7-ene), 178 parts of 2,3-dicyanonaphthalene, and 40 parts of aluminum chloride anhydride were mixed and stirred. After heating, the mixture was refluxed at 136°C for 5 hours. While stirring, the reaction solution cooled to 30°C was injected into a mixed solvent containing 5000 parts of methanol and 10000 parts of water to obtain a blue slurry. The slurry was filtered, washed with a mixed solvent containing 2000 parts of methanol and 4000 parts of water, and dried to obtain the compound of the following chemical formula (19). Five parts of diphenyl phosphate were added to 200 parts of N-methylpyrrolidone, and the mixture was stirred thoroughly and heated to 50°C. Ten parts of the compound of the following chemical formula (19) were added little by little to the solution, and the mixture was stirred at 90°C for 120 minutes. The reaction solution was then added to 2000 parts of water, and the resulting precipitate was treated by filtration and washing with water, and then dried to obtain the near-infrared absorbing pigment (A-NIR3) represented by the following chemical formula (20). The near-infrared absorbing pigment (A-NIR3) was micronized by the same method as A-NIR1 to obtain the micronized near-infrared absorbing pigment (A-NIR3).

[0526] [Chemistry 49]

[0527] (Near-infrared absorbing pigment (A-NIR32)) Six parts of bis(4-bromophenyl)phosphoric acid were added to 200 parts of N-methylpyrrolidone, and the mixture was stirred thoroughly and heated to 50°C. Ten parts of the compound of formula (19) were added little by little to the solution, and the mixture was stirred at 90°C for 120 minutes. Subsequently, the reaction solution was added to 2000 parts of water, and the resulting precipitate was treated by filtration and washing with water, and then dried to obtain the near-infrared absorbing pigment (A-NIR32) represented by the following chemical formula (201). The near-infrared absorbing pigment (A-NIR32) was micronized by the same method as A-NIR1 to obtain the micronized near-infrared absorbing pigment (A-NIR32).

[0528] [Transformation 50]

[0529] (Near-infrared absorbing pigment (A-NIR33)) Four parts of diphenylphosphonic acid were added to 200 parts of N-methylpyrrolidone, and the mixture was stirred thoroughly and heated to 50°C. Ten parts of the compound of chemical formula (19) were added little by little to the solution, and the mixture was stirred at 90°C for 120 minutes. Subsequently, the reaction solution was added to 2000 parts of water, and the resulting precipitate was treated by filtration and washing with water, and then dried to obtain the near-infrared absorbing pigment (A-NIR33) represented by the following chemical formula (202). The near-infrared absorbing pigment (A-NIR33) was micronized by the same method as A-NIR1 to obtain the micronized near-infrared absorbing pigment (A-NIR33).

[0530] [Chemistry 51]

[0531] (Near-infrared absorbing pigment (A-NIR4)) According to International Publication No. 2019 / 058882, a near-infrared absorbing pigment (A-NIR4) represented by chemical formula (21) was obtained. The near-infrared absorbing pigment (A-NIR4) was miniaturized by the same method as A-NIR1 to obtain a miniaturized near-infrared absorbing pigment (A-NIR4).

[0532] [Chemistry 52]

[0533] <Manufacturing of Adhesive Resin (B)> (Alkali-soluble adhesive resin (B1-1) solution) 100 parts of propylene glycol monomethyl ether acetate (PGMAc) were placed in a reaction vessel equipped with a thermometer, cooling pipe, nitrogen gas inlet pipe, and stirring device on a separable four-necked flask. While injecting nitrogen gas into the vessel, the temperature was raised to 120°C. At the same temperature, a mixture of 10.4 parts of styrene (St), 85.3 parts of glycidyl methacrylate (GMA), 67.2 parts of dicyclopentyl methacrylate (DCPMA), and 1.0 part of azobisisobutyronitrile (AIBN) was added dropwise over 2.5 hours to carry out the polymerization reaction. Next, the air inside the flask was replaced, and 0.3 parts of tri-dimethylaminomethylphenol and 0.3 parts of hydroquinone were added to 43.2 parts of acrylic acid (hereinafter, AA), and the mixture was reacted at 120°C for 5 hours. This allows the epoxy group of GMA to react with the carboxyl group of AA, introducing a building block (b1-1) derived from the monomer containing the epoxy group (hereinafter, denoted as GMA+AA). Then, 60.8 parts of tetrahydrophthalic anhydride (hereinafter, THPA) and 0.5 parts of triethylamine were added, and the mixture was reacted at 120°C for 4 hours. This caused the hydroxyl groups of GMA-AA to undergo an esterification reaction with THPA, introducing a structure (b1-2) derived from a fatty acid anhydride modified with fatty acid anhydride (hereinafter referred to as GMA+AA+THPA). Subsequently, PGMAc was added with a non-volatile component of 20% to prepare an alkali-soluble adhesive resin solution (B1-1) as a random polymer.

[0534] (Alkali-soluble adhesive resin (B1-2) ~ Alkali-soluble adhesive resin (B1-11)) Alkali-soluble adhesive resins (B1-2) to (B1-11) were synthesized by changing the types and amounts of raw materials and composition ratios as recorded in Tables 1-1 and 1-2, with the addition of PGMAc and the non-volatile component set at 20%. Furthermore, the values ​​in the tables are in moles.

