Processing equipment

Abstract

[Problem] To provide a processing apparatus capable of clearly capturing the edge of a workpiece. [Solution] A processing apparatus comprising: a holding stage having a holding surface for holding a workpiece, the holding surface being smaller than the workpiece; a processing unit for processing the workpiece held on the holding stage; a camera unit for capturing images of the workpiece held on the holding stage; and a control unit. The holding stage has a reflective unit surrounding the holding surface, the reflective unit being positionable below the edge of the workpiece held on the holding surface, at least a portion of the reflective unit being formed of a reflective member, and the edge of the workpiece being captured by the camera unit while positioned above the reflective member.

Description

[Technical Field]

[0001] This invention relates to a processing apparatus. [Previous Technology]

[0002] There is a method in a processing apparatus that divides a workpiece into individual component wafers, wherein, while the workpiece is held on a holding stage, a camera unit captures images of multiple points along the edges of the workpiece, and the edges are detected by image processing. The center of the workpiece is then calculated from the coordinates of the detected multiple edges. For example, Patent Document 1 discloses a technique that captures and detects three or more points along the outer edge of a wafer to detect the center. [Contemporary Art Documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2011-249572. [Summary of the Invention]

[0004] [Problem to be Solved by the Invention] Conventional processing apparatuses struggle to clearly capture the edges of the workpiece while it is held on a holding table. In particular, when removing the outer periphery of the workpiece with a cutting blade, the processing apparatus forms the holding surface smaller than the workpiece to prevent the cutting blade from contacting it. In this case, conventional processing apparatuses lack a supporting member below the edge of the workpiece, thus there is a possibility that the image obtained from capturing the edge of the workpiece will be blurry, and the edge of the workpiece in the image will become indistinct.

[0005] Therefore, the object of the present invention is to provide a processing apparatus that can clearly capture the edge of the workpiece.

[0006] [Technical Means for Solving the Problem] According to the present invention, a processing apparatus is provided, comprising: a holding table having a holding surface for holding a workpiece, the holding surface being smaller than the workpiece; a processing unit for processing the workpiece held on the holding table; a camera unit for photographing the workpiece held on the holding table; and a control unit, wherein the holding table has a reflecting unit surrounding the holding surface, the reflecting unit being positioned below the edge of the workpiece held on the holding surface, at least a portion of the reflecting unit being formed of a reflecting member, and being photographed by the camera unit while the edge of the workpiece is positioned above the reflecting member.

[0007] Preferably, the camera unit captures multiple images of the edge of the workpiece positioned above the reflective member, and the control unit calculates the coordinates of the edge from the captured images and determines the center position of the workpiece.

[0008] Preferably, the cutting blade of the processing unit is positioned inside the edge of the workpiece at a predetermined distance, with the center position as a reference, and the holding table is rotated relative to the cutting blade to remove the outer periphery of the workpiece.

[0009] Preferably, the reflective element is positioned below the retaining surface.

[0010] Preferably, the workpiece is supported by the opening of the annular frame through a thin sheet, and the reflective unit is a frame support unit that supports the annular frame.

[0011] [Effect of the Invention] The present invention has the effect of clearly capturing the edges of the workpiece.

Implementation Method

[0013] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the constituent elements described below include those readily conceived by those skilled in the art to which this invention pertains and are substantially the same. Moreover, the configurations described below can be appropriately combined. Furthermore, various omissions, substitutions, or modifications to the configuration can be made without departing from the spirit of the present invention.

[0014] In the embodiments described below, an XYZ vertical coordinate system is established, and the positional relationships of each part are described with reference to this XYZ vertical coordinate system. A direction in the horizontal plane is designated as the X-axis direction, a direction in the horizontal plane perpendicular to the X-axis direction is designated as the Y-axis direction, and a direction orthogonal to both the X-axis and Y-axis directions is designated as the Z-axis direction. The XY plane system, including the X-axis and Y-axis, is parallel to the horizontal plane. The Z-axis direction, perpendicular to the XY plane, is the vertical direction.