[0535] [Table 1-1] Table 1-1 (B1-1) (B1-2) (B1-3) (B1-4) (B1-5) (B1-6) Derived from monomers containing epoxy groups The constituent unit (b1-1) GMA+AA 20.0% 20.0% 20.0% 20.0% 20.0% 20.0% GMA+AA+THPA 40.0% 40.0% 40.0% 40.0% 40.0% 40.0% The building block containing aromatic ring groups (b2) styrene 10.0% 10.0% 10.0% 10.0% 10.0% 10.0% The building block with aliphatic ring groups (b3) methacrylic acid Dicyclopentyl ester 30.0% 30.0% 30.0% 30.0% 30.0% 30.0% Weight-average molecular weight (Mw) 8000 4000 5000 18000 50000 80000 Acid value (mgKOH / g) 72 72 72 72 72 72 Glass transfer temperature (°C) B B B B B B Double bond equivalent 493 493 493 493 493 493

[0536] [Table 1-2] Table 1-2 (B1-7) (B1-8) (B1-9) (B1-10) (B1-11) Derived from monomers containing epoxy groups The constituent unit (b1-1) GMA+AA 20.0% 20.0% 20.0% 20.0% 20.0% GMA+AA+THPA 40.0% 40.0% 40.0% 40.0% 40.0% The building block containing aromatic ring groups (b2) styrene 10.0% 40.0% 10.0% 10.0% 10.0% The building block with aliphatic ring groups (b3) Dicyclopentenyl methacrylate 30.0% Other constituent units (b5) 2-Ethylhexyl methacrylate 30.0% 2-Methylpropenyloxy -2-Methyladamantane 30.0% Isodecyl methacrylate 30.0% Weight-average molecular weight (Mw) 8000 8000 80000 80000 80000 Acid value (mgKOH / g) 72 72 72 72 72 Glass transfer temperature (°C) B B A C D Double bond equivalent 493 493 493 493 493

[0537] The glass transition temperature (Tg) ranges of the adhesive resins listed in Tables 1-1 and 1-2 are as follows. A: Temperatures above -50℃ and below -10℃ B: Temperature above -10℃ and below 80℃ C: Above 80℃ and below 150℃ D: Less than -50℃ or above 150℃

[0538] (An alkali-soluble adhesive resin solution (Bb-1) containing building blocks with block isocyanate groups) 149.3 g of propylene glycol monomethyl ether was added to a flask containing a stirrer, a dropping funnel, a condenser, a thermometer, and a gas inlet tube. The mixture was stirred while being purged with nitrogen, and the temperature was raised to 78°C. Next, a mixture containing 16.1 g of 2-(3,5-dimethylpyrazol-1-yl)carbonylaminoethyl methacrylate (Karenz MOI-BP, Showa Denko Co., Ltd.), 6.7 g of styrene, 28.2 g of dicyclopentyl methacrylate, 11.0 g of methacrylic acid, 25.3 g of 2-ethylhexyl methacrylate, and 12.8 g of methyl methacrylate was added dropwise to the flask from the dropping funnel. This mixture was then dissolved in 11.2 g of 2,2'-azobis(2,4-dimethylpentanonitrile) (polymerization initiator). After the dropwise addition was completed, the mixture was stirred at 78°C for 3 hours to carry out a copolymerization reaction, generating a random copolymer. Subsequently, propylene glycol monomethyl ether acetate was added at a non-volatile content of 20% to obtain an alkali-soluble adhesive resin solution (Bb-1) containing building blocks with block isocyanate groups. The copolymer in the obtained polymer composition had a weight-average molecular weight of 8,000 and an acid value of 75 KOH mg / g.

[0539] (Alkali-soluble adhesive resin solution containing building blocks with block isocyanate groups (Bb-2) ~ Alkali-soluble adhesive resin solution containing building blocks with block isocyanate groups (Bb-4)) In addition to using the raw materials listed in Table 1-3, random copolymerization was carried out under the same conditions as that for the alkali-soluble adhesive resin solution (Bb-1) containing block isocyanate groups, to obtain alkali-soluble adhesive resin solutions (Bb-2~Bb-4) containing block isocyanate groups. The weight-average molecular weight and acid value of the random copolymers in the obtained polymer compositions are shown in Table 1-3. Furthermore, Karenz MOI-BM in Table 1-3 is 2-[O-(1'-methylpropyleneamino)carboxyamino]ethyl methacrylate (manufactured by Showa Denko Co., Ltd.), and Karenz MOI-DEM is 2-[[[2-methyl-1-oxo-2-propenyl]oxy]ethyl]amino]carbonyl]-1,3-diethyl malonate (manufactured by Showa Denko Co., Ltd.).

[0540] [Table 1-3] Table 1-3 (Bb-1) (Bb-2) (Bb-3) (Bb-4) Containing block isocyanate groups Constituent unit (Bb-1) MOI-BP 10.0% MOI-BM 10.0% MOI-DEM 10.0% 20.0% The building block containing aromatic ring groups (b2) styrene 10.0% 10.0% 10.0% The building block with aliphatic ring groups (b3) Dicyclopentyl methacrylate 20.0% 20.0% 20.0% 10.0% The building block containing a carboxyl group (b4) methacrylic acid 20.0% 20.0% 20.0% 20.0% Other constituent units (b5) 2-Ethylhexyl methacrylate 20.0% 20.0% 20.0% Methyl methacrylate 20.0% 20.0% 20.0% 50.0% Weight-average molecular weight (Mw) 8000 8000 8000 7900 Acid value (mgKOH / g) 75 75 75 111.9

[0541] <Manufacturing of Resin-type Dispersant (Z)> (Alkaline resin-type dispersant (ZB-1) solution) In a reaction apparatus equipped with a gas inlet pipe, condenser, stirring blades, and thermometer, 30 parts of methyl methacrylate, 30 parts of n-butyl methacrylate, 20 parts of hydroxyhexyl methacrylate, and 13.2 parts of tetramethylethyldiamine were added. The mixture was stirred at 50°C for 1 hour while being purged with nitrogen. Next, 9.3 parts of ethyl bromoisobutyrate, 5.6 parts of cuprous chloride, and 133 parts of PGMAc were added. The mixture was heated to 110°C under a nitrogen flow to begin the polymerization of the first block (B-block). After 4 hours of polymerization, the polymerization solution was sampled, and the non-volatile components were determined. Based on the non-volatile components, the polymerization conversion rate was confirmed to be above 98%. Next, 61 parts of PGMAc and 20 parts of 1,2,2,6,6-pentamethylpiperidinyl methacrylate (manufactured by Showa Denko Materials Co., Ltd., Fancryl FA-711MM) as the second block (A block) monomer were added to the reaction apparatus. The mixture was kept at 110°C under nitrogen atmosphere and stirred to continue the reaction. Two hours after the addition of 1,2,2,6,6-pentamethylpiperidinyl methacrylate, the polymerization solution was sampled and the non-volatile components were measured. Based on the conversion of the non-volatile components, it was confirmed that the polymerization conversion rate to the second block (A block) was above 98%. The polymerization was then stopped after the reaction solution was cooled to room temperature. A solution of comb-type resin-type dispersant (ZB-1) with an amine value of 57 mgKOH / g per unit of nonvolatile component, a weight average molecular weight of 6,500, and a weight average molecular weight of 4,500 was obtained by diluting the nonvolatile component with PGMac by means of determination of nonvolatile component to a nonvolatile component content of 30%.

[0542] (Alkaline resin dispersant (ZB-2) solution) In a reaction apparatus equipped with a gas inlet pipe, condenser, stirring blades, and thermometer, 30 parts of methyl methacrylate, 30 parts of n-butyl methacrylate, 20 parts of hydroxyhexyl methacrylate, and 13.2 parts of tetramethylethyldiamine were added. The mixture was stirred at 50°C for 1 hour while being purged with nitrogen. Next, 9.3 parts of ethyl bromoisobutyrate, 0.6 parts of cuprous chloride, and 133 parts of PGMAc were added. The mixture was heated to 110°C under a nitrogen flow to begin the polymerization of the first block (B-block). After 4 hours of polymerization, the polymerization solution was sampled, and the non-volatile components were determined. Based on the non-volatile components, the polymerization conversion rate was confirmed to be above 98%. Next, 61 parts of PGMAc and 20 parts of 1,2,2,6,6-pentamethylpiperidinyl methacrylate (manufactured by Showa Denko Materials Co., Ltd., Fancryl FA-711MM) as the second block (A block) monomer were added to the reaction apparatus. The mixture was kept at 110°C under nitrogen atmosphere and stirred to continue the reaction. Two hours after the addition of 1,2,2,6,6-pentamethylpiperidinyl methacrylate, the polymerization solution was sampled and the non-volatile components were measured. Based on the conversion of the non-volatile components, it was confirmed that the polymerization conversion rate to the second block (A block) was above 98%. The polymerization was then stopped after the reaction solution was cooled to room temperature. A solution of comb-type resin-type dispersant (ZB-2) with an amine value of 58 mgKOH / g per unit of nonvolatile component, a weight average molecular weight of 90,000, and a weight average molecular weight of 69,500 (Mn) was obtained by diluting the nonvolatile component with PGMac by means of determination of nonvolatile component to 30%.

[0543] (Acidic resin-type dispersant (ZA-1) solution) 10 parts of methacrylic acid, 100 parts of methyl methacrylate, 70 parts of isobutyl methacrylate, 20 parts of benzyl methacrylate, and 50 parts of propylene glycol monomethyl ether acetate were loaded into a reaction vessel including a gas inlet pipe, thermometer, condenser, and stirrer, and the mixture was purged with nitrogen gas. The reaction vessel was heated and stirred to 50°C, and 12 parts of 3-mercapto-1,2-propanediol were added. The temperature was raised to 90°C, and a solution prepared by adding 0.1 parts of 2,2'-azobisisobutyronitrile to 90 parts of propylene glycol monomethyl ether acetate was added while reacting for 7 hours. The reaction was confirmed to have reached 95% by the determination of non-volatile components. 19 parts of pyromellitic anhydride, 50 parts of propylene glycol monomethyl ether acetate, 50 parts of cyclohexanone, and 0.4 parts of 1,8-diazabicyclo-[5.4.0]-7-undecene as a catalyst were added, and the reaction was carried out at 100°C for 7 hours. The reaction was terminated after confirming that more than 98% of the anhydride had undergone hemiesterification by determining the acid value. Propylene glycol monomethyl ether acetate was then added to dilute the solution, resulting in a solution of a comb-structured resin-type dispersant (ZA-1) with an acid value of 70 mgKOH / g and a weight average molecular weight of 8,500.