[0015] Based on the drawings, an example of a processing apparatus for processing a workpiece according to the embodiment will be described. FIG1 is a perspective view showing an example of the configuration of the processing apparatus according to the embodiment. FIG2 is a perspective view showing the workpiece to be processed by the processing apparatus shown in FIG1. ​​FIG3 is a perspective view showing an example of the holding table shown in FIG1. ​​FIG4 is a side view schematic diagram for explaining the relationship between the holding table, the workpiece, and the processing unit shown in FIG3. FIG5 is a cross-sectional schematic diagram illustrating an example of the camera unit shown in FIG1.

[0016] The processing apparatus 1 shown in FIG. 1 of the embodiment is a cutting apparatus that cuts the workpiece 200 shown in FIG. 2 into individual components 204 by using a cutting blade 21. In the embodiment, the workpiece 200 is a wafer such as a circular semiconductor wafer or an optical element wafer with silicon, sapphire, gallium, etc. as a substrate 201. The workpiece 200 has components 204 formed in a grid-like area divided by multiple predetermined dividing lines 203, which are formed in a grid-like manner on the upper surface 202 of the substrate 201. The upper surface 202 of the substrate 201 is held on the surface of the substrate 201 of the workpiece 200 on the holding table 10.

[0017] Furthermore, the workpiece 200 in the embodiment can be a so-called TAIKO (registered trademark) wafer with a thinned central portion and a thickened outer periphery. Besides wafers, it can also be a substrate such as a rectangular packaging substrate having multiple resin-sealed components, a ceramic substrate without components 204 and predetermined dividing lines 203, a ferrite substrate, or a substrate containing at least one of a glass plate or nickel and iron. In the embodiment, the workpiece 200 has a sheet 211 adhered to its back surface 205 and is supported by an annular frame 210, the sheet 211 having an annular frame 210 mounted on its outer periphery. The sheet 211 may include, for example, an adhesive film or an adhesive sheet. The workpiece unit 250 supports the workpiece 200 in the opening of the annular frame 210 through the sheet 211.

[0018] (Processing Apparatus) As shown in FIG. 1, the processing apparatus 1 of the embodiment includes: a holding table 10, a processing unit 20, a camera unit 30, a moving unit 40, and a control unit 100. The holding table 10 attracts and holds the workpiece 200 with its holding surface 11. The processing unit 20 cuts the workpiece 200 held by the holding table 10 with a cutting blade 21 mounted on the spindle 22. The camera unit 30 captures images of the workpiece 200 held by the holding table 10. The moving unit 40 moves the holding table 10 and the processing unit 20 relative to each other. The control unit 100 controls each component of the processing apparatus 1.

[0019] The moving unit 40 includes at least: an X-axis moving unit 42, which feeds the holding table 10 in the X-axis direction parallel to the horizontal direction; a Y-axis moving unit 41, which feeds the machining unit 20 and the camera unit 30 in the Y-axis direction parallel to the horizontal direction and perpendicular to the X-axis direction; and a Z-axis moving unit 43, which feeds the machining unit 20 and the camera unit 30 in the Z-axis direction.

[0020] The X-axis moving unit 42 moves the holding table 10 in the X-axis direction, thereby performing machining feed relative to the machining unit 20 along the X-axis direction. The Y-axis moving unit 41 moves the machining unit 20 in the indexing feed direction, i.e., the Y-axis direction, thereby performing indexing feed relative to the holding table 10 and the machining unit 20 along the Y-axis direction. The Z-axis moving unit 43 moves the machining unit 20 in the cutting feed direction, i.e., the Z-axis direction, thereby performing cutting feed relative to the holding table 10 and the machining unit 20 along the Z-axis direction.

[0021] The holding table 10 holds the workpiece 200 in a disc shape, with the holding surface 11 formed of porous ceramic or the like. The holding table 10 is configured to move freely in the X-axis direction by means of the X-axis moving unit 42 and to rotate freely about an axis parallel to the Z-axis direction by means of a rotation drive source (not shown). The holding surface 11 of the holding table 10 is connected to a vacuum suction source (not shown). The workpiece 200, which is integral with the annular frame 210, is placed on the holding surface 11 through a thin sheet 211, and the workpiece 200, which is integral with the annular frame 210, is held by the vacuum suction source by attracting the holding surface 11.

[0022] As shown in Figures 3 and 4, the holding table 10 has a reflective unit 12 surrounding the holding surface 11. The reflective unit 12 can be positioned below the edge of the workpiece 200 held on the holding surface 11. In this embodiment, the reflective unit 12 is a support unit that supports the workpiece 200 held on the holding surface 11. Multiple reflective units 12 contact the workpiece 200 protruding outward from the holding surface 11 and directly support it from below in the vertical direction. Alternatively, multiple reflective units 12 may not directly contact the workpiece 200 but may only be positioned below the edge of the workpiece 200. In the example shown in Figure 3, although the case where the holding table 10 has four reflective units 12 is described, it can also be configured to have one or more reflective units 12. For example, when there is one reflective unit 12, it can be a ring-shaped member surrounding the holding surface 11; when there are two or more, it can be multiple members arranged along the outer edge of the holding surface 11.

[0023] The reflective unit 12 in this invention has a frame support portion 120, which supports an annular frame 210 of a workpiece 200 protruding outward from the holding surface 11 of the holding table 10. The frame support portion 120 has: a mounting portion 121 on which the annular frame 210 is mounted; and a pushing member 122 that rotates about a horizontal axis of rotation relative to the mounting portion 121. The frame support portion 120 is configured such that the pushing member 122 rotates to press the annular frame 210 against the mounting portion 121 and supports the annular frame 210. The frame support portion 120 is configured to be positioned below the edge of the workpiece 200 held on the holding surface 11 of the holding table 10. The frame support 120 is mounted on a guide rail 13 such that it can move radially (horizontally) along the holding surface 11 of the holding platform 10. The guide rail 13 extends horizontally from the lower part of the holding surface 11 of the holding platform 10. The frame support 120 can be moved automatically by a drive means not shown, or it can be moved by an operator.

[0024] At least a portion of the reflective unit 12 is formed of a reflective member. The reflective member may include, for example, a metal member such as SUS (Steel Use Stainless), or a coating provided as a reflective layer on the surface of the reflective unit 12. The reflective unit 12 is photographed by the imaging unit with the edge of the workpiece 200 positioned above the reflective member. In this embodiment, the reflective unit 12 has a reflective portion 123 formed with a reflective member on at least its upper surface. The reflective portion 123 may include, for example, a mounting surface of the mounting portion 121, and a surface of the pushing member 122 overlapping the mounting portion 121. The reflective portion 123 includes surfaces that are visible from above in the vertical direction of the processing apparatus 1 when the pushing member 122 is pushed (overlapped) onto the mounting portion 121, and surfaces that are photographed together with the workpiece 200. The reflective part 123 of the reflective unit 12 moves on the guide rail 13 via the frame support part 120, and even if the size of the annular frame 210 is changed, it can be positioned to overlap the edge (outer periphery) of the workpiece 200 when viewed from above.

[0025] In the case of full cut trimming of the outer periphery of the workpiece 200, the ring frame 210 is not used in most cases, but in order to cope with both the use and non-use of the ring frame 210, the processing device 1 is equipped with a movable frame support 120.

[0026] As shown in FIG. 4, the processing unit 20 is a unit rotatably equipped with a cutting blade 21, which cuts the workpiece 200 held on the holding table 10. The processing unit 20 is able to position the cutting blade 21 at any position on the holding surface 11 of the holding table 10 by means of a Y-axis moving unit 41 and a Z-axis moving unit 43. The processing unit 20 includes a cutting blade 21 and a spindle 22. The cutting blade 21 is fixed to the front end of the spindle 22 and rotates about an axis parallel to the Y-axis direction as the spindle 22 rotates. The spindle 22 is supported on the spindle housing and housed within the spindle housing with its front end exposed to the outside of the spindle housing, and is rotatably supported about an axis parallel to the Y-axis direction.