[0544] (Acidic resin-type dispersant (ZA-2) solution) A reaction vessel, including a gas inlet tube, thermometer, condenser, and stirrer, was filled with 80 parts of n-butyl acrylate, 60 parts of methyl methacrylate, 20 parts of methacrylic acid, 20 parts of Karenz MOI-BM (manufactured by Showa Denko Co., Ltd.), 20 parts of ETERNACOLL OXMA (manufactured by UBE Co., Ltd.), and 100 parts of propylene glycol monomethyl ether acetate. The reaction vessel was purged with nitrogen gas. The reaction vessel was heated to 80°C, and a solution prepared by dissolving 0.1 parts of 2,2'-azobisisobutyronitrile in 14 parts of 2-mercapto-2-methyl-1,3-propanediol was added. The reaction was allowed to proceed for 10 hours. The reaction was confirmed to have reached 95% by measuring the non-volatile components. Next, 39 parts of BPAF: 9,9-bis(3,4-dicarboxyphenyl)fluorenic anhydride (manufactured by JFE Chemical Co., Ltd.), 106 parts of C-1015N (difunctional polycarbonate polyol, trade name Kuraray Polyol C-1015N (hydroxyl value 112 mgKOH / g, manufactured by Kuraray Co., Ltd.), 33 parts of trimellitic anhydride, 392 parts of cyclohexanone, and 0.40 parts of 1,8-diazabicyclo-[5.4.0]-7-undecene as a catalyst were added, and the reaction was carried out at 100°C for 7 hours. The reaction was terminated after confirming that more than 98% of the anhydride had undergone hemiesterification by acid value determination. The non-volatile component was adjusted to 30% using propylene glycol monomethyl ether acetate, yielding an acid value of 94. A solution of a block-type resin dispersant (ZA-2) with an aromatic carboxylic acid terminal, containing mgKOH / g and a weight average molecular weight of 25,000.

[0545] (Acidic resin-type dispersant (ZA-3) solution) Six parts of 3-mercapto-1,2-propanediol, 9.7 parts of pyromellitic dianhydride, 23.5 parts of cyclohexanone, and 0.01 parts of mono-n-butyltin(IV) oxide were added to a reaction vessel including a gas inlet pipe, thermometer, condenser, and stirrer, respectively, and the mixture was purged with nitrogen gas. The reaction vessel was heated to 100°C and reacted for 7 hours. After confirming that more than 97% of the anhydrides had undergone hemiesterification by acid value determination, the system was cooled to 70°C, and 80 parts of methyl methacrylate and 20 parts of hydroxyethyl methacrylate were added. A solution prepared by dissolving 0.1 parts of 2,2'-azobisisobutyronitrile in 26.2 parts of cyclohexanone was added, and the reaction was carried out for 10 hours. After confirming that the polymerization had reached 95% by solids composition determination, the reaction was terminated. After the reaction was completed, the non-volatile component was adjusted to 30% using propylene glycol monomethyl ether acetate to obtain a solution of comb-type resin dispersant (ZA-3) with a weight average molecular weight of 9,500.

[0546] (Photocrosslinking acidic resin dispersant (ZAUV-1) solution) 108 parts of 1-thiopropanetriol, 174 parts of pyromellitic anhydride, 650 parts of PGMAc (methoxypropyl acetate), and 0.2 parts of monobutyltin oxide as a catalyst were added to a reaction vessel including a gas inlet pipe, thermometer, condenser, and stirrer. After purging with nitrogen gas, the reaction was carried out at 120°C for 5 hours (first step). The acid value was determined to confirm that more than 95% of the anhydride had undergone hemiesterification. Next, the compound obtained in the first step (converted to non-volatile components) was added, along with 200 parts of 2-hydroxypropyl methacrylate, 200 parts of ethyl acrylate, 150 parts of tributyl acrylate, 200 parts of 2-methoxyethyl acrylate, 200 parts of methyl acrylate, 50 parts of methacrylic acid, and 663 parts of PGMAc. The reaction vessel was heated to 80°C, and 1.2 parts of 2,2'-azobis(2,4-dimethylpentanonitrile) were added. The reaction was carried out for 12 hours (second step). The reaction was confirmed to have reached 95% by determining the non-volatile components. Finally, 500 parts of a 50% PGMAc solution of the compound obtained in step two, 27.0 parts of 2-methacryloxyethyl isocyanate, and 0.1 parts of hydroquinone were added, and the reaction was continued until the peak at 2270 cm⁻¹ based on the isocyanate group disappeared, as confirmed by infrared spectroscopy (IR) (step three). After confirming the disappearance of the peak, the reaction solution was cooled, and the non-volatile components were adjusted using propylene glycol monomethyl ether acetate to obtain a comb-type resin dispersant (ZAUV-1) solution with 30% non-volatile components. The obtained resin dispersant had an acid value of 68, an unsaturated double bond equivalent of 1,593, and a weight-average molecular weight of 13,000.

[0547] <Preparation of Dispersions> (Dispersion 1) After the following raw materials were stirred and mixed in a homogeneous manner, dispersion 1 was prepared by dispersing the mixture for 3 hours using 0.5 mm diameter zirconia beads in an Eiger mill (M-250 MKII mini model manufactured by Eiger Japan Co., Ltd.) and then filtering it with a 1.0 μm pore size filter. Micronized Pigment (A-R177): 11.0 parts Resin-type dispersant (ZAUV-1): 30.0 parts Organic solvent (PGMAc): 59.0 parts

[0548] (Dispersion 2 to Dispersion 36) Except for changing the raw materials and quantities recorded in Tables 2-1 to 2-5, dispersions 2 to 36 are manufactured in the same manner as dispersion 1.

[0549] [Table 2-1] Table 2-1 dispersion 1 dispersion 2 dispersion 3 dispersion 4 dispersion 5 dispersion 6 dispersion 7 dispersion 8 dispersion 9 dispersion 10 Red pigment (A-R177) 11.0 11.0 11.0 11.0 11.0 (A-R254) 11.0 (A-R291) 11.0 Yellow pigment (A-Y1) 11.0 (A-Y2) 11.0 (A-Y3) 11.0 resin type Dispersant (Z) (ZAUV-1) 30.0 30.0 30.0 30.0 30.0 30.0 (ZB-1) 30.0 (ZA-1) 30.0 (ZA-2) 30.0 (ZA-3) 30.0 Organic solvents (Q) PGMAc 59.0 59.0 59.0 59.0 59.0 59.0 59.0 59.0 59.0 59.0

[0550] [Table 2-2] Table 2-2 dispersion 11 dispersion 12 dispersion 13 dispersion 14 dispersion 15 dispersion 16 dispersion 17 dispersion 18 dispersion 19 dispersion 20 Yellow pigment (A-Y138) 11.0 (A-Y139) 11.0 (A-Y150) 11.0 Green pigment (A-Y4) 11.0 (A-Y185) 11.0 (A-G58) 11.0 (A-G59) 11.0 (A-G63) 11.0 (A-G7) 11.0 Blue pigment (A-G36) 11.0 resin type Dispersant (Z) (ZAUV-1) 30.0 30.0 30.0 30.0 30.0 30.0 30.0 30.0 30.0 30.0 Organic solvents (Q) PGMAc 59.0 59.0 59.0 59.0 59.0 59.0 59.0 59.0 59.0 59.0

[0551] [Table 2-3] Table 2-3 dispersion twenty one dispersion twenty two dispersion twenty three dispersion twenty four dispersion 25 dispersion 26 dispersion 27 dispersion 28 dispersion 29 dispersion 30 Green pigment (A-B156) 11.0 Blue pigment (A-B153) 11.0 Purple pigment (A-V23) 11.0 dye solution (A-D1) 20.0 (A-D2) 20.0 (A-D3) 20.0 Near-infrared Absorbing pigments (A-NIR1) 11.0 (A-NIR2) 11.0 (A-NIR3) 11.0 (A-NIR4) 11.0 resin type Dispersant (Z) (ZAUV-1) 30.0 30.0 30.0 30.0 30.0 30.0 30.0 Organic solvents (Q) PGMAc 59.0 59.0 50.0 50.0 50.0 59.0 59.0 59.0 59.0 59.0 (Q-1) 30.0 30.0 30.0

[0552] [Table 2-4] Table 2-4 Dispersion 31 Green pigment (A-G36) 11.0 Resin-type dispersants (Z) BYK-161 30.0 Organic solvents (Q) PGMAc 59.0

[0553] [Table 2-5] Table 2-5 Dispersion 32 Dispersion 33 Dispersion 34 Dispersion 35 Dispersion 36 Green pigment (A-G36) 11.0 11.0 9.0 13.6 Green pigment (A-G62) 11.0 Resin-type dispersants (Z) BYK-161 30.0 (ZB-1) 30.0 (ZB-2) 30.0 (ZAUV-1) 45.0 11.4 Organic solvents (Q) PGMAc 59.0 59.0 59.0 46.0 75.0

[0554] The raw materials listed in Tables 2-1 to 2-5 are as follows.

[0555] [Organic Solvent (Q)] PGMAc: Propylene glycol monomethyl ether acetate Q-1: A mixture of 60 parts propylene glycol monomethyl ether acetate, 10 parts 2-butanol, 10 parts n-butyl acetate, 10 parts propylene glycol monomethyl ether, and 10 parts isobutyl alcohol. [Resin-type dispersant (Z)] (ZB-3): Disperbyk 161; an alkaline dispersant with a weight average molecular weight of 100,000; manufactured by BYK-Chemie.

[0556] <Manufacturing of Photosensitive Components> [Comparative Example 1] (Photosensitive component 1) The following raw materials are mixed and stirred, and then filtered using a filter with a pore size of 1.0 μm to produce photosensitive component 1. Dispersion 31: 40.91 parts Adhesive resin solution (Bb-4): 10.09 parts Polymerizable compound (C-1): 4.50 parts Photopolymerization initiator (D2): 0.30 parts Organic solvent (PGMAc): 44.20 parts

[0557] [Comparative Example 2] (Photosensitive component 2) Except that the photosensitive component 1 of Comparative Example 1 was changed to the raw materials and amounts listed in Table 3-1, photosensitive component 2 was manufactured in the same manner as in Comparative Example 1.