[0027] As shown in FIG1, the camera unit 30 is fixed to the processing unit 20 in a manner that allows it to move integrally with the processing unit 20. In this embodiment, the camera unit 30 is positioned parallel to the processing unit 20 in the X-axis direction. As shown in FIG5, the camera unit 30 includes: a housing 34 that houses an objective lens 31 facing the workpiece 200 held on the holding table 10, and has an opening 33 formed at its bottom 32 facing the workpiece 200; a flat protective plate 35 that covers the opening 33 and is made of a transparent body; and a camera device 36.

[0028] The housing 34 houses the objective lens 31 in its lower end. In this embodiment, the housing 34 is formed as a quadrangular cylinder and is mounted on the processing unit 20. The opening 33 extends through the bottom 32 of the housing 34 and, in this embodiment, is formed as a circle and is located at the center of the bottom 32. The protective plate 35 is formed as a quadrangular shape with the same shape as the bottom 32 of the housing 34 in plan view. The protective plate 35 is fixed to the lower surface of the bottom 32 of the housing 34. In this embodiment, the protective plate 35 is fixed to the lower surface of the bottom 32 by means of an adhesive and seals the opening 33, thereby preventing the intrusion of mist formed from cutting chips and cutting water from the opening 33 into the housing 34.

[0029] A camera device 36 is mounted on the upper end of the housing 34 and captures images of the area to be divided of the workpiece 200 held on the holding table 10 before cutting, through an objective lens 31, an opening 33, and a protective plate 35. The camera device 36 includes, for example, a CCD (Charge-Coupled Device) or a CMOS (Complementary Metal-Oxide-Semiconductor) camera element. The camera device 36 captures images of the workpiece 200 held on the holding table 10 to obtain images for performing alignment, etc., and outputs the obtained images to the control unit 100. The alignment refers to the alignment of the workpiece 200 with the cutting blade 21.

[0030] Furthermore, the housing 34 houses: a light source 38 that emits light through the objective lens 31, the opening 33, and the protective plate 35 to illuminate the workpiece 200 held on the holding stage 10; and a double-sided mirror 39 that reflects the light emitted by the light source 38 toward the objective lens 31, allowing the camera unit 30 to photograph the workpiece 200 on the holding stage 10 through the objective lens 31, etc. In the embodiment, the light source 38 is a light-emitting element such as an LED (Light Emitting Diode), but in the present invention, it may also be an optical fiber for transmitting light emitted by a light-emitting element such as an LED.

[0031] Referring back to Figure 1, the control unit 100 controls the aforementioned components of the processing apparatus 1, thereby enabling the processing apparatus 1 to perform processing operations on the workpiece 200. Furthermore, the control unit 100 is a computer. The control unit 100 includes: a calculation processing unit having a microprocessor such as a CPU (Central Processing Unit); a memory unit having memory such as ROM (Read Only Memory) or RAM (Random Access Memory); and an input / output interface device. The calculation processing unit of the control unit 100 performs calculation processing according to a computer program stored in the memory unit, and outputs control signals for controlling the processing apparatus 1 to the aforementioned components of the processing apparatus 1 through the input / output interface device. The control unit 100 controls the processing, imaging, etc., of the workpiece 200 by executing the program.

[0032] Furthermore, the control unit 100 is connected to a display unit (not shown) and an input unit (not shown). The display unit is configured as a liquid crystal display device or the like that that displays the status or images of the processing operation. The input unit is used when the operator logs in processing content information. The input unit is configured as at least one of an external input device such as a touch panel or a keyboard provided on the display unit.

[0033] The control unit 100 provides the function of controlling the processing of the workpiece 200 held on the holding surface 11. For example, the control unit 100 moves the holding table 10 and the processing unit 20 relative to each other along a predetermined dividing line by means of the X-axis moving unit 42, the Y-axis moving unit 41 and the Z-axis moving unit 43, thereby cutting the workpiece 200 held on the holding table 10 along the predetermined dividing line. When the frame support 120 has a drive source (not shown), the control unit 100 performs control to position the reflector 123 of the reflector 12 below the edge 206 of the workpiece 200. Furthermore, the control unit 100 provides the following function: positioning the camera unit 30 at the camera position by means of the X-axis moving unit 42, the Y-axis moving unit 41 and the Z-axis moving unit 43, and calculating the coordinates of the edge of the workpiece 200 from the image captured by the camera unit 30, thereby determining the center of the workpiece 200. For example, the control unit 100 can use the technology described in Japanese Patent Application Publication No. 2011-249572 to detect the center of the workpiece 200. The control unit 100 controls the camera unit 30 to capture the edge 206 of the workpiece 200 while the edge 206 of the workpiece 200 is positioned above the reflective portion 123 of the reflective unit 12.

[0034] The above describes a configuration example of the processing apparatus 1 according to this embodiment. Furthermore, the configuration described above using Figures 1 to 5 is only one example, and the configuration of the processing apparatus 1 according to this embodiment is not limited to this example. The functional configuration of the processing apparatus 1 according to this embodiment can be flexibly varied according to specifications or applications.

[0035] (Image Capture Method of the Processing Apparatus) Next, the image capture method performed by the processing apparatus 1 of the embodiment will be described. FIG6 is a top view showing an example of the arrangement relationship between the holding table 10 and the workpiece 200. FIG7 is a schematic diagram showing an example of the arrangement relationship between the reflective unit 12 of the holding table 10 and the imaging unit 30. FIG8 is a diagram showing an example of an image obtained by the processing apparatus 1 using the reflective part 123 of the reflective unit 12 to capture the edge 206 of the workpiece 200. FIG9 is a diagram showing an example of an image obtained by the processing apparatus 1 without using the reflective part 123 of the reflective unit 12 to capture the edge 206 of the workpiece 200.

[0036] In an example shown in FIG. 6, the processing apparatus 1 holds the workpiece 200 with its edge 206 protruding beyond the holding surface 11 by means of a holding table 10. The diameter of the workpiece 200 is larger than the diameter of the holding surface 11 of the holding table 10. The edge 206 of the workpiece 200 includes: the edge of the workpiece 200, the outer periphery including a surface range extending a certain distance from the edge, etc. Each of the plurality of reflective units 12 is configured such that the reflective portion 123 is located below the edge 206 of the workpiece 200. The reflective unit 12 is configured to be located below the edges 206 of multiple workpieces 200 of different sizes by moving radially along the guide rail 13 toward the holding surface 11. The processing apparatus 1 moves the reflective unit 12 along the guide rail 13 by a driving means not shown, thereby positioning the edge 206 of the workpiece 200 above the reflective portion 123 of the reflective unit 12.

[0037] As shown in FIG7, the processing apparatus 1 controls the X-axis movement unit 42, the Y-axis movement unit 41, and the Z-axis movement unit 43 to position the camera unit 30 at a camera position that allows for overlapping and imaging of the reflective portion 123 of the reflective unit 12 with the edge 206 of the workpiece 200. The camera position includes, for example, the position, rotation angle, and height of the holding table 10 pre-set for the workpiece 200. The processing apparatus 1 uses the camera unit 30 positioned at the camera position to capture images of the imaging area 301 (see FIG6 and FIG7) including the edge 206 of the workpiece 200 and the reflective unit 12.

[0038] In this situation, if the accompanying light is incident from above the camera unit 30 relative to the surface of the workpiece 200 and is reflected, it will be received by the objective lens 31 of the camera unit 30. However, if it is incident at an angle relative to the surface of the workpiece 200 and is reflected, it will not be received by the objective lens 31 of the camera unit 30, and the workpiece 200 will be photographed as black, while the outer side of the workpiece 200 will be photographed as white. The accompanying light includes, for example, light emitted by the light source 38 of the camera unit 30, light from the surrounding area of ​​the processing device 1, etc. Furthermore, if the accompanying light is diffused at the reflective portion 123 of the reflective unit 12, a portion of the diffused light will be received by the objective lens 31 of the camera unit 30. Near the edge 206 on the surface of the workpiece 200, a chamfer is applied and a rounded or inclined edge is formed to prevent breakage during the production of the workpiece 200, so the accompanying light will be diffused and become difficult for the camera unit 30 to receive. In this way, the image 500 obtained by the camera unit 30 capturing the image area 301, as shown in FIG8, shows that the first area 510 obtained by capturing the workpiece 200 becomes a dark area, and the second area 520 obtained by capturing the reflective part 123 of the reflective unit 12 becomes a brighter area than the first area 510. As a result, the image 500 becomes clearer because the contrast of the boundary 530 between the first area 510 and the second area 520 becomes more defined, thus the boundary 530 can be identified as the edge 206 (outer periphery) of the workpiece 200.