[0558] [Example 1] (Photosensitive component 3) The following raw materials are mixed and stirred, and then filtered using a filter with a pore size of 1.0 μm to produce photosensitive component 3. Dispersion 31: 40.91 parts Adhesive resin solution (Bb-4): 10.04 parts Polymerizable compound (C-1): 4.50 parts Photopolymerization initiator (D1-4-1): 0.30 parts Leveling agent (E-1): 1.00 part Organic solvent (PGMAc): 43.25 parts

[0559] [Examples 2 to 94] (Photosensitive components 4 to 96) Except that the photosensitive composition 3 of Example 1 is changed to the raw materials and amounts listed in Tables 3-1 to 3-11, photosensitive compositions 4 to 98 are manufactured in the same manner as in Example 1. In the tables, the alkali-soluble adhesive resin solution (Bb) containing the constituent unit having block isocyanate groups is listed as adhesive resin solution (Bb), and the alkali-soluble adhesive resin (B1) is listed as adhesive resin (B1).

[0560] [Table 3-1] Table 3-1 Comparative Example 1 Comparative Example 2 Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Photosensitivity Composition 1 Photosensitivity Composition 2 Photosensitivity Composition 3 Photosensitivity Composition 4 Photosensitivity Composition 5 Photosensitivity Composition 6 Photosensitivity Composition 7 Photosensitivity Composition 8 Photosensitivity Composition 9 Photosensitivity Composition 10 dispersion 31 40.91 40.91 40.91 20 40.91 40.91 40.91 40.91 40.91 40.91 40.91 Adhesive resin solution (Bb) (Bb-4) 10.09 10.04 10.04 10.04 (Bb-1) 10.04 (Bb-2) 10.04 (Bb-3) 10.04 5.02 5.02 5.02 Adhesive resin (B1) (B1-1) 5.02 5.02 5.02 Polymerizable compounds (C) (C-1) 4.50 4.50 4.50 4.50 4.50 4.50 4.50 4.50 4.50 4.50 Photopolymerization initiator (D) (D2) 0.30 0.30 (D1-4-1) 0.30 0.30 0.30 0.30 0.30 (D1-1-1) 0.30 (D1-1-2) 0.30 (D1-1-3) 0.30 Leveling agent (E) (E-1) 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 Organic solvents (Q) PGMAc 44.20 43.25 43.25 43.25 43.25 43.25 43.25 43.25 43.25 43.25 Polymerizing compound (C) / Adhesive resin (B) 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 X 2.02 2.01 2.01 2.01 2.01 2.01 2.01 1.00 1.00 1.00 Y 3.7 3.7 3.7 3.7 3.7 3.7 3.7 4.7 4.7 4.7 X / Y 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.21 0.21 0.21

[0561] [Table 3-2] Table 3-2 Example 9 Example 10 Example 11 Example 12 Example 13 Example 14 Example 15 Example 16 Example 17 Example 18 Photosensitivity Composition 11 Photosensitivity Composition 12 Photosensitivity Composition 13 Photosensitivity Composition 14 Photosensitivity Composition 15 Photosensitivity Composition 16 Photosensitivity Composition 17 Photosensitivity Composition 18 Photosensitivity Composition 19 Photosensitivity Composition 20 dispersion 20 40.91 40.91 40.91 40.91 40.91 40.91 40.91 40.91 40.91 40.91 Adhesive resin solution (Bb) (Bb-3) 5.02 5.02 5.02 5.02 5.02 5.02 5.02 5.02 5.02 5.02 Adhesive resin (B1) (B1-1) 5.02 5.02 5.02 5.02 5.02 5.02 5.02 5.02 5.02 5.02 Polymerizable compounds (C) (C-1) 4.50 4.50 4.50 4.50 4.50 4.50 4.50 4.50 4.50 4.50 Photopolymerization initiator (D) (D1-1-4) 0.30 (D1-2-1) 0.30 (D1-2-2) 0.30 (D1-2-3) 0.30 (D1-2-4) 0.30 (D1-3-1) 0.30 (D1-3-2) 0.30 (D1-3-3) 0.30 (D1-4-1) 0.30 (D1-4-2) 0.30 Leveling agent (E) (E-1) 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 Organic solvents (Q) PGMAc 43.25 43.25 43.25 43.25 43.25 43.25 43.25 43.25 43.25 43.25 Polymerizing compound (C) / Adhesive resin (B) 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 X 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 Y 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 X / Y 0.21 0.21 0.21 0.21 0.21 0.21 0.21 0.21 0.21 0.21