[0039] In contrast, the processing apparatus 1 is positioned below the workpiece 200 where the reflective unit 12 does not exist; that is, below the outer side of the workpiece 200, the area covering the belly of the X-axis moving unit 42 is located. The apparatus captures an image of the edge 206 of the workpiece 200 and its outer perimeter (see FIG. 6). In this case, if the light accompanying the image captures is directed towards the outside of the workpiece 200, since there is no reflective portion 123 of the reflective unit 12, it will be directed towards the belly portion of the X-axis moving unit 42 located below the holding stage 10, and will not be received by the objective lens 31 of the imaging unit 30. Furthermore, if the surface of the belly of the X-axis moving unit 42 is a black component, the light accompanying the image capture will not be reflected by the surface of the belly of the X-axis moving unit 42. Therefore, as shown in Figure 9, in the image 500-1 captured by the camera unit 30, both the first region 510 obtained by capturing the workpiece 200 and the third region 540 obtained by capturing the exterior of the workpiece 200 where the reflective part 123 of the reflective unit 12 is absent become dark regions. Consequently, the contrast of the boundary 530 between the first region 510 and the third region 540 becomes unclear, the exterior of the edge 206 of the workpiece 200 becomes blurred, and the image 500-1 becomes a dull image.

[0040] The processing apparatus 1 of the embodiment analyzes the image 500 obtained by capturing the edge 206 of the workpiece 200 and the reflective portion 123 of the reflective unit 12, and improves the accuracy of calculating the coordinates of the edge 206 of the workpiece 200 based on the distinct boundary 530 between the edge 206 of the workpiece 200 and the reflective portion 123. Furthermore, since the processing apparatus 1 utilizes the reflective unit 12 provided on the holding stage 10, it can capture the edge 206 of the workpiece 200 without adding any new components.

[0041] The control unit 100 of the processing apparatus 1 sets each of the four reflective units 12 of the holding stage 10 as a camera area 301, and captures images of the four camera areas 301 by the camera units 30. The control unit 100 detects four position coordinates on the edge 206 of the workpiece 200 from the four images. The control unit 100 detects the center of the workpiece 200, for example, using the technology described in Japanese Patent Application Publication No. 2011-249572. The control unit 100 calculates the position coordinates of three or more distinct points on the edge 206 of the workpiece 200 by image processing. The multiple position coordinates can be appropriately determined, for example, based on the position of the reflective units 12 of the holding stage 10. The control unit 100 detects the center of the workpiece 200 based on the circumcircle of the triangle represented by the multiple position coordinates. If the control unit 100 detects the center of the workpiece 200, it stores the coordinate information representing the center in a memory device.

[0042] After detecting the center of the workpiece 200, the control unit 100 positions the cutting blade 21 at a predetermined distance from the edge 206 of the workpiece 200, using the center position of the workpiece 200 as a reference, and rotates the holding table 10 relative to the cutting blade 21 to remove a portion of the outer periphery of the workpiece 200. Furthermore, the control unit 100 measures the height of the upper surface of the workpiece 200 based on the detected center position of the workpiece 200, and operates the processing unit 20 accordingly, thereby processing the workpiece 200 along the predetermined dividing line 203. Therefore, by accurately determining the center position of the workpiece 200 and processing it based on that center position, the processing apparatus 1 can improve processing accuracy.

[0043] By means of the above, the processing apparatus 1 captures images by bringing the edge 206 of the workpiece 200 close to the reflective portion 123 of the reflective unit 12. Even when the workpiece 200 is held with its edge 206 protruding outward from the holding surface 11 of the holding table 10, the boundary between the edge 206 and the reflective portion 123 can be captured clearly. In this way, the processing apparatus 1 can accurately grasp the edge 206 of the workpiece 200, thereby improving the processing accuracy of the workpiece 200 held in a state protruding from the holding table 10.

[0044] Even when the processing apparatus 1 uses a workpiece 200 larger than the holding surface 11 of the holding table 10 as the workpiece unit 250, the edge 206 of the workpiece 200 can be clearly captured by the reflective unit 12 that supports the annular frame 210. In this way, the processing apparatus 1 can effectively obtain an image of the edge 206 of the workpiece 200 by utilizing the reflective unit 12 without adding new configurations. The reflective unit 12 has a frame support portion 120 that supports the annular frame 210.

[0045] [Modifications of the Embodiment] FIG10 is a diagram illustrating an example of the relationship between the holding surface 11 and the reflecting unit 12 of the processing apparatus 1 in a modified embodiment. When the processing apparatus 1 is performing a complete cut-off trimming of the workpiece 200, the cutting blade 21 is positioned next to the edge 206 of the workpiece 200 for processing. In this case, as shown in FIG10, the processing apparatus 1 only needs to be configured such that the reflecting portion 123 of the reflecting unit 12 is positioned lower than the holding surface 11 of the holding table 10. When the processing apparatus 1 is performing a complete cut-off trimming of the workpiece 200, it only needs to be configured such that the reflecting portion 123 does not contact the cutting blade 21. Therefore, even when the processing apparatus 1 is performing a complete cut-off trimming of the edge 206 with the cutting blade 21, the reflecting unit 12 can be prevented from contacting the cutting blade 21.

[0046] In the above embodiments, although the description focuses on the case where the reflective portion 123 of the reflective unit 12 of the processing apparatus 1 has a mounting portion 121 and a pushing member 122, the present invention is not limited thereto. FIG11 is a diagram illustrating another usage example of the holding table 10 of the processing apparatus 1 in a modified embodiment.

[0047] In situation 1001 shown in FIG11, the processing apparatus 1 does not use the aforementioned annular frame 210, and the workpiece 200 is held on the holding surface 11 of the holding table 10, while the cutting blade 21 cuts the edge 206 of the workpiece 200. In this case, since the mounting portion 121 of the processing apparatus 1 does not have the annular frame 210 mounted on it, the mounting portion 121 and the pushing member 122 are in a non-contact state. The non-contact state is the state in which the pushing member 122 does not push against the mounting portion 121. The mounting portion 121 and the pushing member 122 are formed by a reflective member.

[0048] In situation 1002, since the processing apparatus 1 contacts the reflective unit 12, the mounting surface (upper surface) of the mounting portion 121 functions as the aforementioned reflective portion 123. The processing apparatus 1 controls the X-axis movement unit 42, the Y-axis movement unit 41, and the Z-axis movement unit 43 to position the camera unit 30 in a camera position that allows for shooting from above with the mounting portion 121 of the reflective unit 12 overlapping the edge 206 of the workpiece 200. The processing apparatus 1 captures a portion of the camera area 301, including the edge 206 of the workpiece 200 and the reflective unit 12, using the camera unit 30 positioned at the camera position.

[0049] In this way, the processing apparatus 1 positions the edge 206 of the workpiece 200 above the mounting portion 121 of the reflective unit 12 and takes a picture, so that even when the workpiece 200 is held in a state protruding from the holding table 10, the boundary between the edge 206 and the reflective unit 12 can be clearly captured. In this way, because the processing apparatus 1 can accurately grasp the edge 206 of the workpiece 200, the processing accuracy of the workpiece 200 held in a state protruding from the holding table 10 can be improved.

[0050] Furthermore, the present invention is not limited to the embodiments described above. That is, various modifications and implementations can be made without departing from the framework of the present invention.

[0051] In the above embodiment, although the description is based on the case where the processing apparatus 1 is provided with reflective portions 123 in all four reflective units 12, the present invention is not limited thereto. The processing apparatus 1 may also be configured such that at least one of the four reflective units 12 is provided with a reflective portion 123.