[0562] [Table 3-3] Table 3-3 Example 19 Example 20 Example 21 Example 22 Example 23 Example 24 Example 25 Example 26 Example 27 Example 28 Photosensitivity Composition 21 Photosensitivity Composition 22 Photosensitivity Composition 23 Photosensitivity Composition 24 Photosensitivity Composition 25 Photosensitivity Composition 26 Photosensitivity Composition 27 Photosensitivity Composition 28 Photosensitivity Composition 29 Photosensitivity Composition 30 dispersion 20 40.91 40.91 40.91 40.91 40.91 40.91 40.91 40.91 40.91 40.91 Adhesive resin solution (Bb) (Bb-3) 5.02 5.02 5.02 5.02 5.02 5.02 5.02 5.02 5.02 5.02 Adhesive resin (B1) (B1-1) 5.02 5.02 5.02 5.02 5.02 (B1-2) 5.02 (B1-3) 5.02 (B1-4) 5.02 (B1-5) 5.02 (B1-6) 5.02 Polymerizable compounds (C) (C-1) 4.50 4.50 4.50 4.50 4.50 4.50 4.50 4.50 4.50 4.50 Photopolymerization initiator (D) (D1-1-2) 0.30 0.30 0.30 0.30 0.30 (D1-4-3) 0.30 (D1-4-4) 0.30 (D1-5-5) 0.30 (D1-5-6) 0.30 (D1-5-7) 0.30 Leveling agent (E) (E-1) 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 Organic solvents (Q) PGMAc 43.25 43.25 43.25 43.25 43.25 43.25 43.25 43.25 43.25 43.25 Polymerizing compound (C) / Adhesive resin (B) 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 X 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 Y 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 X / Y 0.21 0.21 0.21 0.21 0.21 0.21 0.21 0.21 0.21 0.21

[0563] [Table 3-4] Table 3-4 Example 29 Example 30 Example 31 Example 32 Example 33 Example 34 Example 35 Example 36 Example 37 Example 38 Photosensitivity Composition 31 Photosensitivity Composition 32 Photosensitivity Composition 33 Photosensitivity Composition 34 Photosensitivity Composition 35 Photosensitivity Composition 36 Photosensitivity Composition 37 Photosensitivity Composition 38 Photosensitivity Composition 39 Photosensitivity Composition 40 dispersion 20 40.91 40.91 40.91 40.91 40.91 40.91 40.91 1 40.91 2 40.91 3 40.91 Adhesive resin solution (Bb) (Bb-3) 5.02 5.02 5.02 5.02 5.02 5.02 5.02 5.02 5.02 5.02 Adhesive resin (B1) (B1-1) 5.02 5.02 5.02 5.02 5.02 (B1-7) 5.02 (B1-8) 5.02 (B1-9) 5.02 (B1-10) 5.02 (B1-11) 5.02 Polymerizable compounds (C) (C-1) 4.50 4.50 4.50 4.50 4.50 4.50 4.50 4.50 4.50 4.50 Photopolymerization initiator (D) (D1-1-2) 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 Leveling agent (E) (E-1) 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 (E-2) 1.00 Organic solvents (Q) PGMAc 43.25 43.25 43.25 43.25 43.25 43.25 43.25 43.25 43.25 43.25 Polymerizing compound (C) / Adhesive resin (B) 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 X 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 Y 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 X / Y 0.21 0.21 0.21 0.21 0.21 0.21 0.21 0.21 0.21 0.21

[0564] [Table 3-5] Table 3-5 Implementation Example 39 Implementation Example 40 Implementation Example 41 Implementation Example 42 Implementation Example 43 Implementation Example 44 Implementation Example 45 Implementation Example 46 Implementation Example 47 Photosensitivity Composition 41 Photosensitivity Composition 42 Photosensitivity Composition 43 Photosensitivity Composition 44 Photosensitivity Composition 45 Photosensitivity Composition 46 Photosensitivity Composition 47 Photosensitivity Composition 48 Photosensitivity Composition 49 dispersion 1 20.45 10.23 20.05 16.36 2 3 4 5 40.91 6 20.45 20.45 20.05 16.36 7 10.23 twenty one 0.82 12 8.18 16 16.36 17 16.36 18 20.45 19 12.27 12.27 20 12.27 12.27 twenty two 4.09 8 9 10 12 8.18 20.45 4.09 8.18 13 4.09 14 4.09 15 8.18 Adhesive resin solution (Bb) (Bb-3) 5.02 5.02 5.02 5.02 5.02 5.02 5.02 5.02 5.02 Adhesive resin (B1) (B1-1) 5.02 5.02 5.02 5.02 5.02 5.02 5.02 5.02 5.02 Polymerizable compounds (C) (C-1) 4.50 4.50 4.50 4.50 4.50 4.50 4.50 4.50 4.50 Photopolymerization initiator (D) (D1-1-2) 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 Leveling agent (E) (E-1) 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 Organic solvents (Q) PGMAc 43.25 43.25 43.25 43.25 43.25 43.25 43.25 43.25 43.25 Polymerizing compound (C) / Adhesive resin (B) 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 X 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 Y 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 X / Y 0.21 0.21 0.21 0.21 0.21 0.21 0.21 0.21 0.21