[0052] In the above embodiment, although the case in which the reflective unit 12 of the processing apparatus 1 is the frame support portion 120 supporting the annular frame 210 is described, the present invention is not limited thereto. The reflective unit 12 may also be an annular member surrounding the holding surface 11 of the holding table 10, or it may be a plurality of members arranged along the outer periphery of the holding surface 11.

[0053] The processing apparatus 1 may also be a single ring-shaped member without having multiple reflective units 12. For example, the ring-shaped member may be a ring-shaped reflective member surrounding the holding surface 11 of the holding platform 10, and may be provided in the processing apparatus 1 in a manner that is positioned below the holding surface 11.

[0054] In the above embodiment, although the case where the workpiece 200 of the processing apparatus 1 is larger than the holding surface 11 of the holding table 10 is described, the present invention is not limited thereto. For example, when the size of the workpiece 200 is the same as that of the holding surface 11, the processing apparatus 1 positions the reflective portion 123 adjacent to the reflective portion 123 of the reflective unit 12 and takes a picture, and similarly to the embodiment, a clear image of the edge 206 of the workpiece 200 can be obtained.

[0055] In the above embodiment, although the case of processing a disc-shaped workpiece 200 by the processing apparatus 1 is described, the present invention is not limited thereto. For example, the processing apparatus 1 can use a square, polygonal or other workpiece, in which case it is sufficient to position the object to be photographed on the workpiece above the reflective portion 123 of the reflective unit 12.

[0056] In the above embodiments, although the case where the processing device 1 is a cutting device is described, the processing device may also be a grinding device or a laser processing device other than a cutting device. [Simplified Explanation of the Diagram]

[0012] FIG1 is a perspective view showing an example of the configuration of the processing apparatus according to the embodiment. FIG2 is a perspective view showing the workpiece to be processed by the processing apparatus shown in FIG1. ​​FIG3 is a perspective view showing an example of the holding table shown in FIG1. ​​FIG4 is a side view schematic diagram for explaining the relationship between the holding table, the workpiece, and the processing unit shown in FIG3. FIG5 is a cross-sectional schematic diagram for explaining an example of the camera unit shown in FIG1. ​​FIG6 is a top view schematic diagram showing an example of the arrangement relationship between the holding table and the workpiece. FIG7 is a schematic diagram showing an example of the arrangement relationship between the reflective unit and the camera unit of the holding table. FIG8 is a diagram showing an example of the image obtained by the processing apparatus using the reflective part of the reflective unit to capture the edge of the workpiece. FIG9 is a diagram showing an example of the image obtained by the processing apparatus not using the reflective part of the reflective unit to capture the edge of the workpiece. FIG10 is a cross-sectional view for explaining an example of the relationship between the holding surface and the reflective unit of the processing apparatus in a modified embodiment. FIG11 is a cross-sectional view for explaining other usage examples of the holding table of the processing apparatus in a modified embodiment.

Claims

1. A processing apparatus comprising: a holding stage having a holding surface for holding a workpiece, the holding surface being smaller than the workpiece; a processing unit for processing the workpiece held on the holding stage; a camera unit for photographing the workpiece held on the holding stage; and a control unit, the holding stage having a reflecting unit surrounding the holding surface, the reflecting unit being positionable below an edge of the workpiece held on the holding surface, at least a portion of the reflecting unit being formed of a reflecting member, and being photographed by the camera unit while the edge of the workpiece is positioned above the reflecting member, wherein... The workpiece is supported by the opening of the annular frame through a thin sheet, and the reflective unit is the frame support unit that supports the annular frame.

2. The processing apparatus as described in claim 1, wherein, The camera unit captures images of multiple points on the edge of the workpiece positioned above the reflective member. The control unit calculates the coordinates of the edge from the captured images and determines the center position of the workpiece.

3. The processing apparatus as described in claim 2, wherein, Using the center position as a reference, the cutting blade of the processing unit is positioned inside the edge of the workpiece at a predetermined distance, and the holding table is rotated relative to the cutting blade to remove the outer periphery of the workpiece.

4. The processing apparatus as described in claim 3, wherein, The reflective element is positioned below the retaining surface.

Images