[0565] [Table 3-6] Table 3-6 Example 48 Example 49 Example 50 Example 51 Example 52 Example 53 Photosensitivity Composition 50 Photosensitivity Composition 51 Photosensitivity Composition 52 Photosensitivity Composition 53 Photosensitivity Composition 54 Photosensitivity Composition 55 dispersion 1 2.05 8 4.09 9 4.09 10 4.09 20 28.64 8.18 twenty one 28.64 16.36 24.55 34.77 16.36 twenty two 12.27 16.36 8.18 twenty three 8.18 6.14 16.36 twenty four 1.13 25 1.13 26 1.13 27 28 29 30 Adhesive resin solution (Bb) (Bb-3) 5.02 5.02 5.02 5.02 6.40 5.02 Adhesive resin (B1) (B1-1) 5.02 5.02 5.02 5.02 6.40 5.02 Polymerizable compounds (C) (C-1) 4.50 4.50 4.50 4.50 4.50 4.50 Photopolymerization initiator (D) (D1-1-2) 0.30 0.30 0.30 0.30 0.30 0.30 Leveling agent (E) (E-1) 1.00 1.00 1.00 1.00 1.00 1.00 Organic solvents (Q) PGMAc 43.25 43.25 43.25 43.25 43.25 43.25 Polymerizing compound (C) / Adhesive resin (B) 2.2 2.2 2.2 2.2 1.8 2.2 X 1.00 1.00 1.00 1.00 1.28 1.00 Y 4.7 4.7 4.7 4.7 4.4 4.7 X / Y 0.21 0.21 0.21 0.21 0.29 0.21

[0566] [Table 3-7] Table 3-7 Example 54 Example 55 Example 56 Example 57 Photosensitivity Composition 56 Photosensitivity Composition 57 Photosensitivity Composition 58 Photosensitivity Composition 59 dispersion 20 40.91 40.91 40.91 40.91 Adhesive resin solution (Bb) (Bb-3) 1.00 2.51 7.53 9.04 Adhesive resin (B1) (B1-1) 9.04 7.53 2.51 1.00 Polymerizable compounds (C) (C-1) 4.50 4.50 4.50 4.50 Photopolymerization initiator (D) (D1-1-2) 0.30 0.30 0.30 0.30 Leveling agent (E) (E-1) 1.00 1.00 1.00 1.00 Organic solvents (Q) PGMAc 43.25 43.25 43.25 43.25 Polymerizing compound (C) / Adhesive resin (B) 2.2 2.2 2.2 2.2 X 0.20 0.50 1.51 1.81 Y 5.5 5.2 4.2 3.9 X / Y 0.04 0.10 0.36 0.47

[0567] [Table 3-8] Table 3-8 Example 58 Example 59 Example 60 Example 61 Example 62 Example 63 Example 64 Example 65 Example 66 Example 67 Photosensitivity Composition 60 Photosensitivity Composition 61 Photosensitivity Composition 62 Photosensitivity Composition 63 Photosensitivity Composition 64 Photosensitivity Composition 65 Photosensitivity Composition 66 Photosensitivity Composition 67 Photosensitivity Composition 68 Photosensitivity Composition 69 dispersion 20 40.91 40.91 40.91 40.91 16.36 40.91 40....

Claims

1. A photosensitive composition comprising: a pigment, an adhesive resin, a polymerizable compound, a photopolymerization initiator, a resin-type dispersant, and a leveling agent, wherein the adhesive resin comprises an alkali-soluble adhesive resin (Bb) containing constituent units having block isocyanate groups, and an alkali-soluble adhesive resin (B1) not containing constituent units having block isocyanate groups, wherein the alkali-soluble adhesive resin (B1) has a glass transition temperature of -10°C to 80°C. The photopolymerization initiator comprises an O-acyloxime ester-based photopolymerization initiator, wherein the O-acyloxime ester-based photopolymerization initiator comprises one or more selected from the group consisting of the following chemical formulas (1-1) to (1-12), (2-1) to (2-4), (3-1) to (3-3), (4-1) to (4-6), (5-1) to (5-3), (5-5) to (5-7), (6-1) to (6-4) and (7-1) to (7-7).

2. The photosensitive composition as described in claim 1, wherein, The photosensitive composition is applied and dried at 90°C for 1 minute to form a film with a thickness of 3 μm. After exposure to ultraviolet light at an illuminance of 500 mW / cm² and an irradiation dose of 200 mJ / cm², the hardened film formed by heating at 90°C for 30 minutes has a residual film rate of 75% or more. The residual film rate is calculated as follows: (thickness of the hardened film formed by heating at 90°C for 30 minutes) ÷ (thickness of the hardened film exposed to ultraviolet light before heating at 90°C for 30 minutes) × 100.

3. The photosensitive composition as described in claim 1 or claim 2, wherein, The polymeric compounds include polymeric compounds containing base-soluble groups.

4. The photosensitive composition as described in claim 1 or claim 2, wherein, The resin-type dispersant includes an acidic resin-type dispersant.

5. The photosensitive composition as described in claim 4, wherein, The acidic resin type dispersant includes a photocrosslinking acidic resin type dispersant.

6. The photosensitive composition as described in claim 1 or claim 2, wherein, The content of the alkali-soluble adhesive resin (B1) is 5 to 95 parts by weight per 100 parts by weight of the adhesive resin.

7. A hardened film, which is a hardened form of the photosensitive composition as described in any one of claims 1 to 6.

8. A color filter having a hardened film as described in claim 7.

9. An optical filter having a hardened film as described in claim 7.

10. An image display device having a hardened film as described in claim 7.

11. A solid-state imaging element having a hardened film as described in claim 7.

12. An infrared sensor having a hardened film as described in claim 7.

Images